Display panel and electronic device

Abstract

A display panel and an electronic device, relating to the technical field of electronic devices, and aiming to solve the problem of large size of electronic devices. In the display panel provided by the embodiments of the present application, a wiring layer is arranged on the backlight side of a panel body, and the wiring layer comprises a connection line, the connection line being used for connecting a main board and a sub-board of an electronic device. The main board and the sub-board of the electronic device are connected by means of the connection line, and there is no need to additionally provide a connection circuit board for connecting the main board and the sub-board, thus reducing space occupation, and further reducing the size of electronic devices, and facilitating miniaturization of electronic devices.

Description

Display panels and electronic devices

[0001] This application claims priority to Chinese Patent Application No. 202410818222.8, filed with the State Intellectual Property Office of China on June 21, 2024, entitled “Display Panel and Electronic Device”, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of electronic device technology, specifically to a display panel and an electronic device. Background Technology

[0003] Electronic devices (such as mobile phones and tablets) generally consist of a motherboard, a sub-board, and a connecting circuit board. Both the motherboard and the sub-board are printed circuit boards (PCBs), while the connecting circuit board is typically a flexible printed circuit (FPC). The motherboard and the sub-board are connected by the connecting circuit board. However, there is usually a certain distance between the motherboard and the sub-board, resulting in a relatively long connecting circuit board, which makes the electronic device larger and difficult to miniaturize. Summary of the Invention

[0004] This application provides a display panel and an electronic device that can reduce the size of the electronic device.

[0005] In a first aspect, embodiments of this application provide a display panel, including: a panel body and a wiring layer, the wiring layer being disposed on the backlight side of the panel body; the wiring layer includes connecting lines, the connecting lines being used to connect a motherboard and a sub-board of an electronic device.

[0006] With the above setup, the motherboard and sub-board in the electronic device are connected by a connecting cable, eliminating the need for an additional connecting circuit board to connect the motherboard and sub-board. This reduces space occupation and, consequently, reduces the size of the electronic device, facilitating its miniaturization.

[0007] In some embodiments that may include the above-described embodiments, the wiring layer includes a first lead-out segment and a second lead-out segment. The projections of the first and second lead-out segments in the thickness direction of the panel body at least partially overlap with the panel body. That is, a portion of the first lead-out segment and a portion of the second lead-out segment extend outside the panel body, or both the first and second lead-out segments are completely attached to the panel body. One end of the connecting wire is located at the first lead-out segment and connected to the motherboard; the other end of the connecting wire is located at the second lead-out segment and connected to the sub-board. This configuration, by providing the first and second lead-out segments extending outside the panel body, facilitates the connection between the connecting wire and the motherboard and the sub-board.

[0008] Understandably, the first lead-out section extends towards the motherboard to facilitate connection with it; the second lead-out section extends towards the sub-board to facilitate connection with it.

[0009] In some embodiments that may include the above-described embodiments, one end of the connecting wire is located at a first lead-out segment and connected to the motherboard, including: a first connection point on the first lead-out segment connected to one end of the connecting wire, the first connection point being connected to the motherboard; the other end of the connecting wire is located at a second lead-out segment and connected to a sub-board, including: a second connection point on the second lead-out segment connected to the other end of the connecting wire, the second connection point being connected to the sub-board. The first connection board and the second connection point may both include metal sheets, the width of which is greater than the width of the connecting wire, to facilitate the connection between the connecting wire and the motherboard and the sub-board.

[0010] In some embodiments that may include the above-described examples, the first connection point is used for soldering to the motherboard, and the second connection point is used for soldering to the sub-board. This configuration, using soldering for connection, reduces connection difficulty and increases assembly speed.

[0011] In some embodiments that may include the above-described examples, the display panel further includes a first adapter circuit board and a second adapter circuit board. A first connection point is connected to the motherboard via the first adapter circuit board; a second connection point is connected to the sub-board via the second adapter circuit board. This arrangement facilitates the connection between the wiring layer and the motherboard and sub-board. The first and second adapter circuit boards can be flexible circuit boards, giving them a degree of flexibility. Deformation of the first and second adapter circuit boards facilitates their disassembly and installation.

[0012] In some embodiments that may include the above-described embodiments, the first connection point may be soldered to a first adapter circuit board, the first adapter circuit board being provided with a first connector, and the main board may be provided with a first adapter that mates with the first connector. The first connector is detachably connected to the first adapter, thereby achieving a connection with the main board. Similarly, the second connection point is soldered to a second adapter circuit board, the second adapter circuit board being provided with a second connector, and the sub-board being provided with a second adapter that mates with the second connector. The second connector is detachably connected to the second adapter, thereby achieving a connection with the sub-board.

[0013] In some embodiments that may include the above-described embodiments, a first positioning element is provided on the first lead-out segment for positioning the first lead-out segment; a second positioning element is provided on the second lead-out segment for positioning the second lead-out segment. This arrangement can improve the positional accuracy of the first and second lead-out segments, thereby improving installation accuracy.

[0014] In some embodiments that may include the above embodiments, the first positioning member includes a first protrusion and / or a first groove disposed on the first lead-out section; the second positioning member includes a second protrusion and / or a second groove disposed on the second lead-out section.

[0015] In the implementation where the first connection point is directly soldered to the motherboard, the motherboard is provided with a first mating component that cooperates with the first positioning component. The mating between the first positioning component and the first mating component limits the positioning of the first lead-out segment, thereby improving soldering accuracy. For example, the first mating component may include a first mating post and / or a first mating groove disposed on the motherboard. In a plane parallel to the motherboard, the projection of the first mating component can completely coincide with the projection of the first positioning component. During connection, the first positioning component can be aligned with the first mating component, thereby achieving the positioning of the first lead-out segment.

[0016] In the implementation where the first connection point is connected to the motherboard via a first adapter circuit board, the first mating component can be disposed on the first adapter circuit board. Similarly, in the implementation where the second connection point is connected to the motherboard sub-board via a second adapter circuit board, the second mating component can be disposed on the second adapter circuit board.

[0017] In some embodiments that may include the above-described embodiments, the wiring layer further includes a first test line, with both ends of the first test line located at a first lead-out section. The two ends of the first test line are used to connect to different test points on the motherboard. The continuity between the connecting line and the motherboard, i.e., whether the connection between the connecting line and the motherboard is intact, can be evaluated through the test points on the motherboard connected to the two ends of the first test line. For example, the resistance between the test points on the motherboard connected to the two ends of the first test line can be measured. If the resistance between the test points on the motherboard connected to the two ends of the first test line is large (greater than the resistance of the first test line itself), it indicates that the continuity between the connecting line and the motherboard is poor.

