Laser processing method and apparatus, and medium, laser processing system and laser processing device

Abstract

A laser processing method, comprising: acquiring point cloud data of a surface of a region to be processed of an object to be processed, wherein said region of said object is centrosymmetric; performing data fitting on the point cloud data, so as to obtain a mapping relationship between a cross-sectional radius and a cross-sectional center point of said region on the basis of a fitting result; on the basis of the mapping relationship between the cross-sectional radius and the cross-sectional center point of said region, mapping a pre-processing point in preset processing path data to a three-dimensional space where said region is located, so as to obtain a processing path point corresponding to the pre-processing point; and on the basis of the processing path point, generating a processing path corresponding to said region of said object. In the method, the corresponding processing path is generated on the basis of a change in the cross-sectional radius of said region, so that laser processing of said region having a shape change can be efficiently and quickly realized. The present application further relates to a laser processing apparatus, a computer-readable medium, a laser processing system, and a laser processing device.

Description

Laser processing method, device, medium, laser processing system and laser processing equipment

[0001] Cross-reference to related applications

[0002] This application claims priority to Chinese Patent Publication No. 202410731486.X, entitled "Laser processing method, device, computer readable medium and laser processing equipment", filed on June 6, 2024, the entire contents of which are incorporated herein by reference in their entirety. TECHNICAL FIELD

[0003] The present application relates to the field of laser processing technology, and specifically relates to a laser processing method, device, medium, laser processing system and laser processing equipment. BACKGROUND

[0004] Laser processing is a technology that uses a high-energy laser beam to cut, punch, engrave, weld and other processes on materials. Laser processing equipment can process various shapes of objects, such as square, circular and other shapes. Generally, when laser processing is performed, parameters need to be set first, and then the specified shape of the object is processed according to the parameters. However, in some cases, the final processing result may deviate from the expected processing result, and the traditional processing method can only adjust this deviation by repeated processing, resulting in low processing efficiency. SUMMARY

[0005] The present application provides a laser processing method, device, medium, laser processing system and laser processing equipment to improve processing efficiency.

[0006] According to an aspect of an embodiment of the present application, a laser processing method is provided, comprising:

[0007] Obtaining point cloud data of a surface of a to-be-processed region of a to-be-processed object; the to-be-processed region of the to-be-processed object is centrally symmetric;

[0008] Data fitting is performed on the point cloud data to construct and display a three-dimensional model of the to-be-processed region based on the fitting result;

[0009] Displaying a processing path corresponding to the to-be-processed region on the three-dimensional model. According to an aspect of an embodiment of the present application, a laser processing device is provided, comprising:

[0010] A data obtainer is configured to obtain point cloud data of a surface of a to-be-processed region of a to-be-processed object; the to-be-processed region of the to-be-processed object is centrally symmetric;

[0011] A data fitter is configured to perform data fitting on the point cloud data to construct and display a three-dimensional model of the to-be-processed region based on the fitting result;

[0012] a path displayer configured to display a machining path corresponding to the to-be-machined region on the three-dimensional model.

[0013] In an embodiment of the present application, the data fitter comprises:

[0014] a mapping relationship determiner configured to perform data fitting on the point cloud data to obtain a mapping relationship between a cross-sectional radius and a cross-sectional center point of the to-be-machined region based on a fitting result, wherein the cross-section of the to-be-machined region is perpendicular to a central symmetry axis of the to-be-machined region.

[0015] a coordinate determiner configured to determine a position coordinate of each point on the surface of the to-be-machined region according to the mapping relationship between the cross-sectional radius and the cross-sectional center point of the to-be-machined region.

[0016] a model generator configured to generate a three-dimensional model of the to-be-machined region based on the position coordinate of each point on the surface of the to-be-machined region.

[0017] In an embodiment of the present application, the mapping relationship determiner comprises:

[0018] a point set divider configured to divide the point cloud data into a plurality of point sets, wherein one point set comprises point cloud data of points on the surface of the to-be-machined region belonging to a same cross-section.

[0019] a data fitter configured to perform curve fitting on each of the plurality of point sets to determine the mapping relationship between the cross-sectional radius and the cross-sectional center point of the to-be-machined region based on fitting results of the plurality of point sets.

[0020] In an embodiment of the present application, the mapping relationship determiner is specifically configured to:

[0021] perform curve fitting on the point set to obtain a cross-sectional boundary curve represented by the point set;

[0022] calculate the cross-sectional radius and the cross-sectional center point according to the cross-sectional boundary curve;

[0023] generate the mapping relationship between the cross-sectional radius and the cross-sectional center point of the to-be-machined region according to the cross-sectional radius and the cross-sectional center point corresponding to the plurality of point sets.

[0024] In an embodiment of the present application, the path displayer 730 comprises:

[0025] a path point obtainer configured to map a pre-processing point in the preset machining path data to a machining path point corresponding to the pre-processing point according to a mapping relationship between a cross-sectional radius and a cross-sectional center point of the region to be machined;

[0026] a path generator configured to generate a machining path corresponding to the region to be machined according to the machining path points;

[0027] a model display configured to display the machining path corresponding to the region to be machined on the three-dimensional model.

[0028] In an embodiment of the present application, the path point obtainer is specifically configured to:

[0029] generate a cross-sectional center point coordinate according to a coordinate of the pre-processing point in the preset machining path data;

[0030] obtain a cross-sectional radius corresponding to the pre-processing point according to the cross-sectional center point coordinate and the mapping relationship between the cross-sectional radius and the cross-sectional center point of the region to be machined;

[0031] obtain a machining path point corresponding to the pre-processing point according to the cross-sectional radius, the coordinate of the pre-processing point and a mapping relationship between a two-dimensional plane represented by the preset machining path data and a three-dimensional curved surface represented by the three-dimensional model.

[0032] In an embodiment of the present application, the path point obtainer is specifically configured to:

[0033] calculate a curvature of each point on the model of the region to be machined;

[0034] when it is determined that the region to be machined is suitable for machining according to the curvature of each point on the model of the region to be machined, map a pre-processing point in the preset machining path data to a machining path point corresponding to the pre-processing point according to a mapping relationship between a cross-sectional radius and a cross-sectional center point of the region to be machined.

[0035] In an embodiment of the present application, the data obtainer is specifically configured to:

[0036] control a range finder in a laser machining device to scan an upper surface of the region to be machined of the object to be machined to obtain point cloud data of the region to be machined of the object to be machined.

[0037] In an embodiment of the present application, the device is further configured to:

[0038] generate a machining code according to the machining path;

[0039] running the machining code to machine the region to be machined.

[0040] In an embodiment of the present application, the device is further configured to:

[0041] rotating the object to be machined by a rotating accessory in the laser machining device for machining, wherein the rotating accessory corresponds to the same central axis of symmetry as the region to be machined.

[0042] According to an aspect of an embodiment of the present application, there is provided a computer readable medium having stored thereon a computer program which, when executed by a processor, implements the laser machining method as in the above technical solutions.

