Power converter

Abstract

A power converter (1) comprises: a board (100); a first switching element having a first control terminal (12c) connected to the board (100); a second switching element connected in series with the first switching element and having a second control terminal (13c) connected to the board (100); a first drive circuit (120) which has a first drive IC (12a) and a first gate resistor (12b) mounted on the board (100) and which drives the first switching element via a first control terminal (12c); and a second drive circuit (130) which has a second drive IC (13a) and a second gate resistor (13b) mounted on the board (100) and which drives the second switching element via a second control terminal (13c). On the board (100), at least the first control terminal (12c) is disposed between the first drive IC (12a) and the first gate resistor (12b), or the second control terminal (13c) is disposed between the second drive IC (13a) and the second gate resistor (13b).

Description

Power Converter

[0001] The present disclosure relates to power converters.

[0002] Electrically powered vehicles that use a motor as a drive source, such as electric vehicles or hybrid vehicles, are generally equipped with power converters such as inverters or converters. Specifically, these include an on-board charger that converts a commercial AC power source into DC and charges a high-voltage battery, a step-down converter that steps down the power of the high-voltage battery and supplies it to a 12V load inside the vehicle, and an inverter that converts DC power from the high-voltage battery into AC power for the motor. In recent years, with the spread of electric vehicles and the expansion of vehicle interior space, there has been a demand for smaller and less expensive power converters, and efforts are being made to convert switching elements mounted in power converters into power modules.

[0003] By combining multiple switching elements into one power module, it is possible to reduce the size of the power converter and improve the cooling performance of the switching elements. For example, an inverter typically configured with six IGBT switching elements is generally configured with a 2-in-1 (two switching elements mounted in one module) or 6-in-1 (six switching elements mounted in one module) power module.

[0004] The power module has control terminals to which control signals for controlling each IGBT are input. Each of the control terminals is connected to a substrate that is placed over the power module. Drive circuits for controlling and driving each IGBT are individually placed on the substrate, corresponding to each IGBT. Because the drive circuits for driving the power module are placed in an area of ​​the substrate that overlaps the power module, the area of ​​the substrate on which these drive circuits are placed is large, making it difficult to miniaturize the substrate, and this can make it difficult to miniaturize the power converter.

[0005] A power converter configuration has been disclosed that has a power supply control circuit that collectively controls six isolation transformers that supply power to respective drive circuits that drive six power modules (see, for example, Patent Document 1). In Patent Document 1, the power supplies that are normally controlled individually are collectively controlled, thereby simplifying the power supply control circuit that controls the power supplies.

[0006] Patent No. 5029900

[0007] In the above-mentioned Patent Document 1, the power supply control circuit that controls the power supply is simplified. However, because only the circuit on the primary side (low-voltage side) of the transformer is simplified, there is a problem in that the area of ​​the high-voltage region board on which the transformer and the secondary side of the drive circuit are mounted is not reduced. Furthermore, even if only the primary side is simplified, only the drive circuit is arranged in the area surrounded by the control terminals of the power module, making it difficult to arrange other control circuits, which is a problem in that it does not lead to a reduction in the size of the board. Because the area of ​​the board is not reduced and the board is not made smaller, there is a problem in that the power converter cannot be made smaller and less costly.

[0008] Therefore, an object of the present disclosure is to obtain a power converter that has a smaller substrate and is smaller and less expensive.

[0009] The power converter of the present disclosure comprises a substrate, a first switching element having a first control terminal connected to the substrate, a second switching element connected in series to the first switching element and having a second control terminal connected to the substrate, a first drive circuit having a first drive IC and a first gate resistor mounted on the substrate and driving the first switching element via the first control terminal, and a second drive circuit having a second drive IC and a second gate resistor mounted on the substrate and driving the second switching element via the second control terminal, wherein on the substrate, at least the first control terminal is arranged between the first drive IC and the first gate resistor, or the second control terminal is arranged between the second drive IC and the second gate resistor.

[0010] According to the power converter of the present disclosure, at least the first control terminal is disposed between the first driver IC and the first gate resistor, or the second control terminal is disposed between the second driver IC and the second gate resistor, so that both the driver IC and the gate resistor can be disposed close to the control terminal, and the area of ​​the substrate in the high-voltage region can be reduced, thereby making it possible to miniaturize the substrate.Since the substrate is miniaturized and cost-effective, the power converter can also be miniaturized and cost-effective.

[0011] 9 is a diagram showing an outline of the configuration of a power converter according to embodiment 1. FIG. 10 is a diagram showing an outline of an inverter circuit of the power converter according to embodiment 1. FIG. 11 is a plan view of a substrate of the power converter according to embodiment 1. FIG. 12 is a side view of the power converter according to embodiment 1. FIG. 13 is a plan view of a power converter of a comparative example. FIG. 14 is a side view of the power converter of the comparative example. FIG. 15 is a plan view of a substrate of another power converter according to embodiment 1. FIG. 16 is a plan view of a substrate of another power converter according to embodiment 1. FIG. 17 is a cross-sectional view showing an outline of a main part of another power converter cut at the A-A cross section position of FIG. 9. FIG. 18 is a plan view of a substrate of another power converter according to embodiment 1. FIG. 19 is a diagram showing a circuit of an isolation transformer of the power converter according to embodiment 1. FIG. 19 is a diagram showing a circuit of an isolation transformer of another power converter according to embodiment 1. FIG. 19 is a diagram showing a circuit of an isolation transformer of a power converter of a comparative example. FIG. 10 is a diagram showing an outline of the configuration of a power converter according to embodiment 2. FIG. 19 is a diagram showing an outline of an inverter circuit of the power converter according to embodiment 2. FIG. 19 is a plan view of a substrate of the power converter according to embodiment 2. FIG. 19 is a side view of the power converter according to embodiment 2. FIG. 19 is a plan view of a substrate of another power converter according to embodiment 2. 10 is a plan view of a substrate of another power converter according to embodiment 2. FIG. 11 is a cross-sectional view of a main part of a substrate of another power converter according to embodiment 2. FIG. 12 is a cross-sectional view of a main part of a substrate of another power converter according to embodiment 2.

[0012] Hereinafter, a power converter according to an embodiment of the present disclosure will be described with reference to the drawings. Note that the same or equivalent members and parts in each drawing will be denoted by the same reference numerals.

[0013] Embodiment 1. Fig. 1 is a diagram showing an outline of the configuration of a power converter 1 according to embodiment 1; Fig. 2 is a diagram showing an outline of the inverter circuit of the power converter 1, showing an outline of power modules 4, 5, and 6 that constitute the inverter circuit and their drive circuits; Fig. 3 is a plan view of a substrate 100 of the power converter 1, showing the layout of components mounted on the substrate 100, with only the outlines of the power modules 4, 5, and 6 shown through the substrate 100; Fig. 4 is a side view of the power converter 1, showing the connection relationship between the substrate 100 and the power module 4. In this embodiment, the power converter 1 will be described using an inverter as an example. The inverter converts DC power from a high-voltage battery into AC power for the motor. The power converter 1 is not limited to an inverter.

[0014] <Power Converter 1> An example of the circuit configuration of a power converter 1, which is an inverter, will be described using FIG. 1. The power converter 1 is the part surrounded by a dashed line in FIG. 1. The left side of FIG. 1 is the input stage, and the right side is the output stage. A DC power supply 2 is connected to the input stage of the power converter 1, and a motor 3, which is a load, is connected to the output stage. The DC power supply 2 is a DC storage battery, which is a battery, and outputs a DC voltage. When the power converter 1 is an inverter mounted on an electric vehicle or a hybrid vehicle, a secondary battery such as a nickel-metal hydride battery or a lithium-ion battery is used for the DC power supply 2. The secondary battery outputs a voltage of, for example, 100 V or more.

[0015] In this embodiment, the power converter 1 is a three-phase inverter circuit having six switching elements 12, 13, 14, 15, 16, and 17. The power converter 1 has a smoothing capacitor 11 in its input stage. The smoothing capacitor 11 removes voltage ripple and noise from the input DC voltage. The power converter 1 outputs the output voltage, from which the voltage ripple and noise have been removed, as a three-phase AC voltage from output terminals Vu, Vv, and Vw to the motor 3. The motor 3 is, for example, a motor provided in a generator or an electric motor. The control unit 10 outputs control signals to the switching elements 12 to 17 via control lines 32a, 32b, 32c, 32d, 32e, and 32f, and controls the on / off of the switching elements 12 to 17 with a predetermined dead time therebetween.

[0016] The power converter 1 has a voltage sensor 40 and a discharge resistor 112 at its input stage. The voltage sensor 40 is connected in parallel with the smoothing capacitor 11 and detects the DC voltage from the DC power supply 2. The discharge resistor 112 is connected in parallel with the smoothing capacitor 11 and discharges the power of the smoothing capacitor 11 when the inverter is stopped. The control unit 10 acquires information about the DC voltage detected by the voltage sensor 40 via a signal line 31a.

[0017] The power converter 1 has current sensors 41a, 41b, and 41c in the output stage. The current sensor 41a detects the AC current Iu output from the output terminal Vu to the motor 3. The current sensor 41b detects the AC current Iv output from the output terminal Vv to the motor 3. The current sensor 41c detects the AC current Iw output from the output terminal Vw to the motor 3. The control unit 10 acquires information about the AC current detected by the current sensor 41a via the signal line 31b. The control unit 10 acquires information about the AC current detected by the current sensor 41b via the signal line 31c. The control unit 10 acquires information about the AC current detected by the current sensor 41c via the signal line 31d.

[0018] The power converter 1 has a rotation angle sensor and a motor control device (neither shown). The control unit 10 is connected to the rotation angle sensor and the motor control device via signal lines. The control unit 10 acquires rotation angle information of the motor 3 detected by the rotation angle sensor via the signal line, and acquires a torque command value and a DC voltage command value from the motor control device via the signal line. The control unit 10 controls the switching operations of the switching elements 12 to 17 based on the acquired information.

