Semiconductor test cover capable of individual temperature control and socket device including same

Abstract

Disclosed are semiconductor test cover capable of individual temperature control and a socket device including same. The semiconductor test cover capable of individual temperature control according to one aspect of the present invention may comprise: a cover body; a pair of latches mounted on both side surfaces of the cover body via hinge shafts and having hooks formed at the respective ends; a pressing bolt that passes through the cover body and is thereby screw-coupled so as to be capable of moving up and down; and a heat transfer plate which is mounted on the cover body so as to be capable of moving up and down, is pressed by the pressing bolt to press semiconductor elements, and transfers heat between the semiconductor elements to control the individual temperatures thereof.

Description

Semiconductor test cover with individual temperature control and socket device equipped therewith

[0001] The present invention relates to a socket device for semiconductor testing, and more particularly, to a semiconductor testing cover capable of individual temperature control and a socket device having the same.

[0002] Typically, surface-mount semiconductor packages, such as IC devices, are comprised of LGA (Land Grid Array), BGA (Ball Grid Array), and CSP (Chip Sized Package) types, and these undergo testing to ensure reliability before being shipped to customers. For example, a burn-in test, as described above, applies a higher temperature and voltage than normal operating conditions to a semiconductor package before it is applied to the electronic device, thereby checking whether the semiconductor package satisfies those conditions.

[0003] In the case of existing semiconductor package test devices, the durability and reliability of the semiconductor package are generally verified during the test process by mounting the semiconductor package in a test socket, connecting it to a DUT (Device under Test) board, and then performing the test. Such a burn-in socket may include a base having a central opening, a cover that is movably connected to the base with an elastic member in between, a contact complex that is inserted into the opening of the base and has a plurality of contact pins, a latch that moves to an open and support position according to the vertical movement of the cover, and an adapter that is mounted on the base and on which the semiconductor package is placed. For example, in the case of a burn-in test, the test is performed by electrically connecting to the test board at a high temperature of around 120°C.

[0004] However, since the semiconductor test socket devices according to the prior art are of the clamshell type and have hinges on both sides and are locked and pressed twice, the work must be done manually by workers, which requires a lot of time and money, and there was a problem that automation was impossible.

[0005] Furthermore, conventional semiconductor test socket devices are configured with heating wires connected to each socket. During burn-in testing, the temperature is uniformly raised to a certain level and then cool air is blown to dissipate the heat, maintaining the temperature within a certain range. However, this approach has led to problems such as inconsistent temperatures across sockets, depending on the direction of the cool air, resulting in test failures.

[0006] The present invention is intended to solve the above-mentioned problems, and an object of the present invention is to provide a semiconductor test cover capable of individually controlling the temperature of each socket, and a socket device having the cover.

[0007] Another object of the present invention is to provide a semiconductor test cover and a socket device having the same, which are capable of individually controlling temperature, thereby increasing the convenience of operation even during manual operation and enabling the design of a mechanism for automatic operation by locking the cover by a downward operation rather than a hinge rotation and performing a pressurizing operation by rotation.

[0008] The tasks of the present invention are not limited to the tasks mentioned above, and other tasks not mentioned will be clearly understood by those skilled in the art to which the present invention pertains from the description below.

[0009] According to one aspect of the present invention, a semiconductor test cover capable of individual temperature control is provided, comprising: a cover body; a pair of latches installed on both sides of the cover body via a hinge axis and having hooks formed at ends; a pressurizing bolt screwed through the cover body to be able to rise and fall; and a heat transfer plate installed to be able to rise and fall on the cover body and pressed by the pressurizing bolt to pressurize a semiconductor element and mutually transfer heat so as to control the individual temperature of the semiconductor element.

[0010] At this time, a handle fixed to the pressurizing bolt may be included so that the pressurizing bolt can be manually operated.

[0011] At this time, the heat transfer plate may include an elastic means that provides elasticity so that it adheres to the cover body.

[0012] At this time, a packing member provided to wrap the heat transfer plate may be included on one surface of the cover body.

[0013] At this time, the heat transfer plate may have a first region that closely corresponds to the semiconductor element, and a second region that extends outward from the first region and does not closely correspond to the semiconductor element.

[0014] At this time, a stop pin may be included that is fixed to one end of the cover body and prevents the pressurizing bolt from descending above a certain height.