[0018] In some embodiments that may include the above-described embodiments, the wiring layer further includes a second test line, both ends of which are located at a second lead-out section. The two ends of the second test line are used to connect to different test points on the sub-board. By connecting the test points on the sub-board to the two ends of the second test line, the continuity between the connecting line and the sub-board can be evaluated, that is, whether the connecting line and the sub-board are properly connected.

[0019] In some embodiments that may include the above examples, the connecting line includes a first connecting line for transmitting radio frequency (RF) signals. The RF signal can be a signal from an antenna or a signal transmitted to an antenna. The resistance of the first connecting line is 35Ω ± 5Ω (e.g., 35Ω, 38Ω, 40Ω, etc.). Since the RF signal has high power, a lower resistance value in the first connecting line can reduce losses, thereby reducing the impact of the resistance of the first connecting line on the RF signal and ensuring communication performance.

[0020] In some embodiments that may include the above-described embodiments, the connecting line includes a second connecting line for transmitting clock signals, and the resistance of the second connecting line is 50Ω±5Ω (e.g., 45Ω, 50Ω, 55Ω, etc.). This configuration allows for the transmission of clock signals between the motherboard and the sub-board via the second connecting line; and the appropriate resistance value of the second connecting line ensures the accuracy of the clock signal.

[0021] In some embodiments that may include the above-described embodiments, the connecting line includes a third connecting line for transmitting peripheral signals, wherein the peripheral signals may include signals from devices such as display panels, cameras, sensors, and microphones. The resistance of the third connecting line is 90Ω±10Ω (e.g., 80Ω, 90Ω, 100Ω, etc.). This setting provides a moderate impedance for the third connecting line, which can reduce insertion loss, improve return loss, and thus improve signal transmission quality.

[0022] In some embodiments that may include the above embodiments, the connecting line includes a fourth connecting line for transmitting interface signals. These interface signals can be I / O bus interface signals, such as PCIE signals or USB signals. PCIE signals correspond to the Peripheral Component Interconnect Express (PCI) bus, and USB signals correspond to the Universal Serial Bus (USB). The resistance of the fourth connecting line is 100Ω ± 10Ω (e.g., 90Ω, 100Ω, 110Ω). This configuration reduces signal reflection while allowing for a suitable reduction in the width of the fourth connecting line, thereby increasing wiring density.

[0023] In some embodiments that may include the above-described embodiments, the connecting line includes a fifth connecting line for transmitting a power signal. This power signal can be a power supply signal between the motherboard and the sub-board to enable power supply between them (e.g., the motherboard supplies power to the sub-board, or the sub-board supplies power to the motherboard). The resistance of the fifth connecting line is less than or equal to 40mΩ (e.g., 20mΩ, 30mΩ, 40mΩ, etc.). This configuration results in a lower resistance for the fifth connecting line, reducing voltage drop during transmission and ensuring the accuracy of the power supply voltage.

[0024] In some embodiments that may include the above-described embodiments, the wiring layer further includes a grounding wire, which is arranged parallel to and spaced apart from the connecting wires, and is configured to be grounded. The grounding wire protects the connecting wires, thereby preventing external electromagnetic signals from interfering with the signals transmitted through the grounding wire and improving signal transmission quality.

[0025] In some embodiments that may include the above-described embodiments, the display panel further includes a ground layer, which is stacked on the side of the wiring layer opposite to the panel body and configured to be grounded. A through-hole is provided on the wiring layer, extending to the ground layer, and a conductor is disposed within the through-hole, connecting the conductor to the ground wire and the ground layer. This configuration achieves the connection between the ground wire and the ground layer through the conductor, thereby grounding the ground wire. The structure is simple and easy to manufacture.

[0026] In some embodiments that may include the above-described examples, the wiring layer includes a stacked main layer and a metal layer, the metal layer including connecting wires. This arrangement allows the main layer to support the metal layer, preventing it from detaching.

[0027] In some embodiments that may include the above-described embodiments, the display panel further includes a backplate stacked on the backlight side of the panel body, which provides support for the panel body. In an implementation where the main body layer is disposed between the metal layer and the panel body, the backplate may include the main body layer; that is, the backplate and the main body layer may be the same film layer. This configuration eliminates the need for an additional main body layer, reducing the number of film layers in the display panel and consequently lowering its thickness and weight.

[0028] In some embodiments that may include the above-described embodiments, the wiring layer further includes a planarization layer that covers the metal layer. A portion of the planarization layer fills a groove in the metal layer (between adjacent wiring lines), while the remaining portion covers the metal layer. This configuration allows the planarization layer to protect the metal layer from damage. Furthermore, the surface of the planarization layer facing away from the main layer is relatively flat to facilitate bonding with other film layers.

[0029] Secondly, embodiments of this application also provide an electronic device, including: a motherboard, a sub-board, and a display panel as described above; the motherboard and the sub-board are connected by a connecting cable. The electronic device provided in this application includes the display panel of any of the above embodiments; therefore, both can solve the same technical problem and achieve the same technical effect.

[0030] In some embodiments that may include the above-described embodiments, the electronic device further includes a first middle frame and a second middle frame, which are foldably connected. A motherboard is disposed on the first middle frame, a sub-board is disposed on the second middle frame, and a display panel covers the first and second middle frames. This electronic device is a modular electronic device, which can improve the user experience. Attached Figure Description

[0031] Figure 1 is an exploded view of the electronic device provided in an embodiment of this application;

[0032] Figure 2 is an axonometric view of the electronic device provided in an embodiment of this application;

[0033] Figure 3 is an internal structure diagram of the electronic device provided in an embodiment of this application;

[0034] Figure 4 is a cross-sectional view of the display panel provided in an embodiment of this application;

[0035] Figure 5 is a schematic diagram of the connection between the display panel and the motherboard provided in an embodiment of this application;

[0036] Figure 6 is a magnified view of part M in Figure 5;

[0037] Figure 7 is a schematic diagram of the connection between the display panel and the screen circuit board provided in an embodiment of this application;

[0038] Figure 8 is a cross-sectional view of the wiring layer in the display panel provided in an embodiment of this application;

[0039] Figure 9 is a schematic diagram of the wiring layer in the display panel provided in an embodiment of this application;

[0040] Figure 10 is a schematic diagram of the structure of the first lead-out segment in the display panel provided in an embodiment of this application;

[0041] Figure 11 is a schematic diagram of the structure of the second lead-out segment in the display panel provided in an embodiment of this application;

