Display device and portable communication device comprising same

Abstract

The present disclosure provides a display device and a portable communication device comprising same, the display device comprising: a display module including a panel part in which a plurality of pixels are arranged, and a rear surface part for supporting the panel part; and a display flexible printed circuit board (FPCB) module connected to the display module, wherein the display FPCB module includes: a guide structure arranged at a first position of the rear surface of the display FPCB module so as to be in contact with a part of the rear surface part when folded; a signal line connected to the guide structure; and a connector connected to the signal line.

Description

Display device and portable communication device including the same

[0001] Various embodiments of the present document relate to a display device capable of providing a uniform structure and a portable communication device including the same.

[0002] Portable communication devices, such as smartphones, can provide various functions, such as calling functions, based on various applications. To support these functions, portable communication devices may include communication circuits and antennas. As portable communication devices become lighter and larger, internal space becomes narrower, and at least a portion of the device's housing is being used as an antenna. Various structures placed inside or outside the housing of a portable communication device can affect the antenna's communication characteristics.

[0003] A display device according to at least one embodiment of the present disclosure comprises a display module including a panel portion on which a plurality of pixels are arranged - including a display panel - and a rear portion - including a rear portion - that supports the panel portion, a display FPCB (flexible printed circuit board) module (or display FPCB) connected to the display module, wherein the display FPCB module comprises a guide structure (or guide) that is arranged at a first position on the rear of the display FPCB module so as to be in contact with a portion of the rear portion when folded, a signal line connected to the guide structure, and a connector connected to the signal line.

[0004] A portable communication device (or portable electronic device, foldable electronic device, or foldable electronic device having a communication function) according to at least one embodiment of the present disclosure comprises a display device, a housing on which the display device is placed, at least a portion of which includes a metal material and is configured to be used as an antenna and has a sidewall portion, wherein the display device comprises a display module including a panel portion on which a plurality of pixels are arranged - including a display panel - and a rear portion - including a rear portion - that supports the panel portion, a display FPCB (flexible printed circuit board) module (or display FPCB) that is connected to the display module and includes a folding area that is located within a certain distance from the sidewall portion (or sidewall) while the display FPCB module is placed in the housing, wherein the display FPCB module comprises a guide structure (or guide) that is placed at a first position on the rear of the display FPCB module so as to be in contact with a portion of the rear portion when folded, a signal line that is connected to the guide structure, and a connector that is connected to the signal line.

[0005] The above and other aspects, features and advantages of specific embodiments of the present disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0006] FIG. 1 is a block diagram of an exemplary portable communication device (100) capable of performing the operations described in this document.

[0007] FIG. 2 is a drawing showing an example of an exploded perspective view of a portable communication device according to one embodiment.

[0008] FIG. 3 is a drawing showing an example of a part of a housing configuration among the configurations of a portable communication device according to one embodiment.

[0009] FIG. 4 is a drawing showing an example of a cross-section of a portable communication device according to one embodiment.

[0010] FIG. 5 is a drawing showing an example of the rear surface of a first type display device according to one embodiment.

[0011] FIG. 6 is a drawing showing an example of the rear surface of a first type display device before the first type FPCB module is folded according to one embodiment.

[0012] FIG. 7 is a drawing showing an example of the rear surface of a second type display device according to one embodiment.

[0013] FIG. 8 is a drawing showing an example of a cross-section of a portion of the portable communication device of FIG. 7 according to one embodiment.

[0014] FIG. 9 is a drawing showing an example of the rear surface of a third type display device according to one embodiment.

[0015] FIG. 10 is a drawing showing an example of the rear surface of a fourth type display device according to one embodiment.

[0016] FIG. 11 is a drawing showing an example of a fifth type display device in which a second type FPCB module is folded according to one embodiment.

[0017] FIG. 12 is a drawing showing an example of a sixth type display device in which a second type FPCB module is folded according to one embodiment.

[0018] FIG. 13 is a drawing showing at least one example of a detection circuit according to one embodiment of the present disclosure.

[0019] Fig. 14 is a diagram showing an example of a circuit that determines whether a normal condition is determined using electrostatic capacity detection according to one embodiment.

[0020] FIG. 15 is a diagram illustrating an example of a method for tuning an antenna of a portable communication device according to one embodiment.

[0021] Hereinafter, various embodiments of this document may be described with reference to the attached drawings.

[0022] One embodiment of the present invention described below relates to a display FPCB (flexible printed circuit board) module (or display FPCB, display FPCB structure, display FPCB assembly, FPCB structure, FPCB device), wherein the display device (or display structure, display assembly) includes a display module (or display portion, display) and a display FPCB module, and the display FPCB module may include a display processor (e.g., DDIC, display driving integrated chip) (or processor) related to driving of the display module.

[0023] In the following description, a structure in which a display processor related to driving the display module is disposed on a display FPCB is exemplified, but the present disclosure is not limited thereto. For example, the display processor may be disposed on one side of the display module (e.g., the panel portion of the display module). The display module of the present disclosure may include an OCTA (On Cell Touch AMOLED) structure, but the present disclosure is not limited thereto.

[0024] In an embodiment of the present disclosure, a portable communication device folds a display FPCB module among display devices and fixes it on the rear side of the display module (e.g., when defining the part of the display module where a screen is displayed as the front side, the opposite side of the front side), and, by using a guide structure (or marker, guide pad, protrusion, reference structure) arranged on a part of the display FPCB module, supports the folding position and folding length or folding state of the display FPCB module to be uniform for each portable communication device.

[0025] The portable communication device according to the embodiment of the present disclosure can support the portable communication devices to have uniform communication characteristics by uniformly forming the folding state of the display FPCB module for each portable communication device. In this process, the portable communication device of the present disclosure can achieve factory automation by designing the assembly jig to fold the display FPCB module with reference to the guide structure, thereby not only securing mass production benefits due to factory automation, but also enabling the portable communication devices to have more uniform characteristics.

[0026] In this way, the embodiment of the present invention can reduce device-specific radiation deviations that occur due to attachment deviations of the display FPCB module, and can support detection of normal assembly of the display FPCB during various manufacturing processes or use processes.

[0027] In addition, various purposes and effects provided by display devices and portable communication devices including the same according to various embodiments may be mentioned according to embodiments of the detailed description.

[0028] FIG. 1 is a block diagram of an exemplary portable communication device (100) capable of performing the operations described in this document.

[0029] Referring to FIG. 1, the portable communication device (100) may be one of various forms of electronic devices, such as a notebook (190), smartphones (191) having various form factors (e.g., a bar-type smartphone (191-1), a foldable-type smartphone (191-2), or a sliderable (or rollable) type smartphone (191-3)), a tablet (192), a cellular phone (not shown), and other similar computing devices (not shown). The components, their relationships, and their functions illustrated in FIG. 1 are exemplary only and do not limit the implementations described or claimed in this document. The portable communication device (100) may be referred to as a mobile device, a user device, a multi-function device, a portable device, or a server.

[0030] The portable communication device (100) may include components including at least one processor (110) (e.g., including a processing circuit) (or a main processor, hereinafter referred to as processor (110)), at least one memory (120) (hereinafter referred to as memory (120)), at least one display device (140) (e.g., including a display), at least one image sensor (150) (hereinafter referred to as image sensor (150)), at least one communication circuit (160) (hereinafter referred to as communication circuit (160)), and / or at least one sensor (170) (hereinafter referred to as sensor (170)). The above components are merely exemplary. For example, the portable communication device (100) may include other components (e.g., power management integrated circuitry (PMIC), audio processing circuitry, an antenna, a rechargeable battery, or an input / output interface). For example, some components may be omitted from the portable communication device (100). For example, several components can be combined into one component.

[0031] The processor (110) may be implemented as one or more IC (integrated circuit (or circuitry)) chips and may perform various data processing. The processor (110) may include at least one electrical circuit and may individually or collectively perform distributed processing of instructions (or programs, data, etc.) stored in the memory (120). The processor (110) may include a processor assembly including one or more processing circuits. The processor (110) may include any processing circuit operative to control the performance and operations of one or more components (e.g., the memory (120), the display device (140), the image sensor (150), the communication circuit (160), and / or the sensor (170)) of the portable communication device (100). For example, the processor (110) (e.g., the application processor (AP)) may be implemented as a system on chip (SoC) (e.g., a single chip or a chipset). For example, the processor (110) may be implemented with multiple cores (or at least one core circuit), multiple chips, or multiple chipsets. For example, the processor (110) may include one or more processing circuits. For example, the processor (110) may include one or more processing circuits configured to individually and / or collectively perform various functions of the present disclosure. As a non-limiting example, at least a portion of the processor (110) may be included in a first chip of the portable communication device (100), and at least another portion of the processor (110) may be included in a second chip of the portable communication device (100) that is different from the first chip of the portable communication device (100).

[0032] For example, the processor (110) may include a central processing unit (CPU) (111), a graphics processing unit (GPU) (112), a neural processing unit (NPU) (113), an image signal processor (ISP) (114), a display controller (115), a memory controller (116), a storage controller (117), a communication processor (CP) (118), and / or a sensor interface (119). These components of the processor (110) are merely exemplary. For example, the processor (110) may further include other components. For example, some components of the processor (110) may be omitted from the processor (110). For example, some components of the processor (110) may be included as separate components of the portable communication device (100) outside the processor (110). For example, some components of the processor (110) (e.g., memory controller (116)) may be included within other components (e.g., at least a portion of memory (120), an interface (e.g., available for connection to at least one component of the portable communication device (100)), a display device (140) and / or an image sensor (150)).

