Haptics assembly and haptics apparatus

Abstract

Disclosed are a haptics assembly and a haptics apparatus. The haptics assembly comprises: a flexible circuit board, which comprises a plurality of pad units arranged in an array, and a plurality of signal lines, wherein the plurality of pad units are divided into a plurality of pad unit rows extending in a row direction, and a plurality of pad unit columns extending in a column direction, the row direction intersecting the column direction, each pad unit is electrically connected to at least two signal lines, and at least one of the pad unit rows and the pad unit columns is electrically connected to the same signal line; and a plurality of piezoelectric actuators, which are electrically connected to the pad units.

Description

Haptic feedback assembly and haptic feedback device TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of haptic feedback, in particular to a haptic feedback assembly and a haptic feedback device. BACKGROUND

[0002] Haptics is the focus of current technology development, specifically, haptics can make the terminal interact with the human body through touch.

[0003] SUMMARY

[0004] The present disclosure provides a haptic feedback assembly and a haptic feedback device, and the specific solutions are as follows:

[0005] The present disclosure provides a haptic feedback assembly, which comprises:

[0006] The flexible circuit board comprises: a plurality of pad units arranged in an array, and a plurality of signal lines; the plurality of pad units are divided into: a plurality of pad unit rows extending in a row direction, and a plurality of pad unit columns extending in a column direction, the row direction and the column direction intersecting; each pad unit is electrically connected to at least two signal lines, and at least one of the pad unit rows and the pad unit columns is electrically connected to the same signal line;

[0007] The plurality of piezoelectric actuators are electrically connected to the pad units.

[0008] In some embodiments, each pad unit of the plurality of pad units comprises: a first pad and a second pad;

[0009] The piezoelectric actuator has a first lead-out structure and a second lead-out structure on one side facing the flexible circuit board; one of the first lead-out structure and the second lead-out structure is a positive lead-out structure, and the other of the first lead-out structure and the second lead-out structure is a negative lead-out structure; the first lead-out structure is electrically connected to the first pad, and the second lead-out structure is electrically connected to the second pad;

[0010] The plurality of signal lines comprise: a plurality of first signal lines and a plurality of second signal lines; the first signal lines are electrically connected to the first pads, and the second signal lines are electrically connected to the second pads;

[0011] At least one of the first signal lines and the second signal lines is electrically connected to the pad unit rows or the pad unit columns.

[0012] In some embodiments, the first signal lines are electrically connected to the first pads one by one;

[0013] All the second pads in each pad unit row are electrically connected to the same second signal line; or, all the second pads in each pad unit column are electrically connected to the same second signal line.

[0014] In some embodiments, the flexible circuit board further comprises: a plurality of driving pads located at one side of the plurality of pad units in the row direction;

[0015] The plurality of driving pads comprises: a plurality of first driving pads arranged along the column direction, and a second driving pad located at one side of the plurality of first driving pads; the first driving pads are electrically connected to the first signal lines one by one, and the second driving pad is electrically connected to the second signal line;

[0016] The plurality of first signal lines comprises a plurality of first signal line groups; the first signal lines included in the first signal line group are electrically connected to the first pads in the pad unit row one by one;

[0017] The first signal line comprises: a first part extending in the row direction, and a second part electrically connected to the first part and extending substantially in the column direction; the first part is electrically connected to the first driving pad, and the second part is electrically connected to the first pad;

[0018] The first part in the first signal line group is located at one side of the pad unit row electrically connected thereto in the column direction.

[0019] In some embodiments, in each pad unit row, the first part corresponding to the pad unit close to the side of the driving pad is closer to the pad unit row than the first part corresponding to the pad unit away from the side of the driving pad;

[0020] In each pad unit row in the row direction, the length of the first part electrically connected to the pad unit close to the side of the driving pad is less than the length of the first part electrically connected to the pad unit away from the side of the driving pad;

[0021] In each pad unit row in the row direction, the length of the second part electrically connected to the pad unit close to the side of the driving pad is greater than the length of the second part electrically connected to the pad unit away from the side of the driving pad.

[0022] In some embodiments, all the second pads in each pad unit row are electrically connected to the same second signal line; the driving pad comprises one second driving pad;

[0023] The plurality of signal lines further comprises: a third signal line electrically connected to the plurality of second signal lines;

[0024] The second signal line comprises: a third part electrically connected to the second pad in the pad unit row and extending in the row direction;

[0025] One of the second signal lines further comprises: a fourth part electrically connected to the third part and the second driving pad.

[0026] In some embodiments, the first part of the first signal line is located on one side of the pad cell row electrically connected thereto in a positive direction of the column direction;

[0027] The second signal line electrically connected with the last row of pad cell rows arranged in a negative direction of the column direction includes a fourth part, the fourth part being located on one side of the first part of the first signal line in a negative direction of the column direction; the positive direction of the column direction and the negative direction of the column direction are opposite directions in the column direction.

[0028] In some embodiments, the third signal line extends substantially along the column direction and is electrically connected with the second pad in one pad cell column.

[0029] In some embodiments, the flexible circuit board includes a flexible substrate, a first metal layer disposed on a side of the flexible substrate facing the piezoelectric actuator, and a second metal layer disposed on a side of the flexible substrate away from the first metal layer;

[0030] The first metal layer includes the pad cell, the drive pad, the first signal line, and the fourth part;

[0031] The second metal layer includes the third part and the third signal line;

[0032] The fourth part is electrically connected with the third part through a via hole penetrating the flexible substrate, and the third part and the third signal line are electrically connected with the second pad through the via hole penetrating the flexible substrate.

[0033] In some embodiments, all the second pads in each pad cell column are electrically connected with the same second signal line, and the second signal line extends along the column direction; the drive pad includes one second drive pad;

[0034] The plurality of signal lines further include a third signal line electrically connected with the plurality of second signal lines and the second drive pad;

[0035] The third signal line is located on one side of the first part of the first signal line in the column direction.

[0036] In some embodiments, the flexible circuit board includes a flexible substrate, a first metal layer disposed on a side of the flexible substrate facing the piezoelectric actuator, and a second metal layer disposed on a side of the flexible substrate away from the first metal layer;

[0037] The third signal line does not overlap with the first signal line in the orthographic projection of the flexible substrate; the first metal layer includes the pad cell, the drive pad, the first signal line, and the third signal line; the second metal layer includes the second signal line; the second signal line is electrically connected with the second pad through a via hole penetrating the flexible substrate; or,

[0038] The third signal line overlaps the first signal line in the orthographic projection of the flexible substrate; the third signal line comprises a fifth part extending substantially along the row direction and electrically connected with the second pads in one pad unit row, and a sixth part electrically connected with the fifth part and the second bonding pad; the fifth part overlaps the first signal line in the orthographic projection of the flexible substrate, and the sixth part does not overlap the first signal line in the orthographic projection of the flexible substrate; the first metal layer comprises the pad unit, the driving pad, the first signal line and the sixth part; the second metal layer comprises the fifth part and the second signal line; the second signal line and the fifth part are electrically connected with the second pad through the via hole penetrating the flexible substrate.

