Evaporation source, nozzle set, and method of assembling an evaporation source

Abstract

An evaporation source for depositing a layer on a substrate, comprising: a vapor distribution pipe having a plurality of openings provided along a longitudinal axis of the vapor distribution pipe, the plurality of openings facing in a first direction; a plurality of nozzles arranged at the plurality of openings, wherein each nozzle comprises a plume forming part thermally coupled with the vapor distribution pipe, the plume forming part being configured for at least one of forming or shaping a vapor plume directed from the vapor distribution pipe towards the substrate, wherein the plume forming part is rotationally asymmetric with respect to the first direction; and a plurality of fasteners connecting the plurality of nozzles to the vapor distribution pipe such that at least the plume forming part of each nozzle of the plurality of nozzles is locked against rotation about the first direction.

Description

EVAPORATION SOURCE, NOZZLE SET, AND METHOD OF ASSEMBLING ANEVAPORATION SOURCETECHNICAL FIELD

[0001] Embodiments of the present disclosure relate to apparatuses for depositing a layer on a substrate. More particularly, embodiments of the present disclosure relate to an evaporation source, a nozzle set, and a method of assembling an evaporation source. In particular, an evaporation source may be provided for depositing materials of an OLED layer stack on a substrate. Evaporation sources described herein may be configured for depositing one or more metal layers and / or organic layers of an OLED layer stack on a substrate.BACKGROUND

[0002] An organic light-emitting diode (OLED) is a light-emitting diode in which an electroluminescent layer is a film of organic compounds that emits light in response to an electric current. Since OLEDs emit light directly, without involving backlight and color filters, the color gamut and viewing angles possible with OLED displays are greater than those of traditional LCD displays. Furthermore, OLEDs can be manufactured on flexible substrates, and, accordingly, they can be utilized in a variety of applications. Organic light emitting diodes (OLEDs) are used in the manufacture of television screens, computer monitors, mobile phones, other hand-held devices, etc., for displaying information. OLEDs can also be used for general space illumination. An OLED display, for example, may include layers of organic material situated between two electrodes that are deposited on a substrate in a manner so as to form a matrix display panel having individually energizable pixels.

[0003] Organic materials and metallic materials are deposited on a substrate in a vacuum processing chamber for OLED manufacturing. Metallic materials are employed as, for example, electrode materials or electron injection layer (EIL)materials. The materials to be deposited are evaporated using evaporation sources, and the evaporated materials are directed onto a substrate by nozzles. Metallic materials are typically evaporated in an evaporation source at a temperature of 1 ,000°C or above or 1 ,500°C or above. Organic materials are typically evaporated in an evaporation source at temperatures between 250°C and 500°C.

[0004] Metallic and organic evaporators can be used for the production of organic light-emitting diodes (OLED). Also other applications utilize evaporators for depositing metal or organic layers, for example, onto large area substrates. An OLED display, for example, may include a plurality of layers of organic material situated between two electrodes that are deposited on a substrate. One of the electrodes can include a transparent conductive layer such as indium tin oxide (ITO) or other transparent conductive oxide materials (TOO). The second electrode can include a metal or a metal alloy.

[0005] In conventional evaporation sources, particularly conventional OLED evaporation sources, deposition material is typically provided to the substrate via a row of rotationally symmetric nozzles, wherein each nozzle includes an external thread on an outer circumference of the nozzle. The thread is used to screw the nozzles into respective openings of an evaporation tube. Due to increasing complexity of deposition procedures, there is a need for additional control over the vapor plume emitted by the evaporation source. However, providing evaporation sources with a higher flexibility in shape and direction of the vapor plume emitted by the evaporation source remains challenging.

[0006] Accordingly, improved evaporation sources, nozzle sets, and methods of assembling an evaporation source would be beneficial.SUMMARY

[0007] In light of the above, an evaporation source, a nozzle set, and a method of assembling an evaporation source are provided according to the independent claims. Further aspects, benefits, and features of the present disclosure are apparent from the claims, the description, and the accompanying drawings.

[0008] According to an aspect, an evaporation source for depositing a layer on a substrate is provided. The evaporation source includes a vapor distribution pipe having a plurality of openings provided along a longitudinal axis of the vapor distribution pipe, the plurality of openings facing in a first direction. The evaporation source includes a plurality of nozzles arranged at the plurality of openings, wherein each nozzle includes a plume forming part thermally coupled with the vapor distribution pipe. The plume forming part is configured for at least one of forming or shaping a vapor plume directed from the vapor distribution pipe towards the substrate. The plume forming part is rotationally asymmetric with respect to the first direction. The evaporation source includes a plurality of fasteners connecting the plurality of nozzles to the vapor distribution pipe such that at least the plume forming part of each nozzle of the plurality of nozzles is locked against rotation about the first direction.

[0009] According to another aspect, a nozzle set for an evaporation source according to any of the embodiments described herein is provided, the nozzle set including the plurality of nozzles.

[0010] According to yet another aspect, a method of assembling an evaporation source for depositing a layer on a substrate is provided. The method includes providing a vapor distribution pipe having a plurality of openings provided along a longitudinal axis of the vapor distribution pipe, the plurality of openings facing in a first direction. The method includes fastening a plurality of nozzles at the plurality of openings of the vapor distribution pipe using a plurality of fasteners, wherein each nozzle of the plurality of nozzles includes a plume forming part configured for at least one of forming or shaping a vapor plume directed from the vapor distribution pipe towards the substrate. Fastening the plurality of nozzles to the vapor distribution pipe includes thermally coupling the plume forming part of each nozzle with the vapor distribution pipe, and locking at least the plume forming part of each nozzle against rotation about the first direction.BRIEF DESCRIPTION OF THE DRAWINGS

[0011] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the disclosure and are described in the following:

[0012] FIG. 1 shows a schematic sectional view of an evaporation source according to embodiments;

[0013] FIG. 2 shows a schematic sectional view of a nozzle fastened to a vapor distribution pipe according to embodiments of the present disclosure;

[0014] FIG. 3 shows a schematic front view of a nozzle fastened to a vapor distribution pipe according to embodiments;

[0015] FIG. 4 shows a schematic sectional view of a nozzle fastened to a vapor distribution pipe according to further embodiments of the present disclosure;

[0016] FIG. 5 shows a schematic view of an evaporation source according to embodiments;

[0017] FIG. 6 shows a schematic sectional view of an arrangement of evaporation sources having nozzles with more than one outlet per nozzle according to embodiments described herein;

[0018] FIG. 7A schematically illustrates a sectional view of a plume focusing nozzle according to embodiments;

[0019] FIG. 7B shows a front view of a nozzle according to FIG. 7A;

[0020] FIG. 7C schematically illustrates a sectional view of an evaporation source having a nozzle as illustrated in FIGS. 7A and 7B;

[0021] FIG. 8A schematically illustrates a front view of a vapor distribution pipe according to embodiments;

[0022] FIG. 8B schematically illustrates a front view of an evaporation source including the vapor distribution pipe of FIG. 8A and a plurality of nozzles fastened to the vapor distribution pipe according to embodiments described herein;

[0023] FIG. 8C shows a sectional side view of the evaporation source of FIG. 8B;

[0024] FIG. 9 shows a schematic view of a vacuum deposition system with an evaporation source according to embodiments;

[0025] FIG. 10 shows a schematic sectional view of a substrate with an OLED layer stack, manufactured using one or more evaporation sources according to embodiments of the present disclosure; and

[0026] FIG. 11 shows a flow diagram of a method of assembling an evaporation source according to embodiments of the present disclosure.DETAILED DESCRIPTION

[0027] Reference will now be made in detail to the various embodiments, one or more examples of which are illustrated in each figure. Each example is provided by way of explanation and is not meant as a limitation. For example, features illustrated or described as part of one embodiment can be used on or in conjunction with any other embodiment to yield yet a further embodiment. It is intended that the present disclosure includes such modifications and variations. Within the following description of the drawings, the same reference numbers refer to the same or to similar components. Generally, only the differences with respect to the individual embodiments are described. Unless specified otherwise, the description of a part or aspect in one embodiment can apply to a corresponding part or aspect in another embodiment as well.