[0019] The switching elements 12 to 17 are MOSFETs (Metal Oxide Semiconductor Field Effect Transistors), which are self-arc-suppressing semiconductor switching elements made of silicon (Si) and have diodes built in between the source and drain. The switching elements are not limited to MOSFETs, and may be switching elements such as IGBTs (Insulated Gate Bipolar Transistors) with diodes connected in antiparallel. The material of the switching elements is not limited to silicon (Si), and they may be made of wide bandgap semiconductor materials such as silicon carbide (SiC) or gallium nitride (GaN), or diamond-based semiconductor materials.

[0020] The power modules 4, 5, and 6 and their drive circuits will be outlined with reference to Fig. 2. The power converter 1 includes a substrate 100, a switching element 12 that is a first switching element and has a control terminal 12c that is a first control terminal connected to the substrate 100, a switching element 13 that is a second switching element and is connected in series to the first switching element and has a control terminal 13c that is a second control terminal connected to the substrate 100, a first drive circuit 120 that has a drive IC 12a that is a first drive IC and a gate resistor 12b that is a first gate resistor mounted on the substrate 100 and drives the first switching element via the first control terminal, and a second drive circuit 130 that has a drive IC 13a that is a second drive IC and a gate resistor 13b that is a second gate resistor mounted on the substrate 100 and drives the second switching element via the second control terminal.

[0021] The power converter 1 further includes: a switching element 14 that is a third switching element having a control terminal 14c that is a third control terminal connected to the substrate 100; a switching element 15 that is a fourth switching element connected in series to the third switching element and having a control terminal 15c that is a fourth control terminal connected to the substrate 100; a third drive circuit 140 that has a drive IC 14a that is a third drive IC and a gate resistor 14b that is a third gate resistor mounted on the substrate 100 and drives the third switching element via the third control terminal; and a fourth drive circuit 150 that has a drive IC 15a that is a fourth drive IC and a gate resistor 15b that is a fourth gate resistor mounted on the substrate 100 and drives the fourth switching element via the fourth control terminal.

[0022] The power converter 1 further includes a switching element 16 that is a fifth switching element and has a control terminal 16c that is a fifth control terminal connected to the substrate 100, a switching element 17 that is a sixth switching element and is connected in series to the fifth switching element and has a control terminal 17c that is a sixth control terminal connected to the substrate 100, a fifth drive circuit 160 that has a drive IC 16a that is a fifth drive IC and a gate resistor 16b that is a fifth gate resistor mounted on the substrate 100 and drives the fifth switching element via the fifth control terminal, and a sixth drive circuit 170 that has a drive IC 17a that is a sixth drive IC and a gate resistor 17b that is a sixth gate resistor mounted on the substrate 100 and drives the sixth switching element via the sixth control terminal.

[0023] In this embodiment, as shown in FIG. 1 , a three-phase inverter is formed in which different phases of AC are output from each of the series-connected portions of the first switching element and the second switching element, the series-connected portion of the third switching element and the fourth switching element, and the series-connected portion of the fifth switching element and the sixth switching element. The configuration of the power converter 1 is not limited to this. In a configuration in which the power converter 1 has four switching elements 12 to 15, the opposite sides of the series-connected first and second switching elements are connected to the opposite sides of the series-connected third and fourth switching elements, forming a full bridge. In this way, the power converter 1 may have a half-bridge or full-bridge configuration instead of a three-phase inverter, and the power module described below is not limited to a 2-in-1 configuration but may also have a 6-in-1 or 1-in-1 configuration.

[0024] One or more power modules having multiple side surfaces surrounding one or more or all of the first, second, third, fourth, fifth, and sixth switching elements are provided. In this embodiment, as shown in FIG. 2 , three power modules 4, 5, and 6 are provided. Power module 4 has switching elements 12 and 13 and forms a U-phase arm. Power module 5 has switching elements 14 and 15 and forms a V-phase arm. Power module 6 has switching elements 16 and 17 and forms a W-phase arm. The number of power modules is not limited to three, and a configuration in which one power module accommodating all of the switching elements is provided is also acceptable.

[0025] As shown in FIG. 3 , each of the power modules 4, 5, and 6 has four side surfaces. The first control terminal is located on one side surface, the first side surface 4d, and the second control terminal is located on the side surface opposite the first side surface, the second side surface 4e. Each of the power modules 4, 5, and 6 has two control terminals 12c to 17c. One control terminal is connected to the gate of the switching element, and the other control terminal is connected to the source of the switching element. Directions are defined below. In the figure, the direction toward each other between the first side surface 4d and the second side surface 4e is the Y direction. The direction perpendicular to the Y direction and perpendicular to the center line of the surrounding side surfaces is the X direction. The direction perpendicular to the X and Y directions is the Z direction. The direction toward each other between the first side surface 4d and the second side surface 4e is the direction from the first side surface 4d to the second side surface 4e and the direction from the second side surface 4e to the first side surface 4d. The center line of the surrounding side surfaces is a line in the Z direction.

[0026] As shown in FIG. 2 , the power module 4 has two control terminals 12d for detecting the temperature or current of the switching element 12, two control terminals 13d for detecting the temperature or current of the switching element 13, and main circuit terminals 4a, 4b, and 4c through which a large current flows. The control terminals 12c, 12d, 13c, and 13d are connected to the circuit board 100 by soldering, and the main circuit terminals 4a, 4b, and 4c are connected to bus bars or the like by, for example, welding. The power module 5 has two control terminals 14d for detecting the temperature or current of the switching element 14, two control terminals 15d for detecting the temperature or current of the switching element 15, and main circuit terminals 5a, 5b, and 5c through which a large current flows. The control terminals 14c, 14d, 15c, and 15d are connected to the circuit board 100 by soldering, and the main circuit terminals 5a, 5b, and 5c are connected to bus bars or the like by, for example, welding. The power module 6 has two control terminals 16d for detecting the temperature or current of the switching element 16, two control terminals 17d for detecting the temperature or current of the switching element 17, and main circuit terminals 6a, 6b, and 6c through which a large current flows. The control terminals 16c, 16d, 17c, and 17d are connected to the substrate 100 by soldering, and the main circuit terminals 6a, 6b, and 6c are connected to bus bars or the like by, for example, welding. The main circuit terminals 4a, 4b, 5a, 5b, 6a, and 6b are connected to the DC power supply 2, and the main circuit terminals 4c, 5c, and 6c are connected to the motor 3.

[0027] A control unit 10 is mounted on the substrate 100. The control unit 10 includes drive circuits for controlling and driving the switching elements 12 to 17, namely, a first drive circuit 120, a second drive circuit 130, a third drive circuit 140, a fourth drive circuit 150, a fifth drive circuit 160, and a sixth drive circuit 170. The drive ICs 12a to 17a insulate the low-voltage system, such as a microcomputer, from the high-voltage system, such as the switching elements 12 to 17, that constitute the inverter circuit, and drive the high-voltage system, such as the switching elements 12 to 17, based on drive signals from the low-voltage system, such as the microcomputer. The substrate 100 is, for example, a glass epoxy substrate. As shown in FIG. 3, the substrate 100 is provided with a plurality of screw holes 100a. An insulating distance is provided around the screw holes 100a, where no components are placed. The insulating distance is indicated by the hatched area around the screw holes 100a in the figure. The substrate 100 is fixed to, for example, a housing that houses the power modules 4, 5, and 6 using the screw holes 100a.

[0028] 3, the first drive circuit 120 has an isolation transformer 12e which is a first isolation transformer, the second drive circuit 130 has an isolation transformer 13e which is a second isolation transformer, the third drive circuit 140 has an isolation transformer 14e which is a third isolation transformer, the fourth drive circuit 150 has an isolation transformer 15e which is a fourth isolation transformer, the fifth drive circuit 160 has an isolation transformer 16e which is a fifth isolation transformer, and the sixth drive circuit 170 has an isolation transformer 17e which is a sixth isolation transformer. Each of the isolation transformers 12e to 17e generates an isolated power supply and supplies the isolated power supply to the drive ICs 12a to 17a.

[0029] <Comparative Example> Prior to describing the arrangement of the control terminals, which is a key feature of the present disclosure, the configuration of the comparative example will be described with reference to Figures 5 and 6. Figure 5 is a plan view of a board 100 of a power converter 1 of the comparative example, showing the layout of components provided on the board 100, with the power modules 4, 5, and 6 shown only in outline through the board 100, etc. Figure 6 is a side view of the power converter 1 of the comparative example, showing the connection relationship between the board 100 and the power module 4. The area in Figure 5 where no components are mounted is an area where circuits other than the drive circuit, such as a microcomputer, control circuit, control power supply, sensor circuit, and discharge resistor, which are not shown, are mounted. The same applies to the area in Figure 3 where no components are mounted, which will be described later.

[0030] As shown in FIG. 5, the substrate 100 is mounted with driver ICs 12a-17a, gate resistors 12b-17b, and isolation transformers 12e-17e, which constitute the driver circuit. The substrate 100 has a primary component mounting area 103, where low-voltage components are mounted, and a secondary component mounting area 104, which is connected to high-voltage components. The primary component mounting area 103 is surrounded by a dashed line. The secondary component mounting area 104 is surrounded by a dashed line. To insulate the low-voltage and high-voltage components, the primary component mounting area 103 and the secondary component mounting area 104 are separated by driver ICs 12a-17a and isolation transformers 12e-17e. As shown in FIG. 6, the substrate 100 is positioned on one side of the power modules 4, 5, and 6 in the Z direction. As shown in FIG. 5, control terminals 12c-17c and control terminals 12d-17d are connected to the substrate 100. In the area sandwiched between the control terminals 12c to 17c and the control terminals 12d to 17d, the driver ICs 12a to 17a, the gate resistors 12b to 17b, and the isolation transformers 12e to 17e are mounted.

[0031] Two layout constraints on the board 100 will be described. The first constraint is that the areas indicated by diagonal lines around the control terminals 12c to 17c and the control terminals 12d to 17d are areas where component placement is prohibited due to the mounting process. The second constraint is that gate resistors 12b to 17b must be placed immediately adjacent to the control terminals 12c to 17c to prevent malfunction of the switching elements. Considering these constraints, it is necessary to secure an area of ​​the order shown in FIG. 5 for the primary-side component mounting area 103. Because the driver ICs 12a to 17a and the isolation transformers 12e to 17e overlap the primary-side component mounting area 103, the power modules 4, 5, and 6 are positioned with a certain amount of spacing in the X direction to secure the necessary area for the primary-side component mounting area 103. Therefore, in the comparative example, there are many dead spaces 101 and 102, which are areas where no components are mounted, on the board 100, making the board 100 larger than necessary.

