Laser processing method

Abstract

The present invention relates to a laser processing method and to a laser processing method for processing a processing line of a substrate by using a laser processing apparatus comprising: a scanner for deflecting a laser beam; a scanning lens for forming a focal point of the laser beam on the substrate; and a stage on which the substrate is seated and moves. A scan field of the scanning lens is divided into a masking area that is not irradiated with the laser beam and an irradiation area which is disposed adjacent to the masking area and irradiated with the laser beam, and the scanner and the stage are driven in synchronization so that the processing line is processed while disposed in the irradiation area.

Description

Laser processing method

[0001] The present invention relates to a laser processing method, and more particularly, to a laser processing method capable of reducing processing defects caused by an error between the actual focal plane of a scanning lens and the processing plane of a substrate.

[0002] A laser processing device uses an optical system to irradiate a laser beam emitted from a laser light source onto a substrate, and performs processing operations such as marking, exposure, etching, punching, scribing, dicing, and cutting on the substrate through irradiation of the laser beam.

[0003] Among the optical systems that transmit laser beams, a scanning lens (e.g., an F-theta lens) is used to focus the laser beam on a plane, but there is an error between the actual focal plane of the scanning lens and the processing plane of the substrate.

[0004] Figure 1 is a drawing for explaining the actual focal plane formed by the scanning lens and the processing plane of the substrate.

[0005] As illustrated in Fig. 1, a laser beam (L) can be irradiated to a desired location on a plane while passing through a scanner (10) and a scanning lens (20). At this time, a scan field (30) is formed by the scanning lens (20), and the scan field (30) means the maximum scan range in which a processing operation can be performed by scanning the laser beam (L) in the x-axis and y-axis directions.

[0006] In a scan field (30) like this, when the focal length is set so that the actual focal plane (41) and the processing plane (42) of the substrate are aligned at the center (30a) of the scan field, an error may occur at the edge (30b) of the scan field as the actual focal plane (41) and the processing plane (42) of the substrate are not aligned.

[0007] To improve these errors, a telecentric F-theta lens is used, but even in a telecentric F-theta lens, a slight mismatch error occurs between the actual focal plane (41) and the processing plane (42) of the substrate.

[0008] When processing a processing line of a substrate using the entire scan field (30) in a state where such an error exists, there is a risk of processing defects occurring because the energy densities of the laser beam (L) at the center (30a) of the scan field and the edge (30b) of the scan field are different from each other.

[0009] Figure 2 is a drawing for explaining a process of cutting a polarizing film attached to a glass substrate using a laser beam.

[0010] As shown in (a) of Fig. 2, when a laser beam (L) is irradiated along a cutting line while the polarizing film (52) is attached to a glass substrate (51) by an adhesive material (53), the cutting process is completed as a part (52a) of the polarizing film to be cut is cut.

[0011] However, when cutting the polarizing film (52) using the entire scan field (30) as described above, the laser beam (L) may be focused too deeply due to a mismatch between the actual focal plane (41) and the processing plane (42) of the substrate, causing a crack (c1) in the glass substrate (51) (see (b) of FIG. 2), or the laser beam (L) may be focused too shallowly, causing a crack (c2) in the polarizing film (52) due to partial cutting of the polarizing film (52).

[0012] Accordingly, the problem to be solved by the present invention is to solve such a conventional problem, and to provide a laser processing method in which a laser beam is not irradiated in a masking area in a scan field of a scanning lens, and a processing line of a substrate is processed using an irradiation area excluding the masking area, thereby making the actual focal plane of the scan field and the processing plane of the substrate as coincident as possible, thereby maintaining uniform processing quality for the entire processing line.

[0013] In order to achieve the above object, the laser processing method of the present invention is a laser processing method for processing a processing line of a substrate using a laser processing device having a scanner for deflecting a laser beam, a scanning lens for forming a focus of the laser beam on a substrate, and a stage on which the substrate is placed and moved, wherein the scan field of the scanning lens is divided into a masking area where the laser beam is not irradiated and an irradiation area disposed adjacent to the masking area and irradiated with the laser beam, and the scanner and the stage are driven in synchronization so that the processing line is processed while being disposed in the irradiation area.