[0028] According to embodiments of the present disclosure, an evaporation source for depositing a layer on a substrate is provided. The evaporation source includes a vapor distribution pipe having a plurality of openings provided along a longitudinal axis of the vapor distribution pipe. The plurality of openings face in a first direction,particularly all openings in the same direction. For example, the first direction of an opening may be perpendicular to an area encompassed by the edges of the opening. The first direction of an opening may be a direction along the central axis of the opening, the central axis of the opening being directed from the inside of the vapor distribution pipe to the outside of the vapor distribution pipe.

[0029] In embodiments, the evaporation source includes a plurality of nozzles arranged at the plurality of openings. Each of the plurality of nozzles includes a plume forming part. The plume forming part is configured for at least one of forming or shaping a vapor plume directed from the vapor distribution pipe towards the substrate. In embodiments, the plume forming part is rotationally asymmetric with respect to the first direction. Herein, a plume forming part can be considered rotationally asymmetric with respect to the first direction, if the plume forming part is rotationally asymmetric for at least one angle of rotation about the first direction. In particular, some embodiments may be mirror-symmetric and / or axially symmetric. However, such plume forming parts are rotationally asymmetric because angles of rotation exist, for which the plume forming part is not rotationally symmetric.

[0030] For example, the plurality of nozzles may include tilted nozzles, wherein the plume forming part of a nozzle is tilted with respect to the first direction of an opening at which the nozzle is arranged. Tilted nozzles may be used to direct the vapor plume, particularly a main emission direction of the plume forming part, in a direction different from the first direction. For instance, tilted nozzles may be used to deposit material under overhangs on a substrate, for example according to embodiments described herein (see, e.g., FIG. 10). In some embodiments, the plurality of nozzles may include vapor plume focusing nozzles, wherein a vapor plume emitted from the nozzle is shaped by the plume forming part, such that the vapor is focused in at least one dimension, particularly in exactly one dimension. A plume forming part of a plume focusing nozzle may herein also be referred to as a plume focusing part. For example, a plume focusing nozzle may have a duck-nozzle-shaped plume forming part. According to some embodiments of the present disclosure, each plume forming part of the plurality of nozzles is configured for emitting a rotationally asymmetric vapor plume from the vapor distribution pipe towards the substrate, the vapor plume being rotationally asymmetric with respect to the first direction. In some embodiments, thevapor plume may be rotationally asymmetric with respect to a main emission direction of the plume forming part, particularly rotationally asymmetric with respect to the main emission direction and with respect to the first direction.

[0031] In embodiments, the plume forming part of each nozzle is in thermal contact with the vapor distribution pipe, particularly such that condensation of evaporation material on the plume forming part can be reduced or avoided. For example, nozzles according to the present disclosure may also be referred to as “hot nozzles”. The plume forming part of a nozzle may be understood as the part of the nozzle involved in forming, shaping and / or directing the vapor emitted from the nozzle as a vapor plume. In addition to the plume forming part, a nozzle may include one or more further parts, particularly an interface for fastening the nozzle to the vapor distribution pipe, or a channel part extending in the first direction into an opening of the vapor distribution pipe according to embodiments described herein. In some embodiments, the plume forming part of a nozzle is disposed at least partially outside the vapor distribution pipe. It is understood that the plurality of nozzles may include features in accordance with any of the embodiments described herein, particularly in accordance with any of the nozzles described herein.

[0032] The use of rotationally asymmetric plume forming parts in conventional evaporation sources may be challenging. In particular, achieving an alignment of conventional nozzles for a precise and uniform deposition may be challenging, for example using conventional nozzles having an outer thread to screw the nozzle into an opening. More specifically, such conventional nozzles may be screwed manually into the respective openings, thus making an exact alignment of all nozzles in a row of nozzles difficult. Embodiments of the present disclosure provide an evaporation source and nozzles, particularly hot nozzles, which can be precisely aligned. The alignment can be provided by fastening at least the plume forming part of each nozzle to the vapor distribution pipe such that the plume forming part is locked against rotation about the first direction, particularly about the first direction of the opening at which the plume forming part is arranged. Embodiments of the present disclosure may provide a high flexibility in material deposition using rotationally asymmetric nozzles, for example high flexibility with respect to vapor plume directions and / or vapor plume angles relative to the substrate or relative to further evaporation sources in an evaporation sourcearrangement including multiple evaporation sources. In particular, complex nozzles, e.g. oriented nozzles, duck nozzles or slitted nozzles, may be precisely aligned and / or oriented for use in deposition of layers such as organic layers and / or metallic layers on a substrate. Further, a nozzle set fastened to a vapor distribution pipe may be exchanged with a further nozzle set, such as a further nozzle set having a different plume forming part.

[0033] For example, FIG. 1 shows an evaporation source 101 according to embodiments described herein in a vertical sectional plane. In the present disclosure, an evaporation source may be an arrangement configured for evaporation of a source material for deposition of the material on a substrate. The evaporation source 101 may have a crucible 112 configured to evaporate a source material to be deposited onto the substrate. In embodiments, the evaporation source includes a vapor distribution pipe 110 configured to direct the evaporated source material towards the substrate through a plurality of nozzles 111. In particular, the vapor distribution pipe 110 can be in fluid communication with the crucible 112.

[0034] In some embodiments, the vapor distribution pipe 110, which may also be referred to as a vapor distribution tube, may provide a line source with a plurality of nozzles that are arranged in a row (or “line array”) one above the other along a longitudinal direction of the vapor distribution pipe, particularly in a row of openings provided along a longitudinal axis 106 of the vapor distribution pipe 110. The longitudinal axis 106 may correspond to an essentially vertical axis to provide an essentially vertical line source. The vapor distribution pipe may have a single row of nozzles, particularly one single vertical nozzle row suitable to coat substrates having an essentially vertical orientation. An “essentially vertical direction” as used herein relates to a direction that corresponds to the direction of gravity or deviates from the direction of gravity by less than 10°. In FIG. 1 , each of the plurality of nozzles 111 is provided at a respective opening in the vapor distribution pipe 110. The plurality of openings of the vapor distribution pipe 110 each face in a first direction 105. Each of the plurality of nozzles 111 has a plume forming part that is rotationally asymmetric about the first direction 105 of the respective opening of the vapor distribution pipe 110. In further embodiments, more than one nozzle may be arranged at an opening, particularly as described herein with respect to further embodiments (see, e.g.,FIGS. 8A-C).

[0035] According to embodiments, the source material to be deposited may be an inorganic material, particularly a metallic material such as a metallic material for use as an electrode material or an electron transport layer material in an OLED layer stack, or the source material may be an organic material, such as an organic material for organic light emitting diode (OLED) production.

[0036] According to some embodiments, the evaporation source 101 may further include a rotation drive 113 for rotating the vapor distribution pipe 110 around a rotation axis, for example, around the longitudinal axis 106.

[0037] According to embodiments of the present disclosure, the evaporation source includes a plurality of fasteners connecting the plurality of nozzles to the vapor distribution pipe, such that at least the plume forming part of each nozzle of the plurality of nozzles is locked against rotation about the first direction. For example, the plurality of fasteners may be or may include at least one of screws or bolts.

[0038] According to some embodiments, the plurality of nozzles includes a plurality of interfaces for connecting the plurality of nozzles to the vapor distribution pipe. In particular, the plurality of nozzles may include an interface for each of the plurality of openings of the vapor distribution pipe. Each interface may be configured for connecting one or more nozzles to the vapor distribution pipe at a respective opening of the plurality of openings. Each interface of the plurality of interfaces may be connected by at least one fastener of the plurality of fasteners to the vapor distribution pipe, particularly by at least two fasteners or by at least three fasteners. For example, each interface may be connected to the vapor distribution pipe by exactly two fasteners, by exactly three fasteners or by exactly four fasteners. Particularly for an interface attaching a single nozzle to the vapor distribution pipe, two to four fasteners, particularly three fasteners, may be used. For instance, two, three or four fasteners may be used to distribute the force for fastening the nozzle in a circumferential direction about an opening at which the nozzle is provided, particularly while keeping the number of fasteners and the effort of assembling the evaporation source low.