[0015] According to one aspect of the present invention, a semiconductor test socket device capable of individual temperature control is provided, comprising: a cover having a heat transfer plate coupled from an upper portion of a semiconductor element and pressurized and in close contact with the semiconductor element to perform heat transfer; a base body having a mounting hole formed therein for mounting the semiconductor element to support the semiconductor element and fixed to a board for testing; a pin block installed in the mounting hole of the base body and having pogo pins penetrating therethrough for electrically connecting the board and the semiconductor element; and an additional block having heating fins and heat dissipation fins installed in contact with a second region of the heat transfer plate that is not in close contact with the semiconductor element so that a first region of the heat transfer plate and the semiconductor element are in close contact with each other to control the temperature of the semiconductor element by conduction.

[0016] At this time, the additional block may include a temperature sensor connected to the board so as to be able to measure the temperature by being connected to the heat transfer plate.

[0017] At this time, the additional block may include a resistance sensor connected to the board so as to be able to measure resistance by being connected to the heat transfer plate.

[0018] At this time, the cover is locked by being combined with the base body by a pair of latches provided on both sides, and the heat transfer plate can be lowered by a pressurizing bolt to pressurize the semiconductor element.

[0019] According to the above configuration, the semiconductor test cover and socket device having the cover, which can individually control temperature according to one aspect of the present invention, can individually detect the temperature of each socket and control it to an appropriate temperature, thereby enabling a burn-in test to be performed within an accurate temperature range.

[0020] According to another aspect of the present invention, a semiconductor test cover capable of individual temperature control and a socket device having the same can provide an accurate test environment by allowing a semiconductor element to be pressurized by a heat transfer plate, and a temperature sensor, a heating fin, and a heat dissipation fin to be connected to the heat transfer plate to enable rapid temperature control.

[0021] According to another aspect of the present invention, a semiconductor test cover capable of individual temperature control and a socket device having the same are simple to operate and can be automated because the pressurization of the semiconductor element and the heat transfer plate is implemented by lowering the cover and rotating the handle.

[0022] The effects of the present invention are not limited to the effects described above, and should be understood to include all effects that can be inferred from the detailed description of the present invention or the composition of the invention described in the claims.

[0023] FIG. 1 is a plan view of a semiconductor test socket device capable of individual temperature control according to one embodiment of the present invention.

[0024] FIG. 2 is a perspective view of a semiconductor test socket device capable of individual temperature control according to one embodiment of the present invention.

[0025] Figure 3 is a cross-sectional view taken along line AA shown in Figure 2.

[0026] Figure 4 is a cross-sectional view taken along line BB shown in Figure 2.

[0027] FIG. 5 is a separated perspective view of a cover and a base of a semiconductor test socket device capable of individual temperature control according to one embodiment of the present invention.

[0028] FIG. 6 is a bottom perspective view of a semiconductor test cover capable of individual temperature control according to one embodiment of the present invention.

[0029] FIG. 7 is a perspective view of the base of a semiconductor test socket device capable of individual temperature control according to one embodiment of the present invention.

[0030] FIG. 8 is an exploded perspective view of a semiconductor test cover capable of individual temperature control according to one embodiment of the present invention.

[0031] Hereinafter, with reference to the attached drawings, embodiments of the present invention will be described in detail so that those skilled in the art can easily practice the present invention. The present invention may be implemented in various different forms and is not limited to the embodiments described herein. To clearly explain the present invention, parts irrelevant to the description are omitted in the drawings, and the same reference numerals designate identical or similar components throughout the specification.

[0032] The words and terms used in this specification and claims should not be construed as limited to their ordinary or dictionary meanings, but should be interpreted in a way that is consistent with the technical idea of ​​the present invention, in accordance with the principles by which the inventor can define terms and concepts in order to best explain his or her invention.

[0033] Therefore, the embodiments described in this specification and the configurations illustrated in the drawings correspond to a preferred embodiment of the present invention, and do not represent all of the technical ideas of the present invention, so there may be various equivalents and modified examples that can replace the configuration at the time of filing of the present invention.

[0034] In this specification, terms such as “include” or “have” are intended to describe the presence of a feature, number, step, operation, component, part or combination thereof described in the specification, but should be understood not to exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.

[0035] When a component is said to be "in front of," "behind," "above," or "below" another component, unless otherwise specified, it includes not only being placed "in front of," "behind," "above," or "below" the other component in direct contact with it, but also if another component is placed between them. Furthermore, when a component is said to be "connected" to another component, unless otherwise specified, it includes not only being directly connected to one another, but also being indirectly connected to one another.