[0033] The processor (110) may cause other components of the portable communication device (100) to perform various operations by executing instructions stored in the memory (120). The CPU (111) (or central processing circuit) may be configured to control components of the processor (110) based on the execution of instructions stored in the memory (120) (e.g., volatile memory (121) and / or non-volatile memory (122)). The GPU (112) (or graphics processing circuit) may be configured to execute parallel operations (e.g., rendering). The NPU (113) (or neural processing circuit, or artificial intelligence (AI) chip) may be configured to execute operations for an artificial intelligence model (e.g., convolution computation). The ISP (114) (or image signal processing circuit) may be configured to process a raw image acquired through the image sensor (150) into a format suitable for a component within the portable communication device (100) or a component of the processor (110). The display controller (115) (or display control circuit, or DPU (display processing unit)) may be configured to process an image acquired from the CPU (111), the GPU (112), the ISP (114), or the memory (120) (e.g., the volatile memory (121)) into a format suitable for the display device (140). The memory controller (116) (or memory control circuit) may be configured to control reading data from the volatile memory (121) and writing data to the volatile memory (121). The storage controller (117) (or storage control circuit) may be configured to control reading data from the nonvolatile memory (122) and writing data to the nonvolatile memory (122).The CP (118) (communication processing circuit) may be configured to process data acquired from a component of the processor (110) into a format suitable for transmission to another electronic device via the communication circuit (160), or to process data acquired from another electronic device via the communication circuit (160) into a format suitable for processing by the component of the processor (110). For example, the communication circuit (160) may include one or more communication circuits. The sensor interface (119) (or sensing data processing circuit, sensor hub) may be configured to process data about the state of the portable communication device (100) and / or the state of the surroundings of the portable communication device (100), acquired via the sensor (170), into a format suitable for the component of the processor (110).

[0034] The memory (120) may include one or more storage media (or one or more storage devices). For example, the memory (120) may include a memory assembly including one or more storage media. For example, the one or more storage media may include permanent memory (e.g., non-volatile memory (122)) such as a hard drive, flash memory, read-only memory (ROM), semi-permanent memory (e.g., volatile memory (121)) such as random access memory (RAM), any other suitable type of storage (or storage assembly), or any combination thereof. The memory (120) may include cache memory, which is one or more different types of memory used to temporarily store data for a function or feature of the portable communication device (100). As a non-limiting example, the cache memory may be included within the processor (110). The memory (120) may be fixedly embedded within the portable communication device (100) or incorporated into one or more suitable types of components (e.g., a subscriber identity module (SIM) card and / or a secure digital (SD) card) that may be repeatedly inserted into and removed from the portable communication device (100).

[0035] For example, the memory (120) may store one or more software applications, such as an operating system (or system) software application, a firmware software application, a driver software application, a plug-in (e.g., add-in, add-on, and / or applet) software application, and / or any other suitable software applications. For example, the one or more software applications may include instructions executable by the processor (110). For example, the memory (120) may store instructions callable by an application programming interface (API). For example, the memory (120) may store instructions within a library.

[0036] FIG. 2 is a drawing showing an example of an exploded perspective view of a portable communication device according to one embodiment.

[0037] The portable communication device referenced in FIG. 2 may be, for example, an example of the portable communication device described above in FIG. 1.

[0038] Referring to FIGS. 1 and 2, a portable communication device (100) according to one embodiment includes a display device (140), a housing (188) (or a frame, a body, a support structure, a bracket structure), a rear cover (185) (or a cover, a rear case), and the housing (188) may include a first printed circuit board (181) (or a main PCB (printed circuit board)), a second printed circuit board (182) (or a sub PCB), a connection board (183) (or a connection cable, a connection wiring, a FPCB (flexible PCB)), a battery (189), a first bracket (180_br1) (or a first rear bracket, a first rear case), and a second bracket (180_br2) (or a second rear bracket, a second rear case).

[0039] The housing (188) may be formed at least in part from a metal material. Alternatively, the housing (188) may be formed by processing at least a part of a metal plate and adding an injection-molded structure at least partially through an injection process. At least a part of the housing (188) formed from a metal material may be utilized as an antenna of the portable communication device (100). As an example, the housing (188) may include a bottom portion that includes at least a portion of a curved structure and is formed in the shape of a polygonal plate as a whole, and a side wall formed along an edge of the bottom portion and formed in a direction perpendicular to the bottom portion (e.g., the −z-axis or the z-axis direction). As an example, the overall shape of the bottom portion of the housing (188) may include a rectangular shape, and the side wall may be arranged in a band shape along the edge of the bottom portion of the rectangular shape. In the above-described structure, at least a part of the side wall may be formed from a metal material, and at least a part of the bottom portion may include an injection-molded structure. Alternatively, at least a portion of the side wall may include a structure formed of a metal material and an injection-molded structure, and at least a portion of the bottom may include a structure formed of a metal material and an injection-molded structure. According to one embodiment, the side wall of the housing (188) may be segmented by at least one slit formed in the z-axis direction (or -z-axis direction). Correspondingly, the side wall may include a structure in which a plurality of segmented portions are arranged in a band shape, and at least one of an insulating material and an adhesive material may be filled within the slit.

[0040] At least a part of the display device (140) may be mounted on the front side (e.g., the side facing the z-axis direction) of the housing (188). As an example, at least a part of the back side (e.g., the side opposite the front side where the screen is displayed) of the display device (140) may be placed on the front side of the bottom side of the housing (188), and the side wall portions protruding in the z-axis direction among the side walls of the housing (188) may be arranged to surround the edge of the display device (140). A gap may be formed between the side wall portions protruding in the z-axis direction of the housing (188) and the edge of the display device (140). A first adhesive member may be further arranged between the side wall portions and the front side direction of the bottom side of the display device (140) and the housing (188). The first adhesive member may fix at least a part of the display device (140) to the front side of the housing (188). Alternatively, the display device (140) may be secured to the front of the housing (188) based on various structures or methods.

[0041] Electronic elements or other structures related to supporting various functions of the portable communication device (100) may be arranged on the rear side (e.g., the side facing the -z-axis) of the housing (188). As an example, a groove (or hole) may be formed on the rear side of the housing (188) in which a battery (189) may be arranged (or mounted). Alternatively, the rear side of the bottom side of the housing (188) may include a groove (or hole) in which a first printed circuit board (181) and a second printed circuit board (182) may be arranged (or mounted). The bottom side of the housing (188) may include a hole (e.g., a hole penetrating the front and rear sides of the bottom side of the housing (188)) related to wiring arrangements by which the display device (140) and the first printed circuit board (181) or the second printed circuit board (182) may be electrically connected. Additionally or alternatively, a rear cover (185) covering the rear bottom surface (e.g., the surface facing the -z-axis direction) of the housing (188) may be disposed. A second adhesive member may be disposed between the rear bottom surface of the housing (188) and the rear cover (185) to secure the rear cover (185) to the rear bottom surface of the housing (188). As an example, the second adhesive member may be disposed between the edge of the rear cover (185) and the edge of the rear bottom surface of the housing (188) or a side wall portion protruding in the -z-axis direction from the edge of the bottom surface of the housing (188) to secure the rear cover (185) to the housing (188). Alternatively, the rear cover (185) may be secured to the rear surface of the housing (188) based on various structures or methods. A first bracket (180_br1) is placed between the rear cover (185) and the first printed circuit board (181), and the first bracket (180_br1) can be combined with one side of the bottom of the housing (188) (e.g., the bottom part located at the top in the y-axis direction from the center of the portable communication device (100) (or based on the battery (189))).A second bracket (180_br2) is placed between the rear cover (185) and the second printed circuit board (182), and the second bracket (180_br2) can be combined with one side of the bottom of the housing (188) (e.g., the bottom part located at the bottom in the -y-axis direction from the center of the portable communication device (100) (or based on the battery (189)).

[0042] The rear cover (185) may be arranged to cover the rear surface of the housing (188). The rear cover (185) may have a shape similar to the rear surface of the housing (188). At least a portion of the rear cover (185) may include a structure (or portion) formed of a non-metallic material. The rear cover (185) may include at least one hole penetrating in the front-rear direction (e.g., the z-axis direction or the -z-axis direction). The at least one hole may include a camera hole related to at least one camera (or image sensor) arranged within the housing (188) or a sensor hole related to at least one sensor (170).

[0043] The first printed circuit board (181) may be disposed on a portion of the rear surface of the housing (188) (e.g., the upper portion in the y-axis direction based on the battery (189)). The first printed circuit board (181) may include at least one electronic element. For example, the first printed circuit board (181) may include at least one processor (110 of FIG. 1) (e.g., CPU, GPU), at least one camera, at least one sensor, at least one memory (120), and at least one communication circuit (160) related to the operation of the portable communication device (100). According to one embodiment, the first printed circuit board (181) may include at least one microphone or speaker. According to one embodiment, the first printed circuit board (181) may further include a detection circuit (302) related to detecting a folding state of the display FPCB module (200) according to an embodiment of the present disclosure. The number of the detection circuits (302) may vary depending on the number of guide structures arranged in relation to the detection of the folding state of the display FPCB module (200). Alternatively, when the detection of the folding state of the display FPCB module (200) according to the embodiment of the present disclosure is performed using a separate jig, the configuration of the detection circuit (302) may be omitted. Alternatively, the position of the detection circuit (302) may vary. For example, the detection circuit (302) may be arranged on the second printed circuit board (182). Alternatively, the detection circuit (302) may be arranged on another structure (e.g., the display FPCB module (200)).

[0044] The second printed circuit board (182) may be disposed on another portion of the rear surface of the housing (188) (e.g., the lower portion in the -y-axis direction based on the battery (189)). The second printed circuit board (182) may include at least one electronic element. For example, the second printed circuit board (182) may include at least one communication circuit (160) related to the operation of a communication function of the portable communication device (100) and a connection interface (e.g., a USB connector) that may be connected via a wired cable. Additionally or alternatively, the second printed circuit board (182) may include at least one microphone or speaker. For example, the second printed circuit board (182) may be functionally or electrically connected to a display device (140). In this regard, the bottom of the housing (188) on which the second printed circuit board (182) is mounted may include at least one hole through which a connector disposed on the display device (140) (e.g., a connector disposed on the display FCPB module (200)) can be exposed toward the rear of the housing (188).

[0045] The above-described connecting substrate (183) may include at least one of a cable, a wire, a film, a PCB, or an FPCB that can electrically connect the first printed circuit board (181) and the second printed circuit board (182). The connecting substrate (183) may transmit a signal of the first printed circuit board (181) to the second printed circuit board (182), or transmit a signal of the second printed circuit board (182) to the first printed circuit board (181). In the illustrated drawing, a structure in which at least a portion of the connecting substrate (183) is placed on the upper surface of the battery (189) (e.g., the surface exposed toward the rear cover (185)) is exemplified, but the present disclosure is not limited thereto. For example, at least a portion of the connecting substrate (183) may be placed between the battery (189) and the rear bottom portion (or the rear portion of the bottom portion) of the housing (188). Connector pins (or connector receiving portions) may be arranged at both ends of the above-described connecting board (183), and each of the first printed circuit board (181) and the second printed circuit board (182) may include connector receiving portions (or connector pins) that may be connected to each of the both ends of the above-described connecting board (183).

