Buffer module and substrate processing system including same

Abstract

The present invention relates to a buffer module and a substrate processing system including same, and more specifically, to a buffer module for facilitating the flow of substrate transfer and a substrate processing system including same. Disclosed is a buffer module comprising: a buffer chamber (100) in which a gate (101) for loading and unloading a substrate (1) is provided and an inner space (S) is formed; a stator unit (200) which is installed inside the buffer chamber (100) and generates an electromagnetic force for magnetic levitation; a mover (300) disposed to enable magnetic levitation through the electromagnetic force generated by the stator unit (200); and a substrate support unit (400) installed on the mover (300) in which a plurality of substrates (1) are stacked vertically.

Description

Buffer module and substrate processing system including the same

[0001] The present invention relates to a buffer module and a substrate processing system including the same, and more particularly, to a buffer module for facilitating the flow of substrate transport and a substrate processing system including the same.

[0002] The substrate processing system is a system that performs substrate processing such as deposition and etching, and is configured to include a processing module that performs substrate processing, a load lock module that receives a substrate from outside at atmospheric pressure and transfers the substrate to a processing module at a predetermined vacuum pressure, and a return module that transfers the substrate received from the load lock module to and from the processing module.

[0003] The substrate processing system described above has an inline type in which a load lock module, a return module, and a processing module are sequentially arranged, depending on the arrangement, and a cluster type in which a load lock module and a return module combining multiple processing modules are additionally installed.

[0004] Meanwhile, in a conventional substrate processing system, when a series of substrate processing is performed by equipping a plurality of processing modules, there may be a deviation in the substrate processing speed of each processing module, so one or more buffer modules are equipped to ensure a smooth flow of substrate transport.

[0005] However, the buffer module of the conventional substrate processing system is placed in a limited manner between adjacent return modules and the return module in consideration of the accessibility of the transfer robot within the return module, and thus there is a problem in that the positions of the return module and the buffer module are limited.

[0006] In particular, in the conventional substrate processing system, when a buffer module is placed between return modules spaced apart at a certain interval, a return module including an additional transfer robot is placed, which increases the number of return modules and transfer robots required, or the buffer module prevents the return module from being placed in a location desired by the user.

[0007] Due to this, the conventional substrate processing system has a problem in that the overall length of the system increases due to an increase in the number of buffer modules and transfer robots, and it is impossible to construct a system according to free and flexible module arrangement corresponding to the installation space.

[0008] In addition, the conventional substrate processing system has a problem in that, when a substrate is transferred through a transfer robot in a return module arranged around a buffer module, the direction of the substrate with respect to the transfer robot changes, and thus consistency is not maintained in the direction for transferring the substrate to the processing module.

[0009] Meanwhile, in this case, in order to maintain the direction of each transfer robot of the substrate, a separate rotary table must be installed within the return module and the direction of the substrate must be readjusted through this, which causes the device configuration to become complicated and increases the process time.

[0010] The purpose of the present invention is to provide a substrate processing system capable of maximizing space and process efficiency in order to solve the above problems.

[0011] The present invention has been created to achieve the above-described object of the present invention, and discloses a buffer module including a buffer chamber (100) having a gate (101) for introducing and removing a substrate (1) and an internal space (S) formed therein; a stator unit (200) for generating an electromagnetic force for magnetic levitation in the buffer chamber (100); a mover (300) arranged to enable magnetic levitation through the electromagnetic force via the stator unit (200); and a substrate support unit (400) installed on the mover (300) for supporting and storing at least one substrate (1).

[0012] The above substrate support member (400) can store a plurality of the above substrates (1) by stacking them in the vertical direction.

[0013] The above stator part (200) may be provided on the bottom surface of the buffer chamber (100) so as to form a linear movement path along which the mover (300) and the substrate support part (400) move in the internal space (S).

[0014] The above mover (300) and the above substrate support member (400) may be provided in multiple units.

[0015] The above substrate support member (400) may include a support rod (410) installed horizontally on the mover (300), a vertical frame (420) installed vertically at the end of the support rod (410), and a support member (430) provided on the inner surface of the vertical frame (420) to support the substrate (1).

[0016] The above support rod (410) and the vertical frame (420) may be provided as a pair, each symmetrically with respect to the center of the plane of the mover (300).

[0017] The above support member (430) may have a support step (431) formed on the mounting surface on which the substrate (1) is mounted, the shape of which corresponds to the edge of the substrate (1).

[0018] In addition, the present invention discloses a substrate processing system including at least one processing module (20) that performs substrate processing; a return module (10) coupled to the processing module (20) and mutually transferring a substrate (1) to the processing module (20); and a buffer module (30) coupled to the return module (10) and temporarily loading and storing the substrate (1).

[0019] It may additionally include a load lock module (40) that is coupled to the above return module (10) and mutually transfers the outside and the substrate (1).

[0020] The above return module (10) may include a return robot (11) installed to return the substrate (1).

[0021] The above buffer module (30) can be placed between a plurality of the above return modules (10).

[0022] The above processing module (20) can have multiple processing spaces formed.

[0023] The above processing module (20) includes a twin chamber having a pair of processing spaces, the return module (10) includes a twin robot (12) installed inside corresponding to the twin chamber to simultaneously return a pair of the substrates (1), and the buffer module (30) may be equipped inside corresponding to the twin robot (12) with a pair of the mover (300) and the substrate support member (400).

