Flat damper, loudspeaker, electronic device, and vehicle

Abstract

A flat damper, a loudspeaker, an electronic device, and a vehicle. The flat damper comprises a conductive layer and a restoring layer, wherein the restoring layer is arranged on one side of the conductive layer in a first direction, and the restoring layer is suitable for providing a restoring force in the first direction and limiting the movement of the flat damper in a second direction, the first direction intersecting with the second direction.

Description

Planar wave, loudspeaker, electronic equipment and vehicle

[0001] This application claims priority to Chinese Patent Application No. 202421196445.7, filed with the Chinese Patent Office on May 28, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of loudspeaker technology, specifically to a planar spider, loudspeaker, electronic device, and vehicle. Background Technology

[0003] Existing planar spiders use copper foil layers to provide conductivity and restoring force for the entire speaker. However, copper foil has low restoring force, so speakers using copper foil as planar spiders cannot have too high power, because higher power will lead to increased amplitude, and eventually the insufficient extension and restoring force of the copper foil will cause the spring to break, resulting in mechanical damage to the speaker.

[0004] Therefore, existing planar spiders are only suitable for low-power speakers, and not for high-power speakers. Technical issues

[0005] The purpose of this application is to provide a planar spider, a loudspeaker, an electronic device, and a vehicle that solves the problem that existing planar spiders are not suitable for high-power loudspeakers. Technical solutions

[0006] To achieve the objectives of this application, the following technical solution is provided:

[0007] In a first aspect, this application provides a planar elastic wave, comprising:

[0008] Conductive layer;

[0009] A recovery layer is disposed on one side of the conductive layer in a first direction, the recovery layer being adapted to provide a restoring force in the first direction and to restrict the movement of the planar wave in a second direction, the first direction intersecting the second direction.

[0010] In one embodiment, the recovery layer is any one of a spring steel component, a glass fiber component, or a carbon fiber component.

[0011] In one embodiment, the dimension of the recovery layer in the first direction is d1, which satisfies: 130μm≤d1≤170μm.

[0012] In one embodiment, the conductive layer has a dimension d2 in the first direction, satisfying: 10μm≤d2≤15μm.

[0013] In one embodiment, the planar elastic wave further includes a first insulating layer disposed between the conductive layer and the recovery layer.

[0014] In one embodiment, the planar elastic wave further includes a first adhesive layer and a second adhesive layer, wherein the first adhesive layer is disposed between the recovery layer and the first insulating layer, and the second adhesive layer is disposed between the conductive layer and the first insulating layer.

[0015] In one embodiment, the planar elastic wave further includes a second insulating layer disposed on the side of the recovery layer away from the conductive layer.

[0016] In one embodiment, the planar elastic wave further includes a third adhesive layer disposed between the second insulating layer and the recovery layer.

[0017] In one embodiment, the planar elastic wave further includes a third insulating layer disposed on the side of the conductive layer away from the recovery layer.

[0018] In one embodiment, the planar elastic wave further includes a fourth adhesive layer disposed between the conductive layer and the third insulating layer.

[0019] In one embodiment, the planar elastic wave has a mounting hole that penetrates the third insulating layer and the fourth adhesive layer.

[0020] In one embodiment, the planar elastic wave further includes a conductive portion, which is received in the mounting hole and connected to the conductive layer.

[0021] In one embodiment, the planar elastic wave includes an inner ring, an outer ring, and a connecting portion. The inner ring and the outer ring are both rings connected end to end. The outer ring surrounds the inner ring, and the connecting portion connects the inner ring and the outer ring.

[0022] Secondly, this application also provides a loudspeaker, including the planar spring wave described in any one of the various embodiments of the first aspect.

[0023] Thirdly, this application also provides an electronic device including the speaker described in various embodiments of the second aspect.

[0024] Fourthly, this application also provides a vehicle including the speaker described in the various embodiments of the second aspect and / or the electronic device described in the various embodiments of the third aspect. Beneficial effects

[0025] The planar spider of this application has a stacked conductive layer and a restoring layer. The restoring layer can provide restoring force in a first direction and restrict the movement of the planar spider in a second direction. The planar spider of this application has both good conductivity and restoring force. The restoring layer ensures that the planar spider will not break due to insufficient extension and restoring force in the first direction. It can also keep the position of the planar spider and the voice coil connected to the planar spider stable in the magnetic field in the second direction, avoiding sound distortion, sound quality degradation and additional noise. This allows the planar spider to be used in high-power loudspeakers. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0027] Figure 1 is a side view of a planar spar wave according to an embodiment;

[0028] Figure 2 is a top view of a planar sling wave according to an embodiment.

