Light processing method and light processing system

Abstract

The present invention provides: a light processing method with which it is possible to reduce the space for installing a light source for curing a curable resin; and a light processing system in which the space is reduced.　This light processing method includes: a step (a) for supplying a curable resin to a main surface of a base material to be processed; a step (b) for irradiating the main surface of the base material, which is in a conveyance state at a first speed by means of a conveyance unit, with ultraviolet rays from a first light source before or after the execution of the step (a); a step (c) for changing the conveyance speed of the base material by the conveyance unit to a second speed that is slower than the first speed after the execution of the step (b); and a step (d) for curing the curable resin by irradiating the main surface of the base material, which is in a conveyance state at the second speed by means of the conveyance unit, with ultraviolet rays from a second light source that is arranged in the subsequent stage of the first light source.

Description

Light processing method and light processing system

[0001] The present invention relates to a light processing method and a light processing system, and more particularly to a light processing method and a light processing system for curing a curable resin on a substrate.

[0002] Protective materials known as decorative materials and decorative sheets have been used to protect articles such as building interior materials (walls, ceilings, floors, etc.), housing equipment and furniture, and vehicle interior and exterior materials. Decorative materials and decorative sheets are required to have design properties in addition to surface properties such as scratch resistance, stain resistance, and weather resistance, as well as physical and mechanical properties required of protective materials, such as processability.

[0003] In order to improve the design of decorative materials and decorative sheets, methods of imparting a matte effect to the surfaces of decorative materials and decorative sheets are known. By imparting a matte effect to the surfaces of decorative materials and decorative sheets, the texture of the decorative materials and decorative sheets can be improved.

[0004] The present inventors have been investigating a method for imparting a matte effect to the surface of a decorative material or the like, in which a resin layer made of a curable resin is formed on a substrate, and then the resin layer is irradiated with ultraviolet light to form fine irregularities on the surface of the resin layer.

[0005] For example, by using the optical treatment device disclosed in the following Patent Document 1, it is possible to form fine irregularities on the surface of a resin layer formed on a substrate. The optical treatment device described in Patent Document 1 is an optical treatment device for manufacturing semiconductors and liquid crystal elements, and includes a light source that irradiates ultraviolet rays onto the surface of a treatment object transported along a transport path, and an optical treatment chamber that can form a space in an inert gas atmosphere in which the ultraviolet rays are irradiated onto the treatment object.

[0006] JP 2019-018164 A

[0007] After forming fine irregularities on the surface of a resin layer by irradiation with ultraviolet light, the resin layer is cured to stabilize the shape of the resin layer. This allows for the production of a decorative material or the like with a matte finish. Therefore, the inventors considered providing an additional light source for irradiating ultraviolet light to cure the resin layer with the fine irregularities formed on its surface. However, the inventors realized that while a large amount of irradiation (cumulative light amount) is not required to form fine irregularities on the surface of a resin layer, a large amount of irradiation (cumulative light amount) of ultraviolet light is required to cure the resin layer, and simply installing an additional light source would require a huge amount of space for the light source.

[0008] When hardening a resin layer having an uneven surface, a huge amount of space is required to install a light source that irradiates the required ultraviolet light, which is not a realistic method for obtaining decorative materials, etc., with a matte finish.

[0009] Furthermore, as will be described in detail later, this also applies when the surface of a substrate is modified with ultraviolet light, and then a resin layer made of a curable resin is formed on the substrate and the resin layer is cured.

[0010] In view of the above circumstances, an object of the present invention is to provide a light processing method that can reduce the space required for installing a light source that cures a curable resin, and a light processing system that reduces the space required.

[0011] The light treatment method according to the present invention is characterized by comprising the steps of: (a) supplying a curable resin to a main surface of a substrate to be treated; (b) irradiating ultraviolet light from a first light source toward the main surface of the substrate, which is being transported at a first speed, before or after the execution of step (a); (c) changing the transport speed of the substrate to a second speed which is slower than the first speed, after the execution of step (b); and (d) irradiating ultraviolet light from a second light source arranged downstream of the first light source with respect to the transport direction of the substrate, toward the main surface of the substrate, which is being transported at the second speed, to cure the curable resin.

[0012] In this specification, the term "main surface" refers to a surface that is much larger in area than the other surfaces of a plate-like or sheet-like object.

[0013] According to the above method, the second speed at which the substrate is irradiated with ultraviolet light emitted from the second light source is at least slower than the first speed at which the substrate is irradiated with ultraviolet light emitted from the first light source, thereby increasing the integrated amount of ultraviolet light emitted from the second light source for curing the curable resin and reducing the space required for installing the second light source.

[0014] In other words, in order to increase the cumulative amount of ultraviolet light emitted by the secondary light source, it is possible to install a large number of secondary light sources or use a large secondary light source, but with the above method, it is possible to increase the cumulative amount of ultraviolet light emitted by the secondary light source while reducing the number of secondary light sources or the size of the secondary light sources compared to when the first speed and the second speed are equal, for example.

[0015] In the above-described light treatment method, the step (b) may be a step that is carried out after the step (a) and roughens the curable resin on the main surface of the substrate.

[0016] Hereinafter, the process of forming fine irregularities on the surface of the curable resin will be referred to as the "roughening process," and the process of curing the curable resin after the roughening process will be referred to as the "curing process." In the roughening process, the curable resin in a liquid state is irradiated with ultraviolet light to cause it to shrink, thereby forming fine irregularities on the surface of the curable resin. In other words, the surface layer of the curable resin becomes semi-cured. Then, in the curing process, the entire curable resin is cured. Since the roughening process shrinks the surface layer of the curable resin, there is no need to increase the integrated light amount, but in the curing process, it becomes necessary to increase the integrated light amount in order to cure the entire curable resin. Therefore, the integrated light amount of ultraviolet light irradiated on the curable resin in the curing process is higher than the integrated light amount of ultraviolet light in the roughening process.

[0017] In contrast, by transporting the substrate at a second speed slower than the first speed, the integrated amount of ultraviolet light emitted by the second light source can be easily increased to be greater than the integrated amount of ultraviolet light emitted by the first light source. In other words, according to the above method, it is possible to obtain a decorative material or the like imparted with a matte effect while reducing the space required for installing the second light source that cures the curable resin.

[0018] More specifically, the first speed is typically determined based on the cumulative light amount required to form fine irregularities on the surface of the curable resin. This is because if the cumulative light amount becomes excessive, it becomes difficult to form the fine irregularities. Here, if the substrate is transported at a speed equal to the first speed during the curing process, it becomes difficult to increase the cumulative light amount of ultraviolet light during the curing process, which would require, for example, the installation of multiple light sources. In contrast, by making the transport speed of the substrate during the curing process (second speed) slower than the first speed, it becomes possible to increase the cumulative light amount of ultraviolet light during the curing process while reducing the space required for installing the light sources during the curing process.

