A method for metallization through-glass VIAS and a glass article manufacutured thereof

The method addresses the challenges of hermeticity and reliability in metallizing through-glass vias by electroplating copper with controlled electrolytes and adhesion layers, achieving seamless and reliable metallization for high aspect ratios.

WO2025250361A1PCT designated stage Publication Date: 2025-12-04CORNING INC
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Patent Information

Application Number
PCT/US2025/029320
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-05-29
Filing Date
2025-05-14
Publication Date
2025-12-04

AI Technical Summary

Technical Problem

Conventional methods for metallizing through-glass vias face challenges in achieving hermeticity and thermomechanical reliability, particularly for small diameters and high aspect ratios, with dry processes being costly and wet processes resulting in voids or seams.

Method used

A method involving cleaning the glass substrate, depositing an adhesion layer, and using electrolytes with controlled current application to electroplate copper into the vias, followed by a laminated dry film resist to prevent lateral growth, ensuring complete and void-free metallization.

Benefits of technology

Enables seam and void-free metallization of through-glass vias with high aspect ratios, maintaining hermeticity and thermomechanical reliability, suitable for high-temperature processing.

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Abstract

A method for metallizing through-glass vias in a glass substrate includes: a) cleaning a glass substrate comprising a plurality of vias extending through the glass substrate, b) depositing an adhesion layer onto a surface of the glass substrate and onto a sidewall of the vias at a via entrance of the surface, c) contacting the glass substrate with a first fluid electrolyte comprising copper ions, and applying a first current to the glass substrate to reduce copper ions from the fluid electrolyte into copper, plugging the vias on the surface, and d) contacting the glass substrate with a second fluid electrolyte comprising copper ions and applying a second current to the glass substrate, and wherein the concentration of copper ions in the second fluid electrolyte is such that when reduced, copper therefrom fills the vias.
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Citation Information

Patent Citations

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    US20130062210A1

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    US20190362987A1

  • Copper metallization for through-glass vias on thin glass

    US20210360797A1

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    US20230107096A1

  • Through-via substrate, mounting substrate, and method for manufacturing through-via substrate

    US20240429149A1