Additive machining device, additive machining method, and additive machining program

Abstract

This additive machining device is provided with: a laser head capable of performing additive machining of a workpiece by supplying a powder material to the workpiece and shining a laser beam at the workpiece; a drive unit for driving the laser head; and a control unit for controlling the additive machining device. The control unit executes: processing for generating a drive path for the laser head on the basis of three-dimensional data defining the shape of an added part of the workpiece; processing for extending the generated drive path in the horizontal direction of the added part; and processing for driving the laser head in accordance with the extended drive path to perform additive machining of the workpiece.

Description

Additional processing device, additional processing method, and additional processing program

[0001] The present disclosure relates to an additive processing device, an additive processing method, and an additive processing program.

[0002] Japanese Patent Laid-Open Publication No. 2023-125537 (Patent Document 1) discloses a processing machine capable of maintaining high processing accuracy of a workpiece during additive processing of the workpiece using a directed energy deposition method. The processing machine includes an additive processing head that supplies powder material to the workpiece and irradiates it with laser light, and a first holding unit and a second holding unit for rotatably holding the workpiece. The first holding unit and the second holding unit are arranged opposite each other in the direction of the workpiece's rotation axis and are configured to hold the workpiece from both sides.

[0003] When the workpiece is irradiated with laser light, the workpiece thermally expands (see paragraph

[0005] ). Therefore, the processing machine moves the first and second holding units relatively away from each other during additional processing of the workpiece. This prevents the surface of the workpiece from being distorted between the first and second holding units.

[0004] Japanese Patent Application Laid-Open No. 2023-125537

[0005] In the additive machining method disclosed in Patent Document 1, there are cases where the workpiece is not additively machined into the intended shape.

[0006] In view of the above, there is a demand for a technique for improving the accuracy of additional machining of a workpiece compared to the conventional technique.

[0007] In one example of the present disclosure, an additive machining apparatus includes a laser head capable of performing additive machining on a workpiece by supplying powder material to the workpiece and irradiating the workpiece with laser light, a drive unit for driving the laser head, and a control unit for controlling the additive machining apparatus, wherein the control unit executes a process of generating a drive path for the laser head based on three-dimensional data defining the shape of an additional portion of the workpiece, a process of extending the generated drive path in a horizontal direction of the additional portion, and a process of driving the laser head according to the extended drive path to additionally machine the workpiece.

[0008] In one example of the present disclosure, the additive machining device further includes a workpiece spindle for holding one side of the workpiece and rotating the workpiece around a predetermined axis, and a tailstock mechanism for tailstocking the other side of the workpiece. In the additive machining process, the control unit performs a process of rotating the workpiece using the workpiece spindle and a process of driving the laser head according to the extended drive path in parallel.

[0009] In one example of the present disclosure, the tailstock mechanism includes a center pin configured to be able to advance and retreat in the direction of the predetermined axis, and an elastic member for pressing the center pin toward the workpiece.

[0010] In one example of the present disclosure, the expanding process includes expanding the generated drive path in a direction of the predetermined axis.

[0011] In one example of the present disclosure, the expanding process includes a process of expanding the generated drive path at least on an installation side of the tailstock mechanism.

[0012] In one example of the present disclosure, the expanding process includes a process of increasing an expanding distance of the drive path in the expanding process as the position of the additional portion is closer to the tailstock mechanism.

[0013] In another example of the present disclosure, there is provided an additive processing method using an additive processing apparatus. The additive processing apparatus includes a laser head capable of performing additive processing on the workpiece by supplying powder material to the workpiece and irradiating the workpiece with laser light, and a drive unit for driving the laser head. The additive processing method includes the steps of generating a drive path for the laser head based on three-dimensional data that defines the shape of an additional portion of the workpiece, extending the generated drive path in a horizontal direction of the additional portion, and driving the laser head according to the extended drive path to additionally process the workpiece.

[0014] In another example of the present disclosure, an additive processing program is provided for an additive processing apparatus. The additive processing apparatus includes a laser head capable of performing additive processing on a workpiece by supplying powder material to the workpiece and irradiating the workpiece with laser light, and a drive unit for driving the laser head. The additive processing program causes the additive processing apparatus to execute the following processes: generating a drive path for the laser head based on three-dimensional data defining the shape of an additional portion of the workpiece; extending the generated drive path in a horizontal direction of the additional portion; and driving the laser head according to the extended drive path to additionally process the workpiece.

[0015] In one example of the present disclosure, an additive machining apparatus includes a laser head capable of performing additive machining on a workpiece by supplying powder material to the workpiece and irradiating the workpiece with laser light, a drive unit for driving the laser head, and a control unit for controlling the additive machining apparatus. The control unit drives the laser head to perform additive machining of an additional portion of a desired shape on the workpiece. The additive machining process includes driving the laser head so that, when additionally machining a horizontal end of the additional portion, an optical axis of the laser head is directed from the outside of the additional portion toward the end in a top view.

[0016] In one example embodiment of the present disclosure, the additional machining device further includes a work spindle for holding one side of the workpiece and rotating the workpiece about a predetermined axis, and a tailstock mechanism for tailstocking the other side of the workpiece. In the additional machining process, the control unit performs the workpiece rotation process by the work spindle and the laser head drive process in parallel.

[0017] In one example of the present disclosure, the tailstock mechanism includes a center pin configured to be movable back and forth in the direction of the specified axis, and an elastic member that generates an elastic force to press the center pin toward the workpiece.

[0018] In one example of the present disclosure, the additional processing process includes driving the laser head so that the angle formed between the optical axis and a plane perpendicular to the specified axis becomes larger as the additional processing position moves toward the very end of the additional portion in the direction of the specified axis.

[0019] In one example of the present disclosure, the additional processing process includes driving the laser head while maintaining the optical axis parallel to the direction of gravity during additional processing other than the end portion.

[0020] In one example of the present disclosure, the additional processing process includes maintaining a constant distance from the laser head to the additional portion in the direction of the optical axis when additional processing is performed at the end and when additional processing is performed at a portion other than the end.

[0021] Another example of the present disclosure provides an additive processing method using an additive processing apparatus. The additive processing apparatus includes a laser head capable of performing additive processing on a workpiece by supplying powder material to the workpiece and irradiating the workpiece with laser light, and a drive unit for driving the laser head. The additive processing method includes a step of additionally processing an additional portion of a desired shape on the workpiece by driving the laser head. The additional processing step includes a step of driving the laser head so that, when additionally processing a horizontal end of the additional portion, an optical axis of the laser head faces from the outside of the additional portion toward the end in a top view.

[0022] The above and other objects, features, aspects and advantages of the present invention will become apparent from the following detailed description of the invention taken in conjunction with the accompanying drawings.

[0023] 11 is a diagram showing an example of the appearance of an additional processing device; FIG. 12 is a diagram showing an example of the device configuration of an additional processing device; FIG. 13 is a diagram showing the state of additional processing of a workpiece by a laser head; FIG. 14 is a diagram for explaining layering processing of a workpiece; FIG. 15 is a diagram showing an example of the drive path expansion process; FIG. 16 is a diagram showing an example of the hardware configuration of a control unit; FIG. 17 is a flowchart showing the flow of additional processing processing; FIG. 18 is a diagram showing the additional processing step of a certain layer; FIG. 19 is a diagram showing the additional processing step following FIG. 10; FIG. 20 is a diagram showing the additional processing step following FIG. 11; FIG. 21 is a diagram showing the mode of additional processing of an end portion in a different layer; FIG. 22 is a flowchart showing the flow of additional processing processing according to a second embodiment.

