Electronic device and method for transmitting and receiving signal in electronic device

Abstract

An electronic device, according to the present invention, comprises: a first PCB including an RFIC; a second PCB including an RFFE circuit connected to an antenna; a plurality of RF transmission lines; an FPCB connecting the two PCBs; a memory; and a processor, wherein the processor transmits a transmission signal to the second PCB via a first RF transmission line, transmits a first reception signal received via the antenna to the first PCB via a second RF transmission line, checks information related to the quality of the first reception signal transmitted via the second RF transmission line while transmitting the transmission signal via the first RF transmission line, and changes a signal path of the first reception signal from the second RF transmission line to a third RF transmission line on the basis that the information related to the quality of the first reception signal satisfies a first condition.

Description

Electronic devices and methods for transmitting and receiving signals in electronic devices

[0001] Various aspects of the present disclosure relate to electronic devices and methods of transmitting and receiving signals in electronic devices.

[0002] As mobile communication technology advances and the use of mobile devices offering diverse functions becomes more widespread, efforts are being made to provide communication systems capable of meeting the growing demand for wireless data traffic. For example, 5G communication systems may offer services in higher frequency bands (e.g., 25-60 GHz) in addition to the frequency bands used in 3G and LTE (long-term evolution) systems to achieve higher data rates and faster data transmission speeds.

[0003] For example, in order to mitigate path loss of radio waves and increase the transmission distance of radio waves in the mmWave band, beamforming, massive MIMO (massive MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, and large scale antenna technologies are being discussed in 5G communication systems.

[0004] In order to transmit a signal from an electronic device to a communication network (e.g., a base station), data generated from a processor or a communication processor within the electronic device may be signal-processed through an RF circuit (e.g., a radio frequency integrated circuit (RFIC) or a radio frequency front end (RFFE)) and then transmitted to the outside of the electronic device through at least one antenna. A signal received from the outside through the at least one antenna may be signal-processed through an RF circuit (e.g., an RFFE) and then received by the RFIC.

[0005] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0006] Various aspects relate to an electronic device. The electronic device may include a first printed circuit board (PCB) including a radio frequency integrated circuit (RFIC). The electronic device may include a second PCB including a radio frequency front end (RFFE) circuit connected to at least one antenna. The electronic device may include a plurality of transmission lines, including a first radio frequency (RF) transmission line, a second RF transmission line, and a third RF transmission line, and at least one flexible printed circuit board (FPCB) connected between the first PCB and the second PCB. The electronic device may include a memory storing instructions and at least one processor. The instructions, when individually or collectively executed by the at least one processor, may cause the electronic device to transmit a transmit signal (Tx signal) to the second PCB via the first RF transmission line. The instructions, when individually or collectively executed by the at least one processor, may cause the electronic device to control transmission of first receive signals (Rx signals) received via the at least one antenna to the first PCB via the second RF transmission line. The instructions, when individually or collectively executed by the at least one processor, may cause the electronic device to determine, while transmitting the transmit signal via the first RF transmission line, information related to the quality of the first receive signal transmitted via the second RF transmission line.The instructions, when individually or collectively executed by the at least one processor, may cause the electronic device to control a signal path of the first received signal to be changed from the second RF transmission line to the third RF transmission line based on information related to the quality of the first received signal satisfying a first condition.

[0007] Various aspects relate to a method of operating an electronic device. The electronic device may include a first printed circuit board (PCB) including a radio frequency integrated circuit (RFIC), a second PCB including a radio frequency front end (RFFE) circuit connected between the RFIC and at least one antenna, a plurality of transmission lines including a first radio frequency (RF) transmission line, a second RF transmission line, and a third RF transmission line, at least one flexible printed circuit board (FPCB) connected between the first PCB and the second PCB, and at least one processor. The method of operating the electronic device may include an operation of transmitting a transmit signal (Tx signal) to the second PCB through the first RF transmission line. The method of operating the electronic device may include an operation of controlling a first receive signal (Rx signal) received through the at least one antenna to be transmitted to the first PCB through the second RF transmission line. The method of operating the electronic device may include an operation of checking information related to the quality of the first reception signal transmitted through the second RF transmission line while transmitting the transmission signal through the first RF transmission line. The method of operating the electronic device may include an operation of controlling a signal path of the first reception signal to be changed from the second RF transmission line to the third RF transmission line based on whether the information related to the quality of the first reception signal satisfies a first condition.

[0008] According to various aspects, a storage medium storing at least one computer-readable instruction may be provided, wherein the at least one instruction, when executed by a processor of an electronic device, individually or collectively causes the electronic device to perform at least one operation. The at least one operation may include transmitting a transmit signal (Tx signal) to a second PCB via a first RF transmission line among a plurality of transmission lines disposed on a flexible printed circuit board (FPC) that interconnects a first printed circuit board (PCB) including a radio frequency integrated circuit (RFIC) and a second PCB including a radio frequency front end (RFFE) circuit connected between the RFIC and at least one antenna. The at least one operation may include controlling a first receive signal (Rx signal) received via the at least one antenna to be transmitted to the first PCB via a second RF transmission line among the plurality of transmission lines. The at least one operation may include an operation of checking information related to the quality of the first received signal transmitted through the second RF transmission line while transmitting the transmission signal through the first RF transmission line. The at least one operation may include an operation of controlling a signal path of the first received signal to be changed from the second RF transmission line to a third RF transmission line among the plurality of transmission lines based on whether the information related to the quality of the first received signal satisfies a first condition.

[0009] Various aspects relate to an electronic device. The electronic device may include a first printed circuit board (PCB) including a radio frequency integrated circuit (RFIC). The electronic device may include a second PCB including a radio frequency front end (RFFE) circuit connected to at least one antenna. The electronic device may include a plurality of transmission lines, including a first radio frequency (RF) transmission line, a second RF transmission line, and a third RF transmission line, and at least one flexible printed circuit board (FPCB) connected between the first PCB and the second PCB. The electronic device may include a memory storing instructions and at least one processor. The instructions, when individually or collectively executed by the at least one processor, may cause the electronic device to transmit a transmit signal (Tx signal) to the second PCB via the first RF transmission line. The instructions, when individually or collectively executed by the at least one processor, may cause the electronic device to control transmission of first receive signals (Rx signals) received via the at least one antenna to the first PCB via the second RF transmission line. The instructions, when individually or collectively executed by the at least one processor, may cause the electronic device to determine, while transmitting the transmit signal via the first RF transmission line, a magnitude of the transmit signal transmitted via the first RF transmission line.The instructions, when individually or collectively executed by the at least one processor, may cause the electronic device to control a signal path of the first receive signal to be changed from the second RF transmission line to the third RF transmission line based on a magnitude of the transmit signal satisfying a first condition.

[0010] In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

[0011] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0012] FIG. 2 is a block diagram of an electronic device for supporting legacy network communication and 5G network communication according to various embodiments.

[0013] FIG. 3A is a diagram illustrating wireless communication systems providing a network of legacy communication and / or 5G communication according to various embodiments.

[0014] FIG. 3b is a diagram illustrating wireless communication systems providing a network of legacy communication and / or 5G communication according to various embodiments.

[0015] FIG. 3c is a diagram illustrating wireless communication systems providing a network of legacy communication and / or 5G communication according to various embodiments.

[0016] FIG. 4A illustrates a block diagram of an electronic device according to various embodiments.

[0017] FIG. 4b illustrates a block diagram of an electronic device according to various embodiments.

[0018] FIG. 5 is a diagram illustrating the internal structure of an electronic device according to various embodiments.

[0019] FIG. 6 illustrates a block diagram of an electronic device according to various embodiments.

[0020] FIG. 7 illustrates a block diagram of an electronic device according to various embodiments.

[0021] FIG. 8 illustrates a block diagram of an electronic device according to various embodiments.

[0022] FIG. 9 illustrates a flowchart for explaining a method of operating an electronic device according to various embodiments.

[0023] FIG. 10 illustrates a flowchart for explaining an operation method of an electronic device according to various embodiments.

[0024] FIG. 11 illustrates a block diagram of an electronic device according to various embodiments.

[0025] FIG. 12 illustrates a block diagram of an electronic device according to various embodiments.

[0026] FIG. 13 illustrates a flowchart for explaining a method of operating an electronic device according to various embodiments.

[0027] FIG. 14 illustrates a flowchart for explaining an operation method of an electronic device according to various embodiments.

[0028] FIG. 15 illustrates a block diagram of an electronic device according to various embodiments.

[0029] FIG. 16 illustrates a flowchart for explaining a method of operating an electronic device according to various embodiments.

[0030] FIG. 17A illustrates a block diagram of an electronic device according to various embodiments.

[0031] FIG. 17b illustrates a block diagram of an electronic device according to various embodiments.

[0032] FIG. 18 illustrates a block diagram of an electronic device according to various embodiments.

[0033] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0034] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to one embodiment. Referring to FIG. 1 , in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (104) or the server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0035] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0036] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0037] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0038] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0039] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0040] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0041] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0042] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0043] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0044] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0045] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0046] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0047] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0048] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0049] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0050] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0051] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0052] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0053] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0054] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0055] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0056] In the detailed description below, reference numerals in the drawings may be used interchangeably or omitted for components that can be easily understood through the preceding embodiments, and their detailed descriptions may also be omitted. An electronic device according to an embodiment disclosed in this document may be implemented by selectively combining components of different embodiments, and components of one embodiment may be replaced by components of another embodiment. For example, it should be noted that the present invention is not limited to specific drawings or embodiments.

[0057] FIG. 2 is a block diagram (200) of an electronic device (101) for supporting legacy network communication and 5G network communication according to various embodiments. Referring to FIG. 2, the electronic device (101) may include a first communication processor (212), a second communication processor (214), a first radio frequency integrated circuit (RFIC) (222), a second RFIC (224), a third RFIC (226), a fourth RFIC (228), a first radio frequency front end (RFFE) (232), a second RFFE (234), a first antenna module (242), a second antenna module (244), a third antenna module (246), and antennas (248). The electronic device (101) may (for example, additionally) include a processor (120) and a memory (130). The second network (199) may include a first cellular network (292) and a second cellular network (294). According to various embodiments, the electronic device (101) may (for example, additionally) include at least one of the components described in FIG. 1, and the second network (199) may (for example, additionally) include at least one other network. According to one embodiment, the first communication processor (212), the second communication processor (214), the first RFIC (222), the second RFIC (224), the fourth RFIC (228), the first RFFE (232), and the second RFFE (234) may form at least a portion of the wireless communication module (192). According to another embodiment, the fourth RFIC (228) may be omitted or included as part of the third RFIC (226).

[0058] The first communication processor (212) may establish a communication channel in a band to be used for wireless communication with the first cellular network (292), and may support legacy network communication through the established communication channel. According to various embodiments, the first cellular network may be a legacy network including a second generation (2G), 3G, 4G, or long term evolution (LTE) network. The second communication processor (214) may establish a communication channel corresponding to a designated band (e.g., about 6 GHz to about 60 GHz) among the bands to be used for wireless communication with the second cellular network (294), and may support 5G network communication through the established communication channel. According to various embodiments, the second cellular network (294) may be a 5G network defined by the 3GPP. Additionally, according to one embodiment, the first communication processor (212) or the second communication processor (214) may support establishment of a communication channel corresponding to another designated band (e.g., about 6 GHz or less) among the bands to be used for wireless communication with the second cellular network (294), and 5G network communication through the established communication channel. According to various embodiments, the first communication processor (212) may support a band corresponding to about 410 MHz to 7.125 GHz, and the second communication processor (214) may support a band corresponding to about 24.25 GHz to 52.6 GHz.

[0059] The first communication processor (212) can transmit and receive data with the second communication processor (214). For example, data classified to be transmitted via the second cellular network (294) may be changed to be transmitted via the first cellular network (292). In this case, the first communication processor (212) can receive the transmission data from the second communication processor (214). For example, the first communication processor (212) can transmit and receive data with the second communication processor (214) via the processor-to-processor interface (213). The above interprocessor interface (213) may be implemented as, for example, a universal asynchronous receiver / transmitter (UART) (e.g., HS-UART (high speed-UART) or PCIe (peripheral component interconnect bus express) interface), but there is no limitation on its type. Alternatively, the first communication processor (212) and the second communication processor (214) may exchange control information and packet data information using, for example, a shared memory. The first communication processor (212) may transmit and receive various information, such as sensing information, information on output intensity, and resource block (RB) allocation information, with the second communication processor (214).

[0060] Depending on the implementation, the first communication processor (212) may not be directly connected to the second communication processor (214). In this case, the first communication processor (212) may transmit and receive data with the second communication processor (214) through the processor (120) (e.g., application processor). For example, the first communication processor (212) and the second communication processor (214) may transmit and receive data with the processor (120) (e.g., application processor) through an HS-UART interface or a PCIe interface, but there is no limitation on the type of interface. Alternatively, the first communication processor (212) and the second communication processor (214) may exchange control information and packet data information with the processor (120) (e.g., application processor) using shared memory.

[0061] According to one embodiment, the first communication processor (212) and the second communication processor (214) may be implemented in a single chip or a single package. According to various embodiments, the first communication processor (212) or the second communication processor (214) may be formed in a single chip or a single package with the processor (120), the auxiliary processor (123), or the communication module (190). For example, an integrated communication processor in which the first communication processor (212) and the second communication processor (214) are integrated may support functions for communicating with both the first cellular network (292) and the second cellular network (294).

[0062] The first RFIC (222) can convert a baseband signal generated by the first communication processor (212) into a radio frequency (RF) signal of about 700 MHz to about 3 GHz used in the first cellular network (292) (e.g., a legacy network) during transmission (e.g., during a transmission operation of the electronic device (101)). During reception (e.g., during a reception operation of the electronic device (101)), the RF signal can be acquired from the first network (292) (e.g., a legacy network) via an antenna (e.g., the first antenna module (242)) and preprocessed via an RFFE (e.g., the first RFFE (232)). The first RFIC (222) can convert the preprocessed RF signal into a baseband signal so that the first communication processor (212) can process the preprocessed RF signal.