[0039] In some embodiments, all the first pads in each pad unit row are electrically connected with the same first signal line; all the second pads in each pad unit column are electrically connected with the same second signal line.

[0040] In some embodiments, the flexible circuit board further comprises a plurality of driving pads located on one side of the plurality of pad units in the row direction;

[0041] The plurality of driving pads comprises a plurality of first driving pads arranged along the column direction, and a plurality of second driving pads arranged along the column direction; the plurality of second driving pads are located on one side of the plurality of first driving pads in the column direction; the first driving pads are electrically connected with the first signal lines one by one, and the second driving pads are electrically connected with the second signal lines one by one;

[0042] The first signal line comprises a seventh part electrically connected with the first pads in the pad unit row and extending along the row direction;

[0043] The second signal line comprises an eighth part electrically connected with the second pads in the pad unit column and extending along the column direction, and a ninth part extending substantially along the row direction and electrically connected with the eighth part; the ninth part is electrically connected with the second driving pad.

[0044] In some embodiments, the ninth part of the plurality of second signal lines is located on one side of the plurality of first signal lines in the column direction;

[0045] The ninth part corresponding to the pad unit column close to the side of the driving pad is closer to the pad unit row than the ninth part corresponding to the pad unit column far from the side of the driving pad;

[0046] In the row direction, the length of the ninth part electrically connected with the pad unit column close to the side of the driving pad is smaller than the length of the ninth part electrically connected with the pad unit column far from the side of the driving pad.

[0047] In some embodiments, the flexible circuit board comprises: a flexible substrate, a first metal layer disposed on a side of the flexible substrate facing the piezoelectric actuator, and a second metal layer disposed on a side of the flexible substrate facing away from the first metal layer;

[0048] The first metal layer comprises: a pad unit, a driving pad, a plurality of first signal lines, and a ninth part;

[0049] The second metal layer comprises: an eighth part;

[0050] The eighth part is electrically connected to the ninth part through a via hole penetrating the flexible substrate, and the eighth part is electrically connected to the second pad through a via hole penetrating the flexible substrate.

[0051] In some embodiments, the haptic feedback assembly further comprises: a driving device bound to the plurality of driving pads;

[0052] The driving device comprises: an output end bound to the driving pad one by one.

[0053] The haptic feedback device provided by the embodiments of the present disclosure comprises:

[0054] The haptic feedback assembly provided by the embodiments of the present disclosure;

[0055] The touch display module is located on a side of the plurality of piezoelectric actuators facing away from the flexible circuit board; the touch display module comprises a display area, and the plurality of piezoelectric actuators are located in the orthographic projection of the touch display module on the display area; the orthographic projection of the plurality of piezoelectric actuators on the touch display module corresponds to a virtual keyboard area of the touch display module. BRIEF DESCRIPTION OF DRAWINGS

[0056] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings needed in the embodiment description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and other drawings can also be obtained by those skilled in the art without creative labor.

[0057] FIG. 1 is a structural schematic diagram of a haptic feedback assembly provided by an embodiment of the present disclosure;

[0058] FIG. 2 is a structural schematic diagram of another haptic feedback assembly provided by an embodiment of the present disclosure;

[0059] FIG. 3 is a sectional view along AA' in FIG. 1 provided by an embodiment of the present disclosure;

[0060] FIG. 4 is a sectional view along DD' in FIG. 1 provided by an embodiment of the present disclosure;

[0061] FIG. 5 is a structural schematic diagram of another haptic feedback assembly provided by an embodiment of the present disclosure;

[0062] FIG. 6 is a structural schematic diagram of a driving device according to an embodiment of the present disclosure;

[0063] FIG. 7 is a structural schematic diagram of another haptic feedback assembly according to an embodiment of the present disclosure;

[0064] FIG. 8 is a structural schematic diagram of another haptic feedback assembly according to an embodiment of the present disclosure;

[0065] FIG. 9 is a structural schematic diagram of another haptic feedback assembly according to an embodiment of the present disclosure;

[0066] FIG. 10 is a structural schematic diagram of another haptic feedback assembly according to an embodiment of the present disclosure;

[0067] FIG. 11 is a structural schematic diagram of another haptic feedback assembly according to an embodiment of the present disclosure;

[0068] FIG. 12 is a structural schematic diagram of another haptic feedback assembly according to an embodiment of the present disclosure;

[0069] FIG. 13 is a structural schematic diagram of another haptic feedback assembly according to an embodiment of the present disclosure;

[0070] FIG. 14 is a structural schematic diagram of another haptic feedback assembly according to an embodiment of the present disclosure;

[0071] FIG. 15 is a structural schematic diagram of another haptic feedback assembly according to an embodiment of the present disclosure;

[0072] FIG. 16 is a structural schematic diagram of a haptic feedback device according to an embodiment of the present disclosure;

[0073] FIG. 17 is a structural schematic diagram of another haptic feedback device according to an embodiment of the present disclosure;

[0074] FIG. 18 is a schematic diagram of a virtual keyboard area according to an embodiment of the present disclosure;

[0075] FIG. 19 is a schematic diagram of another virtual keyboard area according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0076] In order to make the objectives, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be described clearly and completely below with reference to the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, rather than all the embodiments of the present disclosure. And the embodiments in the present disclosure and the features in the embodiments can be combined with each other without conflict. Based on the described embodiments of the present disclosure, all other embodiments obtained by a person of ordinary skill in the art without creative labor fall within the scope of protection of the present disclosure.

[0077] Unless otherwise defined, technical terms or scientific terms used in the present disclosure shall have the meanings as understood by a person of ordinary skill in the art to which the present disclosure pertains. The terms "first", "second", and similar terms used in the present disclosure do not denote any order, quantity, or importance, but are used to distinguish different components. The terms "include", "comprise", and similar terms mean that the elements or objects before the terms encompass the elements or objects listed after the terms and equivalents thereof, and do not exclude other elements or objects. The terms "connect" or "connected" or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect.

[0078] It should be noted that the size and shape of the figures in the drawings do not reflect the true proportions, but only serve to illustrate the present disclosure. The same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout.

[0079] In the related art, more and more electronic devices use touch screens combined with virtual keyboard technology to replace traditional physical keyboards as a medium for display and human-computer interaction input information. Virtual keyboard technology enables users to directly input text into electronic devices through touch screens. The difference from physical keyboards is that when a user presses a key on a virtual keyboard, the finger cannot feel the feedback of the key, so it is difficult to perceive whether it is pressed correctly, and the screen still needs to be observed constantly, reducing the convenience of the electronic device. Therefore, it is necessary to add a tactile feedback function. Piezoelectric devices are one of the solutions to achieve the tactile feedback function of virtual keyboards. However, if each piezoelectric device is individually wired and connected to a control circuit to achieve individual control of each piezoelectric device, it will result in a large number of signal lines and complex wiring.

