Multilayer ceramic capacitor

Abstract

The present invention provides a multilayer ceramic capacitor in which the consolidation characteristics of ridge portions is high, and that makes it possible to suppress peeling of an internal electrode and a dielectric layer in the mountain portions, even when the internal electrode has a bent shape. Provided is a multilayer ceramic capacitor (1) wherein a first facing portion (33) of a first internal electrode (31) has a first ridge portion (201), a second facing portion (34) of a second internal electrode (32) has a second ridge portion (202), the first ridge portion (201) has a first flat region (2131), the second ridge portion (202) has a second flat region (2132), and the first ridge portion (201) is disposed on a first lead-out portion-side end portion (151) of the first facing portion (33).

Description

Multilayer ceramic capacitors

[0001] The present invention relates to a multilayer ceramic capacitor.

[0002] Multilayer ceramic capacitors, which include a laminate in which dielectric layers and internal electrodes are alternately stacked, and external electrodes connected to the internal electrodes, are important electronic components used in a variety of electronic devices. However, in conventional multilayer ceramic capacitors, the total number of laminated internal electrodes and dielectric layers in the extension portions where the internal electrodes do not face each other is smaller than the total number of laminated dielectric layers and internal electrodes in the facing portions where the internal electrodes face each other. This can result in steps in the extension portions, which can degrade the quality of the multilayer ceramic capacitor. Therefore, Patent Document 1 proposes a multilayer ceramic capacitor in which a ceramic pattern is arranged in the portions where steps occur to eliminate the steps, and the internal electrodes are bent.

[0003] JP 2015-159140 A

[0004] However, in the technology described in the conventional document 1, when force is applied to the portion where the internal electrode overlaps with the ceramic pattern (step absorption layer) arranged to eliminate the step in the portion where the step occurs in the manufacturing process, the force escapes. As a result, the pressure bonding between the internal electrode and the dielectric layer (step absorption layer) becomes insufficient in the portion where the internal electrode is bent, which causes a problem that structural defects such as peeling occur starting from the portion where the internal electrode is bent.

[0005] The present invention is devised to solve the above-mentioned problems, and aims to provide a multilayer ceramic capacitor in which, even when the internal electrodes have a curved shape, the convex portions have high compaction properties and peeling between the internal electrodes and the dielectric layers at the convex portions can be suppressed.

[0006] The multilayer ceramic capacitor of the present invention comprises a laminate including a plurality of laminated dielectric layers and a plurality of internal electrodes, the laminate having first and second main surfaces facing each other in a lamination direction of the dielectric layers and the internal electrodes, first and second side surfaces facing each other in a width direction perpendicular to the lamination direction, and first and second end surfaces facing each other in a length direction perpendicular to the lamination direction and the width direction, and external electrodes connected to the internal electrodes and provided on a surface of the laminate, the internal electrodes having a first internal electrode extended to the first end surface and a second internal electrode extended to the second end surface, the first internal electrode having a first end surface facing the second internal electrode in the lamination direction. the second internal electrode has a second opposing portion facing the first internal electrode in the stacking direction, the first opposing portion having a first convex portion that is bent at least in part, the second opposing portion having a second convex portion that is bent at least in part, the first convex portion having a first flat region that is a flat region at least in part, the second convex portion having a second flat region that is a flat region at least in part, the first internal electrode has a first lead portion that does not face the second internal electrode in the stacking direction, and at least a portion of the first convex portion is arranged at an end of the first opposing portion on the first lead portion side.

[0007] According to the present invention, it is possible to provide a multilayer ceramic capacitor in which, even if the internal electrodes have a curved shape, the convex portions have high compaction properties and peeling between the internal electrodes and the dielectric layers at the convex portions can be suppressed.

[0008] FIG. 1 is an external perspective view of a multilayer ceramic capacitor according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view taken along line 101-101 in FIG. 1. FIG. 3 is a cross-sectional view taken along line 102-102 in FIG. 1. FIG. 4 is a cross-sectional view taken along line 103-103 in FIG. 1. FIG. 5 is an enlarged view of framed area 330 in FIG. 1. FIG. 6 is a cross-sectional view taken along line 104-104 in FIG. 1. FIG. 7 is a diagram illustrating an example of a manufacturing method according to an embodiment of the present invention. FIG. 8 is a view corresponding to FIG. 2 for a second embodiment of the present invention. FIG. 9 is a view corresponding to FIG. 6 for the second embodiment of the present invention. FIG. 10 is a view corresponding to FIG. 2 for a third embodiment of the present invention. FIG. 11 is a view corresponding to FIG. 2 for a fourth embodiment of the present invention.

[0009] First Embodiment A multilayer ceramic capacitor 1 according to a first embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view showing the appearance of a multilayer ceramic capacitor 1 according to a first embodiment of the present invention.

[0010] 1, the multilayer ceramic capacitor 1 has a substantially rectangular parallelepiped shape. The multilayer ceramic capacitor 1 includes a laminate 2 having a substantially rectangular parallelepiped shape and a pair of external electrodes disposed at opposite ends of the laminate 2 and spaced apart from each other.

[0011] The arrow T in Fig. 1 indicates the lamination direction T of the multilayer ceramic capacitor 1 and the laminate 2. The arrow L indicates the length direction L, which is perpendicular to the lamination direction T of the multilayer ceramic capacitor 1 and the laminate 2. The arrow W indicates the width direction W, which is perpendicular to the lamination direction T and length direction L of the multilayer ceramic capacitor 1 and the laminate 2. The lamination direction T, length direction L, and width direction W are perpendicular to one another. The arrows T, L, and L indicate the same directions as those described above in figures other than Fig. 1 as well.

[0012] One of the pair of external electrodes is provided at one end of the laminate 2 in the length direction L. The other of the pair of external electrodes is provided at the other end of the laminate 2 in the length direction L. One of the external electrodes is referred to as a first external electrode 41. The other external electrode is referred to as a second external electrode 42.

[0013] (Laminate) The laminate 2 will be described with reference to Figs. 2, 3, and 4 in addition to Fig. 1. Fig. 2 is a cross-sectional view taken along line 101-101 of Fig. 1. Fig. 3 is a cross-sectional view taken along line 102-102 of Fig. 1. Fig. 4 is a cross-sectional view taken along line 103-103 of Fig. 1. As shown in Fig. 2, the laminate 2 includes a plurality of laminated dielectric layers 20 and a plurality of internal electrodes. The internal electrodes include a first internal electrode 31 and a second internal electrode 32.

[0014] The two surfaces of the laminate 2 that face each other in the stacking direction T are called the first main surface 3 and the second main surface 4. The two surfaces of the laminate 2 that face each other in the width direction W are called the first side surface 5 and the second side surface 6. The two surfaces of the laminate 2 that face each other in the length direction L are called the first end surface 7 and the second end surface 8.

[0015] The laminate 2 has a rectangular parallelepiped shape. The portions where three faces of the laminate 2 intersect are called corners. The portions where two faces of the laminate 2 intersect are called ridges. The corners and ridges of the laminate 2 are preferably rounded. Some or all of the main surfaces, side surfaces, and end surfaces may have irregularities formed thereon.

[0016] (Dielectric Layer) The total number of dielectric layers 20 included in the laminate 2 is preferably 100 or more and 2000 or less.