[0024] Hereinafter, each embodiment according to the present invention will be described with reference to the drawings. In the following description, the same parts and components are denoted by the same reference numerals. Their names and functions are also the same. Therefore, detailed description thereof will not be repeated. Note that each embodiment and each modified example described below may be selectively combined as appropriate.

[0025] First Embodiment A. Appearance of Additional Processing Apparatus 100 First, an additional processing apparatus 100 according to an embodiment will be described with reference to Fig. 1. Fig. 1 is a diagram showing an example of the appearance of the additional processing apparatus 100.

[0026] The additive processing apparatus 100 is a processing machine capable of additive manufacturing (AM) processing of a workpiece. The additive processing apparatus 100 performs additive processing by supplying a powder material to the workpiece and irradiating the workpiece with laser light.

[0027] The additive processing device 100 may be a processing machine capable of subtractive manufacturing (SM) of a workpiece as well as additive processing of the workpiece. Examples of subtractive manufacturing functions include a milling function and a turning function.

[0028] The additional processing device 100 includes, for example, a cover body 130 and an operation panel 200 .

[0029] The cover body 130 is a mechanism for protecting components provided inside the additional processing apparatus 100. The cover body 130 is provided with a door DR. The door DR is, for example, a sliding door. The door DR may be configured to be openable and closable by a drive source such as a motor, or may be configured to be openable and closable manually.

[0030] The operation panel 200 is a general-purpose computer and has a display for displaying various information related to processing. The display may be, for example, a liquid crystal display, an organic electroluminescence (EL) display, or other display device. The display also has a touch panel that accepts various operations for the additional processing device 100 by touch operation.

[0031] <B. Device configuration of additional processing device 100> Next, the device configuration of the additional processing device 100 will be described with reference to Fig. 2. Fig. 2 is a diagram showing an example of the device configuration of the additional processing device 100. Fig. 2 shows, as an example of the additional processing device 100, an AM / SM hybrid processing machine that is capable of additional processing of a workpiece and subtractive processing of a workpiece.

[0032] As described above, the additional processing device 100 includes the cover body 130. The cover body 130 forms the exterior of the additional processing device 100, and also defines the processing area AR in which additional processing of the workpiece W is performed.

[0033] The additional machining device 100 also includes a bed 11 , a tool rest 16 , a workpiece spindle 22 , a tailstock mechanism 25 , a tool spindle 30 , and a laser head 140 .

[0034] For ease of explanation, the direction of the rotation axis of the workpiece spindle 22 will also be referred to as the "Z-axis direction." The Z-axis direction is parallel to the rotation axes AX1 and AX2 shown in FIG. 2. A direction on a horizontal plane perpendicular to the Z-axis direction will also be referred to as the "X-axis direction." A direction perpendicular to both the X-axis and Z-axis directions will be referred to as the "Y-axis direction." In the example of FIG. 2, the Y-axis direction corresponds to the direction of gravity.

[0035] The bed 11 is a base member for supporting various devices within the additive machining apparatus 100. In the example of Fig. 2, the bed 11 supports the tool rest 16, the workpiece spindle 22, the tailstock mechanism 25, the tool spindle 30, and the laser head 140. The bed 11 is installed on the floor of a factory or the like. The bed 11 is made of metal such as cast iron.

[0036] The tool rest 16 has a turret 18. The turret 18 is configured to be rotatable about a rotation axis AX1. The turret 18 holds a plurality of tools spaced apart in the circumferential direction around the rotation axis AX1. The tool rest 16 is also configured to be movable in the X-axis and Y-axis directions by various drive mechanisms such as motors. The tool rest 16 performs turning by bringing a fixed tool held by the turret 18 into contact with a workpiece W that is rotationally driven by a workpiece spindle 22.

[0037] The work spindle 22 is configured to be rotatable while holding one side of the workpiece W. More specifically, the work spindle 22 is provided with a chuck mechanism 23. The chuck mechanism 23 is a mechanism for fixing the workpiece W to the work spindle 22. The work spindle 22 is also configured to be rotatable about a rotation axis AX2 that extends along its axial direction.

[0038] The tailstock mechanism 25 is configured to support the workpiece W from the side opposite the workpiece spindle 22 so as not to impede the rotation of the workpiece W by the workpiece spindle 22. The tailstock mechanism 25 is also configured to be movable in the direction of the rotation axis AX2 by various drive mechanisms such as a motor. As a result, the tailstock mechanism 25 tailstocks the long workpiece W from the side opposite the workpiece spindle 22.

[0039] The configuration for realizing the tailstock is not particularly limited. As an example, the tailstock mechanism 25 includes a center pin 26 and an elastic member 27.

[0040] The center pin 26 is configured to be able to advance and retreat in the direction of the rotation axis AX2 (predetermined axis). As an example, the center pin 26 has a pin shape that extends in the direction of the rotation axis AX2. As a result, the center pin 26 tail-loads the end face of the workpiece W from the side opposite to the workpiece spindle 22.

[0041] The elastic member 27 is built into the tailstock mechanism 25 and is a member that presses the center pin 26 toward the workpiece W. In other words, the elastic member 27 generates an elastic force that presses the center pin 26 toward the workpiece W. This allows the tailstock mechanism 25 to stably support the workpiece W while absorbing thermal expansion of the workpiece W that occurs during additional machining of the workpiece W. As an example, the elastic member 27 is a coil spring that extends around the rotation axis AX2.

[0042] The tool spindle 30 is provided, for example, at a position higher than the workpiece spindle 22 and the tailstock mechanism 25. The tool spindle 30 is configured to allow tools and a laser head 140 to be detachably attached. Fig. 2 shows an example in which the laser head 140 is attached to the tool spindle 30.

[0043] The laser head 140 can be attached to and detached from the tool spindle 30 by, for example, an automatic tool changer (ATC). The additional machining device 100 attaches the laser head 140 to the tool spindle 30 when performing additional machining of the workpiece W. On the other hand, the additional machining device 100 attaches a tool to the tool spindle 30 when performing subtractive machining of the workpiece W.

[0044] An example of the removal process is milling, in which a rotating tool is brought into contact with the workpiece W fixed to the workpiece spindle 22. Another example of the removal process is turning, in which a tool is pressed against the workpiece W rotating about the rotation axis AX2.

[0045] The laser head 140 performs additional machining by a direct energy deposition (DED) method while attached to the tool spindle 30. As a mechanism for realizing the additional machining, the laser head 140 has a head main body 142 and a laser nozzle 146.

[0046] A powder material is supplied via a cable (not shown) to the head body 142. The supplied powder material may be metal powder, resin powder, or any other type of powder that melts when irradiated with laser light.

[0047] The laser nozzle 146 irradiates the workpiece W with laser light and determines an irradiation area of ​​the laser light on the workpiece W. The powder material supplied to the laser head 140 is ejected toward the workpiece W through the laser nozzle 146.

