Phased array antenna unit, phased array antenna system and satellite platform
By separating the antenna array and signal processing components in the phased array antenna unit and using a heat dissipation housing to achieve self-heating, the problems of numerous parts and heavy weight in traditional designs are solved, reducing satellite costs and burdens and promoting the application of spaceborne phased array antennas.
Patent Information
- Application Number
- PCT/CN2025/095978
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-06-24
- Filing Date
- 2025-05-20
- Publication Date
- 2026-01-02
AI Technical Summary
The satellite-borne phased array antenna adopts the traditional base station antenna architecture design, which results in more parts, more complex architecture, and heavier weight, increasing the burden and cost of the satellite and affecting its promotion and application.
Design a phased array antenna unit, wherein the antenna array is disposed on the reflective plane of the heat dissipation shell, and the signal processing component is disposed on the other side of the heat dissipation shell. The heat dissipation shell is used to dissipate heat from the signal processing component, thereby achieving self-heating and reducing dependence on satellites.
The self-heating design reduces satellite manufacturing and maintenance costs, simplifies the structure, reduces parts and weight, and facilitates the promotion and application of spaceborne phased array antennas.
Smart Images

Figure CN2025095978_02012026_PF_FP_ABST
Abstract
Description
Phased array antenna unit, phased array antenna system and satellite platform
[0001] Cross-reference to Related Applications
[0002] The present disclosure claims priority to Chinese Patent Application No. 202410825335.0, filed on June 24, 2024, the contents of which are incorporated herein by reference in their entirety. TECHNICAL FIELD
[0003] The present application relates to the field of communication technology, in particular to a phased array antenna unit, a phased array antenna system and a satellite platform. BACKGROUND
[0004] With the rise of Non Terrestrial Network (NTN) technology mobile phone direct connection satellite, the satellite platform becomes a trend in the future. The satellite-borne phased array antenna needs to withstand various special and strict space environment tests during satellite transportation, orbiting, running and returning to the ground, etc. Therefore, the architecture design of the satellite-borne phased array antenna is crucial, especially the problem of heat dissipation of the satellite-borne phased array antenna in special space environment (such as space environment) needs to be solved.
[0005] At present, the satellite-borne phased array antenna usually adopts the architecture design of the traditional base station antenna. Under this architecture, the satellite-borne phased array antenna usually dissipates heat through the satellite, which increases the burden of the satellite, increases the satellite manufacturing and operation cost, and affects the promotion and application of the satellite-borne phased array antenna. Moreover, the satellite-borne phased array antenna adopts the architecture design of the traditional base station antenna, which has many designed parts, complex architecture, heavy weight, and increases the satellite launch load and cost.
[0006] SUMMARY
[0007] The present application provides a phased array antenna unit, a phased array antenna system and a satellite platform.
[0008] The present application provides a phased array antenna unit, a phased array antenna system and a satellite platform.
[0009] The present application provides a phased array antenna system, comprising at least one phased array antenna unit, wherein the phased array antenna unit comprises the phased array antenna unit provided in the embodiments of the present application.
[0010] The satellite platform provided in the embodiments of the present application comprises a satellite body and a phased array antenna system, the phased array antenna system is arranged on the satellite body, and the phased array antenna system comprises the phased array antenna system provided in the embodiments of the present application.
[0011] Further description is provided in the description of drawings, specific embodiments and claims regarding the above embodiments and other aspects of the present application and implementation manners thereof. DETAILED DESCRIPTION
[0012] In the drawings of the embodiments of the present application:
[0013] Fig. 1 shows a unit structure schematic diagram of a phased array antenna unit provided in the embodiments of the present application.
[0014] Fig. 2 shows a split structure schematic diagram of a phased array antenna unit provided in the embodiments of the present application.
[0015] Fig. 3 shows a composition structure schematic diagram of a phased array antenna system provided in the embodiments of the present application.
[0016] Fig. 4 shows a composition structure schematic diagram of a satellite platform provided in the embodiments of the present application. DETAILED DESCRIPTION DETAILED DESCRIPTION
[0017] In order for those skilled in the art to better understand the technical solutions of the present application, the embodiments of the present application will be described in detail below with reference to the drawings.
[0018] The present application will be described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the present application are shown. The present application may, however, be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the application to those skilled in the art.
