Server heat dissipation apparatus, and method and device for controlling heat dissipation of server

Abstract

The present application discloses a server heat dissipation apparatus, and a method and device for controlling heat dissipation of a server. The server heat dissipation apparatus is internally equipped with a controller, a radiation heat dissipation device, an electric heat dissipation device, and a heat dissipation plate; the heat dissipation plate is internally equipped with a heat dissipation plate pipe; the radiation heat dissipation device is internally equipped with a first radiation heat dissipation pipe; the electric heat dissipation device is internally equipped with a first electric heat dissipation pipe; the heat dissipation plate is in contact with a component requiring heat dissipation of a server. The controller is configured to: upon detecting that the ambient temperature is lower than or equal to a first ambient temperature, control the heat dissipation plate pipe to be communicated with the first radiation heat dissipation pipe to form a first circulation pipe; and upon detecting that the ambient temperature is greater than the first ambient temperature, control the heat dissipation plate pipe, the first radiation heat dissipation pipe and the first electric heat dissipation pipe to be communicated with each other to form a second circulation pipe. The problem in the prior art of high electric energy consumption in server heat dissipation is solved.

Description

Server cooling equipment, server cooling control methods and devices

[0001] Cross-reference of related applications

[0002] This application claims priority to Chinese Patent Application No. 202410696748.3, filed on May 31, 2024, entitled "Server Heat Dissipation Equipment, Control Method and Apparatus for Server Heat Dissipation", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of computers, and in particular to a server heat dissipation device, a method and apparatus for controlling server heat dissipation. Background Technology

[0004] Currently, in many scenarios, a large number of devices will generate massive amounts of data, and the processing of this massive amount of data has increasingly higher requirements for latency and security, posing a huge challenge to existing data centers.

[0005] To address the aforementioned issues, edge servers are currently deployed at the network edge, providing efficient and intelligent computing, storage, and network resources locally. This significantly alleviates the load on data centers and reduces data latency, and this deployment model is expected to see rapid growth in the future. However, edge servers are mostly deployed outdoors, and their structural design must meet extremely high waterproof and dustproof ratings (IP65 and above). Unlike traditional internally air-cooled servers, outdoor edge servers often employ an external heatsink combined with forced air cooling. The heat-generating chip conducts heat to the external heatsink through internal thermal protrusions, and the heat is then dissipated by an external fan. While this method effectively reduces chip temperature, the long heat conduction path results in high thermal resistance and low heat dissipation efficiency, often requiring a high-power fan to provide sufficient airflow. This undoubtedly contradicts the low overall power consumption requirement of edge servers.

[0006] There is still no effective solution to the problem of high power consumption caused by server heat dissipation in related technologies. Summary of the Invention

[0007] This application provides a server heat dissipation device, a server heat dissipation control method and apparatus, to at least solve the problem of high power consumption for server heat dissipation in related technologies.

[0008] According to a first aspect of the embodiments of this application, a server heat dissipation device is provided. The server heat dissipation device deploys a controller, a radiative heat dissipation device, an electric heat dissipation device, and a heat sink. The heat sink deploys heat sink pipes, the radiative heat dissipation device deploys a first radiative heat dissipation pipe, and the electric heat dissipation device deploys a first electric heat dissipation pipe. The heat sink is in contact with the server's components to be cooled. The controller is configured to detect the ambient temperature of the server's current environment. When the detected ambient temperature is less than or equal to a first ambient temperature, the controller controls the heat sink pipes and the first radiative heat dissipation pipes to be connected to form a first circulation pipe. When the detected ambient temperature is greater than the first ambient temperature, the controller controls the heat sink pipes, the first radiative heat dissipation pipes, and the first electric heat dissipation pipes to be connected to form a second circulation pipe. The first circulation pipe is filled with a first heat dissipation medium, and the second circulation pipe is filled with a second heat dissipation medium.

[0009] The radiative heat dissipation device is configured to dissipate heat from the first or second heat dissipation medium in the first radiative heat dissipation pipe by means of heat radiation.

[0010] The electric cooling device is configured to dissipate heat from the second cooling medium in the first electric cooling pipe by consuming electricity.

[0011] In some embodiments, the first heat dissipation medium is a mixture of the heat dissipation medium in the heat dissipation plate pipe and the heat dissipation medium in the first radiative heat dissipation pipe, and the second heat dissipation medium is a mixture of the heat dissipation medium in the heat dissipation plate pipe, the heat dissipation medium in the first radiative heat dissipation pipe, and the heat dissipation medium in the first power heat dissipation pipe.

[0012] In some embodiments, a radiant heat sink and a phase change energy storage device are deployed in the radiant heat dissipation device. The radiant heat sink is configured to reduce the heat in the third heat dissipation medium by means of heat radiation to obtain a third heat dissipation medium with a medium temperature lower than that of the first medium. The third heat dissipation medium with a medium temperature lower than that of the first medium is then transferred to the phase change energy storage device. The third heat dissipation medium with a medium temperature lower than that of the first medium is used to cool the phase change energy storage material in the phase change energy storage device.

[0013] A phase change energy storage device is configured to store phase change energy storage material, wherein the phase change energy storage material is in a first phase state when the temperature is lower than the first phase change temperature, and in a second phase state when the temperature is higher than the second phase change temperature. The temperature of the first medium is lower than the first phase change temperature, and the first phase change temperature is less than or equal to the second phase change temperature. The first phase state and the second phase state are different physical phase states of the phase change energy storage material.

[0014] In some embodiments, the radiant heat sink includes a heat dissipation medium cavity and a radiant heat dissipation material, the radiant heat dissipation material covering the heat dissipation medium cavity, wherein the heat dissipation medium cavity is configured to store a third heat dissipation medium, and wherein the thermal conductivity of the material of the heat dissipation medium cavity is greater than the first thermal conductivity.

[0015] Radiation heat dissipation material is used to convert the heat stored in the third heat dissipation medium in the heat dissipation medium cavity into energy of a preset wavelength and radiate it outward.

[0016] In some embodiments, the phase change energy storage device includes: a phase change energy storage material cavity, a first radiative heat dissipation pipe and a second radiative heat dissipation pipe, wherein the first radiative heat dissipation pipe and the second radiative heat dissipation pipe are deployed in the phase change energy storage material cavity, the phase change energy storage material cavity is configured to store phase change energy storage material, wherein the thermal conductivity of the phase change energy storage material cavity to the outside is lower than the second thermal conductivity, and the phase change energy storage material is filled outside the first radiative heat dissipation pipe and the second radiative heat dissipation pipe;

[0017] The second radiative heat dissipation pipe is configured to receive a third heat dissipation medium with a temperature lower than that of the first medium from the radiative heat sink.

[0018] In some embodiments, the electric cooling device further includes an electric radiator installed on a first electric cooling pipe, wherein the first electric cooling pipe is configured to transmit a second cooling medium in a second circulation pipe.

[0019] The electric radiator is configured to cool the second heat dissipation medium in the first electric heat dissipation pipe.

[0020] In some embodiments, the power radiator includes a first air-cooled radiator and a second power heat dissipation pipe, wherein the second power heat dissipation pipe is configured to exchange heat with the first power heat dissipation pipe.

[0021] The first air-cooled radiator is configured to convert electrical energy into wind energy to cool the second power cooling pipe.

[0022] In some embodiments, the electric radiator includes a first air conditioning radiator and a third electric radiator pipe, wherein the third electric radiator pipe is configured to exchange heat with the first electric radiator pipe.

[0023] The first air conditioning condenser is configured to use electricity to evaporate the refrigerant and cool the third electric cooling pipe.

[0024] In some embodiments, the electric heat sink includes a second air-cooled heat sink, a second air-cooled heat sink, and a fourth electric heat sink pipe, wherein the fourth electric heat sink pipe is configured to exchange heat with the first electric heat sink pipe.

[0025] The second air-cooled radiator is configured to convert electrical energy into air energy to cool the fourth power cooling pipe;

[0026] The second air conditioning condenser is configured to use electricity to evaporate the refrigerant and cool the fourth power cooling pipe.

[0027] In some embodiments, the electric radiator includes a third air-cooled radiator, a third air-cooled radiator, a fifth electric radiator pipe, and a sixth electric radiator pipe, wherein the fifth electric radiator pipe is configured to exchange heat with the first electric radiator pipe.

[0028] The sixth power cooling pipe is configured to exchange heat with the first power cooling pipe;

[0029] The third air-cooled radiator is configured to convert electrical energy into air energy to cool the fifth power cooling pipe;

[0030] The third air conditioning condenser is configured to use electricity to evaporate the refrigerant and cool the sixth power cooling pipe.

[0031] In some embodiments, a heat sink includes a heat sink substrate and heat sink pipes, wherein the heat sink pipes are disposed inside the heat sink substrate, and the heat sink contacts the server's components to be cooled through the heat sink substrate, wherein the heat sink substrate is configured to exchange heat with the components to be cooled.

[0032] The heat dissipation pipes are designed to cool the heat dissipation substrate.

[0033] In some embodiments, a heat dissipation medium cavity, a first radiative heat dissipation pipe and a second radiative heat dissipation pipe are deployed in the radiative heat dissipation device, and the electric heat dissipation device includes a first electric heat dissipation pipe and an electric radiator, wherein the first radiative liquid outlet of the first radiative heat dissipation pipe is connected to the heat dissipation liquid inlet of the heat dissipation plate pipe, and the heat dissipation liquid outlet of the heat dissipation plate pipe is connected to the first radiative liquid inlet of the first radiative heat dissipation pipe.

[0034] The second radiant outlet of the second radiant heat dissipation pipe is connected to the inlet of the heat dissipation medium cavity, and the outlet of the heat dissipation medium cavity is connected to the second radiant inlet of the second radiant heat dissipation pipe.

[0035] The first radiant liquid outlet is also connected to the power liquid inlet of the first electric heat dissipation pipe, and the heat dissipation liquid inlet is also connected to the power liquid outlet of the first electric heat dissipation pipe.

[0036] The heat dissipation medium cavity is configured as a third heat dissipation medium with a storage medium temperature lower than that of the first medium.

[0037] The electric radiator is configured to cool the second heat dissipation medium in the first electric heat dissipation pipe by consuming electricity.

[0038] In some embodiments, the first radiant outlet of the first radiant heat dissipation pipe is connected to the heat dissipation inlet of the heat dissipation plate pipe via a first solenoid valve and a first flow pump; the heat dissipation outlet of the heat dissipation plate pipe is connected to the first radiant inlet of the first radiant heat dissipation pipe via a second solenoid valve; the second radiant outlet of the second radiant heat dissipation pipe is connected to the cavity inlet of the heat dissipation medium cavity via a third solenoid valve and a second flow pump; the cavity outlet of the heat dissipation medium cavity is connected to the second radiant inlet of the second radiant heat dissipation pipe via a fourth solenoid valve; the first radiant outlet is also connected to the power inlet of the first electric heat dissipation pipe via a fifth solenoid valve; and the heat dissipation inlet is also connected to the first... An electric cooling pipe has its electric outlet connected to a sixth solenoid valve and a first flow pump. The controller is configured to, when the ambient temperature is detected to be less than or equal to a first ambient temperature, control the first, second, third, and fourth solenoid valves to open, forming a first circulation pipe, and control the first and second flow pumps to operate; when the ambient temperature is detected to be greater than the first ambient temperature, control the first solenoid valve to close, control the second, third, fourth, fifth, and sixth solenoid valves to open, forming a second circulation pipe, and control the first and second flow pumps and the electric cooling radiator to operate.

[0039] According to a second aspect of the embodiments of this application, a method for controlling heat dissipation of a server is provided. The server heat dissipation device includes a controller, a radiant heat dissipation device, an electric heat dissipation device, and a heat sink. The heat sink has heat dissipation pipes, the radiant heat dissipation device has first radiant heat dissipation pipes, and the electric heat dissipation device has first electric heat dissipation pipes. The heat sink is in contact with the server's components to be cooled. The method is applied to the controller and includes:

[0040] Detect the ambient temperature of the server's current environment;

[0041] When the ambient temperature is detected to be less than or equal to the first ambient temperature, the heat sink pipe is connected to the first radiative heat sink pipe to form a first circulation pipe. The first circulation pipe is filled with a first heat dissipation medium, and the radiative heat dissipation device allows heat to be dissipated from the heat dissipation medium in the first radiative heat sink pipe by means of heat radiation.