[0032] 3 and 4, the arrangement of the control terminals, which is a main part of the present disclosure, will be described. On the substrate 100, at least the first control terminal is arranged between the first driving IC and the first gate resistor, or the second control terminal is arranged between the second driving IC and the second gate resistor, or the third control terminal is arranged between the third driving IC and the third gate resistor, or the fourth control terminal is arranged between the fourth driving IC and the fourth gate resistor, or the fifth control terminal is arranged between the fifth driving IC and the fifth gate resistor, or the sixth control terminal is arranged between the sixth driving IC and the sixth gate resistor.

[0033] In this embodiment, control terminal 12c is arranged between driver IC 12a and gate resistor 12b, control terminal 13c is arranged between driver IC 13a and gate resistor 13b, control terminal 14c is arranged between driver IC 14a and gate resistor 14b, control terminal 15c is arranged between driver IC 15a and gate resistor 15b, control terminal 16c is arranged between driver IC 16a and gate resistor 16b, and control terminal 17c is arranged between driver IC 17a and gate resistor 17b. The configuration is not limited to one in which all control terminals 12c to 17c are arranged in this manner, and any one or more control terminals may be arranged in this manner.

[0034] 3 shows a configuration in which six switching elements 12 to 17 are provided in the power modules 4, 5, and 6, but this is not limited thereto. When the power converter 1 has four switching elements 12 to 15, the configuration is such that, on the substrate 100, at least the first control terminal is disposed between the first driving IC and the first gate resistor, or the second control terminal is disposed between the second driving IC and the second gate resistor, or the third control terminal is disposed between the third driving IC and the third gate resistor, or the fourth control terminal is disposed between the fourth driving IC and the fourth gate resistor. When the power converter 1 has two switching elements 12 and 13, the configuration is such that, on the substrate 100, at least the first control terminal is disposed between the first driving IC and the first gate resistor, or the second control terminal is disposed between the second driving IC and the second gate resistor.

[0035] In the board layout shown in FIG. 3 , gate resistors 12b–17b are mounted in the dead space 101 shown in FIG. 5 for the comparative example, eliminating the dead space where components are not mounted, allowing components to be mounted efficiently on the board 100. This layout allows the driver ICs 12a–17a and isolation transformers 12e–17e to be closer to the control terminals 12c–17c and 12d–17d connected to them, thereby ensuring a larger primary-side component mounting area 103. By ensuring the primary-side component mounting area 103, the spacing between the power modules 4, 5, and 6 can be narrowed compared to FIG. 5 , significantly reducing the dead space 102 shown in FIG. 5 , allowing components to be mounted efficiently on the board 100. Because components can be mounted efficiently on the board 100, the board 100 can be made smaller by the board reduction area 105 in FIG. 3 compared to FIG. 5 . The board reduction area 105 is the area surrounded by a dashed line on the left side of the board 100.

[0036] By arranging the control terminal between the driver IC and the gate resistor in this way, both the driver IC and the gate resistor can be arranged close to the control terminal, and the area of ​​dead space on the substrate 100 in the secondary side region 104, which is a high-voltage region, can be reduced, thereby making it possible to miniaturize the substrate 100. Since the substrate 100 is made smaller and less expensive, it is possible to make the power converter 1 smaller and less expensive. Note that while the substrate 100 can be made smaller by arranging at least one control terminal between the driver IC and the gate resistor, the effect of miniaturizing the substrate 100 is greatest when all of the control terminals are arranged between the driver IC and the gate resistor.

[0037] <Modification 1> A modification of the configuration of the power converter 1 will be described with reference to Fig. 7. Fig. 7 is a plan view of the substrate 100 of another power converter 1 according to embodiment 1, showing the layout of components provided on the substrate 100, and illustrating only the outlines of the power modules 4, 5, and 6 through the substrate 100, etc. In the configuration of modification 1, the first control terminal, the third control terminal, and the fifth control terminal are arranged side by side in the X direction along the first side surface 4d, the second control terminal, the fourth control terminal, and the sixth control terminal are arranged side by side in the X direction along the second side surface 4e, and the first drive circuit, the second drive circuit, the third drive circuit, the fourth drive circuit, the fifth drive circuit, and the sixth drive circuit are arranged on the other side in the X direction of the control terminal that is arranged furthest to one side in the X direction among the first control terminal, the second control terminal, the third control terminal, the fourth control terminal, the fifth control terminal, and the sixth control terminal.

[0038] 7, the first drive circuit 120, the second drive circuit 130, the third drive circuit 140, the fourth drive circuit 150, the fifth drive circuit 160, and the sixth drive circuit 170 are arranged on the other side in the X direction of the control terminal 13d arranged closest to one side in the X direction. In the figure, the direction indicated by the arrow X is the other side in the X direction, and the direction opposite to the direction indicated by the arrow X is the one side in the X direction. Furthermore, the direction indicated by the arrow Y is the other side in the Y direction, and the direction opposite to the direction indicated by the arrow Y is the one side in the Y direction. Furthermore, the direction indicated by the arrow Z is the one side in the Z direction, and the direction opposite to the direction indicated by the arrow Z is the other side in the Z direction. With this configuration, the first drive circuit 120, the second drive circuit 130, the third drive circuit 140, the fourth drive circuit 150, the fifth drive circuit 160, and the sixth drive circuit 170 are not arranged on one side in the X direction of the control terminal 13d arranged furthest on one side in the X direction, so that the secondary side area 104 can be reduced. Since the secondary side area 104 is reduced, the substrate reduction area 105 is expanded, so that the substrate 100 can be further reduced in size. Since the substrate 100 is further reduced in size and cost, the power converter 1 can be further reduced in size and cost.

[0039] <Modification 2> Another modification of the configuration of the power converter 1 will be described with reference to Fig. 8. Fig. 8 is a plan view of the substrate 100 of another power converter 1 according to embodiment 1, showing the layout of components provided on the substrate 100, with only the outlines of the power modules 4, 5, and 6 shown through the substrate 100 etc. In the configuration of variant example 2, the first control terminal, the third control terminal, and the fifth control terminal are arranged side by side in the X direction along the first side surface 4d, the second control terminal, the fourth control terminal, and the sixth control terminal are arranged side by side in the X direction along the second side surface 4e, and the first drive circuit, the second drive circuit, the third drive circuit, the fourth drive circuit, the fifth drive circuit, and the sixth drive circuit are arranged on the other side in the X direction of the control terminal that is arranged furthest in the X direction among the first control terminal, the second control terminal, the third control terminal, the fourth control terminal, the fifth control terminal, and the sixth control terminal that is arranged furthest in the X direction.

[0040] 8 , the first drive circuit 120, the second drive circuit 130, the third drive circuit 140, the fourth drive circuit 150, the fifth drive circuit 160, and the sixth drive circuit 170 are arranged on the other side in the X direction of the control terminal 13d arranged furthest on the one side in the X direction and on one side in the X direction of the control terminal 16d arranged furthest on the other side in the X direction. With this configuration, the first drive circuit 120, the second drive circuit 130, the third drive circuit 140, the fourth drive circuit 150, the fifth drive circuit 160, and the sixth drive circuit 170 are arranged on the other side in the X direction of the control terminal 13d arranged furthest on the one side in the X direction and on one side in the X direction of the control terminal 16d arranged furthest on the other side in the X direction, thereby significantly reducing the secondary-side area 104. Because the secondary-side area 104 is significantly reduced, the substrate reduction area 105 is further expanded, and the substrate 100 can be further miniaturized. Since the substrate 100 is further reduced in size and cost, the power converter 1 can be further reduced in size and cost.

[0041] FIG. 8 also shows the low-voltage-high-voltage insulation distance 107, which is the insulation distance between the low voltage and high voltage. In the configuration shown in FIG. 3, the area to the right of the isolation transformer 16e was constrained by the insulation distance between the low voltage and high voltage, so no area was available for arranging low-voltage circuits. However, in the configuration shown in FIG. 8, all drive circuits are arranged inward in the X direction from all control terminals, thereby reducing the secondary side area 104 and ensuring a larger area to the right of the isolation transformer 16e for arranging low-voltage circuits. By using the secured area as a control circuit mounting area 106 for arranging low-voltage circuits, dead space on the board 100 can be reduced. Reducing the dead space on the board 100 allows for the board 100 to be made smaller and less expensive, thereby enabling the power converter 1 to be made smaller and less expensive. In this way, the area to the right of the board 100 may be the board reduction area 105 or the control circuit mounting area 106.

[0042] <Modification 3> Another modification of the configuration of the power converter 1 will be described with reference to FIGS. 9 and 10 . FIG. 9 is a plan view of a substrate 100 of another power converter 1 according to embodiment 1, showing the layout of components provided on the substrate 100, with the power modules 4, 5, and 6 shown only in outline through the substrate 100, etc. FIG. 10 is a cross-sectional view showing an outline of a main portion of the other power converter 1 taken along the A-A cross section in FIG. 9 . In the configuration of modification 3, a resin member 108 for fixing the substrate 100 is provided in an area surrounded by the first control terminal, the second control terminal, the third control terminal, the fourth control terminal, the fifth control terminal, and the sixth control terminal, and the substrate 100 abuts against the resin member 108. In this embodiment, as shown in FIG. 10 , the substrate 100 is fixed to the resin member 108 with an adhesive 109.

[0043] This configuration eliminates the screw holes 100a provided at the screw-elimination locations 110 shown by dashed lines in FIG. 9 , thereby narrowing the spacing between the first drive circuit 120, the second drive circuit 130, the third drive circuit 140, the fourth drive circuit 150, the fifth drive circuit 160, and the sixth drive circuit 170 in the X direction compared to the configuration shown in FIG. 3 . Because the spacing between the first drive circuit 120, the second drive circuit 130, the third drive circuit 140, the fourth drive circuit 150, the fifth drive circuit 160, and the sixth drive circuit 170 in the X direction is narrowed, the board reduction area 105 can be further expanded, thereby reducing the size and cost of the board 100. Because the board 100 can be reduced in size and cost, the power converter 1 can be reduced in size and cost.