[0063] The second RFIC (224) may convert a baseband signal generated by the first communication processor (212) or the second communication processor (214) into an RF signal (hereinafter, a 5G Sub6 RF signal) of a Sub6 band (e.g., about 6 GHz or less) used in the second cellular network (294) (e.g., a 5G network) during transmission (e.g., during a transmission operation of the electronic device (101)). During reception (e.g., during a reception operation of the electronic device (101)), the 5G Sub6 RF signal may be acquired from the second cellular network (294) (e.g., a 5G network) via an antenna (e.g., the second antenna module (244)) and preprocessed via an RFFE (e.g., the second RFFE (234)). The second RFIC (224) can convert the preprocessed 5G Sub6 RF signal into a baseband signal so that it can be processed by a corresponding communication processor among the first communication processor (212) or the second communication processor (214).

[0064] The third RFIC (226) can convert the baseband signal generated by the second communication processor (214) into an RF signal (hereinafter, 5G Above6 RF signal) of a 5G Above6 band (e.g., about 6 GHz to about 60 GHz) to be used in the second cellular network (294) (e.g., 5G network). Upon reception (e.g., during a reception operation of the electronic device (101)), the 5G Above6 RF signal can be acquired from the second cellular network (294) (e.g., 5G network) through an antenna (e.g., antenna (248)) and preprocessed through the third RFFE (236). The third RFIC (226) can convert the preprocessed 5G Above6 RF signal into a baseband signal so that the second communication processor (214) can process the 5G Above6 RF signal. In one embodiment, the third RFFE (236) may be formed as part of the third RFIC (226).

[0065] The electronic device (101) may, according to one embodiment, include a fourth RFIC (228) separate from or at least as a part of the third RFIC (226). In this case, the fourth RFIC (228) may convert a baseband signal generated by the second communication processor (214) into an RF signal (hereinafter, referred to as an IF signal) of an intermediate frequency band (e.g., about 9 GHz to about 11 GHz) and then transmit the IF signal to the third RFIC (226). The third RFIC (226) may convert the IF signal into a 5G Above6 RF signal. Upon reception (e.g., during a reception operation of the electronic device (101)), the 5G Above6 RF signal may be received from the second cellular network (294) (e.g., a 5G network) via an antenna (e.g., antenna (248)) and converted into an IF signal by the third RFIC (226). The fourth RFIC (228) may convert the IF signal into a baseband signal so that the second communication processor (214) can process it. The RFICs (222, 224, 226, 228) may correspond to RF transceivers. According to one embodiment, at least a portion of the RF transceiver and / or peripheral circuitry of the RF transceiver may perform a function corresponding to the RFICs (222, 224, 226, 228).

[0066] In one embodiment, the first RFIC (222) and the second RFIC (224) may be implemented as a single chip or at least a portion of a single package. According to various embodiments, when the first RFIC (222) and the second RFIC (224) in FIG. 2 are implemented as a single chip or a single package, they may be implemented as an integrated RFIC. In this case, the integrated RFIC may be connected to the first RFFE (232) and the second RFFE (234), such that the integrated RFIC may convert a baseband signal into a signal in a band supported by the first RFFE (232) and / or the second RFFE (234), and transmit the converted signal to one of the first RFFE (232) and the second RFFE (234). In one embodiment, the first RFFE (232) and the second RFFE (234) may be implemented as at least a portion of a single chip or a single package. According to one embodiment, at least one antenna module of the first antenna module (242) or the second antenna module (244) may be omitted or combined with another antenna module to process RF signals of corresponding multiple bands.

[0067] In one embodiment, the third RFIC (226) and the antenna (248) may be disposed on the same substrate to form a third antenna module (246). For example, the wireless communication module (192) or the processor (120) may be disposed on the first substrate (e.g., the main PCB). In this case, the third RFIC (226) may be disposed on a portion (e.g., the bottom surface) of a second substrate (e.g., the sub PCB) separate from the first substrate, and the antenna (248) may be disposed on another portion (e.g., the top surface) to form the third antenna module (246). By disposing the third RFIC (226) and the antenna (248) on the same substrate, it is possible to reduce the length of the transmission line therebetween. This can reduce, for example, the loss (e.g., attenuation) of signals in a high-frequency band (e.g., about 6 GHz to about 60 GHz) used in 5G network communications by the transmission line. Due to this, the electronic device (101) can improve the quality or speed of communication with the second network (294) (e.g., 5G network).

[0068] According to one embodiment, the antenna (248) may be formed as an antenna array including a plurality of antenna elements that may be used for beamforming. In this case, the third RFIC (226) may include a plurality of phase shifters (238) corresponding to the plurality of antenna elements, for example, as part of the third RFFE (236). During transmission (e.g., during a transmission operation of the electronic device (101), each of the plurality of phase shifters (238) may shift the phase of a 5G Above6 RF signal to be transmitted to an external source of the electronic device (101) (e.g., a base station of a 5G network) via its corresponding antenna element. During reception (e.g., during a reception operation of the electronic device (101), each of the plurality of phase shifters (238) may shift the phase of a 5G Above6 RF signal received from the external source via its corresponding antenna element to be the same or substantially the same phase. This enables transmission or reception via beamforming between the electronic device (101) and the external device.

[0069] The second cellular network (294) (e.g., a 5G network) may operate independently (e.g., Stand-Alone (SA)) or in connection with (e.g., Non-Stand Alone (NSA)) the first cellular network (292) (e.g., a legacy network). For example, the 5G network may only have an access network (e.g., a 5G radio access network (RAN) or next generation RAN (NG RAN)) and no core network (e.g., next generation core (NGC)). In this case, the electronic device (101) may access an external network (e.g., the Internet) under the control of the core network (e.g., evolved packed core (EPC)) of the legacy network after accessing the access network of the 5G network. Protocol information for communication with a legacy network (e.g., LTE protocol information) or protocol information for communication with a 5G network (e.g., New Radio (NR) protocol information) may be stored in the memory (230) and accessed by other components (e.g., the processor (120), the first communication processor (212), or the second communication processor (214)).

[0070] This specification describes various details of an electronic device (101) based on specific components included in the electronic device (101). However, the electronic device may include only some of the components described, and may also include one or more additional components to properly implement the functions required to be provided by and / or to operate the electronic device as described herein.

[0071] FIGS. 3A, 3B, and 3C are diagrams illustrating wireless communication systems that provide networks for legacy communication and / or 5G communication according to various embodiments. Referring to FIGS. 3A, 3B, and 3C, a network environment (300a to 300c) may include at least one of a legacy network and a 5G network. The legacy network may include, for example, a 4G or LTE base station (340) (e.g., an eNodeB (eNB)) of the 3GPP standard that supports wireless connection with an electronic device (101) and an evolved packet core (EPC) (342) that manages 4G communication. The above 5G network may include, for example, a New Radio (NR) base station (350) (e.g., gNB (gNodeB)) that supports wireless connection with an electronic device (101) and a 5th generation core (5GC) (352) that manages 5G communication of the electronic device (101).

[0072] According to various embodiments, the electronic device (101) may transmit and receive control messages and user data via legacy communication and / or 5G communication. The control messages may include, for example, messages related to at least one of security control, bearer setup, authentication, registration, or mobility management of the electronic device (101). The user data may refer to, for example, user data excluding control messages transmitted and received between the electronic device (101) and the core network (330) (e.g., EPC (342)).

[0073] Referring to FIGS. 3A, 3B, and 3C, an electronic device (101) according to one embodiment may transmit and receive at least one of a control message or user data to and from at least a portion of a 5G network (e.g., an NR base station (350), 5GC (352)) using at least a portion of a legacy network (e.g., an LTE base station (340), an EPC (342)).

[0074] According to various embodiments, the network environment (300a) may include a network environment that provides wireless communication dual connectivity (DC) to an LTE base station (340) and an NR base station (350), and transmits and receives control messages with an electronic device (101) through a core network (330) of one of the EPC (342) or 5GC (352).

[0075] According to various embodiments, in a DC environment, one of the LTE base stations (340) or the NR base station (350) may operate as a master node (MN) (310) and the other may operate as a secondary node (SN) (320). The MN (310) may be connected to a core network (330) and may transmit and receive control messages. The MN (310) and the SN (320) may be connected via a network interface and may transmit and receive messages related to management of radio resources (e.g., communication channels) to each other.

[0076] According to various embodiments, the MN (310) may be configured as an LTE base station (340), the SN (320) as an NR base station (350), and the core network (330) as an EPC (342). For example, control messages may be transmitted and received through the LTE base station (340) and the EPC (342), and user data may be transmitted and received through at least one of the LTE base station (340) or the NR base station (350).

[0077] According to various embodiments, the MN (310) may be configured as an NR base station (350), the SN (320) as an LTE base station (340), and the core network (330) as a 5GC (352). For example, control messages may be transmitted and received through the NR base station (350) and the 5GC (352), and user data may be transmitted and received through at least one of the LTE base station (340) or the NR base station (350).

[0078] Referring to FIG. 3b, according to various embodiments, a 5G network may be composed of an NR base station (350) and a 5GC (352), and may transmit and receive control messages and user data independently from an electronic device (101).

[0079] Referring to FIG. 3c, the legacy network and the 5G network according to various embodiments can independently provide data transmission and reception. For example, the electronic device (101) and the EPC (342) can transmit and receive control messages and user data via the LTE base station (340). As another example, the electronic device (101) and the 5GC (352) can transmit and receive control messages and user data via the NR base station (350).

[0080] According to various embodiments, the electronic device (101) may be registered with at least one of the EPC (342) or the 5GC (352) to transmit and receive control messages.

[0081] According to various embodiments, the EPC (342) or the 5GC (352) may interwork to manage communication of the electronic device (101). For example, movement information of the electronic device (101) may be transmitted and received through an interface between the EPC (342) and the 5GC (352).

[0082] As described above, dual connectivity through an LTE base station (340) and an NR base station (350) may also be named EN-DC (E-UTRA new radio dual connectivity).

[0083] Hereinafter, the structure of an electronic device (e.g., electronic device (101)) according to various embodiments will be described in detail with reference to FIGS. 4A and 4B. In each drawing of the embodiments described below, one communication processor (260) and one RFIC (410) are illustrated as being connected to multiple RFFEs (431, 432), but the various embodiments described below are not limited thereto. For example, in the various embodiments described below, as also illustrated in FIG. 2, multiple communication processors (212, 214) and / or multiple RFICs (222, 224, 226, 228) may be connected to multiple RFFEs (232, 234, 236), respectively.

[0084] FIG. 4A illustrates a block diagram of an electronic device according to various embodiments.

[0085] Referring to FIG. 4A, an electronic device according to various embodiments (e.g., an electronic device (101) as exemplarily illustrated in FIG. 1 and / or FIG. 2) may include a processor (120), a communication processor (260), an RFIC (410), a first RFFE (431), a second RFFE (432), a first antenna (441), a second antenna (442), a third antenna (443), a fourth antenna (444), a first switch (451), or a second switch (452). For example, the first RFFE (431) may be disposed above within a housing of the electronic device (101), and the second RFFE (432) may be disposed below the first RFFE (431) within the housing of the electronic device (101), but the various embodiments of the present disclosure are not limited to the above-described placement positions.

[0086] According to various embodiments, the RFIC (410) may convert a baseband signal generated by the communication processor (260) into a radio frequency (RF) signal used for a first communication network or a second communication network during transmission (e.g., during a transmission operation of the electronic device (101). For example, the RFIC (410) may transmit an RF signal used for a first communication network to a first antenna (441) or a fourth antenna (444) via a first RFFE (431) and a first switch (451). The RFIC (410) may transmit an RF signal used for the first communication network or the second communication network to a second antenna (442) or a third antenna (443) via a second RFFE (432) and a second switch (452). According to various embodiments, the RFIC (410) may transmit an RF signal corresponding to a first communication network (e.g., NR) to a first antenna (441) or a fourth antenna (444) through a first RFFE (431), and may transmit an RF signal corresponding to a second communication network (e.g., LTE) to a second antenna (442) or a third antenna (443) through a second RFFE (432). In another embodiment, the RFIC (410) may operate as a multi-input multi-output (MIMO) antenna by transmitting an RF signal corresponding to a first communication network (e.g., NR) or a second communication network (e.g., LTE) to a first antenna (441) or a fourth antenna (444) through a first RFFE (431), and transmitting an RF signal corresponding to the same first communication network (e.g., NR) or a second communication network (e.g., LTE) to a second antenna (442) or a third antenna (443) through a second RFFE (432).

[0087] According to various embodiments, the transmission path transmitted from the RFIC (410) through the first RFFE (431) and the first switch (451) to the first antenna (441) may be referred to as a 'first antenna transmission path (Ant Tx 1)'. The transmission path transmitted from the RFIC (410) through the first RFFE (431) and the first switch (451) to the fourth antenna (444) may be referred to as a 'fourth antenna transmission path (Ant Tx 4)'.

[0088] According to various embodiments, the RFIC (410) may convert a baseband signal generated by the communication processor (260) into a radio frequency (RF) signal used in a first communication network or a second communication network during transmission (e.g., during a transmission operation of the electronic device (101). For example, the RFIC (410) may transmit the RF signal used in the first communication network or the second communication network to a second antenna (442) or a third antenna (443) via a second RFFE (432) and a second switch (452).

[0089] According to various embodiments, the transmission path transmitted from the RFIC (410) through the second RFFE (432) and the second switch (452) to the second antenna (442) may be referred to as a 'second antenna transmission path (Ant Tx 2)'. The transmission path transmitted from the RFIC (410) through the second RFFE (432) and the second switch (452) to the third antenna (443) may be referred to as a 'third antenna transmission path (Ant Tx 3)'.

