Wafer processing apparatus

Abstract

Provided in the embodiments of the present application is a wafer processing apparatus, comprising a chamber, an adjustment plate, and a spray head disposed in the chamber. A top wall of the chamber is provided with a window. The adjustment plate is mounted above the top wall by means of at least two lifting / lowering assemblies, the spray head being connected to the adjustment plate by means of a connecting rod passing through the window. The lifting / lowering assemblies each comprise a connecting member, a lifting / lowering member and a movable member, the connecting members being disposed above the adjustment plate. The adjustment plate is provided with a first through hole, the lifting / lowering members passing through the first through hole. The connecting members are connected to the top wall by means of the lifting / lowering members, the adjustment plate being connected to the connecting members by means of the movable members. When the lifting / lowering member in any one of the lifting / lowering assemblies ascends or descends, the lifting / lowering assembly is configured in such a way that the movable member drives a side of the adjustment plate to ascend or descend synchronously, so that the angle of the adjustment plate changes. The wafer processing apparatus of the present application can uniformly process wafers.

Description

Wafer processing apparatus TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor technology, and in particular, to a wafer processing apparatus. BACKGROUND

[0002] A wafer processing apparatus generally processes a wafer by techniques such as cleaning, etching, and plasma enhanced chemical vapor deposition (PECVD). One type of wafer processing apparatus includes a chamber having a tray and a showerhead that delivers a process gas into the chamber for processing a wafer on the tray. In such a chamber, if the showerhead is at an angle to the tray, the wafer can be processed non-uniformly during the wafer processing.

[0003] To this end, the prior art generally measures and adjusts the parallelism between the showerhead and the tray manually when the wafer processing apparatus is assembled. However, due to the high-temperature environment in the process and other factors, the tray will gradually deform during operation, causing the showerhead and the tray to be unable to maintain parallelism, and further causing the quality of wafer processing to be substandard. SUMMARY

[0004] Embodiments of the present application provide a wafer processing apparatus that can process a wafer uniformly at least to some extent.

[0005] The present application provides a wafer processing apparatus, comprising a chamber, a top wall of the chamber being provided with a window; an adjusting plate being arranged above the top wall by at least two lifting assemblies; a showerhead being arranged inside the chamber and connected to the adjusting plate by a connecting rod passing through the window; wherein the lifting assembly comprises a connecting piece, a lifting piece, and a movable piece, the connecting piece is arranged above the adjusting plate, the adjusting plate is provided with a first through hole, the lifting piece is arranged in the first through hole, the connecting piece is connected to the top wall through the lifting piece, the adjusting plate and the connecting piece are connected through the movable piece, and the lifting assembly is configured to: when the lifting piece in any one of the lifting assemblies is lifted or lowered, the movable piece drives one side of the adjusting plate to be lifted or lowered synchronously, so that the angle of the adjusting plate changes.

[0006] Specifically, the adjusting plate and / or the connecting piece are provided with a second through hole, and the movable piece is a connecting rod with an anti-disengagement part, the connecting rod moves up and down in the second through hole under the drive of the lifting piece.

[0007] Specifically, a spring is arranged between the connecting piece and the adjusting plate, and the spring is sleeved outside the connecting rod.

[0008] Specifically, a limiting slot is formed on the adjusting plate and / or the connecting piece, the movable piece is a connecting rod with a sliding block, the sliding block is slidably connected in the limiting slot, and the cross section of the limiting slot is larger than the cross section of the sliding block.

[0009] Specifically, the depth of the limiting slot is larger than the thickness of the sliding block, and the difference between the depth of the limiting slot and the thickness of the sliding block is larger than or equal to one third of the thickness of the sliding block.

[0010] Specifically, each of the lifting assemblies comprises a plurality of the connecting rods, and the plurality of the connecting rods are uniformly distributed around the lifting piece.

[0011] Specifically, the movable piece is two adjusting rods, and the two adjusting rods are rotationally connected.

[0012] Specifically, the lifting piece is hingedly connected with the top wall of the cavity.

[0013] Specifically, the number of the lifting assemblies is three, and the three lifting assemblies are uniformly distributed around the connecting rod.