[0019] The accompanying drawings, which are included to provide a further understanding of the embodiments of the present application and constitute a part of the specification, illustrate the embodiments of the present application and together with the detailed description serve to explain the present application. The above and other features and advantages of the present application will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
[0020] The present application can be described with reference to plan and / or sectional views as per ideal schematic diagrams of the present application. Therefore, the example illustrations can be modified according to manufacturing techniques and / or tolerances.
[0021] The embodiments of the present application and the features in the embodiments can be combined with each other without conflict.
[0022] The terminology used by the present disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the present disclosure. As used in the present disclosure, the term "and / or" includes any and all combinations of one or more of the associated listed items. As used in the present disclosure, the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. As used in the present disclosure, the term "comprises," "comprising," "consists of and / or "consisting of" specifies the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.
[0023] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present disclosure, and will not be interpreted in an overly literal or overly formal sense unless expressly so defined herein.
[0024] The present disclosure is not limited to the embodiments and implementations shown in the drawings, but includes modifications of configurations formed based on manufacturing processes. Therefore, the regions illustrated in the drawings have a schematic property, and the shape of the regions shown in the drawings exemplifies a specific shape of a region of an element, but is not restrictive.
[0025] In the related art, a satellite-borne phased array antenna adopts a conventional base station antenna architecture, which is usually composed of an antenna array, a radio frequency connector, a reflecting plate, a shielding cover, an active PCB, a power supply, and a casing. The heat dissipation path is transmitted from the active PCB and the power supply to the casing, which guides the heat to the satellite cabin plate, and the heat is radiated by the satellite. With such a design, the satellite-borne phased array antenna has many design parts, a complex architecture, and a heavy weight, which increases the satellite launch load and cost. Moreover, the satellite-borne phased array antenna increases the burden of the satellite through satellite heat dissipation, which increases the satellite manufacturing and operation cost and affects the promotion and application of the satellite-borne phased array antenna.
[0026] The present application provides a phased array antenna unit, a phased array antenna system, and a satellite platform, which can solve the technical problems existing in the related art.
[0027] FIG. 1 shows a unit structure schematic diagram of a phased array antenna unit provided by the present application, and FIG. 2 shows a structure split schematic diagram of a phased array antenna unit provided by the present application. As shown in FIGS. 1 and 2, the present application embodiment provides a phased array antenna unit 100, which includes an antenna array 101, a heat dissipation casing 102, and a signal processing assembly 103.
[0028] The antenna array 101 comprises a plurality of antenna elements 1011 arranged in an array, the antenna array 101 is arranged on a first side surface M of the heat dissipation shell 102, the first side surface M of the heat dissipation shell 102 is a reflection plane of the antenna array 101; the signal processing assembly 103 is arranged on a second side surface N of the heat dissipation shell 102 facing away from the first side surface M, and the heat dissipation shell 102 is used to dissipate heat for the signal processing assembly 103.
[0029] In the phased array antenna unit provided in the embodiments of the present application, the antenna array 101 is connected with the signal processing assembly 103, the antenna array 101 is configured to amplify and emit radio frequency signals (such as electromagnetic wave signals) from the signal processing assembly 103 outward, and receive radio frequency signals from the outside and transmit them to the signal processing assembly 103 through a receiving link; the signal processing assembly 103 is configured to transmit or receive radio frequency signals through the antenna array 101, and analyze and process the external radio frequency signals after low-noise amplification and other processing.
[0030] In the phased array antenna unit provided in the embodiments of the present application, the heat dissipation shell 102 can provide a heat dissipation path for the signal processing assembly 103, and also can protect, shield signals and prevent radiation for the signal processing assembly 103, and also can provide a reflection signal function for the antenna array 101 by using the surface facing the antenna array 101, i.e. the first side surface M, as the reflection plane of the antenna array 101, thereby realizing beamforming of the antenna array 101.