[0024] In addition, the present invention discloses a substrate processing system including a first substrate processing device (2) including at least one first processing module (21) for performing substrate processing, and a first return module (13) to which the first processing module (21) is coupled and which mutually transfers a substrate (1) to the first processing module (21); a second substrate processing device (3) including at least one second processing module (22) for performing substrate processing, and a second return module (14) to which the second processing module (22) is coupled and which mutually transfers a substrate (1) to the second processing module (22); and a buffer module (30) having one end coupled to the first return module (13) and the other end coupled to the second return module (14), and which temporarily loads and stores a substrate (1) to be mutually transferred between the first substrate processing device (2) and the second substrate processing device (3).

[0025] The above first substrate processing device (2) and the above second substrate processing device (3) can perform different processes.

[0026] The second substrate processing device (3) is arranged on the rear side of the first substrate processing device (2), the first return module (13) is arranged on the front side of the side of the first processing module (21), and the second return module (14) can be arranged on the rear side of the side of the second processing module (22).

[0027] It includes at least one third processing module (23) that performs substrate processing, and a third return module (15) that is coupled to the rear side of the side of the third processing module (23) and mutually transfers the substrate (1) to the third processing module (23), and further includes a third substrate processing device (5) that is arranged in front of the first substrate processing device (2), and the buffer module (30) may include a first buffer module (31) that is arranged between the first return module (13) and the third return module (15) and in which the horizontal position of the substrate support unit (400) is fixed, and a second buffer module (32) that is arranged between the first return module (13) and the second return module (14) and in which the substrate support unit (400) is horizontally movable.

[0028] It includes at least one fourth processing module (24) that performs substrate processing, and a fourth return module (16) that is coupled to a front side of the side of the fourth processing module (24) and mutually transfers a substrate (1) to the fourth processing module (24), and further includes a fourth substrate processing device (6) that is arranged at the rear of the second substrate processing device (3), and the buffer module (30) may include a first buffer module (31) that is arranged between the second return module (14) and the fourth return module (16) and in which the horizontal position of the substrate support unit (400) is fixed, and a second buffer module (32) that is arranged between the first return module (13) and the second return module (14) and in which the substrate support unit (400) is horizontally movable.

[0029] The first return module (13) includes a return robot (11) installed to return a single substrate (1) therein, and the second return module (14) may include a twin robot (12) installed to simultaneously return a pair of substrates (1) therein, corresponding to the second processing module (22), which is a twin chamber having a pair of processing spaces.

[0030] The buffer module (30) may be provided with a plurality of movers (300) and substrate support members (400) movably located therein so as to be able to respond to the transport robot (11) and the twin robot (12).

[0031] The first return module (13) includes a first twin robot (18) installed to simultaneously return a pair of substrates (1) therein, corresponding to the first processing module (21), which is a twin chamber having a pair of processing spaces, and the second return module (14) includes a second twin robot (19) having a different width from the first twin robot (18), corresponding to the second processing module (22), which is a twin chamber having a pair of processing spaces and has a different spacing between a pair of openings from the first processing module (21), to simultaneously return a pair of substrates (1) therein.

[0032] The buffer module (30) may be provided with a plurality of movers (300) and substrate support members (400) movably located therein so as to be able to respond to the first twin robot (18) and the second twin robot (19).

[0033] The above buffer module (30) can receive a substrate (1) from the first return module (13) and rotate the substrate support part (400) and the substrate (1) supported thereon at a preset angle through the rotation of the mover (300) and transfer the substrate (1) to the second return module (14).

[0034] The buffer module (30) can transfer the substrate (1) by rotating the mover (300) so that the direction of the substrate (1) with respect to the transfer robot (11) in the first transfer module (13) and the direction of the substrate (1) with respect to the transfer robot (11) in the second transfer module (14) are maintained identically.

[0035] The buffer module according to the present invention and the substrate processing system including the same have an advantage in that, by having a cassette section that can move through magnetic levitation within the buffer module, temporarily loaded substrates can be moved within the buffer module and selectively accessed by a transfer robot within an adjacent transfer module as needed.

[0036] In particular, the buffer module according to the present invention and the substrate processing system including the same have the advantage of being able to connect relatively long distance transfer modules with a single buffer module and to connect relatively long distance transfer modules with smooth substrate transfer using only the buffer module without installing an additional transfer module and transfer robot by moving the cassette section within the buffer module.

[0037] In addition, the buffer module according to the present invention and the substrate processing system including the same have the advantage of reducing the footprint of the entire system by allowing unrestricted connection between return modules with a single buffer module, and enabling efficient space arrangement and process execution by installing the return module at an optimized location.

[0038] In particular, the buffer module according to the present invention and the substrate processing system including the same have the advantage of enabling substrate loading corresponding to both the twin robot and the transfer robot by arranging a buffer module to which a plurality of movable cassette sections are applied between a transfer module equipped with twin robots for simultaneously transferring a plurality of substrates and a transfer module equipped with a transfer robot for transferring a single substrate, as a twin chamber is applied to the processing module.

[0039] In addition, the buffer module according to the present invention and the substrate processing system including the same have the advantage of being easy to resolve and manage particle issues caused by friction during movement through temporary loading and storage of the substrate through magnetic levitation.

[0040] In addition, the buffer module according to the present invention and the substrate processing system including the same have the advantage of being able to rotate the substrate support part and the substrate supported thereon through the free rotation of the mover in the buffer module, thereby maintaining the direction of the substrate transferred to the transfer module via the buffer module to a constant direction with respect to the transfer robot, or transferring the substrate by rotating it at a rotation angle desired by the user.

[0041] Figure 1 is a perspective view showing a buffer module according to the present invention.

[0042] Fig. 2 is an exploded perspective view showing the configuration of the buffer module according to Fig. 1.

[0043] Fig. 3 is a cross-sectional view showing the appearance of the buffer module according to Fig. 1.

