Physical property value calculating device, method, and program

Abstract

An accepting unit (34) accepts a material physical property value of each of a plurality of materials constituting a semiconductor package substrate that is to be subjected to calculation, a stacking order of each of the plurality of materials, and a value of a predetermined parameter, and a calculating unit (36) calculates a substrate physical property value of the semiconductor package substrate that is to be subjected to calculation, using an integrated calculation formula obtained by adding, using predetermined coefficients, a first calculation formula for calculating, using a rule of mixtures, a change in the substrate physical property value with respect to a predetermined parameter when stress is applied to the semiconductor package substrate in a fiber direction of the material, and a second calculation formula for calculating, using the rule of mixtures, a change in the substrate physical property value with respect to the predetermined parameter when stress is applied in a direction perpendicular to the fiber direction, the coefficients being adjusted such that the substrate physical property value calculated using the integrated calculation formula matches the result of a simulation of the substrate physical property value.

Description

Physical property calculation device, method, and program

[0001] The present disclosure relates to a physical property calculation device, a physical property calculation method, and a physical property calculation program.

[0002] 2. Description of the Related Art Conventionally, materials used in manufacturing a product are selected in consideration of the phenomena that may occur in the product depending on the design of the product and the physical properties of the materials used.

[0003] For example, a method for selecting a material for a panel used in manufacturing a semiconductor package has been proposed, which selects a material capable of producing a panel with a sufficiently small amount of warpage (see Patent Document 1). The method described in Patent Document 1 relates to a method for selecting a material for a panel including a back coating layer, a number of semiconductor elements, a sealing layer, and an insulating layer. This method involves using structural analysis software to construct a virtual model of the panel, into which the properties of the materials constituting the back coating layer, the sealing layer, and the insulating layer have been input. This method also calculates the amount of warpage of the virtual model and identifies, through structural analysis, the properties of the materials constituting the back coating layer, the sealing layer, and the insulating layer that affect the amount of warpage of the panel. Based on the identified information, this method then selects at least one new material from the back coating layer, the sealing layer, and the insulating layer so as to reduce the amount of warpage of the virtual model.

[0004] For example, when a material supplier simulates the warpage of a substrate in a semiconductor package when a selected material is used and reports the simulation results to a customer, if the customer does not approve the results, the design information, materials, etc. are changed. The material supplier then runs the simulation again based on the changed design information and materials and reports the results to the customer. Since the customer may not want to provide detailed design information at the product design stage, the above process may be repeated, and it may take a long time for the customer to approve the selected material.

[0005] To solve the above problems, a material selection support device has been proposed that can reduce the number of interactions required for selecting materials for product manufacturing (see Patent Document 2). This device simulates phenomena occurring in the product based on shape values ​​related to the shape of the product and physical property values ​​of the materials used in the product each time they are received. Furthermore, for each of a plurality of pre-registered materials, the device calculates the difference between the physical property values ​​of each of the plurality of materials and the received physical property values, and displays the simulation results and the calculated difference on a display device.

[0006] JP 2020-38924 A International Publication No. 2023 / 181543

[0007] Simulations of the physical properties of semiconductor package substrates using commercial simulators require a lot of time due to the large number of parameters used in the simulation and the complex calculation formulas, so there is a demand for shortening this processing time. While it is possible to shorten the processing time by using simple calculation formulas, in this case the calculation results may deviate from the simulation results, which poses problems in terms of accuracy.

[0008] The present disclosure has been made in consideration of the above points, and aims to provide a physical property calculation device, method, and program that can easily calculate values ​​that are close to simulation results for the physical property values ​​of a semiconductor package device.

[0009] A physical property calculation device according to a first aspect includes: a receiving unit that receives material physical property values ​​of each of a plurality of materials that constitute a semiconductor package substrate to be calculated, a stacking order of each of the plurality of materials, and values ​​of predetermined parameters that affect the substrate physical property values ​​of the semiconductor package substrate; and a calculation unit that calculates the substrate physical property values ​​of the semiconductor package substrate to be calculated using an integrated calculation formula that adds together, by a predetermined coefficient, a first calculation formula for calculating, by a rule of mixture, a change in the substrate physical property value with respect to the predetermined parameter when stress is applied to the semiconductor package substrate in a fiber direction of the material, and a second calculation formula for calculating, by a rule of mixture, a change in the substrate physical property value with respect to the predetermined parameter when stress is applied to the semiconductor package substrate in a direction perpendicular to the fiber direction, wherein the coefficient is adjusted so that the substrate physical property values ​​calculated by the integrated calculation formula match simulation results of the substrate physical property values.

