Electronic device

Abstract

The present application provides an electronic device, comprising a middle frame, a rear cover, a circuit board, a support member, a first antenna sub-portion, and a second antenna sub-portion. The rear cover is fixed to one side of the middle frame; an inner cavity and an air duct are formed between the rear cover and the middle frame; the circuit board and the support member are both mounted in the inner cavity; the first antenna sub-portion is fixed to the side of the support member facing the rear cover and is electrically connected to the circuit board; the second antenna sub-portion is fixed to the side of the rear cover facing the middle frame or is part of the rear cover, and is at least partially located in the air duct; the area of the rear cover directly facing the second antenna sub-portion is a non-signal shielding area; and the first antenna sub-portion and the second antenna sub-portion jointly constitute an antenna. The antenna area of the electronic device is large, thereby achieving good antenna performance.

Description

Electronic device

[0001] This application claims priority from the Chinese patent application No. 202410557549.4 filed on April 30, 2024, and entitled "Electronic device", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] Embodiments of the present application relate to the technical field of antennas, and in particular to an electronic device. BACKGROUND

[0003] Currently, for electronic devices adopting large-size full screens, a support antenna is usually used to realize signal transmission. However, due to the development demand of multi-functionality of electronic devices, there are many internal components in electronic devices, so the arrangement space of the support antenna in the electronic device is limited, resulting in limited area of the support antenna and poor performance of the antenna. SUMMARY

[0004] Embodiments of the present application provide an electronic device, which has a larger antenna area and better antenna performance.

[0005] In a first aspect, an electronic device is provided, which includes a middle frame, a back cover, a support, a circuit board, an antenna first sub-portion, and an antenna second sub-portion. The back cover is fixed to one side of the middle frame, and an inner cavity and an air duct are formed between the back cover and the middle frame. The circuit board and the support are both installed in the inner cavity. The antenna first sub-portion is fixed to one side of the support facing the back cover and is electrically connected to the circuit board. The antenna second sub-portion is fixed to one side of the back cover facing the middle frame and is at least partially located in the air duct. A region of the back cover directly opposite the antenna second sub-portion is a non-signal shielding region. The non-signal shielding region allows signals to pass through. The antenna first sub-portion and the antenna second sub-portion jointly constitute an antenna.

[0006] In the present embodiment, the antenna of the electronic device includes the antenna first sub-portion and the antenna second sub-portion. The electronic device increases the area of the antenna by adding the antenna second sub-portion, which is at least partially located in the air duct and can transmit signals through the back cover, thereby improving the performance of the antenna, and the antenna has better bandwidth and radiation efficiency. In addition, the air duct of the electronic device also provides a good clearance environment for the antenna, which is conducive to ensuring the performance of the antenna.

[0007] The circuit board is provided with a feeding circuit, which can feed the antenna first sub-portion. For example, the antenna first sub-portion can be electrically connected to the circuit board through a wire or a pin. For example, one end of the wire or the pin can be fixed to one side of the support facing the back cover and connected to the antenna first sub-portion, and the other end of the wire or the pin can be wound from the side of the support to the circuit board to connect the circuit board.

[0008] The air in the air duct can exchange with the space outside the electronic device to transfer the heat inside the electronic device to the outside of the electronic device, so as to achieve heat dissipation. For example, the air duct is isolated from the inner cavity. At this time, the air duct is separated from the inner cavity, so that the external dust, water vapor and the like can be prevented from entering the inner cavity through the air duct, so as to protect the device in the inner cavity and improve the reliability of the electronic device.

[0009] The non-signal shielding area can be made of non-conductive material. The non-conductive material can be glass fiber, ceramic, plastic, etc.

[0010] In some possible implementation manners, the second sub-part of the antenna is a flexible printed circuit board or a metal piece. At this time, the second sub-part of the antenna has a simple structure and is easy to implement.

[0011] In some possible implementation manners, the second sub-part of the antenna is a conductive heat dissipation piece. In this embodiment, the electronic device reuses the heat dissipation piece as the second sub-part of the antenna, which not only retains the heat dissipation function of the heat dissipation piece, but also enables the air duct to take away the heat of the heat dissipation piece and the heat of other components in the electronic device that are in thermal contact with the heat dissipation piece, so as to ensure the heat dissipation performance of the electronic device, and improve the antenna performance of the electronic device without adding additional structural pieces, which is low in difficulty and low in cost.

[0012] For example, the second sub-part of the antenna can be a graphite sheet. The graphite sheet is easy to cut and is more suitable for heat dissipation and antenna design, and has low cost. The graphite sheet can be assembled and fixed to the back cover by adhesion or the like.

[0013] In some possible implementation manners, the second sub-part of the antenna is assembled and fixed to the back cover. At this time, the second sub-part of the antenna and the back cover are first processed separately and then assembled, which is low in manufacturing difficulty and easy to implement. Alternatively, the second sub-part of the antenna is formed on the back cover. At this time, the connection stability between the second sub-part of the antenna and the back cover is high. That is, the second sub-part of the antenna can be fixed to the back cover by assembly or forming.

[0014] In some possible implementation manners, the back cover can be a non-metal back cover, such as a glass fiber back cover, a ceramic back cover, or a plastic back cover, etc. At this time, the back cover has a simple structure and is easy to implement.

[0015] In some possible implementation manners, the area of the second sub-part of the antenna is greater than the area of the first sub-part of the antenna. At this time, the second sub-part of the antenna can greatly increase the area of the antenna of the electronic device to improve the antenna performance. For example, the area of the second sub-part of the antenna can be greater than twice the area of the first sub-part of the antenna.

[0016] In some possible implementation manners, the second sub-part of the antenna corresponds to the air duct as a whole. At this time, the support and the first sub-part of the antenna can be arranged as close to the air duct as possible to ensure the coupling between the first sub-part of the antenna and the second sub-part of the antenna.

[0017] In some possible implementation manners, the second sub-antenna part includes a first portion and a second portion, the first portion corresponds to the air duct arrangement, and the second portion corresponds to the inner cavity arrangement, and an area of the first portion is greater than an area of the second portion. In this embodiment, the second sub-antenna part can correspond to most of the structure of the air duct arrangement and a small part of the structure is located outside the air duct. Not only can the coupling difficulty of the first sub-antenna part and the second sub-antenna part be reduced, but also the space of the air duct can be fully utilized to improve the antenna performance of the electronic device.

[0018] In some possible implementation manners, a distance between the first sub-antenna part and the second sub-antenna part is less than one-eighth of a wavelength corresponding to a center frequency of an operating frequency band of the antenna. In this embodiment, by setting the distance between the first sub-antenna part and the second sub-antenna part, the first sub-antenna part and the second sub-antenna part are close enough to be coupled smoothly and form the antenna together.

[0019] In some possible implementation manners, the support is an audio module, and the first sub-antenna part is fixed to an acoustic cavity shell of the audio module. The audio module further includes a loudspeaker installed in the acoustic cavity shell, and the first sub-antenna part can be arranged staggered with the loudspeaker of the audio module to reduce the interference of the loudspeaker on the first sub-antenna part.

[0020] In some possible implementation manners, the support is a bracket, and the first sub-antenna part is fixed to an insulating portion of the bracket. At least part of the structure of the bracket is made of insulating material. For example, the bracket can be made of insulating material as a whole, and the insulating portion of the bracket is the whole bracket; or the bracket can be made of insulating material locally to form the insulating portion, and another portion of the bracket can be a conductive portion or other.

[0021] In some possible implementation manners, the first sub-antenna part is a flexible printed circuit board or a metal piece. At this time, the structure of the first sub-antenna part is simple and easy to implement.

[0022] In some possible implementation manners, the first sub-antenna part is assembled and fixed to the support. At this time, the first sub-antenna part and the support are processed separately first and then assembled, which is low in manufacturing difficulty and easy to implement. Alternatively, the first sub-antenna part is formed on the support. At this time, the connection stability of the first sub-antenna part and the support is high.