[0042] When the ambient temperature is detected to be higher than the first ambient temperature, the control heat sink pipe, the first radiative heat sink pipe, and the first electric heat sink pipe are connected to form a second circulation pipe. The second circulation pipe is filled with a second heat dissipation medium. The radiative heat dissipation device allows the second heat dissipation medium in the first radiative heat sink pipe to be dissipated by heat radiation, and the electric heat dissipation device allows the second heat dissipation medium in the first electric heat sink pipe to be dissipated by consuming electricity.

[0043] In some embodiments, the radiative heat dissipation device further includes a heat dissipation medium cavity and a second radiative heat dissipation pipe, controlling the heat dissipation plate pipe to be connected to the first radiative heat dissipation pipe to form a first circulation pipe, including:

[0044] A conduction signal is sent to the first solenoid valve, the second solenoid valve, the third solenoid valve and the fourth solenoid valve, and a start signal is sent to the first flow pump and the second flow pump to form a first circulation pipeline. The first solenoid valve, the second solenoid valve, the third solenoid valve and the fourth solenoid valve are turned on when they receive the conduction signal, and the first flow pump and the second flow pump are run when they receive the start signal.

[0045] The control of the heat dissipation plate pipe, the first radiant heat dissipation pipe, and the first electrical heat dissipation pipe forms a second circulation pipe, including:

[0046] A closing signal is sent to the first solenoid valve, an opening signal is sent to the second, third, fourth, fifth, and sixth solenoid valves, and a start signal is sent to the first and second flow pumps to form a second circulation pipeline. The first solenoid valve closes when it receives the closing signal, the second, third, fourth, fifth, and sixth solenoid valves open when they receive the opening signal, and the first and second flow pumps run when they receive the start signal.

[0047] Specifically, the first radiant outlet of the first radiant heat dissipation pipe is connected to the heat dissipation inlet of the heat dissipation plate pipe via a first solenoid valve and a first flow pump; the heat dissipation outlet of the heat dissipation plate pipe is connected to the first radiant inlet of the first radiant heat dissipation pipe via a second solenoid valve; the second radiant outlet of the second radiant heat dissipation pipe is connected to the cavity inlet of the heat dissipation medium cavity via a third solenoid valve and a second flow pump; the cavity outlet of the heat dissipation medium cavity is connected to the second radiant inlet of the second radiant heat dissipation pipe via a fourth solenoid valve; the first radiant outlet is also connected to the power inlet of the first electric heat dissipation pipe via a fifth solenoid valve; the heat dissipation inlet is also connected to the power outlet of the first electric heat dissipation pipe via a sixth solenoid valve and a first flow pump.

[0048] In some embodiments, after the control heat sink pipe and the first radiative heat dissipation pipe are connected to form a first circulation pipe, the method further includes:

[0049] When the ambient temperature is detected to rise above the first ambient temperature, the first duration during which the ambient temperature is above the first ambient temperature is detected.

[0050] If the first duration is detected to be less than or equal to the first duration, the heat sink pipe and the first radiative heat dissipation pipe are kept connected to form the first circulation pipe.

[0051] If the first duration is detected to be longer than the first duration, the control heat sink pipe, the first radiative heat sink pipe and the first electrical heat sink pipe are connected to form a second circulation pipe.

[0052] In some embodiments, the electric cooling device further includes an electric radiator mounted on a first electric cooling pipe. After controlling the heat dissipation plate pipe, the first radiant cooling pipe, and the first electric cooling pipe to form a second circulation pipe, the method further includes:

[0053] Detect whether the ambient temperature is greater than the second ambient temperature, wherein the second ambient temperature is greater than the first ambient temperature;

[0054] When the ambient temperature is detected to be less than or equal to the second ambient temperature, the electric radiator is controlled to convert electrical energy into wind energy to cool the first electric radiator pipe.

[0055] If the ambient temperature is detected to be higher than the second ambient temperature, the electric radiator is controlled to use electrical energy to evaporate the refrigerant and cool the first electric radiator pipe.

[0056] In some embodiments, after controlling the electric radiator to convert electrical energy into wind energy to cool the first electric cooling pipe, the method further includes one of the following:

[0057] The system detects whether the ambient temperature is less than or equal to a first ambient temperature; if the ambient temperature is less than or equal to the first ambient temperature, it detects a second duration during which the ambient temperature is less than or equal to the first ambient temperature; if the second duration is greater than the second duration, it controls the heat dissipation plate pipe to connect with the first radiant heat dissipation pipe to form a first circulation pipe and shuts off the electric heat dissipation device; if the second duration is less than the second duration, it continues to control the electric radiator to convert electrical energy into wind energy to cool the first electric heat dissipation pipe.

[0058] The system detects whether the ambient temperature is greater than the second ambient temperature; if the ambient temperature is greater than the second ambient temperature, it detects the third duration during which the ambient temperature is greater than the second ambient temperature; if the third duration is greater than the third duration, it controls the electric radiator to use electrical energy to evaporate the refrigerant and cool the first electric cooling pipe; if the third duration is less than or equal to the third duration, it continues to control the electric radiator to convert electrical energy into wind energy to cool the first electric cooling pipe.

[0059] In some embodiments, after controlling the electric radiator to use electrical energy to evaporate refrigerant and cool the first electric radiator pipe, the method further includes:

[0060] Check whether the ambient temperature is less than or equal to the second ambient temperature;

[0061] If the ambient temperature is detected to be less than or equal to the second ambient temperature, the fourth duration of the ambient temperature being less than or equal to the second ambient temperature is detected; if the fourth duration is detected to be greater than the fourth duration, the electric radiator is controlled to convert electrical energy into wind energy to cool the first electric cooling pipe, and the electric radiator is prohibited from using electrical energy to evaporate refrigerant to cool the first electric cooling pipe.

[0062] If the fourth duration is detected to be less than or equal to the fourth duration, the electric radiator continues to be controlled to use electrical energy to evaporate the refrigerant and cool the first electric radiator pipe.

[0063] According to a third aspect of the embodiments of this application, a server heat dissipation control device is also provided. The server heat dissipation device includes a controller, a radiative heat dissipation device, an electrical heat dissipation device, and a heat sink. A heat sink pipe is deployed in the heat sink. A first radiative heat dissipation pipe is deployed in the radiative heat dissipation device, and a first electrical heat dissipation pipe is deployed in the electrical heat dissipation device. The heat sink is in contact with the server's components to be cooled. The server heat dissipation control device is applied to the controller. The server heat dissipation control device includes:

[0064] The first detection module is set to detect the ambient temperature of the server's current environment;

[0065] The first control module is configured to control the heat sink pipe and the first radiative heat dissipation pipe to be connected when the ambient temperature is detected to be less than or equal to the first ambient temperature, forming a first circulation pipe. The first circulation pipe is filled with a first heat dissipation medium, and the radiative heat dissipation device allows heat to be dissipated from the heat dissipation medium in the first radiative heat dissipation pipe by means of heat radiation.

[0066] The second control module is configured to control the heat sink pipe, the first radiative heat sink pipe, and the first electrical heat sink pipe to conduct when the ambient temperature is detected to be higher than the first ambient temperature, forming a second circulation pipe. The second circulation pipe is filled with a second heat dissipation medium. The radiative heat dissipation device allows the second heat dissipation medium in the first radiative heat sink pipe to dissipate heat through heat radiation, and the electrical heat dissipation device allows the second heat dissipation medium in the first electrical heat sink pipe to dissipate heat by consuming electricity.

[0067] According to a fourth aspect of this application, a computer program product is also provided, comprising a computer program that is executed by a processor of the steps in any of the above method embodiments.

[0068] According to a fifth aspect of this application, a non-volatile computer-readable storage medium is also provided, wherein a computer program is stored in the non-volatile computer-readable storage medium, wherein the computer program is configured to perform the steps in any of the above method embodiments when it is run.

[0069] According to a sixth aspect of this application, an electronic device is also provided, including a memory and a processor, wherein a computer program is stored in the memory and the processor is configured to run the computer program to perform the steps in any of the above method embodiments.

[0070] This application proposes a server heat dissipation device. The device includes a controller, a radiative heat dissipation device, a power heat dissipation device, and a heat sink. The heat sink contains heat dissipation pipes, the radiative heat dissipation device contains a first radiative heat dissipation pipe, and the power heat dissipation device contains a first power heat dissipation pipe. The heat sink is in contact with the server's components to be cooled. The controller is configured to detect the ambient temperature of the server's current environment. When the detected ambient temperature is less than or equal to a first ambient temperature, indicating a low ambient temperature, the controller can connect the heat sink pipes and the first radiative heat dissipation pipe to form a first circulation pipe. The first circulation pipe is filled with a first heat dissipation medium. The radiative heat dissipation device allows heat to be dissipated through radiation. The heat dissipation medium in the heat dissipation pipes dissipates heat. Since the radiant cooling device uses heat radiation to dissipate heat from the heat dissipation medium in the first radiant cooling pipe, it greatly reduces power consumption. When the detected ambient temperature is higher than the initial ambient temperature, indicating that the ambient temperature is too high and the radiant cooling device alone may not be sufficient for cooling, the heat sink pipes, the first radiant cooling pipe, and the first electrical cooling pipe can be connected to form a second circulation pipe. This second circulation pipe is filled with a second heat dissipation medium. The radiant cooling device allows heat to be dissipated from the second heat dissipation medium in the first radiant cooling pipe through heat radiation, while the electrical cooling device allows heat to be dissipated from the second heat dissipation medium in the first electrical cooling pipe through power consumption. Because the radiant cooling device participates in the process of dissipating heat from the second heat dissipation medium in the first electrical cooling pipe, power consumption is also reduced. This technical solution solves the problem of high power consumption in server cooling in related technologies, achieving the technical effect of reducing power consumption in server cooling. Attached Figure Description

[0071] Figure 1 is a schematic diagram of the structure of a server heat dissipation device according to an embodiment of this application;

[0072] Figure 2 is a schematic diagram of the structure of a radiative heat dissipation device according to an embodiment of this application;

[0073] Figure 3 is a schematic diagram of the structure of a radiant heat sink according to an embodiment of this application;

[0074] Figure 4 is a schematic diagram of the structure of a phase change energy storage device according to an embodiment of this application;

[0075] Figure 5 is a schematic diagram of the structure of a phase change energy storage device according to an embodiment of this application;

[0076] Figure 6 is a schematic diagram of the structure of a power heat dissipation device according to an embodiment of this application;

[0077] Figure 7 is a schematic diagram of the structure of a power cooling device according to an embodiment of this application;

[0078] Figure 8 is a schematic diagram of the structure of a power cooling device according to an embodiment of this application;

[0079] Figure 9 is a schematic diagram of the structure of a power cooling device according to an embodiment of this application;

[0080] Figure 10 is a schematic diagram of the structure of an electric heat dissipation device according to an embodiment of this application;

[0081] Figure 11 is a schematic diagram of the structure of an electric heat dissipation device according to an embodiment of this application;

[0082] Figure 12 is a schematic diagram of the structure of an electric heat dissipation device according to an embodiment of this application;

[0083] Figure 13 is a schematic diagram of the structure of a heat sink according to an embodiment of this application;

[0084] Figure 14 is a schematic diagram of a server heat dissipation device pipe connection according to an embodiment of this application;

[0085] Figure 15 is a schematic diagram of a solenoid valve and flow pump deployment according to an embodiment of this application;

[0086] Figure 16 is a schematic diagram of the internal modules of a server heat dissipation device according to an embodiment of this application;

[0087] Figure 17 is a hardware structure block diagram of a computer device for a server heat dissipation control method according to an embodiment of this application.

[0088] Figure 18 is a flowchart of a server heat dissipation control method according to an embodiment of this application;

[0089] Figure 19 is a schematic diagram of a first circulation pipe and a second circulation pipe according to an embodiment of the present application;

[0090] Figure 20 is a structural block diagram of a server heat dissipation control device according to an embodiment of this application;

[0091] Figure 21 is a schematic diagram of an electronic device according to an embodiment of this application. Detailed Implementation

[0092] The embodiments of this application will be described in detail below with reference to the accompanying drawings and examples.