[0090] According to various embodiments, during reception (e.g., during a reception operation of the electronic device (101), an RF signal may be received from a first communication network via a first antenna (441) or a fourth antenna (444), and the received RF signal may be transmitted to a communication processor (260) via at least one RFIC (e.g., RFIC (410)). Additionally, an RF signal may be received from a first communication network or a second communication network via a second antenna (442) or a third antenna (443), and the received RF signal may be transmitted to a communication processor (260) via at least one RFIC (e.g., RFIC (410)).

[0091] According to various embodiments, the first communication network and the second communication network may be different communication networks. For example, the first communication network may be a 5G network, and the second communication network may be a legacy network (e.g., an LTE network). When the first communication network is a 5G network, the first RFFE (431) may be designed to be suitable for processing signals corresponding to the 5G network, and the second RFFE (432) may be designed to be suitable for processing signals corresponding to a legacy network. According to various embodiments, the frequency band of a signal transmitted through the first RFFE (431) and the frequency band of a signal transmitted through the second RFFE (432) may be the same, similar, or different. According to various embodiments, when an electronic device transmits a signal through at least one of the first antenna (441) and the fourth antenna (444) via the first RFFE (431) and the first switch (451), and transmits a reference signal (e.g., a sounding reference signal (SRS)) through the first antenna (441) and the fourth antenna (444), it may be referred to as '1T2R' since it uses one transmit antenna (Tx) and two receive antennas (Rx). According to various embodiments, when an electronic device transmits a signal through at least one of the second antenna (442) and the third antenna (443) via the second RFFE (432) and the second switch (452), and transmits a reference signal (e.g., a SRS) through the second antenna (442) and the third antenna (443), it may be referred to as '1T2R' since it uses one transmit antenna (Tx) and two receive antennas (Rx).

[0092] According to various embodiments, when the electronic device simultaneously transmits and receives data through the first RFFE (431) and the second RFFE (432), it may be referred to as '2T4R' since it uses two transmit antennas (Tx) and four receive antennas (Rx). The electronic device illustrated in FIG. 4A may operate in 1T2R or 2T4R according to various embodiments, and thus may be referred to as an electronic device supporting '1T2R / 2T4R'.

[0093] According to various embodiments, the RFIC (410) may convert a baseband signal generated by the communication processor (260) into a radio frequency (RF) signal used for a first communication network or a second communication network during transmission (e.g., during a transmission operation of the electronic device (101). For example, the RFIC (410) may transmit an RF signal used for a first communication network to a first antenna (441) or a fourth antenna (444) via the first RFFE (431) and the first switch (451). Additionally, the RFIC (410) may transmit an RF signal used for the first communication network to a second antenna (442) or a third antenna (443) via the first RFFE (431), the first switch (451), and the second switch (452).

[0094] According to various embodiments, the RFIC (410) may transmit an RF signal corresponding to a first communication network (e.g., NR) to a first antenna (441) or a fourth antenna (444) through a first RFFE (431), and may transmit an RF signal corresponding to a second communication network (e.g., LTE) to a second antenna (442) or a third antenna (443) through a second RFFE (432). According to various embodiments, the RFIC (410) may operate as a multi-input multi-output (MIMO) antenna by transmitting an RF signal corresponding to a first communication network (e.g., NR) or a second communication network (e.g., LTE) to a first antenna (441) or a fourth antenna (444) through a first RFFE (431) and a first switch (451), and to a second antenna (442) or a third antenna (443) through the first RFFE (431), the first switch (451), and the second switch (452). According to various embodiments, a transmission path transmitted from the RFIC (410) to the first antenna (441) through the first RFFE (431) and the first switch (451) may be referred to as a 'first antenna transmission path (Ant Tx 1)'. The transmission path transmitted from the RFIC (410) through the first RFFE (431), the first switch (451) to the fourth antenna (444) may be referred to as a 'fourth antenna transmission path (Ant Tx 4)'. The transmission path transmitted from the RFIC (410) through the first RFFE (431), the first switch (451), and the second switch (452) to the second antenna (442) may be referred to as a 'second antenna transmission path (Ant Tx 2)'. The transmission path transmitted from the RFIC (410) through the first RFFE (431), the first switch (451), and the second switch (452) to the third antenna (443) may be referred to as a 'third antenna transmission path (Ant Tx 3)'.

[0095] FIG. 4B illustrates a detailed block diagram of an electronic device according to various embodiments. Referring to FIG. 4B, an electronic device according to various embodiments (e.g., an electronic device (101) as exemplarily illustrated in FIG. 1) may include a communication processor (260), an RFIC (410), a first RFFE (431), a first antenna (441), a second RFFE (432), and a second antenna (442).

[0096] According to various embodiments, the first RFFE (431) may include additional components different from the second RFFE (432) (e.g., additionally) for signal processing suited to the characteristics of a 5G network or for supporting multi-bands. For example, the first RFFE (431) may include a front end module (FEM) (460) and a first single pole double throw (SPDT) switch (470).

[0097] According to various embodiments, the FEM (460) may include an amplifier (e.g., a power amplifier (PA) (461)) and a PA ET IC (envelop tracking IC) (464). According to various embodiments, the PA ET IC (464) may be included within the FEM (460) as illustrated in FIG. 4B, or may be connected to the FEM (460) externally. The PA ET IC (464) may control the Vcc of the PA (461) under the control of the communication processor (260) or the RFIC (410). The above PA ET IC (envelop tracking IC) (464) can operate in a plurality of modes (e.g., envelope tracking (ET) mode, average power tracking (APT) mode, maximum power mode (e.g., APT full bias or battery direct)) under the control of the communication processor (260) or RFIC (410).

[0098] According to one embodiment, the first RFFE (431) and / or the second RFFE (432) may be referred to as an RF circuit in the following description. According to one embodiment, the RF circuit may include an amplifier (e.g., a power amplifier (PA)), band pass filters (BPF), a coupler, a switching circuit (e.g., a switch box or an antenna switch module (ASM)), or a low noise amplifier (LNA). According to one embodiment, the RF circuit may be referred to as an RFFE, a front end module (FEM), a power amplifier module (PAM), a power amplifier module with integrated duplexer (PAMiD), an LNA PAMiD (LPAMiD), or a front end module with integrated duplexer (FEMid) depending on a function or a component included therein, but is not limited to the above terms.

[0099] According to one embodiment, as illustrated in FIG. 4B, the power amplifier (461) and the switch (470) may be included in a single semiconductor chip or integrated circuit constituting the RF circuit (e.g., the first RFFE (431)). According to one embodiment, the switch (470) may be configured as a separate module external to the RF circuit. According to one embodiment, the RF circuit may be configured as a semiconductor chip or an integrated integrated circuit integrated with the RF IC (410) as described above. For example, the amplifier (461) and / or the switch (470) included in the RF circuit may be configured as a semiconductor chip or an integrated integrated circuit integrated with the RFIC (410) described above.

[0100] FIG. 5 is a diagram illustrating an example of an internal structure of an electronic device (e.g., electronic device (101)) according to various embodiments.

[0101] Referring to FIG. 5, according to one embodiment, the electronic device (101) may include at least one printed circuit board (PCB). For example, the electronic device (101) may include a first PCB (510) and a second PCB (520). The first PCB (510) may be referred to as a main PCB, and the second PCB (520) may be referred to as a sub PCB, but the present invention is not limited to the above terms. For example, the second PCB (520) may be referred to as a main PCB, and the first PCB (510) may be referred to as a sub PCB. Although FIG. 5 illustrates a bar-type electronic device, the electronic device (101) according to various embodiments may include electronic devices having a form factor that includes a plurality of housings. For example, the electronic device (101) may include a foldable electronic device, a slideable electronic device, or a rollable electronic device that includes a plurality of housings. According to one embodiment, a first PCB (510) may be disposed in a first housing among a plurality of housings included in an electronic device (101), and a second PCB (520) may be disposed in a second housing among a plurality of housings included in an electronic device (10). According to one embodiment, a first PCB (510) and a second PCB (520) may be disposed in each of the first housing and the second housing.

[0102] According to one embodiment, the first PCB (510) may include at least one RFIC (410). The first PCB (510) may include at least one RFFE (e.g., RFFE (431, 432) as exemplarily illustrated in FIG. 4A or FIG. 4B). According to one embodiment, the first PCB (510) may include at least one power amplifier module (PAM) (511, 512, 513, 514) including at least one power amplifier (PA) as the at least one RFFE. The at least one PAM (511, 512, 513, 514) included in the first PCB (510) may amplify an RF signal to be transmitted from the RFIC (410) to the outside of the electronic device (101). For example, the first PCB (510) may include a first PAM (511), a second PAM (512), a third PAM (513), and / or a fourth PAM (514). The first PAM (511) may correspond to a module for amplifying SRS during EN-DC operation.

[0103] According to one embodiment, the electronic device (101) can amplify an SRS through at least one PAM (511, 512, 513, 514) (e.g., a first RFFE (431) or a second RFFE (432) as exemplarily illustrated in FIG. 4A) and transmit the amplified SRS through a plurality of antennas (541, 542) (e.g., a first antenna (441), a second antenna (442), a third antenna (443), and a fourth antenna (444) as exemplarily illustrated in FIG. 4A). The SRS transmitted through each antenna of the electronic device (101) can be received through an antenna of a base station (e.g., a gNB). SRS is a signal transmitted to check the status of an uplink channel used to transmit a signal from an electronic device (101) to a base station. The base station receiving the SRS can check the channel status with the electronic device (101) and report it to the electronic device (101). For example, in a MIMO environment, the SRS may be used to check the status of a downlink channel used to transmit preferences from a base station to the electronic device (101).

[0104] According to various embodiments, for transmitting SRS, a first antenna connected to a main PCB (e.g., a first PCB (510)) and provided at the top of the electronic device (101) and a second antenna connected to a sub PCB (e.g., a second PCB (520)) and provided at the bottom of the electronic device (101) may be used together. The first antenna and the second antenna may each be an antenna group including one or more antenna elements (e.g., a radiator, a ground). Among the transmission lines arranged on the FRC (FPCB type RF cable), when not transmitting SRS, at least one transmission line used for receiving data may be used as part of the signal paths for SRS transmission. Compared to the SRS path of the main PCB (e.g., the first PCB (510)), the SRS path connected to the sub PCB (e.g., the second PCB (520)) via the FRC may be relatively longer and vulnerable to ambient interference. Accordingly, in comparison with the SRS transmitted to the first antenna on the main PCB (e.g., the first PCB (510)), the SRS transmitted to the second antenna via the sub PCB (e.g., the second PCB (520)) may have an offset value added to the power level. When the SRS is transmitted through the FRC at an increased power level with the added offset value, the transmission lines on the FRC for LTE data signals being received through the adjacent RF reception path may be changed or selected as one of a plurality of signal combinations based on the reception strength / quality (e.g., SINR) of at least one LTE data signal (Rx) or the transmission signal strength of at least one SRS. According to various embodiments, the SRS may be simultaneously transmitted through two or more wires (lines) in the FRC. When the LTE data signal is simultaneously transmitted through two or more wires transmitting the SRS and the adjacent transmission lines, the size or quality of the LTE data signal may be affected.

[0105] According to various embodiments, the base station may receive an SRS transmitted from the electronic device (101) and estimate a channel for each antenna of the electronic device (101) (e.g., a first antenna (441), a second antenna (442), a third antenna (443), and a fourth antenna (444) as exemplarily illustrated in FIG. 4A) based on the received SRS. The base station may transmit a beamformed signal to each antenna of the electronic device (101) (e.g., a first antenna (441), a second antenna (442), a third antenna (443), and a fourth antenna (444) as exemplarily illustrated in FIG. 4A) based on the channel estimate.

[0106] The second PAM (512) may correspond to an LPAMiD (LNA PAMiD (power amplifier module with integrated duplexer)) module. The third PAM (513) may correspond to an LB (low band) PAMiD module for amplifying a low-band signal. The fourth PAM (514) may correspond to a PAM module for amplifying an ultra-high band (UHB) (e.g., N78 band) signal. Although four PAMs are exemplified in FIG. 5, the number is not limited thereto, and three or fewer or five or more PAMs may be included. In addition, each of the PAMs (511, 512, 513, and 514) is not limited to the above-described purposes.

[0107] According to one embodiment, the second PCB (520) may include at least one RFFE (522) (e.g., RFFE (431, 432) as exemplarily illustrated in FIG. 4A or FIG. 4B). For example, the second PCB (520) may include an LFEM (LNA FEM) as an example of the RFFE (522). The RFFE (522) (e.g., LFEM) may amplify an RF signal received from the outside of the electronic device (101) through at least one antenna through an LNA (low noise amplifier). According to one embodiment, the second PCB (520) may (e.g., additionally) include a diplexer (521).

[0108] According to one embodiment, the electronic device (101) may include at least one flexible printed circuit board (FPCB) (530) between the first PCB (510) and the second PCB (520). For example, the electronic device (101) may include a first FPCB (e.g., FPCB (530)) for transmitting an RF signal and a second FPCB (not shown) for transmitting a digital signal other than an RF signal between the first PCB (510) and the second PCB (520). The first FPCB (e.g., FPCB (530)) and the additional second FPCB (not shown) may each be configured to include a plurality of circuit layers. Although the electronic device (101) illustrated in FIG. 5 is illustrated as having at least one FPCB (530) connected between the first PCB (510) and the second PCB (520), embodiments of the present disclosure may also be applied to transmission lines (e.g., wiring connections on the PCB) between RFICs (410) and RFFEs (432) arranged on the same PCB. Embodiments of the present disclosure may also be applied to transmission lines between other RF elements or various types of signal paths between other digital elements in addition to between the RFICs (410) and RFFEs (432). It may be understood that embodiments of the present disclosure may be applied to one or more transmission lines between RF elements, for example, transmission lines between an RFIC and an RFFE of an electronic communication device, and / or various other types of signal paths between RF elements (e.g., between digital elements) of an electronic device.