[0042] Figure 12 is a schematic diagram showing the connection between the wiring layer and the first and second adapter circuit boards in the display panel provided in the embodiment of this application;

[0043] Figure 13 is a schematic diagram of the wiring layer in Figure 12;

[0044] Figure 14 is a schematic diagram of the structure of the first adapter circuit board in Figure 12;

[0045] Figure 15 is a schematic diagram of the structure of the first positioning member in the display panel provided in an embodiment of this application;

[0046] Figure 16 is a second structural schematic diagram of the first positioning member in the display panel provided in an embodiment of this application;

[0047] Figure 17 is a schematic diagram of a display panel with a first test line disposed on the wiring layer in an embodiment of this application;

[0048] Figure 18 is a second schematic diagram of the wiring layer in the display panel provided in the embodiment of this application;

[0049] Figure 19 is a magnified view of a portion of point A in Figure 18;

[0050] Figure 20 is a schematic diagram of the wiring layer in the display panel provided in the embodiment of this application.

[0051] Figure 21 is a second cross-sectional view of the wiring layer in the display panel provided in the embodiment of this application.

[0052] Explanation of reference numerals in the attached drawings: 10: Electronic device; 20: Display panel; 110: Middle frame; 111: Accommodating space; 112: First middle frame; 113: Second middle frame; 114: First accommodating space; 115: Second accommodating space; 120: Main board; 130: Sub-board; 140: Battery; 141: First battery; 142: Second battery; 150: Back cover; 160: Hinge structure; 201: Panel body; 202: Polarizing film; 203: Optical adhesive; 204: Cover plate; 210: Wiring layer; 211: Connecting line; 212: Main body layer; 213: Metal layer; 214: Planarization layer; 215: Support layer; 216: Adhesive layer ; 2161: First adhesive layer; 2162: Second adhesive layer; 217: First lead-out section; 218: Second lead-out section; 219: First connection point; 220: Second connection point; 221: First adapter circuit board; 222: Second adapter circuit board; 223: First connector; 224: Second connector; 225: First positioning component; 226: First mating component; 227: Second positioning component; 229: First test line; 230: Second test line; 231: Grounding wire; 232: Through hole; 240: Bending section; 241: Limiting plate; 250: Screen circuit board; 251: Driver chip; 252: Back plate; 253: Adhesive layer. Detailed Implementation

[0053] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0054] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature.

[0055] Furthermore, in the embodiments of this application, directional terms such as "up," "down," "left," "right," "horizontal," and "vertical" are defined relative to the orientation of the components shown in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the components in the accompanying drawings.

[0056] The connection / linking in the embodiments of this application should be interpreted broadly. For example, "connection" can be a fixed connection, an electrical connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium.

[0057] This application provides an electronic device, which may include mobile phones, tablets, smartwatches, etc. This application does not limit the electronic device.

[0058] Referring to Figure 1, in some embodiments, the electronic device 10 may include a non-foldable electronic device. Taking a candybar phone as an example, the electronic device 10 may include a mid-frame 110, a display panel 20, a motherboard 120, a sub-board 130, a battery 140, and a back cover 150. The mid-frame 110 forms an accommodating space 111. The display panel 20 covers one side of the mid-frame 110, and the back cover 150 covers the other side of the mid-frame 110 to enclose the accommodating space 111. The motherboard 120, the sub-board 130, and the battery 140 are all disposed within the accommodating space 111. The battery 140 is used to power the motherboard 120 and the sub-board 130.

[0059] In some implementations, both the main board 120 and the secondary board 130 can be printed circuit boards (PCBs). The secondary board 130 can connect to devices such as a charging interface, microphone, and motor, while the main board 120 can connect to devices such as a camera and antenna in the electronic device 10. The main board 120 can also house a system-on-chip (SOC) and memory. Taking the orientation shown in Figure 1 as an example, the main board 120 can be positioned above the battery 140, and the secondary board 130 can be positioned below the battery 140 to ensure a reasonable layout of the electronic device 10. The main board 120 and the secondary board 130 are electrically connected to enable signal transmission between them. The display panel 20 can be connected to either the main board 120 or the secondary board 130 to display images under the control of either the main board 120 or the secondary board 130.

[0060] Referring to Figures 2 and 3, in some embodiments, the electronic device 10 can be a foldable electronic device, taking a foldable mobile phone as an example. The electronic device 10 may include a first middle frame 112, a second middle frame 113, and a display panel 20. The first middle frame 112 and the second middle frame 113 are foldably connected. For example, the first middle frame 112 and the second middle frame 113 can be connected by a hinge structure 160. The hinge structure 160 is configured to allow the first middle frame 112 to be folded or unfolded relative to the second middle frame 113. This application embodiment does not limit the hinge structure 160. Wherein, when the first middle frame 112 is unfolded relative to the second middle frame 113 (the electronic device 10 is in the unfolded state), the first middle frame 112 and the second middle frame 113 can be approximately located in the same plane; when the first middle frame 112 and the second middle frame 113 are folded together (the electronic device 10 is in the folded state), the first middle frame 112 and the second middle frame 113 are approximately parallel and close to each other.

[0061] It is understood that in the above embodiments, the display panel 20 covers the first middle frame 112 and the second middle frame 113. The display panel 20 is a flexible display panel, so that it bends accordingly during the folding or unfolding of the first middle frame 112 relative to the second middle frame 113. For example, in the folded state, the display panel 20 can be sandwiched between the first middle frame 112 and the second middle frame 113 (i.e., folded inward); or, in the folded state, the display panel 20 can cover the outside of the first middle frame 112 and the second middle frame 113 (i.e., folded outward); the embodiments of this application do not limit this.

[0062] The first frame 112 encloses a first accommodating space 114, and the second frame 113 encloses a second accommodating space 115. The electronic device 10 also includes a motherboard 120 and a sub-board 130. The motherboard 120 can be disposed within the first accommodating space 114, and the sub-board 130 can be disposed within the second accommodating space 115. The display panel 20 can be connected to the motherboard 120 or the sub-board 130 to display images under the control of the motherboard 120 or the sub-board 130. The motherboard 120 and the sub-board 130 are electrically connected to realize signal transmission between the motherboard 120 and the sub-board 130. For example, the motherboard 120 is provided with a system chip, memory, etc., and the motherboard 120 can also be connected to devices such as a camera and an antenna; the sub-board 130 can be connected to devices such as a charging interface, a microphone, and a motor. The electronic device 10 also includes a first battery 141 and a second battery 142. The first battery 141 is disposed in a first accommodating space 114, and the second battery is disposed in a second accommodating space 115. The battery capacity of the electronic device 10 can be increased by using the first battery 141 and the second battery 142, thereby increasing the standby time.

