Mounting device and mounting method

Abstract

A mounting device according to the present invention picks and mounts components using picking members and comprises a head that can simultaneously raise / lower two or more picking members, an imaging unit that can capture an image of a top surface of a component, a temporary installation platform on which a specific component that has a prescribed feature unit formed on the top surface thereof is to be temporarily installed, and a control unit that, when the specific component is to be mounted, controls the head and the imaging unit by performing temporary installation control that causes the specific component as picked by a picking member to be temporarily installed on the temporary installation platform, imaging control that causes a top surface image of the temporarily installed specific component to be captured, and re-picking control that causes the specific component to be re-picked from the temporary installation platform by a picking member, at least one of the temporary installation control and the re-picking control involving control of the head to simultaneously raise and / or simultaneously lower two or more picking members.

Description

Mounting device and mounting method

[0001] This specification discloses a mounting apparatus and a mounting method.

[0002] Conventionally, a mounting device has been proposed that recognizes the position of a characteristic feature, such as a light-emitting element, formed on the top surface of a component, and then picks up the component using a picking member of a head and mounts it (see, for example, Patent Document 1). In this mounting device, a component supplied from a supply device is first picked up by the picking member and then temporarily mounted on a temporary mounting stand, and in that state, the position of the characteristic feature is recognized from an image of the top surface of the component, and the pick-up position of the component is set.

[0003] Patent No. 6892552

[0004] In the mounting device described above, the collection member must be raised and lowered when temporarily mounting a component on the temporary mounting stand, and also when re-collecting the component from the temporary mounting stand. Therefore, when capturing images of the top surfaces of multiple components, the process of recognizing the characteristic features takes time.

[0005] The main object of the present disclosure is to quickly perform processing to recognize the features of components and to properly mount the components.

[0006] The present disclosure has adopted the following means to achieve the above-mentioned main object.

[0007] The mounting device of the present disclosure is a mounting device that mounts components by using a collection member, and includes: a head that can raise and lower two or more collection members simultaneously; an imaging unit that can capture an image of the top surface of the components; a temporary mounting stand on which a specific component having a predetermined characteristic portion formed on its top surface is temporarily mounted; and a control unit that, when mounting the specific component, controls the head and the imaging unit to execute a temporary mounting control that causes the specific component collected by the collection member to be temporarily mounted on the temporary mounting stand, an imaging control that captures an image of the top surface of the temporarily mounted specific component, and a re-collection control that causes the collection member to re-collect the specific component from the temporary mounting stand, and controls the head so that the two or more collection members at least simultaneously rise or descend in at least one of the temporary mounting control and the re-collection control.

[0008] The mounting device of the present disclosure can quickly perform processing to recognize the characteristic portions of the specific component, thereby enabling the specific component to be mounted appropriately.

[0009] 1 is a schematic configuration diagram of the mounting device 10. A block diagram showing a configuration related to control of the mounting device 10 and a management device 70. A schematic configuration diagram of the head 30. A top view of the temporary mounting stand 19. A flowchart showing an example of a specific component mounting process. An explanatory diagram showing an example of temporary mounting control. An explanatory diagram showing an example of imaging control. An explanatory diagram showing an example of re-collection control. A top view of the temporary mounting stand 19B of a modified example. A flowchart showing a specific component mounting process of a modified example.

[0010] An embodiment of the present disclosure will be described with reference to the drawings. Fig. 1 is a schematic configuration diagram of a mounting apparatus 10. Fig. 2 is a block diagram showing a configuration related to control of the mounting apparatus 10 and a management apparatus 70. Note that the left-right direction in Fig. 1 is the X-axis direction, the front-rear direction is the Y-axis direction, and the up-down direction is the Z-axis direction.

[0011] As shown in FIG. 1, the mounting device 10 includes a tape feeder 11, a substrate conveying unit 12, a head 30, a head moving unit 15, a mark camera 17, a parts camera 18, a temporary mounting stand (mounting stand) 19, and a control unit 20 (see FIG. 2).

[0012] The tape feeder 11 supplies components to a predetermined supply position by pulling out from a reel a tape having a plurality of recesses in which components are accommodated at predetermined intervals and feeding the tape rearward along the Y-axis direction. The components accommodated in the recesses are protected by a film covering the surface of the tape, and the film is peeled off just before the supply position, exposing the components.

[0013] 1 with a gap therebetween and spanning the X-axis direction, and drives the conveyor belts to transport the substrate S. The substrate transport unit 12 may, for example, have two pairs of conveyor belts and can transport two substrates S simultaneously.

[0014] The head 30 includes one or more nozzles 35 (picking members) that pick up (suck) components using negative pressure. The head 30 picks up components supplied to a supply position by the tape feeder 11 using the nozzles 35, and mounts the components at a mounting position on a board S transported by the board transport unit 12. As shown in FIG. 3 , the head 30 is configured as, for example, a rotary head to which multiple nozzles 35 are attached so as to be rotatable in the circumferential direction. The nozzles 35, which are located at a lifting position (a predetermined rotation position), can be raised and lowered in the Z-axis direction (up and down). The head 30 includes a head main body 31, a nozzle holder 32, the nozzles 35, an R-axis drive unit 40, a Q-axis drive unit 50, a first Z-axis drive unit 60, and a second Z-axis drive unit 65.