[0039] In some embodiments, each interface may include one or more holes forthe at least one fastener, particularly for arranging each of the at least one fastener through a respective hole of the interface. The vapor distribution pipe may include a pipe interface at each of the plurality of openings, each pipe interface being configured for connection with an interface of the plurality of the interfaces. Each pipe interface may include one or more further holes, particularly threaded holes, for fastening an interface of one or more nozzles to the pipe interface of the vapor distribution pipe via the at least one fastener. The one or more further holes may be one or more blind holes, particularly threaded blind holes. The one or more further holes of a pipe interface at an opening may be disposed in a pattern corresponding to the one or more holes of an interface to be arranged at the opening.

[0040] In some embodiments, the plurality of nozzles includes an interface of the plurality of interfaces for each opening of the plurality of openings. Each interface may include a flange. The flange may extend around an edge of a respective opening of the vapor distribution pipe. For example, FIG. 2 illustrates a nozzle 111 of an evaporation source according to embodiments described herein, the nozzle 111 being fastened to a vapor distribution pipe 110 of the evaporation source. The nozzle 111 includes an interface 230 for connecting the nozzle 111 to the vapor distribution pipe 110. In particular, in FIG. 2, the interface 230 includes a flange 231 extending circumferentially about the first direction 105 of an opening 218 of the vapor distribution pipe 110 at which the nozzle 111 is arranged. The interface 230 of the nozzle 111 is connected to a pipe interface 235 of the vapor distribution pipe 110. In particular, a plurality of fasteners 240, specifically screws, are arranged through holes 232 of the flange 231 and screwed into further holes 236, particularly threaded blind holes, of the pipe interface 235 of the vapor distribution pipe 110.

[0041] According to some embodiments, each nozzle 111 of the plurality of nozzles includes a respective flange 231 for fastening the nozzle 111 to a respective opening 218 of the plurality of openings, particularly for individually fastening each nozzle 111 to the vapor distribution pipe 110. In embodiments, each nozzle 111 of the plurality of nozzles may be arranged at a respective opening of the plurality of openings. For example, referring particularly to FIGS. 1 to 5, each nozzle 111 is arranged at a respective opening 218.

[0042] In some embodiments, as illustrated for example in FIGS. 2 and 4, the plume forming part 220 of each nozzle 111 is arranged outside the vapor distribution pipe 110. Each nozzle 111 may further include a channel part 225 extending into the respective opening 218 of the plurality of openings. The channel part 225 may be oriented along the first direction 105. The channel part 225 of a nozzle 111 may include an inner channel 227, particularly an inner channel 227 to direct evaporated material from the vapor distribution pipe 110 to the plume forming part 220 of the nozzle 111. In some embodiments, the channel part 225 and plume forming part 220 may form a continuous conduit for evaporated material from within the opening 218 or from within the vapor distribution pipe 110 to the outside of the vapor distribution pipe 110. The inner channel 227 of the channel part 225 may be formed by an inner wall of the channel part 225, particularly a cylindrical inner wall around the first direction 105. The inner channel 227 of the channel part 225 may have an inner channel diameter. The inner channel diameter may be at least 1 mm, particularly at least 1 .5 mm or at least 2 mm, and / or maximum 18 mm, particularly maximum 16 mm or maximum 14 mm. For example, the inner channel diameter of each nozzle of an organic material evaporation source may be between 1 mm and 18 mm, particularly between 1.5 mm and 16 mm or between 2 mm and 14 mm. The inner channel diameter of each nozzle of a metallic material evaporation source may be between 1 mm and 8 mm, particularly between 1.5 mm and 6 mm or between 2 mm and 4 mm. In some embodiments, a flange 231 may extend at least partially, particularly fully, in a circumferential direction around the channel part 225.

[0043] According to some embodiments, the plurality of openings 218 of the vapor distribution pipe are circular openings, for example as in FIGS. 2 or 4. A flange 231 of an interface 230 arranged at a circular opening may be provided as a circular flange with an outer diameter larger than the diameter of the respective circular opening. In further embodiments, the openings and / or the flanges may have a polygonal shape, e.g. a rectangular shape (see, e.g., FIGS. 8A-C). In embodiments, the plurality of openings of the vapor distribution pipe may include at least three openings, particularly at least five or at least seven openings. In some embodiments, the plurality of nozzles includes more nozzles 111 than the number of openings 218 of the plurality of openings. Particularly in embodiments, in which each nozzle 111 is arranged at arespective opening 218, the plurality of openings may include for example at least 10 or at least 20 openings, more particularly circular openings.

[0044] In embodiments, the channel part 225 extending into a respective opening, particularly into a circular opening of the vapor distribution pipe 110, may have a cylindrical outer surface, as shown for example in FIGS. 2 and 4. In some embodiments, the channel part 225 may be integrally formed with the plume forming part 220 (FIG. 2). In embodiments, a gap 226 may be formed between an outer surface, particularly a cylindrical outer surface, of the channel part 225 and an inner surface of the respective opening 218. The gap 226 may be smaller than 0.5 mm, particularly smaller than 0.3 mm or smaller than 0.2 mm, and / or larger than 0.03 mm, particularly larger than 0.05 mm or larger than 0.07 mm. For example, the gap 226 may be about 0.1 mm. A small gap may allow for insertion of the channel part into the opening and / or may allow for heat conductance between the channel part and the vapor distribution pipe.

[0045] According to some embodiments, as shown for example in FIG. 4, the channel part 225 and the plume forming part 220 are separate parts of the nozzle 111. The channel part 225 may include an external thread screwed into a corresponding internal thread of the respective opening 218. The external thread may be provided on an outer cylindrical surface of the channel part 225. The channel part 225 may be in direct contact with the plume forming part 220 and / or the interface 230 of the nozzle 111. In particular, the channel part 225 may be thermally coupled with the plume forming part 220 and / or the interface 230. The channel part 225 may be thermally coupled with the vapor distribution pipe 110, particularly via a direct contact with the vapor distribution pipe 110, more particularly via the direct contact of the external thread of the channel part 225 and the internal thread of the vapor distribution pipe 110 at the respective opening 218.

[0046] According to embodiments, the plume forming part, the channel part and / or the interface may be configured for operation up to a temperature of at least 200°C, particularly of at least 250°C, and / or maximum 600°C, particularly maximum 500°C, for example for operation in an evaporation source configured for organic material deposition. In some embodiments, the plume forming part, the channel part and / or theinterface may be configured for operation up to a temperature of at least 900°C, particularly of at least 1000°C, and / or maximum 1700°C, particularly maximum 1500°C, for example for operation in an evaporation source configured for metallic material deposition. The plume forming part, the channel part and / or the interface may include or may be made from metal. The metal may be, or may include, for example steel such as stainless steel, particularly for organic material deposition by the evaporation source. The metal may be or may include a metal alloy configured for high temperature operation, particularly for metallic material deposition by the evaporation source.

[0047] In some embodiments, the evaporation source includes a plurality of seals 250. A seal 250 of the plurality of seals may be arranged at each opening 218 of the plurality of openings, particularly between an interface 230 and the vapor distribution pipe 110, particularly between a flange 231 and the vapor distribution pipe 110. For example, in FIG. 2, a seal 250 is arranged between the flange 231 and an outer pipe surface of the vapor distribution pipe 110. In embodiments, the at least one fastener 240 fastening the interface 230 to the vapor distribution pipe 110 extends through the seal 250. According to some embodiments, a seal material of the seal may be a thermally conductive seal material. The seal may be in direct contact with the interface 230, e.g. a flange 231 , and with the outer pipe surface of the vapor distribution pipe 110. In particular, the seal 250 may conduct heat between the vapor distribution pipe 110 and the interface 230 via solid material heat conduction.