[0063] Referring to Figure 4, in this embodiment, the display panel 20 includes a panel body 201, which is used to display images. Exemplarily, the panel body 201 may include an organic light-emitting diode (OLED), a liquid crystal display (LCD), a mini-LED (Min-LED) device, etc. This embodiment does not limit the panel body 201. It is understood that, as shown in Figure 1, in the implementation of the electronic device 10 as a non-foldable electronic device, the display panel 20 can be a rigid display panel, meaning it cannot be bent. As shown in Figure 2, in the implementation of the electronic device 10 as a foldable electronic device, the display panel 20 is a flexible display panel, meaning it can be bent.

[0064] Referring to Figures 5 and 6, the panel body 201 includes a bent section 240 located at the edge and bent towards the backlight side of the panel body 201. The bent section 240 is connected to the main board 120 via the screen circuit board 250 to display images under the control of the main board 120. In some implementations, a driver chip 251 is also provided on the screen circuit board 250, which can drive the panel body 201 to display images under the control of the main board 120. Referring to Figure 7, in implementations where the display panel 20 is larger, multiple driver chips 251 can be provided on the screen circuit board 250 to meet the driving requirements of the panel body 201. It can be understood that the light-emitting side is the side of the panel body 201 facing the user, and the backlight side is the side of the panel body 201 away from the user.

[0065] In the above implementation, the screen circuit board 250 may include a flexible printed circuit (FPC), and the screen circuit board 250 can be bent appropriately to facilitate connection with the motherboard 120.

[0066] In other embodiments, the screen circuit board 250 may also be connected to the sub-board 130 (as shown in Figures 1 and 3) to display images under the control of the sub-board 130.

[0067] Referring again to FIG4, in some embodiments, the display panel 20 further includes a polarizer 202 (Pol) stacked on the light-emitting side of the panel body 201. The polarizer 202 can reduce the reflection of ambient light, thereby avoiding interference from ambient light and improving the imaging quality of the display panel 20.

[0068] In some embodiments, the display panel 20 further includes a color filter on encapsulation (COE) stacked on the light-emitting side of the panel body 201. The COE can also eliminate interference from ambient light and improve the imaging quality of the display panel 20.

[0069] In the above implementation, the display panel 20 may further include a cover glass 204 (CG) and optically clear adhesive 203 (OCA). The cover glass 204 covers the light-emitting side of the panel body 201, and the optically clear adhesive 203 is disposed between the cover glass 204 and the panel body 201, thereby bonding the cover glass 204 and the panel body 201 together. The cover glass 204 protects the panel body 201 from damage caused by external objects.

[0070] It is understandable that, in the implementation of the display panel 20 including the polarizer 202, the cover plate 204 can be disposed on the side of the polarizer 202 facing away from the panel body 201, and the cover plate 204 is connected to the polarizer 202 by optical adhesive 203. In the implementation of the display panel 20 including the color filter, the cover plate 204 can be disposed on the side of the color filter facing away from the panel body 201, and the cover plate 204 is connected to the color filter by optical adhesive 203.

[0071] Referring to Figures 4 and 8, in this embodiment, the display panel 20 further includes a wiring layer 210. The wiring layer 210 is disposed on the backlight side of the panel body 201. The wiring layer 210 includes connecting lines 211, which are used to connect the main board 120 and the sub-board 130 in the electronic device 10 (as shown in Figures 1 and 3). That is, the main board 120 and the sub-board 130 in the above embodiment are connected by connecting lines 211 to realize signal transmission between the main board 120 and the sub-board 130. There can be one or more connecting lines 211, and this embodiment does not limit the number of connecting lines 211.

[0072] In this embodiment, the connecting line 211 has a certain resistance. By appropriately setting the width and length of the connecting line 211, its resistance can be adjusted. For example, increasing the length of the connecting line 211 increases its resistance, while increasing its width decreases its resistance. The resistance of the connecting line 211 can be appropriately set according to the signal transmitted by it to meet usage requirements.

[0073] In some embodiments, the connecting line 211 may include a first connecting line for transmitting radio frequency (RF) signals. The RF signal may be a signal from an antenna or a signal transmitted to an antenna. The resistance of the first connecting line is 35Ω ± 5Ω (e.g., 35Ω, 38Ω, 40Ω, etc.). Since the RF signal has high power, a lower resistance value in the first connecting line reduces losses, thereby minimizing the impact of the first connecting line's resistance on the RF signal and ensuring communication performance. It is understood that there may be multiple first connecting lines, spaced apart, to transmit RF signals.

[0074] In some embodiments, the connecting line 211 includes a second connecting line for transmitting a clock signal. The resistance of the second connecting line is greater than or equal to 35Ω; for example, the resistance of the second connecting line is 50Ω ± 5Ω (e.g., 45Ω, 50Ω, 55Ω, etc.). This configuration allows for the transmission of clock signals between the motherboard 120 and the sub-board 130 via the second connecting line; and the resistance value of the second connecting line is appropriate to ensure the accuracy of the clock signal. It is understood that there can be multiple second connecting lines, spaced apart, to transmit clock signals.

[0075] In some embodiments, the connecting line 211 includes a third connecting line for transmitting peripheral signals; wherein the peripheral signals may include signals from devices such as the display panel 20, camera, sensor, and microphone. The resistance of the third connecting line is 90Ω±10Ω (e.g., 80Ω, 90Ω, 100Ω, etc.). This setting provides a moderate impedance for the third connecting line, reducing insertion loss and improving return loss, thereby improving signal transmission quality. It is understood that there can be multiple third connecting lines, spaced apart, to transmit peripheral signals.

[0076] In some embodiments, the connection line 211 includes a fourth connection line for transmitting interface signals. These interface signals can be I / O bus interface signals, such as PCIE signals or USB signals. PCIE signals correspond to the Peripheral Component Interconnect Express (PCI) bus, and USB signals correspond to the Universal Serial Bus (USB). The resistance of the fourth connection line is 100Ω ± 10Ω (e.g., 90Ω, 100Ω, 110Ω). This configuration reduces signal reflection while allowing for a reduction in the width of the fourth connection line, thereby increasing wiring density. It is understood that there can be multiple fourth connection lines, spaced apart, to transmit interface signals.

