Electronic device comprising support structure and manufacturing method therefor

Abstract

An electronic device according to one embodiment of the present may comprise: a housing including a first surface, a second surface facing the opposite direction of the first surface, and a sidewall surrounding the space between the first surface and the second surface; a display; a window disposed on the first surface of the housing; a support structure disposed in the inner space of the housing; and a waterproof member disposed between the second surface of the housing and the display. The support structure can comprise: a first support structure disposed on at least a portion of the waterproof member along the edge of the display; and a second support structure having at least a portion disposed between the window and the inner side surface of the sidewall. The hardness of the first support structure can be greater than the hardness of the second support structure.

Description

Electronic device including a support structure and method for manufacturing the same

[0001] Various embodiments of the present disclosure relate to electronic devices, for example, to a support structure for a display and an electronic device including the same, and a method for manufacturing the electronic device.

[0002] Thanks to remarkable advancements in information and communication technology and semiconductor technology, the proliferation and use of various electronic devices is rapidly increasing. In particular, recent electronic devices are being developed to enable portable communication.

[0003] Electronic devices can refer to devices that perform specific functions based on the programs installed on them, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, and car navigation systems. For example, these electronic devices can output stored information as audio or video. As electronic device integration increases and ultra-high-speed, high-capacity wireless communications become more widespread, a single electronic device, such as a mobile communication terminal, can now be equipped with a variety of functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions such as mobile banking, and functions such as schedule management and electronic wallets are being integrated into a single electronic device. These electronic devices are becoming smaller and more portable for users.

[0004] To miniaturize electronic devices, the display bezel area was reduced by utilizing molding materials, but there was a problem with the display and window being damaged or the waterproof performance being deteriorated depending on the hardness of the molding materials.

[0005] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0006] An electronic device according to one embodiment of the present disclosure may include a housing including a first surface, a second surface facing in an opposite direction to the first surface, and a side wall surrounding a space between the first surface and the second surface; a display; a window disposed on the first surface of the housing; a support structure disposed in an inner space of the housing; and a waterproof member disposed between the second surface of the housing and the display. The support structure may include a first support structure disposed on at least a portion of the waterproof member along an edge of the display; and a second support structure, at least a portion of which is disposed between the window and an inner surface of the side wall. A hardness of the first support structure may be higher than a hardness of the second support structure.

[0007] A method for manufacturing an electronic device according to one embodiment of the present disclosure may include: combining a display, a mold base, and a first mold cap of the electronic device; applying a first molding liquid to a position corresponding to a display panel of the display through the first mold cap and then semi-curing the first molding liquid; removing the first mold cap, combining a second mold cap, and applying a second molding liquid having a lower hardness than the first molding liquid to a position corresponding to a window of the display through the second mold cap; thermally curing the first molding liquid and the second molding liquid; and cooling the first molding liquid and the second molding liquid, and then disassembling the display to which the first molding liquid and the second molding liquid are applied, the mold base, and the second mold cap.

[0008] An electronic device according to one embodiment of the present disclosure may include a housing including a first surface, a second surface facing in an opposite direction to the first surface, and a sidewall surrounding a space between the first surface and the second surface; a window disposed on the first surface of the housing; a display; and first and second support structures disposed along an edge of the display. The first support structure may include a first portion disposed corresponding to the display and a second portion extending from the first portion and disposed corresponding to the window. The second support structure may include a third portion disposed on one side of the window and a fourth portion extending from the third portion and disposed corresponding to the window.

[0009] The above-described aspects or other aspects, configurations and / or advantages of various embodiments of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.

[0010] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0011] FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0012] FIG. 3 is a perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0013] FIG. 4 is an exploded perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0014] FIG. 5 is an exploded perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0015] FIG. 6 is a drawing illustrating the front of an electronic device (401) according to one embodiment of the present disclosure.

[0016] Figure 7 is an enlarged view according to one embodiment of area A shown in Figure 6.

[0017] Fig. 8 is a cross-sectional view of the electronic device (401) taken along the line A-A' shown in Fig. 7.

[0018] FIG. 9 is a cross-sectional view of the electronic device (401) taken along the B-B' line shown in FIG. 7.

[0019] FIG. 10 is an enlarged view according to one embodiment of area A shown in FIG. 6.

[0020] Fig. 11 is a cross-sectional view taken along line A-A' shown in Fig. 10.

[0021] Fig. 12 is an enlarged view according to one embodiment of area A shown in Fig. 6.

[0022] Fig. 13 is a cross-sectional view taken along line A-A' shown in Fig. 12.

[0023] FIG. 14 is a cross-sectional view taken along line A-A' of FIG. 7 according to one embodiment.

[0024] FIG. 15 is a cross-sectional view taken along line A-A' of FIG. 7 according to one embodiment.

[0025] FIG. 16 is a cross-sectional view taken along line A-A' of FIG. 7 according to one embodiment.

[0026] FIG. 17 is a cross-sectional view taken along line A-A' of FIG. 7 according to one embodiment.

[0027] FIG. 18 is a cross-sectional view taken along line A-A' of FIG. 7 according to one embodiment.

[0028] FIG. 19 is a drawing illustrating a method for manufacturing an electronic device according to one embodiment of the present disclosure.

[0029] FIG. 20 is a drawing of a manufacturing method according to one embodiment in the first molding liquid application step (821) and the second molding liquid application step (831) of FIG. 19.

[0030] FIG. 21 is a drawing of a manufacturing method according to one embodiment in the first molding liquid application step (920) and the second molding liquid application step (930) of FIG. 19.

[0031] FIG. 22 is a perspective view of an electronic device (901) according to one embodiment.

[0032] FIG. 23 is a front view of an electronic device (902) according to one embodiment.

[0033] Fig. 24 is a front view of an electronic device (903) according to one embodiment.

[0034] Figure 25 is an enlarged view of area B or B' shown in Figures 23 and 24.

[0035] FIG. 26 is a drawing of an electronic device (1001) according to one embodiment.

[0036] FIG. 27 is a drawing showing a front view of an electronic device (1001) in an unfolded state according to one embodiment.

[0037] FIG. 28 is a drawing showing an electronic device (1002) according to one embodiment.

[0038] FIG. 29 is a drawing showing an electronic device (1003) according to one embodiment.

[0039] Fig. 30 is an enlarged view of C or C' shown in Figs. 28 and 29.

[0040] FIG. 31 is a drawing showing an electronic device (1101) according to one embodiment.

[0041] Figure 32 is an enlarged cross-sectional view of the DD' section of Figure 31.

[0042] Figure 33 is an enlarged cross-sectional view of the EE' section of Figure 31.

[0043] Throughout the attached drawings, similar reference numbers may be assigned to similar parts, components and / or structures.

[0044] During the molding process to support and secure the display, molding fluid can leak and spread on the sides of the window. Using a high-hardness material can cause the window to break upon impact. Conversely, using a low-hardness material can cause damage to the display panel and the bending section. Furthermore, there is a risk of deterioration and movement of the waterproofing material.

[0045] The problem to be solved in this disclosure is to be able to protect a window from external impact.

[0046] The problem to be solved in the present disclosure is to be able to protect a display panel or band from external impact.

[0047] The problem solved and attempted in the present disclosure is that a window and a display panel or a banding portion can be simultaneously protected from external impact.

[0048] The problem to be solved in the present disclosure is that the bezel area of ​​an electronic device can be reduced.

[0049] The problem to be solved in this disclosure is not limited to the problem mentioned above, and may be determined in various ways without departing from the spirit and scope of this disclosure.

[0050] An electronic device according to various embodiments of the present disclosure can protect the display panel and band portion while simultaneously protecting the window by placing one of the support structures having differential properties in the display area and placing the other support structure on the window side.

[0051] An electronic device according to various embodiments of the present disclosure can prevent deterioration and movement of a waterproof member disposed inside a housing by disposing a high-hardness material among support structures having differential properties in an area corresponding to a display panel.

[0052] A method for manufacturing an electronic device according to various embodiments of the present disclosure can mold a support structure having differential properties, and can prevent impact on the window by applying a low-hardness material even when a high-hardness molding liquid leaks out of the window side.

[0053] Molding fluid modulus Molding thickness Bare cushioning improvement rate (impact test) 20MPa 3 1um + 19.1% 54um + 23.7% 100MPa 3 1um + 4.06% 54um + 8.18% 100um + 9.21%

[0054] [Table 1] can disclose the results of the impact test when using a support structure with differential properties.

[0055] An electronic device according to various embodiments of the present disclosure can reduce a bezel area of ​​a display by utilizing a support structure having differential properties.

[0056] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0057] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0058] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (101) (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0059] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor), or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0060] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0061] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0062] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0063] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0064] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0065] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0066] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (101) (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0067] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0068] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (101) (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0069] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (101) (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0070] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0071] The camera module (180) can capture still images and moving images. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0072] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0073] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0074] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (101) (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (101) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0075] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (101) (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0076] The antenna module (197) can transmit or receive signals or power to or from the outside (e.g., an external electronic device (101)). According to one embodiment, the antenna module may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and the external electronic device (101) through the selected at least one antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0077] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0078] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0079] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (101) (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service by itself, request one or more external electronic devices (101) to perform the function or at least a part of the service. One or more external electronic devices (101) that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0080] The electronic device (101) according to various embodiments of the present disclosure may be a device of various forms. The electronic device (101) may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device (101) according to various embodiments of the present disclosure is not limited to the aforementioned devices.

[0081] The various embodiments of the present disclosure and the terminology used therein are not intended to limit the technical features described in the present disclosure to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In the present disclosure, each of the phrases "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among the phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0082] The term "module" used in various embodiments of the present disclosure may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integrally formed component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0083] Various embodiments of the present disclosure may be implemented as software (e.g., a program) including one or more instructions stored in a storage medium (e.g., an internal memory or an external memory) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0084] According to one embodiment, the method according to various embodiments of the present disclosure may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0085] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0086] In the detailed description below, the longitudinal direction of the electronic device (101) may be defined as the 'Y-axis direction', the width direction as the 'X-axis direction', and / or the height direction (thickness direction) as the 'Z-axis direction'. In the detailed description below, references to the longitudinal direction, the width direction, and / or the height direction (or thickness direction) may indicate the longitudinal direction, the width direction, and / or the height direction (or thickness direction) of the electronic device.

[0087] In some embodiments, with respect to the direction that a component is facing, 'negative / positive (- / +)' may be mentioned together with the rectangular coordinate system illustrated in the drawing. In one embodiment, when a component is facing 'a certain direction', it may be understood that not only does a component face 'the same direction as the certain direction', but also a component faces 'a direction parallel to the certain direction'. In describing the direction, if 'negative / positive (- / +)' is not described, it may be interpreted to include both the + direction and the - direction unless otherwise defined.

[0088] Hereinafter, in the description of the electronic device (101) described below, the 'first direction' may mean the X-axis direction or a direction parallel to the X-axis. The above description is based on the rectangular coordinate system described in the drawing for the sake of brevity of description, and it is to be noted that the description of such directions or components does not limit the various embodiments of the present disclosure.

[0089] FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0090] FIG. 3 is a perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0091] The embodiments of FIGS. 2 to 3 can be combined with the embodiment of FIG. 1 or the embodiments of FIGS. 4 to 21.

[0092] Referring to FIGS. 2 and 3, an electronic device (101) according to one embodiment (e.g., the electronic device (101) of FIG. 1) may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In one embodiment (not shown), the housing (210) may also refer to a structure that forms a portion of the first side (210A) of FIG. 2, the second side (210B) of FIG. 3, and the side surface (210C). According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The back plate (211) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side structure (or “side bezel structure”) (218) that is joined to the front plate (202) and the back plate (211) and comprises a metal and / or a polymer. In one embodiment, the back plate (211) and the side structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0093] Although not shown, the front plate (202) may include a seamlessly extending region(s) that curves toward the rear plate (211) at least along a portion of an edge. In one embodiment, the front plate (202) (or the rear plate (211)) may include only one of the curved extending regions toward the rear plate (211) (or the front plate (202)) at one edge of the first surface (210A). In some embodiments, the front plate (202) or the rear plate (211) may be substantially flat. For example, the curved extending region may not be included. When the curved extending region is included, the thickness of the electronic device (101) in the portion that includes the curved extending region may be smaller than that of other portions.

[0094] According to one embodiment, the electronic device (101) may include at least one of a display (220), an audio module (203, 207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (217), a light emitting element (206), and a connector hole (208, 209). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., the key input device (217) or the light emitting element (206)) or may additionally include other components.

[0095] The display (220) may be visually exposed, for example, through a significant portion of the front plate (202). In one embodiment, at least a portion of the display (220) may be visually exposed through the front plate (202) forming the first surface (210A) or through a portion of a side surface (210C). In one embodiment, the edge of the display (220) may be formed to be substantially the same as the adjacent outer shape of the front plate (202). In one embodiment (not shown), the gap between the outer edge of the display (220) and the outer edge of the front plate (202) may be formed to be substantially the same in order to expand the area over which the display (220) is visually exposed.

[0096] In one embodiment (not shown), a recess or opening may be formed in a portion of a screen display area of ​​the display (220), and at least one of an audio module (214), a sensor module (204), a camera module (205), and a light-emitting element (206) may be included that are aligned with the recess or opening. In one embodiment (not shown), at least one of an audio module (214), a sensor module (204), a camera module (205), a fingerprint sensor (not shown), and a light-emitting element (206) may be included on a back surface of the screen display area of ​​the display (220). In one embodiment (not shown), the display (220) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen. In one embodiment, at least a portion of the sensor modules (204, 219) and / or at least a portion of the key input device (217) may be disposed in the first areas (210D) and / or the second areas (210E).

