Electronic device comprising conductive connector

Abstract

This electronic device may include: a bracket including a conductive portion; a display including a conductive layer; a conductive connector disposed between the conductive layer of the display and the conductive portion of the bracket and in contact with the conductive layer of the display; and a conductive adhesive for attaching the conductive connector to the conductive portion of the bracket, wherein the conductive connector includes an interior part including an elastic foam, an exterior part including a conductive woven layer, a coating portion attached to an inner surface of the conductive woven layer and formed of an elastic material, and an adhesive for attaching the interior part to the coating portion attached to the exterior part.

Description

Electronic device comprising a conductive connecting member

[0001] The present disclosure relates to an electronic device including a conductive connecting member.

[0002] Portable electronic devices may include an antenna or antenna circuit for communication with external devices. To ensure the performance of the antenna and antenna circuit, conductive parts within the electronic device may be utilized as ground. To connect multiple conductive parts, the portable electronic device may include a conductive connecting member.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] An electronic device may include a bracket. The bracket may include a conductive portion. The electronic device may further include a display. The display may include a conductive layer. The electronic device may further include a conductive connecting member. The conductive connecting member is disposed between the conductive layer of the display and the conductive portion of the bracket, and may be in contact with the conductive layer of the display. The electronic device may further include a conductive adhesive. The conductive adhesive may attach the conductive connecting member to the conductive portion of the bracket. The conductive connecting member may include an interior part and an exterior part. The interior part may include an elastic foam. The exterior part may include a conductive woven layer. The conductive connecting member may include a coating part. The coating part may be attached to an inner surface of the conductive woven layer of the exterior part. The conductive connecting member may further include an adhesive. The above adhesive can attach the interior part to the coating portion.

[0005] An electronic device may include a bracket, a display on the bracket, and a conductive connection member electrically connecting a conductive portion of the bracket and a conductive layer of the display facing the conductive portion of the bracket. The conductive connection member may include an elastic foam. The conductive connection member may further include an adhesive on a first surface of the elastic foam facing the conductive layer of the display and a second surface of the elastic foam facing the conductive portion of the bracket. The conductive connection member may include a coating on an outer surface of the adhesive. The conductive connection member may include a conductive shell disposed along an outer surface of the coating and in contact with the conductive portion of the bracket and the conductive layer of the display, thereby providing a conductive path between the conductive portion of the bracket and the conductive layer of the display. A portion of the coating may fill a groove on a surface of the conductive shell.

[0006] Figure 1 illustrates an electronic device according to one embodiment.

[0007] Figure 2 is an exploded perspective view of an electronic device according to one embodiment.

[0008] FIG. 3 is a plan view illustrating a bracket of an electronic device according to one embodiment.

[0009] FIG. 4 is a cross-sectional view of an electronic device, according to one embodiment, showing a portion where a conductive connector connecting a display and a bracket is disposed.

[0010] Figure 5 is an enlarged cross-sectional view of the periphery of the conductive connector.

[0011] Figure 6 is a perspective view of an exemplary conductive connector.

[0012] Figure 7 is a plan view of an exemplary conductive connector.

[0013] Fig. 8 shows an exemplary manufacturing process of a conductive connector.

[0014] Figure 9a shows an exemplary process for forming a coated fabric.

[0015] Figure 9b shows an exemplary process for coating a conductive woven layer.

[0016] Figures 9c and 9d illustrate an exemplary process for forming a conductive connector using a conductive woven layer and an elastic foam.

[0017] FIG. 10 is a block diagram of an electronic device within a network environment according to one embodiment.

[0018] Figure 1 illustrates an electronic device according to one embodiment.

[0019] Referring to FIG. 1, an electronic device (100) according to one embodiment may include a housing (110) forming an exterior of the electronic device (100). For example, the housing (110) may include a first side (or front side) (100A), a second side (or back side) (100B), and a third side (or side surface) (100C) surrounding a space between the first side (100A) and the second side (100B). In one embodiment, the housing (110) may also refer to a structure (e.g., a frame structure (140) of FIG. 2) forming at least a portion of the first side (100A), the second side (100B), and / or the third side (100C).

[0020] An electronic device (100) according to one embodiment may include a substantially transparent front plate (102). In one embodiment, the front plate (102) may form at least a portion of the first surface (100A). In one embodiment, the front plate (102) may include, for example, a glass plate including various coating layers, or a polymer plate, although the present disclosure is not limited to the above embodiment.

[0021] An electronic device (100) according to one embodiment may include a substantially opaque back plate (111). In one embodiment, the back plate (111) may form at least a portion of the second surface (100B). In one embodiment, the back plate (111) may be formed of a coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials.

[0022] An electronic device (100) according to one embodiment may include a side bezel structure (or side member) (118) (e.g., a side wall (141) of a frame structure (140) of FIG. 2). In one embodiment, the side bezel structure (118) may be combined with a front plate (102) and / or a rear plate (111) to form at least a portion of a third side (100C) of the electronic device (100). For example, the side bezel structure (118) may form the entire third side (100C) of the electronic device (100). In one embodiment, the side bezel structure (118) may form the third side (100C) of the electronic device (100) together with the front plate (102) and / or the rear plate (111).

[0023] In one embodiment, when the third side (100C) of the electronic device (100) is partially formed by the front plate (102) and / or the rear plate (111), the front plate (102) and / or the rear plate (111) may include a region that extends seamlessly from its edge toward the rear plate (111) and / or the front plate (102). The extending region of the front plate (102) and / or the rear plate (111) may be located, for example, at both ends of a long edge of the electronic device (100), but embodiments of the present disclosure are not limited to the above-described example.

[0024] In one embodiment, the side bezel structure (118) may comprise a metal and / or a polymer. In one embodiment, the back plate (111) and the side bezel structure (118) may be formed integrally and may comprise the same material (e.g., a metal material such as aluminum), although embodiments of the present disclosure are not limited thereto. For example, the back plate (111) and the side bezel structure (118) may be formed as separate components and / or may comprise different materials.

[0025] In one embodiment, the electronic device (100) may include at least one of a display (101), an audio module (103, 104, 107), a sensor module, a camera module (105, 112, 113), a key input device (117), a light-emitting element, and / or a connector hole. In one embodiment, the electronic device (100) may omit at least one of the above components (e.g., the key input device (117) or the light-emitting element) or may additionally include other components.

[0026] In one embodiment, the display (101) (e.g., the display module (1060) of FIG. 10) may be visually exposed through a substantial portion of the front plate (102). For example, at least a portion of the display (101) may be visible through the front plate (102) forming the first surface (100A). In one embodiment, the display (101) may be disposed on the back surface of the front plate (102).

[0027] In one embodiment, the outer shape of the display (101) may be formed to be substantially the same as the outer shape of the front plate (102) adjacent to the display (101). In one embodiment, in order to expand the area where the display (101) is visually exposed, the gap between the outer shape of the display (101) and the outer shape of the front plate (102) may be formed to be substantially the same.

[0028] In one embodiment, the display (101) (or the first surface (100A) of the electronic device (100)) may include a screen display area (101A). In one embodiment, the display (101) may provide visual information to a user through the screen display area (101A). In the illustrated embodiment, when the first surface (100A) is viewed from the front, the screen display area (101A) is depicted as being positioned on the inside of the first surface (100A) and spaced apart from the outer edge of the first surface (100A), but embodiments of the present disclosure are not limited thereto. In one embodiment, when the first surface (100A) is viewed from the front, at least a portion of an edge of the screen display area (101A) may substantially coincide with an edge of the first surface (100A) (or the front plate (102)).

[0029] In one embodiment, the screen display area (101A) may include a sensing area (101B) configured to acquire biometric information of the user. Here, the meaning of "the screen display area (101A) includes the sensing area (101B)" may be understood to mean that at least a portion of the sensing area (101B) may overlap the screen display area (101A). For example, the sensing area (101B) may be an area capable of displaying visual information by the display (101) like other areas of the screen display area (101A) and additionally capable of acquiring biometric information of the user (e.g., a fingerprint). In one embodiment, the sensing area (101B) may also be formed in the key input device (117).

