Electronic device

Abstract

The present application relates to the technical field of electronic devices, and in particular to an electronic device. The electronic device comprises a circuit board, a first chip, one or more first optical modules, and a heat dissipation air duct, wherein the circuit board comprises a first surface and a second surface arranged opposite to the first surface in a first direction; the first chip is arranged on the circuit board; the one or more first optical modules are located on the side facing away from the second surface, and a first orthographic projection of the first chip on the circuit board does not overlap a second orthographic projection of the one or more first optical modules on the circuit board; the heat dissipation air duct is provided on the side facing the second surface of the circuit board; taking the arrangement direction of the first chip and the one or more optical modules as a second direction, along the second direction, the circuit board is divided into a first region and a second region, the first chip is arranged in the first region, and along a third direction, at least one of two edges of the first region is provided with a first hollowed-out region; the second orthographic projection of the one or more first optical modules on the circuit board is located in the second region, the second region is provided with a second hollowed-out region, and the first hollowed-out region and the second hollowed-out region are both in communication with the heat dissipation air duct; and the first direction, the second direction and the third direction are perpendicular in pairs.

Description

Electronic device

[0001] Cross Reference to Related Applications

[0002] This application claims priority to the Chinese Patent Application No. 202421470286.5, filed on June 25, 2024, and entitled "Electronic device", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0003] The present application relates to the technical field of electronic devices, and in particular to an electronic device. BACKGROUND

[0004] Chip, optical module and printed circuit board (PCB) are basic components that constitute many electronic devices, such as switches, routers, servers, etc. The optical module is responsible for the transmission and reception of optical signals, and the PCB provides circuit connection and support for the optical module and other electronic components. However, as the functions of electronic devices increase, the performance of processors improves, or the data transmission rate improves, the power consumption of electronic devices gradually increases, and the heat dissipation bottleneck of the heat dissipation device of the related electronic device gradually appears, which cannot meet the heat dissipation needs of the upgraded electronic device. SUMMARY

[0005] In a first aspect, the present application provides an electronic device, which includes a circuit board, a chip, an optical module and a heat dissipation air duct. The circuit board includes a first surface and a second surface arranged opposite along a first direction. The optical module is located on a side of the circuit board facing away from the second surface, and the chip is arranged on the first surface and / or the second surface. The chip and the optical module do not overlap in orthographic projection on the circuit board. The heat dissipation air duct is along the first direction. A direction in which the chip and the optical module are arranged is a second direction. Along the second direction, the circuit board is divided into a first region and a second region. The chip is arranged in the first region. Along a third direction, at least one of two end portions of the first region is provided with a first hollow area. The orthographic projection of the optical module on the circuit board is located in the second region, and the second region is provided with a second hollow area. The first hollow area and the second hollow area are both in communication with the heat dissipation air duct. The first direction, the second direction and the third direction are perpendicular to each other.

[0006] In an embodiment, the electronic device further includes a support plate and a fan. The fan is located on the heat dissipation passage, and the support plate is used to carry the circuit board, the chip, the optical module and / or the fan. The circuit board is perpendicular to the support plate. Along the third direction, an end portion of the first region away from the support plate is provided with the first hollow area, and / or an end portion of the first region close to the support plate is provided with the first hollow area.

[0007] In an embodiment, the first hollow area is a strip-shaped opening extending along the second direction.

[0008] In an embodiment, the chip is located on the first surface, and the electronic device further comprises a ring-shaped baffle located on a side of the chip away from the circuit board, a projection of the ring-shaped baffle on the circuit board is located in the first region, and the ring-shaped baffle surrounds a projection of the chip on the circuit board.

[0009] In an embodiment, the first region is provided with two or more chips arranged along a third direction.

[0010] In an embodiment, the electronic device further comprises a heat dissipation device located on a side of the circuit board away from the first surface, and the heat dissipation device comprises a plurality of heat dissipation fins extending along the first direction.

[0011] In an embodiment, a central axis of the heat dissipation device coincides with a central axis of the chip.