[0093] It should be noted that the terms "first," "second," etc., in the specification, claims, and drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0094] This embodiment provides a server heat dissipation device. Figure 1 is a schematic diagram of the structure of a server heat dissipation device according to an embodiment of this application. As shown in Figure 1, the server heat dissipation device 1 includes a controller 10, a radiant heat dissipation device 12, an electric heat dissipation device 14, and a heat sink 16. The heat sink 16 contains a heat sink pipe 16-1, the radiant heat dissipation device 12 contains a first radiant heat dissipation pipe 12-1, and the electric heat dissipation device 14 contains a first electric heat dissipation pipe 14-1. The heat sink 16 is in contact with the server's components to be cooled. The controller 10 is configured to detect the ambient temperature of the server's current environment. When the ambient temperature is detected to be less than or equal to a first ambient temperature, the controller controls the heat sink pipe 16-1 to connect with the first radiant heat dissipation pipe 12-1 to form a first circulation pipe (as shown in Figure 1(a)). When the ambient temperature is detected to be greater than the first ambient temperature, the controller controls the heat sink pipe 16-1, the first radiant heat dissipation pipe 12-1, and the first electric heat dissipation pipe 14-1 to connect to form a second circulation pipe (as shown in Figure 1(b)). The first circulation pipe is filled with a first heat dissipation medium, and the second circulation pipe is filled with a second heat dissipation medium.

[0095] The radiative heat dissipation device 12 is configured to dissipate heat from the first heat dissipation medium or the second heat dissipation medium in the first radiative heat dissipation pipe 12-1 by means of heat radiation.

[0096] The electric heat dissipation device 14 is configured to dissipate heat from the second heat dissipation medium in the first electric heat dissipation pipe 14-1 by consuming electricity.

[0097] In some embodiments, the server in this embodiment may be, but is not limited to, an edge server, which is mostly deployed outdoors. Edge servers deploy computing nodes at the network edge, providing efficient and intelligent computing, storage, and network resources nearby, thereby greatly alleviating the load on data centers and reducing data latency. This deployment model will see rapid development in the future.

[0098] In some embodiments, in this embodiment, the radiative heat dissipation device 12 is configured to dissipate heat from the first or second heat dissipation medium in the first radiative heat dissipation pipe 12-1 through heat radiation. The radiative heat dissipation device 12 may be, but is not limited to, a heat dissipation device that utilizes space radiation cooling to reduce the energy consumption of electronic devices. It uses radiative heat exchange to transfer the server's heat to the extremely low temperature of outer space, thereby achieving a highly efficient cooling process. This process does not require additional electrical energy consumption and is a spontaneous energy transfer process. Applying this cooling method to the heat dissipation system of outdoor edge servers will greatly reduce the energy consumption of the heat dissipation system.

[0099] In some embodiments, in this embodiment, the heat sink pipe 16-1 and the first radiative heat dissipation pipe 12-1 are connected, the first circulation pipe and the first power heat dissipation pipe 14-1 are connected, and the second circulation pipe may be, but is not limited to, an external circulation pipe. The heat dissipation medium may be, but is not limited to, a liquid working fluid.

[0100] As an optional solution, Figure 2 is a schematic diagram of the structure of a radiative heat dissipation device according to an embodiment of this application. As shown in Figure 2, the radiative heat dissipation device 12 deploys a radiative heat sink 12-2 and a phase change energy storage device 12-3. The radiative heat sink 12-2 is configured to reduce the heat in the third heat dissipation medium by heat radiation, resulting in a third heat dissipation medium with a medium temperature lower than that of the first medium. The third heat dissipation medium with a medium temperature lower than that of the first medium is then transferred to the phase change energy storage device 12-3. The third heat dissipation medium with a medium temperature lower than that of the first medium is used to cool the phase change energy storage material in the phase change energy storage device 12-3.

[0101] Phase change energy storage device 12-3 is configured to store phase change energy storage material, wherein the phase change energy storage material is in a first phase state when the temperature is lower than the first phase change temperature, and the phase change energy storage material is in a second phase state when the temperature is higher than the second phase change temperature. The temperature of the first medium is lower than the first phase change temperature, and the first phase change temperature is less than or equal to the second phase change temperature. The first phase state and the second phase state are different physical phase states of the phase change energy storage material.

[0102] In some embodiments, the radiant heat sink 12-2 may be, but is not limited to, a radiant cooling module, and the phase change energy storage device 12-3 may be, but is not limited to, a phase change energy storage module. When the first phase is solid, the second phase may be liquid. When the first phase is solid, the second phase may also be gaseous. When the first phase is liquid, the second phase may be gaseous.

[0103] As an optional solution, Figure 3 is a schematic diagram of the structure of a radiative heat sink according to an embodiment of this application. As shown in Figure 3, the radiative heat sink 12-2 includes a heat dissipation medium cavity 12-2-1 and a radiative heat dissipation material 12-2-2. The radiative heat dissipation material 12-2-2 covers the heat dissipation medium cavity 12-2-1. The heat dissipation medium cavity 12-2-1 is configured to store a third heat dissipation medium. The thermal conductivity of the material of the heat dissipation medium cavity 12-2-1 is greater than that of a first thermal conductivity.

[0104] The radiative heat dissipation material 12-2-2 is configured to convert the heat of the third heat dissipation medium stored in the heat dissipation medium cavity 12-2-1 into energy of a preset wavelength and radiate it outward.

[0105] In some embodiments, the heat dissipation medium cavity 12-2-1 may be, but is not limited to, a radiation cooling sealed cavity, the radiation heat dissipation material 12-2-2 may be, but is not limited to, a surface radiation cooling material, and the third heat dissipation medium may be, but is not limited to, a liquid working fluid inside the radiation cooling sealed cavity.

[0106] In some embodiments, the preset band may be, but is not limited to, the 8-13 μm (micrometer) band, which is located in an atmospheric window and has excellent emissivity (>90%).

[0107] In some embodiments, the radiant heat sink 12-2 may be, but is not limited to, a radiant cooling module. The radiant cooling module mainly consists of a radiant cooling sealed cavity (equivalent to the aforementioned heat dissipation medium cavity 12-2-1), an internal liquid working fluid, and a surface radiant cooling material (equivalent to the aforementioned radiant heat dissipation material 12-2-2). The sealed cavity, in addition to serving as a container for the internal liquid working fluid, also acts as the top cover of the server's external rack, which helps to enhance the radiant cooling effect. To optimize heat transfer between the internal liquid working fluid and the cavity wall, the cavity material is made of aluminum alloy. The internal liquid working fluid mainly serves as a heat transfer medium between the radiant cooling module and the phase change energy storage module, transferring the "cold energy" from outer space obtained by radiant cooling to the phase change energy storage module for storage. To ensure normal flow of the working fluid even in low-temperature environments, ethylene glycol antifreeze can be used as the internal liquid working fluid. Surface radiation cooling materials are generally attached or coated onto the outer wall of a sealed cavity for direct radiative heat exchange with outer space. They have excellent reflectivity (>90%) in the solar radiation band (0.3–4.0 μm) and excellent emissivity (>90%) in the atmospheric window (8–13 μm). Common materials include coatable inorganic composite coatings or coatable polymer materials. Inorganic coatings are generally inorganic composite coatings such as alumina, silica, and silicon nitride, while polymer materials are generally high-molecular composite materials such as polyvinyl chloride, polystyrene, ethyl cellulose, and cellulose acetate. This application does not specify any particular polymer material.

[0108] As an optional solution, Figure 4 is a schematic diagram of the structure of a phase change energy storage device according to an embodiment of this application. As shown in Figure 4, the phase change energy storage device 12-3 includes: a phase change energy storage material cavity 12-3-1, a first radiative heat dissipation pipe 12-1 and a second radiative heat dissipation pipe 12-4. The first radiative heat dissipation pipe 12-1 and the second radiative heat dissipation pipe 12-4 are deployed in the phase change energy storage material cavity 12-3-1. The phase change energy storage material cavity 12-3-1 is configured to store phase change energy storage material. The thermal conductivity of the phase change energy storage material cavity 12-3-1 to the outside is lower than the second thermal conductivity. The phase change energy storage material is filled outside the first radiative heat dissipation pipe 12-1 and the second radiative heat dissipation pipe 12-4.

[0109] The second radiative heat dissipation pipe 12-4 is configured to receive a third heat dissipation medium with a medium temperature lower than that of the first medium from the radiative heat sink 12-2.

[0110] In some embodiments, the phase change energy storage material cavity 12-3-1 may be, but is not limited to, a stainless steel cavity in a phase change energy storage module, the inner wall of which is covered with insulating foam. Alternatively, the phase change energy storage material cavity 12-3-1 may directly use a material with a thermal conductivity lower than the second thermal conductivity.

[0111] In some embodiments, the phase change energy storage module mainly consists of a stainless steel cavity (equivalent to the phase change energy storage material cavity 12-3-1 mentioned above), thermal insulation foam, phase change energy storage material, and a serpentine coil. The stainless steel cavity primarily serves as the container and structural support for the internal phase change energy storage material. The thermal insulation foam is attached to the inner wall of the cavity, effectively isolating the internal phase change material from the external environment. Phase change energy storage materials primarily utilize the characteristic of absorbing or releasing a large amount of latent heat during a physical phase change to achieve "cold storage" or "heat storage." Common types include gas-liquid, solid-gas, and solid-liquid. To prevent excessive pressure within the cavity after a phase change, this application may use granular inorganic solid-liquid phase change materials with a phase change temperature between 25 and 30°C. The serpentine coil mainly includes a radiant cooling side serpentine coil and a cold plate side serpentine coil. Both use liquid working fluid inside the coil to store the "cooling" obtained by the radiant cooling module and the heat generated by the server in phase change energy storage material. Heat exchange is formed through the phase change energy storage material. The working fluid temperature inside the former coil rises and returns to the radiant cooling sealed cavity, while the working fluid temperature inside the latter coil decreases and returns to the server cold plate, completing one cycle. The introduction of phase change energy storage material can greatly reduce the interference caused by drastic fluctuations in the external ambient temperature and maintain the stability of the liquid working fluid temperature inside the cold plate.

[0112] In some embodiments, FIG5 is a schematic diagram of the structure of a phase change energy storage device according to an embodiment of the present application. As shown in FIG5, a cold plate side serpentine coil and a radiation cooling side serpentine coil are deployed in the phase change energy storage device 12-3. The space between the cold plate side serpentine coil and the radiation cooling side serpentine coil is filled with phase change energy storage material. The cold plate side serpentine coil is connected to the cold plate working fluid inlet and the cold plate working fluid outlet, and the radiation cooling side serpentine coil is connected to the radiation cooling inlet and the radiation cooling outlet.

[0113] In some embodiments, the first radiative heat dissipation pipe 12-1 may be, but is not limited to, a serpentine coil on the cold plate side, and the second radiative heat dissipation pipe 12-4 may be, but is not limited to, a serpentine coil on the radiative cooling side.

[0114] As an optional solution, Figure 6 is a schematic diagram of the structure of an electric heat dissipation device according to an embodiment of this application. As shown in Figure 6, the electric heat dissipation device 14 also includes an electric heat sink 14-2, which is installed on a first electric heat dissipation pipe 14-1. The first electric heat dissipation pipe 14-1 is configured to transmit the second heat dissipation medium in the second circulation pipe.

[0115] The electric radiator 14-2 is configured to cool the second heat dissipation medium in the first electric heat dissipation pipe 14-1.

[0116] In some embodiments, the power cooling device 14 may be, but is not limited to, a CDU module. Figure 7 is a schematic diagram of the structure of a power cooling device according to an embodiment of this application. As shown in Figure 7, the power cooling device 14 includes a primary cooling pipe and a secondary cooling pipe. The primary cooling pipe connects the inlet and outlet of the primary cooling pipe. A flow pump 3 and a solenoid valve 7 are deployed on the secondary cooling pipe, and the cooling coil of the secondary cooling pipe is cooled by fan cooling.

[0117] In some embodiments, the first power cooling conduit 14-1 may be, but is not limited to, a primary-side cooling conduit. The power radiator 14-2 may be, but is not limited to, a secondary-side cooling conduit and a fan.