[0029] Explanation of reference numerals in the attached drawings: 100-planar elastic wave, 10-conductive layer, 20-rebound layer, 30-first insulating layer, 31-first adhesive layer, 32-second adhesive layer, 40-second insulating layer, 41-third adhesive layer, 50-third insulating layer, 51-fourth adhesive layer, 60-conductive part, 70-inner ring, 80-outer ring, 90-connecting part. Embodiments of the present invention

[0030] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0031] It should be noted that when a component is said to be "fixed" to another component, it can be directly on the other component or it can be in a middle component. When a component is said to be "connected" to another component, it can be directly connected to the other component or it may be in a middle component.

[0032] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. The terminology used in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used in this application includes any and all combinations of one or more of the associated listed items.

[0033] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0034] Existing loudspeakers consist of a planar spider, a diaphragm, and a voice coil. The planar spider connects the diaphragm and voice coil, providing stable support for both. When the voice coil moves in a magnetic field driven by an electric current, the planar spider ensures that the diaphragm vibrates in sync with the voice coil's movement. The voice coil's vibration drives the diaphragm to vibrate, which in turn compresses air to generate sound waves. Simultaneously, the planar spider must provide the necessary restoring force to the diaphragm, allowing it to quickly return to its initial position after the voice coil stops moving. The planar spider also prevents the voice coil from contacting magnets or other components during vibration.

[0035] In one embodiment, the loudspeaker further includes a magnetic circuit system, which includes a magnet, a magnetic guide plate, and a field core column. The magnet, the magnetic guide plate, and the field core column work together to make the magnetic field distribution of the magnetic circuit system uniform, so that the voice coil can vibrate smoothly.

[0036] Optionally, the loudspeaker can be a cone type, horn type, dome type, etc., without restriction.

[0037] Existing planar spiders typically use a single layer of copper foil to provide conductivity and restoring force for the entire speaker. Because copper foil has low restoring force, speakers made using this planar spider cannot have high power output. High-power speakers would experience increased amplitude, ultimately leading to spider breakage due to insufficient copper foil elongation and restoring force, causing mechanical damage to the speaker. Therefore, existing planar spiders are only suitable for low-power speakers and not for high-power speakers.

[0038] Referring to Figure 1, this application provides a planar elastic wave 100, including a conductive layer 10 and a recovery layer 20. The recovery layer 20 is disposed on one side of the conductive layer 10 in a first direction, and the recovery layer 20 is adapted to provide a restoring force in the first direction and restrict the movement of the planar elastic wave 100 in a second direction, wherein the first direction intersects the second direction.

[0039] The conductive layer 10 can be a metal component; specifically, it can be made of copper, copper alloy, silver, aluminum alloy, etc., without limitation. The conductive layer 10 provides electromagnetic shielding for the planar spider 100, helping to reduce or eliminate the impact of electromagnetic interference on speaker performance and ensuring pure audio signal transmission. Furthermore, using the conductive layer 10 eliminates the need for filament wire, significantly reducing the speaker's thickness, preventing speaker malfunction due to filament wire breakage, extending product lifespan, and optimizing the manufacturing process.

[0040] Optionally, the conductive layer 10 and the recovery layer 20 have the same orthographic projection in the first direction.

[0041] Specifically, restricting the movement of the planar wave 100 in the second direction can be done by preventing the planar wave 100 from displacing in the second direction, or by minimizing the displacement of the planar wave 100 in the second direction.

[0042] The planar spider 100 of this application has a stacked conductive layer 10 and a restoring layer 20. The restoring layer 20 can provide a restoring force in a first direction and restrict the movement of the planar spider 100 in a second direction. The planar spider 100 of this application has both good conductivity and restoring force. The restoring layer 20 prevents the planar spider 100 from breaking due to insufficient extension and restoring force in the first direction. It can also keep the position of the planar spider 100 and the voice coil connected to the planar spider 100 stable in the magnetic field in the second direction, avoiding sound distortion, sound quality degradation and additional noise. This allows the planar spider 100 to be applied to high-power loudspeakers.

[0043] In one embodiment, the recovery layer 20 is any one of a spring steel component, a glass fiber component, or a carbon fiber component.

