Tactile feedback device and electronic device

Abstract

The present application relates to the technical field of electronics. Disclosed are a tactile feedback device and an electronic device. The tactile feedback device comprises a housing, a vibration assembly and a vibration transmission assembly, wherein the vibration assembly comprises a mounting member and a piezoelectric ceramic member which are arranged on the housing, the mounting member wrapping around the piezoelectric ceramic member and being capable of vibrating along with deformation of the piezoelectric ceramic member, and the toughness of the mounting member being greater than that of the piezoelectric ceramic member; and the vibration transmission assembly is arranged on the housing and abuts against the mounting member, and a touch portion is provided at the end of the vibration transmission assembly that faces away from the mounting member.

Description

haptic feedback devices and electronic devices

[0001] This application claims priority to Chinese Patent Application No. 202410700967.4, filed with the Chinese Patent Office on May 31, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of electronic technology, and in particular to a haptic feedback device and an electronic device. Background Technology

[0003] With the development of technology, haptic feedback devices (such as touch buttons, sliding buttons, or pressing buttons) are widely used in electronic devices, such as mobile phones, tablets, computers, air conditioners, fans, and automobiles, to achieve different function controls.

[0004] Piezoelectric ceramic sheets are a crucial component in haptic feedback technology. However, in related technologies, the piezoelectric ceramic sheets in haptic feedback devices are exposed. When electronic devices are in high-humidity and high-salinity environments, external ions or water molecules can accelerate short circuits in the piezoelectric ceramic sheets, leading to their breakdown and failure. Technical issues

[0005] The main purpose of this application is to propose a tactile feedback device that aims to solve the problem of short-circuit failure of the piezoelectric ceramic sheet in the tactile feedback device under high temperature and high humidity environment, so as to improve the reliability of the tactile feedback device. Technical solutions

[0006] To achieve the above objectives, the haptic feedback device proposed in this application includes:

[0007] case;

[0008] A vibration assembly includes a mounting member disposed on the housing and a piezoelectric ceramic component. The mounting member encloses the piezoelectric ceramic component and can vibrate in response to the deformation of the piezoelectric ceramic component. The mounting member has a toughness greater than that of the piezoelectric ceramic component.

[0009] A vibration transmission component is disposed on the housing and abuts against the mounting member, and a touch part is provided at the end of the vibration transmission component away from the mounting member.

[0010] In one embodiment of this application, the mounting component is a circuit board, and the piezoelectric ceramic component is embedded in the circuit board and electrically connected to the circuit board.

[0011] In one embodiment of this application, the circuit board includes:

[0012] Two fixed ends are fixedly connected to the housing; and

[0013] A vibrating part is connected between the two fixed ends; the piezoelectric ceramic component is built into the vibrating part, and the end of the vibration transmission assembly facing away from the touch part abuts against the vibrating part.

[0014] In one embodiment of this application, the vibration unit includes a matching layer and a wrapping layer disposed on both sides of the piezoelectric ceramic part in the thickness direction. The matching layer is located between the piezoelectric ceramic part and the vibration transmission component, and the wrapping layer is located on the side of the piezoelectric ceramic part away from the vibration transmission component.

[0015] In one embodiment of this application, the material of the matching layer is the same as the material of the wrapping layer, and the thickness of the matching layer is greater than the thickness of the wrapping layer.

[0016] In one embodiment of this application, the piezoelectric ceramic element is a sheet structure, the thickness of the piezoelectric ceramic element is H1, and the thickness of the coating layer is H2, satisfying: H1≥3H2.

[0017] In one embodiment of this application, the thickness of the piezoelectric ceramic element is H1, and the thickness of the matching layer is H3, satisfying: 2H1≤H3≤3H1.

[0018] In one embodiment of this application, the thickness of the matching layer is the same as the thickness of the wrapping layer, and the material of the matching layer is different from the material of the wrapping layer.

[0019] In one embodiment of this application, the thickness of the vibrating part is H4, and the thickness of the fixed end is H5, satisfying: H4>H5.

[0020] In one embodiment of this application, the mounting component has a closed mounting cavity, and the piezoelectric ceramic component is disposed within the mounting cavity;

[0021] The piezoelectric ceramic component has gaps between its two ends in the longitudinal direction and the cavity walls corresponding to the mounting cavity.