[0118] As an optional solution, Figure 8 is a schematic diagram of the structure of an electric heat dissipation device according to an embodiment of this application. As shown in Figure 8, the electric heat sink 14-2 includes a first air-cooled heat sink 14-2-1 and a second electric heat dissipation pipe 14-2-2, wherein the second electric heat dissipation pipe 14-2-2 is configured to exchange heat with the first electric heat dissipation pipe 14-1;

[0119] The first air-cooled radiator 14-2-1 is configured to convert electrical energy into wind energy to cool the second power cooling pipe 14-2-2.

[0120] In some embodiments, the second power heat dissipation pipe 14-2-2 may be, but is not limited to, a secondary cooling pipe, and the first air-cooled radiator 14-2-1 may be, but is not limited to, a fan.

[0121] As an optional solution, Figure 9 is a schematic diagram of the structure of an electric heat dissipation device according to an embodiment of this application. As shown in Figure 9, the electric heat sink 14-2 includes a first air conditioning heat sink 14-2-3 and a third electric heat dissipation pipe 14-2-4, wherein the third electric heat dissipation pipe 14-2-4 is configured to exchange heat with the first electric heat dissipation pipe 14-1;

[0122] The first air conditioning condenser 14-2-3 is configured to use electrical energy to evaporate the refrigerant and cool the third power cooling pipe 14-2-4.

[0123] In some embodiments, FIG10 is a schematic diagram of the structure of an electric cooling device according to an embodiment of the present application. As shown in FIG10, the electric cooling device 14 includes a primary cooling pipe and a secondary cooling pipe, wherein the primary cooling pipe is connected to the liquid inlet and the liquid outlet of the primary cooling pipe. A flow pump 4 and a solenoid valve 8 are deployed on the secondary cooling pipe, and the cooling coil of the secondary cooling pipe is cooled by means of air conditioning.

[0124] As an optional solution, Figure 11 is a schematic diagram of the structure of an electric heat dissipation device according to an embodiment of this application. As shown in Figure 11, the electric heat sink 14-2 includes a second air-cooled heat sink 14-2-5, a second air-cooled heat sink 14-2-6, and a fourth electric heat dissipation pipe 14-2-7, wherein the fourth electric heat dissipation pipe 14-2-7 is configured to exchange heat with the first electric heat dissipation pipe 14-1;

[0125] The second air-cooled radiator 14-2-5 is configured to convert electrical energy into air energy to cool the fourth power cooling pipe 14-2-7.

[0126] The second air conditioning condenser 14-2-6 is configured to use electrical energy to evaporate the refrigerant and cool the fourth power condenser 14-2-7.

[0127] In some embodiments, the second air-cooled radiator 14-2-5 and the second air-conditioning radiator 14-2-6 can be used simultaneously to cool the fourth power heat dissipation pipe 14-2-7.

[0128] As an optional solution, Figure 12 is a schematic diagram of the structure of an electric heat dissipation device according to an embodiment of this application. As shown in Figure 12, the electric heat sink 14-2 includes a third air-cooled heat sink 14-2-8, a third air-cooled heat sink 14-2-9, a fifth electric heat dissipation pipe 14-2-10, and a sixth electric heat dissipation pipe 14-2-11, wherein the fifth electric heat dissipation pipe 14-2-10 is configured to exchange heat with the first electric heat dissipation pipe 14-1;

[0129] The sixth power cooling pipe 14-2-11 is configured to exchange heat with the first power cooling pipe 14-1;

[0130] The third air-cooled radiator 14-2-8 is configured to convert electrical energy into air energy to cool the fifth power cooling pipe 14-2-10;

[0131] The third air conditioning condenser 14-2-9 is configured to use electrical energy to evaporate the refrigerant and cool the sixth power condenser 14-2-11.

[0132] In some embodiments, the third air-cooled radiator 14-2-8 and the third air-cooled radiator 14-2-9 can be used to cool the fifth power cooling pipe 14-2-10 and the sixth power cooling pipe 14-2-11, respectively. Then, the fifth power cooling pipe 14-2-10 and the sixth power cooling pipe 14-2-11 exchange heat with the first power cooling pipe 14-1.

[0133] In some embodiments, the power cooling device 14 may be, but is not limited to, a CDU (Cooling Distribution Unit) module. The CDU module mainly consists of a primary-side cooling pipeline, a secondary-side cooling pipeline, and a monitoring system. The inlet of the primary-side cooling pipeline is connected to the outlet of the phase change cooling energy storage module via a pipeline, and the outlet of the primary-side cooling pipeline is connected to the inlet of the cold plate module via a pipeline. The liquid working fluid, cooled by the phase change energy storage module, flows through the primary-side cooling pipeline and exchanges heat with the secondary-side pipeline, thus forming secondary cooling. The secondary-side cooling pipeline can be designed in two ways: a fan-cooled circulation pipeline and an air conditioning-cooled circulation pipeline. In the former, the liquid working fluid in the pipeline is mainly cooled by an outdoor fan blowing through the cooling coil, while in the latter, the liquid working fluid in the pipeline is mainly cooled by the evaporative cooling plate in the air conditioning unit. The CDU module's monitoring system primarily communicates with the microcontroller module to determine the operating mode of the secondary cooling pipeline and monitors and adjusts the temperature and flow parameters of the liquid working fluid in real time to ensure the server operates within the normal temperature range. Solenoid valves, flow pumps, and external circulation pipelines together form the cooling system's circulation path. Under the regulation of the microcontroller module and the CDU monitoring system, the solenoid valves and flow pumps control the switching and flow rates of different pipeline sections to switch between different cooling modes and maximize energy savings in the heat dissipation system. It is also worth noting that to prevent "cooling" leakage, exposed pipeline sections must be wrapped with insulation material (commonly insulation foam) to effectively isolate them from the external environment.

[0134] As an optional solution, Figure 13 is a schematic diagram of the structure of a heat sink according to an embodiment of this application. As shown in Figure 13, the heat sink 16 includes: a heat sink substrate 16-2 and a heat sink pipe 16-1. The heat sink pipe 16-1 is deployed inside the heat sink substrate 16-2. The heat sink 16 contacts the server's components to be cooled through the heat sink substrate 16-2. The heat sink substrate 16-2 is configured to exchange heat with the components to be cooled.

[0135] The heat dissipation pipe 16-1 is configured to cool the heat dissipation substrate 16-2.

[0136] In some embodiments, the heat sink 16 may be, but is not limited to, a cold plate module. The heat sink 16 includes: an aluminum substrate and copper pipe channels, the copper pipe channels connecting the outlet and inlet of the copper pipe channels. The heat sink substrate 16-2 may be, but is not limited to, an aluminum substrate, and the heat sink pipe 16-1 may be, but is not limited to, a copper pipe channel, which is designed in a series channel configuration. The component to be cooled may be, but is not limited to, a chip in a server. The bottom of the aluminum substrate forms thermal contact with the chip package shell through a thermal pad or thermal grease. The heat from the chip is transferred to the cold plate, causing the working fluid temperature inside its channels to rise. After flowing into the phase change energy storage module through the outlet of the cold plate to achieve cooling, it then flows back into the copper pipe channels through the inlet of the cold plate to complete one cooling cycle.

[0137] As an optional solution, Figure 14 is a schematic diagram of the pipe connection of a server heat dissipation device according to an embodiment of this application. As shown in Figure 14, the radiative heat dissipation device 12 is equipped with a heat dissipation medium cavity 12-2-1, a first radiative heat dissipation pipe 12-1 and a second radiative heat dissipation pipe 12-4. The electric heat dissipation device 14 includes a first electric heat dissipation pipe 14-1 and an electric radiator 14-2. The first radiative liquid outlet 12-1-1 of the first radiative heat dissipation pipe 12-1 is connected to the heat dissipation liquid inlet 16-1-1 of the heat dissipation plate pipe 16-1, and the heat dissipation liquid outlet 16-1-2 of the heat dissipation plate pipe 16-1 is connected to the first radiative liquid inlet 12-1-2 of the first radiative heat dissipation pipe 12-1.

[0138] The second radiative liquid outlet 12-4-1 of the second radiative heat dissipation pipe 12-4 is connected to the cavity inlet 12-2-1-1 of the heat dissipation medium cavity 12-2-1, and the cavity outlet 12-2-1-2 of the heat dissipation medium cavity 12-2-1 is connected to the second radiative liquid inlet 12-4-2 of the second radiative heat dissipation pipe 12-4.

[0139] The first radiating liquid outlet 12-1-1 is also connected to the power liquid inlet 14-1-1 of the first power heat dissipation pipe 14-1, and the heat dissipation liquid inlet 16-1-1 is also connected to the power liquid outlet 14-1-2 of the first power heat dissipation pipe 14-1.

[0140] The heat dissipation medium cavity 12-2-1 is configured as a third heat dissipation medium with a storage medium temperature lower than that of the first medium.

[0141] The electric radiator 14-2 is configured to cool the second heat dissipation medium in the first electric heat dissipation pipe 14-1 by consuming electricity.

[0142] As an optional solution, Figure 15 is a schematic diagram of the deployment of an electromagnetic valve and a flow pump according to an embodiment of this application. As shown in Figure 15, the first radiant outlet 12-1-1 of the first radiant heat dissipation pipe 12-1 is connected to the heat dissipation inlet 16-1-1 of the heat dissipation plate pipe 16-1 through a first electromagnetic valve 111 and a first flow pump 777. The heat dissipation outlet 16-1-2 of the heat dissipation plate pipe 16-1 is connected to the first radiant inlet 12-1-2 of the first radiant heat dissipation pipe 12-1 through a second electromagnetic valve 222. The second radiant outlet 12-4-1 of the second radiant heat dissipation pipe 12-4 is connected to the cavity inlet 12-2-1-1 of the heat dissipation medium cavity 12-2-1 through a third electromagnetic valve 222. Solenoid valve 333 is connected to the second flow pump 888. The outlet 12-2-1-2 of the heat dissipation medium cavity 12-2-1 is connected to the second radiative inlet 12-4-2 of the second radiative heat dissipation pipe 12-4 through the fourth solenoid valve 444. The first radiative outlet 12-1-1 is also connected to the power inlet 14-1-1 of the first power heat dissipation pipe 14-1 through the fifth solenoid valve 555. The heat dissipation inlet 16-1-1 is also connected to the power outlet 14-1-2 of the first power heat dissipation pipe 14-1 through the sixth solenoid valve 666 and the first flow pump 777.

[0143] The controller 10 is configured to, when the ambient temperature is detected to be less than or equal to a first ambient temperature, control the first solenoid valve 111, the second solenoid valve 222, the third solenoid valve 333, and the fourth solenoid valve 444 to open, forming a first circulation pipe, and control the first flow pump 777 and the second flow pump 888 to operate; when the ambient temperature is detected to be greater than the first ambient temperature, control the first solenoid valve 111 to close, control the second solenoid valve 222, the third solenoid valve 333, the fourth solenoid valve 444, the fifth solenoid valve 555, and the sixth solenoid valve 666 to open, forming a second circulation pipe, and control the first flow pump 777, the second flow pump 888, and the power radiator 14-2 to operate.

[0144] Figure 16 is a schematic diagram of the internal modules of a server heat dissipation device according to an embodiment of this application. As shown in Figure 16, the server heat dissipation device mainly consists of seven parts: a radiative cooling module, a phase change energy storage module, a cold plate module, a microcontroller module, a CDU module, matching solenoid valves, flow pumps, and external circulation pipelines. The radiative cooling module can be, but is not limited to, a radiative cooling water tank. The controller 10 can be, but is not limited to, a microcontroller module. By acquiring the ambient temperature, it controls the switching of the solenoid valves (111-666) on the connecting pipelines of the radiative cooling module and the phase change energy storage module, and sends flow signals to the flow pumps 777 and 888. At the same time, the microcontroller module also communicates with the monitoring system of the CDU module (equivalent to a power cooling device) to control the start and stop of the CDU module. When the microcontroller module detects that the ambient temperature is low, the "cooling power" acquired by the radiative cooling module can meet the heat dissipation requirements of the server, and the CDU module does not work at this time. When the microcontroller module detects that the ambient temperature is high, the CDU module will start working to compensate for the cooling power.