[0080] Therefore, the embodiments of the present disclosure provide a tactile feedback assembly, as shown in FIG. 1 and FIG. 2, which comprises:

[0081] The flexible circuit board 1 comprises: a plurality of pad units 101 arranged in an array, and a plurality of signal lines 102; the plurality of pad units 101 are divided into: a plurality of pad unit rows 3 extending along a row direction X, and a plurality of pad unit columns 4 extending along a column direction Y, the row direction X and the column direction Y intersect, and in FIG. 1, the row direction X and the column direction Y are perpendicular; each pad unit 101 is electrically connected to at least two signal lines 102, and at least one of the pad unit rows 3 and the pad unit columns 4 is electrically connected to the same signal line 102.

[0082] The plurality of piezoelectric actuators 2 are electrically connected to the pad units 101.

[0083] The haptic feedback assembly provided by the embodiments of the present disclosure can realize that at least two signal lines are electrically connected to the pad unit, and at least one of the pad unit row and the pad unit column is electrically connected to the same signal line, the number of signal lines can be reduced, the wiring difficulty can be reduced, and the wiring space can be saved by loading a driving signal on the signal line, selecting a piezoelectric actuator corresponding to one pad unit in the arrayed plurality of pad units to provide vibration excitation, compared with the case that each pad unit is separately wired.

[0084] It should be noted that FIG. 1 is a top view of the haptic feedback assembly, and FIG. 2 is a sectional view of the haptic feedback assembly. In FIG. 1, each piezoelectric actuator 2 corresponds to a position divided by a dashed box B1, that is, an area occupied by each piezoelectric actuator 2 on the flexible circuit board 1 is shown schematically. In a specific implementation, the lead-out structure of the piezoelectric actuator is welded to the pad unit by welding. Specifically, the lead-out structure is welded to the position of the dashed box in FIG. 1.

[0085] In some embodiments, the structure of the piezoelectric actuator is a piezoelectric film or a piezoelectric ceramic block. By using the piezoelectric film or the piezoelectric ceramic block, a voltage provided by the flexible circuit board to the piezoelectric actuator can directly provide vibration excitation. When the haptic feedback assembly is applied to a product such as a touch display, the resonance frequency of part of the product assembly can be used to make the structure produce ultrasonic vibration, so that the haptic feedback assembly produces a haptic feedback effect, and the haptic feedback can be adjusted through the piezoelectric film effect.

[0086] In some embodiments, the above-mentioned haptic feedback assembly provided by the embodiments of the present disclosure can be integrated in products such as notebooks and displays, and can be used as a display screen in many fields such as vehicle-mounted displays and consumer electronics to provide users with a rich and realistic haptic experience. The area where the plurality of piezoelectric actuators are arranged corresponds to a virtual key area of the display screen, and one piezoelectric actuator corresponds to one key of the virtual key area. When a user presses a key on the virtual keyboard, the piezoelectric actuator provides vibration excitation, so that the user can feel the feedback of the key, and can perceive whether the key is pressed correctly without observing the display screen, thereby improving the convenience of using the virtual key display product.

[0087] In some embodiments, as shown in FIG. 1, each pad unit 101 in the plurality of pad units 101 includes a first pad 1011 and a second pad 1012;

[0088] As shown in FIG. 2, one side of the piezoelectric actuator 2 facing the flexible circuit board 1 has a first lead-out structure 201 and a second lead-out structure 202; one of the first lead-out structure 201 and the second lead-out structure 202 is a positive lead-out structure, and the other of the first lead-out structure 201 and the second lead-out structure 202 is a negative lead-out structure; the first lead-out structure 201 is electrically connected to the first pad 1011, and the second lead-out structure 202 is electrically connected to the second pad 1012;

[0089] As shown in FIG. 1, the plurality of signal lines 102 includes a plurality of first signal lines 1021 and a plurality of second signal lines 1022; the first signal lines 1021 are electrically connected with the first pads 1011, and the second signal lines 1022 are electrically connected with the second pads 1012; at least one of the first signal lines 1021 and the second signal lines 1011 is electrically connected with the pad unit row 3 or the pad unit column 4.

[0090] The haptic feedback assembly provided by the embodiments of the present disclosure is characterized in that at least one of the first signal lines and the second signal lines is electrically connected with the pad unit row or the pad unit column, that is, all the first pads in a row of pad unit rows are electrically connected with the same first signal line, and / or all the second pads in a column of pad unit columns are electrically connected with the same second signal line; or all the first pads in a column of pad unit columns are electrically connected with the same first signal line, and / or all the second pads in a row of pad unit rows are electrically connected with the same second signal line. Thus, by applying a voltage to the first signal line and the second signal line electrically connected with the pad unit, the piezoelectric actuator corresponding to the pad unit can be made to provide vibration excitation.

[0091] It should be noted that the first pad 1011 is electrically connected with the positive electrode lead-out structure, and the second pad 1012 is electrically connected with the negative electrode lead-out structure, as an example for illustration in FIG. 1.

[0092] In some embodiments, the piezoelectric actuator further includes a positive electrode, a piezoelectric layer, and a negative electrode which are stacked; wherein the positive electrode is electrically connected with the positive electrode lead-out structure, and the negative electrode is electrically connected with the negative electrode lead-out structure.

[0093] In some embodiments, as shown in FIG. 3 and FIG. 4, the flexible circuit board 1 includes a flexible substrate 104, a first metal layer C1 arranged on the side of the flexible substrate 104 facing the piezoelectric actuator (not shown), and a second metal layer C2 arranged on the side of the flexible substrate 104 away from the first metal layer C1.

[0094] In specific implementation, when the first signal line and the second signal line have an overlap in the orthographic projection on the flexible substrate, and in the region where the first signal line and the second signal line have an overlap in the orthographic projection on the flexible substrate, one of the first signal line and the second signal line is located in the first metal layer, and the other is located in the second metal layer. That is, the haptic feedback assembly provided by the embodiments of the present disclosure has double-layer wiring on both sides of the flexible substrate, which can avoid mutual interference between different signal lines, reduce the wiring difficulty, and save the wiring space.

[0095] It should be noted that FIG. 3 is a cross-sectional view along AA' in FIG. 1, and FIG. 4 is a cross-sectional view along DD' in FIG. 1.

[0096] In some embodiments, the material of the flexible substrate includes, but is not limited to, PI (polyimide), PMMA (polymethyl methacrylate), PC (polycarbonate), PET (polyethylene terephthalate), PC / PMMA composite material, organic-inorganic composite material.

[0097] In some embodiments, as shown in FIG. 1, the flexible circuit board 1 further includes a plurality of driving pads 103. In specific implementation, the driving pads are used to input driving signals, and the piezoelectric actuator vibrates to generate haptic feedback under the excitation of the driving signals.

[0098] In some embodiments, as shown in FIG. 5, the haptic feedback assembly further includes a driving device 8 which is bound to the plurality of driving pads 103.