[0030] In one embodiment, the display (101) may include an area where a first camera module (105) (e.g., camera module (1080) of FIG. 10) is positioned. In one embodiment, an opening is formed in the area of ​​the display (101), and the first camera module (105) (e.g., a punch hole camera) may be at least partially positioned within the opening so as to face the first surface (100A). For example, the screen display area (101A) may surround at least a portion of an edge of the opening. In one embodiment, the first camera module (105) (e.g., an under display camera (UDC)) may be positioned under the display (101) so as to overlap the area of ​​the display (101). For example, the display (101) can provide visual information to the user through the above area, and additionally, the first camera module (105) can obtain an image corresponding to a direction toward the first surface (100A) through the above area of ​​the display (101).

[0031] In one embodiment, the display (101) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen.

[0032] In one embodiment, the audio module (103, 104, 107) (e.g., audio module (1070) of FIG. 10) may include a microphone hole (103, 104) and a speaker hole (107).

[0033] In one embodiment, the microphone holes (103, 104) may include a first microphone hole (103) formed in a portion of the third surface (100C) and a second microphone hole (104) formed in a portion of the second surface (100B). A microphone for acquiring external sound may be placed inside the microphone holes (103, 104). The microphone may include multiple microphones to detect the direction of the sound.

[0034] In one embodiment, a second microphone hole (104) formed in a portion of the second surface (100B) may be positioned adjacent to a camera module (105, 112, 113). For example, the second microphone hole (104) may acquire sound according to the operation of the camera module (105, 112, 113). However, the embodiments of the present disclosure are not limited thereto.

[0035] In one embodiment, the speaker hole (107) may include an external speaker hole (107) and a call receiver hole. The external speaker hole (107) may be formed on a part of the third surface (100C) of the electronic device (100). In one embodiment, the external speaker hole (107) may be implemented as a single hole with the microphone hole (103). In one embodiment, the call receiver hole may be formed on another part of the third surface (100C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (107) on the third surface (100C). For example, with reference to the illustration in FIG. 1, the external speaker hole (107) may be formed on the third surface (100C) corresponding to the lower portion of the electronic device (100), and the call receiver hole may be formed on the third surface (100C) corresponding to the upper portion of the electronic device (100). However, the embodiments of the present disclosure are not limited thereto, and in one embodiment, the call receiver hole may be formed in a location other than the third surface (100C). For example, the call receiver hole may be formed by a spaced space between the front plate (102) (or display (101)) and the side bezel structure (118).

[0036] In one embodiment, the electronic device (100) may include at least one speaker configured to output sound to the exterior of the housing (110) through an external speaker hole (107) and / or a call receiver hole.

[0037] In one embodiment, a sensor module (e.g., sensor module (1076) of FIG. 10) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (100) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0038] In one embodiment, a camera module (105, 112, 113) (e.g., camera module (1080) of FIG. 10) may include a first camera module (105) positioned to face a first side (100A) of an electronic device (100), a second camera module (112) positioned to face a second side (100B), and a flash (113).

[0039] In one embodiment, the second camera module (112) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera module (112) is not necessarily limited to including multiple cameras and may include a single camera.

[0040] In one embodiment, the first camera module (105) and the second camera module (112) may include one or more lenses, image sensors, and / or image signal processors.

[0041] In one embodiment, the flash (113) may include, for example, a light emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (100).

[0042] In one embodiment, a key input device (117) (e.g., input module (1050) of FIG. 10) may be disposed on a third side (100C) of the electronic device (100). In one embodiment, the electronic device (100) may not include some or all of the key input devices (117), and the key input devices (117) that are not included may be implemented in another form, such as a soft key, on the display (101).

[0043] In one embodiment, a connector hole may be formed on the third surface (100C) of the electronic device (100) so that a connector of an external device can be accommodated. A connection terminal (e.g., connection terminal (1078) of FIG. 10) electrically connected to the connector of the external device may be arranged within the connector hole. The electronic device (100) according to one embodiment may include an interface module (e.g., interface (1077) of FIG. 10) for processing electrical signals transmitted and received through the connection terminal.

[0044] In one embodiment, the electronic device (100) may include a light-emitting element. For example, the light-emitting element may be disposed on a first surface (100A) of the housing (110). The light-emitting element may provide status information of the electronic device (100) in the form of light. In one embodiment, the light-emitting element may provide a light source that is linked to the operation of the first camera module (105). For example, the light-emitting element may include an LED, an IR LED, and / or a xenon lamp.

[0045] Figure 2 is an exploded perspective view of an electronic device according to one embodiment.

[0046] In the following, redundant descriptions of configurations having the same reference numerals as the configurations described above are omitted.

[0047] Referring to FIG. 2, an electronic device (100) according to one embodiment may include a frame structure (140), a first printed circuit board (150), a second printed circuit board (152), a cover plate (160), and a battery (170).

[0048] In one embodiment, the frame structure (140) may include a side wall (141) forming an exterior of the electronic device (100) (e.g., the third side (100C) of FIG. 1) and a support portion (143) extending inwardly from the side wall (141). In one embodiment, the frame structure (140) may be disposed between the display (101) and the back plate (111). In one embodiment, the side wall (141) of the frame structure (140) may surround a space between the back plate (111) and the front plate (102) (and / or the display (101)), and the support portion (143) of the frame structure (140) may extend from the side wall (141) within the space. According to one embodiment, a side wall (141) forming a side surface of an electronic device (100) (e.g., a third surface (100C) of FIG. 1) may include a speaker hole (107) connecting the inside and the outside of the electronic device (100). The speaker hole (107) may penetrate the side wall (141).

[0049] In one embodiment, the frame structure (140) may support or accommodate other components included in the electronic device (100). For example, a display (101) may be disposed on one side of the frame structure (140) facing one direction (e.g., +z direction), and the display (101) may be supported by a support portion (143) of the frame structure (140). In one embodiment, a first printed circuit board (150), a second printed circuit board (152), a battery (170), and a second camera module (112) may be disposed on the other side of the frame structure (140) facing the opposite direction (e.g., -z direction). The first printed circuit board (150), the second printed circuit board (152), the battery (170), and the second camera module (112) can each be mounted in a recess defined by a side wall (141) and / or a support portion (143) of the frame structure (140).

[0050] In one embodiment, the first printed circuit board (150), the second printed circuit board (152), and the battery (170) may be respectively coupled to the frame structure (140). For example, the first printed circuit board (150) and the second printed circuit board (152) may be fixedly disposed to the frame structure (140) via a coupling member, such as a screw. For example, the battery (170) may be fixedly disposed to the frame structure (140) via an adhesive member, such as a double-sided tape. However, embodiments of the present disclosure are not limited to the above-described examples.

[0051] In one embodiment, the cover plate (160) may be disposed between the first printed circuit board (150) and the back plate (111). In one embodiment, the cover plate (160) may be disposed on the first printed circuit board (150). For example, the cover plate (160) may be disposed on a surface of the first printed circuit board (150) facing the -z direction.

[0052] In one embodiment, the cover plate (160) may at least partially overlap the first printed circuit board (150) with respect to the z-axis. In one embodiment, the cover plate (160) may cover at least a portion of the first printed circuit board (150). In this way, the cover plate (160) may protect the first printed circuit board (150) from physical impact or prevent detachment of a connector coupled to the first printed circuit board (150).

[0053] In one embodiment, the cover plate (160) may be fixedly positioned on the first printed circuit board (150) via a joining member (e.g., a screw), or may be joined to the frame structure (140) together with the first printed circuit board (150) via the joining member.

[0054] In one embodiment, the display (101) may be positioned between a frame structure (140) and a front plate (102). For example, the front plate (102) may be positioned on one side (e.g., in the +z direction) of the display (101), and the frame structure (140) may be positioned on the other side (e.g., in the -z direction).

[0055] In one embodiment, the front plate (102) may be coupled with the display (101). For example, the front plate (102) and the display (101) may be adhered to each other via an optical adhesive (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)) interposed between the front plate (102) and the display (101).

[0056] In one embodiment, the front plate (102) may be coupled with a frame structure (140). For example, the front plate (102) may include an outer portion extending outside the display (101) when viewed in the z-axis direction, and may be adhered to the frame structure (140) through an adhesive member (e.g., double-sided tape) disposed between the outer portion of the front plate (102) and the frame structure (140) (e.g., side wall (141)). However, embodiments of the present disclosure are not limited to the above-described examples.

[0057] In one embodiment, the first printed circuit board (150) and / or the second printed circuit board (152) may be equipped with a processor (e.g., the processor (1020) of FIG. 10), a memory (e.g., the memory (1030) of FIG. 10), and / or an interface (e.g., the interface (1077) of FIG. 10). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (100) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector. In one embodiment, the first printed circuit board (150) and the second printed circuit board (152) may be operatively or electrically connected to each other via a connecting member (e.g., a flexible printed circuit board).