[0048] <C. Additional Machining> Next, the additional machining by the laser head 140 will be described in more detail with reference to Figures 3 and 4. Figure 3 is a diagram showing the additional machining of the workpiece W by the laser head 140 from the Z-axis direction.

[0049] The additive processing apparatus 100 is configured to be able to realize, for example, high-speed additive processing. One example of the high-speed additive processing technology is EHLA (Extreme High-speed Laser Application).

[0050] More specifically, the laser head 140 moves in the direction of the rotation axis AX2 of the workpiece spindle 22 (i.e., in the Z-axis direction) and irradiates the laser beam LS onto the workpiece W that is being rotated by the workpiece spindle 22. As a result, the portion irradiated with the laser beam LS melts, and a molten pool MP is formed on the workpiece W.

[0051] In addition, the laser head 140 supplies powder material PM to the workpiece W in parallel with the irradiation of the laser beam LS. The laser head 140 is configured to supply the powder material PM from the exit side of the laser beam LS toward the location on the workpiece W that is irradiated with the laser beam LS. Because the focus F of the laser beam LS is located above the surface of the workpiece W, the supplied powder material PM is melted by the laser beam LS before it reaches the surface of the workpiece W. As a result, the molten powder material PM is introduced into the molten pool MP. When the molten pool MP hardens on the workpiece W, it becomes a layer SL.

[0052] Layers SL are repeatedly formed on the workpiece W to achieve layering processing. Fig. 4 is a diagram for explaining layering processing on the workpiece W. Fig. 4 shows a cross-sectional view of the workpiece W along the XY plane.

[0053] 4, a flange-shaped additional portion PB is formed on a base material portion PA of the workpiece W. The additional portion PB is formed by stacking a plurality of layers SL1 to SL4 in order.

[0054] More specifically, the additive processing device 100 first drives the laser head 140 to the start position of additive processing on the first layer SL1. The additive processing device 100 then performs the following processes in parallel: rotating the workpiece W using the workpiece spindle 22, driving the laser head 140 toward the positive side in the Z-axis direction, emitting the laser beam LS using the laser head 140, and supplying the powder material PM. When the laser head 140 reaches the end position of additive processing on the layer SL1, the additive processing device 100 stops emitting the laser beam LS using the laser head 140 and supplying the powder material PM. As a result, the layer SL1 is formed on the workpiece W.

[0055] The additional processing device 100 then drives the laser head 140 to the start position of additional processing on the second layer SL2. Next, the additional processing device 100 performs the following processes in parallel: rotating the workpiece W using the workpiece spindle 22, driving the laser head 140 toward the positive side in the Z-axis direction, emitting the laser beam LS using the laser head 140, and supplying the powder material PM. When the laser head 140 has reached the end position of the additional processing on layer SL2, the additional processing device 100 stops emitting the laser beam LS using the laser head 140 and supplying the powder material PM. As a result, the layer SL2 is formed on the workpiece W.

[0056] By repeating the above-described process, the additional processing device 100 can additionally process the base material portion PA of the workpiece W to form additional portions PB of various shapes.

[0057] It should be noted that the formation of the additional portion PB does not necessarily have to be realized by high-speed additional processing. As an example, the additional processing device 100 may form the additional portion PB by additional processing in which the workpiece spindle 22 is rotated at a low speed. In this case, the additional processing device 100 forms the additional portion PB with the focus F of the laser light LS positioned on the surface of the workpiece W.

[0058] D. Driving Path Extension Functions

[0059] (D1. Overview) Next, an overview of the process of expanding the drive path of the laser head 140 will be described.

[0060] The additional processing device 100 generates a drive path for the laser head 140 based on three-dimensional data that defines the shape of the additional portion PB of the workpiece W. Then, the additional processing device 100 drives the laser head 140 in accordance with the generated drive path to form the additional portion PB on the workpiece W.

[0061] At this time, the workpiece W thermally expands due to the irradiation of the laser light during the additional processing, and contracts after the additional processing is completed, which may result in the additional portion PB of the workpiece W becoming smaller than the intended size.

[0062] Therefore, the additional processing device 100 according to this embodiment expands the drive path generated from the three-dimensional data in the horizontal direction of the additional portion PB. As a result, the additional processing device 100 forms an additional portion PB on the workpiece W that is larger in size than the additional portion PB defined in the three-dimensional data. After additional processing of the workpiece W, the additional portion PB shrinks because it reaches room temperature. This allows the additional portion PB to reach the intended size. As a result, the additional processing accuracy of the workpiece is improved compared to conventional methods.

[0063] (D2. Specific Example) Next, a specific example of the process of expanding the drive path of the laser head 140 will be described with reference to Figures 5 and 6. Figure 5 is a diagram that schematically shows the drive path expansion process.

[0064] As shown in step S1, the additive processing device 100 first acquires three-dimensional data 124 including the additional portion PB of the workpiece W. The three-dimensional data 124 is, for example, data designed using CAD (Computer Aided Design). The three-dimensional data 124 includes at least data indicating the shape of the additional portion PB. Note that the three-dimensional data 124 may also include the shape of the base material portion PA that forms the additional portion PB.

[0065] In step S2, the additive machining device 100 generates a drive path R for the laser head 140 based on the three-dimensional data 124. The drive path R is a command value that defines the path of the laser head 140 when forming the additional portion PB on the workpiece W.

[0066] The drive path R may be generated by any method. As one example, the drive path R may be designed by a designer. As another example, the drive path R may be automatically generated by CAM (Computer Aided Manufacturing). CAM is a tool for automatically generating an NC (Numerically Control) program required for processing by the additive processing device 100 based on three-dimensional data 124 created by CAD.

[0067] The NC program generated by the CAM includes a drive path R of the laser head 140. In addition, the NC program may include the attitude (for example, angle) of the laser head 140 during additional processing, the speed of the laser head 140 during additional processing, a laser beam irradiation command (for example, ON / OFF command) for the laser head 140 during additional processing, and a supply command (for example, ON / OFF command) for the powder material PM of the laser head 140 during additional processing.

[0068] The NC program generated by the CAM may include not only command values ​​related to the laser head 140 but also command values ​​related to the workpiece spindle 22. As an example, the NC program may include the rotational speed of the workpiece spindle 22 during additional machining.

[0069] The driving path R is generated for each layer to be formed. In the example of step S2 in Fig. 5, driving paths R1 to RN for forming the first to Nth layers (N is a natural number of 2 or more), respectively, are shown.

[0070] Driving path R1 includes a start position SP1 of the laser head 140 during additional processing of the first layer and an end position EP1 of the laser head 140 during additional processing of the first layer. Driving path R2 includes a start position SP2 of the laser head 140 during additional processing of the second layer and an end position EP2 of the laser head 140 during additional processing of the second layer. Driving path RN includes a start position SPN of the laser head 140 during additional processing of the Nth layer and an end position EPN of the laser head 140 during additional processing of the Nth layer.

[0071] In step S3, the additional processing device 100 expands the drive path R generated from the three-dimensional data 124 in the direction of the rotation axis AX2 (that is, the Z-axis direction) to generate an expanded drive path R'.