[0036] Hereinafter, a semiconductor test cover capable of individual temperature control and a socket device (1) equipped therewith according to an embodiment of the present invention will be described with reference to the drawings.

[0037] A semiconductor test socket device (1) capable of individual temperature control according to one embodiment of the present invention may include a socket (100) composed of a cover (110) and a base (120) and a board (10).

[0038] At this time, the cover (110) may include a cover body (115), a pair of latches (116), a pressurizing bolt, and a heat transfer plate.

[0039] At this time, the cover body (115) is formed in a roughly rectangular shape, and a hinge axis (116a) can be assembled with a latch (116) on both sides. Of course, a torsion spring is added to the hinge axis (116a) so that the latch (116) has rotational elasticity in the direction in which it is locked.

[0040] At this time, a nut hole (115a) is formed in the center of the cover body (115), and a pressurizing bolt (112) can be screwed into the nut hole (115a). Accordingly, as the pressurizing bolt (112) rotates, the pressurizing bolt (112) is raised and lowered relative to the cover body (115) in accordance with the direction of rotation.

[0041] At this time, a plurality of through holes (115c) are formed in the cover body (115), and a spring bolt (113) is installed to pass through the through holes (115c), and a spring (114) can be installed between the head of the spring bolt (113) and the jaw of the through hole (115a) to be caught on the jaw. At this time, the end of the spring bolt (113) is fixed by screwing it to the receiving block (118). Therefore, the receiving block (118) is always subjected to a force so as to be in close contact with the cover body (115) by the elastic force of the spring (114).

[0042] The above pair of latches (116) may be installed on both sides of the cover body (115) via a hinge axis (116a) and may have a hook (116b) formed at the end.

[0043] At this time, the hook (116b) of the latch (116) is caught on the catch (121b) of the base body (121), so that the base body (121) and the cover body (115) can be combined.

[0044] A handle (111) fixed to the pressurizing bolt (113) may be included so that the pressurizing bolt (113) can be manually operated.

[0045] At this time, the handle (111) is formed so that it can be turned by hand, and the handle (111) is fixed by being connected to the pressurizing bolt (112) with several bolts. Therefore, when the handle (111) is held and turned, the pressurizing bolt (112) rotates.

[0046] The cover body (115) may include a stop pin (115b) that is fixed at one end and prevents the pressurizing bolt (112) from descending above a certain height.

[0047] At this time, the stop pin (115b) is partially inserted into the groove of the cover body (115) and its height is fixed, and a stop groove (11a) is formed in the handle (111), so that when the handle (111) and the pressure bolt (112) are lowered above a certain height, the end of the stop pin (115b) is caught on the end of the stop groove (111a) and prevents further lowering. Of course, the stop groove (111a) may be formed in the shape of an annular groove in the handle (111).

[0048] The above-mentioned pressurizing bolt (112) can be screw-connected to be able to be raised and lowered by penetrating the cover body (115), and the head portion is fastened and fixed by the handle (111) and bolts, and the screw portion (112a) is screw-connected to the nut hole (115c) of the cover body (115). Therefore, when the pressurizing bolt (112) rotates relative to the cover body (115), it operates to be raised and lowered relative to the cover body (115) according to the direction of rotation.

[0049] The heat transfer plate (119) is installed so as to be able to move up and down on the cover body (115) and is pressed by the pressurizing bolt (112) to pressurize the semiconductor element (2) and mutual heat transfer can be achieved so as to control the individual temperature of the semiconductor element (2).

[0050] At this time, the heat transfer plate (119) may have a first region (1191) that closely corresponds to the semiconductor element (2), and may have a second region (1192) that extends outward from the first region (1191) and does not closely correspond to the semiconductor element (2).

[0051] At this time, the heat transfer plate (119) can be made of a metal with high thermal conductivity.

[0052] At this time, the heat transfer plate (119) can be pressed into the first region (1191) to be in close contact with the semiconductor element (2) to enable heat transfer, and a heating fin (123a) and a heat dissipation fin (123b) can be connected to the second region (1192) that is not in close contact with the semiconductor element (2), and a resistance sensor (123c) and a temperature sensor (123d) can be connected to the second region (1192).

[0053] At this time, resistance and temperature are detected in the second region (1192), and the heating fins (123a) and the heat dissipation fins (123b) are controlled according to the signals, thereby enabling the temperature of the heat transfer plate (119) to be controlled within a certain temperature range. As a result, the temperature of each individual socket (100) can be controlled.