[0014] Specifically, an elastic sealing piece is further included, and the elastic sealing piece is used to seal the gap between the connecting rod and the window.

[0015] Specifically, the connecting rod is a hollow pipe, and the elastic sealing piece forms a fluid inlet, wherein the connecting rod is connected with a first fluid supply device, and the fluid inlet is connected with a second fluid supply device.

[0016] The wafer processing device of the present application can adjust the levelness of the adjusting plate through the lifting assembly, so as to adjust the levelness of the shower head relative to the tray, and can uniformly process the wafer.

[0017] Other characteristics and advantages of the present application will become apparent from the following detailed description, or will be learned by practice of the present application.

[0018] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present application.

[0019] SUMMARY

[0020] The drawings herein are incorporated into the specification and form a part of the specification, show embodiments consistent with the present application, and together with the specification serve to explain the principles of the present application. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor. In the drawings:

[0021] Figure 1 shows a schematic diagram of a cross-sectional structure of a wafer processing device according to an embodiment of the present application;

[0022] Figure 2 shows a schematic diagram of a partial structure of a lifting member in the wafer processing device of Figure 1;

[0023] Figure 3A shows a schematic diagram of a wafer processing device in use according to an embodiment of the present application;

[0024] Figure 3B shows a schematic diagram of the wafer processing device of Figure 3A in another use state;

[0025] Figure 4A shows a schematic diagram of a wafer processing device in use according to another embodiment of the present application;

[0026] Figure 4B shows a schematic diagram of the wafer processing device of Figure 4A in another use state;

[0027] Figure 5A shows a schematic diagram of a wafer processing device in use according to another embodiment of the present application;

[0028] Figure 5B shows a schematic diagram of the wafer processing device of Figure 5A in another use state;

[0029] Figure 6A shows a schematic diagram of a wafer processing device in use according to another embodiment of the present application;

[0030] Figure 6B shows a schematic diagram of the wafer processing device of Figure 6A in another use state;

[0031] Figure 7 shows a schematic diagram of a cross-sectional structure of a wafer processing device according to an embodiment of the present application;

[0032] Figure 8 shows a schematic diagram of a wafer processing device in use according to another embodiment of the present application.

[0033] 100, a shower head,

[0034] 200, a top wall of the cavity,

[0035] 300, a leveling mechanism,

[0036] 301, an adjusting plate,

[0037] 3011, a first through hole,

[0038] 3012, a protrusion,

[0039] 302, a lifting rod,

[0040] 303, a driving member,

[0041] 3031, a connecting plate,

[0042] 304, a spring,

[0043] 305. connecting rod,

[0044] 306. limiting piece,

[0045] 307. second through hole,

[0046] 308. limiting groove,

[0047] 309. sliding block,

[0048] 310. shaft sleeve,

[0049] 400. connecting rod,

[0050] 500. first bellows,

[0051] 600. second fluid supply device.

[0052] Preferred embodiments of the present application

[0053] Example implementations will now be described more fully with reference to the accompanying drawings. Example implementations may, however, be implemented in many different forms and should not be construed as limited to the examples set forth herein; rather, these implementations are provided so that this disclosure will be thorough and complete, and will fully convey the scope of example implementations to those skilled in the art.

[0054] Moreover, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the application. One skilled in the relevant art will recognize, however, that the

[0055] Referring to FIGS. 1-8, a wafer processing device is provided to adjust the angle between a showerhead 100 and a tray, and also to adjust the distance between the showerhead 100 and the tray, so that the wafer can be processed uniformly.

[0056] The wafer processing device includes a cavity, and a tray and a showerhead 100 disposed in the cavity. A wafer is placed on the tray, and the showerhead 100 is disposed above the tray. A first fluid supply device supplies a first fluid to the showerhead 100 through a hollow connecting rod 400, and the showerhead 100 supplies the first fluid to the wafer on the tray to process the wafer.

[0057] As shown in FIG. 1, a leveling mechanism 300 is arranged above the cavity top wall 200, and the leveling mechanism 300 is connected to the shower head 100 through a connecting rod 400 to adjust the angle between the shower head 100 and a tray (not shown in the figure). The cavity top wall 200 is provided with a window, and the connecting rod 400 passes through the window. The area of the window is larger than the cross-sectional area of the connecting rod 400, so that the connecting rod 400 can move in the window when the angle of the shower head 100 is adjusted. In this embodiment, the leveling mechanism 300 is arranged outside the cavity, which causes less disturbance to the inside of the cavity and can better ensure the cleanliness of the inside of the cavity.