[0014] In the laser processing method of the present invention, the masking area can be formed by software control so that the laser beam is not irradiated inside the masking area.

[0015] In the laser processing method of the present invention, the masking area may be arranged in the central portion of the scan field, and the irradiation area may be arranged to surround the masking area.

[0016] In the laser processing method of the present invention, the movement path of the center of the scan field by the movement of the stage can be arranged to be spaced apart from the processing line.

[0017] In the laser processing method of the present invention, the processing line is formed in an arbitrary geometric shape, and the movement path of the center of the scan field by the movement of the stage can be arranged inside the processing line.

[0018] In the laser processing method of the present invention, the irradiation area is divided into a plurality of sub-irradiation areas, and the processing line can be processed by being divided by at least two sub-irradiation areas among the plurality of sub-irradiation areas.

[0019] In the laser processing method of the present invention, the processing line includes a first processing line and a second processing line arranged to form a certain angle, the irradiation area includes a first sub-irradiation area formed on one side of the masking area, and a second sub-irradiation area formed to intersect the first sub-irradiation area, and the first processing line can be processed by the first sub-irradiation area, and the second processing line can be processed by the second sub-irradiation area.

[0020] In the laser processing method of the present invention, the processing line includes a first processing line and a third processing line that are arranged to face each other, and the irradiation area includes a first sub-irradiation area formed on one side of the masking area and a third sub-irradiation area formed on the opposite side of the first sub-irradiation area with the masking area interposed therebetween, and the first processing line can be processed by the first sub-irradiation area, and the third processing line can be processed by the third sub-irradiation area.

[0021] In the laser processing method of the present invention, the processing line is formed in a circular shape, and the irradiation area includes a first sub-irradiation area formed on one side of the masking area, a second sub-irradiation area formed to intersect the first sub-irradiation area, a third sub-irradiation area formed on an opposite side of the first sub-irradiation area with the masking area interposed therebetween, and a fourth sub-irradiation area formed on an opposite side of the second sub-irradiation area with the masking area interposed therebetween, and the processing line can be sequentially processed by the first sub-irradiation area, the second sub-irradiation area, the third sub-irradiation area, and the fourth sub-irradiation area.

[0022] In the laser processing method of the present invention, the irradiation area may be arranged in the central portion of the scan field, and the masking area may be arranged to surround the irradiation area.

[0023] In the laser processing method of the present invention, the movement path of the center of the scan field by the movement of the stage can be arranged to overlap the processing line.

[0024] According to the laser processing method of the present invention, the laser beam is not irradiated in the masking area of ​​the scan field of the scanning lens, and the processing line of the substrate is processed using the irradiation area excluding the masking area, so that the actual focal plane of the scan field and the processing plane of the substrate are as coincident as possible, thereby preventing the formation of cracks in the substrate and maintaining the processing quality uniformly for the entire processing line.

[0025] In addition, according to the laser processing method of the present invention, processing is possible in a state where the movement path of the center of the scan field by stage movement is positioned at a certain distance from the processing line of the substrate, so that the overall movement path of the stage can be reduced, thereby reducing the time required for processing of the processing line.

[0026] Figure 1 is a drawing for explaining the actual focal plane formed by the scanning lens and the processing plane of the substrate.

[0027] Figure 2 is a drawing for explaining a process of cutting a polarizing film attached to a glass substrate using a laser beam.

[0028] Figure 3 is a drawing showing an example of a laser processing device used in the laser processing method of the present invention.

[0029] FIG. 4 is a drawing showing a scan field of one embodiment of the laser processing method of the present invention.

[0030] Fig. 5 is a drawing for explaining a case in which a curved processing line is processed using the investigation area of ​​the scan field of Fig. 4.

[0031] Fig. 6 is a drawing for explaining a case of processing an open processing line using the investigation area of ​​the scan field of Fig. 4.

[0032] Fig. 7 is a drawing for explaining a case of processing a closed processing line using the investigation area of ​​the scan field of Fig. 4.

