Electroplating fixture, electroplating device, electroplating anode apparatus and electroplating apparatus

Abstract

An electroplating fixture, an electroplating device, an electroplating anode apparatus, and an electroplating apparatus. The electroplating fixture comprises a fixed conductive plate and a movable conductive plate. and further comprises: a conductive frame connected to the fixed conductive plate; a first conductive block arranged on the conductive frame and electrically connected to the fixed conductive plate by means of the conductive frame; and a second conductive block arranged on the conductive frame, wherein the second conductive block is insulated from the first conductive block, and the second conductive block is electrically connected to the movable conductive plate. By arranging on the conductive frame the first conductive block and the second conductive block that are insulated from each other, the first conductive block and the second conductive block enable different currents to flow through. All clamping points on the same side share the same current contact point. The uniformity of an electroplating layer during double-sided simultaneous electroplating is achieved by respectively applying different currents to the clamping points on the two sides.

Description

Electroplating clamp, electroplating equipment, electroplating anode device and electroplating device

[0001] Cross-reference to related applications

[0002] The present application claims priority to the Chinese patent application No. 202420927299.4, filed on April 29, 2024, and entitled "Electroplating clamp and electroplating equipment", and the Chinese patent application No. 202422017468.3, filed on August 19, 2024, and entitled "Electroplating anode device and electroplating device", the contents of which are incorporated herein by reference in their entirety. TECHNICAL FIELD

[0003] The present application belongs to the technical field of battery and semiconductor manufacturing and the technical field of metal electroplating, and specifically relates to an electroplating clamp, an electroplating equipment, an electroplating anode device and an electroplating device. BACKGROUND

[0004] With the rapid development of the photovoltaic industry, the industrial production technology of solar cells is becoming more and more diversified. At present, the photovoltaic electrode manufacturing process uses a screen printing silver electrode process, which consumes a large amount of silver paste, and the cost of silver paste is relatively high. Electroplating copper technology has the advantages of low cost and better conductivity than silver paste, and is considered to be the most potential photovoltaic electrode manufacturing process to realize silver-free photovoltaic.

[0005] In the related prior art, after the electroplating tool clamp clamps the battery to be electroplated, a cathode connector is generally used. Due to the inconsistency of the number and patterning of the grid lines on both sides of the battery, there is a certain difference in the plating area of each side. If the same current is passed through both sides, it will cause a significant difference in the thickness of the plating layer on both sides of the battery.

[0006] Electroplating is a process of plating a thin layer of other metal or alloy on the surface of certain metal by using electrolysis, which is a process of attaching a metal film to the surface of a metal or other material part by using electrolysis.

[0007] The existing electroplating treatment device generally fixes the anode plate directly on the anode shell, which cannot well guarantee the distance and parallelism between the metal plates. When the electroplated part passes through the gap between the anode plates, the unreasonable spacing and parallelism can easily lead to uneven electroplating, reducing the yield. Moreover, the existing anode plate cannot be disassembled, and when the metal layer on the anode plate is consumed, the entire anode plate needs to be replaced, which is very troublesome.

[0008] SUMMARY

[0009] Therefore, the present application provides an electroplating clamp and an electroplating equipment to solve the problem of uneven electroplating caused by the same current passing through the clamping points on both sides in the prior art.

[0010] In one aspect, the application provides an electroplating fixture, comprising a fixed conductive plate and a movable conductive plate, the electroplating fixture further comprising: a conductive frame connected with the fixed conductive plate; a first conductive block arranged on the conductive frame, the first conductive block being electrically connected with the fixed conductive plate through the conductive frame; and a second conductive block arranged on the conductive frame, the second conductive block being insulated from the first conductive block and electrically connected with the movable conductive plate.

[0011] The above-mentioned embodiments have the beneficial effects that the first conductive block and the second conductive block are arranged on the conductive frame and insulated from each other, so that the first conductive block and the second conductive block can flow through different currents. The same current contact point is used for all clamping points on the same surface, and the uniformity of the electroplating layer during double-sided simultaneous electroplating is achieved by passing different currents through the clamping points on the two surfaces.

[0012] As an optional embodiment, the conductive frame is arranged outside the fixed conductive plate.

[0013] As an optional embodiment, the conductive frame comprises: a first support electrically connected with the fixed conductive plate, the first support extending away from the fixed conductive plate; and a second support connected with one end of the first support away from the fixed conductive plate, the second support and the first support forming an included angle therebetween; wherein the movable conductive plate and the first conductive block are arranged on the second support, respectively.

[0014] The above-mentioned embodiments have the beneficial effects that the first support extends away from the fixed conductive plate, so that a gap is formed between the second support and the fixed conductive plate, thereby accommodating the upward extending part of the movable conductive plate and forming installation spaces for the first conductive block and the second conductive block.

[0015] As an optional embodiment, the movable conductive plate is provided with a first via, and the first support penetrates through the first via, so that the movable conductive plate is located between the fixed conductive plate and the second support.

[0016] As an optional embodiment, the conductive frame further comprises an insulating member arranged between the first conductive block and the movable conductive plate.

[0017] The above-mentioned embodiments have the beneficial effects that the first conductive block and the movable conductive plate are insulated by the insulating member, so that the currents flowing through the first conductive block and the second conductive block can be independent of each other.

[0018] As an optional implementation, the insulating member comprises: a first insulating part arranged between the first conductive block and the movable conductive plate; and a second insulating part arranged between the first conductive block and the second conductive block.

[0019] The above-mentioned implementation has the beneficial effect that the first conductive block and the second conductive block are insulated by the second insulating part, and the insulation effect is better.

[0020] As an optional implementation, the conductive frame further comprises a conductive member electrically connected with the movable conductive plate, the first conductive block is insulatedly connected with the conductive member, and the second conductive block is electrically connected with the conductive member.