[0044] Because the screw holes 100a are typically required to secure the substrate 100, it is necessary to eliminate the screw holes 100a while ensuring the fixability of the substrate 100. Therefore, in this embodiment, a resin member 108 is provided in the screw hole elimination location 110 as a fixing portion for securing the substrate 100. With this configuration, compared to before the screw holes were eliminated, components can be mounted on the side of the substrate 100 opposite the side where the power modules 4, 5, and 6 are mounted, and pattern wiring on the inner layers of the substrate 100 is possible. Therefore, the primary-side component mounting area 103 is sufficiently secured, and the spacing between the first drive circuit 120, the second drive circuit 130, the third drive circuit 140, the fourth drive circuit 150, the fifth drive circuit 160, and the sixth drive circuit 170 in the X direction can be further narrowed. Since the spacing between these drive circuits in the X direction is further narrowed, the substrate reduction area 105 can be further expanded, thereby further reducing the size and cost of the substrate 100. Since the substrate 100 can be further reduced in size and cost, the power converter 1 can be further reduced in size and cost.

[0045] The resin member 108 extends in the direction of the screw holes 100 a, and is fixed to the housing by screws passing through the screw holes 100 a. In this embodiment, the resin member 108 also serves as a guide for inserting the control terminal 17 d into a through-hole provided in the substrate 100, as shown in FIG.

[0046] <Modification 4> Another modification of the configuration of the power converter 1 will be described using Figs. 11 to 13 and a comparative example shown in Fig. 14. Fig. 11 is a plan view of a substrate 100 of another power converter 1 according to embodiment 1, showing the layout of components provided on the substrate 100, with only the outlines of power modules 4, 5, and 6 shown see-through through the substrate 100, Fig. 12 is a diagram showing the circuit of an isolation transformer of the power converter 1 according to embodiment 1, Fig. 13 is a diagram showing the circuit of an isolation transformer of another power converter 1 according to embodiment 1, and Fig. 14 is a diagram showing the circuit of an isolation transformer of a power converter 1 of a comparative example. In the configuration of modification 4, the second isolation transformer, the fourth isolation transformer, and the sixth isolation transformer form a first coupling transformer 19e, which is a single isolation transformer, and the first isolation transformer, the third isolation transformer, and the fifth isolation transformer form a second coupling transformer 18e, which is a single isolation transformer. In the configuration shown in FIG. 11, both the first coupling transformer 19e and the second coupling transformer 18e are formed, but this is not limiting, and a configuration in which only one of the coupling transformers is formed may also be used.

[0047] With this configuration, three isolation transformers are replaced with one coupling transformer, thereby reducing the area occupied by the isolation transformers on the board 100. Because the area occupied by the isolation transformers on the board 100 is reduced, the secondary-side area 104 to the right of the power module 6 can be reduced, thereby ensuring a board-reduction area 105 at the right end of the board 100. Furthermore, by replacing three isolation transformers with one coupling transformer, the primary-side circuit of the isolation transformer can also be simplified, thereby reducing the primary-side component mounting area 103. Therefore, compared to FIG. 3 , the power module 4 can be moved to the right, thereby expanding the board-reduction area 105. Because the board-reduction area 105 is expanded, the board 100 can be made smaller and less expensive. The board 100 can be made smaller and less expensive, thereby reducing the power converter 1 in size and cost.

[0048] The isolation transformer shown in Figure 12 is composed of a primary winding Np, a feedback winding FB, and a secondary winding Ns1, and outputs one secondary voltage for one primary voltage input. The isolation transformer shown in Figure 12 is a general circuit diagram of each of the isolation transformers shown in Figures 3, 7, 8, and 9. The isolation transformer shown in Figure 13 is composed of a primary winding Np, a feedback winding FB, and secondary windings Ns1, Ns2, and Ns3, and outputs three secondary voltages for one primary voltage input. It is a general circuit diagram of each of the coupling transformers shown in Figure 11. The isolation transformer of the comparative example shown in Figure 14 is composed of a primary winding Np, a feedback winding FB, and secondary windings Ns1, Ns2, Ns3, Ns4, Ns5, and Ns6, and outputs six secondary voltages for one primary voltage input. This is a general circuit diagram when a single isolation transformer is used to configure an inverter drive power supply.

[0049] The more isolation transformers are shared, the smaller the area and volume of components are, which is advantageous for miniaturizing circuit boards and devices. However, sharing multiple isolation transformers increases the impact on inverter operation when a circuit failure occurs. In on-board power converters, safely stopping the vehicle when a component in the circuit fails is an essential requirement. In the isolation transformer configuration shown in Figure 14, if the primary winding of the isolation transformer fails, the behavior of all secondary windings becomes undefined, making it impossible to control the inverter output. As shown in Figure 1, the inverter output is connected to the motor, so if the inverter output cannot be controlled, the motor operation cannot be controlled. If the motor operation cannot be controlled, the vehicle cannot be safely stopped, resulting in a loss of stability. In the isolation transformer configurations shown in Figures 12 and 13, the motor can be stopped and safely maintained by constantly turning on the lower switching elements 13, 15, and 17 or the upper switching elements 12, 14, and 16 in Figure 1, thereby ensuring vehicle stability.

[0050] As described above, the power converter 1 according to the first embodiment comprises the substrate 100, a first switching element having a first control terminal connected to the substrate 100, a second switching element connected in series to the first switching element and having a second control terminal connected to the substrate 100, a first drive circuit 120 having a first drive IC and a first gate resistor mounted on the substrate 100 and driving the first switching element via the first control terminal, and a second drive circuit 130 having a second drive IC and a second gate resistor mounted on the substrate 100 and driving the second switching element via the second control terminal. In the substrate 100, at least the first control terminal is disposed between the first drive IC and the first gate resistor, or the second control terminal is disposed between the second drive IC and the second gate resistor. Therefore, both the drive IC and the gate resistor can be disposed close to the control terminal, and the area of ​​the dead space of the substrate 100 in the secondary side region 104, which is a high-voltage region, can be reduced, thereby making it possible to miniaturize the substrate 100. Since the substrate 100 is made smaller and less expensive, the power converter 1 can be made smaller and less expensive.

[0051] a third switching element having a third control terminal connected to the substrate 100; a fourth switching element connected in series to the third switching element and having a fourth control terminal connected to the substrate 100; a third drive circuit having a third drive IC and a third gate resistor mounted on the substrate 100 and driving the third switching element via the third control terminal; and a fourth drive circuit having a fourth drive IC and a fourth gate resistor mounted on the substrate 100 and driving the fourth switching element via the fourth control terminal, and the first switching element, the second switching element, the third switching element and the fourth switching element are connected. When the first and second control terminals are connected to the substrate 100 to form a full bridge, and at least the first control terminal is disposed between the first driving IC and the first gate resistor, or the second control terminal is disposed between the second driving IC and the second gate resistor, or the third control terminal is disposed between the third driving IC and the third gate resistor, or the fourth control terminal is disposed between the fourth driving IC and the fourth gate resistor, both the driving IC and the gate resistor can be disposed close to the control terminal, and the area of ​​dead space in the secondary side region 104, which is a high-voltage region, of the substrate 100 can be reduced, thereby making it possible to miniaturize the substrate 100. Since the substrate 100 is miniaturized and cost-effective, the power converter 1 can also be made smaller and more cost-effective.

[0052] a fifth switching element having a fifth control terminal connected to the substrate; a sixth switching element connected in series to the fifth switching element and having a sixth control terminal connected to the substrate (100); a fifth drive circuit having a fifth drive IC and a fifth gate resistor mounted on the substrate (100) and driving the fifth switching element via the fifth control terminal; and a sixth drive circuit having a sixth drive IC and a sixth gate resistor mounted on the substrate (100) and driving the sixth switching element via the sixth control terminal, where a three-phase inverter is formed in which alternating currents of different phases are output from the respective serially connected parts of these switching elements, and in the substrate (100), at least the first control terminal is connected to the first drive IC and the first gate resistor, or the second control terminal is located between the second driver IC and the second gate resistor, or the third control terminal is located between the third driver IC and the third gate resistor, or the fourth control terminal is located between the fourth driver IC and the fourth gate resistor, or the fifth control terminal is located between the fifth driver IC and the fifth gate resistor, or the sixth control terminal is located between the sixth driver IC and the sixth gate resistor, both the driver IC and the gate resistor can be located close to the control terminal, and the area of ​​dead space on the substrate 100 in the secondary side region 104, which is a high-voltage region, can be reduced, thereby making it possible to miniaturize the substrate 100. Since the substrate 100 is miniaturized and cost-effective, the power converter 1 can be made smaller and more cost-effective.

[0053] One or more power modules having a plurality of side surfaces surrounding one or more or all of the first switching element, the second switching element, the third switching element, the fourth switching element, the fifth switching element, and the sixth switching element are provided, the first control terminal is arranged on the first side surface 4d, the second control terminal is arranged on the second side surface 4e opposite to the first side surface 4d, the first control terminal, the third control terminal, and the fifth control terminal are arranged side by side in the X direction along the first side surface 4d, the second control terminal, the fourth control terminal, and the sixth control terminal are arranged side by side in the X direction along the second side surface 4e, When the first drive circuit 120, the second drive circuit 130, the third drive circuit 140, the fourth drive circuit 150, the fifth drive circuit 160, and the sixth drive circuit 170 are arranged on the other side of the X-direction from the control terminal furthest to the one side in the X-direction among the second control terminal, the third control terminal, the fourth control terminal, the fifth control terminal, and the sixth control terminal, the first drive circuit 120, the second drive circuit 130, the third drive circuit 140, the fourth drive circuit 150, the fifth drive circuit 160, and the sixth drive circuit 170 are not arranged on the one side of the X-direction from the control terminal 13d furthest to the one side in the X-direction, thereby reducing the secondary-side region 104. Since the secondary-side region 104 is reduced, the substrate reduction region 105 is expanded, thereby enabling the miniaturization of the substrate 100. Since the substrate 100 is reduced in size and cost, the power converter 1 can be reduced in size and cost.

