Resin application device

Abstract

The present invention relates to a resin application device and, more specifically, to a resin application device comprising: a resin spraying unit for applying a resin to an electronic component mounted on an assembly substrate; and a camera unit for acquiring an image of the assembly substrate, wherein initial application position setting is automatically performed when a nozzle of the resin spraying unit is replaced. The resin application device according to the present invention for solving the technical problem may comprise a control unit for correcting the application position using proportional integral control when actual application coordinates are included in a proportional control area while in an initial application position setting mode.

Description

Resin application device

[0001] The present invention relates to a resin application device, and more specifically, to a resin application device that automatically performs initial application position setting when a nozzle of a resin injection unit that applies resin to an electronic component mounted on an assembly board is replaced.

[0002] The electronics industry is currently experiencing a trend toward mass distribution of lightweight, miniaturized, high-speed, multi-functional, and highly reliable products by major global manufacturers. These products typically utilize mass-produced, standardized components that incorporate proprietary technologies.

[0003] For example, smartphones are exclusively supplied to the global market by a few companies with global brands, and the components used in the flagship models of these companies must be produced in quantities incomparable to those previously produced, and the supply price is lowered to reflect the expanded production.

[0004] Therefore, since the advantages of mass production of limited items must be maximized, reducing the work time for preparatory work and initial correction processes that were naturally performed in previous production processes has become an important technical challenge that must be solved.

[0005] When the nozzle of the dispenser in the resin dispensing device is replaced, the production operation of the resin dispensing device is stopped and the test dispensing process is repeated to set the initial dispensing position while the operator manually corrects the dispensing position. However, this may cause the accuracy of the initial dispensing position setting to be affected by deviations among operators, which may result in a deterioration in production quality.

[0006] Additionally, downtime loss occurs, corresponding to the time it takes to stop and set up production operations. Depending on the production equipment, downtime loss has been found to result in a decline in production output of approximately 2% to 7%.

[0007] And after performing the initial application location setting, the application work is continuously performed at the same location without real-time location correction, so the probability of defects occurring due to deviations that occur depending on the location where the actual assembly board is installed increases, which may ultimately lead to a decrease in production quantity.

[0008] There is a need to develop a technology for a resin coating device that improves these problems.

[0009] The technical challenge of the present invention is to automatically perform initial application position setting when a resin injection nozzle is replaced, thereby preventing downtime loss equivalent to the time required to stop production and set the position. Furthermore, it corrects deviations in real time when performing production after initial application position setting.

[0010] The resin application device of the present invention for solving the above technical problem may include a resin spraying unit for applying resin to an electronic component mounted on an assembly board, a camera unit for obtaining an image of the assembly board, and a control unit for controlling the resin spraying unit and correcting the position of the applied resin from the image obtained from the camera unit.

[0011] In some embodiments of the present invention, the control unit may perform an initial application position setting mode that automatically obtains correction application coordinates during initial setting.

[0012] In some embodiments of the present invention, the control unit may correct the application position using proportional integral control when the actual application coordinates are included in the proportional control area during the initial application position setting mode.

[0013] In some embodiments of the present invention, the control unit may stop the chart position correction when the actual application coordinates are included in the target area during the initial application position setting mode.

[0014] In some embodiments of the present invention, the control unit may limit the number of application processes for correction in the initial application position setting mode.

[0015] In some embodiments of the present invention, it may be characterized in that electronic components are not mounted on the same number of assembly boards as the number of application processes in the initial application position setting mode.

[0016] In some embodiments of the present invention, the resin dispensing unit may include a dispenser and a dispenser control unit.

[0017] In some embodiments of the present invention, the control unit may perform an operation mode in which actual continuous application work is performed after performing initial application position setting.

[0018] In some embodiments of the present invention, the control unit can correct the difference between the target application coordinates and the corrected application coordinates in the work mode.

[0019] According to the resin application device of the present invention, when the nozzle of the resin injection unit is replaced, the initial application position setting is automatically performed, thereby reducing the downtime loss that occurs equivalent to the time for stopping and setting the production work.

[0020] In addition, it can solve the problem of low accuracy in initial application position setting depending on the deviation of each worker, and can drastically reduce the probability of defects occurring during production work after initial application position setting.

[0021] Figure 1 is a drawing showing a resin application device according to one embodiment of the present invention.