[0077] In some embodiments, the connecting line 211 includes a fifth connecting line for transmitting a power signal. This power signal can be a power supply signal between the motherboard 120 and the sub-board 130, enabling power supply between them (e.g., the motherboard 120 supplying power to the sub-board 130, or the sub-board 130 supplying power to the motherboard 120). The resistance of the fifth connecting line is less than or equal to 40mΩ (e.g., 20mΩ, 30mΩ, 40mΩ, etc.). This configuration results in a lower resistance for the fifth connecting line, reducing voltage drop during transmission and ensuring the accuracy of the power supply voltage. It is understood that there can be multiple fifth connecting lines, spaced apart, to transmit the power signal.

[0078] In some implementations, the connecting line 211 may include one or more of a first connecting line, a second connecting line, a third connecting line, a fourth connecting line, and a fifth connecting line. For example, the connecting line 211 may include a first connecting line, a second connecting line, a third connecting line, a fourth connecting line, and a fifth connecting line.

[0079] As shown in Figures 4 and 8, in the embodiment of this application, the display panel 20 has a wiring layer 210 stacked on the backlight side of the panel body. The wiring layer 210 includes connecting lines 211. The main board 120 and the sub-board 130 in the electronic device 10 are connected by the connecting lines 211. There is no need to set up an additional connecting circuit board to connect the main board 120 and the sub-board 130, which reduces the space occupation and thus reduces the size of the electronic device 10, making it easier to achieve miniaturization of the electronic device 10.

[0080] As shown in Figure 1, in the implementation of the electronic device 10 as a non-foldable electronic device, the battery 140 is disposed between the main board 120 and the sub-board 130. The connecting circuit board connecting the main board 120 and the sub-board 130 spans across the battery 140. Due to the limited thickness of the electronic device 10, the battery 140 has a relatively small thickness and capacity. As shown in Figures 1 and 4, in this embodiment, the main board 120 and the sub-board 130 are connected through the wiring layer 210 of the display panel 20, eliminating the need for a connecting circuit board. This allows for an increase in the thickness of the battery 140, improving its capacity and thus extending the standby time of the electronic device 10.

[0081] As shown in Figure 3, in the implementation of the electronic device 10 including a foldable electronic device, the connecting circuit board connecting the main board 120 and the sub-board 130 passes through the hinge structure 160, resulting in a large volume of the hinge structure 160. As shown in Figures 3 and 4, in this embodiment, the main board 120 and the sub-board 130 are connected through the wiring layer 210 of the display panel 20, eliminating the need for a connecting circuit board and reducing the volume of the hinge structure 160.

[0082] Referring again to Figures 4 and 8, in this embodiment, the wiring layer 210 includes a main layer 212 and a metal layer 213. The main layer 212 and the metal layer 213 are stacked on the backlight side of the panel body 201. The material of the main layer 212 may include insulating materials such as polyimide (PI). This embodiment does not limit the material of the main layer 212. The metal layer 213 includes connecting lines 211. That is, connecting lines 211 can be obtained by patterning the metal layer 213. For example, part of the metal layer 213 can be removed by etching, cutting, etc., to form connecting lines 211. Of course, the metal layer 213 with a certain pattern (connecting lines 211) can be formed by electroplating. The material of the metal layer 213 may include copper, aluminum, etc., and the thickness of the metal layer 213 can be 4μm-10μm (such as 5μm, 6μm, 7μm, 8μm, etc.).

[0083] With the above settings, the main body layer 212 can support the metal layer 213 to prevent the metal layer 213 from falling off.

[0084] In some embodiments, the metal layer 213 may be disposed between the main body layer 212 and the panel body 201, or the main body layer 212 may be disposed between the metal layer 213 and the panel body 201.

[0085] Referring again to Figures 4 and 8, in the above implementation, the wiring layer 210 may further include a planarization layer 214, which covers the metal layer 213. That is, part of the planarization layer 214 fills the grooves (between adjacent connecting lines 211) on the metal layer 213, while the remaining part covers the metal layer 213. This configuration allows the planarization layer 214 to protect the metal layer 213 from damage. Furthermore, the surface of the planarization layer 214 facing away from the main layer 212 is relatively flat, facilitating connection with other film layers. For example, the thickness of the planarization layer 214 can be 8μm ± 2μm (e.g., 6μm, 8μm, 10μm, etc.).

[0086] In some embodiments, the display panel 20 further includes a backplate 252 stacked on the backlight side of the panel body 201, which supports the panel body 201. In an implementation where the main body layer 212 is disposed between the metal layer 213 and the panel body 201, the backplate 252 may include the main body layer 212; that is, the backplate 252 and the main body layer 212 may be the same film layer. This configuration eliminates the need for an additional main body layer 212, reducing the number of film layers in the display panel 20 and thus reducing its thickness and weight.

[0087] Referring again to Figure 4, in some implementations, the display panel 20 further includes an adhesive layer 216 and a support layer 215 disposed on the backlight side of the panel body 201. The adhesive layer 216 is located between the support layer 215 and the wiring layer 210, and the connection between the support layer 215 and the wiring layer 210 can be achieved through the adhesive layer 216, thereby fixing the support layer 215; the support layer 215 can further support the panel body 201. For example, in the implementation where the electronic device is a non-foldable electronic device, the material of the support layer 215 may include copper, aluminum, etc.; in the implementation where the electronic device includes a foldable electronic device, the support layer 215 may include a bendable metal plate.

[0088] In the above implementation, the adhesive layer 216 may include a first adhesive layer 2161 and a second adhesive layer 2162 stacked together to improve the adhesive force of the adhesive layer 216. For example, the second adhesive layer 2162 may be located between the first adhesive layer 2161 and the support layer 215; the first adhesive layer 2161 may include a mesh adhesive, and the second adhesive layer 2162 may include a foam adhesive.

[0089] Referring to Figure 9, in this embodiment, the wiring layer 210 includes a first lead-out segment 217 and a second lead-out segment 218. The projections of the first lead-out segment 217 and the second lead-out segment 218 in the thickness direction of the panel body 201 at least partially overlap with the panel body 201. That is, a portion of the first lead-out segment 217 and a portion of the second lead-out segment 218 can extend outside the panel body 201, or both the first lead-out segment 217 and the second lead-out segment 218 can be completely attached to the panel body 201. One end of the connecting line 211 is located at the first lead-out segment 217, and the other end of the connecting line 211 is located at the second lead-out segment 218. The connecting line 211 on the first lead-out segment 217 is used to connect to the motherboard 120 (as shown in Figure 1), and the connecting line 211 on the second lead-out segment 218 is used to connect to the sub-board 130. This configuration, by setting a first lead-out section 217 and a second lead-out section 218 extending out of the panel body 201, facilitates the connection between the connecting cable 211 and the main board 120 and the sub-board 130.