[0043] According to an aspect of an embodiment of the present application, there is provided a laser machining system, the laser machining device comprising: a processor; and a memory for storing executable instructions of the processor; wherein the processor executes the executable instructions to cause the laser machining device to perform the laser machining method as in the above technical solutions.

[0044] According to an aspect of an embodiment of the present application, there is provided a laser machining device, comprising:

[0045] a body;

[0046] a rotating accessory, the rotating accessory being arranged on the body and configured to clamp and rotate the object to be machined;

[0047] a range finder, the range finder being arranged on the body and configured to scan the object to be machined to obtain point cloud data of a surface of a region to be machined of the object to be machined, and transmit the scanned point cloud data to a control module;

[0048] a control module configured to process the point cloud data according to the laser machining method provided by any of the embodiments of the present application.

[0049] According to an aspect of an embodiment of the present application, there is provided a laser machining system, comprising:

[0050] a laser machining device, the laser machining device comprising a body, a range finder and a rotating accessory, the rotating accessory and the range finder being arranged on the body; wherein the rotating accessory is configured to clamp and rotate the object to be machined; and the range finder is configured to scan the object to be machined to obtain point cloud data of a surface of a region to be machined of the object to be machined, and transmit the scanned point cloud data to a terminal device;

[0051] A terminal device in communication with the laser processing device, the terminal device configured to process the point cloud data according to the laser processing method provided by any of the embodiments of the present application to obtain a processing path corresponding to the region to be processed, and send the processing path to the laser processing device to process the region to be processed.

[0052] According to an aspect of an embodiment of the present application, a computer program product or computer program is provided, which includes computer instructions stored in a computer readable storage medium. A processor of a computer device reads the computer instructions from the computer readable storage medium, and the processor executes the computer instructions to cause the computer device to perform the laser processing method in the above technical solutions.

[0053] In the technical solutions provided by the embodiments of the present application, the point cloud data of the surface of the region to be processed can be used to construct and display a three-dimensional model of the region to be processed, so that the three-dimensional reconstruction of the region to be processed is realized, and the processing path corresponding to the region to be processed is displayed on the three-dimensional model. In this way, even for an object to be processed with an irregular shape, a processing path that matches the shape of the object to be processed can be well constructed, so that the processing effect of processing on the irregular object is improved. In addition, since the processing path corresponding to the region to be processed can be displayed on the three-dimensional model, the processing effect corresponding to the processing path can be previewed in advance, so that the processing path can be adjusted in time when the processing effect deviates from the expectation, thereby improving the processing efficiency.

[0054] It should be understood that the above general description and the following detailed description are only exemplary and do not limit the present application. BRIEF DESCRIPTION OF DRAWINGS

[0055] The above and other objects, features and advantages of the present application will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.

[0056] FIG. 1A schematically shows a schematic diagram of a laser processing device to which the technical solutions of the present application are applied.

[0057] FIG. 1B schematically shows a schematic diagram of a laser processing system to which the technical solutions of the present application are applied.

[0058] FIG. 2 schematically shows a flowchart of a laser processing method provided by an embodiment of the present application.

[0059] FIG. 3 schematically shows a flowchart of a laser processing method provided by an embodiment of the present application.

[0060] FIG. 4 schematically shows a schematic diagram of point cloud data provided by an embodiment of the present application.

[0061] FIG. 5A schematically shows a diagram of a model of a region to be processed according to an embodiment of the present application.

[0062] FIG. 5B schematically shows a diagram of a path to be processed according to an embodiment of the present application.

[0063] FIG. 6 schematically shows a flowchart of a laser processing method according to an embodiment of the present application.

[0064] FIG. 7 schematically shows a block diagram of a laser processing apparatus according to an embodiment of the present application.

[0065] FIG. 8 schematically shows a block diagram of a computer system suitable for use in a laser processing apparatus according to an embodiment of the present application. DETAILED DESCRIPTION

[0066] Example implementations will now be described more fully with reference to the accompanying drawings. Example implementations can be implemented in any

[0067] Moreover, described features, structures, or characteristics can be combined in any suitable manner in one or more example implementations. In the following description, numerous specific details are provided to give a thorough understanding of example implementations. One skilled in relevant art will recognize, however, that the

[0068] Some of the block diagrams shown in the drawings are functional entities that do not necessarily have to correspond to physically or logically independent entities. These functional entities can be implemented in software, or in one or more hardware modules or integrated circuits, or in different network and / or processor devices and / or microcontroller devices.

[0069] FIG. 1A schematically shows a diagram of a laser processing apparatus to which the present application is applied.

[0070] As shown in FIG. 1A, the laser processing device includes a body 110, a range finder 120 and a rotating accessory 130, the range finder 120 and the rotating accessory 130 are arranged on the body 110, and the rotating accessory 130 is used to clamp a center-symmetric object to be processed and can drive the object to be processed to rotate. The range finder 120 is used to scan the object to be processed to obtain point cloud data of the surface of the processing area of the object to be processed. The range finder 120 includes a laser radar, a structured light camera, a line laser profiler and the like.

[0071] In the technical solution of the present application, after the center-symmetric object to be processed is clamped by the rotating accessory 130, the surface of the object to be processed is scanned by the range finder 120. At this time, the rotating accessory 130 can be kept stationary, and the range finder 120 can scan the part of the surface of the object to be processed facing the range finder 120 to obtain point cloud data of the object to be processed.

[0072] The laser processing device can further include a control module (not shown in FIG. 1A), which can be arranged in the body 110. The range finder 120 can send the point cloud data obtained by scanning to the control module, and the control module can implement the laser processing method provided by any embodiment of the present application to process the point cloud data. For example, the control module performs data fitting on the point cloud data to construct and display a three-dimensional model of the processing area based on the fitting result, and displays a processing path corresponding to the processing area on the three-dimensional model, so that the laser processing device processes the processing area based on the processing path.

[0073] FIG. 1B schematically shows a schematic diagram of a laser processing system applying the technical solution of the present application.

[0074] As shown in FIG. 1B, the laser processing system includes a laser processing device 100 and a terminal device 200. The structure of the laser processing device 100 can refer to the embodiment of FIG. 1A.

[0075] The terminal device 200 can be communicatively connected with the laser processing device 100. The terminal device 200 can be a smart phone, a tablet computer, a notebook computer, a smart voice interactive device or any electronic device capable of communicating with the laser processing device 100. The communication connection between the terminal device 200 and the laser processing device 100 can be wired communication connection or wireless communication connection.

[0076] The laser processing device 100 can send the point cloud data scanned by the range finder 120 to the terminal device 200, and the terminal device 200 can process the point cloud data according to the laser processing method provided in any embodiment of the present application. For example, the terminal device 200 performs data fitting on the point cloud data to construct and display a three-dimensional model of the to-be-processed region based on the fitting result, and displays the processing path corresponding to the to-be-processed region on the three-dimensional model. The terminal device 200 sends the processing path to the laser processing device for processing the to-be-processed region. The terminal device 200 can send the processing path to the laser processing device 100, so that the laser processing device 100 processes the to-be-processed region according to the processing path.