[0015] The head main body 31 is a rotating body that can be rotated by the R-axis drive device 40, and has a plurality of (e.g., 8, 20, or 28) nozzles 35 arranged thereon. The nozzle holders 32 are arranged at predetermined angular intervals in the circumferential direction of the head main body 31, and are supported by the head main body 31 so that they can be freely raised and lowered. The nozzles 35 are detachably attached to the tip ends of the nozzle holders 32. The nozzles 35 suction a component by negative pressure supplied by a pressure supply device (not shown) through an internal flow path of the nozzle holder 32, and release the suction of the component by positive pressure supplied by the pressure supply device.

[0016] The R-axis drive device 40 revolves (revolves) the multiple nozzle holders 32 (multiple nozzles 35) in the circumferential direction around the central axis of the head main body 31. As shown in FIG. 3 , the R-axis drive device 40 includes an R-axis motor 41, an R-shaft 42 extending axially from the central axis of the head main body 31, and a transmission gear 43 that transmits the rotation of the R-axis motor 41 to the R-shaft 42. The R-axis drive device 40 rotates the head main body 31 by driving the R-shaft 42 to rotate with the R-axis motor 41 via the transmission gear 43. As the head main body 31 rotates, each nozzle holder 32 revolves (revolves) in the circumferential direction together with the nozzles 35.

[0017] The Q-axis drive unit 50 rotates (spins) each nozzle holder 32 (each nozzle 35) around its central axis. The Q-axis drive unit 50 includes a Q-axis motor 51, a cylindrical member 52, a transmission gear 53, and a Q-axis gear 54. The cylindrical member 52 is inserted coaxially and rotatably relative to the R-axis 42, and has a spur gear 52a formed on its outer circumferential surface. The transmission gear 53 transmits the rotation of the Q-axis motor 51 to the cylindrical member 52. The Q-axis gear 54 is provided on the upper part of each nozzle holder 32 and meshes with the spur gear 52a of the cylindrical member 52 so as to be slidable in the Z-axis direction (up and down direction). The Q-axis drive unit 50 rotates the cylindrical member 52 via the transmission gear 53 using the Q-axis motor 51, thereby collectively rotating each Q-axis gear 54 meshing with the spur gear 52a of the cylindrical member 52. Each nozzle holder 32 rotates (spins) around its central axis together with the nozzle 35 as a unit with the rotation of the Q-axis gear 54 .

[0018] The first and second Z-axis drive devices 60, 65 are configured to be able to raise and lower the nozzle holder 32 in the Z-axis direction (lifting direction) at two lifting positions on the orbit of the nozzle holder 32. The first and second Z-axis drive devices 60, 65 are provided along the alignment direction (X-axis direction) of the tape feeders 11, and include Z-axis sliders 62, 67 and Z-axis motors 61, 66 that raise and lower the Z-axis sliders 62, 67. The first and second Z-axis drive devices 60, 65 drive the Z-axis motors 61, 66, respectively, to raise and lower the Z-axis sliders 62, 67, thereby coming into contact with the nozzle holder 32 below the Z-axis sliders 62, 67 and raising and lowering the nozzle holder 32 integrally with the nozzle 35. The first and second Z-axis drive units 60, 65 may use linear motors as the Z-axis motors 61, 66 to raise and lower the Z-axis sliders 62, 67, or may use a rotary motor and a ball screw mechanism to raise and lower the Z-axis sliders 62, 67. Thus, the head 30 includes two Z-axis drive units 60, 65 that can raise and lower the nozzle holders 32 (nozzles 35) at their respective elevation positions. Therefore, the head 30 can individually raise and lower the nozzles 35 at each elevation position to individually pick up or place components. The head 30 can also simultaneously raise and lower the nozzles 35 at each elevation position to simultaneously pick up or place components. The distance between the nozzles 35 at the two elevation positions in the X-axis direction is distance D1 (see FIG. 3 ).

[0019] The head moving unit 15 includes an X-axis moving unit 15a that moves the slider to which the head 30 is attached in the X-axis direction, and a Y-axis moving unit 15b that moves the head 30 in the Y-axis direction together with the slider 16 to which the X-axis moving unit 15a is mounted. The head 30 is moved in the X and Y directions by the head moving unit 15 to a position above the supply position or above the mounting position. For example, the X-axis moving unit 15a is configured using a ball screw mechanism, and the Y-axis moving unit 15b is configured using a linear motor.

[0020] Mark camera 17 is disposed on the underside of the slider to which head 30 is attached so as to move in the X and Y directions in accordance with the movement of head 30. Note that mark camera 17 may also be disposed on the underside of head 30. The area below mark camera 17 is an imaging area, and the mark camera 17 captures images of reference marks and the top surfaces of components attached to board S and outputs the images to control unit 20.

[0021] Parts camera 18 is disposed in front of board transport unit 12. Parts camera 18 has an imaging range above it, and captures an image of the parts picked up by nozzle 35 from below, and outputs the image to control unit 20.

