Heat dissipation device and communication apparatus

Abstract

The present application relates to the technical field of heat dissipation of apparatuses. Disclosed are a heat dissipation device and a communication apparatus. The heat dissipation device comprises a first liquid cooling plate, a second liquid cooling plate, a first liquid dispenser and a second liquid dispenser. The first liquid cooling plate is configured to be attached to a chip, and comprises a first inner channel through which a cooling working medium flows to take away surface heat, and a first liquid inlet and a first liquid outlet, which are in communication with the first inner channel. The second liquid cooling plate is configured to be attached to an optical module, and comprises a second inner channel through which the cooling working medium flows to take away the surface heat, and a second liquid inlet and a second liquid outlet, which are in communication with the second inner channel. One end of the first liquid dispenser is in communication with the first liquid inlet and the second liquid inlet, and the first liquid dispenser is configured to supply the cooling working medium to the first inner channel and the second inner channel. The heat dissipation device and the communication apparatus provided in the embodiments of the present application can improve the heat dissipation capability for a heating component.

Description

Heat dissipation device and communication device

[0001] The present application claims priority to the Chinese patent application No. 202410821403.6, filed on June 24, 2024, and entitled "Heat dissipation device and communication device", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the field of device heat dissipation, and in particular to a heat dissipation device and a communication device. BACKGROUND

[0003] With the continuous development of communication technology, the data generated and exchanged in various fields also presents an explosive growth. Data transmission and exchange cannot be separated from communication devices, which can transmit data in the form of electrical signals or optical signals. Optical transmission is being widely used in communication devices due to its characteristics of long transmission distance, low signal loss and low waveform distortion.

[0004] Due to the improvement of data transmission capacity, the power consumption of the heat generating components in the communication device also increases, resulting in higher temperature during the operation of the communication device. How to improve the heat dissipation capacity of the heat generating components in the communication device is an important problem. SUMMARY

[0005] The present application aims to provide a heat dissipation device and a communication device, which can improve the heat dissipation capacity of the heat generating components.

[0006] The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of protection of the claims.

[0007] In a first aspect, embodiments of the present application provide a heat dissipation device. The heat dissipation device includes a first liquid cooling plate, a second liquid cooling plate, a first liquid distributor and a second liquid distributor. The first liquid cooling plate is configured to be attached to a chip, and includes a first internal passage for a cooling medium to flow through to carry away surface heat, and a first inlet and a first outlet connected to the first internal passage. The second liquid cooling plate is configured to be attached to an optical module, and includes a second internal passage for a cooling medium to flow through to carry away surface heat, and a second inlet and a second outlet connected to the second internal passage, respectively. One end of the first liquid distributor is connected to the first inlet and the second inlet, and is configured to supply the cooling medium to the first internal passage and the second internal passage. One end of the second liquid distributor is connected to the first outlet and the second outlet, and is configured to recover the cooling medium in the first internal passage and the second internal passage.

[0008] The heat dissipation device provided by the embodiments of the present application is provided with a first liquid cooling plate and a second liquid cooling plate for heat generating components in a communication device, the first liquid cooling plate is used for dissipating heat from a chip, and the second liquid cooling plate is used for dissipating heat from an optical module. The cooling medium flowing in the first liquid cooling plate and the second liquid cooling plate can be input by the first distributor and output by the second distributor. By using the liquid cooling heat dissipation form of the liquid cooling plate, the heat dissipation capacity for the heat generating components can be improved.

[0009] The heat dissipation device and the communication device provided by the embodiments of the present application are provided with a first liquid cooling plate and a second liquid cooling plate for heat generating components in a communication device, the first liquid cooling plate is used for dissipating heat from a chip, and the second liquid cooling plate is used for dissipating heat from an optical module. The cooling medium flowing in the first liquid cooling plate and the second liquid cooling plate can be input by the first distributor and output by the second distributor. By using the liquid cooling heat dissipation form of the liquid cooling plate, the heat dissipation capacity for the heat generating components can be improved.

