Double-pump series-connected water-cooling heat dissipation device

Abstract

The present invention relates to the technical field of water-cooling heat dissipation. Provided is a double-pump series-connected water-cooling heat dissipation device, comprising: a radiator module, which comprises a plurality of radiator tubes and a water return chamber, wherein the water return chamber is connected to and communicated with the plurality of radiator tubes; a water inlet and outlet module, which comprises a plurality of chambers and is connected to and communicated with the radiator module; and a pumping module, which comprises a plurality of impeller chambers and flow channels, wherein the plurality of impeller chambers are connected to and communicated with the radiator module by means of the water inlet and outlet module. In the dual-pump series-connected water-cooling heat dissipation device provided by the present invention, the use of two pumps connected in series enables a working fluid to rapidly undergo alternating heat and cold circulation, thereby more rapidly taking away heat from a heat source.

Description

Double-pump series water-cooling heat dissipation device TECHNICAL FIELD

[0001] The present application relates to the technical field of water-cooling heat dissipation, in particular to a double-pump series water-cooling heat dissipation device. BACKGROUND

[0002] With the rapid development of electronic technology and information network technology, computers have become an essential part of people's daily life. With the rapid development of electronic technology, the performance of computers has also rapidly improved. The improvement in performance is accompanied by an increase in the heat generated by the internal components of the computer, which has a serious impact on the performance and service life of the computer. The traditional heat dissipation methods for heat-generating components mainly include air cooling and water cooling. Air cooling is achieved by driving air flow with a fan, and the air is forced to flow through the heat sink to dissipate heat.

[0003] However, relying solely on air cooling has been difficult to meet the heat dissipation needs of high-performance equipment, and existing water-cooling heat dissipation devices have reached the performance bottleneck, and running the fan at high speed to improve performance will generate a lot of noise. SUMMARY

[0004] The present application provides a double-pump series water-cooling heat dissipation device, which uses double-pump series to enable the working fluid to quickly alternate between hot and cold circulation, thereby more quickly dissipating the heat of the heat source.

[0005] To solve the above technical problems, the technical solution of the present application is as follows:

[0006] A double-pump series water-cooling heat dissipation device, comprising:

[0007] A cold row module comprising a plurality of row pipes and a rotating water chamber, the rotating water chamber being connected and communicated with the plurality of row pipes;

[0008] An inlet and outlet water module comprising a plurality of chambers and being connected and communicated with the cold row module;

[0009] A pump module comprising a plurality of impeller cavities and flow channels, the plurality of impeller cavities being connected and communicated with the cold row module through the inlet and outlet water module.

[0010] Further, the plurality of row pipes comprise:

[0011] An inlet water row pipe having an input end communicated with the inlet and outlet water module and an output end communicated with the rotating water chamber;

[0012] An outlet water row pipe having an output end communicated with the inlet and outlet water module and an input end communicated with the rotating water chamber;

[0013] The inlet water row pipe and the outlet water row pipe are parallel to each other.

[0014] Further, the water inlet and outlet module comprises:

[0015] a water inlet chamber, an output end of the water inlet chamber being communicated with an input end of the water inlet pipe, an input end of the water inlet chamber being provided with a first water inlet hole, the water inlet chamber being communicated with the pump module through the first water inlet hole;

[0016] a water outlet chamber, an input end of the water outlet chamber being communicated with an output end of the water outlet pipe, an output end of the water outlet chamber being provided with a first water outlet hole, the water outlet chamber being communicated with the pump module through the first water outlet hole;

[0017] a drainage chamber, the drainage chamber being located in the water inlet chamber, the drainage chamber being not communicated with the water inlet chamber;

[0018] the drainage chamber being provided with a second water inlet hole and a second water outlet hole, the drainage chamber being communicated with the pump module through the second water inlet hole and the second water outlet hole.

[0019] Further, the water inlet and outlet module is divided into a lower chamber and an upper chamber by a partition plate;

[0020] the upper chamber has no liquid flowing therethrough;

[0021] the lower chamber is composed of the water inlet chamber and the water outlet chamber, the water inlet chamber being communicated with the water inlet pipe, the water outlet chamber being communicated with the water outlet pipe;

[0022] a height of the lower chamber separated by the partition plate is higher than a height of the water inlet pipe and the water outlet pipe.

