Electronic device comprising speaker

Abstract

According to an embodiment of the present disclosure, an electronic device may comprise: a housing which includes a bracket including a front surface and a rear surface opposite to the front surface, a first opening penetrating from the front surface to the rear surface, and a second opening penetrating from the front surface to the rear surface and spaced apart from the first opening; a display arranged on the front surface; a circuit board arranged on the rear surface; and a speaker arranged on the circuit board and aligned with the first opening, wherein an acoustic path is configured to output sound generated from the speaker to the outside of the electronic device, and a partial area of the acoustic path is defined by the bracket, the second opening, and at least a portion of the circuit board.

Description

Electronic devices containing speakers

[0001] Various embodiments disclosed in this document relate to electronic devices, for example, electronic devices including speakers.

[0002] Thanks to remarkable advancements in information and communication technology and semiconductor technology, the proliferation and use of various electronic devices is rapidly increasing. Electronic devices are being developed to enable portability and communication.

[0003] An electronic device can refer to any device that performs a specific function based on the program installed on it, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, or car navigation systems. For example, these electronic devices can output stored information as audio or video. As the integration of electronic devices increases and ultra-high-speed, high-capacity wireless communication becomes more widespread, a single electronic device, such as a mobile communication terminal, can be equipped with various functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions such as mobile banking, or functions such as schedule management and electronic wallets are being integrated into a single electronic device. These electronic devices are becoming smaller so that users can conveniently carry them.

[0004] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above-described matters constitute prior art related to the present disclosure.

[0005] According to one embodiment of the present disclosure, an electronic device includes a bracket including a front surface and a rear surface opposite to the front surface, a housing including a first opening extending from the front surface to the rear surface, and a second opening extending from the front surface to the rear surface and spaced apart from the first opening, a display disposed on the front surface, a circuit board disposed on the rear surface, and a speaker disposed on the circuit board and aligned with the first opening, wherein an acoustic path is configured to output sound generated from the speaker to the outside of the electronic device, and a partial region of the acoustic path may be formed by at least a portion of the bracket, the second opening, and the circuit board.

[0006] According to one embodiment of the present disclosure, an electronic device may include a housing including a front surface, a rear surface opposite the front surface, and a plurality of openings extending from the front surface to the rear surface, a display disposed on the front surface, a circuit board disposed on the rear surface, a speaker disposed on the circuit board, a first sealing member disposed between the circuit board and the rear surface, surrounding a first opening among the plurality of openings, the first sealing member including a sealing material, and a second sealing member disposed between the circuit board and the rear surface, surrounding a second opening among the plurality of openings, the second sealing member including a sealing material.

[0007] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0008] FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0009] FIG. 3 is a perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0010] FIG. 4 is an exploded perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0011] FIG. 5 is an exploded perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0012] FIG. 6 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0013] FIG. 7 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure, viewed from the opposite direction from FIG. 6.

[0014] FIG. 8 is a front view of an electronic device according to one embodiment of the present disclosure.

[0015] FIG. 9 is a rear view of an electronic device according to one embodiment of the present disclosure, viewed from the opposite direction to FIG. 8.

[0016] FIG. 10 is a cross-sectional view of an electronic device taken along line AA' of FIG. 2 according to one embodiment of the present disclosure.

[0017] FIG. 11 is a cross-sectional view of an electronic device taken along line BB' of FIG. 2 according to one embodiment of the present disclosure.

[0018] FIG. 12 is a drawing of a graph showing that the acoustic performance of sound generated from a speaker through a second opening is improved according to one embodiment of the present disclosure.

[0019] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0020] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0021] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0022] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0023] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0024] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0025] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0026] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0027] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0028] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0029] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0030] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0031] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0032] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0033] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0034] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0035] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0036] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0037] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0038] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0039] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0040] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0041] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0042] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0043] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0044] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0045] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0046] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0047] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0048] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0049] Hereinafter, for the convenience of explanation of FIGS. 2 to 11, an orthogonal coordinate system is illustrated in FIGS. 2 to 11, which is defined and interpreted as an X-axis, a Y-axis, and a Z-axis that are orthogonal to each other. Hereinafter, for the convenience of explanation, the X-axis direction may be defined and interpreted as a width direction of an electronic device or components of an electronic device, the Y-axis direction may be defined and interpreted as a length direction of an electronic device or components of an electronic device, and the Z-axis direction may be defined and interpreted as a height direction (or thickness direction) of an electronic device or components of an electronic device. The electronic device or components of an electronic device of the present disclosure are not limited by the above directions.

[0050] FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0051] FIG. 3 is a perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0052] The embodiments of FIGS. 2 and 3 may be combined with the embodiments of FIG. 1 or the embodiments of FIGS. 4 to 12.

[0053] Referring to FIGS. 2 and 3 , an electronic device (101) according to one embodiment (e.g., the electronic device (101) of FIG. 1 ) may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In one embodiment, the housing (210) may also refer to a structure that forms a portion of the first side (210A) of FIG. 2 , the second side (210B), and the side surface (210C) of FIG. 3 . In one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The rear plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side structure (or “side bezel structure”) (218) that is coupled to the front plate (202) and the rear plate (211) and comprises a metal and / or polymer. In one embodiment, the rear plate (211) and the side structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0054] Although not shown, the front plate (202) may include a seamlessly extending region(s) that curves toward the back plate (211) at least along a portion of an edge. In one embodiment, the front plate (202) (or the back plate (211)) may include only one of the curved extending regions toward the back plate (211) (or the front plate (202)) at one edge of the first surface (210A). Depending on the embodiment, the front plate (202) or the back plate (211) may be substantially flat. For example, the front plate (202) or the back plate (211) may not include a curved extending region. When the front plate (202) or the back plate (211) includes a curved extending region, the thickness of the electronic device (101) in the portion that includes the curved extending region may be smaller than that of the other portions.

[0055] According to one embodiment, the electronic device (101) may include at least one of a display (220), an audio module (203, 207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (216, 217), a light emitting element (206), and a connector hole (208, 209). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., the key input device (216, 217) or the light emitting element (206)) or may additionally include other components.

[0056] The display (220) may be visually exposed, for example, through a significant portion of the front plate (202). In one embodiment, at least a portion of the display (220) may be visually exposed through the front plate (202) forming the first surface (210A) or through a portion of a side surface (210C). In one embodiment, the edge of the display (220) may be formed to be substantially the same as the adjacent outer shape of the front plate (202). In one embodiment (not shown), the gap between the outer edge of the display (220) and the outer edge of the front plate (202) may be formed to be substantially the same in order to expand the area over which the display (220) is visually exposed.