[0017] The ceramic material contained in the dielectric layer 20 is, for example, BaTiO ３ , CaTiO ３ , SrTiO ３ , CaZrO ３ The ceramic material may be a dielectric ceramic having the above-mentioned main component and an auxiliary component added thereto. Examples of the auxiliary component include a Mn compound, an Fe compound, a Cr compound, a Co compound, a Ni compound, and an Mg compound.

[0018] The preferred thickness of one dielectric layer 20 is 0.5 μm or more and 10 μm or less.

[0019] The size of the laminate 2 is not particularly limited. The preferred length of the laminate 2 in the longitudinal direction L is 0.2 mm or more and 10 mm or less. The preferred length of the laminate 2 in the width direction W is 0.1 mm or more and 10 mm or less. The preferred length of the laminate 2 in the stacking direction T is 0.1 mm or more and 5 mm or less.

[0020] (Internal Electrodes) The internal electrodes will now be described. The internal electrodes include a plurality of first internal electrodes 31 and a plurality of second internal electrodes 32. The first internal electrodes 31 are internal electrodes exposed at the first end face 7. The second internal electrodes 32 are internal electrodes exposed at the second end face 8. Figure 3 shows the first internal electrodes 31.

[0021] The first internal electrode 31 has a first opposing portion 33 and a first lead portion 35. The first opposing portion 33 is a portion of the first internal electrode 31 that faces the second internal electrode 32. The first lead portion 35 is a portion of the first internal electrode 31 that is led from the first opposing portion 33 to the first end face 7. The second internal electrode 32 has a second opposing portion 34 and a second lead portion 36. The second opposing portion 34 is a portion of the second internal electrode 32 that faces the first internal electrode 31. The second lead portion 36 is a portion of the second internal electrode 32 that is led from the second opposing portion 34 to the second end face 8.

[0022] When the internal electrodes are viewed in a cross section parallel to the length direction L and width direction W of the laminate 2, the portions located at the corners of the external shape of the internal electrodes are called corner portions.

[0023] The shape of the first facing portion 33 is not particularly limited. A preferred shape of the first facing portion 33 is a rectangle. The corners of the first facing portion 33 may be rounded, or the corners of the first facing portion 33 may be tapered obliquely. The shape of the first facing portion 33 may be tapered, with an inclination increasing in either direction in the length direction L.

[0024] The shape of the second facing portion 34 is not particularly limited. A preferred shape of the second facing portion 34 is a rectangular shape. The corners of the second facing portion 34 may be rounded, or the corners of the second facing portion 34 may be tapered and obliquely formed. The shape of the second facing portion 34 may be tapered, with an inclination increasing in either direction in the length direction L.

[0025] The shape of the first lead portion 35 is not particularly limited. A preferred shape of the first lead portion 35 is a rectangle. The corners of the first lead portion 35 may be rounded or may be tapered and obliquely formed. The shape of the first lead portion 35 may be tapered, with an inclination increasing in either direction in the length direction L.

[0026] The shape of the second lead portion 36 is not particularly limited. A preferred shape of the second lead portion 36 is a rectangular shape. The corners of the second lead portion 36 may be rounded or may be tapered and obliquely formed. The shape of the second lead portion 36 may be tapered, with an inclination increasing in either direction in the length direction L.

[0027] The width in the width direction W of the first opposing portion 33 may be the same as or different from the width in the width direction W of the first lead portion 35. The width in the width direction W of the second opposing portion 34 may be the same as or different from the width in the width direction W of the second lead portion 36.

[0028] The first internal electrode 31 and the second internal electrode 32 may be made of an appropriate conductive material, for example, a metal such as Ni, Cu, Ag, Pd, Au, or Sn, or an alloy containing at least one of these metals, such as an Ag-Pd alloy.

[0029] The preferred thickness of each of the first internal electrode 31 and the second internal electrode 32 is, for example, about 0.2 μm or more and 2.0 μm or less.

[0030] A preferred total number of the first internal electrodes 31 and the second internal electrodes 32 is 20 or more and 2000 or less.

[0031] (Outer Layer Portion and Inner Layer Portion) The division of the laminate 2 in the stacking direction T will be described. As shown in Figures 2 and 4, the laminate 2 is divided into an inner layer portion 10 and an outer layer portion in the stacking direction T. The outer layer portion includes a first outer layer portion 11 and a second outer layer portion 12.

[0032] The inner layer portion 10 is a portion of the laminate 2 in the stacking direction T between the position of the internal electrode closest to the first main surface 3 and the position of the internal electrode closest to the second main surface 4 .

[0033] The first outer layer portion 11 is a portion of the laminate 2 between the first main surface 3 and the position of the internal electrode closest to the first main surface 3 in the stacking direction T. In other words, the first outer layer portion 11 is a portion of the laminate 2 between the inner layer portion 10 and the first main surface 3.

[0034] The second outer layer portion 12 is a portion of the laminate 2 between the second main surface 4 and the position of the internal electrode closest to the second main surface 4 in the stacking direction T. In other words, the second outer layer portion 12 is a portion of the laminate 2 between the inner layer portion 10 and the second main surface 4.

[0035] (Core portion and side gap portion) The division of the laminate 2 in the width direction W will be described. As shown in Figures 3 and 4, the laminate 2 is divided into a core portion 25 and a side gap portion in the width direction W. The side gap portion includes a first side gap portion 15 and a second side gap portion 16.

[0036] The core portion 25 is a portion of the laminate 2 in the width direction W where an internal electrode is provided. The first side gap portion 15 is a portion of the laminate 2 between the core portion 25 and the first side surface 5 in the width direction W. The second side gap portion 16 is a portion of the laminate 2 between the core portion 25 and the second side surface 6 in the width direction W. No internal electrode is provided in the side gap portion. Only the dielectric layer 20 is provided in the side gap portion. The side gap portion is also called a W gap.

[0037] (Valid Portion and Invalid Portion) The division of the core portion 25 in the stacking direction T will be described. As shown in Fig. 4, the core portion 25 is divided into a valid portion 26 and an invalid portion in the stacking direction T. The invalid portion includes a first invalid portion 28 and a second invalid portion 29.

[0038] The effective portion 26 is the portion of the core portion 25 in which the first internal electrode 31 or the second internal electrode 32 is arranged in the stacking direction T. The first ineffective portion 28 is the portion of the core portion 25 between the effective portion 26 and the first main surface 3 in the stacking direction T. The second ineffective portion 29 is the portion of the core portion 25 between the effective portion 26 and the second main surface 4 in the stacking direction T. No internal electrodes are provided in the ineffective portion. Only the dielectric layer 20 is provided in the ineffective portion.

[0039] (Electrode opposing portion) In the core portion 25, the portion where the first internal electrode 31 and the second internal electrode 32 overlap is called the electrode opposing portion 38. In the electrode opposing portion 38, the first opposing portion 33 and the second opposing portion 34 overlap. In the multilayer ceramic capacitor 1, capacitance is formed when the opposing portions of the internal electrodes face each other with the dielectric layer 20 interposed therebetween, thereby exhibiting the characteristics of the capacitor. In other words, capacitance is formed in the electrode opposing portion 38.