[0021] The above-mentioned implementation has the beneficial effect that the movable conductive plate and the second conductive block are connected by the conductive member, the conductive member can be a copper plate, and the conductive effect between the second conductive block and the movable conductive plate is better.

[0022] As an optional implementation, the first conductive block and / or the second conductive block has a structure of being wide at the top and narrow at the bottom.

[0023] The above-mentioned implementation has the beneficial effect that the first conductive block and the second conductive block are arranged to be wide at the top and narrow at the bottom, so as to facilitate input of current to the first conductive block and the second conductive block.

[0024] In another aspect, the application further provides an electroplating device, which comprises the electroplating clamp of any one of the above-mentioned implementations.

[0025] The above-mentioned implementation has the beneficial effect that the electroplating device comprises the electroplating clamp of any one of the above-mentioned implementations, so that the electroplating device has all the beneficial effects of the electroplating clamp, which will not be described herein again.

[0026] The electroplating device further comprises a conductive seat having a recess, the shape of the recess being matched with the shapes of the first conductive block and the second conductive block of the electroplating clamp, so as to support the first conductive block and the second conductive block.

[0027] The above-mentioned implementation has the beneficial effect that the tower body structure of the electroplating clamp is simple and the stress is clear, and the structure of the electroplating clamp is more stable.

[0028] The technical problem to be solved by the application is also to overcome the existing electroplating treatment device, the anode plate is generally directly fixed on the anode shell, and the distance and parallelism between the metal plates cannot be well guaranteed, when the electroplated piece passes through the gap between the anode plates, the unreasonable distance and parallelism easily lead to uneven electroplating, and the yield is reduced, and the existing anode plate cannot be disassembled, when the metal layer on the anode plate is consumed, the staff needs to re-coat in the electroplating tank, which is very troublesome.

[0029] In another aspect, the application provides an electroplating anode device, comprising:

[0030] a conductive base frame;

[0031] a mounting structure, the mounting structure comprising a first mounting member and a second mounting member, the first mounting member being connected to the conductive base frame, the first mounting member comprising a mounting portion; the second mounting member being provided in plurality, the plurality of second mounting members being arranged on the first mounting member in an array;

[0032] an anode mounting structure, the anode mounting structure comprising an anode member and a third mounting member, the anode member being connected to the third mounting member, the third mounting member and / or the first mounting member being provided with a mounting slot;

[0033] wherein the anode mounting structure is provided in plurality, the plurality of anode mounting structures being mounted to the first mounting member in abutment with the second mounting member, the third mounting member being connected to the first mounting member in plug-in connection.

[0034] The beneficial effects of the above embodiment include that the anode member is mounted on the first mounting member by virtue of the mounting slot design between the first mounting member, the second mounting member and the third mounting member, which ensures the parallelism between the anode members after mounting, effectively improves the production capacity, and ensures the flatness of the anode member, accurately controls the distance between adjacent anode members, and improves the product yield.

[0035] Optionally, the third mounting member is provided with at least two first mounting slots on the side away from the anode member, and when the third mounting member is mounted to the first mounting member, the first mounting member is inserted into the first mounting slots.

[0036] The beneficial effects of the above embodiment include that the first mounting slot is provided below the third mounting member, and the anode member is directly inserted into the first mounting member by virtue of the cooperation between the first mounting slot and the first mounting member, which facilitates the installation while ensuring the parallelism.

[0037] Optionally, the first mounting member further comprises a mounting base, the mounting base being connected to the conductive base frame.

[0038] The mounting portion is provided in two, and the two mounting portions are oppositely arranged on both sides of the mounting base.

[0039] The beneficial effects of the above embodiment include that the mounting portion is provided in two, and the double-point positioning ensures that the anode member is in a vertical state after installation, and ensures the parallelism between the plurality of anode members.

[0040] Optionally, the second mounting member is provided with a second mounting slot on one side close to the first mounting member, and the mounting portion is provided with an insertion slot, the second mounting slot is adapted to be inserted into the insertion slot to mount the second mounting member on the first mounting member.

[0041] Optionally, the third mounting member is provided with a first mounting hole on two sides, and the second mounting member is provided with a second mounting hole on two sides.

[0042] When the anode mounting structure is mounted on the mounting portion, the first mounting hole and the second mounting hole are opposite to form a mounting channel matched with a fastener.

[0043] The beneficial effects of the above embodiment include that the anode member has a certain service life due to the loss in the production process of the anode member, and the metal coating is used. When the metal coating on the anode member is worn out, the bolt can be removed to detach the anode mounting structure from the mounting structure for repair, without the need for overall replacement, thereby reducing the maintenance cost.

[0044] Optionally, the anode member is provided in a mesh structure.

[0045] The beneficial effects of the above embodiment include that the anode member is provided in a mesh structure, which facilitates the flow of the electroplating solution and improves the uniformity of metal ions in the solution, thereby improving the uniformity of electroplating.

[0046] Optionally, the conductive base frame is made of titanium-coated copper material.

[0047] The beneficial effects of the above embodiment include that the use of titanium-coated copper material reduces the resistance value while ensuring corrosion resistance, thereby ensuring the uniformity of the electric field of each anode mesh.

[0048] Optionally, the conductive base frame includes an assembly portion and an electrical connection portion, the electrical connection portion is provided with two, and the two electrical connection portions are respectively arranged on two sides of the assembly portion, the electrical connection portion is adapted to be placed above the surface of the electroplating solution to be connected to the power supply, and the assembly portion is adapted to be placed below the surface of the electroplating solution.

[0049] Optionally, the conductive base frame is provided with a first assembly hole, and the mounting base is provided with a second assembly hole, the first assembly hole is adapted to be opposite to the second assembly hole to form an assembly channel.