[0048] In embodiments, the seal material may be a heat-resistant seal material. The seal 250 may be configured for operation up to a temperature of at least 200°C, particularly of at least 250°C, and / or maximum 600°C, particularly maximum 500°C, for example, for operation in an evaporation source configured for organic material deposition. In some embodiments, the seal 250 may be configured for operation up to a temperature of at least 900°C, particularly of at least 1000°C, and / or maximum 1700°C, particularly maximum 1500°C, for example for operation in an evaporation source configured for metallic material deposition. In embodiments, a seal 250 may be provided as a foil or a disc, particularly as a foil or a disc extending between the interface 230 and the vapor distribution pipe 110 and around the opening 218 at which the interface 230 is provided.

[0049] According to some embodiments, a seal material of the seal 250 includes at least one of metal or graphite. In particular, the seal 250 may consist of the at least one of metal or graphite. The metal may be or may include tantalum. For instance, the seal 250 may be provided as a tantalum foil or as a graphite foil. A seal 250 may be provided to make the connection between an interface of one or more nozzles and the vapor distribution pipe leak-tight with respect to vapor from the vapor distribution pipe.

[0050] In some embodiments, the plurality of interfaces 230 and / or the vapor distribution pipe 110 may include a protrusion in contact with the seal 250. For example, the interface 230, particularly a flange 231 , may include an interface protrusion 234. The interface protrusion 234 may be provided on a surface of the interface 230, the surface facing towards the vapor distribution pipe 110 and / or the seal 250. The interface protrusion 234 may extend towards the vapor distribution pipe 110. The interface protrusion 234 may surround the opening 218, at which the interface 230 is arranged, in a circumferential direction about the first direction 105. The vapor distribution pipe 110 may include a pipe surface protrusion 238. The pipe surface protrusion 238 may be provided on an outer pipe surface of the vapor distribution pipe 110, the outer pipe surface facing towards the seal 250 and particularly towards the interface 230. The pipe surface protrusion 238 may extend towards the interface 230. The pipe surface protrusion 238 may surround the opening 218, at which the interface 230 is arranged, in circumferential direction about the first direction 105. The pipe surface protrusion 238 and / or the interface protrusion 234 may include an edge, particularly an edge extending circumferentially around the first direction 105. The pipe surface protrusion 238 and / or the interface protrusion 234 may improve a sealing function provided by the seal 250, particularly by pressing or cutting into the seal 250. For example, FIG. 2 shows an embodiment with both a pipe surface protrusion 238 and an interface protrusion 234 extending circumferentially about the first direction 105, each having two edges cutting into the seal 250.

[0051] According to embodiments, each interface 230 includes a thermal contact region in contact with an outer pipe surface of the vapor distribution pipe 110 and / or with a seal 250 arranged between the interface 230 and the vapor distribution pipe 110. In particular, the thermal contact region of the interface 230 may thermally couple the plume forming part 220 to the vapor distribution pipe 110. For example, a flange231 of an interface 230 may provide a thermal contact region, wherein at least a portion of a surface of the flange 231 facing the vapor distribution pipe 110 may be in direct contact with the vapor distribution pipe 110 (see, e.g., FIG. 4) and / or in direct contact with a seal 250 arranged between the flange 231 and the outer pipe surface of the vapor distribution pipe 110 (see, e.g., FIG 2). The thermal coupling of the nozzle with the vapor distribution pipe, particularly of the plume forming part with the vapor distribution pipe, can provide for the operation of the nozzle as a hot nozzle, specifically to avoid material condensation on the plume forming part 220.

[0052] According to some embodiments, each nozzle 111 is fastened to the respective opening 218 by at least two fasteners 240 positioned at different angular positions about a center of the respective opening 218, wherein at least two angles between the angular positions are different. Holes 232 in the interface and / or further holes 236 in the vapor distribution pipe 110 may be arranged in accordance with the at least two fasteners. For example, referring to FIG. 3, a nozzle 111 similar to the nozzle 111 shown in FIG. 2, is fastened to a vapor distribution pipe 110 by three fasteners 240. The three fasteners 240 are provided at angular positions separated by a first angle 241 , a second angle 242 and a third angle 243 in a circumferential direction about a center 244 of the opening in the vapor distribution pipe 110, at which the nozzle 111 is arranged. The first angle 241 , the second angle 242 and the third angle 243 are not equal. For example, the first angle 241 may be 120 degrees, the second angle 242 may be 122 degrees, and the third angle may be 118 degrees. In embodiments, the interface 230 may be configured to be fastened to the vapor distribution pipe 110 using the at least one fastener 240 in exactly one orientation relative to each other. For example, fastening the interface 230 in exactly one orientation may be achieved via two or more fasteners 240 spaced by different angles in a circumferential direction about a center 244 of the respective opening 218. Allowing the nozzles to be fastened in only one orientation may avoid mistakes in the orientation of the plurality of nozzles along the vapor distribution pipe. In particular, a correct alignment of the plurality of nozzles may be ensured.

[0053] In some embodiments of the present disclosure, each plume forming part 220 of the plurality of nozzles 111 is configured to emit the vapor plume in a main emission direction 221 , the main emission direction 221 being angled with respect tothe first direction 105, as shown for example in FIG. 2. An angled emission may be used for example for deposition of material under overhang structures in OLED manufacturing as described herein. Embodiments described herein may particularly provide for a correct alignment of nozzles for angled emission along the vapor distribution pipe.

[0054] According to embodiments, an angle 222 between the main emission direction 221 and the first direction 105 may be minimum 5 degrees, particularly minimum 10 degrees or minimum 15 degrees, and / or maximum 50 degrees, particularly maximum 40 degrees, maximum 30 degrees or maximum 20 degrees. For example, the angle 222 between the main emission direction 221 and the first direction 105 may be between 10 degrees and 20 degrees, between 10 degrees and 30 degrees, or between 15 degrees and 30 degrees. In embodiments, the main emission direction 221 of at least one nozzle 111 of the plurality of nozzles may be angled horizontally with respect to the first direction 105, particularly in a plane perpendicular to the longitudinal axis 106 of the vapor distribution pipe 110. In some embodiments, the main emission direction 221 of at least one nozzle 111 of the plurality of nozzles may be angled vertically with respect to the first direction 105, particularly in a plane including the longitudinal axis 106 and the first direction 105. In even further embodiments, the main emission direction 221 of at least one nozzle 111 of the plurality of nozzles may be angled horizontally and vertically with respect to the first direction 105. According to some embodiments, the main emission direction 221 of each of the plurality of nozzles, particularly of all nozzles of the evaporation source 101 , may be angled at the same angle 222 with respect to the first direction 105. In further embodiments, the respective main emission directions 221 of the plurality of nozzles may be different.

[0055] For example, FIG. 5 schematically illustrates a vapor distribution pipe 110 of an evaporation source 101 with a plurality of nozzles 111 , wherein each nozzle 111 is fastened to the vapor distribution pipe 110 at a respective opening 218. For instance, the nozzles 111 may be nozzles 111 as illustrated in any of FIGS. 2 to 4. Each opening 218 of the plurality of openings 218 of the vapor distribution pipe 110 faces in a first direction 105, while a main emission direction 221 of each nozzle 111 of the plurality of nozzles is angled with respect to the first direction 105. In embodiments, a mainemission direction 221 of a nozzle 111 may be understood as a central or average direction of a vapor plume emitted by the nozzle 111 towards a substrate 10. In some embodiments, the main emission direction 221 may be angled with respect to a substrate plane of a substrate 10. For example, in FIG. 5, the main emission direction 221 is angled with respect to the substrate 10, the substrate 10 being transported past the evaporation source 101 in a transportation direction 509. For example, as illustrated in FIG. 5, the longitudinal axis 106 of the vapor distribution pipe 110 may extend essentially in a vertical z-direction. The substrate 10 may be at least essentially vertically oriented in a y-z plane and transported in the y-direction. The main emission direction 221 of each of the plurality of nozzles 111 may be angled horizontally with respect to the first direction 105 in a respective x-y plane.