[0145] In some embodiments, the first radiative liquid outlet 12-1-1 of the first radiative heat dissipation pipe 12-1 may be, but is not limited to, the cold plate working fluid outlet in FIG. 5. The heat dissipation liquid inlet 16-1-1 of the heat dissipation plate pipe 16-1 may be, but is not limited to, the cooling plate inlet in FIG. 13. The heat dissipation liquid outlet 16-1-2 of the heat dissipation plate pipe 16-1 may be, but is not limited to, the cooling plate outlet in FIG. 13, and the first radiative liquid inlet 12-1-2 of the first radiative heat dissipation pipe 12-1 may be, but is not limited to, the cold plate working fluid inlet in FIG. 5. The second radiative liquid outlet 12-4-1 of the second radiative heat dissipation pipe 12-4 may be, but is not limited to, the radiative cooling liquid outlet in FIG. 5. The cavity inlet 12-2-1-1 of the heat dissipation medium cavity 12-2-1 may be, but is not limited to, the inlet of the radiative cooling water tank in FIG. 16. The outlet 12-2-1-2 of the heat dissipation medium cavity 12-2-1 may, but is not limited to, the outlet of the radiant cooling water tank in Figure 16. The second radiant inlet 12-4-2 of the second radiant heat dissipation pipe 12-4 may, but is not limited to, the radiant cooling inlet in Figure 5. The power inlet 14-1-1 of the first power heat dissipation pipe 14-1 may, but is not limited to, the primary side pipe inlet in Figure 7. The power outlet 14-1-2 of the first power heat dissipation pipe 14-1 may, but is not limited to, the primary side pipe outlet in Figure 7.

[0146] The methods and embodiments provided in this application can be executed in a server device or a similar computing device. Taking a server device as an example, FIG17 is a hardware structure block diagram of a computer device for a server heat dissipation control method according to an embodiment of this application. As shown in FIG17, the server device may include one or more (only one is shown in FIG1) processors 102 (processor 102 may include, but is not limited to, microprocessors MCU or programmable logic devices FPGA, etc.) and a memory 104 configured to store data. The server device may also include a transmission device 106 configured for communication and an input / output device 108. Those skilled in the art will understand that the structure shown in FIG1 is only illustrative and does not limit the structure of the server device. For example, the server device may also include more or fewer components than shown in FIG1, or have a different configuration than shown in FIG1.

[0147] The memory 104 may be configured to store computer programs, such as application software programs and modules, like the computer program corresponding to the server heat dissipation control method in this embodiment. The processor 102 executes various functional applications and data processing, i.e., the implemented methods, by running the computer programs stored in the memory 104. The memory 104 may include high-speed random access memory, and may also include non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some instances, the memory 104 may include memory remotely located relative to the processor 102, and these remote memories can be connected to the server device via a network. Examples of networks include, but are not limited to, the Internet, corporate intranets, local area networks, mobile communication networks, and combinations thereof.

[0148] The transmission device 106 is configured to receive or transmit data via a network, an example of which may include a wireless network provided by a communication provider for server equipment. In one example, the transmission device 106 includes a Network Interface Controller (NIC), which can connect to other network devices via a base station to communicate with the Internet. In another example, the transmission device 106 may be a Radio Frequency (RF) module configured to communicate with the Internet wirelessly.

[0149] This embodiment provides a method for controlling server heat dissipation. Figure 18 is a flowchart of a server heat dissipation control method according to an embodiment of this application. As shown in Figure 18, the server heat dissipation device includes a controller 10, a radiant heat dissipation device 12, a power heat dissipation device 14, and a heat sink 16. The heat sink 16 has a heat sink pipe 16-1, the radiant heat dissipation device 12 has a first radiant heat dissipation pipe 12-1, and the power heat dissipation device 14 has a first power heat dissipation pipe 14-1. The heat sink 16 is in contact with the server's components to be cooled. The method is applied to the controller 10, and the process includes the following steps:

[0150] Step S12: Detect the ambient temperature of the server's current environment;

[0151] Step S14: When the ambient temperature is detected to be less than or equal to the first ambient temperature, the heat dissipation plate pipe 16-1 is connected to the first radiative heat dissipation pipe 12-1 to form a first circulation pipe. The first circulation pipe is filled with a first heat dissipation medium, and the radiative heat dissipation device 12 allows heat to be dissipated in the heat dissipation medium in the first radiative heat dissipation pipe 12-1 by means of heat radiation.

[0152] Step S16: When the ambient temperature is detected to be higher than the first ambient temperature, the heat dissipation plate pipe 16-1, the first radiative heat dissipation pipe 12-1 and the first electric heat dissipation pipe 14-1 are controlled to be connected to form a second circulation pipe. The second circulation pipe is filled with a second heat dissipation medium. The radiative heat dissipation device 12 allows the second heat dissipation medium in the first radiative heat dissipation pipe 12-1 to be dissipated by heat radiation. The electric heat dissipation device 14 allows the second heat dissipation medium in the first electric heat dissipation pipe 14-1 to be dissipated by consuming electricity.

[0153] As an optional solution, the radiative heat dissipation device 12 also includes a heat dissipation medium cavity 12-2-1 and a second radiative heat dissipation pipe 12-4, controlling the heat dissipation plate pipe 16-1 to be connected to the first radiative heat dissipation pipe 12-1 to form a first circulation pipe, including:

[0154] S21, a conduction signal is sent to the first solenoid valve 111, the second solenoid valve 222, the third solenoid valve 333 and the fourth solenoid valve 444, and a start signal is sent to the first flow pump 777 and the second flow pump 888 to form a first circulation pipeline, wherein the first solenoid valve 111, the second solenoid valve 222, the third solenoid valve 333 and the fourth solenoid valve 444 are turned on when they receive the conduction signal, and the first flow pump 777 and the second flow pump 888 are operated when they receive the start signal;

[0155] The control heat dissipation plate pipe 16-1, the first radiative heat dissipation pipe 12-1, and the first electrical heat dissipation pipe 14-1 are connected to form a second circulation pipe, including:

[0156] S22, a closing signal is sent to the first solenoid valve 111, an opening signal is sent to the second solenoid valve 222, the third solenoid valve 333, the fourth solenoid valve 444, the fifth solenoid valve 555 and the sixth solenoid valve 666, and a start signal is sent to the first flow pump 777 and the second flow pump 888 to form a second circulation pipeline. The first solenoid valve 111 closes when it receives the closing signal, the second solenoid valve 222, the third solenoid valve 333, the fourth solenoid valve 444, the fifth solenoid valve 555 and the sixth solenoid valve 666 open when they receive the opening signal, and the first flow pump 777 and the second flow pump 888 run when they receive the start signal.

[0157] The first radiant outlet 12-1-1 of the first radiant heat dissipation pipe 12-1 is connected to the heat dissipation inlet 16-1-1 of the heat dissipation plate pipe 16-1 via a first solenoid valve 111 and a first flow pump 777. The heat dissipation outlet 16-1-2 of the heat dissipation plate pipe 16-1 is connected to the first radiant inlet 12-1-2 of the first radiant heat dissipation pipe 12-1 via a second solenoid valve 222. The second radiant outlet 12-4-1 of the second radiant heat dissipation pipe 12-4 is connected to the cavity inlet 12-2-1-1 of the heat dissipation medium cavity 12-2-1 via a third solenoid valve 222. Valve 333 is connected to the second flow pump 888. The outlet 12-2-1-2 of the heat dissipation medium cavity 12-2-1 is connected to the second radiative inlet 12-4-2 of the second radiative heat dissipation pipe 12-4 through the fourth solenoid valve 444. The first radiative outlet 12-1-1 is also connected to the power inlet 14-1-1 of the first power heat dissipation pipe 14-1 through the fifth solenoid valve 555. The heat dissipation inlet 16-1-1 is also connected to the power outlet 14-1-2 of the first power heat dissipation pipe 14-1 through the sixth solenoid valve 666 and the first flow pump 777.

[0158] In some embodiments, FIG19 is a schematic diagram of the formation of a first circulation pipe and a second circulation pipe according to an embodiment of the present application. As shown in FIG19, after the microcontroller module (controller 10) is powered on, it first acquires the ambient temperature and judges the temperature value. If the ambient temperature value is detected to be lower than the first temperature value (equivalent to the first ambient temperature, which can be selected as 25°C), the microcontroller module will control the solenoid valves 111, 222, 333, and 444 to open, and the flow pumps 777 and 888 to start working and pump out a fixed flow rate according to the specified parameter signal. At this time, the server is powered on and started, the solenoid valves 555 and 666 are closed, and the CDU module does not work. During this cycle, the "cooling" obtained by the radiative cooling module is continuously stored in the phase change energy storage module through the liquid working fluid, and exchanges heat with the high-temperature working fluid flowing out from the server's cold plate. After the working fluid temperature drops, it flows back to the cold plate to complete the cycle. At this time, the "cooling" provided by the radiative cooling module can fully meet the server's heat dissipation requirements. If the monitored ambient temperature value is higher than the first temperature value but lower than the second temperature value (equivalent to the second ambient temperature, which can be selected as 30℃), the "cooling" provided by the radiative cooling module is slightly insufficient. The microcontroller module will communicate with the CDU module to make the latter start working. At this time, the solenoid valves 555 and 666 in Figure 16 will open, the electronic valve 111 will close, the CDU module will start the fan cooling cycle mode, the solenoid valve 7 in Figure 7 will open, and the flow pump 3 and the outdoor fan will start working. At this time, the liquid working fluid cooled by the phase change energy storage module flows through the primary cooling pipe and exchanges heat with the secondary pipe to form secondary cooling. The cooled working fluid flows back to the cold plate to complete the cycle. If the ambient temperature is detected to be higher than the second temperature value, indicating a harsh high-temperature environment, the microcontroller module will communicate with the CDU module to activate the air conditioning cooling mode. At this time, solenoid valves 555 and 666 in Figure 16 remain open, solenoid valve 111 in Figure 16 and solenoid valve 7 in Figure 7 are closed, and solenoid valves 8-10 in Figure 10 are open. Flow pump 3 stops working, and flow pump 4 starts working. The high-temperature working fluid on the secondary side cools down through heat exchange with the evaporator plate of the air conditioning module. Simultaneously, as the compressor of the air conditioning module starts working, the power consumption of the cooling system reaches its maximum. Simultaneously, after the latter two cooling modes are activated, the CDU monitoring module will monitor the highest temperature of the working fluid in the primary side pipeline in real time and adjust the flow rate inside the secondary side pipeline in real time according to this temperature value to adapt to changes in the ambient temperature.In addition, to prevent fluctuations in the external environment from causing repeated switching between the three cooling modes, the microcontroller module is configured with the following judgment logic: If the system is already operating in the first cooling mode, it must detect that the external ambient temperature is higher than the first temperature value for a period of 2 minutes before the system can switch to the second cooling mode; if the system is already operating in the second cooling mode, it must detect that the external ambient temperature is lower than the first temperature value for a period of 2 minutes before switching to the first cooling mode, or it must detect that the external ambient temperature is higher than the second temperature value for a period of 2 minutes before switching to the third cooling mode; if the system is already operating in the third cooling mode, it must detect that the external ambient temperature is lower than the second temperature value for a period of 2 minutes before switching to the second cooling mode.

[0159] As an optional solution, after the heat dissipation plate pipe 16-1 is connected to the first radiative heat dissipation pipe 12-1 to form a first circulation pipe, the method further includes:

[0160] S31, when the ambient temperature is detected to rise above the first ambient temperature, the first duration for which the ambient temperature is above the first ambient temperature is detected;

[0161] S32, if the first duration is detected to be less than or equal to the first duration, continue to control the heat dissipation plate pipe 16-1 to be connected to the first radiation heat dissipation pipe 12-1 to form the first circulation pipe;

[0162] S33, when the first duration is detected to be longer than the first duration, the heat sink pipe 16-1, the first radiation heat sink pipe 12-1 and the first power heat sink pipe 14-1 are controlled to be turned on to form a second circulation pipe.

[0163] In some embodiments, the first duration may be, but is not limited to, 2 minutes.