[0077] The laser processing method provided in the present application will be described in detail below in combination with the specific embodiments.

[0078] FIG. 2 schematically shows a flowchart of the laser processing method provided in an embodiment of the present application. As shown in FIG. 2, the method comprises steps 210 to 240, which are specifically as follows.

[0079] In step 210, point cloud data of a to-be-processed region surface of a to-be-processed object is acquired; the to-be-processed region of the to-be-processed object is centrally symmetric.

[0080] Specifically, the to-be-processed object is an object that needs to be processed by laser, which is composed of a material that can be processed by laser. In shape, it can be a centrally symmetric object. For example, the to-be-processed object can be a cylindrical object, or an object with a first part being a cylindrical body and a second part being another shape that is not centrally symmetric. In some cases, some regions of the to-be-processed object need to be processed, and some regions do not need to be processed. The regions that need to be processed are referred to as to-be-processed regions, which can be marked by a user or identified from the to-be-processed object according to a user processing strategy. Alternatively, the to-be-processed region can be the entire to-be-processed object. Since the regions of the to-be-processed object other than the to-be-processed regions do not need to be processed, they naturally do not need to generate processing paths. Therefore, the present application only considers the to-be-processed regions of the to-be-processed object and does not consider other regions. The subsequent examples also only show the to-be-processed regions. In this embodiment, the to-be-processed region of the to-be-processed object is centrally symmetric, that is, the centrally symmetric region of the to-be-processed object can be regarded as the to-be-processed region, which can be a centrally symmetric object with a certain size changing, for example, the shape of the to-be-processed region can be regarded as a cylindrical shape, but the radius of the cross section of the to-be-processed region changes along the center line direction, thus forming an object with the size of the cross section changing along the center line direction, which can be referred to as a curved cylindrical object.

[0081] The information of a point in the point cloud data represents the position coordinates of a point on the surface of the object to be processed in a three-dimensional space. The coordinate axes in the three-dimensional coordinate system are denoted as an x-axis, a y-axis and a z-axis respectively. A point i in the point cloud data can be represented as (xi, yi, zi).

[0082] In an embodiment of the present application, the point cloud data can be obtained by specifically measuring points on the surface of the region to be processed of the object to be processed. For example, the laser processing device shown in FIG. 1 can control the range finder 120 to scan the surface of the object to be processed. The scanning process is to measure the distance of each point to obtain the three-dimensional position coordinates of each point and form the point cloud data. Alternatively, the range finder 120 can perform single-point scanning distance measurement on the object to be processed, that is, only one point on the object to be processed is measured by one scanning to obtain the three-dimensional position coordinates of the point. The point cloud data of the object to be processed can be obtained by repeating the single-point scanning distance measurement multiple times.

[0083] In an embodiment of the present application, the point cloud data is formed by part of points on the surface of the region to be processed of the object to be processed, for example, the point cloud data obtained by scanning the upper surface of the region to be processed of the object to be processed by the range finder 120 of the laser processing device shown in FIG. 1. The technical solution of the present application can generate the processing path of the entire region to be processed based on part of the point cloud data on the surface of the region to be processed, thereby reducing the amount of point cloud data required for generating the processing path and improving the processing efficiency.

[0084] In an embodiment of the present application, the point cloud data is formed by part of points on the surface of the region to be processed of the object to be processed, for example, the point cloud data obtained by scanning the upper surface of the region to be processed of the object to be processed by the range finder 120 of the laser processing device shown in FIG. 1. The technical solution of the present application can generate the processing path of the entire region to be processed based on part of the point cloud data on the surface of the region to be processed, thereby reducing the amount of point cloud data required for generating the processing path and improving the processing efficiency.

[0085] Specifically, the point cloud data is fitted to obtain a fitting result representing the shape of the region to be processed. Since the point cloud data is in a three-dimensional space, the fitting result also represents the shape of the region to be processed in the three-dimensional space, thereby obtaining the three-dimensional model of the region to be processed. The fitting process can be curve fitting, surface fitting or the like, or the points can be fitted into lines first and then the lines are fitted into a surface.

[0086] In an embodiment of the present application, after the three-dimensional model of the region to be processed is constructed, it can be detected whether the point cloud data obtained in step 210 is distributed on the model of the region to be processed. If most of the point cloud data (i.e., more than a preset number of point cloud data) is distributed on the model of the region to be processed, it indicates that the modeling is correct and the three-dimensional model can be used. If more than a certain number of point cloud data is not distributed on the three-dimensional model of the region to be processed, it indicates that the modeling is incorrect, and the three-dimensional model of the region to be processed should be re-constructed.

[0087] In an embodiment of the present application, after the three-dimensional model of the region to be processed is constructed, it can be detected whether the point cloud data obtained in step 210 is distributed on the model of the region to be processed. If most of the point cloud data (i.e., more than a preset number of point cloud data) is distributed on the model of the region to be processed, it indicates that the modeling is correct and the three-dimensional model can be used. If more than a certain number of point cloud data is not distributed on the three-dimensional model of the region to be processed, it indicates that the modeling is incorrect, and the three-dimensional model of the region to be processed should be re-constructed.

[0088] Specifically, the machining path is a laser moving path when the laser machining device performs machining processing, and the machining path can be generated based on the shape of the to-be-machined region in the to-be-machined object. The machining path corresponding to the to-be-machined region is displayed on the three-dimensional model, so that the machining path can be previewed through the three-dimensional model, and thus the machining effect can be known before machining.

[0089] In the technical scheme provided in the embodiments of the present application, the three-dimensional model of the to-be-machined region can be constructed and displayed based on the point cloud data of the surface of the to-be-machined region, so that the three-dimensional reconstruction of the to-be-machined region is realized, and the machining path corresponding to the to-be-machined region is displayed on the three-dimensional model. In this way, even for a to-be-machined object with an irregular shape, a machining path that matches the shape of the to-be-machined object can be well constructed, so that the machining effect of machining on an irregular object is improved. In addition, since the machining path corresponding to the to-be-machined region can be displayed on the three-dimensional model, the machining effect corresponding to the machining path can be previewed in advance, so that the machining path can be adjusted in time when the machining effect deviates from the expectation, thereby improving the machining efficiency.

[0090] FIG. 3 schematically shows a flowchart of a laser machining method provided in an embodiment of the present application. As shown in FIG. 3, the method includes steps 310 to 340, which are specifically as follows:

[0091] Step 310: Obtain point cloud data of a to-be-machined region surface of a to-be-machined object; the to-be-machined region of the to-be-machined object is centrally symmetric.

[0092] Step 310 is the same as step 210 described above, and thus will not be described again here.

[0093] Step 320: Perform data fitting on the point cloud data to obtain a mapping relationship between a cross-sectional radius and a cross-sectional center point of the to-be-machined region based on a fitting result.