[0031] In the phased array antenna unit provided in the embodiments of the present application, the heat dissipation shell of the phased array antenna unit is arranged between the antenna array and the signal processing assembly, the heat generated by the signal processing assembly can be dissipated through the heat dissipation shell, thereby realizing self-heat dissipation of the phased array antenna unit. In actual application, the phased array antenna unit can be applied to a satellite-borne phased array antenna, and the phased array antenna unit can realize self-heat dissipation through the heat dissipation shell, without the need to dissipate heat through a satellite, thereby reducing the burden of the satellite, which is conducive to reducing the manufacturing and operation and maintenance costs of the satellite and is conducive to improving the promotion and application range of the satellite-borne phased array antenna. Meanwhile, in the phased array antenna unit provided in the embodiments of the present application, the surface of the heat dissipation shell facing the antenna array can be used as the reflection plane of the antenna array, and the heat dissipation shell is integrally formed, without the need to additionally provide a reflection plate for the antenna array, thereby effectively reducing the part design and weight of the phased array antenna unit, which can effectively reduce the satellite launch load and cost in the application of the satellite-borne phased array antenna; the phased array antenna unit provided in the embodiments of the present application can be applied to a space environment without air (heat dissipation medium), and the phased array antenna unit realizes self-heat dissipation through the heat dissipation shell in the space environment.
[0032] In some embodiments, the first side surface M of the heat dissipation shell 102 is coated with a radiation material (not shown in the figure) except for the mounting area of the antenna array element 1011, and the heat dissipation shell 102 dissipates heat by radiation through the radiation material, which can radiate heat on the heat dissipation shell 102, thereby improving the heat dissipation effect of the heat dissipation shell 102 and meeting the needs of self-heat dissipation of the phased array antenna unit in a special space environment (such as space environment) in actual application.
[0033] In some embodiments, the radiation material includes but is not limited to white paint, and the radiation material can also adopt other materials that can radiate heat, which is not specially limited in the present application.
[0034] In some application scenarios, the heat dissipation shell 102 is provided with a plurality of heat dissipation teeth (not shown in the figure), and the heat dissipation shell 102 can dissipate heat by air convection through the heat dissipation teeth. The heat dissipation teeth can form a heat dissipation channel therebetween, the heat dissipation shell 102 conducts heat to the heat dissipation teeth, the temperature of the heat dissipation teeth rises, the air near the heat dissipation channel expands due to heating, the hot air rises, and the air in the environment flows to the heat dissipation shell 102 and the heat dissipation teeth, thereby forming air convection, and the heat dissipation shell 102 and the heat dissipation teeth dissipate heat by air convection.
[0035] In some embodiments, the plurality of heat dissipation teeth can be distributed on the four peripheral edge regions of the heat dissipation shell 102, and the plurality of heat dissipation teeth can be arranged within or outside the outer contour of the heat dissipation shell 102.
[0036] In some embodiments, the heat dissipation teeth can be integrally formed with the heat dissipation shell 102, or the heat dissipation teeth can be fixedly connected to the heat dissipation shell 102 by riveting, gluing or laser welding process.
[0037] In some embodiments, the phased array antenna unit 100 further comprises a shielding cover 104, which is arranged on the side of the signal processing assembly 103 away from the heat dissipation shell 102, and the shielding cover 104, the signal processing assembly 103 and the heat dissipation shell 102 are fixedly connected.
[0038] In some embodiments, the shielding cover 104 can be fixedly connected to the heat dissipation shell 102 by screws, and the signal processing assembly 103 is fixedly installed in the space formed between the shielding cover 104 and the heat dissipation shell 102.
[0039] In some embodiments, the shielding cover 104 and the heat dissipation shell 102 can be sealingly connected to prevent external environmental moisture from entering.
[0040] In some embodiments, the shielding cover 104 can provide a heat dissipation path for the signal processing component 103 and the power supply component, and can also protect, shield signals and prevent radiation for the signal processing component 103 and the power supply component.
[0041] In some embodiments, the heat generated by the signal processing component 103 can also be transmitted to the heat dissipation shell 102 through the shielding cover 104 and dissipated through the heat dissipation shell 102.
[0042] In some embodiments, a heat-conducting structure (not shown in the figure) is filled between the signal processing component 103 and the heat dissipation shell 102, and the heat generated by the signal processing component 103 can be conducted to the heat dissipation shell 102 through the heat-conducting structure for heat dissipation treatment, thereby facilitating to improve the heat dissipation efficiency of the signal processing component 103.
[0043] In some embodiments, the heat-conducting structure can be a heat-conducting gel or a heat-conducting pad, and other suitable heat-conducting materials can also be used, which are not specially limited in the present application.