[0097] The audio module (203, 207, 214) may include a microphone hole (203) and a speaker hole (207, 214). The microphone hole (203) may have a microphone disposed therein for acquiring external sound, and in one embodiment, multiple microphones may be disposed so as to detect the direction of the sound. The speaker hole (207, 214) may include an external speaker hole (207) and a receiver hole (214) for calls. In one embodiment, the speaker hole (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (207, 214) (e.g., a piezo speaker).

[0098] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) and / or a fourth sensor module (e.g., a fingerprint sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on not only the first surface (210A) (e.g., the display (220)) of the housing (210), but also the second surface (210B) or the side surface (210C). The electronic device (101) may further include, for example, at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0099] The camera modules (205, 212, 213) may include a first camera device (205) disposed on a first surface (210A) of the electronic device (101), a second camera device (212) disposed on a second surface (210B), and / or a flash (213). The camera devices (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one surface of the electronic device (101). In one embodiment, the flash (213) may emit infrared light, and infrared light emitted by the flash (213) and reflected by a subject may be received via the third sensor module (219). The electronic device (101) or the processor of the electronic device (101) can detect depth information of the subject based on the point in time when infrared rays are received from the third sensor module (219).

[0100] The key input device (217) may be disposed on a side surface (210C) of the housing (210). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (220). In one embodiment, the key input device may include a sensor module disposed on a second surface (210B) of the housing (210).

[0101] The light-emitting element (206) may be disposed, for example, on the first surface (210A) of the housing (210). The light-emitting element (206) may provide, for example, status information of the electronic device (101) in the form of light. In one embodiment, the light-emitting element (206) may provide a light source that is linked to the operation of, for example, the camera module (205). The light-emitting element (206) may include, for example, an LED, an IR LED, and a xenon lamp.

[0102] The connector holes (208, 209) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (e.g., an earphone jack) (209) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0103] FIG. 4 is an exploded perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0104] FIG. 5 is an exploded perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0105] The embodiments of FIGS. 4 and 5 can be combined with the embodiments of FIGS. 1 to 3, or the embodiments of FIGS. 6 to 21.

[0106] Referring to FIGS. 4 and 5 , the electronic device (101) (e.g., the electronic device (101) of FIG. 1 or 2 ) may include a side structure (310), a first support member (311) (e.g., a bracket), a front plate (320) (e.g., the front plate (202) of FIG. 1 ), a display (330) (e.g., the display module (160) of FIG. 1 , the display (220) of FIG. 2 ), at least one printed circuit board (or board assembly) (340a, 340b), a battery (350), a second support member (360) (e.g., a rear case), an antenna, a camera assembly (307), and a rear plate (380) (e.g., the rear plate (211) of FIG. 2 ). When including a plurality of printed circuit boards (340a, 340b), the electronic device (101) can electrically connect different printed circuit boards by including at least one flexible printed circuit board (340c). For example, the printed circuit boards (340a, 340b) can include a first circuit board (340a) positioned above the battery (350) and a second circuit board (340b) positioned below, and the flexible printed circuit board (340c) can electrically connect the first circuit board (340a) and the second circuit board (340b).

[0107] According to one embodiment, the electronic device (101) may omit at least one of the components (e.g., the first support member (311) or the second support member (360)) or may additionally include other components. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 1 or FIG. 2, and any redundant description will be omitted below.

[0108] The first support member (311) may be provided in a flat shape at least in part. In one embodiment, the first support member (311) may be disposed inside the electronic device (101) and connected to the side structure (310), or may be formed integrally with the side structure (310). The first support member (311) may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. When the first support member (311) is formed at least partially of a metallic material, the side structure (310) or a portion of the first support member (311) may function as an antenna. The first support member (311) may have a display (330) coupled to one surface and a printed circuit board (340a, 340b) coupled to the other surface. A processor, a memory, and / or an interface may be mounted on the printed circuit board (340a, 340b). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0109] The first support member (311) may be referred to as a “support member.” The housing (301) may include the support member (311). The support member (311) may face the front plate (320). The support member (311) may face the rear plate (380). The support member (311) may be coupled to the front plate (320) or the rear plate (380). The support member (311) may be made of reinforced plastic or metal.

[0110] The support member (311) may include a support body (3111). The support body (3111) may have a flat shape. The support body (3111) may provide a space in which a battery (350) or a printed circuit board (340a, 340b) is placed.

[0111] The support member (311) may include an end portion (3112). The end portion (3112) may be integral with the support body (3111). The end portion (3112) may be formed along the perimeter of the support body (3111). The end portion (3112) may extend along the perimeter of the side structure (310). The end portion (3112) may be integral with the side structure (310).

[0112] The front plate (320) may be coupled to the support member (311). The front plate (320) may be referred to as a “cover” or a “rear cover.”

[0113] The rear plate (380) may be referred to as a “cover” or a “rear cover.” The cover (380) may face the support member (311). The cover (380) may be made of reinforced plastic or reinforced glass.

[0114] The cover (380) may include a cover body (381). The cover body (381) may be flat. The cover body (381) may face the support body (3111).

[0115] The cover (380) may include a cover edge (382). The cover edge (382) may be integral with the cover body (381). The cover edge (382) may extend along the direction in which the end portion (3112) of the support member (311) extends. The cover edge (382) may face the end portion (3112) of the support member (311). The cover edge (382) may be coupled with the end portion (3112) of the support member (311). The cover edge (382) may be referred to as a “joint portion.”

[0116] In one embodiment, the first support member (311) and the side structure (310) may be combined to be referred to as a front case or housing (301). In one embodiment, the housing (301) may be generally understood as a structure for accommodating, protecting, or arranging a printed circuit board (340a, 340b) or a battery (350). In one embodiment, the housing (301) may be understood as including a structure that can be visually or tactilely perceived by a user in the appearance of the electronic device (101), for example, a side structure (310), a front plate (320), and / or a rear plate (380). The housing (301) may include the side structure (310), the first support member (311), the front plate (320), and the rear plate (380). In one embodiment, the 'front or rear surface of the housing (301)' may refer to the first surface (210A) of FIG. 1 or the second surface (210B) of FIG. 2. In one embodiment, the first support member (311) is disposed between the front plate (320) (e.g., the first surface (210A) of FIG. 1) and the rear plate (380) (e.g., the second surface (210B) of FIG. 2), and may function as a structure for arranging electrical / electronic components such as printed circuit boards (340a, 340b) or camera assemblies (307).

[0117] The memory may include, for example, volatile memory or non-volatile memory.

[0118] The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0119] The second support member (360) may include, for example, an upper support member (360a) and a lower support member (360b). In one embodiment, the upper support member (360a) may be arranged to surround a printed circuit board (340a, 340b) (e.g., the first circuit board (340a)) together with a portion of the first support member (311). For example, the upper support member (360a) of the second support member (360) may be arranged to face the first support member (311) with the first circuit board (340a) interposed therebetween. In one embodiment, the lower support member (360b) of the second support member (360) may be arranged to face the first support member (311) with the second circuit board (340b) interposed therebetween. Circuit devices implemented in the form of integrated circuit chips (e.g., processors, communication modules, or memories) or various electrical / electronic components may be placed on printed circuit boards (340a, 340b), and according to an embodiment, the printed circuit boards (340a, 340b) may be provided with an electromagnetic shielding environment from the second support member (360). In one embodiment, the lower support member (360b) may be utilized as a structure on which electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be placed. In one embodiment, electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be placed on an additional printed circuit board (not shown). For example, the lower support member (360b) may be placed to surround the additional printed circuit board together with another part of the first support member (311). A speaker module or interface arranged on an additional printed circuit board or lower support member (360b) not shown may be arranged corresponding to the audio module (207) or connector hole (208, 309) of FIG. 1.

[0120] The battery (350) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially on the same plane as, for example, the printed circuit boards (340a, 340b). The battery (350) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0121] Although not shown, the antenna may include a conductive pattern implemented on the surface of the second support member (360), for example, through a laser direct structuring process. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the thin film-type antenna may be disposed between the back plate (380) and the battery (350). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, another antenna structure may be formed by the side structure (310) and / or a portion or combination of the first support member (311).

[0122] In one embodiment, the camera assembly (307) may include at least one camera module. Within the electronic device (101), the camera assembly (307) (or at least one camera module) may receive at least a portion of light incident through an optical hole or camera window (312, 313, 319). In one embodiment, the camera assembly (307) may be disposed on the first support member (311) at a location adjacent to the printed circuit board (340a, 340b). In one embodiment, the camera module(s) of the camera assembly (307) may be generally aligned with one of the camera windows (312, 313, 319) and may be at least partially wrapped around the second support member (360) (e.g., the upper support member (360a)).

[0123] FIG. 6 is a diagram illustrating a front view of an electronic device (401) according to one embodiment of the present disclosure. FIG. 7 is an enlarged view of an embodiment of area A illustrated in FIG. 6. FIG. 8 is a cross-sectional view of the electronic device (401) taken along the line A-A' illustrated in FIG. 7. FIG. 9 is a cross-sectional view of the electronic device (401) taken along the line B-B' illustrated in FIG. 7.

[0124] The electronic device (401) of FIGS. 6 to 9 may be substantially the same as the electronic device (101) of FIGS. 1 to 5. The components described with reference to FIGS. 6 to 9 may be substantially the same in part or in whole as the components described with reference to FIGS. 1 to 5. The components described with reference to FIGS. 6 to 9 may be substantially the same in part or in whole as the components described with reference to FIGS. 10 to 21.

[0125] An electronic device (401) may include a housing (410). The housing (410) may include a window (430) and a back plate (411). The window (430) may face a first direction. The back plate (411) may face a second direction. The housing (410) may include a first surface (410A), a second surface (410B) facing in an opposite direction to the first surface, and a third surface (410C) surrounding a space between the first surface (410A) and the second surface (410B). The first surface (410A) may face a first direction (+Z direction). The second surface (410B) may face a second direction (-Z direction). The third surface (410C) may face a third direction perpendicular to the +Z direction. The housing (410) may include a side wall (412) surrounding a space between the back plate (411) and the window (430). The side wall (412) may face a third direction.

[0126] According to one embodiment, the back plate (411) may be substantially identical to the back plate of FIGS. 2 to 5 (e.g., the back plate (211) illustrated in FIG. 3).

[0127] In one embodiment, the back plate (411) may be integrally coupled with the side wall (412). In one embodiment, the back plate (411) may be detachably coupled with the side wall (412). The back plate (411) may include a second surface (410B) facing the inside of the housing (410). The side wall (412) of the housing (410) may be disposed spaced apart from the display (420). The side wall (412) of the housing may be disposed to be in contact with the display (420).

[0128] According to one embodiment, the housing (410) may include a detachable window (430). The window (430) may be detachably coupled to the housing (410). The window (430) may include a transparent material. The window (430) may be positioned above the display (420). The window (430) may cover the display (420). The window (430) may be spaced apart from or in contact with the side wall (412). The window (430) may be coupled to the display (420) and detachably from the housing (410). The screen output from the display (420) may pass through the window (430) and be exposed to the outside of the electronic device (e.g., the electronic device (101) of FIGS. 2 to 4 ). The window (430) may be substantially identical to the front plate (202) illustrated in FIG. 2 or the front plate (320) illustrated in FIGS. 4 and 5.

[0129] According to one embodiment, the electronic device (401) may include a display (420). The display (420) may be assembled with some components of the electronic device (401) (e.g., the window (430) of FIG. 6 and the circuit board (423) of FIG. 8) to form a display module. The display (420) may output a screen displayed on the outside of the electronic device (e.g., the electronic device (101) of FIGS. 2 to 5). The display (420) may be substantially the same as the display (330) illustrated in FIG. 4.

[0130] According to one embodiment, the display (420) may include a panel (421) and a bending portion (422). The panel (421) may be rectangular or circular. The bending portion (422) may be bent and extended from the panel (421). The bending portion (422) may include a flexible material. The bending portion (422) may include chips on plastic (COP).

[0131] According to one embodiment, the display (420) may be connected to a circuit board (423). The circuit board (423) may be electrically connected to the display (420). The circuit board (423) may include at least a portion of a flexible material. The circuit board (423) may be a flexible circuit board.

[0132] Referring to FIGS. 8 and 9, the electronic device (401) may include a waterproof member (450) (e.g., waterproof tape). The waterproof member (450) may be disposed in the internal space of the housing (410). The waterproof member (450) may be disposed between the rear plate (411) and the display (420). The waterproof member (450) may include an adhesive material. The waterproof member (450) may prevent external substances (e.g., water) from entering the internal space of the electronic device (401).

[0133] According to one embodiment, the electronic device (401) may include a support structure (440). The support structure (440) may be positioned at and extend along an edge (460) of the display (420). The support structure (440) may support or fix the display (420). The support structure (440) may fix the panel (421) and the bending portion (422) of the display (420). A portion of the support structure (440) may fill the space formed by the bending portion (422). A portion of the support structure (440) may be positioned at a side (431) of the window (430). The support structure (440) may support or fix the window (430). The support structure (440) may be referred to as a “fixing member,” a “buffering member,” an “injection molded product,” etc. The support structure (440) can be manufactured by molding a resin material. The support structure (440) can fix or support the circuit board (423). The support structure (440) can be made of an adhesive material. The support structure (440) can reduce the bezel area (not shown) of the electronic device (401).