[0109] According to one embodiment, the at least one FPCB (530) may include a plurality of transmission lines (531, 532, 533, 534, 535, 536, 537, 538). For example, the plurality of transmission lines may be arranged on the same circuit layer among the plurality of circuit layers included in the FPCB (530), or some of the transmission lines may be arranged on different circuit layers. Although FIG. 5 illustrates that the at least one FPCB (530) includes eight transmission lines, the number is not limited thereto, and seven or fewer or nine or more transmission lines may be included. For example, the at least one FPCB (530) may transmit and receive an RF signal through each of the plurality of transmission lines. For example, an RF signal transmitted from the first PCB (510) to the at least one FPCB (530) may be transmitted to the second PCB (520) through at least one transmission line included in the at least one FPCB (530). An RF signal transmitted from the second PCB (520) to the at least one FPCB (530) may be transmitted to the first PCB (510) through at least one transmission line included in the at least one FPCB (530). An RF signal transmitted from the first PCB (510) to the second PCB (520) through at least one transmission line included in the FPCB (530) may correspond to a transmission signal (Tx signal) (e.g., an uplink signal) transmitted from the electronic device (101) to a communication network (e.g., a base station). The RF signal transmitted from the second PCB (530) to the first PCB (510) through at least one transmission line included in the FPCB (530) may correspond to a received signal (Rx signal) (e.g., a downlink signal) transmitted from a communication network (e.g., a base station) and received through an antenna of the electronic device (101).

[0110] According to one embodiment, the first transmission line (531) and the second transmission line (532) included in the FPCB (530) may be used for transmission of transmit signals (Tx signals) (e.g., transmission from the first PCB (510) to the second PCB (520)) or transmission of receive signals (Rx signals) (e.g., transmission from the second PCB (520) to the first PCB (510)). For example, an RF signal generated in the RFIC (410) may be amplified through at least one of the first PAM (511), the second PAM (512), or the third PAM (513), and then transmitted to the second PCB (520) through at least one of the first transmission line (531) or the second transmission line (532). An RF signal transmitted to the second PCB (520) through at least one of the first transmission line (531) or the second transmission line (532) may be transmitted to the outside of the electronic device (101) (e.g., a base station) through the first antenna (541). The RF signal transmitted through at least one of the first transmission line (531) or the second transmission line (532) may correspond to a low band / mid band (LB / MB) frequency signal or a high band (HB) frequency signal. The RF signal transmitted through at least one of the first transmission line (531) or the second transmission line (532) may correspond to a frequency signal used for 5G communication (e.g., an N41 band signal). The RF signal transmitted through at least one of the first transmission line (531) or the second transmission line (532) may correspond to a reference signal (e.g., SRS). According to one embodiment, the RF signal received from the outside of the electronic device (101) through the first antenna (541) may be transmitted to at least one of the first transmission line (531) or the second transmission line (532) through the second PCB (520).An RF signal transmitted through at least one of the first transmission line (531) or the second transmission line (532) in the second PCB (520) may be transmitted to an RFIC (410) included in the first PCB (510). For example, an RF signal transmitted through at least one of the first transmission line (531) or the second transmission line (532) in the second PCB (520) may be amplified through an LNA included in the first PAM (511), the second PAM (512), or the third PAM (513) of the first PCB (510) and then transmitted to the RFIC (410).

[0111] According to one embodiment, the third transmission line (533) and the fourth transmission line (534) included in the FPCB (530) may be used for transmitting transmission signals (Tx signals) or receiving signals (Rx signals). For example, an RF signal generated in the RFIC (410) may be amplified through the fourth PAM (514) and then transmitted to the second PCB (520) through at least one of the third transmission line (533) or the fourth transmission line (534). The RF signal transmitted to the second PCB (520) through at least one of the third transmission line (533) or the fourth transmission line (534) may be transmitted to the outside of the electronic device (101) (e.g., a base station) through the diplexer (521) and the second antenna (542). The RF signal transmitted through at least one of the third transmission line (533) or the fourth transmission line (534) may correspond to a frequency signal (e.g., an N78 band signal) or an ultra high band (UHB) signal used for 5G communication. The RF signal transmitted through at least one of the third transmission line (533) or the fourth transmission line (534) may correspond to a reference signal (e.g., an SRS). According to one embodiment, the RF signal received from the outside of the electronic device (101) through the second antenna (542) may be transmitted through the diplexer (521) of the second PCB (520) to at least one of the third transmission line (533) or the fourth transmission line (534). An RF signal transmitted through at least one of the third transmission line (533) or the fourth transmission line (534) in the second PCB (520) can be transmitted to the RFIC (410) through the fourth PAM (514) of the first PCB (510).For example, an RF signal transmitted through at least one of the third transmission line (533) or the fourth transmission line (534) in the second PCB (520) may be amplified through an LNA included in the fourth PAM (514) of the first PCB (510) and then transmitted to the RFIC (410).

[0112] According to one embodiment, the fifth transmission line (535), the sixth transmission line (536), the seventh transmission line (537), or the eighth transmission line (538) included in the FPCB (530) may be used for transmitting received signals (Rx signals). For example, an RF signal received from the outside of the electronic device (101) through the second antenna (542) may be amplified to low noise by an LNA included in the RFFE (522) of the second PCB (520) and then transmitted to at least one of the fifth transmission line (535) to the eighth transmission line (538). An RF signal transmitted through at least one of the fifth transmission line (535) to the eighth transmission line (538) in the second PCB (520) may be transmitted to the RFIC (410) of the first PCB (510). The RF signal transmitted through at least one of the fifth transmission line (535) to the eighth transmission line (538) may correspond to a mid band (MB) frequency signal or a high band (HB) frequency signal.

[0113] According to one embodiment, when connecting PCBs (510, 520) within an electronic device (101) using an FPCB (530) as illustrated in FIG. 5, the signal path of the received signal may become longer. For example, when an RF transmission line (e.g., the fifth transmission line (535) to the eighth transmission line (538)) for transmitting the received signal among a plurality of RF transmission lines included in the FPCB (530) is adjacent to at least one of the RF transmission lines (e.g., the first transmission line (531) to the fourth transmission line (534)) assigned as a transmission path, de-sense (e.g., a decrease in the sensitivity of the received signal) may occur. For example, if at least one of the RF transmission lines for transmitting the received signal is adjacent to at least one of the RF transmission lines assigned as the transmission path, a signal (e.g., an uplink signal) transmitted through the RF transmission line assigned as the transmission path may interfere with a signal (e.g., a downlink signal) transmitted through the RF transmission line for transmitting the received signal, thereby reducing the sensitivity of the received signal. For example, the frequency band of the transmitted signal (e.g., the N78 or N41 frequency band) may be higher than the frequency band of the received signal (e.g., the B1, B3, B7, B8 frequency band), but is not limited thereto.

[0114] According to one embodiment, the electronic device (101) may transmit and receive a 5G signal (e.g., an N78 frequency band signal) through any one of the first transmission lines (531) to the fourth transmission lines (534) in an EN-DC situation, and may receive an LTE signal (e.g., a B1, B3, B6, B7, or B8 frequency band signal) through any one of the fifth transmission lines (535) to the eighth transmission lines (538). For example, an LTE signal received through any one of the fifth transmission lines (535) to the eighth transmission lines (538) may be desensitized by a 5G transmission signal (e.g., an SRS signal) transmitted through any one of the first transmission lines (531) to the fourth transmission lines (534).

[0115] FIG. 6 illustrates a block diagram of an electronic device (e.g., electronic device (101)) according to various embodiments.

[0116] Referring to FIG. 6, at least some of the connection lines between the RFIC (e.g., RFIC (410)) and the RFFE (e.g., RFFE (522)) may be connected by an FPCB (e.g., FPCB (530)). For example, the FPCB (530) may include a fifth transmission line (RX_MHB1) (535), a sixth transmission line (RX_MHB2) (536), a seventh transmission line (RX_MHB3) (537), and an eighth transmission line (RX_MHB4) (538).

[0117] According to one embodiment, the RFIC (410) may allocate and use one RF transmission line for each frequency band among the plurality of RF transmission lines included in the FPCB (530) to receive signals in the B1, B3, and B7 frequency bands. The electronic device (101) may sequentially allocate RF transmission lines each time a component carrier (CC) is added in a CA (carrier aggregation) or EN-DC state. For example, the PCC (primary component carrier) may be allocated to the fifth transmission line (535), the SCC1 (secondary component carrier 1) may be allocated to the sixth transmission line (536), and the SCC2 may be allocated to the seventh transmission line (537). The eighth transmission line (538) may remain unused. A cell corresponding to a PCC may correspond to a primary serving cell (Pcell), and a cell corresponding to an SCC may correspond to a secondary serving cell (Scell).

[0118] In one embodiment, when the B1 frequency band signal is set to PCC, the fifth transmission line (535) may be allocated for receiving the B1 frequency band signal. Then, when the B3 frequency band is set to SCC1, the sixth transmission line (536) may be allocated for receiving the B3 frequency band signal. Then, when the B7 frequency band is set to SCC2, the seventh transmission line (537) may be allocated for receiving the B7 frequency band signal. The eighth transmission line (538) may remain unused.

[0119] According to one embodiment, when an RF transmission line (e.g., the fifth transmission line (535), the FIG. 6 transmission line (536), or the seventh transmission line (537)) for transmitting a reception signal among a plurality of RF transmission lines included in an FPCB (530) as illustrated in FIG. 6 is allocated and used as a reception path, desense may occur due to an adjacent RF transmission line among the RF transmission lines allocated as a transmission path (e.g., the first transmission line (531) to the fourth transmission line (534)).

[0120] FIG. 7 illustrates a block diagram of an electronic device (e.g., electronic device (101)) according to various embodiments.

[0121] Referring to FIG. 7, according to one embodiment, if at least one of the RF transmission lines for transmitting a reception signal (e.g., the fifth transmission line (535), the sixth transmission line (536), or the seventh transmission line (537)) among the plurality of RF transmission lines included in the FPCB (530) as illustrated in FIG. 6 is adjacent to at least one of the RF transmission lines assigned as a transmission path (e.g., the first transmission line (531) to the fourth transmission line (534)), de-sense may occur. For example, if at least one of the RF transmission lines for transmitting the received signal (e.g., the fifth transmission line (535), the sixth transmission line (536), or the seventh transmission line (537)) is adjacent to at least one of the RF transmission lines assigned as the transmission path (e.g., the first transmission line (531), the second transmission line (532), the third transmission line (533), or the fourth transmission line (534)), a signal (e.g., an uplink signal) transmitted through the RF transmission line assigned as the transmission path may interfere with a signal (e.g., a downlink signal) transmitted through the RF transmission line for transmitting the received signal, thereby lowering the sensitivity of the received signal.

[0122] In one embodiment, the RF transmission line for transmitting the received signal may be positioned adjacent to the RF transmission line assigned as the transmission path. For example, the receive / transmit RF transmission lines may be positioned on the same FPCB. However, this is not limited to this, and they may be positioned on two or more different adjacent FPCBs, respectively.

[0123] Desensitization can have different effects (e.g., sensitivity) depending on the physical proximity of RF transmission lines. For example, if the fourth transmission line (534) and the sixth transmission line (536) are closest to each other in terms of line layout, the reception quality of the received signal (e.g., downlink signal) through the sixth transmission line can be most significantly affected by the transmitted signal (e.g., uplink signal) through the fourth transmission line.

[0124] FIG. 8 illustrates a block diagram of an electronic device (e.g., electronic device (101)) according to various embodiments.

[0125] Referring to FIG. 8, at least some of the connection lines between an RFIC (e.g., RFIC (410)) and an RFFE (e.g., RFFE (522)) may be connected by an FPCB (e.g., FPCB (530)). The RFIC (410) may include a plurality of mixers (411) and a first switch (412). Each of the plurality of mixers (411) may be designed to process a signal of a specific frequency band, but is not limited thereto. The RFFE (522) may include a plurality of filters (522a), a plurality of LNAs (522b), and a second switch (522c) (e.g., a 4P4T switch). The FPCB (530) may include a plurality of RF transmission lines. For example, as described above, the FPCB (530) may include a plurality of RF transmission lines (e.g., the fifth transmission line (535) to the eighth transmission line (538)) for transmitting a reception signal received through the antenna (542) from the RFFE (522) to the RFIC (410). The FPCB (530) may include a plurality of RF transmission lines (e.g., the first transmission line (531) to the fourth transmission line (534)) for transmitting a transmission signal through at least one antenna (820) from the RFIC (410). An antenna switching module (ASM) (810) may be coupled between the RFIC (410) and the at least one antenna (820). According to one embodiment, as illustrated in FIG. 5, between the RFIC (410) and a plurality of RF transmission lines (e.g., the first transmission line (531) to the fourth transmission line (534)) for transmitting each of the transmission signals, at least one power amplifier module (PAM) (511, 512, 513, 514) including at least one PA (power amplifier) ​​as at least one RFFE may be included.

[0126] According to one embodiment, as described above, at least one RF transmission line among a plurality of RF transmission lines (e.g., the first transmission line (531) to the fourth transmission line (534)) allocated for transmission of transmit signals (Tx signals) can influence at least one RF transmission line among a plurality of RF transmission lines (e.g., the fifth transmission line (535) to the eighth transmission line (538)) allocated for transmission of receive signals (Rx signals).

[0127] According to one embodiment, when a desense occurs in at least one RF transmission line among the fifth transmission line (535) to the eighth transmission line (538), the electronic device (101) can change the reception path so that a reception signal received through the RF transmission line where the desense occurs is received through another RF transmission line. According to one embodiment, the electronic device (101) (e.g., the communication processor (260)) can change the RF transmission line of each reception signal by controlling the switch (522c) included in the RFFE (522).