[0058] The connecting rod 400 is sleeved with a first bellows 500. One end of the first bellows 500 is sealingly connected to the connecting rod 400, and the other end of the first bellows 500 covers the window and is sealingly connected to the cavity top wall 200, so that the window is sealed by the first bellows 500, and the pollutants outside the cavity can be prevented from entering the cavity through the window, which is conducive to improving the yield of the wafer after processing. In other embodiments of the present application, the first bellows 500 can be replaced by an elastic cover or other elastic sealing members. For example, the first bellows 500 is an elastic ring, which is sleeved outside the connecting rod 400. The inner ring of the elastic ring is sealingly connected to the connecting rod 400, and the outer ring of the elastic ring is sealingly connected to the window.

[0059] The side wall of the first bellows 500 is provided with a fluid inlet, which is in communication with a second fluid supply device 600 arranged outside the cavity, for supplying a second fluid into the cavity. The second fluid enters the gap between the first bellows 500 and the connecting rod 400, and then enters the cavity through the gap between the connecting rod 400 and the window, so that the first fluid entering the cavity through the connecting rod 400 cannot accumulate at the top of the cavity, thereby avoiding the formation of particles on the wafer due to the accumulation of the first fluid at the top of the cavity. At the same time, at least two kinds of fluids can be supplied into the cavity through the connecting rod 400 and the fluid inlet simultaneously according to the needs of the wafer processing process, which can improve the efficiency of wafer processing. For example, the second fluid can be nitrogen or other gases used for purging, or other fluids used for changing the environment of the cavity or participating in the reaction.

[0060] The wafer processing device of the present application comprises an adjusting plate arranged above the top wall through at least two lifting assemblies, and the adjusting plate and the at least two lifting assemblies constitute the leveling mechanism 300. The lifting assembly comprises a connecting piece, a lifting piece and a movable piece.

[0061] As shown in FIG. 1, in this embodiment, the connecting member is embodied as a driving member 303, and the lifting member is embodied as a lifting rod 302. An adjusting plate 301 is arranged above the cavity top wall 200 and connected with the shower head 100 through a connecting rod 400. The driving member 303 is arranged above the adjusting plate 301 and connected with the adjusting plate 301 through a movable member. The adjusting plate 301 is provided with a first through hole 3011, one end of the lifting rod 302 is connected with the driving member 303 through the first through hole 3011, and the other end of the lifting rod 302 is fixedly connected with the cavity top wall 200, so as to drive the adjusting plate 301 to lift through the driving member 303. The diameter of the first through hole 3011 is larger than the diameter of the lifting rod 302, so as to provide space for the lifting rod 302 to move in the first through hole 3011. The leveling mechanism 300 comprises a plurality of driving members 303 distributed above the adjusting plate 301, and each driving member 303 is connected with a lifting rod 302. The driving member 303 can be a motor, an electric cylinder or a pneumatic cylinder, etc. In other embodiments of the present application, the lifting rod 302 can also be a lifting shaft, a lifting slide rail or other lifting member. In other embodiments of the present application, the driving member 303 can be arranged at other positions, and a connecting plate or other connecting member arranged above the adjusting plate 301 is connected with the lifting rod 302.