[0044] Specifically, the main component material of the spring steel component is 65Mn. The tensile strength of 65Mn is a1, which satisfies: a1≥980MPa. The yield strength of 65Mn is b1, which satisfies: b1≥740MPa.

[0045] Specifically, the main constituent materials of carbon fiber components can be one-dimensional carbon fiber and / or two-dimensional carbon fiber, as well as resin-based materials as the matrix. The tensile strength of carbon fiber is a2, which satisfies: a2≥1600MPa, and the yield strength of carbon fiber is b2, which satisfies: b2≥1000MPa.

[0046] Specifically, the tensile strength of the glass fiber is a3, which satisfies: a3≥1000MPa, and the yield strength of the glass fiber is b3, which satisfies: b3≥1000MPa.

[0047] Using materials with good tensile and yield strength, such as spring steel, glass fiber, and carbon fiber, as the recovery layer 20, the recovery layer 20 has good restoring force in the first direction. This allows the planar spider 100 to drive the diaphragm of the loudspeaker to quickly return to its initial position after the voice coil stops moving. At the same time, it can also prevent the planar spider 100 from breaking due to insufficient extension and restoring force.

[0048] Referring to Figure 1, in one embodiment, the size of the recovery layer 20 in the first direction is d1, which satisfies: 130μm≤d1≤170μm.

[0049] Optionally, d1 can be 130μm, 140μm, 150μm, 160μm, 170μm, etc., without restriction.

[0050] When d1 < 130 μm, the thickness of the recovery layer 20 is too thin, and the recovery force of the recovery layer 20 is insufficient to support the recovery layer 20 in driving the rest of the planar elastic wave 100 to return to its initial position in the first direction; when d1 > 170 μm, the thickness of the recovery layer 20 is sufficient to meet the recovery force requirement, and an excessively thick recovery layer 20 will lead to material waste; when 130 μm ≤ d1 ≤ 170 μm, the thickness of the recovery layer 20 is moderate and can provide sufficient recovery force.

[0051] Optionally, the size of the recovery layer 20 in the first direction can be adjusted according to the actual situation. The size of the recovery layer 20 of the planar spider 100 of a high-power loudspeaker is larger than the size of the recovery layer 20 of the planar spider 100 of a low-power loudspeaker (e.g., less than 1 watt), because a larger d1 recovery layer 20 can withstand greater vibration.

[0052] Referring to Figure 1, in one embodiment, the conductive layer 10 has a dimension d2 in the first direction, which satisfies: 10μm≤d2≤15μm.

[0053] Optionally, d2 can be 10μm, 11μm, 12μm, 13μm, 14μm, 15μm, etc., without restriction.

[0054] When d2 < 10 μm, the structural strength of the conductive layer 10 is too low, which may lead to breakage during vibration recovery. When d2 > 15 μm, the conductive layer 10 is too thick, which increases the overall weight and cost of the planar elastic wave 100. When 10 μm ≤ d2 ≤ 15 μm, the structural strength of the conductive layer 10 can be guaranteed, and the overall weight of the planar elastic wave 100 can be reduced.

[0055] Referring to Figure 1, in one embodiment, the planar elastic wave 100 further includes a first insulating layer 30, which is disposed between the conductive layer 10 and the recovery layer 20.

[0056] The material of the first insulating layer 30 can be plastic, rubber, etc. Specifically, plastic can be polyvinyl chloride, polyethylene, polyimide, etc., without restriction.

[0057] The first insulating layer 30 has a dimension d3 in the first direction, satisfying: 10μm≤d3≤15μm. Optionally, d3 can be 10μm, 11μm, 12μm, 13μm, 14μm, 15μm, etc., without limitation.

[0058] The first insulating layer 30 is provided to prevent electrical connection between the conductive layer 10 and the recovery layer 20, which would otherwise impair the speaker's performance.

[0059] Referring to Figure 1, in one embodiment, the planar elastic wave 100 further includes a first adhesive layer 31 and a second adhesive layer 32. The first adhesive layer 31 is disposed between the recovery layer 20 and the first insulating layer 30, and the second adhesive layer 32 is disposed between the conductive layer 10 and the first insulating layer 30.

