Copper busbar structure, motor controller, and vehicle

Abstract

The present application relates to the technical field of vehicles, and discloses a copper busbar structure, a motor controller, and a vehicle. A plurality of DC pins of two pin units are integrated into a same DC copper busbar, and six groups of DC pins of the two pin units are electrically connected to six half-bridge structures of two three-phase full-bridge driving modules in a one-to-one correspondence mode, so that the two three-phase full-bridge driving modules require only two copper busbar structures. Compared with the related art employing 12 DC terminals, the number of components is reduced, the structure of bus capacitors is simplified, the cost of the motor controller is lowered, and the size of the motor controller is further reduced, thereby reducing the space occupied by the motor controller. Two polarity terminals of the motor controller are electrically connected to positive and negative electrodes of a DC power supply by means of bus capacitors, respectively, simplifying connection; and two motors are electrically connected to the two three-phase full-bridge driving modules in a one-to-one correspondence mode, and the motor controller integrates controllers of the two motors, thereby reducing the space occupied by the motor controller in the vehicle.

Description

Copper bar structure, motor controller and vehicle

[0001] The present application claims priority from the Chinese Utility Model Application No. 202421107147.6 filed on May 20, 2024 and entitled "A copper bar structure, a motor controller and a vehicle". TECHNICAL FIELD

[0002] The present application relates to the technical field of electric machines, and in particular to a copper bar structure, a motor controller and a vehicle. BACKGROUND

[0003] The motor controller of a hybrid electric vehicle is generally a dual-motor controller, which is provided with two control modules. The current control modules include three-phase full-bridge type, half-bridge type and bridge arm type. For a dual-motor controller, two three-phase full-bridge modules can be provided, three half-bridge modules can be provided, or six bridge arm modules can be provided.

[0004] Taking a dual-motor controller with two three-phase full-bridge modules as an example, each three-phase full-bridge module needs to use six DC terminals, and two three-phase full-bridge modules need twelve DC terminals, which increases the size and cost of the motor controller.

[0005] SUMMARY

[0006] The present application aims to provide a copper bar structure, a motor controller and a vehicle, which can simplify the structure of the motor controller, occupy less space and have low cost.

[0007] To achieve this purpose, the present application adopts the following technical solutions:

[0008] The copper bar structure comprises a DC copper bar extending in a first direction, and two pin units, each of which comprises a plurality of DC pins distributed in the first direction and divided into three groups, one end of the DC pin being connected to the DC copper bar.

[0009] The DC copper bar is connected at one end in the first direction to a polarity terminal for connecting a bus capacitor.

[0010] As an implementable manner of the above-mentioned copper bar structure, the two pin units are respectively arranged on opposite sides of the DC copper bar in a second direction.

[0011] Alternatively, the two pin units are arranged on the same side of the DC copper bar in the second direction and are spaced apart in the first direction.

[0012] The first direction and the second direction are perpendicular.

[0013] In order to achieve the above object, the application further provides a motor controller, comprising two three-phase full-bridge driving modules and two copper bar structures according to any one of the above solutions.

[0014] In each of the copper bar structures, two of the pin units are arranged in one-to-one correspondence with two of the three-phase full-bridge driving modules.

[0015] Each of the three-phase full-bridge driving modules comprises three half-bridge structures, and in each of the pin units, three groups of the DC pins are electrically connected to the three half-bridge structures of the three-phase full-bridge driving module.

[0016] As an implementable mode of the above motor controller, the two pin units of any one of the copper bar structures are arranged on opposite sides of the DC copper bar in a second direction, the two three-phase full-bridge driving modules are distributed along the second direction, and the two copper bar structures are located between the two three-phase full-bridge driving modules along the second direction; the first direction and the second direction are perpendicular.

[0017] As an implementable mode of the above motor controller, the two three-phase full-bridge driving modules are symmetrically arranged about a preset plane, the preset plane is perpendicular to the second direction and parallel to the first direction.

[0018] As an implementable mode of the above motor controller, the two DC copper bars are arranged opposite to each other and spaced apart along a third direction, the third direction is perpendicular to the first direction and the second direction.

[0019] And / or,

[0020] The two polarity terminals are located on the same end of the DC copper bar in the first direction, and the two polarity terminals are spaced apart along the second direction.

[0021] As an implementable mode of the above motor controller, the motor controller further comprises a heat dissipation substrate and a heat dissipation housing, both of the three-phase full-bridge driving modules are attached to the same heat dissipation substrate, the heat dissipation substrate is arranged between the three-phase full-bridge driving modules and the heat dissipation housing along a third direction, and the third direction is perpendicular to the first direction and the second direction.

[0022] A cooling channel is formed between the heat dissipation substrate and the heat dissipation housing.

[0023] A support member is arranged in the cooling channel, one end of the support member is connected to or abuts against the heat dissipation housing, and the other end of the support member is connected to or abuts against the heat dissipation substrate.

[0024] As an implementation manner of the motor controller, the support is a strip structure extending along the first direction, and the support is arranged opposite to the copper bar structure along the third direction.

[0025] and / or,

[0026] The cooling channel is provided with two groups of forced convection structures connected to the heat dissipation shell or the heat dissipation substrate, and the two groups of forced convection structures are arranged opposite to the two three-phase full-bridge drive modules along the third direction, respectively.