[0057] In one embodiment, a recess or opening is formed in a portion of a screen display area of ​​the display (220), and the electronic device (101) may include at least one of an audio module (214), a sensor module (204), a camera module (205), and a light-emitting element (206) aligned with the recess or opening. In one embodiment, the display (220) may include at least one of an audio module (214), a sensor module (204), a camera module (205), a fingerprint sensor, and a light-emitting element (206) on a rear surface of the screen display area. In one embodiment, the display (220) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen.

[0058] In one embodiment, the camera module (205) may be configured to capture images of the front of the display (220) through a camera opening formed in the display (220) (e.g., the camera opening (305) of FIG. 10). The camera module (205) may be covered by the front plate (202). The camera module (205) may not be visually exposed through the display (220) and may include a hidden under-display camera (UDC). The under-display camera may be configured to capture images of external objects through the camera opening of the display (220).

[0059] The audio module (203, 207, 214) may include a microphone hole (203) and a speaker hole (207, 214). A microphone for acquiring external sound through the microphone hole (203) may be placed inside the housing (210), and in one embodiment, multiple microphones may be placed to detect the direction of the sound. The speaker hole (207, 214) may include an external speaker hole (207) and a call receiver hole (214). In one embodiment, the speaker hole (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (207, 214) (e.g., a piezo speaker).

[0060] According to one embodiment, the call receiver hole (214) may form a passage for transmitting sound generated from a speaker (e.g., speaker (420) of FIG. 10) disposed inside the housing (210) to the outside of the electronic device (101).

[0061] According to one embodiment, the receiver hole (214) for calling may be positioned adjacent to a first edge (2101) (e.g., an edge facing the +Y direction in FIGS. 2 and 3) of the electronic device (101) forming at least a portion of the side surface (210C). The first edge (2101) may be defined and / or referred to as a top edge of the electronic device (101).

[0062] In one embodiment, the call receiver hole (214) may be defined by the housing (210). In one embodiment, the call receiver hole (214) may be formed between a portion of the housing (210) (e.g., the first edge (2101)) and an upper edge of the display (220), but is not limited thereto.

[0063] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) and / or a fourth sensor module (e.g., a fingerprint sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on not only the first surface (210A) (e.g., the display (220)) of the housing (210), but also the second surface (210B) or the side surface (210C). The electronic device (101) may further include, for example, at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0064] The camera modules (205, 212, 213) may include a first camera device (205) disposed on a first surface (210A) of the electronic device (101), a second camera device (212) disposed on a second surface (210B), and / or a flash (213). The camera devices (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one surface of the electronic device (101). In one embodiment, the flash (213) may emit infrared light, and infrared light emitted by the flash (213) and reflected by a subject may be received via the third sensor module (219). The electronic device (101) or the processor of the electronic device (101) can detect depth information of the subject based on the point in time when infrared rays are received from the third sensor module (219).

[0065] The key input devices (216, 217) may be disposed on one surface of the housing (210). For example, the key input devices (216, 217) may be disposed on a side surface (210C) of the housing (210). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (216, 217), and the key input devices that are not included may be implemented in another form, such as soft keys, on the display (220). In one embodiment, the key input devices (216, 217) may include a sensor module disposed on a second surface (210B) of the housing (210).

[0066] According to one embodiment, the key input device (216, 217) may be defined and / or referred to as a side key, a key input module, or a button assembly.

[0067] According to one embodiment, the key input device (216, 217) may include a volume key (216) or a power key (217). The volume key (216) may be a key that can adjust the intensity of an audio signal output from the electronic device (101). The volume key (216) may have an elongated shape when viewed from the side of the electronic device (101) (e.g., when viewed from the +X direction to the -X direction in FIGS. 2 and 3). Since the volume key (216) is provided in an elongated shape, a key input for volume up may be possible on one side of the volume key (216), and a key input for volume down may be possible on the other side of the volume key (216). For example, when viewed from the side of the electronic device (101), the volume key (216) may visually appear as a single member, but the volume key (216) may provide two key input points. The volume key (216) may be configured to adjust the intensity of an acoustic signal, but is not limited thereto, and may provide scroll up-down control, text size control, or other key input functions.

[0068] According to one embodiment, the power key (217) may be separated from the volume key (216). The power key (217) may be configured to control the on-off of the electronic device (101) or to control the standby mode and the activation mode of the electronic device (101).

[0069] The light emitting element (206) may be disposed, for example, on the first surface (210A) of the housing (210). The light emitting element (206) may provide, for example, status information of the electronic device (101) in the form of light. In one embodiment, the light emitting element (206) may provide a light source that is linked to the operation of, for example, the camera module (205). The light emitting element (206) may include, for example, a light emitting diode (LED), an infrared (IR) LED, and a xenon lamp.

[0070] The connector holes (208, 209) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (e.g., an earphone jack) (209) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0071] FIG. 4 is an exploded perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0072] FIG. 5 is an exploded perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0073] The embodiments of FIGS. 4 to 5 may be combined with the embodiments of FIGS. 1 to 3, or the embodiments of FIGS. 6 to 12.

[0074] Referring to FIGS. 4 and 5, the electronic device (101) (e.g., the electronic device (101) of FIG. 1 or the electronic device (101) of FIGS. 2 to 3) may include a side structure (310), a first bracket (311), a front plate (320) (e.g., the front plate (202) of FIG. 2), a display (330) (e.g., the display (220) of FIG. 2), at least one printed circuit board (or board assembly) (341, 343), a battery (350), a second bracket (360) (e.g., a rear case), an antenna, a camera assembly (307), and a rear plate (380) (e.g., the rear plate (211) of FIG. 2). When including a plurality of printed circuit boards (341, 343), the electronic device (101) can electrically connect different printed circuit boards by including at least one flexible connection member (345). For example, the printed circuit boards (341, 343) can include a first circuit board (341) positioned above (e.g., in the +Y-axis direction) the battery (350) and a second circuit board (343) positioned below (e.g., in the -Y-axis direction), and the flexible connection member (345) can electrically connect the first circuit board (341) and the second circuit board (343).

[0075] According to one embodiment, the electronic device (101) may omit at least one of the components (e.g., the second bracket (360)) or additionally include another component. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIGS. 1 to 3, and any redundant description thereof will be omitted below.