[0040] (L Gaps) In the core portion 25, the portion between the electrode opposing portion 38 and the end face is called the L gap. The lead portions of the internal electrodes are arranged in the L gaps. As shown in FIGS. 2 and 3 , the L gaps include a first L gap 18 and a second L gap 19. The first L gap 18 is the portion between the electrode opposing portion 38 and the first end face 7. The first lead portion 35 is arranged in the first L gap 18. The second L gap 19 is the portion between the electrode opposing portion 38 and the second end face 8. The second lead portion 36 is arranged in the second L gap 19.

[0041] (External Electrodes) The external electrodes include a first external electrode 41 and a second external electrode 42. The first external electrode 41 is connected to the first internal electrode 31 and is disposed on the first end face 7. The first external electrode 41 may also be disposed on a portion of the first main surface 3 and a portion of the second main surface 4, as well as a portion of the first side surface 5 and a portion of the second side surface 6. In this embodiment, the first external electrode 41 is disposed from the first end face 7 to a portion of the first main surface 3 and a portion of the second main surface 4, as well as a portion of the first side surface 5 and a portion of the second side surface 6.

[0042] The second external electrode 42 is connected to the second internal electrode 32 and is disposed on the second end face 8. The second external electrode 42 may also be disposed on a portion of the first main surface 3 and a portion of the second main surface 4, as well as a portion of the first side surface 5 and a portion of the second side surface 6. In this embodiment, the second external electrode 42 is disposed from the second end face 8 to a portion of the first main surface 3 and a portion of the second main surface 4, as well as a portion of the first side surface 5 and a portion of the second side surface 6.

[0043] The external electrodes include an underlying electrode layer and a plating layer.

[0044] (Base electrode layer) The base electrode layer will be described with reference to Fig. 2. The base electrode layer includes a first base electrode layer 51 and a second base electrode layer 52. The first base electrode layer 51 is a base electrode layer included in the first external electrode 41. The second base electrode layer 52 is a base electrode layer included in the second external electrode 42.

[0045] The base electrode layer includes at least one selected from a baked layer, a conductive resin layer, a thin film layer, etc. When the base electrode layer is a baked layer, the baked layer includes a glass component and a metal. The glass component includes at least one element selected from, for example, B, Si, Ba, Mg, Al, and Li. The metal includes at least one element selected from, for example, Cu, Ni, Ag, Pd, an Ag-Pd alloy, and Au.

[0046] The baking layer may be formed in multiple layers. The baking layer is formed by applying a conductive paste containing a glass component and a metal to the laminate and baking it. The baking layer may be simultaneously baked with the internal electrodes and the dielectric layers. Alternatively, the baking layer may be baked after the internal electrodes have been baked. When the baking layer is simultaneously baked with the internal electrodes and the dielectric layers, it is preferable to form the baking layer by adding a dielectric material instead of the glass component.

[0047] The thickness in the length direction L at the center position in the stacking direction T of the baked layer located on the first end face 7 and the second end face 8 is preferably, for example, about 3 μm or more and 160 μm or less.

[0048] When a baked layer is provided as a base electrode layer on a portion of the first main surface 3 and a portion of the second main surface 4, and also on a portion of the first side surface 5 and a portion of the second side surface 6, it is preferable that the thickness in the stacking direction T or the width direction W at the center in the length direction L of the base electrode layer located on the first main surface 3 and the second main surface 4, and the first side surface 5 and the second side surface 6 is, for example, approximately 3 μm or more and 40 μm or less.

[0049] (Plating Layer) The plating layer will be described. The plating layer includes a first plating layer and a second plating layer. The first plating layer is disposed so as to cover the first base electrode layer 51. The second plating layer is disposed so as to cover the second base electrode layer 52.

[0050] The material constituting the plating layer includes, for example, at least one selected from Cu, Ni, Sn, Ag, Pd, an Ag—Pd alloy, and Au.

[0051] The plating layer may be formed of multiple layers. In this embodiment, the first plating layer and the second plating layer each include two plating layers. When the plating layer has a two-layer structure, preferably, one plating layer is a Ni plating layer and the other plating layer is a Sn plating layer. The Ni plating layer included in the first plating layer is referred to as a first Ni plating layer 63. The Ni plating layer included in the second plating layer is referred to as a second Ni plating layer 64. The Sn plating layer included in the second plating layer is referred to as a first Sn plating layer 65. The Sn plating layer included in the second plating layer is referred to as a second Sn plating layer 66.

[0052] The Ni plating layer can prevent the base electrode layer from being eroded by solder when mounting the ceramic electronic component. The Sn plating layer improves the wettability of the solder when mounting the ceramic electronic component, allowing for easier mounting. The plating layers are preferably Ni plating layer and Sn plating layer, in that order, from the plating layer in contact with the base electrode layer. The plating layers may be three or more layers. The plating layers may be mainly composed of metal species other than Ni and Sn.

[0053] The preferred thickness of each plating layer is 2 μm or more and 15 μm or less.

[0054] (When no base electrode layer is provided) External electrodes may be formed using only plating layers without providing a base electrode layer. A structure in which only plating layers are provided without providing a base electrode layer will be described. No base electrode layer is provided on the first external electrode or the second external electrode, and the plating layer is formed directly on the surface of the laminate. The multilayer ceramic capacitor includes a plating layer that is directly and electrically connected to the first internal electrode or the second internal electrode. When the external electrodes have such a structure, a catalyst may be disposed on the surface of the laminate as a pretreatment for plating, and then the plating layer may be formed.

[0055] In this case, the plating layer preferably includes a lower-layer plating electrode formed on the surface of the laminate and an upper-layer plating electrode formed on the surface of the lower-layer plating electrode. The lower-layer plating electrode and the upper-layer plating electrode preferably include at least one metal selected from Cu, Ni, Sn, Pb, Au, Ag, Pd, Bi, and Zn, or an alloy containing such a metal. The lower-layer plating electrode is preferably formed using Ni, which has solder barrier properties. The upper-layer plating electrode is preferably formed using Sn or Au, which have good solder wettability.

[0056] When the first internal electrode and the second internal electrode are formed using Ni, it is preferable that the lower-layer plated electrode be formed using Cu, which has good bonding properties with Ni. The upper-layer plated electrode may be formed as needed. The first external electrode and the second external electrode may be composed of only the lower-layer plated electrode. The upper-layer plated electrode may be the outermost layer of the plated layer, or other plated electrodes may be formed on the surface of the upper-layer plated electrode.

[0057] The thickness of each plating layer disposed without a base electrode layer is preferably 1 μm or more and 15 μm or less. The plating layer preferably does not contain glass. The metal content per unit volume of the plating layer is preferably 99% by volume or more.

[0058] (Size of Multilayer Ceramic Capacitor) When the size of the multilayer ceramic capacitor 1 including the laminate 2 and the external electrodes is expressed as "length in the longitudinal direction (L) × length in the width direction (W) × length in the stacking direction (T)", it is generally expected to be, for example, "1.6 mm × 0.8 mm × 0.8 mm", "1.0 mm × 0.5 mm × 0.5 mm", "0.6 mm × 0.3 mm × 0.3 mm", "0.4 mm × 0.2 mm × 0.2 mm", or "0.2 mm × 0.1 mm × 0.1 mm". However, the size of the multilayer ceramic capacitor 1 is not limited to the above sizes.

[0059] The thickness of the first outer layer portion 11 and the thickness of the second outer layer portion 12 can be set to, for example, 10 μm or more and 80 μm or less.