[0050] The beneficial effects of the above embodiment include that when the first mounting member fails, the first mounting member and the conductive base frame can be detached, thereby improving the flexibility of the entire device and facilitating the workers to disassemble and assemble.

[0051] In another aspect, the application also provides an electroplating device, comprising the electroplating anode device.

[0052] The electroplating anode device and the electroplating device provided by the application have the following advantages.

[0053] 1. The electroplating anode device provided by the application comprises a conductive base frame, a mounting structure and an anode mounting structure, the mounting structure comprises a first mounting member and a second mounting member, the first mounting member is connected with the conductive base frame, and the first mounting member is provided with at least two mounting portions arranged in parallel; the second mounting member is provided in plurality, and the plurality of second mounting members are arranged in an array on the first mounting member; the anode mounting structure comprises an anode member and a third mounting member, the anode member is connected with the third mounting member, and the third mounting member and / or the first mounting member is provided with a mounting groove. The anode mounting structure is provided in plurality, the plurality of anode mounting structures are mounted to the first mounting member in combination with the second mounting member, and the third mounting member is connected with the first mounting member in a plug-in manner.

[0054] This structure uses the mounting groove designed between the first mounting member, the second mounting member and the third mounting member to mount the anode member on the first mounting member, so as to ensure the parallelism between the anode members after the anode members are mounted, effectively improve the production capacity, ensure the flatness of the anode members, accurately control the distance between the adjacent anode members, and improve the product yield. By fixing the second mounting member and the third mounting member in an array on the first mounting member, the distance between any two adjacent anode members is ensured to be the same, the uniformity of electroplating is improved, and the yield is improved. Moreover, the mounting structure and the anode mounting structure are detachable structures, when the metal coating on the anode member is worn out, the anode mounting structure can be removed from the mounting structure for repair, without the need of overall replacement, thereby reducing the maintenance cost. BRIEF DESCRIPTION OF DRAWINGS

[0055] In order to more clearly illustrate the specific embodiments of the application or the technical solutions in the prior art, the drawings needed in the following description of the specific embodiments or the prior art will be briefly introduced. Obviously, the drawings in the following description are some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor.

[0056] Fig. 1 is a perspective structural schematic view of the electroplating clamp of the embodiment of the application;

[0057] Fig. 2 is an enlarged structural schematic view of A in Fig. 1;

[0058] Fig. 3 is a perspective structural schematic view of the conductive frame of the electroplating clamp of the embodiment of the application;

[0059] Fig. 4 is an enlarged structural schematic view of B in Fig. 3;

[0060] Fig. 5 is a front view of an electroplating fixture according to an embodiment of the present application;

[0061] Fig. 6 is a schematic view of an electroplating anode device according to an embodiment of the present application;

[0062] Fig. 7 is a schematic view of a conductive base frame and a mounting structure according to an embodiment of the present application;

[0063] Fig. 8 is a schematic view of a conductive base frame and a first mounting member according to an embodiment of the present application;

[0064] Fig. 9 is a side view of a first mounting member according to an embodiment of the present application;

[0065] Fig. 10 is a front view of an anode member according to an embodiment of the present application;

[0066] Fig. 11 is a front view of a second mounting member according to an embodiment of the present application;

[0067] Fig. 12 is a schematic view of an electroplating apparatus according to an embodiment of the present application.

[0068] Reference Signs List:

[0069] 100, electroplating fixture; 110, fixed conductive plate; 120, movable conductive plate; 1201, first via hole; 130, conductive frame; 131, first support; 132, second support; 133, insulating member; 1331, first insulating portion; 1332, second insulating portion; 134, conductive member; 140, first conductive block; 150, second conductive block; 160, first metal fastener; 170, second metal fastener;

[0070] 1, conductive base frame; 11, first assembly hole;

[0071] 2, mounting structure; 21, first mounting member; 211, mounting base; 212, mounting portion; 213, insertion slot; 22, second mounting member; 221, second mounting slot; 222, second mounting hole;

[0072] 3, anode mounting structure; 31, anode member; 32, third mounting member; 321, first mounting slot; 322, first mounting hole;

[0073] 4, electroplating cell;

[0074] 510, first conductive clamping piece; 520, second conductive clamping piece; 530, movable conductive shaft; 540, fixed conductive shaft. DETAILED DESCRIPTION

[0075] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0076] In the description of the present application, it should be noted that the orientations or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first" and "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0077] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0078] In addition, the technical features involved in the different embodiments of the present application described below can be combined with each other as long as there is no conflict between them.

[0079] The embodiments of the present application will be described below with reference to FIGS. 1 to 12.

[0080] Embodiment 1

[0081] As shown in FIGS. 1 and 2, the embodiments of the present application provide an electroplating clamp 100, which comprises a fixed conductive plate 110 and a movable conductive plate 120, and further comprises a conductive frame 130, a first conductive block 140 and a second conductive block 150. The conductive frame 130 is connected with the fixed conductive plate 110. The first conductive block 140 is arranged on the conductive frame 130 and is electrically connected with the fixed conductive plate 110 through the conductive frame 130. The second conductive block 150 is arranged on the conductive frame 130 and is insulated from the first conductive block 140, and the second conductive block 150 is electrically connected with the movable conductive plate 120.

[0082] Understandably, the electroplating fixture 100 further comprises fixed conductive shafts 540 and movable conductive shafts 530, the fixed conductive plates 110, the fixed conductive shafts 540 and the movable conductive shafts 530 form a frame structure. Among them, two fixed conductive plates 110 are oppositely arranged and parallel to each other, one end of the fixed conductive shaft is connected with one of the fixed conductive plates 110, and the other end of the fixed conductive shaft 540 is connected with the other fixed conductive plate 110. One of the fixed conductive plates 110 is adapted to be electrically connected with an external power supply, and the outer side wall of the fixed conductive plate 110 electrically connected with the external power supply is provided with a movable conductive plate 120, and the movable conductive plate 120 is connected with the movable conductive shaft 530. The movable conductive plate 120 is adapted to be electrically connected with an external power supply.