[0022] The temporary mounting stand 19 is disposed in front of the board transport unit 12. This temporary mounting stand 19 has a horizontal top surface and is used, for example, as a stand for temporarily mounting specific components Ps. The specific components Ps have, for example, predetermined features formed on their top surfaces and require recognition of the position and shape of the features (referred to as top surface recognition). The specific components Ps are, for example, LED components having a light-emitting body on their top surfaces as their features. Components that do not require such top surface recognition are referred to as normal components. In this embodiment, the mounting device 10 has the nozzle 35 pick up specific components Ps supplied to the supply position by the tape feeder 11, temporarily mount them on the temporary mounting stand 19, and then have the mark camera 17 capture a top surface image in this state, which is then image-processed to perform top surface recognition. When picking up specific components Ps supplied to the supply position, the mounting device 10 may also have the mark camera 17 capture a top surface image, process the top surface image, and set a pickup position by performing top surface recognition, and then have the nozzle 35 pick up the specific components Ps.

[0023] As shown in FIG. 4 , temporary attachment points P for temporarily attaching specific components Ps are provided on the upper surface of the temporary attachment stand 19. The temporary attachment points P may be recessed to accommodate the specific components Ps. In this embodiment, four temporary attachment points P (P1, P2, P3, P4) are provided on the upper surface of the temporary attachment stand 19 at equal intervals along the X-axis direction. The temporary attachment points P are provided so that the distance between adjacent temporary attachment points P is half (D1 / 2) of the distance D1 between the nozzles 35 at the two elevation positions. Therefore, by simultaneously raising and lowering the nozzles 35 at the two elevation positions, specific components Ps can be simultaneously attached to and picked up at the leftmost temporary attachment point P1 and the third temporary attachment point P3 from the left in FIG. 4 . Similarly, by simultaneously raising and lowering the nozzles 35 at the two elevation positions, specific components Ps can be simultaneously attached to and picked up at the second temporary attachment point P2 from the left and the fourth temporary attachment point P4 from the left in FIG. 4 . The interval between the temporary attachment points P does not have to be exactly half the interval D1, but may be approximately half the interval D1.

[0024] In this embodiment, the mounting device 10 is divided into two halves, each with a head 30L, 30R and a head movement unit 15L, 15R. The left-side head 30L and head movement unit 15L are also referred to as the first head and first head movement unit, respectively, and the right-side head 30R and head movement unit 15R are also referred to as the second head and second head movement unit, respectively. Furthermore, part cameras 18L, 18R are respectively provided in the left and right sides of the mounting device 10, and mark cameras 17L, 17R are respectively provided on the sliders to which the heads 30L, 30R are attached. The following description will be given without distinguishing between the left and right configurations unless necessary. The temporary mounting stand 19 may be provided in each of the left and right sides of the mounting device 10, or in only one of the two sides.

[0025] The control unit 20 is configured as a microprocessor centered around a CPU 21, and includes a ROM 22 for storing processing programs, an HDD 23 as a storage unit for storing various data, a RAM 24 used as a work area, an input / output interface, etc. The storage unit is not limited to the HDD 23 and may be an SSD or the like. The control unit 20 outputs control signals to each tape feeder 11, the substrate transport unit 12, the heads 30 (30L, 30R), the head movement unit 15 (15L, 15R), the mark cameras 17 (17L, 17R), the part cameras 18 (18L, 18R), etc. The control unit 20 also receives inputs of various signals from the tape feeders 11, the substrate transport unit 12, the heads 30, the head movement unit 15, etc., as well as images captured by the mark camera 17 and the part camera 18.

[0026] The management device 70 is, for example, a general-purpose computer, and as shown in FIG. 2 , is composed of a CPU 71, ROM 72, HDD 73, RAM 74, etc., and is equipped with an input device 75 such as a keyboard and a mouse, and a display 76 such as an LCD. The HDD 73 stores production jobs for the boards S. The production jobs are information that determines which components are to be mounted on the boards S in the mounting device 10, in what order, and how many boards S with the components mounted thereon are to be produced. The production jobs also include information about the components to be mounted, such as the mounting order of the components, mounting position information, and component type information, such as the component shape and whether the component is a normal component or a specific component. The management device 70 is communicatively connected to the control unit 20 of the mounting device 10, and outputs production jobs to the control unit 20 to start production, and receives information about the production status from the control unit 20.

[0027] The component mounting process of the mounting device 10 will be described below. When the component to be mounted is a standard component, the control unit 20 first controls the head moving unit 15 to move the head 30 above the supply position of the tape feeder 11 and lower the nozzle 35 to pick up (suck) the component supplied to the supply position. The control unit 20 repeatedly moves each nozzle 35 to the lifting position and causes the nozzle 35 to pick up the component until each nozzle 35 has picked up a component. Next, the control unit 20 controls the head moving unit 15 to move the head 30 above the part camera 18 and controls the part camera 18 to capture an image of the bottom surface of the component picked up by the nozzle 35. Next, the control unit 20 determines the misalignment of the component picked up by the nozzle 35 based on the image of the bottom surface and corrects the target mounting position of the component to eliminate the misalignment. The control unit 20 then controls the head moving unit 15 to move the head 30 above the board S and lower the nozzle 35 to mount the component at the target mounting position on the board S. The control unit 20 repeats the operation of sequentially moving each nozzle 35 to the lifted position and causing the nozzle 35 to mount the component until the picked component is mounted on each nozzle 35 .