[0090] In other implementations, the projections of the first lead-out segment 217 and the second lead-out segment 218 in the thickness direction of the panel body 201 are located outside the panel body 201, that is, the first lead-out segment 217 and the second lead-out segment 218 are located outside the panel body 201.

[0091] Referring again to Figure 9, in the implementation of the wiring layer 210 including the main body layer 212 (as shown in Figure 8), the main body layer 212 includes an integrally structured attachment layer 253, a first lead-out section 217, and a second lead-out section 218. The attachment layer 253 is attached to the panel body 201 (as shown in Figure 4). The first lead-out section 217 and the second lead-out section 218 extend outside the panel body 201. One end of the connecting line 211 is located on the first lead-out section 217, and the other end of the connecting line 211 is located on the second lead-out section 218. The remaining part of the connecting line 211 is located on the attachment layer 253.

[0092] Referring again to Figure 9, it can be understood that the first lead-out segment 217 extends towards the main board 120 (as shown in Figures 1 and 3) to facilitate connection with the main board 120; the second lead-out segment 218 extends towards the sub-board 130 to facilitate connection with the sub-board 130. This embodiment does not limit the positions of the first lead-out segment 217 and the second lead-out segment 218; their positions can be reasonably set according to the positions of the main board 120 and the sub-board 130. In the implementation where the display panel includes the bent segment 240 as shown in Figure 6, the first lead-out segment 217 or the second lead-out segment 218 is located on the same side of the panel body as the bent segment 240. Of course, the first lead-out segment 217 and the second lead-out segment 218 can also be located on different sides of the panel body than the bent segment 240; this embodiment does not limit this.

[0093] Referring to Figures 9 and 10, in some implementations, one end of the connecting line 211 is located at the first lead-out section 217 and connected to the motherboard 120, including: the first lead-out section 217 is provided with a first connection point 219 connected to one end of the connecting line 211, and the first connection point 219 is used to connect to the motherboard 120 (as shown in Figures 1 and 3); similarly, as shown in Figures 9 and 11, the other end of the connecting line 211 is located at the second lead-out section 218 and connected to the sub-board 130, including: the second lead-out section 218 is provided with a second connection point 220 connected to the other end of the connecting line 211, and the second connection point 220 is used to connect to the sub-board 130. The first connection point 219 and the second connection point 220 may both include a metal sheet, the width of which is greater than the width of the connecting line 211, to facilitate the connection between the connecting line 211 and the motherboard 120 and the sub-board 130. For example, the shapes of the first connection point 219 and the second connection point 220 can be regular shapes such as rectangles, circles, trapezoids, and ellipses. Of course, the shapes of the first connection point 219 and the second connection point 220 can also be other irregular shapes.

[0094] It is understood that in the implementation of multiple connection lines 211, including a first connection line, a second connection line, a third connection line, a fourth connection line, and a fifth connection line, a first lead-out segment 217 is provided with multiple first connection points 219, and a second lead-out segment 218 is provided with multiple second connection points 220. One end of each connection line 211 is connected to a first connection point 219, and the other end of each connection line 211 is connected to a second connection point 220, so that one end of each connection line 211 is connected to the main board 120 through the corresponding first connection point 219 (as shown in Figures 1 and 3), and the other end of each connection line 211 is connected to the sub-board 130 through the corresponding second connection point 220.

[0095] In some embodiments, the first connection point 219 is directly connected to the motherboard 120 (as shown in Figures 1 and 3), and the second connection point 220 is directly connected to the sub-board 130. Exemplarily, the first connection point 219 can be soldered to the motherboard 120, and the second connection point 220 can be soldered to the sub-board 130. This configuration, using soldering, reduces connection difficulty and increases assembly speed. Soldering methods such as laser soldering, rigid-flex PCB (FPC On Board, FOB) soldering, and hot-press soldering can be used. In other implementations, the first connection point 219 can also be connected to the motherboard 120 via an anisotropic conductive film (ACF), and the second connection point 220 can also be connected to the sub-board 130 via an anisotropic conductive film. The anisotropic conductive adhesive film includes a thermosetting resin doped with silver-coated resin particles. During use, the anisotropic conductive adhesive film is sandwiched between the first lead-out section 217 and the main board 120. Heating then destroys the resin particles, allowing the silver to connect the first connection point 219 to the main board 120. Similarly, when connecting the second lead-out section 218, the anisotropic conductive adhesive film is sandwiched between the second lead-out section 218 and the sub-board 130. Heating then destroys the resin particles, allowing the silver to connect the second connection point 220 to the sub-board 130.

[0096] Referring to Figures 12 and 13, in other embodiments, the display panel 20 further includes a first adapter circuit board 221 and a second adapter circuit board 222. A first connection point 219 is connected to the main board 120 (as shown in Figures 1 and 3) via the first adapter circuit board 221; a second connection point 220 is connected to the sub-board 130 via the second adapter circuit board 222. This arrangement facilitates the connection between the wiring layer and the main board 120 and the sub-board 130. The first adapter circuit board 221 and the second adapter circuit board 222 can be flexible circuit boards, giving them a certain degree of flexibility. The deformation of the first adapter circuit board 221 and the second adapter circuit board 222 facilitates their disassembly and installation.

[0097] Referring again to Figures 12 and 13, it can be understood that the first connection point 219 can be soldered to the first adapter circuit board 221. The first adapter circuit board 221 is provided with a first connector 223. The main board 120 can be provided with a first adapter that mates with the first connector 223. The first connector 223 is detachably connected to the first adapter, thereby realizing the connection between the main board 120 and the first adapter. Similarly, the second connection point 220 is soldered to the second adapter circuit board 222. The second adapter circuit board 222 is provided with a second connector 224. The sub-board 130 is provided with a second adapter that mates with the second connector 224. The second connector 224 is detachably connected to the second adapter, thereby realizing the connection between the sub-board 130 and the second adapter. Of course, in other implementations, the first adapter circuit board 221 can also be connected to the main board 120 by soldering, and the second adapter circuit board 222 can also be connected to the sub-board 130 by soldering. This application embodiment does not limit the connection method between the first adapter circuit board 221 and the main board 120, or the connection method between the second adapter circuit board 222 and the sub-board 130.