[0134] According to one embodiment, the support structure (440) may include a first support structure (441) and a second support structure (442). The support structure (440) may be disposed in the interior space of the housing (410). A portion of the support structure (440) may be disposed between the display (420) and the rear plate (411). A portion of the support structure (440) may be disposed between the waterproof member (450) and the display (420). A portion of the support structure (440) may be disposed between the side wall (412) of the housing (410) and the side surface (431) of the window (430). The support structure (440) may support or fix the display (420). The support structure (440) may support or fix the window (430). The support structure (440) can support or fix the panel (421) and the bending portion (422) of the display (420). The support structure (440) can fix or support the circuit board (423). The support structure (440) can support or fix the window (430) by transmitting a support force through the display (420). The support structure (440) can prevent damage to or movement of the display (420) and the window (430) from external impact. The hardness of the first support structure (421) and the physical properties of the second support structure (422) may be different. The hardness of the first support structure (441) may be higher than the hardness of the second support structure (442). The support structure (440) including the first support structure (441) and the second support structure (442) having different hardnesses can simultaneously prevent impact on the window and damage or movement of the display.

[0135] In this disclosure, hardness is defined as shore hardness for convenience, but the expression of high and low hardness or high and low hardness is not necessarily limited to shore hardness.

[0136] According to one embodiment, the first support structure (441) may include a first portion (4411) and a second portion (4412). The first support structure (441) may be disposed along an edge (460) of the display (420). The first support structure (441) may be disposed in an internal space of the housing (410). A portion of the first support structure (441) may be disposed between a rear plate (411) of the housing and the display (420). A portion of the first support structure (441) may be disposed between a window (430) and the rear plate (411) of the housing (410). The first support structure (441) may be disposed between a waterproof member (450) and the display (420). The first support structure (441) may be formed to surround a portion of a panel (421) of the display (420) or a bending portion (422). The first support structure (441) can completely fill the space formed by the bending portion (422). The first support structure (441) can fix or support the display (420). The first support structure (441) can fix or support the panel (421) or the bending portion (422) of the display (420). The first support structure (441) can prevent damage or movement of the panel (421) and the bending portion (422) from external impact. The first support structure (441) can support or fix the circuit board (423). The first support structure (441) can prevent damage or movement of the circuit board (423) from external impact. The first support structure (441) can fix or support the window (430). The first support structure (441) can support or fix the waterproof member (450). The first support structure (441) can fix or support the waterproofing member to prevent deterioration. The first support structure (441) may be referred to as a "fixing member," a "buffering member," an "injection molded product," etc. The first support structure (441) may be manufactured by molding a resin material. The first support structure (441) may include an adhesive material.The hardness of the first support structure (441) may be higher than the hardness of the second support structure (442). The first support structure (441) may be a high-hardness material. The hardness of the first support structure (441) may be 70 (Shore D) or more and 85 (Shore D) or less.

[0137] According to one embodiment, the first part (4411) may be disposed on one side of the display (420) along the edge (460) of the display (420). The first part (4411) may support or fix the display (420). The first part (4411) may support or fix the panel (421) or the bending part (422) of the display (420). The first part (4411) may support or fix the panel (421) or the bending part (422) to prevent damage or movement of the panel (421) and the bending part (422) from external impact. The first part (4411) may support or fix the circuit board (423). The first part (4411) may be disposed below or at a corresponding position of the window (430). A portion of the first portion (4411) may be positioned on one side of the window (430). The first portion (4411) may support or fix the window (430). The first portion (4411) may be positioned between the waterproof member (450) and the window (430). The first portion (4411) may fix or support the waterproof member (450) and prevent deterioration and movement of the waterproof member (450).

[0138] According to one embodiment, the second portion (4412) may be disposed between the display (420) and the rear plate (411) of the housing (410) along the edge (460) of the display (420). The second portion (4412) may fix or support the panel (421) or the circuit board (423) of the display (420). The second portion (4412) may prevent damage or movement of the panel (421) and the circuit board (423) from external impact. The second portion (4412) may be disposed between the waterproof member (450) and the display (420) to fix or support the waterproof member (450) and prevent deterioration and movement of the waterproof member (450). The second portion (4412) may be formed to extend from the first portion (4411).

[0139] In one embodiment, the second support structure (442) may include a third portion (4421) and a fourth portion (4422). In the present disclosure, the third portion may be referred to as “at least a portion of the second support structure (442) disposed between the side wall (412) of the housing (410) and the side surface (431) of the window (430)” or substantially the same therefor. In the present disclosure, the fourth portion (4422) may be referred to as “at least a portion of the second support structure (442) disposed between the window (430) and the back plate (411) of the housing (410)” or substantially the same therefor. The second support structure (442) may be disposed along an edge (460) of the display (420). The second support structure (442) may be disposed in an interior space of the housing (410). A portion of the second support structure (442) may be disposed between the window (430) and the rear plate (411) of the housing (410). A portion of the second support structure (442) may be disposed between the window (430) and the side wall (412) of the housing (410). The second support structure (442) may be disposed to contact or face the outer surface (4413) of the first support structure (441) along the edge (460) of the display (420). The second support structure (442) may support or fix the display (420). The second support structure (442) may fix or support the window (430). The second support structure (442) may prevent damage and movement of the window (430) from external impact. The second support structure (442) may be referred to as a “fixing member,” a “buffering member,” an “injection molded product,” etc. The second support structure (442) may be manufactured by molding a resin material. The second support structure (442) may include an adhesive material. The hardness of the second support structure (442) may be lower than the hardness of the first support structure (441). The second support structure (442) may be a low-hardness material.The hardness of the second support structure (442) may be 40 (Shore D) or more and 65 (Shore D) or less.

[0140] According to one embodiment, the third portion (4421) may be positioned along the edge (460) of the display (420). The third portion (4421) may be positioned on one side of the window (430). The third portion (4421) may be positioned between the side surface (431) of the window (430) and the side wall (412) of the housing (410). The third portion (4421) may be spaced apart from, face, or contact the inner surface (4121) of the side wall (412). The third portion (4421) may fix or support the window (430). The third portion (4421) may prevent damage and movement of the window (430) from external impact. The third portion (4421) may be formed to extend from the fourth portion (4422).

[0141] According to one embodiment, the fourth portion (4422) may be positioned along the edge (460) of the display (420). The fourth portion (4422) may be positioned in a space between the window (430) and the rear plate (411) of the housing (410). The fourth portion (4422) may be in contact with or face the outer surface (4413) of the first support structure (441). The fourth portion (4422) may extend to face the outer surface (4413) of the first support structure (441). The fourth portion (4422) may be in contact with the waterproof member (450). The fourth portion (4422) may fix or support the window (430) or the display (420). The fourth portion (4422) may prevent damage and movement of the window (430) and the display (420) from external impact. The fourth part (4422) can support or fix the first support structure (441). The fourth part (4422) can prevent damage and movement of the first support structure (441) from external impact.

[0142] Fig. 10 is an enlarged view of an embodiment of area A illustrated in Fig. 6. Fig. 11 is a cross-sectional view taken along line A-A' illustrated in Fig. 10. The electronic device (501) may be substantially identical to the electronic device (101) illustrated in Figs. 1 to 5 or the electronic device (401) illustrated in Figs. 6 to 9.

[0143] The components described with reference to FIGS. 10 and 11 may be substantially the same as some or all of the components described with reference to FIGS. 1 to 9. The components described with reference to FIGS. 10 and 11 may be substantially the same as some or all of the components described with reference to FIGS. 12 to 21.

[0144] Hereinafter, the configurations of the electronic device (501) not described may be substantially the same as the configurations of the electronic device (101) illustrated in FIGS. 1 to 5 and the electronic device (401) illustrated in FIGS. 6 to 9.

[0145] According to one embodiment, the electronic device (501) may include a support structure (540). The support structure (540) may be positioned along an edge of the display (e.g., the display edge (460) illustrated in FIG. 6). A portion of the support structure (540) may be positioned on a side of the window. The support structure (540) may be referred to as a “fixing member,” a “buffering member,” an “injection molded product,” etc. The support structure (540) may be manufactured by molding a resin material. The support structure (540) may support or fix the display (520). The support structure (540) may support or fix the window (530). The support structure (540) may fix or support the circuit board (523). The support structure (540) may be made of an adhesive material. The support structure (540) can reduce the bezel area (not shown) of the electronic device (501).

[0146] According to one embodiment, the support structure (540) may include a first support structure (541) and a second support structure (542). The support structure (540) may be disposed in the interior space of the housing (510). A portion of the support structure (540) may be disposed between the display (520) and the rear plate (511) of the housing (510). A portion of the support structure (540) may be disposed between the waterproof member (550) and the display (520). A portion of the support structure (540) may be disposed between the side wall (512) of the housing (510) and the side surface (531) of the window (530). The support structure (540) may support or fix the display (520). The support structure (540) may support or fix the window (530). The support structure (540) can support or fix the panel (521) and the bending portion (522) of the display (520). The support structure (540) can completely fill the space formed by the bending portion (522). The support structure (540) can support or fix the window (530) by transmitting a supporting force through the display (520). The support structure (540) can prevent damage and movement of the display (520) and the window (530) from external impact. The hardness of the first support structure (541) and the physical properties of the second support structure (542) may be different. The hardness of the first support structure (541) may be higher than the hardness of the second support structure (542).

[0147] According to one embodiment, the first support structure (541) and the second support structure (542) can be joined through a recess (5414) and a protrusion (5423).

[0148] According to one embodiment, the first support structure (541) may include a first portion (5411) and a second portion (5412). The first support structure (541) may be disposed along an edge of the display (e.g., an edge (460) of the display illustrated in FIG. 6). The first support structure (541) may be disposed in an interior space of the housing (510). A portion of the first support structure (541) may be disposed between the back plate (511) and the display (520). A portion of the first support structure (541) may be disposed between the window (530) and the back plate (511) of the housing (510). The first support structure (541) may be disposed between the waterproof member (550) and the display (520). The first support structure (541) may be formed to surround a portion of the panel (521) of the display (520) or the bending portion (522) along the edge of the display (e.g., the edge (460) of the display illustrated in FIG. 6). The first support structure (541) may fix or support the display (520). The first support structure (541) may fix or support the panel (521) or the bending portion (522) of the display (520). The first support structure (541) may completely fill the space formed by the bending portion (522). The first support structure (541) may prevent damage or movement of the panel (521) and the bending portion (522) from external impact. The first support structure (541) may support or fix the circuit board (523). The first support structure (541) can prevent damage or movement of the circuit board (523) due to external impact. The first support structure (541) can fix or support the window (530). The first support structure (541) can support or fix the waterproof member (550). The first support structure (541) can prevent deterioration and movement of the waterproof member. A portion of the outer surface (5413) of the first support structure (541) can form a recess (5414) in a direction away from the side wall (512) of the housing (510).The first support structure (541) may be referred to as a “fixing member,” a “buffering member,” an “injection molded product,” etc. The first support structure (541) may be manufactured by molding a resin material. The first support structure (541) may include an adhesive material. The hardness of the first support structure (541) may be higher than the hardness of the second support structure (542). The first support structure (541) may be a high-hardness material. The hardness of the first support structure (541) may be 70 (Shore D) or more and 85 (Shore D) or less.

[0149] According to one embodiment, the first part (5411) may be disposed on one side of the display (520) along an edge of the display (520) (e.g., the edge (460) of the display (420) of FIG. 6). The first part (5411) may support or fix the display (520). The first part (5411) may support or fix the panel (521) or the bending part (522) of the display (520). The first part (5411) may prevent damage or movement of the panel (521) and the bending part (522) from external impact. The first part (5411) may support or fix the circuit board (523). The first part (5411) may be disposed below or at a corresponding position of the window (530). The first part (5411) may support or fix the window (530). The first part (5411) may be disposed on the waterproof member (550). The first part (5411) may be disposed between the waterproof member (550) and the window (530) to fix or support the waterproof member (550) and prevent deterioration and movement of the waterproof member (550). The first part (5411) may form an outer surface (5413) toward the side wall (512) of the housing (510). A portion of the outer surface (5413) of the first part (5411) may form a recess (5414) in a direction away from the side wall (512) of the housing. The recess (5414) of the first part (5411) may increase a bonding force with the second support structure (542).

[0150] According to one embodiment, the second portion (5412) may be disposed between the display (520) and the rear plate (511) of the housing (510) along an edge of the display (520) (e.g., the edge (460) of the display (420) of FIG. 6). The second portion (5412) may fix or support the panel (521) or the circuit board (523) of the display (520). The second portion (5412) may completely fill the space formed by the bending portion (522). The second portion (5412) may prevent damage to or movement of the panel (521) and the circuit board (523) from external impact. The second portion (5412) may be disposed between the waterproof member (550) and the display (520) to fix or support the waterproof member (550) and prevent deterioration and movement of the waterproof member (550). The second part (5412) can be formed by extending from the first part (5411).