[0033] Fig. 8 is a drawing for explaining a case in which a circular-shaped processing line is processed using the investigation area of ​​the scan field of Fig. 4.

[0034] FIG. 9 is a drawing showing a scan field of another embodiment of the laser processing method of the present invention.

[0035] Fig. 10 is a drawing for explaining a case in which an open processing line is processed using the investigation area of ​​the scan field of Fig. 9.

[0036] Hereinafter, embodiments of a laser processing method according to the present invention will be described in detail with reference to the attached drawings.

[0037] First, referring to FIG. 3, an example of a laser processing device (100) used in the laser processing method of the present invention is illustrated.

[0038] The laser processing device (100) includes a laser light source (110), a beam delivery unit (120), a scanner (130), a scanning lens (140), a stage (150), and a control unit (160).

[0039] A laser light source (110) refers to a means for emitting a laser beam (L), and such a laser light source (110) can be classified into various types, such as gas, liquid, and solid laser light sources, depending on the type of material that generates the laser beam (L). In addition, the laser light source (110) can emit, for example, a pulsed laser beam, but is not limited thereto, and can also emit a continuous wave laser beam depending on the type of processing work.

[0040] The beam transmission unit (120) is for transmitting a laser beam (L) emitted from a laser light source (110) along a predetermined path, and may include, for example, a plurality of mirrors or an optical cable.

[0041] The scanner (130) performs a predetermined processing operation on the processing line (PL) of the substrate (S) by deflecting the laser beam (L) onto the substrate (S). For example, a 2D galvanometer that deflects the laser beam (L) in the x and y directions that are parallel to and perpendicular to the plane of the substrate (S) can be used as the scanner (130). This 2D galvanometer can improve the precision of the laser processing operation by finely controlling the scan point of the laser beam (L).

[0042] The scanning lens (140) serves to adjust the focus of the laser beam (L) so that the laser beam (L) passing through the scanner (130) can be focused at a desired location on the substrate (S). In this embodiment, the scanning lens (140) may be an F-theta lens or a telecentric F-theta lens.

[0043] The stage (150) moves the substrate (S) while the substrate (S) is secured thereon. Since the processing line (PL) of the substrate is larger than the scan field (170) formed by the scanning lens (140), the stage (150) can be used to move the substrate (S) while performing processing work on the processing line (PL).

[0044] The control unit (160) drives the scanner (130) and the stage (150) in synchronization.

[0045] The control unit (160) can rotate the mirror of the scanner (130) at high speed within a predetermined angle range so that the angle of the mirror is continuously adjusted, and simultaneously drive the stage (150) at low speed in at least two axes (x-axis and y-axis) directions. Here, the stage (150) has a slow response, is driven at a low speed, and can have a wide processing area, while the scanner (130) has a fast response, is driven at a high speed, and can have a narrow processing area.

[0046] Therefore, in the present invention, by simultaneously controlling the scanner (130) and the stage (150) through the control unit (160), more precise processing is possible and processing time can be saved compared to the conventional method of processing the substrate (S) by moving only the stage (150). In addition, by simultaneously controlling the scanner (130) and the stage (150) in synchronization, processing can be performed regardless of the size of the substrate (S).

[0047] FIG. 4 is a drawing illustrating a scan field of one embodiment of the laser processing method of the present invention.

[0048] Referring to FIG. 4, the scan field (170) formed by the scanner of the present invention is divided into a masking area (171), an investigation area (172), and a center (173).

[0049] The masking area (171) is an area where the laser beam (L) is not irradiated, and in this embodiment, it is placed in the center of the scan field (170). The masking area (171) of this embodiment is not formed by placing a physical mask between the scanning lens (140) and the substrate (S), but can be formed by controlling the area corresponding to the masking area (171) so that the laser beam (L) is not irradiated using the software of the control unit (160).

[0050] In Fig. 4, the masking area (171) is depicted as a square shape, but other shapes such as a circle are also possible.