[0046] The battery (189) may be mounted on one side of the housing (188) (e.g., a groove or hole provided for mounting the battery (189). The battery (189) may supply power to, for example, a first printed circuit board (181) or a second printed circuit board (182). In this regard, the battery (189) may include a PMIC (Power management IC) for power charging and discharging. As an example, the battery (189) may be adhered to the rear bottom portion of the housing (188), and the portable communication device (100) may further include a battery adhesive member for adhering the battery (189).

[0047] The first bracket (180_br1) may be disposed between the rear cover (185) and the first printed circuit board (181). The first bracket (180_br1) may have, for example, a size that is the same as or similar to a size of at least one direction of the first printed circuit board (181). Alternatively, the first bracket (180_br1) may protect the first printed circuit board (181) by covering at least a portion of the first printed circuit board (181) and being coupled to the rear bottom portion of the housing (188). According to one embodiment, at least one antenna pattern may be disposed on at least a portion of the first bracket (180_br1), and the antenna pattern printed on the first bracket (180_br1) may be electrically connected to the first printed circuit board (181).

[0048] The second bracket (180_br2) may be disposed between the rear cover (185) and the second printed circuit board (182). The second bracket (180_br2) may have, for example, a size that is the same as or similar to a size of at least one direction of the second printed circuit board (182). Alternatively, the second bracket (180_br2) may protect the second printed circuit board (182) by covering at least a portion of the second printed circuit board (182) and being coupled to the rear bottom portion of the housing (188). According to one embodiment, at least one antenna pattern may be disposed on at least a portion of the second bracket (180_br2).

[0049] Meanwhile, at least some of the structure of the housing (188) described above, the structure of the first printed circuit board (181) and the second printed circuit board (182), the configuration of the first bracket (180_br1), the second bracket (180_br2), and the configuration of the rear cover (185) may be omitted or replaced with other configurations.

[0050] The display device (140) may be placed on the front side (e.g., one side in the z-axis direction) of the housing (188). According to one embodiment, at least a portion of the edge of the display device (140) may be protected by sidewall portions disposed on the front edge of the housing (188). According to one embodiment, the display device (140) (or display assembly) may include a display module (140d) (or display) and a display FPCB module (200). The display module (140d) may include a panel portion (140p) (or panel layer) for displaying a screen and a rear portion (140r) (or rear layer) disposed on the rear side of the panel portion (140p).

[0051] The panel portion (140p) may include, for example, a pixel layer (or a display panel on which a plurality of pixels are arranged) in which a plurality of pixels related to screen display are arranged, and a touch layer (or a touch panel) arranged on the pixel layer to detect a user's touch. Additionally or alternatively, the panel portion (140p) may include a protective layer (or protective layers) that protects at least one of the pixel layer or the touch layer. A hole related to front camera operation may be formed in at least one of the layers constituting the panel portion (140p) (or included in the panel portion (140p)).

[0052] The rear portion (140r) may be composed of a plurality of layers. For example, the rear portion (140r) may include at least one of a first rear support layer that dissipates heat generated in the panel portion (140p) when observed from the -z-axis to the z-axis direction, a second rear support layer that absorbs shock transmitted through the panel portion (140p), and a third rear support layer that supports the rear surface of the panel portion (140p). Additionally or alternatively, the portable communication device (100) (or the display module (140d)) may further include an adhesive layer that attaches the rear portion (140r) to the rear surface of the panel portion (140p) or adheres the first to third rear support layers. The rear portion (140r) may include only one of the first to third rear support layers or may include all of the support layers. Alternatively, the rear portion (140r) may have an area equal to or similar to the overall size of the panel portion (140p) and may be disposed on the rear surface (e.g., one side in the -z-axis direction) of the panel portion (140p). At least a portion of the rear portion (140r) may be partially removed. Alternatively, any one of the plurality of rear support layers may be configured to have a different size or shape from the other support layers.

[0053] One side of the display FPCB module (200) may be coupled to the display module (140d), and at least a portion of the other side of the display FPCB module (200) may be fixed to the rear surface of the display module (140d). In this process, the folding area of ​​the display FPCB module (200) may be arranged adjacent to a side wall portion of the housing (188) (e.g., a side wall portion used as a metal antenna). According to one embodiment, a guide structure may be arranged on the display FPCB module (200). The display FPCB module (200) may include a detection circuit (301) used to monitor the degree of folding (or folding state). The detection circuit (301) may replace the detection circuit (302) arranged on the first printed circuit board (181) as described above, or may be replaced by the detection circuit (302), or may be further added independently of the detection circuit (302). Alternatively, if the detection circuit (301) is placed in an external device (e.g., a display inspection jig) used to inspect for abnormalities in the display device (140), the detection circuit (301) may be omitted from the display FPCB module (200).

[0054] The display FPCB module (200) including the above guide structure can have the folding degree of the display FPCB module (200) uniform by monitoring the folding state of the display FPCB module (200) based on the above guide structure. Correspondingly, since the distance between the display FPCB module (200) and the side wall portion of the housing (188) is managed to be constant for each portable communication device (100), the communication characteristics of the communication circuit (160) that uses at least a portion of the side wall of the housing (188) as an antenna can be designed uniformly.

[0055] As described above, the display device (140) according to one embodiment of the present disclosure includes a guide structure disposed on at least a portion of the display FPCB module (200), and by using the guide structure to check the degree of folding or the folding state of the display FPCB module (200) during the folding process of the display FPCB module (200), the folding state of the display FPCB module (200) of each portable communication device (100) can be uniformly managed. Based on this, the display device (140) of the present disclosure can be managed to exhibit uniform communication characteristics for each portable communication device (100) in an environment in which a part of the metal side wall of the housing (188) is used as an antenna.

[0056] FIG. 3 is a drawing showing an example of a portion of a housing configuration among the configurations of a portable communication device according to one embodiment. FIG. 4 is a drawing showing an example of a cross-section of a portion of a portable communication device according to one embodiment.

[0057] Referring to FIGS. 1 to 3, a housing (188) according to one embodiment may include a bottom portion (188_bot) on which a first printed circuit board (the first printed circuit board 181 of FIG. 2) is placed, and a side wall (188_w) forming an edge of the bottom portion (188_bot). The rear surface of the bottom portion (188_bot) may include at least a battery area (189_ar) on which a battery (the battery 189 of FIG. 2) is placed. Additionally or alternatively, as described above in FIG. 2, the rear surface of the bottom portion (188_bot) may further include an area on which a second printed circuit board (the second printed circuit board 182 of FIG. 2) is placed.

[0058] The side wall (188_w) may include a plurality of slits (188_st1, 188_st2, 188_st3) and a plurality of housing antennas (188_at1, 188_at2). As an example, the side wall (188_w) may include a first slit (188_st1) arranged at an edge in the -y-axis direction, a second slit (188_st2), and a third slit (188_st3) arranged at an edge in the x-axis direction. The side wall (188_w) may include a first housing antenna (188_at1) arranged between the first slit (188_st1) and the second slit (188_st2), and a second housing antenna (188_at2) arranged between the first slit (188_st1) and the third slit (188_st3). Additionally or alternatively, the side wall (188_w) may further include at least one slit arranged in a region other than the three slits (188_st1, 188_st2, 188_st3), and the side wall may further include at least one slit and at least one housing antenna isolated by the slits (188_st1, 188_st2, 188_st3).

[0059] The above slits (188_st1, 188_st2, 188_st3) may cut a portion of the side wall (188_w) to segment the housing antennas (188_at1, 188_at2) (or space them apart by forming a gap of a certain size) or to segment a side wall portion different from the housing antennas (188_at1, 188_at2) (or space them apart by forming a gap of a certain size). At least an insulating material may be filled in the empty space or gap corresponding to the slits (188_st1, 188_st2, 188_st3). Alternatively, a material (or structure) in which an insulating material and an adhesive material are mixed may be placed in the slits (188_st1, 188_st2, 188_st3). The above housing antennas (188_at1, 188_at2) are electrically connected to the communication circuit (160) described above in FIG. 1 and can be used for signal transmission and reception of the communication circuit (160).

[0060] In the embodiment of the present disclosure, the side wall (188_w) presents a structure including a first housing antenna (188_at1) positioned between a first slit (188_st1) and a second slit (188_st2) that can electrically influence and be influenced by the display FPCB module (200) of the display device (140). In the embodiment of the present disclosure, when the direction in which the display FPCB module (200) is folded is changed to the left and right side directions (e.g., in the x-axis or -x-axis direction, in the direction in which the volume or power key is arranged or in the opposite direction) with respect to the center of the portable communication device (100) and the housing antenna is formed as a part of the left and right side walls, the direction or position of the display FPCB module (200) including the guide structure of the present disclosure may be changed and applied.

[0061] Referring to FIGS. 1 to 4, as shown in the cross-section taken along the A0-A0` cutting line of FIG. 3, a portable communication device (100) according to one embodiment may include at least a display device (140) and a housing (188).

[0062] The above display device (140) may include a display FPCB module (200) and a display module (140d).

[0063] The display module (140d) may include a panel portion (140p) and a rear portion (140r). The panel portion (140p) may include a window (140_wd), a touch panel (140_tp), and a display panel (140_pn). Additionally or alternatively, the panel portion (140p) may further include at least one adhesive layer that bonds the window (140_wd) (or a protective layer), the touch panel (140_tp), and the display panel (140_pn). Alternatively, the panel portion (140p) may further include a polarizing plate. The rear portion (140r) may be disposed on the rear surface of the panel portion (140p) to support the panel portion (140p). The rear portion (140r) may include, for example, at least one shock absorbing layer and a metal layer (e.g., a Cu layer or a metal pattern layer). However, the display module (140d) of the present invention is not limited to the types or numbers of the panel portion (140p) and the rear portion (140r) described above, and the panel portion (140p) may include at least one layer capable of supporting a function of displaying a screen, and the rear portion (140r) may be configured to include at least one layer including a structure (or portion) made of a metal material.

[0064] The display FPCB module (200) may include a display processor (200_ic) (or processor, display driving IC) and a display FPCB (200_fp). The display processor (200_ic) may be disposed on a panel portion (140p) of the display module (140d). Alternatively, the display processor (200_ic) may be disposed on the display FPCB (200_fp). The display FPCB (200_fp) is connected to the display panel portion (140p) and at least a portion thereof may be folded. At least a portion of the folded portion may be disposed on a rear portion (140r) of the display module (140d).