[0151] In one embodiment, the second support structure (542) may include a third portion (5421) and a fourth portion (5422). In the present disclosure, the third portion may be referred to as “at least a portion of the second support structure (542) disposed between the side wall (512) of the housing (510) and the side surface (531) of the window (530)” or substantially the same therefor. In the present disclosure, the fourth portion (5422) may be referred to as “at least a portion of the second support structure (542) disposed between the window (530) and the back plate (511) of the housing (510)” or substantially the same therefor. The second support structure (542) may be disposed along an edge of the display (520) (e.g., the edge (460) of the display in FIG. 6). The second support structure (542) may be disposed in an interior space of the housing (510). A portion of the second support structure (542) may be disposed between the window (530) and the back plate (511) of the housing (510). A portion of the second support structure (542) may be disposed between the side surface (531) of the window (530) and the side wall (512) of the housing (510). The second support structure (542) may be disposed to contact or face the outer surface (5413) of the first support structure (541) along the edge of the display (e.g., the edge (460) of the display as shown in FIG. 6). The second support structure (542) may support or fix the display (520). The second support structure (542) may fix or support the window (530). The second support structure (542) may prevent damage and movement of the window (530) due to external impact. The second support structure (542) may be referred to as a "fixing member," a "buffering member," an "injection molded product," etc. The second support structure (542) may be manufactured by molding a resin material. The second support structure (542) may include an adhesive material. The hardness of the second support structure (542) may be lower than the hardness of the first support structure (541).The second support structure (542) may be a low-hardness material. The hardness of the second support structure (542) may be 40 (Shore D) or more and 65 (Shore D) or less.

[0152] According to one embodiment, the third portion (5421) may be positioned along an edge of the display (520) (e.g., the edge (460) of the display in FIG. 6). The third portion (5421) may be positioned on one side of the window (530). The third portion (5421) may be positioned between a side surface (531) of the window (530) and a side wall (512) of the housing (510). The third portion (5421) may be spaced apart from, face, or contact the inner surface (5121) of the housing side wall (512). The third portion (5421) may fix or support the window (530). The third portion (5421) may prevent damage and movement of the window (530) due to external impact. The third portion (5421) may be formed to extend from the fourth portion (5422).

[0153] According to one embodiment, the fourth portion (5422) may be positioned along an edge of the display (520) (e.g., the edge (460) of the display in FIG. 6). The fourth portion (5422) may be positioned in a space between the window (530) and the rear plate (511) of the housing (510). The fourth portion (5422) may contact or face the outer surface (5413) of the first support structure (541). The fourth portion (5422) may contact the waterproof member (550). The fourth portion (5422) may fix or support the window (530) or the display (520). The fourth portion (5422) may prevent damage and movement of the window (530) and the display (520) from external impact. The fourth portion (5422) may support or fix the first support structure (541). The fourth portion (5422) can prevent damage and movement of the first support structure (541) from external impact. A portion of the fourth portion (5422) can include a protrusion (5423). The protrusion (5423) can be positioned in a recess (5414) of the first support structure (541). The protrusion (5423) of the fourth portion (5422) can be positioned in the recess (5414) of the first support structure (541) to increase the bonding force between the first support structure (541) and the second support structure (542).

[0154] FIG. 12 is an enlarged view of an embodiment of area A illustrated in FIG. 6. FIG. 13 is a cross-sectional view taken along line A-A' illustrated in FIG. 12. The electronic device (601) described with reference to FIGS. 12 and 13 may be substantially the same as the electronic device (501) illustrated in FIGS. 10 and 11. The components described with reference to FIGS. 12 and 13 may be substantially the same, in part or in whole, as the components described with reference to FIGS. 1 to 11. The components described with reference to FIGS. 12 and 13 may be substantially the same, in part or in whole, as the components described with reference to FIGS. 14 to 21.

[0155] Hereinafter, the configurations of the electronic device (601) not described may be substantially the same as the configurations of the electronic devices (101, 401, 501) illustrated in FIGS. 1 to 11.

[0156] According to one embodiment, the electronic device (601) may include a support structure (640). The support structure (640) may be positioned along and extend along an edge of the display (e.g., the edge (460) of the display illustrated in FIG. 6). A portion of the support structure (640) may be located on a side of the window. The support structure (640) may be referred to as a “fixing member,” a “buffering member,” an “injection molded product,” etc. The support structure (640) may be manufactured by molding a resin material. The support structure (640) may support or fix the display (620). The support structure (640) may support or fix the window (630). The support structure (640) may fix or support the circuit board (623). The support structure (640) may be made of an adhesive material. The support structure (640) can support or fix the display (620) or window (630) to reduce the bezel area (not shown) of the electronic device (601) and the display (620).

[0157] According to one embodiment, the first support structure (641) and the second support structure (642) can be joined through a recess (6414) and a protrusion (6423).

[0158] According to one embodiment, the first support structure (641) may include a first portion (6411) and a second portion (6412). The first support structure (641) may be positioned along an edge of the display (e.g., an edge (460) of the display as illustrated in FIG. 6). The first support structure (641) may be positioned in an interior space of the housing (610). A portion of the first support structure (641) may be positioned between a rear plate (611) of the housing and the display (620). A portion of the first support structure (641) may be positioned between a window (630) and the rear plate (611) of the housing (610). The first support structure (641) may be positioned between a waterproof member (650) and the display (620). The first support structure (641) may be formed to surround a portion of the panel (621) of the display (620) or the bending portion (622) along an edge of the display (e.g., the edge (460) of the display illustrated in FIG. 6). The first support structure (641) may fix or support the display (620). The first support structure (641) may fix or support the panel (621) or the bending portion (622) of the display (620). The first support structure (641) may completely fill the space formed by the bending portion (622). The first support structure (641) may prevent damage and movement of the panel (621) and the bending portion (622) from external impact. The first support structure (641) may support or fix the circuit board (623). The first support structure (641) can prevent damage and movement of the circuit board (623) from external impact. The first support structure (641) can fix or support the window (630). The first support structure (641) can support or fix the waterproof member (650). The first support structure (641) can prevent deterioration and movement of the waterproof member (650). A portion of the outer surface (6413) of the first support structure (641) can form a protrusion (6414) toward the side wall (612) of the housing (610).The first support structure (641) may be referred to as a “fixing member,” a “buffering member,” an “injection molded product,” etc. The first support structure (641) may be manufactured by molding a resin material. The first support structure (641) may include an adhesive material. The hardness of the first support structure (641) may be higher than the hardness of the second support structure (642). The first support structure (641) may be a high-hardness material. The hardness of the first support structure (641) may be 70 (Shore D) or more and 85 (Shore D) or less.

[0159] According to one embodiment, the first part (6411) may be disposed on one side of the display (620) along an edge of the display (620) (e.g., the edge (460) of the display (420) of FIG. 6). The first part (6411) may support or fix the display (620). The first part (6411) may support or fix the panel (621) or the bending part (622) of the display (620). The first part (6411) may prevent damage and movement of the panel (621) and the bending part (622) from external impact. The first part (6411) may support or fix the circuit board (623). The first part (6411) may be disposed below or at a corresponding position of the window (630). The first part (6411) may support or fix the window (630). The first part (6411) can be placed between the waterproofing member (650) and the window (630). The first part (6411) can fix or support the waterproofing member (650) and prevent deterioration and movement of the waterproofing member (650). The first part (6411) can form an outer surface (6413) toward the side wall (612) of the housing (610). A part of the outer surface (6413) of the first part (6411) can form a recess (6414) toward the side wall (612) of the housing (610). The recess (6414) of the first part (6411) can increase the bonding force with the second support structure (642).

[0160] According to one embodiment, the second portion (6412) may be disposed between the display (620) and the rear plate (611) of the housing (610) along an edge of the display (620) (e.g., the edge (460) of the display (420) of FIG. 6). The second portion (6412) may fix or support the panel (621) or the circuit board (623) of the display (620). The second portion (6412) may completely fill the space formed by the bending portion (622). The second portion (6412) may prevent damage to and movement of the panel (621) and the circuit board (623) from external impact. The second portion (6412) may be disposed between the waterproof member (650) and the display (620) to fix or support the waterproof member (650) and prevent deterioration and movement of the waterproof member (650). The second portion (6412) may be formed by extending from the first portion (6411).

[0161] In one embodiment, the second support structure (642) may include a third portion (6421) and a fourth portion (6422). In the present disclosure, the third portion may be referred to as “at least a portion of the second support structure (642) disposed between the side wall (612) of the housing (610) and the side surface (631) of the window (630)” or substantially the same therefor. In the present disclosure, the fourth portion (6422) may be referred to as “at least a portion of the second support structure (642) disposed between the window (630) and the back plate (611) of the housing (610)” or substantially the same therefor. The second support structure (642) may be disposed along an edge of the display (620) (e.g., the edge (460) of the display in FIG. 6). The second support structure (642) may be disposed in an interior space of the housing (610). A portion of the second support structure (642) may be disposed between the window (630) and the back plate (611) of the housing (610). A portion of the second support structure (642) may be disposed between the side surface (631) of the window (630) and the side wall (612) of the housing (610). The second support structure (642) may be disposed to contact or face the outer surface (6413) of the first support structure (641) along the edge of the display (620) (e.g., the edge (460) of the display as shown in FIG. 6). The second support structure (642) may support or fix the display (620). The second support structure (642) may fix or support the window (630). The second support structure (642) may prevent the window (630) from being damaged or moved due to external impact. The second support structure (642) may be referred to as a "fixing member," a "buffering member," an "injection molded product," etc. The second support structure (642) may be manufactured by molding a resin material. The second support structure (642) may include an adhesive material. The hardness of the second support structure (642) may be lower than the hardness of the first support structure (641).The second support structure (642) may be a low-hardness material. The hardness of the second support structure (642) may be 40 (Shore D) or more and 65 (Shore D) or less.

[0162] According to one embodiment, the third portion (6421) may be positioned along an edge of the display (620) (e.g., the edge (460) of the display in FIG. 6). The third portion (6421) may be positioned on one side of the window (630). The third portion (6421) may be positioned between a side surface (631) of the window (630) and a side wall (612) of the housing (610). The third portion (6421) may face or contact an inner surface (6121) of the side wall (612) of the housing. The third portion (6421) may fix or support the window (630). The third portion (6421) may prevent damage or movement of the window (630) due to external impact. The third portion (6421) may be formed to extend from the fourth portion (6422).

[0163] According to one embodiment, the fourth portion (6422) may be positioned along an edge of the display (620) (e.g., the edge (460) of the display in FIG. 6). The fourth portion (6422) may be positioned in a space between the window (630) and the rear plate (611) of the housing (610). The fourth portion (6422) may contact or face the outer surface (6413) of the first support structure (641). The fourth portion (6422) may contact the waterproof member (650). The fourth portion (6422) may fix or support the window (630) or the display (620). The fourth portion (6422) may prevent damage or movement of the window (630) and the display (620) from external impact. The fourth portion (6422) may support or fix the first support structure (641). The fourth portion (6422) can prevent damage or movement of the first support structure (641) due to external impact. The fourth portion (6422) can include a recess (6423) toward the side wall (612) of the housing. A part of the fourth portion (6422) can include a recess (6423) in which a protrusion (6414) of the first support structure (641) is disposed. The recess (6423) of the fourth portion (6422) can increase the bonding force between the first support structure (641) and the second support structure (642) by allowing the protrusion (6414) of the first support structure (641) to be inserted therein.

[0164] FIGS. 14 to 16 are cross-sectional views according to various embodiments of the line A-A' illustrated in FIG. 7. The electronic device (701) described with reference to FIGS. 14 to 16 may be substantially the same as the electronic devices (101, 401, 501, 601) described with reference to FIGS. 1 to 13. The components described with reference to FIGS. 14 to 16 may be substantially the same as some or all of the components described with reference to FIGS. 1 to 13. The components described with reference to FIGS. 14 to 16 may be substantially the same as some or all of the components described with reference to FIGS. 17 to 21.

[0165] Hereinafter, the configurations of the electronic device (701) not described may be substantially the same as the configurations of the electronic devices (101, 401, 501, 601) illustrated in FIGS. 1 to 13.

[0166] According to one embodiment, the electronic device (701) may include a support structure (e.g., a support structure (740a) illustrated in FIG. 14). The support structure (e.g., a support structure (740a) illustrated in FIG. 14) may be positioned along and extend along an edge of the display (e.g., an edge (460) of the display illustrated in FIG. 6). A portion of the support structure (e.g., a support structure (740a) illustrated in FIG. 14) may be positioned on a side of the window. The support structure (e.g., a support structure (740a) illustrated in FIG. 14) may be referred to as a “fixing member,” a “buffering member,” an “injection molded product,” etc. The support structure (e.g., a support structure (740a) illustrated in FIG. 14) may be manufactured by molding a resin material. The support structure (e.g., a support structure (740a) illustrated in FIG. 14) may support or fix the display (720). A support structure (e.g., a support structure (740a) illustrated in FIG. 14) can support or fix a window (730). The support structure (e.g., a support structure (740a) illustrated in FIG. 14) can fix or support a circuit board (723). The support structure (e.g., a support structure (740a) illustrated in FIG. 14) can be made of an adhesive material. The support structure (e.g., a support structure (740a) illustrated in FIG. 14) can reduce a bezel area (not illustrated) of the electronic device (701).

[0167] According to one embodiment, a support structure (e.g., a support structure (740a) illustrated in FIG. 14) may include a first support structure (741) and a second support structure (e.g., a second support structure (742a) illustrated in FIG. 14). The first support structure (741) may be substantially identical to the first support structures (441, 541, 641) described with reference to FIGS. 5 to 13.

[0168] According to one embodiment, the second support structure (e.g., the second support structure (742a) illustrated in FIG. 14) may include a third portion (e.g., the third portion (7421a) illustrated in FIG. 14) and a fourth portion (e.g., the fourth portion (7422a) illustrated in FIG. 14). In the present disclosure, the third portion (e.g., the third portion (7421a) illustrated in FIG. 14) may be referred to as “at least a portion of the second support structure (e.g., the second support structure (742a) illustrated in FIG. 14) disposed between the side wall (712) of the housing (710) and the side surface (731) of the window (730)” or substantially the same. Hereinafter, the fourth portion (e.g., the fourth portion (7422a) illustrated in FIG. 14) may be substantially the same as the fourth portions (4422, 5422, 6422) described with reference to FIGS. 5 to 13.