[0012] In an embodiment, the heat dissipation device further comprises an evaporator directly connected to the heat dissipation fins, and the heat dissipation fins extend away from the evaporator.

[0013] In an embodiment, a projection of the evaporator on the circuit board is located in the first region.

[0014] In an embodiment, a size of the heat dissipation fin along the second direction is less than or equal to 180 mm.

[0015] In a second aspect, the various example embodiments of the present application provide an electronic device, which comprises a circuit board, a first chip, one or more first optical modules, and a heat dissipation air duct, wherein the circuit board comprises a first surface and a second surface arranged opposite to the first surface along a first direction; the first chip is arranged on the circuit board; the one or more first optical modules are located on a side away from the second surface, and a first projection of the first chip on the circuit board and a second projection of the one or more first optical modules on the circuit board do not overlap; and the heat dissipation air duct is arranged on a side facing the second surface of the circuit board; wherein a direction of arrangement of the first chip and the one or more first optical modules is a second direction, along the second direction, the circuit board is divided into a first region and a second region, and the first chip is arranged in the first region; along a third direction, at least one of two edges of the first region is provided with a first hollow area; the second projection of the one or more first optical modules on the circuit board is located in the second region; the second region is provided with a second hollow area, and the first hollow area and the second hollow area are in communication with the heat dissipation air duct; and the first direction, the second direction, and the third direction are perpendicular to each other.

[0016] In an embodiment, the one or more first optical modules extend along the first direction.

[0017] In an embodiment, the first hollow area is a strip-shaped opening extending along the second direction.

[0018] In an embodiment, the one or more first light modules comprise a plurality of light module groups, each light module group comprising one or more second light modules, and the second hollowed-out region is arranged between at least two of the plurality of light module groups.

[0019] In an embodiment, the one or more second light modules of each light module group are arranged along a second direction, the plurality of light module groups are arranged along a third direction, and the second hollowed-out region is arranged between each two of the plurality of light module groups.

[0020] In an embodiment, the first chip is located on the first surface, and the electronic device further comprises a ring-shaped baffle located on a side of the first chip away from the circuit board, a projection of the ring-shaped baffle on the circuit board is located in the first region, and the ring-shaped baffle surrounds the first projection of the first chip on the circuit board.

[0021] In an embodiment, the first region is provided with at least one first chip and at least one second chip, and the first chip and the second chip are arranged along a third direction.

[0022] In an embodiment, the electronic device further comprises a heat dissipation device, and the heat dissipation device is located on a side of the circuit board away from the first surface.

[0023] In an embodiment, the heat dissipation device comprises a plurality of heat dissipation fins, and the heat dissipation fins extend along a first direction.

[0024] In an embodiment, the heat dissipation device further comprises an evaporator, and the evaporator is directly connected to the heat dissipation fins, and the heat dissipation fins extend away from the evaporator.

[0025] In an embodiment, a projection of the evaporator on the circuit board is located in the first region.

[0026] In an embodiment, a dimension of the heat dissipation fins along a second direction is less than or equal to 180 mm.

[0027] In an embodiment, a central axis of the heat dissipation device coincides with a central axis of the first chip.

[0028] In an embodiment, the electronic device further comprises a support plate and a fan, the fan is located in the heat dissipation air duct, and the support plate is used to support the circuit board, the first chip, the one or more first light modules, and / or the fan, and the circuit board is perpendicular to the support plate.

[0029] In an embodiment, along the third direction, an end of the first region away from the support plate is provided with the first hollowed-out region, and / or an end of the first region close to the support plate is provided with the first hollowed-out region.