[0098] Referring to Figure 13, in some embodiments, a first positioning element 225 is provided on the first lead-out segment 217 for positioning the first lead-out segment 217; a second positioning element 227 is provided on the second lead-out segment 218 for positioning the second lead-out segment 218. This arrangement can improve the positional accuracy of the first lead-out segment 217 and the second lead-out segment 218, thereby improving the installation accuracy.

[0099] For example, the first positioning member 225 includes a first protrusion and / or a first groove disposed on the first lead-out section 217. Similarly, the second positioning member 227 includes a second protrusion and / or a second groove disposed on the second lead-out section 218. This configuration simplifies the manufacturing of the display panel.

[0100] Referring again to Figures 10 and 11, in the implementation where the first connection point 219 is directly soldered to the motherboard 120 (as shown in Figures 1 and 3), the motherboard 120 is provided with a first mating member that cooperates with the first positioning member 225. The first lead-out segment 217 is limited by the cooperation between the first positioning member 225 and the first mating member, thereby improving soldering accuracy. For example, the first mating member may include a first mating post and / or a first mating groove provided on the motherboard 120. In a plane parallel to the motherboard 120, the projection of the first mating member can completely coincide with the projection of the first positioning member 225. During connection, the first positioning member 225 can be aligned with the first mating member, thereby achieving the positioning of the first lead-out segment 217.

[0101] Similarly, in the implementation where the second connection point 220 is directly welded to the sub-plate 130 (as shown in Figures 1 and 3), the sub-plate 130 is provided with a second mating member that cooperates with the second positioning member 227. This mating member, through its cooperation with the second positioning member 227, limits the positioning of the second lead-out section 218, thereby improving welding accuracy. For example, the second mating member may include a second mating post and / or a second mating groove provided on the sub-plate 130. In a plane parallel to the sub-plate 130, the projection of the second mating member can completely coincide with the projection of the second positioning member 227. During connection, the second positioning member 227 can be aligned with the second mating member to achieve positioning of the second lead-out section 218.

[0102] As shown in Figures 12-14, it can be understood that in the implementation where the first connection point 219 is connected to the main board 120 (as shown in Figures 1 and 3) via the first adapter circuit board 221, the first mating component 226 can be disposed on the first adapter circuit board 221. Similarly, in the implementation where the second connection point 220 is connected to the main board sub-board 130 via the second adapter circuit board 222, the second mating component can be disposed on the second adapter circuit board 222. The structures of the first positioning component 225 and the first mating component 226 are roughly similar to those in the above implementations, and the structures of the second positioning component 227 and the second mating component are also roughly similar to those in the above implementations, and will not be described further here.

[0103] In the above implementation, the projection of the first positioning member 225 onto the plane parallel to the motherboard 120 (as shown in Figures 1 and 3) can be a regular shape such as a circle or rectangle; of course, the projection of the first positioning member 225 onto the plane parallel to the motherboard 120 can also be other irregular shapes, for example, the projection of the first positioning member 225 onto the plane parallel to the motherboard 120 can be a cross shape (as shown in Figure 15), a half-I-shape (as shown in Figure 16), etc. The shape of the second positioning member 227 can be the same as or different from that of the first positioning member 225, and this embodiment of the application does not limit this.

[0104] As shown in Figures 17 and 18, in the above embodiment, the wiring layer 210 further includes a first test line 229. Both ends of the first test line 229 are located at the first lead-out section 217. The two ends of the first test line 229 are used to connect to different test points on the motherboard 120. By connecting the test points on the motherboard 120 to the two ends of the first test line 229, the conductivity between the connecting line 211 and the motherboard 120 (as shown in Figures 1 and 3) can be evaluated, that is, whether the connection between the connecting line 211 and the motherboard 120 is intact. For example, the resistance between the test points on the motherboard 120 connecting the two ends of the first test line 229 can be measured. If the resistance between the test points on the motherboard 120 connecting the two ends of the first test line 229 is large (greater than the resistance of the first test line 229 itself), it indicates that the conductivity between the connecting line 211 and the motherboard 120 is poor.

[0105] It is understandable that there can be multiple first test lines 229, with each first test line 229 connected to different test points on the motherboard 120 at both ends; or, one end of multiple first test lines 229 can be connected to the same test point on the motherboard 120, and the other end of each first test line 229 can be connected to different test points on the motherboard 120. If the resistance between the test points at both ends of each first test line 229 is small (approximately equal to the resistance of the first test line 229 itself), then the conductivity between the connecting line 211 and the motherboard 120 is good. If there is a first test line 229 with a large resistance between the test points at both ends, then the conductivity between the connecting line 211 and the motherboard 120 is poor.

[0106] Referring again to Figure 18, in some embodiments, the wiring layer 210 further includes a second test line 230. Both ends of the second test line 230 are located at the second lead-out section 218. The two ends of the second test line 230 are used to connect to different test points on the sub-board 130 (as shown in Figures 1 and 3). By connecting the test points on the sub-board 130 to the two ends of the second test line 230, the continuity between the connecting line 211 and the sub-board 130 can be evaluated, that is, whether the connection between the connecting line 211 and the sub-board 130 is intact. For example, the continuity between the connecting line 211 and the sub-board 130 can be evaluated by measuring the resistance between the test points on the sub-board 130 connecting to the two ends of the second test line 230. If the resistance between the test points on the sub-board 130 connecting to the two ends of the second test line 230 is large (greater than the resistance of the second test line 230 itself), it indicates that the continuity between the connecting line 211 and the sub-board 130 is poor.

[0107] It is understandable that there can be multiple second test lines 230, with each second test line 230 connected to different test points on the sub-board 130 at both ends; or, one end of multiple second test lines 230 can be connected to the same test point on the sub-board 130, and the other end of each second test line 230 can be connected to different test points on the sub-board 130. If the resistance between the test points at both ends of each second test line 230 is small (approximately equal to the resistance of the second test line 230 itself), then the continuity between the connecting line 211 and the sub-board 130 is good. If there are second test lines 230 with large resistance between the test points at both ends, then the continuity between the connecting line 211 and the sub-board 130 is poor.

[0108] Referring to Figures 18 and 19, in some embodiments, the wiring layer 210 further includes a grounding wire 231, which is arranged parallel to the connecting wire 211 and configured to be grounded. The grounding wire 231 protects the connecting wire 211, thereby preventing external electromagnetic signals from interfering with the signals transmitted through the grounding wire 231 and improving signal transmission quality.