[0054] When the first drive circuit 120, the second drive circuit 130, the third drive circuit 140, the fourth drive circuit 150, the fifth drive circuit 160, and the sixth drive circuit 170 are arranged on the other side in the X direction of the control terminal that is furthest in the X direction among the first control terminal, the second control terminal, the third control terminal, the fourth control terminal, the fifth control terminal, and the sixth control terminal, and on one side in the X direction of the control terminal that is furthest in the X direction among the first control terminal, the second control terminal, the third control terminal, the fourth control terminal, the fifth control terminal, and the sixth control terminal, the secondary side area 104 can be significantly reduced. Since the secondary side area 104 is significantly reduced, the substrate reduction area 105 is further expanded, and the substrate 100 can be further reduced in size. Since the substrate 100 is further reduced in size and cost, the power converter 1 can be further reduced in size and cost.

[0055] A resin member 108 for fixing the substrate 100 is provided in an area surrounded by the first control terminal, the second control terminal, the third control terminal, the fourth control terminal, the fifth control terminal, and the sixth control terminal, and when the substrate 100 abuts against the resin member 108, the screw holes 100a provided in the screw elimination locations 110 can be eliminated, thereby narrowing the spacing in the X direction between the first drive circuit 120, the second drive circuit 130, the third drive circuit 140, the fourth drive circuit 150, the fifth drive circuit 160, and the sixth drive circuit 170. Since the spacing in the X direction between the first drive circuit 120, the second drive circuit 130, the third drive circuit 140, the fourth drive circuit 150, the fifth drive circuit 160, and the sixth drive circuit 170 is narrowed, the substrate reduction area 105 can be further expanded, thereby enabling the substrate 100 to be made smaller and less expensive. Since the substrate 100 can be made smaller and less expensive, the power converter 1 can be made smaller and less expensive.

[0056] When the first coupling transformer 19e, which is a single isolation transformer, is formed from the second isolation transformer, the fourth isolation transformer, and the sixth isolation transformer, three isolation transformers are replaced with one coupling transformer, thereby reducing the area occupied by the isolation transformer on the substrate 100. Because the area occupied by the isolation transformer on the substrate 100 is reduced, the secondary side region 104 on the right side of the power module 6 can be reduced, thereby ensuring a reduced substrate area 105 on the substrate 100. Furthermore, by replacing three isolation transformers with one coupling transformer, the primary side circuit of the isolation transformer can be simplified, thereby reducing the primary side component mounting region 103, thereby further expanding the reduced substrate area 105. Because the reduced substrate area 105 is expanded, the substrate 100 can be made smaller and less expensive. The reduced size and cost of the substrate 100 can be reduced, thereby reducing the size and cost of the power converter 1. Furthermore, since the behavior of all secondary windings is not unstable, the motor can be stopped by keeping the lower switching elements 13, 15, and 17 or the upper switching elements 12, 14, and 16 always on, thereby ensuring the stability of the automobile.

[0057] When the first, third, and fifth isolation transformers are combined to form a single isolation transformer, the second coupling transformer 18e, replaces three isolation transformers with a single coupling transformer, thereby reducing the area occupied by the isolation transformer on the board 100. Because the area occupied by the isolation transformer on the board 100 is reduced, the secondary-side region 104 on the right side of the power module 6 can be reduced, thereby ensuring a reduced board area 105 on the board 100. Furthermore, replacing three isolation transformers with a single coupling transformer simplifies the circuit on the primary side of the isolation transformer, thereby reducing the primary-side component mounting region 103 and further expanding the reduced board area 105. The expanded reduced board area 105 allows for a reduction in the size and cost of the board 100. The reduction in size and cost of the board 100 allows for a reduction in size and cost of the power converter 1. Furthermore, since the behavior of all secondary windings is not unstable, the motor can be stopped by keeping the lower switching elements 13, 15, and 17 or the upper switching elements 12, 14, and 16 always on, thereby ensuring the stability of the automobile.

[0058] Embodiment 2. A power converter 1 according to embodiment 2 will now be described. Fig. 15 is a diagram showing an outline of the configuration of a power converter 1 according to embodiment 2, Fig. 16 is a diagram showing an outline of the inverter circuit of power converter 1, and is a diagram showing an outline of power modules 4, 5, 6, 7, 8, and 9 that constitute the inverter circuit and their drive circuits, Fig. 17 is a plan view of a substrate 100 of power converter 1, showing the layout of components provided on substrate 100, and a view showing only the outlines of power modules 4 to 9 through substrate 100, and Fig. 18 is a side view of power converter 1, showing the connection relationship between substrate 100 and power module 4. The power converter 1 according to embodiment 2 has a configuration in which switching elements 20, 21, 22, 23, 24, and 25 are added to the configuration of embodiment 1.

[0059] 15 , the first switching element, the second switching element, the third switching element, the fourth switching element, the fifth switching element, and the sixth switching element are each configured by connecting a plurality of switching elements in parallel. In this embodiment, as shown in FIG. 15 , the first switching element is configured by connecting switching element 12 and switching element 20 in parallel, the second switching element is configured by connecting switching element 13 and switching element 21 in parallel, the third switching element is configured by connecting switching element 14 and switching element 22 in parallel, the fourth switching element is configured by connecting switching element 15 and switching element 23 in parallel, the fifth switching element is configured by connecting switching element 16 and switching element 24 in parallel, and the sixth switching element is configured by connecting switching element 17 and switching element 25 in parallel. The number of switching elements connected in parallel is not limited to this.

[0060] In recent years, electric vehicles have become increasingly more powerful and functional, and at the same time, there is a demand for higher power and functionality in the on-board power converter 1. By connecting multiple switching elements in parallel in this way, it is possible to realize a power converter 1 with higher power than that of the first embodiment. The other configurations are the same as those shown in FIG. 1 , and therefore description thereof will be omitted.

[0061] Because switching elements 20 to 25 are added, power modules 7, 8, and 9 are provided, each having multiple side surfaces surrounding these switching elements. As shown in FIG. 16 , power module 7 has switching elements 20 and 21, forming a U-phase arm. Power module 8 has switching elements 22 and 23, forming a V-phase arm. Power module 9 has switching elements 24 and 25, forming a W-phase arm. Each of the multiple switching elements 12 to 17 and 20 to 25 included in the first switching element, second switching element, third switching element, fourth switching element, fifth switching element, and sixth switching element has a control terminal connected to the substrate 100. Each of power modules 7, 8, and 9 has two control terminals 20c to 25c, one control terminal connected to the gate of the switching element and the other control terminal connected to the source of the switching element.

[0062] Power module 7 has two control terminals 20d for detecting the temperature or current of switching element 20, two control terminals 21d for detecting the temperature or current of switching element 21, and main circuit terminals 7a, 7b, and 7c through which a large current flows. Power module 8 has two control terminals 22d for detecting the temperature or current of switching element 22, two control terminals 23d for detecting the temperature or current of switching element 23, and main circuit terminals 8a, 8b, and 8c through which a large current flows. Power module 9 has two control terminals 24d for detecting the temperature or current of switching element 24, two control terminals 25d for detecting the temperature or current of switching element 25, and main circuit terminals 9a, 9b, and 9c through which a large current flows.

[0063] The number of driver ICs has not increased compared to that shown in FIG. 2. One driver IC drives two switching elements. Specifically, driver IC 12a drives switching elements 12 and 20, driver IC 13a drives switching elements 13 and 21, driver IC 14a drives switching elements 14 and 22, driver IC 15a drives switching elements 15 and 23, driver IC 16a drives switching elements 16 and 24, and driver IC 17a drives switching elements 17 and 25. Gate resistors 20b, 21b, 22b, 23b, 24b, and 25b connected to the added switching elements 20 to 25, respectively, are provided on the substrate 100. Gate resistors 12b to 17b and gate resistors 20b to 25b are generally configured as chip resistors.

[0064] 17 is an area where circuits other than the drive circuit, such as a microcomputer, a control circuit, a control power supply, a sensor circuit, and a discharge resistor, which are not shown, are mounted. In the present embodiment in which the added power modules 7, 8, and 9 are arranged in parallel, as in the first embodiment, the control terminal is arranged between the drive IC and the gate resistor, thereby significantly reducing the dead space on the substrate 100, thereby enabling the substrate 100 to be made smaller and less expensive, and therefore the power converter 1 to be made smaller and less expensive.

[0065] The first driving IC and the first control terminal are connected via a first gate resistor and a first driving substrate pattern provided on the substrate 100. The second driving IC and the second control terminal are connected via a second gate resistor and a second driving substrate pattern provided on the substrate 100. The third driving IC and the third control terminal are connected via a third gate resistor and a third driving substrate pattern provided on the substrate 100. The fourth driving IC and the fourth control terminal are connected via a fourth gate resistor and a fourth driving substrate pattern provided on the substrate 100. The fifth driving IC and the fifth control terminal are connected via a fifth gate resistor and a fifth driving substrate pattern provided on the substrate 100. The sixth driving IC and the sixth control terminal are connected via a sixth gate resistor and a sixth driving substrate pattern provided on the substrate 100.

[0066] In this embodiment, the driver IC 12a and the control terminal 12c are connected via the gate resistor 12b and a first driver substrate pattern (not shown), the driver IC 12a and the control terminal 20c are connected via the gate resistor 20b and the first driver substrate pattern (not shown), the driver IC 13a and the control terminal 13c are connected via the gate resistor 13b and a second driver substrate pattern (not shown), the driver IC 13a and the control terminal 21c are connected via the gate resistor 21b and the second driver substrate pattern (not shown), the driver IC 14a and the control terminal 14c are connected via the gate resistor 14b and a third driver substrate pattern (not shown), and the driver IC 14a and the control terminal 22c are connected via the gate resistor 22b and the third driver substrate pattern (not shown).