[0027] As an implementation manner of the motor controller, the motor controller further comprises a packaging frame, and the three-phase full-bridge drive modules are packaged in the packaging frame, and each half-bridge structure is connected to one three-phase terminal for connection with a phase connection terminal of a motor.

[0028] The direct-current copper bar is injection molded on the packaging frame, and / or the three-phase terminal is injection molded on the packaging frame.

[0029] To achieve the above-mentioned purpose, the application further provides a vehicle comprising a direct-current power supply, two motors and the motor controller according to any one of the above-mentioned solutions, the two motors are electrically connected to the two three-phase full-bridge drive modules in a one-to-one correspondence, and the polarity terminals of the two copper bar structures are connected to the positive and negative poles of the direct-current power supply through bus capacitors.

[0030] The application has the following beneficial effects:

[0031] The copper bar structure and the motor controller provided by the application integrate multiple direct-current pins of two pin units in the same direct-current copper bar, and electrically connect six groups of direct-current pins of the two pin units to six half-bridge structures of two three-phase full-bridge drive modules in a one-to-one correspondence, so that the two three-phase full-bridge drive modules only need two copper bar structures, which greatly reduces the number of parts compared with the related art which uses twelve direct-current terminals, and only needs to connect the polarity terminals of the two copper bar structures to the bus capacitors, so as to simplify the structure of the bus capacitors, reduce the cost of the motor controller, and also reduce the size of the motor controller, thereby reducing the occupied space of the motor controller.

[0032] The vehicle provided by the application comprises a direct-current power supply, two motors and the above-mentioned motor controller, the two polarity terminals of the two copper bar structures are electrically connected to the positive and negative poles of the direct-current power supply through bus capacitors, which simplifies the connection between the direct-current power supply and the motor controller; the two motors are electrically connected to the two three-phase full-bridge drive modules in a one-to-one correspondence, and the above-mentioned motor controller integrates the controllers of the two motors, thereby reducing the occupied space of the motor controller on the vehicle. BRIEF DESCRIPTION OF DRAWINGS

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments of the present application will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort on the basis of the contents of the embodiments of the present application and the drawings.

[0034] Fig. 1 is a structural schematic diagram of a motor controller provided by the embodiments of the present application;

[0035] Fig. 2 is a top view of the motor controller provided by the embodiments of the present application;

[0036] Fig. 3 is a sectional view of the motor controller provided by the embodiments of the present application;

[0037] Fig. 4 is a structural schematic diagram of a copper bar structure provided by the embodiments of the present application;

[0038] Fig. 5 is a partial sectional view of the motor controller provided by the embodiments of the present application;

[0039] Fig. 6 is a structural schematic diagram of a phase terminal provided by the embodiments of the present application;

[0040] Fig. 7 is a partial enlarged schematic diagram of A in Fig. 5;

[0041] Fig. 8 is a sectional view of a heat dissipation shell provided by the embodiments of the present application.

[0042] In the drawings: 11, heat dissipation substrate; 111, first mounting hole; 12, packaging frame; 120, window; 121, first insulating mounting part; 122, second insulating mounting part; 13, forced convection structure; 2, heat dissipation shell; 21, cooling medium inlet; 22, cooling medium outlet; 23, slot; 24, support; 3, half-bridge structure; 31, circuit board; 311, ceramic substrate; 312, upper copper plate; 313, lower copper plate; 32, power semiconductor; 33, drive terminal; 4, copper bar structure; 41, direct current copper bar; 42, polarity terminal; 43, direct current pin; 5, three-phase terminal; 51, terminal body; 511, phase electrical connection part; 52, phase pin; 6, cover plate; 100, cooling chamber. DETAILED DESCRIPTION

[0043] The present application will be further described in detail below in conjunction with the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application. In addition, it should be noted that, for the convenience of description, only the parts related to the present application are shown in the drawings, but not all the structures.

[0044] In the description of the present application, unless specifically defined and limited otherwise, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0045] In the present application, unless specifically defined and limited otherwise, the first feature "on" or "under" the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature "on", "above" and "above" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "under", "below" and "below" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0046] In the description of the present embodiment, the terms "up", "down", "right", etc. orientation or position relationship is based on the orientation or position relationship shown in the drawings, only for the convenience of description and simplification of operation, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second" are only used to distinguish in the description, and have no special meaning.

[0047] It should be noted that in the embodiments of the present application, the first direction refers to the X direction shown in FIGS. 1-8, the second direction refers to the Y direction shown in FIGS. 1-8, and the third direction refers to the Z direction shown in FIGS. 1-8. The first direction, the second direction and the third direction are perpendicular to each other.

[0048] As shown in FIGS. 1 and 2, the embodiments of the present application provide a copper bar structure, which includes a direct current copper bar 41 extending in a first direction, and two pin units, each pin unit including a plurality of direct current pins 43 distributed in the first direction and divided into three groups, and a polarity terminal 42 connected at one end of the direct current copper bar 41 in the first direction for connecting a bus capacitor.

[0049] The embodiment of the present application also provides a motor controller, comprising two three-phase full-bridge driving modules and two copper bar structures 4 described above; in each copper bar structure 4, two pin units are arranged in one-to-one correspondence with the two three-phase full-bridge driving modules; each three-phase full-bridge driving module comprises three half-bridge structures 3, and in each pin unit, three groups of DC pins 43 are electrically connected in correspondence with the three half-bridge structures 3 of the three-phase full-bridge driving module.

