Laser processing device
WO2025253578A1PCT designated stage Publication Date: 2025-12-11FANUC LTD
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Patent Information
- Application Number
- PCT/JP2024/020673
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-06-06
- Publication Date
- 2025-12-11
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Figure JP2024020673_11122025_PF_FP_ABST
Abstract
The purpose of the present disclosure is to make it possible to avoid the occurrence of adverse effects such as poor compatibility between a correction amount calculation program and a correction program. This laser processing device is provided with a processing head, a processing control device, a sensor, and a sensor control device. The processing control device, by controlling laser processing in accordance with a processing program, performs the laser processing along a processing path. In a pre-processing stage, the sensor detects detection information about a detection region. The sensor control device calculates a feature amount on the basis of the detection information, and transmits the feature amount to the processing control device. The processing control device calculates a correction amount of an irradiation position of laser light with respect to a workpiece by using the feature amount and a correction amount calculation program. The correction amount calculation program can be edited by a user in the pre-processing stage. Furthermore, the processing control device corrects the processing path in the processing program by using the correction amount and a correction program.
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Citation Information
Patent Citations
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