[0083] The movable conductive plate 120 is electrically connected with all the movable conductive shafts 530, which can avoid unstable contact and improve the stability of conduction.

[0084] A plurality of fixed conductive shafts 540 are arranged in parallel between the two fixed conductive plates 110, the fixed conductive shafts 540 are electrically connected with the fixed conductive plates 110 inside, and a plurality of first conductive clamping pieces 510 are arranged on the fixed conductive shafts 540 along the length direction, and the first conductive clamping pieces 510 are electrically connected with the fixed conductive shafts 540. A plurality of movable conductive shafts 530 are arranged in parallel, and the movable conductive shafts 530 and the fixed conductive shafts 540 are arranged in parallel one by one, the movable conductive shafts 530 are electrically connected with the movable conductive plates 120, a plurality of second conductive clamping pieces 520 are arranged on the movable conductive shafts 530 along the length direction, the second conductive clamping pieces 520 are electrically connected with the movable conductive shafts 530, and the movable conductive shafts 530 are arranged to make the second conductive clamping pieces 520 and the first conductive clamping pieces 510 respectively clamp the workpiece to be electroplated from both sides in a natural state, and slide relative to the fixed conductive shafts 540 under the action of external force to form a workpiece to be electroplated clamping space between the second conductive clamping pieces 520 and the first conductive clamping pieces 510. A plurality of first conductive clamping pieces 510 and a plurality of second conductive clamping pieces 520 are arranged one by one, and the sliding of the movable conductive shafts 530 relative to the fixed conductive shafts 540 is used to realize the opening and closing of the first conductive clamping pieces 510 and the second conductive clamping pieces 520 to load the workpiece to be electroplated. When the electroplating fixture 100 is used to clamp the battery piece to be electroplated, the first conductive clamping piece 510 and the corresponding second conductive clamping piece 520 are respectively electrically connected with the two side surfaces of the clamped battery piece to be electroplated; wherein the battery piece to be electroplated can be a silicon wafer.

[0085] The conductive frame 130 can be detachably connected with the fixed conductive plate 110 through a gasket and a fastener such as a bolt or a screw.

[0086] Among them, the end of the fixed conductive shaft 540 is connected with the fixed conductive plate 110 through the first metal fastener 160. The end of the movable conductive shaft 530 is connected with the movable conductive plate 120 through the second metal fastener 170.

[0087] The material of the movable conducting plate 120 is beryllium copper. The movable conducting plate 120 is provided with a bending part, which can provide a buffer for matching the sliding of the movable conducting shaft 530 relative to the fixed conducting shaft 540.

[0088] The fixed conducting plate 110 is provided with two, and the conducting frame 130 is arranged on one of the fixed conducting plates 110, or one conducting frame 130 is arranged on both of the fixed conducting plates 110. The selection of the scheme can be determined according to actual needs. The embodiment is described by taking the conducting frame 130 arranged on one of the fixed conducting plates 110 as an example.

[0089] The conducting frame 130 is provided with the first conducting block 140 and the second conducting block 150 which are insulated from each other, so that the first conducting block 140 and the second conducting block 150 can flow through different currents. The same current contact point is used for all clamping points on the same surface, and the uniformity of the electroplating layer during double-sided electroplating is realized by passing different currents through the clamping points on the two surfaces.

[0090] Further, the conducting frame 130 is arranged on the outer side of the fixed conducting plate 110, which can avoid the interference of the first conducting block 140, the second conducting block 150 and the like arranged on the conducting frame 130 with other components, and in use, the positioning of the first conducting block 140 and the second conducting block 150 can be simplified. Understandably, the conducting frame 130 can also be arranged on the inner side of the fixed conducting plate 110 or other positions, which will not be described here. The first conducting block 140 and the second conducting block 150 arranged on the conducting frame 130 will not affect the access of the current.

[0091] Specifically, as shown in FIG. 3, the conducting frame 130 includes a first support 131 and a second support 132. The first support 131 is electrically connected with the fixed conducting plate 110, and the first support 131 extends away from the fixed conducting plate 110. The second support 132 is connected with one end of the first support 131 away from the fixed conducting plate 110, and an included angle is formed between the first support 131 and the second support 132. The movable conducting plate 120 and the first conducting block 140 are arranged on the second support 132, respectively.

[0092] Understandably, the first support 131 can be detachably connected with the fixed conducting plate 110, the first support 131 and the second support 132 can be integrally arranged, and the first support 131 and the second support 132 can be in L shape. The first support 131 can be in plate shape or block shape, the direction away from the fixed conducting plate 110 of the first support 131 is a direction perpendicular to the fixed conducting plate 110, and the second support 132 is upwardly bent to be arranged, so that there is a gap between the second support 132 and the fixed conducting plate 110. The first conducting block 140 and the second conducting block 150 can be arranged on the end part of the second support 132 extending upwardly.

[0093] Further, as shown in FIG. 2 and FIG. 5, the movable conducting plate 120 is provided with a first through hole 1201, and the first support 131 penetrates the first through hole 1201, so that there is a gap between the movable conducting plate 120 and the fixed conducting plate 110, the movable conducting plate 120 is located between the fixed conducting plate 110 and the second support 132, and the upper end of the movable conducting plate 120 can be connected with the upper end of the conducting frame 130.

[0094] The fixed conducting plate 110 is provided with a second through hole, the axial end of the movable conducting shaft 530 penetrates into the second through hole and penetrates out, and the movable conducting plate 120 is electrically connected with the end of the movable conducting shaft 530 penetrating out of the second through hole. The movable conducting shaft 530 can move freely along the axial direction of the second through hole while being supported on the fixed conducting plate 110 as a whole.