[0010] A physical property calculation method according to a second aspect is a method in which a computer executes processing including: receiving material physical property values ​​of each of a plurality of materials constituting a semiconductor package substrate to be calculated, a stacking order of each of the plurality of materials, and values ​​of predetermined parameters that affect the substrate physical property values ​​of the semiconductor package substrate; and calculating substrate physical property values ​​of the semiconductor package substrate to be calculated using an integrated formula obtained by adding, by a predetermined coefficient, a first formula for calculating, by a rule of mixture, how the substrate physical property value changes with respect to the predetermined parameter when stress is applied to the semiconductor package substrate in a fiber direction of the material; and a second formula for calculating, by a rule of mixture, how the substrate physical property value changes with respect to the predetermined parameter when stress is applied to the semiconductor package substrate in a direction perpendicular to the fiber direction, wherein the coefficient has been adjusted so that the substrate physical property values ​​calculated by the integrated formula coincide with simulation results of the substrate physical property values.

[0011] A physical property calculation program according to a third aspect is a program that causes a computer to function as: a receiving unit that receives material physical property values ​​of each of a plurality of materials that constitute a semiconductor package substrate to be calculated, a stacking order of each of the plurality of materials, and values ​​of predetermined parameters that affect the substrate physical property values ​​of the semiconductor package substrate; and a calculation unit that calculates the substrate physical property values ​​of the semiconductor package substrate to be calculated using an integrated calculation formula that adds, by a predetermined coefficient, a first calculation formula for calculating, by a rule of mixture, how the substrate physical property value changes with respect to the predetermined parameter when stress is applied to the semiconductor package substrate in the fiber direction of the material, and a second calculation formula for calculating, by a rule of mixture, how the substrate physical property value changes with respect to the predetermined parameter when stress is applied to the semiconductor package substrate in a direction perpendicular to the fiber direction, wherein the coefficient has been adjusted so that the substrate physical property values ​​calculated by the integrated calculation formula coincide with simulation results of the substrate physical property values.

[0012] According to the physical property calculation device, method, and program of the present disclosure, it is possible to easily calculate values ​​close to simulation results for the physical property values ​​of a semiconductor package device.

[0013] 1 is a block diagram showing the hardware configuration of a physical property calculation device according to the present embodiment; FIG. 2 is a block diagram showing an example of the functional configuration of a physical property calculation device according to the present embodiment; FIG. 3 is a diagram for explaining the rule of mixture for the fiber direction and the fiber perpendicular direction; FIG. 4 is a diagram showing an example of calculation results of physical property values ​​according to the rule of mixture for each of the fiber direction and the fiber perpendicular direction; FIG. 5 is a diagram showing an example of calculation results of physical property values ​​according to an integrated calculation formula with adjusted coefficients; FIG. 6 is a diagram showing an example of a reception display screen; FIG. 7 is a diagram for explaining calculation of board physical property values; FIG. 8 is a flowchart showing the flow of a creation process; FIG. 9 is a flowchart showing the flow of a calculation process; FIG. 10 is a diagram showing an example of a comparison result between actual measurement values, simulation results, and calculation results according to the present method after coefficient readjustment; FIG. 11 is a block diagram showing a schematic configuration of a physical property calculation system according to Modification 2;

[0014] An example of this embodiment will be described below with reference to the drawings.

[0015] Fig. 1 is a block diagram showing the hardware configuration of a physical property calculation apparatus 10 according to this embodiment. As shown in Fig. 1, the physical property calculation apparatus 10 includes a CPU (Central Processing Unit) 12, a memory 14, a storage device 16, an input device 18, an output device 20, a storage medium reader 22, and a communication I / F (Interface) 24. Each component is connected to each other via a bus 26 so as to be able to communicate with each other.

[0016] The storage device 16 stores a physical property calculation program for executing the creation process and calculation process described below. The CPU 12 is a central processing unit that executes various programs and controls each component. That is, the CPU 12 reads the program from the storage device 16 and executes the program using the memory 14 as a work area. The CPU 12 controls each component and performs various calculation processes in accordance with the program stored in the storage device 16.

[0017] The memory 14 is configured with RAM (Random Access Memory) and serves as a working area for temporarily storing programs and data. The storage device 16 is configured with ROM (Read Only Memory), HDD (Hard Disk Drive), SSD (Solid State Drive), etc., and stores various programs including the operating system and various data.

[0018] The input device 18 is a device for performing various inputs, such as a keyboard, a mouse, etc. The output device 20 is a device for outputting various information, such as a display, a printer, etc. A touch panel display may be used as the output device 20 to function as the input device 18.

[0019] The storage medium reader 22 reads data stored in various storage media such as CD (Compact Disc)-ROM, DVD (Digital Versatile Disc)-ROM, Blu-ray Disc, USB (Universal Serial Bus) memory, etc., and writes data to the storage media. The communication I / F 24 is an interface for communicating with other devices, and uses standards such as Ethernet (registered trademark), FDDI, or Wi-Fi (registered trademark).

[0020] Next, the functional configuration of the physical property calculation device 10 according to this embodiment will be described.

[0021] 2 is a block diagram showing an example of the functional configuration of the physical property calculation apparatus 10. As shown in FIG. 2, the physical property calculation apparatus 10 includes, as its functional configuration, a creation unit 32, a reception unit 34, a calculation unit 36, and a display control unit 38. The physical property calculation apparatus 10 also includes a calculation formula storage unit 40 and a storage area in which a material DB (database) 42 is stored. Each functional configuration is realized when the CPU 12 reads out a physical property calculation program stored in the storage device 16, expands it into the memory 14, and executes it.