[0169] According to various embodiments, the third portion (e.g., the third portion (4421) of FIG. 8) of the second support structure (e.g., the second support structure (442) of FIG. 8) may include various shapes between the side wall (712) of the housing (710) and the side surface (731) of the window (730) or on one side of the window (730).

[0170] A third portion (7421a) of a second support structure (742a) according to an embodiment of FIG. 14 may include a shape that is parallel or parallel to an inner surface (7121) of a side wall (712) of a housing (710). A gap (743a) may be formed between the third portion (7421a) and the side wall (712). The third portion (7421a) may extend in the +Z or -Z direction while maintaining the gap (743a) constant. The third portion (7421a) may extend toward the first surface (710A) of the housing (710) so that the gap (743a) increases. The third portion (7421a) may extend toward the first surface (710A) of the housing (710) so that the gap (743a) decreases. As the third portion (7421a) extends toward the first surface (710A), the gap (743a) may tend to increase or decrease in some sections. It may extend toward the first surface (710A) of the housing (710). The third portion (7421a) of the second support structure (742a) may support or fix the window (730). The third portion (7421a) may prevent damage or movement of the window (730) due to external impact. Due to the gap (743a), the user may easily couple or separate the components of the electronic device (701) in which the display (720) and the support structure (740a) are coupled with the window (730) from the housing (710).

[0171] The third part (7421b) of the second support structure (742b) according to one embodiment of FIG. 15 may include a curved structure formed convexly toward the side wall (712) of the housing (710). The third part (7421b) of the second support structure (742b) may support or fix the window (730). The third part (7421b) may prevent damage or movement of the window (730) due to external impact. The third part (7421b) may include a semicircular shape convex toward the side wall (712). A gap (743b) may be formed between the third part (7421b) and the side wall (712). The gap (743b) between the center of the semicircular third part (7421b) and the side wall (712) may be formed to be the smallest. By forming the smallest gap (743b) between the center of the third portion (7421b) and the side wall of the housing, the load caused by external impact is distributed, thereby preventing damage or movement of the window (730). Due to the gap (743b), the user can easily combine or separate the component in which the display (720) and the support structure (740b) are combined with the window (730) from the housing (710).

[0172] A third portion (7421c) of a second support structure (742c) according to an embodiment of FIG. 16 may be formed to be in contact with an inner surface (7121) of a side wall (712) of a housing (710). The third portion (7421c) may extend in the first direction (+Z direction) of the housing (710), and an extended end (7423c) may be positioned to correspond to an outer surface (732) of a window (730). The third portion (7421c) may be positioned so that no space is created between the inner surface (7121) of the housing (710) and the side surface (731) of the window (730). The third portion (7424c) may be formed at a position in contact with the inner surface (7121) and an end (7423c) corresponds to an outer surface (732) of the window (730). The third portion (7421c) can increase the bonding strength between the housing (710) and the display (720). The third portion (7421c) can increase the bonding strength between the housing (710) and the window (730) included in the housing. By preventing a space from forming between the window (730) and the side wall (712) of the housing (710), the inflow of external substances can be prevented. The third portion (7421c) can support or fix the window (730). The third portion (7421c) can prevent damage and movement of the window (730) due to external impact.

[0173] FIG. 17 is a cross-sectional view according to an embodiment of A-A' illustrated in FIG. 7. The electronic device (701) described with reference to FIG. 17 may be substantially the same as the electronic devices (101, 401, 501, 601) described with reference to FIGS. 1 to 16. Some or all of the components described with reference to FIG. 17 may be substantially the same as some or all of the components described with reference to FIGS. 18 to 21.

[0174] Hereinafter, the configurations of the electronic device (701) not described may be substantially the same as the configurations of the electronic devices (101, 401, 501, 601) illustrated in FIGS. 1 to 13.

[0175] According to one embodiment, the electronic device (701) may include a housing (710b). A portion of an inner surface (7121b) of a side wall (712b) of the housing (710b) may form a recess (7122b) facing away from the display (720). Configurations of the housing (710b), not described below, may be substantially the same as those of the housings (401, 510, 610, 710) illustrated in FIGS. 1 to 16 .

[0176] According to one embodiment, the electronic device (701) may include a support structure (740d). The support structure (740d) may include a first support structure (741b) and a second support structure (742d). The support structure (740d) may be positioned along an edge of the display (e.g., the edge (460) of the display illustrated in FIG. 6) and may extend along the edge. A portion of the support structure (740d) may be positioned on a side (731b) of the window. The support structure (740d) may be referred to as a “fixing member,” a “buffering member,” an “injection molded product,” etc. The support structure (740d) may be manufactured by molding a resin material. The support structure (740d) may support or fix the display (720). The support structure (740d) may support or fix the window (730b). The support structure (740d) can fix or support the circuit board (723). The support structure (740d) can be made of an adhesive material. The support structure (e.g., the support structure (740a) illustrated in FIG. 14) can reduce the bezel area (not illustrated) of the electronic device (701). The support structure (740d) can prevent damage or movement of the window (730b) due to external impact. The support structure (740d) can prevent damage or movement of the display (720) due to external impact.

[0177] According to one embodiment, the first support structure (741b) may include a first portion (7411b) and a second portion (7412b). The first support structure (741b) may form a recess (7414b) in a direction away from the side wall (712b) of the housing (710b) on a portion of the outer surface (7413b). The first support structure (741b) may support or fix the display (720). The first support structure (741b) may support or fix the window (730b). The first support structure (741b) may prevent damage or movement of the panel (721) and the bending portion (722) due to external impact. Below, the configurations of the first support structure (741b) not described are the same as the configurations of the first support structures (441, 541, 641) illustrated in FIGS. 1 to 13.

[0178] In one embodiment, the second support structure (742d) may include a third portion (7421d) and a fourth portion (7422d). At least a portion of the third portion (7421) may include a protrusion (7424d). The protrusion (7424d) may be positioned in a recess (7122b) formed in an inner surface (7121b) of the housing side wall (712b). The protrusion (7424d) of the third portion may be positioned in the recess (7122b) of the housing side wall so as not to create a space. A portion of the third portion (7421d) may abut against the inner surface (7121b) of the housing side wall. The protrusions (7424d) of the third portion (7421d) disposed in the recesses (7122b) of the side wall (712b) can increase the bonding force between the housing (710b) and the display (720). The fourth portion (7422d) can include a protrusion (7423d) that protrudes from at least a portion of the fourth portion (7422d) and is disposed in a recess (7414b) formed in the first support structure (741b). The protrusions (7423d) of the second support structure (742d) disposed in the recesses (7414b) formed in the first support structure (741b) can increase the bonding force between the first support structure (741b) and the second support structure (742d). The second support structure (742d) can support or fix the display. The second support structure (742d) can support or fix the window (730b). The second support structure (741d) can prevent damage or movement of the window (730b) due to external impact. The configurations of the second support structure (742d), not described below, may be substantially the same as those of the second support structure (742c) illustrated in FIG. 16.

[0179] In the present disclosure, the third portion (7421d) may be named “at least a portion of the second support structure (724d) disposed between the side wall (712) of the housing (710) and the side surface (731b) of the window (730b)” or substantially the same.

[0180] Fig. 18 is a cross-sectional view according to one embodiment of A-A' illustrated in Fig. 7. The electronic device (701) described with reference to Fig. 18 may be substantially the same as the electronic devices (101, 401, 501, 601) described with reference to Figs. 1 to 13. The components described with reference to Fig. 18 may be substantially the same, in part or in whole, as the components described with reference to Figs. 1 to 17.

[0181] Hereinafter, the configurations of the electronic device (701) not described may be substantially the same as the configurations of the electronic devices (101, 401, 501, 601) illustrated in FIGS. 1 to 13.

[0182] In one embodiment, the electronic device (701) may include a support structure (740e). The support structure (740e) may include a first support structure (741c) and a second support structure (742e). The support structure (740e) may be positioned along an edge of the display (e.g., the edge (460) of the display illustrated in FIG. 6) and may extend along the edge. A portion of the support structure (740e) may be positioned on a side (731) of the window (730). The support structure (740e) may be referred to as a “fixing member,” a “buffering member,” an “injection molded product,” etc. The support structure (740e) may be manufactured by molding a resin material. The support structure (740e) may support or fix the display (720). The support structure (740e) may support or fix the window (730). The support structure (740e) can fix or support the circuit board (723). The support structure (740e) can be made of an adhesive material. The support structure (740e) can reduce the bezel area (not shown) of the electronic device (701). The support structure (740e) can prevent damage or movement of the window (730) due to external impact. The support structure (740e) can prevent damage or movement of the display (720) due to external impact.

[0183] According to one embodiment, the first support structure (741c) may include a first portion (7411c) and a second portion (7412c). The first support structure (741c) may include an extension portion (7413c) formed by extending from the first portion (7411c). A portion of the extension portion (7413c) may be disposed on one side of the window (730). A portion of the extension portion (7413c) may be disposed between a side surface (731) of the window (730) and a side wall (712) of the housing (710). The first support structure (741c) may support or fix the display (720). The first support structure (741c) may support or fix the window (730). The first support structure (741c) may prevent damage or movement of the panel (721) and the bending portion (722) due to external impact. Hereinafter, the configurations of the first support structure (741c) not described may be substantially the same as the configurations of the first support structures (441, 541, 641) illustrated in FIGS. 1 to 13.

[0184] In one embodiment, the second support structure (742e) may include a third portion (7421e) and a fourth portion (7422e). The third portion (7421e) may be positioned between the window (730) and the inner surface (7121) of the housing side wall. The third portion (7421e) may be positioned between a portion of an extension portion (7413c) formed by extending from the first support structure (741c) and the inner surface (7121) of the housing side wall. The third portion (7421e) may cover the extension portion (7413c). The third portion (7421e) may be in contact with or face the inner surface (7121) of the housing side wall. The third part (7421e) of the second support structure (742e) having a lower hardness than the first support structure (741c) can prevent damage or movement of the window (730) from external impact even when the extension part (7413c) of the first support structure (741c) is arranged on one side of the window (730). The second support structure (742e) can support or fix the display (720). The second support structure (742e) can support or fix the window (730). The second support structure (741e) can prevent damage or movement of the window (730) from external impact. The configurations of the second support structure (742e) not described below can be substantially the same as the second support structure (442) illustrated in FIGS. 5 to 8 .

[0185] In the present disclosure, the third portion (7421e) may be named “at least a portion of the second support structure (724e) disposed between the side wall (712) of the housing (710) and the side surface (731) of the window (730)” or substantially the same.

[0186] FIG. 19 is a drawing illustrating a method for manufacturing an electronic device according to one embodiment of the present disclosure. FIG. 20 is a drawing for a manufacturing method according to one embodiment in the first molding liquid application step (820) and the second molding liquid application step (830) of FIG. 19. FIG. 21 is a drawing for a manufacturing method according to one embodiment in the first molding liquid application step (920) and the second molding liquid application step (930) of FIG. 19. The first molding liquid or the second molding liquid disclosed in FIG. 19 may be substantially the same as the first support structure (e.g., the first support structure (441) illustrated in FIG. 6) or the second support structure (e.g., the second support structure (442) illustrated in FIG. 6) disclosed in FIGS. 5 to 18. The configurations of electronic devices (e.g., electronic device (401) illustrated in FIG. 6) not described in the manufacturing method steps below may be substantially the same as some or all of the configurations described with reference to FIGS. 6 to 18.

[0187] According to one embodiment, a method for manufacturing an electronic device (e.g., an electronic device (401) of FIG. 5) may include a step (810) of assembling a mold base (802) and a first mold cap (803) to a component (801) in which a display (8011) and a window (8012) are combined. The method for manufacturing an electronic device (e.g., an electronic device (401) of FIG. 5) may include a step (8201) of applying a first molding liquid (821) and semi-curing it (820). The method for manufacturing an electronic device (e.g., an electronic device (401) of FIG. 5) may include a step (830) of separating a first mold cap (803), combining a second mold cap (804), and then injecting a second molding liquid (831) (8301). A method for manufacturing an electronic device (e.g., an electronic device (401) of FIG. 5) may include thermally curing (840) a first molding liquid (821) and a second molding liquid (831). The method for manufacturing an electronic device (e.g., an electronic device (401) of FIG. 5) may include a process (850) of cooling the first molding liquid (821) and the second molding liquid (831) and disassembling the mold base (802) and the second mold cap (804).

[0188] Referring to FIG. 20, in the process of applying and semi-curing the first molding liquid (821) (820), the first molding liquid (821) may be injected (8201) into the internal space (8031) between the first mold cap (803) and the component (801) in which the display (8011) and the window (8012) are combined. The first molding liquid (821) may be injected (8201) through the injection port (8032) of the first mold cap (803). The first molding liquid (821) may be applied so as to surround the display (8011) in the space between the component (801) in which the display (8011) and the window (8012) are combined and the first mold cap (803). Thereafter, the first molding liquid (821) may be semi-cured. The hardness (hareness) of the first molding liquid (821) may be 70 (Shore D) or more and 85 (Shore D) or less. The process may include disassembling the first mold cap (803) and joining the second mold cap (804) before injecting the second molding liquid (831) (8301). The second molding liquid (831) may be injected into the space (8041) between the second mold cap (804) and the part (801) where the display (8011) and the window (8012) to which the first molding liquid (821) is applied are joined through the injection port (8042) of the second mold cap (804). The second molding liquid (831) may be applied along the outer surface (8211) of the semi-hardened first molding liquid (821). After the second molding liquid (831) is applied, the first molding liquid (821) and the second molding liquid (831) can be thermally cured. The second molding liquid (831) can have a lower hardness than the first molding liquid (821). The hardness of the second molding liquid (831) can be 40 (Shore D) or more and 65 (Shore D) or less. Since the second molding liquid (831) with a low hardness is applied (8301) while covering the first molding liquid (821), the second molding liquid (831) can prevent damage or movement of the window (e.g., the window (430) of FIG. 6) due to external impact.