[0072] 5, the additional processing device 100 extends the drive paths R1 to RN, respectively, to generate drive paths R1' to RN'. At this time, the additional processing device 100 may extend the drive paths R1 to RN on one side of the rotation axis AX2, or may extend the drive paths R1 to RN on both sides of the rotation axis AX2.

[0073] As an example, the additional processing device 100 moves the start positions SP1 to SPN of the drive paths R1 to RN to the negative side in the Z-axis direction. As a result, the start positions SP1 to SPN are updated to start positions SP1' to SPN'. As a result, drive paths R1' to RN' that are extended to the negative side in the Z-axis direction are generated.

[0074] As another example, the additional processing device 100 moves the end positions EP1 to EPN of the drive paths R1 to RN toward the positive side in the Z-axis direction. As a result, the end positions EP1 to EPN are updated to end positions EP1' to EPN'. As a result, drive paths R1' to RN' that are extended toward the positive side in the Z-axis direction are generated.

[0075] As yet another example, the additive processing device 100 moves the start positions SP1 to SPN of the drive paths R1 to RN to the negative side in the Z-axis direction, and moves the end positions EP1 to EPN of the drive paths R1 to RN to the positive side in the Z-axis direction. As a result, the start positions SP1 to SPN are updated to start positions SP1' to SPN', and the end positions EP1 to EPN are updated to end positions EP1' to EPN'. As a result, drive paths R1' to RN' extended on both sides in the Z-axis direction are generated.

[0076] The additional processing device 100 then drives the laser head 140 according to the expanded drive path R' to form the additional portion PB on the workpiece W. At this time, the additional processing device 100 performs additional processing while holding the workpiece W between the workpiece spindle 22 and the tailstock mechanism 25, as described with reference to FIG. 2 . Because the tailstock mechanism 25 has an elastic member 27 for absorbing thermal expansion, the size of the workpiece W changes in the direction of the rotation axis AX2 during additional processing. In response to this change, the additional processing device 100 expands the drive path R generated from the three-dimensional data 124 in the direction of the rotation axis AX2. Therefore, even if the workpiece W shrinks after the completion of additional processing due to its temperature reaching room temperature, the additional portion PB will have the intended size in the direction of the rotation axis AX2. As a result, the processing accuracy of the additional portion PB in the direction of the rotation axis AX2 is improved.

[0077] The size of the workpiece W is more likely to change on the installation side of the tailstock mechanism 25, which has an elastic function, than on the installation side of the workpiece spindle 22. Therefore, the additional processing device 100 preferably expands the drive path R generated from the three-dimensional data 124 at least on the installation side of the tailstock mechanism 25.

[0078] The expansion method will be described below with reference to Fig. 6. Fig. 6 is a diagram schematically illustrating the process of expanding the driving path R shown in Fig. 5 to a driving path R'.

[0079] Although Figure 6 shows an example in which one drive path R is expanded, typically, the additional processing device 100 applies the expansion process shown in Figure 6 to each of the drive paths R1 to RN shown in Figure 5.

[0080] In this example, the additional processing device 100 expands the drive path R by an expansion distance ΔE1 on the installation side of the workpiece spindle 22, and expands the drive path R by an expansion distance ΔE2 on the installation side of the tailstock mechanism 25. At this time, the additional processing device 100 makes the expansion distance ΔE2 on the installation side of the tailstock mechanism 25 longer than the expansion distance ΔE1 on the installation side of the workpiece spindle 22. This allows the additional processing device 100 to further improve the additional processing accuracy of the workpiece W.

[0081] The expansion distance ΔE1 on the installation side of the workpiece spindle 22 may be 0. In other words, the additional processing device 100 may expand the drive path R only on the installation side of the tailstock mechanism 25.

[0082] Furthermore, the additional portion PB is more likely to be thermally displaced in the direction of the rotation axis AX2 the closer it is to the tailstock mechanism 25. Therefore, the additional processing device 100 may change the expansion distances ΔE1, ΔE2 depending on the position of the additional portion PB relative to the workpiece W. In this case, the additional processing device 100 increases the expansion distances ΔE1, ΔE2 the closer the position of the additional portion PB is to the tailstock mechanism 25. This allows the additional processing device 100 to further improve the accuracy of additional processing of the workpiece W.

[0083] The extension distance of the drive path R can be determined by various factors other than those described above. As an example, the additional processing device 100 increases the extension distances ΔE1 and ΔE2 as the width of the workpiece W in the direction of the rotation axis AX2 increases. In other words, the additional processing device 100 decreases the extension distances ΔE1 and ΔE2 as the width of the workpiece W in the direction of the rotation axis AX2 decreases.

[0084] As another example, the additional processing device 100 increases the extension distances ΔE1, ΔE2 as the temperature of the workpiece W during additional processing increases. In other words, the additional processing device 100 decreases the extension distances ΔE1, ΔE2 as the temperature of the workpiece W during additional processing decreases. The temperature of the workpiece W during additional processing may be measured by a temperature sensor or may be estimated based on the irradiation intensity of the laser light irradiated from the laser head 140.

[0085] <E. Drive Mechanism of Additional Processing Apparatus 100> Next, the drive mechanism of the additional processing apparatus 100 will be described with reference to Fig. 7. Fig. 7 is a diagram showing an example of the drive mechanism of the additional processing apparatus 100.

[0086] As shown in FIG. 7, the additional processing device 100 includes a control unit 50 and drive units 210, 220, 230A, 230B, and 240.

[0087] The control unit 50 controls various devices within the additional processing apparatus 100. The control unit 50 may have any configuration. The control unit 50 may be configured with a single control unit or multiple control units. As an example, the control unit 50 includes at least one of a CNC (Computer Numerical Control) and a PLC (Programmable Logic Controller).

[0088] The drive unit 210 is a drive mechanism for rotationally driving the workpiece spindle 22. The drive unit 210 may be composed of a single drive unit or multiple drive units. In the example of Fig. 7, the drive unit 210 is composed of a motor driver 211C and a motor 212C.

[0089] The motor driver 211C sequentially receives input of the target rotation angle or target rotation speed of the work spindle 22 from the control unit 50, and outputs a current corresponding to the target rotation angle or target rotation speed to the motor 212C. This causes the work held by the work spindle 22 to rotate around the Z-axis direction as the center of rotation. The motor 212C may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0090] The drive unit 220 is a drive mechanism for driving the tailstock mechanism 25. The drive unit 220 may be composed of a single drive unit or multiple drive units. In the example of Fig. 7, the drive unit 220 is composed of a motor driver 221Z and a motor 222Z.

[0091] The motor driver 221Z sequentially receives input of target positions for the workpiece spindle 22 from the control unit 50 and outputs a current corresponding to the target positions to the motor 222Z. This causes the motor 222Z to move the tailstock mechanism 25 to any position in the Z-axis direction. The motor 222Z may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0092] The drive unit 230A is a drive mechanism for moving the position of the tool spindle 30. The above-mentioned laser head 140 is driven by being attached to the tool spindle 30. The drive unit 230A may be composed of a single drive unit or may be composed of multiple drive units. In the example of FIG. 7, the drive unit 230A is composed of motor drivers 231X to 231Z and motors 232X to 232Z.