[0065] Referring to FIG. 4, which shows a cross-section taken along the A0-A0` cutting line of FIG. 3, the housing (188) of the portable communication device (100) according to one embodiment may include at least an injection part (188_md) and a first housing antenna (188_at1).

[0066] The above injection part (188_md) may include a structure (or a non-metallic part) made of a non-metallic material. As an example, the injection part (188_md) may include a bottom part (188_bot), a housing injection side wall (188_mdc) extending from the bottom part (188_bot) in the z-axis direction, and an injection support part (188_mds) that comes into contact with the first housing antenna (188_at1).

[0067] The above-described bottom portion (188_bot) may constitute (or include) the bottom of the housing (188). The bottom portion (188_bot) may include a plate shape in which the length of the x-axis or y-axis is greater than the size of the z-axis. As described above, the bottom portion (188_bot) provides a space in which various elements of the portable communication device (100) can be arranged, and may support at least a portion of the arranged various elements. As an example, at least a portion of the display device (140) may be placed in the front direction (e.g., z-axis direction) of the bottom portion (188_bot), and a battery (189) or at least one printed circuit board (181, 182), and a rear cover (185) may be placed in the rear direction (e.g., -z-axis direction) of the bottom portion (188_bot).

[0068] The housing injection side wall (188_mdc) may be disposed at an edge (e.g., an edge of the xy plane) of the bottom portion (188_bot). For example, the housing injection side wall (188_mdc) may extend from the front of the bottom portion (188_bot) to a certain height in the z-axis direction. Alternatively, the housing injection side wall (188_mdc) may be disposed between the edge of the bottom portion (188_bot) and the injection support portion (188_mds), and the upper height of the housing injection side wall (188_mdc) may be formed higher than the z-axis direction height of the injection support portion (188_mds) or the z-axis direction height of the bottom portion (188_bot). As an example, at least a portion of the housing injection side wall (188_mdc) may be disposed between the housing bottom portion (188_bot) and the injection support portion (188_mds) and may include a portion that protrudes higher in the z-axis direction than a height of one side of the bottom portion (188_bot) (e.g., a side facing the z-axis) or one side of the injection support portion (188_mds) (e.g., a side facing the z-axis). The housing injection side wall (188_mdc) may form a step shape facing the -y-axis direction together with the injection support portion (188_mds). One side of the housing injection side wall (188_mdc) (e.g., a side facing the -y-axis) may be disposed to face (or contact) one side (e.g., a side facing the y-axis) of the first housing antenna (188_at1). The housing injection side wall (188_mdc) may be formed of the same material (e.g., non-metallic material) as the injection support (188_mds) and the housing bottom (188_bot). The height of the housing injection side wall (188_mdc) in the z-axis direction (or the top height of the housing injection side wall (188_mdc)) may be formed lower than the height of the first housing antenna (188_at1) in the z-axis direction (or the top height of the first housing antenna (188_at1)). As an example, the top portion of the housing injection side wall (188_mdc) may form a stepped shape together with the top portion of the first housing antenna (188_at1).A portion of the display device (140) (e.g., window (140_wd)) may be placed on at least a portion of the upper portion of the housing injection side wall (188_mdc). Alternatively, at least a portion of the upper portion of the housing injection side wall (188_mdc) may support at least a portion of the edge of the display device (140).

[0069] The above-described bottom portion (188_bot) and the housing injection side wall (188_mdc) may form a groove in which at least a portion of the display device (140) may be seated. Correspondingly, at least a portion of an edge of the display device (140) may face one side (e.g., a side facing the y-axis direction) of the housing injection side wall (188_mdc). As an example, a display FPCB (200_fp) electrically connected to at least one of the display panel (140_pn) and the touch panel (140_tp) may be folded from the z-axis direction to the -z-axis direction, and the folded area (e.g., a curved area) of the display FPCB (200_fp) may be arranged adjacent to a corner area formed by the bottom portion (188_bot) and the housing injection side wall (188_mdc). The display FPCB (200_fp) may have an electrical influence on the first housing antenna (188_at1) as it includes at least metal wiring. The display FPCB (200_fp) of the present disclosure may maintain a constant distance between the display FPCB (200_fp) (or display processor (200_ic)) of each portable communication device (100) and the first housing antenna (188_at1) by forming a uniform folding shape of the display FPCB (200_fp) using a guide structure, thereby supporting uniform communication characteristics.

[0070] The injection support member (188_mds) may include a shape that protrudes in the -y-axis direction from a portion (e.g., a lower portion in the -z-axis direction) of the housing injection side wall (188_mdc). For example, the injection support member (188_mds) may support a lower portion (e.g., a part in the -z-axis direction) of the first housing antenna (188_at1). In this regard, one surface (e.g., a surface facing the z-axis direction) of the injection support member (188_mds) may be in contact with the lower portion (or the surface facing the -z-axis direction) of the first housing antenna (188_at1). The thickness of the injection support member (188_mds) in the z-axis direction may be formed to be smaller than the thickness of the first housing antenna (188_at1) in the z-axis direction. The y-axis length of the above injection support member (188_mds) can be formed to be equal to or similar to the y-axis thickness of the first housing antenna (188_at1).

[0071] FIG. 5 is a drawing showing an example of the rear surface of a first type display device according to one embodiment. FIG. 6 is a drawing showing an example of the rear surface of a first type display device before the first type FPCB module is folded according to one embodiment.

[0072] Referring to FIGS. 1 to 5 and 6, the first type display device (140_t1) may include a first type display module (140d1) and a first type FPCB module (200_t1) (or a first type display FPCB module).

[0073] The first type display module (140d1) may include a panel portion (140p) and a rear portion (140r). The panel portion (140p) may include at least a portion of the same configuration as the panel portion (140p) described above in FIG. 4.

[0074] The rear portion (140r) may include a configuration identical or similar to the rear portion (140r) described above in FIG. 4. For example, the rear portion (140r) may include a plurality of layers including a metal layer. Alternatively, the rear portion (140r) may include a first rear support layer (140_r1), a second rear support layer (140_r2), and a third rear support layer (140_r3).

[0075] The first rear support layer (140_r1) may include a metal layer (or a Cu layer). The first rear support layer (140_r1) may be arranged over the entire rear surface of the display. Alternatively, the first rear support layer (140_r1) may be arranged in an area of ​​the entire rear surface of the display, excluding an area where the second rear support layer (140_r2) (or at least one of the second rear support layer (140_r2) and the third rear support layer (140_r3)) is formed. The first rear support layer (140_r1) may support the panel portion (140p). The first rear support layer (140_r1) may dissipate at least a portion of the heat generated in the panel portion (140p).

[0076] The second rear support layer (140_r2) may be exposed by removing at least a portion of the first rear support layer (140_r1). The second rear support layer (140_r2) may be disposed between the panel portion (140p) and the first rear support layer (140_r1) in the Z-axis direction. The second rear support layer (140_r2) may be disposed between the third rear support layer (140_r3) and a lower portion of the first rear support layer (140_r1) in the Y-axis direction. At least a portion of the second rear support layer (140_r2) may be formed similarly to a portion of the first type FPCB module (200_t1) (e.g., a portion of the second portion (202) of FIG. 6). An adhesive material may be applied or an adhesive member may be disposed on the second rear support layer (140_r2). At least a portion of the second rear support layer (140_r2) may be formed to surround at least a portion of the first structure contact area (140_r1_co1) formed as a part of the first rear support layer (140_r1). The second rear support layer (140_r2) may serve as a shock absorbing layer of the panel portion (140p). The second rear support layer (140_r2) may be formed of a non-conductive material. For example, at least a portion of the second rear support layer (140_r2) may be formed of a sponge or a plurality of embossments of a non-conductive material.

[0077] The third rear support layer (140_r3) may include an adhesive layer separately adhered on the first rear support layer (140_r1). At least a portion of the third rear support layer (140_r3) may include a shape corresponding to at least a portion of a shape of the rear surface (e.g., the surface shown in FIG. 6) of the first type FPCB module (200_t1). The third rear support layer (140_r3) may include a conductive adhesive member. The third rear support layer (140_r3) may fix at least a portion of the first type FPCB module (200_t1) to the rear portion (140r). A portion of the third rear support layer (140_r3) corresponding to an area where the display processor (200_ic) is disposed may be removed while the first type FPCB module (200_t1) is folded. Alternatively, when the first type FPCB module (200_t1) is folded, the third rear support layer (140_r3) and the area of ​​the first rear support layer (140_r1) corresponding to the area where the display processor (200_ic) is disposed may be removed to become an area (200_ic_ar) where the second rear support layer (140_r2) is exposed. The third rear support layer (140_r3) may be disposed within a first distance from one edge (e.g., the -y-axis edge) of the panel portion (140p) (or the display panel (140_pn) of FIG. 4), and the portion of the second rear support layer (140_r2) where the first rear support layer (140_r1) is removed and exposed may be disposed within a second distance from one edge (e.g., the y-axis edge) of the third rear support layer (140_r3).

[0078] The rear portion (140r) may include a first region (140_bsen_ar) in which a biometric sensor is arranged. The first region (140_bsen_ar) may be formed in a form penetrating the first rear support layer (140_r1), the second rear support layer (140_r2), and the third rear support layer (140_r3) in the z-axis direction. When the first type FPCB module (200_t1) is in a folded state, the first region (140_bsen_ar) may be aligned with the second region (200_bsen_ar) formed in the first type FPCB module (200_t1).

[0079] The above first type FPCB module (200_t1) may include a display FPCB (200_fp) (e.g., a first FPCB (200_fp1) (or display panel FPCB), a second FPCB (200_fp2) (or touch panel FPCB)), a touch processor (200_tpic), a connector (200_co), a detection circuit (200_cir), a first signal line (200_sl1), and a second signal line (200_sl2). The detection circuit (200_cir) may be omitted. If the above detection circuit (200_cir) is omitted from the first type FPCB module (200_t1), the first type FPCB module (200_t1) may include only one signal line (e.g., one of the first signal line (200_sl1) and the second signal line (200_sl2)) connecting the guide structure and the connector (200_co).