[0128] According to one embodiment, when a desense occurs in at least one RF transmission line among the fifth transmission line (535) to the eighth transmission line (538), the electronic device (101) controls the switch (522c) included in the RFFE (522) to change the RF transmission line of at least one reception signal (e.g., each reception signal), thereby changing the signal received from the mixers (411) through the switch (412) of the RFIC (410). Accordingly, the electronic device (101) can control the first switch (412) so that the reception signal input to the mixers (411) through the first switch (412) is suitable for a frequency band that can be processed by each mixer.

[0129] FIG. 9 illustrates a flowchart for explaining an operation method of an electronic device (e.g., electronic device (101)) according to various embodiments.

[0130] In the following examples, the operations may be performed sequentially, but are not necessarily sequential. For example, the order of the operations may be changed, and at least two operations may be performed in parallel.

[0131] According to one embodiment, an electronic device (e.g., electronic device (101)) may include a first PCB (e.g., PCB (510)) including an RFIC (e.g., RFIC (410)) (e.g., RF transceiver circuitry). The electronic device may include a second PCB (e.g., PCB (520)) including an RFFE (e.g., RFFE (522)) (e.g., RFFE circuitry (522)) connected to at least one antenna (e.g., second antenna (542) of FIG. 5). The electronic device may include an FPCB (e.g., FPCB (530)) connected between the first PCB (510) and the second PCB (520). The FPCB (530) may include a plurality of transmission lines (e.g., the first transmission line (531) to the eighth transmission line (538)) including a first RF transmission line, a second RF transmission line, and a third RF transmission line. The electronic device may include a memory (e.g., the memory (130) of FIG. 1) that stores instructions. The electronic device may include at least one processor (e.g., at least one of the processor (120), the first communication processor (212), the second communication processor (214), and / or the integrated communication processor (260). The instructions, when individually or collectively executed by the at least one processor, may cause the electronic device to perform at least one operation. However, the electronic device (101) may include other suitable configurations to implement the operations disclosed herein.

[0132] According to various embodiments, an electronic device (e.g., electronic device (101)) (e.g., at least one of the processor (120), the first communication processor (212), the second communication processor (214), and / or the integrated communication processor (260)) may, in operation 902, transmit a transmission signal from the first PCB to the second PCB via a first RF transmission line (e.g., at least one RF transmission line from the first transmission line (531) to the fourth transmission line (534), as exemplarily illustrated in FIG. 5 ).

[0133] According to various embodiments, the electronic device (e.g., the electronic device (101)) may control, in operation 904, to transmit first receive signals (Rx signals) received via at least one antenna from the second PCB to the first PCB via a second RF transmission line (e.g., at least one RF transmission line among the fifth transmission line (535) to the eighth transmission line (538) as exemplarily illustrated in FIG. 5).

[0134] According to various embodiments, the electronic device (e.g., the electronic device (101)) may, in operation 906, check information related to the quality of the first received signal transmitted through the second RF transmission line while transmitting the transmission signal through the first RF transmission line. For example, the information related to the quality of the first received signal may include at least one of a reference signal received power (RSRP), a received signal strength indicator (RSSI), a reference signal received quality (RSRQ), a signal to interference plus noise ratio (SINR), and / or a signal to noise ratio (SNR).

[0135] According to various embodiments, the electronic device (e.g., the electronic device (101)) may control, at operation 908, to change a signal path of the first received signal from the second RF transmission line to a third RF transmission line based on whether the information related to the quality of the first received signal satisfies a first condition. For example, at operation 908, the electronic device (101) may control, at operation 908, to change a signal path of the first received signal from the sixth transmission line (536) to the eighth transmission line (538) based on whether the information related to the quality of the first received signal satisfies the first condition. According to various embodiments, the electronic device (101) may control, at operation 908, to maintain transmission of the first received signal through the second RF transmission line based on whether the information related to the quality of the first received signal satisfies a second condition. According to one embodiment, the second condition may correspond to a pass condition, and the first condition may correspond to a fail condition. For example, the electronic device (e.g., electronic device (101)) may determine that the second condition is satisfied when the RSRP of the first received signal is equal to or greater than a first threshold value (e.g., -80 dBm). The electronic device (101) may determine that the first condition is satisfied when the RSRP of the first received signal is less than a second threshold value (e.g., -100 dBm). The first threshold value and the second threshold value may be set to be the same or different. The electronic device (101) may determine that the second condition is satisfied when the SINR of the first received signal is equal to or greater than a third threshold value (e.g., 21 dB). The electronic device (101) may determine that the second condition is satisfied when the SINR of the first received signal is less than a fourth threshold value (e.g., 20 dB). The third threshold value and the fourth threshold value may be set to be the same or different.In the various embodiments described below, information related to the quality of the received signal will be described using SINR as an example. In the embodiments described below, SINR may be replaced with at least one of the aforementioned RSRP, RSSI, RSRQ, or SNR.

[0136] According to various embodiments, the electronic device (e.g., electronic device 101) may have a form factor including a plurality of housings as described above. For example, the electronic device 101 may include a foldable electronic device, a slideable electronic device, or a rollable electronic device including a plurality of housings. According to one embodiment, when the shape of the electronic device 101 is transformed from a first state (e.g., an open state) to a second state (e.g., a closed state), the transmission line of the transmission signal may be changed from the first RF transmission line described above to another transmission line. In addition, as the transmission line of the transmission signal is changed, the transmission line of at least one reception signal may be changed to another transmission line. In this way, when the transmission line of the transmission signal or the transmission line of the reception signal is changed, the electronic device 101 may perform operations 906 and 908 described above.

[0137] According to various embodiments, the electronic device (e.g., the electronic device (101)) may control to change the signal path of the first received signal and also change the path of the transmitted signal based on whether the information related to the quality of the first received signal satisfies the first condition in operation 908. For example, the electronic device (101) may control to switch the transmission line of the transmitted signal to a path further away from the transmission line of the received signal. For example, if the first condition is still satisfied despite changing the signal path of the first received signal, the electronic device (101) may control to switch the transmission line of the transmitted signal to a path further away from the transmission line of the received signal. For example, the electronic device (101) may control to switch the transmission line of the transmitted signal to a path that is not currently being used or to another transmission path or receiving path that is currently being used. For example, if the first condition is still satisfied despite the signal path of the first reception signal being changed, the transmission line of the transmission signal can be controlled to be switched to a path that is further away from the transmission path of the reception signal and is not in use, or to be switched to another transmission path or reception path currently in use.

[0138] FIG. 10 illustrates a flowchart for explaining an operation method of an electronic device (e.g., electronic device (101)) according to various embodiments.

[0139] In the following examples, the operations may be performed sequentially, but are not necessarily sequential. For example, the order of the operations may be changed, and at least two operations may be performed in parallel.

[0140] According to one embodiment, an electronic device (e.g., electronic device (101)) may include a first PCB (510) including an RFIC (410) (or RF transceiver circuit). The electronic device may include a second PCB (520) including an RFFE (522) (or RFFE circuit) connected to at least one antenna (e.g., a second antenna (542) as exemplarily illustrated in FIG. 5). The electronic device may include an FPCB (530) connected between the first PCB (510) and the second PCB (520). The FPCB (530) may include a plurality of transmission lines (e.g., the first transmission line (531) to the eighth transmission line (538)) including a first RF transmission line, a second RF transmission line, and a third RF transmission line. The electronic device may include a memory (e.g., the memory (130) as exemplarily illustrated in FIG. 1) for storing instructions. The electronic device may include at least one processor (e.g., one of the processor (120), the first communication processor (212), the second communication processor (214), or the integrated communication processor (260). The instructions, when individually or collectively executed by the at least one processor, may cause the electronic device to perform at least one operation. However, the electronic device (101) may include other suitable components to implement the operations disclosed herein.

[0141] According to various embodiments, an electronic device (e.g., electronic device (101)) (e.g., at least one of at least one processor (120), a first communication processor (212), a second communication processor (214), or an integrated communication processor (260)) may, in operation 1002, transmit a transmission signal from the first PCB to the second PCB via a first RF transmission line (e.g., at least one RF transmission line from the first transmission line (531) to the fourth transmission line (534) as exemplarily illustrated in FIG. 5 ).

[0142] According to various embodiments, the electronic device (e.g., the electronic device (101)) may control, in operation 1004, to transmit first receive signals (Rx signals) received via at least one antenna from the second PCB to the first PCB via a second RF transmission line (e.g., at least one RF transmission line among the fifth transmission line (535) to the eighth transmission line (538) as exemplarily illustrated in FIG. 5).

[0143] According to various embodiments, the electronic device (e.g., electronic device (101)) may, in operation 1006, determine the intensity and / or size of the transmission signal transmitted through the first RF transmission line while transmitting the transmission signal through the first RF transmission line.

[0144] According to various embodiments, the electronic device (e.g., the electronic device (101)) may control, in operation 1008, to change the signal path of the first reception signal from the second RF transmission line to the third RF transmission line based on whether the intensity and / or size of the transmission signal satisfies the set condition. For example, the electronic device (101) may control, in operation 1008, to change the signal path of the first reception signal from the sixth transmission line (536) to the eighth transmission line (538) based on whether the intensity or size of the transmission signal satisfies the set condition. According to one embodiment, the condition for changing the transmission line may include not only the intensity and / or size of the transmission signal but also the transmission time. According to one embodiment, the set condition may be stored separately by frequency band. The set condition may be set by the manufacturer, set by the user, or set or updated through artificial intelligence learning. In various embodiments described below, information related to the quality of the received signal set as a condition for changing the signal path of the received signal in FIG. 9 may be replaced with the intensity or size of the transmitted signal described in FIG. 10.

[0145] FIG. 11 illustrates a block diagram of an electronic device (e.g., electronic device (101)) according to various embodiments.

[0146] Referring to FIG. 11, according to various embodiments, the electronic device (101) may include an FPCB (530) electrically connected between an RFIC (410) and an RFFE (522). The FPCB (530) may include RF transmission lines corresponding to four receiving paths (e.g., a fifth transmission line (535) to an eighth transmission line (538)).

[0147] According to one embodiment, when the SINR measured in the frequency band of each received signal constituting the CA and EN-DC combination satisfies a first condition (e.g., becomes lower than or equal to a first threshold value), the electronic device (101) may change the receiving path of each received signal by controlling a switch included in the RFFE (522) as illustrated in FIG. 8 (e.g., a switch (522c) as illustrated in FIG. 8). For example, the electronic device (101) may change the receiving path of each received signal until the received signals of all frequency bands constituting the CA and EN-DC combination satisfy an SINR reference value. The SINR reference value may be set equally for each frequency band or may be set differently.

[0148] Referring to FIG. 11, according to one embodiment, the electronic device (101) can transmit a transmission signal from a first PCB (e.g., RFIC (410)) to a second PCB (e.g., RFFE (522)) via a first RF transmission line (e.g., at least one RF transmission line among the first transmission line (531) to the fourth transmission line (534) as exemplarily illustrated in FIG. 5). The electronic device (101) may control, while transmitting the transmission signal, to transmit a plurality of reception signals (Rx signals) received through at least one antenna (e.g., the second antenna (542)) from the second PCB (e.g., the RFFE (522) of the second PCB) to the first PCB (e.g., the RFIC (410) of the first PCB) through at least one RF transmission line among a plurality of RF transmission lines (e.g., the fifth transmission line (535) to the eighth transmission line (538) as exemplarily illustrated in FIG. 5). For example, as illustrated in FIG. 11, a reception signal of a B1 frequency band received through at least one antenna (e.g., the second antenna (542)) may be transmitted from the RFFE (522) to the RFIC (410) through the fifth transmission line (535) of the FPCB (530). A reception signal of a B3 frequency band received through at least one antenna (e.g., the second antenna (542)) can be transmitted from the RFFE (522) to the RFIC (410) through the sixth transmission line (536) of the FPCB (530). A reception signal of a B7 frequency band received through at least one antenna (e.g., the second antenna (542)) can be transmitted from the RFFE (522) to the RFIC (410) through the seventh transmission line (537) of the FPCB (530).

[0149] According to various embodiments, the electronic device (101) may check information related to the quality of each received signal while transmitting the transmission signal. For example, the information related to the quality of the received signal may include at least one of a reference signal received power (RSRP), a received signal strength indicator (RSSI), a reference signal received quality (RSRQ), a signal to interference plus noise ratio (SINR), and / or a signal to noise ratio (SNR).

[0150] According to various embodiments, the electronic device (101) may check whether information related to the quality of the received signal (e.g., SINR) satisfies the first condition. According to one embodiment, the electronic device (101) may store SINR reference values ​​for each MCS (modulation and coding scheme) of frequency bands constituting CA and EN-DC in the form of a table in a memory (e.g., a memory (130) as exemplarily illustrated in FIG. 1) as shown in below.

[0151] MCS standard SINR (dB) 273326312529242723212221212120191919181917191617151714171317121711151015915815715615515

[0152] In the above , the SINR reference value for each MCS may be set in consideration of the BLER (block error rate) or data throughput depending on the model of each electronic device (101). As described above, various embodiments may be replaced with other values ​​(e.g., RSRP, RSSI, RSRQ, or SNR) indicating the strength and / or quality of the signal in addition to the SINR.