[0030] The electronic device provided in the application, the heat dissipation air duct is along a first direction, that is, the heat dissipation air duct is perpendicular to the circuit board, the chip is arranged in the first region, the orthographic projection of the optical module on the circuit board is located in the second region, the first region is provided with a first hollow area, the second region is provided with a second hollow area, the first hollow area and the second hollow area are both in communication with the heat dissipation air duct, wherein, taking the chip arranged on the first surface as an example, the air in the environment can flow to the chip, and then flow to the heat dissipation passage through the first hollow area of the circuit board; at the same time, the air in the environment can flow to the optical module, and then flow to the heat dissipation passage through the second hollow area of the circuit board. Therefore, the electronic device in the application can relatively independently dissipate heat for the chip and the optical module, avoid mutual influence between the chip and the optical module, the hot air can be discharged to the outside of the device through the heat dissipation air duct, and the heat dissipation efficiency of the electronic device is effectively improved. BRIEF DESCRIPTION OF DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or the prior art, below will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are some embodiments of the present disclosure, and other drawings can also be obtained by those skilled in the art without any creative labor under the premise of the drawings.

[0032] Fig. 1 is a structural schematic diagram of a related electronic device.

[0033] Fig. 2 is a structural schematic diagram of an electronic device according to an embodiment of the present application.

[0034] Fig. 3 is a structural schematic diagram of a circuit board according to an embodiment of the present application.

[0035] Fig. 4 is a structural schematic diagram of a circuit board according to another embodiment of the present application.

[0036] Fig. 5 is a structural schematic diagram of a circuit board according to another embodiment of the present application.

[0037] Fig. 6 is a fluid flow direction schematic diagram of an electronic device according to an embodiment of the present application.

[0038] Fig. 7 is a fluid flow direction schematic diagram of an electronic device according to another embodiment of the present application.

[0039] Fig. 8 is a structural schematic diagram of an electronic device according to an embodiment of the present application.

[0040] Fig. 9 is a structural schematic diagram of an electronic device according to an embodiment of the present application.

[0041] Fig. 10 is a top view of an electronic device according to another embodiment of the present application.

[0042] Fig. 11 is a side view of an electronic device according to another embodiment of the present application.

[0043] Figure 12 is a top view of an electronic device according to another embodiment of this application.

[0044] Figure 13 is a simulation cloud diagram of the temperature difference between two chips in an electronic device according to an embodiment of this application.

[0045] Reference numerals: 10, 100 - Chip; 20, 200 - Optical module; 30 - Fan; 300 - Blower; 310 - Heat dissipation duct; 40 - PCB; 400 - Circuit board; 410 - First area; 420 - Second area; 431, 432 - Edge; 500 - Housing; 510 - Support plate; 520 - Side plate; 530 - Top plate; 540 - Annular baffle; 60, 600 - Heat dissipation device; 61, 610 - Heat dissipation fins; 620 - Evaporator; 70, 700 - Thermally conductive material; 01 - First surface; 02 - Second surface; 03 - First cutout area; 04 - Second cutout area; 05 - Air outlet. Detailed Implementation

[0046] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0047] In the description of the embodiments of this application, unless otherwise stated, " / " means "or". For example, A / B can mean A or B. The "and / or" in the text is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist simultaneously, and B exists alone. In addition, in the description of the embodiments of this application, "multiple" means two or more.

[0048] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly indicating the number of indicated technical features. Thus, a feature defined with "first" and "second" may explicitly or implicitly include one or more of that feature, and in the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more.

[0049] When using the terms "comprising," "having," and "including" as described in this application, another component may be added unless explicitly qualifying terms such as "only," "consisting of," etc. are used. Unless otherwise stated, singular terms may include plural forms and should not be construed as having only one quantity.

[0050] In the present application, orientation terms such as "upper", "lower", "left", "right", etc. are used to describe the relative positional relationship of components, usually based on the normal use direction or installation reference system of the device. For example, "upper" means the part at the top of the device or the higher part, "lower" means the part at the bottom of the device or the lower part, "left" means the part on the left side of the device compared to the center line, and "right" means the part on the right side of the device compared to the center line. However, during use, the device may be flipped, rotated, or otherwise changed in position, in which case the orientation terms should be understood as the direct spatial positional relationship with respect to other components rather than a fixed direction. Those skilled in the art can appropriately understand these terms according to the use environment.