[0023] Further, the pump module comprises:

[0024] a lower pump cover plate, being communicated with the water inlet and outlet module;

[0025] an upper pump cover plate, being clamped with the lower pump cover plate;

[0026] a pump carrier plate, being clamped between the lower pump cover plate and the upper pump cover plate, and one side of the pump carrier plate abutting against the lower pump cover plate to form a chamber sealed space.

[0027] Further, the lower pump cover plate is provided with a third water inlet hole, a third water outlet hole, a fourth water inlet hole and a fourth water outlet hole;

[0028] the third water inlet hole being communicated with the first water inlet hole;

[0029] the third water outlet hole being communicated with the first water outlet hole;

[0030] the fourth water inlet hole being communicated with the second water inlet hole;

[0031] the fourth water outlet hole being communicated with the second water outlet hole.

[0032] Further, the pump carrier plate comprises:

[0033] The water inlet pump cavity is communicated with the drainage cavity in sequence through a second water outlet hole and a fourth water outlet hole, and the output end of the water inlet flow channel is communicated with a water inlet chamber;

[0034] The output end of the water inlet flow channel is communicated with the water inlet chamber in sequence through a third water inlet hole and a first water inlet hole;

[0035] The water outlet pump cavity is communicated with the third water outlet hole and the first water outlet hole, and the output end of the water outlet flow channel is communicated with a water outlet nozzle;

[0036] The water inlet nozzle is communicated with the drainage cavity in sequence through a fourth water inlet hole and a second water inlet hole.

[0037] Further, the pump lower cover plate is provided with a flow guide pump cavity; and the flow guide pump cavity and the pump carrier plate abut to form a pump cavity closed space.

[0038] Further, the water inlet pipe and the water outlet pipe are arranged in the through hole of the first cover plate and communicated with the water inlet and outlet module; and the first cover plate and one side of the water inlet and outlet module abut to cover.

[0039] Further, the water inlet pump cavity is provided with a first impeller, and the first impeller is connected with a first stator;

[0040] The water outlet pump cavity is provided with a second impeller, and the second impeller is connected with a second stator.

[0041] The above-mentioned scheme of the present application at least has the following beneficial effects:

[0042] The above-mentioned scheme of the present application adopts the double-pump series connection mode, so that the heat dissipation device has stronger driving capacity, the working fluid can be more quickly subjected to cold and hot alternating circulation, and the heat of the heat source can be more quickly taken away;

[0043] Under the condition of limited application space, the pump and the exhaust are integrally arranged, so that the degree of integration is higher and the device is better adapted to the application ring of the case, and in addition, compared with the traditional pump arranged on the heat exchange cavity close to the heat source, the pump and the exhaust are integrated, and the heat exchange cavity can have a larger abundant heat exchange space to enhance the heat exchange capacity. BRIEF DESCRIPTION OF DRAWINGS

[0044] Fig. 1 is a schematic view of the double-pump series connection type water-cooled heat dissipation device provided by the embodiment of the present application.

[0045] Fig. 2 is an exploded view of the double-pump series connection type water-cooled heat dissipation device provided by the embodiment of the present application.

[0046] Fig. 3 is another exploded view of the double-pump series water-cooled heat dissipation device according to an embodiment of the present application.

[0047] Fig. 4 is a plan view of the pump carrier plate of the double-pump series water-cooled heat dissipation device according to an embodiment of the present application.

[0048] Fig. 5 is another plan view of the pump carrier plate of the double-pump series water-cooled heat dissipation device according to an embodiment of the present application.

[0049] Fig. 6 is an exploded view of an embodiment 2 of the double-pump series water-cooled heat dissipation device according to an embodiment of the present application.

[0050] Fig. 7 is another exploded view of the embodiment 2 of the double-pump series water-cooled heat dissipation device according to an embodiment of the present application.

[0051] Fig. 8 is a plan view of the water inlet and outlet module of the embodiment 2 of the double-pump series water-cooled heat dissipation device according to an embodiment of the present application.

[0052] Fig. 9 is a plan view of the pump lower cover plate of the embodiment 2 of the double-pump series water-cooled heat dissipation device according to an embodiment of the present application.

[0053] Fig. 10 is another plan view of the pump lower cover plate of the embodiment 2 of the double-pump series water-cooled heat dissipation device according to an embodiment of the present application.