[0023] In some possible implementation manners, part of the structure of the support constitutes part of the air duct wall. At this time, the support and the air duct are arranged compactly and the distance therebetween is very close, which is conducive to the coupling of the first sub-antenna part and the second sub-antenna part, reduces the arrangement difficulty of the first sub-antenna part and the second sub-antenna part, and is also conducive to saving the internal space of the electronic device, thereby being conducive to the miniaturization of the electronic device.

[0024] In some possible implementation manners, the electronic device further includes a first sealing member located between the support member and the rear cover and constituting a partial air duct wall of the air duct. In this embodiment, the first sealing member can not only seal the air duct, but also limit the support member and the rear cover, thereby providing certain support for the rear cover and improving the structural reliability of the electronic device. In addition, the first sealing member has certain compressibility and can absorb assembly tolerances of the support member and the rear cover, thereby improving the assembly accuracy of the electronic device.

[0025] In some possible implementation manners, the electronic device further includes a second sealing member located between the support member and the middle frame and constituting a partial air duct wall of the air duct. In this embodiment, the second sealing member can not only seal the air duct, but also limit the support member and the middle frame, thereby improving the structural reliability of the electronic device. In addition, the second sealing member has certain compressibility and can absorb assembly tolerances of the support member and the middle frame, thereby improving the assembly accuracy of the electronic device.

[0026] In some possible implementation manners, the middle frame includes a frame and a middle plate fixed to an inner side of the frame, the frame is connected to the rear cover, the middle plate is arranged opposite to the rear cover, the air duct and the inner cavity are located between the middle plate and the rear cover, and the outlet of the air duct is arranged on the frame or between the frame and the rear cover.

[0027] In some possible implementation manners, the middle plate includes an air duct bottom wall and an air duct side wall, the air duct side wall is fixed to one side of the air duct bottom wall facing the rear cover, the air duct side wall is connected to the rear cover, the air duct bottom wall, the air duct side wall and the rear cover surround the air duct, and the air duct bottom wall and the air duct side wall are integrally formed on the middle plate. In other words, the air duct bottom wall and the air duct side wall can be integrally formed with the middle plate during the forming process of the middle plate, and the air duct bottom wall and the air duct side wall are integrally formed with at least one other structure of the middle plate.

[0028] In this embodiment, the air duct side wall and the air duct bottom wall are integrally formed on the middle plate, which can not only simplify the structure of the air duct and improve the air tightness of the air duct, but also facilitate the forming and assembly of the air duct and reduce the cost of the electronic device.

[0029] In some possible implementation manners, the middle plate includes a metal portion, and the metal portion is arranged opposite to the first antenna sub-portion and the second antenna sub-portion. For example, the middle plate can be made of a metal material as a whole to form the metal portion, or the middle plate can be made of a metal material in part to form the metal portion.

[0030] In this embodiment, the metal portion of the middle plate is arranged opposite to the first antenna sub-portion and the second antenna sub-portion, which can be used as a reflecting plate of the first antenna sub-portion and the second antenna sub-portion to improve the antenna radiation efficiency, adjust the antenna signal direction, and enhance the antenna signal strength. In addition, the metal portion of the middle plate can also increase the structural strength of the middle frame.

[0031] In some possible implementation manners, the electronic device further includes a fan, the fan is installed in the inner cavity, and an air outlet of the fan is communicated with the air duct. In the embodiment, air generated by the operation of the fan can be sent out of the electronic device through the air duct to carry out heat of the electronic device to achieve heat dissipation.

[0032] In some possible implementation manners, the electronic device further includes a display screen, the display screen is located at a side of the middle frame away from the back cover and is fixed to the middle frame. For example, the display screen has a display function, or the display screen can integrate the display function and the touch sensing function.

[0033] In the second aspect, the embodiments of the present application provide an electronic device, including a middle frame, a back cover, a circuit board, a support and an antenna first sub-portion. The back cover is fixed to a side of the middle frame, and an inner cavity and an air duct are formed between the back cover and the middle frame. The circuit board and the support are both installed in the inner cavity, and the antenna first sub-portion is fixed to a side of the support facing the back cover and is electrically connected to the circuit board.

[0034] In the second aspect, the embodiments of the present application provide an electronic device, including a middle frame, a back cover, a circuit board, a support and an antenna first sub-portion. The back cover is fixed to a side of the middle frame, and an inner cavity and an air duct are formed between the back cover and the middle frame. The circuit board and the support are both installed in the inner cavity, and the antenna first sub-portion is fixed to a side of the support facing the back cover and is electrically connected to the circuit board.

[0035] In the second aspect, the embodiments of the present application provide an electronic device, including a middle frame, a back cover, a circuit board, a support and an antenna first sub-portion. The back cover is fixed to a side of the middle frame, and an inner cavity and an air duct are formed between the back cover and the middle frame. The circuit board and the support are both installed in the inner cavity, and the antenna first sub-portion is fixed to a side of the support facing the back cover and is electrically connected to the circuit board.

[0036] In the second aspect, the embodiments of the present application provide an electronic device, including a middle frame, a back cover, a circuit board, a support and an antenna first sub-portion. The back cover is fixed to a side of the middle frame, and an inner cavity and an air duct are formed between the back cover and the middle frame. The circuit board and the support are both installed in the inner cavity, and the antenna first sub-portion is fixed to a side of the support facing the back cover and is electrically connected to the circuit board.

[0037] In some possible implementation manners, the antenna second sub-portion is made of a conductive material. In the embodiment, a part of the back cover is made of a conductive material to form the conductive antenna second sub-portion, so that the antenna second sub-portion can be part of the antenna. The conductive material can be metal, carbon fiber or the like.

[0038] In some possible implementation manners, the main body includes an insulating part and a conductive part, the insulating part is connected between the second sub-antenna part and the conductive part, and the material of the conductive part is the same as or different from that of the second sub-antenna part.

[0039] When the material of the conductive part is the same as that of the second sub-antenna part, the back cover can be configured by opening a slot in a conductive structure and filling a non-conductive structure in the slot. In this case, the manufacturing cost of the back cover is relatively low. When the material of the conductive part is different from that of the second sub-antenna part, the material of the second sub-antenna part can be more flexible, and can better adapt to the antenna signal transmission requirements.

[0040] In some possible implementation manners, the main body is made of an insulating material. In this case, the back cover can be configured by adding a local conductive structure to an insulating structure.

[0041] In some possible implementation manners, the area of the second sub-antenna part is greater than that of the first sub-antenna part. In this case, the second sub-antenna part can greatly increase the area of the antenna of the electronic device, so as to improve the performance of the antenna. For example, the area of the second sub-antenna part can be greater than twice the area of the first sub-antenna part.

[0042] In some possible implementation manners, the second sub-antenna part is arranged corresponding to the air duct as a whole. In this case, the support and the first sub-antenna part can be arranged as close to the air duct as possible, so as to ensure the coupling between the first sub-antenna part and the second sub-antenna part.

[0043] In some possible implementation manners, the second sub-antenna part includes a first part and a second part, the first part is arranged corresponding to the air duct, the second part is arranged corresponding to the inner cavity, and the area of the first part is greater than that of the second part. In this embodiment, the second sub-antenna part can be arranged corresponding to the air duct in most of the structure, and a small part of the structure is located outside the air duct. This not only reduces the difficulty of coupling between the first sub-antenna part and the second sub-antenna part, but also makes full use of the space of the air duct, so as to improve the performance of the antenna of the electronic device.

[0044] In some possible implementation manners, the distance between the first sub-antenna part and the second sub-antenna part is less than one-eighth of the wavelength corresponding to the center frequency of the working frequency band of the antenna. In this embodiment, by setting the distance between the first sub-antenna part and the second sub-antenna part, the first sub-antenna part and the second sub-antenna part are close enough, and the two can be coupled smoothly to form the antenna together.