[0051] "Connection" generally refers to the physical or functional connection between two components, which can be direct contact or indirect connection through one or more intermediate elements. In some embodiments, "connection" can be a movable connection, such as in a hinge structure that allows relative movement between two components; or a fixed connection, such as a non-separable connection between two components achieved by welding, bonding, or threaded combination. It can be understood that "intermediate element" refers to a structure between two components, which can be used to change the connection characteristics, optimize force distribution, or achieve specific functional purposes. The intermediate element can include, but is not limited to, a shaft, a gasket, a support structure, or a transmission member. In some embodiments, the "intermediate element" can be an optional component, so that different components can be directly connected; while in other embodiments, the "intermediate element" is a key component to achieve functional requirements, such as isolation or transmission of electrical signals. In the present application, these terms can be appropriately understood by those skilled in the art according to the use environment without specific explanation.

[0052] FIG. 1 is a structural schematic diagram of a related electronic device. Referring to FIG. 1, in the related electronic device (such as a switch), the arrangement direction of the switch chip 10 and the optical module 20 is the same as the air duct direction B of the fan 30, and the optical module 20 and the switch chip 10 are arranged on the surface of the PCB 40 along the air duct direction, that is, the optical module 20 and the switch chip 10 are arranged in series along the air duct direction. Along the fluid flow direction, the structure in the front (the optical module 20 or the switch chip 10) will block the structure in the back, resulting in a lower heat dissipation efficiency of the related switch.

[0053] An electronic device is provided in the embodiments of the present application. FIG. 2 is a structural schematic diagram of an electronic device according to an embodiment of the present application. FIG. 3 is a structural schematic diagram of a circuit board according to an embodiment of the present application. FIG. 4 is a structural schematic diagram of a circuit board according to another embodiment of the present application. FIG. 5 is a structural schematic diagram of a circuit board according to still another embodiment of the present application. Please refer to FIGS. 2-5 together. The electronic device comprises a circuit board 400, a chip 100, an optical module 200 and a heat dissipation air duct 310. The circuit board 400 comprises a first surface 01 and a second surface 02 which are oppositely arranged along a first direction D1. The heat dissipation air duct 310 is along the first direction D1. Here, the air direction of the heat dissipation air duct 310 can be the direction indicated by the arrow in the figure, or can be opposite to the direction indicated by the arrow.

[0054] The optical module 200 is located on the side of the circuit board 400 away from the second surface 02, that is, the optical module 200 is opposite to the first surface 01. Specifically, the optical module 200 can be directly arranged on the first surface 01, or can not be in contact with the circuit board 400, as long as the optical module 200 is signal-connected with the circuit board 400. The optical module 200 is used to convert electrical signals into optical signals for transmission, and is usually connected with external devices in a plug-in manner. The chip 100 can be arranged on the first surface 01 and / or the second surface 02, and is specifically arranged according to actual needs, but it is necessary to ensure that the orthographic projection of the chip 100 and the optical module 200 on the circuit board 400 does not overlap.

[0055] Please refer to FIGS. 2-5 together. Taking the arrangement direction of the chip 100 and the optical module 200 as a second direction D2, along the second direction D2, as shown in FIGS. 2-5, the circuit board 400 is divided into a first region 410 and a second region 420 (the region enclosed by the dashed line frame), the chip 100 is arranged in the first region 410, and at least one of the two edges 431, 432 of the first region 410 is provided with a first hollow area 03 along a third direction D3, wherein the edges 431, 432 include an upper edge 431 and a lower edge 432. The optical module 200 is arranged in the second region 420, and the second region 420 is provided with a second hollow area 04. The first hollow area 03 and the second hollow area 04 are both in communication with the heat dissipation air duct 310 to realize the circulation of air, so that the chip 100 and the optical module 200 can be cooled respectively. Here, the first direction D1, the second direction D2 and the third direction D3 are perpendicular to each other. It is worth mentioning that due to the limitation of process conditions or other factors, there may be some deviations or errors in the actual process, so that the "perpendicular" described above may not be completely accurate. For example, the "perpendicular" described above can be a perpendicular structure allowed within the error range. Of course, the "perpendicular" can also be understood as "basically perpendicular" or "completely perpendicular". Therefore, as long as the "perpendicular" described above generally meets the above conditions, it belongs to the protection scope of the present application.