[0010] In some embodiments, the heat dissipation device further comprises a third distributor, the second liquid cooling plate has a plurality of second liquid cooling plates, the third distributor is provided with a liquid inlet cavity and a liquid return cavity which are isolated from each other, the liquid inlet cavity is connected to one end of the first distributor and the second liquid inlet of the plurality of second liquid cooling plates, and the liquid return cavity is connected to one end of the second distributor and the second liquid outlet of the plurality of second liquid cooling plates. In this way, different optical modules can be cooled by the plurality of second liquid cooling plates, and the third distributor can provide cooling medium for each second liquid cooling plate.

[0011] In some embodiments, the heat dissipation device further comprises a third distributor, the second liquid cooling plate has a plurality of second liquid cooling plates, the second inner channels of the plurality of second liquid cooling plates are sequentially connected in a head-to-tail manner to form a flow channel, the third distributor is provided with a liquid inlet cavity and a liquid return cavity which are isolated from each other, the liquid inlet cavity is connected to one end of the first distributor and one end of the flow channel, and the liquid return cavity is connected to one end of the second distributor and the other end of the flow channel. In this way, the second inner channels of the plurality of second liquid cooling plates can be connected in series, and the number of connecting pipelines between the second liquid cooling plate and the third distributor can be reduced.

[0012] In some embodiments, the flow channel has a plurality of flow channels, one end of the plurality of flow channels is connected to the liquid inlet cavity, and the other end of the plurality of flow channels is connected to the liquid return cavity. In this way, the second inner channels of some of the second liquid cooling plates can be connected in series, and the cooling medium can be ensured not to flow in too many second liquid cooling plates, so as to avoid affecting the heat dissipation effect of the optical module.

[0013] In some embodiments, the third distributor is provided with an inlet joint in communication with the inlet cavity, and an outlet joint in communication with the outlet cavity, the inlet joint is further in communication with one end of the first distributor, and the outlet joint is further in communication with one end of the second distributor, the inlet joint and the outlet joint are located on the same side of the third distributor. In this way, by arranging the inlet joint and the outlet joint on the same side of the third distributor, the connection with other distributors can be facilitated.

[0014] In some embodiments, the second liquid cooling plate is provided with a limiting step at the opposite two side edges. In this way, by arranging the limiting step, the second liquid cooling plate can be limited after installation.

[0015] In some embodiments, the surface edge of the second liquid cooling plate arranged on the optical module is provided with a guide slope, and the guide slope is located on the side of the second liquid cooling plate away from the third distributor. In this way, by arranging the guide slope, the insertion and extraction of the optical module can be guided.

[0016] In some embodiments, the first inner channel has a plurality of first inner channels, one end of the plurality of first inner channels is in communication with the first inlet, and the other end of the plurality of first inner channels is in communication with the first outlet. In this way, by the shunt design of the plurality of first inner channels, the flow resistance can be reduced.

[0017] In some embodiments, the first liquid cooling plate includes a support plate, a base plate and a cover plate, the support plate is provided with a hollow area, the base plate is connected to one side of the hollow area, and the cover plate is covered on the other side of the hollow area, the base plate is provided with a first inner channel, and the first inlet and the first outlet are arranged on the support plate. In this way, by the cooperation between different components, the forming of the first liquid cooling plate can be facilitated.

[0018] In a second aspect, the embodiments of the present application also provide a communication device, which includes a circuit board and the heat dissipation device. The circuit board is provided with a chip and an optical module. The first liquid cooling plate of the heat dissipation device is connected with the circuit board and is attached to the chip, and the second liquid cooling plate of the heat dissipation device is connected with the optical module and is attached to the optical module. BRIEF DESCRIPTION OF DRAWINGS

[0019] FIG. 1 is a perspective structural schematic view of the heat dissipation device in application according to some embodiments of the present application;

[0020] FIG. 2 is a top view structural schematic view of the heat dissipation device in application according to some embodiments of the present application;

[0021] FIG. 3 is a top view structural schematic view of the second liquid cooling plate in application according to some embodiments of the present application;

[0022] FIG. 4 is a right view structural schematic view of the second liquid cooling plate in application according to some embodiments of the present application;

[0023] Figure 5 is a top view of the structure of the heat dissipation device provided in some embodiments of this application when the second liquid cooling plate is combined with the optical mouse cage.