[0189] The hardness of the present disclosure is defined in terms of shore hardness for convenience, but is not necessarily limited to the shore hardness in expressing high and low hardness or high and low hardness.

[0190] Referring to Fig. 21, the step of applying and semi-curing the first molding liquid (921) may include a case where the first molding liquid overflows to one side (8013) of the window. The first molding liquid (921) may be injected (9201) into the space (8031) between the first mold cap (803) and the part (801) where the display (8011) and the window (8012) are combined. The first molding liquid (921) may have a Shore D of 70 or more and 85 or less. Detailed components for the step of injecting and semi-curing the first molding liquid (921) and semi-curing (920), which are not described below, may be substantially the same as the components for the step of applying and semi-curing the first molding liquid (821) and semi-curing (820) of Figs. 18 and 19.

[0191] Referring to FIG. 21, in the step (930) of applying the second molding liquid (931), the second molding liquid (931) may be injected (9301) so as to be applied (9311) while covering the first molding liquid (921) overflowing to one side (8013) of the window. The second molding liquid (931) may be injected into the space (8041) between the second mold cap (804) and the part (801) where the display (8011) and the window (8012) on which the first molding liquid (921) is applied are combined. The second molding liquid (931) may have a hardness lower than that of the first molding liquid (921). The hardness of the second molding liquid (931) may be 40 (Shore D) or more and 65 (Shore D) or less. By applying (9311) the second molding liquid (931) while covering the first molding liquid (921) overflowing on one side (8012) of the window, the second molding liquid (931) can prevent damage or movement of the window (e.g., window (430) of FIG. 6) due to external impact. Detailed components of the application step (930) of the second molding liquid (931) that are not described below may be the same as the components of the application step (830) of the second molding liquid (831) of FIGS. 18 to 19.

[0192] Fig. 22 is a perspective view of an electronic device (901) according to one embodiment. Fig. 23 is a front view of an electronic device (902) according to one embodiment. Fig. 24 is a front view of an electronic device (903) according to one embodiment. Fig. 25 is an enlarged view of area B or B' illustrated in Figs. 23 and 24.

[0193] The components of the electronic device described with reference to FIGS. 22 to 25 may be substantially the same as all or part of the components described with reference to FIGS. 1 to 24. The components of the electronic device described with reference to FIGS. 22 to 25 may be substantially the same as all or part of the components described with reference to FIGS. 26 to 30. Hereinafter, configurations not described may be substantially the same as the components described with reference to FIGS. 1 to 24 and 26 to 30.

[0194] Referring to FIG. 22, the electronic device (901) may be a foldable electronic device (901). The electronic device (901) may include a first housing (910a) and a second housing (910b). The electronic device (901) may include a hinge portion (913) that is coupled to allow the first housing (910a) and the second housing (910b) to rotate. The first housing (910a) and the second housing (910b) may rotate about the hinge portion (913). The electronic device (901) may include a first surface (901A) corresponding to the first housing and facing the -Z direction. The electronic device (901) may include a second surface (901B) corresponding to the second housing (910b) and facing the same direction as the first surface (901A) in an unfolded state. The electronic device (901) may include a third side (901C) facing in an opposite direction to the first side (901A) and the second side (901B).

[0195] The electronic device (901) may include a display (920). The display (920) may be disposed on a third side (901C) of the electronic device (901). The display (920) may be disposed in a first housing (910a). The display (920) may extend from the first housing (910a) and may be disposed in a second housing (910b) across a hinge portion (913). The display (920) may be configured as a flexible display.

[0196] The electronic device (901) may include a window (930). The window (930) may be disposed on the display (920). The window may be disposed in a first housing (910a) or a second housing (910b). The window may extend from the first housing (910a) across the hinge portion (913) and be disposed in the second housing (910b).

[0197] The electronic device (901) may include a first housing (910a). The first housing (910a) may include a back plate (911a) and a side wall (912a). The electronic device (901) may include a second support structure (942a) in an S1 region of the first housing (910a). The second support structure (942a) may be positioned between the side wall (912b) of the first housing and a window (930). The second support structure (942a) may be positioned between the window (930) and the back plate (911a).

[0198] The electronic device (901) may include a second housing (910b). The second housing (910b) may include a back plate (911b) and a side wall (912b). The electronic device (901) may include a second support structure (942b) in an S2 region of the second housing (910b). The second support structure (942b) may be positioned between the side wall (912b) of the second housing and a window (930). The second support structure (942b) may be positioned between the window (930) and the back plate (911b).

[0199] The electronic device (901) may include a first support structure (941a) and a second support structure (942b) in the S2' region of the second housing. The first support structure (941a) may be disposed between the display (920) and the rear plate (911b). The first support structure (941a) may be disposed to surround a panel (e.g., 921 of FIG. 25) and a bending portion (e.g., 922 of FIG. 25) of the display (920). The first support structure (941a) may be formed of a material having a higher hardness than the second support structure (942b). The second support structure (942b) may be disposed between the first support structure (941a) and a side wall (912b) of the second housing. The second support structure (942b) may be arranged to extend along the side wall (912b) of the second housing (910b).

[0200] According to one embodiment, the electronic device (901) may include a second support structure (942c) in the S1' region. The S1' region may be a region corresponding to the hinge portion (913). The second support structure (942c) may be positioned between the window (930) and the hinge portion side wall (9132). The second support structure (942c) may be positioned between the window (930) and the hinge cover (9131).

[0201] According to one embodiment, the electronic device (901) may have a second support structure (942c) disposed in the S1' region, which is different from the second support structure (942a) and the second support structure (942b). The second support structure (942c) may include a material having a lower hardness than the second support structure (942a) disposed in the S1 region of the first housing (910a). The third support structure (942c) may include a material having a lower hardness than the second support structure (942b) disposed in the S2 region of the second housing (910b). For example, the second support structure (942c) may include a material having a softer material than the second support structures (942a, 942b) disposed in the first housing (910a) and the second housing (910b), thereby facilitating an open state and a folded state in the foldable electronic device. The second support structure (942c) arranged in the S1' region described with reference to FIGS. 22 to 25 is not limited to the support structure according to one embodiment, and may include a configuration including a design change or an equivalent range in a foldable electronic device.

[0202] According to one embodiment, the electronic device (902) may include a second support structure (942a) disposed in the S1 region of the first housing (910a), a second support structure (942b) disposed in the S2 and S2' regions of the second housing (910b), and a second support structure (942c) disposed in the S1' region of the hinge portion, which are formed by extending integrally with each other. Each of the second support structures (942a, 942b, 942c) may be disposed connected to or separated from each other.

[0203] According to one embodiment, the electronic device (903) may not include a second support structure (942c) in the S1' region. The second support structure (942a) disposed in the S1 region of the first housing and the second support structure (942b) disposed in the S2 region of the second housing may be spaced apart from the S1' region and disposed on side walls (912a, 912b) of the first and second housings, respectively.

[0204] The first support structure (e.g., 941 of FIG. 25) and the second support structure (e.g., 942 of FIG. 25) not described in FIGS. 22 to 25 may be substantially the same as the first support structure (e.g., 441 of FIG. 8) and the second support structure (e.g., 442 of FIG. 8) described in FIGS. 1 to 24.

[0205] FIG. 26 is a drawing of an electronic device (1001) according to one embodiment. FIG. 27 is a drawing showing a front view of an electronic device (1001) in an unfolded state according to one embodiment. FIG. 28 is a drawing showing an electronic device (1002) according to one embodiment. FIG. 29 is a drawing showing an electronic device (1003) according to one embodiment. FIG. 30 is an enlarged view of C or C' shown in FIGS. 28 and 29.

[0206] The components of the electronic device (e.g., 1001 of FIG. 26) described with reference to FIGS. 26 to 30 may be all or partly identical to the components described with reference to FIGS. 1 to 25. The components of the electronic device (e.g., 1001 of FIG. 26) described with reference to FIGS. 26 to 30 may be all or partly substantially identical to the components described with reference to FIGS. 31 to 33.

[0207] Hereinafter, the components of FIGS. 26 to 30 that are not described may be substantially the same as the components described in FIGS. 1 to 25 and FIGS. 31 to 33.

[0208] Referring to FIGS. 26 and 27, the electronic device (1001) may be a multi-foldable electronic device (1001). FIG. 26 is a drawing illustrating a folded state of the electronic device (1001). FIG. 27 is a drawing illustrating an unfolded state of the electronic device (1001). The electronic device (1001) may include a first housing (1010a), a second housing (1010b), and a third housing (1010c). The electronic device (1001) may include a first hinge portion (1013a) to which the first housing (1010a) and the second housing (1010b) are coupled so that they can rotate. The first housing (1010a) and the second housing (1010b) can rotate about the first hinge portion (1013a). The electronic device (1001) may include a second hinge portion (1013b) that is coupled to allow the first housing (1010a) and the third housing (1010c) to rotate, respectively. The first housing (1010a) and the third housing (1010c) may rotate about the second hinge portion (1013b). Referring to FIG. 26, the electronic device (1001) may have the third housing (1010c) positioned between the first housing (1010a) and the second housing (1010b) in a folded state. The rotation radius of the first hinge portion (1013a) may be greater than the radius of the second hinge portion (1013b). The electronic device (1001) may include a first surface (1001A) corresponding to the first housing and facing the -Z direction. The electronic device (1001) may include a second surface (1001B) corresponding to the second housing (1010b) and facing the same direction as the first surface (1001A) in the unfolded state. The electronic device (1001) may include a third surface (1001C) corresponding to the third housing (1010c) and facing the same direction as the first surface (1001A) and the second surface (1001B) in the unfolded state. The electronic device (1001) may include a fourth surface (1001D) facing the opposite direction from the first surface to the third surface in the unfolded state.

[0209] An electronic device (1001) may include a display (1020). The display (1020) may be disposed on a fourth surface (1001D) of the electronic device (1001). The display (1020) may be disposed in a first housing (1010a). The display (1020) may extend from the first housing (1010a) across a first hinge portion (1013a) and may be disposed in a second housing (1010b). The display (1020) may extend from the first housing (1010a) across a second hinge portion (1013b) and may be disposed in a third housing (1010c). The display (1020) may be disposed on a fourth surface (1001D) of the electronic device. The display (1020) may be configured as a flexible display.

[0210] An electronic device (1001) may include a window (1030). The window (1030) may be disposed on the display (1020). The window (1030) may be disposed in a first housing (1010a), a second housing (1010b), and a third housing (1010c). The window may extend from the first housing (1010a) across the first hinge portion (1013a) and be disposed in the second housing (1010b). The window may extend from the first housing (1010a) across the second hinge portion (1013b) and be disposed in the third housing (1010c). The window (1030) may be disposed on a fourth side (1001D) of the electronic device.

[0211] An electronic device (1001) may include a first housing (1010a). The first housing (1010a) may include a back plate (1011a) and a side wall (1012a). The electronic device (1001) may include a second support structure (1042a) in a T1 region of the first housing (1010a). The second support structure (1042a) may be positioned between the side wall (1012a) of the first housing and a window (1030). The second support structure (1042a) may be positioned between the window (1030) and the back plate (1011a).

[0212] The electronic device (1001) may include a second housing (1010b). The second housing (1010b) may include a back plate (1011b) and a side wall (1012b). The electronic device (1001) may include a second support structure (1042b) in a T2 region of the second housing (1010b). The second support structure (1042b) may be positioned between the side wall (1012b) of the second housing and a window (1030). The second support structure (1042b) may be positioned between the window (1030) and the back plate (1011b).

[0213] The electronic device (1001) may include a third housing (1010c). The third housing (1010c) may include a back plate (1011c) and a side wall (1012c). The electronic device (1001) may include a second support structure (1042c) in a T3 region of the second housing (1010c). The second support structure (1042c) may be positioned between the side wall (1012c) of the third housing and a window (1030). The second support structure (1042c) may be positioned between the window (1030) and the back plate (1011c).

[0214] The electronic device (1001) may include a first support structure (1041a) and a second support structure (1042c) in the T3' region of the third housing. The first support structure (1041a) may be disposed between the display (1020) and the rear plate (1011c). The first support structure (1041a) may be disposed to surround a panel (e.g., 1021 of FIG. 30) and a bending portion (e.g., 1022 of FIG. 30) of the display (1020). The first support structure (1041a) may be formed of a material having a higher hardness than the second support structure (1042c). The second support structure (1042c) may be disposed between the first support structure (1041a) and a side wall (1012c) of the third housing. The second support structure (1042c) may be arranged to extend along the side wall (1012c) of the third housing (1010c).

[0215] According to one embodiment, the electronic device (1001) may include a second support structure (1042d) in the T2' region. The T2' region may be a region corresponding to the first hinge portion (1013a). The second support structure (1042d) may be disposed between the window (1030) and the first hinge portion side wall (10132a). The second support structure (1042d) may be disposed between the window (1030) and the first hinge cover (10131a). The second support structure (1042d) disposed in the T2' region may be a different second support structure from the second support structure (1042c) disposed in the T3 region of the third housing (1010c). The second support structure (1042d) disposed in the T2' region may include a material having a lower hardness than the second support structure disposed in the first to third housings (e.g., the second support structure (1042a) disposed in the T1 region). For example, the second support structure (1042d) disposed in the Td' region may facilitate the second housing (1010b) and the third housing (1010c) to be opened or folded relative to each other.