[0022] The creation unit 32 acquires the results of a simulation using simulation software for the physical property values ​​of each of the plurality of semiconductor package substrates. The physical property values ​​include, for example, the modulus of elasticity and the coefficient of thermal expansion. The creation unit 32 also acquires the physical property values ​​of each of the plurality of materials constituting the plurality of semiconductor package substrates for which simulation results have been obtained (hereinafter referred to as "material physical property values") and information on the stacking order of each of the plurality of materials (hereinafter also referred to as "layer configuration").

[0023] In this embodiment, a formula based on the rule of mixtures, which is simpler than simulation, is used to calculate the physical properties of a semiconductor package substrate. The rule of mixtures is a method for predicting the physical properties of a composite material made by combining two or more materials. The rule of mixtures predicts the physical properties of the composite material based on the physical properties of each material and the volume ratio between the materials. As shown in FIG. 3 , there are two types of rule of mixtures. The first type, as shown in the upper diagram of FIG. 3 , predicts the physical properties of a composite material made of a matrix and fibers when stress is applied in the fiber direction. The second type, as shown in the lower diagram of FIG. 3 , predicts the physical properties of a composite material made of a matrix and fibers when stress is applied in a direction perpendicular to the fiber direction (hereinafter referred to as the "fiber perpendicular direction").

[0024] For example, in a wiring layer having a build-up layer as a base material and a copper wiring pattern as a fiber, the physical property values ​​are the elastic modulus and the coefficient of thermal expansion (CTE) as follows: The following formula (1) is the formula for the elastic modulus E in the fiber direction, the following formula (2) is the formula for the elastic modulus E in the direction perpendicular to the fiber, the following formula (3) is the formula for the thermal expansion coefficient α in the direction perpendicular to the fiber, and the following formula (4) is the formula for the thermal expansion coefficient α in the direction perpendicular to the fiber.

[0025]

[0026] where ν is Poisson's ratio, E is elastic modulus, α is thermal expansion coefficient, and f is fiber volume ratio. The subscript m represents the base material, d represents the fiber, t represents the fiber direction, and a represents the fiber perpendicular direction.

[0027] In the wiring layer of a semiconductor package substrate, there are various copper wiring pattern designs, resulting in various residual copper ratios. The physical properties of the wiring layer vary depending on the residual copper ratio. Figure 4 shows examples of calculations of the modulus of elasticity and CTE when the residual copper ratio corresponds to the fiber volume ratio using each of the above-mentioned formulas of the rule of mixture. The dashed line in Figure 4 represents the calculation results in the fiber direction, and the dashed line in Figure 4 represents the calculation results in the direction perpendicular to the fiber. That is, the dashed line in the upper part of Figure 4 represents the calculation results using the above formula (1), the dashed line in the upper part of Figure 4 represents the calculation results using the above formula (2), the dashed line in the lower part of Figure 4 represents the calculation results using the above formula (3), and the dashed line in the lower part of Figure 4 represents the calculation results using the above formula (4). Note that Figure 4 is an example using the physical properties shown in the table below.

[0028]

[0029] 4 show the simulation results of the physical property values ​​of the wiring layer. When only the formula for the mixture rule in the fiber direction or only the formula for the mixture rule in the direction perpendicular to the fiber is used, there is a large deviation from the simulation results.

[0030] Therefore, in this embodiment, an integrated calculation formula is used in which the formula for the composite rule for the fiber direction and the formula for the composite rule for the direction perpendicular to the fiber are added together using a predetermined coefficient a.

[0031] Specifically, when the formula for the composite rule in the fiber direction is A and the formula for the composite rule in the direction perpendicular to the fiber is B, the creation unit 32 sets the integrated calculation formula as shown in formula (5) below. A×a+B×(1−a) (5) That is, when a=1, only the formula for the composite rule in the fiber direction is represented, and when a=0, only the formula for the composite rule in the direction perpendicular to the fiber is represented, and the larger the value of a, the greater the contribution of the composite rule in the fiber direction. In the above example of elastic modulus, the integrated calculation formula is formula (6) below, and in the example of CTE, the integrated calculation formula is formula (7) below. Note that (1) to (4) in formulas (6) and (7) represent formulas (1) to (4) above. (1)×a+(2)×(1−a) (6) (3)×a+(4)×(1−a) (7)

[0032] The creation unit 32 adjusts the coefficient a so that the physical property values ​​of the wiring layer calculated using the integrated calculation formula match the simulation results of the physical property values ​​of the wiring layer. Figure 5 shows the calculation results (solid line) of the physical property values ​​using the integrated calculation formula with the adjusted coefficient a for the same example as in Figure 4. In the example in the upper diagram of Figure 5, a = 0.30, and in the example in the lower diagram of Figure 5, a = 0.62. By using the integrated calculation formula, it is possible to calculate physical property values ​​that are more consistent with the simulation results than the calculation results when only the formula for the rule of mixture in the fiber direction and the formula for the rule of mixture in the perpendicular fiber direction are used.