[0045] In some possible implementation manners, the support is an audio module, and the first sub-antenna part is fixed to an acoustic cavity shell of the audio module. The audio module further includes a loudspeaker installed in the acoustic cavity shell, and the first sub-antenna part can be arranged staggered with the loudspeaker of the audio module, so as to reduce the interference of the loudspeaker on the first sub-antenna part.

[0046] In some possible implementation manners, the support is a bracket, and the first sub-antenna is fixed to an insulating part of the bracket.

[0047] In some possible implementation manners, the first sub-antenna is a flexible printed circuit board or a metal piece. At this time, the first sub-antenna has a simple structure and is easy to implement.

[0048] In some possible implementation manners, the first sub-antenna is assembled and fixed to the support. At this time, the first sub-antenna and the support are first processed separately and then assembled, so that the manufacturing difficulty is low and the implementation is easy. Alternatively, the first sub-antenna is formed on the support. At this time, the connection stability between the first sub-antenna and the support is high.

[0049] In some possible implementation manners, part of the structure of the support constitutes part of the air duct wall of the air duct. At this time, the support and the air duct are arranged compactly, and the distance between the support and the air duct is very close, which is beneficial to the coupling between the first sub-antenna and the second sub-antenna, reduces the arrangement difficulty of the first sub-antenna and the second sub-antenna, and is also beneficial to saving the internal space of the electronic device, thereby facilitating the miniaturization of the electronic device.

[0050] In some possible implementation manners, the electronic device further includes a first sealing member, the first sealing member is located between the support and the rear cover, and constitutes part of the air duct wall of the air duct. In this embodiment, the first sealing member can not only seal the air duct, but also limit the support and the rear cover, provide certain support for the rear cover, and is beneficial to improving the structural reliability of the electronic device. In addition, the first sealing member has a certain compressibility and can absorb the assembly tolerance of the support and the rear cover, which is beneficial to improving the assembly precision of the electronic device.

[0051] In some possible implementation manners, the electronic device further includes a second sealing member, the second sealing member is located between the support and the middle frame, and constitutes part of the air duct wall of the air duct. In this embodiment, the second sealing member can not only seal the air duct, but also limit the support and the middle frame, which is beneficial to improving the structural reliability of the electronic device. In addition, the second sealing member has a certain compressibility and can absorb the assembly tolerance of the support and the middle frame, which is beneficial to improving the assembly precision of the electronic device.

[0052] In some possible implementation manners, the middle frame includes a frame and a middle plate fixed to the inner side of the frame, the frame is connected to the rear cover, the middle plate is arranged opposite to the rear cover, the air duct and the inner cavity are located between the middle plate and the rear cover, and the outlet of the air duct is arranged on the frame or between the frame and the rear cover.

[0053] In some possible implementation manners, the middle plate comprises a bottom wall of the air duct and a side wall of the air duct, the side wall of the air duct is fixed to one side of the bottom wall of the air duct facing the back cover, the side wall of the air duct is connected to the back cover, the bottom wall of the air duct, the side wall of the air duct and the back cover surround the air duct, and the bottom wall of the air duct and the side wall of the air duct are integrally formed on the middle plate. In other words, the bottom wall of the air duct and the side wall of the air duct can be integrally formed in the forming process of the middle plate, and the bottom wall of the air duct and the side wall of the air duct are integrally formed with at least one other structure of the middle plate.

[0054] In the embodiment, by integrally forming the side wall of the air duct and the bottom wall of the air duct on the middle plate, not only can the structure of the air duct be simplified and the air tightness of the air duct be improved, but also the forming and assembling difficulty of the air duct can be reduced, and the cost of the electronic device can be reduced.

[0055] In some possible implementation manners, the middle plate comprises a metal part, and the metal part is arranged opposite to the first sub-part of the antenna and the second sub-part of the antenna. For example, the middle plate can be made of a metal material as a whole to form the metal part, or the middle plate can be made of a metal material in part to form the metal part.

[0056] In the embodiment, the metal part of the middle plate is arranged opposite to the first sub-part of the antenna and the second sub-part of the antenna, and can be used as a reflecting plate of the first sub-part of the antenna and the second sub-part of the antenna to improve the radiation efficiency of the antenna, adjust the signal direction of the antenna, and enhance the signal strength of the antenna. In addition, the middle frame has the metal part, which can increase the structural strength of the middle frame.

[0057] In some possible implementation manners, the electronic device further comprises a fan, the fan is installed in the inner cavity, and an air outlet of the fan is connected to the air duct. In the embodiment, air generated by the operation of the fan can be sent out of the electronic device through the air duct to carry out heat dissipation.

[0058] In some possible implementation manners, the electronic device further comprises a display screen, the display screen is located on a side of the middle frame away from the back cover and is fixed to the middle frame. For example, the display screen has a display function, or the display screen can integrate the display function and the touch sensing function. BRIEF DESCRIPTION OF DRAWINGS

[0059] In order to illustrate the technical solutions in the embodiments or the background art of the present application, the drawings needed to be used in the embodiments or the background art of the present application will be described below.

[0060] FIG. 1 is a structural schematic diagram of an electronic device according to an embodiment of the present application;

[0061] FIG. 2 is a schematic diagram of part of the structure of the electronic device shown in FIG. 1;

[0062] FIG. 3 is a schematic diagram of a cross-sectional structure of the electronic device shown in FIG. 1 along A-A;

[0063] Fig. 4 is a partial enlarged view of the structure shown in Fig. 3;

[0064] Fig. 5 is a comparison of the S11 curve of the antenna of the electronic device provided in the embodiments of the present application and that of a conventional electronic device;

[0065] Fig. 6 is a comparison of the radiation efficiency curve of the antenna of the electronic device provided in the embodiments of the present application and that of a conventional electronic device;

[0066] Fig. 7 is a schematic view of a partial structure of the electronic device provided in the embodiments of the present application in another embodiment;

[0067] Fig. 8 is a schematic view of the structure of the back cover of the electronic device shown in Fig. 7 from another angle. DETAILED DESCRIPTION

[0068] The embodiments of the present application will be described below in conjunction with the accompanying drawings in the embodiments of the present application.

[0069] In the description of the embodiments of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection" should be understood in a broad sense, for example, "connection" can be detachable connection, or can be non-detachable connection; can be direct connection, or can be indirect connection through an intermediate medium.

[0070] In the embodiments of the present application, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second", etc. can explicitly or implicitly include one or more of the features. The term "multiple" means at least two. The terms "including", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized. "An integrally formed structural member" means that during the process of forming one part of the structural member, the part is connected together with another part, without the need for connecting the two parts together through reprocessing (such as bonding, welding, buckling, screwing).

[0071] In the embodiments of the present application, "and / or" is only a description of the association relationship between the associated objects, which means that there can be three relationships, for example, A and / or B can mean that A exists alone, A and B exist together, and B exists alone. In addition, the character " / " in this paper generally represents that the front and rear associated objects are in an "or" relationship.

[0072] Please refer to Figs. 1 and 2, Fig. 1 is a schematic view of the structure of an electronic device 100 provided in the embodiments of the present application, and Fig. 2 is a schematic view of a partial structure of the electronic device 100 shown in Fig. 1.

[0073] In some embodiments, the electronic device 100 of the present application can be a tablet computer, a notebook computer, a mobile phone, a wearable device, etc. The wearable device can be a smart watch, a smart bracelet, smart glasses, etc. The electronic device 100 can be a straight device or a foldable device. The electronic device 100 of the present application is taken as an example of a tablet computer, and of course, other types of electronic devices 100 can also adopt similar structures, which will not be described hereinafter. It should be noted that FIG. 1 and the relevant drawings hereinafter only schematically show some components included in the electronic device 100, and the actual shape, actual size, actual position and actual structure of these components are not limited by FIG. 1 and the drawings hereinafter.