[0024] Figure 6 is a schematic cross-sectional view along direction AA in Figure 5;

[0025] Figure 7 is a right-side view of the structure of the heat dissipation device provided in some embodiments of this application when the second liquid cooling plate is combined with the optical mouse cage.

[0026] Figure 8 is a top view of the second liquid cooling plate in a heat dissipation device provided in some embodiments of this application;

[0027] Figure 9 is a schematic cross-sectional view of the structure along the BB direction in Figure 8;

[0028] Figure 10 is a front view of the heat dissipation device provided in some embodiments of this application when the second liquid cooling plate is connected to the capillary tube.

[0029] Figure 11 is a schematic cross-sectional view of the structure along the CC direction in Figure 10;

[0030] Figure 12 is a schematic cross-sectional view of the structure along the DD direction in Figure 11;

[0031] Figure 13 is a front view schematic diagram of the third liquid distributor in a heat dissipation device provided in some embodiments of this application;

[0032] Figure 14 is a schematic cross-sectional view of the structure along the EE direction in Figure 13;

[0033] Figure 15 is a schematic cross-sectional view of the structure along the FF direction in Figure 13;

[0034] Figure 16 is a schematic cross-sectional view of the structure along the GG direction in Figure 13;

[0035] Figure 17 is a structural schematic diagram of the application of the second liquid cooling plate in the heat dissipation device provided in some other embodiments of this application;

[0036] Figure 18 is a front view of the first liquid cooling plate in a heat dissipation device provided in some embodiments of this application;

[0037] Figure 19 is a schematic cross-sectional view of the structure along HH in Figure 18;

[0038] Figure 20 is a schematic cross-sectional view of the structure along direction II in Figure 19;

[0039] Figure 21 is an exploded structural diagram of the first liquid cooling plate in a heat dissipation device provided in some embodiments of this application;

[0040] Figure 22 is a front view structural diagram of the first liquid distributor in a heat dissipation device provided in some embodiments of this application;

[0041] FIG. 23 is a schematic view of a cross-sectional structure along J-J in FIG. 22;

[0042] FIG. 24 is a right view of a first distributor in a heat dissipation device according to some embodiments of the present application. DETAILED DESCRIPTION

[0043] To make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the various embodiments of the present application will be described in detail below with reference to the drawings. However, those skilled in the art can understand that, in the various embodiments of the present application, many technical details are presented in order to make the readers better understand the present application. However, the technical solutions claimed by the present application can be implemented even without these technical details and various changes and modifications based on the following various embodiments. The division of the following various embodiments is for the convenience of description, and should not constitute any limitation on the specific embodiments of the present application. The various embodiments can be combined with each other and quoted to each other without contradiction.

[0044] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this application; the description and the claims of this application and the above description of drawings, the terms "comprising" and "having" and any variations thereof, are intended to cover not exclusively inclusive.

[0045] In the description of the embodiments of the present application, unless otherwise explicitly specified and limited, the technical terms "mounting", "connection", "connection" and the like should be understood broadly, for example, can be fixedly connected, or can be detachably connected, or can be integrated; can be mechanically connected, or can be electrically connected; can be directly connected, or can be indirectly connected through an intermediate medium; can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0046] Because the traditional data center adopts air cooling heat dissipation system, the energy consumption of the heat dissipation system accounts for as high as 33%. The rapid construction of data centers puts forward higher requirements on heat dissipation and energy consumption, realizes efficient heat dissipation of equipment, reduces power usage effectiveness (PUE), saves power, and meets the market trend of advocating carbon emission reduction and energy saving. PUE is an index for evaluating the energy efficiency of data centers, and its value is greater than 1. The closer to 1, the less non-IT (Information Technology) equipment consumes energy, that is, the better the energy efficiency.

[0047] The communication device is part of the data center for data transmission and exchange, and the heat dissipation requirement of the communication device increases with the increase of data volume. With the continuous development of optical transmission technology, the device for transmitting data mainly includes a switch for optical signal transmission. The chip and the optical module are the main heat generating units of the switch. With the improvement of the data transmission capacity of the switch, the optical module throughput increases, and the power consumption also increases. Therefore, the temperature of the switch is getting higher and higher, and the high temperature will affect the performance of the device, the noise of the whole machine is large, and the service life is shortened.