[0094] Specifically, the data fitting is performed on the point cloud data, and the fitting result can represent a curve formed by the to-be-machined region surface. The points on the curve are also points on the cross section of the to-be-machined region, so that the cross-sectional radius and the cross-sectional center point can be calculated through the curve, and then the mapping relationship between the cross-sectional center and the cross-sectional radius is obtained. The cross section of the to-be-machined region is perpendicular to the central symmetry axis of the to-be-machined region.

[0095] In an embodiment of the present application, the mapping relationship to be finally obtained is the mapping relationship between the cross-section related parameters, and therefore, when fitting the point cloud data, the point cloud data can be divided or classified based on the cross-section, so that the point cloud data corresponding to one cross-section forms a point set, and then the data fitting can be performed according to the point set. The process specifically includes: dividing the point cloud data into a plurality of point sets, wherein one point set includes the point cloud data of the surface of the to-be-processed region belonging to the same cross-section; and performing curve fitting on the plurality of point sets to obtain the mapping relationship between the cross-section radius and the cross-section center point of the to-be-processed region based on the fitting results of the plurality of point sets.

[0096] For example, the to-be-processed region is placed in the direction shown in FIG. 1 and the point cloud data is obtained, and the point cloud data of the surface of the to-be-processed region is shown in FIG. 4. As can be seen from the point cloud data shown in FIG. 4, the points arranged horizontally are the points distributed along the center line direction of the surface of the to-be-processed region, the points arranged vertically are the points distributed in the direction perpendicular to the center line of the to-be-processed region, and one cross-section of the to-be-processed region is naturally perpendicular to the center line of the to-be-processed region. Therefore, the points in the point cloud data can be divided in the direction in which the points are arranged vertically, so that the point cloud data belonging to the same cross-section is obtained, and these point cloud data are recorded as the point set corresponding to the cross-section.

[0097] In an embodiment of the present application, when dividing the point set, the difference between the coordinate values of the coordinate axis parallel to the direction of the center line of the to-be-processed region in the position coordinates of two points can be calculated, and if the difference is less than a preset threshold value, it can be considered that the two points corresponding to the difference belong to the same cross-section. Assuming that the x-axis is parallel to the direction of the center line of the to-be-processed region among the x-axis, y-axis and z-axis, when the two points belong to the same cross-section, the x-axis coordinate values should be substantially the same, and therefore, when dividing the point set, the difference between the x-axis coordinates of the two points is calculated, and if the difference is less than a preset threshold value, it can be considered that the two points corresponding to the difference belong to the same cross-section. The preset threshold value can be set according to actual needs.

[0098] In an embodiment of the present application, the process of performing curve fitting on the point set data specifically includes: performing curve fitting on the point set to obtain the cross-section boundary curve represented by the point set; calculating the cross-section radius and the cross-section center point according to the cross-section boundary curve; and generating the mapping relationship between the cross-section radius and the cross-section center point of the to-be-processed region according to the cross-section radius and the cross-section center point corresponding to the plurality of point sets.

[0099] Specifically, the points in the point set are actually boundary points on the cross section of the region to be processed, or in other words, contour points of the cross section, and therefore, data curve fitting can be performed on the points in the point set to obtain a boundary curve of the cross section represented by the point set. For example, in the point cloud data shown in FIG. 4, curve fitting is performed on the point set in the first column, and an expression of a circular curve is obtained, which is a boundary line of a cross section. According to the boundary curve of the cross section, the radius and the center point of the cross section can be calculated. For example, according to the expression of the circular curve obtained from the point set in the first column, the radius and the center coordinates of the circular curve can be calculated, and the radius of the circular curve is the radius of the cross section, and the center coordinates of the circular curve are the coordinates of the center point of the cross section.

[0100] According to the radius and the center point of each cross section, a mapping relationship between the cross section radius and the cross section center point of the region to be processed can be obtained. It should be noted that the mapping relationship is a discrete mapping relationship, which can be represented by a mathematical discrete expression r = f(x', y', z'), where r represents the cross section radius, and (x', y', z') represents the cross section center point. For example, taking the point cloud data shown in FIG. 4 as an example, the cross section radius corresponding to the point set in the first column is r1, and the cross section center point is (x'1, y'1, z'1), which can be denoted as r1 = f(x'1, y'1, z'1); the cross section radius corresponding to the point set in the second column is r2, and the cross section center point is (x'2, y'2, z'2), which can be denoted as r2 = f(x'2, y'2, z'2); and the cross section radius corresponding to the point set in the i-th column is ri, and the cross section center point is (x'i, y'i, z'i), which can be denoted as ri = f(x'i, y'i, z'i). These data are summarized to form a mapping relationship between the cross section radius and the cross section center point of the region to be processed. Optionally, the mapping relationship can be in the form of a table, and subsequent calculations based on the mapping relationship can be regarded as querying or interpolating the mapping relationship table.

[0101] In some cases, when the collected point cloud data is insufficient or unevenly distributed, data interpolation can be used to expand the cross section radius and cross section center point data in the mapping relationship. For example, if (x'1, y'1, z'1) and (x'2, y'2, z'2) are far apart, (x'0, y'0, z'0) can be inserted between (x'1, y'1, z'1) and (x'2, y'2, z'2) by data interpolation, and the corresponding cross section radius r0 can be calculated based on the mapping relationship. For example, taking the x-axis coordinates as an example, assuming that when r = 1, the x-coordinate is 1, and when r = 2, the x-coordinate is 2, then the x-coordinate 1.5 is inserted, and r = 1.5 is calculated.

[0102] Step 330, determining the position coordinates of each point on the surface of the region to be processed according to the mapping relationship between the cross-sectional radius and the cross-sectional center point of the region to be processed.

[0103] Step 340, generating a three-dimensional model of the region to be processed based on the position coordinates of each point on the surface of the region to be processed.

[0104] According to the foregoing embodiments, the point cloud data obtained in step 310 can be point cloud data of a part of the surface of the region to be processed. After the mapping relationship between the cross-sectional radius and the cross-sectional center point of the region to be processed is calculated based on the part of the point cloud data, the coordinate information of any point on the surface of the region to be processed can be calculated according to the mapping relationship, that is, the coordinate information of the points on the surface of the region to be processed that are not collected by the point cloud data can be calculated based on the part of the point cloud data, and then a model of the region to be processed can be constructed according to these data, which is a three-dimensional model. Alternatively, a three-dimensional model of the object to be processed can also be constructed based on the point cloud data of the object to be processed, which also includes the region to be processed.

[0105] Step 350, mapping the pre-processing points in the preset machining path data to the three-dimensional space where the region to be processed is located according to the mapping relationship between the cross-sectional radius and the cross-sectional center point of the region to be processed, to obtain machining path points corresponding to the pre-processing points.