[0095] In another embodiment, the conducting frame 130 further includes an insulating piece 133, which is arranged between the conducting frame 130 and the movable conducting plate 120, so that the insulating piece 133 electrically connected to the conducting frame 130 insulates between the first conducting block 140 and the movable conducting plate 120, ensuring that the currents of the first conducting block 140 and the second conducting block 150 are independent of each other when different currents are input, so that the plating currents on both sides of the battery are different, and thus the thicknesses of the plating layers are different.

[0096] In another embodiment, as shown in FIG. 4, the insulating piece 133 includes a first insulating part 1331 and a second insulating part 1332, the first insulating part 1331 is arranged between the first conducting block 140 and the movable conducting plate 120, and the second insulating part 1332 is arranged between the first conducting block 140 and the second conducting block 150.

[0097] The first insulating part 1331 and the second insulating part 1332 can be plate-shaped structures, the first insulating part 1331 insulates the first conducting block 140 and the movable conducting plate 120, and the second insulating part 1332 can insulate the first conducting block 140 and the second conducting block 150.

[0098] In another embodiment, the conducting frame 130 further includes a conducting piece 134, the conducting piece 134 is electrically connected with the movable conducting plate 120, the first conducting block 140 is insulatedly connected with the conducting piece 134, and the second conducting block 150 is electrically connected with the conducting piece 134.

[0099] The conductive member 134 is in a plate shape, and is connected to the movable conductive plate 120, and is arranged between the insulating member 133 and the movable conductive plate 120, and the insulating member 133 is arranged in front of the first conductive block 140 and the conductive member 134. It can also be understood that the first conductive block 140, the second support 132, the insulating member 133, the conductive member 134 and the movable conductive plate 120 are arranged in sequence. The movable conductive plate 120, the conductive member 134 and the insulating member 133 are sequentially connected to the side of the conductive frame 130 facing the fixed conductive plate 110, and the first conductive block 140 is connected to the side of the conductive frame 130 away from the fixed conductive plate 110. The first conductive block 140, the insulating member 133, the conductive member 134 and the movable conductive plate 120 can be connected to the conductive frame 130 by screws or bolts and the like fasteners.

[0100] In another embodiment, the first conductive block 140 and / or the second conductive block 150 has a structure that is wide at the top and narrow at the bottom.

[0101] It can be understood that the first conductive block 140 and the second conductive block 150 can have the same structure, and the first conductive block 140 and the second conductive block 150 have a V-shaped cross section, which is more convenient for positioning the first conductive block 140 and the second conductive block 150. For example, only one slot needs to be provided to match the shape of the first conductive block 140 and the second conductive block 150, and the first conductive block 140 and the second conductive block 150 can be fixed. Of course, the shape of the first conductive block 140 and the second conductive block 150 is not limited to V-shaped, but can also be other structural forms.

[0102] Embodiment 2

[0103] The embodiment provides an electroplating anode device, as shown in FIGS. 6-11, comprising: a conductive base frame 1, a mounting structure 2 and an anode mounting structure 3.

[0104] As shown in FIGS. 6-8, the overall shape of the conductive base frame 1 is U-shaped, the bottom plate of the conductive base frame 1 is an assembly part, and the two top ends are power connection parts adapted to be placed above the surface of the electroplating solution to be connected to the power supply, and the assembly part is adapted to be placed below the surface of the electroplating solution, and a plurality of first assembly holes 11 are arranged in the center position along the length direction of the assembly part.

[0105] As shown in FIGS. 6-8, the mounting structure 2 comprises a first mounting piece 21 and a second mounting piece 22. The bottom end of the first mounting piece 21 is a mounting base 211 which is horizontally mounted in a plate shape. The length of the mounting base 211 is shorter than that of the bottom plate of the conductive base frame 1. A plurality of second assembly holes are also arrayed along the length direction of the mounting base 211. Two mounting parts 212 are vertically fixed on the two length edges of the mounting base 211 respectively. The mounting parts 212 are vertically placed in a plate shape. The two mounting parts 212 and the mounting base 211 form a U-shaped structure. A plurality of insertion slots 213 are vertically formed on the mounting parts 212. The plurality of insertion slots 213 are arrayed and spaced along the length direction thereof. The plurality of insertion slots 213 on the two mounting parts 212 are symmetrically arranged. The interval distance between any two adjacent insertion slots 213 on the same mounting part 212 is the same.

[0106] As shown in FIG. 10, the anode mounting structure 3 comprises an anode piece 31 and a third mounting piece 32 which are fixedly connected in an up-down direction. Two first mounting slots 321 are formed on the side of the third mounting piece 32 close to the two mounting parts 212 corresponding to the two mounting parts 212. Two first mounting holes 322 are formed on the two sides of the third mounting piece 32 corresponding to the second mounting holes 222 respectively.