[0054] Reference signs: 1, cooling module; 2, water inlet and outlet module; 3, pump module; 11, rotating water chamber; 12, water inlet pipe; 13, water outlet pipe; 14, first cover plate; 21, water inlet chamber; 22, water outlet chamber; 23, first water inlet hole; 24, first water outlet hole; 25, drainage chamber; 26, upper chamber; 27, partition plate; 251, second water inlet hole; 252, second water outlet hole; 31, pump lower cover plate; 32, pump upper cover plate; 33, pump carrier plate; 34, water outlet nozzle; 35, water inlet nozzle; 36, flow guide pump cavity; 311, third water inlet hole; 312, third water outlet hole; 313, fourth water inlet hole; 314, fourth water outlet hole; 331, water inlet pump cavity; 332, water inlet flow channel; 333, water outlet pump cavity; 334, water outlet flow channel; 335, first impeller; 336, second impeller; 337, first stator; 338, second stator. DETAILED DESCRIPTION

[0055] Exemplary embodiments of the present disclosure will be described more fully hereinafter with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it is to be understood that the present disclosure can be embodied in various forms without being limited by the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the present disclosure to those skilled in the art.

[0056] As shown in FIG. 1 to FIG. 5, the embodiment of the present application proposes a double-pump series water-cooling heat dissipation device, comprising:

[0057] The cold-dissipation module 1 comprises a plurality of pipes and a rotating water chamber 11 connected and communicated with the plurality of pipes;

[0058] The water inlet and outlet module 2 comprises a plurality of chambers and is connected and communicated with the cold-dissipation module 1;

[0059] The pumping module 3 comprises a plurality of impeller chambers and flow channels, and is connected and communicated with the cold-dissipation module 1 through the water inlet and outlet module 2.

[0060] In the embodiment of the present application, the cold-dissipation module 1 can provide a large-area heat dissipation surface through the connection and communication of the plurality of pipes and the rotating water chamber 11, thereby increasing the heat dissipation efficiency; the cooling water flows through the rotating water chamber 11 through the pipes, absorbs heat, and then is cooled through the cold-dissipation module 1; the water inlet and outlet module 2 connects and communicates the cold-dissipation module 1 and the pumping module 3, thereby playing a role of conveying and recycling the cooling water; the cooling water enters the cold-dissipation module 1 from the water inlet chamber 21, is cooled, is pumped away by the pumping module 3 through the water outlet chamber 22, and then is recycled for cooling; the pumping module 3 comprises a plurality of impeller chambers and flow channels, and the cooling water is pumped away from the water inlet and outlet module 2 through the rotation of the impeller and is sent back to the water inlet and outlet module 2, thereby forming a closed loop; the pumping module 3 provides sufficient water flow pressure, thereby ensuring that the cooling water can fully flow through the cold-dissipation module 1 to dissipate heat; the double-pump series water-cooling heat dissipation device can improve the heat dissipation efficiency, quickly conducts the heat generated by the equipment to the cooling water, and timely discharges the cooling water through the circulation of the pumping module 3, thereby maintaining the stability of the heat dissipation effect; meanwhile, the double-pump series water-cooling heat dissipation device has a compact structure, occupies a small space, and is suitable for the heat dissipation requirements of various space-limited equipment.

[0061] As shown in FIG. 1 to FIG. 5, the plurality of pipes comprises:

[0062] The water inlet pipe 12 is communicated with the water inlet and outlet module 2 at the input end and is communicated with the rotating water chamber 11 at the output end;

[0063] The water outlet pipe 13 is communicated with the water inlet and outlet module 2 at the output end and is communicated with the rotating water chamber 11 at the input end;

[0064] The water inlet pipe 12 and the water outlet pipe 13 are parallel to each other.