[0067] Furthermore, the driver IC 15a and the control terminal 15c are connected via the gate resistor 15b and a fourth driver substrate pattern (not shown), and the driver IC 15a and the control terminal 23c are connected via the gate resistor 23b and a fourth driver substrate pattern (not shown). The driver IC 16a and the control terminal 16c are connected via the gate resistor 16b and a fifth driver substrate pattern (not shown), and the driver IC 16a and the control terminal 24c are connected via the gate resistor 24b and a fifth driver substrate pattern (not shown). The driver IC 17a and the control terminal 17c are connected via the gate resistor 17b and a sixth driver substrate pattern, pattern 50, and the driver IC 17a and the control terminal 25c are connected via the gate resistor 25b and a sixth driver substrate pattern, pattern 50. Pattern 50 is indicated by a dashed line in FIG. 17 .

[0068] One of the issues when driving power modules in parallel is resonance between parallel modules. If resonance occurs between parallel modules, the gate voltage may exceed the gate withstand voltage, or an arm short circuit may occur due to false gate on, which may cause failure of the switching elements and power converters. This resonance occurs due to the difference in parasitic inductance between the elements connected in parallel. It is possible to suppress resonance between elements connected in parallel by making the parasitic inductance from the drive IC to the drive control terminal the same for all elements connected in parallel.

[0069] In this embodiment, the first, second, third, fourth, fifth, and sixth drive substrate patterns are each arranged between the control terminals of the multiple switching elements. In FIG. 17 , pattern 50 is arranged between control terminal 17c and control terminal 25c. This configuration makes the pattern lengths between the parallel-connected elements (the pattern lengths from the drive IC to the control terminals) identical, thereby suppressing resonance between the parallel-connected elements. This suppression of resonance can prevent failures of the switching elements and the power converter 1. By arranging the control terminals between the drive IC and the gate resistor and each drive substrate pattern between the control terminals of the multiple switching elements, resonance between the parallel-connected elements is suppressed, and dead space on the substrate 100 is significantly reduced, resulting in a smaller and more cost-effective substrate 100. This also contributes to a smaller and more cost-effective power converter 1.

[0070] <Modification 1> A modification of the configuration of the power converter 1 will be described with reference to Fig. 19. Fig. 19 is a plan view of the substrate 100 of another power converter 1 according to embodiment 2, showing the layout of components provided on the substrate 100, with only the outlines of the power modules 4 to 9 shown through the substrate 100. In Fig. 19, a pattern 50a which is a second drive substrate pattern connected to the drive IC 13a, and a pattern 50b which is a fourth drive substrate pattern connected to the drive IC 15a are shown by dashed lines. In the configuration of variant example 1, a plurality of power modules 4 to 9 are provided, the substrate 100 is arranged on one side of the power modules 4 to 9 in the Z direction, and at least a portion of a specific drive circuit, which is at least one of the first drive circuit 120, the second drive circuit 130, the third drive circuit 140, the fourth drive circuit 150, the fifth drive circuit 160, and the sixth drive circuit 170, overlaps, as viewed in the Z direction, with a power module having any one of the first switching element, the second switching element, the third switching element, the fourth switching element, the fifth switching element, and the sixth switching element, which is not driven by the specific drive circuit.

[0071] 19 , a portion of the drive IC 12 a of the first drive circuit 120, which is a specific drive circuit, overlaps, as viewed in the Z direction, with a power module 5 having a switching element that is not driven by the first drive circuit 120. Furthermore, an isolation transformer 12 e of the first drive circuit 120 overlaps, as viewed in the Z direction, with a power module 5 having a switching element that is not driven by the first drive circuit 120. Furthermore, a portion of the isolation transformer 13 e of the second drive circuit 130 overlaps, as viewed in the Z direction, with a power module 5 having a switching element that is not driven by the second drive circuit 130. Furthermore, a portion of the isolation transformer 17 e of the sixth drive circuit 170 overlaps, as viewed in the Z direction, with a power module 8 having a switching element that is not driven by the sixth drive circuit 170. The configuration of the drive circuit overlapping with the power module, as viewed in the Z direction, is not limited to this.

[0072] 17, in the configuration shown in Fig. 19, the drive circuits for the U-phase power modules 4 and 7 and the W-phase power modules 6 and 9 are arranged closer to the drive circuits for the V-phase power modules 5 and 8. Specifically, the drive ICs 12a and 13a, the isolation transformers 12e and 13e, the drive ICs 16a and 17a, and the isolation transformers 16e and 17e are arranged closer to the drive ICs 14a and 15a and the isolation transformers 14e and 15e.

[0073] This configuration significantly reduces the dead space between the power modules and other phases (e.g., dead space 102 shown in FIG. 5 ), thereby ensuring a mounting area 111 in which other circuit blocks can be arranged. In the first embodiment, this area was referred to as the substrate reduction area 105, but in the second embodiment, this area is referred to as the mounting area 111. This is because the mounting area 111 itself cannot be eliminated because an area is required to connect the control terminals of the power module to the substrate 100. By mounting circuit blocks other than the drive circuit (such as the microcomputer, control circuit, control power supply, sensor circuit, and discharge resistor described in the first embodiment) in the mounting area 111, it is possible to eliminate a portion of the upper area of ​​the substrate 100 in FIG. 19 where these circuits were originally mounted. Eliminating a portion of the substrate 100 allows for a reduction in the size and cost of the substrate 100, thereby enabling a reduction in the size and cost of the power converter 1.

[0074] In this embodiment, a voltage sensor 40 that detects a voltage is provided on the substrate 100, and at least a portion of the voltage sensor 40 is arranged so as to overlap an area of ​​the substrate 100 that is surrounded by the first control terminal, the second control terminal, the third control terminal, the fourth control terminal, the fifth control terminal, and the sixth control terminal. It is desirable to arrange the voltage sensor 40, for example, in the mounting area 111. In FIG. 19 , the voltage sensor 40 is arranged so as to overlap a portion of the mounting area 111 that is surrounded by the control terminals.

[0075] As described above, the voltage sensor 40 is a circuit that detects the DC voltage from the DC power supply 2. Therefore, the voltage sensor 40 must be connected to the positive and negative potentials of the DC power supply 2 on the board 100. Because the negative side of the DC power supply 2 is the same as the source potential of the lower switching element, the control terminal may be used as the negative side. By placing the voltage sensor 40 in the mounting area 111, the voltage sensor 40 can be placed in close proximity to the control terminal, thereby shortening the high-voltage wiring pattern and enabling the board 100 to be made smaller. For example, if the voltage sensor 40 is placed on the top of the board, the high-voltage wiring pattern must be routed from the control terminal on the bottom of the board to the voltage sensor 40 on the top of the board. A sufficient insulation distance between the low-voltage and high-voltage wiring patterns is required around the wiring pattern to ensure insulation. This area becomes dead space where components and patterns cannot be placed, resulting in a larger board.

[0076] In this embodiment, a discharge resistor 112 that discharges power is provided on the substrate 100, and at least a portion of the discharge resistor 112 is arranged so as to overlap an area of ​​the substrate 100 surrounded by the first control terminal, the second control terminal, the third control terminal, the fourth control terminal, the fifth control terminal, and the sixth control terminal. It is desirable to arrange the discharge resistor 112, for example, in the mounting area 111. In Fig. 19, the discharge resistor 112 is arranged so as to overlap a portion of the mounting area 111 surrounded by the control terminals.

[0077] As described above, the discharge resistor 112 discharges power from the smoothing capacitor 11 connected in parallel to the DC power supply 2 when the inverter is stopped. Therefore, the discharge resistor 112 must be connected to the positive and negative potentials of the DC power supply 2 on the circuit board 100. Because the negative side of the DC power supply 2 is the same as the source potential of the lower switching element, the control terminal may be used as the negative side. By placing the discharge resistor 112 in the mounting area 111, the discharge resistor 112 can be placed in close proximity to the control terminal, thereby shortening the high-voltage wiring pattern and enabling the board 100 to be made smaller. For example, if the discharge resistor 112 is placed on the top of the board, a high-voltage wiring pattern must be routed from the control terminal at the bottom of the board to the discharge resistor 112 at the top of the board. A sufficient insulation distance between the low-voltage and high-voltage wiring patterns is required around the wiring pattern to ensure insulation. This area becomes dead space where components and patterns cannot be placed, resulting in a larger board.

[0078] In this embodiment, the substrate 100 is provided with a control connector 113 to which a control signal is input from outside, and the control connector 113 is arranged on one side in the Y direction or the other side in the Y direction of an area of ​​the substrate 100 surrounded by the first control terminal, the second control terminal, the third control terminal, the fourth control terminal, the fifth control terminal, and the sixth control terminal. In FIG. 19 , the control connector 113 is arranged on the other side in the Y direction. The control connector 113 is a connector that connects the outside of the inverter with the substrate 100 inside the inverter. The control connector 113 is a component that exchanges information necessary for inverter control, such as command values ​​to the inverter, and monitor values ​​and fault information from the inverter.

[0079] Signals input and output to the control connector 113 are basically low-voltage signals. Therefore, if the control connector 113 is placed in an area sandwiched between the secondary side areas 104, the insulation distance between the low voltage and high voltage must be increased, resulting in an excessively large dead space in which components and patterns cannot be placed. By placing the control connector 113 on one side in the Y direction or the other side in the Y direction of the area of ​​the substrate 100 surrounded by the control terminals, the area required to ensure the insulation distance between the low voltage and high voltage can be significantly reduced, thereby making it possible to reduce the size and cost of the substrate 100 and the power converter 1.

[0080] <Modification 2> Another modification of the configuration of the power converter 1 will be described with reference to FIGS. 20 to 22. FIG. 20 is a plan view of the board 100 of another power converter 1 according to embodiment 2, showing the layout of components mounted on the board 100, with the power modules 4 to 9 shown only in outline through the board 100. FIGS. 21 and 22 are cross-sectional views of a main portion of the board 100 of the other power converter 1, showing the pattern proximity region 114. In FIG. 20, dashed lines indicate pattern 50a, which is a second drive board pattern connected to drive IC 13a, and pattern 50b, which is a fourth drive board pattern connected to drive IC 15a. The configuration of FIG. 20 will be described in comparison with the configuration of FIG. 19. In the configuration shown in FIG. 20, screw holes have been removed from the primary-side component mounting region 103. Furthermore, one second coupling transformer 18e is provided from the three isolation transformers 12e, 14e, and 16e, and one first coupling transformer 19e is provided from the three isolation transformers 13e, 15e, and 17e. By providing a coupling transformer and integrating multiple drive circuits, the dead space on the board 100 can be significantly reduced, and the mounting area 111 can be further expanded.