[0074] In some embodiments, the electronic device 100 can include a middle frame 1, a back cover 2 and a display screen 3. For example, the back cover 2 is fixed to one side of the middle frame 1, and the display screen 3 is located on the side of the middle frame 1 away from the back cover 2 and is fixed to the middle frame 1. In the following, for the convenience of description, the electronic device 100 is defined to have a thickness direction, and the back cover 2, the middle frame 1 and the display screen 3 are arranged in the thickness direction of the electronic device 100. In some examples, the back cover 2 and the display screen 3 can be in a flat shape as a whole or in a major part, and are perpendicular to the thickness direction of the electronic device 100.

[0075] For example, the display screen 3 has a display function, or the display screen 3 can integrate a display function and a touch sensing function. The display function of the display screen 3 is used to display text, images, videos, etc. The touch sensing function of the display screen 3 is used to detect the touch action of the user to realize the information interaction between man and machine. The display screen 3 can be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode display screen, a micro light-emitting diode (Micro LED) display screen, a micro organic light-emitting diode (Micro OLED) display screen, or a quantum dot light emitting diode (QLED) display screen, a liquid crystal display (LCD), etc. In other embodiments, the electronic device 100 can also not be provided with the display screen 3.

[0076] Exemplarily, the middle frame 1 can include a side frame 11 and a middle plate 12 fixed to the inner side of the side frame 11, the side frame 11 is connected to the back cover 2, and the middle plate 12 is arranged opposite to the back cover 2. The side frame 11 and the middle plate 12 can be an integrally formed structural member, or can be formed into an integrated structure by assembling, for example, bonding, welding, clamping, fastening connection and the like, and the embodiments of the present application do not make strict limitation thereto.

[0077] Please refer to FIGS. 2 to 4, FIG. 3 is a schematic diagram of the cross-sectional structure of the electronic device 100 along A-A shown in FIG. 1, and FIG. 4 is a partial enlarged schematic diagram of the structure shown in FIG. 3.

[0078] In some embodiments, the inner cavity 4 and the air duct 5 are formed between the back cover 2 and the middle frame 1. Exemplarily, the air duct 5 and the inner cavity 4 can be located between the middle plate 12 and the back cover 2. The inner cavity 4 is located on the inner side of the side frame 11. The outlet (not shown in the figure) of the air duct 5 can be arranged on the side frame 11 or between the side frame 11 and the back cover 2. The air in the air duct 5 can exchange with the air outside the electronic device 100 to transfer the heat inside the electronic device 100 to the outside of the electronic device 100, thereby achieving heat dissipation. Exemplarily, the air duct 5 is isolated from the inner cavity 4. At this time, the air duct 5 and the inner cavity 4 are separated and are independent spaces, which can prevent external dust, water vapor and the like from entering the inner cavity 4 through the air duct 5, thereby protecting the devices located in the inner cavity 4 and improving the reliability of the electronic device 100.

[0079] Exemplarily, the middle plate 12 can include an air duct bottom wall 121 and an air duct side wall 122, the air duct side wall 122 is fixed to the side of the air duct bottom wall 121 facing the back cover 2, the air duct side wall 122 is connected to the back cover 2, and the air duct bottom wall 121, the air duct side wall 122 and the back cover 2 surround the air duct 5. The air duct bottom wall 121 and the air duct side wall 122 can be integrally formed on the middle plate 12. In other words, the air duct bottom wall 121 and the air duct side wall 122 can be formed together in the forming process of the middle plate 12, and the air duct bottom wall 121 and the air duct side wall 122 are integrally formed with at least one other structure of the middle plate 12. For example, the middle plate 12 can be formed by die casting, and the air duct bottom wall 121 and the air duct side wall 122 are formed together in the die casting process.

[0080] In the present embodiment, by integrally forming the air duct side wall 122 and the air duct bottom wall 121 on the middle plate 12, not only can the structure of the air duct 5 be simplified and the air tightness of the air duct 5 be improved, but also the difficulty of forming and assembling the air duct 5 can be reduced, and the cost of the electronic device 100 can be reduced.

[0081] In some other embodiments, the air duct side wall 122 and the air duct bottom wall 121 can also be formed independently, and then fixed to other structures of the middle plate 12 through assembly to form a part of the middle plate 12. In the embodiments of the present application, the "fixed through assembly" means fixed connection through assembly, for example, fixed connection through welding, clamping, bonding, fastener connection and the like.

[0082] In some embodiments, the electronic device 100 further comprises a fan 6, the fan 6 is installed in the inner cavity 4, and an air outlet of the fan 6 is communicated with the air duct 5. In the embodiments, the fan 6 works to form air which can be sent out of the electronic device 100 through the air duct 5 to take out the heat inside the electronic device 100 to achieve heat dissipation. In some examples, the air duct side wall 122 can comprise two oppositely arranged parts, one end of the two parts can be connected with the frame 11, and the other end of the two parts can be connected with the fan 6.

[0083] It can be understood that in the embodiments of the present application, the electronic device 100 can be a thin and large flat size product, for example, the flat size can be 10 inches (25.4 cm) or more. At this time, the display screen 3 can also be a large flat size product to achieve large screen display. Moreover, the electronic device 100 has a large enough space inside for setting the air duct 5 and the fan 6, so that the electronic device 100 has better heat dissipation performance.

[0084] In some other embodiments, the air duct 5 can also be arranged in the electronic device 100 without arranging the fan 6, air exchange between the air duct 5 and the outside of the electronic device 100 can also take away the heat inside the electronic device 100 to achieve heat dissipation. Alternatively, the electronic device 100 can also be provided with other structural members for heat exchange with the outside of the electronic device 100 through the air duct 5, or driving air in the air duct 5 to exchange heat with the outside of the electronic device 100, which is not strictly limited in the embodiments of the present application.

[0085] Please refer to FIG. 2 and FIG. 3, in some embodiments, the electronic device 100 can further comprise a support 7, the support 7 is installed in the inner cavity 4. The support 7 can be arranged adjacent to the air duct 5 to be close to the air duct 5. For example, the support 7 can be fixed to the side of the middle plate 12 facing the back cover 2. The support 7 has a certain structure height, and the gap between the support 7 and the back cover 2 can be smaller than the gap between the middle plate 12 and the back cover 2.

[0086] In some examples, the support 7 can be an audio module. For example, the audio module can have an acoustic cavity housing and a loudspeaker, and the loudspeaker can be mounted on the inside of the acoustic cavity housing. The acoustic cavity housing can be made of an insulating material such as plastic, and the insulating part of the acoustic cavity housing is the support as a whole. Alternatively, the acoustic cavity housing can be partially made of a non-metallic material, and the part of the acoustic cavity housing forms the insulating part.

[0087] In some other examples, the support 7 can be a bracket. At least part of the structure of the bracket is made of an insulating material. For example, the bracket can be made of an insulating material as a whole, and the insulating part of the bracket is the bracket as a whole. Alternatively, the bracket can be partially made of an insulating material to form the insulating part, and another part of the bracket can be a conductive part or the like. The insulating material can be plastic or the like.

[0088] In some examples, the electronic device 100 can further include a circuit board 8 mounted in the inner cavity 4. The circuit board 8 can be arranged adjacent to the support 7 to be close to the support 7. The circuit board 8 can be a hard printed circuit board (PCB), a flexible printed circuit board (FPC), or a combination of hard and soft printed circuit boards, and the present application is not limited in this regard.

[0089] Please refer to FIGS. 2 and 4, in some examples, the electronic device 100 can further include an antenna first sub-portion 91. The antenna first sub-portion 91 is fixed to the side of the support 7 facing the back cover 2 and electrically connected to the circuit board 8. The circuit board 8 is provided with a feeding circuit (not shown in the figure), and the feeding circuit can feed the antenna first sub-portion 91. For example, the antenna first sub-portion 91 can be electrically connected to the circuit board 8 through a wire or a pin. For example, one end of the wire or the pin can be fixed to the side of the support 7 facing the back cover 2 and connected to the antenna first sub-portion 91, and the other end of the wire or the pin can be wound from the side of the support 7 to the circuit board 8 to be connected to the circuit board 8.