[0065] In the embodiment of the present application, the input end of the water inlet pipe 12 is connected and communicated with the water inlet and outlet module 2, so as to introduce cooling water from the water inlet and outlet module 2 to the rotary water chamber 11; the cooling water is guided in the rotary water chamber 11, the output end of the water outlet pipe 13 is connected and communicated with the water inlet and outlet module 2, so as to extract the cooling water from the rotary water chamber 11 and send it back to the water inlet and outlet module 2; through the connection of the water inlet pipe 12 and the water outlet pipe 13, the cooling water can circulate in the cooling module 1 to realize heat transfer and heat dissipation; the water inlet pipe 12 introduces the cooling water into the rotary water chamber 11, the water outlet pipe 13 extracts the cooling water from the rotary water chamber 11 and performs secondary heat dissipation, and the circulation is maintained; the heat generated by the equipment can be continuously conducted to the cooling water, and the cooling water is circulated in time to maintain the stability and efficiency of the heat dissipation effect; at the same time, the connection and communication of the water inlet pipe 12 and the water outlet pipe 13 also ensure the continuity and stability of the water flow, and improve the working efficiency of the whole water cooling heat dissipation device; the water inlet pipe 12 and the water outlet pipe 13 are parallel to each other, which can effectively guide the flow direction of the cooling water and avoid the mutual interference and mixing of the water flow.

[0066] As shown in FIGS. 1-5, the water inlet and outlet module 2 comprises:

[0067] The water inlet chamber 21, the output end of the water inlet chamber 21 is communicated with the input end of the water inlet pipe 12, the input end of the water inlet chamber 21 is provided with a first water inlet hole 23, the water inlet chamber 21 is communicated with the pump module 3 through the first water inlet hole 23;

[0068] The water outlet chamber 22, the input end of the water outlet chamber 22 is communicated with the output end of the water outlet pipe 13, the output end of the water outlet chamber 22 is provided with a first water outlet hole 24, the water outlet chamber 22 is communicated with the pump module 3 through the first water outlet hole 24.

[0069] In the embodiment of the present application, the output end of the water inlet chamber 21 is communicated with the input end of the water inlet pipe 12, and the cooling water can enter the water inlet pipe 12 from the water inlet chamber 21; the input end of the water inlet chamber 21 is provided with a first water inlet hole 23, which is communicated with the pump module 3; the purpose is to guide the cooling water from the pump module 3 to the water inlet and outlet module 2; the input end of the water outlet chamber 22 is communicated with the output end of the water outlet pipe 13, and the cooling water can enter the water outlet chamber 22 from the water outlet pipe 13; the output end of the water outlet chamber 22 is provided with a first water outlet hole 24, which is communicated with the pump module 3; the purpose is to guide the cooling water to the pump module 3 and discharge the cooling water from the system; the water inlet chamber 21 and the water outlet chamber 22 realize the shunting and connection of the cooling water; the cooling water enters the water inlet pipe 12 from the water inlet chamber 21, is cooled by the cooling module 1, and then enters the water outlet chamber 22 through the water outlet pipe 13; through the first water inlet hole 23 and the first water outlet hole 24, the smooth circulation and timely discharge of the cooling water between the water inlet and outlet module 2 and the pump module 3 are ensured; the temperature of the equipment can be effectively reduced, and the high-efficiency cooling effect is realized; at the same time, stable water flow and pressure can be provided, and it is ensured that the cooling water can fully flow through the cooling module 1 and take away the heat.

[0070] As shown in FIGS. 1-5, the water inlet and outlet module 2 further comprises a drainage chamber 25, which is located in the water inlet chamber 21, and the drainage chamber 25 is not communicated with the water inlet chamber 21.

[0071] The drainage chamber 25 is provided with a second water inlet hole 251 and a second water outlet hole 252, and the drainage chamber 25 is communicated with the pump module 3 through the second water inlet hole 251 and the second water outlet hole 252.

[0072] In the embodiment of the present application, the drainage chamber 25 is located in the water inlet chamber and is not communicated with the water inlet chamber 21, and is communicated with the pump module 3 through the second water inlet hole 251 and the second water outlet hole 252; the drainage chamber 25 can guide the cooling water into the pump module 3; the cooling water enters the drainage chamber 25 through the second water inlet hole 251 and enters the pump module 3 through the second water outlet hole 252, forming a flow, thereby increasing the circulation and flow of the water flow; the introduction of the drainage chamber 25 makes the cooling water have a clear flow direction in the water inlet chamber 21; the drainage chamber 25 ensures the flow and circulation of the cooling water, improves the continuity and stability of the water flow, and increases the circulation and flow of the water flow, improves the cooling effect; at the same time, it can also optimize the water flow distribution, ensure the smooth circulation of the cooling water, and improve the working efficiency of the whole cooling system.