[0081] In this embodiment, at least a portion of the first drive substrate pattern, the second drive substrate pattern, the third drive substrate pattern, the fourth drive substrate pattern, the fifth drive substrate pattern, and the sixth drive substrate pattern are provided on an inner layer of the substrate 100. In the configuration shown in Fig. 20, it is desirable to use an inner layer of the substrate 100 for the drive substrate pattern that is the gate wiring.

[0082] The pattern 50a from the driver IC 13a to the control terminals 13c and 21c and the pattern 50b from the driver IC 15a to the control terminals 15c and 23c are close to each other in the pattern proximity region 114 surrounded by the dashed line. This is because the driver circuits are arranged in a concentrated manner to reduce dead space, resulting in a short distance between the driver ICs. Since it is necessary to ensure an insulating distance even between patterns of different phases (U, V, W), the proximity of the driver board patterns restricts the arrangement of the driver circuits, and it may not be possible to arrange the driver circuits in a concentrated manner. Either the pattern 50a or the pattern 50b, which are close to each other in the pattern proximity region 114, is provided on an inner layer of the substrate 100. In FIG. 21 , the pattern 50b is provided on an inner layer of the substrate 100.

[0083] By providing either pattern 50a or pattern 50b on an inner layer of substrate 100, rather than providing both pattern 50a and pattern 50b on the surface layer of substrate 100, the insulation distance between pattern 50a and pattern 50b can be shortened. Because the insulation distance between pattern 50a and pattern 50b is shortened, the distance between driving ICs can be shortened. Because the distance between driving ICs is shortened, the driving ICs can be arranged in a concentrated manner, thereby reducing the size and cost of substrate 100 and the size and cost of power converter 1.

[0084] In this embodiment, two adjacent drive substrate patterns among the first, second, third, fourth, fifth, and sixth drive substrate patterns may be provided on different layers of the substrate 100. It is desirable to use different layers of the substrate 100 for gate wiring of different phases. In FIG. 22, patterns 50a and 50b are provided on different layers of the substrate 100. Since the layers of the substrate 100 are insulated from each other, using different layers of the substrate 100 for gate wiring of different phases eliminates the need to consider the insulation distance. This allows the distance between the drive ICs to be further reduced.

[0085] In other words, by placing the gate wiring on an inner layer or on a different layer, the constraints on the insulation distance can be relaxed and the driving ICs can be placed closer to each other, thereby making it possible to reduce the size and cost of the substrate 100 and the power converter 1.

[0086] As described above, in the power converter 1 according to the second embodiment, a plurality of power modules 4 to 9 are provided, the substrate 100 is disposed on one side of the power modules 4 to 9 in the Z direction, and at least a portion of a specific drive circuit, which is at least one of the first drive circuit 120, the second drive circuit 130, the third drive circuit 140, the fourth drive circuit 150, the fifth drive circuit 160, and the sixth drive circuit 170, overlaps, as viewed in the Z direction, with a power module having any of the first switching element, the second switching element, the third switching element, the fourth switching element, the fifth switching element, and the sixth switching element, which is not driven by the specific drive circuit. This significantly reduces the dead space between the phases, thereby ensuring a mounting area 111 in which other circuit blocks can be arranged. By mounting circuit blocks other than the drive circuits in the mounting area 111, it is possible to eliminate part of the area of ​​the substrate 100 on which those circuits were originally mounted. Since a portion of the substrate 100 can be removed, the substrate 100 can be made smaller and less expensive, and therefore the power converter 1 can be made smaller and less expensive.

[0087] When at least a portion of the first drive substrate pattern, the second drive substrate pattern, the third drive substrate pattern, the fourth drive substrate pattern, the fifth drive substrate pattern, and the sixth drive substrate pattern are provided on an inner layer of the substrate 100, the insulation distance between the inner layer drive substrate patterns and the surface layer drive substrate patterns can be shortened. Because the insulation distance between the inner layer drive substrate patterns and the surface layer drive substrate patterns is shortened, the distance between the drive ICs can be shortened. Because the distance between the drive ICs is shortened, the drive ICs can be arranged in a concentrated manner, which allows the substrate 100 to be made smaller and more cost-effective, and the power converter 1 to be made smaller and more cost-effective.

[0088] When two adjacent drive board patterns among the first drive board pattern, the second drive board pattern, the third drive board pattern, the fourth drive board pattern, the fifth drive board pattern, and the sixth drive board pattern are provided on different layers of the substrate 100, there is no need to consider the insulation distance between the drive board patterns of different phases because the layers of the substrate 100 are insulated from each other. This allows the distance between the drive ICs to be further reduced, allowing the drive ICs to be arranged more closely together, thereby reducing the size and cost of the substrate 100 and the power converter 1.

[0089] The substrate 100 is provided with a control connector 113 to which a control signal is input from outside, and when the control connector 113 is positioned on one side in the Y direction or the other side in the Y direction of the area of ​​the substrate 100 surrounded by the first control terminal, the second control terminal, the third control terminal, the fourth control terminal, the fifth control terminal, and the sixth control terminal, the area for ensuring the insulation distance between low voltage and high voltage can be significantly reduced, thereby making it possible to reduce the size and cost of the substrate 100 and the power converter 1.

[0090] When a voltage sensor 40 for detecting voltage is provided on the substrate 100 and at least a portion of the voltage sensor 40 is arranged overlapping an area of ​​the substrate 100 surrounded by the first control terminal, the second control terminal, the third control terminal, the fourth control terminal, the fifth control terminal, and the sixth control terminal, by arranging the voltage sensor 40 in the mounting area 111 of the substrate 100 surrounded by the control terminals, the voltage sensor 40 can be arranged in close proximity to the control terminals, which shortens the high-voltage wiring pattern and allows the substrate 100 to be made smaller.

[0091] When a discharge resistor 112 for discharging power is provided on the substrate 100 and at least a portion of the discharge resistor 112 is arranged overlapping an area of ​​the substrate 100 surrounded by the first control terminal, the second control terminal, the third control terminal, the fourth control terminal, the fifth control terminal, and the sixth control terminal, by arranging the discharge resistor 112 in the mounting area 111 of the substrate 100 surrounded by the control terminals, the discharge resistor 112 can be arranged in close proximity to the control terminal, thereby shortening the high-voltage wiring pattern and making it possible to miniaturize the substrate 100.

[0092] When the first, second, third, fourth, fifth, and sixth drive board patterns are arranged between the control terminals of the multiple switching elements, the pattern lengths between the elements connected in parallel (the pattern lengths from the drive IC to the control terminals) are made the same, and resonance between the elements connected in parallel can be suppressed. Since resonance between the elements connected in parallel is suppressed, failures of the switching elements and the power converter 1 can be suppressed.

[0093] Although various exemplary embodiments and examples are described in this disclosure, the various features, aspects, and functions described in one or more embodiments are not limited to the application of a particular embodiment, but may be applied to the embodiments alone or in various combinations. Therefore, countless modifications not illustrated are anticipated within the scope of the technology disclosed in this specification. For example, this includes cases where at least one component is modified, added, or omitted, and even cases where at least one component is extracted and combined with components of another embodiment.

[0094] 1 Power converter, 2 DC power supply, 3 Motor, 4, 5, 6, 7, 8, 9 Power module, 4a, 4b, 4c, 5a, 5b, 5c, 6a, 6b, 6c, 7a, 7b, 7c, 8a, 8b, 8c, 9a, 9b, 9c Main circuit terminal, 4d First side, 4e Second side, 10 Control section, 11 Smoothing capacitor, 12, 13, 14, 15, 16, 17 Switching element, 12a, 13a, 14a, 15a, 16a, 17a Drive IC, 12b, 13b, 14b, 15b, 16b, 17b Gate resistor, 12c, 13c, 14c, 15c, 16c, 17c Control terminals, 12d, 13d, 14d, 15d, 16d, 17d Control terminals, 12e, 13e, 14e, 15e, 16e, 17e Isolation transformer, 18e Second coupling transformer, 19e First coupling transformer, 20, 21, 22, 23, 24, 25 Switching elements, 20b, 21b, 22b, 23b, 24b, 25b Gate resistors, 20c, 21c, 22c, 23c, 24c, 25c Control terminals, 20d, 21d, 22d, 23d, 24d, 25d Control terminals, 31a, 31b, 31c, 31d Signal lines, 32a, 32b, 32c, 32d, 32e, 32f Control lines, 40 Voltage sensors, 41a, 41b, 41c Current sensors, 50, 50a, 50b Pattern, 100 Board, 100a Screw holes, 101, 102 dead space, 103 primary side component mounting area, 104 secondary side area, 105 board reduction area, 106 control circuit mounting area, 107 low voltage-high voltage insulation distance, 108 resin member, 109 adhesive, 110 screw elimination location, 111 mounting area, 112 discharge resistor, 113 control connector, 114 pattern proximity area, 120 first drive circuit, 130 second drive circuit, 140 third drive circuit, 150 fourth drive circuit, 160 fifth drive circuit, 170 sixth drive circuit

Claims

1. A power converter comprising: a substrate; a first switching element having a first control terminal connected to the substrate; a second switching element connected in series to the first switching element and having a second control terminal connected to the substrate; a first drive circuit having a first drive IC and a first gate resistor mounted on the substrate, and driving the first switching element via the first control terminal; and a second drive circuit having a second drive IC and a second gate resistor mounted on the substrate, and driving the second switching element via the second control terminal, wherein on the substrate, at least the first control terminal is arranged between the first drive IC and the first gate resistor, or the second control terminal is arranged between the second drive IC and the second gate resistor.