[0090] For example, when the support 7 is an audio module, the antenna first sub-portion 91 can be fixed to the acoustic cavity housing of the audio module, for example, to the insulating part of the acoustic cavity housing. The antenna first sub-portion 91 can be arranged away from the loudspeaker (not shown in the figure) of the audio module to reduce the interference of the loudspeaker on the antenna first sub-portion 91.

[0091] For example, when the support 7 is a bracket, the antenna first sub-portion 91 can be fixed to the insulating part of the bracket.

[0092] For example, the antenna first sub-portion 91 can be a flexible printed circuit board or a metal piece. In this case, the antenna first sub-portion 91 has a simple structure and is easy to implement.

[0093] For example, the first antenna subpart 91 is a flexible printed circuit board, and the first antenna subpart 91 is assembled and fixed to the support 7 by means of adhesion, clamping, welding, fastener connection, etc. Alternatively, the first antenna subpart 91 is a metal plate, for example, a copper plate, an iron plate, an aluminum plate, etc., and the first antenna subpart 91 can be assembled and fixed to the support 7 by means of adhesion, clamping, welding, fastener connection, etc. Alternatively, the first antenna subpart 91 is an LDS (Laser-Direct-structuring) metal structure, and a metal material such as copper, iron, or aluminum can be used, and the first antenna subpart 91 can be directly formed on the support 7 by means of the LDS process.

[0094] For example, the first antenna subpart 91 is a flexible printed circuit board, and the first antenna subpart 91 is assembled and fixed to the support 7 by means of adhesion, clamping, welding, fastener connection, etc. Alternatively, the first antenna subpart 91 is a metal plate, for example, a copper plate, an iron plate, an aluminum plate, etc., and the first antenna subpart 91 can be assembled and fixed to the support 7 by means of adhesion, clamping, welding, fastener connection, etc. Alternatively, the first antenna subpart 91 is an LDS (Laser-Direct-structuring) metal structure, and a metal material such as copper, iron, or aluminum can be used, and the first antenna subpart 91 can be directly formed on the support 7 by means of the LDS process.

[0095] Please refer to FIG. 2 and FIG. 4, in some embodiments, the electronic device 100 can further include a second antenna subpart 92, which can be fixed to one side of the back cover 2 facing the middle frame 1 and at least partially located in the air duct 5. Wherein, the second antenna subpart 92 can form a first projection on the back cover 2, and the air duct 5 can form a second projection on the back cover 2, when the first projection is at least partially located in the second projection, that is, when the first projection at least partially coincides with the second projection, the second antenna subpart 92 is at least partially located in the air duct 5.

[0096] Wherein, the area of the back cover 2 directly opposite to the second antenna subpart 92 is a non-signal shielding area. Wherein, the non-signal shielding area allows signals to pass through, and can also be referred to as a signal passing area. For example, the non-signal shielding area can be made of non-conductive material. Wherein, the non-conductive material can be glass fiber, ceramic, plastic, etc.

[0097] In some examples, the back cover 2 can be a non-metal back cover, for example, a glass fiber back cover, a ceramic back cover, or a plastic back cover, etc. At this time, the back cover 2 is simple in structure and easy to implement. In other examples, the back cover 2 can also be a spliced structure, for example, when the back cover 2 includes the above-mentioned non-signal shielding area (referred to as the first area), the back cover 2 can further include a second area, the second area can be a signal shielding area or a non-signal shielding area, and the second area is spliced with the first area. The specific structure and material of the back cover 2 are not strictly limited in the embodiments of the present application.

[0098] The antenna first subunit 91 is coupled to the antenna second subunit 92. The antenna first subunit 91 and the antenna second subunit 92 jointly constitute the antenna 9 of the electronic device 100, that is, the antenna 9 of the electronic device 100 includes the antenna first subunit 91 and the antenna second subunit 92.

[0099] In the embodiment, the antenna 9 of the electronic device 100 is increased in area by the antenna second subunit 92 which is at least partially located in the air duct 5 and can transmit signals through the back cover 2, thereby improving the performance of the antenna 9, and the antenna 9 has better bandwidth and radiation efficiency. In addition, the air duct 5 of the electronic device 100 also provides a good clearance environment for the antenna 9, which is conducive to ensuring the performance of the antenna 9.

[0100] In the embodiment, the antenna 9 is jointly constituted by the antenna first subunit 91 and the antenna second subunit 92, and both of them work to present the performance of the antenna 9. If the antenna second subunit 92 is omitted, the S11 curve of the antenna and the frequency curve of the antenna will change significantly.

[0101] Please refer to FIG. 5 and FIG. 6, FIG. 5 is an S11 curve comparison diagram of the antenna of the electronic device 100 and a conventional electronic device 100, and FIG. 6 is an antenna radiation efficiency curve comparison diagram of the electronic device 100 and the conventional electronic device 100.

[0102] In FIG. 5, the S11 curve represents the return loss of the antenna, the vertical coordinate unit is decibel (dB), and the horizontal coordinate represents the frequency, the unit is gigahertz (GHz). In FIG. 5, the solid line represents the S11 curve of the antenna 9 of the electronic device 100 of the embodiment, and the dotted curve represents the S11 curve of the antenna without the antenna second subunit 92. As shown in FIG. 5, in some possible embodiments, the electronic device 100 of the embodiment can not only realize the coverage of the 2.4 GHz frequency band of wifi (Wireless Fidelity), but also significantly improve the resonance depth compared with the scheme without the antenna second subunit 92.

[0103] In FIG. 6, the vertical coordinate unit is decibel (dB), and the horizontal coordinate represents the frequency, the unit is gigahertz (GHz). In FIG. 5, the solid line represents the radiation efficiency curve of the antenna 9 of the electronic device 100 of the embodiment, and the dotted curve with triangles represents the radiation efficiency curve of the antenna without the antenna second subunit 92. As shown in FIG. 6, in some possible embodiments, the radiation efficiency of the electronic device 100 of the embodiment in the 2.4 GHz frequency band is improved by about 6 dB compared with the scheme without the antenna second subunit 92.

[0104] It can be understood that the setting of the second sub-antenna part 92 increases a resonance in the band, and the second sub-antenna part 92 is the main radiator of the antenna 9, thereby improving the performance of the antenna 9 of the electronic device 100. In some examples, the first sub-antenna part 91 can form a resonance, which can be in the band or not in the band, or the first sub-antenna part 91 can not form a resonance, and the first sub-antenna part 91 is used to feed the signal to the second sub-antenna part 92, and the specific role and structure of the first sub-antenna part 91 are not strictly limited in the embodiments of the present application.

[0105] It can be understood that the antenna 9 of the electronic device 100 according to the embodiments of the present application can cover the 2.4 GHz frequency band of wifi, and in other examples, the antenna 9 can cover other frequency bands, for example, other frequency bands in the 1.7 GHz to 5 GHz frequency band.

[0106] In the embodiments of the present application, the second sub-antenna part 92 can include one or more structural parts, and when the second sub-antenna part 92 includes a plurality of structural parts, the plurality of structural parts can be connected or spaced, and the specific structure and shape of the second sub-antenna part are not strictly limited in the embodiments of the present application. The following examples are described by taking the second sub-antenna part 92 including one structural part as an example.

[0107] Please refer to FIG. 2 and FIG. 4 again, in some examples, the area of the second sub-antenna part 92 is greater than the area of the first sub-antenna part 91. At this time, the second sub-antenna part 92 can greatly increase the area of the antenna 9 of the electronic device 100, so as to improve the performance of the antenna 9. For example, the area of the second sub-antenna part 92 can be greater than twice the area of the first sub-antenna part 91.