[0060] (Arrow Section) The arrow section will be described with reference to FIGS. 2 and 5. FIG. 5 is an enlarged view of the boxed area 330 in FIG. 1. The internal electrodes of the multilayer ceramic capacitor 1 of this embodiment have an arrow section. The arrow section refers to a portion of the internal electrode that has a mountain-like (arc-shaped) shape when viewed at 2000 times in a cross section parallel to the length direction L and stacking direction T of the laminate 2. The arrow section refers to a shape that has an inclined region leading to the peak and an inclined region returning from the peak.

[0061] As shown in Fig. 2, the convex portion includes a first convex portion 201 and a second convex portion 202. The first convex portion 201 is the convex portion disposed on the first internal electrode 31. The second convex portion 202 is the convex portion disposed on the second internal electrode 32. The convex portions will be described below mainly using the first convex portion 201 as an example. The description of the first convex portion 201 also applies to the second convex portion 202.

[0062] (Inclined Region) The shape of the convex portion will be described with reference to Fig. 5. Line 220 shown in Fig. 5 is a line parallel to the tangent to the first main surface 3 at the center in the longitudinal direction L of the laminate 2. Line 220 is called the reference line 220. A portion of the internal electrode having an inclination angle 231 of more than 8 degrees with respect to the reference line 220 is defined as an inclined region leading to the peak or an inclined region returning from the peak.

[0063] The terms "to" and "return" in the inclined region leading to the peak and the inclined region returning from the peak are based on the assumption that the internal electrodes are traced in a direction from the center of the length direction L of the laminate 2 toward the end face of the laminate 2. The center of the length direction L of the laminate 2 is indicated by a line 503 in FIG. 2. The line 503 is referred to as a longitudinal center line 503.

[0064] (First Inclined Region and Second Inclined Region) The inclined region leading to the peak is called the first inclined region 211. The inclined region returning from the peak is called the second inclined region 212.

[0065] (Flat Region) The convex portion has at least a partial flat region 213. The flat region is a region of the convex portion where the acute angle with the reference line 220 is 5 degrees or less. In the flat region, the internal electrode is flat. In the example shown in FIG. 5 , the acute angle between the flat region 213 and the reference line 220 is 0 degrees.

[0066] 5, the flat region 213 is the top of the convex portion. The convex portion includes a first inclined region 211, a flat region 213, and a second inclined region 212 in this order.

[0067] (Arrangement of the convex portion) The arrangement of the convex portion will be described. At least a part of the convex portion is arranged on at least a part of the facing portion of the internal electrode. Also, at least a part of the convex portion is arranged on at least a part of the lead-out portion of the internal electrode. The first convex portion 201 will be used as an example for the description.

[0068] 2, at least a portion of the first convex portion 201 is disposed in at least a portion of the first opposing portion 33. In the example shown in FIG. 1, the first inclined region 211 and the flat region 213 of the first convex portion 201 are disposed in the first opposing portion 33.

[0069] Furthermore, at least a portion of the first convex portion 201 is disposed in at least a portion of the first lead-out portion 35. In the example shown in FIG. 1 , the second inclined region 212 of the first convex portion 201 is disposed in the first lead-out portion 35.

[0070] It should be noted that there are no particular limitations on which part of the convex portion is disposed in the facing portion and which part is disposed in the lead-out portion. For example, the entire convex portion may be disposed in the facing portion.

[0071] (Lead-out portion side end) The end of the opposing portion on the lead-out portion side is called the lead-out portion side end. The end of the first opposing portion 33 on the first lead-out portion 35 side is called the first lead-out portion side end 151. The end of the second opposing portion 34 on the second lead-out portion 36 side is called the second lead-out portion side end 152.

[0072] At least a portion of the first convex portion 201 is disposed at the first draw-out portion side end 151. Disposed at the first draw-out portion side end 151 means that at least a portion of the first convex portion 201 is in contact with the first draw-out portion side end 151, and that at least a portion of the first convex portion 201 is positioned across the first draw-out portion side end 151. Similarly, at least a portion of the second convex portion 202 is disposed at the second draw-out portion side end 152.

[0073] In the example shown in FIG. 2 , the boundary between the flat region 213 of the first convex portion 201 and the second inclined region 212 is located at the first lead-out portion side end 151 .

[0074] In the multilayer ceramic capacitor 1 of this embodiment, flat regions 213 are arranged in the convex portions of the internal electrodes. This improves the compaction between the internal electrodes and the dielectric layers 20, and prevents peeling between the internal electrodes and the dielectric layers 20. This is because the flat regions 213 included in the convex portions allow the internal electrodes and the dielectric layers 20 to be firmly attached to each other. In other words, when the internal electrodes and the dielectric layers 20 are pressed together so as to create the flat regions 213 in the convex portions, the compaction between the convex portions and the dielectric layers 20 is improved, and peeling can be prevented.

[0075] In the multilayer ceramic capacitor 1 of this embodiment, the convex portions are arranged at the drawn-out portion side ends of the opposing portions. Specifically, the first convex portion 201 is arranged at the first drawn-out portion side end 151 of the first opposing portion 33. The second convex portion 202 is arranged at the second drawn-out portion side end 152 of the second opposing portion 34.

[0076] Peeling is likely to occur near the ends of the opposing portions of the internal electrodes in the length direction L. In the multilayer ceramic capacitor 1 of this embodiment, convex portions are arranged at the first lead portion side end 151 and the second lead portion side end 152. This makes it possible to more reliably prevent peeling from occurring near the ends of the opposing portions of the internal electrodes in the length direction L.

[0077] (Direction of Convexity) The arched portion has a shape that is convex toward the outer layer portion in a cross section parallel to the length direction L and the stacking direction T.

[0078] In FIG. 2 , the two first convex portions 201 arranged at the first lead-out portion side end 151 are depicted as first convex portion 2011 and first convex portion 2012. Line 502 in FIG. 2 indicates the center of the laminate 2 in the stacking direction T. Line 502 is referred to as the stacking direction center line 502. The first convex portion 2011 and the first convex portion 2012 are located between the stacking direction center line 502 and the first main surface 3 in the stacking direction T. Both the first convex portion 2011 and the first convex portion 2012 are convex toward the second outer layer portion 12. In this way, the convex portions have a shape that is convex toward the closer of the two outer layer portions, i.e., the first outer layer portion 11 and the second outer layer portion 12, in a cross section parallel to the length direction L and the stacking direction T.

[0079] (Height of the convexity) The height of the convex portion in the stacking direction T increases as the convex portion is disposed in the internal electrode closer to the outer layer portion. In FIG. 2, the height of the first convex portion 2011 in the stacking direction T is indicated by height 2111. The height of the first convex portion 2012 in the stacking direction T is indicated by height 2112. Height 2112 is greater than height 2111. In this way, in the multilayer ceramic capacitor 1 of this embodiment, the height of the convex portion increases as the convex portion is disposed in the internal electrode closer to the outer layer portion. In other words, the height of the convex portion increases as it moves away from the center in the stacking direction.

[0080] In the present invention, by arranging the convex portion as described above, even if the internal electrode has a curved shape, the convex portion has high compaction properties, and peeling between the internal electrode and the dielectric layer 20 at the convex portion can be suppressed.