[0106] Specifically, the preset machining path data is the general path data in the laser machining equipment, and the preset machining path data can be a bitmap to be processed or a vector graph svg path data. The points in the preset machining path data are referred to as pre-processing points, and the preset machining path data is generally generated based on a two-dimensional plane, so the coordinates of the pre-processing points are two-dimensional coordinates. Assuming that the two-dimensional plane is represented by the x-axis and the y-axis, the coordinates of the pre-processing points can be denoted as (x, y). In some cases, the coordinates of the pre-processing points can also be extended to three-dimensional coordinates by assigning 0 to the coordinates perpendicular to the two-dimensional plane, for example, the coordinates of the pre-processing points can be denoted as (x, y, 0).

[0107] Mapping the pre-processing points to the three-dimensional space where the region to be processed is located, the obtained machining path points are three-dimensional coordinates. The pre-processing points in the preset machining path data can be regarded as points in a rectangle, and the machining path points on the surface of the region to be processed can be regarded as points on a cylinder after the rectangle is deformed, for example, a rectangular object can be obtained by expanding a cylindrical object along a straight line on the surface, and then a cylindrical object can be obtained by reversing the rectangle.

[0108] In an embodiment of the present application, the three-dimensional space where the to-be-processed region is located can be the three-dimensional space where the to-be-processed region entity is located, or the three-dimensional space where the to-be-processed region model is located. Mapping the pre-processing point to the three-dimensional space where the to-be-processed region entity is located can display the pre-processing point on the to-be-processed region entity, and thus guide the laser processing equipment to perform laser processing on the to-be-processed region entity. Mapping the pre-processing point to the three-dimensional space where the to-be-processed region model is located can preview the position of the pre-processing point on the to-be-processed region, so as to facilitate the user to view. The to-be-processed region model can be a three-dimensional model obtained by modeling the whole to-be-processed object, or a three-dimensional model obtained by modeling only the to-be-processed region.

[0109] In an embodiment of the present application, the specific operation of obtaining the processing path point comprises: generating a cross-section center point coordinate according to the coordinate of the pre-processing point in the preset processing path data; obtaining a cross-section radius corresponding to the pre-processing point according to the cross-section center point coordinate and a mapping relationship between the cross-section radius and the cross-section center point of the to-be-processed region; and obtaining the processing path point corresponding to the pre-processing point on the surface of the to-be-processed region according to the cross-section radius, the coordinate of the pre-processing point, and a mapping relationship between the two-dimensional plane represented by the preset processing path data and the three-dimensional curved surface represented by the surface of the to-be-processed region.

[0110] Specifically, first, the coordinate of the pre-processing point is taken as the cross-section center point coordinate, and based on the mapping relationship between the cross-section radius and the cross-section center point of the to-be-processed region, the cross-section radius corresponding to the pre-processing point can be obtained. Based on the mapping relationship between the two-dimensional plane represented by the preset processing path data and the three-dimensional curved surface represented by the surface of the to-be-processed region, which can be simply referred to as the mapping relationship between the rectangular plane and the curved cylindrical surface, based on the mapping relationship, the cross-section radius, and the two-dimensional coordinate of the pre-processing point, the three-dimensional coordinate of the processing path point on the surface of the to-be-processed region corresponding to the pre-processing point can be obtained.

[0111] In an embodiment of the present application, before obtaining the processing path point, the technical solution of the present application further comprises: calculating the curvature of each point on the model of the to-be-processed region, and when it is determined that the to-be-processed region is suitable for processing according to the curvature of each point on the three-dimensional model of the to-be-processed region, mapping the pre-processing point in the preset processing path data to the three-dimensional space where the three-dimensional model of the to-be-processed region is located according to the mapping relationship between the cross-section radius and the cross-section center point of the to-be-processed region, to obtain the processing path point corresponding to the pre-processing point.

[0112] Specifically, in some cases, the laser processing device has certain requirements on the size of the region to be processed, and when the region to be processed does not meet the size requirements, the laser processing device usually cannot process the region to be processed. Therefore, before calculating the processing path points, the curvature of each point on the three-dimensional model of the region to be processed is first calculated, which is used to judge whether the region to be processed is suitable for processing, and only when the region to be processed is suitable for processing, the processing path points on the surface of the region to be processed are calculated. When the region to be processed is not suitable for processing, a prompt message can be generated to allow the operator to adjust the size of the region to be processed.

[0113] For example, when the curvature change in a region on the model of the region to be processed is less than a first threshold value, it indicates that the region is suitable for processing; when the curvature change in a region on the model of the region to be processed is greater than the first threshold value and less than a second threshold value, it indicates that the region can be processed, but the curvature change is relatively obvious, and a curvature warning can be generated; when the curvature change in a region on the model of the region to be processed is greater than the second threshold value, it indicates that the region is not suitable for processing. When each numerical value is compared, the equal case can be classified as greater than or less than according to actual needs.

[0114] Step 360, generating a processing path corresponding to the region to be processed according to the processing path points.

[0115] Specifically, after determining the processing path points, the processing path can be generated according to each processing path point. Subsequently, the laser processing device can perform laser processing operation on the region to be processed on the object to be processed according to the processing path.

[0116] Step 370, displaying the processing path corresponding to the region to be processed on the three-dimensional model.

[0117] Finally, the processing path corresponding to the region to be processed is mapped to the three-dimensional model, so that the processing effect of the processing path on the region to be processed can be intuitively reflected.

[0118] In an embodiment of the present application, when the processing path corresponding to the region to be processed is displayed on the three-dimensional model of the region to be processed, different curvature changes on the three-dimensional model can also be displayed by color differentiation. The curvature change also reflects whether the corresponding region is suitable for processing. For example, gray represents general curvature and is suitable for processing; yellow represents curvature warning and warns processing; red represents excessive curvature and prohibits processing. For example, the visual display graph of the model of the region to be processed is shown in FIG. 5A.

[0119] In the technical scheme provided in the embodiments of the present application, the mapping relationship between the cross-sectional radius and the cross-sectional center point of the machining area is obtained by data fitting on the point cloud data of the surface of the machining area on the object to be machined, and then the pre-machining points in the preset machining path data are mapped to the surface of the machining area according to the mapping relationship to obtain the corresponding machining path points of the pre-machining points on the surface of the machining area, and then the machining path corresponding to the machining area is generated according to the corresponding machining path points of the pre-machining points on the surface of the machining area. Since the mapping relationship can reflect the relationship between the cross-sectional radius and the cross-sectional center point, when the cross-sectional radius of the machining area changes, the corresponding machining path can still be generated according to the mapping relationship, so that the laser machining of the machining area with shape change can be efficiently and quickly realized.

[0120] In an embodiment of the present application, the laser machining device includes a moving process and a machining process when performing laser machining on the machining area. The moving process refers to that the laser emitting device in the laser machining device needs to be moved to the position to be machined, and the machining process refers to that the laser emitting device emits laser to perform real laser machining on the machining area. Based on the two processes, the machining path of the laser machining device includes a moving path and a machining path. The moving path is the path corresponding to the moving process, and the machining path is the path corresponding to the machining process. Correspondingly, the machining path points include moving points on the moving path and machining points on the machining path. After the machining path points are obtained, it can be judged whether the machining path points are located on the machining area. If the machining path points are located on the machining area, the machining path points are taken as machining points; if the machining path points are not located on the machining area, the machining path points are taken as moving points. Subsequently, the moving path can be generated according to the moving points, and the machining path can be generated according to the machining points.