[0054] One surface of the cover body (115) may include a packing member configured to wrap the heat transfer plate (119).

[0055] At this time, the packing member may be a rubber packing (117) made of rubber material.

[0056] When the cover (110) is fastened to the base (120) and pressurized and heated while the rubber packing (117) is installed to surround the heat transfer plate (119) in this manner and a test is performed, the semiconductor element (2) and the heat transfer plate (119) are isolated from the outside and insulated and sealed during the process, so that high thermal efficiency and rapid temperature control can be achieved at the same time.

[0057] The above base (120) may include a base body (121), a pin block (122), and an additional block (123).

[0058] The above base body (121) has a mounting hole (121a) formed in which the semiconductor element (2) is mounted, a pin block (122) is installed, and supports the semiconductor element (2) and can be fixed to a board (10) for testing.

[0059] At this time, the base body (121) can be formed in a plate-like shape on a roughly rectangular surface.

[0060] At this time, a hook (121b) is formed on the side of the base body (121) so that the hook (116b) of the latch (116) can be caught. The hook (121b) may be formed by cutting the body (121) so that a portion thereof forms a section.

[0061] The above pin block (122) is installed in the mounting hole (121a) of the base body (121), and pogo pins that electrically connect the board (10) and the semiconductor element (2) can be installed through it.

[0062] At this time, when the semiconductor element (2) is provided on the upper surface of the pin block (122), the height between the mounting hole (121a) and the upper surface of the pin block (122) is spaced apart to form a groove, so that the semiconductor element (2) is mounted at an accurate position, and each pogo pin can be connected to the semiconductor element (2) at an accurate position.

[0063] In order to control the temperature of the semiconductor element (2) by conduction by bringing the first region (1191) of the heat transfer plate (119) and the semiconductor element (2) into close contact, the additional block (123) may be provided with heating fins (123a) and heat dissipation fins (123b) that come into contact with the second region (1192) of the heat transfer plate (119) that is not in close contact with the semiconductor element (2).

[0064] At this time, additional blocks (123) can be provided on each side of the pin block (122), and the second region (1192) of the heat transfer plate (119) can be precisely coupled to the upper part of each additional block (123).

[0065] At this time, a heating fin joining groove (119b) and a heat dissipation fin joining groove (119a) may be formed in the heat transfer plate (119) to partially accommodate the heating fin (123a) and the heat dissipation fin (123b).

[0066] At this time, a joining groove (119c) may be formed in the heat transfer plate (119) so that a pin for measuring resistance and a pin for measuring temperature can be connected to each of the second region (1192).

[0067] At this time, the heating fin (123a) is connected to the board (10) and can be heated by resistance heat, and as a result, the entire heat transfer plate (119) can be quickly heated.

[0068] At this time, the heat dissipation fin (123b) is also connected to the board (10) and the thermoelectric semiconductor for heat dissipation of the board (10), so that heat dissipation of the heat transfer plate (119) can be quickly performed.

[0069] Finally, the current state of the heat transfer plate (119) is detected through the temperature sensor (123d) and the resistance sensor (123c), and the temperature of the heat transfer plate (119) can be quickly reached to a constant temperature suitable for a burn-in test using the heating fin (123a) and the heat dissipation fin (123b) and controlled within a constant temperature range.

[0070] Referring to FIG. 1, a plan view of a semiconductor test socket device capable of individual temperature control according to one embodiment of the present invention is illustrated.

[0071] In the illustrated embodiment, the socket device (1) may be provided in the form of a tray, and the sockets (100) are electrically and physically connected and fixed to the board (1).

[0072] At this time, the cover (110) is connected to the base (120) by a latch (116), and can be quickly separated from each other by pressing the latch (116). Conversely, the separated cover (110) can also be quickly connected by pressing from the top of the base (120).

[0073] At this time, the latch (116) of the cover (110) slides down the side of the base (120) and when it reaches the hook (121b) of the base body (121), the hook (116b) moves inside the hook (121b) by the elastic force of the torsion spring, and the cover (110) is coupled to the base (120). Then, when the handle (111) is turned, the heat transfer plate (119) presses and seals the semiconductor element (2), creating a condition for performing a test operation.