[0108] In the embodiments of the present application, the second sub-antenna part 92 can include one or more structural parts, and when the second sub-antenna part 92 includes a plurality of structural parts, the plurality of structural parts can be connected or spaced, and the specific structure and shape of the second sub-antenna part are not strictly limited in the embodiments of the present application. The following examples are described by taking the second sub-antenna part 92 including one structural part as an example.

[0109] In some examples, the second sub-antenna part 92 can include a first part 921 and a second part 922. The second part 922 is connected to the first part 921. The first part 921 is arranged corresponding to the air duct 5, for example, can be located in the air duct 5. The second part 922 is arranged corresponding to the inner cavity 4, for example, can be located outside the air duct 5. The area of the first part 921 is greater than the area of the second part 922.

[0110] In the embodiments of the present application, the second sub-antenna part 92 can include one or more structural parts, and when the second sub-antenna part 92 includes a plurality of structural parts, the plurality of structural parts can be connected or spaced, and the specific structure and shape of the second sub-antenna part are not strictly limited in the embodiments of the present application. The following examples are described by taking the second sub-antenna part 92 including one structural part as an example.

[0111] In some embodiments, the second sub-antenna 92 can be arranged in the air duct 5 as a whole. For example, the second sub-antenna 92 can be arranged in the air duct 5 as a whole. In this case, the support 7 and the first sub-antenna 91 can be arranged as close to the air duct 5 as possible to ensure the coupling between the first sub-antenna 91 and the second sub-antenna 92.

[0112] In some embodiments, the distance between the first sub-antenna 91 and the second sub-antenna 92 is less than one-eighth of the wavelength corresponding to the center frequency of the operating frequency band of the antenna 9. In this case, since the shapes of the first sub-antenna 91 and the second sub-antenna 92 can be regular or irregular, the distance between the first sub-antenna 91 and the second sub-antenna 92 refers to the size at the narrowest position in the gap between the two.

[0113] In this embodiment, by arranging the distance between the first sub-antenna 91 and the second sub-antenna 92, the first sub-antenna 91 and the second sub-antenna 92 are close enough to be coupled to form the antenna 9. It can be understood that in other embodiments, the distance between the first sub-antenna 91 and the second sub-antenna 92 can also meet other settings when the first sub-antenna 91 and the second sub-antenna 92 are coupled, and the present embodiment does not make strict limitations on this.

[0114] In some examples, the second sub-antenna 92 can be arranged staggered with the first sub-antenna 91 in the thickness direction of the electronic device 100; in other examples, the second sub-antenna 92 can also be arranged at least partially opposite to the first sub-antenna 91 in the thickness direction of the electronic device 100, and the present embodiment does not make strict limitations on the relative position relationship between the two.

[0115] In some embodiments, the second sub-antenna 92 can be a flexible printed circuit board or a metal piece. In this case, the second sub-antenna 92 has a simple structure and is easy to implement. For example, the second sub-antenna 92 can be assembled and fixed to the back cover 2. In this case, the second sub-antenna 92 and the back cover 2 are first processed separately and then assembled, which has low manufacturing difficulty and is easy to implement. Alternatively, the second sub-antenna 92 can be formed on the back cover 2. For example, after the back cover 2 is manufactured, the second sub-antenna 92 can be processed on the back cover 2 so that the second sub-antenna 92 is directly formed on the back cover 2 without the need for subsequent assembly process to be fixed to the back cover 2. In this case, the connection stability between the second sub-antenna 92 and the back cover 2 is high. In the present embodiment, the second sub-antenna 92 can be fixed to the back cover 2 by assembly or forming, and the implementation is flexible and diversified.

[0116] For example, the second antenna subpart 92 is a flexible printed circuit board, and the second antenna subpart 92 is assembled and fixed to the back cover 2 by means of adhesion, clamping, welding, fastener connection, etc.; or the second antenna subpart 92 is a metal plate, for example, a copper plate, an iron plate, an aluminum plate, etc., and the second antenna subpart 92 can be assembled and fixed to the back cover 2 by means of adhesion, clamping, welding, fastener connection, etc.; or the second antenna subpart 92 is an LDS (Laser-Direct-structuring) metal structure, and the second antenna subpart 92 can be directly formed on the back cover 2 by means of the LDS process. When the second antenna subpart 92 is a flexible printed circuit board or an LDS metal structure, a relatively complex antenna structure can be realized; when the second antenna subpart 92 is a metal plate, a relatively simple antenna structure can be realized, and the cost is relatively low.

[0117] In some embodiments, the second antenna subpart 92 can also be a conductive heat dissipation member. For example, the second antenna subpart 92 can be a graphite sheet, and the second antenna subpart 92 can be assembled and fixed to the back cover 2 by means of adhesion, etc. In this embodiment, the electronic device 100 reuses the heat dissipation member as the second antenna subpart 92, so that the heat dissipation function of the heat dissipation member can be retained, the air duct 5 can also take away the heat of the heat dissipation member, thereby taking away the heat of other components in the electronic device 100 that are in thermal contact with the heat dissipation member, to ensure the heat dissipation performance of the electronic device 100, and the performance of the antenna 9 of the electronic device 100 can be improved without increasing additional structure, which is low in difficulty and low in cost.

[0118] In addition, when the second antenna subpart 92 adopts a graphite sheet, the graphite sheet is easy to cut, and is more suitable for meeting the heat dissipation demand and the antenna design demand, and the cost is low. In other embodiments, the second antenna subpart 92 can also be other forms of conductive heat dissipation members, for example, the second antenna subpart 92 can also be a heat plate adopting a heat pipe structure, etc., and the specific implementation structure of the second antenna subpart 92 is not strictly limited in the embodiments of the present application.

[0119] In some embodiments, the middle plate 12 of the middle frame 1 can include a metal part (not shown in the figure), and the metal part is arranged opposite to the first antenna subpart 91 and the second antenna subpart 92. For example, the middle plate 12 can be made of a metal material as a whole to form the metal part; or the middle plate 12 can be made of a metal material locally to form the metal part.

[0120] In this embodiment, the metal part of the middle plate 12 is arranged opposite to the first antenna subpart 91 and the second antenna subpart 92, and can be used as a reflector plate of the first antenna subpart 91 and the second antenna subpart 92 to improve the radiation efficiency of the antenna 9, adjust the signal direction of the antenna 9, and enhance the signal strength of the antenna 9. In addition, the middle plate 12 with the metal part can also increase the structural strength of the middle frame 1.

[0121] The metal part can be made of copper, aluminum, copper alloy, aluminum alloy, copper-aluminum composite material, or the like.

[0122] As shown in FIG. 4, in some embodiments, part of the structure of the support 7 can constitute part of the air duct wall of the air duct 5. In this case, the support 7 and the air duct 5 are arranged compactly, and the distance between them is very close, which is conducive to the coupling of the first antenna subpart 91 and the second antenna subpart 92, reduces the difficulty of arranging the first antenna subpart 91 and the second antenna subpart 92, and is also conducive to saving the internal space of the electronic device 100, thereby facilitating the miniaturization of the electronic device 100.

[0123] For example, part of the structure of the support 7 can be lapped on the air duct side wall 122 and sealingly connected to the air duct side wall 122 and the rear cover 2.

[0124] In some embodiments, the electronic device 100 can further include a first sealing member 20 located between the support 7 and the rear cover 2 and constituting part of the air duct wall of the air duct 5. The first sealing member 20 can be made of foam, rubber, or the like. For example, the first sealing member 20 can be bonded to the support 7 to maintain a relatively fixed positional relationship with the support 7.

[0125] In this embodiment, the first sealing member 20 not only can seal the air duct 5, but also can limit the positions of the support 7 and the rear cover 2, provide certain support for the rear cover 2, and facilitate improving the structural reliability of the electronic device 100. In addition, the first sealing member 20 has a certain compressibility and can absorb the assembly tolerance of the support 7 and the rear cover 2, thereby facilitating improving the assembly precision of the electronic device 100.