[0076] According to one embodiment, the electronic device (101) may include a housing (301) (e.g., housing (210) of FIGS. 2 and 3).

[0077] According to one embodiment, the housing (301) may include a first bracket (311) and a side structure (310) (e.g., the side structure (218) or side (210C) of FIGS. 2 and 3).

[0078] According to one embodiment, the first bracket (311) may be provided in at least a portion in a flat shape. In one embodiment, the first bracket (311) may be disposed inside the electronic device (101) and connected to the side structure (310), or may be formed integrally with the side structure (310). The first bracket (311) may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. When the first bracket (311) is at least partially formed of a metallic material, the side structure (310) or a portion of the first bracket (311) may function as an antenna. The first bracket (311) may be defined and / or referred to as a first support member (311), a first support plate (311), or a first mid bracket.

[0079] According to one embodiment, the first bracket (311) may include a front side (311a) and a rear side (311b) opposite to the front side (311a). The front side (311a) may be defined and / or referred to as a first surface (311a) or a front surface (311a). The rear side (311b) may be defined and / or referred to as a second surface (311b) or a rear surface (311b).

[0080] In one embodiment, the front side (311a) may face the display (330). The back side (311b) may face the back plate (380).

[0081] According to one embodiment, a display (330) may be coupled to the front surface (311a) of the first bracket (311), and a printed circuit board (341, 343) may be coupled to the rear surface (311b) of the first bracket (311). A processor, memory, and / or an interface may be mounted on the printed circuit board (341, 343). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0082] In one embodiment, the first bracket (311) and the side structure (310) may be combined to be referred to as a front case or housing (301). In one embodiment, the housing (301) may be generally understood as a structure for accommodating, protecting, or arranging a printed circuit board (341, 343) or a battery (350). In one embodiment, the housing (301) may be understood as including structures that can be visually or tactilely recognized by a user in the appearance of the electronic device (101), for example, a side structure (310), a front plate (320), and / or a rear plate (380). In one embodiment, the 'front or rear of the housing (301)' may refer to the first side (210A) of FIG. 2 or the second side (210B) of FIG. 3. In one embodiment, the first bracket (311) is positioned between the front plate (320) (e.g., the first side (210A) of FIG. 2) and the rear plate (380) (e.g., the second side (210B) of FIG. 3) and may function as a structure for positioning electrical / electronic components such as printed circuit boards (341, 343) or camera assemblies (307).

[0083] According to one embodiment, the memory may include, for example, volatile memory (e.g., volatile memory (132) of FIG. 1) or non-volatile memory (e.g., non-volatile memory (134) of FIG. 1).

[0084] According to one embodiment, the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, and may include, for example, a USB connector, an SD card / multimedia card (MMC) connector, or an audio connector.

[0085] According to one embodiment, the second bracket (360) may include, for example, an upper support member (360a) and a lower support member (360b). In one embodiment, the upper support member (360a) may be arranged to surround a printed circuit board (341, 343) (e.g., the first circuit board (341)) together with a portion of the first bracket (311). For example, the upper support member (360a) of the second bracket (360) may be arranged to face the first bracket (311) with the first circuit board (341) interposed therebetween. In one embodiment, the lower support member (360b) of the second bracket (360) may be arranged to face the first bracket (311) with the second circuit board (343) interposed therebetween. Circuit devices implemented in the form of integrated circuit chips (e.g., processors, communication modules, or memories) or various electrical / electronic components may be placed on the circuit boards (341, 343), and according to an embodiment, the circuit boards (341, 343) may be provided with an electromagnetic shielding environment from the second bracket (360). In one embodiment, the lower support member (360b) may be utilized as a structure on which electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be placed. In one embodiment, electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be placed on an additional printed circuit board (not shown). For example, the lower support member (360b) may be placed to surround an additional circuit board together with another part of the first bracket (311). A speaker module or interface arranged on an additional circuit board or lower support member (360b) not shown may be arranged corresponding to the audio module (207) or connector hole (208, 209) of FIG. 2.The second bracket (360) may be defined and / or referred to as a second support member (360), a second support plate (360), or a second mid bracket.

[0086] According to one embodiment, the battery (350) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially on the same plane as, for example, the printed circuit board (341, 343). The battery (350) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0087] Although not shown, the antenna may include a conductive pattern implemented on the surface of the second bracket (360), for example, through a laser direct structuring method. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the thin film-type antenna may be disposed between the back plate (380) and the battery (350). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, another antenna structure may be formed by the side structure (310) and / or a portion or combination of the first bracket (311).

[0088] In one embodiment, the camera assembly (307) may include at least one camera module. Within the electronic device (101), the camera assembly (307) (or at least one camera module) may receive at least a portion of light incident through an optical hole or camera window (312, 313, 319). In one embodiment, the camera assembly (307) may be disposed on the first bracket (311) at a location adjacent to the printed circuit board (341, 343). In one embodiment, the camera module(s) of the camera assembly (307) may be generally aligned with one of the camera windows (312, 313, 319) and may be at least partially encased in the second bracket (360) (e.g., the upper support member (360a)).

[0089] According to one embodiment, the electronic device (101) may include a flexible connection member (345). The flexible connection member (345) may include a flexible flat cable (FFC), a flexible printed circuit board (FPCB), or a board to board connector (B2B connector).

[0090] According to one embodiment, the flexible connecting member (345) is at least partially bendable. For example, the flexible connecting member (345) may be configured to be at least partially folded or unfolded.

[0091] According to one embodiment, the flexible connecting member (345) can electrically connect a first circuit board (341) (e.g., a main circuit board) and at least one electrical component. For example, one end of the flexible connecting member (345) can be physically and / or electrically connected to at least a portion of the first circuit board (341). For example, the other end of the flexible connecting member (345) can be physically and / or electrically connected to at least a portion of the at least one electrical component. The at least one electrical component can include, for example, a second circuit board (343) (e.g., a sub circuit board). However, the at least one electrical component is not limited thereto and can include various electrical components (e.g., an antenna, a speaker, a battery, a display, or a sensor).

[0092] According to one embodiment, the flexible connecting member (345) may be configured to transmit power or an electrical signal from the first circuit board (341) to at least one electrical component. The flexible connecting member (345) may be configured to transmit power or an electrical signal from the at least one electrical component to the first circuit board (341). The electrical signal may include a control signal, a power signal, or a communication signal.