[0058] In one embodiment, a battery (170) (e.g., battery (1089) of FIG. 10 ) may power at least one component of the electronic device (100). For example, the battery (170) may include a rechargeable secondary battery or a fuel cell. At least a portion of the battery (170) may be disposed substantially coplanar with the first printed circuit board (150) and / or the second printed circuit board (152).

[0059] An electronic device (100) according to one embodiment may include an antenna module (e.g., antenna module (1097) of FIG. 10). In one embodiment, the antenna module may be disposed between the rear plate (111) and the battery (170). The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna module may, for example, perform short-range communication with an external device or wirelessly transmit and receive power with an external device.

[0060] In one embodiment, the housing (110) of the electronic device (100) may refer to a configuration or structure that forms at least a portion of the exterior of the electronic device (100). In this respect, at least a portion of the front plate (102), the frame structure (140), and / or the rear plate (111) that form the exterior of the electronic device (100) may be referred to as the housing (110) of the electronic device (100).

[0061] FIG. 3 is a plan view illustrating a bracket of an electronic device according to one embodiment. FIG. 4 is a cross-sectional view of an electronic device according to one embodiment, with a portion cut away where a conductive connector connecting a display and a bracket is disposed.

[0062] Referring to FIGS. 3 and 4, the electronic device (100) may include a display (410) (e.g., the display (101) of FIG. 1), a bracket (420) (e.g., the support portion (143) of FIG. 2), and a conductive connecting member (310).

[0063] The display (410) may define at least a portion of the front surface (100A) of the electronic device (100). For example, the display (410) may be or correspond to at least a portion of the exterior of the electronic device (100) (or at least a portion of the exterior of the housing (110). The display (410) may be supported by a bracket (420) (or a support portion (143) of the housing (110)). The display (410) may be disposed on a side wall (141) of a side bezel structure (118) of the housing (110).

[0064] The display (410) may include a plurality of layers (411, 412). Among the plurality of layers (411, 412), the conductive layer (411) facing the interior of the electronic device (100) (or the interior space of the housing (110)) may be formed of a metal material. The conductive layer (411) may be positioned on the rear surface of the display (410) to improve the surface quality of the display (410). The remaining plurality of layers (412) may be disposed on the conductive layer (411). The conductive layer (411) may be formed of a metal material. For example, the metal material may include copper or stainless steel. The remaining plurality of layers (412) may include a display panel for driving the display (410). For example, the plurality of layers (412) may include layers that function as at least one of a transparent member, a polarizer, a color filter, a pixel layer, a touch panel (or a touch pattern), a digitizer, or a thin film transistor. The plurality of layers (412) may be attached to each other by an adhesive or an adhesive layer. In one embodiment, the conductive layer (411) may be formed separately from the display (410) and may be positioned on the back of the display (410). For example, the conductive layer (411) may be positioned as a display support member (e.g., a lattice plate) to support the back of the display (410).

[0065] Among the plurality of layers (412), at least the transparent member may be a cover glass or a window. The window may define at least a portion of the front surface (100A) of the housing (110) or the electronic device (100). The polarizing plate may reduce the amount of light reflected within the display (410) after being incident from the outside of the electronic device (100). As the amount of light reflected within the display (410) is reduced by the polarizing plate, the visibility of the display (410) may be improved. To improve visibility, the display (410) may include a color filter instead of the polarizing plate. However, embodiments of the present disclosure are not limited thereto, and the display (410) may include both the polarizing plate and the color filter. The pixel layer may be configured to provide visual information to the outside. The pixel layer may be configured to emit light of a specified color from each pixel to the outside. The pixel layer may be configured to operate by a thin film transistor. A touch panel or digitizer may be configured to receive external input transmitted through the surface of the display (410).

[0066] The bracket (420) may be positioned in an internal space defined by the housing (110). The bracket (420) may be a part of the housing (110). For example, the housing (110) may include a bracket (420) extending from a side wall (141) toward the internal space.

[0067] The bracket (420) may be formed from a metal material (or conductive material) to have rigidity to form a frame within the electronic device (100). For example, the bracket (420) may include a conductive portion (421). However, embodiments of the present disclosure are not limited thereto, and the bracket (420) may further include a non-conductive portion. The non-conductive portion may be formed from a polymer or an injection-molded material to reduce the weight of the electronic device (100) or improve the functionality of the electronic device (100).

[0068] The conductive portion (421) of the bracket (420) may include a recessed portion (425) formed from a surface facing the display (410). The bracket (420) may be positioned toward the display (410) and may support the display (410) by directly contacting it or by contacting it with other members.

[0069] The conductive connecting member (310) may be disposed between the conductive layer (411) of the display (410) and the conductive portion (421) of the bracket (420). For example, the conductive connecting member (310) may be interposed between the bracket (420) and the display (410). The recessed portion (425) of the bracket (420) may be a part of the conductive portion (421) of the bracket (420). The recessed portion (425) of the bracket (420) may accommodate a part of the conductive connecting member (310). The conductive connecting member (310) may be disposed on the recessed portion (425). For example, the recessed portion (425) may support the conductive connecting member (310). The conductive connecting member (310) placed in the recess portion (425) can support the display (410) by coming into contact with the conductive layer (411) of the display (410).

[0070] According to one embodiment, as shown in FIG. 3, the housing (110) may include one or more conductive portions (341-1, 341-2, 341-3, 341-4, 341-5, 341-6) that function as an antenna (e.g., an antenna module (1097) of FIG. 10) for communication with an external electronic device (e.g., an electronic device (1002) of FIG. 10). The one or more conductive portions (341-1, 341-2, 341-3, 341-4, 341-5, 341-6) may, for example, form at least a portion of a side wall (141) (or a side bezel structure (118)) of the housing (110). For example, the bracket (420) may be combined with a side wall (141) including one or more conductive portions (341-1, 341-2, 341-3, 341-4, 341-5, 341-6), or may be formed integrally with the side wall (141). To improve performance for signals from an external electronic device (1002) and / or a server (e.g., a server (1008) of FIG. 10) received by the electronic device (100) via one or more conductive portions (341-1, 341-2, 341-3, 341-4, 341-5, 341-6) functioning as antennas or for signals transmitted from the electronic device (100) to the external electronic device (1002) and / or the server (1008), the display (410) and the bracket (420) may be configured to function as a ground.

[0071] For example, the conductive layer (411) of the display (410) can be electrically connected to the conductive portion (421) of the bracket (420) through the conductive connecting member (310) that is connected to the conductive layer (411) of the display (410) and the conductive portion (421) of the bracket (420). For example, the conductive layer (411) of the display (410) that is in contact with one side (310a) of the conductive connecting member (310) can be electrically connected to the bracket (420) that is in contact with the other side (310b) of the conductive connecting member (310) that is opposite to the one side (310a) of the conductive connecting member (310) through the conductive connecting member (310). The conductive connecting member (310) may provide (or include) a current path between the conductive portion (421) of the bracket (420) and the conductive layer (411) of the display (410). The other side (310b) of the conductive connecting member (310) may be attached to the recessed portion (425) (or the conductive portion (421) of the bracket (420). The conductive connecting member (310) may be attached to the recessed portion (425) and the conductive layer (411) of the display (410).

[0072] The conductive connecting member (310) may have elasticity. For example, the conductive connecting member (310) may be pressed by the bracket (420) and the display (410) when assembling the electronic device (100). By the pressing, the conductive connecting member (310) may be compressed. The conductive connecting member (310) may be pressed by the display (410) and the bracket (420) within the assembled electronic device (100), thereby pressing the display (410) toward the outside of the electronic device (100) or pressing the bracket (420) toward the rear of the electronic device (100) by the repulsive force (or restoring force) of the conductive connecting member (310). The conductive connecting member (310) having elasticity may be configured to maintain contact with the conductive layer (411) of the bracket (420) and the display (410). The conductive connecting member (310) that applies pressure between the bracket (420) and the display (410) by elasticity can reduce the electrical resistance between the conductive portion of the bracket (420) and the conductive layer (411) of the display (410). For example, the conductive connecting member (310) loosely fitted between the bracket (420) and the display (410) can have a relatively small contact area between the bracket (420) and the display (410), so that the resistance between the conductive layer (411) of the display (410) and the conductive portion (421) of the bracket (420) can increase. The conductive connecting member (310) in close contact with the bracket (420) and the display (410) can have a relatively large contact area between the bracket (420) and the display (410), so that the resistance between the conductive layer (411) of the display (410) and the conductive portion (421) of the bracket (420) can be reduced.When the resistance between the conductive layer (411) of the display (410) and the conductive portion (421) of the bracket (420) is reduced, the flow of current according to the electrical connection between the conductive layer (411) of the display (410) and the conductive portion (421) of the bracket (420) is improved, so that the electronic device (100) can provide the effect of increasing the conductive portion that operates as ground.