[0048] And the overall thermal resistance performance of the air-cooled radiator is close to the limit, and the limited space increases the heat dissipation challenge. The traditional air-cooled heat dissipation has been unable to meet the heat dissipation requirements of the switch.

[0049] In order to improve the heat dissipation capacity of the heat generating components, some embodiments of the present application provide a heat dissipation device. The heat dissipation device adopts a liquid cooling heat dissipation form including a liquid cooling plate to dissipate heat from the heat generating components of the switch. Through the liquid cooling system, the cooling working medium is introduced into the device, absorbs the heat generated during the operation of the heat generating components, and then is led out to be cooled outside the device. The temperature of the device can be effectively reduced, the working performance of the device is improved, and the efficient operation of the device is ensured.

[0050] Moreover, the liquid cooling heat dissipation device can efficiently dissipate heat for the chip and the optical module of the communication device, and reduce the power utilization efficiency.

[0051] The heat dissipation device provided by some embodiments of the present application will be described below in combination with FIGS. 1 to 24. The heat dissipation device is used to dissipate heat for the heat generating components in the communication device.

[0052] As shown in FIGS. 1 to 24, the heat dissipation device provided by some embodiments of the present application includes a first liquid cooling plate 11, a second liquid cooling plate 12, a first liquid distributor 13, and a second liquid distributor 14. The first liquid cooling plate 11 is used to be attached to the chip, and the first liquid cooling plate 11 includes a first inner channel 111 for the cooling working medium to flow and take away the surface heat, and a first liquid inlet 112 and a first liquid outlet 113 connected to the first inner channel 111. The second liquid cooling plate 12 is used to be attached to the optical module, and the second liquid cooling plate 12 includes a second inner channel 121 for the cooling working medium to flow and take away the surface heat, and a second liquid inlet 122 and a second liquid outlet 123 connected to the second inner channel 121, respectively. One end of the first liquid distributor 13 is in communication with the first liquid inlet 112 and the second liquid inlet 122, and is used to supply the cooling working medium to the first inner channel 111 and the second inner channel 121. One end of the second liquid distributor 14 is in communication with the first liquid outlet 113 and the second liquid outlet 123, and is used to recover the cooling working medium in the first inner channel 111 and the second inner channel 121.

[0053] The first liquid cooling plate 11 is a part of the heat dissipation device for dissipating heat of the chip. The cooling medium can flow in the first inner channel 111 of the first liquid cooling plate 11 and take away the heat transferred to the surface of the first liquid cooling plate 11 in the flow process. The cooling medium can enter from the first liquid inlet 112 and flow out from the first liquid outlet 113 after absorbing heat in the flow process.

[0054] The second liquid cooling plate 12 is a part of the heat dissipation device for dissipating heat of the optical module. The cooling medium can flow in the second inner channel 121 of the second liquid cooling plate 12 and take away the heat transferred to the surface of the second liquid cooling plate 12 in the flow process. The cooling medium can enter from the second liquid inlet 122 and flow out from the second liquid outlet 123 after absorbing heat in the flow process.

[0055] The first liquid distributor 13 and the second liquid distributor 14 respectively play a role in distributing the cooling medium at the inflow end and the return end. The cooling medium can flow to the first liquid cooling plate 11 and the second liquid cooling plate 12 from one end of the first liquid distributor 13 after entering the inside of the first liquid distributor 13. The parallel connection of the liquid cooling plates in the flow circuit is realized, and the system flow resistance is reduced. The cooling medium flowing in the first liquid cooling plate 11 and the second liquid cooling plate 12 can enter the inside of the second liquid distributor 14 from one end of the second liquid distributor 14 and finally flow out to the outside of the equipment. The cooling medium can be fluorinated liquid, deionized water or propylene glycol solution.

[0056] The heat dissipation device provided by some embodiments of the present application is arranged for the heat generating components in the communication equipment, and the first liquid cooling plate 11 and the second liquid cooling plate 12 are arranged respectively, the chip is cooled by the first liquid cooling plate 11, and the optical module is cooled by the second liquid cooling plate 12. The cooling medium flowing in the first liquid cooling plate 11 and the second liquid cooling plate 12 can be input by the first liquid distributor 13 and output by the second liquid distributor 14. By using the liquid cooling heat dissipation form of the liquid cooling plate, the heat dissipation capacity of the heat generating components can be improved.