[0099] The driving device 8 includes an output end (not shown) which is bound to the driving pads 103 one by one.

[0100] In some embodiments, as shown in FIG. 6, the driving device 8 includes a microcontroller MCU, a digital-to-analog converter DAC, and an operational amplifier circuit 801.

[0101] The input end of the operational amplifier circuit 801 is electrically connected to the digital-to-analog converter DAC, and the output end of the operational amplifier circuit 801 is electrically connected to the driving pads 103 one by one.

[0102] The input end of the digital-to-analog converter DAC is electrically connected to the microcontroller MCU.

[0103] The microcontroller MCU is used to control the digital-to-analog converter DAC circuit to output a low-voltage driving signal to the operational amplifier circuit 801, and the operational amplifier circuit 801 is used to amplify and output a high-voltage haptic feedback driving signal. The high-voltage haptic feedback driving signal is transmitted to the signal line, the pad unit, and the piezoelectric actuator through the binding pad.

[0104] In some embodiments, the plurality of driving pads comprises: a first driving pad and a second driving pad; the first driving pad is electrically connected with the first signal line, and the second driving pad is electrically connected with the second signal line; the input end of the operational amplifier circuit comprises: a first output end electrically connected with the first driving pad in one-to-one correspondence, and a second output end electrically connected with the second driving pad in one-to-one correspondence. The first output end is used for outputting a first level signal, and the second output end is used for outputting a second level signal. If the first pad is electrically connected with the positive electrode lead-out structure and the second pad is electrically connected with the negative electrode lead-out structure, the first level signal is a high level signal, and the second level signal is a low level signal. If the first pad is electrically connected with the negative electrode lead-out structure and the second pad is electrically connected with the positive electrode lead-out structure, the first level signal is a low level signal, and the second level signal is a high level signal.

[0105] In some embodiments, as shown in FIG. 1, FIG. 7-FIG. 9, the first signal line 1021 is electrically connected with the first pad 1011 in one-to-one correspondence;

[0106] As shown in FIG. 1, FIG. 7, all the second pads 1012 in each pad unit row 3 are electrically connected with the same second signal line 1022; or as shown in FIG. 8, FIG. 9, all the second pads 1012 in each pad unit column 4 are electrically connected with the same second signal line 1022.

[0107] The tactile feedback assembly provided by the embodiments of the present disclosure is that all the second pads in each pad unit row are electrically connected with the same second signal line, that is, when a driving signal is loaded to the second signal line, all the second pads in the pad unit row input the driving signal; or all the second pads in each pad unit column are electrically connected with the same second signal line, that is, when a driving signal is loaded to the second signal line, all the second pads in the pad unit row input the driving signal. However, since the first signal line is electrically connected with the first pad in one-to-one correspondence, even if the driving signal is input to the pad unit row or the pad unit column, the piezoelectric actuator to be driven can be driven separately through the first signal line and the first pad, which can reduce the number of signal lines, save wiring space, and reduce wiring difficulty. When the user presses a key on the virtual keyboard, the piezoelectric actuator corresponding to the key and the pad unit are determined, a first level signal is loaded to the first signal line electrically connected with the pad unit, and only a second level signal is loaded to the second signal line electrically connected with the pad unit, so that only the piezoelectric actuator electrically connected with the pad unit can be driven to provide vibration excitation, thereby realizing individual control of the piezoelectric actuator to achieve tactile feedback of pressing the virtual key.

[0108] It should be noted that in FIG. 1 and FIG. 8, the first pad 1011 is electrically connected with the positive electrode lead-out structure, and the second pad 1012 is electrically connected with the negative electrode lead-out structure; in FIG. 7 and FIG. 9, the first pad 1011 is electrically connected with the negative electrode lead-out structure, and the second pad 1012 is electrically connected with the positive electrode lead-out structure.

[0109] In some embodiments, as shown in FIG. 1, FIG. 7-FIG. 9, in the pad unit row 3, all the first pads 1011 are located in the same row, all the second pads 1012 are located in the same row, and a row of first pads 1011 is located on one side of a row of second pads 1012 in the column direction Y;

[0110] In the pad unit column 4, all the first pads 1011 are located in the same column, all the second pads 1012 are located in the same column, and a column of first pads 1011 is located on one side of a column of second pads 1012 in the row direction X;

[0111] As shown in FIG. 1 and FIG. 8, when the first pad 1011 is electrically connected with the positive electrode lead-out structure, and the second pad 1012 is electrically connected with the negative electrode lead-out structure, a row of first pads 1011 is located on one side of a row of second pads 1012 in the positive direction Y+ (upper side in the figure) of the column direction Y, and a column of first pads 1011 is located on one side of a column of second pads 1012 in the negative direction (left side in the figure) of the row direction X. As shown in FIG. 7 and FIG. 9, when the first pad 1011 is electrically connected with the negative electrode lead-out structure, and the second pad 1012 is electrically connected with the positive electrode lead-out structure, a row of first pads 1011 is located on one side of a row of second pads 1012 in the negative direction Y- (lower side in the figure) of the column direction Y, and a column of first pads 1011 is located on one side of a column of second pads 1012 in the positive direction (right side in the figure) of the row direction X; wherein the positive direction Y+ of the column direction Y and the negative direction Y- of the column direction Y are opposite directions in the column direction Y.

[0112] In some embodiments, as shown in FIG. 1, FIG. 7-FIG. 9, the plurality of driving pads 103 are located on one side of the plurality of pad units 101 in the row direction X;

[0113] The plurality of driving pads 103 includes a plurality of first driving pads 1031 arranged in the column direction Y, and a second driving pad 1032 located on one side of the plurality of first driving pads 1031;

[0114] The plurality of first signal lines 1021 includes a plurality of first signal line groups 5; the first signal line 1021 included in the first signal line group 5 is electrically connected with the first pad 1011 in the pad unit row 3 in a one-to-one correspondence;

[0115] The first signal line 1021 comprises a first part 10211 extending along the row direction X and a second part 10212 electrically connected with the first part 10211 and extending along the column direction Y; the first part 10211 is electrically connected with the first driving pad 1031, and the second part 10212 is electrically connected with the first pad 1011.

[0116] The first part 10211 in the first signal line group 5 is located on one side of the pad unit row 3 electrically connected with the first part 10211 in the column direction Y.

[0117] It should be noted that extending along the column direction Y approximately means that the extending direction is not perpendicular to the column direction Y. For example, the second part 10212 can extend linearly along the column direction Y, or extend in a bent manner along the column direction Y, or have both linearly extending parts and bent extending parts along the column direction Y. For example, in FIGS. 1, 7-9, the second part 10212 has both linearly extending parts and parts having an angle with the column direction Y.

[0118] In the embodiments of the present disclosure, the plurality of driving pads are located on one side of the plurality of pad units in the row direction, and the plurality of first binding pads are arranged along the column direction and electrically connected with the first pads one by one, and the first signal line electrically connected with the first pad one by one extends from one side of the pad unit row along the row direction X and is electrically connected with the first binding pad arranged along the column direction, which is beneficial to fully utilizing the wiring space on one side of the plurality of pad unit groups.