[0022] In one embodiment of this application, the vibration component is integrally formed.

[0023] In one embodiment of this application, the vibration transmission component includes:

[0024] A button is provided on the housing, the button having a touch portion, the touch portion being exposed on the outer surface of the housing; and

[0025] The vibration transmission block has one end connected to the end of the button away from the touch part, and the other end connected to the middle of the mounting component.

[0026] In one embodiment of this application, a waterproof sealing layer is provided between the button and the housing;

[0027] And / or, a waterproof sealing layer is provided between the mounting component and the housing.

[0028] To achieve the above objectives, this application also provides an electronic device including the aforementioned haptic feedback device. Beneficial effects

[0029] In the haptic feedback device of this application, a vibration component and a vibration transmission component are provided on the housing. The vibration transmission component has a touch control part, allowing the user to apply pressure to the vibration transmission component through the touch control part, which then transmits the pressure to the vibration component. The piezoelectric ceramic component of the vibration component can convert mechanical signals into electrical signals to control related functions. Simultaneously, the piezoelectric ceramic component can vibrate under electric drive, and the vibration transmission component can transmit the vibration to the touch control part to achieve haptic feedback. In this embodiment, the mounting component is wrapped around the piezoelectric ceramic component and can vibrate with the deformation of the piezoelectric ceramic component, ensuring that there are no exposed parts of the piezoelectric ceramic component. Therefore, in high temperature and high humidity environments, the piezoelectric ceramic component will not come into contact with external ions or water molecules, thereby reducing the risk of short circuit failure of the piezoelectric ceramic component. In addition, the toughness of the mounting component is greater than that of the piezoelectric ceramic component. Therefore, when the haptic feedback device is dropped or impacted, the mounting component can buffer the piezoelectric ceramic component, thus reducing the risk of cracks or even breakage of the piezoelectric ceramic component. This ensures the reliability of piezoelectric ceramic components and improves the overall reliability of the haptic feedback device. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0031] Figure 1 is a schematic diagram of the structure of an embodiment of the haptic feedback device of this application;

[0032] Figure 2 is a front view of the embodiment in Figure 1;

[0033] Figure 3 is a full sectional schematic diagram of the structure of an embodiment of the haptic feedback device of this application;

[0034] Figure 4 is a schematic diagram of the structure of the vibration component in an embodiment of this application;

[0035] Figure 5 is a full cross-sectional schematic diagram of the vibration component in the embodiment of this application;

[0036] Figure 6 is a magnified view of part M in Figure 5.

[0037] Explanation of icon numbers:

[0038] Label Name 100 Housing 202 Gap 200 Vibration Component 220 Piezoelectric Ceramic Component 210 Mounting Component 300 Vibration Transmission Component 210A Circuit Board 310 Button 211 Fixed End 311 Touch Part 212 Vibration Part 320 Vibration Transmission Block 2121 Matching Layer 400 Waterproof Sealing Layer 2122 Encapsulation Layer 500 Bolt 201 Mounting Cavity

[0039] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Embodiments of the present invention

[0040] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0041] It should be noted that if the embodiments of this application involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0042] Meanwhile, the meaning of "and / or" or "and / or" appearing throughout the text is that it includes three options. Taking "A and / or B" as an example, it includes option A, option B, or an option that satisfies both A and B.

[0043] Furthermore, if the embodiments of this application involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0044] Piezoelectric ceramic sheets are a crucial component of haptic feedback technology. However, in related technologies, the piezoelectric ceramic sheets in haptic feedback devices are exposed. When electronic devices are in environments with high humidity and high salinity, external ions or water molecules can accelerate short circuits in the piezoelectric ceramic sheets, causing them to break down and fail. Furthermore, exposed ceramic sheets are prone to cracking or even breaking when the product is dropped or subjected to impact.

[0045] Based on this, this application proposes a haptic feedback device. The purpose is to protect the piezoelectric ceramic sheet from the effects of ions or water molecules in high-temperature and high-humidity environments by encapsulating it, thus preventing short-circuit failure. Simultaneously, it provides cushioning protection for the piezoelectric ceramic sheet in the event of a product drop or impact, reducing the risk of breakage and improving the reliability of the haptic feedback device. It is understood that the electronic device used in this haptic feedback device is not limited to a specific type of electronic device; for example, it could be a mobile phone, tablet, computer, air conditioner, fan, or automobile, etc. This haptic feedback device can be a press-based haptic feedback device, a slide-based haptic feedback device, or a touch-based haptic feedback device, etc.