[0028] Furthermore, when the component to be mounted is a specific component Ps, the mounting process is performed as follows. Fig. 5 is a flowchart showing an example of the specific component mounting process. In the specific component mounting process, the control unit 20 moves the head 30 above the supply position of the tape feeder 11 and causes the nozzle 35 to pick up the specific component Ps (S100). The control unit 20 repeats the operation of sequentially moving each nozzle 35 to the raised / lowered position and causing the nozzle 35 to pick up the specific component Ps until the required specific component Ps is picked up.

[0029] Next, the control unit 20 moves the head 30 above the temporary attachment stand 19 (S110), and executes temporary attachment control to temporarily attach specific components Ps by simultaneously raising and lowering the two nozzles 35 using the first and second Z-axis drive devices 60, 65, with a temporary attachment point P on the temporary attachment stand 19 set as the target temporary attachment position (S120). In S120, the control unit 20 executes temporary attachment of specific components Ps to each of the multiple temporary attachment points P. In this embodiment, as shown in an example in FIG. 6 , the specific components Ps are simultaneously temporarily attached to temporary attachment points P1 and P3 in the first temporary attachment control, and the specific components Ps are simultaneously temporarily attached to temporary attachment points P2 and P4 in the second temporary attachment control. That is, in the temporary mounting control, the temporary mounting of specific components Ps is repeated by moving the head 30 from one end (e.g., the left end) to the other end (e.g., the right end) in the X-axis direction (predetermined direction) of the temporary mounting stand 19 (see dotted arrow) until the temporary mounting of specific components Ps to multiple temporary mounting points P is completed.

[0030] Next, the control unit 20 executes imaging control to cause the mark camera 17 to capture top surface images of the specific components Ps temporarily attached to each temporary attachment point P of the temporary attachment stand 19 (S130). As shown in an example in FIG. 7 , the control unit 20 moves the mark camera 17 above the temporary attachment stand 19 from the other end (right end) toward one end (left end) in the X-axis direction (see dotted arrow), sequentially capturing top surface images of each specific component Ps at each imaging position on each temporary attachment point P. Note that the imaging position of each specific component Ps is set to the position directly above each temporary attachment point P. Therefore, the center of the image of each specific component Ps coincides with the position of each temporary attachment point P (P1 to P4). Note that by appropriately designing the imaging range of the mark camera 17 and the spacing between each temporary attachment point P, multiple specific components Ps may be captured in a single top surface image.

[0031] After capturing the top surface image in this manner, the control unit 20 executes re-picking control to simultaneously raise and lower the two nozzles 35 using the first and second Z-axis drive devices 60, 65 to re-pick the specific components Ps (S140). In S140, the control unit 20 executes re-picking of the specific components Ps from the multiple temporary attachment points P on the temporary attachment table 19. In this embodiment, as shown in FIG. 8 , the specific components Ps are simultaneously re-picked from the temporary attachment points P1 and P3 in the first re-picking control, and the specific components Ps are simultaneously re-picked from the temporary attachment points P2 and P4 in the second re-picking control. That is, in the re-picking control, the specific components Ps are repeatedly re-picked while moving the head 30 from one end (left end) of the temporary attachment table 19 in the X-axis direction toward the other end (right end) (see dotted arrow) until the specific components Ps have been completely re-picked from the multiple temporary attachment points P. In the re-collection control of this embodiment, the specific component Ps is re-collected at the same target re-collection position as in the temporary attachment control. For example, if the control unit 20 temporarily attaches the specific component Ps to the nozzle 35 at the temporary attachment point P1 (x1, y1) as the target temporary attachment position in the temporary attachment control, the control unit 20 causes the nozzle 35 to re-collect the specific component P at the temporary attachment point P1 (x1, y1) as the target re-collection position in the re-collection control.

[0032] After executing the temporary mounting control, image capturing control, and re-collection control in S120 to S140, the control unit 20 determines whether or not all top surface images of the specific components Ps picked up (sucked) by the head 30 have been captured (S150). If the control unit 20 determines that all images have not been captured, it returns to S120 and executes the processes from S120 onwards for the specific components Ps for which top surface images have not been captured.

[0033] On the other hand, if the control unit 20 determines that all images have been captured, it detects the positions of the characteristic features of the specific components Ps from the top surface image (S160), recognizes any positional deviations of the characteristic features relative to the re-collection positions, and corrects the mounting positions of the specific components Ps based on the positional deviations (S170). As described above, the image center of the top surface image of each specific component P coincides with the position of each temporary attachment point P. Furthermore, in the re-collection control, the specific components Ps are re-collected at the same positions as in the temporary attachment control, i.e., the positions of each temporary attachment point P. Therefore, the re-collection positions coincide with the image center of the top surface image. Therefore, the control unit 20 processes the top surface image to recognize the center positions of the characteristic features of the specific components Ps, and calculates the deviations in the X and Y directions between the recognized center positions of the characteristic features and the image center, thereby recognizing the positional deviations of the characteristic features relative to the re-collection positions. In this way, in S160 and S170, the control unit 20 recognizes the positional deviations of each specific component Ps picked up by each nozzle 35 of the head 30 from the respective top surface images and corrects the mounting positions of each specific component Ps.