[0056] The circuit board 400 can be a PCB. Optionally, as shown in FIG. 2, the electronic device further includes a housing 500, which specifically can include a support plate 510, a side plate 520, and a top plate 530, and the support plate 510, the side plate 520, and the top plate 530 surround a receiving cavity. The circuit board 400, the chip 100, and the optical module 200 are arranged in the receiving cavity, and the support plate 510 is used to support the circuit board 400, the chip 100, and the optical module 200. The circuit board 400 is perpendicular to the support plate 510, and the heat dissipation air duct 310 is located in the receiving cavity, so that air can pass through the heat dissipation air duct 310 to dissipate heat from the chip 100 and the optical module 200. In the third direction, an edge of the circuit board 400 away from the support plate 510 is an upper edge 431, and an edge of the circuit board 400 connected to the support plate 510 is a lower edge 432.

[0057] In an optional embodiment of the present application, the chip 100 is arranged on the first surface 01 of the circuit board 400. Air in the environment can flow to the chip 100, then pass through the first hollow area 03 of the circuit board 400, and then flow to the heat dissipation channel 310. In other possible embodiments of the present application, the chip 100 is arranged on the second surface 02 of the circuit board 400. Air in the environment can flow to the first area 410 of the circuit board 400. Under the blocking of the circuit board 400, the air passes through the first hollow area 03 of the circuit board 400, then passes through the chip 100, and then flows into the heat dissipation channel 310.

[0058] Continuing to refer to FIG. 2, the electronic device in the present application further includes a fan 300 arranged in the receiving cavity, and the fan 300 is located on the heat dissipation air duct 310. Optionally, the fan 300 can extract air, and the air direction of the fan 300 is the direction D1 shown in FIG. 2. Alternatively, the fan 300 can also blow air, and the air direction of the fan 300 is opposite to the direction D1 shown in FIG. 2.

[0059] In a possible implementation, as shown in FIG. 3, the first area 410 includes a first hollow area 03, and the first hollow area 03 is arranged at the upper edge 431 of the first area 410. The flow direction of the fluid is specifically described as follows. FIG. 6 is a schematic diagram of the fluid flow direction of an electronic device according to an embodiment of the present application. Referring to FIG. 6, the chip 100 is located on the first surface 01 of the circuit board 400, and the fan 300 is arranged on the heat dissipation air duct 310. Taking the fan 300 as an example of an air extraction fan, the air circulation path is described as follows. When the first hollow area 03 is arranged at the upper edge 431 of the first area 410, under the suction of the fan 300, air in the environment can flow to the chip 100, then pass through the first hollow area 03 at the upper edge 431 of the first area 410, and then enter the heat dissipation air duct 310. Finally, the air flows to the fan 300 and is discharged to the outside of the receiving cavity under the action of the fan 300.

[0060] As shown in FIG. 4, the first region 410 includes a first hollow area 03, and the first hollow area 03 is arranged at the lower edge 432 of the first region 410. Taking the case that the chip 100 is located on the first surface 01 of the circuit board 400 as an example, the flow path of the air is described as follows. Under the suction of the fan 300, the air in the environment can flow to the chip 100, then enter the heat dissipation air duct 310 through the first hollow area 03 at the lower edge 432 of the first region 410, and finally flow to the fan 300, and finally be discharged to the outside of the accommodating cavity under the action of the fan 300.

[0061] In another possible implementation, as shown in FIG. 5, the first region 410 includes two first hollow areas 03, and the upper edge 431 and the lower edge 432 of the first region 410 are each provided with a first hollow area 03. The flow path of the fluid is described as follows. FIG. 7 is a schematic diagram of the fluid flow path of an electronic device according to another embodiment of the present application. Taking the case that the chip 100 is located on the first surface 01 of the circuit board 400 and the fan 300 is an extraction fan as an example, the flow path of the air is described as follows. Under the suction of the fan 300, the air in the environment can flow to the chip 100, then enter the heat dissipation air duct 310 through the first hollow area 03 at the upper edge 431 and the first hollow area 03 at the lower edge 432 of the first region 410, and finally flow to the fan 300, and finally be discharged to the outside of the accommodating cavity under the action of the fan 300.