[0050] The copper bar structure 4 provided by the embodiment of the present application integrates the plurality of DC pins 43 of the two pin units in the same DC copper bar 41, and electrically connects the six groups of DC pins 43 of the two pin units in one-to-one correspondence with the six half-bridge structures 3 of the two three-phase full-bridge driving modules, so that the two three-phase full-bridge driving modules only need the two copper bar structures 4, the number of parts is greatly reduced compared with the twelve DC terminals in the related art, and the polarity terminal 42 of the two copper bar structures 4 only needs to be connected with the bus capacitor, so that the structure of the bus capacitor can be simplified, the cost of the motor controller is reduced, and the size of the motor controller is also reduced, thereby reducing the occupied space of the motor controller.

[0051] It should be noted that in the two copper bar structures 4, one of the two polarity terminals 42 is a positive terminal, and the other is a negative terminal.

[0052] In some embodiments, the copper bar structure 4 is an integrally formed structural member, and the DC copper bar 41, the DC pin 43 and the polarity terminal 42 can be formed by bending, stamping, cutting and the like, so as to integrate the polarity terminal 42 and the DC pin 43 of the two pin units in the same DC copper bar 41, which is simple in structure, low in cost and easy to form.

[0053] In some embodiments, the motor controller further comprises a packaging frame 12, and the packaging frame 12 is divided into two full-bridge packaging spaces distributed along a second direction, and each full-bridge packaging space encapsulates one three-phase full-bridge driving module. In this way, the two three-phase full-bridge driving modules share one packaging frame 12, and the structure of the motor controller is simplified.

[0054] In some embodiments, as shown in FIGS. 1 and 2, each full-bridge packaging space is divided into three windows 120 along a first direction, and each window 120 encapsulates one half-bridge structure 3. The six windows 120 of the two full-bridge packaging spaces are distributed in the form of three rows along the first direction and two columns along the second direction on the packaging frame 12, which not only enables the six half-bridge structures 3 to share one packaging frame 12, but also enables the six half-bridge structures 3 to be independently encapsulated, and the encapsulation effect is good.

[0055] It should be noted that the half-bridge structure 3 is packaged in the corresponding window 120 by pouring insulating pouring glue into the window 120. The insulating pouring glue can be selected from a silicon gel, and other types of insulating pouring glue can also be selected.

[0056] In other embodiments, two windows can also be arranged on the packaging frame 12, each window forms a full-bridge packaging space, and two three-phase full-bridge drive modules are correspondingly packaged in the two windows, that is, the two full-bridge packaging spaces are not divided, and no window is arranged. At this time, the packaging frame 12 is only used to fix the copper bar structure 4. It should be noted that whether the window is arranged or not, the packaging frame 12 has the function of fixing the copper bar structure 4. The connection between the packaging frame 12 and the copper bar structure 4 will be described below.

[0057] In some embodiments, as shown in FIG. 3, the motor controller further comprises a heat dissipation substrate 11, which is arranged on one side of the packaging frame 12 in the third direction, and the two three-phase full-bridge drive modules are attached to the same heat dissipation substrate 11. In this way, the two three-phase full-bridge drive modules share one heat dissipation substrate 11, only one heat dissipation substrate 11 needs to be arranged, the number of parts of the motor controller is reduced, and the integration of the motor controller is improved.

[0058] In some embodiments, each half-bridge structure 3 comprises a circuit board 31, and a plurality of power semiconductors 32 and drive terminals 33 are electrically connected to the circuit board 31. The circuit board 31 is attached to the heat dissipation substrate 11.

[0059] Among them, the power semiconductor 32 is the core heating component of the half-bridge structure 3, and the heat generated by the power semiconductor 32 working is transmitted to the heat dissipation substrate 11 through the circuit board 31, and is dissipated by the heat dissipation substrate 11. The drive terminal 33 is used to connect the external driving circuit, and the driving signal sent by the external driving circuit controls the working state of the power semiconductor 32 through the drive terminal 33, so as to control the corresponding three-phase full-bridge drive module and realize the control of the corresponding motor.

[0060] In some embodiments, in each half-bridge structure 3, the number of power semiconductors 32 and the number of drive terminals 33 are plural. Specifically, each half-bridge structure 3 comprises at least two groups of parallelly arranged power semiconductors 32, and each group of power semiconductors 32 comprises at least two seriesly arranged power semiconductors 32. In this way, not only can the current of the circuit in which each group of power semiconductors 32 is located not exceed the maximum current carrying value allowed when the motor controller works, but also the number of groups of parallelly arranged power semiconductors 32 can be reduced as much as possible while meeting the use requirements of the motor controller.

[0061] The power semiconductors 32 and the drive terminals 33 are respectively electrically connected to corresponding reserved positions on the circuit board 31, and the power semiconductors 32 and the circuit board 31 are connected by lead wires, metal bus bars, etc., so as to form a half-bridge structure 3. The power semiconductors 32 are mainly power semiconductor elements such as IGBT (Insulated Gate Bipolar Transistor), MOSFET (Metal Oxide Semiconductor Field Effect Transistor), diode, etc., which are related technologies in the field and will not be specifically introduced here.