[0093] According to one embodiment, the electronic device (101) may include a key input device (316, 317) (e.g., the key input device (216, 217) of FIG. 2). The key input device (316, 317) may include a volume key (316) (e.g., the volume key (216) of FIG. 2) or a power key (e.g., the power key (217) of FIG. 2).

[0094] According to one embodiment, the volume key (316) may be disposed on one surface of the housing (301). For example, the volume key (316) may be disposed on a portion of a lateral surface of the housing (301) (e.g., the lateral structure (310) of FIG. 4), but is not limited thereto.

[0095] According to one embodiment, the volume key (316) may include a haptic module (e.g., the haptic module (179) of FIG. 1). The haptic module may include a piezo actuator. The piezo actuator may be configured to provide a mechanical stimulus (e.g., vibration or movement) that is perceptible to the user through a tactile or kinesthetic sense when the user presses or touches the volume key (316).

[0096] According to one embodiment, the volume key (316) may have an elongated shape when viewed from the side of the electronic device (101) (e.g., when viewed from the +X direction to the -X direction in FIG. 4). The volume key (316) may be spaced apart from the power key (317).

[0097] According to one embodiment, the electronic device (101) may include a speaker (420) (e.g., the sound output module (155) of FIG. 1). According to one embodiment, the speaker (420) may be disposed on the first bracket (311). The speaker (420) may be mounted on the rear surface (311b) of the first bracket (311). According to one embodiment, the speaker (420) may be disposed on an opening (e.g., the fourth opening (411) of FIG. 10) formed in the first circuit board (341) (e.g., the circuit board (410) of FIG. 10) and mounted on the rear surface (311b) of the first bracket (311).

[0098] According to one embodiment, the speaker (420) may be placed inside the housing (301). The speaker (420) may be configured to output sound to the outside of the electronic device (101) through a call receiver hole (e.g., call receiver hole (214) of FIG. 2) formed in a first edge (3101) of the housing (301) (e.g., first edge (2101) of FIGS. 2 and 3).

[0099] According to one embodiment, a speaker (420) (e.g., an audio output module (155) of FIG. 1 or an audio module (170) of FIG. 1) may be configured to convert an electrical signal into sound and output the sound to the outside of the electronic device (101). For example, the speaker (420) may include a diaphragm, a magnet, or a voice coil.

[0100] According to one embodiment, sound generated from the speaker (420) can be output to the outside of the electronic device (101) through a call receiver hole (e.g., call receiver hole (214) of FIG. 2).

[0101] FIG. 6 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0102] FIG. 7 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure, viewed from the opposite direction from FIG. 6.

[0103] The embodiments of FIGS. 6 and 7 can be combined with the embodiments of FIGS. 1 to 5, or the embodiments of FIGS. 8 to 12.

[0104] The configurations of the embodiments of FIGS. 6 and 7 may be partially or entirely identical to the configurations of the embodiments of FIGS. 1 to 5, or the configurations of the embodiments of FIGS. 8 to 12.

[0105] Referring to FIGS. 6 and 7, an electronic device (101) (e.g., the electronic device (101) of FIGS. 2 to 5) may include a housing (301) (e.g., the housing (301) of FIGS. 4 and 5).

[0106] According to one embodiment, the housing (301) may include a first bracket (311) and a side structure (310).

[0107] According to one embodiment, the first bracket (311) may include a front side (311a) and a back side (311b) opposite the front side (311a).

[0108] According to one embodiment, the first bracket (311) may include a plurality of openings (3111, 3112, 3114). The plurality of openings (3111, 3112, 3114) may be spaced apart from each other. The plurality of openings (3111, 3112, 3114) may include holes extending from the front side (311a) to the rear side (311b).

[0109] According to one embodiment, the plurality of openings (3111, 3112, 3114) may include a first opening (3111), a first opening (3111), a second opening (3112), and a third opening (3113).

[0110] According to one embodiment, a first opening (3111) of the plurality of openings (3111, 3112, 3113) may be aligned with a speaker (420) (e.g., speaker (420) of FIG. 5).

[0111] According to one embodiment, a second opening (3112) among the plurality of openings (3111, 3112, 3113) may be spaced apart from the first opening (3111). The second opening (3112) may be at least partially covered by an acoustic sealing plate (430) and a circuit board (410) (e.g., the first circuit board (341) of FIGS. 4 and 5).

[0112] In one embodiment, a third opening (3113) of the plurality of openings (3111, 3112, 3113) can be aligned with a camera module (e.g., camera module (205) of FIG. 2). The third opening (3113) can be positioned adjacent to a first edge (3101) of the housing (301) (e.g., first edge (3101) of FIGS. 4 and 5).

[0113] According to one embodiment, the first bracket (311) may include a stepped portion (3114) that is recessed from the front side (311a) toward the rear side (311b). The stepped portion (3114) may be defined as a portion that is recessed more than other portions of the first bracket (311). An acoustic sealing plate (430) may be seated on the stepped portion (3114). When looking at the front side (311a) (e.g., when looking at the -Z direction from the +Z direction in FIG. 6), the shape of the acoustic sealing plate (430) may be substantially the same as or corresponding to the shape of the stepped portion (3114), but is not limited thereto.

[0114] According to one embodiment, when looking at the front (311a) (e.g., when looking at the -Z direction from the +Z direction in FIG. 6), the step portion (3114) may have a bent shape along the periphery of the third opening (3113). For example, the step portion (3114) may be spaced apart from the third opening (3113) and may be formed in a curved shape along the periphery of the third opening (3113).

[0115] According to one embodiment, the first opening (3111) and the second opening (3112) may be formed in the step portion (3114).

[0116] According to one embodiment, the electronic device (101) may include a circuit board (410) (e.g., the first circuit board (341) of FIGS. 4 and 5) disposed inside the housing (301). The circuit board (410) may be disposed between the rear surface (311b) of the first bracket (311) and a rear plate (e.g., the rear plate (380) of FIGS. 4 and 5).

[0117] According to one embodiment, the circuit board (410) may include one of a printed circuit board (PCB), a flexible printed circuit board (FPCB), or a rigid-flexible PCB (RF-PCB).

[0118] According to one embodiment, a speaker (420) (e.g., speaker (420) of FIG. 5) may be disposed or mounted on the rear surface (311b) of the first bracket (311).

[0119] According to one embodiment, the speaker (420) may be positioned in a fourth opening (e.g., the fourth opening (411) of FIG. 10) formed in the circuit board (410) and secured to the rear surface (311b) of the first bracket (311). For example, the fourth opening (411) may accommodate at least a portion of the speaker (420).