[0060] Optionally, the materials of the first adhesive layer 31 and the second adhesive layer 32 can be resin, rubber, curing agent, etc., without limitation. Specifically, the material of the first insulating layer 30 is polyimide. The polyimide can form a partially cross-linked structure with the first adhesive layer 31 and the second adhesive layer 32, which is beneficial to improving the bonding strength between the first insulating layer 30 and the first adhesive layer 31 and the second adhesive layer 32, making it less likely for the planar elastic layer structure to separate as a whole, and improving the structural strength of the planar elastic wave 100.

[0061] Optionally, additional structural layers may be provided between the first adhesive layer 31 and the recovery layer 20, and / or between the first adhesive layer 31 and the first insulating layer 30, and / or between the second adhesive layer 32 and the conductive layer 10, and / or between the second adhesive layer 32 and the first insulating layer 30.

[0062] The first adhesive layer 31 has a dimension d4 in the first direction, satisfying: 20μm≤d4≤30μm. Optionally, d4 can be 20μm, 22μm, 25μm, 28μm, 30μm, etc., without limitation.

[0063] The second adhesive layer 32 has a dimension d5 in the first direction, satisfying: 10μm≤d5≤15μm. Optionally, d5 can be 10μm, 11μm, 12μm, 13μm, 14μm, 15μm, etc., without limitation.

[0064] Since the size of the recovery layer 20 is larger than that of the conductive layer 10 in the first direction, the size of the first adhesive layer 31 needs to be larger to provide sufficient adhesive force, which is beneficial to improving the structural stability of the planar elastic wave 100.

[0065] Referring to Figure 1, in one embodiment, the planar elastic wave 100 further includes a second insulating layer 40, which is disposed on the side of the recovery layer 20 away from the conductive layer 10.

[0066] The material of the second insulating layer 40 can be plastic, rubber, etc. Specifically, plastic can be polyvinyl chloride, polyethylene, polyimide, etc., without limitation.

[0067] The second insulating layer 40 has a dimension d6 in the first direction, satisfying: 20μm≤d6≤30μm. Optionally, d6 can be 20μm, 22μm, 25μm, 28μm, 30μm, etc., without limitation.

[0068] The second insulating layer 40 is provided to achieve insulation between the recovery layer 20 and the outside world and to prevent oxidation of the recovery layer 20, thereby improving the service life of the recovery layer 20.

[0069] Referring to Figure 1, in one embodiment, the planar elastic wave 100 further includes a third adhesive layer 41, which is disposed between the second insulating layer 40 and the recovery layer 20.

[0070] The third adhesive layer 41 has a dimension d7 in the first direction, satisfying: 20μm≤d7≤30μm. Optionally, d7 can be 20μm, 22μm, 25μm, 28μm, 30μm, etc., without limitation.

[0071] The third adhesive layer 41 is provided to ensure that the second insulating layer 40 effectively protects the recovery layer 20 from oxidation and provides insulation, thereby improving the service life of the planar elastic wave 100.

[0072] Referring to Figure 1, in one embodiment, the planar elastic wave 100 further includes a third insulating layer 50, which is disposed on the side of the conductive layer 10 away from the recovery layer 20.

[0073] The third insulating layer 50 has a dimension d8 in the first direction, satisfying: 20μm≤d8≤30μm. Optionally, d6 can be 20μm, 22μm, 25μm, 28μm, 30μm, etc., without limitation.

[0074] The third insulating layer 50 is suitable for insulating the conductive layer 10 from the outside world and preventing the conductive layer 10 from oxidizing, thereby improving the service life of the conductive layer 10.

[0075] Referring to Figure 1, in one embodiment, the planar elastic wave 100 further includes a fourth adhesive layer 51, which is disposed between the conductive layer 10 and the third insulating layer 50.

[0076] The fourth adhesive layer 51 has a dimension d9 in the first direction, satisfying: 20μm≤d9≤30μm. Optionally, d9 can be 20μm, 22μm, 25μm, 28μm, 30μm, etc., without limitation.

[0077] The fourth adhesive layer 51 is provided to fix the third insulating layer 50 and the conductive layer 10 relative to each other, so that the third insulating layer 50 can insulate the conductive layer 10 from the outside world, while preventing the conductive layer 10 from oxidizing, improving the service life of the conductive layer 10 and the planar spider 100, which is beneficial to the use of the loudspeaker.

[0078] In one embodiment, the planar elastic wave 100 has a mounting hole that penetrates the third insulating layer 50 and the fourth adhesive layer 51.

[0079] There may be one or more mounting holes, with multiple mounting holes spaced apart. The shape of the mounting holes can be circular, rectangular, elliptical, etc., without restriction.