[0073] As shown in FIGS. 1-5, the pump module 3 comprises:

[0074] a pump lower cover plate 31, which is communicated with the water inlet and outlet module 2;

[0075] A pump upper cover plate 32 is clamped with the pump lower cover plate 31;

[0076] A pump carrier plate 33 is clamped between the pump lower cover plate 31 and the pump upper cover plate 32, and one side of the pump carrier plate 33 abuts the pump lower cover plate 31 to form a cavity sealed space.

[0077] In the embodiment of the present application, the pump module 3 provides water flow pressure and circulation, ensuring that the cooling water can fully flow through the cooling module to take away heat; the pump lower cover plate 31 communicates with the water inlet and outlet module 2, which can guide the cooling water into the water inlet chamber 21 and provide pressure to deliver the cooling water to the cooling module 1; the pump carrier plate 33 is clamped between the pump lower cover plate 31 and the pump upper cover plate 32 to form a cavity sealed space, which can increase the pressure of the water flow and ensure that the cooling water can flow through the cooling module; the pump module 3 enables the cooling water to circulate; one side of the pump carrier plate 33 abuts the pump lower cover plate 31 to form a cavity sealed space; through the rotating movement of the pump module 3, the cooling water is pushed into the water outlet chamber and reenters the water inlet chamber to circulate and dissipate heat; through the pump module 3, the double-pump series water-cooled heat dissipation device can provide sufficient water flow pressure and circulation, ensuring that the cooling water can fully flow through the cooling module 1 to take away heat; at the same time, the pump module 3 is compact in structure, which can effectively circulate and guide the cooling water to improve the heat dissipation efficiency.

[0078] As shown in FIGS. 1-5, the pump lower cover plate 31 is provided with a third water inlet hole 311, a third water outlet hole 312, a fourth water inlet hole 313, and a fourth water outlet hole 314;

[0079] The third water inlet hole 311 communicates with the first water inlet hole 23;

[0080] The third water outlet hole 312 communicates with the first water outlet hole 24;

[0081] The fourth water inlet hole 313 communicates with the second water inlet hole 251;

[0082] The fourth water outlet hole 314 communicates with the second water outlet hole 252.

[0083] In the embodiment of the present application, the communication of the third water inlet hole 311 and the third water outlet hole 312 and the fourth water inlet hole 313 and the fourth water outlet hole 314 can realize the water flow guidance and connection between different modules; the third water inlet hole 311 is communicated with the first water inlet hole 23, and the cooling water enters the water inlet chamber 21 from the pumping module 3; the third water outlet hole 312 is communicated with the first water outlet hole 24, and the cooling water enters the pumping module 3 from the water outlet chamber 22, which can realize the shunting and guidance of the cooling water, ensure the flow and circulation of the water flow in different modules; the fourth water inlet hole 313 is communicated with the second water inlet hole 251, and the cooling water enters the drainage cavity 25 from the water inlet nozzle 35; the fourth water outlet hole 314 is communicated with the second water outlet hole 252, and the cooling water is introduced into the pumping module 3 from the drainage cavity 25, so that the cooling water can flow between different modules, realize the water flow connection between the modules, and ensure the smooth circulation of the cooling water and the normal work of the entire heat dissipation system; through the third water inlet hole 311, the third water outlet hole 312, the fourth water inlet hole 313 and the fourth water outlet hole 314 opened on the lower cover plate 31 of the pump and the communication with the water inlet and outlet module 2, the shunting and guidance of the cooling water can be realized, and the water flow connection between different modules is ensured; the continuity and stability of the water flow can be ensured, and the heat dissipation efficiency and working performance of the double-pump series water-cooled heat dissipation device are improved.

[0084] As shown in FIGS. 1-5, the pump carrier plate 33 comprises:

[0085] The water inlet pump cavity 331 is communicated with the drainage cavity 25 in sequence through the second water outlet hole 252 and the fourth water outlet hole 314, and the output end is communicated with the water inlet flow channel 332;

[0086] The output end of the water inlet flow channel 332 is communicated with the water inlet chamber 21 through the third water inlet hole 311 and the first water inlet hole 23 in sequence;

[0087] The water outlet pump cavity 333 is communicated with the third water outlet hole 312 and the first water outlet hole 24, and the output end is communicated with the water outlet flow channel 334, and the output end of the water outlet flow channel 334 is communicated with the water outlet nozzle 34.