[0044] Figure 4 is a plan view showing a first embodiment of a substrate processing system according to the present invention.

[0045] Fig. 5 is a plan view showing a modified embodiment of the substrate processing system according to Fig. 4.

[0046] Figure 6 is a plan view showing a second embodiment of a substrate processing system according to the present invention.

[0047] Fig. 7 is a plan view showing a modified embodiment of the substrate processing system according to Fig. 6.

[0048] The buffer module according to the present invention and the substrate processing system including the same are described in detail with reference to the attached drawings.

[0049] A buffer module according to the present invention, as illustrated in FIG. 1, comprises: a buffer chamber (100) having a gate (101) for introducing and removing a substrate (1) and forming an internal space (S); a stator unit (200) for generating an electromagnetic force for magnetic levitation in the buffer chamber (100); a mover (300) arranged to enable magnetic levitation through the electromagnetic force generated by the stator unit (200); and a substrate support unit (400) installed on the mover (300) for supporting and storing at least one substrate (1).

[0050] Here, the substrate (1) to be processed can be understood to mean all substrates, such as substrates used in display devices such as LEDs, LCDs, and OLEDs, semiconductor substrates, solar cell substrates, and glass substrates.

[0051] In addition, any process disclosed in the related art can be applied to the process performed in the substrate processing system according to the present invention as long as it is a process for processing a substrate, and for example, processes such as deposition, etching, and heat treatment can be performed.

[0052] Meanwhile, it is also obvious that the processes performed in the substrate processing system according to the present invention may be different processes depending on the processing module (20) described below, and the same process may also be applied.

[0053] The above buffer chamber (100) is configured to have a gate (101) for introducing and removing a substrate (1) and an internal space (S), and various configurations are possible.

[0054] That is, the buffer chamber (100) may be configured to form an internal space (S) into which a substrate (1) requiring temporary storage is introduced and into which a substrate (1) that has been stored is removed.

[0055] For example, the buffer chamber (100) may include a chamber body (110) forming an internal space (S) and an opening (120) provided on a side of the chamber body (110) and forming an opening (101).

[0056] The above chamber body (110) is configured to form an internal space (S) in which a stator part (200), a mover (300), and a substrate support part (400) described later are installed, and various configurations are possible.

[0057] The chamber body (110) may be provided to have various sizes and shapes depending on the installation location and area of ​​the buffer module, and for example, it may be arranged to have the same size as the return module (10) described below, or in the case where the return modules (10) are arranged at a large distance from each other, it may be applied to have a configuration having a length equivalent to the distance between the return modules (10).

[0058] In addition, the chamber body (110) may be formed in a square shape on a plane, like the return module (10) and the processing module (20), but is not limited thereto and may be applied in various shapes such as circular, oval, and polygonal shapes on a plane.

[0059] The above opening (120) is configured to form an opening (101) for introducing and removing a substrate (1) into the internal space (S), and can be provided on the side of the chamber body (110).

[0060] At this time, the opening (120) may be provided separately in the chamber body (110), and as another example, may be omitted or replaced with an opening / closing valve (60) described later.

[0061] In addition, the buffer chamber (100) may include a viewport (109) formed on at least a portion of the side and upper and lower surfaces so that the loading status of the substrate (1) temporarily loaded and stored inside can be checked from the outside.

[0062] The above stator part (200) is a configuration that generates electromagnetic force for magnetic levitation in the buffer chamber (100), and various configurations are possible.

[0063] That is, the stator part (200) may be configured to generate electromagnetic force through mutual electromagnetic interaction with a mover (300) including a permanent magnet by controlling the power applied while it is installed inside the buffer chamber (100) and move the mover (300).

[0064] At this time, the stator part (200) may be provided on the bottom surface of the buffer chamber (100) so as to form a linear movement path along which the mover (300) and the substrate support part (400) move in the internal space (S).

[0065] More specifically, the stator part (200) may be installed on the bottom surface of the buffer chamber (100) or may be provided to form a part of the bottom surface of the buffer chamber (100) in order to function smoothly in the internal space (S) of the vacuum, or may be provided on the outside of the buffer chamber (100).

[0066] Meanwhile, the stator part (200) may include a coil part for applying electromagnetic force to the mover (300), and a circuit part for controlling the coil part and receiving power from the outside.

[0067] Accordingly, the stator part (200) can apply and control electromagnetic force by controlling the coil part by receiving power from the outside through the circuit part, and accordingly, generate electromagnetic force through electromagnetic interaction with the permanent magnet within the mover (300), and move the mover (300) and the substrate support part (400) installed therein in a magnetically levitated state.

[0068] At this time, the stator part (200) may be provided in the buffer chamber (100) to form a travel path of the mover (300), and for example, as described above, it may be provided to form the bottom surface of the buffer chamber (100), so that the mover (300) may move horizontally in a magnetically levitated state by a magnetic force formed from the bottom surface, thereby inducing the substrate support part (400) and the loaded substrate (1) to move.

[0069] The above mover (300) is configured to be magnetically levitated through electromagnetic force via the stator section (200), and various configurations are possible.

[0070] For example, the above mover (300) can move in a magnetically levitated state through electromagnetic interaction with a stator unit (200) that generates electromagnetic force through power application, including permanent magnets arranged in a preset arrangement inside.

[0071] At this time, the mover (300) can perform not only a simple horizontal linear movement, but also a rotational movement or tilting movement around an imaginary vertical line passing through the center.

[0072] Accordingly, the mover (300) can move integrally with the substrate support member (400) installed on the upper surface, and accordingly, the substrate support member (400) and the substrate (1) loaded thereon can be moved within the internal space (S).