[0080] During the assembly of the planar elastic wave 100, mounting holes can be made on the third insulating layer 50 before the third insulating layer 50, the fourth adhesive layer 51, and the conductive layer 10 are installed. Alternatively, mounting holes can be made on the third insulating layer 50 and the fourth adhesive layer 51 after the installation of the third insulating layer 50, the fourth adhesive layer 51, and the conductive layer 10 is completed. There are no restrictions.

[0081] Referring to Figure 2, in one embodiment, the planar elastic wave 100 further includes a conductive part 60, which is received in a mounting hole and connected to the conductive layer 10.

[0082] The conductive part 60 is connected to the conductive layer 10 by welding. The conductive part 60 is a conductive component. Specifically, the material of the conductive part 60 can be tin-based, silver-based, aluminum, stainless steel, nickel-based, etc., without limitation.

[0083] The conductive part 60 is electrically connected to the conductive layer 10, indirectly realizing the electrical connection between the planar spider 100 and the voice coil of the loudspeaker, thereby realizing the transduction and control of the electrical signal of the voice coil.

[0084] Referring to Figure 2, in one embodiment, the planar elastic wave 100 includes an inner ring 70, an outer ring 80, and a connecting portion 90. The inner ring 70 and the outer ring 80 are both rings connected end to end. The outer ring 80 surrounds the inner ring 70, and the connecting portion 90 connects the inner ring 70 and the outer ring 80.

[0085] Optionally, there may be one or more inner rings 70. Multiple inner rings 70 may be spaced apart, or two adjacent inner rings 70 may be connected by a connecting part 90.

[0086] The inner ring 70 is suitable for connection with the voice coil, controlling the movement of the voice coil, ensuring that the voice coil can maintain a stable position and orientation during vibration, and effectively transmitting the vibration generated by the voice coil to the diaphragm of the loudspeaker, thereby ensuring the generation and propagation of sound.

[0087] Optionally, the loudspeaker also includes a frame, which is suitable for supporting and protecting the planar spider 100, voice coil, diaphragm, etc., while preventing foreign objects from falling into the magnetic gap and ensuring that sound can be effectively transmitted into the air. The frame can be made of sheet metal, cast aluminum, plastic, etc., without limitation. The outer ring 80, located away from the outer periphery of the inner ring 70, is suitable for connection with the frame, which helps to improve the structural stability of the loudspeaker.

[0088] The connecting part 90 can be straight or curved, such as in an "S" shape or a wave shape, without limitation. Multiple connecting parts 90 can connect the same inner ring 70 and outer ring 80, which is suitable for improving the connection strength between the inner ring 70 and outer ring 80 and improving the structural strength of the speaker. Multiple connecting parts 90 are spaced apart.

[0089] The inner ring 70 has a first positive and a first negative electrode, and the outer ring 80 has a second positive and a second negative electrode. The first positive and the first negative electrode are arranged in a one-to-one correspondence, and the second positive and the second negative electrode are arranged in a one-to-one correspondence. The positive and negative electrodes on the inner ring 70 and the outer ring 80 correspond to the positive and negative electrodes of the voice coil. The positions of the positive and negative electrodes on the inner ring 70 and the outer ring 80 also correspond to the conductive part 60. This correspondence between the positive and negative electrodes of the inner ring 70 and the outer ring 80 and the positive and negative electrodes of the voice coil ensures that the voice coil vibrates in a preset direction, guaranteeing the sound quality and performance of the loudspeaker.

[0090] The planar spider 100 of this application can provide positioning for the voice coil, and the restoring layer 20 of the planar spider 100 can provide a restoring force for the voice coil in the first direction, enabling the voice coil to return to its initial position after stopping its movement in the first direction. Furthermore, the speaker using the planar spider 100 of this application conducts electricity through the planar spider 100, avoiding the use of nylon wire, thereby greatly reducing the speaker's thickness, preventing speaker loss due to nylon wire breakage, extending product lifespan, and optimizing the product manufacturing process.

[0091] This application provides an electronic device including a speaker as described in any of the foregoing embodiments. Specifically, the electronic device may be an audio system, a mobile phone, a computer, a television, etc., and is not limited thereto.

[0092] This application provides a vehicle including a speaker as described in any of the foregoing embodiments and / or an electronic device as described in any of the foregoing embodiments. The vehicle may have a speaker directly installed, and / or an electronic device including a speaker as described in any of the foregoing embodiments may be installed in the vehicle. Specifically, the vehicle may have a speaker and an in-vehicle tablet computer with a speaker.