[0074] Here, each socket (100) is individually temperature-controlled by each heating fin (123a) and heat dissipation fin (123b) as described above. Therefore, the problem of defects due to temperature unevenness that occurs when the temperature is controlled overall by conventional cold air, etc., can be solved.

[0075] Referring to FIG. 2, a perspective view of a semiconductor test socket device capable of individual temperature control according to one embodiment of the present invention is illustrated.

[0076] In the illustrated embodiment, a cover (110) is coupled to a base (120) via a latch (116) in an individual socket (100).

[0077] At this time, a latch (116) is connected to the cover body (115) by a hinge axis (116a), and the hook (116b) of the latch (116) is provided with elastic force in the inner direction of the cover body (115). Therefore, when the cover body (115) moves toward the base body (121), the end of the hook (116b) is caught by the base body (121) and spreads outward, and when the hook (116b) reaches the hooking portion (121b) of the base body (121), it rotates toward the hooking portion (121b) by the elastic force, so that the hook (116b) is locked to the hooking portion (121b).

[0078] Conversely, when the opposite end of the hook (116b) of the latch (116) is pressed, the hook (116b) can be released from the catch (121b) while overcoming the elastic force, and the cover (110) and the base (120) can be separated.

[0079] Since the operation can be performed by lowering the cover (110) relative to the base (120) and rotating the handle (111), it is easier to work with than the existing two-stage hinge rotation, and can be more advantageous in terms of automation.

[0080] Of course, when the handle (111) is turned while the cover (110) and the base (120) are connected by the latch (116), the heat transfer plate (119) presses the semiconductor element (2) and comes into contact with it, and the condition for performing a burn-in test is satisfied.

[0081] In this ready state, temperature control is performed by detection of the temperature sensor (123d) and resistance sensor (123c) and the heating pin (123a) and heat dissipation pin (123b) and a burn-in test can be performed by the pogo pin.

[0082] Referring to Fig. 3, a cross-sectional view taken along line AA shown in Fig. 2 is shown.

[0083] In the illustrated embodiment, the cover (110) and the base (120) are coupled by the latch (116), and the pressurizing bolt (112) is rotated via the handle (111), thereby lowering the receiving block (118) and the heat transfer plate (119) and pressing them into close contact with the semiconductor element (2).

[0084] At this time, since the additional block (123) is also in close contact with the second region (1192) of the heat transfer plate (119), the heat transfer plate (119) can be heated or dissipated by the heating fin (123a) and the heat dissipation fin (123b). In addition, the temperature sensor (123d) and the resistance sensor (123c) can be in close contact with the heat transfer plate (119) to detect the status.

[0085] At this time, since the cover body (115) is in close contact with the base body (121) and the rubber packing (117) is placed between them, the internal heat transfer plate (119), semiconductor element (2), fin block (122), and additional block (123) are sealed. Therefore, rapid heat transfer and temperature control can be achieved due to the insulation effect.

[0086] Referring to Fig. 4, a cross-sectional view taken along the BB line shown in Fig. 2 is shown.

[0087] As shown, the receiving block (118) that receives the heat transfer plate (119) is shown to be provided with a force to be pressed toward the cover body (115) by the elastic force of the spring (114).

[0088] At this time, a plurality of through holes (115c) are formed in the cover body (115), and a spring bolt (113) can pass through each through hole (115c) and then be bolted to the receiving block (118).

[0089] At this time, a jaw is formed in the through hole (115c) of the cover body (115), and a spring (114) is installed between the jaw and the head of the spring bolt (113).

[0090] Accordingly, as shown, when the pressurizing bolt (112) is lowered and the receiving block (118) is pressed, the spring bolt (113) is lowered together with the receiving block (118) and the spring (114) is compressed.

[0091] Conversely, when the pressurizing bolt (112) rises, the receiving block (118) rises by the elastic force of the spring (114) and returns to its original position.

[0092] Referring to FIG. 5, a separated perspective view of a cover and a base of a semiconductor test socket device capable of individual temperature control according to one embodiment of the present invention is illustrated.

[0093] As shown, when the upper cover (110) is lowered toward the lower base (120), the latch (116) is lowered, and the hook (116b) of the latch (116) is caught on the hook (121b) of the base body (121), so that the cover (110) can be coupled to the base (120).

[0094] At this time, when the hook (116b) of the latch (116) is caught on the hook (121b) of the base body (121), the cover body (115) and the base body (121) are in close contact with each other, and the space where the heat transfer plate (119) and the semiconductor element (2) are located is sealed by the rubber packing (117), enabling insulation.