[0062] In one specific embodiment, as shown in FIG. 3A, the movable member is a connecting rod 305 and a limiting piece 306 fixedly connected with the connecting rod 305, and a second through hole 307 is formed in the adjusting plate 301. One end of the connecting rod 305 is fixedly connected with the driving member 303, and the other end of the connecting rod 305 passes through the second through hole 307 and is connected with the limiting piece 306 to connect the driving member 303 and the adjusting plate 301. The distance from the limiting piece 306 to the driving member 303 is greater than the thickness of the adjusting plate 301, and the size of the limiting piece 306 is greater than the area of the second through hole 307. Therefore, the connecting rod 305 can move up and down in the second through hole 307, and the limiting piece 306 can prevent the connecting rod 305 from being separated from the driving member 303 and the adjusting plate 301. In order to make the adjusting plate 301 tilt, the area of the second through hole 307 is greater than the cross-sectional area of the connecting rod 305. When the lifting rod 302 of one driving member 303 is raised, the lifting rod 302 sequentially passes through the driving member 303, the connecting rod 305, and the limiting piece 306 below the adjusting plate 301 to give the adjusting plate 301 an upward force, thereby driving one side of the adjusting plate 301 to be raised to change the levelness of the adjusting plate 301. The connecting rod 305 on one driving member 303 can be one or more. When the connecting rod 305 is multiple, the multiple connecting rods 305 are arranged around the lifting rod 302, so that the limiting piece 306 below the adjusting plate 301 can always give the adjusting plate 301 an upward force when the adjusting plate 301 is at any angle. The multiple lifting rods 302 adjust the levelness of the adjusting plate 301 by adjusting the height of different positions of the adjusting plate 301, thereby adjusting the levelness of the shower head 100 to adjust the angle between the shower head 100 and the tray. In other embodiments of the present application, the limiting piece 306 is integrally arranged with the connecting rod 305.

[0063] Referring to FIG. 2, a spring 304 is further arranged between the driving member 303 and the adjusting plate 301. The spring 304 is sleeved on the connecting rod 305 and supports the driving member 303, so that a certain space is left between the driving member 303 and the adjusting plate 301, so that the driving member 303 does not interfere with the change of the levelness of the adjusting plate 301. When the lifting rod 302 of one driving member 303 is lowered, the lifting rod 302 sequentially passes through the driving member 303 and the spring to give the adjusting plate 301 a downward force, thereby driving one side of the adjusting plate 301 to be lowered to change the levelness of the adjusting plate 301. In other embodiments of the present application, the spring 304 is sleeved on the lifting rod 302 between the driving member 303 and the adjusting plate 301, or the spring 304 is directly fixed on the driving member 303, or the spring 304 is directly fixed on the adjusting plate 301. The spring 304 can also be replaced by other elastic supports that do not affect the rotation of the driving member 303 and the lifting rod 302.

[0064] As shown in FIG. 3B, when the lifting rods 302 of one or more driving members 303 are lifted or lowered to different heights, different positions of the plate surface of the adjusting plate 301 are subjected to different sizes of upward or downward forces, so that the different positions of the plate surface of the adjusting plate 301 are correspondingly lifted or lowered, so as to change the levelness of the adjusting plate 301, and then adjust the levelness of the shower head 100. The space between the second through hole 307 on the adjusting plate 301 and the driving member 303 can provide space for the rotation of the adjusting plate 301 relative to the connecting rod 305, and also limit the rotation angle of the adjusting plate 301, so as to limit the rotation angle of the adjusting plate 301, so that the shower head 100 is rotated to a set angle and remains at the angle. In addition, the rotation angle of the adjusting plate 301 is also limited by the first through hole 3011. Since the area of the first through hole 3011 is larger than the cross-sectional area of the lifting rod 302, under normal circumstances, the inner edge of the first through hole 3011 does not contact the side wall of the lifting rod 302, and when the inner edge of the first through hole 3011 abuts against the side wall of the lifting rod 302, the adjusting plate 301 stops rotating.

[0065] When the lifting rods 302 of the plurality of driving members 303 are simultaneously lifted by the same height, different positions of the plate surface of the adjusting plate 301 are subjected to the same size of upward force, and the adjusting plate 301 drives the shower head 100 to lift. When the lifting rods 302 of the plurality of driving members 303 are simultaneously lowered by the same height, different positions of the plate surface of the adjusting plate 301 are subjected to the same size of downward force, and the adjusting plate 301 drives the shower head 100 to lower.