[0062] In some embodiments, as shown in FIG. 3, the circuit board 31 is a DBC (Direct Bonding Copper) substrate, i.e., a copper-clad ceramic substrate. Specifically, the DBC substrate includes a ceramic substrate 311 and circuit layers electrically connected to both sides of the ceramic substrate 311 in the thickness direction, wherein the circuit layers are formed of copper or copper alloy, the circuit layer on the side of the ceramic substrate 311 opposite to the heat dissipation substrate 11 forms an upper copper plate 312, and the circuit layer on the side of the ceramic substrate 311 facing the heat dissipation substrate 11 forms a lower copper plate 313.

[0063] It should be noted that the size of the DBC substrate is determined by the number of power semiconductors 32 to be connected and will not be specifically limited here. The circuit board 31 is not limited to the DBC substrate, but can also use other types of circuit boards 31 such as DPC (Direct Plating Copper) substrates, etc., and the DPC substrate is a direct copper-clad ceramic substrate, which will not be listed one by one here.

[0064] Optionally, the power semiconductors 32 are connected by soldering, or by using metal nanoparticles, or by metal diffusion, or by ultrasonic waves. The drive terminals 33 and the DBC substrate are connected by soldering, or by using metal nanoparticles, or by metal diffusion, or by ultrasonic waves. The power semiconductors 32 and the DBC substrate are connected by soldering, or by using metal nanoparticles, or by metal diffusion, or by ultrasonic waves. It should be noted that the soldering process, the process of using metal nanoparticles, the process of metal diffusion, and the process of ultrasonic waves are related technologies in the field and will not be specifically introduced here.

[0065] In some embodiments, the drive terminals 33 are needle-shaped terminals, which are convenient for the drive terminals 33 to be connected to the DBC substrate, and the needle-shaped terminals have a relatively low cost.

[0066] In some embodiments, as shown in FIGS. 1-4, the DC pins 43 are electrically connected with the DBC substrate to electrically connect the DC pins 43 with the half-bridge structure 3, thereby electrically connecting the bus capacitor with the copper bar structure 4 and the half-bridge structure 3.

[0067] In some embodiments, the DC copper bars 41 are injection molded on the packaging frame 12, which is simple in connection and good in connection firmness.

[0068] In some embodiments, the two DC copper bars 41 are oppositely and spacedly arranged along the third direction. In this way, the space in the third direction can be fully utilized, the space occupation of the two DC copper bars 41 in the second direction is reduced, thereby reducing the length of the motor controller in the second direction; and the two DC copper bars 41 are spacedly arranged, thereby avoiding short circuit caused by contact between the two DC copper bars 41.

[0069] In some embodiments, the two pin units are respectively arranged on opposite sides of the DC copper bars 41 in the second direction, the two three-phase full-bridge drive modules are distributed along the second direction, and the copper bar structure 4 is located between the two three-phase full-bridge drive modules along the second direction. In this way, the two copper bar structures 4 can be arranged while ensuring that each copper bar structure 4 is connected with the two three-phase full-bridge drive modules.

[0070] Specifically, the packaging frame 12 includes a first insulating mounting portion 121 located between the two three-phase full-bridge drive modules along the second direction, and the DC copper bars 41 are injection molded in the first insulating mounting portion 121.

[0071] For example, as shown in FIG. 4, each pin unit includes three groups of DC pins 43, i.e., each copper bar structure 4 has six groups of DC pins 43, and the six groups of DC pins 43 are electrically connected to the six half-bridge structures 3 of the two three-phase full-bridge drive modules.

[0072] In some embodiments, the two three-phase full-bridge drive modules are symmetrically arranged about a preset plane, and the preset plane is perpendicular to the second direction and parallel to the first direction. In this way, the installation requirement can be reduced, the integration of the motor controller can be improved, and the processing cost of the three-phase full-bridge drive module can be reduced.

[0073] In other embodiments, the two pin units can also be arranged on the same side of the DC copper bars 41 in the second direction, the two pin units are spacedly distributed along the first direction, the two three-phase full-bridge drive modules are distributed along the first direction, and the copper bar structure 4 is located on any side of the three-phase full-bridge drive module in the second direction. In this way, the two three-phase full-bridge drive modules can also share the two copper bar structures 4.

[0074] In some embodiments, the two polarity terminals 42 are located at the same end of the DC copper bar 41 in the first direction, and the two polarity terminals 42 are spaced apart in the second direction. By locating the two polarity terminals 42 at the same end of the DC copper bar 41 in the first direction, the two polarity terminals 42 are facilitated to be connected to the bus capacitor; by spacing apart the two polarity terminals 42 in the second direction, sufficient installation space is provided for the connection of the two polarity terminals 42 and the bus capacitor, so as to avoid interference when the two polarity terminals 42 are connected to the bus capacitor.

[0075] In other embodiments, the two polarity terminals 42 can also be respectively located at opposite sides of the packaging frame 12 in the first direction; when the two pin units are located at the same side of the DC copper bar 41 in the second direction, the polarity terminals 42 can also be located at the side of the DC copper bar 41 in the second direction which faces away from the three-phase full-bridge drive module.