[0120] According to one embodiment, with the circuit board (410) positioned on the rear surface (311b) of the first bracket (311), the speaker (420) can be aligned with the first opening (3111).

[0121] According to one embodiment, the circuit board (410) may include a first portion (410a). The first portion (410a) may be positioned to cover a second opening (3112).

[0122] According to one embodiment, the electronic device (101) may include an acoustic sealing plate (430). The acoustic sealing plate (430) may be positioned to cover the step portion (3114). A space formed between the acoustic sealing plate (430) and the step portion (3114) may form at least a portion of an acoustic path (302). The acoustic sealing plate (430) may be defined and / or referred to as an acoustic sealer (430).

[0123] In one embodiment, the acoustic sealing plate (430) may include a metal plate. As an example, the metal plate may include, but is not limited to, stainless steel.

[0124] According to one embodiment, the edge of the acoustic sealing plate (430) may be in close contact with the edge of the step portion (3114), but is not limited thereto.

[0125] According to one embodiment, the electronic device (101) may include a first sealing member (440) and a second sealing member (450).

[0126] According to one embodiment, the first sealing member (440) may include a sealing material. For example, the first sealing member (440) may include rubber having an elastic material. For example, the first sealing member (440) may include a rubber ring.

[0127] According to one embodiment, the first sealing member (440) may be positioned between the rear surface (311b) of the first bracket (311) and the circuit board (410). The opening of the first sealing member (440) may be aligned with the speaker (420).

[0128] According to one embodiment, the first sealing member (440) may be disposed between the circuit board (410) and the rear surface (311b) to limit and / or reduce sound generated from the speaker (420) from leaking into the internal space of the electronic device (101).

[0129] According to one embodiment, when looking at the rear surface (311b) (e.g., when looking from the -Z direction to the +Z direction in FIG. 7), the first opening (3111) may be positioned inside the first sealing member (440). For example, the first sealing member (440) may be arranged to surround the first opening (3111).

[0130] According to one embodiment, the second sealing member (450) may include a sealing material. For example, the second sealing member (450) may include rubber having an elastic material. For example, the second sealing member (450) may include a rubber ring.

[0131] According to one embodiment, the second sealing member (450) may be positioned between the rear surface (311b) of the first bracket (311) and the circuit board (410). An opening of the second sealing member (450) may be aligned with a second opening (3112).

[0132] According to one embodiment, the second sealing member (450) may be disposed between the circuit board (410) and the rear surface (311b) to limit and / or reduce sound generated from the speaker (420) from leaking into the internal space of the electronic device (101). For example, the second sealing member (450) may be disposed between the first portion (410a) of the circuit board (410) and the rear surface (311b).

[0133] According to one embodiment, when looking at the rear surface (311b) (e.g., when looking from the -Z direction to the +Z direction in FIG. 7), at least a portion of the second opening (3112) may be positioned inside the second sealing member (450). For example, the second sealing member (450) may be positioned to surround the second opening (3112).

[0134] According to one embodiment, the electronic device (101) may include an acoustic path (302). The acoustic path (302) may be formed inside the electronic device (101). Sound generated from the speaker (420) may be output to the outside of the electronic device (101) through the acoustic path (302).

[0135] According to one embodiment, the sound path (302) may include a first opening (3111), a second opening (3112), and a step portion (3114). According to one embodiment, the sound path (302) may include a call receiver hole (e.g., call receiver hole (214) of FIG. 2).

[0136] According to one embodiment, a partial area of ​​the acoustic path (302) may be defined by the second opening (3112), the acoustic sealing plate (430), and the first portion (410a) of the circuit board (410). A detailed description thereof will be provided below.

[0137] FIG. 8 is a front view of an electronic device according to one embodiment of the present disclosure.

[0138] FIG. 9 is a rear view of an electronic device according to one embodiment of the present disclosure, viewed from the opposite direction to FIG. 8.

[0139] The embodiments of FIGS. 8 and 9 can be combined with the embodiments of FIGS. 1 to 7, or the embodiments of FIGS. 10 to 12.

[0140] The configurations of the embodiments of FIGS. 8 and 9 may be partially or entirely identical to the configurations of the embodiments of FIGS. 1 to 7, or the configurations of the embodiments of FIGS. 10 to 12.

[0141] Referring to FIG. 8, an electronic device (101) (e.g., the electronic device (101) of FIGS. 2 to 7) may include a first bracket (311) including a front surface (311a).

[0142] According to one embodiment, the step portion (3114) formed on the front surface (311a) of the first bracket (311) may be covered by an acoustic sealing plate (430). In the illustrated embodiment, for convenience of explanation, an embodiment is illustrated in which a part of the acoustic sealing plate (430) is omitted and / or removed to form a hole (430a), but the acoustic sealing plate (430) of the present disclosure may have a filled shape so that the front of the first opening (3111) and the second opening (3112) are sealed.

[0143] According to one embodiment, sound generated from a speaker (e.g., speaker (420) of FIG. 7) may be transmitted through the first opening (3111) and pass through the space between the step portion (3114) and the acoustic sealing plate (430). The sound may pass through the space between the step portion (3114) and the acoustic sealing plate (430) and be transmitted to the sound hole (314) (e.g., call receiver hole (214) of FIG. 2) through the connection area (3115). The sound hole (314) may be formed adjacent to the first edge (3101) of the electronic device (101).

[0144] According to one embodiment, the connection area (3115) may include a hole or recess formed in the first bracket (311). The connection area (3115) may form a passage connecting the second opening (3112) and the sound hole (314).

[0145] According to one embodiment, the sound can be output to the outside of the electronic device (101) through the sound hole (314).

[0146] According to one embodiment, the third opening (3113) may be positioned adjacent to the sound hole (314).

[0147] According to one embodiment, an acoustic path (e.g., acoustic path (302) of FIGS. 7 and 8) that includes a passage that allows sound generated from a speaker to be transmitted to the outside of the electronic device (101) may be formed or bent to bypass the third opening (3113) and the camera module (e.g., camera module (460) of FIG. 10).

[0148] Referring to FIG. 9, the first opening (3111) may be surrounded by a first sealing member (440). According to one embodiment, the first sealing member (440) may be positioned between the rear surface (311b) of the first bracket (311) and a circuit board (e.g., the circuit board (410) of FIG. 7).