[0216] According to one embodiment, the electronic device (1001) may include a second support structure (1042e) in the T1' region. The T1' region may be a region corresponding to the second hinge portion (1013b). The second support structure (1042e) may be disposed between the window (1030) and the second hinge portion side wall (10132b). The second support structure (1042e) may be disposed between the window (1030) and the second hinge cover (10131b). The second support structure (1042e) disposed in T1' may be a second support structure (1042e) different from the second support structure (1042a) disposed in the T1 region of the first housing (1010a). The second support structure (1042e) disposed at T1' may be a second support structure (1042e) different from the second support structure (1042b) disposed at the T2 region of the second housing (1010b). The second support structure (1042e) disposed at T1' may be a second support structure different from the second support structure (1042c) disposed at the T3 region of the third housing (1010c). The other second support structure (1042e) disposed at T1' may include a material having a lower hardness than the second support structures disposed at the first to third housings (e.g., the second support structure (1042a) disposed at the T1 region). For example, the second support structure (1042e) disposed at the T1' region may facilitate the first housing (1010a) and the second housing (1010b) to be opened or folded relative to each other.

[0217] According to one embodiment, the electronic device (1002) may include a second support structure (1042a) disposed in a T1 region of a first housing, a second support structure (1042b) disposed in a T2 region of a second housing, a second support structure (1042c) disposed in T3 and T3' regions of a third housing, and a second support structure (1042d, 1042e) disposed in a T2' region of a first hinge portion and a T1' region of a second hinge portion, which extend integrally with each other. Each of the second support structures (1042a, 1042b, 1042c, 1042d, 1042e) may be disposed to be connected to or separated from each other.

[0218] According to one embodiment, the electronic device (1003) may not include a second support structure (1042d) in the T2' region. The second support structure (1042a) disposed in the T1 region of the first housing and the second support structure (1042b) disposed in the T2 region of the second housing may be spaced apart from each other in the T2' region and disposed between the window (1030) and the side walls (1012a, 1012b) disposed in the first and second housings, respectively.

[0219] According to one embodiment, the electronic device (1003) may not include a second support structure (1042e) in the T1' region. The second support structure (1042a) disposed in the T1 region of the first housing and the second support structure (1042c) disposed in the T3 region of the third housing may be disposed between the window (1030) and the side walls (1012a, 1012c) disposed in the first and third housings, respectively, spaced apart from each other in the T1' region.

[0220] The first support structure (e.g., 1041 of FIG. 30) and the second support structure (e.g., 1042c of FIG. 30) not described below may be substantially the same as the first support structure (e.g., 441 of FIG. 8) and the second support structure (e.g., 442 of FIG. 8) described in FIGS. 1 to 25.

[0221] Fig. 31 is a drawing showing an electronic device (1101) according to one embodiment. Fig. 32 is an enlarged cross-sectional view of the DD' section of Fig. 31. Fig. 33 is an enlarged cross-sectional view of the EE' section of Fig. 31.

[0222] The components of the electronic device (1101) described with reference to FIGS. 31 to 33 may be substantially the same as the components of the electronic device described with reference to FIGS. 1 to 30. Hereinafter, components not described in FIGS. 31 to 33 may be substantially the same as the components described in FIGS. 1 to 30.

[0223] The electronic device (1101) may be a rollable electronic device. FIG. 31 is a drawing showing an unfolded state of the rollable electronic device (1101). The electronic device (1101) may include a first housing (1110a) and a second housing (1110b). The second housing (1110b) may move along the second side wall (1113a) of the first housing (1110a). The second housing may move in direction ①. For convenience, the movement of the second housing (1110b) has been described, but the present invention is not limited thereto, and the first housing (1110a) may move relative to the second housing (1110b). In the present disclosure, the unfolded state may mean a state in which a housing (e.g., the second housing (1110b) of FIG. 31) is moved away from another housing (e.g., the first housing (1110a) of FIG. 31). A closed state may mean a state in which a housing (e.g., the second housing (1110b) of FIG. 31) is accommodated in another housing (e.g., the first housing (1110a) of FIG. 31).

[0224] Although not shown, the electronic device (1101) may include a separate driving unit for moving the second housing (1110b). However, the movement of the second housing is not limited, and the first housing (1110a) may also move. The electronic device (1101) may include a first surface (1101A) corresponding to the first housing and facing in the Z direction. The electronic device (1101) may include a second surface (1101B) corresponding to the second housing (1110b) and facing in the same direction as the first surface (1101A). The electronic device (1101) may include a third surface (1101C) facing in an opposite direction to the first surface (1101A) and the second surface (1101B).

[0225] An electronic device (1101) may include a display (1120). The display (1120) may be disposed on a third side (1101C) of the electronic device (1101). The display (1120) may be disposed in a first housing (1110a). The display (1120) may extend from the first housing (1110a) and be disposed in a second housing (1110b). The display (1120) may be disposed along a third side wall (1112b) of the second housing and extend to a second side (1101B) corresponding to the second housing. At least a portion of the display (1120) may be accommodated in an internal space of the first housing (1110a) or the second housing (1110b) when closed. The display (1120) may be configured as a flexible display.

[0226] The electronic device (1101) may include a multi-bar structure (1160). The multi-bar structure (1160) may form a plane at least partially identical to at least a portion of the first housing (1110a) when the electronic device (1101) is in an open state. The multi-bar structure (1160) may be accommodated at least partially into the interior space of the second housing (1110b) when the electronic device (1101) is in a closed state, but is not limited thereto, and may be accommodated into the interior space of the first housing (1110a).

[0227] The internal space of the first housing (1110a) described with reference to FIGS. 31 to 33 may be referred to as substantially the same as the space between the display cover (1130) and the rear cover (1111a) of the first housing. The internal space of the second housing (1110b) may be referred to as substantially the same as the space between the display cover (1130) and the rear cover (1111b) of the second housing.

[0228] The electronic device (1101) may include a first support structure (1141) and a second support structure (1142a) in a D1 region of a first housing (1110a). The electronic device (1101) may include a second support structure (1142a) in a D2 region of the first housing (1110a). The first support structure may be formed to surround a panel of the display (1120). At least a portion of the second support structure (1142a) may be disposed between the first support structure (1141) and a second side wall (1113a) of the housing. The first support structure may be disposed between the display cover (1130) and the second side wall (1113a). The second support structure (1142a) may be disposed to extend from the D1 region along the first side wall (1112a) to the second side wall (1113b). The second support structure (1142a) can be arranged to extend integrally from the D1 region and the D2 region.

[0229] The electronic device (1101) may include a second support structure (1142b) in the D3 area of ​​the second housing (1110b). Referring to FIG. 32, which illustrates a D-D' cross-section of FIG. 31, the second support structure (1142b) may be positioned between the fourth side wall (1113b) of the second housing and the display cover (1130). The second support structure (1142b) positioned in the D3 area may be formed to have a different thickness from the second support structure (1142a) positioned in D1 or D2.

[0230] The electronic device (1101) may include a second support structure (1142c) in the D4 region of the second housing (1110b). Referring to FIG. 33, which illustrates a cross-section taken along line E-E' of FIG. 31, the second support structure (1142c) may be disposed on a third side wall (1112b) of the second housing. The second support structure (1142c) may be disposed between the third side wall (1112b) of the second housing and the display cover (1130). The second support structure (1142c) disposed in the D4 region may be formed to have a different thickness from the second support structure (1142a) disposed in the D1 region or the D2 region.

[0231] The first support structure (1141) and the second support structure (e.g., 1142a of FIG. 31) not described in FIGS. 31 to 33 below may be substantially the same as the first support structure (e.g., 441 of FIG. 8) and the second support structure (e.g., 442 of FIG. 8) described in FIGS. 1 to 30.

[0232] An electronic device according to one embodiment of the present disclosure (e.g., 401 of FIGS. 6 to 9) may include a housing including a window facing a first direction (e.g., 430 of FIGS. 6 to 9), a rear plate facing a second direction opposite to the first direction (e.g., 411 of FIGS. 6 to 9), and a side wall surrounding an internal space between the window and the rear plate (e.g., 412 of FIGS. 6 to 9).

[0233] An electronic device (e.g., 401 of FIGS. 6 to 9) according to one embodiment of the present disclosure may include a display (e.g., 420 of FIGS. 6 to 9) covered by a window (e.g., 430 of FIGS. 6 to 9).

[0234] An electronic device (e.g., 401 of FIGS. 6 to 9) according to one embodiment of the present disclosure may include a support structure (e.g., 440 of FIGS. 6 to 9) disposed in an internal space of the housing (e.g., 410 of FIGS. 6 to 9).

[0235] An electronic device (e.g., 401 of FIGS. 6 to 9) according to one embodiment of the present disclosure may include a waterproof member (e.g., 450 of FIGS. 6 to 9) disposed between the rear plate (e.g., 411 of FIGS. 6 to 9) and the display (e.g., 420 of FIGS. 6 to 9).

[0236] An electronic device according to one embodiment of the present disclosure (e.g., electronic device (401) of FIGS. 6 to 9) may include a first support structure (e.g., 441 of FIGS. 6 to 9) disposed on the waterproof member (e.g., 460 of FIG. 6 to 9) along an edge (e.g., 460 of FIG. 6) of the display (e.g., 420 of FIGS. 6 to 9) and a second support structure (e.g., 442 of FIGS. 6 to 9) including at least a portion disposed between the window side (e.g., 431 of FIGS. 6 to 9) and the inner side (e.g., 4121 of FIGS. 6 to 9) of the side wall (e.g., 411 of FIGS. 6 to 9).

[0237] An electronic device according to one embodiment of the present disclosure (e.g., electronic device (401) of FIGS. 6 to 9) may have a hardness of the first support structure (e.g., 441 of FIGS. 6 to 9) higher than a hardness of the second support structure (e.g., 442 of FIGS. 6 to 9).

[0238] According to one embodiment of the present disclosure, the second support structure (e.g., 422 of FIGS. 6 to 9) may be positioned along an edge of the display (e.g., 460 of FIGS. 6 to 9).

[0239] According to one embodiment of the present disclosure, the first support structure (e.g., 441 of FIGS. 6 to 9) may include an outer surface (e.g., 4413 of FIGS. 6 to 9) facing the side wall (e.g., 411 of FIGS. 6 to 9), and at least a portion of the second support structure (e.g., 442 of FIGS. 6 to 9) may be disposed between the outer surface (e.g., 4413 of FIGS. 6 to 9) and the side wall (e.g., 412 of FIGS. 6 to 9).

[0240] According to one embodiment of the present disclosure, the first support structure (e.g., 521 of FIGS. 10 and 11) may include a recess (e.g., 5414 of FIGS. 10 and 11) in at least a portion of an outer surface (e.g., 5413 of FIGS. 10 and 11) of the first support structure (541), and the second support structure (e.g., 522 of FIGS. 10 and 11) may include a protrusion that protrudes from at least a portion and is positioned in the recess (e.g., 5414 of FIGS. 10 and 11).

[0241] According to one embodiment of the present disclosure, the first support structure (e.g., 521 of FIGS. 12 and 13) may include a protrusion (e.g., 6414 of FIGS. 12 and 13) facing the second support structure (e.g., 642 of FIGS. 12 and 13) on at least a portion of an outer surface (e.g., 5413 of FIGS. 10 and 11) of the first support structure (e.g., 521 of FIGS. 12 and 13) and an outer surface (e.g., 5413 of FIGS. 12 and 13), and at least a portion of the second support structure (e.g., 642 of FIGS. 12 and 13) may include a recess (e.g., 6423 of FIGS. 12 and 13) in which the protrusion (e.g., 6414 of FIGS. 12 and 13) is disposed.

[0242] At least a portion (e.g., 7421a of FIG. 14) of the second support structure disposed between the window side (e.g., 731 of FIG. 14) and the inner side (e.g., 7121 of FIG. 14) of the side wall (e.g., 712 of FIG. 14) according to one embodiment of the present disclosure may face parallel to the inner side of the housing side wall (e.g., 7121 of FIG. 14).

[0243] At least a portion (e.g., 7421b of FIG. 15) of the second support structure disposed between the window side (e.g., 731 of FIG. 15) and the inner side of the side wall (e.g., 7121 of FIG. 15) according to one embodiment of the present disclosure may have a convex curved surface in the direction of the side wall (e.g., 711 of FIG. 15).

[0244] At least a part of the second support structure (e.g., 7421c in FIG. 16) disposed between the window side (e.g., 731 in FIG. 16) and the inner surface (7121) of the side wall according to one embodiment of the present disclosure may be in contact with the inner surface of the side wall (e.g., 7121 in FIG. 16), and an end of at least a part of the second support structure extending in the first direction (e.g., 7423c in FIG. 16) may be positioned corresponding to the outer surface of the window (e.g., 732 in FIG. 16).

[0245] According to one embodiment of the present disclosure, a portion of an inner surface (e.g., 7121b of FIG. 17) of the side wall (e.g., 712b of FIG. 17) includes a recess (e.g., 7122b of FIG. 17) in an opposite direction to the inner surface (e.g., 7121b of FIG. 17), and at least a portion (e.g., 7421d of FIG. 17) of the second support structure disposed between the window side surface (e.g., 731 of FIG. 17) and the inner surface (e.g., 712b of FIG. 17) of the side wall may include a protrusion (e.g., 7424d of FIG. 17) disposed in the recess (e.g., 7121b of FIG. 17) of the side wall.