[0073] For example, FIG. 3 illustrates an electronic device (100) as including a single conductive connecting member (310). However, embodiments of the present disclosure are not limited thereto. For example, the electronic device (100) may include a plurality of conductive members that provide a current path between a conductive portion (421) of the bracket (420) and a conductive layer (411) of the display (410). The plurality of conductive members may be arranged adjacent to one or more conductive portions of the bracket (420) or sidewall (141) that function as an antenna.

[0074] The electronic device (100) may cause a material (e.g., an adhesive material) that oxidizes the bracket (420) or the conductive connecting member (310) due to pressure applied for contact between the bracket (420) and the conductive connecting member (310) to leak out from the conductive connecting member (310). A structure may be required to reduce oxidation of the conductive connecting member (310) and increase the conductive portion that acts as a ground for the antenna. The structure of the conductive connecting member (310) is described with reference to FIG. 5 described below.

[0075] According to one or more of the embodiments described above, the electronic device (100) may include a conductive connecting member (310) that provides (or includes) a current path by electrically connecting a conductive layer (411) of a display (410) and a bracket (420). The conductive connecting member (310) may increase a conductive portion that acts as a ground of the electronic device (100) by forming the current path.

[0076] Fig. 5 is an enlarged cross-sectional view of the periphery of a conductive connector. Fig. 6 is a perspective view of an exemplary conductive connector. Fig. 7 is a plan view of an exemplary conductive connector.

[0077] Referring to FIGS. 5, 6, and 7, the electronic device (100) may include a display (410), a conductive connecting member (310), and a bracket (420). The display (410) may include a conductive layer (411). The bracket (420) may include a conductive portion (421). The conductive connecting member (310) may be disposed between the conductive layer (411) of the display (410) and the conductive portion (421) of the bracket (420). The conductive connecting member (310) may be in contact with the conductive layer (411) of the display (410) and the conductive portion (421) of the bracket (420). A conductive connecting member (310) having an outer surface made of a conductive material that comes into contact with the conductive layer (411) of the display (410) and the conductive portion (421) of the bracket (420) can electrically connect the conductive layer (411) of the display (410) and the conductive portion (421) of the bracket (420). The conductive connecting member (310) can be pressed by the display (410) and the bracket (420) to ensure a stable electrical connection between the display (410) and the bracket (420). The conductive connecting member (310) can be brought into close contact with the conductive layer (411) of the display (410) and the conductive portion (421) of the bracket (420) by the pressing. As the conductive connecting member (310) is in close contact with the conductive layer (411) of the display (410) and the conductive portion (421) of the bracket (420), the electrical resistance between the conductive layer (411) of the display (410) and the conductive portion (421) of the bracket (420) can be reduced.

[0078] In some embodiments, the conductive connecting member (310) may include an interior part (510), an exterior part (530), and an adhesive (550).

[0079] The interior part (510) may form (or include) the interior of the conductive connecting member (310). The interior part (510) may include an elastic foam. The interior part (510) formed of an elastic foam may be deformed by an external force. For example, the interior part (510) may be compressed by the display (410) and the bracket (420) when assembling the electronic device (100). The elastic foam of the interior part (510) may be formed from polyurethane (PU). For example, the elastic foam may include PU.

[0080] The exterior part (530) may include a coating (532) and a conductive outer shell (531). The coating (532) may form an inner surface of the exterior part (530). The coating (532) may be referred to as an inner portion of the exterior part (530) in terms of forming the inner surface of the exterior part (530). The conductive outer shell (531) may form an outer surface of the exterior part (530). The conductive outer shell (531) may be referred to as an outer portion in terms of forming the outer surface of the exterior part (530).

[0081] The conductive connecting member (310) may have a hexahedral shape. For example, one side (310a) of the conductive connecting member (310) may be in contact with the display (410). The one side (310a) of the conductive connecting member (310) may be referred to as an upper side. The other side (310b) of the conductive connecting member (310) facing the one side (310a) may face the conductive portion (421) of the bracket (420). The other side (310b) of the conductive connecting member may be referred to as a lower side. The conductive connecting member (310) may include side surfaces (310c, 310d) connecting the one side (310a) and the other side (310b).

[0082] The exterior part (530) may be disposed on one side (310a) of the conductive connecting member (310) facing the conductive layer (411) of the display (410), the other side (310b) of the bracket (420) facing the conductive portion (421), and two side surfaces (310c, 310d) spaced apart from each other among the four side surfaces (310a) and the other side (310b). The interior part (510) (made of elastic foam) may be exposed from the (remaining) two side surfaces (310d) among the four side surfaces (310c, 310d) of the conductive connecting member (310).

[0083] The conductive outer sheath (531) may include conductive weft yarns (711) and conductive warp yarns (712). The conductive outer sheath (531) may be woven by the conductive weft yarns (711) and the conductive warp yarns (712). An outer portion of the exterior part (530) including the conductive outer sheath (531) may include at least one non-conductive portion formed from an elastic material (e.g., PU) positioned within one or more gaps (g) defined by the conductive weft yarns (711) and the conductive warp yarns (712). The non-conductive portion may include the same material as the coating (532). For example, the non-conductive portion may be a part of the coating (532). The non-conductive portion may be connected or bonded to the coating (532). The non-conductive portion may be a part of the coating (532). The coating (532) may include an elastic material (e.g., PU) identical to the elastic foam. The inner portion (e.g., coating (532)) of the exterior part (530) may be connected to the non-conductive portion of the outer portion of the exterior part (530). For example, a portion of the coating (532) may at least partially fill gaps (g) (or grooves) formed on the surface of the conductive outer sheath (531) (or conductive woven layer). The gaps (g) may be formed by weaving the conductive weft yarn (711) and the conductive warp yarn (712). The gaps (g) of the conductive outer sheath (531) may be connected to each other and may extend from one side of the conductive outer sheath (531) to the other side. The gaps (g) of the conductive outer sheath (531) may represent paths or holes connecting the outer surface and the inner surface of the conductive outer sheath (531). The conductive outer layer (531) can be represented as a conductive woven layer in terms of the conductive weft (711) and conductive warp (712) being woven together.

[0084] The conductive weft (711) and the conductive warp (712) forming the conductive outer sheath (531) may be represented by conductive fibers. Each of the conductive weft (711) and the conductive warp (712) may include a fiber (531a) and a conductive coating (531b). In one embodiment, at least one of the conductive weft (711) or the conductive warp (712) may include a fiber (531a) and a conductive coating (531b). The fiber (531a) may represent the core of the conductive weft (711) and the conductive warp (712). The fiber (531a) may include a polymer material and may be thin and flexible. The conductive coating (531b) may wrap around the fiber (531a) laterally. The conductive coating (531b) may be coated along the outer surface of the fiber (531a). The conductive coating (531b) may be plated on the outer surface of the fiber (531a). The conductive coating (531b) may include nickel (Ni), copper (Cu), gold (Au), and / or silver (Ag). For example, the conductive coating (531b) may be plated or coated with nickel (Ni), copper (Cu), gold (Au), and / or silver (Ag) on ​​the outer surface of the fiber (531a).

[0085] Conductive weft (711) and conductive warp (712) including conductive coating (531b) arranged along the outer surface of fiber (531a) are woven so that the conductive coatings of the conductive weft (711) and the conductive warp (712) can contact each other. The conductive coatings of the conductive weft (711) and the conductive warp (712) can provide (or include) the outer surface of a conductive connecting member (310) having conductivity. The conductive connecting member (310) having conductivity can electrically connect the conductive layer (411) of the display (410) and the conductive portion (421) of the bracket (420). The conductive connecting member (310) can provide (or include) a conductive path between the conductive layer (411) of the display (410) and the conductive portion (421) of the bracket (420). For example, the conductive layer (411) of the display (410) and the conductive portion (421) of the bracket (420) connected by the conductive thread (711) and the conductive slope (712) of the conductive connecting member (310) can be configured to function as a ground.