[0073] Meanwhile, the above mover (300) can be applied to any type of permanent magnet arrangement disclosed in the past for magnetic levitation, such as a Halbach arrangement.

[0074] At this time, the above mover (300) may be provided in multiple units for the stator unit (200), and for example, may be provided in two units so as to move independently of each other by magnetically levitating on the stator unit (200).

[0075] The above substrate support member (400) is installed on the mover (300) and is configured to support at least one substrate (1), and various configurations are possible.

[0076] That is, the substrate support member (400) may be configured to be installed on the mover (300) and move integrally with the mover (300), and to support and temporarily store at least one substrate (1).

[0077] For example, the substrate support member (400) may be a cassette that temporarily stores a plurality of substrates (1) by loading them vertically, and as another example, it may be configured to load a single substrate (1) on a support surface.

[0078] At this time, the substrate support member (400) is installed on the mover (300) and moves as a whole, so that it can move freely in the internal space (S) of the buffer chamber (100), and accordingly, even when it is installed in the buffer module (30) connecting the return modules (10) of a relatively long distance, it can approach the return module (10) on one side to mutually transfer the substrate (1), and approach the return module (10) on the other side to mutually transfer the substrate (1).

[0079] For example, the substrate support member (400) may include a support rod (410) installed horizontally on the mover (300), a vertical frame (420) installed vertically at the end of the support rod (410), and a support member (430) provided on the inside of the vertical frame (420) to support the substrate (1).

[0080] At this time, the support rods (410) may be formed as a pair to be symmetrical with respect to the center of the plane of the mover (300), and may be installed with each having a length in the radial direction.

[0081] In addition, the vertical frame (420) is configured to be installed vertically at the end of the support rod (410), and may be provided as a pair to be symmetrical with respect to the center of the plane of the mover (300) corresponding to the support rod (410).

[0082] Accordingly, the support rod (410) and the vertical frame (420) are formed symmetrically with respect to the center of the mover (300) on a plane, and can induce the substrate (1) to rotate in response to rotation (rotation) about an imaginary vertical line passing through the center of the mover (300).

[0083] The above support member (430) may be configured to protrude from the inner surface of the vertical frame (420) and support the substrate (1).

[0084] At this time, the support members (430) may be provided as a pair spaced apart from each other on the inner surface of one vertical frame (420) corresponding to the edge shape of the substrate (1), and more specifically, may be provided spaced apart from each other at a certain interval corresponding to the edge of the circular substrate (1).

[0085] In addition, the support member (430) may have a support step (431) formed in a shape corresponding to the edge of the substrate (1) on the mounting surface where the substrate (1) is mounted, and a part of the edge of the substrate (1) may be surrounded by the support step (431) to guide the substrate (1) to be positioned in the correct position.

[0086] In particular, the support step (431) is formed with a curved surface on the inner surface to form a part of a circle in a plane corresponding to the edge shape of the substrate (1), so that not only the substrate (1) can be positioned in its original position, but also the substrate (1) can be prevented from being dislodged due to horizontal movement and rotation of the mover (300) and the substrate support member (400).

[0087] In addition, the support members (430) may be arranged in pairs on the same horizontal plane, or may be arranged in multiple numbers spaced apart from each other in the vertical direction, thereby enabling the substrate (1) to be stored by loading it in the vertical direction.

[0088] Hereinafter, the substrate processing system according to the present invention will be described in detail with reference to the attached drawings.

[0089] The buffer module in the substrate processing system described below can be applied in the same manner as described above, so redundant description is omitted.

[0090] The substrate processing system according to the present invention, as illustrated in FIG. 4, includes at least one processing module (20) for performing substrate processing; a return module (10) coupled to the processing module (20) and for mutually transferring a substrate (1) to the processing module (20); and a buffer module (30) coupled to the return module (10) and for temporarily loading and storing the substrate (1).

[0091] In addition, the substrate processing system according to the present invention may additionally include a load lock module (40) that is coupled to the return module (10) and mutually transfers the substrate (1) to and from the outside.

[0092] In addition, the substrate processing system according to the present invention may additionally include an equipment shear module (50) of atmospheric pressure, which is arranged in front of the load lock module (40) to mutually transfer the load lock module (40) and the substrate (1).

[0093] The above load lock module (40), as illustrated in FIG. 4, is installed between the equipment shear module (50) and the return module (10), and may be configured to perform at least one of bringing in and taking out the substrate (1) to the outside.

[0094] That is, the load lock module (40) can maintain a vacuum pressure between the external atmospheric pressure and the vacuum pressure inside the substrate processing system and transfer the substrate (1) to each of the return module (10) and the equipment shear module (50).

[0095] Meanwhile, the load lock module (40) may be configured to be a single unit installed between the equipment shear module (50) and the return module (10) as illustrated in FIG. 4, and to perform both the introduction and removal of the substrate (1). As another example, it may be configured in multiple units and divided into a load lock module for introducing the substrate (1) and a load lock module for removing the substrate (1).

[0096] In addition, it is also obvious that the load lock module (40) is installed between the equipment shear module (50) and the return module (10) of one end of the system, and may also be additionally installed separately at the other end of the system.

[0097] The above equipment shear module (50) is arranged in front of the load lock module (40) and is configured to have an atmospheric pressure atmosphere for mutually transferring the load lock module (40) and the substrate (1), and various configurations are possible.

[0098] For example, the equipment front end module (50), i.e., the EFEM (Equipment Front End Module), is a device for transporting a substrate (1) between the outside and a transport module (10). For example, the equipment front end module (50) may include a port on which a carrier on which the substrate (1) is transported is installed, and a robot for transporting the substrate (1) between this port and a load lock module (40).