[0019] In the above-described light treatment method, the step (b) may be a step that is carried out before the step (a) and that modifies the main surface of the substrate.

[0020] While a large cumulative light dose is not required when modifying the main surface of a substrate, a large cumulative light dose is typically required to harden a curable resin. This is because modifying the main surface of a substrate is merely a reaction that oxidizes the surface of the substrate. In other words, the same discussion as in roughening a substrate applies to the point that the first speed is determined based on the cumulative light dose required to modify the substrate. Furthermore, by transporting the substrate at a second speed slower than the first speed, the cumulative light dose of ultraviolet light emitted by the second light source can be easily increased to be greater than the cumulative light dose of ultraviolet light emitted by the first light source. Therefore, according to the above method, even when supplying a curable resin to a substrate after modifying the surface of the substrate with ultraviolet light, the space required for installing the second light source that hardens the curable resin can be reduced.

[0021] The light processing method may include, after performing the step (d), a step of conveying the substrate at a third speed that is slower than the second speed, and then stopping the conveyance of the substrate.

[0022] Preferably, the substrate, after the curing step of the curable resin, is stopped at a predetermined position on the transport unit that transports the substrate and collected. Here, the second speed of the substrate may differ for each sample. In this case, stopping the substrate at the predetermined position requires stopping the transport unit at a timing that takes into account the speed of each substrate. In contrast, according to the above method, after the curing step, the substrate is transported at a third speed slower than the second speed. This makes it easy to stop the substrate at the predetermined position even when the second speed differs for each substrate.

[0023] Furthermore, in the above-described light processing method, the step (b) includes a step of creating an inert gas atmosphere in the light processing space in which the first light source is located, and a step of exhausting gas originating from the light processing space to the outside from an exhaust space partitioned off from the light processing space, and the light processing method may include a step of exhausting gas originating from the light processing space to the outside through an exhaust chamber located upstream or downstream of a light processing chamber having the light processing space and the exhaust space, and spaced apart from the light processing chamber.

[0024] According to the above method, the oxygen concentration in the light treatment space is reduced, and the ultraviolet light emitted by the first light source can be efficiently irradiated onto the substrate. Here, as will be described in detail in the "Embodiment for Carrying Out the Invention" section, it is expected that gas originating from the light treatment space will leak to the outside from the periphery of the light treatment chamber when the substrate conveying speed is changed. In contrast, according to the above method, it is possible to prevent gas originating from the light treatment space from leaking to the outside while maintaining a low oxygen concentration, thereby minimizing the impact on workers who may be present around the light treatment chamber.

[0025] The optical processing system according to the present invention is characterized by comprising: a transport unit that transports a substrate to be processed; a supply unit that supplies a curable resin to a main surface of the substrate; a first light source that irradiates ultraviolet light toward the main surface of the substrate on the transport unit; a second light source that is arranged after the supply unit and the first light source in terms of the transport direction of the transport unit and irradiates ultraviolet light toward the main surface of the substrate on the transport unit; a detection unit that detects the position of the substrate in terms of the transport direction; and a control unit that controls the transport unit to reduce the transport speed of the substrate that is located after the first light source and before the second light source in terms of the transport direction based on a signal from the detection unit.

[0026] According to the above configuration, the second speed at which the substrate is irradiated with ultraviolet light emitted by the second light source can be made slower than the first speed at which the substrate is irradiated with ultraviolet light emitted by the first light source. Therefore, even when the integrated amount of ultraviolet light emitted by the second light source needs to be greater than the integrated amount of ultraviolet light emitted by the first light source to cure the curable resin, the space required to install the second light source can be reduced.

[0027] In the optical processing system, the supply unit may be disposed before the first light source in the transport direction, or after the first light source in the transport direction.

[0028] Furthermore, in the optical processing system, the control unit may be configured to stop the transport unit after reducing the transport speed of the substrate located downstream of the second light source in the transport direction based on a signal from the detection unit.

[0029] The above configuration is preferable because it is easy to stop the substrate at a predetermined position even when the second speed of the substrate is made different for each sample.

[0030] The light processing system may also include a light processing chamber having a light processing space in which the first light source is located and an exhaust space that is partitioned from the light processing space and exhausts gas originating from the light processing space, and an exhaust chamber that is disposed at a position upstream or downstream of the light processing chamber in the transport direction and spaced apart from the light processing chamber and exhausts gas originating from the light processing space to the outside.

[0031] For example, when the transport speed of the substrate is changed, it is expected that gas originating from the light treatment space will leak around the light treatment chamber. In contrast, the above configuration can prevent the gas from leaking to the outside while maintaining a low oxygen concentration. In other words, the above configuration is preferable because it can reduce the impact on workers who may be around the light treatment chamber.

[0032] The optical processing system may include a plurality of exhaust chambers provided both upstream and downstream of the optical processing chamber in the transport direction.

[0033] According to the present invention, there are provided a light processing method that can reduce the space required for installing a light source that cures a curable resin, and a light processing system that reduces the space required.

[0034] 6A is a diagram schematically showing an example of the configuration of an optical processing system according to the present invention. FIG. 6B is a block diagram partially showing the configuration of the optical processing system. FIG. 6C is a diagram schematically showing an example of the transition of the substrate transport speed. FIG. 6D is a flow diagram showing an example of an optical processing method executed by the optical processing system. FIG. 6E is a diagram schematically showing the configuration of the substrate after execution of a supply process. FIG. 6F is a diagram schematically showing the configuration of the substrate after execution of an ultraviolet irradiation process. FIG. 6G is a diagram schematically showing the configuration of an optical processing system according to a second embodiment, following FIG. 1. FIG. 6H is a flow diagram showing an example of a processing method executed by the optical processing system according to the second embodiment. FIG. 6I is an enlarged view of the supply unit in FIG. 6A. FIG. 6I is a diagram schematically showing the configuration of the substrate after execution of a supply process. FIG. 6F is a diagram partially showing the configuration of an optical processing system according to a third embodiment. FIG. 6G is a diagram schematically showing an example of the transition of the substrate transport speed, which is a diagram schematically showing the configuration of a control unit according to FIG. 2. FIG. 6G is a diagram partially showing the configuration of an optical processing system according to a fourth embodiment. FIG. 13A is an enlarged view of a part of FIG. 14A. 10A and 10B are diagrams showing another example of the configuration of the control unit, and further another example of the configuration of the control unit.