[0080] Additionally or alternatively, the first type FPCB module (200_t1) may further include a biosensor module. In relation to the biosensor module arrangement, the first type display device (140_t1) may include a biosensor region (140_bsen_ar, 200_bsen_ar). The biosensor region (140_bsen_ar, 200_bsen_ar) may include a first region (140_bsen_ar) in which at least a portion of the rear portion (140r) is removed and the rear portion of the panel portion (140p) (e.g., the rear portion of the display panel (140_pn)) is exposed. Additionally, the biosensor region (140_bsen_ar, 200_bsen_ar) may include a second region (200_bsen_ar) from which a portion of the first FPCB (200_fp1) is removed (or from which a portion of the second part (202) of the first type FPCB module (200_t1) is removed). The biosensor region (140_bsen_ar, 200_bsen_ar) may include a region in which the first region (140_bsen_ar) and the second region (200_bsen_ar) overlap in the z-axis direction.

[0081] Referring to FIGS. 1 to 5, the first FPCB (200_fp1) may be electrically connected to pads (or metal signal terminals related to pixel driving) arranged on the front edge (e.g., the side facing the z-axis direction) of the display panel (140_pn). Alternatively, the first FPCB (200_fp1) may be electrically connected to a display processor (200_ic) (e.g., display driving integrated chips, DDIC) arranged on the front edge of the display panel (140_pn). The first FPCB (200_fp1) may be connected to a printed circuit board (e.g., at least one of the first PCB 181 and the second PCB 182 of FIG. 2) through a connector (200_co), and may transmit a signal transmitted by a main processor (e.g., a CPU or GPU) mounted on the printed circuit board to the display panel (140_pn). In this regard, the first FPCB (200_fp1) may include at least one wiring layer (or metal pattern layer) and at least one insulating layer. At least a portion of the first signal line (200_sl1) and the second signal line (200_sl2) may be disposed on at least one wiring layer of the first FPCB (200_fp1). At least one insulating layer of the first FPCB (200_fp1) may be disposed to cover at least a portion of the first signal line (200_sl1) and the second signal line (200_sl2). According to one embodiment, when the detection circuit (200_cir) is omitted in the first type FPCB module (200_t1), at least a portion of one of the first signal line (200_sl1) or the second signal line (200_sl2) may be disposed on at least one wiring layer of the first FPCB (200_fp1).

[0082] A part of the second FPCB (200_fp2) may be electrically connected to the touch processor (200_tpic), and another part may be electrically connected to the touch panel (the touch panel (140_tp) of FIG. 4). The second FPCB (200_fp2) may transmit a signal generated in the touch processor (200_tpic) to the touch panel (the touch panel (140_tp) of FIG. 4), or transmit a signal change generated in the touch panel (the touch panel (140_tp) of FIG. 4) to the touch processor (200_tpic). The second FPCB (200_fp2) may include a wiring electrically connected to a connector (200_co). The second FPCB (200_fp2) may include at least one wiring layer (or metal pattern layer) and at least one insulating layer. The number of wiring layers and the number of insulating layers of the first FPCB (200_fp1) and the second FPCB (200_fp2) may be formed differently. The length of the first FPCB (200_fp1) in the x-axis direction and the length of the second FPCB (200_fp2) in the x-axis direction may vary depending on the observation position. Meanwhile, in the above description, the first FPCB (200_fp1) and the second FPCB (200_fp2) are illustrated as being in a separated form, but the present disclosure is not limited thereto. For example, the first FPCB (200_fp1) and the second FPCB (200_fp2) may be integrated or at least partially disposed on the rear portion (140r) of the first type display module (140d1) after the first FPCB (200_fp1) and the second FPCB (200_fp2) are fixed on a specific film or adhesive material.

[0083] The above touch processor (200_tpic) may be mounted on one side of the second FPCB (200_fp2). The touch processor (200_tpic) may supply a signal for driving the touch panel (the touch panel (140_tp) of FIG. 4) to the touch panel (the touch panel (140_tp) of FIG. 4) according to a control signal transmitted through the connector (200_co) (or through the second FPCB (200_fp2) connected to the connector (200_co)). The touch processor (200_tpic) may detect a signal change on the touch panel (the touch panel (140_tp) of FIG. 4) and transmit the detected signal change to a printed circuit board (e.g., at least one of the first PCB 181 and the second PCB 182 of FIG. 2) through the connector (200_co).

[0084] The connector (200_co) may include terminals electrically connected to the first FPCB (200_fp1) and terminals electrically connected to the second FPCB (200_fp2). The connector (200_co) according to the embodiment of the present disclosure may include terminals connected to the first signal line (200_sl1) and the second signal line (200_sl2). Meanwhile, in the first type display device (140_t1), a structure in which two signal lines (200_sl1, 200_sl2) are connected to the connector (200_co) is exemplified, but the present disclosure is not limited thereto. For example, the connector (200_co) may include a terminal connected to one signal line. As an example, when the detection circuit (200_cir) is omitted in the first type FPCB module (200_t1), the connector (200_co) may include a terminal connected to one of the first signal line (200_sl1) or the second signal line (200_sl2).

[0085] The above detection circuit (200_cir) may include at least one element. For example, the detection circuit (200_cir) may include distribution resistor elements that divide the voltage of the power supplied to the first guide structure (200_gd1). The detection circuit (200_cir) may include the detection circuit (301) described above in FIG. 2. When a separate inspection jig connected to the connector (200_co) is used in relation to detecting the folding state of the display FPCB module (200), the detection circuit (200_cir) may be omitted. The inspection jig supplies a designated test power through a connector (200_co) and a first signal line (200_sl1), and determines a signal received through a connector (200_co) and a second signal line (200_sl2), thereby determining the arrangement state of the first guide structure (200_gd1), thereby determining the folding state of the display FPCB module (200).

[0086] The first signal line (200_sl1) can electrically connect the connector (200_co) and the detection circuit (200_cir). In this regard, the first signal line (200_sl1) may include a conductive material (or a member). For example, at least a portion of the first signal line (200_sl1) may connect the detection circuit (200_cir) and the connector (200_co) through at least one of the first FPCB (200_fp1) and the second FPCB (200_fp2). The first signal line (200_sl1) may be formed on a metal layer of at least one of the first FPCB (200_fp1) and the second FPCB (200_fp2), and may be isolated (electrically separated) from other metal patterns formed on the same metal layer.

[0087] The second signal line (200_sl2) may be arranged between the connector (200_co) and the detection circuit (200_cir). For example, at least a portion of the second signal line (200_sl2) may electrically connect the connector (200_co) and the detection circuit (200_cir) through at least one of the first FPCB (200_fp1) and the second FPCB (200_fp2). In this regard, the second signal line (200_sl2) may be formed of a conductive material (or a conductive member). At least a portion of the second signal line (200_sl2) may be arranged parallel to the first signal line (200_sl1). The second signal line (200_sl2) may be a signal line that detects a signal change depending on whether the first guide structure (200_gd1) and the rear portion (140r) of the display device (140) are in contact. The second signal line (200_sl2) may be formed on at least one metal layer among the first FPCB (200_fp1) and the second FPCB (200_fp2), and may be isolated (electrically separated) from other metal patterns formed on the same metal layer. Alternatively, the second signal line (200_sl2) may be disposed on the same metal layer as the first signal line (200_sl1) (e.g., at least one metal layer among the metal pattern layer of the first FPCB (200_fp1) and the metal pattern layer of the second FPCB (200_fp2)). The present disclosure is not limited thereto, and the second signal line (200_sl2) may be disposed on a different metal layer from the metal layer of the first FPCB (200_fp1) (or the second FPCB (200_fp2)) on which the first signal line (200_sl1) is disposed.

[0088] According to one embodiment, when the detection circuit (200_cir) is removed from the first type FPCB module (200_t1), either the first signal line or the second signal line may be arranged between the first guide structure (200_gd1) and the connector (200_co). Either the first signal line or the second signal line may be used to detect a signal change according to a contact state between the first guide structure (200_gd1) and the rear portion (140r) of the display device (140).

[0089] Referring to FIGS. 1 to 6, the first type FPCB module (200_t1) may have a partially different stacking configuration. For example, the first stacking number of the first part (201) of the first type FPCB module (200_t1) located within a third distance from the first type display module (140d1) of the first type FPCB module (200_t1) and the second stacking number of the second part (201) of the first type FPCB module (200_t1) located within a fourth distance (e.g., a distance greater than the third distance) from the third distance of the first type display module (140d1) may be different. As an example, the first stacking number (e.g., the number of metal layers (or metal pattern layers, metal wiring layers) and insulating layers) may be less than the second stacking number (e.g., the number of metal layers and insulating layers). According to one embodiment, the hardness of the first portion (201) of the first type FPCB module (200_t1) and the hardness of the second portion (201) of the first type FPCB module (200_t1) may be different. For example, the hardness of the first portion (201) may be lower than the hardness of the second portion (202). Alternatively, the first portion (201) may be more ductile (more flexible) than the second portion (202).

[0090] According to one embodiment, the first guide structure (200_gd1), signal lines (200_sl1, 200_sl2), and connector (200_co) may be disposed in the second portion (202). The display processor (200_ic) may be disposed in the first portion (201). At least a portion of the first portion (201) (e.g., the entire portion excluding the portion where the display processor (200_ic) is disposed) may be adhered to the third back support layer (140_r3). A portion of the second portion (202) may be adhered on the third back support layer (140_r3), and another portion of the second portion (202) may be disposed on the first back support layer (140_r1) or the second back support layer (140_r2). An adhesive material (or adhesive member) may be applied (or placed) to the first part (201) and the second part (202) so as to be adhered to the rear part (140r). The first part (201) and the second part (202) may be configured to distinguish the shape of the first type FPCB module (200_t1) in the vertical direction (e.g., y-axis or -y-axis direction). The first FPCB (200_fp1) and the second FPCB (200_fp2) may include a state in which the shape of the first type FPCB module (200_t1) is distinguished in the left-right direction (e.g., x-axis or -x-axis direction). Accordingly, the first FPCB (200_fp1) may be included in a part of the first part (201) described above and the second part (202), and the second FPCB (200_fp2) may be included in another part of the first part (201) described above and another part of the second part (202).