[0099] The above processing module (20) is a configuration that performs substrate processing and can have various configurations.

[0100] That is, the above processing module (20) can be applied as a configuration that performs various types of substrate processing disclosed in the related art, and can be provided on at least one side of the return module (10), for example, on both sides of a return module (10) having a square shape on a plane, or as another example, can be provided on three sides of the return module (10) except for the point connected to the load lock module (50).

[0101] Meanwhile, the above processing module (20) may be configured as a single process chamber with a single processing space formed inside or a configuration with multiple processing spaces formed inside, and as another example, may be applied as a twin chamber with a pair of processing spaces formed inside.

[0102] For example, the processing module (20) may have a configuration having a plurality of processing spaces that are interconnected or separated so as to enable simultaneous processing of a plurality of substrates (1) within a single process chamber, and in this case, the substrate (1) may be transferred between processing spaces via a transfer means separately provided within the process chamber.

[0103] The above return module (10) is configured to be coupled with a processing module (20) and to mutually transfer a substrate (1) to the processing module (20), and various configurations are possible.

[0104] At this time, the return module (10) may be equipped with a return chamber that forms a return space inside, and a robot that is installed in the return space inside the return chamber and returns the substrate (1).

[0105] Meanwhile, the return module (10) can be combined with at least one processing module (20) to form one substrate processing device, and a substrate processing system can be constructed by connecting the substrate processing devices to each other through the return modules (10) and buffer modules (30).

[0106] In addition, the return module (10) may be equipped with a return robot (11) to return a single substrate (1) therein, and as another example, a twin robot (12) may be installed to simultaneously return a pair of substrates (1) to multiple processing spaces such as twin chambers.

[0107] At this time, the transport robot (11) and the twin robot (12) may be configured to operate the arm through a driving unit including a motor to transport the substrate (1) through an end effector, and for example, the processing module (20) and the substrate (1) may be transported to each other, and the substrate support unit (400) of the buffer module (30) and the substrate (1) may be transported to each other.

[0108] Meanwhile, the above-mentioned return robot (11) may be configured to be applied for returning a single substrate (1) depending on the type of processing module (20) coupled to the return module (10), and the twin robot (12) may be configured to simultaneously return a pair of substrates (1) and may be provided corresponding to a processing module (20) in which a pair of processing spaces, such as twin chambers, are formed.

[0109] The above buffer module (30) is coupled to the return module (10) and is configured to temporarily load and store the substrate (1), and its specific configuration is as described above.

[0110] At this time, the buffer module (30) is arranged between a plurality of return modules (10) to facilitate the transport flow of the substrate (1) and to temporarily load and store the substrate (1).

[0111] In addition, as described above, the buffer module (30) can be arranged singly without any limitation on the distance between the return modules (10), and can approach adjacent return modules (10) by appropriately adjusting the shape and size of the buffer chamber (100) and moving the mover (300) and the substrate support member (400) within the internal space (S) of the substrate (1).

[0112] In addition, the buffer module (30) may be provided with a pair of movers (300) and substrate supporters (400) inside in correspondence with the aforementioned twin robot (12), and accordingly, the substrate (1) may be transferred to a pair of end effectors of the twin robot (12) at the same time.

[0113] The substrate processing system according to the present invention, as a first embodiment, as shown in FIG. 4, is configured such that a plurality of return modules (10) each of which is coupled to a processing module (20) are arranged at a distance from each other, and the return modules (10) can be connected through a buffer module (30).

[0114] Meanwhile, in this case, a gate valve (60) is applied between each module to open and close the opening for transferring the substrate (1), and the pressure can be maintained independently.

[0115] More specifically, two processing modules (20) each having multiple processing spaces formed in each of three return modules (10) can be installed on both sides, and the forward-most (in the direction toward the equipment front module) return module (10) can be arranged on the rear side of the side of the processing module (20), the middle-side return module (10) can be arranged on the front side of the side of the processing module (20), and the rear-most return module (10) can be arranged on the front side of the side of the processing module (20).

[0116] In this case, the gap between the front-most side return module (10) and the middle side return module (10) is formed relatively narrow, so that it can be approached according to the stroke of the return robot (11) in the adjacent return module (10), and thus the first buffer module (31) can be placed in which the horizontal position of the substrate support member (400) and the substrate (1) loaded thereon is fixed, i.e., horizontal movement is not applied.

[0117] However, the gap between the middle side return module (10) and the rearmost side return module (10) is formed relatively long, so in the case of the conventional substrate processing system, there is a problem that multiple buffer modules and additional return modules and return robots must be applied.

[0118] The substrate processing system according to the present invention may be applied with a single buffer module (30) between the middle side return module (10) and the rearmost side return module (10), a buffer chamber (100) having a length, a substrate support part (400), and a second buffer module (32) in which the substrate (1) can be moved via a mover (300).

[0119] Accordingly, the second buffer module (32) can be arranged to respond as a single buffer module (30) by moving the mover (300) and the substrate support (400) to a position adjacent to the intermediate transfer module (10) when access to the transfer robot (11) of the intermediate transfer module (10) is required, and by moving the mover (300) and the substrate support (400) to a position adjacent to the rearmost transfer module (10) when access to the transfer robot (11) of the rearmost transfer module (10) is required.

[0120] Meanwhile, in this case, each of the processing modules (20) coupled to a single return module (10) may perform the same process or different processes, and the processing modules (20) coupled to different return modules (10) may also perform the same process or different processes.