[0093] In the description of the embodiments of this application, it should be noted that the orientation or positional relationship of the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and other indicators are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0094] The above-disclosed embodiments are merely preferred embodiments of this application and should not be construed as limiting the scope of this application. Those skilled in the art will understand that all or part of the processes for implementing the above embodiments and equivalent variations made in accordance with the claims of this application are still within the scope of this application.

Claims

1. A planar elastic wave, wherein, include: Conductive layer; and A recovery layer is disposed on one side of the conductive layer in a first direction, the recovery layer being adapted to provide a restoring force in the first direction and to restrict the movement of the planar wave in a second direction, the first direction intersecting the second direction.

2. The planar elastic wave according to claim 1, wherein, The recovery layer can be any of a spring steel component, a glass fiber component, or a carbon fiber component.

3. The planar elastic wave according to claim 1, wherein, The dimension of the recovery layer in the first direction is d1, which satisfies: 130μm≤d1≤170μm.

4. The planar elastic wave according to claim 1, wherein, The conductive layer has a dimension d2 in the first direction, which satisfies: 10μm≤d2≤15μm.

5. The planar elastic wave according to any one of claims 1 to 4, wherein, The planar elastic wave further includes a first insulating layer disposed between the conductive layer and the recovery layer.

6. The planar elastic wave according to claim 5, wherein, The first insulating layer has a dimension d3 in the first direction, which satisfies: 10μm≤d3≤15μm.

7. The planar elastic wave according to claim 5, wherein, The planar elastic wave further includes a first adhesive layer and a second adhesive layer, wherein the first adhesive layer is disposed between the recovery layer and the first insulating layer, and the second adhesive layer is disposed between the conductive layer and the first insulating layer.

8. The planar elastic wave according to claim 7, wherein, The first adhesive layer has a dimension d4 in the first direction, satisfying: 20μm≤d4≤30μm; and / or The second adhesive layer has a dimension d5 in the first direction, which satisfies: 10μm≤d5≤15μm.

9. The planar elastic wave according to claim 7, wherein, The first insulating layer is a polyimide layer, and a partially cross-linked structure can be formed between the first insulating layer, the first adhesive layer, and the second adhesive layer.

10. The planar elastic wave according to any one of claims 1 to 9, wherein, The planar elastic wave further includes a second insulating layer, which is disposed on the side of the recovery layer away from the conductive layer.

11. The planar elastic wave according to claim 7, wherein, The planar elastic wave further includes a third adhesive layer, which is disposed between the second insulating layer and the recovery layer; and / or The second insulating layer has a dimension of d6 in the first direction, which satisfies: 20μm≤d6≤30μm.

12. The planar elastic wave according to any one of claims 1 to 11, wherein, The planar elastic wave also includes a third insulating layer, which is disposed on the side of the conductive layer away from the recovery layer.

13. The planar elastic wave according to claim 12, wherein, The planar elastic wave further includes a fourth adhesive layer, which is disposed between the conductive layer and the third insulating layer; and / or The third insulating layer has a dimension d8 in the first direction, which satisfies: 20μm≤d8≤30μm.

14. The planar elastic wave according to claim 13, wherein, The planar elastic wave has mounting holes that penetrate the third insulating layer and the fourth adhesive layer; and / or The fourth adhesive layer has a dimension d9 in the first direction, which satisfies: 20μm≤d9≤30μm.

15. The planar elastic wave according to claim 14, wherein, The planar elastic wave also includes a conductive part, which is housed in the mounting hole and connected to the conductive layer.

16. The planar elastic wave according to claim 15, wherein, The conductive part is connected to the conductive layer by welding.

17. The planar elastic wave according to any one of claims 1 to 16, wherein, The planar elastic wave includes an inner ring, an outer ring, and a connecting part. The inner ring and the outer ring are both rings connected end to end. The outer ring surrounds the inner ring, and the connecting part connects the inner ring and the outer ring.

18. A loudspeaker, wherein, The loudspeaker includes a planar spider as described in any one of claims 1 to 17.

19. An electronic device, wherein, The electronic device includes the speaker as described in claim 18.

20. A vehicle including the electronic equipment of claim 19, wherein, The vehicle includes the electronic equipment as described in claim 19.

Images