[0057] In actual situations, the internal flow channel of the first liquid cooling plate 11 and the second liquid cooling plate 12 can adopt a simple layout of a serpentine flow channel or a parallel flow channel, which can be formed by a CNC (Computer Numerical Control) machine. In order to improve the heat exchange coefficient of the liquid cooling plate, the internal flow channel can also be formed by a chisel tooth process.

[0058] In some embodiments, as shown in FIG. 3 and FIG. 14, the heat dissipation device can further include a third distributor 15, and the second liquid cooling plate 12 can be multiple, the third distributor 15 is provided with a liquid inlet cavity 151 and a liquid return cavity 152 which are isolated from each other, the liquid inlet cavity 151 is connected to one end of the first distributor 13 and the second liquid inlet 122 of the multiple second liquid cooling plates 12, and the liquid return cavity 152 is connected to one end of the second distributor 14 and the second liquid outlet 123 of the multiple second liquid cooling plates 12.

[0059] The multiple second liquid cooling plates 12 can dissipate heat for multiple optical modules. The cooling medium flowing in the multiple second liquid cooling plates 12 can be input by the third distributor 15. The third distributor 15 is arranged adjacent to the multiple second liquid cooling plates 12. The third distributor 15 is divided into two cavities, one side for liquid inlet and the other side for liquid return, and the two cavities are isolated from each other, mainly for the multiple second liquid cooling plates 12 to distribute and converge the cooling medium.

[0060] The liquid inlet cavity 151 of the third distributor 15 can receive the cooling medium transmitted by the first distributor 13, and through the connection between the liquid inlet cavity 151 and the second liquid inlet 122 of the multiple second liquid cooling plates 12, the cooling medium is provided to each second liquid cooling plate 12. After the cooling medium flows through the second inner channel 121 in the second liquid cooling plate 12, it will be connected between the second liquid outlet 123 and the liquid return cavity 152 of the third distributor 15, so that the liquid return cavity 152 receives the cooling medium that absorbs heat. And finally flow out by the second distributor 14.

[0061] Through the arrangement of the third distributor 15, the liquid supply for the multiple second liquid cooling plates 12 is facilitated, and through the flow distribution of the third distributor 15, the uniform heat dissipation of the multiple optical modules is realized. In order to facilitate the uniformity of each optical module, the branch flow resistance, i.e. the flow resistance of the second liquid cooling plate 12, can be increased. Increasing the branch flow resistance is beneficial to the uniform flow distribution of the third distributor 15. Different distributors are used to realize the parallel connection of each level of liquid cooling plate in the flow circuit, the layout is simple and clear, and the system flow resistance is small. The number of second liquid cooling plates 12 can be three, four, five, six, seven or eight.

[0062] In addition, the multiple second liquid cooling plates 12 can also be arranged in series. That is, the cooling medium flowing in the second liquid cooling plate 12 can come from other second liquid cooling plates 12, and only part of the interfaces of the multiple second liquid cooling plates 12 are connected to the third distributor 15.

[0063] As shown in FIG. 17, in some embodiments, the heat dissipation device can further include a third distributor 15, and the second liquid cooling plate 12 can be provided in plurality, and the second inner channels 121 of the plurality of second liquid cooling plates 12 are sequentially connected in series to form a flow channel, and the third distributor 15 is provided with a liquid inlet cavity 151 and a liquid return cavity 152 which are isolated from each other, the liquid inlet cavity 151 is connected to one end of the first distributor 13 and one end of the flow channel, and the liquid return cavity 152 is connected to one end of the second distributor 14 and the other end of the flow channel.

[0064] The second inner channels 121 of the second liquid cooling plate 12 can be connected by a metal pipe 16 to form a flow channel including a plurality of second inner channels 121. One end of the flow channel receives the cooling medium distributed by the liquid inlet cavity 151, and the other end of the flow channel returns the cooling medium to the liquid return cavity 152. In this way, the number of pipes between the second liquid cooling plate 12 and the third distributor 15 can be reduced, and the connection structure can be simplified.