[0035] Hereinafter, embodiments of the optical processing method and the optical processing system according to the present invention will be described with reference to the drawings as appropriate. Note that the drawings are all schematic illustrations, and the dimensional ratios and numbers in the drawings do not necessarily correspond to the actual dimensional ratios and numbers.

[0036] [First Embodiment] Fig. 1 is a diagram schematically illustrating an example of the configuration of an optical processing system according to the present invention. Fig. 1 shows a block diagram of some elements of the optical processing system 1. Below, with reference to Fig. 1, the configuration of the optical processing system 1 will be described, and then an optical processing method executed by the optical processing system 1 will be described.

[0037] As shown in FIG. 1, the optical processing system 1 includes a transport unit 3 that transports the substrate W1 to be processed, a supply unit 5 that supplies a curable resin 6 to the main surface of the substrate W1, an optical processing chamber 10, a light source 21, a control unit 30, and a detection unit 31.

[0038] In the following drawings, the X-Y-Z coordinate system will be referred to as appropriate, in which the conveyance direction of the substrate W1 is defined as the X direction and the plane perpendicular to the X direction is defined as the YZ plane. The Z direction is typically the vertical direction.

[0039] In the following description, when a positive or negative direction is to be distinguished from the positive or negative direction, the direction is described with a positive or negative sign, such as "+X direction" and "-X direction." When a direction is to be described without distinguishing between positive and negative directions, the direction is simply described as "X direction." In other words, in this specification, when simply described as "X direction," both the "+X direction" and the "-X direction" are included. The same applies to the Y direction and the Z direction.

[0040] 1, the transport unit 3 supports the substrate W1 to be processed and transports the substrate W1 in the +X direction. As an example, the transport unit 3 includes pulleys (3a, 3b) and a belt 3c.

[0041] The pulleys (3 a, 3 b) are, for example, shaped like a rotating body with an axis extending in the Y direction as its center. The belt 3 c is, for example, shaped like a sheet and wound around the pulleys 3 a and 3 b. The substrate W1 on the belt 3 c is transported due to the rotation of the pulleys (3 a, 3 b).

[0042] The width (dimension in the Y direction) of the pulleys (3a, 3b) is preferably larger than the width of the belt 3c. Furthermore, the width (dimension in the Y direction) of the belt 3c is preferably larger than the dimension in the Y direction of the substrate W1. As an example, the width of the belt 3c is 500 mm or more and 560 mm or less. Furthermore, the thickness (dimension in the Z direction) of the belt 3c is preferably 0.1 mm or more and 2.0 mm or less from the viewpoint of suppressing deflection of the belt 3c and facilitating smooth movement.

[0043] The belt 3c is made of a resin material such as polyurethane or polytetrafluoroethylene (PTFE). Considering that irradiation of oxygen or water in the air with ultraviolet rays (L1, L2), which will be described later, can generate active substances such as ozone and hydroxyl radicals, the belt 3c is preferably made of a fluorine-based resin material such as PTFE.

[0044] In addition, from the viewpoint of facilitating the change of the conveying speed, which will be described later, it is preferable that the belt 3c be configured to be continuous in the X direction.

[0045] (Supply unit 5) The supply unit 5 supplies the curable resin 6 to the main surface of the substrate W1. A conventionally known configuration can be used as a method for supplying the curable resin 6 to the substrate W1. Specifically, examples of the method for supplying the curable resin 6 include die coating, bar coating, spray coating, and curtain coating.

[0046] The curable resin 6 is a photocurable resin that is cured by irradiation with ultraviolet light. For example, the photocurable resin is a bifunctional acrylate UV-curable resin. The photocurable resin includes a precursor of an acrylic resin, a photopolymerization initiator that polymerizes the precursor, and a solvent. The precursor of the acrylic resin is composed of a monomer or oligomer having an acrylic group, or both a monomer and an oligomer having an acrylic group. Instead of the precursor of the acrylic resin, a precursor of another resin (e.g., an epoxy resin) may be used.

[0047] 1, the light processing chamber 10 includes an ultraviolet irradiation unit 11, a purge unit 14, and an exhaust unit (16, 17). The light processing chamber 10 has a partition wall 10a, and in the light processing chamber 10, the ultraviolet irradiation unit 11, the purge unit 14, and the exhaust unit (16, 17) are partitioned by the partition wall 10a. In this embodiment, the light processing chamber 10 is disposed after the supply unit 5, i.e., on the +X side.

[0048] The ultraviolet irradiation unit 11 has a box shape with an opening in the −Z direction. As shown in FIG. 1, the ultraviolet irradiation unit 11 has a light source 11a therein and constitutes a light processing space A1.

[0049] The light source 11a irradiates ultraviolet light L1 toward the main surface of the substrate W1 being transported by the transport unit 3. The ultraviolet light L1 is vacuum ultraviolet light, i.e., light that exhibits light intensity in a wavelength band of at least 205 nm or less. In this specification, "exhibiting light intensity in a wavelength band of at least 205 nm or less" refers to light that exhibits emission intensity at least at 205 nm or less in the emission spectrum of the light source 11a. Examples of such light include: (1) light that exhibits intensity over a broad wavelength band and exhibits an emission spectrum in which the peak emission wavelength showing the maximum intensity is 205 nm or less; (2) light that exhibits an emission spectrum showing multiple maximum intensities (multiple peaks), with any of the multiple peaks falling within the wavelength range of 205 nm or less; and (3) light in which light at 205 nm or less exhibits an integrated intensity of at least 30% or more of the total integrated intensity in the emission spectrum.

[0050] As an example, the light source 11a is configured as a xenon excimer lamp, and emits ultraviolet light L1 whose peak emission wavelength showing maximum intensity is located near 172 nm. The number of light sources 11a in the ultraviolet irradiation unit 11 is arbitrary. Note that the light source 11a may be configured as a solid-state light source such as an LED. The light source 11a corresponds to the "first light source."

[0051] 1, the ultraviolet irradiation unit 11 has gas inlets (12a, 12b). The gas inlets (12a, 12b) are connected to a gas source (not shown) and introduce an inert gas G1 into the ultraviolet irradiation unit 11. By introducing the inert gas G1 into the ultraviolet irradiation unit 11, the light treatment space A1 becomes an inert gas atmosphere. This reduces the oxygen concentration in the light treatment space A1, making it easier to irradiate the substrate W1 with ultraviolet light L1.