[0121] In an embodiment of the present application, after the machining path is generated, the machining path can be attached to the surface of the machining area model for visual display. As shown in FIG. 5B, the machining path can be regarded as the relative running track of the laser emitting device and the machining area (curved cylindrical body). In the laser machining process, the laser machining device cannot rotate, but can move along a specified direction, for example, along the center line direction of the curved cylindrical body; the part holding the curved cylindrical body can drive the curved cylindrical body to rotate, so that the relative movement between the laser emitting device and the machining area forms a spiral track.

[0122] In an embodiment of the present application, after the machining path is generated, the technical scheme of the present application further includes: generating machining code according to the machining path; and then running the machining code to machine the machining area.

[0123] FIG. 6 schematically shows a flowchart of a laser processing method according to an embodiment of the present application. As shown in FIG. 6, the method comprises the following steps:

[0124] S610, clamping the curved cylinder. The curved cylinder represents the object to be processed in the present application. In the present embodiment, the processing region is the whole object to be processed. Therefore, the object to be processed and the processing region represent the same processing object, which is hereinafter referred to as the object to be processed. The curved cylinder is clamped by the rotating accessory with adjustable clamping radius (e.g., the rotating accessory 130 shown in FIG. 1), so as to ensure that the curved cylinder can move coaxially with the rotating shaft.

[0125] S620, scanning the upper surface of the object to obtain xyz information. The upper surface of the curved cylinder is scanned by the range finder (e.g., the range finder 120 shown in FIG. 1) to obtain the xyz coordinate information, which is the point cloud data.

[0126] S630, three-dimensional reconstruction of the object. The curved cylinder is reconstructed in three dimensions based on the obtained xyz coordinate information of the upper surface, i.e., the mathematical discrete expression of the curved cylinder is obtained by fitting the obtained xyz information: r = f(x, y, z), which represents the mapping relationship between the cross-sectional radius of the object to be processed and the center point of the cross section. The xyzr of the expression can be used to obtain the coordinate of any surface position of the object, and the coordinates can be used to complete the profile of the curved cylinder, including the unscanned information.

[0127] S640, displaying the curved cylinder. The modeling information of the curved cylinder can be viewed by display, and the processing regions in the model are distinguished by different colors, for example, the gray part represents the processable part, the yellow part represents the warning processing part, and the red part represents the forbidden processing part. When the curved surface is represented by most of the scanning points, the modeling is normal. Through these information, it can be ensured that the modeling is correct and the curvature change is suitable for processing.

[0128] S650, displaying the three-dimensional processing path. The bit map or vector graph svg path data (i.e., the preset processing path data) generates the plane xy coordinate data of certain equidistant points (i.e., the pre-processing points); the radius r value of the point on the plane xy coordinate is obtained by the aforementioned mathematical discrete expression; the xyz coordinate information of the point on the curved cylinder (i.e., the processing path point) is calculated by the radius r. These points are divided into processing points and moving points. The obtained xyz points are used to realize the attachment display of the processing path on the surface of the curved cylinder. For details, reference can be made to the related description of step 230, which will not be repeated here.

[0129] S660, generating the laser equipment and rotating accessory processing code. That is, generating the processing path. The laser cutting machine and rotating accessory gcode processing code are generated based on the xyz coordinate information of the processing path, and the executable running code of the laser cutting machine and the rotating accessory is generated.

[0130] S670, processing is completed. The gcode processing code is run to process the displayed path. The processing of the path to be processed is achieved through synchronous movement of the laser cutting machine and the drivable rotating accessory.

[0131] The technical scheme of the present application realizes a curved surface cylindrical path display and laser processing method, which can quickly realize curved surface cylindrical surface modeling, curved surface cylindrical surface to-be-processed path 3D display and adjustment, and curved surface cylindrical surface 3D engraving.

[0132] It should be noted that although the steps of the method in the present application are described in a specific order in the drawings, this does not require or imply that the steps must be performed in this specific order, or that all the steps shown must be performed to achieve the desired result. In addition or alternatively, some steps can be omitted, multiple steps can be combined into one step, and / or one step can be divided into multiple steps, etc.

[0133] The device embodiment of the present application is introduced below, which can be used to execute the laser processing method in the above-mentioned embodiments of the present application. FIG. 7 schematically shows a structural block diagram of a laser processing device provided by an embodiment of the present application. As shown in FIG. 7, the laser processing device provided by the embodiment of the present application comprises:

[0134] A data obtainer 710 is configured to obtain point cloud data of a to-be-processed region surface of a to-be-processed object; the to-be-processed region of the to-be-processed object is centrally symmetric;

[0135] A data fitter 720 is configured to perform data fitting on the point cloud data to construct and display a three-dimensional model of the to-be-processed region based on a fitting result;

[0136] A path display 730 is configured to display a processing path corresponding to the to-be-processed region on the three-dimensional model.

[0137] In an embodiment of the present application, the data fitter 720 comprises:

[0138] A mapping relationship determiner is configured to perform data fitting on the point cloud data to obtain a mapping relationship between a cross-sectional radius and a cross-sectional center point of the to-be-processed region based on a fitting result; wherein the cross-section of the to-be-processed region is perpendicular to the central symmetry axis of the to-be-processed region;

[0139] A coordinate determiner is configured to determine the position coordinates of each point on the surface of the to-be-processed region according to the mapping relationship between the cross-sectional radius and the cross-sectional center point of the to-be-processed region;

[0140] The model generator is configured to generate a three-dimensional model of the region to be processed based on position coordinates of each point on the surface of the region to be processed.

[0141] In an embodiment of the present application, the mapping relationship determiner comprises:

[0142] The point set divider is configured to divide the point cloud data into a plurality of point sets, wherein one point set comprises point cloud data of points on the surface of the region to be processed belonging to the same cross section.

[0143] The data fitter is configured to perform curve fitting on each of the plurality of point sets, to determine a mapping relationship between cross section radii and cross section center points of the region to be processed based on fitting results of the plurality of point sets.

[0144] In an embodiment of the present application, the mapping relationship determiner is specifically configured to:

[0145] perform curve fitting on the point set to obtain a cross section boundary curve represented by the point set;

[0146] calculate a cross section radius and a cross section center point according to the cross section boundary curve;

[0147] generate a mapping relationship between cross section radii and cross section center points of the region to be processed according to the cross section radii and the cross section center points corresponding to the plurality of point sets.

[0148] In an embodiment of the present application, the path display 730 comprises:

[0149] The path point obtainer is configured to map a pre-processing point in pre-processing path data to a three-dimensional space in which the three-dimensional model of the region to be processed is located, to obtain a processing path point corresponding to the pre-processing point, according to the mapping relationship between cross section radii and cross section center points of the region to be processed.