[0081] (Convex Portion of Laminate) The length of the laminate 2 in the stacking direction T will be described with reference to Fig. 2. A lengthwise end convex portion 401 is formed on each main surface of the laminate 2. The lengthwise end convex portion 401 is formed at a position corresponding to the position of the arch portion in the lengthwise direction L. In other words, the lengthwise end convex portion 401 is formed on an extension of the arch portion in the stacking direction T.

[0082] The shape of the longitudinal end convex portion 401 in a cross section parallel to the longitudinal direction L and the stacking direction T is substantially trapezoidal.

[0083] (Height of laminate) Length 513 shown in Fig. 2 indicates the length in the stacking direction T at the center in the length direction L of laminate 2. Length 515 shown in Fig. 2 indicates the length in the stacking direction T of laminate 2 at the center position in the length direction L of length direction end convex portion 401. Length 515 is longer than length 513. This is because the thickness of dielectric layer 20 is thicker in the vicinity of the end on the lead-out portion side of the opposing portion.

[0084] 2 , for the exposed positions of the internal electrodes drawn out to the first end face 7, the distance between adjacent internal electrodes in the stacking direction T is indicated by length 522. Furthermore, the distance between adjacent internal electrodes in the stacking direction T at the center of the longitudinal direction L of the laminate 2 is indicated by length 521. The length 522 is more than twice the length 521. In other words, when the distance in the stacking direction T between the first internal electrode 31 and the second internal electrode 32 at the center of the longitudinal direction L of the laminate 2 is T1, and the distance in the stacking direction T between adjacent first drawn-out portions 35 at the first end face 7 is T2, the relationship between T1 and T2 satisfies T2 > 2 × T1. This is because the thickness of the dielectric layer 20 is thicker near the end of the drawn-out portion of the opposing portion. Furthermore, with this configuration, the step between the electrode facing portion 38 and the first L gap 18 and the step between the electrode facing portion 38 and the second L gap 19 can be eliminated, thereby suppressing the occurrence of structural defects.

[0085] (Position of Flat Region) The arrangement of the flat region 213 will be described. The flat region 213 of the convex portion is preferably arranged in the opposing portion. The flat region 213 included in the first convex portion 201 is referred to as the first flat region 2131. The flat region 213 included in the second convex portion 202 is referred to as the second flat region 2132. The first flat region 2131 is preferably arranged in the first opposing portion 33. The second flat region 2132 is preferably arranged in the second opposing portion 34. This can further suppress peeling between the internal electrode and the dielectric layer 20, particularly near the first lead portion side end 151 and the second lead portion side end 152.

[0086] (Bent Portion) The bent portion will be described with reference to Fig. 2. The bent portion is a portion that includes only the first inclined region 211 leading to the peak and the flat region 213 serving as the peak, but does not include the second inclined region 212 returning from the peak. The bent portion differs from the convex portion in that it does not include the inclined region returning from the peak, i.e., the second inclined region 212.

[0087] That is, the convex portion includes, in order, a first inclined region 211 leading to the peak, a flat region 213 as the peak, and a second inclined region 212 returning from the peak. In contrast, the bent portion includes only the first inclined region 211 leading to the peak and the flat region 213 as the peak, but does not include the second inclined region 212 returning from the peak. The meanings of the inclined region and flat region are the same as those of the convex portion described above.

[0088] 2 , the bent portion includes a first bent portion 301 and a second bent portion 302. The first bent portion 301 is a bent portion included in the first internal electrode 31. The second bent portion 302 is a bent portion included in the second internal electrode 32.

[0089] (Arrangement of bent portions) As shown in Fig. 2, the first bent portion 301 is arranged at the end of the first opposing portion 33 on the second end face 8 side. The second bent portion 302 is arranged at the end of the second opposing portion 34 on the first end face 7 side. The flat region of the first bent portion 301 is called the third flat region 2133. The flat region of the second bent portion 302 is called the fourth flat region 2134. The third flat region 2133 and the fourth flat region 2134 are both arranged in the opposing portions of the internal electrodes.

[0090] By arranging the bent portion at the end in the length direction L of the electrode facing portion 38 where peeling between the internal electrode and the dielectric layer 20 is likely to occur, the occurrence of peeling can be more reliably suppressed.

[0091] (Length of Flat Region) The length of the flat region 213 in the longitudinal direction L will be described. In FIG. 5, the length of the flat region 213 in the longitudinal direction L is shown as length 530. Length 530 is preferably 15 μm or more and 85 μm or less. FIG. 5 shows the first flat region 2131, which is the flat region 213 of the first convex portion 201. The preferred lengths of the flat regions 213 are 15 μm or more and 85 μm or less for the second flat region 2132 of the second convex portion 202, the third flat region 2133 of the first bend portion 301, and the fourth flat region 2134 of the second bend portion 302, similarly to the first flat region 2131.

[0092] (Method for measuring the length of the flat region) The length in the longitudinal direction of the flat region is measured as follows. (1) The surfaces of the multilayer ceramic capacitor 1 parallel to the longitudinal direction L and the stacking direction T are polished to expose a cross section parallel to the longitudinal direction L and the stacking direction T at the center of the width direction W. (2) An image is taken of the vicinity of the convex portion of the internal electrode at 2000x magnification. (3) In the internal electrode closest to the outer layer portion, the length in the longitudinal direction of the flat region of the convex portion is measured. As described above, the measurement is performed by determining the portion of the convex portion where the angle between the tangent to the internal electrode and the tangent to the first main surface 3 at the center in the longitudinal direction L (reference line 220) is 5 degrees or less as the flat region, and measuring the length in the longitudinal direction L of the flat region.

[0093] (Width Direction Ends of Internal Electrodes) The width direction W end portions of the internal electrodes in the multilayer ceramic capacitor 1 of this embodiment will be described with reference to Fig. 6. Fig. 6 is a cross-sectional view taken along line 104-104 in Fig. 1.

[0094] 6, the first internal electrode 31 has a third bent portion 303 at each end in the width direction W. Similarly, the second internal electrode 32 has a fourth bent portion 304 at each end in the width direction W.

[0095] The shapes of the third bent portion 303 and the fourth bent portion 304 in a cross section parallel to the width direction W and the stacking direction T are similar to those of the first bent portion 301 and the second bent portion 302 described above. The third bent portion 303 and the fourth bent portion 304 each include a first inclined region 211 leading to an apex and a flat region 213 serving as an apex. The meanings of the first inclined region 211 and the flat region 213 here are similar to those of the first inclined region 211 and the flat region 213 in the first bent portion and the second bent portion described above. However, the reference lines used to define the inclined region and the flat region are different.

[0096] In the first bent portion and the second bent portion, similarly to the arch portion, the reference line 220 is a line parallel to the tangent to the first main surface 3 at the center in the length direction L of the laminate 2 in a cross section parallel to the length direction L and the stacking direction T. In contrast, the reference line 222 in the third bent portion 303 and the fourth bent portion 304 is a line parallel to the tangent to the first main surface 3 at the center in the width direction W of the laminate 2 in a cross section parallel to the width direction W and the stacking direction T.

[0097] (Flat Region) The third bent portion 303 and the fourth bent portion 304 each have a flat region 213. The flat region 213 of the third bent portion 303 is referred to as a fifth flat region 2135. The flat region 213 of the fourth bent portion 304 is referred to as a sixth flat region 2136. The third bent portion 303 has the fifth flat region 2135 in at least a portion thereof. The fourth bent portion 304 has the sixth flat region 2136 in at least a portion thereof. The fifth flat region 2135 and the sixth flat region 2136 are both flat regions.