[0051] The irradiation area (172) is positioned adjacent to the masking area (171) and is an area where the laser beam (L) is irradiated. In the present embodiment, it is positioned to surround the masking area (171). The irradiation area (172) of the present embodiment may be formed in, for example, a donut shape that surrounds the masking area (171).

[0052] The irradiation area (172) of the present embodiment can be divided into a plurality of sub-irradiation areas depending on the location. The irradiation area (172) includes a first sub-irradiation area (172a) formed on one side of the masking area (171), a second sub-irradiation area (172b) formed to intersect the first sub-irradiation area (172a), a third sub-irradiation area (172c) formed to intersect the second sub-irradiation area (172b) and formed on the opposite side of the first sub-irradiation area (172a) with the masking area (171) interposed therebetween, and a fourth sub-irradiation area (172d) formed to intersect the third sub-irradiation area (172c) and formed on the opposite side of the second sub-irradiation area (172b) with the masking area (171) interposed therebetween.

[0053] The investigation area (172) of this embodiment is illustrated as being divided into four sub-investigation areas, but may be divided into a variety of sub-investigation areas, such as two, three, or five.

[0054] The center (173) is defined as the center of the scan field (170).

[0055] Fig. 5 is a drawing for explaining a case in which a curved processing line is processed using the investigation area of ​​the scan field of Fig. 4.

[0056] As described above, the investigation area (172) is divided into a plurality of sub-investigation areas, and the processing line (PL) can be divided and processed by at least two of the plurality of sub-investigation areas.

[0057] Additionally, the processing line (PL) can be formed into any arbitrary geometric shape. It can be formed into various geometric shapes such as curves, straight lines, polygons, and circles.

[0058] Referring to FIG. 5, at position A1, the stage (150) is moved so that a part of the processing line (PL1) is placed in the first sub-inspection area (172a), and a part of the processing line (PL1) is processed using the scanner (130), and at position A2, the stage (150) is moved so that another part of the processing line (PL2) is placed in the second sub-inspection area (172b), and a part of the processing line (PL2) is processed using the scanner (130).

[0059] In Fig. 5, the processing line (PL) is shown as being divided into two sub-irradiation areas and processed, but depending on the curvature of the curved shape, the processing line (PL) may be divided into two or more sub-irradiation areas and processed.

[0060] Fig. 6 is a drawing for explaining a case in which an open processing line is processed using the investigation area of ​​the scan field of Fig. 4.

[0061] The laser processing method of the present invention is characterized in that the processing line (PL) of the substrate is processed by the irradiation area (172) by synchronizing and driving the scanner (130) and the stage (150).

[0062] The processing line (PL) processed by the laser processing method of the present embodiment may include a first processing line (PL1), a second processing line (PL2) arranged to intersect the first processing line (PL1), and a third processing line (PL3) arranged to intersect the second processing line (PL2) and to face the first processing line (PL1).

[0063] In the present invention, the meaning that two processing lines are arranged to intersect each other means that the two processing lines are arranged to form a certain angle.

[0064] The processing line (PL) is formed in an overall rectangular shape, but can be formed in an open rectangular shape without a single line segment.

[0065] First, it is desirable to set the focal length so that the actual focal plane and the processing plane of the substrate are aligned in the investigation area (172), and then perform processing work on the processing line (PL).

[0066] When processing the first processing line (PL1), the stage (150) can be driven so that the first sub-irradiation area (172a) among the irradiation areas (172) is placed on the first processing line (PL1). While moving the stage (150) in a direction parallel to the first processing line (PL1), the processing work on the first processing line (PL1) can be performed using the scanner (130).

[0067] Thereafter, when processing the second processing line (PL2), the stage (150) can be driven so that the second sub-irradiation area (172b) among the irradiation areas (172) is placed on the second processing line (PL2). While moving the stage (150) in a direction parallel to the second processing line (PL2), the processing work for the second processing line (PL2) can be performed using the scanner (130).

[0068] Thereafter, when processing the third processing line (PL3), the stage (150) can be driven so that the third sub-irradiation area (172c) among the irradiation areas (172) is placed on the third processing line (PL3). While moving the stage (150) in a direction parallel to the third processing line (PL3), the processing work for the third processing line (PL3) can be performed using the scanner (130).