[0121] A substrate processing system according to the present invention, as a modified example of the first embodiment, as shown in FIG. 5, includes a first substrate processing device (2) including at least one first processing module (21) for performing substrate processing, and a first return module (13) to which the first processing module (21) is coupled and which mutually transfers a substrate (1) to the first processing module (21); a second substrate processing device (3) including at least one second processing module (22) for performing substrate processing, and a second return module (14) to which the second processing module (22) is coupled and which mutually transfers a substrate (1) to the second processing module (22); It includes a buffer module (30) that is connected at one end to the first return module (13) and at the other end to the second return module (14), and temporarily loads and stores a substrate (1) that is mutually transferred between the first substrate processing device (2) and the second substrate processing device (3).

[0122] The above first substrate processing device (2) may be configured to include a first return module (13) to which at least one first processing module (21) is coupled, and the second substrate processing device (3) may be configured to include a second return module (14) to which at least one second processing module (22) is coupled.

[0123] At this time, the first substrate processing device (2) and the second substrate processing device (3) may perform different processes, and for example, one of deposition, etching, and heat treatment may be performed in the first substrate processing device (2), and one of the remaining processes may be performed in the second substrate processing device (3).

[0124] In addition, as another example, the first substrate processing device (2) and the second substrate processing device (3) may perform processes with different process conditions in a single process, and for example, during a deposition process, different deposition processes may be performed on target thin films, or processes with different process conditions may be performed on the same thin film so that the film properties are different.

[0125] Meanwhile, it is also obvious that the same process may be performed in the first substrate processing device (2) and the second substrate processing device (3).

[0126] At this time, the second substrate processing device (3) is placed on the rear side of the first substrate processing device (2), as shown in FIG. 5, and the first return module (13) and the second return module (14) can be connected through a buffer module (30).

[0127] Meanwhile, the first return module (13) is arranged on the front side of the first processing module (21), and the second return module (14) is arranged on the rear side of the second processing module (22), so that the buffer module (30) can be equipped so that the substrate support part (400) and the substrate (1) can move as needed by applying the second buffer module (32) described above.

[0128] In addition, in this case, a third substrate processing device (5) connected to the front of the first substrate processing device (2) through the first buffer module (31), and a fourth substrate processing device (6) connected to the rear of the second substrate processing device (3) through the first buffer module (31) may be additionally provided.

[0129] More specifically, the third substrate processing device (5) may include at least one third processing module (23) that performs substrate processing and a third transfer module (15) that is coupled to the rear side of the side of the third processing module (23) and mutually transfers the substrate (1) to the third processing module (23).

[0130] At this time, the third substrate processing device (5) may be arranged in front of the first substrate processing device (2), and the first return module (13) and the third return module (15) may be arranged relatively close to each other compared to the first return module (13) and the second return module (14), and a first buffer module (31) in which the horizontal position of the substrate support member (400) is fixed may be provided inside.

[0131] In addition, the fourth substrate processing device (6) may include at least one fourth processing module (24) that performs substrate processing, and a fourth transfer module (16) that is coupled to the front side of the side of the fourth processing module (24) and mutually transfers the substrate (1) to the fourth processing module (24).

[0132] At this time, the fourth substrate processing device (6) may be arranged behind the second substrate processing device (3), and the second return module (14) and the fourth return module (16) may be arranged relatively close to each other compared to the first return module (13) and the second return module (14), and a first buffer module (31) in which the horizontal position of the substrate support member (400) is fixed may be provided inside.

[0133] As a result, the substrate processing system according to the present invention may apply a first buffer module (31) in which the horizontal position of the substrate support part (400) is fixed in the case of a buffer module (30) disposed between relatively adjacent transfer modules (10) that is accessible to the stroke of the transfer robot (11) of the adjacent transfer module (10), and a second buffer module (32) in which the substrate support part (400) is horizontally movable via a mover (300) may be applied in the case of a buffer module (30) disposed between relatively distant transfer modules (10) that is inaccessible to the stroke of the transfer robot (11) of the adjacent transfer module (10).

[0134] Accordingly, the substrate processing system according to the present invention has the advantage of being able to install the buffer module (30) appropriately without limitation on the spacing between the return modules (10), thereby allowing for efficient system layout without any restrictions on the installation location of the return module (10).

[0135] In addition, the substrate processing system according to the present invention may be configured, as a second embodiment, as shown in FIG. 6, such that the first transport module (13) includes a transport robot (11) installed therein to transport a single substrate (1), and the second transport module (14) includes a twin robot (12) installed therein to transport a pair of substrates (1) simultaneously, corresponding to the second processing module (22), which is a twin chamber having a pair of processing spaces.

[0136] In this case, a plurality of movers (300) and substrate support members (400) may be movably provided inside the buffer module (30) to correspond to the first transport module (13) in which a single substrate (1) is transported via a transport robot (11) and the second transport module (14) in which a pair of substrates (1) are transported simultaneously via a twin robot (12).

[0137] That is, as shown in FIG. 6, the buffer module (30) is provided with a plurality of movers (300) and substrate support members (400), and when returning a substrate (1) to the twin robot (12) of the second return module (14), the substrate support members (400) are positioned in each of a pair of corresponding openings (101) to mutually return the substrate (1), and when returning a substrate (1) to the return robot (11) of the first return module (13), the substrate support members (400) are positioned in a single opening (101) to mutually return the substrate (1) to the return robot (11).

[0138] Accordingly, the buffer module (30) can be installed adjacent to both the second transport module (14) equipped with a twin robot (12) and the first transport module (13) equipped with a transport robot (11) as a single configuration, thereby greatly improving versatility by mutually transporting the substrate (1).