[0062] Optionally, the first region 410 includes a first circuit layer (not shown in the drawings), which is used to be electrically connected with the chip 100. The first circuit layer is not communicated with the first hollow area 03, so as to avoid affecting the wiring of the first circuit layer by the first hollow area 03. The specific shape of the first hollow area 03 is not limited in the present application, as long as the electrical connection between the circuit board 400 and the chip 100 is not affected.

[0063] Optionally, as shown in FIGS. 2 to 5, the first hollow area 03 is a strip-shaped opening arranged at the first region 410 and extending in the second direction. Under the premise of not affecting the connection between the chip 100 and the circuit board 400, the area of the first hollow area 03 is increased as much as possible, so as to increase the flow rate of the fluid.

[0064] Optionally, the second region 420 includes a second circuit layer (not shown in the drawings), which is used to be electrically connected with the optical module 200. The second circuit layer is not communicated with the second hollow area 04, so as to avoid affecting the wiring of the second circuit layer by the second hollow area 04.

[0065] Optionally, as shown in FIGS. 2-5, the second hollowed-out area 04 can be a plurality of heat dissipation holes arranged in the second area 420, and the heat dissipation holes can be in a strip shape, a circular shape, a triangular shape, or the like. The heat dissipation holes can be arranged according to actual conditions without affecting the connection between the optical module 200 and the circuit board 400.

[0066] FIG. 8 is a structural schematic diagram of an electronic device according to an embodiment of the present application. As shown in FIG. 8, the chip 100 is located on a surface of the circuit board 400 facing away from the fan 300. The electronic device further includes a ring-shaped baffle 540 arranged on a side of the chip 100 facing away from the circuit board 400. A normal projection of the ring-shaped baffle 540 on the circuit board 400 is located in the first area 410 and surrounds a normal projection of the chip 100 on the circuit board 400. The ring-shaped baffle 540 can concentrate the air in the environment to blow toward the chip 100, thereby improving the heat dissipation efficiency of the chip 100.

[0067] FIG. 9 is a structural schematic diagram of an electronic device according to an embodiment of the present application. As shown in FIGS. 8 and 9, the first area 410 is provided with one, two, or more chips 100. When the first area 410 is provided with two or more chips 100, the two or more chips 100 can be arranged along a third direction D3 relative to the arrangement of the two or more chips 100 along a second direction D2. In the arrangement along the third direction D3, the signal loss of the chip 100 is smaller.

[0068] Continuing to refer to FIG. 8, the fan 300 can include a plurality of air outlets 05 arranged along the second direction D2 to improve the suction or blowing efficiency of the hot air in the accommodation cavity.

[0069] Continuing to refer to FIG. 1, in a related electronic device, the heat dissipation device 60 is usually arranged on a side of the chip 10 facing away from the PCB 40. A heat-conducting material 70 is arranged between the heat dissipation device 60 and the chip 10. The extension direction of the heat dissipation fins 61 of the heat dissipation device 60 is perpendicular to the air duct direction B. The heat dissipation fins 61 often extend beyond the air duct of the fan 30, which is not conducive to the heat dissipation of the heat dissipation fins 61.

[0070] Therefore, the electronic device in the embodiments of the present application further comprises a heat dissipation device. FIG. 10 is a top view of an electronic device according to another embodiment of the present application, and FIG. 11 is a side view of the electronic device according to another embodiment of the present application. Referring to FIGS. 10 and 11, the heat dissipation device 600 is located on the side of the circuit board 400 away from the first surface 01. The heat dissipation device 600 comprises a plurality of heat dissipation fins 610 extending in the first direction. The specific extension size of the heat dissipation fins 610 is set according to the distance between the chip 100 and the fan 300. The heat dissipation fins 610 extend in the first direction, which is parallel to the wind direction of the fan 300, so that the fan 300 can dissipate heat from the heat dissipation fins 610. Moreover, the air duct design of the electronic device in the present application can significantly reduce the temperature difference of the heat dissipation fins 610, improve the temperature uniformity of the heat dissipation device 600, and dissipate heat more efficiently.