[0066] In other embodiments of the present application, as shown in FIG. 4A, the lower part of the driving member 303 is provided with a connecting plate 3031, the second through hole 307 is arranged on the connecting plate 3031 of the driving member 303, one end of the connecting rod 305 is fixed with the adjusting plate 301, and the other end passes through the second through hole 307 on the connecting plate 3031 and cooperates with the limiting piece 306 to connect the driving member 303 and the adjusting plate 301, and the area of the second through hole 307 is greater than the cross-sectional area of the connecting rod 305. When the adjusting plate 301 is in a horizontal state, the lifting rod 302 supports the driving member 303, the limiting piece 306 is in contact with the connecting plate 3031, and the connecting plate 3031 is hung above the cavity top wall 200 through the limiting piece 306 and the connecting rod 305. As shown in FIG. 4B, when the lifting rod 302 of one or more driving members 303 rises or falls, different positions of the plate surface of the adjusting plate 301 are subjected to different upward or downward forces, the adjusting plate 301 is inclined, and the levelness of the shower head 100 is adjusted. Among them, when the adjusting plate 301 is subjected to the inclined force, the adjusting plate 301 will give the connecting rod 305 an inclined force in the second through hole 307 because the connecting rod 305 and the adjusting plate 301 are fixedly connected, the connecting rod 305 transmits the inclined force to the limiting piece 306, the limiting piece 306 rotates with the side of the limiting piece as the fulcrum, drives the connecting rod 305 to rotate in the second through hole 307 and rise relative to the second through hole 307, so that the connecting rod 305 drives the adjusting plate 301 to incline. In other embodiments of the present application, the connecting plate 3031 and the adjusting plate 301 are both provided with the second through hole 307, the area of the second through hole 307 on the connecting plate is greater than the cross-sectional area of the connecting rod 305, and the area of the second through hole 307 on the adjusting plate 301 is greater than the cross-sectional area of the connecting rod 305.

[0067] In other embodiments of the present application, the connecting rod 305 can also be replaced by a screw-nut structure, the screw is inserted into the second through hole 307, and the nut serves as a anti-loosening structure, and the area of the second through hole 307 is greater than the cross-sectional area of the screw.

[0068] In other embodiments of the present application, as shown in FIG. 5A, the adjusting plate 301 and the driving member 303 are connected through the connecting rod 305 and the limiting slot 308. Specifically, one end of the connecting rod 305 is fixedly connected with the driving member 303, the other end of the connecting rod 305 is connected with the sliding block 309, the limiting slot 308 is formed on the adjusting plate 301, the sliding block 309 is clamped in the limiting slot 308, the cross section of the sliding block 309 is smaller than the slot cross section of the limiting slot 308, and the width of the sliding block 309 is greater than the slot width of the limiting slot 308, so that the sliding block 309 can move in the limiting slot 308 and cannot be separated from the limiting slot 308. The thickness of the sliding block 309 is smaller than the depth of the limiting slot 308. For example, the difference between the depth of the limiting slot 308 and the thickness of the sliding block 309 is not less than one third of the thickness of the sliding block 309, so that the limiting slot 308 can be inclined relative to the sliding block 309. A certain space is left between the adjusting plate 301 and the driving member 303, so that the adjusting plate 301 can adjust the levelness. When the lifting rod 302 of one driving member 303 is raised, the lifting rod 302 gives the adjusting plate 301 an upward force through the driving member 303, the connecting rod 305, the sliding block 309 and the slot bottom of the limiting slot 308 in sequence, so that one side of the adjusting plate 301 is raised. When the lifting rod 302 of one driving member 303 is lowered, the lifting rod 302 gives the adjusting plate 301 a downward force through the driving member 303, the connecting rod 305, the sliding block 309 and the slot bottom of the limiting slot 308 in sequence, so that one side of the adjusting plate 301 is lowered, and the levelness of the adjusting plate 301 changes. The extension direction of the limiting slot 308 is set as required. As shown in FIG. 5B, when the lifting rod 302 of one or more driving members 303 is raised or lowered, the lifting rod 302 drives the adjusting plate 301 to be inclined, and the limiting slot 308 on the adjusting plate 301 is also inclined. Under the action of gravity, the limiting slot 308 slides downward relative to the sliding block 309. When the sliding block 309 slides to the end of the limiting slot 308, the sliding of the sliding block 309 stops, and the position of the adjusting plate 301 is adjusted. The inclination angle of the adjusting plate 301 is related to the length of the limiting slot 308. The inclination angle of the adjusting plate 301 is also related to the depth of the limiting slot 308.