[0034] Next, the control unit 20 moves the head 30 above the corrected mounting position to mount the specific component Ps (S180), and determines whether all of the specific components Ps picked up by the head 30 have been mounted (S190). If the control unit 20 determines that all of the specific components Ps have not been mounted, the control unit 20 returns to S180 and executes the process. If the control unit 20 determines that all of the specific components Ps have been mounted, the control unit 20 ends the specific component mounting process.

[0035] The control unit 20 may execute the processes of S160 and S170 in parallel while executing other processes (re-collection control or temporary mounting control of the next specific component Ps) after capturing the top surface image in S130. Alternatively, the control unit 20 may execute the processes of S160 and S170 in parallel with the process of S180. That is, the control unit 20 may sequentially execute the mounting process for the specific component Ps whose mounting position has been corrected after recognizing a positional deviation from the top surface image.

[0036] Here, the correspondence between the components of this embodiment and the components of the present disclosure will be clarified. The head 30 of this embodiment corresponds to the head of the present disclosure, the mark camera 17 corresponds to the imaging unit, the temporary mounting stand 19 corresponds to the temporary mounting stand, and the control unit 20 corresponds to the control unit. In this embodiment, the operation of the mounting device 10 is described, thereby clarifying an example of the mounting method of the present disclosure.

[0037] In the mounting apparatus 10 of the embodiment described above, the control unit 20 simultaneously raises and lowers two nozzles 35 (picking members) for both controlling the temporary mounting of specific components Ps onto the temporary mounting stand 19 and controlling the re-picking of specific components Ps from the temporary mounting stand 19. This allows two specific components Ps to be temporarily mounted onto the temporary mounting stand 19 at the same time, and two specific components Ps to be simultaneously re-picked from the temporary mounting stand 19. Therefore, compared to systems that temporarily mount specific components Ps onto the temporary mounting stand 19 one by one, or systems that re-pick specific components Ps from the temporary mounting stand 19 one by one, the process for recognizing the characteristic parts of the specific components P can be performed quickly, and the specific components Ps can be mounted appropriately.

[0038] Furthermore, the control unit 20 performs image processing on the top surface image to detect the positions of the characteristic parts of the specific components Ps, recognizes the positional deviation of the characteristic parts relative to the position where the nozzle 35 re-picks up the specific components Ps, and mounts the specific components Ps at a mounting position corrected based on the recognized positional deviation. Therefore, even if the re-picking control is performed by simultaneously raising and lowering the two nozzles 35, the positional deviation of the characteristic parts of each specific component Ps can be appropriately corrected for mounting.

[0039] Furthermore, the control unit 20 controls the head 30 so that the nozzle 35 re-picks up the specific component Ps, with the target position set to the same position as when the nozzle 35 temporarily mounted the specific component Ps. This makes it easy to set the target position for re-picking up, and prevents the positional deviation of the characteristic part from being biased toward any one of the multiple specific components Ps to be re-picked, allowing the specific components Ps to be mounted more appropriately.

[0040] Furthermore, the temporary attachment stand 19 is provided with a plurality of (e.g., four) temporary attachment points P, which is greater than the number (e.g., two) of nozzles 35 that can be raised and lowered simultaneously. The control unit 20 repeatedly executes temporary attachment control for simultaneously raising and lowering the nozzles 35 so that the specific components Ps are temporarily attached to all of the plurality of temporary attachment points P, and then controls the head 30 and the mark camera 17 to execute imaging control of the temporarily attached specific components Ps. As a result, images of the specific components Ps temporarily attached to the temporary attachment stand 19 can be captured all at once, which makes it possible to capture top surface images more efficiently than if the temporary attachment control and imaging control were executed alternately once each.

[0041] The head 30 is a rotary head in which the nozzles 35 are arranged so as to be rotatable in the circumferential direction and can simultaneously raise and lower the nozzles 35 at two locations in the circumferential direction. The temporary mounting table 19 has four temporary mounting points P arranged in the X-axis direction (predetermined direction) at intervals (D1 / 2) that are half the interval D1 in the predetermined direction between the two locations that can be simultaneously raised and lowered. Therefore, by executing temporary mounting control twice to simultaneously raise and lower the nozzles 35, the specific components Ps can be efficiently temporarily mounted at the four temporary mounting points.

[0042] In addition, in the temporary fitting control, the head 30 moves from one end to the other end in the X-axis direction (predetermined direction) of the temporary fitting stand 19, in the imaging control, the mark camera 17 (head 30) moves from the other end to the one end in the X-axis direction of the temporary fitting stand 19, and in the re-collection control, the head 30 moves from one end to the other end in the X-axis direction of the temporary fitting stand 19. Therefore, the movement efficiency of the head 30 (mark camera 17) can be improved compared to when the head 30 always starts moving from one end or when the head 30 always starts moving from the other end, and therefore the process for recognizing the characteristic portion of the specific part Ps can be performed more quickly.

[0043] It goes without saying that the present disclosure is not limited to the above-described embodiments, and can be embodied in various forms as long as they fall within the technical scope of the present disclosure.