[0153] According to one embodiment, as illustrated in FIG. 11, the B3 frequency band transmitted through the sixth transmission line (536) may have an MCS set to 22 and an SINR of a received signal may be confirmed to be 18 dB. Referring to Table 1 above, when the MCS is 22, the reference value of the SINR may be set to 21 dB. The electronic device (101) may determine that the SINR of the received signal corresponding to the B3 frequency band is less than the reference value of the SINR as it is confirmed to be 18 dB. The electronic device (101) may determine that the first condition (e.g., a fail condition) is satisfied as it confirms that the confirmed SINR is less than the set reference value. Based on the confirmation that the first condition is satisfied, the electronic device (101) may change the signal path of the received signal corresponding to the B3 frequency band to another signal path. For example, the signal path of the reception signal corresponding to the B3 frequency band can be changed from the sixth transmission line (536) to the fifth transmission line (535). The signal path of the reception signal corresponding to the B1 frequency band transmitted through the fifth transmission line (535) can be changed from the fifth transmission line (535) to the sixth transmission line (536). As a result of changing the signal path of the reception signal corresponding to the B3 frequency band, the SINR can be confirmed as 23 dB. The electronic device (101) can confirm that the SINR of the reception signal corresponding to the B3 frequency band is higher than the reference value of the SINR as it is confirmed as 23 dB. The electronic device (101) can confirm that the second condition (e.g., pass condition) is satisfied as it confirms that the confirmed SINR is higher than the set reference value. The electronic device (101) can maintain the signal path of the reception signal corresponding to the B3 frequency band as the currently changed signal path (e.g., the fifth transmission line (535)) based on confirmation that the second condition is satisfied.

[0154] FIG. 12 illustrates a block diagram of an electronic device (e.g., electronic device (101)) according to various embodiments.

[0155] Referring to FIG. 12, according to one embodiment, the electronic device (101) can transmit a transmission signal from a first PCB (e.g., RFIC (410)) to a second PCB (e.g., RFFE (522)) via a first RF transmission line (e.g., at least one RF transmission line among the first transmission line (531) to the fourth transmission line (534) as exemplarily illustrated in FIG. 5). The electronic device (101) may control, while transmitting the transmission signal, to transmit a plurality of reception signals (Rx signals) received through at least one antenna (e.g., the second antenna (542)) from the second PCB (e.g., the RFFE (522)) to the first PCB (e.g., the RFIC (410)) through at least one RF transmission line among a plurality of RF transmission lines (e.g., the fifth transmission line (535) to the eighth transmission line (538) as exemplarily illustrated in FIG. 5). For example, as illustrated in FIG. 12, a reception signal of a B1 frequency band received through at least one antenna (e.g., the second antenna (542)) may be transmitted from the RFFE (522) to the RFIC (410) through the fifth transmission line (535) of the FPCB (530). A reception signal of a B3 frequency band received through at least one antenna (e.g., the second antenna (542)) may be transmitted from the RFFE (522) to the RFIC (410) through the sixth transmission line (536) of the FPCB (530). A reception signal of a B7 frequency band received through at least one antenna (e.g., the second antenna (542)) may be transmitted from the RFFE (522) to the RFIC (410) through the seventh transmission line (537) of the FPCB (530). As exemplarily illustrated in FIG. 12, before changing the transmission line, the eighth transmission line (538) may not be used for receiving the reception signal.

[0156] According to various embodiments, the electronic device (101) may check information related to the quality of each received signal while transmitting the transmission signal. According to various embodiments, the electronic device (101) may check whether information (e.g., SINR) related to the quality (e.g., quality considering signal strength) of the received signal satisfies a first condition. According to one embodiment, as illustrated in FIG. 12, the B3 frequency band transmitted through the sixth transmission line (536) may have an MCS set to 22 and may have an SINR of a received signal confirmed to be 18 dB. Referring to the aforementioned , when the MCS is 22, the reference value of the SINR may be set to 21 dB. The electronic device (101) may check that the SINR of the received signal corresponding to the B3 frequency band is less than the reference value of the SINR as it is confirmed to be 18 dB. The electronic device (101) can determine that the first condition (e.g., fail condition) is satisfied by confirming that the confirmed SINR is less than the set reference value. Based on confirming that the first condition is satisfied, the electronic device (101) can change the signal path of the reception signal corresponding to the B3 frequency band to another signal path that is not currently in use. For example, the signal path of the reception signal corresponding to the B3 frequency band can be changed from the sixth transmission line (536) to the eighth transmission line (538). As a result of changing the signal path of the reception signal corresponding to the B3 frequency band, the SINR can be confirmed to be 23 dB. The electronic device (101) can determine that the SINR of the reception signal corresponding to the B3 frequency band is equal to or greater than the reference value of the SINR by confirming that the SINR is 23 dB. The electronic device (101) can determine that the second condition (e.g., pass condition) is satisfied by confirming that the confirmed SINR is greater than or equal to the set reference value.The electronic device (101) can maintain the signal path of the reception signal corresponding to the B3 frequency band as the currently changed signal path (e.g., the 8th transmission line (538)) based on confirmation that the second condition is satisfied.

[0157] Referring to FIGS. 11 and 12 , the electronic device (101) can identify a combination of signal paths that cause reception signals in all frequency bands to satisfy a reference SINR by swapping or exchanging signal paths of reception signals that satisfy a first condition (e.g., a fail condition) among reception signals corresponding to each CC constituting the CA and EN-DC with signal paths of other reception signals. According to one embodiment, if there is an unused signal path in the CA, the electronic device (101) can maintain the signal path for the reception signal in the frequency band that does not satisfy the first condition as it is, and (for example, as an example where the change in signal path only includes a change from the sixth transmission line (536) to the unused eighth transmission line (538)) change the signal path for the reception signal in the frequency band that satisfies the first condition to the unused signal path, as illustrated in FIG. 12 .

[0158] Referring to FIG. 11, the reception signal of the B1 frequency band, which is a frequency band exchanged with the signal path of the B3 frequency band, may correspond to a signal having the highest SINR among the signals currently being received. According to one embodiment, after the signal path of the reception signal corresponding to the B1 frequency band is switched to the sixth transmission line (536) as illustrated in FIG. 11, the electronic device (101) may check whether the SINR of the reception signal corresponding to the B1 frequency band satisfies a first condition. If the SINR of the reception signal corresponding to the B1 frequency band does not satisfy the first condition (e.g., is equal to or greater than a first threshold value), the electronic device (101) may control to maintain the switched signal path (e.g., the sixth transmission line (536)). If the signal path of the reception signal corresponding to the B1 frequency band is switched to the sixth transmission line (536) and satisfies the first condition (e.g., if it is less than the first threshold value), the electronic device (101) may change the signal path of the reception signal corresponding to the B1 frequency band to another signal path. According to one embodiment, if the reception signal corresponding to the B3 frequency band still satisfies the first condition even after the signal path is changed, the signal path of the reception signal corresponding to the B3 frequency band may be exchanged with a reception signal of another signal path (e.g., the seventh transmission line (537) or the eighth transmission line (538)) so that the SINR of all reception signals satisfies the reference value. According to one embodiment, if there is an unused signal path (e.g., the eighth transmission line (538)) during CA as exemplarily illustrated in FIG. 12, the signal path of the reception signal of the frequency band satisfying the first condition may be preferentially changed to the unused signal path while leaving the other signal paths as they are. In one embodiment, if there is no combination that satisfies the SINR criterion for all received signals, the combination with the smallest difference between the SINR and the criterion value in all receive paths may be selected.In one embodiment, if there is no combination that satisfies the SINR criterion for all received signals, a combination based on the priority of the received signals may be selected.

[0159] According to one embodiment, when the signal path of the received signal corresponding to a CC that satisfies the first condition among each CC constituting the CA and EN-DC is confirmed, the electronic device (101) can change the frequency bands that combine the CA in a predetermined order and confirm a value that satisfies the SINR. Information on the combination of the predetermined signal paths can be generated in the form of a table in a memory (e.g., memory (130) as exemplarily illustrated in FIG. 1) and each signal path can be stored as a code. For example, when the B1 frequency band, the B3 frequency band, and the B7 frequency band constitute the CA, the PCC of LTE can be set as B1 = SCC1 = B3, and the SCC2 = B7. According to one embodiment, the B1 frequency band can be set as the fifth transmission line (535), the B3 frequency band can be set as the sixth transmission line (536), and the B7 frequency band can be set as the seventh transmission line (537). According to one embodiment, when the SINR of the received signal corresponding to the B3 frequency band is confirmed to be a value lower than or equal to a reference value, it is possible to sequentially change the combination of signal paths in a preset order and confirm whether the SINR of all received signals satisfies the second condition.

[0160] According to one embodiment, when the signal path of the received signal has four signal paths (e.g., the fifth transmission line (535), the sixth transmission line (536), the seventh transmission line (537), and the eighth transmission line (538)) as in the examples described above, 1CA may have 4 cases, 2CA may have 12 cases, 3CA may have 24 cases, and 4CA may have 24 cases, as shown in , , and below. In , , and below, MHB1 may correspond to the fifth transmission line (535), MHB2 may correspond to the sixth transmission line (536), MHB3 may correspond to the seventh transmission line (537), and MHB4 may correspond to the eighth transmission line (538).

[0161] Rx Path CodeCC#11MHB12MHB23MHB34MHB4

[0162] Rx Path CodeCC#1CC#21MHB1MHB22MHB1MHB33MHB1MHB44MHB2MHB15MHB2MHB36MHB2MHB47MHB3MHB18MHB3MHB29MHB3MHB410MHB4MHB111MHB4MHB212MHB4MHB3

[0163] RxPath CodeCC#1CC#2CC#31MHB1MHB2MHB32MHB1MHB2MHB43MHB1MHB3MHB24MHB1MHB3MHB45MHB1MHB4MHB26MHB 1MHB4MHB37MHB2MHB1MHB38MHB2MHB1MHB49MHB2MHB3MHB110MHB2MHB3MHB411MHB2MHB4MHB112MHB2MHB4 MHB313MHB3MHB1MHB214MHB3MHB1MHB415MHB3MHB2MHB116MHB3MHB2MHB417MHB3MHB4MHB118MHB3MHB4MH B219MHB4MHB1MHB220MHB4MHB1MHB321MHB4MHB2MHB122MHB4MHB2MHB323MHB4MHB3MHB124MHB4MHB3MHB2

[0164] FIG. 13 illustrates a flowchart for explaining an operation method of an electronic device (e.g., electronic device (101)) according to various embodiments.

[0165] Referring to FIG. 13, according to various embodiments, the electronic device (101) may include an FPCB (530) electrically connected between the RFIC (410) and the RFFE (522). The FPCB (530) may include RF transmission lines corresponding to four receiving paths (e.g., the fifth transmission line (535) to the eighth transmission line (538)). However, the electronic device (101) may include other suitable configurations to implement the functions and / or operations disclosed herein.

[0166] According to one embodiment, the electronic device (101) may, in operation 1302, determine the number of frequency bands using a receiving path (e.g., an MHB port) corresponding to the MHB in the RFIC (410). For example, the number (N) of frequency bands using a receiving path corresponding to the MHB may be 1 to 4, but is not limited to the above number.

[0167] According to one embodiment, the electronic device (101) may, in operation 1304, determine whether at least one reception signal for each frequency band used satisfies a set condition (e.g., a first condition). For example, the electronic device (101) may, in operation 1304, determine whether the SINR of the reception signal for each frequency band used is less than a reference SINR for each MCS (as exemplarily shown in ).

[0168] According to one embodiment, if the reception signal for each frequency band does not satisfy the set condition (e.g., the first condition) (operation 1304-No), the electronic device (101) may control to maintain the current signal path (e.g., MHB port) of the frequency band constituting each CC in operation 1308, since all the reception signals for each frequency band are in good condition.

[0169] According to one embodiment, when the reception signal for each frequency band satisfies a set condition (e.g., a first condition) (operation 1304-Yes), in operation 1306, the electronic device (101) may sequentially change the signal path of the reception signal for each frequency band according to a combination of , , or described above, depending on the number of N, until the set condition is not satisfied.

[0170] FIG. 14 illustrates a flowchart for explaining an operation method of an electronic device (e.g., electronic device (101)) according to various embodiments.

[0171] Referring to FIG. 14, according to various embodiments, the electronic device (101) may include an FPCB (530) electrically connected between the RFIC (410) and the RFFE (522). The FPCB (530) may include RF transmission lines corresponding to four receiving paths (e.g., the fifth transmission line (535) to the eighth transmission line (538)). However, the electronic device (101) may include other suitable configurations to implement the functions and / or operations disclosed herein.

[0172] According to one embodiment, the electronic device (101), in operation 1402, uses a frequency band corresponding to the MHB in the RFIC (410) (e.g., an MHB port) and an unused frequency band.

[0173] According to one embodiment, the electronic device (101) may, in operation 1404, check whether at least one frequency band-specific reception signal currently in use satisfies a set condition (e.g., a first condition). For example, the electronic device (101) may, in operation 1404, check whether the SINR of the at least one frequency band-specific reception signal in use is less than a reference SINR per MCS (e.g., as exemplarily shown in Table 1).

[0174] According to one embodiment, if the at least one frequency band-specific reception signal does not satisfy the set condition (e.g., the first condition) (operation 1404-No), and since all frequency band-specific reception signals are in good condition, the electronic device (101) may control to maintain the current signal path (e.g., MHB port) of the frequency band constituting each CC in operation 1412.

[0175] According to one embodiment, if at least one of the reception signals for each of the frequency bands satisfies a set condition (e.g., a first condition) (operation 1404-Yes), the electronic device (101) may change the reception path of the reception signal corresponding to the problematic frequency band to a path of an MHB port that does not use the reception path (operation 1406).

[0176] According to one embodiment, the electronic device (101) can change the reception path of the reception signal corresponding to the problematic frequency band and then check whether the reception signal of the problematic frequency band satisfies the set condition in operation 1408.

[0177] According to one embodiment, if the reception signal of the problematic frequency band continues to satisfy the set condition (e.g., the first condition) despite the path change (operation 1408 - Yes), the electronic device (101) may sequentially change the reception paths in the set order in operation 1410. For example, the electronic device (101) may sequentially change the reception paths in the set order in operation 1410 and identify the reception paths in which the reception signal of the problematic frequency band does not satisfy the set condition.

[0178] According to one embodiment, if the electronic device (101) does not satisfy a condition (e.g., a first condition) set according to a change in the received signal of the problematic frequency band (operation 1408-No), in operation 1412, the electronic device may control to maintain the current signal path (e.g., MHB port) of the frequency band constituting each CC.