[0093] The motor driver 231X sequentially receives input of target positions of the tool spindle 30 in the X-axis direction from the control unit 50, and outputs a current corresponding to the target positions to the motor 232X. In this way, the motor 232X drives the tool spindle 30 to any position in the X-axis direction. The motor 232X may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0094] The motor driver 231Y sequentially receives input of target positions of the tool spindle 30 in the Y-axis direction from the control unit 50, and outputs a current corresponding to the target positions to the motor 232Y. In this way, the motor 232Y drives the tool spindle 30 to any position in the Y-axis direction. The motor 232Y may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0095] The motor driver 231Z sequentially receives input of target positions of the tool spindle 30 in the Z-axis direction from the control unit 50, and outputs a current corresponding to the target positions to the motor 232Z. This causes the motor 232Z to move the tool spindle 30 to any position in the Z-axis direction. The motor 232Z may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0096] The drive unit 230B is a drive mechanism for rotationally driving the tool spindle 30. The drive unit 230B may be configured with a single drive unit or multiple drive units. In the example of Fig. 7, the drive unit 230B is configured with motor drivers 231A and 231B and motors 232A and 232B.

[0097] The motor driver 231A sequentially receives input of a target rotation angle or a target rotation speed of the tool spindle 30 about the X-axis direction from the control unit 50, and outputs a current corresponding to the target rotation angle or the target rotation speed to the motor 232A. The motor 232A drives the tool spindle 30 to rotate about the X-axis direction. The motor 232A may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0098] The motor driver 231B sequentially receives input of a target rotation angle or a target rotation speed of the tool spindle 30 around the axial direction of the tool spindle 30 as a rotation center from the control unit 50, and outputs a current corresponding to the target rotation angle or the target rotation speed to the motor 232B. The motor 232B drives the tool spindle 30 to rotate around the axial direction of the tool spindle 30 as a rotation center. The motor 232B may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0099] The drive unit 240 is a drive mechanism for driving the tool post 16 and the turret 18. The drive unit 240 may be composed of a single drive unit or multiple drive units. In the example of Fig. 7, the drive unit 240 is composed of motor drivers 241C, 241Y, and 241Z and motors 242C, 242Y, and 242Z.

[0100] The motor driver 241C receives a target value for the rotation angle of the turret 18 about the Z-axis direction, and outputs a current corresponding to the target value to the motor 242C. In this way, the motor driver 241C controls the rotation angle of the turret 18 about the Z-axis direction. The motor 242C may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0101] The motor driver 241Y sequentially receives input of target positions of the tool post 16 in the Y-axis direction from the control unit 50, and outputs a current corresponding to the target positions to the motor 242Y. This causes the motor 242Y to move the tool post 16 to any position in the Y-axis direction. The motor 242Y may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0102] The motor driver 241Z sequentially receives input of target positions of the tool post 16 in the Z-axis direction from the control unit 50, and outputs a current corresponding to the target position to the motor 242Z. This causes the motor 242Z to move the tool post 16 to any position in the Z-axis direction. The motor 242Z may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0103] <F. Hardware Configuration of Control Unit 50> Next, the hardware configuration of the control unit 50 shown in Fig. 7 will be described with reference to Fig. 8. Fig. 8 is a diagram showing an example of the hardware configuration of the control unit 50.

[0104] As described above, the control unit 50 may be a CNC or a PLC. Fig. 8 shows the hardware configuration of the control unit 50 as a CNC.

[0105] The control unit 50 includes, for example, a control circuit 101, a read only memory (ROM) 102, a random access memory (RAM) 103, a communication interface 104, and an auxiliary storage device 120. These components are connected to an internal bus 109.

[0106] The control circuit 101 is configured, for example, by at least one integrated circuit, which may be configured, for example, by at least one central processing unit (CPU), at least one graphics processing unit (GPU), at least one application specific integrated circuit (ASIC), at least one field programmable gate array (FPGA), or a combination thereof.

[0107] The control circuit 101 controls the operation of the control unit 50 by executing various programs such as a machining program 122. The machining program 122 is a program for realizing various processes described in this specification. Upon receiving an execution command for the machining program 122, the control circuit 101 reads the machining program 122 from the ROM 102 to the RAM 103. The RAM 103 functions as a working memory and temporarily stores various data required for executing the machining program 122.

[0108] The communication interface 104 is an interface for realizing communication with various devices. The additional processing device 100 communicates with, for example, various drive units (e.g., the above-mentioned drive units 210, 220, 230A, 230B, 240, etc.) for realizing additional processing of the workpiece via the communication interface 104.

[0109] The auxiliary storage device 120 is a storage medium such as a hard disk or a flash memory. The auxiliary storage device 120 stores the machining program 122, the above-mentioned three-dimensional data 124, etc. The storage location of the machining program 122 and the three-dimensional data 124 is not limited to the auxiliary storage device 120, and may be stored in a storage area of ​​the control circuit 101 (for example, a cache memory), the ROM 102, the RAM 103, an external device (for example, a server), etc.

[0110] Furthermore, the machining program 122 may be provided not as a standalone program but as part of an arbitrary program. In this case, various processes according to this embodiment are realized in cooperation with the arbitrary program. Even a program that does not include some of these modules does not deviate from the spirit of the machining program 122 according to this embodiment. Furthermore, some or all of the functions provided by the machining program 122 may be realized by dedicated hardware. Furthermore, the control unit 50 may be configured in the form of a so-called cloud service in which at least one server executes part of the processing of the machining program 122.

[0111] <G. Control Flow of Additional Machining> Next, the control flow of additional machining will be described with reference to Fig. 9. Fig. 9 is a flowchart showing the flow of additional machining processing.

[0112] 9 is realized, for example, by the control unit 50 of the additive processing apparatus 100 executing the above-described processing program 122. In another aspect, some or all of the processing may be executed by circuit elements or other hardware.

[0113] In step S110, the control unit 50 acquires three-dimensional data 124 including the additional portion PB of the workpiece W.

[0114] In step S112, the control unit 50 generates an NC program that defines drive commands for the laser head 140 based on the three-dimensional data 124 acquired in step S110. The NC program includes a drive path for the laser head 140 to form the additional portion PB. The NC program may also include the attitude (angle, etc.) of the laser head 140 during additional machining, the speed of the laser head 140, a command to irradiate the laser light by the laser head 140, a command to supply the powder material PM from the laser head 140, etc. The NC program may also include command values ​​such as the rotational speed of the workpiece spindle 22.

[0115] In step S114, the control unit 50 extends the drive path of the laser head 140 defined in the NC program generated in step S112. The drive path extension process is as described above, and therefore, description thereof will not be repeated.

[0116] In step S116, the control unit 50 controls the laser head 140 in accordance with the NC program after the expansion process in step S114. In this way, the additional machining device 100 forms the additional portion PB on the workpiece W.

[0117] Although the above description has been given of an example in which the processes of steps S110, S112, S114, and S116 are executed consecutively, these processes do not necessarily have to be executed consecutively. As an example, the NC program generation process shown in steps S110, S112, and S114 and the additional machining process shown in step S116 may be executed at different times. In this case, these processes may be executed by the same device or by different devices.

[0118] Second Embodiment <H. Overview> Next, an additional processing device 100 according to a second embodiment will be described.