[0088] In the embodiment of the present application, the water inlet pump cavity 331, the water inlet flow channel 332, the water outlet pump cavity 333 and the water outlet flow channel 334 are arranged on the pump carrier plate 33 to guide the flow of cooling water, realize the suction and discharge of cooling water; the input end of the water inlet pump cavity 331 is communicated with the drainage cavity 25 through the second water outlet hole 252, and the output end is communicated with the water inlet flow channel 332; the output end of the water inlet flow channel 332 is communicated with the water inlet chamber 21 in turn through the third water inlet hole 311 and the first water inlet hole 23; cooling water can enter the water inlet chamber 21 from the drainage cavity 25 through the water inlet pump cavity 331 and the water inlet flow channel 332; through the arrangement of the pump carrier plate 33, the cooling water is guided into the pump module 3, and the pump module 3 provides power for the cooling water; the input end of the water outlet pump cavity 333 is communicated with the first water outlet hole 24 through the third water outlet hole 312, and the output end is communicated with the water outlet flow channel 334; the output end of the water outlet flow channel 334 is communicated with the water outlet nozzle 34; cooling water can be discharged from the system through the water outlet pump cavity 333 and the water outlet flow channel 334; through the arrangement of the pump carrier plate 33, the cooling water is guided into the pump module 3 and discharged from the system in time through the driving of the pump module 3, which ensures the circulating heat dissipation effect; through the arrangement of the pump carrier plate 33, the double-pump series water-cooled heat dissipation device can realize the suction and discharge of cooling water; cooling water enters the water inlet chamber 21 through the water inlet pump cavity 331 and the water inlet flow channel 332, and cooling water is discharged from the system through the water outlet pump cavity 333 and the water outlet flow channel 334, which ensures the heat dissipation effect, can keep the stable operation of the system and improve the heat dissipation efficiency.

[0089] As shown in FIGS. 1-5, the pump carrier plate 33 is further provided with a water inlet nozzle 35;

[0090] The output end of the water inlet nozzle 35 is communicated with the drainage chamber 25 in turn through the fourth water inlet hole 313 and the second water inlet hole 251.

[0091] In the embodiment of the present application, the water inlet nozzle 35 is used to guide the inflow of cooling water and introduce the cooling water into the drainage chamber 25; the output end of the water inlet nozzle 35 is communicated with the drainage chamber 25 in turn through the fourth water inlet hole 313 and the second water inlet hole 251; through the water inlet nozzle 35, the cooling water can directly enter the drainage chamber 25; the drainage chamber 25 is located inside the water inlet chamber 21 and is communicated with the pump module 3 through the second water inlet hole 251, the cooling water can be guided into the pump module 3 to circulate and flow, further heat dissipation, realize the circulating flow of cooling water, can keep the continuous supply of cooling water, improve the heat dissipation effect, and keep the normal operation of the equipment.

[0092] As shown in FIGS. 1-5, the water inlet pipe 12 and the water outlet pipe 13 are arranged in the through hole of the first cover plate 14 and communicated with the water inlet and outlet module 2; the first cover plate 14 abuts and covers one side of the water inlet and outlet module 2.

[0093] In the embodiment of the present application, the water inlet pipe 12 and the water outlet pipe 13 are arranged in parallel through the first cover plate 14, which can effectively guide the flow direction of the cooling water, avoid the mutual interference and mixing of the water flow; the first cover plate 14 plays a role of heat insulation, preventing the heat conduction of the cooling water to other parts of the water inlet and outlet module 2, thereby reducing the heat influence of the heat dissipation device on the surrounding environment; the water inlet pipe 12 and the water outlet pipe 13 are arranged in parallel through the first cover plate 14, so that the structure of the whole device is more compact, occupies less space, and is suitable for the heat dissipation requirements of various space-limited equipment; the first cover plate 14 is abutted and covered with one side of the water inlet and outlet module 2, which can simplify the installation process of the device and improve the installation efficiency; the water inlet pipe 12 and the water outlet pipe 13 are arranged in parallel through the first cover plate 14 and abutted and covered with one side of the water inlet and outlet module 2, which can optimize the water flow guide and heat insulation, and at the same time make the whole device more compact and convenient to install, further improving the heat dissipation efficiency and use convenience of the double-pump series water-cooled heat dissipation device; the first cover plate 14 has a through hole structure, through which the water inlet chamber, the water outlet chamber, the water inlet pipe and the water outlet pipe are connected, thereby ensuring the smooth flow of the water.