[0044] In the above-described embodiment, the control unit 20 simultaneously raises and lowers the two nozzles 35 in both the temporary attachment control and the recollection control, but this is not limited to this. The control unit 20 may simultaneously raise and lower the two nozzles 35 in one of the temporary attachment control and the recollection control, and raise and lower the nozzles 35 one by one in the other. Furthermore, the nozzles 35 may simultaneously be raised or lowered in at least one of the temporary attachment control and the recollection control. For example, the two nozzles 35 may be simultaneously lowered in the temporary attachment control, but the two nozzles 35 may be raised individually rather than simultaneously, and the nozzles 35 may be raised and lowered individually one by one in the recollection control. Note that raising the two nozzles 35 individually is not limited to starting the raising of one nozzle 35 after the other nozzle 35 has completed its raising, but also includes starting the raising of one nozzle 35 with a slight delay after the other nozzle 35 has started to rise. Similarly, lowering two nozzles 35 individually does not necessarily mean starting the descent of one nozzle 35 after the descent of the other nozzle 35 has been completed, but also includes starting the descent of one nozzle 35 with a slight delay after the descent of the other nozzle 35 has begun.

[0045] In the embodiment, the control unit 20 executes temporary attachment control to temporarily attach specific components Ps to all of the multiple temporary attachment points P, and then executes image capture control of the temporarily attached specific components Ps all at once. However, this is not limited to this. The control unit 20 may alternately execute temporary attachment control and image capture control once each. For example, the control unit 20 may execute temporary attachment control of specific components Ps to two temporary attachment points P, execute image capture control of the two specific components Ps, and then execute temporary attachment control of specific components Ps to the remaining two temporary attachment points P, and execute image capture control of the two specific components Ps. However, for efficient processing, the embodiment described above is preferable.

[0046] In the embodiment, the temporary attachment stand 19 is provided with a plurality of temporary attachment points P, the number of which is greater than the number of nozzles 35 that can be raised and lowered simultaneously. However, this is not limited to this. It is sufficient that the temporary attachment stand 19 is provided with at least two temporary attachment points P. Furthermore, while the temporary attachment stand 19 is provided with one row of four temporary attachment points P aligned in the X-axis direction (predetermined direction), this is not limited to this. Multiple rows of four temporary attachment points P may be provided in the Y-axis direction. For example, as shown in a modified temporary attachment stand 19B in FIG. 9 , a row of temporary attachment points P1 to P4 (first row) and a row of temporary attachment points P11 to P14 (second row) may be provided, resulting in a total of eight temporary attachment points P. The number of rows of temporary attachment points P may be three or more. Furthermore, the number of rows is not limited to four temporary attachment points P in the second and subsequent rows, and only two temporary attachment points P (e.g., P11 and P13) may be provided, resulting in a total of six temporary attachment points P. That is, it is not necessary to provide four (equal number of) temporary attachment points P in each row. By doing so, even if more than four temporary attachment points P are provided on the temporary attachment table 19B, the amount of movement of the head 30 during temporary attachment control and re-collection control can be reduced.

[0047] In the embodiment, the temporary attachment stand 19 has a plurality of temporary attachment points P arranged at equal intervals along the X-axis direction, and the interval between adjacent temporary attachment points P is half (D1 / 2) of the interval D1 between the nozzles 35. However, this is not limited to this. Regardless of the interval D1, it is sufficient that the plurality of temporary attachment points P are arranged side by side so that the interval between adjacent temporary attachment points P is a predetermined interval. Then, in the temporary attachment control and re-picking control, temporary attachment and re-picking of the specific component Ps can be performed while moving the head 30 by an amount corresponding to the predetermined interval.

[0048] In the embodiment, the control unit 20 controls the head 30 to re-pick the specific component Ps using the same target position as the temporary mounting position of the specific component Ps as the target position, but this is not limited to this. For example, the control unit 20 may set the target re-pickup position based on the characteristic portion of one of two specific components Ps to be re-pickup simultaneously, and re-pick up the two specific components Ps simultaneously. In this way, one specific component Ps can be re-pickup without misalignment of the characteristic portion, while the other specific component Ps will be disproportionately misaligned in the characteristic portion. However, the control unit 20 can properly mount the other specific component Ps by correcting the mounting position of the other specific component Ps based on the misalignment.

[0049] The specific component mounting process may also be modified as follows. FIG. 10 is a flowchart showing the specific component mounting process of the modified example. In this modified example, the same steps as those in the embodiment are assigned the same step numbers, and their descriptions are omitted. In this modified specific component mounting process, the control unit 20 executes image capture control in S130, detects the position of a characteristic feature of the specific component Ps from the top surface image, and recognizes, for example, a positional deviation of the characteristic feature relative to the center of the top surface image of the specific component Ps or a predetermined reference position of the specific component Ps (S131), and determines whether the positional deviation is equal to or greater than a predetermined amount (S133). For example, the control unit 20 recognizes the positional deviation of two specific components Ps re-picked simultaneously, determines whether the recognized positional deviations are equal to or greater than a predetermined amount, and if either of the recognized positional deviations is equal to or greater than the predetermined amount, makes a positive determination in S133. Alternatively, the control unit 20 may perform the determination in S133 based only on the largest positional deviation among the recognized positional deviations, or may perform the determination in S133 based on the average value of the recognized positional deviations.