[0071] Optionally, the central axis Z of the heat dissipation device 600 coincides with the central axis of the chip 100. It should be noted that the number of chips 100 can be one, two or more. When the number of chips 100 is two or more, the central axes of the two or more chips 100 coincide with the central axis of the heat dissipation device 600. The above arrangement can make the heat dissipation device 600 have a symmetrical structure relative to the chip 100, so as to avoid damage to the chip 100 caused by the heat dissipation device 600 in the vibration and drop scenarios.

[0072] Continuing to refer to FIG. 10, the electronic device further comprises a heat-conducting material 700 arranged between the heat dissipation device 600 and the chip 100. The heat-conducting material 700 helps to improve the heat conduction efficiency between the chip 100 and the heat dissipation device 600. The heat-conducting material 700 has a low thermal resistance, which can help heat to pass through the contact surface more quickly, reduce the loss of heat in the conduction process, and increase the heat contact area between the heat dissipation device 600 and the chip 100, so that heat can be more effectively transferred from the high-temperature chip 100 to the heat dissipation device 600.

[0073] FIG. 12 is a top view of an electronic device according to another embodiment of the present application. The heat dissipation device 600 further comprises an evaporator 620 directly connected to the heat dissipation fins 610, and the heat dissipation fins 610 extend away from the evaporator 620. When the chip 100 is arranged on the surface of the circuit board 400 facing the fan 300, the evaporator 620 can be in direct contact with the chip 100, or a heat-conducting material can be arranged therebetween. When the chip 100 is arranged on the surface of the circuit board 400 away from the fan 300, the evaporator 620 can be in direct contact with the circuit board 400, or a heat-conducting material can be arranged therebetween.

[0074] It can be understood that, relative to the related heat dissipation device, the evaporator 620 and the heat dissipation fin 610 are connected by the heat pipe, in the heat dissipation device 600 in the embodiment of the application, the evaporator 620 and the heat dissipation fin 610 are directly connected, which can reduce the number of parts, simplify the structure of the heat dissipation device 600, and make disassembly and assembly simpler. At the same time, because the heat pipe does not need to be arranged, the failure of the heat pipe can be avoided, which leads to the failure of the heat dissipation device 600, as long as the reliability of the evaporator 620 is ensured, the reliability can be improved by more than 50%, and the temperature difference between the chip 100 and the heat dissipation fin 610 is reduced by 5-10℃.

[0075] In addition, because the heat dissipation efficiency of the electronic equipment in the application is improved, the volume of the heat dissipation device 600 is smaller, specifically, the size of the heat dissipation fin 610 along the second direction is less than or equal to 180mm, and the size of the fin of the heat dissipation device 600 in the related electronic equipment along the second direction is about 400mm, the volume of the heat dissipation device 600 in the application is smaller, and the occupied space is reduced, at the same time, the weight of the heat dissipation device 600 is lighter, which can be reduced from more than 2kg to about 1kg, and the problem that the chip 100 is easily damaged in the chip 100 vibration drop scene can be effectively protected.

[0076] Optionally, the evaporator 620 is located in the orthographic projection of the circuit board 400 on the first area 410, avoiding the evaporator 620 from blocking the second hollow area 04, so as to affect the heat dissipation of the optical module 200.

[0077] In summary, in the electronic equipment in the application, the air duct design of the chip 100 and the optical module 200 is optimized, which can significantly improve the heat dissipation efficiency of the electronic equipment, and at the same time, the setting position and structure of the heat dissipation device 600 can be optimized, which can reduce the temperature difference of the heat dissipation fin 610, improve the temperature uniformity of the heat dissipation device 600, and dissipate heat more efficiently to meet the heat dissipation requirements of the chip 100 and the optical module 200.