[0164] In some embodiments, the heat sink pipe 16-1 is connected to the first radiative heat dissipation pipe 12-1 to form a first circulation pipe, that is, the first cooling mode is adopted.

[0165] As an optional solution, the electric cooling device 14 also includes an electric radiator 14-2, which is installed on the first electric cooling pipe 14-1. After the control heat dissipation plate pipe 16-1, the first radiant heat dissipation pipe 12-1, and the first electric cooling pipe 14-1 are connected to form a second circulation pipe, the method further includes:

[0166] S41, Detect whether the ambient temperature is greater than the second ambient temperature, wherein the second ambient temperature is greater than the first ambient temperature;

[0167] S42, when the ambient temperature is detected to be less than or equal to the second ambient temperature, the electric radiator 14-2 is controlled to convert electrical energy into wind energy to cool the first electric heat dissipation pipe 14-1;

[0168] S43, when the ambient temperature is detected to be higher than the second ambient temperature, the electric radiator 14-2 is controlled to use electrical energy to evaporate the refrigerant to cool the first electric radiator pipe 14-1.

[0169] In some embodiments, the electric radiator 14-2 is controlled to convert electrical energy into wind energy to cool the first electric heat dissipation pipe 14-1, that is, the second cooling mode is adopted;

[0170] In some embodiments, the control power radiator 14-2 uses electrical energy to evaporate refrigerant to cool the first power heat dissipation pipe 14-1, i.e., a third cooling mode is adopted.

[0171] As an alternative, after the electric radiator 14-2 converts electrical energy into wind energy to cool the first electric cooling pipe 14-1, the method further includes one of the following:

[0172] S51, detect whether the ambient temperature is less than or equal to the first ambient temperature; if the ambient temperature is less than or equal to the first ambient temperature, detect the second duration for which the ambient temperature is less than or equal to the first ambient temperature; if the second duration is greater than the second duration, control the heat dissipation plate pipe 16-1 to connect with the first radiant heat dissipation pipe 12-1 to form a first circulation pipe, and shut down the electric heat dissipation device 14; if the second duration is less than the second duration, continue to control the electric radiator 14-2 to convert electrical energy into wind energy to cool the first electric heat dissipation pipe 14-1.

[0173] S52, detect whether the ambient temperature is greater than the second ambient temperature; if the ambient temperature is greater than the second ambient temperature, detect the third duration for which the ambient temperature is greater than the second ambient temperature; if the third duration is greater than the third duration, control the electric radiator 14-2 to use electrical energy to evaporate the refrigerant and cool the first electric cooling pipe 14-1; if the third duration is less than or equal to the third duration, continue to control the electric radiator 14-2 to convert electrical energy into wind energy to cool the first electric cooling pipe 14-1.

[0174] In some embodiments, the second duration and the third duration may be, but are not limited to, 2 minutes.

[0175] As an alternative, after controlling the electric radiator 14-2 to use electrical energy to evaporate the refrigerant and cool the first electric cooling pipe 14-1, the method further includes:

[0176] S61, detect whether the ambient temperature is less than or equal to the second ambient temperature;

[0177] S62, if the ambient temperature is detected to be less than or equal to the second ambient temperature, the fourth duration of the ambient temperature being less than or equal to the second ambient temperature is detected; if the fourth duration is detected to be greater than the fourth duration, the electric radiator 14-2 is controlled to convert electrical energy into wind energy to cool the first electric heat dissipation pipe 14-1, and the electric radiator 14-2 is prohibited from using electrical energy to evaporate refrigerant to cool the first electric heat dissipation pipe 14-1.

[0178] S63, if the fourth duration is detected to be less than or equal to the fourth duration, the electric radiator 14-2 continues to be controlled to use electrical energy to evaporate the refrigerant and cool the first electric radiator pipe 14-1.

[0179] In some embodiments, the fourth duration and the third duration may be, but are not limited to, 2 minutes.

[0180] It is worth noting that, in order to effectively solve the technical problem of excessive energy consumption in outdoor edge server air-cooled heat dissipation systems, this application proposes a server heat dissipation control method and server heat dissipation equipment. The server heat dissipation equipment introduces a radiative cooling module, a phase change energy storage module, a cold plate module, a microcontroller module, and a CDU (Cooling Distribution Unit) module into the liquid cooling system. When the outdoor temperature is low, the radiative cooling module radiates heat to outer space through the atmospheric window (8-13μm) via its surface radiative cooling material. The liquid working fluid inside the module cools down and is then transferred to the phase change energy storage module through pipes for storage, thus reducing the internal temperature of the phase change energy storage module. Simultaneously, the liquid working fluid inside the server cold plate module heats up after passing through the server's main heat-generating chip. The high-temperature working fluid flows into the phase change energy storage module through pipes to cool down and then returns to the server cold plate through a flow pump and pipes to form a cycle. When the outdoor temperature is high, the cooling capacity of the radiative cooling is insufficient to support the server's heat dissipation needs. In this case, the server cold plate circulation loop closes, and the CDU module turns on and opens the circulation pipes to provide sufficient cooling capacity for the server. The switching of the above heat dissipation modes is all based on the monitoring system within the microcontroller module and the CDU module. Both control the opening and closing of different modules and circulation pipes by monitoring the ambient temperature and the temperature of the working fluid inside the pipes in real time. Based on the above design, this application can provide a safe and reliable cooling system for the outdoor deployment of edge servers, and can effectively utilize the "coldness" of outer space to meet the server's heat dissipation needs. Multiple heat dissipation modes greatly reduce the energy consumption of the server's heat dissipation system, thereby achieving the goal of energy saving.

[0181] This application proposes a method for controlling server heat dissipation. By introducing a radiative cooling module, a phase change energy storage module, a cold plate module, a microcontroller module, and a CDU module into the cooling system of an edge server, it provides a new approach for energy-saving deployment of edge servers outdoors. During operation, the radiative cooling module radiates heat to outer space through an atmospheric window (8-13 μm) via its surface radiative cooling material. The liquid working fluid inside the module cools down and is stored in the phase change energy storage module through pipes, where it exchanges heat with the high-temperature working fluid from the cold plate. The cooled liquid working fluid returns to the server's cold plate through a flow pump and pipes to form a cycle. If the ambient temperature is too high, the microcontroller module triggers the CDU module to start working to provide greater cooling capacity and switches between different cooling modes at different temperatures. The entire liquid cooling system is simple in design and has more efficient heat dissipation performance. It introduces the "coldness" of outer space into the cooling system, which greatly reduces the energy consumption of the heat dissipation system in the overall power consumption. At the same time, the introduction of the phase change energy storage module can also greatly reduce the fluctuations caused by drastic changes in ambient temperature and maintain the stability of the liquid working fluid temperature in the cold plate, so as to ensure the safe and reliable operation of the edge server outdoors.

[0182] This application proposes a server heat dissipation control method, providing a new approach for energy-efficient outdoor deployment of edge servers. The system (server cooling equipment) utilizes a radiative cooling module to radiate heat to outer space through an atmospheric window (8-13 μm) via a surface radiative cooling material. This "cooling" energy is stored in a phase change energy storage module via a liquid working fluid in pipes. The high-temperature working fluid from the cold plate exchanges heat with this "cooling" energy in the phase change energy storage module. The cooled liquid working fluid returns to the server cold plate via a flow pump and pipes, forming a cycle. This system innovatively combines radiative cooling technology with the server's liquid cooling system, significantly reducing the energy consumption required for the server's heat dissipation system. Simultaneously, the CDU module of this patent provides two cooling modes with greater "cooling" capacity, enabling wide-temperature deployment of edge servers outdoors. This segmented temperature control strategy also greatly saves energy consumption in the server's heat dissipation system. The entire liquid cooling system is simple in design and has high heat dissipation performance. The introduction of the phase change energy storage module can also greatly reduce the fluctuations caused by drastic changes in ambient temperature and maintain the stability of the liquid working fluid temperature inside the cold plate, so as to ensure the safe and reliable operation of the edge server outdoors.

[0183] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods according to the embodiments can be implemented by means of software plus necessary general-purpose hardware platforms, and of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a non-volatile computer-readable storage medium (such as ROM / RAM, magnetic disk, optical disk), and includes several instructions to cause a terminal device (which may be a mobile phone, computer, server, or network device, etc.) to execute the methods of the various embodiments of this application.

[0184] This embodiment also provides a server heat dissipation control device, which is configured to implement the embodiments and optional implementations, and will not be repeated as already described. As used below, the term "module" can be a combination of software and / or hardware that implements a predetermined function. Although the device described in the following embodiments is preferably implemented in software, hardware implementation, or a combination of software and hardware, is also possible and contemplated.

[0185] Figure 20 is a structural block diagram of a server heat dissipation control device according to an embodiment of this application; as shown in Figure 20, the server heat dissipation device includes a controller, a radiant heat dissipation device, an electric heat dissipation device, and a heat sink. The heat sink contains heat sink pipes, the radiant heat dissipation device contains a first radiant heat dissipation pipe, and the electric heat dissipation device contains a first electric heat dissipation pipe. The heat sink is in contact with the server's components to be cooled. The server heat dissipation control device is applied to the controller, and the server heat dissipation control device includes:

[0186] The first detection module 902 is configured to detect the ambient temperature of the current environment in which the server is located.

[0187] The first control module 904 is configured to control the heat sink pipe and the first radiative heat dissipation pipe to be connected to form a first circulation pipe when the ambient temperature is detected to be less than or equal to the first ambient temperature. The first circulation pipe is filled with a first heat dissipation medium, and the radiative heat dissipation device allows heat to be dissipated from the heat dissipation medium in the first radiative heat dissipation pipe by means of heat radiation.

[0188] The second control module 906 is configured to control the heat sink pipe, the first radiative heat sink pipe, and the first electrical heat sink pipe to conduct when the ambient temperature is detected to be higher than the first ambient temperature, forming a second circulation pipe. The second circulation pipe is filled with a second heat dissipation medium. The radiative heat dissipation device allows the second heat dissipation medium in the first radiative heat sink pipe to dissipate heat through heat radiation, and the electrical heat dissipation device allows the second heat dissipation medium in the first electrical heat sink pipe to dissipate heat through power consumption.

[0189] In one exemplary embodiment, the radiative heat dissipation device further includes a heat dissipation medium cavity and a second radiative heat dissipation pipe, and a first control module, comprising:

[0190] The first transmitting unit is configured to send a conduction signal to the first solenoid valve, the second solenoid valve, the third solenoid valve and the fourth solenoid valve, and to send a start signal to the first flow pump and the second flow pump to form a first circulation pipeline. The first solenoid valve, the second solenoid valve, the third solenoid valve and the fourth solenoid valve are turned on when they receive the conduction signal, and the first flow pump and the second flow pump are operated when they receive the start signal.

[0191] The second control module includes:

[0192] The second sending unit is configured to send a shut-off signal to the first solenoid valve, send an on signal to the second, third, fourth, fifth, and sixth solenoid valves, and send a start signal to the first and second flow pumps to form a second circulation pipeline. The first solenoid valve closes when it receives the shut-off signal, the second, third, fourth, fifth, and sixth solenoid valves open when they receive the on signal, and the first and second flow pumps run when they receive the start signal.

[0193] Specifically, the first radiant outlet of the first radiant heat dissipation pipe is connected to the heat dissipation inlet of the heat dissipation plate pipe via a first solenoid valve and a first flow pump; the heat dissipation outlet of the heat dissipation plate pipe is connected to the first radiant inlet of the first radiant heat dissipation pipe via a second solenoid valve; the second radiant outlet of the second radiant heat dissipation pipe is connected to the cavity inlet of the heat dissipation medium cavity via a third solenoid valve and a second flow pump; the cavity outlet of the heat dissipation medium cavity is connected to the second radiant inlet of the second radiant heat dissipation pipe via a fourth solenoid valve; the first radiant outlet is also connected to the power inlet of the first electric heat dissipation pipe via a fifth solenoid valve; the heat dissipation inlet is also connected to the power outlet of the first electric heat dissipation pipe via a sixth solenoid valve and a first flow pump.

[0194] In one exemplary embodiment, the apparatus further includes:

[0195] The second detection module is configured to detect the first duration of the ambient temperature being higher than the first ambient temperature after the control heat sink pipe and the first radiative heat sink pipe are connected to form the first circulation pipe and the ambient temperature is detected to rise to a level higher than the first ambient temperature.