[0069] In other embodiments of the present application, as shown in FIG. 6A, the limiting slot 308 is arranged on the connecting plate 3031 of the driving member 303, the connecting rod 305 is connected with the limiting slot 308 through the sliding block 309, and the connecting rod 305 is fixedly connected with the adjusting plate 301. As shown in FIG. 6B, when the lifting rod 302 of one or more driving members 303 is raised or lowered, the lifting rod 302 drives the adjusting plate 301 to be inclined. Under the action of gravity, the adjusting plate 301 drives the sliding block 309 to slide downward in the limiting slot 308 through the connecting rod 305. When the sliding block 309 slides to the end of the limiting slot 308, the sliding of the sliding block 309 stops, and the position of the adjusting plate 301 is adjusted.

[0070] In other embodiments of the present application, the connecting plate 3031 of the adjusting plate 301 and the driving member 303 is provided with a limiting slot 308, and the connecting rod 305 is slidably connected with the limiting slot 308 through a sliding block 309.

[0071] In other embodiments of the present application, the leveling mechanism 300 is different from the foregoing embodiments in structure, specifically, the connecting mode of the driving member 303 and the adjusting plate 301 is different. As shown in FIG. 7, the driving member 303 is provided with a rotating shaft on each side, and the adjusting plate 301 is provided with two protrusions 3012, each of which is provided with a shaft sleeve 310 matched with the rotating shaft, so that the driving member 303 and the adjusting plate 301 are connected through the rotating shaft and the shaft sleeve 310. The driving member 303 is fixedly connected with the rotating shaft, the adjusting plate 301 is fixedly connected with the protrusion 3012, the protrusion 3012 is fixedly connected with the shaft sleeve 310, and the rotating shaft is rotatably connected with the shaft sleeve 310. A certain distance is left between the driving member 303 and the adjusting plate 301 to provide an adjusting space for the adjusting plate 301. The lifting rod 302, the driving member 303, the protrusion 3012, the rotating shaft and the shaft sleeve 310 constitute a lifting assembly. There are multiple groups of the lifting assembly, which are evenly distributed on the adjusting plate 301. As shown in FIG. 8, when the lifting rod 302 in a group of the lifting assembly is lifted, the lifting rod 302 is sequentially provided with an upward force on one side of the adjusting plate 301 through the driving member 303, the rotating shaft and the shaft sleeve 310, so that the angle of the adjusting plate 301 changes. Since the rotating shaft is rotatably connected with the shaft sleeve 310, and a certain distance is left between the driving member 303 and the adjusting plate 301 to change the angle between the adjusting plate 301 and the driving member 303. In other embodiments of the present application, the rotating shaft is arranged on the protrusion 3012, and the shaft sleeve 310 is connected with the driving member 303. In other embodiments of the present application, the shaft sleeve 310 can be replaced by a rotating hole provided on the protrusion, and the diameter of the rotating hole is equal to the diameter of the rotating shaft. In other embodiments of the present application, the rotating shaft, the shaft sleeve 310 and the protrusion 3012 can be replaced by other connecting structures. For example, the adjusting plate 301 and the driving member 303 can be connected through two rotating connecting adjusting rods, one of which is connected with the adjusting plate 301, and the other of which is connected with the driving member 303.

[0072] In other embodiments of the present application, referring to FIG. 1 again, the lifting rods 302 are connected to the cavity top wall 200 through a twist ball structure. In this embodiment, one end of the lifting rod 302 is capable of relatively rotating with the adjusting plate 301 through the driving member 303, and the first through hole of the adjusting plate 301 is capable of limiting the angle between the lifting rod 302 and the adjusting plate 301. When the lifting rod 302 contacts the first through hole, the first through hole will push the lifting rod 302 to relatively rotate with the cavity top wall 200 through the twist ball structure, so as to change the angle between the lifting rod 302 and the cavity top wall 200, so that the lifting rod 302 is inclined, and the levelness of the adjusting plate 301 is more easily adjusted. At the same time, since there are multiple lifting rods 302, and the rotation angle between the lifting rod 302 and the adjusting plate 301 is limited by the first through hole, after each lifting rod 302 is lifted to a set height, the rotation angle of each lifting rod 302 will be limited by other lifting rods 302, so that the adjusting plate 301 can be fixed at a set angle. In other embodiments of the present application, the lifting rod 302 can be connected to the cavity top wall 200 through a hinge shaft structure or a rotating structure capable of changing the projection included angle between the adjusting plate 301 and the lifting rod 302 in the vertical plane.