[0033] The creation unit 32 stores the integrated calculation formula created by adjusting the coefficient a in the calculation formula storage unit 40 .

[0034] In addition, when the actual measured value of the physical property value of the wiring layer is obtained, the creation unit 32 adjusts the coefficient a so that the physical property value of the wiring layer calculated by the integrated calculation formula matches the actual measured value, and updates the stored integrated physical property value.

[0035] The receiving unit 34 receives specified conditions related to the semiconductor package substrate for which the substrate physical property values ​​are to be calculated. The specified conditions include the material physical property values ​​of each of the multiple materials constituting the semiconductor package substrate, the stacking order of each of the multiple materials, and the values ​​of predetermined parameters that affect the physical property values ​​of the entire semiconductor package substrate (hereinafter referred to as "substrate physical property values"). The material physical property values ​​include the modulus of elasticity, CTE, and Poisson's ratio, which are necessary for calculating the physical property values ​​using the above integrated calculation formula. In the following, a case where the predetermined parameter is the copper remaining ratio of the wiring layer will be described.

[0036] Specifically, the reception unit 34 receives the specified conditions via a reception display screen that is displayed on the display by the display control unit 38, which will be described later. Fig. 6 shows an example of a reception display screen 50. In the example of Fig. 6, the reception display screen 50 includes a material property value specification area 52, a layer configuration specification area 54, a remaining copper ratio specification area 56, a calculation button 58, a calculation result display area 60, and a material candidate display area 62. Note that the material property value specification area 52, the layer configuration specification area 54, and the remaining copper ratio specification area 56 are examples of the "first area" in the present disclosure, and the calculation result display area 60 is an example of the "second area" in the present disclosure.

[0037] The material property value specification area 52 is an area for specifying the property values ​​of each material. In the example of FIG. 6 , the property values ​​of each material are specified using a slide bar, but a field for direct input of a numerical value may also be provided. The layer structure specification area 54 is an area for specifying the layer structure of each material. In the layer structure specification area 54, adding, deleting, or rearranging layers is specified, for example, by dragging. The remaining copper ratio specification area 56 is an area for specifying the remaining copper ratio, which is an example of a predetermined parameter. In the example of FIG. 6 , the remaining copper ratio is specified using a slide bar, but a field for direct input of a numerical value may also be provided. The calculation button 58, calculation result display area 60, and material candidate display area 62 will be described later.

[0038] The receiving unit 34 receives the information specified in each of the material property value specifying area 52, the layer configuration specifying area 54, and the remaining copper ratio specifying area 56 as specified conditions.

[0039] When the calculation button 58 for instructing the execution of calculation of board physical properties is selected on the reception display screen 50, the calculation unit 36 ​​calculates the board physical properties of the target semiconductor package board using the integrated calculation formula stored in the calculation formula storage unit 40. Specifically, as shown in the upper diagram of FIG. 7 , the calculation unit 36 ​​calculates the physical properties of the wiring layer (indicated by the dashed line) of the semiconductor package board using the integrated calculation formula. Then, as shown in the lower diagram of FIG. 7 , the calculation unit 36 ​​uses the physical properties calculated using the integrated calculation formula as the material physical properties for the wiring layer, and adds up the material physical properties of each layer in stacking order from the top of the board using the fiber direction rule of mixture formula. In the case of the lower diagram of FIG. 7 , the calculation unit 36 ​​calculates the physical properties of the first layer from the top, SR, as the base material and the second layer, BU / PP, as the fiber. Next, the calculation unit 36 ​​calculates the physical properties of the resultant base material and the third layer, copper wiring layer, as the fiber. This procedure is repeated to add up the physical properties of all layers constituting the board.

[0040] The display control unit 38 displays the above-mentioned reception display screen 50, for example, as shown in Figure 6, on the display. The display control unit 38 also displays the calculation results by the calculation unit 36 ​​in a calculation result display area 60 on the reception display screen 50.

[0041] Furthermore, for at least one of the plurality of materials, the display control unit 38 selects a material having a material property value closest to the material property value specified in the material property value specification area 52 from a plurality of materials pre-registered in the material DB 42. Then, the display control unit 38 presents the selected material to the user by displaying it in the material candidate display area 62 as a candidate material for realizing the calculated substrate property value.

[0042] An example of the material DB 42 is shown in Fig. 8. In the example of Fig. 8, the material DB 42 stores, for each material, the "material name" of the material and material property values ​​such as "elastic modulus," "CTE," and "Poisson's ratio" in association with each other. Note that instead of or in addition to the material name, the product model name and number of the material, a unique identification number, etc. may be used.

[0043] Next, the operation of the physical property calculation device 10 according to this embodiment will be described.