[0107] When the electroplating anode device is assembled, first, the mounting structure 2 is assembled, and the second mounting pieces 22 are inserted into the slots 213 one by one on the mounting portions 212. Specifically, the two second mounting slots 221 on the second mounting piece 22 are inserted into the corresponding two insertion slots 213, so that the second mounting piece 22 is mounted on the mounting portion 212, ensuring that the second mounting piece 22 is vertically mounted. After the mounting is completed, the spacing between any two adjacent second mounting pieces 22 is the same, and any two second mounting pieces 22 are parallel to each other. Then, the mounting structure 2 is mounted on the conductive base frame 1, and the mounting structure 2 is laid on the upper surface of the conductive base frame 1 along the length direction of the conductive base frame 1. At this time, the second assembly holes on the mounting base 211 and the first assembly holes 11 on the conductive base frame 1 are arranged correspondingly to form an assembly channel, and a bolt is used to pass through the assembly channel to mount the mounting structure 2 on the conductive base frame 1. Finally, the two first mounting slots 321 on the third mounting piece 32 are inserted into the two mounting portions 212, respectively. The third mounting pieces 32 and the second mounting pieces 22 are arranged one by one, and any third mounting piece 32 is arranged on the left side or the right side of the second mounting piece 22, ensuring that the spacing between any two anode pieces 31 is the same. At this time, the two first mounting holes 322 on each third mounting piece 32 are arranged opposite to the two second mounting holes 222 of the corresponding second mounting piece 22 to form an installation channel, and a bolt is used to pass through the installation channel to fix the anode mounting structure 3 on the mounting structure 2. At this time, the anode mounting structure 3 is completed, and the entire anode piece 31 is in a vertical state. By using the precise slot design on the third mounting piece 32 and the second mounting piece 22 and the U-shaped slot design of the first mounting piece 21, the three are mounted together, ensuring that the parallelism between the anode pieces 31 after installation is guaranteed, which can effectively improve the production capacity. And it ensures the flatness of the anode piece 31, can accurately control the distance between adjacent anode pieces 31, and improve the product yield. By fixing the second mounting piece 22 and the third mounting piece 32 array on the first mounting piece 21, the spacing between any two adjacent anode pieces 31 is ensured to be the same, which improves the uniformity of electroplating and improves the yield. And the mounting structure 2 and the anode mounting structure 3 are detachable structures. When the anode piece 31 is worn out after electroplating a metal coating, the bolt can be removed to detach the anode mounting structure 3 from the mounting structure 2 for repair, without the need for overall replacement, thereby reducing maintenance costs.

[0108] In other implementable ways, there are three ways to install the third mounting piece 32 and the first mounting slot 321. The first way is to only open the first mounting slot 321 on the third mounting piece 32, without opening the mounting slot on the first mounting piece 21. The second way is to not open the mounting slot on the third mounting piece 32, and to open the mounting slot on the first mounting piece 21. The third way is to open the mounting slot on both the third mounting piece 32 and the first mounting piece 21, and the two are inserted into each other.

[0109] The third mounting member 32 is a plate processing, and the third mounting member 32 is connected with the anode member 31 by welding, which is easy to adhere to the anode member 31, ensures the installation precision, and reduces the distance requirement between the anode nets.

[0110] In the embodiment, as shown in FIG. 10, the anode member 31 is provided in a net plate structure, which is beneficial to the flow of the electroplating liquid and improves the uniformity of metal ions in the liquid, thereby improving the uniformity of electroplating. The surface of the anode member 31 is coated with a noble metal coating to maintain the activity of the anode member 31. In the production process, the noble metal coating is lost, so the electroplating metal coating has a certain service life. The mounting structure 2 and the anode mounting structure 3 are detachable structures. When the electroplating metal coating on the anode member 31 is lost, the bolt can be removed, so that the anode mounting structure 3 is detached from the mounting structure 2, and the repair is carried out without the need for overall replacement, thereby reducing the maintenance cost.

[0111] In the embodiment, the material of the conductive base frame 1 is made of titanium-coated copper material. The use of titanium-coated copper material reduces the conductive resistance under the premise of ensuring corrosion resistance, and ensures the consistency of the electric field of each anode net. The conductive base frame 1 is designed in a U shape, which can lead the power connection part out of the electroplating liquid surface. The double-sided conduction can further improve the consistency of the electric field between each anode net.

[0112] In other implementable manners, as shown in FIG. 9, a through hole is further provided between any two adjacent plug-in slots 213 on one mounting part 212, which reduces the weight of the entire device and is beneficial to the flow of the electroplating liquid and improves the uniformity of metal ions in the liquid, thereby improving the uniformity of electroplating.

[0113] The working principle of the electroplating anode device provided in the embodiment is as follows:

[0114] First, the mounting structure 2 is assembled, two second mounting grooves 221 on each of the second mounting members 22 are respectively inserted into the corresponding two insertion grooves 213, so as to mount the second mounting members 22 on the mounting portions 212, and ensure that the second mounting members 22 are vertically mounted. After the mounting is completed, the spacing between any two adjacent second mounting members 22 is the same, and any two second mounting members 22 are parallel to each other. Then, the mounting structure 2 is mounted on the conductive base frame 1, and the mounting structure 2 is laid on the upper surface of the conductive base frame 1 along the length direction of the conductive base frame 1. At this time, the second assembly holes on the mounting base 211 and the first assembly holes 11 on the conductive base frame 1 are correspondingly arranged to form an assembly channel, and a bolt is used to penetrate the assembly channel to mount the mounting structure 2 on the conductive base frame 1. Finally, two first mounting grooves 321 on the third mounting member 32 are respectively inserted into the two mounting portions 212, and a plurality of third mounting members 32 are arranged one by one corresponding to a plurality of second mounting members 22. A bolt is used to penetrate the mounting channel to fix the anode mounting structure 3 on the mounting structure 2. The power supply is connected to the power connection end at the top end of the conductive base frame 1, and the electroplating work is performed.

[0115] Embodiment 3

[0116] The embodiment provides an electroplating device, as shown in FIG. 12, which comprises the electroplating clamp 100 of any one of the embodiments in the above-mentioned embodiment 1 and the electroplating anode device of any one of the embodiments in the above-mentioned embodiment 2.

[0117] As an optional embodiment, the electroplating device further comprises a conductive seat, and the conductive seat has a groove, and the shape of the groove is matched with the shape of the first conductive block 140 and the second conductive block 150 of the electroplating clamp 100, so as to support the first conductive block 140 and the second conductive block 150.