[0056] According to some embodiments of the present disclosure, the plume forming part of each nozzle of the plurality of nozzles has at least two outlets for emitting vapor from the nozzle towards the substrate, particularly exactly two outlets or exactly three outlets. In particular, each of the at least two outlets may be configured for forming a respective vapor plume. The plume forming part 220 of each nozzle may include a first outlet 613 configured to emit a first vapor plume 614 along a first main emission direction 615. The plume forming part may include a second outlet 616 configured to emit a second vapor plume 617 along a second main emission direction 618. In embodiments, the first vapor plume 614 and the second vapor plume 617 may be distinct vapor plumes, particularly not overlapping vapor plumes. According to some embodiments, the at least two outlets may be configured to emit at least two vapor plumes along at least two main emission directions. At least one main emission direction, particularly at least two main emission directions, may be angled with respect to the first direction 105 of an opening at which the nozzle having the at least two outlets is arranged.

[0057] For example, FIG. 6 schematically illustrates a sectional view of an evaporation system 690 including an evaporation source arrangement 600 configured for material deposition on a substrate 10. The evaporation source arrangement 600 includes two evaporation sources, particularly a first evaporation source 601 and a second evaporation source 602. In embodiments, the first evaporation source 601 may for example, be configured for the deposition of a first material such as a first metal,e.g. magnesium. The second evaporation source 602 may be configured for the deposition of a second material such as a second metal different from the first metal, e.g. silver. Each of the first evaporation source 601 and the second evaporation source 602 may include a plurality of nozzles 611 , particularly a plurality of nozzles configured in accordance with embodiments described herein. For clarity, only the plume forming part 220 of one nozzle 611 of each of the first evaporation source 601 and the second evaporation source 602 is shown in FIG. 6. Each plume forming part 220 includes two outlets, particularly a first outlet 613 and a second outlet 616 for forming a first vapor plume 614 and a second vapor plume 617, respectively. A first main emission direction 615 of the first outlet 613 is different from a second main emission direction 618 of the second outlet 616. In particular, a first angle between the first main emission direction 615 and the first direction 105 of the opening 218, at which the nozzle 611 is arranged, may be different from a second angle between the second main emission direction 618 and the first direction 105. In some embodiments, an absolute value of the first angle may be different from the absolute value of the second angle. In embodiments, the evaporation system 690 may include shields 619 to further shape the vapor plumes emitted by the nozzles 611 before the vapor plumes reach the substrate 10.

[0058] According to some embodiments, as illustrated for example in FIG. 6, one or more vapor plumes of a first evaporation source 601 may overlap with one or more further vapor plumes of a second evaporation source 602, particularly at the substrate 10. An overlap of vapor plumes may be used for co-deposition of materials from different evaporation sources on the substrate 10.

[0059] According to some embodiments of the present disclosure, the plume forming part 220 of each nozzle 111 of the plurality of nozzles may be configured for shaping the vapor plume emitted by the nozzle 111. In particular, the plume forming part 220 may be configured for focusing the vapor plume emitted by the respective nozzle 111 in at least one dimension, particularly in exactly one dimension. For example, the vapor plume may be focused in a direction of the longitudinal axis 106 of the vapor distribution pipe 110. In particular, the vapor plume may be focused such that a vapor plume opening angle in a plane including the longitudinal axis 106 is smaller than a further vapor plume opening angle in a plane perpendicular to the longitudinal axis 106.

[0060] In embodiments, the plume forming part 220 of each nozzle 111 may include a first wall surface 762 of a first wall 761 , the first wall 761 being positioned at the opening 718 at which the plume forming part 220 is arranged. The first wall 761 may be arranged on the vapor distribution pipe 110. The first wall surface 762 may be arranged at the opening 718. The first wall 761 may extend between the opening 718 and a neighboring opening 719, particularly in embodiments in which the nozzle is configured for focusing the vapor plume in a direction of the longitudinal axis 106. In embodiments, the plume forming part 220 can include a second wall surface 766 of a second wall 765. The second wall surface 766 may be arranged at the opening 718. The second wall 765 may be arranged on the vapor distribution pipe 110 on the opposite side of the opening 718 with respect to the first wall 761 . The second wall 765 may be arranged parallel to the first wall 761. In embodiments, the first wall surface 762 and / or the second wall surface 766 may be slanted with respect to the first direction 105. In particular, each of the first wall surface 762 and / or the second wall surface 766 may be slanted away from the opening 718 at which the plume forming part 220 of the nozzle 111 is arranged. An absolute value of a slant angle of the slanted first wall surface 762 and / or the slanted second wall surface 766 may increase with increasing distance from the opening 718 and towards the substrate, the slant angle being measured relative to the first direction 105. For example, the flank of the slanted first wall surface 762 and / or the slanted second wall surface 766 may follow the flank of a Gaussian distribution. For instance, the first wall surface 762 and the second wall surface 766 may be shaped like vapor-contacting surfaces of the wings of a duck nozzle.

[0061] According to some embodiments, each nozzle 111 may include the plume forming part 220 with the first wall surface 762 and / or the second wall surface 766, and a separate channel part 225. The channel part 225 may be provided in accordance with embodiments described herein, particularly with an external thread on an outer cylindrical surface of the channel part 225 for screwing the channel part 225 into a respective opening of the vapor distribution pipe 110. The channel part 225 may include an aperture 768 at an end of the channel part 225 for emitting the vapor from the vapor distribution pipe 110. In particular, the aperture 768 may be arranged outside the vapor distribution pipe 110. The aperture 768 may be arranged between the firstwall 761 and the second wall 765, particularly between the first wall surface 762 and the second wall surface 766. In embodiments, the channel part 225 may determine the amount of material flux leaving the vapor distribution pipe 110 through the respective nozzle 111. The plume focusing part may determine the focus function of the nozzle 111. In some embodiments, the plume focusing part may further guide the vapor in a main emission direction different from the first direction 105.

[0062] For example, FIG. 7A schematically illustrates a sectional view of a nozzle 111 including a channel part 225 to be screwed into an opening of the vapor distribution pipe 110, and a plume forming part 220 with a first wall surface 762 of a first wall 761 and a second wall surface 766 of a second wall 765 for shaping a vapor plume emitted by the nozzle 111. In some embodiments and as illustrated for example, in FIGS. 7A- 7C, the first wall 761 and the second wall 765 may provide the interface for fastening the plume forming part 220 to the vapor distribution pipe 110. For example, each of the first wall 761 and the second wall 765 may include a hole 232, through which a fastener may be arranged for fastening the plume forming part 220 to the vapor distribution pipe 110. In particular, a fastener (not shown) may be arranged through each of the holes 232 of the first wall 761 and the second wall 765, and may be screwed into a corresponding further hole 236 in the vapor distribution pipe 110, for example into a threaded blind hole (see, e.g., FIG. 7C).

[0063] In some embodiments, the first wall 761 and second wall 765 may be connected by one or more bridge sections 769 of the nozzle 111 in a circumferential direction about the opening 218, particularly by two bridge sections 769 arranged on opposite sides of the opening 218. The bridge sections 769 may be arranged essentially flush with the end of the channel part 225 providing the aperture 768. In embodiments, the first wall 761 , the second wall 765 and / or the bridge sections 769 may be in direct contact, particularly in thermal contact, with the channel part 225. In some embodiments, the first wall 761 , the second wall 765 and the bridge sections 769 may be integrally formed.

[0064] According to embodiments, the first wall 761 may extend from the opening 218, which is located between the first wall 761 and the second wall 765, in a first longitudinal direction of the longitudinal axis 106 of the vapor distribution pipe 110 to aneighboring opening 719. In particular, the first wall may have an additional first wall surface 763 providing at least a portion of a further plume forming part of a nozzle 111 at the neighboring opening 719. Similarly, the second wall 765 may extend from the opening 218 in a second longitudinal direction of the longitudinal axis 106 to a further neighboring opening 720. In particular, the second wall 765 may have an additional second wall surface 767 providing at least a portion of yet another plume forming part of a nozzle 111 at the further neighboring opening 720. The nozzles 111 at the neighboring opening 719 and the further neighboring opening 720 may each include a respective channel part 225. In embodiments, the plurality of nozzles 111 may include a channel part 225 for each opening of the plurality of openings, and a plurality of external segments 700 (see particularly FIG. 7B) fastened by at least one fastener to the vapor distribution pipe, wherein each external segment includes a first wall 761 and a second wall 765 connected by one or more bridge sections 769. Each external segment may include a plume forming part 220 of at least one nozzle 111 for at least one opening. The external segment 700 may additionally form a portion of one or more plume forming parts 220 of one or more further nozzles 111. For example, in FIG. 7C, the additional first wall surface 763 may form a further plume forming part at the neighboring opening 719 together with an additional second wall surface 767 of a neighboring external segment. The external segment 700 may include an interface for fastening the external segment to the vapor distribution pipe 110, particularly by holes 232 provided through the first wall 761 and the second wall 765 according to embodiments described herein.