[0246] According to one embodiment of the present disclosure, the second support structure (e.g., 442 of FIGS. 6 to 9) may be disposed on at least a portion of the surface of the waterproof member (e.g., 450 of FIGS. 6 to 9).

[0247] According to one embodiment of the present disclosure, the first support structure (741c) includes an extension (e.g., 7413c of FIG. 18) extending between a side surface (e.g., 731 of FIG. 18) of the window (e.g., 730 of FIG. 18) and an inner surface (e.g., 7111 of FIG. 18) of the side wall (e.g., 711 of FIG. 18), and at least a portion of the second support structure (e.g., 742e of FIG. 18) may be disposed between the extension (e.g., 7413c of FIG. 18) and the inner surface (e.g., 7111 of FIG. 18) of the side wall.

[0248] According to one embodiment of the present disclosure, the hardness of the first support structure (e.g., 441 of FIGS. 6 to 9) may be configured to be 70 (Shore D) or more and 85 (Shore D) or less, and the hardness of the second support structure (e.g., 442 of FIGS. 6 to 9) may be configured to be 40 (Shore D) or more and 60 (Shore D) or less.

[0249] According to one embodiment of the present disclosure, the first support structure (e.g., 441 of FIGS. 6 to 9) or the second support structure (e.g., 442 of FIGS. 6 to 9) may include an adhesive material.

[0250] According to one embodiment of the present disclosure, the first support structure (e.g., 441 of FIGS. 6 to 9) may include a first portion (e.g., 4411 of FIGS. 6 to 9) and a second portion (e.g., 4412 of FIGS. 6 to 9) extending from the first portion, and the second portion (e.g., 4412 of FIGS. 6 to 9) may be in contact with a side surface of the display (e.g., 420 of FIGS. 6 to 9) and may be positioned below the window (e.g., 430 of FIGS. 6 to 9), and the first portion (e.g., 4411 of FIGS. 6 to 9) may be positioned below the waterproof member (e.g., 450 of FIGS. 6 to 9) and a portion of the display (e.g., 420 of FIGS. 6 to 9).

[0251] A method for manufacturing an electronic device according to one embodiment of the present disclosure may include a process (e.g., 810 of FIG. 19) of combining a display (e.g., 820 of FIG. 20) and a window (e.g., 830 of FIG. 20) of the electronic device (e.g., 401 of FIGS. 6 to 9) with a component (e.g., 801 of FIG. 20), a mold base (e.g., 802 of FIG. 20), and a first mold cap (e.g., 803 of FIG. 20).

[0252] A method for manufacturing an electronic device (e.g., 401 of FIGS. 6 to 9) according to one embodiment of the present disclosure may include a process of applying a first molding liquid (e.g., 821 of FIG. 20) to a space (e.g., 8031 ​​of FIG. 20) between a component (e.g., 801 of FIG. 20) in which a display (e.g., 820 of FIGS. 6 to 9) and a window (e.g., 830 of FIG. 20) are combined through the first mold cap (e.g., 803 of FIG. 20) and the first mold cap (e.g., 803 of FIG. 20), and then semi-curing the first molding liquid (e.g., 821 of FIG. 20) (e.g., 820 of FIG. 19).

[0253] A method for manufacturing an electronic device (e.g., 401 of FIGS. 6 to 9) according to one embodiment of the present disclosure includes removing the first mold cap (e.g., 803 of FIG. 20) and combining a second mold cap (e.g., 804 of FIG. 20), and then applying the semi-cured first molding liquid (e.g., 821 of FIG. 20) through the second mold cap (e.g., 804 of FIG. 20) to a display (e.g., 820 of FIG. 20) and a window (e.g., 830 of FIG. 20) to which the semi-cured first molding liquid (e.g., 821 of FIG. 20) is combined, and applying a second molding liquid (e.g., 822 of FIG. 20) having a lower hardness than the first molding liquid (e.g., 821 of FIG. 20) to the space between the second mold cap (e.g., 804 of FIG. 20) and the semi-cured first molding liquid (e.g., 821 of FIG. 20). It may include a process (830) of applying along the outer surface (e.g., 8211 of FIG. 20).

[0254] A method for manufacturing an electronic device (e.g., 401 of FIGS. 6 to 9) according to one embodiment of the present disclosure may heat-cure (830) the first molding liquid (e.g., 821 of FIG. 20) and the second molding liquid (e.g., 822 of FIG. 20).

[0255] A method for manufacturing an electronic device (e.g., 401 of FIGS. 6 to 9) according to one embodiment of the present disclosure may include a process (850) of cooling the first molding liquid (e.g., 821 of FIG. 20) and the second molding liquid (e.g., 831 of FIG. 20), and then disassembling a part (e.g., 801 of FIG. 20) in which the display (e.g., 820 of FIG. 20) and the window (e.g., 830 of FIG. 20) to which the first molding liquid (e.g., 821 of FIG. 20) and the second molding liquid (e.g., 831 of FIG. 20) are applied, the mold base (e.g., 802 of FIG. 20), and the second mold cap (e.g., 804 of FIG. 20) are combined.

[0256] An electronic device (e.g., 401 of FIGS. 6 to 9 ) according to one embodiment of the present disclosure may include a first support structure (e.g., 441 of FIGS. 6 to 9 ) and a second support structure (e.g., 442 of FIGS. 6 to 9 ) disposed along an edge of the display (e.g., 460 of FIGS. 6 to 9 ).

[0257] According to one embodiment of the present disclosure, the first support structure (e.g., 441 of FIGS. 6 to 9) may include a first portion (e.g., 4411 of FIGS. 6 to 9) and a second support structure (e.g., 4412 of FIGS. 6 to 9) arranged corresponding to the display (e.g., 420 of FIGS. 6 to 9).

[0258] The second support structure (e.g., 442 of FIGS. 6 to 9) according to one embodiment of the present disclosure may include a third portion (e.g., 4421 of FIGS. 6 to 9) disposed on one side of the window (e.g., 430 of FIGS. 6 to 9) and a fourth portion (e.g., 4422 of FIGS. 6 to 9) extending from the third portion (e.g., 4421 of FIGS. 6 to 9) and disposed corresponding to the window (e.g., 430 of FIGS. 6 to 9).

[0259] According to one embodiment of the present disclosure, the outer surface of the third portion (e.g., 4421 of FIGS. 6 to 9) may be parallel to the inner surface of the side wall (e.g., 4121 of FIGS. 6 to 9) or may be a convex curved surface in the direction of the housing side wall.

[0260] According to one embodiment of the present disclosure, the third portion (e.g., 7421c of 16) may be in contact with the inner surface of the side wall (e.g., 7121 of FIG. 16), and an end (e.g., 7423c of FIG. 16) of the third portion (e.g., 7421c of 16) extending in the first direction may be positioned corresponding to the outer surface of the window (e.g., 731 of FIG. 16).

[0261] According to one embodiment of the present disclosure, a portion of the inner surface (e.g., 7121b of FIG. 17) of the side wall may include a recess (e.g., 7122b of FIG. 17) in a direction opposite to the inner surface, and a portion of the third portion (e.g., 7421d of FIG. 79) may include a protrusion (e.g., 7424d of FIG. 17) disposed in the recess (e.g., 7122b of FIG. 19) of the inner surface (e.g., 7121 of FIG. 17) of the side wall.

[0262] According to one embodiment of the present disclosure, the outer surface of the second portion (e.g., 5313 of FIG. 11) may include at least one recess (e.g., 5423 of FIG. 11), and may include a protrusion (e.g., 5423 of FIG. 11) that protrudes from at least a portion of the fourth portion (e.g., 5421 of FIG. 11) and is positioned in the recess (e.g., 5414 of FIG. 11) of the first portion (e.g., 5411 of FIG. 11).

[0263] Although the detailed description of the present disclosure has described specific embodiments, it will be apparent to those skilled in the art that various modifications are possible without departing from the scope of the present disclosure.

Claims

1. In electronic devices (401; 501; 601; 701), A housing (410) comprising a window (430) facing a first direction, a rear plate (411) facing a second direction opposite to the first direction, and side walls (412; 512; 612; 712; 712b) facing a third direction different from the first direction and the second direction and surrounding an internal space between the window and the rear plate; A display (420) covered by the above window (430); A waterproof member (450) disposed between the rear plate and the display (420); and It includes a support structure (440; 540; 640; 740a; 740b; 740c; 740d; 740e) arranged in the internal space of the housing (410), The above support structure is, A first support structure (441; 541; 641; 741a; 741b; 741c) disposed on the waterproof member (450) along the edge (460) of the display (420), and A second support structure (442, 542, 642, 742a; 742b; 742c; 742d; 742e) comprising at least a portion (4421; 5421; 6421; 7421a; 7421b; 7421c; 7421d; 7421e) disposed between the side surface (431; 531; 631; 731) of the window (430) and the inner surface (4121; 5121; 6121; 7121; 7121b) of the side wall, An electronic device (401) in which the hardness of the first support structure (441) is higher than the hardness of the second support structure (442).

2. In paragraph 1, The second support structure (442) is an electronic device (401) arranged along the edge (460) of the display.

3. In paragraph 1 or 2, The above first support structure (441; 442; 642) includes an outer surface (4413; 5413; 6413) facing the side wall (412; 512; 612), An electronic device (401) wherein at least a portion (4421; 5421; 5422) of the second support structure (442; 542; 642) is disposed between the outer surface of the first support structure and the side wall.

4. In paragraph 3, The first support structure (541) includes a recess (5414) on a portion of the outer surface (5413) of the first support structure (541), The above second support structure (542) An electronic device (501) comprising a protrusion (5423) protruding from a portion of the second support structure and positioned in the recess.

5. In paragraph 3, The first support structure (641) includes a protrusion (6414) facing the second support structure (642) on at least a portion of the outer surface (6413) of the first support structure, The second support structure (642) is an electronic device (601) including a recess (6423) in which the protrusion (6414) is arranged.

6. In any one of paragraphs 1 to 5, An electronic device (701) in which at least a portion of the second support structure (742a) disposed between the side surface (731) of the window (730) and the inner surface (7121) of the side wall (712) faces parallel to the inner surface (7121) of the side wall (712).

7. In any one of paragraphs 1 to 5, An electronic device (701) in which at least a portion of the second support structure (742b) disposed between the side surface of the window (730) and the inner surface (7121) of the side wall (712) includes a convex curved surface toward the side wall (712).

8. In any one of paragraphs 1 to 5, At least a part of the second support structure (742c) disposed between the side surface (731) of the window (730) and the inner surface (7121) of the side wall (712) is in contact with the inner surface (7121) of the side wall (712), An electronic device (701) in which at least a portion of an end (7423c) of the second support structure (742c) extending in the first direction is positioned corresponding to an outer surface (732) of the window (730).

9. In any one of paragraphs 1 to 5, A portion of the inner surface (7121b) of the side wall (712b) includes a recess (7122b) in the opposite direction to the inner surface, An electronic device (701) wherein at least a portion of the second support structure (742d) disposed between the side surface of the window (730) and the inner surface (7121b) of the side wall (712b) includes a protrusion (7424d) disposed in a recess (7122b) of the side wall.

10. In any one of paragraphs 1 to 9, The above second support structure (442) is an electronic device (701) placed on a part of the above waterproof member (450).

11. In any one of paragraphs 1 to 10, The first support structure (741c) includes an extension (7413c) extending between the side surface (731) of the window (730) and the inner surface (7121) of the side wall (712), An electronic device (701) wherein at least a portion of the second support structure (742e) is disposed between the extension (7413c) and the inner surface (7121) of the side wall (712).

12. In any one of paragraphs 1 to 11, An electronic device (401) in which the hardness of the first support structure (441) is configured to be 70 (Shore D) or more and 85 (Shore D) or less, and the hardness of the second support structure (442) is configured to be 40 (Shore D) or more and 60 (Shore D) or less.

13. In any one of paragraphs 1 to 12, An electronic device wherein at least one of the first support structure (441) or the second support structure (442) comprises an adhesive material.

14. In any one of paragraphs 1 to 13, The first support structure (441) includes a first portion (4411) and a second portion (4412) extending from the first portion, An electronic device in which the first part (4411) is positioned corresponding to the window (430) while contacting one side of the display (420), and the second part (4412) is positioned between the waterproof member (450) and the display (420).

15. In a method for manufacturing an electronic device, A bonding process (810) for bonding a part (801) in which a display (8011) and a window (8012) of the electronic device (401) are combined, a mold base (802) and a first mold cap (803); A semi-curing process (820) in which a first molding liquid (821) is applied to a space (8031) between a component (801) in which a display (8011) and a window (8012) are combined through the first mold cap (803) and the first mold cap (803) to surround a part of the display (8011), and then the first molding liquid is semi-cured; A process (830) of removing the first mold cap (803) and combining the second mold cap (804), and then applying a second mold liquid (831) having a lower hardness than the first mold liquid (821) to the space between the part (801) in which the display (8011) and the window (8012) are combined through the second mold cap (804) and the second mold cap (804) along the outer surface (8211) of the first mold liquid (821) that has been semi-hardened; A heat curing process (840) for curing the first molding liquid (821) and the second molding liquid (831) with heat at a predetermined temperature; A manufacturing method including a disassembly process (850) of disassembling a part (801) in which the display (8011) and the window (8012) to which the first molding liquid (821) and the second molding liquid (831) are applied are combined, the mold base (802), and the second mold cap (804), after cooling the first molding liquid (821) and the second molding liquid (831).

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