[0046] The structure of the haptic feedback device of this application will be described below by way of an embodiment.

[0047] As shown in Figures 1 to 3, the tactile feedback device includes a housing 100, a vibration component 200, and a vibration transmission component 300.

[0048] The vibration assembly 200 includes a mounting member 210 and a piezoelectric ceramic component 220 disposed on the housing 100. The mounting member 210 encloses the piezoelectric ceramic component 220 and can vibrate with the deformation of the piezoelectric ceramic component 220. The toughness of the mounting member 210 is greater than that of the piezoelectric ceramic component 220. The vibration transmission assembly 300 is disposed on the housing 100 and abuts against the mounting member 210. A touch part 311 is provided at the end of the vibration transmission assembly 300 away from the mounting member 210.

[0049] In this embodiment, the housing 100 serves to support and install other components (such as vibration component 200, vibration transmission component 300, etc.) in the haptic feedback device. It can be understood that the housing 100 can be a component independent of the haptic feedback device, or it can be a component such as a base or casing in the electronic device to which the haptic feedback device is used, as long as it can serve the purpose of support and installation.

[0050] The vibration assembly 200 includes a mounting member 210 and a piezoelectric ceramic component 220. The mounting member 210 is mounted on the housing 100 and serves to mount the piezoelectric ceramic component 220. Since the piezoelectric ceramic component 220 is enclosed within the mounting member 210, no part of the piezoelectric ceramic component 220 is exposed. Therefore, when the haptic feedback device is in a high-temperature and high-humidity environment, the piezoelectric ceramic component 220 will not come into contact with external ions or water molecules, thereby reducing the risk of short-circuit failure. Understandably, the piezoelectric ceramic component 220 vibrates under electrical drive during operation. The mounting member 210, enclosed within the piezoelectric ceramic component 220, vibrates along with it, thus ensuring the functionality of the piezoelectric ceramic component 220 and transmitting the vibration to the vibration transmission assembly 300, from which feedback is provided to the user via the touch unit 311. By making the toughness of the mounting component 210 greater than that of the piezoelectric ceramic component 220, the mounting component 210 can absorb the impact when the haptic feedback device is dropped or subjected to an impact, thus buffering the piezoelectric ceramic component 220 and reducing the risk of cracks or even breakage of the piezoelectric ceramic component 220, thereby ensuring the reliability of the piezoelectric ceramic component 220.

[0051] In practical applications, the shape and structure of the mounting component 210 can be determined according to the actual situation, such as a plate-like structure, strip-like structure, block-like structure, or other irregular structure; the material of the mounting component 210 can also be determined according to the actual situation, such as soft rubber material, plastic material, or metal material, etc., and its specific shape, structure, and material are not limited here. In practical applications, the piezoelectric ceramic component 220 can be a sheet-like structure or a plate-like structure, etc.

[0052] The vibration transmission component 300 is disposed on the housing 100 and abuts against the mounting member 210. The end of the vibration transmission component 300 away from the mounting member 210 is provided with a touch part 311. The user can apply touch force to the vibration transmission component 300 through the touch part 311, so that the vibration transmission component 300 transmits the touch force to the mounting member 210 and the piezoelectric ceramic component 220. The piezoelectric ceramic component 220 converts the mechanical signal into an electrical signal to realize the control function related to the electronic device. At the same time, the electric drive component in the haptic feedback device can drive the piezoelectric ceramic component 220 to make corresponding vibrations, and transmit the vibrations to the touch part 311 through the vibration transmission component 300 to provide feedback to the user, thus realizing the haptic feedback function.

[0053] In practical applications, the touch portion 311 of the vibration transmission component 300 can be in the form of a press, slide, touch, or other touch control, and the specific touch control form is not limited here. The vibration transmission component 300 abuts against the mounting part 210, and it is understood that the two can be connected by compression, bonding, welding, or other connection methods.