[0118] Optionally, when the electroplating device is used for electroplating, the electroplating anode device is mounted in an electroplating tank, the electroplating tank is provided with an electroplating solution, the electroplating clamp 100 clamping the battery piece 4 to be electroplated is placed in the electroplating tank, each battery piece 4 to be electroplated is inserted between the adjacent anode members in the electroplating anode device, the conductive base frame 1 in the electroplating anode device is electrically connected with the positive pole of the power supply, and the first conductive block 140 and the second conductive block 150 in the electroplating clamp are electrically connected with the negative pole of the power supply.

[0119] Optionally, when the electroplating device is used for electroplating, two conductive lines can be formed in the electroplating clamp 100, and the two conductive lines are respectively:

[0120] The first conductive block 140→the conductive frame 130→the fixed conductive plate 110→the fixed conductive shaft→the first conductive clamping piece;

[0121] The second conductive block 150→the conductive member 134→the movable conductive plate 120→the movable conductive shaft→the second conductive clamping piece.

[0122] Thus, the current independent control of the fixed conductive shaft and the movable conductive shaft can be realized, and then the purpose of independent control of the plating rate of the front and back surfaces of the to-be-plated cell sheet 4, which can be a silicon sheet, is achieved.

[0123] Optionally, the plating fixture 100 needs to be connected with the plated cell sheet as a cathode in the plating process. If the same input current is used, the plated areas of the front and back surfaces are different, and then the current density will be different, which leads to poor thickness uniformity of the cell double surface in the plating process.

[0124] The above plating equipment sets the current contact point for each surface clamping point of the plating fixture 100, so that appropriate currents can be passed according to the plated areas and patterns of the two surfaces of the cell sheet in the plating process, so that the current density of the double surface to-be-plated area of the cell sheet remains consistent in the plating process, and then good uniformity in the double surface plating process of the cell sheet is achieved. Thus, the problem of obvious difference between the front and back surfaces caused by using the same input current can be simply and effectively solved.

[0125] Embodiment 4

[0126] The embodiment provides a plating device, which comprises a machine body and a plating anode device in any of the embodiments of embodiment 2 mounted on the machine body. It comprises the mounting structure 2 and the anode mounting structure 3 in the above embodiment 2, and thus has all the beneficial effects of the above plating anode device. After the installation of the anode member 31, the parallelism between the anode members 31 is ensured, the production capacity can be effectively improved, the product yield can be improved, the uniformity of plating can be improved, and the yield can be improved. The maintenance cost is reduced.

[0127] Obviously, the above embodiments are only examples for clearly illustrating, and are not intended to limit the embodiments. For those skilled in the art, other different forms of changes or modifications can be made on the basis of the above description. Here, all the embodiments need not and cannot be exhausted. The obvious changes or modifications derived therefrom are still within the protection scope of the present application.

Claims

1. An electroplating fixture comprising a fixed electrically conductive plate (110) and a movable electrically conductive plate (120), characterized in that, The electroplating fixture (100) further comprises: a conductive frame (130) connected with the fixed conductive plate (110); a first conductive block (140) arranged on the conductive frame (130), the first conductive block (140) being electrically connected with the fixed conductive plate (110) through the conductive frame (130); a second conductive block (150) arranged on the conductive frame (130), the second conductive block (150) being insulated from the first conductive block (140) and electrically connected with the movable conductive plate (120).

2. The electroplating fixture of claim 1, wherein, The conductive frame (130) is arranged outside the fixed conductive plate (110).

3. The electroplating fixture of claim 2, wherein, The conductive frame (130) comprises: a first support (131) electrically connected with the fixed conductive plate (110) and extending away from the fixed conductive plate (110); a second support (132) connected with one end of the first support (131) away from the fixed conductive plate (110), and an included angle being formed between the first support (131) and the second support (132); wherein the movable conductive plate (120) and the first conductive block (140) are arranged on the second support (132) respectively.

4. The electroplating fixture of claim 3, wherein, The movable conductive plate (120) is provided with a first via hole (1201), and the first support (131) penetrates through the first via hole (1201) so that the movable conductive plate (120) is located between the fixed conductive plate (110) and the second support (132).

5. The electroplating fixture of any one of claims 1 to 4, wherein, The conductive frame (130) further comprises an insulating piece (133) arranged between the first conductive block (140) and the movable conductive plate (120).

6. The electroplating fixture of claim 5, wherein, The insulating piece (133) comprises: a first insulating part (1331) arranged between the first conductive block (140) and the movable conductive plate (120); a second insulating part (1332) arranged between the first conductive block (140) and the second conductive block (150).

7. The electroplating fixture of any one of claims 1 to 4, wherein, The conductive frame (130) further comprises a conductive piece (134) electrically connected with the movable conductive plate (120), the first conductive block (140) being insulated from the conductive piece (134), and the second conductive block (150) being electrically connected with the conductive piece (134).

8. The electroplating fixture of any one of claims 1 to 4, wherein, The first conductive block (140) and / or the second conductive block (150) has a structure of being wide at the top and narrow at the bottom.

9. An electroplating apparatus, characterized by, The electroplating device comprises the electroplating fixture (100) according to any one of claims 1 to 8.

10. The electroplating apparatus of claim 9, wherein, The electroplating device further comprises a conductive seat having a groove, the shape of the groove being matched with the shapes of the first conductive block (140) and the second conductive block (150) of the electroplating fixture (100) to support the first conductive block (140) and the second conductive block (150).