2. A third switching element having a third control terminal connected to the substrate; a fourth switching element connected in series to the third switching element and having a fourth control terminal connected to the substrate; a third drive circuit having a third drive IC and a third gate resistor mounted on the substrate and driving the third switching element via the third control terminal; and a fourth drive circuit having a fourth drive IC and a fourth gate resistor mounted on the substrate and driving the fourth switching element via the fourth control terminal, wherein the opposite sides of the series-connected sides of the first switching element and the second switching element connected in series are connected to the opposite sides of the series-connected sides of the third switching element and the fourth switching element connected in series to form a full bridge; 2. The power converter according to claim 1, wherein, on the substrate, at least the first control terminal is arranged between the first driving IC and the first gate resistor, or the second control terminal is arranged between the second driving IC and the second gate resistor, or the third control terminal is arranged between the third driving IC and the third gate resistor, or the fourth control terminal is arranged between the fourth driving IC and the fourth gate resistor.

3. A three-phase inverter is formed, comprising: a fifth switching element having a fifth control terminal connected to the substrate; a sixth switching element connected in series to the fifth switching element and having a sixth control terminal connected to the substrate; a fifth drive circuit having a fifth drive IC and a fifth gate resistor mounted on the substrate and driving the fifth switching element via the fifth control terminal; and a sixth drive circuit having a sixth drive IC and a sixth gate resistor mounted on the substrate and driving the sixth switching element via the sixth control terminal, wherein a three-phase inverter is formed, in which alternating current of different phases is output from a portion where the first switching element and the second switching element are connected in series, a portion where the third switching element and the fourth switching element are connected in series, and a portion where the fifth switching element and the sixth switching element are connected in series, 3. The power converter according to claim 2, wherein, on the substrate, at least the first control terminal is arranged between the first driving IC and the first gate resistor, or the second control terminal is arranged between the second driving IC and the second gate resistor, or the third control terminal is arranged between the third driving IC and the third gate resistor, or the fourth control terminal is arranged between the fourth driving IC and the fourth gate resistor, or the fifth control terminal is arranged between the fifth driving IC and the fifth gate resistor, or the sixth control terminal is arranged between the sixth driving IC and the sixth gate resistor.

4. One or more power modules are provided, each having a plurality of side surfaces surrounding one or more or all of the first switching element, the second switching element, the third switching element, the fourth switching element, the fifth switching element, and the sixth switching element; the first control terminal is arranged on a first side surface that is the side surface, and the second control terminal is arranged on a second side surface that is the side surface opposite to the first side surface; the direction toward each other between the first side surface and the second side surface is defined as the Y direction, and the direction perpendicular to the Y direction and perpendicular to the center line of the surrounding side surfaces is defined as the X direction; the first control terminal, the third control terminal, and the fifth control terminal are arranged side by side in the X direction along the first side surface, and the second control terminal, the fourth control terminal, and the sixth control terminal are arranged side by side in the X direction along the second side surface; 4. The power converter according to claim 3, wherein the first drive circuit, the second drive circuit, the third drive circuit, the fourth drive circuit, the fifth drive circuit, and the sixth drive circuit are arranged on the other side in the X direction of a control terminal among the first control terminal, the second control terminal, the third control terminal, the fourth control terminal, the fifth control terminal, and the sixth control terminal that is arranged furthest on one side in the X direction.

5. One or more power modules are provided, each having a plurality of side surfaces surrounding one or more or all of the first switching element, the second switching element, the third switching element, the fourth switching element, the fifth switching element, and the sixth switching element; the first control terminal is arranged on a first side surface that is the side surface, and the second control terminal is arranged on a second side surface that is the side surface opposite to the first side surface; the direction toward each other between the first side surface and the second side surface is defined as the Y direction, and the direction perpendicular to the Y direction and perpendicular to the center line of the surrounding side surfaces is defined as the X direction; the first control terminal, the third control terminal, and the fifth control terminal are arranged side by side in the X direction along the first side surface, and the second control terminal, the fourth control terminal, and the sixth control terminal are arranged side by side in the X direction along the second side surface; 4. The power converter according to claim 3, wherein the first drive circuit, the second drive circuit, the third drive circuit, the fourth drive circuit, the fifth drive circuit, and the sixth drive circuit are arranged on the other side in the X direction of a control terminal that is furthest on one side in the X direction among the first control terminal, the second control terminal, the third control terminal, the fourth control terminal, the fifth control terminal, and the sixth control terminal, and on one side in the X direction of a control terminal that is furthest on the other side in the X direction among the first control terminal, the second control terminal, the third control terminal, the fourth control terminal, the fifth control terminal, and the sixth control terminal.

6. A plurality of power modules are provided, each having a plurality of side surfaces surrounding one or a plurality of switching elements among the first switching element, the second switching element, the third switching element, the fourth switching element, the fifth switching element, and the sixth switching element, wherein the first control terminal is arranged on a first side surface which is the side surface, and the second control terminal is arranged on a second side surface which is the side surface opposite to the first side surface, wherein the direction toward each other between the first side surface and the second side surface is defined as the Y direction, a direction perpendicular to the Y direction and perpendicular to the center line of the surrounding side surfaces is defined as the X direction, and a direction perpendicular to the X direction and the Y direction is defined as the Z direction, wherein the first control terminal, the third control terminal, and the fifth control terminal are arranged side by side in the X direction along the first side surface, and the second control terminal, the fourth control terminal, and the sixth control terminal are arranged side by side in the X direction along the second side surface, and the substrate is arranged on one side of the power module in the Z direction, 6. The power converter according to claim 3, wherein at least a portion of a specific drive circuit, which is at least one of the first drive circuit, the second drive circuit, the third drive circuit, the fourth drive circuit, the fifth drive circuit, and the sixth drive circuit, overlaps, as viewed in the Z direction, with the power module including any one of the first switching element, the second switching element, the third switching element, the fourth switching element, the fifth switching element, and the sixth switching element that is not driven by the specific drive circuit.

7. One or more power modules are provided, each having a plurality of side surfaces surrounding one or more or all of the first switching element, the second switching element, the third switching element, the fourth switching element, the fifth switching element, and the sixth switching element; the first control terminal is arranged on a first side surface that is the side surface, and the second control terminal is arranged on a second side surface that is the side surface opposite to the first side surface; the direction toward each other between the first side surface and the second side surface is defined as the Y direction, and the direction perpendicular to the Y direction and perpendicular to the center line of the surrounding side surfaces is defined as the X direction; the first control terminal, the third control terminal, and the fifth control terminal are arranged side by side in the X direction along the first side surface, and the second control terminal, the fourth control terminal, and the sixth control terminal are arranged side by side in the X direction along the second side surface; a resin member for fixing the substrate is provided in an area surrounded by the first control terminal, the second control terminal, the third control terminal, the fourth control terminal, the fifth control terminal, and the sixth control terminal; The power converter according to claim 3 , wherein the substrate is in contact with the resin member.

8. The power converter according to any one of claims 3 to 7, wherein the second drive circuit has a second isolation transformer, the fourth drive circuit has a fourth isolation transformer, the sixth drive circuit has a sixth isolation transformer, and the second isolation transformer, the fourth isolation transformer, and the sixth isolation transformer form a first coupling transformer that is a single isolation transformer.

9. The power converter according to any one of claims 3 to 8, wherein the first drive circuit has a first isolation transformer, the third drive circuit has a third isolation transformer, the fifth drive circuit has a fifth isolation transformer, and the first isolation transformer, the third isolation transformer, and the fifth isolation transformer form a second coupling transformer that is a single isolation transformer.

10. The first driving IC and the first control terminal are connected via the first gate resistor and a first driving substrate pattern provided on the substrate, the second driving IC and the second control terminal are connected via the second gate resistor and a second driving substrate pattern provided on the substrate, the third driving IC and the third control terminal are connected via the third gate resistor and a third driving substrate pattern provided on the substrate, the fourth driving IC and the fourth control terminal are connected via the fourth gate resistor and a fourth driving substrate pattern provided on the substrate, the fifth driving IC and the fifth control terminal are connected via the fifth gate resistor and a fifth driving substrate pattern provided on the substrate, and the sixth driving IC and the sixth control terminal are connected via the sixth gate resistor and a sixth driving substrate pattern provided on the substrate.

10. A power converter as described in any one of claims 3 to 9, wherein at least a portion of the first drive substrate pattern, the second drive substrate pattern, the third drive substrate pattern, the fourth drive substrate pattern, the fifth drive substrate pattern, and the sixth drive substrate pattern are provided on an inner layer of the substrate.

11. A power converter as described in claim 10, wherein two adjacently arranged drive substrate patterns among the first drive substrate pattern, the second drive substrate pattern, the third drive substrate pattern, the fourth drive substrate pattern, the fifth drive substrate pattern, and the sixth drive substrate pattern are provided on different layers of the substrate.

12. A power converter as described in any one of claims 4 to 7, wherein the substrate is provided with a control connector to which a control signal is input from outside, and the control connector is arranged on one side in the Y direction or on the other side in the Y direction of an area of ​​the substrate surrounded by the first control terminal, the second control terminal, the third control terminal, the fourth control terminal, the fifth control terminal, and the sixth control terminal.

13. A power converter according to any one of claims 3 to 9, wherein the substrate is provided with a voltage sensor that detects voltage, and at least a portion of the voltage sensor is arranged so as to overlap an area of ​​the substrate that is surrounded by the first control terminal, the second control terminal, the third control terminal, the fourth control terminal, the fifth control terminal, and the sixth control terminal.

14. A power converter according to any one of claims 3 to 9, wherein the substrate is provided with a discharge resistor for discharging power, and at least a portion of the discharge resistor is arranged so as to overlap an area of ​​the substrate surrounded by the first control terminal, the second control terminal, the third control terminal, the fourth control terminal, the fifth control terminal, and the sixth control terminal.

15. The power converter according to claim 10 or 11, wherein each of the first switching element, the second switching element, the third switching element, the fourth switching element, the fifth switching element, and the sixth switching element is configured by connecting a plurality of switching elements in parallel, each of the plurality of switching elements included in the first switching element, the second switching element, the third switching element, the fourth switching element, the fifth switching element, and the sixth switching element has a control terminal connected to the substrate, and each of the first driving substrate pattern, the second driving substrate pattern, the third driving substrate pattern, the fourth driving substrate pattern, the fifth driving substrate pattern, and the sixth driving substrate pattern is arranged between the control terminals included in each of the plurality of switching elements.

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