[0139] In addition, the substrate processing system according to the present invention, as a modified example of the second embodiment, can be connected to each other through a buffer module (30) between substrate processing devices composed of a processing module (20) to which a twin chamber is applied and a return module (10) to which a twin robot (12) is applied, as shown in FIG. 7, and a pair of openings (101) are formed at the installation location with the buffer module (30) corresponding to the twin robot (12), and a plurality of substrate support parts (400) that are movable or have a fixed position are arranged inside.

[0140] At this time, the first substrate processing device (2) and the second substrate processing device (3) may be applied with buffer modules (10) and processing modules (20) of the same size, but buffer modules (10) and processing modules (20) of different sizes may also be applied.

[0141] For example, the first return module (13) may include a first twin robot (18) installed to simultaneously return a pair of substrates (1) inside the first processing module (21), which is a twin chamber having a pair of processing spaces.

[0142] In contrast, the second return module (14) is a twin chamber having a pair of processing spaces, and the interval between the pair of openings corresponds to a second processing module (22) that is different from that of the first processing module (21), and may include a first twin robot (18) and a second twin robot (19) having different widths to simultaneously return a pair of substrates (1) inside.

[0143] In this case, a pair of substrate support parts (400) in a buffer module (30) connecting the first transport module (13) equipped with the first twin robot (18) and the second transport module (14) equipped with the second twin robot (19) need to have different intervals corresponding to each twin robot when exchanging the substrate (1) with the first twin robot (18) and exchanging the substrate (1) with the second twin robot (19).

[0144] To this end, the buffer module (30) may be provided with a plurality of movers (300) and substrate support members (400) movably located inside to correspond to the first twin robot (18) and the second twin robot (19).

[0145] That is, when a substrate (1) needs to be interchanged with the first twin robot (18), the gap between them can be widened by the movement of a corresponding pair of movers (300) and substrate supporters (400), and when a substrate (1) needs to be interchanged with the second twin robot (19), the gap between them can be narrowed by the movement of a corresponding pair of movers (300) and substrate supporters (400).

[0146] In addition, the buffer module (30) can receive the substrate (1) from the first return module (13) and rotate the substrate support part (400) and the substrate (1) supported thereon at a preset angle through the rotation of the mover (300) and transfer the substrate (1) to the second return module (14).

[0147] More specifically, the buffer module (30), when placed between the first return module (13) and the second return module (14), can receive a substrate (1) through the return robot (11) of the first return module (13), and transfer the received substrate (1) to the return robot (11) of the second return module (14). In this process, the mover (300) can be rotated by an angle between an imaginary straight line connecting the center of the first return module (13) and the center of the buffer module (30) and an imaginary straight line connecting the center of the second return module (14) and the center of the buffer module (30) so that the direction of the substrate (1) with respect to the first return module (13) return robot (11) and the direction of the substrate (1) with respect to the second return module (14) return robot (11) are maintained to be the same.

[0148] For example, as shown in FIG. 5, when the first return module (13) and the second return module (14) are installed at an angle of 180 degrees on a straight line with the buffer module (30) in between, the mover (300) in the buffer module (30) can receive the substrate (1) and rotate 180 degrees to induce the direction of the substrate (1) to the return robot (11) in each return module (10) to be maintained the same.

[0149] In addition, as another example, when the first return module (13) and the second return module (14) are installed at a 90-degree angle with the buffer module (30) in between, the mover (300) in the buffer module (30) receives the substrate (1) and rotates 90 degrees to face the second return module (14), thereby allowing the directions of the substrate (1) to the return robot (11) in each return module (10) to be maintained the same.

[0150] Meanwhile, in the above-described example, an embodiment was described in which the directions of the transport robots (11) in each transport module (10) of the substrate (1) are maintained the same, but in contrast, if the directions of the transport robots (11) of the substrate (1) need to vary as much as the user desires, the rotation angle of the mover (300) may be appropriately adjusted.

[0151] Through this, the substrate processing system according to the present invention can simplify the configuration of the device by omitting the configuration of a rotary table separately installed within the transfer module to maintain the direction of the substrate with respect to the transfer robot in the past, and has the advantage of shortening the process time and increasing the process efficiency accordingly by omitting the process within the transfer module for adjusting the direction of the substrate with respect to the transfer robot.

[0152]

[0153] The above is only a description of some of the preferred embodiments that can be implemented by the present invention, and as is well known, the scope of the present invention should not be construed as being limited to the above embodiments, and the technical ideas of the present invention described above and the technical ideas that are fundamental to the present invention are all included in the scope of the present invention.

Claims

1. A buffer chamber (100) having a gate (101) for introduction and removal of a substrate (1) and an internal space (S) formed; A stator unit (200) that generates electromagnetic force for magnetic levitation in the above buffer chamber (100); A mover (300) arranged to enable magnetic levitation through the electromagnetic force through the stator section (200); A buffer module characterized by including a substrate support member (400) installed on the above mover (300) and supporting and storing at least one substrate (1).

2. In claim 1, The above substrate support member (400) is A buffer module characterized in that a plurality of the above substrates (1) are stacked and stored in a vertical direction.

3. In claim 1, The above stator part (200) is A buffer module characterized in that it is provided on the bottom surface of the buffer chamber (100) so as to form a linear movement path along which the mover (300) and the substrate support member (400) move in the internal space (S).

4. In claim 1, The above mover (300) and the above substrate support member (400) are A buffer module characterized by being provided in multiple units.

5. In claim 1, The above substrate support member (400) is A buffer module characterized by including a support rod (410) installed horizontally on the above mover (300), a vertical frame (420) installed vertically at the end of the support rod (410), and a support member (430) provided on the inner surface of the vertical frame (420) to support the substrate (1).

6. In claim 5, The above support rod (410) and the vertical frame (420) are A buffer module characterized in that each of the two is provided in pairs so as to be symmetrical with respect to the center of the plane of the above mover (300).