[0126] When the second antenna subpart 92 extends from the air duct 5 to the inner cavity 4, the first sealing member 20 can also abut on the second antenna subpart 92 for sealing and limiting. In this case, part of the structure of the first sealing member 20 is sealed between the support 7 and the rear cover 2, and another part of the structure of the first sealing member 20 is sealed between the support 7 and the second antenna subpart 92. The second antenna subpart 92 is fixed to the rear cover 2, and the first sealing member 20 can abut on but not be bonded to the rear cover 2 and the second antenna subpart 92 to facilitate dismounting or mounting of the rear cover 2 and the second antenna subpart 92. Alternatively, the first sealing member 20 can be bonded to the rear cover 2 and the second antenna subpart 92.

[0127] In some embodiments, the electronic device 100 can further include a second sealing member 30, which is located between the support member 7 and the middle frame 1 and constitutes part of the air duct wall of the air duct 5. For example, the second sealing member 30 can be sealed between the air duct side wall 122 and the support member 7. The second sealing member 30 can be made of materials such as foam or rubber. For example, the second sealing member 30 can be bonded to the air duct side wall 122 and / or the support member 7 to maintain a stable connection relationship.

[0128] In the present embodiment, the second sealing member 30 not only seals the air duct 5, but also limits the support member 7 and the middle frame 1, which is conducive to improving the structural reliability of the electronic device 100. In addition, the second sealing member 30 has a certain compressibility and can absorb the assembly tolerance of the support member 7 and the middle frame 1, which is conducive to improving the assembly accuracy of the electronic device 100.

[0129] When the air duct side wall 122 is made of a metal material, the first sealing member 20 and / or the second sealing member 30 can be made of an insulating material to achieve electrical isolation.

[0130] In the embodiment of FIG. 4, the air duct side wall 122, the second sealing member 30, the support member 7, and the first sealing member 20 cooperatively form the air duct wall of the air duct 5. In other embodiments, the air duct wall of the air duct 5 can also be formed by the air duct side wall 122, or by the air duct wall, the support member 7, and one of the sealing members. The present embodiments do not strictly limit the specific structure of the air duct wall of the air duct 5.

[0131] Please refer to FIG. 7 and FIG. 8, FIG. 7 is a partial structure schematic diagram of an electronic device 100 in some embodiments, and FIG. 8 is a structure schematic diagram of the back cover 2 of the electronic device 100 in FIG. 7 from another angle. In FIG. 8, the angle of the back cover 2 is the angle of the bottom view or top view of the back cover 2, that is, the angle of the back cover 2 viewed from the outside of the electronic device 100 or the angle of the back cover 2 viewed from the inside of the electronic device 100. The electronic device 100 in the present embodiment can include most of the technical features of the electronic device 100 in the previous embodiments. The following mainly describes the differences between the two, and most of the same content of the two will not be described again.

[0132] In some embodiments, the electronic device 100 can include a middle frame 1, a back cover 2, a support 7, a circuit board 8, and an antenna first sub-portion 91. The back cover 2 is fixed to one side of the middle frame 1, and an inner cavity 4 and an air duct 5 are formed between the back cover 2 and the middle frame 1. The support 7 and the circuit board 8 are both mounted in the inner cavity 4. The antenna first sub-portion 91 is fixed to one side of the support 7 facing the back cover 2 and is electrically connected to the circuit board 8. The back cover 2 includes a main body 21 and an antenna second sub-portion 92 connected to the main body 21. The arrangement surfaces of the main body 21 and the antenna second sub-portion 92 are perpendicular to the thickness direction of the back cover 2, and the two are insulated. At least part of the antenna second sub-portion 92 is arranged opposite to the air duct 5. The antenna first sub-portion 91 is coupled to the antenna second sub-portion 92. The antenna first sub-portion 91 and the antenna second sub-portion 92 together constitute the antenna 9 of the electronic device 100, that is, the antenna 9 of the electronic device 100 includes the antenna first sub-portion 91 and the antenna second sub-portion 92.

[0133] In the present embodiment, the antenna 9 of the electronic device 100 is increased in area by adding the antenna second sub-portion 92, which is part of the structure of the back cover 2 and can transmit signals with the outside. The antenna second sub-portion 92 is at least partially arranged opposite to the air duct 5, thereby increasing the area of the antenna and improving the performance of the antenna 9. The antenna 9 has better bandwidth and radiation efficiency. In addition, the air duct 5 of the electronic device 100 provides a good clearance environment for the antenna 9, which is conducive to ensuring the performance of the antenna 9.

[0134] It can be understood that the main difference between the present embodiment and the previous embodiments is the implementation of the antenna second sub-portion 92. In the previous embodiments, the antenna second sub-portion 92 and the back cover 2 are two structural members, and the antenna second sub-portion 92 is fixed to the back cover 2. In the present embodiment, the antenna second sub-portion 92 is part of the structure of the back cover 2, and the manufacturing of the antenna second sub-portion 92 is completed when the back cover 2 is manufactured. Compared with the previous embodiments, one structural member is reduced, which is conducive to simplifying the structure and assembly process of the electronic device 100.

[0135] The back cover 2 is generally plate-shaped, and the plate surface of the back cover 2 is perpendicular to the thickness direction of the back cover 2. The arrangement surfaces of the main body 21 and the antenna second sub-portion 92 are perpendicular to the thickness direction of the back cover 2, that is, the main body 21 and the antenna second sub-portion 92 are arranged on the plate surface of the back cover 2, and the main body 21 and the antenna second sub-portion 92 are also generally plate-shaped. The back cover 2 can be flat, or the back cover 2 can be in the shape of a flat middle portion and a curved peripheral surface, and the present embodiment does not strictly limit this.

[0136] Part of or the whole of the second antenna sub-part 92 is arranged opposite the air duct 5 in the thickness direction of the electronic device 100. At this time, the projection of the air duct 5 on the back cover 2 overlaps at least part of the second antenna sub-part 92.

[0137] The second antenna sub-part 92 is made of a conductive material. In this embodiment, a certain area of the back cover 2 is made of a conductive material to form the conductive second antenna sub-part 92, so that the second antenna sub-part 92 can serve as part of the antenna 9. The conductive material can be metal, carbon fiber, etc.

[0138] In some embodiments, the main body 21 can include an insulating part 211 and a conductive part 212, the insulating part 211 being connected between the second antenna sub-part 92 and the conductive part 212, and the material of the conductive part 212 being the same as or different from that of the second antenna sub-part 92.

[0139] When the material of the conductive part 212 is the same as that of the second antenna sub-part 92, the back cover 2 can be made of a structure in which a slit is opened in a conductive structure and a non-conductive structure is filled in the slit. For example, a slit can be opened in a metal plate to form the conductive part 212 and the second antenna sub-part 92, and a non-metal material can be filled in the slit, for example, the insulating part 211 can be formed by nano-injection. At this time, the manufacturing cost of the back cover 2 is relatively low.

[0140] When the material of the conductive part 212 is different from that of the second antenna sub-part 92, the selection of the material of the second antenna sub-part 92 is more flexible, which can better adapt to the antenna signal transmission requirements.

[0141] In some embodiments, the main body 21 is made of an insulating material. At this time, the back cover 2 can be made of a structure in which a local conductive structure is added to an insulating structure. For example, the main body 21 is made of a glass fiber material, the second antenna sub-part 92 is made of a carbon fiber material, and the back cover 2 is made of a structure in which a local carbon fiber plate is added to a glass fiber plate. Alternatively, the main body 21 is made of a plastic material, the second antenna sub-part 92 is made of a metal material (such as copper, aluminum, iron, etc. or an alloy thereof), and the back cover 2 is made of a structure in which a local metal plate is added to a non-metal plate.