[0054] In summary, in the haptic feedback device of this application, the housing 100 is provided with a vibration component 200 and a vibration transmission component 300. The vibration transmission component 300 has a touch control part 311. The user can apply pressure to the vibration transmission component 300 through the touch control part 311 and transmit the pressure to the vibration component 200. The piezoelectric ceramic component 220 of the vibration component 200 can convert mechanical signals into electrical signals to realize the control of related functions. At the same time, the piezoelectric ceramic component 220 can vibrate under electric drive, and the vibration transmission component 300 can transmit the vibration to the touch control part 311 to realize the haptic feedback function. In this embodiment, the mounting component 210 encloses the piezoelectric ceramic component 220 and can deform and vibrate with the piezoelectric ceramic component 220, ensuring that no part of the piezoelectric ceramic component 220 is exposed. Therefore, in high-temperature and high-humidity environments, the piezoelectric ceramic component 220 will not come into contact with external ions or water molecules, thereby reducing the risk of short-circuit failure. Furthermore, the mounting component 210 has greater toughness than the piezoelectric ceramic component 220. Therefore, when the haptic feedback device is dropped or impacted, the mounting component 210 can cushion the piezoelectric ceramic component 220, thus reducing the risk of cracks or even breakage. This ensures the reliability of the piezoelectric ceramic component 220 and improves the overall reliability of the haptic feedback device.

[0055] In one embodiment of this application, as shown in Figures 3 to 5, the mounting component 210 is a circuit board 210A, and the piezoelectric ceramic component 220 is embedded in the circuit board 210A and electrically connected to the circuit board 210A.

[0056] Understandably, the piezoelectric ceramic component 220 needs to be powered during normal operation. In this embodiment, the mounting component 210 is a circuit board 210A, that is, the piezoelectric ceramic component 220 is wrapped by the circuit board 210A, so that the piezoelectric ceramic component 220 can be directly connected to the circuit on the circuit board 210A without additional wiring operations. At the same time, there is no need to set up an additional wrapping component to wrap the piezoelectric ceramic component 220, which can reduce the number of structural components and reduce material costs.

[0057] In practical applications, the piezoelectric ceramic component 220 can be first embedded in the substrate of the circuit board 210A. Then, a copper layer and wiring are laid on the surface of the substrate to electrically connect the piezoelectric ceramic component 220 with the circuit board 210A. Finally, the piezoelectric ceramic component 220 and the circuit board 210A are molded into an integral structure using an integrated mold. Compared to manufacturing the circuit board 210A and the piezoelectric ceramic component 220 separately and requiring wiring assembly, this embodiment directly integrates the piezoelectric ceramic component 220 into the circuit board 210A, which can save assembly steps, simplify processes, improve production efficiency, and also reduce the size of the vibration component 200 and reduce the space occupied.

[0058] In one embodiment of this application, as shown in Figures 2 to 5, the circuit board 210A includes two fixed ends 211 and a vibration part 212. The two fixed ends 211 are fixedly connected to the housing 100; the vibration part 212 is connected between the two fixed ends 211; the piezoelectric ceramic component 220 is built into the vibration part 212, and the end of the vibration transmission component 300 facing away from the touch part 311 abuts against the vibration part 212.

[0059] In this embodiment, the two fixed ends 211 serve to mount the circuit board 210A to the housing 100. In one embodiment, the two fixed ends 211 can be fixed to the housing 100 by bonding, screwing, welding, or other methods. In this embodiment, considering factors such as connection reliability and ease of assembly and disassembly, the two fixed ends 211 are fixedly connected to the housing 100 by bolts 500. As an example, a waterproof sealing layer 400 can be provided at the assembly point of the bolts 500 with the housing 100 and the circuit board 210A, which can improve impact resistance and waterproof performance. At the same time, the vibration performance of the entire vibration assembly 200 can be adjusted by controlling the preload of the waterproof sealing layer 400 by the bolts 500.

[0060] The vibrating part 212 is connected between two fixed ends 211. It can be understood that the vibrating part 212 is suspended by the two fixed ends 211. The piezoelectric ceramic component 220 is built into the vibrating part 212. When the piezoelectric ceramic component 220 is deformed and vibrated by electric drive, it can drive the vibrating part 212 to vibrate together. The vibration transmission component 300 abuts against the vibrating part 212. Then the vibration of the vibrating part 212 can be fed back to the touch part 311 through the vibration transmission component 300 to realize the tactile feedback function.