[0065] An evaporation source arrangement 100 may include a plurality of evaporation sources 101 according to embodiments described herein, particularly two or three evaporation sources. Each evaporation source 101 includes a plurality of openings 218, wherein a channel part 225 is screwed into each of the openings 218. External segments 700 are fastened to each of the vapor distribution pipes 110. As shown in FIG. 7C, in operation of an evaporation source 101 , a plurality of external segments 700 is arranged in a row along the openings 218 and the corresponding channel parts 225, such that each channel part 225 has a corresponding plume forming part 220 to form a nozzle 111. In embodiments, plume forming parts 220 for some channel parts 225 of an evaporation source 101 may each be provided by a singleexternal segment 700. Further plume forming parts for further channel parts of the evaporation source 101 may each be provided by two external segments 700. In particular, a plume forming part provided by two external segments 700 may include an additional first wall surface 767 of a first external segment and an additional second wall surface 763 of a second external segment neighboring the first external segment. As shown in FIG. 7C, the plume forming part 220, particularly including the first wall surface 762 and the second wall surface 766, is rotationally asymmetric with respect to the first direction 105 of the respective opening 718.

[0066] According to some embodiments of the present disclosure, a group of nozzles is arranged at each of the plurality of openings 218 of the vapor distribution pipe 110. In particular, the plurality of nozzles 111 may include a plurality of groups of nozzles. Each group of nozzles includes at least two nozzles 111 , particularly at least three nozzles 111. For example, each group of nozzles may include exactly two nozzles 111 , exactly three nozzles 111 or exactly four nozzles 111 at each opening 218. The plurality of nozzles may include an interface for each of the groups of nozzles, for example a flange 231 for each of the groups of the nozzles. The number of interfaces may be less than the number of nozzles 111 of the plurality of nozzles, for example half, a third or a fourth of the number of the plurality of nozzles. In some embodiments, the plume forming parts 220 of each group of nozzles may be connected to, or integrally formed with, an interface such as a flange 231. According to embodiments, a seal 250 may be arranged between each of the interfaces and the vapor distribution pipe 110 in accordance with further embodiments described herein (see, e.g. FIG. 2).

[0067] In embodiments, each of the plurality of openings 218 may have a length, particularly in a direction of the longitudinal axis 106 of the vapor distribution pipe 110, and a width, wherein the length of the opening is larger than the width. The length may be at least 1 .5 times larger than the width, particularly at least 2 times larger or at least 3 times larger, and / or maximum 10 times larger than the width, particularly maximum 8 times larger or maximum 7 times larger. For instance, each opening 218 of the plurality of openings may be rectangular.

[0068] For example, FIG. 8A illustrates a front view of a vapor distribution pipe 110with a plurality of openings 218, each opening 218 having a length along the longitudinal axis 106 of the vapor distribution pipe 110 that is larger than a width of the opening 218. FIGS. 8B and 8C illustrate the vapor distribution pipe 110 with a plurality of nozzles 111 , wherein a respective group of nozzles 111 is fastened to each of the openings 218. In FIGS. 8B and 8C, each group of nozzles for example, includes three nozzles 111. In particular, each group of nozzles 111 includes a flange 231 which is fastened to the vapor distribution pipe 110 via fasteners 240, particularly via screws extending through holes of the flange 231. The fasteners 240 are screwed into corresponding further holes of the vapor distribution pipe 110. A seal 250 is arranged between each flange 231 and the vapor distribution pipe 110, particularly to avoid leakage of vapor between the flanges 231 and the vapor distribution pipe 110. Each group of nozzles 111 includes plume forming parts 220 of the group of nozzles 111. The plume forming parts can be rigidly connected to the respective flange 231. In particular, the plume forming parts 220 of the groups of nozzles are locked against rotation about the first direction 105 via the rigid connection with the flanges 231 and the vapor distribution pipe 110. For example, in FIGS. 8B and 8C, the plume forming parts 220 are integrally formed with the respective flanges 231. In FIGS. 8B and 8C, the plume forming parts 220 provide a vapor outlet that emits a vapor plume in a main emission direction 221 which is angled with respect to the first direction 105. In particular, if the longitudinal axis 106 of the vapor distribution pipe 110 is arranged at least substantially vertically, the main emission direction 221 may be angled in a vertical plane. In further embodiments, the angle of the main emission direction 221 may be oriented in a different direction than illustrated in FIG. 8C, e.g. in a horizontal plane, or the plume forming part 220 may for example, be a plume focusing part.

[0069] According to embodiments of the present disclosure, a nozzle set is provided. The nozzle set includes a plurality of nozzles 111 according to any of the embodiments described or illustrated herein. The nozzles 111 of the nozzle set may include any of the features of nozzles described herein. In particular, each nozzle 111 may include a plume forming part 220 and optionally a channel part 225. The plurality of nozzles may include a plurality of interfaces 230. Further, the nozzles may be configured to be fastened to a vapor distribution pipe 110 in accordance with any of the embodiments described herein. In particular, the plurality of nozzles 111 areconfigured to be fastened at a plurality of openings 218 facing in a first direction 105. In some embodiments, the nozzle set may include a plurality of fasteners 240 for fastening the nozzles 111 of the nozzle set to a vapor distribution pipe 110 in accordance with embodiments described herein.

[0070] According to embodiments, one or more evaporation sources 101 described herein may be provided in a deposition system, particularly in a vacuum deposition system. FIG. 9 shows a vacuum deposition system 900 with an evaporations source 101 according to embodiments described herein in a schematic top view. The vacuum deposition system 900 includes a first vacuum chamber 901 that houses the evaporation source 101 , and, optionally, one or more further vacuum chambers that may house one or more further evaporation sources, e.g., a second evaporation source 902 and / or a third evaporation source 903. The vacuum deposition system 900 may include at least five or at least ten evaporation sources, for coating the substrate with a plurality of layers. The evaporation sources may be configured to coat vertically or essentially vertically oriented substrates that are transported past the evaporation sources on a substrate transportation track 913. A plurality of materials, that may include one or more metals and one or more organic materials, can be deposited in succession onto the substrate for providing a layer stack on the substrate, particularly an OLED layer stack. For example, the vacuum deposition system 900 may include ten or more evaporation sources for coating the substrate with a plurality of layers.

[0071] In the present disclosure, a "vacuum deposition system" is to be understood as a system or arrangement configured for vacuum deposition of materials on a substrate. A "vacuum chamber" or “vacuum processing chamber” is to be understood as a chamber configured for vacuum deposition. The term "vacuum", as used herein, can be understood in the sense of a technical vacuum having a vacuum pressure of less than, for example, 10 mbar. Typically, the pressure in a vacuum chamber as described herein may be between 10’5mbar and about 10’8mbar, particularly between 10’5mbar and 10’7mbar.

[0072] The vacuum deposition system 900 may include a substrate transportation track 913 configured to move a substrate 10 along a substrate transport path T past the evaporation source 101 and past the optional further evaporation sources. Thesubstrate transportation track 913 may extend at least partially through the first vacuum chamber 901 and through the optional further vacuum chambers and may include a substrate transportation system configured for substrate transport, e.g., a roller transportation system, one or more linear motors and / or a magnetic levitation system suitable for moving the substrate relative to and past the evaporation sources. The substrate may be carried by a substrate carrier 920 during the transport and / or deposition.