[0091] According to one embodiment, the first guide structure (200_gd1) may be arranged at a first position on the rear surface (200_rear_sf) of the first type FPCB module (200_t1). For example, the first guide structure (200_gd1) may be arranged so that at least a portion of the first guide structure (200_gd1) is exposed on the rear surface (200_rear_sf) of the first type FPCB module (200_t1) (a surface facing the rear surface (140r) of the first type display module (140d1) when the first type FPCB module (200_t1) is in a folded state). The first guide structure (200_gd1) may include a metal material (or a structure formed of a metal material). Alternatively, the first guide structure (200_gd1) may be formed as a portion of a specific metal layer of the first type FPCB module (200_t1) including a plurality of metal layers and an insulating layer. As an example, a part of the metal layer disposed on the rear surface (200_rear_sf) of the first type FPCB module (200_t1) may form a first guide structure (200_gd1). For example, an FPCB rear surface insulating layer (200_rear_ins1) may be disposed on the rear surface (200_rear_sf) of the first type FPCB module (200_t1). The first guide structure (200_gd1) may be formed by removing a part of the FPCB rear surface insulating layer (200_rear_ins1), thereby exposing a part of the metal layer disposed thereunder. Alternatively, the first guide structure (200_gd1) may be formed by applying (or disposing) a separate metal material on the FPCB rear surface insulating layer (200_rear_ins1).

[0092] According to one embodiment, at least one layer (e.g., a metal layer disposed on the rear surface (200_rear_sf)) among a plurality of metal layers constituting the first type FPCB module (200_t1) may include at least one ground region (200_gnd_1, 200_gnd_2, 200_gnd_3). The at least one ground region (200_gnd_1, 200_gnd_2, 200_gnd_3) may be formed by exposing a portion of a metal layer disposed thereunder when the FPCB rear insulating layer (200_rear_ins1) is removed. The at least one ground region (200_gnd_1, 200_gnd_2, 200_gnd_3) may be disposed on the same metal layer. The at least one grounding region (200_gnd_1, 200_gnd_2, 200_gnd_3) may be arranged on the same layer and may be electrically connected. When the first type FPCB module (200_t1) is folded, the at least one grounding region (200_gnd_1, 200_gnd_2, 200_gnd_3) may be bonded to at least one of the third rear support layer (140_r3) and the first rear support layer (140_r1). The third rear support layer (140_r3) may be formed of a conductive adhesive material (e.g., a conductive double-sided tape). Accordingly, at least one of the ground regions (200_gnd_1, 200_gnd_2, 200_gnd_3) may serve as a ground terminal electrically connected to the first rear support layer (140_r1) via the third rear support layer (140_r3). The first guide structure (200_gd1) and the at least one of the ground regions (200_gnd_1, 200_gnd_2, 200_gnd_3) may be spaced apart from each other. As an example, the first guide structure (200_gd1) may be arranged in an island shape on the metal layer including the at least one of the ground regions (200_gnd_1, 200_gnd_2, 200_gnd_3).The first signal line (200_sl1) and the second signal line (200_sl2) may be arranged on the same metal layer as the at least one of the ground regions (200_gnd_1, 200_gnd_2, 200_gnd_3) and the first guide structure (200_gd1).

[0093] While the first type FPCB module (200_t1) is folded and at least a portion thereof is in contact with the rear portion (140r), the first guide structure (200_gd1) may be in contact with a first structure contact area (140_r1_co1) corresponding to a portion of the first rear support layer (140_r1). The first structure contact area (140_r1_co1) is a specific area of ​​the first rear support layer (140_r1) and may be arranged in an area at least partially surrounded by the second rear support layer (140_r2). Since the first structure contact area (140_r1_co1) is formed as a portion of the first rear support layer (140_r1), it may include a portion (or structure) formed of a metal material. Accordingly, the first guide structure (200_gd1) can be in electrical contact with the first rear support layer (140_r1) that serves as a ground through the first structure contact area (140_r1_co1). The position of the first structure contact area (140_r1_co1) or a portion of the second rear support layer (140_r2) surrounding the first structure contact area (140_r1_co1) can be formed identically for each display device (140). While the first type FPCB module (200_t1) is folded and fixed on the rear portion (140r), the first guide structure (200_gd1) is operated to be in contact with the first structure contact area (140_r1_co1) surrounded by the second rear support layer (140_r2), thereby uniformly forming a folded state of the first type FPCB module (200_t1). Alternatively, the distance between the folding area of ​​the first type FPCB module (200_t1) and the first housing antenna (188_at1) can be formed uniformly.

[0094] FIG. 7 is a drawing showing an example of the rear side of a second type display device according to an embodiment. FIG. 8 is a drawing showing an example of a cross-section of a portion of the portable communication device of FIG. 7 according to an embodiment. As an example, the cross-section of FIG. 8 shows a cross-section when the A1-A1` cutting line position shown in FIG. 3 is applied to the second type display device (140_t2) of FIG. 7. Alternatively, the cross-section of FIG. 8 shows an example of a cross-section cut along the A1-A1` cutting line position of FIG. 3 after the first type FPCB module (200_t1) of the second type display device (140_t2) of FIG. 7 is folded and fixed to the first modified rear part (140r_ch1) of the display device (140_t2). The second type display device (140_t2) of FIG. 7 may be presented through some modifications of the first type display device (140_t1). Alternatively, the second type display device (140_t2) of FIG. 7 may include a structure in which the detection circuit (200_cir) described in FIG. 5 or FIG. 6 is removed from the FPCB module. If the detection circuit is removed from the first type FPCB module (200_t1), one signal line (e.g., 200sl1) may connect the connector (200_co) and the first guide structure (200_gd1).

[0095] Referring to FIGS. 1 to 8, a second type display device (140_t2) may include a first type FPCB module (200_t1) and a second type display module (140d2). The first type FPCB module (200_t1) illustrated in FIGS. 7 and 8 may include the same structure as the first type FPCB module (200_t1) described above with reference to FIGS. 5 and 6. For example, the first type FPCB module (200_t1) may include a first guide structure (200_gd1), a first signal line (200_sl1), a connector (200_co), and at least one ground region (200_gnd_1, 200_gnd_2, 200_gnd_3). Additionally or alternatively, the first type FPCB module (200_t1) includes display FPCBs (200_fp) (e.g., the first FPCB (200_fp1), the second FPCB (200_fp2)) that are distinguished based on the x-axis direction, and may further include a display processor (200_ic) electrically connected to the first FPCB (200_fp1), a touch processor (the touch processor (200_tpic) of FIG. 5) electrically connected to the second FPCB (200_fp2), and a detection circuit (the detection circuit (200_cir) of FIG. 5). When the second type display device (140_t2) further includes the detection circuit, the first type FPCB module (200_t1) described in FIG. 7 or FIG. 8 may include a plurality of signal lines connected to the detection circuit. In addition, the first type FPCB module (200_t1) includes a first part (201) and a second part (202) that are distinguished based on the y-axis direction, and the configuration may have the same structure as the first part (e.g., the first part (201) of FIG. 6) and the second part (e.g., the second part (202) of FIG. 6) of the description related to FIGS. 5 and 6 above.

[0096] The second type display module (140d2) may have the same or similar configuration as the first type display module (140d1) described above with reference to FIGS. 5 and 6, except for the structure bonding area (140_r3_co1). For example, the second type display module (140d2) may include a panel portion (140p) and a first modified rear portion (140r_ch1). According to one embodiment, the panel portion (140p) may include a window (140_wd), a first adhesive layer (140_ad), a polarizing layer (140_pl), a touch panel (140_pl), and a display panel (140_pn). The window (140_wd) may be bonded to the polarizing layer (140_pl) via the first adhesive layer (140_ad).

[0097] The first FPCB (200_fp1) may be electrically connected to one end of a display panel (140_pn) on which a plurality of pixels are arranged through the first film (140_f1) (or the first anisotropic film, the first conductive film). A second film (140_f2) may be arranged at one end of the touch panel (140_tp) to which the second FPCB (200_fp2) is electrically connected. Alternatively, the second FPCB (200_fp2) may be electrically connected to one end of the touch panel (140_tp) through the second film (140_f2) (or the second anisotropic film, the second conductive film).

[0098] The first deformed rear portion (140r_ch1) may include, for example, a first deformed rear support layer (140_r1_ch1), a second rear support layer (140_r2), and a third rear support layer (140_r3). The second rear support layer (140_r2) and the third rear support layer (140_r3) may have the same or similar configurations as the second rear support layer and the third rear support layer described above with reference to FIGS. 5 and 6.

[0099] The first modified rear support layer (140_r1_ch1) may include a metal layer (or Cu layer) and a structure bonding region (140_r3_co1). The structure bonding region (140_r3_co1) may include a conductive material and an adhesive material. For example, the structure bonding region (140_r3_co1) may include a region in which a conductive adhesive member (e.g., a conductive double-sided tape) is disposed on the first modified rear support layer (140_r1_ch1). The conductive adhesive member disposed on the structure bonding region (140_r3_co1) may be composed of the same material as the third rear support layer (140_r3). The structure bonding region (140_r3_co1) may be formed to have, for example, a size equal to or larger than the size of the first guide structure (200_gd1). The conductive adhesive member arranged in the structure bonding region (140_r3_co1) may be arranged (or laminated) on the first deformable rear support layer (140_r1_ch1) in the -z-axis direction. The conductive adhesive member may be formed to be smaller than the entire size of the first deformable rear support layer (140_r1_ch1). Alternatively, at least a portion of the conductive adhesive member may be surrounded by at least a portion of the second rear support layer (140_r2).

[0100] As the first type FPCB module (200_t1) is folded, and at least a portion of the first part (201) and the second part (202) of the first type FPCB module (200_t1) are respectively adhered and fixed to the first deformed rear part (140r_ch1), the first guide structure (200_gd1) may be operated to come into contact with the structure adherence area (140_r3_co1). An inspection jig connected to the connector (200_co) as an external device physically separated from the portable communication device or a main processor (e.g., CPU) included in the portable communication device can determine whether the folding state of the first type FPCB module (200_t1) is good by confirming a signal according to the contact state between the guide structure and the rear part. Here, the inspection jig or main processor can determine whether the first guide structure (200_gd1) and the structure bonding area (140_r3_co1) are in contact when receiving a signal transmitted through a signal path including a first deformed rear support layer (140_r1_ch1) to which the structure bonding area (140_r3_co1) is electrically connected, a structure bonding area (140_r3_co1) connected to the first guide structure (200_gd1), a first signal line (200_sl1) connected to the first guide structure (200_gd1), and a connector (200_co) connected to the first signal line (200_sl1). When the first guide structure (200_gd1) and the structure bonding area (140_r3_co1) are operated so as to be in electrical contact, a gap (dif) between the first housing antenna (188_at1) and the display FPCB (200_fp) (e.g., the first FPCB (200_fp1) or the second FPCB (200_fp2)) can be formed by a preset distance.