[0069] In this way, the first processing line (PL1) can be processed by the first sub-irradiation area (172a), the second processing line (PL2) can be processed by the second sub-irradiation area (172b), and the third processing line (PL3) can be sequentially processed by the third sub-irradiation area (172c).

[0070] As illustrated in FIG. 6, in the present invention, since only the irradiation area (172) is used when processing the processing line (PL), the movement path (182) of the center (173) of the scan field (170) due to the movement of the stage (150) can be positioned at a certain distance from the processing line (PL) of the substrate.

[0071] In this embodiment, it is preferable that the movement path (182) of the center (173) of the scan field (170) by the movement of the stage (150) be positioned a certain distance inside the processing line (PL) of the substrate. If the processing line (PL) is formed in an overall rectangular shape, the movement path (182) of the center (173) of the scan field (170) by the movement of the stage (150) may be positioned inside the rectangular shape.

[0072] Compared to the path of the actually formed processing line (PL), the movement path (182) of the center (173) of the scan field (170) due to the movement of the stage (150) of the present invention is relatively reduced, so that the time required to process the entire processing line (PL) can be reduced.

[0073] In addition, since the edge of the scan field (170) has a relatively wider cross-sectional area than the center of the scan field (170), the stage (150) can also be moved relatively quickly while performing processing work.

[0074] Fig. 7 is a drawing for explaining a case in which a closed processing line is processed using the investigation area of ​​the scan field of Fig. 4.

[0075] The processing line (PL) processed by the laser processing method of the present embodiment may include a first processing line (PL1), a second processing line (PL2) arranged to intersect the first processing line (PL1), a third processing line (PL3) arranged to intersect the second processing line (PL2) and face the first processing line (PL1), and a fourth processing line (PL4) arranged to intersect the third processing line (PL3) and face the second processing line (PL2).

[0076] The processing line (PL) is formed in an overall rectangular shape, and can be formed in a closed rectangular shape in which all four line segments exist.

[0077] First, it is desirable to set the focal length so that the actual focal plane and the processing plane of the substrate are aligned in the investigation area (172), and then perform processing work on the processing line (PL).

[0078] When processing the first processing line (PL1), the stage (150) can be driven so that the first sub-irradiation area (172a) among the irradiation areas (172) is placed on the first processing line (PL1). While moving the stage (150) in a direction parallel to the first processing line (PL1), the processing work on the first processing line (PL1) can be performed using the scanner (130).

[0079] Thereafter, when processing the second processing line (PL2), the stage (150) can be driven so that the second sub-irradiation area (172b) among the irradiation areas (172) is placed on the second processing line (PL2). While moving the stage (150) in a direction parallel to the second processing line (PL2), the processing work for the second processing line (PL2) can be performed using the scanner (130).

[0080] Thereafter, when processing the third processing line (PL3), the stage (150) can be driven so that the third sub-irradiation area (172c) among the irradiation areas (172) is placed on the third processing line (PL3). While moving the stage (150) in a direction parallel to the third processing line (PL3), the processing work for the third processing line (PL3) can be performed using the scanner (130).

[0081] Thereafter, when processing the fourth processing line (PL4), the stage (150) can be driven so that the fourth sub-irradiation area (172d) among the irradiation areas (172) is placed on the fourth processing line (PL4). While moving the stage (150) in a direction parallel to the fourth processing line (PL4), the processing work for the fourth processing line (PL4) can be performed using the scanner (130).

[0082] In this way, the first processing line (PL1) can be processed by the first sub-irradiation area (172a), the second processing line (PL2) can be processed by the second sub-irradiation area (172b), the third processing line (PL3) can be processed by the third sub-irradiation area (172c), and the fourth processing line (PL4) can be sequentially processed by the fourth sub-irradiation area (172d).

[0083] Fig. 8 is a drawing for explaining a case in which a circular-shaped processing line is processed using the investigation area of ​​the scan field of Fig. 4.