[0086] The interior part (510) and the exterior part (530) can be joined by an adhesive (550). The adhesive (550) can be placed between the interior part (510) and the exterior part (530). The adhesive (550) can contact the inner portions of the interior part (510) and the exterior part (530). For example, the adhesive (550) can contact the outer surface of the elastic foam of the interior part (510), and the adhesive (550) can contact the coating (532) of the exterior part (530).

[0087] When the coating (532) is omitted from the conductive connecting member (310), the adhesive (550) in contact with the inner surface of the exterior part (530) can flow out of the conductive connecting member (310) through the gap (g) formed in the conductive outer covering (531) of the exterior part (530). The conductive outer covering (531) of the exterior part (530) is woven by conductive weft (711) and conductive warp (712) and can include a gap (g) positioned between the conductive weft (711) and the conductive warp (712). There can be a plurality of gaps (g). The plurality of gaps can be connected to each other to connect one side and the other side of the conductive outer covering (531). For example, a gap formed on one side of the conductive shell (531) may be connected to a gap disposed on the other side of the conductive shell (531). In one embodiment, some of the gaps may penetrate the conductive shell (531) to connect one side of the conductive shell (531) to the other side. The adhesive (550) may flow to the outer surface of the conductive connecting member (310) through the gaps or gaps that provide a passage connecting the two sides of the conductive shell (531). The coating (532) may reduce the transfer of the adhesive (550) to the conductive shell (531) by filling a portion of the gap (g) formed in the conductive shell (531). The adhesive (550) may include an acrylic oligomer, an acrylic copolymer, a tackifier, or a combination of exemplary adhesive components. The adhesive (550) may include a carboxyl group (-COOH) to enhance adhesive strength. The carboxyl group is not bound to the polymer structure of the adhesive (550) at high temperatures or pressures and can move freely between polymer structures.When assembling the electronic device (100) (e.g., when assembling the display (410) and the housing (110)), if the conductive connecting member (310) is pressed or the conductive layer (411) of the display (410) or the conductive portion (421) of the bracket (420) is pressed by the restoring force of the conductive connecting member (310), the carboxyl group in the adhesive (550) may flow out to the outside of the conductive connecting member (310). The carboxyl group that flows out to the outside of the conductive connecting member (310) has acidity and may increase reactivity with surrounding metals. As the reactivity increases, an oxide film may be formed on the surface of the metal that comes into contact with the carboxyl group. For example, the conductive layer (411) of the display (410) in contact with the conductive connecting member (310), the conductive portion (421) of the bracket (420) in contact with the conductive connecting member (310), or the outer surface of the conductive connecting member (310) may be oxidized by the carboxyl group released from the adhesive (550) to form a film. By the oxidation film, the resistance of the surface of the counterpart in contact with the conductive connecting member (310) may increase, thereby impeding the flow of current or blocking a portion of the electrical path.

[0088] In order to improve the electrical connection between the conductive layer (411) of the display (410) and the conductive portion (421) of the bracket (420) by the conductive connecting member (310), the conductive connecting member (310) may further include a coating (532) to reduce the outflow of carboxyl groups. For example, the coating (532) may be configured to restrict the adhesive (550) from flowing toward the display (410) or the conductive adhesive (570) through one or more gaps of the exterior part (530). The coating (532) may fill a portion of the gap on the inner surface of the conductive outer shell (531). For example, the coating (532) may be disposed on the inner surface of the conductive outer shell (531) and may be introduced into a portion of the gap (g) while being thermally compressed. A coating (532) that has undergone a thermal compression process may be attached to a conductive outer shell (531). The coating (532) may at least partially fill a gap among gaps disposed in the conductive outer shell (531) that contacts the coating (532). For example, a portion of the coating (532) (or a non-conductive portion disposed on an outer portion of the exterior part (530)) may at least partially fill a gap located at a boundary surface of the outer portion of the exterior part (530) that contacts an inner portion of the exterior part (530) among the one or more gaps. As a portion of the gap (g) is filled by the coating (532), the adhesive (550) may be configured to restrict migration of the adhesive (550) through the gap (g) to the outside of the conductive connecting member (310).

[0089] The coating (532) is formed of an elastic material, thereby maintaining the restoration speed and low resistance of the conductive connecting member (310). The coating (532) can reduce the outflow of the adhesive (550) between the gaps (g) of the conductive outer shell (531) even under high heat and pressure during the assembly process. The coating (532) can reduce the outflow of low molecular weight components (e.g., carboxyl groups (COOH)) of the adhesive (550), thereby reducing oxidation of the outer surface of the conductive outer shell (531) or the conductive connecting member (310), and reducing the peeling of the plating layer of the conductive outer shell (531).

[0090] The electronic device (100) may further include a conductive adhesive (570). The conductive adhesive (570) may attach the conductive connecting member (310) to the conductive portion (421) of the bracket (420). For example, the conductive adhesive (570) may fill a portion of one or more gaps (g) located on the outer surface of the exterior part (530). Some of the gaps (g) filled with the conductive adhesive (570) may face the conductive portion (421) of the bracket (420).

[0091] Other portions of the one or more gaps (g) located on the outer surface of the exterior part (530) may be empty. For example, a conductive adhesive (570) may be disposed on a surface of the exterior part (530) facing the bracket (420). The conductive portion (421) of the bracket (420) may be attached through the conductive adhesive (570) disposed on the surface (310b) of the exterior part (530) facing the bracket (420). The conductive portion (421) of the bracket (420) may be electrically connected to the conductive connecting member (310) through the conductive adhesive (570).

[0092] The conductive adhesive (570) can be attached to the conductive connection member (310) by contacting the other side (310b) of the conductive connection member (310). The conductive adhesive (570) can be attached to the conductive portion (421) of the bracket (420) by contacting the conductive portion (421). The conductive adhesive (570) can electrically connect the bracket (420) and the conductive connection member (310). The conductive adhesive (570) can include conductive particles. By pressing the conductive adhesive (570), the conductive particles can come into contact with each other. The conductive particles that come into contact with each other can electrically connect the conductive portion (421) of the bracket (420) and the conductive connection member (310). Through the interconnected conductive particles, the conductive portion (421) of the bracket (420) can be electrically connected to the conductive layer (411) of the display (410).

[0093] The conductive connecting member (310) may further include a conductive layer (590). The conductive layer (590) included in the conductive connecting member (310) may define another side (310b) of the conductive connecting member (310). The other side (310b) of the conductive connecting member (310) may represent a side facing the conductive portion (421) of the bracket (420). For example, the conductive layer (590) of the conductive connecting member (310) may be disposed on one side of the exterior part (530) facing the conductive portion (421) of the bracket (420) of the conductive connecting member (310). The conductive layer (590) of the conductive connecting member (310) may include gold (Au) or silver (Ag). For example, the conductive layer (590) of the conductive connecting member (310) may be formed by plating or depositing nickel (Ni), copper (Cu), gold (Au), and / or silver (Ag) on ​​one surface of the exterior part (530) of the conductive connecting member (310). The one surface of the exterior part (530) on which the plating or metal material is deposited may be in contact with the conductive adhesive (570) disposed on the conductive portion (421). For example, the one surface of the exterior part (530) may be attached to the conductive adhesive (570). The conductive layer (590) of the conductive connecting member (310) may form an interface between the conductive connecting member (310) and the conductive adhesive (570). The conductive layer (590) of the conductive connecting member (310) formed from gold or silver can provide resistance to chemical reactions by substances (e.g., carboxyl groups) included in the conductive adhesive. For example, the conductive layer (590) of the conductive connecting member (310) formed from gold or silver can reduce oxidation by the adhesive substance of the conductive adhesive (570).Since the surface formed from the conductive layer (590) that comes into contact with the conductive adhesive (570) among the outer surfaces of the conductive connecting member (310) is inhibited from oxidation, the conductive connecting member (310) can provide a stable electrical connection with the conductive portion (421) of the bracket (420) attached to the conductive adhesive (570). For example, the conductive connecting member (310) can increase resistance stability by inhibiting oxidation of the surface of the exterior part (530) of the conductive connecting member (310).