7. In claim 6, The above support member (430) is A buffer module characterized in that a support step (431) having a shape corresponding to the edge of the substrate (1) is formed on the mounting surface on which the substrate (1) is mounted.

8. At least one processing module (20) that performs substrate processing; The above processing module (20) is combined with a return module (10) that mutually transfers a substrate (1) to the processing module (20); A substrate processing system characterized by including a buffer module (30) according to any one of claims 1 to 7, which is coupled to the return module (10) and temporarily loads and stores the substrate (1).

9. In claim 8, A substrate processing system characterized by further including a load lock module (40) coupled to the above return module (10) and transferring the substrate (1) to and from the outside.

10. In claim 8, The above return module (10) is A substrate processing system characterized by including a return robot (11) installed to return the above substrate (1).

11. In claim 8, The above buffer module (30) is A substrate processing system characterized in that it is arranged between a plurality of the above return modules (10).

12. In claim 8, The above processing module (20) is A substrate processing system characterized in that multiple processing spaces are formed.

13. In claim 8, The above processing module (20) is It includes a twin chamber having a pair of processing spaces, The above return module (10) is It includes a twin robot (12) installed inside to simultaneously return a pair of the substrates (1) corresponding to the twin chambers, The above buffer module (30) is A substrate processing system characterized in that the mover (300) and the substrate support member (400) are provided as a pair inside corresponding to the twin robot (12).

14. A first substrate processing device (2) including at least one first processing module (21) that performs substrate processing, and a first return module (13) that is coupled to the first processing module (21) and mutually transfers a substrate (1) to the first processing module (21); A second substrate processing device (3) including at least one second processing module (22) that performs substrate processing, and a second return module (14) that is coupled to the second processing module (22) and mutually transfers the substrate (1) to the second processing module (22); A substrate processing system characterized by including a buffer module (30) according to any one of claims 1 to 7, wherein one end is coupled to the first return module (13) and the other end is coupled to the second return module (14), and the buffer module (30) temporarily loads and stores a substrate (1) that is mutually transferred between the first substrate processing device (2) and the second substrate processing device (3).

15. In claim 14, The above first substrate processing device (2) and the above second substrate processing device (3) are, A substrate processing system characterized by performing different processes.

16. In claim 14, The above second substrate processing device (3) is It is placed on the rear side of the first substrate processing device (2), The above first return module (13) is It is placed on the front side of the first processing module (21) above, The above second return module (14) is A substrate processing system characterized in that it is arranged on the rear side of the side of the second processing module (22).

17. In claim 16, It includes at least one third processing module (23) that performs substrate processing, and a third return module (15) that is coupled to the rear side of the side of the third processing module (23) and mutually transfers the substrate (1) to the third processing module (23), and further includes a third substrate processing device (5) that is arranged in front of the first substrate processing device (2), The above buffer module (30) is A substrate processing system characterized by comprising a first buffer module (31) disposed between the first return module (13) and the third return module (15) and having the horizontal position of the substrate support member (400) fixed therein, and a second buffer module (32) disposed between the first return module (13) and the second return module (14) and having the substrate support member (400) horizontally movable therein.

18. In claim 16, It includes at least one fourth processing module (24) that performs substrate processing, and a fourth transfer module (16) that is coupled to the front side of the side of the fourth processing module (24) and mutually transfers the substrate (1) to the fourth processing module (24), and further includes a fourth substrate processing device (6) that is arranged at the rear of the second substrate processing device (3). The above buffer module (30) is A substrate processing system characterized by including a first buffer module (31) arranged between the second return module (14) and the fourth return module (16) and having the horizontal position of the substrate support member (400) fixed therein, and a second buffer module (32) arranged between the first return module (13) and the second return module (14) and having the substrate support member (400) horizontally movable therein.

19. In claim 14, The above first return module (13) is It includes a return robot (11) installed to return a single substrate (1) inside, The above second return module (14) is A substrate processing system characterized by including a twin robot (12) installed to simultaneously return a pair of substrates (1) inside the second processing module (22), which is a twin chamber having a pair of processing spaces.

20. In claim 19, The above buffer module (30) is A substrate processing system characterized in that a plurality of movers (300) and substrate support members (400) are movably provided inside to correspond to the above-mentioned return robot (11) and the above-mentioned twin robot (12).

21. In claim 14, The above first return module (13) is In response to the first processing module (21), which is a twin chamber having a pair of processing spaces, a first twin robot (18) is installed to simultaneously return a pair of substrates (1) therein. The above second return module (14) is A substrate processing system characterized in that it comprises a twin chamber having a pair of processing spaces, a pair of openings corresponding to a second processing module (22) different from the first processing module (21), and a second twin robot (19) having a different width from the first twin robot (18) so as to simultaneously return a pair of substrates (1) therein.

22. In claim 21, The above buffer module (30) is A substrate processing system characterized in that a plurality of movers (300) and substrate support members (400) are movably provided inside to correspond to the first twin robot (18) and the second twin robot (19).

23. In claim 14, The above buffer module (30) is A substrate processing system characterized in that the substrate (1) is received from the first return module (13) and, before the substrate (1) is transferred to the second return module (14), the substrate support member (400) and the substrate (1) supported thereon are rotated at a preset rotation angle through the rotation of the mover (300).

24. In claim 23, The above buffer module (30) is A substrate processing system characterized in that the substrate (1) is transferred by rotating the mover (300) so that the direction of the substrate (1) with respect to the transfer robot (11) in the first transfer module (13) and the direction of the substrate (1) with respect to the transfer robot (11) in the second transfer module (14) are maintained identical to each other.

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