[0050] If the control unit 20 determines in S133 that the positional deviation is not equal to or greater than a predetermined amount, it corrects the target position for recollection of the specific parts Ps based on the positional deviation (S135), and executes recollection control in S140, which simultaneously raises and lowers the two nozzles 35 based on the target position. In S135, the control unit 20 corrects the target positions so that the positional deviation is distributed approximately evenly between the two specific parts Ps. Alternatively, the control unit 20 may correct the target position for recollection based on a characteristic feature of one of the specific parts Ps so that the positional deviation of that specific part Ps is eliminated.

[0051] On the other hand, if the control unit 20 determines in S133 that the misalignment is equal to or greater than the predetermined amount, it corrects the target positions for re-picking the specific components Ps based on the misalignment (S137) and executes re-picking control to re-pick the specific components Ps by individually raising and lowering each nozzle 35 based on the target positions (S139). In S137, the control unit 20 corrects the target positions (picking positions) for each individual re-picking, for example, to eliminate each misalignment. Therefore, if the misalignment is equal to or greater than the predetermined amount, the specific components Ps can be individually re-picked at appropriate target positions that eliminate the misalignment of the characteristic portions of each specific component P. Note that, since the misalignment of the characteristic portions recognized from the top-view image has been eliminated after the process of S139 has been executed, the correction of the mounting positions in S170 may be omitted.

[0052] In this modified example, S133 determines whether the positional deviation is greater than or equal to a predetermined amount, corrects the target position based on the determination result (S135, S137), and then executes either simultaneous lifting / lowering re-collection control (S140) or individual lifting / lowering re-collection control (S139). However, this is not limited to this. For example, the control unit 20 may omit the processes of S133, S137, and S139, i.e., execute simultaneous lifting / lowering re-collection control using a position corrected based on the positional deviation recognized from the top-view image as the target position. Alternatively, if the control unit 20 determines that the positional deviation is not greater than or equal to the predetermined amount, it may execute simultaneous lifting / lowering re-collection control in S140, and if the control unit 20 determines that the positional deviation is greater than or equal to the predetermined amount, it may execute individual lifting / lowering re-collection control in S139. Note that when executing simultaneous lifting / lowering re-collection control in S140, the process of S135 before that is not essential and may be omitted.

[0053] In the embodiment, the head 30 is a rotary head in which a plurality of nozzles 35 (nozzle holders 32) are arranged side by side on the same circumference, but this is not limited thereto and a head in which a plurality of nozzles 35 are arranged side by side on the same line may also be used. In this case, temporary attachment points P may be provided on the temporary attachment table 19 at intervals such as the spacing between adjacent nozzles 35 or half that spacing. Furthermore, the number of nozzles 35 that can be raised and lowered simultaneously is not limited to two, as long as two or more nozzles can be raised and lowered simultaneously. In other words, the head 30 may be configured to be capable of at least one of simultaneous temporary attachment and simultaneous re-picking of two or more components.

[0054] In the embodiment, the head 30 moves from one end of the temporary attachment stand 19 to the other end in the temporary attachment control, the mark camera 17 (head 30) moves from the other end of the temporary attachment stand 19 to one end in the imaging control, and the head 30 moves from one end of the temporary attachment stand 19 to the other end in the re-collection control, but this is not limitative. That is, the head 30 (mark camera 17) may always start moving from one end or the other end.

[0055] In the embodiment, the mounting device 10 includes two heads 30, and each head 30 is independently movable, but the number of heads is not limited to two, and the mounting device 10 may include three or more heads 30, and each head 30 may be independently movable. Alternatively, the mounting device 10 is not limited to one including multiple heads 30, and may include only one head 30.

[0056] Here, the mounting method of the present disclosure can quickly perform processing to recognize the characteristic parts of the specific component Ps and properly mount the specific component Ps, similar to the above-described mounting device 10. In this mounting method, various aspects of the mounting device 10 may be employed, or configurations or steps may be added to realize each function of the mounting device 10.

[0057] In this specification, the technical idea of ​​changing "the mounting device according to claim 2" in claim 4 at the time of application to "the mounting device according to claim 2 or 3", the technical idea of ​​changing "the mounting device according to claim 1 or 2" in claim 5 at the time of application to "the mounting device according to any one of claims 1 to 4", the technical idea of ​​changing "the mounting device according to claim 5" in claim 6 at the time of application to "the mounting device according to any one of claims 1 to 5", the technical idea of ​​changing "the mounting device according to claim 1 or 2" in claim 7 at the time of application to "the mounting device according to any one of claims 1 to 6", The technical idea of ​​changing "the mounting device according to claim 1 or 2" in claim 8 to "the mounting device according to any one of claims 1 to 7", the technical idea of ​​changing "the mounting device according to claim 7" in claim 9 as originally filed to "the mounting device according to any one of claims 1 to 8", the technical idea of ​​changing "the mounting device according to claim 9" in claim 10 as originally filed to "the mounting device according to any one of claims 1 to 9", and the technical idea of ​​changing "the mounting device according to claim 1 or 2" in claim 11 as originally filed to "the mounting device according to any one of claims 1 to 10" are also disclosed.

[0058] The present disclosure can be used in technical fields such as component mounting processing.