[0076] In some embodiments, the polarity terminal 42 is provided with a first through hole for connecting the bus capacitor. In other embodiments, a nut can also be welded or riveted to the polarity terminal 42, and the nut is connected to the bus capacitor. It should be noted that the ways of connecting the bus capacitor by providing a through hole on the polarity terminal 42, welding a nut, or riveting a nut are common connection methods in the art, which will not be introduced in detail here.

[0077] In some embodiments, as shown in FIGS. 1 and 4, the plurality of DC pins 43 electrically connected to any one of the three-phase full-bridge drive modules are spaced apart in the first direction. In this way, short circuit caused by contact between adjacent two DC pins 43 electrically connected to the same three-phase full-bridge drive module can be avoided.

[0078] In some embodiments, as shown in FIGS. 1 and 6, each half-bridge structure 3 is connected to one three-phase terminal 5 for connecting to the phase connection terminal of the motor. Specifically, one group of three-phase terminals 5 is arranged on each side of the packaging frame 12 in the second direction, the two three-phase full-bridge drive modules are located between the two groups of three-phase terminals 5 in the second direction, and the two groups of three-phase terminals 5 are symmetrically arranged about the preset plane. Each group of three-phase terminals 5 includes three three-phase terminals 5 arranged in the first direction, one end of each three-phase terminal 5 corresponds to electrical connection with one half-bridge structure 3, and the other end is used for connecting to the phase connection terminal of the motor.

[0079] When the motor controller is applied to a hybrid vehicle, especially a hybrid vehicle using a distributed motor, the two three-phase full-bridge drive modules are located between the two groups of three-phase terminals 5 in the second direction, and the two groups of three-phase terminals 5 are symmetrically arranged about the preset plane, which facilitates the wiring of the distributed motor. It should be noted that the motor controller is not limited to hybrid vehicles, but can be used in any vehicle with two motors.

[0080] It should be noted that the three three-phase terminals 5 located on the same side of the packaging frame 12 are respectively used for connecting the U-phase terminal, the V-phase terminal and the W-phase terminal of the same motor.

[0081] In some embodiments, the three three-phase terminals 5 are injection molded on the packaging frame 12, the connection is simple, the connection firmness is good, and the insulation between the three three-phase terminals 5 can be achieved.

[0082] Specifically, as shown in FIG. 1 and FIG. 6, the packaging frame 12 further comprises two second insulation mounting portions 122, the two three-phase full-bridge driving modules are located between the two second insulation mounting portions 122 along a second direction, and the three three-phase terminals 5 located on the same side of the packaging frame 12 are injection molded in the same second insulation mounting portion 122, and the three three-phase terminals 5 are separated by the second insulation mounting portion 122 to avoid short circuit caused by contact between adjacent two three-phase terminals 5.

[0083] Specifically, each three-phase terminal 5 comprises a terminal body 51 extending along the second direction, and a plurality of phase pins 52 connected to one end of the terminal body 51, the other end of the terminal body 51 penetrates out of the second insulation mounting portion 122 along the second direction to form a phase electrical connection portion 511, the phase electrical connection portion 511 is used for connecting the phase terminal of the motor, and the phase pin 52 is electrically connected with the DBC substrate.

[0084] Exemplarily, the three-phase terminal 5 is an integrally formed structural member, the terminal body 51 and the phase pin 52 can be formed by bending process or the like, and the structure is simple, the cost is low, and the molding is easy.

[0085] Exemplarily, the phase electrical connection portion 511 is provided with a second through hole for connecting the phase terminal of the motor. In other embodiments, a nut can be welded or riveted on the phase electrical connection portion 511, and the nut is connected with the phase terminal of the motor.

[0086] Optionally, the phase pin 52 and the DBC substrate are connected by using solder, or using metal nanoparticles, or based on metal diffusion, or based on ultrasonic wave.

[0087] Optionally, the packaging frame 12 can be made of insulating materials such as plastic or nylon, which is not limited here.

[0088] Optionally, the DBC substrate and the heat dissipation substrate 11 are connected by using solder, or using metal nanoparticles, or based on metal diffusion, or based on ultrasonic wave.

[0089] In some embodiments, the packaging frame 12 and the heat dissipation substrate 11 are detachably connected, which is convenient for disassembly. Exemplarily, the packaging frame 12 is connected to the heat dissipation substrate 11 by fasteners such as bolts. In other embodiments, the packaging frame 12 can be clamped to the heat dissipation substrate 11.

[0090] In some embodiments, as shown in FIG. 5 and FIG. 7, the side of the heat dissipation substrate 11 opposite to the packaging frame 12 is provided with a heat dissipation shell 2, and a cooling channel is formed between the heat dissipation substrate 11 and the heat dissipation shell 2 for circulating cooling medium to dissipate heat of the two three-phase full-bridge drive modules, so that the two three-phase full-bridge drive modules share one cooling channel, which is simple in structure and low in cost.

[0091] Specifically, the cooling channel includes a cavity 100 formed between the heat dissipation substrate 11 and the heat dissipation shell 2, one end of the cooling channel forms a cooling medium inlet 21, and the other end forms a cooling medium outlet 22. The cooling medium inlet 21 and the cooling medium outlet 22 are both arranged on the heat dissipation shell 2. In other embodiments, the cooling medium inlet 21 and the cooling medium outlet 22 can also be arranged on the heat dissipation substrate 11, or one of the cooling medium inlet 21 and the cooling medium outlet 22 is arranged on the heat dissipation shell 2, and the other is arranged on the heat dissipation substrate 11.