[0094] According to one embodiment, the thicknesses of the components of the conductive connecting member (310) may be as follows. The thickness of the interior part (510) (or elastic foam) may be from about 400 micrometers to about 600 micrometers. The thickness of the adhesive (550) may be from about 5 micrometers to about 10 micrometers. The thickness of the coating (532) may be from about 3 micrometers to about 5 micrometers. The thickness of the conductive outer shell (531) may be from about 20 micrometers to about 25 micrometers. The thickness of the conductive adhesive (570) may be from about 5 micrometers to about 12 micrometers.

[0095] In the above embodiment, the conductive outer shell (531) is described as being woven from a plurality of conductive fibers. However, the embodiments of the present disclosure are not limited thereto. According to one embodiment, the conductive outer shell (531) may have a rough outer surface. A conductive outer shell (531) with a rough outer surface can increase the contact area with the adhesive, thereby improving adhesive strength.

[0096] The electronic device (100) according to the above-described embodiment can electrically connect conductive components (e.g., the conductive layer (411) of the display (410) and the conductive portion (421) of the bracket (420)) through the conductive connecting member (310). The electrically connected conductive components can improve the ground performance of the electronic device and, by improving noise shielding, can improve the radiation performance of the antenna. The coating (532) disposed within the conductive connecting member (310) can reduce oxidation of the surface of the conductive connecting member (310) due to the outflow of carboxyl groups of the adhesive due to the pressing of the conductive connecting member (310). By preventing oxidation of the conductive connecting member (310), the stability of the electrical connection between the conductive layer (411) of the display (410) and the conductive portion (421) of the bracket (420) can be improved.

[0097] Figure 8 illustrates an exemplary manufacturing process for a conductive connector. Figure 9a illustrates an exemplary process for forming a coated fabric. Figure 9b illustrates an exemplary process for coating a conductive woven layer. Figures 9c and 9d illustrate exemplary processes for forming a conductive connector using a conductive woven layer and an elastic foam.

[0098] Referring to FIG. 8, in operation 801, a metal material may be plated on a woven layer. For example, the woven layer may be a fabric woven with weft and warp yarns. The weft and warp yarns may be formed from fibers (e.g., fibers (531a) of FIG. 5 ). The woven layer may include a conductive coating (e.g., conductive coating (531b) of FIG. 5 ) that wraps the fibers (531a) through the plating. The conductive coating (531b) may include nickel (Ni), copper (Cu), gold (Au), and / or silver (Ag). The conductive weft and warp yarns including the conductive coating (531b) may provide a conductive path.

[0099] Referring to FIGS. 8, 9a and 9b, in operation 803, an elastic coating can be performed on a conductive woven layer on which a metal material is plated.

[0100] For elastic coating, a polymer layer (901) having an elastic coating material (903) applied thereto may be prepared. The polymer layer (901) may be moved by rollers (r1, r2, r3). ​​The coating material (903) may be applied to the polymer layer (901) while being moved by roller (r3) among the rollers (r1, r2, r3) that is partially contained in a tank containing the coating material (903) for coating. In one embodiment, the polymer layer (901) may be formed from polyethylene terephthalate (PET).

[0101] Referring to FIGS. 8 and 9B, in operation 803, an elastic coating may be performed on a conductive woven layer on which a metal material is plated. The elastically coated conductive woven layer may function as a conductive outer shell (e.g., a conductive outer shell (531) of FIG. 5) of a conductive connecting member (e.g., a conductive connecting member (310) of FIG. 3). For example, a polymer material may be coated on the conductive woven layer to form an outer shell of the conductive connecting member.

[0102] A polymer layer (901) (to which a coating material (903) is applied) is positioned so as to be in contact with a conductive outer shell (531) (or a conductive woven layer) and can pass through rollers (r4, r5). By means of the rollers (r4, r5), the coating material (903) can be pressed against the conductive outer shell (531). The rollers (r4, r5) apply heat while the coating material (903) is pressed against the conductive outer shell (531), so that a portion of the coating material (903) can permeate into a gap within the conductive outer shell (531). For example, a portion of the coating material (903) can partially fill a gap in the conductive outer shell (531). After the coating material (903) is pressed onto the conductive outer shell (531), the coating material (903) can be cured at room temperature to form the outer shell of the conductive connecting member (310). The coating material (903) can be cured to function as a coating of the conductive connecting member (310) (e.g., coating (532) of FIG. 5). After the coating material (903) is cured, the polymer layer (901) can be removed.

[0103] Referring to FIGS. 8 and 9c, in operation 805, an elastic foam may be attached on an elastic coating layer disposed on the inner surface of the conductive shell.

[0104] An adhesive (550) may be applied on an elastic coating (532) disposed on the inner surface of a conductive outer shell (531) of a conductive connecting member (310). The adhesive (550) may be positioned on the elastic coating (532), and the elastic coating (532) may be configured to limit the adhesive (550) from flowing out to the outer surface of the conductive outer shell (531).

[0105] An adhesive (550) may be applied to the entire surface of the elastic coating (532). An interior part (510) of a conductive connecting member (310) formed of elastic foam may be placed on the elastic coating (532) to which the adhesive (550) has been applied. The elastic foam may be attached to the elastic coating (532) (or the inner surface of the conductive outer shell (531) or the inner surface of the exterior part (530)) by the adhesive (550).

[0106] Referring to FIGS. 8 and 9d, in operation 807, the elastic foam attached on the elastic coating layer can be wrapped with the outer skin of the conductive connecting member to form a conductive connecting member.

[0107] The outer shell (531) (or exterior part (530)) of the conductive connecting member (310) can be wrapped around the outer surface of the interior part (510) formed from elastic foam. The conductive connecting member (310) in which the exterior part (530) wraps the interior part (510) can include the interior part (510) having elastic foam, an adhesive (550), and the exterior part (530).

[0108] The adhesive (550) may be applied along the outer surface of the interior part (510) (or elastic foam). For example, the adhesive (550) may be disposed on one side of the interior part (510) (or elastic foam) facing the conductive layer (e.g., the conductive layer (411) of FIG. 4) of the display (e.g., the display (410) of FIG. 4)) and the other side of the interior part (510) (or elastic foam) facing the conductive portion (e.g., the conductive portion (421) of FIG. 4) of the bracket (e.g., the bracket (420) of FIG. 4).

[0109] The exterior part (530) may include a conductive outer shell (531) and a coating (532). A portion of the coating (532) may fill a groove or gap formed on the surface of the conductive outer shell (531) through thermal transfer in operation 803.

[0110] The coating (532) may be disposed on the outer surface of the adhesive (550). For example, the coating (532) may partially wrap the outer surface of the adhesive (550). The adhesive (550) is applied to the surface of the coating (532), and the exterior part (530) including the coating (532) to which the adhesive (550) is applied wraps the side surface of the interior part (510), so that the coating (532) may be disposed on the outer surface of the adhesive (550) when the conductive connecting member (310) is completed. The coating (532) may be referred to as a coating layer or a coating portion from the side when it is applied to the conductive outer skin (531) of the exterior part (530) to form a single layer.

[0111] The conductive outer shell (531) may be arranged along the outer surface of the coating (532). When assembling an electronic device (e.g., the electronic device (100) of FIG. 1), the conductive outer shell (531) may contact the conductive portion (421) of the bracket (420) and the conductive layer (411) of the display (410), thereby providing a conductive path between the conductive portion (421) of the bracket (420) and the conductive layer (411) of the display (410).

[0112] According to one embodiment, the electronic device can extend the ground by electrically connecting a conductive portion of a bracket and a conductive layer of a display by reducing oxidation of a surface of a conductive connecting member.

[0113] According to one embodiment, the electronic device can provide a stable electrical connection between the conductive portion and the conductive layer by including a conductive connecting member having elasticity.

[0114] In one embodiment, the fibers of the conductive connecting member have elasticity, thereby improving the restoration speed of the conductive connecting member and maintaining low resistance. The conductive connecting member includes an elastic coating, thereby improving the elasticity of the conductive connecting member, reducing the outflow of carboxyl groups, which are low molecular weight components of the adhesive, thereby preventing the formation of an oxide film on the surface of the conductive connecting member, and reducing the loss of the plating layer of the conductive connecting member.

[0115] The technical tasks to be achieved in this document are not limited to the technical tasks mentioned above, and other technical tasks not mentioned will be clearly understood by those with ordinary knowledge in the technical field to which this document pertains.