[0022] FIG. 2 is a drawing showing an initial setting process of a resin application device according to one embodiment of the present invention.

[0023] Fig. 3 is a drawing showing the resin application control coordinates according to Fig. 2.

[0024] FIG. 4 is a drawing showing resin application control coordinates of an operation mode of a resin application device according to one embodiment of the present invention.

[0025] The advantages and features of the present invention, and the methods for achieving them, will become clearer with reference to the embodiments described in detail below together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms. These embodiments are provided only to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims. Like reference numerals designate like elements throughout the specification.

[0026] “And / or” includes each and every combination of one or more of the items mentioned.

[0027] The terminology used herein is for the purpose of describing embodiments only and is not intended to limit the present invention. In this specification, the singular also includes the plural unless specifically stated otherwise. As used herein, the terms "comprises" and / or "comprising" do not exclude the presence or addition of one or more other components, steps, operations, and / or elements mentioned.

[0028] Additionally, throughout the specification, when a part is said to be "connected" to another part, this includes not only cases where it is "directly connected," but also cases where it is "indirectly" or "electrically connected" with other members or components in between.

[0029] Additionally, throughout the specification, the description that each layer (film), region, pattern or structure is formed "on" or "under" the substrate, each layer (film), region, pad or pattern includes both being formed directly or through the interposition of another layer. The criteria for being on / over or under / under each layer are explained based on the drawings.

[0030] Additionally, expressions such as 'first, second', etc. are used only to distinguish between multiple components, and do not limit the order or other characteristics between the components.

[0031] In addition, the flowcharts illustrated in the drawings are merely exemplary sequences for obtaining the most desirable results in carrying out the present invention, and it is obvious that other steps may be added or some steps may be deleted.

[0032] Unless otherwise defined, all terms (including technical and scientific terms) used herein may be used in their common sense to those of ordinary skill in the art to which the present invention pertains. Furthermore, terms defined in commonly used dictionaries are not to be interpreted ideally or excessively unless explicitly and specifically defined otherwise.

[0033] Hereinafter, a resin application device according to the present invention will be described with reference to the drawings.

[0034] FIG. 1 is a drawing showing a resin application device according to one embodiment of the present invention, where (A) shows a resin application device and an assembly substrate on which resin is applied, and (B) shows a plan view of the assembly substrate.

[0035] Referring to FIG. 1, a resin application device (1) according to the present invention may include a resin spraying unit (20) that applies resin (37) to an electronic component (33) mounted on an assembly board (30), a camera unit (12) that acquires an image of the assembly board (30), and a control unit (10) that controls the resin spraying unit (20) and corrects the position of the applied resin (37) from the image acquired by the camera unit (12).

[0036] The above control unit (10) may include a microcontroller, a storage device, and peripheral circuits. The control unit (10) may perform calculations and control operations of the resin application device according to the present invention by a microcontroller that executes a program stored in the storage device.

[0037] The above resin injection unit (20) may include a dispenser (21) and a dispenser control unit (22) that controls the operation of the dispenser (21), and the nozzle of the dispenser (21) may be replaced as needed during operation.

[0038] For example, the electronic component (33) may be a heterogeneous component (e.g., a coil) including an electronic component lead (34) formed of a wire. The electronic component lead (34) of such an electronic component (33) may be mounted on an assembly board (30) as a heterogeneous mount, and then the electronic component lead (34) and the board land (31) of the assembly board (30) may be connected by laser welding.

[0039] In order to secure a stable connection of the electronic component (33) mounted on the assembly board (30) in this way, a resin (37) may be applied to the connection portion of the board land (31) and the electronic component lead (34).

[0040] The above resin (37) may be an adhesive that can stably fix the electronic component lead (34) to the substrate land (31).

[0041] The above resin (37) can be sprayed in an appropriate amount by adjusting the amount by the dispenser (21), and may be an epoxy resin that is liquid when sprayed but hardens over time or with heat.

[0042] The above assembly board (30) is placed on a moving line (40), and when the resin application work on the assembly board (30) is completed, it can be moved on the moving line (40).

[0043] The control unit (10) of the resin application device (1) according to the present invention can perform an initial application position setting mode that automatically obtains a correction application coordinate during initial setting, and can correct the application position using proportional integral control when the actual application coordinate (57) is included in the proportional control area during the initial application position setting mode.