[0044] The physical property calculation device 10 executes a creation process in a creation phase of an integrated calculation formula. Furthermore, the physical property calculation device 10 executes a calculation process in a calculation phase of the substrate physical property values ​​of the semiconductor package substrate to be calculated. FIG. 9 is a flowchart showing the flow of the creation process executed by the CPU 12 of the physical property calculation device 10. Furthermore, FIG. 10 is a flowchart showing the flow of the calculation process executed by the CPU 12 of the physical property calculation device 10. The CPU 12 reads a physical property calculation program from the storage device 16, expands it into the memory 14, and executes it, whereby the CPU 12 functions as each functional component of the physical property calculation device 10, and executes the creation process shown in FIG. 9 and the calculation process shown in FIG. 10. The calculation process is an example of a physical property calculation method of the present disclosure.

[0045] First, the creation process shown in FIG. 9 will be described.

[0046] In step S10, the creation unit 32 acquires the results of a simulation using simulation software for the physical property values ​​of each wiring layer of the plurality of semiconductor package substrates, and acquires information on the material physical property values ​​of each of the plurality of materials constituting the plurality of semiconductor package substrates for which simulation results have been obtained, and the stacking order of each of the plurality of materials.

[0047] Next, in step S12, the physical property values ​​of the wiring layer are calculated using the integrated calculation formula shown in equation (5), and the coefficient a is adjusted so that the simulation results of the physical property values ​​of the wiring layer match the physical property values ​​of the wiring layer calculated using the integrated calculation formula.

[0048] Next, in step S14, the creation unit 32 stores the integrated calculation formula created by adjusting the coefficient a in the calculation formula storage unit 40, and the creation process ends.

[0049] Next, the calculation process shown in FIG. 10 will be described.

[0050] In step S20, the display control unit 38 displays, on the display, a reception display screen 50 such as that shown in Fig. 6. Then, the reception unit 34 receives, as specified conditions, information specified in each of the material property value specification area 52, layer configuration specification area 54, and remaining copper ratio specification area 56 on the reception display screen 50.

[0051] Next, in step S22, the calculation unit 36 ​​determines whether or not to execute calculation of the substrate physical property values ​​by determining whether or not the calculation button 58 on the reception display screen 50 has been selected. If the substrate physical property values ​​are to be calculated, the process proceeds to step S24, and if the substrate physical property values ​​are not to be calculated, the process proceeds to step S34.

[0052] In step S24, the calculation unit 36 ​​calculates the physical property values ​​of the wiring layer of the semiconductor package substrate using the integrated calculation formula stored in the calculation formula storage unit 40 and the specified conditions accepted in step S20. Then, for the wiring layer, the calculation unit 36 ​​sets the physical property values ​​calculated using the integrated calculation formula as the material physical property values, and calculates the substrate physical property values ​​by sequentially adding up the material physical property values ​​of each layer according to the fiber direction rule of mixture formula. Then, the display control unit 38 displays the substrate physical property values ​​calculated in step S24 in the calculation result display area 60 of the reception display screen 50.

[0053] Next, in step S26, the display control unit 38 selects, for at least one of the plurality of materials, a material having a material property value closest to the material property value specified in the material property value specification area 52 from the plurality of materials pre-registered in the material DB 42. Then, the display control unit 38 displays the selected material in the material candidate display area 62 as a candidate material for realizing the calculated substrate physical property value.

[0054] Next, in step S28, it is determined whether or not the specified conditions have been changed in at least one of the material property value specification area 52, the layer configuration specification area 54, and the remaining copper ratio specification area 56 on the reception display screen 50. If the specified conditions have been determined to have been changed, the process proceeds to step S30, and if the specified conditions have not been changed, the process proceeds to step S34.

[0055] In step S30, the calculation unit 36 ​​calculates the substrate physical property values ​​based on the changed specified conditions in the same manner as in step S24 above, and updates the display in the calculation result display area 60. Next, in step S30, the display control unit 38 selects candidate materials based on the changed specified conditions in the same manner as in step S24 above, and updates the display in the candidate material display area 62.

[0056] Next, in step S34, the display control unit 38 determines whether or not a command to end the display has been received, thereby determining whether or not to end the display of the reception display screen 50. If the display is not to be ended, the process returns to step S28, and if the display is to be ended, the calculation process ends.

[0057] 11 shows an example of a comparison result between the actual measured value of CTE, which is an example of a substrate physical property value, the simulation result, and the calculation result by this embodiment (hereinafter also referred to as "this method") for semiconductor package substrate samples 1 to 5. As shown in FIG. 11, this method was able to calculate CTE with an average difference of about 0.5 ppm / °C from the simulation result and an average difference of about 1 ppm / °C from the actual measured value.

[0058] Furthermore, in the case of simulation, information on the copper wiring pattern of the wiring layer is generally required, but according to the present method, the physical properties of the board can be calculated even without information on the copper wiring pattern.

[0059] Since there are various copper wiring patterns, this method, which does not use information on the copper wiring pattern, may result in a large difference between the calculated substrate physical property values ​​and the actual measured values. Therefore, as described above, when multiple actual measured values ​​of the physical property values ​​of the wiring layer are obtained, the creation unit 32 may readjust the coefficient a so that the physical property values ​​of the wiring layer calculated using the integrated calculation formula match the actual measured values. The coefficient a may be adjusted so that the calculated physical property values ​​match the actual measured values, similar to the adjustment based on a comparison with the simulation results.