[0098] (Length of Flat Region) Length 601 in Fig. 6 indicates the length in the width direction W of the fifth flat region 2135. Length 602 in Fig. 6 indicates the length in the width direction W of the sixth flat region 2136. The lengths 601 and 602 are preferably 15 µm or more and 85 µm or less. This improves the adhesion between the internal electrode and the dielectric layer 20. In other words, the presence of the flat region makes the end portions of the internal electrodes in the width direction W compact, making it less likely for peeling to occur at the end portions of the internal electrodes in the width direction W.

[0099] (Bending Direction of Bent Portions) The third bent portion 303 and the fourth bent portion 304 have a shape that spreads out on both sides in the stacking direction T. A shape that spreads out on both sides refers to a shape in which the first inclined region 211 is inclined toward the main surface, not toward the stacking direction center line 502. More specifically, the first inclined region 211 located between the stacking direction center line 502 and the first main surface 3 is inclined toward the first main surface 3. On the other hand, the first inclined region 211 located between the stacking direction center line 502 and the second main surface 4 is inclined toward the second main surface 4.

[0100] The bent portions are shaped to extend on both sides in the stacking direction T, which increases the thickness of the dielectric layer 20 at the ends of the internal electrodes in the width direction W. This reduces defects such as short circuits at the ends of the internal electrodes in the width direction W.

[0101] (Height of Bent Portion) The height of each bent portion in the stacking direction T can be set to increase as it approaches the main surface from the stacking direction center line 502. In Figure 6, for the fourth bent portion 304 located between the stacking direction center line 502 and the second main surface 4, the fourth bent portion 304 closest to the stacking direction center line 502 is shown as bent portion 3041, and the fourth bent portion 304 closest to the second main surface 4 is shown as bent portion 3042. The height of bent portion 3041 in the stacking direction T is shown as height 611. The height of bent portion 3042 in the stacking direction T is shown as height 612. Height 612 is greater than height 611.

[0102] The same can be done for the height of the third bent portion. Alternatively, the third bent portion and the fourth bent portion may not be distinguished, and the height of each bent portion may increase as it approaches each main surface from the stacking direction center line 502.

[0103] By setting the height of the bent portion as described above, the occurrence of short circuits can be further suppressed.

[0104] (Convex Portions of Laminate) The length of the laminate 2 in the stacking direction T will be described with reference to Fig. 6. Width direction end convex portions 402 are formed on each main surface of the laminate 2. The width direction end convex portions 402 are formed at positions corresponding to the positions of the bent portions in the width direction W. In other words, the width direction end convex portions 402 are formed on extensions of the bent portions in the stacking direction T.

[0105] The shape of the width direction end convex portion 402 in a cross section parallel to the width direction W and the stacking direction T is substantially trapezoidal.

[0106] (Height of Laminate) A length 621 shown in Fig. 6 indicates the length in the stacking direction T at the center in the width direction W of the laminate 2. A length 622 shown in Fig. 6 indicates the length in the stacking direction T of the laminate 2 at the center position in the width direction W of the width direction end convex portion 402. A length 6225 is longer than the length 621. This is because the thickness of the dielectric layer 20 is thicker near the end of the internal electrode in the width direction W.

[0107] 1 , the center of each main surface in the length direction L and the center of each main surface in the width direction W are surrounded by the width direction end convex portions 402 and the length direction end convex portions 401. In other words, the width direction end convex portions 402 and the length direction end convex portions 401 are positioned so as to surround the center of each main surface in the length direction L and the center of each main surface in the width direction W.

[0108] (Method for Manufacturing Multilayer Ceramic Capacitor) A method for manufacturing the multilayer ceramic capacitor 1 will be described. Note that the method for manufacturing the multilayer ceramic capacitor 1 is not limited to the method described below.

[0109] A dielectric sheet and a conductive paste for the internal electrodes are prepared. The dielectric sheet and the conductive paste for the internal electrodes contain a binder and a solvent. Known binders and solvents can be used. The dielectric sheet is also called a ceramic green sheet. The conductive paste is also called a paste for the internal electrodes.

[0110] A dielectric sheet on which an internal electrode pattern is formed is prepared, and a conductive paste for the internal electrodes is printed in a predetermined pattern on the dielectric sheet by, for example, screen printing or gravure printing, to form a dielectric sheet on which a pattern of a first internal electrode is formed and a dielectric sheet on which a pattern of a second internal electrode is formed.

[0111] A predetermined number of dielectric sheets not printed with an internal electrode pattern are stacked to form a portion that will become a first outer layer portion, on which dielectric sheets printed with a first internal electrode pattern and a second internal electrode pattern are stacked in order to form a portion that will become an inner layer portion, and further a predetermined number of dielectric sheets not printed with an internal electrode pattern are stacked on top of the portion that will become an inner layer portion to form a portion that will become a second outer layer portion, thereby producing a laminated sheet.

[0112] (Step Compensation Paste) In the multilayer ceramic capacitor 1 of this embodiment, the step compensation paste is applied to the ceramic green sheets on which the internal electrode paste has been printed. That is, the manufacturing process includes a step compensation paste application step. The step compensation paste application step is a step that follows the internal electrode paste printing step.

[0113] The order of printing the internal electrode paste and applying the step compensation paste is not particularly limited. In the above example, the case of printing the internal electrode paste and then applying the step compensation paste has been described. However, instead of printing the internal electrode paste and then applying the step compensation paste, the order of applying the step compensation paste and then printing the internal electrode paste may be changed.

[0114] A specific description will be given with reference to FIG. 7 . FIG. 7 is a diagram showing a state in which an internal electrode paste 1001, an internal electrode paste 1002, and a step compensation paste 1003 are printed or applied to a ceramic green sheet 1000. As shown in FIG. 7 , the step compensation paste 1003 and the internal electrode paste partially overlap each other on the ceramic green sheet 1000. The thickness of the step compensation paste 1003 is greater than the thickness of the internal electrode paste. The material of the internal electrode paste 1001 and the material of the internal electrode paste 1002 are the same material. The internal electrode paste 1001 is printed in a pattern corresponding to the first internal electrode. The internal electrode paste 1002 is printed in a pattern corresponding to the second internal electrode.

[0115] 7, the printing of the internal electrode paste 1001 and the application of the step compensation paste 1003 are performed so that they partially overlap each other. Similarly, the printing of the internal electrode paste 1002 and the application of the step compensation paste 1003 are performed so that they partially overlap each other.

[0116] When viewed in a plan view along the lamination direction T, there are portions where the internal electrode paste 1001 and the step compensation paste 1003 overlap. Similarly, there are portions where the internal electrode paste 1002 and the step compensation paste 1003 overlap.

[0117] The overlap width between the internal electrode paste 1001 and the step compensation paste 1003 is indicated by width 1021. The overlap width between the internal electrode paste 1002 and the step compensation paste 1003 is also the same as width 1021. Width 1021 can be preferably set to 20 μm or more and 100 μm or less.