[0044] In some embodiments, the signal processing component 103 can include but is not limited to an active radio frequency printed circuit board (PCB) and a plurality of signal transceiving components (not shown in the figure) integrated on the active radio frequency printed circuit board (not shown in the figure). The plurality of signal transceiving components can be arranged in an array, and the signal transceiving components are arranged one-to-one corresponding to the antenna array 1011. The signal transceiving components are connected corresponding to the corresponding antenna array, and the signal transceiving components are used for transceiving signals.
[0045] In some embodiments, the signal transceiving component can be a phased array transmit / receive (TR) component, which can be used for adjusting the amplitude and phase of the signal, thereby realizing the scanning function of the antenna in space; the TR component can also be used for realizing the switching between the transmitted and received signals, and also has the function of power amplification, so that the antenna can transmit a large-power radio frequency signal. For receiving a weak radio frequency signal, the TR component can further perform power amplification on the basis of low-noise amplification. Exemplarily, the main component devices of the TR component can include but are not limited to an attenuator, a phase shifter, a transceiving switch, a driver, a power amplifier, an amplifier, a low-noise amplifier, a circulator, and control devices related to these devices.
[0046] In some embodiments, the phased array antenna unit 100 further includes a radio frequency connector 105, and the antenna array 1011 is connected to the corresponding signal transceiving component through the radio frequency connector 105.
[0047] In some embodiments, the radio frequency connector 105 can be a blind-mate radio frequency connector, and the antenna array 1011 is connected to the corresponding signal transceiver assembly through the blind-mate radio frequency connector 105.
[0048] In some embodiments, a through hole is formed on the heat dissipation shell 102 at a position corresponding to the installation of the antenna array 1011, the radio frequency connector 105 is arranged in the through hole, and the radio frequency connector 105 is sealingly arranged in the through hole between the heat dissipation shell 102, one end of the radio frequency connector 105 is connected to the antenna array 1011, and the other end of the radio frequency connector 105 is connected to the signal transceiver assembly arranged corresponding to the antenna array 1011 through the through hole, so that the antenna array 1011 is connected to the corresponding signal transceiver assembly, and the signal is transmitted between the antenna array 1011 and the corresponding signal transceiver assembly through the radio frequency connector 105.
[0049] In some embodiments, the phased array antenna unit 100 further comprises a power supply assembly (not shown in the figure), which is used to provide required power supply for each component in the phased array antenna unit; the power supply assembly is integrated on the active radio frequency printed circuit board, or the power supply assembly is arranged on the side of the active radio frequency printed circuit board away from the heat dissipation shell 102.
[0050] In some embodiments, the signal transceiver assembly and the power supply assembly of the phased array antenna unit 100 are integrated on the same active radio frequency printed circuit board, which can be beneficial to simplify the architecture of the phased array antenna unit 100, reduce the weight of the phased array antenna unit 100, simplify the design of parts, and save manufacturing costs.
[0051] In some embodiments, the phased array antenna unit 100 can be an active phased array antenna unit; in some embodiments, the phased array antenna unit 100 can be a satellite-borne active phased array antenna unit.
[0052] The embodiments of the present application also provide a phased array antenna system, which comprises at least one phased array antenna unit, and the phased array antenna unit comprises the phased array antenna unit provided above.
[0053] For the related description of the phased array antenna unit, please refer to the specific description of the phased array antenna unit above, which will not be repeated here.
[0054] In some embodiments, the number of phased array antenna units is multiple; the multiple phased array antenna units can be arranged in a regular planar shape, or the multiple phased array antenna units can be arranged in an irregular planar shape, or the multiple phased array antenna units can be arranged in a folded three-dimensional shape. The regular planar shape is, for example, a rectangle, a square, a polygon, etc.
[0055] In some application scenarios, the phased array antenna system is applied to a satellite platform, the phased array antenna system comprises a plurality of phased array antenna units, the plurality of phased array antenna units are arranged in a folded three-dimensional shape when the satellite is on the ground, and the plurality of phased array antenna units are unfolded to be arranged in a planar shape after the satellite is launched into orbit.
[0056] FIG. 3 shows a schematic diagram of a structure of a phased array antenna system according to an embodiment of the present application. In some embodiments, as shown in FIG. 3, the number of phased array antenna units is a plurality, and each phased array antenna unit comprises, but is not limited to, an antenna array 301, a heat dissipation shell 302, a signal processing assembly 303 and a shielding cover 304 arranged in sequence. The plurality of phased array antenna units are arranged in a regular planar shape (such as a rectangle), and adjacent two phased array antenna units can be connected through a connecting member (such as a rotating shaft).