[0179] FIG. 15 illustrates a block diagram of an electronic device (e.g., electronic device (101)) according to various embodiments.

[0180] Referring to FIG. 15, an electronic device (e.g., electronic device (101)) may include a shunt capacitor (1510) in at least one RF transmission line (e.g., the eighth transmission line (538)) among a plurality of RF transmission lines. For example, as illustrated in RFIC (410), the shunt capacitor (1510) may be connected in parallel with the eighth transmission line (538) at an RF input portion into which the eighth transmission line (538) is input. For example, one end of the shunt capacitor (1510) may be connected to a point of the eighth transmission line (538), and the other end may be connected to ground. The value of the above shunt capacitor (1510) may be set to a value (e.g., 2.2 pF, 2.7 pF, or 3.3 pF) that can minimize desense depending on the combination of received signals for each frequency band. According to one embodiment, when a received signal transmitted through a specific RF transmission line among the four RF transmission lines (e.g., the fifth RF transmission line (535) to the eighth RF transmission line (538)) satisfies the first condition, the signal path of the received signal may be changed to an RF transmission line (e.g., the eighth transmission line (538)) to which the shunt capacitor (1510) is added.

[0181] According to one embodiment, when a shunt capacitor (1510) is added between the RFIC (410) and the RFFE (522), the desense caused by the transmission signal (e.g., the N78 transmission signal) can be reduced. According to one embodiment, the shunt capacitor (1510) can be disposed adjacent to the RFIC (410) (e.g., between the FPCB (530) and the RFIC (410)) to increase the desense reduction effect, for example. According to one embodiment, when the power of the transmission signal is equal to or greater than a set value and at least one reception signal satisfies a first condition, the signal path of the reception signal satisfying the first condition can be changed to a signal path in which the shunt capacitor (1510) is disposed. According to one embodiment, when the power of the transmission signal is less than a set value, if the signal path of the reception signal is changed to a signal path in which the shunt capacitor (1510) is arranged, a problem may occur in which the desense is strong but the absolute sensitivity is reduced. The electronic device (101) may use a signal path (e.g., the eighth transmission line (538)) in which the shunt capacitor (1510) is arranged as the signal path of the reception signal that satisfies the first condition when the power of the transmission signal is greater than or equal to a set value and at least one reception signal satisfies the first condition.

[0182] FIG. 16 illustrates a flowchart for explaining an operation method of an electronic device (e.g., electronic device (101)) according to various embodiments.

[0183] Referring to FIG. 16, according to various embodiments, the electronic device (101) may include an FPCB (530) electrically connected between the RFIC (410) and the RFFE (522). The FPCB (530) may include RF transmission lines corresponding to four receiving paths (e.g., the fifth transmission line (535) to the eighth transmission line (538)). However, the electronic device (101) may include other suitable configurations to implement the functions and / or operations disclosed herein.

[0184] According to one embodiment, the electronic device (101) may, in operation 1602, determine the number of frequency bands using a receiving path corresponding to the MHB in the RFIC (410). For example, the number (N) of frequency bands using a receiving path corresponding to the MHB may be 1 to 4, but is not limited to the above number.

[0185] According to one embodiment, the electronic device (101) may, in operation 1604, check whether the reception signal for each frequency band used satisfies a set condition (e.g., a first condition). For example, the electronic device (101) may, in operation 1604, check whether the SINR of the reception signal for each frequency band used is less than a reference SINR for each MCS (e.g., as exemplarily shown in ).

[0186] According to one embodiment, if the reception signal for each frequency band does not satisfy the set condition (e.g., the first condition) (operation 1604-No), the electronic device (101) may control to maintain the current signal path (e.g., MHB port) of the frequency band constituting each CC in operation 1612, since all the reception signals for each frequency band are in good condition.

[0187] According to one embodiment, if the reception signal for each frequency band satisfies the set condition (e.g., the first condition) (operation 1604 - Yes), in operation 1606, the electronic device (101) can check whether two or more signal paths among the N reception signals for each frequency band used satisfy the set condition. As a result of the check, if two or more signal paths satisfy the set condition (operation 1606 - Yes), in operation 1608, the signal paths of the reception signals for each frequency band can be sequentially changed according to the set order until two or more signal paths do not satisfy the set condition. As a result of the above verification, if two or more signal paths do not satisfy the set condition (Operation 1606-No), for example, if there is only one problematic frequency band, the electronic device (101) may, in operation 1610, change the signal path of the received signal corresponding to the problematic frequency band to a signal path to which a shunt capacitor is applied (e.g., the eighth transmission line (538)). In operation 1612, the electronic device (101) may control to maintain the current signal path (e.g., MHB port) of the frequency band constituting each CC.

[0188] FIGS. 17A and 17B illustrate block diagrams of an electronic device (e.g., electronic device (101)) according to various embodiments.

[0189] Referring to FIGS. 17A and 17B , the electronic device (101) may add a ground switch (1710) to at least one RF transmission line (e.g., the eighth transmission line (538)) among a plurality of RF transmission lines. According to one embodiment, the electronic device (101) may control the ground switch (1710) to the off state of FIG. 17A when using the RF transmission line (e.g., the eighth transmission line (538)) to which the ground switch (1710) is added in the current CA combination. According to one embodiment, when the electronic device (101) does not use the RF transmission line (e.g., the eighth transmission line (528)) to which the ground switch (1710) is added in the current CA combination, the eighth transmission line (528) may be short-circuited with GND by changing the ground switch (1710) from the off state of FIG. 17A to the on state of FIG. 17B. As the eighth transmission line (528) is short-circuited with GND, desense may be improved. For example, when the electronic device (101) transmits a receive signal through the seventh transmission line (537) adjacent to the eighth transmission line (538), and transmits a transmit signal through at least one of the third transmission line (533) or the fourth transmission line (534), the electronic device (101) may control the ground switch (1710) to the on state, thereby improving, for example, the occurrence of desense in the seventh transmission line (537). In one embodiment, the ground switch (1710) may be positioned adjacent to the RFFE (522) (e.g., between the FPCB (530) and the RFFE (522)) to, for example, enhance the desense reduction effect.

[0190] FIG. 18 illustrates a block diagram of an electronic device (e.g., electronic device (101)) according to various embodiments.

[0191] Referring to FIG. 18, the RFFE (522) (e.g., an RFFE circuit of an electronic device) may include a plurality of first switches (1811, 1812, 1813, 1814), a plurality of LNAs (1821, 1822, 1823, 1824), a plurality of second switches (1831, 1832, 1833, 1834), a third switch (1841), and a plurality of fourth switches (1851, 1852, 1853).

[0192] According to one embodiment, each of the plurality of first switches (1811, 1812, 1813, 1814) may be connected to each of the plurality of LNAs (1821, 1822, 1823, 1824). For example, a reception signal of a frequency band selected from each of the plurality of first switches (1811, 1812, 1813, 1814) may be input to the corresponding connected LNAs (1821, 1822, 1823, 1824) and subjected to low-noise amplification processing. The low-noise amplified reception signal from each of the above LNAs (1821, 1822, 1823, 1824) can be transmitted to at least one of the plurality of second switches (1831, 1832, 1833, 1834) and the plurality of fourth switches (1851, 1852, 1853) under the control of the third switch (1841).

[0193] According to one embodiment, the plurality of fourth switches (1851, 1852, 1853) may be connected to at least one RF transmission line among the plurality of RF transmission lines (e.g., the fifth transmission line (535) to the eighth transmission line (538)) included in the FPCB (530). According to one embodiment, when a reception signal is not transmitted through a corresponding RF transmission line among the plurality of fourth switches (1851, 1852, 1853), the fourth switch may be switched to be connected to ground (GND). For example, when at least one fourth switch among the plurality of fourth switches (1851, 1852, 1853) is connected to ground (GND), the same effect as when the ground switch (1710) illustrated in FIG. 17B is controlled to an on state may be achieved.

[0194] According to one embodiment, the electronic device (101) may store the setting order of the aforementioned reception paths in the form of a lookup table. The electronic device (101) may update the lookup table through an artificial intelligence model based on a machine learning or deep learning model. The input variables of the machine learning may include at least one of a transmission / reception frequency, a transmission / reception frequency band, transmission power, reception power, a selected transmission / reception path, or a reception sensitivity index (SIR, SINR, BLER, BER). According to one embodiment, the location of the electronic device (101) may also be used for learning the machine learning. The electronic device (101) may also consider the location when switching the RF transmission line. The output value of the machine learning may correspond to the selected transmission path and / or reception path. The machine learning model of the present disclosure may include various transformer models. The operation of the machine learning model of the present disclosure may include a learning and inference process that finds patterns in data, stores them as models that are generalized rules, and inputs new data into the learned model to obtain results. The learning of the machine learning model performed through the electronic device (101) may correspond to initial learning or re-learning. The learning process of the machine learning model may include forward propagation and / or backward propagation. Algorithms such as “regression,” “decision tree,” “neural network,” or “k-nearest neighbor” may be used for learning. According to various embodiments, multiple different machine learning models may be used for each target task.

[0195] The artificial intelligence model of the present disclosure may be located in the memory of the electronic device (101) or at least some elements may be located in another electronic device (102 or 104) or server (108).

[0196] The above artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively, a hardware structure, the artificial intelligence model may include a software structure.

[0197] In one embodiment, the electronic device (101) may change the order of indexes stored in the lookup table through learning using the aforementioned artificial intelligence model. For example, the electronic device (101) may arrange recently used indexes relatively closer to the front, or update the lookup table based on the improvement rate (performance enhancement) according to the combination.

[0198] According to various embodiments, an electronic device (e.g., an electronic device (101) of FIG. 5) may include a first printed circuit board (PCB) (e.g., a first PCB (510) of FIG. 5) including a radio frequency integrated circuit (RFIC) (e.g., an RFIC (410) of FIG. 5) as exemplarily illustrated). The electronic device may include a second PCB (e.g., a second PCB (520) of FIG. 5) including a radio frequency front end (RFFE) circuit connected to at least one antenna. The electronic device may include a plurality of transmission lines (e.g., RF transmission lines 531, 532, 533, 534, 535, 536, 537, 538 as exemplarily illustrated in FIG. 5 ) including a first radio frequency (RF) transmission line, a second RF transmission line, and a third RF transmission line, and may include at least one flexible printed circuit board (FPCB) (e.g., FPCB 530 as exemplarily illustrated in FIG. 5 ) connected between the first PCB and the second PCB. The electronic device may include a memory (e.g., a memory 130 as exemplarily illustrated in FIG. 1 ) that stores instructions. The electronic device may include at least one processor. The above instructions, when individually or collectively executed by the at least one processor, may cause the electronic device to transmit transmit signals (Tx signals) to the second PCB via the first RF transmission line.The instructions, when individually or collectively executed by the at least one processor, may cause the electronic device to control transmission of a first Rx signal (Rx signals) received via the at least one antenna to the first PCB via the second RF transmission line. The instructions, when individually or collectively executed by the at least one processor, may cause the electronic device to determine, while transmitting the Tx signal via the first RF transmission line, information related to a quality of the first Rx signal transmitted via the second RF transmission line. The instructions, when individually or collectively executed by the at least one processor, may cause the electronic device to control changing a signal path of the first Rx signal from the second RF transmission line to the third RF transmission line based on whether the information related to the quality of the first Rx signal satisfies a first condition.

[0199] According to one embodiment, the instructions, when individually or collectively executed by the at least one processor, may cause the electronic device to control transmission of the first received signal over the second RF transmission line based on the information related to the quality of the first received signal satisfying a second condition.

[0200] In one embodiment, the second condition may correspond to a pass condition, and the first condition may correspond to a fail condition.

[0201] According to one embodiment, the RFFE circuit (e.g., additionally) includes a switch, and the instructions, when individually or collectively executed by the at least one processor, cause the electronic device to control the switch to change the signal path of the first received signal.

[0202] According to one embodiment, the first frequency band corresponding to the transmitted signal may be higher than the second frequency band corresponding to the first received signal.

[0203] According to one embodiment, the instructions, when individually or collectively executed by the at least one processor, may cause the electronic device to control the transmission of a second receive signal corresponding to a third frequency band, the second receive signal corresponding to the third frequency band constituting carrier aggregation together with the first receive signal corresponding to the second frequency band, to the first PCB via the third RF transmission line, and to exchange a signal path of the first receive signal and a signal path of the second receive signal based on information related to a quality of the first receive signal satisfying the first condition.

[0204] According to one embodiment, the instructions, when individually or collectively executed by the at least one processor, may cause the electronic device to control the electronic device to identify a fourth RF transmission line that is not currently in use among the plurality of transmission lines, and to change a signal path of the first reception signal from the second RF transmission line to the fourth RF transmission line, based on information related to the quality of the first reception signal satisfying the first condition.

[0205] According to one embodiment, the instructions, when individually or collectively executed by the at least one processor, may cause the electronic device to control the transmission of a plurality of received signals constituting a carrier aggregation to the first PCB, respectively, through the plurality of transmission lines, and to sequentially change a combination between the plurality of transmission lines and the plurality of received signals based on information related to the quality of at least one of the plurality of received signals satisfying the first condition.

[0206] According to one embodiment, the instructions, when individually or collectively executed by the at least one processor, may cause the electronic device to control the combination between the plurality of transmission lines and the plurality of received signals based on information related to the quality of a received signal of the plurality of received signals satisfying the second condition.

[0207] According to one embodiment, the information related to the quality of the first received signal may include at least one of a reference signal received power (RSRP), a received signal strength indicator (RSSI), a reference signal received quality (RSRQ), a signal to interference plus noise ratio (SINR), or a signal to noise ratio (SNR).

[0208] According to one embodiment, the instructions, when individually or collectively executed by the at least one processor, may cause the electronic device to control the combination between the plurality of RF transmission lines and the plurality of received signals based on information related to the quality of a received signal of the plurality of received signals satisfying the second condition.