[0078] Fig. 13 is a simulation cloud chart of the temperature difference of two chips of the electronic equipment according to an embodiment of the application, referring to Fig. 13, when the first area of the circuit board includes two first hollow areas, the maximum temperature difference between the two chips arranged along the third direction D3 of the first area is only 2°, which effectively improves the temperature uniformity of the chip.

[0079] Obviously, those skilled in the art can make various modifications and variations to the embodiments of the application without departing from the spirit and scope of the application. Thus, if these modifications and variations of the application belong to the scope of the claims of the application and their equivalent technologies, the application also intends to include these modifications and variations.

Claims

1. An electronic device comprising: a circuit board comprising a first surface and a second surface disposed opposite to the first surface along a first direction; a first chip disposed on the circuit board; one or more first optical modules located on a side facing away from the second surface, and a first orthographic projection of the first chip on the circuit board and a second orthographic projection of the one or more first optical modules on the circuit board do not overlap; and a heat dissipation air duct disposed on a side facing towards the second surface of the circuit board; wherein, with an arrangement direction of the first chip and the one or more first optical modules being a second direction, the circuit board is divided into a first region and a second region along the second direction, and the first chip is disposed in the first region; along a third direction, at least one of two edges of the first region is provided with a first hollow area; the second orthographic projection of the one or more first optical modules on the circuit board is located in the second region; the second region is provided with a second hollow area, and the first hollow area and the second hollow area are in communication with the heat dissipation air duct; and the first direction, the second direction and the third direction are perpendicular to each other. 2.The electronic device of claim 1, wherein, The one or more first optical modules extend along the first direction. 3.The electronic device of claim 1, wherein, The first hollow area is a strip-shaped opening extending along the second direction.

4. The electronic device according to any one of claims 1 to 3, wherein The one or more first optical modules comprise a plurality of optical module groups, each optical module group comprising one or more second optical modules, and the second hollow area is disposed between at least two of the plurality of optical module groups.

5. The electronic device of claim 4, wherein, The one or more second optical modules of each optical module group are arranged along the second direction, the plurality of optical module groups are arranged along the third direction, and the second hollow area is disposed between each two of the plurality of optical module groups.

6. The electronic device according to any one of claims 1 to 5, wherein The first chip is located on the first surface, and the electronic device further comprises an annular baffle plate disposed on a side of the first chip facing away from the circuit board, an orthographic projection of the annular baffle plate on the circuit board is located in the first region, and the annular baffle plate surrounds the first orthographic projection of the first chip on the circuit board. 7.The electronic device of claim 1, wherein The first region is provided with at least one first chip and at least one second chip, and the first chip and the second chip are arranged along the third direction.

8. The electronic device of any one of claims 1 to 7, wherein, The electronic device further comprises a heat dissipation device located on a side of the circuit board facing away from the first surface.

9. The electronic device of claim 8, wherein, The heat dissipation device comprises a plurality of heat dissipation fins extending along the first direction.

10. The electronic device of claim 9, wherein, The heat dissipation device further comprises an evaporator directly connected to the heat dissipation fins, and the heat dissipation fins extend away from the evaporator.

11. The electronic device of claim 10, wherein, An orthographic projection of the evaporator on the circuit board is located in the first region.

12. The electronic device of any one of claims 9 to 11, wherein, A dimension of the heat dissipation fins along the second direction is less than or equal to 180 mm.

13. The electronic device of any of claims 8 to 12, wherein, A central axis of the heat dissipation device coincides with a central axis of the first chip.

14. The electronic device of any one of claims 1 to 13, wherein, The electronic device further comprises a support plate and a fan, the fan is located in the heat dissipation air duct, the support plate is used to support the circuit board, the first chip, the one or more first optical modules and / or the fan, and the circuit board is perpendicular to the support plate.

15. The electronic device of claim 14, wherein, In the third direction, an end of the first region away from the support plate is provided with the first hollow region, and / or an end of the first region close to the support plate is provided with the first hollow region.

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