[0196] The third control module is configured to continue controlling the heat sink pipe and the first radiative heat dissipation pipe to connect and form the first circulation pipe when the first duration is detected to be less than or equal to the first duration.

[0197] The fourth control module is configured to control the heat sink pipe, the first radiative heat dissipation pipe, and the first power heat dissipation pipe to conduct when the first duration is detected to be longer than the first duration, thereby forming a second circulation pipe.

[0198] In one exemplary embodiment, the power cooling device further includes a power radiator mounted on the first power cooling pipe, and the device also includes:

[0199] The third detection module is configured to detect whether the ambient temperature is greater than the second ambient temperature after the control heat sink pipe, the first radiative heat sink pipe and the first power heat sink pipe are connected to form the second circulation pipe. The second ambient temperature is greater than the first ambient temperature.

[0200] The fifth control module is configured to control the electric radiator to convert electrical energy into wind energy to cool the first electric cooling pipe when the ambient temperature is detected to be less than or equal to the second ambient temperature.

[0201] The sixth control module is configured to control the electric radiator to use electrical energy to evaporate refrigerant and cool the first electric radiator pipe when the ambient temperature is detected to be higher than the second ambient temperature.

[0202] In one exemplary embodiment, the apparatus further includes one of the following:

[0203] The fourth detection module is configured to, after controlling the electric radiator to convert electrical energy into wind energy to cool the first electric cooling pipe, detect whether the ambient temperature is less than or equal to a first ambient temperature; if the ambient temperature is detected to be less than or equal to the first ambient temperature, detect a second duration during which the ambient temperature is less than or equal to the first ambient temperature; if the second duration is detected to be greater than the second duration, control the heat dissipation plate pipe to connect with the first radiant heat dissipation pipe to form a first circulation pipe, and shut down the electric cooling device; if the second duration is detected to be less than the second duration, continue to control the electric radiator to convert electrical energy into wind energy to cool the first electric cooling pipe.

[0204] The fifth detection module is configured to, after controlling the electric radiator to convert electrical energy into wind energy to cool the first electric cooling pipe, detect whether the ambient temperature is greater than the second ambient temperature; if the ambient temperature is detected to be greater than the second ambient temperature, detect the third duration for which the ambient temperature is greater than the second ambient temperature; if the third duration is detected to be greater than the third duration, control the electric radiator to use electrical energy to evaporate refrigerant to cool the first electric cooling pipe; if the third duration is detected to be less than or equal to the third duration, continue to control the electric radiator to convert electrical energy into wind energy to cool the first electric cooling pipe.

[0205] In one exemplary embodiment, the apparatus further includes:

[0206] The sixth detection module is configured to detect whether the ambient temperature is less than or equal to the second ambient temperature after the electric radiator uses electrical energy to evaporate the refrigerant to cool the first electric radiator pipe.

[0207] The seventh detection module is configured to detect the fourth duration for which the ambient temperature is less than or equal to the second ambient temperature when the ambient temperature is detected to be less than or equal to the second ambient temperature; and to control the electric radiator to convert electrical energy into wind energy to cool the first electric cooling pipe when the fourth duration is detected to be greater than the fourth duration, and to prohibit the electric radiator from using electrical energy to evaporate refrigerant to cool the first electric cooling pipe.

[0208] The seventh control module is configured to continue controlling the electric radiator to use electrical energy to evaporate refrigerant and cool the first electric radiator pipe if the fourth duration is detected to be less than or equal to the fourth duration.

[0209] It should be noted that each module can be implemented by software or hardware. For the latter, it can be implemented in the following ways, but not limited to: all modules are located in the same processor; or, each module is located in a different processor in any combination.

[0210] Embodiments of this application also provide a computer program product, including a computer program that, when executed by a processor, implements the steps of the methods in various embodiments of this application; the computer program product further includes a non-volatile computer-readable storage medium storing the computer program, which, when executed by a processor, implements the steps of the methods in various embodiments of this application.

[0211] Embodiments of this application also provide a non-volatile computer-readable storage medium storing a computer program, wherein the computer program is configured to execute the steps of any of the method embodiments at runtime.

[0212] In one exemplary embodiment, the non-volatile computer-readable storage medium may include, but is not limited to, various media capable of storing computer programs, such as USB flash drives, read-only memory (ROM), random access memory (RAM), portable hard drives, magnetic disks, or optical disks.

[0213] An embodiment of this application also provides an electronic device. FIG21 is a schematic diagram of an electronic device according to an embodiment of this application. As shown in FIG21, the electronic device includes a memory and a processor. The memory stores a computer program, and the processor is configured to run the computer program to perform the steps in any of the method embodiments.

[0214] In one exemplary embodiment, the electronic device may further include a transmission device and an input / output device, wherein the transmission device is connected to a processor and the input / output device is connected to a processor.

[0215] The optional examples in this embodiment can be found in the examples described in the embodiments and exemplary implementations, and will not be repeated here.

[0216] It is obvious to those skilled in the art that the modules or steps of this application can be implemented using general-purpose computing devices. They can be centralized on a single computing device or distributed across a network of multiple computing devices. They can be implemented using computer-executable program code, and thus can be stored in a storage device for execution by a computing device. In some cases, the steps shown or described can be performed in a different order than those presented herein, or they can be fabricated as separate integrated circuit modules, or multiple modules or steps can be fabricated as a single integrated circuit module. Thus, this application is not limited to any particular combination of hardware and software.

[0217] The above are merely optional embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the principles of this application should be included within the protection scope of this application.

Claims

1. A server heat dissipation device, characterized in that, a controller, a radiation heat dissipation device, a power heat dissipation device and a heat dissipation plate are arranged in the server heat dissipation device, the heat dissipation plate is arranged with a heat dissipation plate pipeline, the radiation heat dissipation device is arranged with a first radiation heat dissipation pipeline, the power heat dissipation device is arranged with a first power heat dissipation pipeline, and the heat dissipation plate is in contact with a component of the server to be cooled, wherein, the controller is configured to detect an ambient temperature of an environment in which the server is currently located, control the heat dissipation plate pipeline and the first radiation heat dissipation pipeline to be in communication to form a first circulation pipeline when it is detected that the ambient temperature is less than or equal to a first ambient temperature, and control the heat dissipation plate pipeline, the first radiation heat dissipation pipeline and the first power heat dissipation pipeline to be in communication to form a second circulation pipeline when it is detected that the ambient temperature is greater than the first ambient temperature, wherein the first circulation pipeline is filled with a first heat dissipation medium, and the second circulation pipeline is filled with a second heat dissipation medium; the radiation heat dissipation device is configured to dissipate heat of the first heat dissipation medium or the second heat dissipation medium in the first radiation heat dissipation pipeline by heat radiation; the power heat dissipation device is configured to dissipate heat of the second heat dissipation medium in the first power heat dissipation pipeline by power consumption.

2. The server heat dissipation apparatus according to claim 1, wherein, The first heat dissipation medium is a mixture of heat dissipation medium in the heat dissipation plate pipeline and heat dissipation medium in the first radiation heat dissipation pipeline, and the second heat dissipation medium is a mixture of heat dissipation medium in the heat dissipation plate pipeline, heat dissipation medium in the first radiation heat dissipation pipeline and heat dissipation medium in the first power heat dissipation pipeline. 3.The server heat dissipation device of claim 1, characterized in that, a radiation radiator and a phase change energy accumulator are arranged in the radiation heat dissipation device, wherein, the radiation radiator is configured to reduce heat in a third heat dissipation medium by heat radiation to obtain the third heat dissipation medium with a medium temperature less than a first medium temperature, and transmit the third heat dissipation medium with the medium temperature less than the first medium temperature to the phase change energy accumulator, wherein the third heat dissipation medium with the medium temperature less than the first medium temperature is used to cool a phase change energy material in the phase change energy accumulator; the phase change energy accumulator is configured to store the phase change energy material, wherein the phase change energy material is in a first phase state when a temperature is less than a first phase change temperature, the phase change energy material is in a second phase state when a temperature is greater than a second phase change temperature, the first medium temperature is less than the first phase change temperature, the first phase change temperature is less than or equal to the second phase change temperature, and the first phase state and the second phase state are different physical phase states of the phase change energy material. 4.The server heat dissipation device of claim 3, characterized in that, the radiation radiator comprises a heat dissipation medium cavity and a radiation heat dissipation material, and the radiation heat dissipation material covers the heat dissipation medium cavity, wherein, the heat dissipation medium cavity is configured to store the third heat dissipation medium, and a thermal conductivity of a material of the heat dissipation medium cavity is greater than a first thermal conductivity. The radiation heat dissipation material is configured to convert heat of the third heat dissipation medium stored in the heat dissipation medium cavity into energy of a preset wave band and radiate the energy outward.

5. The server heat dissipation device according to claim 3, wherein, The phase change energy storage device comprises a phase change energy storage material cavity, a first radiation heat dissipation pipeline and a second radiation heat dissipation pipeline, and the first and second radiation heat dissipation pipelines are arranged in the phase change energy storage material cavity. The phase change energy storage material cavity is configured to store phase change energy storage material, wherein the phase change energy storage material cavity has a heat conductivity lower than the second heat conductivity with respect to the outside, and the phase change energy storage material is filled outside the first and second radiation heat dissipation pipelines. The second radiation heat dissipation pipeline is configured to receive the third heat dissipation medium with a medium temperature lower than the first medium temperature from the radiation heat sink.

6. The server heat dissipation device according to claim 1, wherein, The power heat dissipation device further comprises a power heat sink, and the power heat sink is arranged on the first power heat dissipation pipeline. The first power heat dissipation pipeline is configured to transmit the second heat dissipation medium in the second circulating pipeline. The power heat sink is configured to cool the second heat dissipation medium in the first power heat dissipation pipeline.

7. The server heat dissipation device according to claim 6, wherein, The power heat sink comprises a first air-cooled heat sink and a second power heat dissipation pipeline. The second power heat dissipation pipeline is configured to exchange heat with the first power heat dissipation pipeline. The first air-cooled heat sink is configured to convert electric energy into wind energy to cool the second power heat dissipation pipeline.

8. The server heat dissipation device according to claim 7, wherein, The power heat sink comprises a first air-conditioning cold heat sink and a third power heat dissipation pipeline. The third power heat dissipation pipeline is configured to exchange heat with the first power heat dissipation pipeline. The first air-conditioning cold heat sink is configured to use electric energy to evaporate refrigerant to cool the third power heat dissipation pipeline.

9. The server heat dissipation device according to claim 7, wherein, The power heat sink comprises a second air-cooled heat sink, a second air-conditioning cold heat sink and a fourth power heat dissipation pipeline. The fourth power heat dissipation pipeline is configured to exchange heat with the first power heat dissipation pipeline. The second air-cooled heat sink is configured to convert electric energy into wind energy to cool the fourth power heat dissipation pipeline. The second air-conditioning cold heat sink is configured to use electric energy to evaporate refrigerant to cool the fourth power heat dissipation pipeline.

10. The server heat dissipation device according to claim 7, wherein, The power heat sink comprises a third air-cooled heat sink, a third air-conditioning cold heat sink, a fifth power heat dissipation pipeline and a sixth power heat dissipation pipeline. The fifth power heat dissipation pipeline is configured to exchange heat with the first power heat dissipation pipeline. The sixth electric heat dissipation pipeline is arranged to exchange heat with the first electric heat dissipation pipeline. The third air-cooled heat sink is arranged to convert electric energy into wind energy to cool the fifth electric heat dissipation pipeline. The third air-conditioning heat sink is arranged to use electric energy to evaporate refrigerant to cool the sixth electric heat dissipation pipeline.

11. The server heat dissipation device according to claim 1, wherein the heat dissipation plate comprises a heat dissipation substrate and a heat dissipation plate pipeline arranged inside the heat dissipation substrate, and the heat dissipation plate is in contact with a component to be cooled of the server through the heat dissipation substrate, and wherein the heat dissipation substrate is arranged to exchange heat with the component to be cooled, and the heat dissipation plate pipeline is arranged to cool the heat dissipation substrate.