[0150] The path generator is configured to generate a processing path corresponding to the region to be processed according to the processing path point.

[0151] The model display is configured to display the processing path corresponding to the region to be processed on the three-dimensional model.

[0152] In an embodiment of the present application, the path point obtainer is specifically configured to:

[0153] generate a cross section center point coordinate according to a coordinate of the pre-processing point in the pre-processing path data;

[0154] obtain a cross section radius corresponding to the pre-processing point according to the cross section center point coordinate and the mapping relationship between cross section radii and cross section center points of the region to be processed.

[0155] According to the cross-section radius, the coordinate of the pre-processing point, and a mapping relationship between a two-dimensional plane represented by the preset processing path data and a three-dimensional curved surface represented by the three-dimensional model, a processing path point corresponding to the pre-processing point is obtained.

[0156] In an embodiment of the present application, the path point obtainer is specifically configured to:

[0157] calculate the curvature of each point on the three-dimensional model of the region to be processed;

[0158] When it is determined that the region to be processed is suitable for processing according to the curvature of each point on the model of the region to be processed, map a pre-processing point in preset processing path data to a three-dimensional space in which the three-dimensional model of the region to be processed is located according to a mapping relationship between the cross-section radius and the cross-section center point of the region to be processed, to obtain a processing path point corresponding to the pre-processing point.

[0159] In an embodiment of the present application, the data obtainer 710 is specifically configured to:

[0160] control a range finder in the laser processing device to scan the upper surface of the region to be processed of the object to be processed, to obtain point cloud data of the surface of the region to be processed of the object to be processed.

[0161] In an embodiment of the present application, the device is further configured to:

[0162] generate a processing code according to the processing path;

[0163] run the processing code to process the region to be processed.

[0164] In an embodiment of the present application, the device is further configured to:

[0165] rotate the object to be processed by a rotating accessory in the laser processing device for processing, wherein the rotating accessory corresponds to the same central symmetry axis as the region to be processed.

[0166] The specific details of the laser processing device provided in the embodiments of the present application have been described in detail in the corresponding method embodiments, and will not be repeated here.

[0167] FIG. 8 schematically shows a computer system structure block diagram of a laser processing system for implementing embodiments of the present application.

[0168] It should be noted that the laser processing system includes a laser processing device and a terminal device in communication connection with the laser processing device, and the computer system 800 of the laser processing system shown in FIG. 8 is only an example and should not bring any limitation to the functions and use range of the embodiments of the present application.

[0169] As shown in FIG. 8, the computer system 800 includes a central processing unit 801 (CPU), which can be located in the laser processing device or in the terminal device in communication connection with the laser processing device, and can perform various appropriate actions and processes according to programs stored in a read-only memory 802 (ROM) or loaded from a storage portion 808 to a random access memory 803 (RAM). Various programs and data required for system operation are also stored in the random access memory 803. The central processing unit 801, the read-only memory 802, and the random access memory 803 are connected to each other through a bus 804. An input / output interface 805 (I / O interface) is also connected to the bus 804.

[0170] The following components are connected to the input / output interface 805: an input portion 806 including a keyboard, a mouse, and the like; an output portion 807 including a cathode ray tube (CRT), a liquid crystal display (LCD), and the like, and a speaker, and the like; a storage portion 808 including a hard disk, and the like; and a communication portion 809 including a network interface card such as a local area network card, a modem, and the like. The communication portion 809 performs communication processing via a network such as the Internet. A drive 810 is also connected to the input / output interface 805 as necessary. A removable medium 811 such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, and the like is mounted on the drive 810 as necessary, so that a computer program read therefrom is installed in the storage portion 808 as necessary.

[0171] In particular, according to the embodiments of the present application, the processes described in each of the method flowcharts can be implemented as a computer software program. For example, the embodiments of the present application include a computer program product including a computer program carried on a computer readable medium, the computer program containing program codes for executing the methods shown in the flowcharts. In such embodiments, the computer program can be downloaded and installed from a network by the communication portion 809, and / or installed from the removable medium 811. When the computer program is executed by the central processing unit 801, various functions defined in the system of the present application are performed.

[0172] Note that the computer readable medium shown in the embodiments of the present application can be a computer readable signal medium or a computer readable storage medium or any combination thereof. The computer readable storage medium may, for example, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or apparatus, or any combination thereof. More specific examples of the computer readable storage medium can include, but are not limited to, an electrical connection having one or more wires, a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM), a flash memory, an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination thereof. In this application, the computer readable storage medium can be any tangible medium that contains or stores a program used by an instruction execution system, apparatus or device, and can be used or combined with the same. In this application, the computer readable signal medium can include a data signal carried in a baseband or as a part of a carrier wave, which carries computer readable program code. Such a propagated data signal can take on many forms, including but not limited to an electromagnetic signal, an optical signal, or any suitable combination thereof. The computer readable signal medium can also be any computer readable medium that is not a computer readable storage medium and that can transmit, propagate or transport a program for use by or in connection with an instruction execution system, apparatus or device. The program code contained on the computer readable medium can be transmitted or propagated using any suitable medium, including but not limited to wireless, wired, optical, electromagnetic, infrared, or any suitable combination thereof.

[0173] The flow diagrams and the block diagrams in the drawings are illustrations of possible architectures, functions, and operations of systems, methods, and computer program products according to various embodiments of the present application. In this regard, each block in the flow diagrams or block diagrams can represent a module, a segment, or a portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that in some alternative implementations, the functions noted in the blocks can occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and / or flow diagrams, and combinations thereof, can be implemented by special purpose hardware-based systems that perform the specified functions or operations, or combinations of special purpose hardware and computer instructions.

[0174] It should be noted that, although several modules or units for a device for action execution are mentioned in the above detailed description, such a division is not mandatory. Indeed, according to an embodiment of the application, the features and functionalities of two or more modules or units described above can be embodied in one module or unit. Conversely, the features and functionalities of one module or unit described above can be further divided into several modules or units embodied.

[0175] Those skilled in the art can easily understand, through the above description of the embodiments, that the example embodiments described herein can be implemented by software, or by software in combination with necessary hardware. Therefore, the technical solutions according to the embodiments of the present application can be embodied in the form of a software product, which can be stored in a non-volatile storage medium (which can be a CD-ROM, a U disk, a mobile hard disk, etc.) or a network, and includes several instructions to make a computing device (which can be a personal computer, a server, a touch terminal, or a network device, etc.) execute the methods according to the embodiments of the present application.

[0176] Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the application disclosed herein. It is intended that the present application cover any and all variations of the application that come within the scope of the present application, along with all of the equivalents thereof. It is intended that the specification and examples be considered as exemplary only, with the true scope and spirit of the application being indicated by the following claims.