[0052] The inert gas G1 may be, for example, nitrogen gas. In order to easily create an inert gas atmosphere in the light treatment space A1, it is preferable that the gas inlet ports (12a, 12b) inject the inert gas G1 along an XY plane including the transport direction of the substrate W1.

[0053] In this specification, the term "inert gas atmosphere" may refer to an atmosphere in which the inert gas G1 occupies 90 vol% or more of the total atmosphere in the light treatment space A1. This preferably results in an oxygen concentration of less than 10 vol% in the light treatment space A1. For example, when 172 nm ultraviolet light travels 4 mm through a space with an oxygen concentration of less than 10%, a light intensity of 50% or more can be ensured. It is preferable that the inert gas G1 occupies 95 vol% or more in the light treatment space A1. In this case, the oxygen concentration in the light treatment space A1 is reliably less than 5%. For example, when 172 nm ultraviolet light travels 4 mm through a space with an oxygen concentration of 5% or less, a light intensity of 70% or more can be ensured. It is even more preferable that the inert gas concentration in the light treatment space A1 occupies 98 vol% or more.

[0054] The purge unit 14 has a box shape with an opening in the −Z direction. The purge unit 14 also has a nozzle 14a, as shown in Fig. 1. The nozzle 14a is connected to a gas source (not shown) and sprays a purge gas G2 made of an inert gas.

[0055] When the substrate W1 transported by the transport unit 3 is transported to a region facing the light processing chamber 10, an air layer originating from the space outside the light processing chamber 10 may remain on the main surface of the substrate W1. In response to this, by injecting purge gas G2 from the nozzle 14a toward the substrate W1, the air layer is reduced and oxygen is prevented from entering the light processing chamber 10. In the present invention, it is optional whether the light processing chamber 10 has a purge unit 14.

[0056] The exhaust units (16, 17) are box-shaped with an opening in the −Z direction. The exhaust unit 16 has an exhaust port 16a, and on the −X side of the purge unit 14, an exhaust space B1 is formed to exhaust gas g1 leaking from the ultraviolet irradiation unit 11 and the purge unit 14.

[0057] The exhaust unit 17 has an exhaust port 17 a and defines an exhaust space B 2 on the +X side of the ultraviolet irradiation unit 11 for exhausting gas g 2 leaking from the ultraviolet irradiation unit 11 .

[0058] Gas g1 is a gas originating from the optical processing space A1 and includes an inert gas G1 and a purge gas G2. Similarly to gas g1, gas g2 is also originating from the optical processing space A1 and includes the inert gas G1. By exhausting gas g1 and gas g2 using the exhaust units (16, 17), it is possible to prevent the inert gas G1 and the purge gas G2 from leaking to the periphery of the optical processing system 1. Considering the possibility that an operator is present around the optical processing system 1, it is preferable that the optical processing chamber 10 has an exhaust unit (16, 17).

[0059] (Light source 21) As shown in FIG. 1, the light source 21 is arranged at a subsequent stage of the light processing chamber 10. The light source 21 irradiates ultraviolet light L2 toward the main surface of the substrate W1 transported by the transport unit 3. This hardens the curable resin 6 supplied to the substrate W1 by the supply unit 5. As an example, the light source 21 is configured to include a plurality of solid-state light sources such as LEDs. Furthermore, the ultraviolet light L2 exhibits a light intensity in a wavelength range of 250 nm or more and 500 nm or less. The light source 21 may be configured, for example, as a high-pressure mercury lamp. The light source 21 corresponds to the "second light source."

[0060] (Detection unit 31) The detection unit 31 is a detection means for detecting the position of the substrate W1 in the X direction in the transport unit 3. As an example, the detection unit 31 includes a sensor 31a arranged at a position subsequent to the light treatment chamber 10 and prior to the light source 21, and detects the position of the substrate W1 by an infrared method. In Figure 1, as an example, an example is shown in which the sensor 31a is installed on the outer wall surface of the light treatment chamber 10.

[0061] The detection unit 31 detects that the substrate W1 is located in the rear stage of the optical processing chamber 10, and transmits a signal d1 to the control unit 30. Note that the method for detecting the position of the substrate W1 by the detection unit 31 is arbitrary, and a conventionally known technique can be used.

[0062] (Control Unit 30) Next, a description will be given of the configuration of the control unit 30 and the control of the transport unit 3 by the control unit 30. The control unit 30 is a control means that transmits control signals to the transport unit 3, and is configured to include a processor such as a CPU, for example.

[0063] Fig. 2 is a block diagram partially illustrating the configuration of the optical processing system 1. As shown in Fig. 2, the control unit 30 has a receiving unit 30a and a transmitting unit 30b. The control unit 30 is configured to be able to receive a signal d1 from the detection unit 31 via the receiving unit 30a (see also Fig. 1).

[0064] Then, based on receiving the signal d1 from the detection unit 31, the control unit 30 transmits a signal d2 to the transport unit 3 to change the transport speed of the transport unit 3. Specifically, based on receiving the signal d1, the control unit 30 reduces the transport speed of the substrate W1 by the transport unit 3.

[0065] Fig. 3 is a diagram schematically illustrating an example of the transition of the conveying speed of the substrate W1. Fig. 3 shows the conveying speed of the substrate W1 relative to the position of the substrate W1 in the X direction. In Fig. 3, region C1 corresponds to the region facing the ultraviolet irradiation unit 11 in the Z direction (see Fig. 1). Region C2 corresponds to the region facing the light source 21 (see Fig. 1).

[0066] 3, after conveyance of the substrate W1 starts at speed sp1, the substrate W1 passes through the region C1 at the same speed. Thereafter, at a timing when the substrate W1 is positioned at least in front of the region C2, the control unit 30 sends a signal d2 to the conveying unit 3, and the conveying speed of the substrate W1 is changed to speed sp2. As a result, the substrate W1 passes through the region C2 at speed sp2. The speed sp1 corresponds to the "first speed," and the speed sp2 corresponds to the "second speed."

[0067] For example, the speed sp1 is equal to or greater than 10 m / min and less than 150 m / min. The speed sp2 is, for example, equal to or greater than 3 m / min and less than 10 m / min, and is slower than the speed sp1.

[0068] Next, a description will be given of a light processing method executed by the light processing system 1. Fig. 4 is a flow chart showing an example of a light processing method 1a executed by the light processing system 1.

[0069] (Substrate W1 Preparation Step S1) As shown in Fig. 4, first, the substrate W1 is prepared. As an example, the substrate W1 can be a plate-shaped member made of resin, steel, or wood. The substrate W1 may also be in a sheet shape. Once the substrate W1 is prepared, transportation of the substrate W1 begins.