[0073] The vacuum deposition system 900 may further include a shield transportation track 912 extending between the substrate transportation track 913 and the evaporation source 101 in the first vacuum chamber 901 . The shield transportation track 912 is configured to move a movable shield 930 in front of the substrate 10 for shielding one or more edge regions of the substrate 10 and / or for shielding at least parts of a substrate carrier 920 that carries the substrate 10. The movable shield 930 may be a movable edge exclusion shield with a shielding frame for covering one or more edge regions of the substrate. The shield transportation track 912 may be located between the substrate transportation track 913 and the evaporation source 101 in the first vacuum chamber 901 and may include a shield transportation system, e.g., a roller transportation system, one or more linear motors and / or a magnetic levitation system suitable to move the movable shield 930 in front of the substrate 10, such that one or more edge regions of the substrate are covered during coating with the evaporation source 101 , as is schematically depicted in FIG. 9.

[0074] The movable shield 930 may be movable back and forth on the shield transportation track 912, as is schematically indicated by respective arrows in FIG. 9, such that subsequent substrates moved along the substrate transport path T can be shielded by the movable shield 930 during coating with the evaporation source 101. Each evaporation source may have an associated movable shield that is movable back and forth on a (respective) shield transportation track for shielding an edge region of the substrate from being coated when the substrate is moved past the respective evaporation source.

[0075] Accordingly, an in-line system is provided that allows the deposition of a plurality of layers on a substrate in succession, while the substrate is moved throughthe vacuum deposition system 900, past a plurality of evaporation sources.

[0076] Embodiments described herein particularly relate to deposition of materials, e.g. for display manufacturing on large area substrates. According to some embodiments, large area substrates or carriers supporting one or more substrates may have a size of 0.5 m2or larger, particularly of 1 m2or larger. For instance, the deposition system may be adapted for processing large area substrates, such as substrates of GEN 4.5, which corresponds to approximately 0.67 m2of substrate (0.73x0.92m), GEN 5, which corresponds to approximately 1 .4 m2substrates (1.1 m x 1 .3 m), GEN 6, which corresponds to approximately 2.7 m2(1 .5 m x 1 .8 m), GEN 7.5, which corresponds to approximately 4.29 m2substrates (1.95 m x 2.2 m), GEN 8.5, which corresponds to approximately 5.7 m2substrates (2.2 m x 2.5 m), or even GEN 10, which corresponds to approximately 8.7 m2substrates (2.85 m x 3.05 m). Even larger generations such as GEN 11 and GEN 12 and corresponding substrate areas can similarly be implemented. According to yet further implementations, half-sizes of the above- mentioned substrate generations can be processed. Alternatively or additionally, semiconductor wafers may be processed and coated in deposition systems according to the present disclosure.

[0077] Embodiments described herein may particularly relate to OLED fabrication on a substrate. OLED pixels can be formed on a substrate using photo lithography and patterning, particularly without a fine metal mask (FMM). An FMM has a plurality of pixel holes and is positioned in front of the substrate and aligned relative to the substrate before the material deposition, so that individual pixels can be deposited onto the substrate. OLED pixel patterning without FMMs is based on a structure that acts as a “mask” and is formed directly on the substrate before coating the substrate with a plurality of materials in a vacuum deposition system. The structure that is formed on the substrate may include sidewalls adjacent to pixel regions, particularly sidewalls surrounding the pixel regions, and overhang structures projecting from the sidewalls at least partially over the pixel regions, as is exemplarily depicted in FIG. 10.

[0078] FIG. 10 is a schematic sectional view showing a part of an OLED layer stack 1060 on a substrate 10 manufactured with OLED pixel patterning techniques. Adjacent pixel-defining layer (PDL) structures 1015 are formed on an upper surface of thesubstrate 10 that define pixel regions 13, and overhang structures 1020 are disposed on the PDL structures 1015. The overhang structures 1020 include a lower portion 1020B with a sidewall and an upper portion 1020A with an overhang protruding from the lower portion 1020B partially over the pixel region 13. In FIG. 10, a first sidewall 11 adjacent to a pixel region 13 is schematically depicted, and a first overhang 12 projects from the first sidewall 11 partially over the pixel region 13. As will be appreciated, the pixel region 13 may be surrounded by two or more sidewalls, and overhangs may be formed on the two or more sidewalls and project partially over the pixel region from different sides.

[0079] By depositing various materials on the pixel regions to defined positions under the overhangs, in combination with subsequent etching / patterning, individually switchable pixels can be formed on the substrate. The deposition of metals and organic layers in predetermined regions, particularly under the overhangs, is challenging.

[0080] The lower portion 1020B with the first sidewall 11 may be made of a conductive material meant to be in contact with a cathode layer 1011 of the OLED layer stack 1060 and may allow a connection of the cathode layer 1011 with a cathode potential. Alternatively, or additionally, at least a part of the first sidewall 11 may include an assistant cathode 1016 meant to be in contact with the cathode layer 1011 of the OLED layer stack. The upper portion 1020A that forms the overhang may be made of a non-conductive inorganic material or alternatively of a conductive inorganic material.

[0081] The OLED layer stack 1060 generally includes, in the following order, an anode layer 1014, a hole injection layer 1018, at least one organic layer 1013 (made of one or more optically active organic materials), an electron injection layer 1012, the cathode layer 1011 , and at least one encapsulation layer 1010.

[0082] As is shown in FIG. 10, the at least one organic layer 1013 does not contact the first sidewall 11 , and the cathode layer 1011 contacts the first sidewall 11 under the first overhang 12. For ensuring that the organic layer does not substantively contact the first sidewall 11 under the first overhang, the at least one organic layer 1013 may be deposited with an organic vapor plume 1032 having a small opening angle, particularly a smaller opening angle than a metal vapor plume 1031 of a subsequently deposited metal layer. For ensuring that the cathode layer 1011 reliably contacts thefirst sidewall 11 under the overhang, the cathode layer may be deposited with a metal vapor plume 1031 having a large opening angle. However, vapor plumes with large opening angles may not always be beneficial. For example, because a vapor plume with a large opening angle causes a substantial shadowing effect in several directions that leads to stray coating on regions of the deposition system and on the substrate that should not be coated. Embodiments of the present disclosure may particularly provide deposition with various angled main emission directions and / or vapor plumes with different opening angles, e.g. by focusing of vapor plumes. Main emission directions and / or opening angles may be adjusted, for instance to control how far under an overhang material is deposited.

[0083] According to embodiments of the present disclosure, a method 1100 of assembling an evaporation source 101 is provided. The evaporation source 101 is configured for depositing a layer on a substrate 10. The method 1100 may use components of an evaporation source 101 according to embodiments described herein, particularly a vapor distribution pipe 110, a plurality of nozzles 111 , a plurality of fasteners 240 and optionally a plurality of seals 250. For example, FIG. 11 illustrates a flow diagram of a method 1100 in accordance with embodiments of the present disclosure. At block 1110, the method 1100 includes providing a vapor distribution pipe110 having a plurality of openings 218 provided along a longitudinal axis 106 of the vapor distribution pipe 110, the plurality of openings 218 facing in a first direction 105. The vapor distribution pipe 110 may be provided with a plurality of pipe interfaces 235 for fastening a plurality of nozzles 111 to the vapor distribution pipe 110, particularly for fastening a plurality of interfaces 230 of the plurality of nozzles 111 to the vapor distribution pipe 110.

[0084] At block 1120, the method may include positioning a plurality of nozzles 111 at the plurality of openings 218. In particular, interfaces 230 of the plurality of nozzles111 may be aligned with pipe interfaces 235 of the vapor distribution pipe 110. The plurality of nozzles 111 may be positioned in a row parallel to the longitudinal axis 106 of the vapor distribution pipe 110. The plurality of nozzles 111 may be positioned such that the nozzles 111 are aligned for material deposition on a substrate 10. In particular, the main emission directions 221 of the nozzles 111 may be aligned, particularly in parallel.