[0084] The processing line (PL) processed by the laser processing method of this embodiment can be formed into an overall circular shape.

[0085] When processing the first processing line (PL1) in the 9 o'clock direction, the stage (150) can be driven so that the first sub-irradiation area (172a) among the irradiation areas (172) is placed on the first processing line (PL1). While moving the stage (150) along the circular processing line (PL), the processing work on the first processing line (PL1) can be performed using the scanner (130).

[0086] Thereafter, when processing the second processing line (PL2) in the 12 o'clock direction, the stage (150) can be driven so that the second sub-irradiation area (172b) among the irradiation areas (172) is placed on the second processing line (PL2). While moving the stage (150) along the circular processing line (PL), the processing work for the second processing line (PL2) can be performed using the scanner (130).

[0087] Thereafter, when processing the third processing line (PL3) in the 3 o'clock direction, the stage (150) can be driven so that the third sub-irradiation area (172c) among the irradiation areas (172) is placed on the third processing line (PL3). While moving the stage (150) along the circular processing line (PL), the processing work for the third processing line (PL3) can be performed using the scanner (130).

[0088] Thereafter, when processing the fourth processing line (PL4) in the 6 o'clock direction, the stage (150) can be driven so that the fourth sub-irradiation area (172d) among the irradiation areas (172) is placed on the fourth processing line (PL4). While moving the stage (150) along the circular processing line (PL), the processing work for the fourth processing line (PL4) can be performed using the scanner (130).

[0089] In this way, the circular-shaped processing line (PL) can be sequentially processed by the first sub-irradiation area (172a), the second sub-irradiation area (172b), the third sub-irradiation area (172c), and the fourth sub-irradiation area (172d).

[0090] FIG. 9 is a drawing showing a scan field of another embodiment of the laser processing method of the present invention.

[0091] Referring to FIG. 9, the scan field (190) formed by the scanner of the present embodiment is divided into an investigation area (191), a masking area (192), and a center (193).

[0092] The irradiation area (191) is an area where the laser beam (L) is irradiated and can be positioned in the center of the scan field (190). The external irradiation area (172) of the present embodiment can be formed in a donut shape, for example, surrounding the masking area (171).

[0093] The masking area (192) can be arranged to surround the irradiation area (191) as an area where the laser beam (L) is not irradiated. The masking area (192) of the present embodiment is not formed by placing a physical mask between the scanning lens (140) and the substrate (S), but can be formed by controlling the edge of the scan field (190) so that the laser beam (L) is not irradiated using the software of the control unit (160).

[0094] In Fig. 9, the masking area (192) is depicted as a square shape, but other shapes such as a circle are also possible.

[0095] The center (193) is defined as the center of the scan field (190).

[0096] Fig. 10 is a drawing for explaining a case in which an open processing line is processed using the investigation area of ​​the scan field of Fig. 9.

[0097] Referring to FIG. 9, in order to maintain a uniform processing quality for the entire processing line (PL), the processing line (PL) is processed by irradiating a laser beam (L) through the irradiation area (191), and since there is an error between the actual focal plane of the scanning lens (140) and the processing plane of the substrate (S) in the masking area (192), the laser beam (L) is not irradiated through the masking area (192), which is the edge of the scan field.

[0098] First, it is desirable to set the focal length so that the actual focal plane and the processing plane of the substrate (S) coincide in the central part (191) of the scan field, and then perform processing work on the processing line (PL).

[0099] In this way, when processing a processing line (PL) using the irradiation area (191) in the central part of the scan field, the stage (150) can be moved while aligning the irradiation area (191) with the processing line (PL) of the substrate. That is, the movement path (181) of the center (193) of the scan field (190) due to the movement of the stage (150) can be arranged to overlap with the processing line (PL) of the substrate.

[0100] In Fig. 10, the movement path (181) of the center (193) of the scan field (190) and the processing line (PL) of the substrate are depicted as being somewhat spaced apart in order to distinguish them, but in reality, this means that they are overlapping.