[0149] According to one embodiment, the first sealing member (440) can prevent and / or limit sound generated from the speaker and introduced into the sound path through the first opening (3111) from leaking into the internal space of the electronic device (101).

[0150] According to one embodiment, a second sealing member (450) may be disposed on an inner edge of the first bracket (311) defining the second opening (3112). According to one embodiment, the second sealing member (450) may be disposed between the rear surface (311b) of the first bracket (311) and a first portion of the circuit board (e.g., the first portion (410a) of FIG. 7).

[0151] In one embodiment, the second sealing member (450) may prevent and / or limit sound passing through the acoustic path and / or the second opening (3112) from leaking into the interior space of the electronic device (101).

[0152] FIG. 10 is a cross-sectional view of an electronic device taken along line AA' of FIG. 2 according to one embodiment of the present disclosure.

[0153] FIG. 11 is a cross-sectional view of an electronic device taken along line BB' of FIG. 2 according to one embodiment of the present disclosure.

[0154] FIG. 12 is a drawing of a graph showing that the acoustic performance of sound generated from a speaker through a second opening is improved according to one embodiment of the present disclosure.

[0155] The embodiments of FIGS. 10 to 12 can be combined with the embodiments of FIGS. 1 to 9.

[0156] The configurations of the embodiments of FIGS. 10 to 12 may be partially or entirely identical to the configurations of the embodiments of FIGS. 1 to 9.

[0157] Referring to FIGS. 10 and 11, an electronic device (101) (e.g., the electronic device (101) of FIGS. 2 to 9) may include a speaker (420) (e.g., the sound output module (155) of FIG. 1, the audio module (170) of FIG. 1, or the speaker (420) of FIG. 7).

[0158] According to one embodiment, the front surface (311a) of the first bracket (311) may be configured to support a display (330) (e.g., the display (330) of FIG. 4).

[0159] According to one embodiment, the display (330) may be covered by a front plate (320) (e.g., the front plate (320) of FIG. 4).

[0160] According to one embodiment, the first edge (3101) of the lateral structure (310) may form at least a portion of a lateral surface of the electronic device (101).

[0161] According to one embodiment, the circuit board (410) may be disposed on the rear surface (311b) of the first bracket (311). The circuit board (410) may include a fourth opening (411). For example, a speaker (420) may be disposed on the fourth opening (411). The speaker (420) disposed on the fourth opening (411) may be mounted on the rear surface (311b) of the first bracket (311). Sound generated from the speaker (420) may be transmitted to the first opening (3111).

[0162] According to one embodiment, the back plate (380) may be positioned to cover the speaker (420) and the circuit board (410).

[0163] According to one embodiment, the electronic device (101) may include a camera module (460) (e.g., camera module (205) of FIG. 2).

[0164] According to one embodiment, the camera module (460) may be disposed on the front side (e.g., the side facing the +Z direction of FIGS. 10 and 11) of the circuit board (410). The speaker (420) may be disposed on the rear side (311b) of the first bracket (311) (e.g., the side facing the -Z direction of FIGS. 10 and 11).

[0165] In one embodiment, the camera module (460) may be disposed under the display (330). For example, it may be positioned in the Z direction of FIGS. 10 and 11 with respect to the display (330). The camera module (460) may be disposed between the circuit board (410) and the display (330).

[0166] According to one embodiment, the camera module (460) may be configured to capture an object outside the electronic device (101) through the third opening (3113) formed in the first bracket (311) and the camera opening (305) formed in the display (330). The camera module (460) may be covered by a front plate (320) to prevent foreign substances from entering from the outside of the electronic device (101).

[0167] According to one embodiment, the camera module (460) may include an under display camera (UDC).

[0168] According to one embodiment, the electronic device (101) may include a shield can (415). The shield can (415) may be disposed on the rear surface of the circuit board (410) (e.g., the surface facing the -Z direction of FIGS. 10 and 11). The shield can (415) may be disposed to cover the speaker (420). The shield can (415) may be configured to limit and / or block noise from interfering with the electric / electronic components of the electronic device (101) disposed outside the shield can (415) and the speaker (420) disposed inside the shield can (415).

[0169] Referring to FIG. 10, the sound path (302) may include a fourth opening (411), a first opening (3111), and a step portion (3114).

[0170] According to one embodiment, sound generated from the speaker (420) can be transmitted to the first opening (3111) of the first bracket (311).

[0171] According to one embodiment, as the first sealing member (440) is disposed between the rear surface (311b) of the first bracket (311) and the circuit board (410), sound generated from the speaker (420) can be restricted from leaking into the internal space of the electronic device (101). The sound generated from the speaker (420) can be transmitted to the first opening (3111) and the step portion (3114). As the first opening (3111) and the step portion (3114) are covered by the acoustic sealing plate (430), the sound can be restricted and / or reduced from leaking between the front surface (311a) and the display (330).

[0172] According to one embodiment, the sound may be transmitted to the sound hole (314) through a space formed between the step portion (3114) and the cover (340) after passing through the first opening (3111).

[0173] Referring to FIG. 11, the sound path (302) may include a step portion (3114), a second opening (3112), a connection area (3115), and a sound hole (314).

[0174] According to one embodiment, sound passing through the first opening (e.g., the first opening (3111) of FIG. 10) can be transmitted toward the connection area (3115) through the space formed between the step portion (3114) and the acoustic sealing plate (430).

[0175] According to one embodiment, when the sound is transmitted toward the connection area (3115), the sound may pass through a partial area (302a) of the acoustic path (302) corresponding to the second opening (3112). The partial area (302a) of the acoustic path (302) may be defined by the acoustic sealing plate (430), the second opening (3112), and the first portion (410a) (e.g., a portion of the circuit board (410)). According to one embodiment, since the second opening (3112) is covered by the first portion (410a) of the circuit board (410), the circuit board (410) may form at least a portion of the partial area (302a) of the acoustic path (302). Since a separate member for covering the partial area (302a) of the acoustic path (302) is not provided, the number of components of the electronic device (101) may be reduced. Additionally, in the limited internal space of the electronic device (101), the size of the circuit board (410) can be sufficiently secured.

[0176] According to one embodiment, as the second sealing member (450) is arranged between the rear surface (311b) of the first bracket (311) and the first portion (410a) of the circuit board (410), sound generated from the speaker (420) can be restricted from leaking into the internal space of the electronic device (101). The sound generated from the speaker (420) can be transmitted to the connection area (3115). As the second opening (3112) and the step portion (3114) are covered by the acoustic sealing plate (430), sound leakage between the front surface (311a) and the display (330) can be restricted and / or reduced.