[0065] In some embodiments, as shown in FIG. 17, the flow channel can be provided in plurality, and one end of the plurality of flow channels is connected to the liquid inlet cavity 151, and the other end of the plurality of flow channels is connected to the liquid return cavity 152.

[0066] That is, the plurality of second liquid cooling plates 12 are connected in series and then in parallel. This can make the cooling medium flowing in each flow channel flow through a smaller number of second liquid cooling plates 12, and ensure the heat dissipation capacity of each second liquid cooling plate 12 for the corresponding optical module. As shown in FIG. 17, two second liquid cooling plates 12 are connected in series by a metal pipe 16, and the metal pipe 16 is arranged in a U shape. The two second liquid cooling plates 12 form a group and are connected in parallel to the third distributor 15. The metal pipe 16 can be a copper pipe or a metal corrugated hose, and is welded to the second liquid inlet 122 and the second liquid outlet 123 of the second liquid cooling plate 12.

[0067] For the liquid cooling heat dissipation of the "Belly-to-Belly" stacked optical module, the optical module liquid cooling assembly as shown in FIGS. 1 and 2 can be used. The upper and lower optical module liquid cooling assemblies are mirror-symmetric through the PCB (Printed Circuit Board). During the insertion and removal of the optical module, the heat is taken away by the cooling medium inside the second liquid cooling plate 12.

[0068] In addition, the first distributor 13 has a cavity and adopts a one-in-three-out design. The second distributor 14 has a cavity and adopts a three-in-one-out design. The liquid inlet hole 132 of the first distributor 13 is connected to the liquid outlet hole of the second distributor 14 by liquid cooling quick connection, the three liquid distribution holes 133 of the first distributor 13 supply liquid to the two optical module liquid cooling assemblies and the first liquid cooling plate 11, and the three liquid return holes of the second distributor 14 recycle the cooling liquid of the two optical module liquid cooling assemblies and the first liquid cooling plate 11. The liquid distribution holes 133 of the first distributor 13 and the liquid return holes of the second distributor 14 are connected to the barb joint 18 of the welding connection hose, and the material of the first distributor 13 and the second distributor 14 can be copper or stainless steel. In order to ensure uniform distribution, the system flow resistance of the optical module liquid cooling assembly and the flow resistance of the first liquid cooling plate 11 can be adjusted, or the aperture size of the three distribution holes of the first distributor 13 can be optimized.

[0069] The cooling working medium flows into the first distributor 13 from the liquid cooling joint, supplies liquid to two third distributors 15 and one first liquid cooling plate 11. The third distributor 15 supplies liquid to the upper and lower two layers of second cooling plates through the capillary hose 17. After being converged by the third distributor 15, the cooling liquid finally returns to the second distributor 14.

[0070] In addition, the heat dissipation of the optical module can adopt the combination of the liquid cooling plate and the capillary hose 17, and the flexibility of the capillary hose 17 is used to realize the floating of the liquid cooling plate. In order to compensate for the structural gap in the plugging process of the optical module. As shown in FIG. 11, the capillary hose 17 is in interference fit with the barb head of the second liquid cooling plate 12 to realize sealing, and is locked by a sleeve. The material of the capillary hose 17 is PTFE (Polytetrafluoro-Ethylene). In order to realize convenient disassembly, as shown in FIGS. 10 to 12, the capillary hose 17 and the third distributor 15 can be connected by a flange 155, and the capillary hose 17 is connected with a sleeve 171. The flange 155 is processed with corresponding threaded holes 156 at the corresponding position, and the end of the sleeve 171 can be matched with the threaded holes 156. The end face of the flange 155 is sealed by an O-ring 157.

[0071] As shown in FIGS. 3 and 14, the third distributor 15 can be provided with a liquid inlet joint 153 communicating with the liquid inlet cavity 151, and a liquid outlet joint 154 communicating with the liquid return cavity 152. The liquid inlet joint 153 also communicates with one end of the first distributor 13, and the liquid outlet joint 154 also communicates with one end of the second distributor 14. The liquid inlet joint 153 and the liquid outlet joint 154 are located on the same side of the third distributor 15.