[0095] Since the burn-in test of the semiconductor element (2) is performed in this insulating state, rapid individual temperature control is possible.

[0096] At this time, when the hook (116b) is caught on the catch (121b) and the handle (111) is turned, the pressurizing bolt (112) pressurizes the heat transfer plate (119), which ultimately pressurizes the semiconductor element (2), and even in this state, the test space can be maintained in an insulated state by the rubber packing (117).

[0097] Referring to FIG. 6, a bottom perspective view of a semiconductor test cover capable of individual temperature control according to one embodiment of the present invention is illustrated.

[0098] As shown, the cover (110) has a structure in which a heat transfer plate (119) is pressed against a cover body (115) by the elastic force of a spring (114).

[0099] At this time, a plurality of spring bolts (113) pass through the through hole (115c) in the cover body (115) and the ends are screwed to the receiving block (118). Here, a spring (114) is installed between the head of the spring bolt (113) and the step of the through hole (115c) to provide elasticity.

[0100] At this time, the heat transfer plate (119) can be fixed to the receiving block (118) via a cross frame (118a). That is, the heat transfer plate (119) and the cross frame (118a) are fastened to and fixed to the receiving block (118). Therefore, when the receiving block (118) is pressurized, the heat transfer plate (119) and the cross frame (118a) are also pressurized to press the semiconductor element (2).

[0101] At this time, the cross frame (118a) can prevent the receiving block (118) and the heat transfer plate (119) from bending when pressurized, thereby allowing the heat transfer plate (119) to pressurize the semiconductor element (2) and also to firmly adhere to the additional block (123).

[0102] At this time, a first region (1191) and a second region (1192) are formed in the heat transfer plate (119), and a heating fin coupling groove (119b) into which a heating fin (123a) and a heat dissipation fin (123b) are inserted, and a heat dissipation fin coupling groove (119a) is formed in the second region (1192) on the opposite side, and a groove (119c) into which a temperature sensor is inserted is formed, and a resistance sensor can also be in close contact with the second region (1192).

[0103] At this time, the receiving block (118) can be pressed by the pressurizing block (112) while being provided with elastic force. That is, it can be separated from the cover body (115) by the pressurizing bolt (112) while having an elastic force that allows it to be pressed against the cover body (115), and when the pressing force of the pressurizing bolt (112) is removed, it can be pressed against the cover body (115) again by the elastic force.

[0104] Accordingly, the operation of the heating fin (123a) and the heat dissipation fin (123b) can be controlled based on the temperature information detected by the temperature sensor (123d) and the resistance information detected by the resistance sensor (123c).

[0105] Referring to FIG. 7, a perspective view of the base of a semiconductor test socket device capable of individual temperature control according to one embodiment of the present invention is illustrated.

[0106] As shown, the base (120) has a pin block (122) for testing installed in a mounting hole (121a) at the center, and a mounting groove in which a semiconductor element (2) is mounted is formed by the step between the pin block (122) and the base body (121).

[0107] At this time, additional blocks (123) are installed on both sides of the pin block (122), and a heating fin (123a), a heat dissipation fin (123b), a temperature sensor (123d), and a resistance sensor (123c) connected to the board (10) can be installed on the additional blocks (123).

[0108] At this time, when the semiconductor element (2) is placed on the upper part of the pin block (122) and pressurization is completed, the pogo pins of the pin block (122) are connected to the designated positions of the semiconductor element (2) and a test is performed.

[0109] Here, the semiconductor element (2) is in a state of being pressurized by the heat transfer plate (119), so it is in close contact with the heat transfer plate (119) and heat transfer can be achieved quickly.

[0110] Accordingly, the burn-in test can be stably implemented by quickly controlling the temperature of the heat transfer plate (119) by the heating fin (123a) and the heat dissipation fin (123b).

[0111] Referring to FIG. 8, an exploded perspective view of a semiconductor test cover capable of individual temperature control according to one embodiment of the present invention is shown.

[0112] As shown, a hinge axis (116a) is installed on both sides of the cover body (115), and a latch (116) is installed on each hinge axis (116a).

[0113] At this time, a pressurizing bolt (112) is screwed into the center of the cover body (115) so that it can be raised and lowered, and the pressurizing bolt (112) is fastened by a fastening member so that it can rotate together with the handle (111) and rotates together.