[0044] In addition, the control unit (10) can stop the chart position correction when the actual application coordinates (57) are included in the target area in the initial application position setting mode.

[0045] FIG. 2 is a drawing showing an initial setting process of a resin application device according to one embodiment of the present invention, where (A) is a description of each process and (B) is a plan view of an assembly substrate (30) for each process.

[0046] Referring to FIG. 2, when an assembly board (30) with an electronic component (33) mounted thereon, such as #1-1 of (B) in the first #1 process, is placed in a resin application device (1), the camera unit (12) can acquire an image of the assembly board (30) and transmit it to the control unit (10).

[0047] The above control unit (10) can extract the center coordinates of the substrate land (310), such as #1-2 of (B), from the image. The extracted center coordinates become the target application coordinates (55), (Xp, Yp) to which the resin (37) should be applied.

[0048] In the second #2 process, the dispenser (21) can apply the resin (37) to the assembly substrate (30) as in #2 of (B) under the control of the control unit (10).

[0049] In the next third process #3, the camera unit (12) can acquire an image of the assembly board (30) and transmit it to the control unit (10).

[0050] The above control unit (10) can extract the center coordinates of the applied resin (37), such as #3 of (B), from the image. The extracted center coordinates become the actual applied coordinates (57), (Xe, Ye) where the resin (37) is actually applied.

[0051] In the fourth process #4, the control unit (10) can perform position deviation calculation and position correction using the target application coordinates (55) (Xp, Yp) and actual application coordinates (57) (Xe, Ye) extracted as described above.

[0052] In this way, the nth resin application task is completed, and the n+1th resin application task with the corrected position reflected can be performed repeatedly.

[0053] Fig. 3 is a drawing showing the resin application control coordinates according to Fig. 2.

[0054] Referring to Fig. 3, the position deviation calculation and correction process is described in detail.

[0055] As shown in Fig. 3, the extracted target application coordinates (55) (Xp, Yp) and actual application coordinates (57) (Xe, Ye) can be displayed in XY coordinates.

[0056] The target application coordinates (55) (Xp, Yp) are the center of the substrate land (31) and indicate the target position where application should be performed.

[0057] The actual application coordinates (57) (Xe, Ye) are the locations where the actual resin (37) is applied.

[0058] At this time, the area inside a square formed by lines spaced apart from the target application coordinates (55) (Xp, Yp) in the + direction of the X-axis by the first upper limit Xuth, in the - direction by the first lower limit Xlth, in the + direction of the Y-axis by the first upper limit Yuth, and in the - direction by the first lower limit Ylth can be set as the target area. The target area means an area where correction is completed without the need for further correction when the actual application coordinates (57) (Xe, Ye) are detected within the area.

[0059] Also, an area inside a rectangle formed by lines spaced apart from the target application coordinates (55) (Xp, Yp) in the + direction of the X-axis by a second upper limit Xu, in the - direction by a second lower limit Xl, in the + direction of the Y-axis by a second upper limit Yu, and in the - direction by a first lower limit Yl may be set as a proportional control area. The proportional control area means an area in which correction is performed using proportional integral control when the actual application coordinates (57) (Xe, Ye) are detected within the area.

[0060] First, the difference between the actual application coordinates (57) (Xe, Ye) and the target application coordinates (55) (Xp, Yp) can be calculated to obtain ΔPosition1, (Xd, Yd) = (Xe-Xp, Ye-Yp).

[0061] When the absolute value of Δposition1 is greater than the second upper limit (Xu, Yu) in the + direction of the axis, or greater than the second lower limit (Xl, Yl) in the - direction of the axis, it can be determined that the actual application coordinates (57) (Xe, Ye) are located outside the proportional control area.

[0062] If the actual application coordinates (57) (Xe, Ye) are located outside the proportional control area, correction can be performed by reflecting the value of Δposition1 100%.

[0063] When the absolute value of Δposition1 is less than the second upper limit (Xu, Yu) in the + direction of the axis, or less than the second lower limit (Xl, Yl) in the - direction of the axis, it can be determined that the actual application coordinates (57) (Xe, Ye) are located inside the proportional control area.

[0064] If the actual application coordinates (57) (Xe, Ye) are located inside the proportional control area, compensation can be performed by performing proportional integral control using the value of Δposition1.

[0065] The first initial application position setting mode performs proportional compensation because there is no accumulated Δposition1 value to reflect in integral control. However, compensation can be performed through proportional-integral control from the second mode onward.