[0119] In some embodiments, as shown in FIGS. 1, 7-9, the plurality of first driving pads 1031 are divided into a plurality of first driving pad groups 6, and the first driving pad 1031 in the first driving pad group 6 is electrically connected with the first signal line 1021 in the first signal line group 5 one by one. The plurality of first driving pad groups 6 are arranged along the column direction Y in sequence; and the first driving pad groups 6 are arranged with intervals.

[0120] In some embodiments, as shown in FIGS. 1, 7-9, in each pad unit row 3, the first part 10211 corresponding to the pad unit 101 close to the driving pad 103 is closer to the pad unit row 3 than the first part 10211 corresponding to the pad unit 101 far from the driving pad 103;

[0121] In the row direction X, in each pad unit row 3, the length of the first part 10211 electrically connected with the pad unit 101 close to the driving pad 103 is smaller than the length of the first part 10211 electrically connected with the pad unit 101 far from the driving pad 103;

[0122] In the row direction X, in each pad unit row 3, the length of the second part 10212 corresponding to the electrical connection of the pad unit 101 close to the driving pad 103 side is greater than the length of the second part 10212 corresponding to the electrical connection of the pad unit 101 away from the driving pad 103 side.

[0123] Thus, the multiple first signal lines corresponding to one pad unit row can be mutually interfered in the case of fully utilizing the wiring space of one side of the pad unit row.

[0124] When all the second pads in each pad unit row are electrically connected with the same second signal line, in some embodiments, as shown in FIG. 10, the driving pad 103 can include multiple second driving pads 1032, and the second signal line 1022 is electrically connected with the second driving pad 1032 one by one, that is, the second pads in different pad unit rows 3 can be controlled individually.

[0125] Alternatively, in some embodiments, as shown in FIG. 1 and FIG. 3, all the second pads 1012 in each pad unit row 3 are electrically connected with the same second signal line 1022; the driving pad 103 includes one second driving pad 1032;

[0126] The multiple signal lines 102 further include a third signal line 1023 electrically connected with the multiple second signal lines 1022;

[0127] The second signal line 1022 includes a third part 10221 electrically connected with the second pad 1012 in the pad unit row 3 and extending along the row direction X;

[0128] One of the second signal lines 1022 further includes a fourth part 10222 electrically connected with the third part 10221 and the second driving pad 1032.

[0129] That is, the multiple second signal lines are electrically connected through the third signal line, only one second driving pad is electrically connected with one of the second signal lines, so that the multiple second signal lines can input the same driving signal, the number of second binding pads and the number of signal lines extending to the binding pad area can be reduced, the wiring difficulty can be reduced, and the cost can be saved. Moreover, even if all the second pads input the same driving signal through the second signal line, since the first pad is independently driven, only the piezoelectric actuator corresponding to the touch position can be driven to provide vibration excitation, so that the piezoelectric actuator can be controlled individually to realize the haptic feedback of pressing the virtual button.

[0130] In some embodiments, as shown in FIG. 1 and FIG. 7, the first part 10211 in the first signal line group 5 is located on one side of the pad unit row 3 electrically connected therewith in the positive direction Y+ of the column direction Y;

[0131] The second signal line 1022 electrically connected with the last row of pad unit row 3 arranged in the negative Y direction of the column direction Y includes a fourth part 10222, and the fourth part 10222 is located on one side of the first part 10211 of the plurality of first signal lines 1021 in the negative Y direction of the column direction Y. Thus, the wiring difficulty can be reduced, and mutual interference between the signal lines can be avoided.

[0132] In some embodiments, as shown in FIG. 1, FIG. 7, the third signal line 1023 extends substantially along the column direction Y and is electrically connected with the second pad 1012 in one pad unit column 4. Thus, the length of the third signal line electrically connected with the plurality of second signal lines can be reduced, and the cost can be saved.

[0133] In some embodiments, as shown in FIG. 1, FIG. 3, FIG. 4, and FIG. 7, the first metal layer C1 includes the pad unit 101, the driving pad 103, the plurality of first signal lines 1021, and the fourth part 10222.

[0134] The second metal layer C2 includes the third part 10221 and the third signal line 1023.

[0135] The fourth part 10222 is electrically connected with the third part 10221 through a via (reference numeral 1042 in FIG. 4) penetrating the flexible substrate 104, and the third part 10221 and the third signal line 1023 are electrically connected with the second pad 1012 through a via (reference numeral 1041 in FIG. 4) penetrating the flexible substrate 104.

[0136] In specific implementation, the third signal line is integrally connected with the third part, the first signal line is integrally connected with the first pad and the first binding pad, and the fourth part is integrally connected with the second pad and the second binding pad.

[0137] In some embodiments, as shown in FIG. 7, the third part 10221 does not overlap with the first signal line 1021 in the orthographic projection of the flexible substrate 104, and the third signal line 1023 overlaps with the first signal line 1021 in the orthographic projection of the flexible substrate 104, that is, the third part 10221 does not interfere with the first signal line 1021.

[0138] Therefore, in some embodiments, as shown in FIG. 11, the second signal line 1022 is located in the first metal layer C1, and the third signal line 1023 is located in the second metal layer C2; the third signal line 1023 is electrically connected with the second pad 1012 through a via (not shown) penetrating the flexible substrate 104. The second signal line 1022 is integrally connected with the second pad 1012 and the second binding pad 1032.

[0139] When all the second pads in each pad unit column are electrically connected with the same second signal line, in some embodiments, as shown in FIG. 12, the driving pad 103 can include a plurality of second driving pads 1032, and the second signal line 1022 is electrically connected with the second driving pads 1032 one by one, that is, the second pads in different pad unit columns 4 can be controlled individually.

[0140] Alternatively, in some embodiments, as shown in FIG. 8 and FIG. 9, all the second pads 1012 in each pad unit column 4 are electrically connected with the same second signal line 1022, and the second signal line 1022 extends along the column direction Y; the driving pad 103 includes one second driving pad 1032.

[0141] The plurality of signal lines 102 further include a third signal line 1023 electrically connected with the plurality of second signal lines 1022 and the second driving pad 1032.

[0142] The third signal line 1023 is located on one side of the first part 10211 of the plurality of first signal lines 1021 in the column direction Y.

[0143] That is, the plurality of second signal lines are electrically connected through the third signal line, and only one second driving pad is electrically connected with one of the second signal lines, so that the plurality of second signal lines can input the same driving signal, the number of second binding pads and the number of signal lines extending to the binding pad area can be reduced, the wiring difficulty can be reduced, and the cost can be saved. Moreover, even if all the second pads input the same driving signal through the second signal line, since the first pads are independently driven, only the piezoelectric actuator corresponding to the touch position can be driven to provide vibration excitation, so that the piezoelectric actuator can be controlled individually to realize the tactile feedback of pressing the virtual button.