[0094] As shown in FIGS. 1-5, the water inlet pump cavity 331 is provided with a first impeller 335, and the first impeller 335 is connected with a first stator 337;

[0095] The water outlet pump cavity 333 is provided with a second impeller 336, and the second impeller 336 is connected with a second stator 338.

[0096] In the embodiment of the present application, the double-pump series water-cooled heat dissipation device circulates the cooling liquid into the heat dissipation equipment through two pumps, and then the hot cooling liquid after passing through the heat dissipation equipment returns to the pump for circulation; the water inlet pump cavity 331 is provided with a first impeller 335 and a first stator 337, and the water outlet pump cavity 333 is provided with a second impeller 336 and a second stator 338; through the series connection of the double pumps, stronger driving capacity can be provided, and the working fluid can be quickly circulated to alternately cool and heat, thereby quickly taking away the heat of the heat source; the first impeller 335 and the first stator 337 are used to generate water flow in the water inlet pump cavity 331, and the cooling liquid is sucked into the heat dissipation device for cooling; and the second impeller 336 and the second stator 338 are used to generate stronger water flow in the water outlet pump cavity 333, and the hot cooling liquid after passing through the heat dissipation device is quickly discharged to ensure the cooling effect; the double-pump series water-cooled heat dissipation device can provide higher water flow speed and greater cooling capacity, thereby being able to more effectively reduce the temperature of the heat dissipation equipment and maintain its normal operation; in addition, the flow speed of the cooling liquid can also be improved, the time of the cooling liquid staying in the heat dissipation device is reduced, and the cooling liquid is prevented from overheating and losing the heat dissipation effect; thereby the double-pump series water-cooled heat dissipation device has higher heat dissipation performance, and can better protect the stable operation of the heat dissipation equipment.

[0097] As shown in FIGS. 5-10, the water inlet and outlet module 2 is divided into a lower chamber and an upper chamber 26; the lower chamber includes a water inlet chamber 21 for guiding cooling water into the cooling module, and a water outlet chamber 22 for guiding cooling water into the pumping module 3, and the height of the lower chamber matches the height of the cooling module 1, being higher than the through hole on the first cover plate 14, so that water does not form a storage area and does not affect the efficient flow of water; the upper chamber 26 does not pass water.

[0098] As shown in FIGS. 5-10, the pumping lower cover plate 31 is provided with a flow guide pump cavity 36; and the flow guide pump cavity 36 abuts against the pump carrier plate 33 to form a pump cavity closed space; which can effectively prevent the leakage of cooling liquid inside the pump cavity or the entry of external impurities, and the flow guide pump cavity 36 can guide the direction of the flow of cooling liquid, making it more uniformly pass through the pump carrier plate, reducing the turbulence and resistance of the liquid, and improving the efficiency of the pump; the close abutment of the pump carrier plate and the flow guide pump cavity can reduce the dead angle and liquid leakage in the pump cavity, and improve the flow effect of the cooling liquid.

[0099] The above is the preferred embodiment of the present application, it should be noted that for those skilled in the art, without departing from the principles of the present application, can make several improvements and refinements, these improvements and refinements should also be considered as the protection scope of the present application.

Claims

1. A double-pump series water-cooling heat sink, characterized by, The application relates to a cold-drawing module (1), an inlet-outlet water module (2) and a pump module (3). The cold-drawing module (1) comprises a plurality of pipes and a rotating water chamber (11) connected with the pipes. The inlet-outlet water module (2) comprises a plurality of chambers and is connected with the cold-drawing module (1). The pump module (3) comprises a plurality of impeller chambers and flow channels, and the impeller chambers are connected with the cold-drawing module (1) through the inlet-outlet water module (2).

2. The dual-pump series water-cooled heat sink of claim 1, wherein, The plurality of pipes comprises an inlet pipe (12) and an outlet pipe (13). The inlet pipe (12) is connected with the inlet-outlet water module (2) at an input end and is connected with the rotating water chamber (11) at an output end. The outlet pipe (13) is connected with the inlet-outlet water module (2) at an output end and is connected with the rotating water chamber (11) at an input end. The inlet pipe (12) and the outlet pipe (13) are parallel to each other.