[0070] (Curable resin supplying step S2) Next, the supplying unit 5 supplies the curable resin 6 onto the main surface of the substrate W1. Fig. 5A is a diagram schematically showing the configuration of the substrate W1 after the supplying step S2 is performed. By the supplying step S2, as shown in Fig. 5A, a resin layer P1 made of the curable resin 6 is formed on the main surface of the substrate W1.

[0071] Step S2 of supplying the curable resin 6 to the main surface of the substrate W1 corresponds to step (a).

[0072] (Ultraviolet Light Irradiation Step S3) Then, ultraviolet light L1 is irradiated toward the substrate W1, more specifically, toward the resin layer P1 on the substrate W1 (ultraviolet light irradiation step S3). Fig. 5B is a diagram schematically illustrating the configuration of the substrate W1 after the ultraviolet light irradiation step S3 is performed.

[0073] As mentioned above, the ultraviolet light L1 exhibits light intensity at least in a wavelength band of 205 nm or less. By irradiating the resin layer P1 with the ultraviolet light L1, the double bonds of the molecules constituting the resin layer P1 are cleaved, and the cleaved portions react with other molecules. This causes the volume of the resin layer P1 to decrease and shrink, resulting in the formation of an uneven region P1a on the surface of the resin layer P1, which includes fine irregularities that scatter visible light (see FIG. 5B). In other words, the irradiation of the ultraviolet light L1 roughens the surface of the resin layer P1, imparting a matte finish to the substrate W1.

[0074] During the ultraviolet ray irradiation step S3, the substrate W1 is transported at a speed sp1 (see FIG. 3).

[0075] Furthermore, from the viewpoint of efficiently irradiating the substrate W1 with the ultraviolet rays L1, the oxygen concentration in the light treatment space A1 is made low by introducing the inert gas G1 (see FIG. 1 ). That is, the light treatment method 1a includes a step of filling the light treatment space A1 with an inert gas atmosphere when irradiating the substrate W1 with the ultraviolet rays L1.

[0076] Furthermore, as mentioned above, in view of the presence of workers around the optical processing system 1, during the process of creating an inert gas atmosphere in the optical processing space A1, it is preferable to carry out a process of exhausting gases (g1, g2) originating from the optical processing space A1 from the exhaust spaces (B1, B2) of the optical processing chamber 10.

[0077] In this manner, the step S3 of irradiating the substrate W1 with ultraviolet light L1 corresponds to the step (b). In this embodiment, the ultraviolet light irradiation step S3 is a step of roughening the surface of the resin layer P1.

[0078] At this stage, only the resin layer P1 is shrunk, and the entire resin layer P1 is in an uncured state.

[0079] (Conveyance speed reducing step S4) Next, as shown in Fig. 4, after the ultraviolet ray irradiation step S3 is performed, the conveyance speed of the substrate W1 is reduced in step S4. The manner of changing the conveyance speed is as described with reference to Fig. 3. This step S4 corresponds to step (c).

[0080] (Step S5 of curing resin layer P1) Then, in the curing step S5, ultraviolet light L2 emitted from the light source 21 is irradiated onto the resin layer P1 on the substrate W1. As described above, the ultraviolet light L2 has a light intensity in the wavelength range of 250 nm or more and 500 nm or less. As a result, the ultraviolet light L2 acts on the photopolymerization initiator in the resin layer P1, causing a polymerization reaction of the curable resin 6 that constitutes the resin layer P1 to proceed, and the resin layer P1 is cured.

[0081] In this way, the step S5 of irradiating the resin layer P1 on the substrate W1 with ultraviolet light L2 to harden the resin layer P1 corresponds to the step (d).

[0082] Thereafter, the conveyance of the substrate W1 is stopped at a predetermined position downstream of the light source 21, and the substrate W1 is removed (post-process).

[0083] In the ultraviolet irradiation step S3, the resin layer P1 made of the curable resin 6 in a liquid state is irradiated with ultraviolet rays L1, causing it to shrink, thereby forming fine irregularities on the surface of the resin layer P1. Meanwhile, in the curing step S5, the resin layer P1 is irradiated with ultraviolet rays L2, causing the entire resin layer P1 to be cured. Therefore, the integrated light amount of the ultraviolet rays L2 in the curing step S5 is the integrated light amount required to cure the entire resin layer P1. In other words, the integrated light amount of the ultraviolet rays L2 is higher than the integrated light amount of the ultraviolet rays L1 in the ultraviolet irradiation step S3.

[0084] As described above, the conveyance speed of the substrate W1 during the curing step S5 is set to a speed sp2, which is slower than the speed sp1 (see FIG. 3). This makes it easy to increase the integrated light amount of the ultraviolet light L2 irradiated onto the resin layer P1 to be greater than the integrated light amount of the ultraviolet light L1 irradiated onto the resin layer P1. In other words, the light treatment method 1a makes it possible to obtain a decorative material or the like that has a matte finish while reducing the space required for installing the light source 21 that cures the resin layer P1.

[0085] Second Embodiment Next, a second embodiment of the optical processing system 1 will be described, focusing on differences from the first embodiment. Fig. 6 is a diagram schematically illustrating the configuration of the optical processing system 1 according to the second embodiment, following Fig. 1. Fig. 7 is a flow chart illustrating an example of an optical processing method 1a executed by the optical processing system 1 according to the second embodiment.

[0086] 6 differs from the first embodiment in that the supply unit 5 that supplies the curable resin 7 to the substrate W1 is located after the light treatment chamber 10 in the X direction and before the light source 21. That is, as shown in Fig. 7, in this embodiment, the ultraviolet irradiation step S3 is performed before the supply step S2. An example of the configuration of the supply unit 5 will be described later with reference to Fig. 8.

[0087] In this embodiment, the ultraviolet light L1 emitted by the light source 11a is directly irradiated onto the main surface of the substrate W1 (ultraviolet light irradiation step S3). As a result, the main surface of the substrate W1 is hydrophilized. This hydrophilization process occurs because the irradiation of the ultraviolet light L1 oxidizes the main surface of the substrate W1, increasing the number of polar molecules, such as hydroxyl groups (—OH groups), on the main surface. In addition, the irradiation of the ultraviolet light L1 is expected to have the effect of decomposing organic molecules present on the main surface of the substrate W1.

[0088] In this embodiment, the oxygen concentration in the light treatment space A1 during irradiation with the ultraviolet light L1 is set to, for example, 1% to 10%, which allows an active substance such as ozone to be generated from the oxygen present in the light treatment space A1 and used to treat the surface of the substrate W1.