[0144] In some embodiments, as shown in FIG. 8, the third signal line 1023 does not overlap with the projection of the first signal line 1021 on the flexible substrate 104; the first metal layer C1 includes the pad unit 101, the driving pad 103, the plurality of first signal lines 1021, and the third signal line 1023; the second metal layer C2 includes the second signal line 1022; the second signal line 1022 is electrically connected with the second pad 1012 through a via (not shown) penetrating the flexible substrate 104.

[0145] In specific implementation, the third signal line is integrally connected with the second pad and the second binding pad, and the first signal line is integrally connected with the first pad and the first binding pad.

[0146] Alternatively, in some embodiments, as shown in FIG. 9, the third signal line 1023 overlaps the orthographic projection of the first signal line 1021 on the flexible substrate 104; the third signal line 1023 comprises a fifth part 10231 extending substantially along the row direction X and electrically connected with the second pads 1012 in one pad unit row 3, and a sixth part 10232 electrically connected with the fifth part 10231 and the second bonding pad 1032; the fifth part 10231 overlaps the orthographic projection of the first signal line 1021 on the flexible substrate 104, and the sixth part 10232 does not overlap the orthographic projection of the first signal line 1021 on the flexible substrate 104; the first metal layer C1 comprises the pad units 101, the driving pads 103, the first signal lines 1021 and the sixth part 10232; the second metal layer C2 comprises the fifth part 10231 and the second signal line 1022; the second signal line 1022 and the fifth part 10231 are electrically connected with the second pads 1012 through the via (not shown) penetrating the flexible substrate 104.

[0147] In specific implementation, the fifth part is integrally connected with the second signal line, the sixth part is integrally connected with the second bonding pad, and the first signal line is integrally connected with the first pad and the first bonding pad.

[0148] In some embodiments, as shown in FIG. 13 and FIG. 14, all the first pads 1011 in each pad unit row 3 are electrically connected with the same first signal line 1021; and all the second pads 1012 in each pad unit column 4 are electrically connected with the same second signal line 1022.

[0149] The haptic feedback assembly provided by the embodiments of the present disclosure is characterized in that all the second pads in each pad unit row are electrically connected to the same second signal line, that is, when a driving signal is loaded to the second signal line, all the second pads in the pad unit row input the driving signal; all the second pads in each pad unit column are electrically connected to the same second signal line, that is, when a driving signal is loaded to the second signal line, all the second pads in the pad unit row input the driving signal. However, since each pad unit row is independently controlled and each pad unit column is independently controlled, it is only necessary to determine the pad unit row and the pad unit column corresponding to the key to load the driving signal, so that the required pad unit and piezoelectric actuator can be located, and the required piezoelectric actuator can be driven individually, thereby further reducing the number of signal lines, saving wiring space, and reducing wiring difficulty. When a user presses a key on the virtual keyboard, the piezoelectric actuator and the pad unit corresponding to the key are determined, a first-level signal is loaded to the first signal line electrically connected to the pad unit, and a second-level signal is loaded to the second signal line electrically connected to the pad unit, so that only the piezoelectric actuator electrically connected to the pad unit is driven to provide vibration excitation, thereby realizing independent control of the piezoelectric actuator and realizing haptic feedback of pressing the virtual key.

[0150] It should be noted that in FIG. 13, the first pad 1011 is electrically connected to the positive electrode lead-out structure, and the second pad 1012 is electrically connected to the negative electrode lead-out structure; in FIG. 14, the first pad 1011 is electrically connected to the negative electrode lead-out structure, and the second pad 1012 is electrically connected to the positive electrode lead-out structure.

[0151] In some embodiments, as shown in FIGS. 13 and 14, the plurality of driving pads 103 includes a plurality of first driving pads 1031 arranged in the column direction Y and a plurality of second driving pads 1032 arranged in the column direction Y; the plurality of second driving pads 1032 is located on one side of the plurality of first driving pads 1031 in the column direction Y; the first driving pad 1031 is electrically connected to the first signal line 1021 one by one, and the second driving pad 1032 is electrically connected to the second signal line 1022 one by one.

[0152] The first signal line 1021 includes a seventh part 10213 electrically connected to the first pad 1011 in the pad unit row 3 and extending in the row direction X;

[0153] The second signal line 1022 includes an eighth part 10223 electrically connected to the second pad 1012 in the pad unit column 4 and extending in the column direction Y, and a ninth part 10224 extending substantially in the row direction X and electrically connected to the eighth part 10223; the ninth part 10224 is electrically connected to the second driving pad 1032.

[0154] In some embodiments, as shown in FIG. 13 and FIG. 14, the ninth part 10224 of the plurality of second signal lines 1022 is located on one side of the plurality of first signal lines 1021 in the column direction Y;

[0155] The ninth part 10224 corresponding to the pad unit column 4 close to the driving pad 103 is closer to the pad unit row 3 than the ninth part 10224 corresponding to the pad unit column 4 far from the driving pad 103;

[0156] In the row direction X, the length of the ninth part 10224 corresponding to the pad unit column 4 close to the driving pad 103 is smaller than the length of the ninth part 10224 corresponding to the pad unit column 4 far from the driving pad 103.

[0157] In some embodiments, as shown in FIG. 13 and FIG. 14, the first metal layer C1 includes the pad unit 101, the driving pad 103, the plurality of first signal lines 1021, and the ninth part 10224;

[0158] The second metal layer C2 includes the eighth part 10223;

[0159] The eighth part 10223 is electrically connected with the ninth part 10224 through the via penetrating the flexible substrate 104, and the eighth part 10223 is electrically connected with the second pad 1012 through the via (not shown) penetrating the flexible substrate 104.

[0160] In some embodiments, as shown in FIG. 13 and FIG. 14, the part of the first signal line 1021 includes a plurality of seventh parts 10213, and further includes a tenth part 10214 extending in the column direction Y and connecting two seventh parts 10213; the tenth part 10214 is located in the first metal layer C1.

[0161] The second signal line 1022 further includes an eleventh part 10225 extending in the column direction Y and electrically connected with the eighth part 10223 and the ninth part 10224; the eleventh part 10225 is located in the first metal layer C1.

[0162] In some embodiments, as shown in FIG. 1, in one pad unit column 4, there is no displacement in the row direction X between two adjacent pad units 101 in the column direction Y. Alternatively, as shown in FIG. 15, in at least part of the pad unit columns 4, there is displacement in the row direction X between part of two adjacent pad units 101 in the column direction Y.

[0163] Based on the same inventive concept, the embodiments of the present disclosure also provide a tactile feedback device, as shown in FIG. 16, which includes:

[0164] The tactile feedback assembly 9 provided by the embodiments of the present disclosure;

[0165] The touch display module 10 is located on the side of the plurality of piezoelectric actuators 2 away from the flexible circuit board 1. As shown in FIG. 17, the touch display module includes a display area 10-AA, and the plurality of piezoelectric actuators 2 are located in the orthographic projection of the touch display module 10 on the display area 10-AA. The orthographic projection of the plurality of piezoelectric actuators 2 on the touch display module 10 corresponds to a virtual keyboard area (not shown) of the touch display module 10.