[0209] According to one embodiment, the transmit signal may correspond to a control signal, and the receive signal may correspond to a data signal.

[0210] According to one embodiment, the control signal corresponds to one of a plurality of control signals transmitted to determine a state of an uplink channel, and a first power value of the control signal can be upwardly adjusted in consideration of a second power value of another control signal among the plurality of control signals.

[0211] According to various embodiments, an operating method of an electronic device, including a first printed circuit board (PCB) including a radio frequency integrated circuit (RFIC), a second PCB including a radio frequency front end (RFFE) circuit connected between the RFIC and at least one antenna, a plurality of transmission lines including a first radio frequency (RF) transmission line, a second RF transmission line, and a third RF transmission line, at least one flexible printed circuit board (FPCB) connected between the first PCB and the second PCB, and at least one processor, may include an operation of transmitting a transmit signal (Tx signal) to the second PCB through the first RF transmission line. The operating method of the electronic device may include an operation of controlling a first receive signal (Rx signal) received through the at least one antenna to be transmitted to the first PCB through the second RF transmission line. The method of operating the electronic device may include an operation of checking information related to the quality of the first reception signal transmitted through the second RF transmission line while transmitting the transmission signal through the first RF transmission line. The method of operating the electronic device may include an operation of controlling a signal path of the first reception signal to be changed from the second RF transmission line to the third RF transmission line based on whether the information related to the quality of the first reception signal satisfies a first condition.

[0212] According to one embodiment, the method may include an operation of controlling to maintain transmission of the first received signal through the second RF transmission line based on the information related to the quality of the first received signal satisfying a second condition.

[0213] In one embodiment, the second condition may correspond to a pass condition, and the first condition may correspond to a fail condition.

[0214] According to one embodiment, the RFFE circuit further comprises a switch, and the method may include an operation of controlling the signal path of the first received signal to be changed by the switch.

[0215] According to one embodiment, the RFFE circuit may include a plurality of switches, and the method may include an operation of controlling a signal path change of the first received signal by setting (e.g., switching) the plurality of switches. According to one embodiment, the RFFE circuit may be connected to a plurality of transmission lines via a plurality of switches, and the method may include an operation of controlling a signal path change of the first received signal by setting (e.g., switching) the plurality of switches.

[0216] According to one embodiment, the first frequency band corresponding to the transmitted signal may be higher than the second frequency band corresponding to the first received signal.

[0217] According to one embodiment, the method may include an operation of controlling transmission of a second reception signal corresponding to a third frequency band, which constitutes carrier aggregation together with the first reception signal corresponding to the second frequency band, to the first PCB through the third RF transmission line, and an operation of controlling exchange of a signal path of the first reception signal and a signal path of the second reception signal based on information related to the quality of the first reception signal satisfying the first condition.

[0218] According to one embodiment, the method may include an operation of identifying a fourth RF transmission line that is not currently in use among the plurality of transmission lines based on information related to the quality of the first reception signal satisfying the first condition, and a method of controlling a signal path of the first reception signal to be changed from the second RF transmission line to the fourth RF transmission line.

[0219] According to one embodiment, the method may include an operation of controlling a plurality of reception signals constituting a carrier aggregation to be transmitted to the first PCB through the plurality of transmission lines, respectively, and an operation of controlling a combination between the plurality of transmission lines and the plurality of reception signals to be sequentially changed based on information related to the quality of at least one reception signal among the plurality of reception signals satisfying the first condition.

[0220] According to one embodiment, the method may include an operation of controlling to maintain a combination between the plurality of transmission lines and the plurality of received signals based on information related to the quality of the received signals of the plurality of received signals satisfying the second condition.

[0221] According to one embodiment, the information related to the quality of the first received signal may include at least one of a reference signal received power (RSRP), a received signal strength indicator (RSSI), a reference signal received quality (RSRQ), a signal to interference plus noise ratio (SINR), or a signal to noise ratio (SNR).

[0222] According to one embodiment, the transmit signal may correspond to a control signal, and the receive signal may correspond to a data signal.

[0223] According to various embodiments, a storage medium storing at least one computer-readable instruction may cause the at least one instruction, when executed individually or collectively by a processor of an electronic device, to cause the electronic device to perform at least one operation. The at least one operation may include transmitting a transmit signal (Tx signal) to a second PCB via a first RF transmission line among a plurality of transmission lines disposed on a flexible printed circuit board (FPC) that interconnects a first printed circuit board (PCB) including a radio frequency integrated circuit (RFIC) and a second PCB including a radio frequency front end (RFFE) circuit connected between the RFIC and at least one antenna. The at least one operation may include controlling a first receive signal (Rx signal) received via the at least one antenna to be transmitted to the first PCB via a second RF transmission line among the plurality of transmission lines. The at least one operation may include an operation of checking information related to the quality of the first received signal transmitted through the second RF transmission line while transmitting the transmission signal through the first RF transmission line. The at least one operation may include an operation of controlling a signal path of the first received signal to be changed from the second RF transmission line to a third RF transmission line among the plurality of transmission lines based on whether the information related to the quality of the first received signal satisfies a first condition.

[0224] According to various embodiments, an electronic device may include a first printed circuit board (PCB) including a radio frequency integrated circuit (RFIC). The electronic device may include a second PCB including a radio frequency front end (RFFE) circuit connected to at least one antenna. The electronic device may include a plurality of transmission lines including a first radio frequency (RF) transmission line, a second RF transmission line, and a third RF transmission line, and at least one flexible printed circuit board (FPCB) connected between the first PCB and the second PCB. The electronic device may include a memory storing instructions. The electronic device may include at least one processor. The instructions, when individually or collectively executed by the at least one processor, may cause the electronic device to transmit transmit signals (Tx signals) to the second PCB via the first RF transmission line. The instructions, when individually or collectively executed by the at least one processor, may cause the electronic device to control transmission of first receive signals (Rx signals) received via the at least one antenna to the first PCB via the second RF transmission line. The instructions, when individually or collectively executed by the at least one processor, may cause the electronic device to determine, while transmitting the transmit signal via the first RF transmission line, a magnitude of the transmit signal transmitted via the first RF transmission line.The instructions, when individually or collectively executed by the at least one processor, may cause the electronic device to control a signal path of the first receive signal to be changed from the second RF transmission line to the third RF transmission line based on a magnitude of the transmit signal satisfying a first condition.

[0225] According to one embodiment, the instructions, when individually or collectively executed by the at least one processor, may cause the electronic device to control transmission of the first receive signal over the second RF transmission line based on the magnitude of the transmit signal satisfying a second condition.

[0226] In one embodiment, the second condition may correspond to a pass condition, and the first condition may correspond to a fail condition.

[0227] According to one embodiment, the RFFE circuit (e.g., additionally) includes a switch, and the instructions, when individually or collectively executed by the at least one processor, cause the electronic device to control the switch to change the signal path of the first received signal.

[0228] According to one embodiment, the instructions, when individually or collectively executed by the at least one processor, may cause the electronic device to control, while transmitting the first receive signal to the first PCB, to transmit a second receive signal forming a carrier aggregation with the first receive signal from the second PCB to the first PCB via the third RF transmission line, and to control, based on the information related to the magnitude of the transmit signal satisfying the specified condition, to change a signal path of the second receive signal from the third RF transmission line to the second RF transmission line.

[0229] According to one embodiment, the instructions, when individually or collectively executed by the at least one processor, may cause the electronic device to control the third RF transmission line among the plurality of transmission lines to be currently unused, and to change the signal path of the first reception signal from the second RF transmission line to the third RF transmission line, based on the information related to the magnitude of the transmission signal satisfying the specified condition.

[0230] According to one embodiment, the electronic device may (e.g., additionally) include a capacitor connected between the third RF transmission line and ground. According to one embodiment, the electronic device may (e.g., additionally) include a switch connected between the third RF transmission line and ground.

[0231] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0232] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0233] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0234] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0235] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0236] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, A first printed circuit board (PCB) including a radio frequency integrated circuit (RFIC); A second PCB including a radio frequency front end (RFFE) circuit connected to at least one antenna; At least one flexible printed circuit board (FPCB) including a plurality of RF transmission lines including a first RF (radio frequency) transmission line, a second RF transmission line, and a third RF transmission line, and connected between the first PCB and the second PCB; Memory that stores instructions; and Contains at least one processor, The above instructions, when individually or collectively executed by the at least one processor, cause the electronic device to: Transmitting transmission signals (Tx signals) to the second PCB through the first RF transmission line, Controlling to transmit the first reception signal (Rx signals) received through the at least one antenna to the first PCB through the second RF transmission line, While transmitting the transmission signal through the first RF transmission line, information related to the quality of the first reception signal transmitted through the second RF transmission line is checked, An electronic device that causes a signal path of the first reception signal to be changed from the second RF transmission line to the third RF transmission line based on information related to the quality of the first reception signal satisfying a first condition.

2. In the first paragraph, the instructions, when individually or collectively executed by the at least one processor, cause the electronic device to: An electronic device that causes control to maintain transmission of the first reception signal through the second RF transmission line based on the information related to the quality of the first reception signal satisfying the second condition.

3. An electronic device in the second paragraph, wherein the second condition corresponds to a pass condition, and the first condition corresponds to a fail condition.

4. In the first paragraph, the RFFE circuit further includes a switch, The above instructions cause the electronic device to: An electronic device that causes the signal path of the first reception signal to be changed by the switch.

5. An electronic device according to claim 1, wherein the first frequency band corresponding to the transmission signal is higher than the second frequency band corresponding to the first reception signal.

6. In any one of paragraphs 1 to 5, the instructions, when individually or collectively executed by the at least one processor, cause the electronic device to: Controlling to transmit a second reception signal corresponding to a third frequency band, which constitutes carrier aggregation together with the first reception signal corresponding to the second frequency band, to the first PCB through the third RF transmission line; An electronic device that causes a control to exchange a signal path of the first received signal and a signal path of the second received signal based on information related to the quality of the first received signal satisfying the first condition.

7. In any one of paragraphs 1 to 5, the instructions, when individually or collectively executed by the at least one processor, cause the electronic device to: Based on the information related to the quality of the first reception signal satisfying the first condition, the third RF transmission line that is not currently in use among the plurality of RF transmission lines is identified, An electronic device that causes a signal path of the first reception signal to be controlled to be changed from the second RF transmission line to the third RF transmission line.

8. In any one of paragraphs 1 to 5, the instructions, when individually or collectively executed by the at least one processor, cause the electronic device to: Controlling to transmit a plurality of reception signals including the first reception signal constituting the carrier aggregation to the first PCB through the plurality of RF transmission lines, An electronic device that causes a control to sequentially change a combination between the plurality of RF transmission lines and the plurality of received signals based on information related to the quality of at least one of the plurality of received signals satisfying the first condition.

9. In the 8th paragraph, the instructions, when individually or collectively executed by the at least one processor, cause the electronic device to: An electronic device that causes control to maintain a combination between the plurality of RF transmission lines and the plurality of received signals based on information related to the quality of the received signals of the plurality of received signals satisfying the second condition.

10. In any one of paragraphs 1 to 9, An electronic device wherein the above-mentioned transmission signal corresponds to a control signal and the above-mentioned reception signal corresponds to a data signal.

11. An electronic device according to claim 10, wherein the control signal corresponds to one of a plurality of control signals transmitted to check the status of an uplink channel, and a first power value of the control signal is upwardly adjusted in consideration of a second power value of another control signal among the plurality of control signals.

12. A method of operating an electronic device, comprising: a first printed circuit board (PCB) including a radio frequency integrated circuit (RFIC); a second PCB including a radio frequency front end (RFFE) circuit connected between the RFIC and at least one antenna; a plurality of transmission lines including a first RF transmission line, a second RF transmission line, and a third RF transmission line; and at least one flexible printed circuit board (FPCB) connected between the first PCB and the second PCB; and at least one processor. An operation of transmitting a transmission signal (Tx signals) to the second PCB through the first RF transmission line; An operation of controlling a first reception signal (Rx signals) received through at least one antenna to be transmitted to the first PCB through the second RF transmission line; An operation of checking information related to the quality of the first reception signal transmitted through the second RF transmission line while transmitting the transmission signal through the first RF transmission line; and An operating method of an electronic device, comprising an operation of controlling a signal path of the first reception signal to be changed from the second RF transmission line to the third RF transmission line based on information related to the quality of the first reception signal satisfying a first condition.

13. In the 12th paragraph, the method, An operating method of an electronic device, comprising an operation of controlling transmission of the first reception signal through the second RF transmission line based on the information related to the quality of the first reception signal satisfying a second condition.

14. A method of operating an electronic device in the 13th paragraph, wherein the second condition corresponds to a pass condition, and the first condition corresponds to a fail condition.

15. In a non-transitory storage medium storing at least one computer-readable instruction, said at least one instruction, when executed individually or collectively by at least one processor of an electronic device, causes said electronic device to perform at least one operation; At least one of the above actions: An operation of transmitting a transmission signal (Tx signal) to a second PCB through a first RF transmission line among a plurality of transmission lines arranged on a flexible printed circuit board (Flexible PCB) that connects a first printed circuit board (PCB) including a radio frequency integrated circuit (RFIC) and a second PCB including a radio frequency front end (RFFE) circuit connected between the RFIC and at least one antenna; An operation of controlling a first reception signal (Rx signals) received through at least one antenna to be transmitted to the first PCB through a second RF transmission line among the plurality of transmission lines; An operation of checking information related to the quality of the first reception signal transmitted through the second RF transmission line while transmitting the transmission signal through the first RF transmission line; and A storage medium including an operation for controlling a signal path of the first reception signal to be changed from the second RF transmission line to a third RF transmission line among the plurality of transmission lines based on information related to the quality of the first reception signal satisfying a first condition.

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