[0089] 7, after the ultraviolet irradiation step S3 is performed and before the curing step S5 is performed, a step S4 of reducing the conveying speed of the substrate W1 is performed (see also FIG. 3). Note that, although an example in which the conveying speed of the substrate W1 is reduced before the supplying step S2 is performed is shown in FIG. 7, the conveying speed of the substrate W1 may be reduced after the supplying step S2 is performed.

[0090] Fig. 8 is an enlarged view of the supply unit 5 in Fig. 6. As shown in Fig. 8, the supply unit 5 includes a plurality of rollers 5a, and supplies the curable resin 7 to the main surface of the substrate W1 by feeding out the sheet-shaped curable resin 7 (supply step S2).

[0091] In this embodiment, the curable resin 7 exhibits adhesive properties. The curable resin 7 has spacers (7a, 7b) on both sides, and the supply unit 5 supplies the curable resin 7 to the substrate W1 while peeling off the spacer 7b on the substrate W1 side. FIG. 9 is a diagram schematically showing the configuration of the substrate W1 after the supply step S2 is performed. As shown in FIG. 9, a resin layer P1 is formed on the main surface of the substrate W1 by performing the supply step S2. In this embodiment, the resin layer P1 has a spacer 7a on the side opposite to the main surface of the substrate W1.

[0092] By performing the ultraviolet irradiation process S3, the hydrophilicity of the main surface of the substrate W1 is improved, and then the curable resin 7 is supplied to the substrate W1, which is preferable as it improves the adhesive strength between the substrate W1 and the resin layer P1.

[0093] Next, the light source 21 irradiates the resin layer P1 with ultraviolet light L2 through the spacer 7a (curing step S5). As a result, the ultraviolet light L2 acts on the photopolymerization initiator in the resin layer P1, causing a polymerization reaction of the curable resin 7 constituting the resin layer P1 to proceed, and the resin layer P1 is cured.

[0094] Here, similar to the first embodiment, the curing step S5 requires a large integrated light amount of ultraviolet light L2, whereas the ultraviolet irradiation step S3 does not require a large integrated light amount of ultraviolet light L1, because the ultraviolet irradiation step S3 is merely a step of oxidizing the surface of the substrate W1.

[0095] In contrast, in this embodiment, as in the first embodiment, the conveying speed of the substrate W1 during the curing step S5 is set to a speed sp2, which is slower than the speed sp1 (see also FIG. 3). This allows the integrated light amount of ultraviolet light L2 irradiated onto the resin layer P1 to be easily greater than the integrated light amount of ultraviolet light L1 irradiated onto the main surface of the substrate W1. In other words, the light processing method 1a according to this embodiment makes it possible to obtain an adhesive laminate material while reducing the space required for installing the light source 21 that cures the resin layer P1. The laminate material can be adhered to a desired location by peeling off the spacer 7a.

[0096] In this embodiment, the adhesive curable resin 7 may be supplied in any manner.

[0097] [Third Embodiment] Next, a third embodiment of the optical processing system 1 will be described, focusing on the differences from the first embodiment. Fig. 10 is a diagram partially illustrating the configuration of the optical processing system 1 according to the third embodiment. Fig. 10 illustrates the configuration of the rear stage of the light source 21 in the optical processing system 1. Note that in this embodiment, the configuration of the front stage of the light source 21 is the same as in the first embodiment.

[0098] 10 also illustrates a planned stop region E1 where the transport of the substrate W1 is stopped after the ultraviolet light L2 is irradiated onto the substrate W1 (curing step S5). After the transport of the substrate W1 is stopped in the planned stop region E1, the substrate W1 is recovered. As an example, the planned stop region E1 corresponds to the position of an opening / closing section for removing the substrate W1 in a chamber (not shown) that houses the transport unit 3.

[0099] Here, it is conceivable to vary the speed sp2 of the substrate W1 for each sample. In this case, to stop the substrate W1 in the planned stop region E1, it becomes necessary to stop the transport unit 3 at a timing that takes into account each speed sp2. In other words, if an operation is performed to stop the transport unit 3 when the substrate W1 reaches a predetermined position, regardless of the speed sp2, the stop position of the substrate W1 will fluctuate depending on the speed sp2. Furthermore, it is conceivable that, depending on the speed sp2, it may be difficult to suddenly stop the substrate W1 in the planned stop region E1.

[0100] 10, a sensor 31b may be disposed downstream of the light source 21. The sensor 31b detects that the substrate W1 is positioned downstream of the light source 21 and transmits a signal d3 to the control unit 30.

[0101] Fig. 11 is a diagram schematically illustrating the configuration of the control unit 30, following Fig. 2. As shown in Fig. 11, when the control unit 30 receives a signal d3 from the detection unit 31, it transmits a signal d4 to the transport unit 3 to reduce the transport speed of the transport unit 3.

[0102] 12 is a diagram schematically illustrating an example of the transition of the conveying speed of the substrate W1 in this embodiment. As shown in FIG. 12, the control unit 30 transmits a signal d4 to the conveying unit 3 to control the conveying speed of the substrate W1 to change from speed sp2 to speed sp3. It is preferable that speed sp3 be slower than speed sp2.

[0103] Furthermore, by setting the speed sp3 to a predetermined speed, even when the speed sp2 is changed, it is possible to stop the substrate W1 in the intended stop area E1 without changing the position at which the operation to stop the transport unit 3 is performed. In other words, when the control unit 30 sends a signal dx to the transport unit 3 to stop the transport unit 3 (see FIG. 12), it is no longer necessary to change the timing of sending the signal dx depending on the speed sp2.

[0104] Therefore, the light processing method 1a preferably includes a step of conveying the substrate W1 at a speed sp3 slower than the speed sp2 after the resin layer P1 is cured (curing step S5), and then stopping the conveyance of the substrate W1. The speed sp3 corresponds to the "third speed."

[0105] As an example, the speed sp3 is preferably equal to or greater than 1 m / min and less than 3 m / min, and more preferably equal to or greater than 2 m / min and less than 3 m / min.

[0106] In this embodiment, similar to the first embodiment, the control unit 30 sends a signal d2 to the conveying unit 3 based on a signal d1 from the detection unit 31, and changes the conveying speed of the substrate W1 from speed sp1 to speed sp2.

[0107] The configuration according to this embodiment can be realized in combination with the second embodiment.

[0108] Fourth Embodiment Next, a fourth embodiment of the optical processing system 1 will be described, focusing on the differences from the first embodiment.