[0166] The touch feedback device provided by the embodiments of the present disclosure includes the touch display module and the above-mentioned touch feedback assembly provided by the embodiments of the present disclosure. The plurality of piezoelectric actuators of the touch feedback assembly correspond to the virtual keyboard area of the touch display module, so that when a user presses a key on the virtual keyboard, the piezoelectric actuators are driven by the flexible circuit board to provide vibration excitation, so that the user can feel the feedback of the key pressing without observing the display screen, and can also perceive whether the key is pressed correctly, thereby improving the convenience of using the virtual key display product.

[0167] In some embodiments, as shown in FIG. 17, the touch display module further includes a peripheral area 10-NA surrounding the display area 10-AA, and the plurality of binding pads 103 are located in the orthographic projection of the touch display module on the peripheral area 10-NA.

[0168] In some embodiments, as shown in FIGS. 18 and 19, the virtual keyboard area includes a plurality of virtual keys 11. FIGS. 18 and 19 respectively show two different arrangements of the virtual keys 11.

[0169] In specific implementation, in the virtual keyboard area, one virtual key 11 can correspond to one piezoelectric actuator, or one virtual key 11 can correspond to a plurality of piezoelectric actuators. For example, each virtual key 11 in FIG. 18 and the virtual key 11 of English letters in FIG. 19 correspond to one piezoelectric actuator, and the virtual key 11 of space in FIG. 19 corresponds to a plurality of piezoelectric actuators.

[0170] In some embodiments, the touch feedback assembly and the touch display module are attached by adhesive material. The adhesive material is, for example, optical adhesive.

[0171] In some embodiments, the touch display module can be a liquid crystal display module or a self-luminous display module, which are not limited in the present disclosure. The liquid crystal display module includes a liquid crystal display panel and a backlight source, and the self-luminous display module is internally provided with a light-emitting device, which can be an organic light-emitting diode (OLED), a quantum dot light-emitting diode (QLED), a mini light-emitting diode (Mini LED), a micro light-emitting diode (Micro LED), or the like.

[0172] In a specific implementation, the touch display module further includes a touch electrode. If the touch display module is a liquid crystal display module, the common electrode included in the liquid crystal display module is multiplexed as the touch electrode. If the touch display module is a self-luminous display module, taking an OLED as an example, as shown in FIG. 15, the touch display module 10 includes a substrate 1001, a light-emitting device 1002 located on the side of the substrate 1001 facing away from the haptic feedback assembly 9, an encapsulation layer 1003 located on the side of the light-emitting device 1002 facing away from the substrate 1001, a touch electrode 1004 located on the side of the encapsulation layer 1003 facing away from the substrate 1001, and a cover plate 1005 located on the side of the touch electrode 1004 facing away from the substrate 1001.

[0173] Since the principle of solving the problem of the haptic feedback device is similar to that of the haptic feedback assembly, the implementation of the haptic feedback device can refer to the implementation of the aforementioned haptic feedback assembly, and the repeated parts will not be described herein. The haptic feedback device can be a mobile phone, a tablet computer, a smart wearable device (such as a smart watch), a vehicle-mounted display screen, or the like.

[0174] In a specific implementation, the haptic feedback device provided by the embodiments of the present disclosure can further include other functional structures known to those skilled in the art, which will not be described in detail herein.

[0175] In summary, the haptic feedback assembly and the haptic feedback device provided by the embodiments of the present disclosure can realize that at least one of the row of pad units and the column of pad units is electrically connected to the same signal line, so that the piezoelectric actuator corresponding to the selected one of the plurality of array-arranged pad units can be provided with vibration excitation by loading a driving signal on the signal line, and compared with the case of separately wiring each pad unit, the number of signal lines can be reduced, the wiring difficulty can be reduced, and the wiring space can be saved.

[0176] While the preferred embodiments of the application have been described, additional variations and modifications can be made to these embodiments by those skilled in the art once they have the benefit of the present disclosure. Therefore, the appended claims are intended to encompass all such variations and modifications as falling within the scope of the present application.

[0177] It is apparent that many modifications and variations of this disclosure can be effected although only a few have been chosen for illustration here. No portion thereof is intended to be dedicated to the public regardless of whether these modifications and variations fall within the scope of the application. It is intended that all per cent amounts, parts, and percentages are based on weight unless otherwise indicated. It is intended that all measurements, values, ratings, and other specifications are to be understood as modified in all instances by the term "about" unless otherwise indicated.

Claims

1. A haptic feedback component, wherein, include: The flexible circuit board includes: multiple pad units arranged in an array, and multiple signal lines; The plurality of pad units are divided into: a plurality of pad unit rows extending along the row direction and a plurality of pad unit columns extending along the column direction, wherein the row direction and the column direction intersect; each of the pad units is electrically connected to at least two of the signal lines, and at least one of the pad unit rows and the pad unit columns is electrically connected to the same signal line. Multiple piezoelectric actuators are electrically connected to the pad unit.

2. The haptic feedback component according to claim 1, wherein, Each of the plurality of pad units includes: a first pad and a second pad; The piezoelectric actuator has a first lead-out structure and a second lead-out structure on the side facing the flexible circuit board; one of the first lead-out structure and the second lead-out structure is a positive lead-out structure, and the other of the first lead-out structure and the second lead-out structure is a negative lead-out structure; the first lead-out structure is electrically connected to the first pad, and the second lead-out structure is electrically connected to the second pad; The plurality of signal lines include: a plurality of first signal lines and a plurality of second signal lines; the first signal lines are electrically connected to the first pad, and the second signal lines are electrically connected to the second pad; At least one of the first signal line and the second signal line is electrically connected to the pad cell row or the pad cell column.

3. The haptic feedback component according to claim 2, wherein, The first signal line is electrically connected to the first pad in a one-to-one correspondence; All second pads in each row of pad cells are electrically connected to the same second signal line; or, all second pads in each column of pad cells are electrically connected to the same second signal line.

4. The haptic feedback component according to claim 3, wherein, The flexible circuit board further includes: a plurality of driving pads located on one side of the plurality of pad units in the row direction; The plurality of driving pads includes: a plurality of first driving pads arranged along the column direction, and a second driving pad located on one side of the plurality of first driving pads; the first driving pads are electrically connected to the first signal lines in a one-to-one correspondence, and the second driving pads are electrically connected to the second signal lines; The plurality of first signal lines include a plurality of first signal line groups; the first signal lines included in the first signal line group are electrically connected to the first pads in the pad unit row one by one; The first signal line includes: a first portion extending along the row direction, and a second portion electrically connected to the first portion and extending substantially along the column direction; the first portion is electrically connected to the first drive pad, and the second portion is electrically connected to the first pad; The first portion of the first signal line group is located on one side of the row of pad cells electrically connected thereto in the column direction.