[0114] At this time, a spring bolt (113) and a spring (114) are installed in the through hole (115c) at each corner of the cover body (115), and the spring bolt (113) is respectively fastened to the receiving block (118), so that the receiving block (118) is pressed against the cover body (115) by the elastic force of the spring (114).

[0115] At this time, a cross-shaped frame (118a) and a heat transfer plate (119) are fastened and assembled to the receiving block (118), and a rubber packing (117) is fixed to the cover body (115) so as to insulate the space in which the heat transfer plate (119) is installed.

[0116] Accordingly, referring to FIG. 7, when the semiconductor element (2) is seated in the seating hole (121a) of the base (120), the cover (110) is lowered from the upper portion of the base (120) and the latch (116) is caught in the catching groove (121b) of the base body (121), the cover (110) and the base (120) are coupled.

[0117] At this time, when the handle (111) is rotated, the pressurizing bolt (112) presses the receiving block (118), and as a result, the heat transfer plate (119) presses the semiconductor element (2).

[0118] At this time, by operating the heating fins (123a) and the heat dissipation fins (12b) according to a set program based on the temperature information and resistance information measured in the second area (1192) through the additional block (123), the temperature of the heat transfer plate (119) is controlled, thereby quickly controlling the temperature of the semiconductor element (2) within a certain range, and then a test can be performed.

[0119] Here, even during the test, the heating fin (123a) and the heat dissipation fin (123b) can be operated according to the input information to continuously maintain the semiconductor element (2) within an accurate temperature range, and the test can be performed.

[0120] Although the embodiments of the present invention have been described, the spirit of the present invention is not limited to the embodiments presented in this specification, and those skilled in the art who understand the spirit of the present invention will be able to easily propose other embodiments by adding, changing, deleting, or adding components within the scope of the same spirit, but this will also be considered to fall within the spirit of the present invention.

[0121] The present invention can be applied to a device for inspecting semiconductors.

Claims

1. Cover body; A pair of latches installed on both sides of the cover body via a hinge axis and having hooks formed at the ends; A pressurizing bolt that is screwed through the cover body to enable it to be raised and lowered; and A heat transfer plate that is installed in a movable manner on the cover body and presses the semiconductor element by the pressurizing bolt and mutually transfers heat to control the individual temperature of the semiconductor element; Semiconductor test cover with individual temperature control.

2. In paragraph 1, Including a handle fixed to the pressurizing bolt so that the pressurizing bolt can be manually operated, Semiconductor test cover with individual temperature control.

3. In paragraph 1, Including an elastic means that provides elasticity so that the heat transfer plate is pressed against the cover body. Semiconductor test cover with individual temperature control.

4. In paragraph 1, Including a packing member provided to wrap the heat transfer plate on one side of the cover body, Semiconductor test cover with individual temperature control.

5. In paragraph 1, The above heat transfer plate has a first region that is in close contact with the semiconductor element, and a second region that extends outward from the first region and is not in close contact with the semiconductor element. Cover for semiconductor testing with individual temperature control.

6. In paragraph 1, A stop pin is fixed to the cover body and prevents the pressurizing bolt from descending above a certain height. Semiconductor test cover with individual temperature control.

7. A cover having a heat transfer plate that is bonded from the top of the semiconductor element and pressurized to the semiconductor element to conduct heat transfer; A base body having a mounting hole formed to support the semiconductor element and fixed to a board for testing; A pin block installed in a mounting hole of the base body and having pogo pins penetrating therethrough for electrically connecting the board and the semiconductor element; and An additional block including a heating fin and a heat dissipation fin that are in contact with a second region of the heat transfer plate that is not in contact with the semiconductor element so that the first region of the heat transfer plate and the semiconductor element are in contact with each other to control the temperature of the semiconductor element through conduction; Semiconductor test socket device with individual temperature control.

8. In paragraph 7, A temperature sensor installed in the above-mentioned additional block and connected to the board so as to measure temperature by being connected to the heat transfer plate; Semiconductor test socket device with individual temperature control.

9. In paragraph 7, A resistance sensor installed in the above-mentioned additional block and connected to the board so as to measure resistance by being connected to the heat transfer plate, Semiconductor test socket device with individual temperature control.

10. In paragraph 7, The above cover is locked by being combined with the base body by a pair of latches provided on both sides, and the heat transfer plate is lowered by a pressurizing bolt to press the semiconductor element tightly. Semiconductor test socket device with individual temperature control.

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