[0061] Further, as shown in Figures 3 to 5, the vibration part 212 includes a matching layer 2121 and a wrapping layer 2122 respectively disposed on both sides of the piezoelectric ceramic part 220 in the thickness direction. The matching layer 2121 is located between the piezoelectric ceramic part 220 and the vibration transmission assembly 300, and the wrapping layer 2122 is located on the side of the piezoelectric ceramic part 220 away from the vibration transmission assembly 300.

[0062] Understandably, the piezoelectric ceramic component 220 is encased inside the vibrating part 212. When the piezoelectric ceramic component 220 is electrically driven, it will have driving stress inside. At the same time, the two outer sides of the piezoelectric ceramic component 220 will be subjected to different forces from the matching layer 2121 and the encapsulation layer 2122. When the forces on both sides are different, the piezoelectric ceramic component 220 will bend and deform, which will in turn cause the vibrating part 212 to bend and deform together. When the electric drive disappears, the piezoelectric ceramic component 220 will recover its deformation, which will also cause the vibrating part 212 to recover its deformation. This process repeats, thus realizing the function of the piezoelectric ceramic component 220 driving the vibrating part 212 to vibrate.

[0063] In this embodiment, the matching layer 2121 is located between the piezoelectric ceramic component 220 and the vibration transmission component 300. The matching layer 2121 and the piezoelectric ceramic component 220 have matching bending resistance. When the piezoelectric ceramic component 220 bends, it will cause the matching layer 2121 to bulge and bend towards the vibration transmission component 300. When the piezoelectric ceramic component 220 recovers its deformation, it will cause the matching layer 2121 to move away from the vibration transmission component 300, thereby realizing the function of transmitting vibration to the touch unit 311. The wrapping layer 2122 is located on the side of the piezoelectric ceramic component 220 away from the vibration transmission component 300. Its main function is to wrap and protect the piezoelectric ceramic component 220, preventing the piezoelectric ceramic component 220 from failing due to contact with ions or water molecules, and it also plays a buffering role.

[0064] It should be noted that the specific materials and thicknesses of the matching layer 2121 and the wrapping layer 2122 can be determined according to the actual situation.

[0065] In one embodiment, as shown in Figures 3 to 5, the material of the matching layer 2121 is the same as that of the wrapping layer 2122, and the thickness of the matching layer 2121 is greater than that of the wrapping layer 2122.

[0066] In this embodiment, the matching layer 2121 and the wrapping layer 2122 are made of the same material. Therefore, the piezoelectric ceramic component 220 can be bent smoothly by using a difference in thickness between the matching layer 2121 and the wrapping layer 2122. In this case, the piezoelectric ceramic component 220 is eccentrically positioned in the thickness direction of the vibrating part 212. The thickness of the matching layer 2121 is greater than the thickness of the wrapping layer 2122, and the bending resistance of the matching layer 2121 matches that of the piezoelectric ceramic component 220. The wrapping layer 2122 only needs to completely cover and wrap the piezoelectric ceramic component 220. It should be noted that the thicknesses of both the matching layer 2121 and the wrapping layer 2122 are related to the thickness of the piezoelectric ceramic component 220.

[0067] As an example, as shown in Figures 5 and 6, the thickness of the piezoelectric ceramic part 220 is H1, and the thickness of the encapsulation layer 2122 is H2, satisfying: H1≥3H2.

[0068] Understandably, the wrapping layer 2122 serves to protect the piezoelectric ceramic component 220. Therefore, the thickness H2 of the wrapping layer 2122 should not be too large. If the thickness H2 is too large, it will easily inhibit the bending range of the piezoelectric ceramic component 220, causing the piezoelectric ceramic component 220 to be unable to bend and affecting the performance of the haptic feedback device. Based on this, in this embodiment, the thickness H2 of the wrapping layer 2122 and the thickness H1 of the piezoelectric ceramic component 220 are set to satisfy H1≥3H2, so that the thickness H2 of the wrapping layer 2122 is not greater than 1 / 3 of the thickness H1 of the piezoelectric ceramic component 220, thereby ensuring the bending performance of the piezoelectric ceramic component 220 and ensuring the function of the haptic feedback device. In one embodiment, the thickness H2 of the wrapping layer 2122 is about 1 / 10 of the thickness H1 of the piezoelectric ceramic component 220, which will not affect the bending performance of the piezoelectric ceramic component 220.