5. The haptic feedback component according to claim 4, wherein, In each row of pad cells, the first portion corresponding to the pad cell on the side closer to the driving pad is closer to the row of pad cells than the first portion corresponding to the pad cell on the side farther from the driving pad. In the row direction, in each row of pad cells, the length of the first part corresponding to the electrical connection of the pad cell on the side closer to the driving pad is less than the length of the first part corresponding to the electrical connection of the pad cell on the side farther from the driving pad. In the row direction, in each row of pad cells, the length of the second part corresponding to the electrical connection of the pad cell closer to the driving pad is greater than the length of the second part corresponding to the electrical connection of the pad cell farther from the driving pad.

6. The haptic feedback component according to claim 4 or 5, wherein, All second pads in each row of pad cells are electrically connected to the same second signal line; the driving pad includes one second driving pad; The plurality of signal lines also includes: a third signal line electrically connected to the plurality of second signal lines; The second signal line includes a third portion that is electrically connected to all the second pads in the row of pad cells and extends along the row direction; One of the second signal lines also includes a fourth part that is electrically connected to the third part and the second drive pad.

7. The haptic feedback component according to claim 6, wherein, The first portion of the first signal line group is located on one side of the row of pad cells that is electrically connected to it in the column direction, facing upwards. The second signal line electrically connected to the last row of pad cells arranged in the negative direction of the column direction includes the fourth part, which is located on one side of the first part of the plurality of first signal lines in the negative direction of the column direction; the positive direction of the column direction and the negative direction of the column direction are opposite directions in the column direction.

8. The haptic feedback component according to claim 6 or 7, wherein, The third signal line extends generally along the column direction and is electrically connected to the second pad in one of the pad unit columns.

9. The haptic feedback component according to any one of claims 6 to 8, wherein, The flexible circuit board includes: a flexible substrate, a first metal layer disposed on the flexible substrate facing the piezoelectric actuator, and a second metal layer disposed on the flexible substrate away from the first metal layer. The first metal layer includes: the pad unit, the drive pad, the plurality of first signal lines, and the fourth part; The second metal layer includes: the third part and the third signal line; The fourth part is electrically connected to the third part through a via penetrating the flexible substrate, and the third part and the third signal line are electrically connected to the second pad through a via penetrating the flexible substrate.

10. The haptic feedback component according to claim 4 or 5, wherein, All second pads in each of the pad unit columns are electrically connected to the same second signal line, which extends along the column direction; the driving pad includes one second driving pad. The plurality of signal lines also includes: a third signal line electrically connected to the plurality of second signal lines and the second drive pad; The third signal line is located on one side of the first portion of the plurality of first signal lines in the column direction.

11. The haptic feedback component according to claim 10, wherein, The flexible circuit board includes: a flexible substrate, a first metal layer disposed on the flexible substrate facing the piezoelectric actuator, and a second metal layer disposed on the flexible substrate away from the first metal layer. The orthographic projection of the third signal line onto the flexible substrate and the first signal line onto the flexible substrate The orthographic projections of the substrates do not overlap; the first metal layer includes: the pad unit, the driving pad, the plurality of first signal lines, and the third signal line; the second metal layer includes: the second signal line; the second signal line is electrically connected to the second pad through a via penetrating the flexible substrate; or... The orthographic projection of the third signal line on the flexible substrate overlaps with the orthographic projection of the first signal line on the flexible substrate; the third signal line includes: a fifth portion extending generally along the row direction and electrically connected to the second pads in one of the pad unit rows, and a sixth portion electrically connected to the fifth portion and the second bonding pads; the orthographic projection of the fifth portion on the flexible substrate overlaps with the orthographic projection of the first signal line on the flexible substrate, and the orthographic projection of the sixth portion on the flexible substrate does not overlap with the orthographic projection of the first signal line on the flexible substrate; the first metal layer includes: the pad unit, the driving pad, the plurality of first signal lines, and the sixth portion; the second metal layer includes: the fifth portion and the second signal line; the second signal line and the fifth portion are electrically connected to the second pads through vias penetrating the flexible substrate.

12. The haptic feedback component according to claim 2, wherein, All the first pads in each row of pad cells are electrically connected to the same first signal line; All the second pads in each of the said pad cell columns are electrically connected to the same second signal line.

13. The haptic feedback component according to claim 12, wherein, The flexible circuit board further includes: a plurality of driving pads located on one side of the plurality of pad units in the row direction; The plurality of driving pads includes: a plurality of first driving pads arranged along the column direction, and a plurality of second driving pads arranged along the column direction; the plurality of second driving pads are located on one side of the plurality of first driving pads in the column direction; the first driving pads are electrically connected to the first signal lines in a one-to-one correspondence, and the second driving pads are electrically connected to the second signal lines in a one-to-one correspondence. The first signal line includes a seventh portion that is electrically connected to all the first pads in the row of pad cells and extends along the row direction; The second signal line includes: an eighth portion electrically connected to all second pads in the pad cell column and extending along the column direction, and a portion extending substantially along the row direction and connected to the eighth portion. The ninth part of the electrical connection; the ninth part is electrically connected to the second drive pad.

14. The haptic feedback component according to claim 13, wherein, The ninth part of the plurality of second signal lines is located on one side of the plurality of first signal lines in the column direction; The ninth part corresponding to the pad cell column on the side closer to the driving pad is closer to the pad cell row than the ninth part corresponding to the pad cell column on the side farther from the driving pad; In the row direction, the length of the ninth part corresponding to the electrical connection of the pad cell column closer to the driving pad is less than the length of the ninth part corresponding to the electrical connection of the pad cell column farther from the driving pad.

15. The haptic feedback component according to claim 13 or 14, wherein, The flexible circuit board includes: a flexible substrate, a first metal layer disposed on the flexible substrate facing the piezoelectric actuator, and a second metal layer disposed on the flexible substrate away from the first metal layer. The first metal layer includes: the pad unit, the drive pad, the plurality of first signal lines, and the ninth part; The second metal layer includes: the eighth part; The eighth part is electrically connected to the ninth part through a via penetrating the flexible substrate, and the eighth part is electrically connected to the second pad through a via penetrating the flexible substrate.

16. The haptic feedback component according to any one of claims 4-11, 13-15, wherein, The haptic feedback component further includes: a driving device, which is bonded to the plurality of driving pads; The driving device includes an output terminal that is bound to each of the driving pads.

17. A haptic feedback device, wherein, include: The haptic feedback component according to any one of claims 1 to 16; A touch display module is located on the side of the plurality of piezoelectric actuators away from the flexible circuit board; The touch display module includes a display area, and the orthographic projection of the plurality of piezoelectric actuators on the touch display module is located in the display area; the orthographic projection of the plurality of piezoelectric actuators on the touch display module corresponds to the virtual keyboard area of ​​the touch display module.

Images