[0109] 13A is a diagram partially illustrating the configuration of an optical processing system 1 according to a fourth embodiment. As shown in FIG. 13A, the optical processing system 1 may have an exhaust chamber 24 located upstream of the optical processing chamber 10 and spaced apart from the optical processing chamber 10 in the X direction. The exhaust chamber 24 is box-shaped with an opening in the −Z direction and has an exhaust port 24a.

[0110] As described above, the exhaust unit 16 exhausts the gas g1 leaking from the ultraviolet irradiation unit 11 and the purge unit 14. Here, when the conveying speed of the substrate W1 is constant, as shown in Fig. 13A, the pressure of the gas g1 sucked in by the exhaust unit 16 from the +X side and the pressure of the gas g3 sucked in from the -X side are balanced, and a mixed gas of the gas g1 and the gas g3 is exhausted from the exhaust port 16a.

[0111] However, when the conveying speed of the substrate W1 is reduced from speed sp1 to speed sp2, the rotation speed of the belt 3c is reduced, which is thought to disrupt the balance between the pressures of gas g1 and gas g3. Figure 13B is an enlarged view of a portion of Figure 13A, and Figure 13B schematically shows the relationship between the pressures of gas g1 and gas g3 at the time when the conveying speed of the substrate W1 is reduced. In other words, as shown in Figure 13B, it is expected that the pressure of gas g1 temporarily exceeds that of gas g3 at the time when the conveying speed of the substrate W1 is reduced, and gas g1 will leak from the -X side of the exhaust unit 16.

[0112] The gas g1 is a gas originating from the optical processing space A1. Therefore, the gas g1 contains an inert gas G1 and a purge gas G2 and has a lower oxygen concentration than air. Because it is expected that workers may be present around the optical processing system 1, it is preferable to prevent the gas g1 from leaking to the outside when the oxygen concentration of the gas g1 is low. Furthermore, as described with reference to the second embodiment, when the oxygen concentration of the optical processing space A1 is, for example, 1% or more and 10% or less, the gas g1 may contain ozone.

[0113] In contrast, by providing the exhaust chamber 24 at a position spaced apart from the optical processing chamber 10 on the −X side of the optical processing chamber 10, even if the gas g1 locally leaks to the −X side of the optical processing chamber 10 (see FIG. 13B), a portion of the gas g1 is drawn into the exhaust chamber 24 by the gas flow f1 generated by exhausting the exhaust chamber 24. Also, although it is conceivable that a portion of the gas g1 will leak out from between the optical processing chamber 10 and the exhaust chamber 24, the gas flow f1 mixes the gas g1 with the air surrounding the exhaust chamber 24, and as a result, it is possible to prevent the gas g1 from leaking to the outside while maintaining a low oxygen concentration.

[0114] If the exhaust chamber 24 were installed adjacent to the light processing chamber 10, it is expected that the gas g1 would leak from a position on the -X side of the exhaust chamber 24. In view of this, it is preferable that the exhaust chamber 24 be arranged at a distance in the X direction from the light processing chamber 10. As an example, the separation distance D1 in the X direction between the light processing chamber 10 and the exhaust chamber 24 is 1 mm or more and 100 mm or less, and preferably 5 mm or more and 20 mm or less. The separation distance D1 can be designed appropriately depending on the transport speed (sp1, sp2) of the substrate W1.

[0115] 14A is a diagram showing another example of the configuration of the optical processing system 1. As shown in Fig. 14A, the optical processing system 1 may have an exhaust chamber 25 at a position downstream of the optical processing chamber 10, spaced apart from the optical processing chamber 10 in the X direction. The configuration of the exhaust chamber 25 is similar to that of the exhaust chamber 24.

[0116] The exhaust unit 17 exhausts the gas g2 originating from the light treatment space A1, similar to the exhaust unit 16. Here, when the substrate W1 (belt 3c) is stopped or the conveying speed of the substrate W1 is constant, the pressure of the gas g2 sucked in by the exhaust unit 17 from the -X side and the pressure of the gas g4 sucked in from the +X side are balanced. However, for example, when the substrate W1 is placed on the conveying unit 3 and then conveyance of the substrate W1 is started, the rotation speed of the belt 3c is increased from the stopped state to a speed sp1 (see FIG. 3).

[0117] In other words, as shown in Figure 14B, when the rotation speed of the belt 3c is increased, the balance of the pressures of gas g2 and gas g4 is thought to be lost. Figure 14B is an enlarged view of a portion of Figure 14A, and Figure 14B schematically shows the relationship between the pressures of gas g2 and gas g4 when the rotation speed of the belt 3c is increased. In other words, when the rotation speed of the belt 3c is increased, the pressure of gas g2 temporarily exceeds that of gas g4, and it is assumed that gas g2 containing inert gas G1 in the light processing chamber 10 leaks out from the +X side of the light processing chamber 10.

[0118] As with gas g1, it is preferable to prevent gas g2 from leaking to the outside. By providing an exhaust chamber 25 at a position spaced apart from the +X side of the optical processing chamber 10 on the +X side of the optical processing chamber 10, even if gas g2 locally leaks to the +X side of the optical processing chamber 10, a portion of the gas g2 is drawn into the exhaust chamber 25 by a gas flow f2 generated by exhaust from the exhaust chamber 25. Although a portion of the gas g2 may leak out from between the optical processing chamber 10 and the exhaust chamber 25, the gas flow f2 mixes the gas g2 with the air surrounding the exhaust chamber 25, thereby preventing the gas g2 from leaking to the outside while maintaining a low oxygen concentration.

[0119] If the exhaust chamber 25 were installed adjacent to the light processing chamber 10, it is expected that the gas g2 would leak from a position on the +X side of the exhaust chamber 25. In view of this, it is preferable that the exhaust chamber 25 be arranged at a distance in the X direction from the light processing chamber 10. As an example, the separation distance D2 in the X direction between the light processing chamber 10 and the exhaust chamber 25 is 1 mm or more and 100 mm or less, and preferably 5 mm or more and 20 mm or less. The separation distance D2 can be designed appropriately depending on the transport speed (sp1, sp2) of the substrate W1.

[0120] As described above, in the optical processing system 1 according to the fourth embodiment, a process of exhausting gas g1 originating from the optical processing space A1 from the exhaust chamber 24 is carried out in the upstream stage of the optical processing chamber 10 (see FIG. 13B). This prevents gas g1 from leaking to the outside while maintaining a low oxygen concentration. Similarly, a process of exhausting gas g2 originating from the optical processing space A1 from the exhaust chamber 25 is carried out in the downstream stage of the optical processing chamber 10 (see FIG. 14B). This prevents gas g2 from leaking to the outside while maintaining a low oxygen concentration. According to this embodiment, even if gases (g1, g2) leak around the optical processing system 1, the impact on workers who may be around the optical processing system 1 can be suppressed, which is preferable.