[0092] The power semiconductor 32 generates heat during operation, and the heat is conducted to the heat dissipation substrate 11 through the DBC substrate, and the heat dissipation substrate 11 conducts the heat to the cooling medium in the cooling cavity 100. The cooling medium enters the cooling cavity 100 through the cooling medium inlet 21 and flows out through the cooling medium outlet 22, and the heat on the heat dissipation substrate 11 is taken away by the circulating cooling medium. Exemplarily, the cooling medium is water, ethanol, etc.

[0093] It should be noted that the heat dissipation substrate 11 is a heat conduction structure, and the heat dissipation substrate 11 is a heat conduction structure made of copper, or copper alloy, or aluminum, or aluminum alloy, etc. with good heat conduction performance, which is conducive to the heat dissipation substrate 11 to conduct the heat generated by the power semiconductor 32 during operation to the cooling medium in the cooling cavity 100.

[0094] Exemplarily, the heat dissipation shell 2 is symmetrically arranged about a preset plane. Specifically, the packaging frame 12 located on the opposite sides of the first insulating mounting portion 121 in the second direction is symmetrically arranged about the preset plane.

[0095] Exemplarily, the cooling medium inlet 21 and the cooling medium outlet 22 are respectively arranged on the opposite sides of the cooling cavity 100 in the first direction, so as to prolong the flow path of the cooling medium in the cooling cavity 100 and improve the heat dissipation effect of the power semiconductor 32. In other embodiments, the cooling medium inlet 21 and the cooling medium outlet 22 can also be respectively arranged on the opposite sides of the cooling cavity 100 in the first direction.

[0096] In some embodiments, as shown in FIG. 1, FIG. 7 and FIG. 8, the side of the heat dissipation shell 2 facing the heat dissipation substrate 11 is provided with a slot 23, part of the opening of the slot 23 is arranged opposite one of the three-phase full-bridge drive modules, and the other part of the opening of the slot 23 is arranged opposite the other three-phase full-bridge drive module. The heat dissipation substrate 11 blocks the opening of the slot 23, so that the cooling channel is formed between the heat dissipation shell 2 and the heat dissipation substrate 11. In other embodiments, the slot 23 can also be arranged on the side of the heat dissipation substrate 11 facing the heat dissipation shell 2. In addition, one slot 23 can be arranged on the heat dissipation shell 2 and the heat dissipation substrate 11 respectively, and the openings of the two slots 23 are arranged opposite to each other.

[0097] In some embodiments, as shown in FIG. 2 and FIG. 5, the heat dissipation substrate 11 and the heat dissipation shell 2 are connected by a plurality of circumferentially spaced fasteners. Specifically, a plurality of first mounting holes 111 are arranged on the heat dissipation substrate 11 along the circumferential edge thereof, and a plurality of second mounting holes are arranged on the heat dissipation shell 2. The plurality of first mounting holes 111 and the plurality of second mounting holes are coaxially arranged one by one. One of the first mounting hole 111 and the corresponding second mounting hole is a mounting through hole arranged through the thickness direction of the heat dissipation substrate 11, and the other is a threaded hole. The heat dissipation substrate 11 and the heat dissipation shell 2 are connected by the fastener passing through the mounting through hole and being screwed into the threaded hole. Exemplarily, the first mounting hole 111 is a threaded hole, and the second mounting hole is a mounting through hole.

[0098] In some embodiments, as shown in FIG. 7, the cooling channel is provided with a forced convection structure 13 connected to the heat dissipation substrate 11. The heat dissipation substrate 11 directly transfers part of the heat to the cooling medium, and transfers another part of the heat to the cooling medium through the forced convection structure 13, so that the heat conduction efficiency is high. The forced convection structure 13 can be selected from heat dissipation fins or other types of forced convection structures in related technologies. When the forced convection structure 13 is selected from heat dissipation fins, commonly used pin fins or sheet fins can be used. One end of the forced convection structure 13 can be inserted into the heat dissipation substrate 11 or the heat dissipation shell 2 in an interference fit, and the forced convection structure 13 can also be an integral structure with the heat dissipation substrate 11. The forced convection structure 13 can also be connected to the heat dissipation shell 2. The forced convection structure 13 can also be clamped between the heat dissipation substrate 11 and the heat dissipation shell 2 along the third direction.

[0099] Exemplarily, the heat dissipation fins are provided in two groups, and the two groups of heat dissipation fins are arranged opposite to the two three-phase full-bridge drive modules along the third direction. In this way, the forced convection effect of the heat dissipation fins can be improved.

[0100] In some embodiments, as shown in FIG. 1, FIG. 7 and FIG. 8, the cooling channel is provided with a support 24, one end of the support 24 is connected to the heat dissipation shell 2, and the other end abuts against the heat dissipation substrate 11. The support 24 supports the heat dissipation substrate 11, preventing the heat dissipation substrate 11 from being recessed to the side where the heat dissipation shell 2 is located.