12. The server heat dissipation device according to claim 1, wherein the radiation heat dissipation device comprises a heat dissipation medium cavity, a first radiation heat dissipation pipeline and a second radiation heat dissipation pipeline, and the electric heat dissipation device comprises the first electric heat dissipation pipeline and an electric heat sink, and wherein a first radiation outlet of the first radiation heat dissipation pipeline is connected with a heat dissipation inlet of the heat dissipation plate pipeline, and a heat dissipation outlet of the heat dissipation plate pipeline is connected with a first radiation inlet of the first radiation heat dissipation pipeline; a second radiation outlet of the second radiation heat dissipation pipeline is connected with a cavity inlet of the heat dissipation medium cavity, and a cavity outlet of the heat dissipation medium cavity is connected with a second radiation inlet of the second radiation heat dissipation pipeline; the first radiation outlet is further connected with an electric inlet of the first electric heat dissipation pipeline, and the heat dissipation inlet is further connected with an electric outlet of the first electric heat dissipation pipeline; the heat dissipation medium cavity is arranged to store a third heat dissipation medium with a medium temperature lower than a first medium temperature; and the electric heat sink is arranged to cool a second heat dissipation medium in the first electric heat dissipation pipeline by consuming electric power.

13. The server heat dissipation device according to claim 12, wherein the first radiation outlet of the first radiation heat dissipation pipeline and the heat dissipation inlet of the heat dissipation plate pipeline are connected through a first electromagnetic valve and a first flow pump, the heat dissipation outlet of the heat dissipation plate pipeline and the first radiation inlet of the first radiation heat dissipation pipeline are connected through a second electromagnetic valve, the second radiation outlet of the second radiation heat dissipation pipeline and the cavity inlet of the heat dissipation medium cavity are connected through a third electromagnetic valve and a second flow pump, the cavity outlet of the heat dissipation medium cavity and the second radiation inlet of the second radiation heat dissipation pipeline are connected through a fourth electromagnetic valve, the first radiation outlet is further connected with the electric inlet of the first electric heat dissipation pipeline through a fifth electromagnetic valve, and the heat dissipation inlet is further connected with the electric outlet of the first electric heat dissipation pipeline through a sixth electromagnetic valve and a first flow pump. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ The controller is configured to control the first electromagnetic valve, the second electromagnetic valve, the third electromagnetic valve and the fourth electromagnetic valve to be turned on to form the first circulation pipeline and control the first flow pump and the second flow pump to operate when detecting that the environment temperature is less than or equal to the first environment temperature; control the first electromagnetic valve to be turned off, control the second electromagnetic valve, the third electromagnetic valve, the fourth electromagnetic valve, the fifth electromagnetic valve and the sixth electromagnetic valve to be turned on to form the second circulation pipeline, and control the first flow pump, the second flow pump and the electric power radiator to operate when detecting that the environment temperature is greater than the first environment temperature.

14. A control method of heat dissipation of a server, characterized by, A controller is arranged in a server heat dissipation device, a radiation heat dissipation device, an electric power heat dissipation device and a heat dissipation plate, the heat dissipation plate is arranged with a heat dissipation plate pipeline, the radiation heat dissipation device is arranged with a first radiation heat dissipation pipeline, the electric power heat dissipation device is arranged with a first electric power heat dissipation pipeline, the heat dissipation plate is in contact with a component of the server to be heat dissipated, the method is applied to the controller, and the method comprises: Detecting an environment temperature of an environment where the server is currently located; Controlling the heat dissipation plate pipeline and the first radiation heat dissipation pipeline to be turned on to form a first circulation pipeline when detecting that the environment temperature is less than or equal to a first environment temperature, wherein the first circulation pipeline is filled with a first heat dissipation medium, and the radiation heat dissipation device allows the heat dissipation medium in the first radiation heat dissipation pipeline to be heat dissipated through heat radiation; Controlling the heat dissipation plate pipeline, the first radiation heat dissipation pipeline and the first electric power heat dissipation pipeline to be turned on to form a second circulation pipeline when detecting that the environment temperature is greater than the first environment temperature, wherein the second circulation pipeline is filled with a second heat dissipation medium, the radiation heat dissipation device allows the second heat dissipation medium in the first radiation heat dissipation pipeline to be heat dissipated through heat radiation, and the electric power heat dissipation device allows the second heat dissipation medium in the first electric power heat dissipation pipeline to be heat dissipated through power consumption.

15. The method of claim 14, wherein: The radiation heat dissipation device is further arranged with a heat dissipation medium cavity and a second radiation heat dissipation pipeline, and the controlling the heat dissipation plate pipeline and the first radiation heat dissipation pipeline to be turned on to form a first circulation pipeline comprises: Sending a turn-on signal to a first electromagnetic valve, a second electromagnetic valve, a third electromagnetic valve and a fourth electromagnetic valve, and sending a start signal to a first flow pump and a second flow pump to form the first circulation pipeline, wherein the first electromagnetic valve, the second electromagnetic valve, the third electromagnetic valve and the fourth electromagnetic valve are turned on when receiving the turn-on signal, and the first flow pump and the second flow pump operate when receiving the start signal; The controlling the heat dissipation plate pipeline, the first radiation heat dissipation pipeline and the first electric power heat dissipation pipeline to be turned on to form a second circulation pipeline comprises: sending a closing signal to the first electromagnetic valve, sending a conducting signal to the second electromagnetic valve, the third electromagnetic valve, the fourth electromagnetic valve, the fifth electromagnetic valve and the sixth electromagnetic valve, and sending a starting signal to the first flow pump and the second flow pump to form the second circulating pipeline, wherein the first electromagnetic valve is closed upon receiving the closing signal, the second electromagnetic valve, the third electromagnetic valve, the fourth electromagnetic valve, the fifth electromagnetic valve and the sixth electromagnetic valve are conducted upon receiving the conducting signal, and the first flow pump and the second flow pump are operated upon receiving the starting signal; The first radiation outflow port of the first radiation heat dissipation pipeline is connected with the heat dissipation inflow port of the heat dissipation plate pipeline through the first electromagnetic valve and the first flow pump, and the heat dissipation outflow port of the heat dissipation plate pipeline is connected with the first radiation inflow port of the first radiation heat dissipation pipeline through the second electromagnetic valve; the second radiation outflow port of the second radiation heat dissipation pipeline is connected with the cavity inflow port of the heat dissipation medium cavity through the third electromagnetic valve and the second flow pump, and the cavity outflow port of the heat dissipation medium cavity is connected with the second radiation inflow port of the second radiation heat dissipation pipeline through the fourth electromagnetic valve; the first radiation outflow port is also connected with the power inflow port of the first power heat dissipation pipeline through the fifth electromagnetic valve, and the heat dissipation inflow port is also connected with the power outflow port of the first power heat dissipation pipeline through the sixth electromagnetic valve and the first flow pump.

16. The method of claim 14, wherein, after the control of the heat dissipation plate pipeline and the first radiation heat dissipation pipeline to be conducted to form the first circulating pipeline, the method further comprises: when the ambient temperature is detected to rise to be greater than the first ambient temperature, detecting a first duration that the ambient temperature is greater than the first ambient temperature; when the first duration is detected to be less than or equal to a first time, continuing to control the heat dissipation plate pipeline and the first radiation heat dissipation pipeline to be conducted to form the first circulating pipeline; when the first duration is detected to be greater than the first time, controlling the heat dissipation plate pipeline, the first radiation heat dissipation pipeline and the first power heat dissipation pipeline to be conducted to form the second circulating pipeline.

17. The method of claim 14, wherein, the power heat dissipation device further deploys a power radiator installed on the first power heat dissipation pipeline, and after the control of the heat dissipation plate pipeline, the first radiation heat dissipation pipeline and the first power heat dissipation pipeline to be conducted to form the second circulating pipeline, the method further comprises: detecting whether the ambient temperature is greater than a second ambient temperature, wherein the second ambient temperature is greater than the first ambient temperature; when the ambient temperature is detected to be less than or equal to the second ambient temperature, controlling the power radiator to convert electrical energy into wind energy to cool the first power heat dissipation pipeline; In a case where it is detected that the ambient temperature is greater than the second ambient temperature, the electric power radiator is controlled to use electric energy to evaporate refrigerant to cool the first electric power radiator pipeline.

18. The method of claim 17, wherein, After the electric power radiator is controlled to convert electric energy into wind energy to cool the first electric power radiator pipeline, the method further comprises one of: detecting whether the ambient temperature is less than or equal to the first ambient temperature; in a case where it is detected that the ambient temperature is less than or equal to the first ambient temperature, detecting a second duration for which the ambient temperature is less than or equal to the first ambient temperature; in a case where it is detected that the second duration is greater than a second time length, controlling the heat dissipation plate pipeline to be in conduction with the first radiation heat dissipation pipeline to form a first circulation pipeline, and turning off the electric power radiator; in a case where it is detected that the second duration is less than the second time length, continuing to control the electric power radiator to convert electric energy into wind energy to cool the first electric power radiator pipeline; detecting whether the ambient temperature is greater than the second ambient temperature; in a case where it is detected that the ambient temperature is greater than the second ambient temperature, detecting a third duration for which the ambient temperature is greater than the second ambient temperature; in a case where it is detected that the third duration is greater than a third time length, controlling the electric power radiator to use electric energy to evaporate refrigerant to cool the first electric power radiator pipeline; in a case where it is detected that the third duration is less than or equal to the third time length, continuing to control the electric power radiator to convert electric energy into wind energy to cool the first electric power radiator pipeline.

19. The method of claim 17, wherein, After the electric power radiator is controlled to use electric energy to evaporate refrigerant to cool the first electric power radiator pipeline, the method further comprises: detecting whether the ambient temperature is less than or equal to the second ambient temperature; in a case where it is detected that the ambient temperature is less than or equal to the second ambient temperature, detecting a fourth duration for which the ambient temperature is less than or equal to the second ambient temperature; in a case where it is detected that the fourth duration is greater than a fourth time length, controlling the electric power radiator to convert electric energy into wind energy to cool the first electric power radiator pipeline, and prohibiting the electric power radiator from using electric energy to evaporate refrigerant to cool the first electric power radiator pipeline; in a case where it is detected that the fourth duration is less than or equal to the fourth time length, continuing to control the electric power radiator to use electric energy to evaporate refrigerant to cool the first electric power radiator pipeline.

20. A control device for heat dissipation of a server, comprising: The server heat dissipation device is provided with a controller, a radiation heat dissipation device, a power heat dissipation device and a heat dissipation plate, the heat dissipation plate is provided with a heat dissipation plate pipeline, the radiation heat dissipation device is provided with a first radiation heat dissipation pipeline, the power heat dissipation device is provided with a first power heat dissipation pipeline, the heat dissipation plate is in contact with the heat dissipation part of the server, the server heat dissipation control device is applied to the controller, and the server heat dissipation control device comprises: A first detection module is arranged to detect the environment temperature of the current environment of the server. A first control module is arranged to control the heat dissipation plate pipeline and the first radiation heat dissipation pipeline to be in conduction to form a first circulation pipeline when it is detected that the environment temperature is less than or equal to a first environment temperature, wherein the first circulation pipeline is filled with a first heat dissipation medium, and the radiation heat dissipation device allows the heat dissipation medium in the first radiation heat dissipation pipeline to be dissipated by heat radiation. A second control module is arranged to control the heat dissipation plate pipeline, the first radiation heat dissipation pipeline and the first power heat dissipation pipeline to be in conduction to form a second circulation pipeline when it is detected that the environment temperature is greater than the first environment temperature, wherein the second circulation pipeline is filled with a second heat dissipation medium, the radiation heat dissipation device allows the second heat dissipation medium in the first radiation heat dissipation pipeline to be dissipated by heat radiation, and the power heat dissipation device allows the second heat dissipation medium in the first power heat dissipation pipeline to be dissipated by power consumption.

21. A computer program product, comprising a computer program, wherein the computer program is executed by a processor to implement the steps of the method in any one of claims 14-19.

22. A non-volatile computer readable storage medium, comprising a computer program, wherein the computer program is executed by a processor to implement the steps of the method in any one of claims 14-19.

23. An electronic device, comprising a memory, a processor and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the steps of the method in any one of claims 14-19. ​ ​ ​

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