[0060] The multiple measured values ​​may be measured values ​​obtained from multiple semiconductor package substrates with a specific copper wiring pattern, or may be measured values ​​obtained from multiple semiconductor package substrates with multiple different copper wiring patterns. In the former case, board physical property values ​​can be calculated with high accuracy, specific to the semiconductor package substrate with a specific copper wiring pattern. In the latter case, board physical property values ​​that can be used for various copper wiring patterns can be calculated.

[0061] 12 shows an example of a comparison result between the actual measured value of CTE, which is an example of a substrate physical property value, the simulation result, and the calculation result when the coefficient a is readjusted based on the actual measured value, for semiconductor package substrate samples 1 to 5. As shown in FIG. 12, with this method, it was possible to calculate CTE with an average difference of about 1 ppm / °C from the simulation result and an average difference of about 0.5 ppm / °C from the actual measured value.

[0062] As described above, the physical property calculation device according to this embodiment receives the material physical property values ​​of each of the multiple materials constituting the semiconductor package substrate to be calculated, the stacking order of each of the multiple materials, and the values ​​of predetermined parameters that affect the substrate physical property values ​​of the semiconductor package substrate. The physical property calculation device also adjusts coefficients so that the calculation results of the physical property values ​​obtained by the integrated calculation formula, which adds the fiber direction composite rule and the fiber perpendicular direction composite rule by a predetermined coefficient, match the simulation results. The physical property calculation device then calculates the substrate physical property values ​​of the semiconductor package substrate to be calculated using the integrated calculation formula with the adjusted coefficients. This allows for easy calculation of physical property values ​​of the semiconductor package device that are close to the simulation results.

[0063] Specifically, calculations based on the above-described rule of composition allow for calculation of board physical properties within the scope of arithmetic operations, more easily than simulation. Furthermore, even if material physical properties and layer structure change, board physical properties corresponding to the changed material physical properties and layer structure can be instantly calculated without modifying the pre-created integrated calculation formula. Furthermore, board physical properties can be calculated using similar procedures for various types of semiconductor package boards, including complex layer structures such as coreless and multi-core. Furthermore, even if the detailed copper wiring pattern is unknown, physical properties close to actual measurements or simulation results can be calculated.

[0064] <Variation 1> In the above embodiment, the creation of the integrated calculation formula and the calculation of the physical property values ​​of the semiconductor package substrate to be calculated using the integrated calculation formula are performed by a single device. As Variation 1, the creation device that creates the integrated calculation formula and the calculation device that calculates the physical property values ​​of the semiconductor package substrate to be calculated using the integrated calculation formula may be configured separately. In this case, the creation device includes a creation unit as a functional unit. The calculation device also includes a reception unit, a calculation unit, and a display control unit 38 as functional units. The integrated calculation formula created by the creation device may be stored in a calculation formula storage unit provided in the calculation device or an external device accessible from the calculation device, and the integrated calculation formula may be read from the calculation formula storage unit and used when calculating the substrate physical property values ​​in the creation device.

[0065] <Modification 2> In the above embodiment, a configuration in which a physical property calculation device functions alone has been described. However, in Modification 2, as shown in Fig. 13, a physical property calculation system 100 including a physical property calculation server 110A and a person in charge terminal 110B will be described. The physical property calculation server 110A and the person in charge terminal 110B are connected via a network. Note that the number of physical property calculation servers 110A and the number of person in charge terminals 110B included in the physical property calculation system 100 is not limited to the example in Fig. 7. Furthermore, in Modification 2, points in common with the above embodiment are represented by symbols with the same numerical portion, and differences from the above embodiment will mainly be described, with detailed description of common functions omitted.

[0066] The physical property calculation server 110A functionally includes a creation unit 32, a calculation unit 36A, and a selection unit 38A. The physical property calculation server 110A also includes a calculation formula storage unit 40 and a storage area in which a material DB 42 is stored.

[0067] The calculation unit 36A receives the specified conditions from the person in charge terminal 110B, and calculates the physical property values ​​of the substrate based on the received specified conditions and the integrated calculation formula stored in the calculation formula storage unit 40. The calculation unit 36A transmits the calculated physical property values ​​of the substrate to the person in charge terminal 110B.

[0068] The selection unit 38A selects from the material DB 42 a material having the closest physical property values ​​to the material physical property values ​​of the specified conditions, and transmits the selected material to the person in charge terminal 110B as a candidate material that will achieve the calculated board physical property values.

[0069] The person in charge terminal 110B is an information processing terminal such as a personal computer, tablet terminal, smartphone, etc. held by the person in charge. Functionally, the person in charge terminal 110B includes a reception unit 32B and a display control unit 38B.

[0070] The reception unit 32B transmits the specified conditions received via the reception display screen 50 to the physical property calculation server 110A.

[0071] The display control unit 38 displays the substrate physical property values ​​and candidate materials transmitted from the physical property calculation server 110A on the reception display screen 50.