[0101] Exemplarily, the support 24 is protruded from the groove bottom wall of the slot 23, and the support 24 and the heat dissipation shell 2 are integrally formed. In other embodiments, one end of the support 24 can be connected to the heat dissipation substrate 11, and the other end abuts against the groove bottom wall of the slot 23; the support 24 can also be independently provided and clamped between the heat dissipation substrate 11 and the groove bottom wall of the slot 23.

[0102] In some embodiments, the support 24 is a strip structure extending in the first direction, and the support 24 is arranged opposite to the copper bar structure 4 in the thickness direction of the heat dissipation substrate 11. In this way, the support effect of the support 24 on the heat dissipation substrate 11 can be improved, and the heat dissipation fins between the two three-phase full-bridge drive modules can be omitted, thereby reducing the cost. It should be noted that the thickness direction of the heat dissipation substrate 11 is the third direction.

[0103] In some embodiments, the support 24 is spaced apart from the inner wall of the cooling chamber 100 in both the second direction and the first direction. In this way, the support 24 also has the effect of forced convection, thereby improving the heat dissipation effect on the two three-phase full-bridge drive modules.

[0104] In some embodiments, the support 24 is located between the cooling medium inlet 21 and the cooling medium outlet 22 in the first direction, and is arranged opposite to the cooling medium inlet 21 and the cooling medium outlet 22. The cooling medium enters the cooling chamber 100 through the cooling medium inlet 21, is divided by the support 24 to the two sides of the support 24 in the second direction, so as to cool the power semiconductors 32 of the two three-phase full-bridge drive modules, and then converges at the cooling medium outlet 22 and flows out through the cooling medium outlet 22. In this way, when both of the two three-phase full-bridge drive modules are working, the power semiconductors 32 of the two three-phase full-bridge drive modules can be fully cooled. Exemplarily, the support 24, the cooling medium inlet 21 and the cooling medium outlet 22 are symmetrically arranged about a preset plane, so that the cooling effect of the cooling medium on the two three-phase full-bridge drive modules is basically the same.

[0105] In some embodiments, a sealing member such as a sealing ring is provided between the heat dissipation substrate 11 and the heat dissipation shell 2, the sealing member is a closed loop structure, and the sealing member surrounds the outer periphery of the cooling chamber 100 to prevent the cooling medium from leaking through the gap between the heat dissipation substrate 11 and the heat dissipation shell 2.

[0106] In some embodiments, as shown in FIG. 3, a cover plate 6 is arranged on the side of the packaging frame 12 opposite to the heat dissipation substrate 11, for blocking the opening of the full-bridge packaging space to prevent the motor controller from adhering dust during transportation. Specifically, the cover plate 6 is provided with perforations for penetrating the drive terminals 33, so as to facilitate the connection of the drive terminals 33 with the external drive circuit. It should be noted that the cover plate 6 can also be cancelled, and the three-phase full-bridge drive module can be sealed only by the insulating potting glue.

[0107] In some embodiments, the packaging frame 12 and the cover plate 6 are detachably connected, such as by fasteners.

[0108] The assembly process of the above motor controller is as follows:

[0109] (1) The power semiconductors 32 and the drive terminals 33 are joined to the reserved positions on the DBC substrate, and the power semiconductors 32 and the circuit board 31 are connected by lead wires, metal bus bars, etc., to form a half-bridge structure 3;

[0110] (2) The six half-bridge structures 3 are connected to the heat dissipation substrate 11 in the form of three rows along the first direction and two columns along the second direction, to form two three-phase full-bridge drive modules distributed along the second direction;

[0111] (3) The two groups of three-phase terminals 5 are injection molded and packaged on the opposite sides of the packaging frame 12 along the second direction, and the three three-phase terminals 5 of each group are arranged along the first direction;

[0112] (4) The DC copper bars 41 of the two copper bar structures 4 are injection molded and packaged in the packaging frame 12, and the two copper bar structures 4 are located between the two three-phase full-bridge drive modules;

[0113] (5) The packaging frame 12 injection molded with the DC copper bars 41 and the three-phase terminals 5 is connected with the heat dissipation bottom plate, so that the six half-bridge structures 3 are respectively located in the six window openings 120 of the six packaging frames 12;

[0114] (6) The DC pins 43 of the copper bar structure 4 and the phase pins 52 of the three-phase terminal 5 are respectively electrically connected to the corresponding reserved positions on the half-bridge structure 3;

[0115] (7) The six window openings 120 of the packaging frame 12 are potting packaged.

[0116] The embodiment of the present application also provides a vehicle, which mainly refers to a hybrid vehicle, the vehicle comprising a direct current power supply, two motors and the motor controller, wherein the polar terminal 42 of one copper bar structure 4 is electrically connected to the positive pole of the direct current power supply through a bus capacitor, the polar terminal 42 of the other copper bar structure 4 is electrically connected to the negative pole of the direct current power supply through a bus capacitor, and the two motors are electrically connected to the two three-phase full-bridge driving modules one by one.

[0117] Specifically, the three three-phase terminals 5 located on one side of the packaging frame 12 correspond to one motor, the three three-phase terminals 5 located on the other side of the packaging frame 12 correspond to the other motor, the three phase connection terminals of any motor are electrically connected to the corresponding three three-phase terminals 5 one by one, and each three-phase full-bridge driving module is provided with an external driving circuit, and each driving terminal 33 of any three-phase full-bridge driving module is electrically connected to the corresponding external driving circuit.