[0177] According to one embodiment, sound passing through the connection area (3115) can be output to the outside of the electronic device (101) through the sound hole (314). According to the illustrated embodiment, the sound hole (314) can be formed at the front end of the first edge (3101) (e.g., the end facing the +Z direction in FIG. 11), but is not limited thereto. According to one embodiment, the sound hole (314) can also be formed as a gap formed between the first edge (3101) and the edge of the display (330) (e.g., the edge facing the +Y direction in FIG. 11).

[0178] According to one embodiment, a partial region (302a) of the acoustic path (302) may have a larger space than other regions (302b, 302c) of the acoustic path (302) adjacent to the partial region (302a) by including a second opening (3112) formed in the first bracket (311).

[0179] According to one embodiment, the thickness (t1) of the partial region (302a) of the acoustic path (302) (e.g., the thickness in the Z-axis direction of FIG. 11) may be greater than the thickness (t2) of the front region (302b) of the acoustic path (302) or the thickness (t3) of the rear region (302c) of the acoustic path (302). For example, the front region (302b) may include an area defined by the step portion (3114) and the acoustic sealing plate (430). Sound may be transmitted from the front region (302b) to the partial region (302a). The rear region (302c) may be defined as an area adjacent to the connecting region (3115). Sound may be transmitted from the partial region (302a) to the connecting region (3115) through the rear region (302c).

[0180] According to one embodiment, since the spatial size of the partial region (302a) is larger than the spatial sizes of the adjacent other regions (302b, 302c), the acoustic performance of sound output to the outside of the electronic device (101) through the acoustic path (302) can be improved. For example, since the spatial size of the partial region (302a) of the acoustic path (302) is made larger by the second opening (3112), the acoustic impedance can be lowered. Accordingly, the acoustic vibration or acoustic distortion of sound passing through the partial region (302a) can be improved.

[0181] Referring to FIG. 12, a first line (L1) is shown representing sound output (vertical axis, dB) according to a frequency band (horizontal axis, Hz) of sound generated from a speaker (420) of an electronic device (101) including a partial region (302a) and a second opening (3112) according to an embodiment of the present disclosure. In addition, a second line (L2) is shown representing sound output (vertical axis, Db) according to a frequency band (horizontal axis, Hz) of sound generated from a speaker of an electronic device according to a comparative example that does not include a second opening.

[0182] According to one embodiment, it can be confirmed that the sound output from the speaker (420) of the electronic device (101) according to the embodiment of the present disclosure has a greater output in the low frequency range (e.g., see A of FIG. 12) than the sound output from the speaker of the electronic device according to the comparative example.

[0183] Electronic devices may include speakers configured to output sound externally. To ensure the speaker's acoustic performance, optimal design of the acoustic path may be required. However, with the slimming of electronic devices, designing the acoustic path to ensure optimal acoustic performance may be challenging.

[0184] According to one embodiment of the present disclosure, an electronic device having improved performance of sound output through an acoustic path can be provided.

[0185] However, the problem to be solved in this disclosure is not limited to the problem mentioned above, and may be determined in various ways without departing from the spirit and scope of this disclosure.

[0186] According to one embodiment of the present disclosure, an electronic device including a speaker having improved acoustic distortion or acoustic vibration of sound passing through an acoustic path may be provided.

[0187] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0188] According to one embodiment, the electronic device (101) may include a housing (301) including a first bracket (311) including a front side (311a) and a rear side (311b) opposite to the front side (311a), a first opening (3111) extending from the front side (311a) to the rear side (311b), and a second opening (3112) extending from the front side (311a) to the rear side (311b) and spaced apart from the first opening (3111).

[0189] According to one embodiment, the electronic device (101) may include a display (330) disposed on the front surface (311a).

[0190] According to one embodiment, the electronic device (101) may include a circuit board (410) disposed on the rear surface (311b).

[0191] According to one embodiment, the electronic device (101) may include a speaker (420) disposed on the rear surface (311b) and aligned with the first opening (3111).

[0192] According to one embodiment, the acoustic path (302) may be configured to output sound generated from the speaker (420) to the outside of the electronic device (101).

[0193] According to one embodiment, a partial area (302a) of the sound path (302) may be defined by at least a portion of the bracket (311), the second opening (3112) and the circuit board (410).

[0194] According to one embodiment, the housing (301) may include a front plate (320) that covers the display (330).

[0195] According to one embodiment, the housing (301) may further include a back plate (380) that covers the circuit board (410) and the speaker (420).

[0196] According to one embodiment, the bracket (311) may be positioned between the front plate (320) and the rear plate (380).

[0197] According to one embodiment, the sound path (302) may include a sound hole (314) formed in the housing (301) and positioned adjacent to an edge of the display (330).

[0198] According to one embodiment, the electronic device (101) may further include an acoustic sealing plate (430) disposed on the front surface (311a) and configured to cover at least a portion of the acoustic path (302).

[0199] According to one embodiment, the acoustic sealing plate (430) may be configured to cover the first opening (3111) and the second opening (3112).

[0200] According to one embodiment, the bracket (311) may include a stepped portion (3114) that is sunken from the front side (311a) toward the rear side (311b).

[0201] According to one embodiment, the first opening (3111) and the second opening (3112) may be formed in the step portion (3114).

[0202] According to one embodiment, the acoustic sealing plate (430) may be mounted on the step portion (3114).

[0203] According to one embodiment, the partial region (302a) may be defined by the acoustic sealing plate (430), the bracket (311), the second opening (3112) and the first portion (410a) of the circuit board (410).

[0204] According to one embodiment, the acoustic sealing plate (430) may include stainless steel.

[0205] According to one embodiment, the housing (301) may further include a third opening (3113) extending from the front side (311a) of the bracket (311) to the rear side (311b) of the bracket (311) and spaced apart from the first opening (3111) and the second opening (3112).

[0206] According to one embodiment, the electronic device (101) may further include a camera module (460) aligned with the third opening (3113).

[0207] In one embodiment, the sound path (302) can be bent to bypass the third opening (3113) and the camera module (460).

[0208] According to one embodiment, the electronic device (101) may further include a first sealing member (440) disposed between the rear surface (311b) and the circuit board (410) and including a sealing material.

[0209] According to one embodiment, when looking at the rear surface (311b), the first opening (3111) may be surrounded by the first sealing member (440).