[0085] At block 1130, the method 1100 includes fastening the plurality of nozzles 111 at the plurality of openings 218 of the vapor distribution pipe 110 using a plurality of fasteners 240. In embodiments, each nozzle 111 of the plurality of nozzles includes a plume forming part 220 configured for at least one of forming or shaping a vapor plume directed from the vapor distribution pipe 110 towards the substrate 10. In embodiments, fastening the plurality of nozzles 111 to the vapor distribution pipe 110 includes thermally coupling the plume forming part 220 of each nozzle 111 with the vapor distribution pipe 110. In particular, the plurality of nozzles may include a plurality of interfaces 230. Each interface 230 may be fastened to the vapor distribution pipe110 such that the interface 230 is in direct contact, particularly direct thermal contact, with the vapor distribution pipe 110 and / or with a seal 250 arranged or sandwiched between the vapor distribution pipe 110 and the interface 230. Each interface 230 may be in thermal contact with one or more plume forming parts 220 of the nozzles 111 , particularly such that heat can be efficiently transmitted between the interface 230 and the one or more plume forming parts 220. For example, in some embodiments, each interface 230 may be integrally formed with one or more plume forming parts 220.

[0086] In embodiments, fastening the plurality of nozzles 111 to the vapor distribution pipe 110 includes locking at least the plume forming part 220 of each nozzle111 against rotation about the first direction 105. In particular, each interface 230 for a single nozzle 111 or for a group of nozzles may be fastened to the vapor distribution pipe 110 by at least one fastener, particularly by at least two fasteners, such that at least the plume forming parts of the one or more nozzles 111 cannot be rotated about the first direction 105. In particular, the plurality of fasteners 240 may fasten the plurality of nozzles to the vapor distribution pipe 110, wherein the plurality of fasteners 240 are oriented at least substantially parallel to the first direction 105, such that the interface and the one or more plume forming parts are locked against rotation.

[0087] According to further embodiments, a method of exchanging a first plurality of nozzles of an evaporation source may be provided. An evaporation source having a first plurality of nozzles according to embodiments described herein may be disassembled by removing the fasteners and the first plurality of nozzles from the vapor distribution pipe. After disassembling the evaporation source, the evaporation source may be re-assembled using a second plurality of nozzles according to embodimentsdescribed herein. The re-assembly of the evaporation source may be performed in accordance with further embodiments described herein, e.g. according to the method 1100 of FIG. 11 . The second plurality of nozzles may be different from the first plurality of nozzles. For example, the second plurality of nozzles may provide a different main emission direction and / or different focusing of the vapor plume as compared to the first plurality of nozzles. Methods of exchanging nozzles described herein may particularly allow for a change of nozzle characteristics of an evaporation source without the need for a new vapor distribution pipe, and particularly while maintaining a precise nozzle alignment.

[0088] Embodiments of the present disclosure may advantageously provide an evaporation source having nozzles with plume forming parts in thermal contact with the evaporation source (“hot nozzles”), wherein the nozzles may be precisely aligned. The variety of nozzle types that can be applied in evaporations sources can be enlarged, particularly for OLED evaporations sources. In particular, orientation and alignment of complex nozzles may be provided. A precise alignment of nozzles may be advantageously used for example, in angled deposition, particularly for deposition under overhang structures such as used in OLED manufacturing. A precise alignment may further be advantageous for instance when using plume focusing nozzles such as duck nozzles, or when using slitted nozzles. Evaporation sources described herein may allow for the vapor distribution pipe to be re-used with different nozzles which are rotationally asymmetric as described herein. In particular, a deposition direction may be changed by a nozzle exchange.

[0089] While the foregoing is directed to embodiments of the disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

[0090] In particular, this written description uses examples to disclose the disclosure, including the best mode, and also to enable any person skilled in the art to practice the described subject-matter, including making and using any devices or systems and performing any incorporated methods. While various specific embodiments have been disclosed in the foregoing, mutually non-exclusive features of the embodiments described above may be combined with each other. Thepatentable scope is defined by the claims, and other examples are intended to be within the scope of the claims if the claims have structural elements that do not differ from the literal language of the claims, or if the claims include equivalent structural elements with insubstantial differences from the literal language of the claims.

Claims

CLAIMS1. An evaporation source for depositing a layer on a substrate, comprising: a vapor distribution pipe having a plurality of openings provided along a longitudinal axis of the vapor distribution pipe, the plurality of openings facing in a first direction; a plurality of nozzles arranged at the plurality of openings, wherein each nozzle comprises a plume forming part thermally coupled with the vapor distribution pipe, the plume forming part being configured for at least one of forming or shaping a vapor plume directed from the vapor distribution pipe towards the substrate, wherein the plume forming part is rotationally asymmetric with respect to the first direction; and a plurality of fasteners connecting the plurality of nozzles to the vapor distribution pipe such that at least the plume forming part of each nozzle of the plurality of nozzles is locked against rotation about the first direction.

2. The evaporation source of claim 1 , wherein the plurality of nozzles comprises a plurality of interfaces for connecting the plurality of nozzles to the vapor distribution pipe, wherein each interface of the plurality of interfaces is connected by at least one fastener of the plurality of fasteners to the vapor distribution pipe.

3. The evaporation source of claim 2, wherein each interface comprises a thermal contact region in contact with a pipe surface of the vapor distribution pipe and / or with a seal arranged between the interface and the vapor distribution pipe.

4. The evaporation source of claim 3, wherein a seal material of the seal comprises at least one of metal or graphite.

5. The evaporation source of any of claims 2 to 4, wherein the plurality of nozzles comprises an interface of the plurality of interfaces for each opening of the plurality of openings, wherein each interface comprises a flange, the flange extending around an edge of a respective opening of the vapor distribution pipe.

6. The evaporation source of claim 5, wherein each nozzle of the plurality of nozzles comprises a respective flange for fastening the nozzle to a respective opening of the plurality of openings.

7. The evaporation source of any of the preceding claims, wherein each nozzle of the plurality of nozzles is arranged at a respective opening of the plurality of openings.

8. The evaporation source of claim 7, wherein the plume forming part of each nozzle is arranged outside the vapor distribution pipe, and wherein each nozzle comprises a channel part extending into the respective opening of the plurality of openings.

9. The evaporation source of claim 8, wherein the channel part is integrally formed with the plume forming part.

10. The evaporation source of claim 8 or 9, wherein a gap between an outer surface of the channel part and an inner surface of the respective opening is smaller than 0.5 mm.

11. The evaporation source of claim 8, wherein the channel part and the plume forming part are separate parts of the nozzle, wherein the channel part comprises an external thread screwed into a corresponding internal thread of the respective opening.

12. The evaporation source of any of claims 7 to 11 , wherein each nozzle is fastened to the respective opening by at least two fasteners positioned at different angular positions about a center of the respective opening, wherein at least two angles between the different angular positions are different.

13. The evaporation source of any of the preceding claims, wherein the plume forming part of each nozzle of the plurality of nozzles has at least two outlets for emitting vapor from the nozzle towards the substrate.

14. The evaporation source of any of the preceding claims, wherein each plume forming part of the plurality of nozzles is configured for emitting a rotationally asymmetric vapor plume from the vapor distribution pipe towards the substrate, the vapor plume being rotationally asymmetric with respect to the first direction.

15. The evaporation source of any of the preceding claims, wherein each plume forming part is configured to emit the vapor plume in a main emission direction, the main emission direction being angled with respect to the first direction.

16. The evaporation source of claim 15, wherein an angle between the main emission direction and the first direction is at least one of minimum 5 degrees or maximum 50 degrees.

17. The evaporation source of any of the preceding claims, wherein the plurality of fasteners comprises at least one of screws or bolts.

18. The evaporation source of any of the preceding claims, wherein the plurality of openings of the vapor distribution pipe are circular or rectangular openings.

19. Nozzle set for an evaporation source of any of the preceding claims, the nozzle set comprising the plurality of nozzles.

20. Method of assembling an evaporation source for depositing a layer on a substrate, the method comprising: providing a vapor distribution pipe having a plurality of openings provided along a longitudinal axis of the vapor distribution pipe, the plurality of openings facing in a first direction; fastening a plurality of nozzles at the plurality of openings of the vapor distribution pipe using a plurality of fasteners, wherein each nozzle of the plurality of nozzles comprises a plume forming part configured for at least one of forming or shaping a vapor plume directed from the vapor distribution pipe towards the substrate, wherein fastening the plurality of nozzles to the vapor distribution pipe comprises: thermally coupling the plume forming part of each nozzle with the vapor distribution pipe; and locking at least the plume forming part of each nozzle against rotation about the first direction.

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