[0069] As an example, as shown in Figures 5 and 6, the thickness of the piezoelectric ceramic part 220 is H1, and the thickness of the matching layer 2121 is H3, satisfying: 2H1≤H3≤3H1.

[0070] Understandably, the thickness H3 of the matching layer 2121 is related to the material of the matching layer 2121 itself. In related technologies, the substrate of the circuit board is often made of FR-4 type substrate or BT board (Bismaleimide Triazine, resin substrate). The thickness H3 of the matching layer 2121 should not be too small or too large. If it is too small, the thickness difference with the wrapping layer 2122 will be small, and the piezoelectric ceramic component 220 may not bend when deformed. If it is too large, the matching layer 2121 may not be able to bend with the piezoelectric ceramic component 220 and affect the performance of the haptic feedback device. Based on this, in this embodiment, the thickness H3 of the matching layer 2121 and the thickness H1 of the piezoelectric ceramic component 220 are set to satisfy 2H1≤H3≤3H1. In this way, the bending vibration performance of the piezoelectric ceramic component 220 and the vibration part 210 can be guaranteed, and the function of the haptic feedback device can be realized.

[0071] In one embodiment, the vibrating part 212 is a one-piece molded structure.

[0072] Of course, in some other embodiments, the thickness of the matching layer 2121 may be the same as the thickness of the wrapping layer 2122, but the materials of the matching layer 2121 and the wrapping layer 2122 may be different. In this embodiment, the piezoelectric ceramic component 220 may be centrally located in the thickness direction of the vibrating part 212, and the bending performance of the piezoelectric ceramic component 220 may be ensured by using different materials for the matching layer 2121 and the wrapping layer 2122.

[0073] In one embodiment of this application, as shown in Figures 5 and 6, the thickness of the vibrating part 212 is H4, and the thickness of the fixed end 211 is H5, satisfying: H4>H5.

[0074] Understandably, since the piezoelectric ceramic component 220 is built into the vibrating part 212, and the vibrating part 212 is suspended between the two fixed ends 211, the thickness H5 of the fixed ends 211 should not be too large or too small. If it is too large, the amplitude cannot be effectively released, and the vibration of the vibrating part 212 may be easily suppressed; if it is too small, the fixed ends 211 will be too flexible, which may cause too much energy of the piezoelectric ceramic component 220 to be converted into deformation potential energy of the fixed ends 211. Based on this, in this embodiment, the thickness H5 of the fixed ends 211 is set to be less than the thickness H4 of the vibrating part 212 and greater than the thickness H1 of the piezoelectric ceramic component 220. In one embodiment, the thickness H5 of the fixed ends 211 is equivalent to the thickness H3 of the matching layer 2121, that is, H5≈H3.

[0075] In one embodiment of this application, as shown in Figures 3 and 5, the mounting component 210 is provided with a closed mounting cavity 201, and the piezoelectric ceramic component 220 is disposed in the mounting cavity 201; the two ends of the piezoelectric ceramic component 220 in the length direction have gaps 202 between them and the cavity walls corresponding to the mounting cavity 201.

[0076] In this embodiment, the piezoelectric ceramic component 220 is embedded within the mounting cavity 201, allowing the mounting component 210 to completely enclose the piezoelectric ceramic component 220. By providing a gap 202 between the two ends of the piezoelectric ceramic component 220 in the length direction and the corresponding cavity wall of the mounting cavity 201, the piezoelectric ceramic component 220 has space for expansion and contraction in the length direction, enabling it to release its degree of freedom in the length direction during vibration and avoiding suppression of the performance release of the piezoelectric ceramic component 220.

[0077] In practical applications, soft glue can also be filled at gap 202 to serve as a barrier.

[0078] In one embodiment of this application, as shown in Figures 1 to 3, the vibration transmission assembly 300 includes a button 310 and a vibration transmission block 320. The button 310 is disposed on the housing 100 and has a touch portion 311, which is exposed on the outer surface of the housing 100. One end of the vibration transmission block 320 is connected to the end of the button 310 away from the touch portion 311, and the other end is connected to the middle of the mounting member 210.