3. The dual-pump series water-cooled heat sink of claim 2, wherein, The inlet-outlet water module (2) comprises an inlet chamber (21), an outlet chamber (22) and a drainage chamber (25). The output end of the inlet chamber (21) is connected with the input end of the inlet pipe (12), the input end of the inlet chamber (21) is provided with a first inlet hole (23), the inlet chamber (21) is connected with the pump module (3) through the first inlet hole (23). The input end of the outlet chamber (22) is connected with the output end of the outlet pipe (13), the output end of the outlet chamber (22) is provided with a first outlet hole (24), and the outlet chamber (22) is connected with the pump module (3) through the first outlet hole (24). The drainage chamber (25) is located in the inlet chamber (21) and is not connected with the inlet chamber (21). The drainage chamber (25) is provided with a second inlet hole (251) and a second outlet hole (252), and the drainage chamber (25) is connected with the pump module (3) through the second inlet hole (251) and the second outlet hole (252).

4. The dual-pump series water-cooled heat sink of claim 3, wherein, The inlet-outlet water module (2) is divided into a lower chamber and an upper chamber (26) by a partition plate (27). The upper chamber (26) is not provided with liquid flow. The lower chamber is composed of the inlet chamber (21) and the outlet chamber (22), the inlet chamber (21) is connected with the inlet pipe (12), and the outlet chamber (22) is connected with the outlet pipe (13). The height of the lower chamber separated by the partition plate (27) is higher than the height of the inlet pipe (12) and the outlet pipe (13).

5. The dual-pump series water-cooled heat sink of claim 3, wherein, The pump module (3) comprises a pump lower cover plate (31), a pump upper cover plate (32) and a pump carrier plate (33). The pump lower cover plate (31) is connected with the inlet-outlet water module (2). The pump upper cover plate (32) is connected with the pump lower cover plate (31). The pump carrier plate (33) is arranged between the pump lower cover plate (31) and the pump upper cover plate (32), and one side of the pump carrier plate (33) is abutted with the pump lower cover plate (31) to form a chamber sealing space.

6. The dual-pump series water-cooled heat sink of claim 5, wherein, The pump lower cover plate (31) is provided with a third inlet hole (311), a third outlet hole (312), a fourth inlet hole (313) and a fourth outlet hole (314). The third inlet hole (311) is connected with the first inlet hole (23). The third outlet hole (312) is connected with the first outlet hole (24). The fourth inlet hole (313) is connected with the second inlet hole (251). The fourth outlet hole (314) is connected with the second outlet hole (252). The fourth water inlet hole (313) is communicated with the second water inlet hole (251); The fourth water outlet hole (314) is communicated with the second water outlet hole (252).

7. The dual-pump series water-cooled heat sink of claim 6, wherein, The pump carrier plate (33) comprises: The water inlet pump cavity (331) is communicated with the drainage cavity (25) in sequence through the second water outlet hole (252) and the fourth water outlet hole (314), and is communicated with the water inlet flow channel (332) at an output end; The output end of the water inlet flow channel (332) is communicated with the water inlet cavity (21) in sequence through the third water inlet hole (311) and the first water inlet hole (23); The water outlet pump cavity (333) is communicated with the third water outlet hole (312) and the first water outlet hole (24) at an input end, and is communicated with the water outlet flow channel (334) at an output end, and the output end of the water outlet flow channel (334) is communicated with the water outlet nozzle (34); The water inlet nozzle (35) is communicated with the drainage cavity (25) in sequence through the fourth water inlet hole (313) and the second water inlet hole (251) at an output end.

8. The dual-pump series water-cooled heat sink of claim 6, wherein, The pump lower cover plate (31) is provided with the flow guide pump cavity (36), and the flow guide pump cavity (36) and the pump carrier plate (33) abut to form a pump cavity airtight space.

9. The dual-pump series-connected water-cooled heat sink of claim 3, wherein, The water inlet pipe (12) and the water outlet pipe (13) are arranged in the through hole of the first cover plate (14) and are communicated with the water inlet and outlet module (2), and the first cover plate (14) and one side of the water inlet and outlet module (2) abut and cover.

10. The dual-pump series water-cooled heat sink of claim 9, wherein, The water inlet pump cavity (331) is provided with the first impeller (335), and the first impeller (335) is connected with the first stator (337); The water outlet pump cavity (333) is provided with the second impeller (336), and the second impeller (336) is connected with the second stator (338).

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