[0121] 14A, the optical processing system 1 has been described as having both the exhaust chamber 24 and the exhaust chamber 25. However, the optical processing system 1 may have either the exhaust chamber 24 or the exhaust chamber 25.

[0122] Considering that the substrate W1 is transported in the X direction, it is considered that the gas g2 is more likely to leak than the gas g1 from the optical processing chamber 10. In view of this, it is preferable that the optical processing system 1 has at least an exhaust chamber 25.

[0123] [Modifications] Modifications of the optical processing system 1 will now be described.

[0124] <1> In the above description, the curable resin (6, 7) is supplied to the substrate W1 in a conveying state. However, the present invention is not limited to this. Specifically, for example, in the first embodiment, the supply unit 5 configured separately from the conveying unit 3 may supply the curable resin 6 to the substrate W1. In other words, the conveying of the substrate W1 may start after the resin layer P1 is formed on the main surface of the substrate W1.

[0125] <2> In the above, the installation positions of the sensors 31a and 31b are arbitrary.

[0126] <3> In the above description, the detection unit 31 is described as including sensors (31a, 31b), but the present invention is not limited to this example. Fig. 15 is a diagram showing another configuration example of the control unit 30. For example, as shown in Fig. 15, the control unit 30 may include the detection unit 31. The detection unit 31 may be configured to include, for example, an encoder, and may be configured to be able to detect the position of the substrate W1 in the X direction based on the rotation speed of the pulley 3a and the time when transport of the substrate W1 starts.

[0127] 16 is a diagram showing yet another example of the configuration of the control unit 30. As shown in Fig. 16, the control unit 30 may be incorporated into the transport unit 3. In other words, it is optional whether the control unit 30 has a receiving unit 30a.

[0128] <4> The signals d1 to d4 may be wireless signals or wired signals. The same applies to the signal dx.

[0129] <5> It is optional whether or not the optical processing chamber 10 of the optical processing system 1 has an exhaust unit (16, 17). When there are no workers around the optical processing system 1 or when there is an exhaust facility that does not belong to the optical processing system 1, the optical processing system 1 does not need to have an exhaust unit (16, 17).

[0130] This also applies to the exhaust chambers (24, 25) described with reference to the fourth embodiment. In other words, it is optional whether or not the optical processing system 1 has the exhaust chambers (24, 25).

[0131] <6> Furthermore, the present invention is not limited to whether the optical processing chamber 10 has a purge unit 14. When the substrate W1 is irradiated with ultraviolet light L1, if the influence of the air layer above the substrate W1 is negligible, the optical processing system 1 does not need to have the purge unit 14.

[0132] <7> The configuration of the optical processing system 1 described above is merely an example, and the present invention is not limited to the illustrated configurations. Furthermore, the above configurations can be realized by combining them appropriately.

[0133] 1: Optical processing system 1a: Optical processing method 3: Conveying unit 3a, 3b: Pulley 3c: Belt 5: Supply unit 5a: Roller 6, 7: Hardening resin 7a, 7b: Spacer 10: Optical processing chamber 10a: Partition wall 11: Ultraviolet irradiation unit 11a: Light source 12a, 12b: Gas inlet 14: Purge unit 14a: Nozzle 16, 17: Exhaust unit 16a, 17a: Exhaust port 21: Light source 24, 25: Exhaust chamber 24a, 25a: Exhaust port 30: Control unit 30a: Receiving unit 30b: Transmitting unit 31: Detection unit 31a, 31b: Sensor

Claims

1. A light treatment method comprising: a step (a) of supplying a curable resin to a main surface of a substrate to be treated; a step (b) of irradiating ultraviolet light from a first light source toward the main surface of the substrate, which is being transported at a first speed, before or after the execution of step (a); a step (c) of changing the transport speed of the substrate to a second speed which is slower than the first speed, after the execution of step (b); and a step (d) of irradiating ultraviolet light from a second light source arranged downstream of the first light source in the transport direction of the substrate, toward the main surface of the substrate, which is being transported at the second speed, to cure the curable resin.

2. The light processing method according to claim 1, wherein the step (b) is carried out after the step (a) and is a step of roughening the curable resin on the main surface of the substrate.

3. The optical processing method according to claim 1, wherein the step (b) is carried out before the step (a) and is a step of modifying the main surface of the substrate.

4. The light processing method according to any one of claims 1 to 3, further comprising the step of, after step (d), conveying the substrate at a third speed slower than the second speed, and then stopping the conveyance of the substrate.

5. The light processing method according to any one of claims 1 to 3, wherein step (b) comprises the steps of: creating an inert gas atmosphere in the light processing space in which the first light source is located; and exhausting gas originating from the light processing space to the outside from an exhaust space partitioned off from the light processing space; and wherein the light processing method comprises the step of exhausting gas originating from the light processing space to the outside via an exhaust chamber located upstream or downstream of a light processing chamber having the light processing space and the exhaust space, and spaced apart from the light processing chamber.

6. An optical processing system comprising: a transport unit that transports a substrate to be processed; a supply unit that supplies a curable resin to a main surface of the substrate; a first light source that irradiates ultraviolet light toward the main surface of the substrate on the transport unit; a second light source that is arranged after the supply unit and the first light source in terms of the transport direction of the transport unit and irradiates ultraviolet light toward the main surface of the substrate on the transport unit; a detection unit that detects the position of the substrate in terms of the transport direction; and a control unit that controls the transport unit to reduce the transport speed of the substrate that is located after the first light source and before the second light source in terms of the transport direction based on a signal from the detection unit.

7. The light processing system according to claim 6, wherein the supply unit is arranged in front of the first light source in the transport direction.

8. The light processing system according to claim 6, wherein the supply unit is disposed downstream of the first light source in the transport direction.

9. The optical processing system according to any one of claims 6 to 8, wherein the control unit is configured to stop the transport unit after slowing down the transport speed of the substrate located downstream of the second light source in the transport direction based on a signal from the detection unit.

10. An optical processing system according to any one of claims 6 to 8, characterized in that it comprises an optical processing chamber having an optical processing space in which the first light source is located and an exhaust space partitioned from the optical processing space and for exhausting gas originating from the optical processing space; and an exhaust chamber disposed at a position upstream or downstream of the optical processing chamber in relation to the transport direction and spaced apart from the optical processing chamber, for exhausting gas originating from the optical processing space to the outside.

11. The optical processing system according to claim 10, further comprising a plurality of exhaust chambers provided both upstream and downstream of the optical processing chamber in the transport direction.

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