[0210] According to one embodiment, the electronic device (101) may further include a second sealing member (450) disposed between the rear surface (311b) and the circuit board (410) and including a sealing material.

[0211] According to one embodiment, when looking at the rear surface (311b), the second opening (3112) may be surrounded by the second sealing member (450).

[0212] According to one embodiment, the circuit board (410) can cover the second opening (3112).

[0213] According to one embodiment, the circuit board (410) may include a fourth opening (411) that accommodates at least a portion of the speaker (420).

[0214] According to one embodiment, the size (t1) of the partial region (302a) of the sound path (302) may be larger than the sizes (t2, t3) of other regions (302b, 302c) of the sound path (302).

[0215] According to one embodiment, the other regions (302b, 302c) may be positioned adjacent to the partial region (302a).

[0216] According to one embodiment, the electronic device (101) may include a housing (301) including a front side (311a), a rear side (311b) opposite the front side (311a), and a plurality of openings (3111, 3112, 3113) extending from the front side (311a) to the rear side (311b).

[0217] According to one embodiment, the electronic device (101) may include a display (330) disposed on the front surface (311a).

[0218] According to one embodiment, the electronic device (101) may include a circuit board (410) disposed on the rear surface (311b).

[0219] According to one embodiment, the electronic device (101) may include a speaker (420) disposed on the circuit board (410).

[0220] According to one embodiment, the electronic device (101) may include a first sealing member (440) disposed between the circuit board (410) and the rear surface (311b), surrounding a first opening (3111) among the plurality of openings (3111, 3112, 3113), and including a sealing material.

[0221] According to one embodiment, the electronic device (101) may include a second sealing member (450) disposed between the circuit board (410) and the rear surface (311b), surrounding a second opening (3112) among the plurality of openings (3111, 3112, 3113), and including a sealing material.

[0222] According to one embodiment, the first sealing member (440) may include a rubber ring.

[0223] According to one embodiment, the second sealing member (450) may include a rubber ring.

[0224] According to one embodiment, the electronic device (101) may further include an acoustic sealing plate (430) disposed on the front surface (311a) and configured to cover the first opening (3111) and the second opening (3112).

[0225] According to one embodiment, the electronic device (101) may further include a camera module (460) disposed on the circuit board (410) and aligned with a third opening (3113) of the plurality of openings (3111, 3112, 3113).

[0226] According to one embodiment, the sound generated from the speaker (420) may be configured to be output to the outside of the electronic device (101) through the sound path (302).

[0227] In one embodiment, the sound path (302) can be bent to bypass the camera module (460).

[0228] Although the detailed description of this document has described specific embodiments, it will be apparent to those skilled in the art that various modifications are possible without departing from the scope of this document.

Claims

1. In an electronic device (101), A housing (301) including a bracket (311) including a front side (311a) and a rear side (311b) opposite to the front side (311a), a first opening (3111) penetrating from the front side (311a) to the rear side (311b), and a second opening (3112) penetrating from the front side (311a) to the rear side (311b) and spaced apart from the first opening (3111); A display (330) placed on the front (311a); A circuit board (410) placed on the rear surface (311b); and A speaker (420) is disposed on the rear surface (311b) and aligned with the first opening (3111), The acoustic path (302) is configured to output sound generated from the speaker (420) to the outside of the electronic device (101), An electronic device (101) in which a partial area (302a) of the sound path (302) is formed by at least a portion of the bracket (311), the second opening (3112) and the circuit board (410).

2. In paragraph 1, The above housing (301) is A front plate (320) covering the above display (330); and Further comprising a back plate (380) covering the circuit board (410) and the speaker (420), The above bracket (311) is an electronic device (101) placed between the front plate (320) and the rear plate (380).

3. In paragraph 1 or 2, The above sound path (302) is an electronic device (101) including a sound hole (314) formed in the housing (301) and positioned adjacent to the edge of the display (330).

4. In any one of paragraphs 1 to 3, An electronic device (101) further comprising an acoustic sealing plate (430) arranged on the front surface (311a) and configured to cover at least a portion of the acoustic path (302).

5. In any one of paragraphs 1 to 4, The above acoustic sealing plate (430) is an electronic device (101) configured to cover the first opening (3111) and the second opening (3112).

6. In any one of paragraphs 1 to 5, The above bracket (311) further includes a stepped portion (3114) that is sunken from the front (311a) toward the rear (311b), The first opening (3111) and the second opening (3112) are formed in the step portion (3114), The above acoustic sealing plate (430) is an electronic device (101) mounted on the step portion (3114).

7. In any one of paragraphs 1 to 6, The above-mentioned partial area (302a) is an electronic device (101) defined by the acoustic sealing plate (430), the bracket (311), the second opening (3112) and the first portion (410a) of the circuit board (410).

8. In any one of paragraphs 1 to 7, The above acoustic sealing plate (430) is an electronic device (101) comprising stainless steel.

9. In any one of paragraphs 1 to 8, An electronic device (101) in which the housing (301) extends from the front side (311a) of the bracket (311) to the rear side (311b) of the bracket (311), and further includes a third opening (3113) spaced apart from the first opening (3111) and the second opening (3112).

10. In any one of paragraphs 1 to 9, An electronic device (101) further comprising a camera module (460) aligned with the third opening (3113).

11. In any one of paragraphs 1 to 10, The above sound path (302) is an electronic device (101) bent to bypass the third opening (3113) and the camera module (460).

12. In any one of paragraphs 1 to 11, It further includes a first sealing member (440) disposed between the rear surface (311b) and the circuit board (410) and including a sealing material, When looking at the rear surface (311b), the first opening (3111) is an electronic device (101) surrounded by the first sealing member (440).

13. In any one of paragraphs 1 to 12, It further includes a second sealing member (450) disposed between the rear surface (311b) and the circuit board (410) and including a sealing material. When looking at the rear surface (311b), the second opening (3112) is an electronic device (101) surrounded by the second sealing member (450).

14. In any one of paragraphs 1 to 13, The circuit board (410) is configured to cover the second opening (3112), An electronic device (101) wherein the circuit board (410) includes a fourth opening (411) that accommodates at least a portion of the speaker (420).

15. In any one of paragraphs 1 to 14, The size (t1) of the partial area (302a) of the sound path (302) is larger than the sizes (t2, t3) of other areas (302b, 302c) of the sound path (302), The above other area (302b, 302c) is an electronic device (101) placed adjacent to the above partial area (302a).

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