[0118] It should be noted that the motor controller is not limited to be used in vehicles, for the equipment using an even number of motors greater than 2, the motors can be grouped two by two, and each group of motors is provided with one motor controller as described above, in particular, for the equipment provided with four or more motors, taking the equipment using four motors as an example, the heat dissipation substrates 11 of two motor controllers can be integrally formed, and the packaging frames 12 of the two motor controllers can be integrally formed, at this time, the packaging frames 12 of the two motor controllers can be arranged symmetrically about a plane perpendicular to the first direction.

[0119] In addition, the above is only the preferred embodiment of the present application and the technical principle applied. Those skilled in the art will understand that the present application is not limited to the specific embodiments described herein, and those skilled in the art can make various obvious changes, readjustments and substitutions without departing from the protection scope of the present application. Therefore, although the present application has been described in more detail through the above embodiments, the present application is not limited to the above embodiments, and can include more other equivalent embodiments without departing from the concept of the present application, and the scope of the present application is determined by the scope of the appended claims.

Claims

1. A copper bar structure, wherein, The copper bar structure (4) comprises a DC copper bar (41) extending along a first direction, and two pin units, each of which comprises a plurality of DC pins (43) distributed along the first direction and divided into three groups, one end of the DC pins (43) being connected to the DC copper bar (41); The DC copper bar (41) is connected with a polarity terminal (42) at one end in the first direction, which is used to connect the bus capacitor.

2. The copper bar structure of claim 1, wherein, The two pin units are respectively arranged on opposite sides of the DC copper bar (41) in a second direction; Or, the two pin units are arranged on the same side of the DC copper bar (41) in the second direction and are spaced apart along the first direction; The first direction and the second direction are perpendicular.

3. The motor controller, wherein, The copper bar structure (4) comprises two three-phase full-bridge drive modules, and two copper bar structures (4) as claimed in claim 1 or 2; In each of the copper bar structures (4), the two pin units are arranged one-to-one with the two three-phase full-bridge drive modules; Each of the three-phase full-bridge drive modules comprises three half-bridge structures (3), and in each of the pin units, three groups of DC pins (43) are electrically connected to the three half-bridge structures (3) of the three-phase full-bridge drive module.

4. The motor controller of claim 3, wherein, In any of the copper bar structures (4), the two pin units are respectively arranged on opposite sides of the DC copper bar (41) in a second direction, the two three-phase full-bridge drive modules are distributed along the second direction, and the two copper bar structures (4) are located between the two three-phase full-bridge drive modules along the second direction; the first direction and the second direction are perpendicular.

5. The motor controller of claim 4, wherein, The two DC copper bars (41) are arranged opposite and spaced apart along a third direction, and the third direction is perpendicular to the first direction and the second direction; And / or, The two polarity terminals (42) are located on the same end of the DC copper bar (41) in the first direction, and the two polarity terminals (42) are spaced apart along the second direction.

6. The motor controller of claim 4, wherein, Further comprising a heat dissipation base plate (11) and a heat dissipation shell (2), the two three-phase full-bridge drive modules are connected with the same heat dissipation base plate (11), the heat dissipation base plate (11) is arranged between the three-phase full-bridge drive modules and the heat dissipation shell (2) along a third direction, and the third direction is perpendicular to the first direction and the second direction; A cooling channel is formed between the heat dissipation base plate (11) and the heat dissipation shell (2); A support (24) is arranged in the cooling channel, one end of the support (24) is connected to or abuts against the heat dissipation shell (2), and the other end of the support (24) is connected to or abuts against the heat dissipation base plate (11).

7. The motor controller of claim 6, wherein, The support (24) is a strip structure extending along the first direction, and the support (24) is arranged opposite to the copper bar structure (4) along the third direction; And / or, Two groups of forced convection structures (13) are arranged in the cooling channel, the forced convection structures (13) are connected to the heat dissipation shell (2) or the heat dissipation base plate (11), and the two groups of forced convection structures (13) are arranged opposite to the two three-phase full-bridge drive modules along the third direction.

8. The motor controller of claim 4, wherein, The three-phase full-bridge driving module is packaged in a packaging frame (12), each of the half-bridge structures (3) is connected with one three-phase terminal (5) for connecting with the phase connection terminal of the motor; The DC copper bar (41) is injection molded and packaged on the packaging frame (12), and / or the three-phase terminal (5) is injection molded and packaged on the packaging frame (12).

9. The motor controller of claim 8, wherein, The two three-phase full-bridge driving modules are symmetrically arranged about a preset plane; The packaging frame (12) is provided with a group of three-phase terminals (5) on both sides along the second direction, and the two three-phase full-bridge driving modules are located between the two groups of three-phase terminals (5) along the second direction, and the two groups of three-phase terminals (5) are symmetrically arranged about the preset plane; The preset plane is perpendicular to the second direction and parallel to the first direction.

10. Vehicle, wherein, The application further provides a motor control system comprising a DC power supply, two motors and the motor controller according to any one of claims 3 to 9, the two motors are electrically connected with the two three-phase full-bridge driving modules one by one, one polarity terminal (42) of the copper bar structure (4) is connected to the positive pole of the DC power supply through a bus capacitor, and the other polarity terminal (42) of the copper bar structure (4) is connected to the negative pole of the DC power supply through a bus capacitor.

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