[0073] The number of the lifting rods 302 is preferably three, and the three lifting rods 302 are not arranged in a straight line, so that each lifting rod 302 is stably positioned while the adjusting plate 301 can be inclined at multiple angles, so that the levelness of the shower head 100 relative to the tray is better adjusted. For example, the three lifting rods 302 can be evenly arranged around the connecting rod 400. The lifting rod 302 is arranged at the edge of the adjusting plate 301 to avoid the distance between adjacent lifting rods 302 being too close, which causes the adjusting plate 301 to be unable to adjust the angle, wherein the diameter of the adjusting plate 301 or the diameter of the circumscribed circle of the adjusting plate 301 is greater than or equal to the diameter of the shower head 100.

[0074] Other embodiments of the application will be apparent to those skilled in the art from consideration of the specification and practice of the aspects disclosed herein. It is intended that the application be limited only by the scope of the claims, including any amendments thereof, and other equivalents. It is intended that the application not be limited to the examples and embodiments described herein, but that it include all possible embodiments which lie within the scope of the application.

[0075] It should be understood that the application is not limited to the precise construction that has been described above and shown in the accompanying drawings, and that various modifications and changes can be made by those skilled in the art without departing from the scope of the application. The scope of the application is to be defined only by the appended claims, including any amendments thereto, and other equivalents.

Claims

1. A wafer processing apparatus, characterized in that, include: The cavity has a window on its top wall; The adjustment plate is mounted above the top wall via at least two lifting components; A spray head is disposed inside the cavity and connected to the adjusting plate via a connecting rod passing through the window; The lifting assembly includes a connector, a lifting component, and a movable component. The connector is located above the adjusting plate. The adjusting plate has a first through hole, and the lifting component passes through the first through hole. The connector is connected to the top wall through the lifting component. The adjusting plate and the connector are connected through the movable component. The lifting assembly is configured such that when any lifting component in the lifting assembly rises or falls, the movable component drives one side of the adjusting plate to rise or fall synchronously, so as to change the angle of the adjusting plate.

2. The wafer processing apparatus according to claim 1, characterized in that, The adjusting plate and / or the connecting member are provided with a second through hole. The movable member is a connecting rod with an anti-detachment part. The connecting rod moves up and down in the second through hole under the drive of the lifting member.

3. The wafer processing apparatus according to claim 2, characterized in that, A spring is provided between the connector and the adjusting plate, and the spring is sleeved on the outside of the connecting rod.

4. The wafer processing apparatus according to claim 1, characterized in that, The adjusting plate and / or the connecting member have a limiting groove. The movable member is a connecting rod with a slider. The slider is slidably engaged in the limiting groove. The cross-section of the limiting groove is larger than the cross-section of the slider.

5. The wafer processing apparatus according to claim 4, characterized in that, The depth of the limiting groove is greater than the thickness of the slider, and the difference between the depth of the limiting groove and the thickness of the slider is greater than or equal to one-third of the thickness of the slider.

6. The wafer processing apparatus according to claim 2, characterized in that, Each of the lifting components includes a plurality of links, which are evenly distributed around the lifting member.

7. The wafer processing apparatus according to claim 1, characterized in that, The movable component consists of two adjusting rods, which are rotatably connected.

8. The wafer processing apparatus according to claim 1, characterized in that, The lifting component is hinged to the top wall of the cavity.

9. The wafer processing apparatus according to claim 1, characterized in that, The number of lifting components is three, and the three lifting components are evenly distributed around the connecting rod.

10. The wafer processing apparatus according to claim 1, characterized in that, It also includes a resilient seal for sealing the gap between the connecting rod and the window.

11. The wafer processing apparatus according to claim 10, characterized in that, The connecting rod is a hollow tube, and the elastic seal has a fluid inlet. The connecting rod is connected to a first fluid supply device, and the fluid inlet is connected to a second fluid supply device.

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