Laser processing device

WO2025253578A1PCT designated stage Publication Date: 2025-12-11FANUC LTD
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Patent Information

Application Number
PCT/JP2024/020673
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-06-06
Publication Date
2025-12-11

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Abstract

The purpose of the present disclosure is to make it possible to avoid the occurrence of adverse effects such as poor compatibility between a correction amount calculation program and a correction program. This laser processing device is provided with a processing head, a processing control device, a sensor, and a sensor control device. The processing control device, by controlling laser processing in accordance with a processing program, performs the laser processing along a processing path. In a pre-processing stage, the sensor detects detection information about a detection region. The sensor control device calculates a feature amount on the basis of the detection information, and transmits the feature amount to the processing control device. The processing control device calculates a correction amount of an irradiation position of laser light with respect to a workpiece by using the feature amount and a correction amount calculation program. The correction amount calculation program can be edited by a user in the pre-processing stage. Furthermore, the processing control device corrects the processing path in the processing program by using the correction amount and a correction program.
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Citation Information

Patent Citations

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  • Additive manufacturing apparatus, additive manufacturing system, additive manufacturing method, processing program generation program, and learning device

    WO2022180673A1