[0072] According to the second modification, multiple personnel can use the services provided by the physical property calculation system 100 via their own personnel terminals 110B, and the processing load on each personnel terminal 110B can be reduced.

[0073] In the above embodiment, the elastic modulus and CTE are calculated as the physical property values ​​of the substrate, but the physical property values ​​are not limited to these as long as they can be calculated using the rule of mixtures. For example, the physical property values ​​may be thermal conductivity, electrical conductivity, resistivity, relative dielectric constant, Poisson's ratio, modulus of rigidity, mass density, etc.

[0074] In addition, although the case where the residual copper ratio is used as an example of a predetermined parameter that affects the substrate physical property values ​​of a semiconductor package substrate has been described, the predetermined parameter may also be the volume ratio of the glass cloth that constitutes the copper-clad laminate, the volume ratio of the resin filler, the volume ratio of the solder for joining the semiconductor element to the substrate, the volume ratio of the components built into the substrate, the volume ratio of the copper and hole-filling resin in the through-holes, etc.

[0075] Furthermore, the physical property calculation process executed by the CPU in the above embodiment by reading software (programs) may be executed by various processors other than the CPU. Examples of such processors include dedicated electrical circuits, such as programmable logic devices (PLDs) (such as field-programmable gate arrays (FPGAs)) whose circuit configuration can be changed after manufacture, and application-specific integrated circuits (ASICs) that are processors with circuit configurations specifically designed to execute specific processes. Furthermore, the physical property calculation process may be executed by one of these various processors, or by a combination of two or more processors of the same or different types (e.g., multiple FPGAs, or a combination of a CPU and an FPGA). Furthermore, the hardware structure of these various processors is, more specifically, an electrical circuit that combines circuit elements such as semiconductor elements.

[0076] In the above embodiment, the physical property calculation program is pre-stored (installed) in a storage device, but this is not limiting. The program may be provided in a form stored in a storage medium such as a CD-ROM, a DVD-ROM, or a USB memory. The program may also be downloaded from an external device via a network.

[0077] <Additional Items> (Additional Item 1) A physical property calculation device including: a receiving unit that receives material physical property values ​​of each of a plurality of materials constituting a semiconductor package substrate to be calculated, a stacking order of each of the plurality of materials, and values ​​of predetermined parameters that affect substrate physical property values ​​of the semiconductor package substrate; and a calculation unit that calculates substrate physical property values ​​of the semiconductor package substrate to be calculated using an integrated calculation formula that adds together, by a predetermined coefficient, a first calculation formula for calculating, by a rule of mixture, a change in the substrate physical property value with respect to the predetermined parameter when stress is applied to the semiconductor package substrate in a fiber direction of a material, and a second calculation formula for calculating, by a rule of mixture, a change in the substrate physical property value with respect to the predetermined parameter when stress is applied to the semiconductor package substrate in a direction perpendicular to the fiber direction, wherein the coefficient has been adjusted so that the substrate physical property value calculated by the integrated calculation formula matches a simulation result of the substrate physical property value.

[0078] (Supplementary Item 2) The physical property calculation device according to Supplementary Item 1 further includes a display control unit that displays on a display device a screen including a first area for receiving, by the receiving unit, the material physical property values ​​of each of a plurality of materials that constitute the semiconductor package substrate to be calculated, the stacking order of each of the plurality of materials, and the values ​​of the predetermined parameters, and a second area for displaying the calculation results by the calculation unit.

[0079] (Supplementary Item 3) The physical property calculation device according to Supplementary Item 2, wherein the display control unit selects and presents a material having a material property value closest to the material property value specified in the first area from a plurality of pre-registered materials for at least one of the plurality of materials.

[0080] (Supplementary Item 4) The physical property calculation device according to any one of Supplementary Items 1 to 3, wherein the calculation unit calculates the physical property values ​​of the wiring layers using the integrated calculation formula, and calculates the substrate physical property values ​​by adding up the physical property values ​​of each layer in stacking order.

[0081] (Supplementary Item 5) A physical property calculation device according to any one of Supplementary Items 1 to 4, further including a creation unit that creates the integrated calculation formula to be used in the calculation unit by adjusting the coefficients so that the physical property values ​​of the wiring layer calculated by the integrated calculation formula match the simulation results of the physical property values ​​of the wiring layer.

[0082] (Supplementary Item 6) The physical property calculation device according to Supplementary Item 5, wherein when an actual measurement value of the physical property value of the wiring layer is obtained, the creation unit adjusts the coefficient so that the physical property value of the wiring layer calculated by the integrated calculation formula matches the actual measurement value.

[0083] (Supplementary Item 7) The physical property calculation device according to any one of Supplementary Items 1 to 6, wherein the substrate physical property value is at least one of an elastic modulus and a thermal expansion coefficient.

[0084] (Supplementary Item 8) The physical property calculation device according to any one of Supplementary Items 1 to 7, wherein the predetermined parameter is a copper remaining ratio of a wiring layer.