11. The electroplating apparatus of claim 9, wherein, The electroplating device further comprises an electroplating anode device, the electroplating anode device comprising: a conductive base frame (1); The mounting structure (2) comprises a first mounting piece (21) and a second mounting piece (22), the first mounting piece (21) is connected with the conductive base frame (1), and the first mounting piece (21) comprises a mounting portion (212); a plurality of second mounting pieces (22) are arranged on the first mounting piece (21); The anode mounting structure (3) comprises an anode piece (31) and a third mounting piece (32), the anode piece (31) is connected with the third mounting piece (32), and the third mounting piece (32) and / or the first mounting piece (21) is provided with a mounting groove; Wherein, the anode mounting structure (3) is provided with a plurality of anode mounting structures (3), and the plurality of anode mounting structures (3) are mounted on the first mounting piece (21) in combination with the second mounting piece (22), and the third mounting piece (32) is connected with the first mounting piece (21) through insertion.

12. The electroplating apparatus of claim 11, wherein, The third mounting piece (32) is provided with at least two first mounting grooves (321) on the side away from the anode piece (31), and when the third mounting piece (32) is mounted on the first mounting piece (21), the first mounting piece (21) is inserted into the first mounting groove (321).

13. The electroplating apparatus of claim 11, wherein, The first mounting piece (21) further comprises a mounting base (211), and the mounting base (211) is connected with the conductive base frame (1); The mounting portion (212) is provided with two mounting portions (212) arranged on the two sides of the mounting base (211).

14. The electroplating apparatus of claim 12, wherein, The second mounting piece (22) is provided with a second mounting groove (221) on the side close to the first mounting piece (21), and the mounting portion (212) is provided with an insertion groove (213), and the second mounting groove (221) is adapted to be inserted with the insertion groove (213) to mount the second mounting piece (22) on the first mounting piece (21).

15. The electroplating apparatus of claim 11, wherein, The third mounting piece (32) is provided with a first mounting hole (322) on the two sides, and the second mounting piece (22) is provided with a second mounting hole (222) on the two sides; When the anode mounting structure (3) is mounted on the mounting portion (212), the first mounting hole (322) is opposite to the second mounting hole (222) to form an installation channel matched with a fastener.

16. The electroplating apparatus of any one of claims 11-15, wherein, The anode piece (31) is provided in a mesh plate structure.

17. The electroplating apparatus of any one of claims 11-15, wherein, The conductive base frame (1) is made of titanium-coated copper material.

18. The electroplating apparatus of any one of claims 11-15, wherein, The conductive base frame (1) comprises an assembly portion and an electrical connection portion, the electrical connection portion is provided with two electrical connection portions arranged on the two sides of the assembly portion respectively, the electrical connection portion is adapted to be placed above the liquid level of the electroplating solution to be connected with the power supply, and the assembly portion is adapted to be placed below the liquid level of the electroplating solution.

19. The electroplating apparatus of claim 13, wherein, The mounting portion is provided with a first assembly hole (11), and the mounting base (211) is provided with a second assembly hole, and the first assembly hole (11) is adapted to be opposite to the second assembly hole to form an assembly channel.

20. An electroplating anode assembly, characterized by It comprises: A conductive base frame (1); The mounting structure (2) comprises a first mounting piece (21) connected with the conductive base frame (1), and the first mounting piece (21) comprises a mounting portion (212); a plurality of second mounting pieces (22) are arranged on the first mounting piece (21); The anode mounting structure (3) comprises an anode piece (31) and a third mounting piece (32), the anode piece (31) is connected with the third mounting piece (32), and the third mounting piece (32) and / or the first mounting piece (21) is provided with a mounting slot; The anode mounting structure (3) is arranged on the first mounting piece (21) in a manner of being attached to the second mounting piece (22), and the third mounting piece (32) is connected to the first mounting piece (21) in a plug-in manner.

21. The electroplating anode arrangement of claim 20, wherein, The third mounting piece (32) is provided with at least two first mounting slots (321) on the side away from the anode piece (31), and the first mounting piece (21) is arranged in the first mounting slot (321) when the third mounting piece (32) is arranged on the first mounting piece (21).

22. The electroplating anode apparatus of claim 20, wherein, The first mounting piece (21) further comprises a mounting base (211) connected with the conductive base frame (1); The mounting portion (212) is arranged on the two sides of the mounting base (211) in a manner of being oppositely arranged.

23. The electroplating anode apparatus of claim 21, wherein, The second mounting piece (22) is provided with a second mounting slot (221) on the side close to the first mounting piece (21), and the mounting portion (212) is provided with a plug-in slot (213), and the second mounting slot (221) is adapted to be plugged into the plug-in slot (213) to arrange the second mounting piece (22) on the first mounting piece (21).

24. The electroplating anode apparatus of claim 20, wherein, The third mounting piece (32) is provided with a first mounting hole (322) on the two sides, and the second mounting piece (22) is provided with a second mounting hole (222) on the two sides; When the anode mounting structure (3) is arranged on the mounting portion (212), the first mounting hole (322) is opposite to the second mounting hole (222) to form an installation channel matched with a fastener.

25. The electroplating anode arrangement of any one of claims 20-24, wherein, The anode piece (31) is arranged in a mesh plate structure.

26. The electroplating anode arrangement of any one of claims 20-24, wherein, The conductive base frame (1) is made of titanium copper material.

27. The electroplating anode arrangement of any one of claims 20-24, wherein, The conductive base frame (1) comprises an assembly portion and an electricity connection portion, the electricity connection portion is arranged on the two sides of the assembly portion in a manner of being oppositely arranged, the electricity connection portion is adapted to be placed above the liquid level of the electroplating solution to be connected with the power supply, and the assembly portion is adapted to be placed below the liquid level of the electroplating solution.

28. The electroplating anode apparatus of claim 22, wherein, The mounting portion is provided with a first assembly hole (11), and the mounting base (211) is provided with a second assembly hole, and the first assembly hole (11) is adapted to be opposite to the second assembly hole to form an assembly channel.

29. An electroplating apparatus, characterized by comprising: The electroplating anode device comprises the electroplating anode device according to any one of claims 20-28.

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