[0101] When the first guide structure (200_gd1) does not contact the structure bonding area (140_r3_co1), the signal transmitted to the first signal line (200_sl1) connected to the first guide structure (200_gd1) may be different from the signal in the contacted state. For example, when the inspection jig or main processor (e.g., CPU) to which the connector (200_co) connected to the first signal line (200_sl1) is connected receives a signal transmitted through a signal path including the first guide structure (200_gd1), the first signal line (200_sl1), and the connector (200_co) that is not in contact with the structure bonding area (140_r3_co1), the folding state defect of the first type FPCB module (200_t1) can be determined.

[0102] The second type display device (140_t2) described above can maintain the fixed state (or bonded state) of the first guide structure (200_gd1) more firmly by attaching the first guide structure (200_gd1) to the structure bonding area (140_r3_co1) where the conductive bonding member is arranged.

[0103] Fig. 9 is a drawing showing an example of the rear surface of a third type display device according to one embodiment. The third type display device (140_t3) of Fig. 9 may be a modified example in which at least a portion of the first type display device (140_t1) described in Figs. 5 and 6 or the second type display device (140_t2) described in Figs. 7 and 8 is modified.

[0104] Referring to FIGS. 1 to 9, a third type display device (140_t3) according to one embodiment may include a first type display module (140d1) and a second type FPCB module (200_t2).

[0105] The first type display module (140d1) may include a panel portion (140p) and a rear portion (140r). The panel portion (140p) may include a configuration identical to or similar to at least a portion of the configuration of the panel portion (140p) described above in FIG. 4, FIG. 5, or FIG. 6. Accordingly, the description of the panel portion (140p) of FIG. 9 may be replaced with or supplemented by the description of the panel portion described above in FIGS. 4 to 6.

[0106] The rear portion (140r) may include a configuration identical or similar to the rear portion (140r) described above in FIG. 4, FIG. 5, or FIG. 6. For example, the rear portion (140r) may include a plurality of layers including a metal layer. Alternatively, the rear portion (140r) may include a first rear support layer (140_r1), a second rear support layer (140_r2), and a third rear support layer (140_r3), as described above in FIG. 4.

[0107] The first rear support layer (140_r1) may include a metal layer (or a Cu layer). The first rear support layer (140_r1) may be arranged over the entire rear surface of the display (e.g., 50% or more). Alternatively, the first rear support layer (140_r1) may be arranged in an area excluding an area where the second rear support layer (140_r2) (or at least one of the second rear support layer (140_r2) and the third rear support layer (140_r3)) is formed, among the entire rear surface of the display. Alternatively, the first rear support layer (140_r1) may be arranged in an area excluding an area where the second rear support layer (140_r2) is formed, and may be arranged to overlap the third rear support layer (140_r3) vertically based on the z-axis direction. The first rear support layer (140_r1) can support the entirety (e.g., more than 50%) of the panel portion (140p). The first rear support layer (140_r1) can dissipate at least a portion of the heat generated in the panel portion (140p).

[0108] According to one embodiment, the first rear support layer (140_r1) included in the third type display device (140_t3) may include a first structure contact area (140_r1_co1) and a second structure contact area (140_r1_co2). At least a portion of the first structure contact area (140_r1_co1) may include an area that comes into contact with the first guide structure (200_gd1) while the second type FPCB module (200_t2) is folded and at least a portion thereof is fixed to the rear portion (140r). At least a portion of the second structure contact area (140_r1_co2) may include an area that comes into contact with the second guide structure (200_gd2) while the second type FPCB module (200_t2) is folded and at least a portion thereof is fixed to the rear portion (140r). The first structure contact area (140_r1_co1) and the second structure contact area (140_r1_co2) are not separately distinguished as parts of the first rear support layer (140_r1), and may have the same or similar shape as the surrounding area. According to various embodiments, the first structure contact area (140_r1_co1) and the second structure contact area (140_r1_co2) (e.g., a metal material area as a part of the first rear support layer (140_r1)) may have a conductive adhesive member disposed in the structure contact area described above in FIG. 7.

[0109] The second rear support layer (140_r2) and the third rear support layer (140_r3) may include support layers having the same or similar shapes as the second rear support layer (140_r2) and the third rear support layer (140_r3) described above in FIG. 5 or FIG. 6. Alternatively, at least a portion of the second rear support layer (140_r2) and the third rear support layer (140_r3) may be deformed. However, even if the second rear support layer (140_r2) and the third rear support layer (140_r3) are deformed, the first guide structure (200_gd1) may be deformed within a range that does not interfere with the electrical contact between the first structure contact area (140_r1_co1) and the second guide structure (200_gd2) and the second structure contact area (140_r1_co2).

[0110] The rear portion (140r) may include a first region (140_bsen_ar) in which a biometric sensor is arranged, which is identical or similar to the rear portion (140r) described above in FIG. 5 or FIG. 6. While the second type FPCB module (200_t2) is folded and at least a portion thereof is fixed to the rear portion (140r), the first region (140_bsen_ar) may be aligned with the second region (200_bsen_ar) formed in the second type FPCB module (200_t2).

[0111] The second type FPCB module (200_t2) may include a display FPCB (200_fp) described above in FIG. 5 (e.g., a first FPCB (200_fp1) (or display panel FPCB) and a second FPCB (200_fp2) (or touch panel FPCB) distinguished in the x-axis direction described in FIG. 5), a touch processor (e.g., a touch processor (140_tpic) of FIG. 5), and a detection circuit (detection circuits 301, 302, 200_cir of FIG. 2 or FIG. 5). In addition, the second type FPCB module (200_t2) may include a first part (201) and a second part (202) similar to the first part and the second part described above in FIG. 6. According to one embodiment, the second type FPCB module (200_t2) may include a first guide structure (200_gd1), a first signal line (200_sl1), a second guide structure (200_gd2), and a third signal line (200_sl3) (or a second signal line in sequence). Additionally or alternatively, when the second type FPCB module (200_t2) includes a detection circuit (detection circuit 200_cir of FIG. 6) connected to the first guide structure (200_gd1) as described above in FIG. 6, it may include a first signal line (200_sl1) for operating the detection circuit (detection circuit 200_cir of FIG. 6) (e.g., wiring connecting the detection circuit (200_cir) and the connector (200_co), or wiring used to supply power to the detection circuit (200_cir)) and a second signal line (another wiring connecting the detection circuit (200_cir) and the connector (200_co), or wiring for detecting a signal change). According to one embodiment, the second type FPCB module (200_t2) may further include a detection circuit for operating the second guide structure (200_gd2) (e.g., another detection circuit added in addition to the detection circuit for operating the first guide structure (200_gd1).As an example, the second type FPCB module (200_t2) may include a third signal line (200_sl3) (e.g., a wire connecting a detection circuit connected to the second guide structure (200_gd2) and a connector (200_co), or a wire used to supply power to an added detection circuit) and a fourth signal line (another wire connecting a detection circuit connected to the second guide structure (200_gd2) and a connector (200_co), or a wire for detecting a signal change).

[0112] Additionally or alternatively, the second type FPCB module (200_t2) may further include a biometric sensor module. In relation to the biometric sensor module arrangement, the third type display device (140_t3) may include a biometric sensor region (140_bsen_ar, 200_bsen_ar). The biometric sensor region (140_bsen_ar, 200_bsen_ar) may include a first region (140_bsen_ar) in which at least a portion of the rear portion (140r) is removed and the rear portion of the panel portion (140p) (e.g., the rear portion in the -z-axis direction of the display panel (140_pn) of FIG. 4 or FIG. 8) is exposed, and a second region (200_bsen_ar) in which a portion of the second portion (202) of the second type FPCB module (200_t2) is removed. The above biosensor region (140_bsen_ar, 200_bsen_ar) may include a region in which the first region (140_bsen_ar) and the second region (200_bsen_ar) overlap in the z-axis direction.

[0113] The above second type FPCB module (200_t2) may include a first portion (201) located within a first distance from one edge (e.g., -y-axis edge) of the panel portion (140p) (or extending to the first distance from one edge of the panel portion (140p)) and a second portion (202) located within a second distance from one edge (e.g., -y-axis edge) of the first portion (201) of the panel portion (140p) (or extending to the second distance from one edge of the first portion (201)), and the first portion (201) and the second portion (202) may have partially different laminated shapes. For example, the number of first laminates of the first part (201) and the number of second laminates of the second part (201) may be different (or the number of first laminates may be smaller), or the ductility of the first part (201) and the ductility of the second part (202) may be different (or the ductility of the first part (201) may be greater than the ductility of the second part (202).

[0114] A second part (202) of the second type FPCB module (200_t2) may at least have a first guide structure (200_gd1) and a second guide structure (200_gd2) spaced apart from each other, a first signal line (200_sl1), a third signal line (200_sl3), a connector (200_co), and at least one ground region (200_gnd_1, 200_gnd_2, 200_gnd_3). Additionally or alternatively, the second part (202) may include at least a part of a layer in which wires for driving a display panel (the display panel (140_pn) of FIG. 4 or FIG. 8) are arranged, and at least a part of a layer in which wires for driving a touch panel (the touch panel (140_tp) of FIG. 4 or FIG. 8) are arranged. According to one embodiment, when the rear surface (200_rear_sf) of the second type FPCB module (200_t2) (the second type FPCB module (200_t2) is folded and at least a portion thereof is fixed to the rear portion (140r), the first and second guide structures (200_gd1, 200_gd2) may be arranged so that at least a portion thereof is exposed on the surface facing the rear surface (140r) of the first type display module (140d1). As an example, a portion of the metal layer arranged on the rear surface (200_rear_sf) of the second type FPCB module (200_t2) may form the first and second guide structures (200_gd1, 200_gd2). According to one embodiment, the first guide structure (200_gd1) of the second type FPCB module (200_t2) The second guide structure (200_gd2) may be disposed at a first position on the rear surface (200_rear_sf) of the second type FPCB module (200_t2), and the second guide structure (200_gd2) may be disposed at a second position (e.g., a position different from the first position) on the rear surface (200_rear_sf) of the second type FPCB module (200_t2). According to one embodiment, an FPCB rear insulating layer (200_rear_ins1) may be disposed on the rear surface (200_rear_sf) of the second type FPCB module (200_t2).The first and second guide structures (200_gd1, 200_gd2) may be exposed by removing the FPCB rear insulating layer (200_rear_ins1). Alternatively, the first and second guide structures (200_gd1, 200_gd2) may be formed by applying a metal material or arranging a metal structure on the FPCB rear insulating layer (200_rear_ins1).