[0177] It should be understood that the present application is not limited to the precise construction that has been described above and illustrated in the accompanying drawings, and that various modifications and changes can be made by those skilled in the art without departing from the scope of the present application. The scope of the present application is limited only by the appended claims.

Claims

1. A laser processing method, comprising: acquiring point cloud data of a surface of a to-be-processed region of a to-be-processed object; the to-be-processed region of the to-be-processed object is centrally symmetric; data fitting is performed on the point cloud data to construct and display a three-dimensional model of the to-be-processed region based on a fitting result; a processing path corresponding to the to-be-processed region is displayed on the three-dimensional model.

2. The laser processing method according to claim 1, wherein The data fitting on the point cloud data to construct and display a three-dimensional model of the to-be-processed region based on a fitting result comprises: data fitting is performed on the point cloud data to determine a mapping relationship between a cross-sectional radius and a cross-sectional center point of the to-be-processed region based on a fitting result; wherein the cross section of the to-be-processed region is perpendicular to the central symmetry axis of the to-be-processed region; determining the position coordinates of each point on the surface of the to-be-processed region according to the mapping relationship between the cross-sectional radius and the cross-sectional center point of the to-be-processed region; generating a three-dimensional model of the to-be-processed region based on the position coordinates of each point on the surface of the to-be-processed region.

3. The laser processing method according to claim 2, wherein The data fitting on the point cloud data to determine a mapping relationship between a cross-sectional radius and a cross-sectional center point of the to-be-processed region based on a fitting result comprises: dividing the point cloud data into a plurality of point sets, wherein a point set includes point cloud data of the surface of the to-be-processed region belonging to the same cross section; curve fitting is performed on a plurality of the point sets respectively to obtain the mapping relationship between the cross-sectional radius and the cross-sectional center point of the to-be-processed region based on the fitting results of a plurality of the point sets.

4. The laser processing method according to claim 3, wherein The curve fitting on a plurality of the point sets respectively to obtain the mapping relationship between the cross-sectional radius and the cross-sectional center point of the to-be-processed region based on the fitting results of a plurality of the point sets comprises: curve fitting is performed on the point set to obtain a cross-sectional boundary curve represented by the point set; calculating the cross-sectional radius and the cross-sectional center point according to the cross-sectional boundary curve; generating the mapping relationship between the cross-sectional radius and the cross-sectional center point of the to-be-processed region according to the cross-sectional radius and the cross-sectional center point corresponding to a plurality of the point sets.

5. The laser processing method according to claim 2, wherein The displaying of the processing path corresponding to the to-be-processed region on the three-dimensional model comprises: mapping a pre-processing point in preset processing path data to a three-dimensional space where a three-dimensional model of the to-be-processed region is located according to the mapping relationship between the cross-sectional radius and the cross-sectional center point of the to-be-processed region, to obtain a processing path point corresponding to the pre-processing point; generating a processing path corresponding to the to-be-processed region according to the processing path point; displaying the processing path corresponding to the to-be-processed region on the three-dimensional model.

6. The laser processing method according to claim 5, wherein The mapping of a pre-processing point in preset processing path data to a three-dimensional space where a three-dimensional model of the to-be-processed region is located according to the mapping relationship between the cross-sectional radius and the cross-sectional center point of the to-be-processed region to obtain a processing path point corresponding to the pre-processing point comprises: generating a cross-sectional center point coordinate according to the coordinates of the pre-processing point in the preset processing path data; According to the cross-section center point coordinate and the mapping relationship between the cross-section radius and the cross-section center point of the region to be processed, a cross-section radius corresponding to the pre-processing point is obtained; According to the cross-section radius, the coordinate of the pre-processing point and the mapping relationship between the two-dimensional plane represented by the pre-set machining path data and the three-dimensional curved surface represented by the three-dimensional model, a machining path point corresponding to the pre-processing point is obtained.

7. The laser processing method according to claim 5, wherein The mapping of the pre-processing point in the pre-set machining path data to the three-dimensional space where the three-dimensional model of the region to be processed is located according to the mapping relationship between the cross-section radius and the cross-section center point of the region to be processed, so as to obtain the machining path point corresponding to the pre-processing point, comprises: calculating the curvature of each point on the three-dimensional model of the region to be processed; When it is determined that the region to be processed is suitable for processing according to the curvature of each point on the three-dimensional model of the region to be processed, the pre-processing point in the pre-set machining path data is mapped to the three-dimensional space where the three-dimensional model of the region to be processed is located according to the mapping relationship between the cross-section radius and the cross-section center point of the region to be processed, so as to obtain the machining path point corresponding to the pre-processing point.

8. The laser processing method according to claim 1, wherein The method further comprises: controlling the range finder in the laser processing device to scan the upper surface of the region to be processed of the object to be processed, so as to obtain the point cloud data of the surface of the region to be processed of the object to be processed.

9. The laser processing method according to claim 1, wherein The method further comprises: generating a machining code according to the machining path; running the machining code to process the region to be processed.

10. The laser processing method according to claim 9, wherein In the process of running the machining code to process the region to be processed, the method further comprises: rotating the object to be processed by a rotating accessory in the laser processing device for processing, wherein the rotating axis corresponding to the rotating accessory is the same as the central symmetry axis corresponding to the region to be processed.

11. A laser processing apparatus, wherein, comprises: a data acquirer configured to acquire point cloud data of a surface of a region to be processed of an object to be processed; the region to be processed of the object to be processed is centrally symmetric; a data fitter configured to perform data fitting on the point cloud data, so as to construct and display a three-dimensional model of the region to be processed based on the fitting result; a path display configured to display a machining path corresponding to the region to be processed on the three-dimensional model.

12. A computer readable medium having stored thereon a computer program, wherein, The computer program is executed by a processor to implement the laser processing method of any one of claims 1 to 10.

13. A laser processing system, wherein, comprises: a processor; and a memory for storing executable instructions of the processor; wherein the processor executes the executable instructions to enable the laser processing device to perform the laser processing method of any one of claims 1 to 10.

14. A laser processing device, comprising: a body; a rotating accessory arranged on the body and configured to clamp an object to be processed and rotate the object to be processed; a range finder arranged on the body and configured to scan the object to be processed to obtain point cloud data of a surface of a region to be processed of the object to be processed, and send the scanned point cloud data to a control module; A control module configured to process the point cloud data according to the laser processing method of any one of claims 1-10.

15. A laser processing system, comprising: A laser processing device, the laser processing device comprising a body, a range finder and a rotating accessory, the rotating accessory and the range finder being arranged on the body; wherein the rotating accessory is configured to hold and rotate a to-be-processed object; and the range finder is configured to scan the to-be-processed object to obtain point cloud data of a surface of a to-be-processed region of the to-be-processed object, and transmit the scanned point cloud data to a terminal device; A terminal device in communication with the laser processing device, the terminal device being configured to process the point cloud data according to the laser processing method of any one of claims 1-10 to obtain a processing path corresponding to the to-be-processed region, and transmit the processing path to the laser processing device to process the to-be-processed region.

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