[0142] The back cover 2 further includes an appearance layer (not shown in the figure), which can be arranged on the side of the main body 21 and the second antenna sub-part 92 away from the middle frame 1. For example, the appearance layer can cover the surface of the main body 21 and the second antenna sub-part 92 away from the middle frame 1. The appearance layer can be used to protect the back cover, improve the appearance and touch of the back cover, and at the same time, the appearance layer also allows the second antenna sub-part 92 to transmit signals with the outside of the electronic device 100. For example, the appearance layer can be a leather layer, etc.

[0143] It can be understood that the main difference between the electronic device 100 of the embodiment and the previous embodiments is the structure of the back cover 2 and the second sub-portion 92 of the antenna described above. The other design contents can be referred to the related description of the previous embodiments, and will not be repeated here.

[0144] In the previous embodiments, part of the structure of the air duct 5 is formed by the middle frame 1, and the support 7 is mounted on the middle frame 1. In some other embodiments, part of the structure of the air duct 5 can also be formed by other structural members of the electronic device 100, and the position of the support 7 is adjusted adaptively, and still meets the requirement of being arranged adjacent to the air duct 5. For example, part of the structure of the air duct 5 can be formed by a bracket or a support, which is fixed to the non-light-emitting side of the display screen 3 (i.e. the side of the display screen 3 facing the back cover 2), and the support 7 is also fixed to the non-light-emitting side of the display screen 3. The embodiments of the present application do not strictly limit the structure of the air duct 5 and the mounting structure of the support 7.

[0145] In this specification, the reference "one embodiment", "some embodiments", "an embodiment", "one specific embodiment", "some specific embodiments", and the like mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the application. Thus, the appearances of the phrase "in one embodiment", "in some embodiments", "in an embodiment", "in one specific embodiment", "in some specific embodiments", and the like, in various places in the specification are not necessarily all referring to the same embodiment, unless otherwise specified.

[0146] The above only describes some of the embodiments of the present application, and the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or replacements within the technical scope disclosed in the present application, which should be covered within the protection scope of the present application. In the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. An electronic device (100), characterized by The antenna (9) comprises a middle frame (1), a back cover (2), a support (7), a circuit board (8), an antenna first sub-portion (91) and an antenna second sub-portion (92). The back cover (2) is fixed to one side of the middle frame (1), and an inner cavity (4) and an air duct (5) are formed between the back cover (2) and the middle frame (1). The support (7) and the circuit board (8) are both installed in the inner cavity (4). The antenna first sub-portion (91) is fixed to one side of the support (7) facing the back cover (2) and is electrically connected to the circuit board (8). The antenna second sub-portion (92) is fixed to one side of the back cover (2) facing the middle frame (1) and is at least partially located in the air duct (5). The area of the back cover (2) facing the antenna second sub-portion (92) is a non-signal shielding area. The antenna first sub-portion (91) and the antenna second sub-portion (92) jointly constitute the antenna (9).

2. The electronic device (100) according to claim 1, characterized in that The antenna second sub-portion (92) is a flexible printed circuit board, a metal piece or a conductive heat dissipation piece.

3. The electronic device (100) according to claim 1 or 2, characterized in that, The antenna second sub-portion (92) is assembled and fixed to the back cover (2), or the antenna second sub-portion (92) is formed on the back cover (2).

4. The electronic device (100) according to any one of claims 1 to 3, characterized in that, The back cover (2) is a glass fiber back cover, a ceramic back cover or a plastic back cover.

5. An electronic device (100), characterized by The antenna (9) comprises a middle frame (1), a back cover (2), a support (7), a circuit board (8) and an antenna first sub-portion (91). The back cover (2) is fixed to one side of the middle frame (1), and an inner cavity (4) and an air duct (5) are formed between the back cover (2) and the middle frame (1). The support (7) and the circuit board (8) are both installed in the inner cavity (4). The antenna first sub-portion (91) is fixed to one side of the support (7) facing the back cover (2) and is electrically connected to the circuit board (8). The back cover (2) comprises a main body (21) and an antenna second sub-portion (92) connected to the main body (21). The arrangement surfaces of the main body (21) and the antenna second sub-portion (92) are perpendicular to the thickness direction of the back cover (2) and are insulated from each other. At least part of the antenna second sub-portion (92) is arranged opposite to the air duct (5). The antenna first sub-portion (91) and the antenna second sub-portion (92) jointly constitute the antenna (9).

6. The electronic device (100) according to claim 5, characterized by The antenna second sub-portion (92) is made of conductive material.

7. The electronic device (100) according to claim 5 or 6, characterized by The main body (21) comprises an insulating portion (211) and a conductive portion (212). The insulating portion (211) is connected between the antenna second sub-portion (92) and the conductive portion (212). The material of the conductive portion (212) is the same as or different from that of the antenna second sub-portion (92). The main body (21) is made of insulating material.

8. The electronic device (100) according to any one of claims 1 to 7, characterized in that, The area of the antenna second sub-portion (92) is greater than that of the antenna first sub-portion (91).

9. The electronic device (100) according to any one of claims 1 to 8, characterized in that, The antenna second sub-portion (92) is arranged opposite to the air duct (5) as a whole; or The second antenna subpart (92) comprises a first part (921) and a second part (922), the first part (921) is arranged corresponding to the air duct (5), the second part (922) is arranged corresponding to the inner cavity (4), and the area of the first part (921) is greater than the area of the second part (922).

10. The electronic device (100) according to any one of claims 1 to 9, characterized in that, The distance between the first antenna subpart (91) and the second antenna subpart (92) is less than one eighth of the wavelength corresponding to the center frequency of the working frequency band of the antenna (9).

11. The electronic device (100) according to any one of claims 1 to 10, characterized in that The support (7) is an audio module, and the first antenna subpart (91) is fixed to the sound cavity shell of the audio module. Alternatively, the support (7) is a bracket, and the first antenna subpart (91) is fixed to the insulating part of the bracket.

12. The electronic device (100) according to any one of claims 1 to 11, characterized in that The first antenna subpart (91) is a flexible printed circuit board or a metal part; and / or, the first antenna subpart (91) is assembled and fixed to the support (7), or the first antenna subpart (91) is formed on the support (7).

13. The electronic device (100) according to any one of claims 1 to 12, characterized in that Part of the structure of the support (7) constitutes part of the air duct wall of the air duct (5).

14. The electronic device (100) according to claim 13, characterized by The electronic device (100) further comprises a first sealing member (20) located between the support (7) and the back cover (2) and constituting part of the air duct wall of the air duct (5). The electronic device (100) further comprises a second sealing member (30) located between the support (7) and the middle frame (1) and constituting part of the air duct wall of the air duct (5).

15. The electronic device (100) according to any one of claims 1 to 14, characterized in that, The middle frame (1) comprises a frame (11) connected to the back cover (2) and a middle plate (12) fixed to the inner side of the frame (11), and the middle plate (12) is arranged opposite to the back cover (2), the air duct (5) and the inner cavity (4) are located between the middle plate (12) and the back cover (2), and the outlet of the air duct (5) is arranged on the frame (11) or between the frame (11) and the back cover (2).

16. The electronic device (100) according to claim 15, characterized by The middle plate (12) comprises an air duct bottom wall (121) and an air duct side wall (122), the air duct side wall (122) is fixed to one side of the air duct bottom wall (121) facing the back cover (2), the air duct side wall (122) is connected to the back cover (2), the air duct bottom wall (121), the air duct side wall (122) and the back cover (2) surround the air duct (5), and the air duct bottom wall (121) and the air duct side wall (122) are integrally formed on the middle plate (12).

17. The electronic device (100) according to claim 15 or 16, characterized by The middle plate (12) comprises a metal part arranged opposite to the first antenna subpart (91) and the second antenna subpart (92).

18. The electronic device (100) according to any one of claims 1 to 17, characterized in that The electronic device (100) further comprises a fan (6) installed in the inner cavity (4), and the air outlet of the fan (6) is communicated with the air duct (5).

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