[0057] FIG. 4 shows a schematic diagram of a structure of a satellite platform according to an embodiment of the present application. As shown in FIG. 4, the satellite platform comprises, but is not limited to, a satellite body 401 and a phased array antenna system 402, the phased array antenna system 402 is arranged on the satellite body 401, and the phased array antenna system 402 comprises the phased array antenna system described above.
[0058] In some embodiments, in the phased array antenna system 402 of the satellite platform, each phased array antenna unit is independently mounted on the satellite body 401, or a plurality of phased array antenna units are interconnected through a connecting member (such as a rotating shaft) and then mounted on the satellite body 401.
[0059] In some embodiments, each phased array antenna unit is mounted in thermal insulation with the satellite body 401 through the shielding cover, so as to facilitate preventing heat generated by the phased array antenna unit from being conducted to the satellite body 401, so as to transmit as much heat as possible to the heat dissipation shell and achieve self-heat dissipation through the heat dissipation shell of the phased array antenna unit.
[0060] The detailed description of the exemplary embodiments and implementations of the present application has been provided above by way of example and non-limitation. However, various modifications and adjustments to the above embodiments and implementations will be apparent to those skilled in the art without departing from the scope of the present application in conjunction with the drawings and claims. Therefore, the proper scope of the present application will be determined according to the claims.
Claims
1. A phased array antenna element, comprising: Antenna array, heat sink housing, and signal processing components; The antenna array includes multiple antenna elements arranged in an array, and the antenna array is disposed on the first side surface of the heat dissipation housing, the first side surface of the heat dissipation housing being the reflecting plane of the antenna array; The signal processing component is disposed on a second side surface of the heat dissipation housing opposite to the first side surface, and the heat dissipation housing is used to dissipate heat from the signal processing component.
2. The phased array antenna element according to claim 1, wherein, The area on the first side surface other than the mounting area of the antenna array is coated with a radiating material, and the heat dissipation housing dissipates heat through the radiating material in a radiating manner.
3. The phased array antenna element according to claim 1, wherein, The phased array antenna unit also includes a shielding cover; The shielding cover is disposed on the side of the signal processing component away from the heat dissipation housing, and the shielding cover, the signal processing component, and the heat dissipation housing are fixedly connected.
4. The phased array antenna element according to claim 1, wherein, A thermally conductive structure is filled between the signal processing component and the heat dissipation housing.
5. The phased array antenna element according to any one of claims 1 to 4, wherein, The signal processing component includes an active radio frequency printed circuit board and multiple signal transceiver components integrated on the active radio frequency printed circuit board, and the signal transceiver components are configured in a one-to-one correspondence with the antenna array.
6. The phased array antenna element according to claim 5, wherein, The phased array antenna unit also includes an RF connector. The heat dissipation housing has a through hole corresponding to the position where the antenna element is installed. One end of the RF connector is connected to the antenna element, and the other end of the RF connector is connected to the signal transceiver component corresponding to the antenna element through the through hole.
7. The phased array antenna element according to claim 5, wherein, The phased array antenna unit also includes a power supply component; The power supply component is integrated on the active radio frequency printed circuit board, or the power supply component is disposed on the side of the active radio frequency printed circuit board away from the heat sink housing.
8. A phased array antenna system, comprising at least one phased array antenna element, wherein the phased array antenna element comprises the phased array antenna element as described in any one of claims 1 to 7.
9. The phased array antenna system according to claim 8, wherein, The number of phased array antenna elements is multiple; The multiple phased array antenna elements are arranged in a regular planar shape, or in an irregular planar shape, or in a folded three-dimensional shape.
10. A satellite platform, comprising: The satellite body and the phased array antenna system, wherein the phased array antenna system is disposed on the satellite body, and the phased array antenna system includes the phased array antenna system as described in claim 8 or 9.
11. The satellite platform according to claim 10, wherein, Each phased array antenna element is independently mounted on the satellite body, or multiple phased array antenna elements are interconnected through connectors and then mounted on the satellite body.
12. The satellite platform according to claim 10, wherein, Each phased array antenna element is heat-insulated from the satellite body by a shielding cover.
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