[0059] 10 Mounting device, 11 Tape feeder, 12 Substrate transport section, 15 (15L, 15R) Head moving section, 15a X-axis moving section, 15b Y-axis moving section, 16 Slider, 17 (17L, 17R) Mark camera, 18 (18L, 18R) Parts camera, 19, 19B Temporary mounting stand, 20 Control section, 21, 71 CPU, 22, 72 ROM, 23, 73 HDD, 24, 74 RAM, 30 (30L, 30R) Head, 31 Head body, 32 Nozzle holder, 35 Nozzle, 40 R-axis driving device, 41 R-axis motor, 42 R-axis, 43 Transmission gear, 50 Q-axis driving device, 51 Q-axis motor, 52 Cylindrical gear, 52a Spur gear, 53 Transmission gear, 54 Q-axis gear, 60: first Z-axis drive device, 61, 66: Z-axis motor, 62, 67: Z-axis slider, 65: second Z-axis drive device, 70: management device, 75: input device, 76: display, P, P1 to P4, P11 to P14: temporary attachment points, Ps: specific component, S: board.

Claims

1. A mounting device that uses a pickup member to pick up and mount components, comprising: a head capable of raising and lowering two or more pickup members simultaneously; an imaging unit capable of capturing an image of the top surface of a component; a temporary mounting stand onto which a specific component having a predetermined characteristic portion formed on its top surface is temporarily mounted; and a control unit that, when mounting the specific component, controls the head and the imaging unit to execute a temporary mounting control that causes the specific component picked up by the pickup member to be temporarily mounted on the temporary mounting stand, an imaging control that captures an image of the top surface of the temporarily mounted specific component, and a re-collection control that causes the pickup member to re-collect the specific component from the temporary mounting stand, and controls the head so that two or more pickup members at least simultaneously rise or fall in at least one of the temporary mounting control and the re-collection control.

2. The mounting device according to claim 1, wherein the control unit controls the head so that two or more of the collection members simultaneously rise and fall in both the temporary attachment control and the re-collection control.

3. The mounting device according to claim 1 or 2, wherein the control unit processes the top surface image to recognize the positional deviation of the characteristic part of the specific component, and controls the head in the re-picking control to mount the specific component at a mounting position corrected based on the position at which the pickup member re-picked the specific component and the positional deviation.

4. The mounting device according to claim 2, wherein the control unit controls the head so that the pickup member re-picks up the specific component in the re-picking control, using the same target position as when the pickup member temporarily mounted the specific component in the temporary mounting control.

5. The mounting device according to claim 1 or 2, wherein the control unit processes the top surface image to recognize positional deviations of the characteristic parts of the specific component, and controls the head so that the collection member re-collects the specific component in the re-collection control, using a position corrected based on the recognized positional deviation as a target position.

6. The mounting device according to claim 1, wherein the control unit processes the top surface image to recognize positional deviation of the characteristic part of the specific component, and if the recognized positional deviation is equal to or greater than a predetermined amount, controls the head in the re-collection control so that the collection member re-collects the specific component individually.

7. The mounting device according to claim 1 or 2, wherein the temporary attachment table is provided with a plurality of temporary attachment points which are greater than the number of the collection members which can be raised and lowered simultaneously, and the control unit repeatedly executes the temporary attachment control of simultaneously raising and lowering the collection members so as to temporarily attach the specific components to all of the plurality of temporary attachment points, and then controls the head and the imaging unit to execute the imaging control of the temporarily attached specific components.

8. The mounting device according to claim 1 or 2, wherein the temporary attachment table has a plurality of temporary attachment points arranged at predetermined intervals in a predetermined direction, the number of temporary attachment points being greater than the number of collection members that can be raised and lowered simultaneously, and wherein the control unit controls the head to move by an amount corresponding to the predetermined intervals during the temporary attachment control and the re-collection control.

9. The mounting device according to claim 7, wherein the head is arranged so that the collection member can be rotated in the circumferential direction and is capable of simultaneously raising and lowering the collection member at two locations in the circumferential direction, and the temporary attachment stand is arranged so that the temporary attachment points are aligned in the specified direction at intervals that are approximately half the interval in the specified direction between the two locations that can be simultaneously raised and lowered.

10. The mounting device according to claim 9, wherein the temporary attachment table has a plurality of rows in which the temporary attachment points are arranged in the predetermined direction, the rows being arranged in a direction substantially perpendicular to the predetermined direction.

11. The mounting device according to claim 1 or 2, wherein the temporary attachment stand has a plurality of temporary attachment points arranged in a predetermined direction, the number of which is greater than the number of collection members that can be raised and lowered simultaneously, the imaging unit is configured to move together with the head, and the control unit controls the head so that, in the temporary attachment control, the temporary attachment stand moves from one end to the other end in the predetermined direction, in the imaging control, the head moves from the other end to the one end, and in the re-collection control, the head moves from the one end to the other end.

12. A mounting method for picking up and mounting a component using a picking member, comprising: (a) when mounting a specific component having a predetermined characteristic portion formed on its upper surface, a step of executing a temporary mounting control for temporarily mounting the specific component picked up by the picking member on a temporary mounting stand, an imaging control for causing an imaging unit to capture an image of the top surface of the temporarily mounted specific component, and a re-picking control for having the picking member re-pick up the specific component from the temporary mounting stand; and (b) a step of simultaneously raising or simultaneously lowering two or more of the picking members in at least one of the temporary mounting control and the re-picking control.

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