[0072] The liquid inlet connector 153 is communicated with the liquid distribution port of the first liquid distributor 13 through the liquid inlet pipeline 131, and the liquid outlet connector 154 is communicated with the liquid return port of the second liquid distributor 14 through the liquid return pipeline 141. The liquid inlet connector 153 and the liquid outlet connector 154 are arranged on the same side of the third liquid distributor 15, so that the connection of the inlet and outlet liquid hoses is simple. The material of the third liquid distributor 15 can be copper or stainless steel, which is welded with the barb head of the connecting hose to form an integral body.

[0073] In some embodiments, a limiting step 124 can be arranged at the opposite two side edges of the second liquid cooling plate 12.

[0074] The second liquid cooling plate 12 can be installed on the optical mouse cage 21 through the fixing spring 23, and the limiting steps 124 arranged on the two sides of the second liquid cooling plate 12 can be limited by the fixing spring 23. The fixing spring 23 is located in the front-back movement direction of the limiting step 124, so as to prevent the front-back displacement of the second liquid cooling plate 12 during the plugging and unplugging of the optical module. As shown in FIG. 5, the position of the second liquid cooling plate 12 avoids the light guide column 22 above the optical mouse cage 21.

[0075] In addition, as shown in FIG. 9, the surface edge of the second liquid cooling plate 12 arranged on the optical module can be provided with a guide slope 125, and the guide slope 125 is located on the side of the second liquid cooling plate 12 away from the third liquid distributor 15.

[0076] The bottom surface of the second liquid cooling plate 12 is designed with a slope, which can guide the plugging and unplugging of the optical module.

[0077] In actual situation, a PI (Polyimide) film 126 can be arranged on the contact surface between the second liquid cooling plate 12 and the optical module, so as to effectively reduce the contact thermal resistance between the packaging shell of the optical module and the second liquid cooling plate 12.

[0078] In some embodiments, the first liquid cooling plate 11 can have a plurality of first inner channels 111, one end of the plurality of first inner channels 111 is communicated with the first liquid inlet port 112, and the other end of the plurality of first inner channels 111 is communicated with the first liquid outlet port 113.

[0079] The internal part of the first liquid cooling plate 11 is designed to form a plurality of first inner channels 111, so as to reduce the flow resistance. The internal flow channel of the first liquid cooling plate 11 can be formed by using a chisel tooth process.

[0080] As shown in FIG. 21, the first liquid cooling plate 11 can include a support plate 101, a substrate 102 and a cover plate 103. The support plate 101 is provided with a hollow area 1011, the substrate 102 is connected to one side of the hollow area 1011, and the cover plate 103 is covered on the other side of the hollow area. The substrate 102 is provided with the first inner channel 111, and the first liquid inlet port 112 and the first liquid outlet port 113 are arranged on the support plate 101.

[0081] The chip dissipates heat by using the first liquid cooling plate 11. Unlike the traditional split liquid cooling plate, the first liquid cooling plate 11 is designed in an integrated manner with the aluminum alloy support and the cover plate 103. Not only is it convenient to install and maintain, but it can also optimize the structure of the liquid cooling plate and achieve weight reduction. The inlet and outlet of the first liquid cooling plate 11 are designed on both sides of the support plate 101, which can effectively reduce the overall height of the first liquid cooling plate 11 and is suitable for 1U (Unit, height) height switches.

[0082] In actual situations, the first liquid cooling plate 11 can be made of the cover plate 103, the barb joint 18, the base plate 102, and the support plate 101 by vacuum brazing. The cold plate material uses copper or aluminum material with good thermal conductivity, and the specific selection can be based on the compatibility of the liquid cooling medium. The base plate 102 is designed to be ultra-thin, with a thickness of 1.0mm to 2.0mm, which effectively reduces the thermal resistance and improves the heat exchange performance of the first liquid cooling plate 11.

[0083] The support plate 101 can be provided with a reinforcing rib 104 to ensure the pressure resistance of the first liquid cooling plate 11. The inlet and outlet liquid main flow channels are arranged on both sides of the support plate 101 to achieve the uniform temperature performance of the first liquid cooling plate 11, while reducing the flow resistance of the first liquid cooling plate 11.