[0116] According to the above-described embodiment, an electronic device (e.g., electronic device (100) of FIG. 1) may include a bracket (e.g., bracket (420) of FIG. 4) including a conductive portion (e.g., conductive portion (421) of FIG. 4), a display (e.g., display (410) of FIG. 4) including a conductive layer (e.g., conductive layer (411) of FIG. 4). The electronic device may further include a conductive connecting member (e.g., conductive connecting member (310) of FIG. 4). The conductive connecting member may be disposed between the conductive layer of the display and the conductive portion of the bracket. The conductive connecting member may be in contact with the conductive layer of the display. The electronic device may further include a conductive adhesive (e.g., conductive adhesive (570) of FIG. 5). The conductive adhesive may attach the conductive connecting member to the conductive portion of the bracket. The conductive connecting member may include an interior part including an elastic foam (e.g., an interior part (510) of FIG. 5), an exterior part including a conductive woven layer (e.g., an exterior part (530) of FIG. 5), a coating portion attached to an inner surface of the conductive woven layer (e.g., a coating (532) of FIG. 5), and an adhesive (e.g., an adhesive (550) of FIG. 5) that attaches the interior part to the coating portion attached to the exterior part.

[0117] In one embodiment, the conductive woven layer (e.g., the conductive sheath (531) of FIG. 5) may include conductive weft (e.g., the conductive weft (711) of FIG. 7), conductive warp yarn (e.g., the conductive warp yarn (712) of FIG. 7), and at least one non-conductive portion disposed within one or more gaps defined by the conductive weft and the conductive warp yarn (e.g., the gap (g) of FIG. 7). The at least one non-conductive portion and the coating portion may be formed of an elastic material.

[0118] In one embodiment, each of the conductive weft and the conductive warp may include a fiber (e.g., a fiber (531a) of FIG. 5) and a conductive coating (e.g., a conductive coating (531b) of FIG. 5) laterally surrounding the fiber. For example, at least one of the conductive weft and the conductive warp may include the fiber and the conductive coating laterally surrounding the fiber.

[0119] According to one embodiment, the conductive connecting member may include a conductive layer (e.g., conductive layer (590) of FIG. 5) that is in contact with the conductive adhesive and is disposed on one surface of the exterior part.

[0120] In one embodiment, the conductive coating is formed from Ni, Cu, Au, and / or Ag. The conductive layer of the conductive connecting member may be formed from Au and / or Ag to provide resistance to a chemical reaction by a material included in the conductive adhesive. For example, the conductive coating may include Ni, Cu, Au, or Ag. The conductive layer of the conductive connecting member may include Au or Ag, which has resistance to a chemical reaction by a material included in the conductive adhesive.

[0121] In one embodiment, the coating portion can at least partially fill one or more gaps disposed in the conductive woven layer.

[0122] In one embodiment, the conductive adhesive may fill a portion of one or more gaps located on an outer surface of the exterior part, and other portions of the one or more gaps located on the outer surface of the exterior part may be empty. Some of the one or more gaps may face the conductive portion of the bracket or the conductive layer of the display.

[0123] According to one embodiment, the conductive layer of the display and the conductive portion of the bracket connected by the conductive connecting member can be configured to function as a ground.

[0124] According to one embodiment, the elastic foam and the elastic material may include PU (polyurethane).

[0125] In one embodiment, the adhesive of the conductive connecting member may include an acrylic oligomer, an acrylic copolymer, a tackifier, or a combination of the adhesive components.

[0126] In one embodiment, the coating portion may be configured to restrict the adhesive from flowing through one or more gaps of the exterior part toward the display or the conductive adhesive.

[0127] In one embodiment, the conductive connecting member can be compressed by the pressure of the bracket and the display.

[0128] According to one embodiment, the conductive connecting member may have a hexahedral shape.

[0129] According to one embodiment, the exterior part may be disposed on an upper surface of the conductive connecting member facing the conductive layer of the display, a lower surface facing the conductive portion of the bracket, and two side surfaces spaced apart from each other among four side surfaces between the upper surface and the lower surface.

[0130] In one embodiment, the thickness of the elastic foam may be 400 micrometers to 600 micrometers, the thickness of the adhesive may be 5 micrometers to 10 micrometers, the thickness of the interior part may be 3 micrometers to 5 micrometers, the thickness of the exterior part may be 20 micrometers to 25 micrometers, and the thickness of the conductive adhesive layer may be 5 micrometers to 12 micrometers.

[0131] In one embodiment, one side of the conductive connecting member may have a surface roughness according to the weaving of the conductive weft and conductive warp yarns included in the exterior part. The conductive connecting member may provide a wide contact area between the outer portion of the exterior part and the conductive adhesive through the surface roughness.

[0132] According to the above-described embodiment, an electronic device (e.g., an electronic device (100) of FIG. 4) may include a bracket (e.g., a bracket (420) of FIG. 4), a display (e.g., a display (410) of FIG. 4) disposed on the bracket, and a conductive connecting member (e.g., a conductive connecting member (310) of FIG. 4) electrically connecting a conductive portion of the bracket (e.g., a conductive portion (421) of FIG. 4)) and a conductive layer of the display facing the conductive portion of the bracket (e.g., a conductive layer (411) of FIG. 4)). The conductive connecting member may include an elastic foam (e.g., an interior part (510) of FIG. 5), an adhesive (e.g., an adhesive (550) of FIG. 5) disposed on a first side of the elastic foam facing the conductive layer of the display and a second side of the elastic foam facing the conductive portion of the bracket, a coating (e.g., a coating (532) of FIG. 5) disposed on an outer surface of the adhesive, and a conductive shell (e.g., a conductive shell (531) of FIG. 5) disposed along an outer surface of the coating and in contact with the conductive portion of the bracket and the conductive layer of the display, thereby providing a conductive path between the conductive portion of the bracket and the conductive layer of the display. A portion of the coating may fill a groove formed on a surface of the conductive shell.

[0133] In one embodiment, the conductive outer shell may be woven from a plurality of conductive fibers.

[0134] According to one embodiment, the electronic device may further include a conductive adhesive that attaches the conductive connecting member to the conductive portion of the bracket. The conductive connecting member may include a conductive layer that is in contact with the conductive adhesive and is disposed on one surface of the exterior part.

[0135] In one embodiment, the conductive connecting member can be compressed by the pressure of the bracket and the display.

[0136] In one embodiment, the coating may be configured to restrict the adhesive from flowing through the conductive shell toward the bracket or the display.

[0137] According to one embodiment, the electronic device may further include a conductive adhesive that attaches the conductive connecting member to the conductive portion of the bracket.

[0138] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned will be clearly understood by a person having ordinary skill in the art to which the present disclosure pertains.

[0139] FIG. 10 is a block diagram of an electronic device within a network environment according to one embodiment.

[0140] FIG. 10 is a block diagram of an electronic device (1001) within a network environment (1000) according to various embodiments. Referring to FIG. 10, in the network environment (1000), the electronic device (1001) may communicate with the electronic device (1002) via a first network (1098) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (1004) or the server (1008) via a second network (1099) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (1001) may communicate with the electronic device (1004) via the server (1008). According to one embodiment, the electronic device (1001) may include a processor (1020), a memory (1030), an input module (1050), an audio output module (1055), a display module (1060), an audio module (1070), a sensor module (1076), an interface (1077), a connection terminal (1078), a haptic module (1079), a camera module (1080), a power management module (1088), a battery (1089), a communication module (1090), a subscriber identification module (1096), or an antenna module (1097). In some embodiments, the electronic device (1001) may omit at least one of these components (e.g., the connection terminal (1078)), or may have one or more other components added. In some embodiments, some of these components (e.g., sensor module (1076), camera module (1080), or antenna module (1097)) may be integrated into a single component (e.g., display module (1060)).

[0141] The processor (1020) may, for example, execute software (e.g., a program (1040)) to control at least one other component (e.g., a hardware or software component) of the electronic device (1001) connected to the processor (1020) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (1020) may store commands or data received from other components (e.g., a sensor module (1076) or a communication module (1090)) in the volatile memory (1032), process the commands or data stored in the volatile memory (1032), and store result data in the non-volatile memory (1034). According to one embodiment, the processor (1020) may include a main processor (1021) (e.g., a central processing unit or an application processor) or a secondary processor (1023) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (1021). For example, when the electronic device (1001) includes the main processor (1021) and the secondary processor (1023), the secondary processor (1023) may be configured to use less power than the main processor (1021) or to be specialized for a given function. The secondary processor (1023) may be implemented separately from the main processor (1021) or as a part thereof.