[0085] REFERENCE SIGNS LIST 10 Physical property calculation device 12 CPU 14 Memory 16 Storage device 18 Input device 20 Output device 22 Storage medium reading device 24 Communication I / F 26 Bus 32 Creation unit 34, 32B Reception unit 36, 36A Calculation unit 38, 38A Display control unit 38B Display control unit 40 Calculation formula storage unit 42 Material DB 50 Reception display screen 52 Material physical property value specification area 54 Layer structure specification area 56 Remaining copper ratio specification area 58 Calculation button 60 Calculation result display area 62 Material candidate display area 100 Physical property calculation system 110A Physical property calculation server 110B Personnel terminal

Claims

1. A physical property calculation device including: a receiving unit that receives material physical property values ​​of each of a plurality of materials that constitute a semiconductor package substrate to be calculated, the stacking order of each of the plurality of materials, and values ​​of predetermined parameters that affect the substrate physical property values ​​of the semiconductor package substrate; and a calculation unit that calculates the substrate physical property values ​​of the semiconductor package substrate to be calculated using an integrated calculation formula that adds together, by a predetermined coefficient, a first calculation formula for calculating, by a rule of mixture, how the substrate physical property value changes with respect to the predetermined parameter when stress is applied to the semiconductor package substrate in the fiber direction of the material, and a second calculation formula for calculating, by a rule of mixture, how the substrate physical property value changes with respect to the predetermined parameter when stress is applied to the semiconductor package substrate in a direction perpendicular to the fiber direction, wherein the coefficient has been adjusted so that the substrate physical property values ​​calculated by the integrated calculation formula match the simulation results of the substrate physical property values.

2. The physical property calculation device according to claim 1, further comprising a display control unit that displays on a display device a screen including a first area for receiving, by the receiving unit, the material physical property values ​​of each of the plurality of materials that constitute the semiconductor package substrate to be calculated, the stacking order of each of the plurality of materials, and the values ​​of the predetermined parameters, and a second area for displaying the results of calculation by the calculation unit.

3. The physical property calculation device according to claim 2, wherein the display control unit selects and presents, from a plurality of pre-registered materials, a material having a material property value closest to the material property value specified in the first area for at least one of the plurality of materials.

4. A physical property calculation device according to any one of claims 1 to 3, wherein the calculation unit calculates the physical property values ​​of the wiring layers using the integrated calculation formula, and calculates the board physical property values ​​by adding up the physical property values ​​of each layer in stacking order.

5. A physical property calculation device according to any one of claims 1 to 3, further comprising a creation unit that creates the integrated calculation formula to be used in the calculation unit by adjusting the coefficients so that the physical property values ​​of the wiring layer calculated by the integrated calculation formula match the simulation results of the physical property values ​​of the wiring layer.

6. A physical property calculation device according to claim 5, wherein when an actual measurement value of the physical property value of the wiring layer is obtained, the creation unit adjusts the coefficient so that the physical property value of the wiring layer calculated by the integrated calculation formula matches the actual measurement value.

7. A physical property calculation device according to any one of claims 1 to 3, wherein the substrate physical property value is at least one of the modulus of elasticity and the coefficient of thermal expansion.

8. A physical property calculation device according to any one of claims 1 to 3, wherein the predetermined parameter is the copper remaining ratio of the wiring layer.

9. A physical property calculation method in which a computer executes processes including: receiving material physical property values ​​of each of a plurality of materials constituting a semiconductor package substrate to be calculated, the stacking order of each of the plurality of materials, and values ​​of predetermined parameters that affect the substrate physical property values ​​of the semiconductor package substrate; and calculating substrate physical property values ​​of the semiconductor package substrate to be calculated using an integrated formula obtained by adding, by a predetermined coefficient, a first formula for calculating, by a rule of mixture, how the substrate physical property values ​​change with respect to the predetermined parameter when stress is applied to the semiconductor package substrate in the fiber direction of the material, and a second formula for calculating, by a rule of mixture, how the substrate physical property values ​​change with respect to the predetermined parameter when stress is applied to the semiconductor package substrate in a direction perpendicular to the fiber direction, wherein the coefficient has been adjusted so that the substrate physical property values ​​calculated by the integrated formula match the simulation results of the substrate physical property values.

10. A physical property calculation program that causes a computer to function as: a receiving unit that receives material physical property values ​​of each of a plurality of materials that constitute a semiconductor package substrate to be calculated, the stacking order of each of the plurality of materials, and values ​​of predetermined parameters that affect the substrate physical property values ​​of the semiconductor package substrate; and a calculation unit that calculates substrate physical property values ​​of the semiconductor package substrate to be calculated using an integrated calculation formula that adds, by a predetermined coefficient, a first calculation formula for calculating, by a rule of mixture, how the substrate physical property values ​​change with respect to the predetermined parameter when stress is applied to the semiconductor package substrate in the fiber direction of the material, and a second calculation formula for calculating, by a rule of mixture, how the substrate physical property values ​​change with respect to the predetermined parameter when stress is applied to the semiconductor package substrate in a direction perpendicular to the fiber direction, wherein the coefficient has been adjusted so that the substrate physical property values ​​calculated by the integrated calculation formula match the simulation results of the substrate physical property values.

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