[0119] The additional processing apparatus 100 according to the first embodiment described above expands the drive path of the laser head 140 in consideration of the thermal expansion of the workpiece during additional processing, thereby improving the accuracy of additional processing of the workpiece.

[0120] In contrast, the additive machining apparatus 100 according to the second embodiment improves the additive machining accuracy of the workpiece in a different machining mode. Specifically, when the powder material PM is supplied to the end of the additive portion PB, some of the powder material PM may fall off the end of the additive portion PB. As a result, the width of the additive portion PB may become shorter than intended. This becomes more pronounced as the number of layers increases.

[0121] Therefore, when additionally processing the horizontal end of the additional portion PB, the additional processing device 100 according to the second embodiment drives the laser head 140 so that the optical axis of the laser head 140 faces from the outside of the additional portion PB toward the end in a top view. The optical axis here refers to a straight line connecting the center of the emission port of the laser beam LS in the laser head 140 and the focal point F (see FIG. 3 ) of the laser beam LS. By driving the laser head 140 so that the optical axis is inclined with respect to the direction of gravity, the powder material PM is more likely to penetrate inside the workpiece W. This prevents the powder material PM from falling from the end of the workpiece W, improving the accuracy of additional processing.

[0122] In the following, differences between the additional processing apparatus 100 according to the first embodiment and the additional processing apparatus 100 according to the second embodiment will be described, and a description of commonalities therebetween will be omitted.

[0123] <I. Driving Mode of Laser Head 140> Next, with reference to FIGS. 10 to 12, a driving mode of the laser head 140 during additional machining according to this embodiment will be described.

[0124] Fig. 10 is a diagram showing an additional processing step S10 of the layer SL4. Fig. 11 is a diagram showing an additional processing step S11 of the layer SL4 following Fig. 10. Fig. 12 is a diagram showing an additional processing step S12 of the layer SL4 following Fig. 11.

[0125] In the following description, the angle formed by the optical axis AXL of the laser head 140 and the plane SF perpendicular to the rotation axis AX2 is defined as the tilt angle θ of the laser head 140.

[0126] An end portion of the additional portion PB in the direction of the rotation axis AX2 is defined as an end portion E. The end portion E is, for example, a portion of the additional portion PB that is within a predetermined distance from the end face of the additional portion PB in the direction of the rotation axis AX2. One side of the end portion E in the direction of the rotation axis AX2 is referred to as end portion E1, and the other side of the end portion E in the direction of the rotation axis AX2 is referred to as end portion E2.

[0127] Assume that additional processing of layer SL4 has started in the additional processing step S10. Based on this, the additional processing device 100 drives the laser head 140 so that the tilt angle θ is greater than 0°. At this time, the additional processing device 100 tilts the laser head 140 so that the optical axis AXL points from the outside of the additional portion PB toward the end E1 in a top view. The tilt angle θ in the additional processing step S10 is, for example, greater than or equal to 10° and less than or equal to 45°.

[0128] In the additional processing step S11, it is assumed that the additional processing position has passed the end E1. During additional processing at positions other than the end E1, the additional processing device 100 drives the laser head 140 while maintaining the optical axis AXL parallel to the direction of gravity. At this time, the optical axis AXL becomes parallel to the orthogonal plane SF, and the tilt angle θ becomes 0°. As a result, the powder material PM is supplied in the direction of gravity (i.e., the positive side in the Y-axis direction). Thereafter, the additional processing device 100 drives the laser head 140 toward the positive side in the Z-axis direction while maintaining the tilt angle θ at 0°.

[0129] In the additional processing step S12, it is assumed that the additional processing position has reached the end E2. Based on this, the additional processing device 100 drives the laser head 140 so that the tilt angle θ is greater than 0°. At this time, the additional processing device 100 tilts the laser head 140 so that the optical axis AXL faces from the outside of the additional portion PB toward the end E2 in a top view. That is, in the additional processing step S12, the additional processing device 100 tilts the laser head 140 in the opposite direction to that in the additional processing step S10. The tilt angle θ of the laser head 140 in the additional processing step S12 is, for example, greater than or equal to 10° and less than or equal to 45°.

[0130] Preferably, the additional processing device 100 maintains a constant distance from the laser head 140 to the additional portion PB throughout the additional processing steps S10 to S12. As an example, this distance is the distance in the direction of the optical axis AXL. In this case, the additional processing device 100 maintains a constant distance from the laser head 140 to the additional portion PB in the direction of the optical axis AXL throughout the additional processing steps S10 to S12. This makes it less likely that the focal position of the laser light with respect to the additional portion PB will fluctuate, stabilizing the quality of the additional processing.

[0131] As another example, the separation distance is the distance in the direction of gravity. In this case, the additional processing device 100 performs the additional processing in the additional processing steps S10 to S12 while maintaining the position of the laser head 140 in the direction of gravity.

[0132] Note that the additional processing device 100 may change the inclination angle θ in stages during additional processing of the end portion E, or may maintain the inclination angle θ constant. Preferably, the additional processing device 100 increases the inclination angle θ as the additional processing position moves toward the extreme end of the additional portion PB in the direction of the rotation axis AX2. In other words, the additional processing device 100 decreases the inclination angle θ as the additional processing position moves toward the inside of the additional portion PB in the direction of the rotation axis AX2. This allows the additional processing device 100 to reduce the amount of powder material PM falling from the end portion E and to more stabilize the quality of the additional processing.

[0133] Although the additional processing steps S10 to S12 for the layer SL4 have been described above, the additional processing apparatus 100 may set the inclination angle θ to be greater than 0° during additional processing of the end portions E of the layers SL1 to SL4. In this case, the inclination angle θ at the end portions E of the layers SL1 to SL4 may be constant or may be changed for each layer. Preferably, the additional processing apparatus 100 drives the laser head 140 so that the inclination angle θ at the end portions E of the upper layers is greater than the inclination angle θ at the end portions E of the lower layers.

[0134] 13A and 13B are diagrams showing additional processing of the end E2 of the different layers SL3 and SL4. In Fig. 13A, the tilt angle θ of the laser head 140 during additional processing of the end E2 of the layer SL3 is shown as "θ1." In Fig. 13B, the tilt angle θ of the laser head 140 during additional processing of the end E2 of the layer SL4 is shown as "θ2."

[0135] 13, the additional processing device 100 sets the inclination angle θ2 during additional processing of the layer SL4 to be larger than the inclination angle θ1 during additional processing of the lower layer SL3. This causes the powder material PM to be supplied more obliquely toward the end E of the upper layer. As a result, the additional processing device 100 can more reliably stack the powder material PM in each layer, thereby improving the accuracy of additional processing.

[0136] <J. Control Flow of Additional Machining> Next, a control flow of additional machining according to the second embodiment will be described with reference to Fig. 14. Fig. 14 is a flowchart showing the flow of additional machining processing according to this embodiment.

[0137] 14 is realized, for example, by the control unit 50 of the additional processing apparatus 100 executing the above-described processing program 122. In another aspect, some or all of the processing may be executed by circuit elements or other hardware.

[0138] In step S210, the control unit 50 initializes a variable "N." At this time, the variable "N" is initialized to "1."