[0142] The auxiliary processor (1023) may control at least a portion of functions or states associated with at least one component (e.g., the display module (1060), the sensor module (1076), or the communication module (1090)) of the electronic device (1001), for example, on behalf of the main processor (1021) while the main processor (1021) is in an inactive (e.g., sleep) state, or together with the main processor (1021) while the main processor (1021) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (1023) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (1080) or a communication module (1090)). In one embodiment, the auxiliary processor (1023) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (1001) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (1008)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0143] The memory (1030) can store various data used by at least one component (e.g., the processor (1020) or the sensor module (1076)) of the electronic device (1001). The data can include, for example, software (e.g., the program (1040)) and input data or output data for commands related thereto. The memory (1030) can include volatile memory (1032) or non-volatile memory (1034).

[0144] The program (1040) may be stored as software in memory (1030) and may include, for example, an operating system (1042), middleware (1044), or an application (1046).

[0145] The input module (1050) can receive commands or data to be used in a component of the electronic device (1001) (e.g., a processor (1020)) from an external source (e.g., a user) of the electronic device (1001). The input module (1050) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0146] The audio output module (1055) can output audio signals to the outside of the electronic device (1001). The audio output module (1055) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0147] The display module (1060) can visually provide information to an external party (e.g., a user) of the electronic device (1001). The display module (1060) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (1060) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0148] The audio module (1070) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (1070) can acquire sound through the input module (1050), output sound through the sound output module (1055), or an external electronic device (e.g., electronic device (1002)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (1001).

[0149] The sensor module (1076) can detect the operating status (e.g., power or temperature) of the electronic device (1001) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (1076) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0150] The interface (1077) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (1001) with an external electronic device (e.g., the electronic device (1002)). In one embodiment, the interface (1077) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0151] The connection terminal (1078) may include a connector through which the electronic device (1001) may be physically connected to an external electronic device (e.g., the electronic device (1002)). According to one embodiment, the connection terminal (1078) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0152] The haptic module (1079) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (1079) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0153] The camera module (1080) can capture still images and videos. According to one embodiment, the camera module (1080) may include one or more lenses, image sensors, image signal processors, or flashes.

[0154] The power management module (1088) can manage power supplied to the electronic device (1001). According to one embodiment, the power management module (1088) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0155] A battery (1089) may power at least one component of the electronic device (1001). In one embodiment, the battery (1089) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0156] The communication module (1090) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (1001) and an external electronic device (e.g., electronic device (1002), electronic device (1004), or server (1008)), and the performance of communication through the established communication channel. The communication module (1090) may operate independently from the processor (1020) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (1090) may include a wireless communication module (1092) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (1094) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, a corresponding communication module can communicate with an external electronic device (1004) via a first network (1098) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (1099) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (1092) can verify or authenticate the electronic device (1001) within a communication network such as the first network (1098) or the second network (1099) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (1096).

[0157] The wireless communication module (1092) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimizing terminal power and connecting multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (1092) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (1092) may support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (1092) may support various requirements specified in the electronic device (1001), an external electronic device (e.g., the electronic device (1004)), or a network system (e.g., the second network (1099)). According to one embodiment, the wireless communication module (1092) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL) each, or 1 ms or less for round trip) for URLLC realization.

[0158] The antenna module (1097) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (1097) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (1097) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (1098) or the second network (1099), may be selected from the plurality of antennas by, for example, the communication module (1090). A signal or power may be transmitted or received between the communication module (1090) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (1097).

[0159] According to various embodiments, the antenna module (1097) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0160] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0161] According to one embodiment, commands or data may be transmitted or received between the electronic device (1001) and an external electronic device (1004) via a server (1008) connected to a second network (1099). Each of the external electronic devices (1002 or 1004) may be the same or a different type of device as the electronic device (1001). According to one embodiment, all or part of the operations executed in the electronic device (1001) may be executed in one or more of the external electronic devices (1002, 1004, or 1008). For example, when the electronic device (1001) performs a certain function or service automatically or in response to a request from a user or another device, the electronic device (1001) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (1001). The electronic device (1001) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (1001) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (1004) may include an Internet of Things (IoT) device. The server (1008) may be an intelligent server utilizing machine learning and / or a neural network.According to one embodiment, an external electronic device (1004) or server (1008) may be included in the second network (1099). The electronic device (1001) may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology and IoT-related technology.

[0162] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0163] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0164] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0165] Various embodiments of the present document may be implemented as software (e.g., a program (1040)) including one or more instructions stored in a storage medium (e.g., an internal memory (1036) or an external memory (1038)) readable by a machine (e.g., an electronic device (1001)). For example, a processor (e.g., a processor (1020)) of the machine (e.g., an electronic device (1001)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0166] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0167] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, A bracket containing a challenging portion; A display comprising a conductive layer; A conductive connector disposed between the conductive layer of the display and the conductive portion of the bracket, and in contact with the conductive layer of the display; and A conductive adhesive is included for attaching the conductive connecting member to the conductive portion of the bracket, The above conductive connecting member is, Interior parts containing elastic foam, Exterior part including a challenging woven layer, A coating portion attached to the inner surface of the conductive woven layer of the exterior part, and Including an adhesive for attaching the interior part to the coating part, Electronic devices.

2. In paragraph 1, The above-mentioned conductive woven layer is, challenging sarcasm, challenging slope, and At least one non-conductive portion disposed within one or more gaps defined by the conductive yarn and the conductive inclination, The above coating portion is formed from an elastic material, Electronic devices.

3. In paragraph 2, At least one of the above-mentioned conductive yarn and the above-mentioned conductive yarn is, fibers, and comprising a conductive coating that laterally surrounds the fiber; Electronic devices.

4. In paragraph 1, The above conductive connecting member is, A conductive layer is provided on one surface of the exterior part and is in contact with the conductive adhesive. Electronic devices.

5. In paragraph 4, The above conductive coating, Containing Ni, Cu, Au and / or Ag, The conductive layer of the above conductive connecting member is, To have resistance to chemical reaction by the material in the above-mentioned conductive adhesive, comprising Au and / or Ag, Electronic devices.

6. In paragraph 1, The above coating part, At least partially filling one or more gaps defined by the above conductive woven layer, Electronic devices.

7. In paragraph 1, The above-mentioned challenging adhesive is, A portion of one or more gaps defined by the conductive woven layer on the outer surface of the exterior part is filled, and another portion of the one or more gaps on the outer surface of the exterior part is empty, Some of said one or more gaps are directed toward said conductive portion of said bracket; Electronic devices.

8. In paragraph 1, The conductive layer of the display and the conductive portion of the bracket are connected to each other by the conductive connecting member, The conductive layer of the display and the conductive portion of the bracket are configured to function as a ground. Electronic devices.

9. In paragraph 1, The above elastic foam is, Containing PU (polyurethane), Electronic devices.

10. In paragraph 1, The adhesive of the above conductive connecting member is, Comprising an acrylic oligomer, an acrylic copolymer, a tackifier or a combination thereof, Electronic devices.

11. In paragraph 1, The coating portion is configured to restrict the adhesive from flowing toward the display or the conductive adhesive through one or more gaps of the exterior part defined by the conductive woven layer. Electronic devices.

12. In paragraph 1, The above conductive connecting member is, Compressed by the pressure of the above bracket and the above display, Electronic devices.

13. In paragraph 1, The above conductive connecting member has a hexahedral shape, The above exterior part is, The conductive connecting member is disposed on the upper surface facing the conductive layer of the display, the lower surface facing the conductive portion of the bracket, and two sides spaced apart from each other among the four sides between the upper surface and the lower surface. Electronic devices.

14. In paragraph 1, The thickness of the above elastic foam is 400 micrometers to 600 micrometers, The thickness of the above adhesive is 5 micrometers to 10 micrometers, The thickness of the above coating portion is 3 micrometers to 5 micrometers, The thickness of the above conductive woven layer is 20 micrometers to 25 micrometers, The thickness of the above-mentioned conductive adhesive is 5 micrometers to 12 micrometers, Electronic devices.

15. In paragraph 1, One side of the conductive connecting member has a roughness according to the weaving of the conductive warp and conductive weft included in the exterior part, The conductive connecting member has a contact area between the outer surface of the exterior part and the conductive adhesive through the unevenness. Electronic devices.

Images