[0066] When the absolute value of Δposition1 is less than the first upper limit (Xuth, Yuth) in the + direction of the axis, or less than the first lower limit (Xlth, Ylth) in the - direction of the axis, it can be determined that the actual application coordinates (57) (Xe, Ye) are located within the target area. At this time, the initial application position setting can be completed without further correction.

[0067] The final corrected coordinate values ​​obtained in this way can become the corrected application coordinates, (Xcal, Ycal).

[0068] The proportional parameters and integral parameters required for proportional integral control can be set by taking into account the allowable error range of the application position of the resin application device, the allowable error range when the assembly board is installed on the moving line, and the number of corrections to be performed.

[0069] As described above, through proportional integral control, the corrected coating coordinates, (Xcal, Ycal), which reflect the allowable error range when the assembly board is installed on the moving line can be obtained.

[0070] The control unit (10) of the resin application device (1) according to the present invention can limit the number of application processes for correction in the initial application position setting mode.

[0071] The number of times that can be operated stably can be set by reflecting actual operating performance and allowable error range.

[0072] In addition, when the number of application processes is determined in the initial application position setting mode as described above, electronic components can be inserted without being mounted on an assembly board equal to the number of application processes. This is to reduce waste when the assembly board used in the initial setting mode is discarded.

[0073] The control unit (10) of the resin application device (1) according to the present invention can perform the actual application work continuously without interruption after performing the initial application position setting. This process is set as the work mode.

[0074] In the above working mode, the difference between the target application coordinates (55) and the correction application coordinates (59) can be corrected.

[0075] FIG. 4 is a drawing showing resin application control coordinates of an operation mode of a resin application device according to one embodiment of the present invention.

[0076] Referring to FIG. 4, the control unit (10) of the present invention can set the correction application coordinates (59) (Xcal, Ycal) obtained in the initial application position setting mode as a reference value.

[0077] In the work mode, the target application coordinates (55) (Xp, Yp) can be detected from the image of the newly introduced assembly board (30).

[0078] By calculating the difference between the correction application coordinates (59) (Xcal, Ycal) and the target application coordinates (55) (Xp, Yp), ΔPosition2 (Xd, Yd) = (Xe-Xp, Ye-Yp) can be obtained.

[0079] In the working mode, resin application can be performed by directly reflecting ΔPosition2, which reflects the difference between the above-mentioned correction application coordinates (59) (Xcal, Ycal) and the above-mentioned target application coordinates (55) (Xp, Yp).

[0080] In this way, the deviation when a newly introduced assembly board (30) is installed on a moving line (40) can be corrected in real time.

[0081] Although the present invention has been described as above, those skilled in the art will recognize that the present invention can be implemented in other forms while maintaining the technical spirit and essential features of the present invention.

[0082] The scope of the present invention will be defined by the patent claims, but it should be interpreted that not only the configuration directly derived from the description of the patent claims, but also all changes or modified forms derived from equivalent configurations are included in the scope of the present invention.

Claims

1. A resin spraying unit that applies resin to electronic components mounted on an assembly board; A camera unit for acquiring an image of the above assembly board; and A resin application device comprising a control unit that controls the resin injection unit and corrects the position of the applied resin from an image obtained from the camera unit.

2. In paragraph 1, The above control unit is a resin application device that performs an initial application position setting mode that automatically obtains correction application coordinates during initial setting.

3. In paragraph 2, The above control unit is a resin application device that corrects the application position using proportional integral control when the actual application coordinates are included in the proportional control area in the initial application position setting mode.

4. In paragraph 2, The above control unit is a resin application device that stops the chart position correction when the actual application coordinates are included in the target area in the initial application position setting mode.

5. In paragraph 2, The above control unit is a resin application device that limits the number of application processes for correction in the initial application position setting mode.

6. In paragraph 5, A resin application device characterized in that electronic components are not mounted on an assembly board the same number of times as the number of application processes in the initial application position setting mode.

7. In paragraph 1, A resin application device, wherein the resin injection unit includes a dispenser and a dispenser control unit.

8. In paragraph 1, The above control unit is a resin application device that performs an operation mode in which actual continuous application work is performed after performing initial application position setting.

9. In paragraph 8, The above control unit is a resin application device that corrects the difference between the target application coordinates and the corrected application coordinates in the above work mode.

Images