[0139] In step S212, the control unit 50 acquires the drive path of the laser head 140 for the Nth layer, and moves the laser head 140 to the start position defined in the drive path.

[0140] In step S214, the control unit 50 drives the laser head 140 to assume an inclined posture that makes the inclination angle θ (see FIG. 10) greater than 0°. Thereafter, the control unit 50 starts the irradiation of laser light by the laser head 140 and the supply of powder material by the laser head 140, and drives the laser head 140 according to the drive path acquired in step S212.

[0141] In step S220, the control unit 50 determines whether the current additional processing position has passed through the end E1 (see FIG. 10). If the control unit 50 determines that the current additional processing position has passed through the end E1 (YES in step S220), the control unit 50 switches control to step S222. If not (NO in step S220), the control unit 50 executes the process of step S220 again.

[0142] In step S222, the control unit 50 drives the laser head 140 to assume an upright posture with the tilt angle θ (see FIG. 11) set to 0° during additional machining between the ends E1 and E2. Thereafter, the control unit 50 continues additional machining in accordance with the drive path acquired in step S212.

[0143] In step S230, the control unit 50 determines whether the current additional processing position has reached the end E2 (see FIG. 12). If the control unit 50 determines that the current additional processing position has reached the end E2 (YES in step S230), the control unit 50 switches control to step S232. If not (NO in step S230), the control unit 50 executes the process of step S230 again.

[0144] In step S232, the control unit 50 drives the laser head 140 to assume an inclined posture that makes the above-mentioned inclination angle θ (see Figure 12) greater than 0°, and continues additional processing according to the drive path acquired in step S212.

[0145] In step S240, the control unit 50 determines whether the current position of the laser head 140 has reached the end position defined in the drive path acquired in step S212. If it is determined that the current position of the laser head 140 has reached the end position (YES in step S240), the control unit 50 switches control to step S242. If not (NO in step S240), the control unit 50 executes the process of step S240 again.

[0146] In step S242, the control unit 50 stops the additional machining. That is, the control unit 50 stops the irradiation of the laser light LS by the laser head 140 and the supply of the powder material PM by the laser head 140.

[0147] In step S250, the control unit 50 determines whether a predetermined termination condition is satisfied. As an example, the termination condition is satisfied when the variable "N" is equal to or greater than a predetermined value. The predetermined value is a natural number equal to or greater than 1. If the control unit 50 determines that the predetermined termination condition is satisfied (YES in step S250), it terminates the processing shown in FIG. 14. If not (NO in step S250), the control unit 50 switches control to step S252.

[0148] In step S252, the control unit 50 increments the variable "N." That is, the control unit 50 adds "1" to the variable "N."

[0149] <K. Others> The first and second embodiments may be combined as appropriate. The concepts of the first and second embodiments may be improved or modified in various ways. Modifications of the first and second embodiments are described below.

[0150] The above description has been given on the premise that the additive machining apparatus 100 includes a workpiece spindle 22 and a tailstock mechanism 25. However, the technical concepts described in this specification can also be applied to an additive machining apparatus 100 that does not include a workpiece spindle 22 and a tailstock mechanism 25. The additive machining apparatus 100 forms the additional portion PB by sequentially forming layers on a non-rotating workpiece W. The technical concepts described in this specification can also be applied to such an additive machining apparatus 100.

[0151] <L. Supplementary Note> The present embodiment includes the following disclosure.

[0152] [Configuration 1] An additive machining device comprising: a laser head capable of performing additive machining on a workpiece by supplying powder material to the workpiece and irradiating the workpiece with laser light; a drive unit for driving the laser head; a workpiece spindle for holding one side of the workpiece and rotating the workpiece around a predetermined axis; a tailstock mechanism for tailstocking the other side of the workpiece; and a control unit for controlling the additive machining device, wherein the control unit executes the following processes: generating a drive path for the laser head based on three-dimensional data that defines the shape of an additional portion of the workpiece; extending the generated drive path in the horizontal direction of the additional portion; and driving the laser head according to the extended drive path to perform additional machining on the workpiece, wherein in the additional machining process, the process of rotating the workpiece by the workpiece spindle and the process of driving the laser head according to the extended drive path are executed in parallel.

[0153] [Configuration 2] The additional machining apparatus according to Configuration 1, wherein the tailstock mechanism includes: a center pin configured to be able to advance and retreat in the direction of the predetermined axis; and an elastic member for pressing the center pin toward the workpiece.

[0154] [Configuration 3] The additional machining device according to configuration 1 or 2, wherein the expanding process includes a process of expanding the generated drive path in the direction of the predetermined axis.

[0155] [Configuration 4] The additional machining apparatus according to Configuration 3, wherein the expanding process includes a process of expanding the generated drive path at least on an installation side of the tailstock mechanism.

[0156] [Configuration 5] The additional machining device according to Configuration 1 or 2, wherein the expanding process includes a process of increasing the expansion distance of the drive path in the expanding process as the position of the additional portion is closer to the tailstock mechanism.

[0157] [Configuration 6] An additive processing method using an additive processing device, wherein the additive processing device comprises: a laser head capable of performing additive processing on a workpiece by supplying powder material to the workpiece and irradiating the workpiece with laser light; a drive unit for driving the laser head; a workpiece spindle for holding one side of the workpiece and rotating the workpiece around a predetermined axis; and a tailstock mechanism for tailstocking the other side of the workpiece, wherein the additive processing method comprises the steps of: generating a drive path for the laser head based on three-dimensional data that defines the shape of an additional portion of the workpiece; extending the generated drive path in the horizontal direction of the additional portion; and driving the laser head according to the extended drive path to perform additional processing on the workpiece, wherein in the additional processing step, the rotation process of the workpiece by the workpiece spindle and the drive process of the laser head according to the extended drive path are performed in parallel.

[0158] [Configuration 7] An additive processing program for an additive processing device, wherein the additive processing device comprises: a laser head capable of performing additive processing on a workpiece by supplying powder material to the workpiece and irradiating the workpiece with laser light; a drive unit for driving the laser head; a workpiece spindle for holding one side of the workpiece and rotating the workpiece around a predetermined axis; and a tailstock mechanism for tailstocking the other side of the workpiece, wherein the additive processing program causes the additive processing device to execute the following processes: generating a drive path for the laser head based on three-dimensional data that defines the shape of an additional portion of the workpiece; extending the generated drive path in the horizontal direction of the additional portion; and driving the laser head in accordance with the extended drive path to perform additional processing on the workpiece, wherein in the additional processing process, the process of rotating the workpiece by the workpiece spindle and the process of driving the laser head in accordance with the extended drive path are executed in parallel.

[0159] [Configuration 8] An additive machining device comprising: a laser head capable of performing additive machining on a workpiece by supplying powder material to the workpiece and irradiating the workpiece with laser light; a drive unit for driving the laser head; a workpiece spindle for holding one side of the workpiece and rotating the workpiece around a predetermined axis; a tailstock mechanism for tailstocking the other side of the workpiece; and a control unit for controlling the additive machining device, wherein the laser head is configured to supply the powder material from the laser light emission port side toward the laser light irradiated location on the workpiece, and the control unit drives the laser head to perform a process of additively machining an additional portion of a desired shape on the workpiece, and the additive machining process includes a process of driving the laser head so that the optical axis of the laser head faces from the outside of the additional portion toward the end in a top view when additionally machining a horizontal end of the additional portion, and the additive machining process is performed in parallel with the process of rotating the workpiece by the workpiece spindle and the process of driving the laser head.