[0084] Some embodiments of the present application also provide a communication device, which includes a circuit board and the above-described heat dissipation device. The circuit board is provided with a chip and an optical module. The first liquid cooling plate 11 of the heat dissipation device is connected with the circuit board and is attached to the chip, and the second liquid cooling plate 12 of the heat dissipation device is connected with the optical module and is attached to the optical module.

[0085] The heat dissipation device can efficiently dissipate heat for the chip and the optical module of the communication device, which can effectively reduce the temperature of the device, improve the working performance of the device, and ensure the efficient operation of the device.

[0086] Those skilled in the art can understand that the above-mentioned embodiments are specific embodiments for implementing the present application, and in actual applications, various changes can be made in form and details without departing from the spirit and scope of the present application.

Claims

1. A heat dissipation device for dissipating heat from heat-generating components in communication equipment, characterized in that, include: The first liquid cooling plate is used to be attached to the chip. The first liquid cooling plate includes a first inner channel for the flow of cooling working fluid to remove surface heat, and a first liquid inlet and a first liquid outlet connected to the first inner channel. The second liquid cooling plate is used to be attached to the optical module. The second liquid cooling plate includes a second inner channel for the flow of cooling working fluid to remove surface heat, and a second liquid inlet and a second liquid outlet respectively connected to the second inner channel. The first liquid distributor has one end connected to the first liquid inlet and the second liquid inlet, and is used to supply cooling working fluid to the first inner channel and the second inner channel. The second distributor is connected at one end to the first liquid outlet and the second liquid outlet, and is used to recover the cooling working fluid in the first inner channel and the second inner channel.

2. The heat dissipation device according to claim 1, characterized in that, It also includes a third liquid distributor. There are multiple second liquid cooling plates. The third liquid distributor is provided with a liquid inlet chamber and a liquid return chamber that are isolated from each other. The liquid inlet chamber is connected to one end of the first liquid distributor and the second liquid inlet of the multiple second liquid cooling plates. The liquid return chamber is connected to one end of the second liquid distributor and the second liquid outlet of the multiple second liquid cooling plates.

3. The heat dissipation device according to claim 1, characterized in that, It also includes a third liquid distributor. There are multiple second liquid cooling plates. The second inner channels of the multiple second liquid cooling plates are connected end to end to form a flow channel. The third liquid distributor is provided with a liquid inlet chamber and a liquid return chamber that are isolated from each other. The liquid inlet chamber is connected to one end of the first liquid distributor and one end of the flow channel. The liquid return chamber is connected to one end of the second liquid distributor and the other end of the flow channel.

4. The heat dissipation device according to claim 3, characterized in that, The flow channels are multiple, one end of each flow channel is connected to the inlet chamber, and the other end of each flow channel is connected to the return chamber.

5. The heat dissipation device according to claim 3 or 4, characterized in that, The third liquid separator is provided with an inlet connector communicating with the inlet chamber and an outlet connector communicating with the return chamber. The inlet connector is also connected to one end of the first liquid separator, and the outlet connector is also connected to one end of the second liquid separator. The inlet connector and the outlet connector are located on the same side of the third liquid separator.

6. The heat dissipation device according to claim 1, characterized in that, Limiting steps are provided at the opposite edges of the second liquid cooling plate.

7. The heat dissipation device according to any one of claims 2 to 4, characterized in that, The second liquid cooling plate has a guide slope on the edge of its surface attached to the optical module, and the guide slope is located on the side of the second liquid cooling plate away from the third liquid distributor.

8. The heat dissipation device according to claim 1, characterized in that, There are multiple first inner channels, one end of each first inner channel is connected to the first liquid inlet, and the other end of each first inner channel is connected to the first liquid outlet.

9. The heat dissipation device according to claim 8, characterized in that, The first liquid cooling plate includes a support plate, a base plate, and a cover plate. The support plate has a hollow area. The base plate is connected to one side of the hollow area. The cover plate covers the other side of the hollow area. The base plate has a first inner channel. The first liquid inlet and the first liquid outlet are disposed on the support plate.

10. A communication device, characterized in that, include: The circuit board contains chips and optical modules; The heat dissipation device according to any one of claims 1 to 9, wherein the first liquid cooling plate of the heat dissipation device is connected to the circuit board and attached to the chip, and the second liquid cooling plate of the heat dissipation device is connected to the optical module and attached to the optical module.

Images