[0101] The laser processing method of the present invention configured as described above can obtain the effect of preventing crack formation in the substrate and maintaining uniform processing quality for the entire processing line by processing the processing line of the substrate using the irradiation area excluding the masking area without irradiating the laser beam in the scan field of the scanning lens, thereby maximally matching the actual focal plane of the scan field and the processing plane of the substrate.

[0102] In addition, the laser processing method of the present invention configured as described above can perform processing in a state where the movement path of the center of the scan field by stage movement is positioned at a certain distance from the processing line of the substrate, so that the overall movement path of the stage can be reduced, thereby obtaining the effect of reducing the time required for processing of the processing line.

[0103] The scope of the present invention is not limited to the embodiments and modifications described above, but can be implemented in various forms within the scope of the appended claims. Any person skilled in the art, without departing from the spirit of the invention as claimed in the claims, may make various modifications to the invention, which are deemed to fall within the scope of the claims.

[0104] The present invention can be used in the laser processing industry to reduce processing defects caused by errors between the actual focal plane of a scanning lens and the processing plane of a substrate.

Claims

1. A laser processing method for processing a processing line of a substrate using a laser processing device having a scanner for deflecting a laser beam, a scanning lens for forming a focus of the laser beam on a substrate, and a stage on which the substrate is mounted and moved. The scan field of the above scanning lens is divided into a masking area where the laser beam is not irradiated and an irradiation area that is positioned adjacent to the masking area and is irradiated with the laser beam, A laser processing method characterized in that the scanner and the stage are driven in synchronization so that processing is performed while the processing line is positioned in the investigation area.

2. In paragraph 1, A laser processing method, characterized in that the above masking area is formed by software control so that the laser beam is not irradiated inside the masking area.

3. In paragraph 1, The above masking area is placed in the central portion of the above scan field, A laser processing method characterized in that the above-mentioned investigation area is arranged to surround the above-mentioned masking area.

4. In paragraph 3, A laser processing method characterized in that the movement path of the center of the scan field by the stage movement is positioned apart from the processing line.

5. In paragraph 4, The above processing line is formed in an arbitrary geometric shape, A laser processing method characterized in that the movement path of the center of the scan field by the movement of the stage is placed inside the processing line.

6. In paragraph 4, The above investigation area is divided into multiple sub-investigation areas, A laser processing method characterized in that the processing line is divided into at least two sub-irradiation areas among the plurality of sub-irradiation areas and processed.

7. In paragraph 6, The above processing line includes a first processing line and a second processing line arranged to form a certain angle, The above investigation area includes a first sub-investigation area formed on one side of the masking area, and a second sub-investigation area formed to intersect the first sub-investigation area, A laser processing method, characterized in that the first processing line is processed by the first sub-irradiation area, and the second processing line is processed by the second sub-irradiation area.

8. In paragraph 6, The above processing line includes a first processing line and a third processing line that are arranged facing each other, The above investigation area includes a first sub-investigation area formed on one side of the masking area, and a third sub-investigation area formed on the opposite side of the first sub-investigation area with the masking area in between. A laser processing method, characterized in that the first processing line is processed by the first sub-irradiation area, and the third processing line is processed by the third sub-irradiation area.

9. In paragraph 6, The above processing line is formed in a circular shape, The above-mentioned investigation area includes a first sub-investigation area formed on one side of the masking area, a second sub-investigation area formed to intersect the first sub-investigation area, a third sub-investigation area formed on the opposite side of the first sub-investigation area with the masking area interposed therebetween, and a fourth sub-investigation area formed on the opposite side of the second sub-investigation area with the masking area interposed therebetween. A laser processing method, characterized in that the processing line is sequentially processed by the first sub-irradiation area, the second sub-irradiation area, the third sub-irradiation area, and the fourth sub-irradiation area.

10. In paragraph 1, The above investigation area is placed in the central part of the above scan field, A laser processing method, characterized in that the masking area is arranged to surround the irradiation area.

11. In paragraph 10, A laser processing method characterized in that the movement path of the center of the scan field by the stage movement is arranged to overlap the processing line.

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