[0160] [Configuration 9] The additional machining apparatus according to Configuration 8, wherein the tailstock mechanism includes: a center pin configured to be able to advance and retreat in the direction of the predetermined axis; and an elastic member that generates an elastic force for pressing the center pin toward the workpiece.

[0161] [Configuration 10] The additional processing device according to Configuration 8 or 9, wherein the additional processing process includes a process of driving the laser head so that the angle formed between the optical axis and a plane perpendicular to the specified axis increases as the additional processing position moves toward the end of the additional portion in the direction of the specified axis.

[0162] [Configuration 11] The additional processing device according to Configuration 8 or 9, wherein the additional processing process includes a process of driving the laser head while maintaining the optical axis parallel to the direction of gravity during additional processing other than the end portion.

[0163] [Configuration 12] The additional processing device according to Configuration 8 or 9, wherein the additional processing process includes a process of maintaining a constant distance from the laser head to the additional portion in the direction of the optical axis when additional processing is performed at the end portion and when additional processing is performed at a portion other than the end portion.

[0164] [Configuration 13] An additive processing method using an additive processing device, wherein the additive processing device comprises: a laser head capable of performing additive processing on a workpiece by supplying powder material to the workpiece and irradiating the workpiece with laser light; a drive unit for driving the laser head; a workpiece spindle for holding one side of the workpiece and rotating the workpiece around a predetermined axis; and a tail push mechanism for tail pushing the other side of the workpiece, wherein the laser head is configured to supply the powder material from the laser light emission port side toward the laser light irradiated location on the workpiece, and the additive processing method comprises the step of driving the laser head to additively process an additional portion of a desired shape on the workpiece, and the additional processing step includes the step of driving the laser head so that, when additionally processing a horizontal end of the additional portion, the optical axis of the laser head faces from the outside of the additional portion toward the end when viewed from above, and the additional processing step comprises the rotation of the workpiece by the workpiece spindle and the drive of the laser head being performed in parallel.

[0165] [Configuration 14] An additive processing program for an additive processing device, wherein the additive processing device comprises: a laser head capable of performing additive processing on a workpiece by supplying powder material to the workpiece and irradiating the workpiece with laser light; a drive unit for driving the laser head; a workpiece spindle for holding one side of the workpiece and rotating the workpiece around a predetermined axis; and a tailstock mechanism for tailstocking the other side of the workpiece, wherein the laser head is configured to supply the powder material from the laser light emission port side toward the laser light irradiated location on the workpiece, and the additive processing program causes the additive processing device to execute a process of additively processing an additional portion of a desired shape on the workpiece by driving the laser head, and the additional processing process includes a process of driving the laser head so that, when additionally processing a horizontal end of the additional portion, the optical axis of the laser head is directed from the outside of the additional portion toward the end when viewed from above, and the additional processing process is an additive processing program in which the process of rotating the workpiece by the workpiece spindle and the process of driving the laser head are executed in parallel.

[0166] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The scope of the present invention is defined by the claims, not by the above description, and is intended to include all modifications within the meaning and scope of the claims.

[0167] DESCRIPTION OF SYMBOLS 11 Bed, 16 Tool rest, 18 Turret, 22 Work spindle, 23 Chuck mechanism, 25 Tailstock mechanism, 26 Center pin, 27 Elastic member, 30 Tool spindle, 50 Control unit, 100 Additional processing device, 101 Control circuit, 102 ROM, 103 RAM, 104 Communication interface, 109 Internal bus, 120 Auxiliary storage device, 122 Processing program, 124 Three-dimensional data, 130 Cover body, 140 Laser head, 142 Head body, 146 Laser nozzle, 200 Operation panel, 210 Drive unit, 211C Motor driver, 212C Motor, 220 Drive unit, 221Z Motor driver, 222Z Motor, 230A Drive unit, 230B Drive unit, 231A Motor driver, 231B Motor driver, 231X Motor driver, 231Y motor driver, 231Z motor driver, 232A motor, 232B motor, 232X motor, 232Y motor, 232Z motor, 240 drive unit, 241C motor driver, 241Y motor driver, 241Z motor driver, 242C motor, 242Y motor, 242Z motor, AR processing area, AX1 rotation axis, AX2 rotation axis, AXL optical axis, DR door, E end, E1 end, E2 end, EPN end position, EP1 end position, EP1' end position, EP2 end position, F focus, LS laser beam, MP molten pool, PA base material portion, PB additional portion, PM powder material, R drive path, R1 drive path, R1' drive path, R2 drive path, RN Drive path, R' drive path, SF orthogonal plane, SL layer, SL1 layer, SL2 layer, SL3 layer, SL4 layer, SPN start position, SP1 start position, SP1' start position, SP2 start position, W workpiece, ΔE1 expansion distance, ΔE2 expansion distance, θ tilt angle, θ1 tilt angle, θ2 tilt angle.

Claims

1. An additive processing device comprising: a laser head capable of performing additive processing on a workpiece by supplying powder material to the workpiece and irradiating the workpiece with laser light; a drive unit for driving the laser head; and a control unit for controlling the additive processing device, wherein the control unit executes the following processes: generating a drive path for the laser head based on three-dimensional data that defines the shape of an additional portion of the workpiece; extending the generated drive path in the horizontal direction of the additional portion; and driving the laser head according to the extended drive path to perform additive processing on the workpiece.

2. The additional processing device according to claim 1, further comprising: a work spindle for holding one side of the workpiece and rotating the workpiece around a predetermined axis; and a tailstock mechanism for tailstocking the other side of the workpiece, and wherein the control unit, in the additional processing process, executes the process of rotating the workpiece by the work spindle and the process of driving the laser head according to the expanded drive path in parallel.

3. The additional processing device according to claim 2, wherein the tailstock mechanism includes a center pin configured to be able to move back and forth in the direction of the specified axis, and an elastic member for pressing the center pin toward the workpiece.

4. An additional processing device comprising: a laser head capable of performing additional processing on a workpiece by supplying powder material to the workpiece and irradiating the workpiece with laser light; a drive unit for driving the laser head; and a control unit for controlling the additional processing device, wherein the control unit drives the laser head to perform a process of additionally processing an additional portion of a desired shape on the workpiece, and the additional processing process includes a process of driving the laser head so that, when additionally processing a horizontal end of the additional portion, the optical axis of the laser head is directed from the outside of the additional portion toward the end when viewed from above.

5. The additional processing device according to claim 4, further comprising: a work spindle for holding one side of the work and rotating the work around a predetermined axis; and a tailstock mechanism for tailstocking the other side of the work; and wherein the control unit, in the additional processing process, executes the rotation process of the work by the work spindle and the drive process of the laser head in parallel.

6. The additional processing device according to claim 5, wherein the tailstock mechanism includes a center pin configured to be able to move back and forth in the direction of the specified axis, and an elastic member that generates an elastic force to press the center pin toward the workpiece.

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