[0118] Furthermore, the step compensation paste 1003 is applied so as to be thicker than the internal electrode paste 1001. In Fig. 7, the thickness of the internal electrode paste 1001 is indicated by thickness 1010. The thickness of the internal electrode paste 1002 is the same as thickness 1010. The thickness of the step compensation paste 1003 is indicated by thickness 1011. Thickness 1011 is thicker than thickness 1010. Thickness 1011 is preferably 1.1 times or more and 1.3 times or less than thickness 1010. The thickness 1011 of the step compensation paste 1003 can be, for example, 0.75 µm or more and 0.95 µm or less.

[0119] The step compensation paste 1003 may have the same material composition as the dielectric layer paste that constitutes the ceramic green sheets, that is, the dielectric sheets, or may have a different material composition.

[0120] In this embodiment, it is possible to manufacture a desired multilayer ceramic capacitor by adjusting the thickness of the step compensation paste and the overlap width between the step compensation paste and the internal electrode paste.

[0121] The laminated sheets are pressed in the lamination direction by means of a hydrostatic press or the like to produce a laminated block.

[0122] The part of the element where the step compensation paste lies on the internal electrode becomes convex. This forms a convex portion on the surface of the laminate. Furthermore, the internal electrode located in the part where the step compensation paste lies on the internal electrode becomes a convex or bent portion.

[0123] When pressing, pressure is applied to flatten a portion of the convex portion of the element body, creating a flat region. Specifically, the portion corresponding to the convex or bent portion that will become the flat region is pressed more firmly. This improves the compaction between the internal electrode and the dielectric layer at the convex or bent portion, improving adhesion. As a result, peeling defects between the internal electrode and the dielectric layer can be suppressed.

[0124] The laminated block is cut into individual pieces to produce laminated chips. Specifically, the laminated block is cut into individual pieces using a cutting blade to produce pre-fired laminates.

[0125] The laminated chip is fired to produce a laminate. Before firing, the corners and ridges of the laminated chip may be rounded by barrel polishing or the like. The firing temperature is preferably 900°C or higher and 1400°C or lower, depending on the materials of the dielectric and internal electrodes. The above-mentioned barrel polishing or the like can also be performed on the laminated body after firing.

[0126] Next, the external electrodes are formed. First, a conductive paste that will become the base electrode layer is applied to both end surfaces of the laminate 2 to form the base electrode layer. When forming a baked layer as the base electrode layer, a conductive paste containing a glass component and a metal is applied by a method such as dipping, and then a baking process is performed to form the base electrode layer. The baking temperature at this time is preferably 700°C or higher and 900°C or lower.

[0127] Thereafter, a plating layer is formed on the surface of the base electrode layer. A Ni plating layer and a Sn plating layer are formed on the base electrode layer. The Ni plating layer and the Sn plating layer are formed sequentially by, for example, barrel plating. In this manner, a multilayer ceramic capacitor is obtained.

[0128] (Embodiment 2) The multilayer ceramic capacitor 1 of embodiment 2 will be described with reference to Figures 8 and 9. Figure 8 is a cross-sectional view of the multilayer ceramic capacitor 1 of embodiment 2 taken along line 101-101 in Figure 1. Figure 9 is a cross-sectional view of the multilayer ceramic capacitor 1 of embodiment 2 taken along line 104-104 in Figure 1. Below, the differences from embodiment 1 will be mainly described for embodiments other than embodiment 1.

[0129] The multilayer ceramic capacitor 1 of Embodiment 2 differs from the multilayer ceramic capacitor 1 of Embodiment 1 in that the laminate 2 does not have lengthwise end convex portions 401 and widthwise end convex portions 402. In Embodiment 1, as shown in FIGS. 2 and 6, lengthwise end convex portions 401 and widthwise end convex portions 402 are formed on each main surface. In contrast, in Embodiment 2, as shown in FIGS. 8 and 9, lengthwise end convex portions 401 and widthwise end convex portions 402 are not formed on each main surface. In other words, unlike Embodiment 1, no convex portions exist on the extension lines of the arched portions and bent portions in the stacking direction T. In this embodiment, the laminate 2 as a whole has a substantially rectangular parallelepiped shape.

[0130] As a result, in the multilayer ceramic capacitor 1 of this embodiment, the presence of flat regions in the convex and bent portions of the internal electrodes maintains the effect of suppressing peeling, while the absence of protrusions improves mountability.

[0131] The multilayer ceramic capacitor 1 of embodiment 2 can be manufactured, for example, by the following method. The process is the same as embodiment 1 up to the point where the multilayer chips are fired and a laminate is obtained. In embodiment 2, the fired laminate is polished to round the entire laminate, and convex portions formed by the step-compensating paste overlapping the internal electrodes are polished and removed. This allows the multilayer ceramic capacitor 1 shown in FIGS. 8 and 9 to be manufactured.

[0132] Third Embodiment The multilayer ceramic capacitor 1 of the third embodiment will be described with reference to Fig. 10. Fig. 10 is a cross-sectional view of the multilayer ceramic capacitor 1 of the third embodiment, taken along line 101-101 in Fig. 1.

[0133] The multilayer ceramic capacitor 1 of Embodiment 3 differs from the multilayer ceramic capacitor 1 of Embodiment 1 in that the first internal electrode 31 does not have the first bent portion 301 at the second lead-portion-side end 152. The multilayer ceramic capacitor 1 of Embodiment 3 also differs from the multilayer ceramic capacitor 1 of Embodiment 1 in that the second internal electrode 32 does not have the second convex portion 202 at the second lead-portion-side end 152.

[0134] The multilayer ceramic capacitor 1 of embodiment 3 can be manufactured by, for example, appropriately adjusting the overlapping and non-overlapping ranges of the step compensation paste and the internal electrode paste, the thickness of the step compensation paste, the overlapping width of the step compensation paste and the internal electrode paste, etc.

[0135] Fourth Embodiment The multilayer ceramic capacitor 1 of the fourth embodiment will be described with reference to Fig. 11. Fig. 11 is a cross-sectional view of the multilayer ceramic capacitor 1 of the fourth embodiment taken along line 101-101 in Fig. 1.

[0136] The multilayer ceramic capacitor 1 of Embodiment 4 differs from the multilayer ceramic capacitor 1 of Embodiment 3 in that the laminate 2 does not have lengthwise end convex portions 401 and widthwise end convex portions 402. In Embodiment 3, as shown in FIG. 10 , lengthwise end convex portions 401 were formed on each main surface. In Embodiment 3, widthwise end convex portions 402 similar to the widthwise end convex portions 402 shown in FIG. 6 in Embodiment 1 were formed on each main surface. In contrast, in Embodiment 4, as shown in FIG. 11 , lengthwise end convex portions 401 are not formed on each main surface. In Embodiment 4, as shown in FIG. 9 in Embodiment 2, widthwise end convex portions 402 are not formed on each main surface.

[0137] The multilayer ceramic capacitor 1 of embodiment 4 can be manufactured, for example, by the following method. The process is the same as embodiment 3 up to the point where the multilayer chips are fired and a laminate is obtained. In embodiment 4, the fired laminate is polished to round the entire laminate, and convex portions formed by the step-compensating paste overlapping the internal electrodes are polished and removed. This allows the multilayer ceramic capacitor 1 shown in FIGS. 11 and 9 to be manufactured.

[0138] As described above, by changing a part of the manufacturing process as shown in the third and fourth embodiments, it is possible to manufacture multilayer ceramic capacitors 1 having various configurations.