[0109] It is understandable that there can be multiple grounding wires 231, and all of them can be located on one side of the connecting line 211 along the direction parallel to the panel body 201 (as shown in Figure 4) to prevent external electromagnetic signals from interfering with the connecting line 211. Alternatively, several grounding wires 231 can be located on one side of the connecting line 211 along the direction parallel to the panel body 201, while the remaining grounding wires 231 can be located on the other side of the connecting line 211 along the direction parallel to the panel body 201. This can prevent electromagnetic signals from both sides of the connecting line 211 from interfering with it, further improving signal transmission quality.

[0110] As shown in Figures 4 and 6, in the above implementation, the display panel 20 further includes a grounding layer, which is stacked on the side of the wiring layer 210 facing away from the panel body 201, and is configured to be grounded. For example, the grounding layer can be a grounding metal plate attached to the side of the wiring layer 210 facing away from the panel body 201; or, in an implementation where the display panel 20 includes a support layer 215, the support layer 215 is grounded. In this case, the grounding layer can be the support layer 215, that is, the support layer 215 serves as the grounding layer to simplify the structure of the display panel 20.

[0111] Referring to Figures 20 and 21, a through-hole 232 is provided on the wiring layer 210, extending to the grounding layer. A conductor is disposed within the through-hole 232, connecting the grounding wire 231 and the grounding layer. This arrangement achieves the connection between the grounding wire 231 and the grounding layer through the conductor, thereby grounding the grounding wire 231. The structure is simple and easy to manufacture. For example, the conductor may include a metal wall disposed on the wall of the through-hole 232; alternatively, the conductor may include a metal post filled within the through-hole 232. This embodiment does not impose such limitations.

[0112] It is understood that, continuing to refer to Figures 8 and 21, in the implementation of wiring layer 210 including main layer 212, metal layer 213 and planarization layer 214, and planarization layer 214 facing panel body 201, through hole 232 can be provided in planarization layer 214. In the implementation of wiring layer 210 including main layer 212, metal layer 213 and planarization layer 214, and main layer 212 facing panel body 201, through hole 232 can be provided in main layer 212.

[0113] The above description is merely a specific implementation of the embodiments of this application, but the protection scope of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the protection scope of this application. Therefore, the protection scope of this application should be determined by the protection scope of the claims.

Claims

1. A display panel, characterized in that, include: Panel body; A wiring layer is disposed on the backlight side of the panel body; the wiring layer includes connecting lines for connecting the motherboard and sub-board of the electronic device.

2. The display panel according to claim 1, characterized in that, The wiring layer includes a first lead-out section and a second lead-out section, the projections of the first lead-out section and the second lead-out section in the thickness direction of the panel body at least partially overlap with the panel body; one end of the connecting line is located at the first lead-out section and is connected to the motherboard; the other end of the connecting line is located at the second lead-out section and is connected to the sub-board.

3. The display panel according to claim 2, characterized in that, One end of the connecting line is located at the first lead-out section and connected to the motherboard, including: a first connection point is provided on the first lead-out section to connect to one end of the connecting line, and the first connection point is connected to the motherboard; the other end of the connecting line is located at the second lead-out section and connected to the sub-board, including: a second connection point is provided on the second lead-out section to connect to the other end of the connecting line, and the second connection point is connected to the sub-board.

4. The display panel according to claim 3, characterized in that, The first connection point is used for soldering to the motherboard, and the second connection point is used for soldering to the sub-board.

5. The display panel according to claim 3, characterized in that, The display panel further includes a first adapter circuit board and a second adapter circuit board. The first connection point is connected to the motherboard through the first adapter circuit board; the second connection point is connected to the sub-board through the second adapter circuit board.

6. The display panel according to claim 4 or 5, characterized in that, The first lead-out segment is provided with a first positioning element, which is used to position the first lead-out segment; the second lead-out segment is provided with a second positioning element, which is used to position the second lead-out segment.

7. The display panel according to claim 6, characterized in that, The first positioning element includes a first protrusion and / or a first groove disposed on the first lead-out section; the second positioning element includes a second protrusion and / or a second groove disposed on the second lead-out section.

8. The display panel according to any one of claims 2-7, characterized in that, The wiring layer also includes a first test line, both ends of which are located at the first lead-out section. The two ends of the first test line are used to connect to different test points on the motherboard.

9. The display panel according to any one of claims 2-8, characterized in that, The wiring layer also includes a second test line, both ends of which are located at the second lead-out section. The two ends of the second test line are used to connect different test points on the sub-board.

10. The display panel according to any one of claims 1-9, characterized in that, The connecting line includes a first connecting line, which is used to transmit radio frequency signals, and the resistance of the first connecting line is 35Ω±5Ω.

11. The display panel according to any one of claims 1-10, characterized in that, The connecting line includes a second connecting line for transmitting a clock signal, and the resistance of the second connecting line is 50Ω±5Ω.

12. The display panel according to any one of claims 1-11, characterized in that, The connection line includes a third connection line, which is used to transmit peripheral signals, and the resistance of the third connection line is 90Ω±10Ω.

13. The display panel according to any one of claims 1-12, characterized in that, The connection line includes a fourth connection line, which is used to transmit interface signals, and the resistance of the fourth connection line is 100Ω±10Ω.

14. The display panel according to any one of claims 1-13, characterized in that, The connecting line includes a fifth connecting line, which is used to transmit power signals, and the resistance of the fifth connecting line is less than or equal to 40mΩ.

15. The display panel according to any one of claims 1-14, characterized in that, The wiring layer also includes a grounding wire, which is arranged parallel to and spaced apart from the connecting wires, and the grounding wire is configured to be grounded.

16. The display panel according to claim 15, characterized in that, The display panel further includes a grounding layer, which is stacked on the side of the wiring layer away from the panel body and is configured to be grounded; the wiring layer is provided with a through hole, which extends to the grounding layer, and a conductor is provided in the through hole, which is connected to the grounding wire and the grounding layer.

17. The display panel according to any one of claims 1-16, characterized in that, The wiring layer includes a main body layer and a metal layer stacked together, and the metal layer includes the connecting lines.

18. The display panel according to claim 17, characterized in that, The wiring layer also includes a planarization layer that covers the metal layer.

19. The display panel according to claim 17 or 18, characterized in that, The display panel includes a back panel stacked on the backlight side of the panel body, and the back panel includes the main body layer.

20. An electronic device, characterized in that, include: The motherboard, the sub-board, and the display panel as described in any one of claims 1-19; The motherboard and the sub-board are connected by the connecting cable.

21. The electronic device according to claim 20, characterized in that, The electronic device further includes a first middle frame and a second middle frame, which are foldably connected. The motherboard is disposed on the first middle frame, the sub-board is disposed on the second middle frame, and the display panel covers the first middle frame and the second middle frame.

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