[0079] This embodiment illustrates the structure of the vibration transmission assembly 300. The button 310 is movably mounted on the housing 100, and the touch portion 311 of the button 310 is exposed on the outer surface of the housing 100 for user touch operation. A vibration transmission block 320 is sandwiched between the button 310 and the mounting member 210, effectively and quickly transmitting pressure and vibration between them. Simultaneously, the vibration transmission block 320 is connected to the middle of the mounting member 210, placing it at the position of maximum vibration amplitude within the mounting member 210. This allows the tactile feedback device to quickly respond to user input and provide tactile feedback.

[0080] In one embodiment, the vibration transmission block 320 can be integrated with the button 310 or be separate components.

[0081] In one embodiment, a waterproof sealing layer 400 can be provided between the button 310 and the housing 100 to provide better waterproof protection and further reduce the risk of short circuit failure.

[0082] This application also proposes an electronic device including a haptic feedback device. The specific structure of the haptic feedback device is as described in the above embodiments. Since this electronic device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here. The electronic device can be a mobile phone, tablet, computer, air conditioner, fan, or car, etc.

[0083] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural transformations made based on the inventive concept of this application and the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this application.

Claims

1. A haptic feedback device, wherein, The haptic feedback device includes: case; A vibration assembly includes a mounting member disposed on the housing and a piezoelectric ceramic component. The mounting member encloses the piezoelectric ceramic component and can vibrate in response to the deformation of the piezoelectric ceramic component. The mounting member has a toughness greater than that of the piezoelectric ceramic component. A vibration transmission component is disposed on the housing and abuts against the mounting member, and a touch part is provided at the end of the vibration transmission component away from the mounting member.

2. The haptic feedback device as described in claim 1, wherein, The mounting component is a circuit board, and the piezoelectric ceramic component is embedded in the circuit board and electrically connected to the circuit board.

3. The haptic feedback device as described in claim 2, wherein, The circuit board includes: Two fixed ends are fixedly connected to the housing; and A vibrating part is connected between the two fixed ends; the piezoelectric ceramic component is built into the vibrating part, and the end of the vibration transmission assembly facing away from the touch part abuts against the vibrating part.

4. The haptic feedback device as described in claim 3, wherein, The vibration unit includes a matching layer and a wrapping layer disposed on both sides of the piezoelectric ceramic part in the thickness direction. The matching layer is located between the piezoelectric ceramic part and the vibration transmission component, and the wrapping layer is located on the side of the piezoelectric ceramic part away from the vibration transmission component.

5. The haptic feedback device as described in claim 4, wherein, The matching layer is made of the same material as the wrapping layer, and the thickness of the matching layer is greater than the thickness of the wrapping layer.

6. The haptic feedback device as claimed in claim 5, wherein, The piezoelectric ceramic component has a sheet-like structure with a thickness of H1 and a coating layer thickness of H2, satisfying the condition: H1 ≥ 3H2.

7. The haptic feedback device as claimed in claim 5, wherein, The thickness of the piezoelectric ceramic component is H1, and the thickness of the matching layer is H3, satisfying: 2H1≤H3≤3H1.

8. The haptic feedback device as claimed in claim 4, wherein, The matching layer has the same thickness as the wrapping layer, but the material of the matching layer is different from that of the wrapping layer.

9. The haptic feedback device according to any one of claims 3 to 8, wherein, The thickness of the vibrating part is H4, and the thickness of the fixed end is H5, satisfying that H4 > H5.

10. The haptic feedback device according to any one of claims 1 to 8, wherein, The mounting component has a closed mounting cavity, and the piezoelectric ceramic component is disposed within the mounting cavity; The piezoelectric ceramic component has gaps between its two ends in the longitudinal direction and the cavity walls corresponding to the mounting cavity.

11. The haptic feedback device according to any one of claims 1 to 8, wherein, The vibration component is integrally molded.

12. The haptic feedback device according to any one of claims 1 to 8, wherein, The vibration transmission component includes: A button is provided on the housing, the button having a touch portion, the touch portion being exposed on the outer surface of the housing; and The vibration transmission block has one end connected to the end of the button away from the touch part, and the other end connected to the middle of the mounting component.

13. The haptic feedback device as claimed in claim 12, wherein, A waterproof sealing layer is provided between the button and the housing; And / or, a waterproof sealing layer is provided between the mounting component and the housing.

14. An electronic device, wherein, The electronic device includes a haptic feedback device as described in any one of claims 1 to 13.

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