[0139] Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various changes, modifications, and combinations are possible.

[0140] <1> A laminate including a plurality of laminated dielectric layers and a plurality of internal electrodes, the laminate having first and second main surfaces facing each other in a stacking direction of the dielectric layers and the internal electrodes, first and second side surfaces facing each other in a width direction perpendicular to the stacking direction, and first and second end surfaces facing each other in a length direction perpendicular to the stacking direction and the width direction; and external electrodes connected to the internal electrodes and provided on a surface of the laminate, the internal electrodes having a first internal electrode extended to the first end surface and a second internal electrode extended to the second end surface, the first internal electrode having a first opposing portion facing the second internal electrode in the stacking direction, the second internal electrode having a second opposing portion facing the first internal electrode in the stacking direction, the first opposing portion having a first convex portion that is bent at least in a part thereof, and the second opposing portion having a second convex portion that is bent at least in a part thereof. a first convex portion having a first flat region that is a flat region at least in part thereof; a second convex portion having a second flat region that is a flat region at least in part thereof; a first internal electrode having a first lead portion that does not face the second internal electrode in the stacking direction; and at least a portion of the first convex portion being arranged at an end of the first opposing portion on the first lead portion side.

[0141] <2> The multilayer ceramic capacitor according to <1>, wherein the first opposing portion has a first bent portion arranged at an end portion on the second end face side, and the first bent portion has a third flat region that is a flat region in at least a part of the first bent portion.

[0142] <3> The multilayer ceramic capacitor according to <2>, wherein the length in the longitudinal direction of each of the first flat region and the third flat region is 15 μm or more and 85 μm or less.

[0143] <4> The multilayer ceramic capacitor according to any one of <1> to <3>, wherein the first internal electrodes have third bent portions arranged at the width direction ends, and the third bent portions have fifth flat regions that are flat regions in at least parts of the third bent portions.

[0144] <5> The multilayer ceramic capacitor according to <1>, wherein the second internal electrode has a second lead portion that does not face the first internal electrode in the stacking direction, and at least a part of the second convex portion is arranged at an end of the second opposing portion on the second lead portion side.

[0145] <6> The multilayer ceramic capacitor according to <2>, wherein the second opposing portion has a second bent portion disposed at an end portion on the first end face side, and the second bent portion has a fourth flat region that is a flat region in at least a part thereof.

[0146] <7> The multilayer ceramic capacitor according to <3>, wherein the length of each of the second flat region and the fourth flat region in the longitudinal direction is 15 μm or more and 85 μm or less.

[0147] <8> The multilayer ceramic capacitor according to <4>, wherein the second internal electrode has a fourth bent portion arranged at an end portion in the width direction, and the fourth bent portion has a sixth flat region that is a flat region in at least a part thereof.

[0148] <9> The multilayer ceramic capacitor according to any one of <1> to <8>, wherein, when a distance in the stacking direction between the first internal electrode and the second internal electrode at a center in the length direction of the laminate is T1, and a distance in the stacking direction between adjacent first lead portions on the first end face is T2, a relationship between T1 and T2 satisfies T2>2×T1.

[0149] REFERENCE SIGNS LIST 1 Multilayer ceramic capacitor 2 Laminate 3 First main surface 4 Second main surface 5 First side surface 6 Second side surface 7 First end surface 8 Second end surface 10 Inner layer portion 11 First outer layer portion 12 Second outer layer portion 15 First side gap portion 16 Second side gap portion 18 First L gap 19 Second L gap 20 Dielectric layer 25 Core portion 26 Effective portion 28 First ineffective portion 29 Second ineffective portion 31 First internal electrode 32 Second internal electrode 33 First opposing portion 34 Second opposing portion 35 First lead portion 36 Second lead portion 38 Electrode opposing portion 41 First external electrode 42 Second external electrode 51 First base electrode layer 52 Second base electrode layer 151 First lead portion side end portion 152 Second lead portion side end 201 First convex portion 202 Second convex portion 211 First inclined region 212 Second inclined region 213 Flat region 220 Reference line 222 Reference line 301 First bent portion 302 Second bent portion 303 Third bent portion 304 Fourth bent portion 330 Frame 401 Convex portion at end in length direction 402 Convex portion at end in width direction 502 Center line in stacking direction 503 Center line in length direction 1000 Ceramic green sheet 1001 Internal electrode paste 1002 Internal electrode paste 1003 Step compensation paste

Claims

1. A laminate including a plurality of laminated dielectric layers and a plurality of internal electrodes, the laminate having first and second main surfaces facing each other in a stacking direction of the dielectric layers and the internal electrodes, first and second side surfaces facing each other in a width direction perpendicular to the stacking direction, and first and second end surfaces facing each other in a length direction perpendicular to the stacking direction and the width direction; and external electrodes connected to the internal electrodes and provided on a surface of the laminate, the internal electrodes having a first internal electrode extended to the first end surface and a second internal electrode extended to the second end surface, the first internal electrode having a first opposing portion facing the second internal electrode in the stacking direction, the second internal electrode having a second opposing portion facing the first internal electrode in the stacking direction, the first opposing portion having a first convex portion that is bent in at least a portion, and the second opposing portion having a second convex portion that is bent in at least a portion. a first convex portion having a first flat region that is a flat region at least in part thereof; a second convex portion having a second flat region that is a flat region at least in part thereof; a first internal electrode having a first lead portion that does not face the second internal electrode in the stacking direction; and at least a portion of the first convex portion being arranged at an end of the first opposing portion on the first lead portion side.

2. The multilayer ceramic capacitor according to claim 1, wherein the first opposing portion has a first bent portion disposed at an end portion on the second end face side, and the first bent portion has a third flat region that is a flat region in at least a portion thereof.

3. The multilayer ceramic capacitor according to claim 2, wherein the length of each of the first flat region and the third flat region in the longitudinal direction is 15 μm or more and 85 μm or less.

4. The multilayer ceramic capacitor according to any one of claims 1 to 3, wherein the first internal electrode has a third bent portion disposed at an end in the width direction, and the third bent portion has a fifth flat region that is a flat region in at least a part of the third bent portion.

5. The multilayer ceramic capacitor according to claim 1, wherein the second internal electrode has a second lead portion that does not face the first internal electrode in the stacking direction, and at least a portion of the second convex portion is located at the end of the second opposing portion on the second lead portion side.

6. The multilayer ceramic capacitor according to claim 2, wherein the second opposing portion has a second bent portion disposed at an end portion on the first end face side, and the second bent portion has a fourth flat region that is a flat region in at least a portion thereof.

7. The multilayer ceramic capacitor according to claim 6, wherein the length of each of the second flat region and the fourth flat region in the longitudinal direction is 15 μm or more and 85 μm or less.

8. The multilayer ceramic capacitor according to claim 4, wherein the second internal electrode has a fourth bent portion disposed at an end portion in the width direction, and the fourth bent portion has a sixth flat region that is a flat region in at least a portion thereof.

9. A multilayer ceramic capacitor according to any one of claims 1 to 8, wherein, when T1 is the distance in the stacking direction between the first internal electrode and the second internal electrode at the center in the longitudinal direction of the laminate, and T2 is the distance in the stacking direction between adjacent first lead portions on the first end face, the relationship between T1 and T2 satisfies T2 > 2 × T1.

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