[0115] In one embodiment, at least some layers of the first portion (201) may be connected to at least some layers of the second portion (202). As an example, if the first portion (201) includes three layers and the second portion (202) includes five layers, three layers of the first portion (201) may be connected to three layers of the second portion (202). One of the remaining two layers of the second portion (202) may include a first metal layer comprising a first guide structure (200_gd1), a second guide structure (200_gd2), a first signal line (200_sl1), a third signal line (200_sl3), and at least one ground region (200_gnd_1, 200_gnd_2, 200_gnd_3), and one of the remaining two layers may include an insulating layer formed to cover at least a portion of the first metal, thereby exposing the first guide structure (200_gd1), the second guide structure (200_gd2), and at least one ground region (200_gnd_1, 200_gnd_2, 200_gnd_3). In the first metal layer, the first guide structure (200_gd1) and the first signal line (200_sl1) are spaced apart from (or isolated from) other metal patterns, the second guide structure (200_gd2) and the third signal line (200_sl3) are spaced apart from (or isolated from) other metal patterns, and at least one of the ground regions (200_gnd_1, 200_gnd_2, 200_gnd_3) can be connected to each other.

[0116] The first signal line (200_sl1) can connect the connector (200_co) and the first guide structure (200_gd1). The first signal line (200_sl1) can be used to supply power transmitted through the connector (200_co) to the first guide structure (200_gd1), or can be used to detect a signal change caused by the first guide structure (200_gd1).

[0117] The third signal line (200_sl3) can connect the connector (200_co) and the second guide structure (200_gd2). At least a portion of the third signal line (200_sl3) can be arranged parallel to the first signal line (200_sl1). The third signal line (200_sl3) can be used to supply power transmitted through the connector (200_co) to the second guide structure (200_gd2), or can be used to detect a signal change caused by the second guide structure (200_gd2). Meanwhile, among the configurations described in FIG. 9, configurations identical or similar to those described in FIG. 6 or FIG. 7 can be replaced or supplemented with the contents described above.

[0118] The third type display device (140_t3) according to the above-described embodiment may include a second type FPCB module (200_t2) having a plurality of guide structures. In the embodiment described with reference to FIG. 9, a structure in which two guide structures (200_gd1, 200_gd2) are arranged is exemplified, but the present disclosure is not limited thereto, and the display device may further include three or more guide structures and signal lines connected to each of the guide structures. The third type display device (140_t3) in which a plurality of guide structures are arranged can not only detect whether the second type FPCB module (200_t2) is folded to a preset distance in one direction (e.g., in the y-axis direction) while being folded, but can also detect whether the second type FPCB module (200_t2) is abnormally tilted while being folded by checking the contact state of each of the plurality of guide structures.

[0119] FIG. 10 is a drawing showing an example of the rear surface of a fourth type display device according to one embodiment.

[0120] Referring to FIGS. 1 to 10, a fourth type display device (140_t4) according to one embodiment may include a second type FPCB module (200_t2) and a third type display module (140d3).

[0121] The second type FPCB module (200_t2) may include a configuration identical or similar to the second type FPCB module described above in FIG. 9. For example, the second type FPCB module (200_t2) includes a display FPCB (200_fp), and the display FPCB (200_fp) may include a first part (201) and a second part (202) having different numbers of layers. The second type FPCB module (200_t2) may include a configuration identical to or similar to the display FPCB (200_fp) described above in FIG. 5 (e.g., a first FPCB (e.g., the first FPCB (200_fp1) of FIG. 5) (or display panel FPCB) distinguished in the x-axis direction), a second FPCB (e.g., the first FPCB (200_fp2) of FIG. 5) (or touch panel FPCB)), a touch processor (e.g., the touch processor (200_tpic) of FIG. 5), and a detection circuit (detection circuits 301, 302, 200_cir of FIG. 2 or FIG. 5). According to one embodiment, the second type FPCB module (200_t2) may include a first guide structure (200_gd1), a first signal line (200_sl1), a second guide structure (200_gd2), a third signal line (200_sl3), a connector (200_co), and at least one ground region (200_gnd_1, 200_gnd_2, 200_gnd_3).

[0122] According to one embodiment, at least a part of a layer in which wires for driving a display panel (e.g., a display panel (140_pn) of FIG. 4 or 8) and at least a part of a layer in which wires for driving a touch panel (e.g., a touch panel (140_tp) of FIG. 4 or 8)) may be arranged may be arranged in the second part (202) of the second type FPCB module (200_t2). According to one embodiment, the first and second guide structures (200_gd1, 200_gd2) may be arranged so that at least a part of the rear surface (200_rear_sf) of the second type FPCB module (200_t2) is exposed. When the second type FPCB module (200_t2) is folded and at least part of it is fixed to the second deformed rear portion (140r_ch2) of the third type display module (140d3), the first and second guide structures (200_gd1, 200_gd2) may be in contact with the second deformed rear portion (140r_ch2) of the third type display module (140d3). As an example, an FPCB rear insulating layer (200_rear_ins1) may be disposed on the rear portion (200_rear_sf) of the second type FPCB module (200_t2). The above first and second guide structures (200_gd1, 200_gd2) may be formed by removing the FPCB rear insulating layer (200_rear_ins1) and exposing it, or by placing a separate metal material or structure on the FPCB rear insulating layer (200_rear_ins1).

[0123] Additionally or alternatively, the second type FPCB module (200_t2) may further include a biosensor module. In relation to the biosensor module arrangement, the fourth type display device (140_t4) may include a biosensor region (140_bsen_ar, 200_bsen_ar). The biosensor region (140_bsen_ar, 200_bsen_ar) may include the first region (140_bsen_ar) and the second region (200_bsen_ar) described above.

[0124] According to one embodiment, at least some layers of the first part (201) can be connected to at least some layers of the second part (202). For example, if the first part (201) includes five layers and the second part (202) includes seven layers, the five layers of the first part (201) can be connected to the five layers of the second part (202). One specific metal layer of the remaining two layers of the second part (202) can include metal patterns corresponding to the first guide structure (200_gd1), the second guide structure (200_gd2), the first signal line (200_sl1), the third signal line (200_sl3), and at least one of the ground regions (200_gnd_1, 200_gnd_2, 200_gnd_3). Among the remaining two layers of the second part (202), the insulating layer is formed to cover the specific metal layer, while exposing at least a portion of the first guide structure (200_gd1) and the second guide structure (200_gd2), and at least one of the ground regions (200_gnd_1, 200_gnd_2, 200_gnd_3), and the exposed portion (the first guide structure (200_gd1) and the second guide structure (200_gd2), and at least one of the ground regions (200_gnd_1, 200_gnd_2, 200_gnd_3)) can be in electrical contact with the fourth deformed rear support layer (140_r1_ch2) while the second type FPCB module (200_t2) is folded and fixed to the second deformed rear portion (140r_ch2) of the third type display module (140d3). Meanwhile, among the configurations of the type 4 display device described in FIG. 10, configurations identical or similar to those of the display devices described in FIGS. 6 to 9 may be replaced or supplemented with the contents described above.

[0125] The third type display module (140d3) may include a panel portion (140p) and a second modified rear portion (140r_ch2). The panel portion (140p) may include at least a portion of the same configuration as the panel portion (140p) described above in FIG. 4.

[0126] The second modified rear portion (140r_ch2) may include a plurality of layers including a metal layer. Alternatively, the second modified rear portion (140r_ch2) may include a fourth modified rear support layer (140_r1_ch2), a second modified rear support layer (140_r2_ch1), and a third modified rear support layer (140_r3_ch1).

[0127] The fourth modified rear support layer (140_r1_ch2) may include a metal layer (or a Cu layer). The fourth modified rear support layer (140_r1_ch2) may be arranged over the entire rear surface of the display device. Alternatively, the fourth modified rear support layer (140_r1_ch2) may be arranged in an area excluding an area where the second modified rear support layer (140_r2_ch1) (or at least one of the second modified rear support layer (140_r2_ch1) and the third modified rear support layer (140_r3_ch1)) is formed, among the entire rear surface of the display device. Alternatively, the fourth modified rear support layer (140_r1_ch2) may be arranged in an area excluding an area where the second modified rear support layer (140_r2_ch1) is formed, and may be arranged to overlap the third modified rear support layer (140_r3_ch1) vertically based on the z-axis direction. The fourth modified rear support layer (140_r1_ch2) can support the entire panel portion (140p). The fourth modified rear support layer (140_r1_ch2) can dissipate at least a portion of the heat generated in the panel portion (140p).

[0128] The second modified rear support layer (140_r2_ch1) may be exposed by removing at least a portion of the fourth modified rear support layer (140_r1_ch2). The second modified rear support layer (140_r2_ch1) may be disposed between the panel portion (140p) and the fourth modified rear support layer (140_r1_ch2) in the Z-axis direction. The second modified rear support layer (140_r2_ch1) may be disposed between the third modified rear support layer (140_r3_ch1) and the lower portion of the fourth modified rear support layer (140_r1_ch2) in the Y-axis direction. At least a portion of the second deformable rear support layer (140_r2_ch1) may include portions that may be in contact with the first guide structure (200_gd1) and the second guide structure (200_gd2) arranged on the second type FPCB module (200_t2). For example, the second deformable rear support layer (140_r2_ch1) may include a third structure contact area (140_r2_co1) that faces (or is in contact with) the first guide structure (200_gd1) and a fourth structure contact area (140_r2_co2) that faces (or is in contact with) the second guide structure (200_gd2) while the second type FPCB module (200_t2) is folded and at least a portion thereof is fixed to the second deformable rear portion (140r_ch2). According to one embodiment, an adhesive material may be applied or an adhesive member may be disposed on the second deformable rear support layer (140_r2_ch1). The second deformable rear support layer (140_r2_ch1) may function as a shock absorbing layer. The second deformable rear support layer (140_r2_ch1) may be formed of a non-conductive material. For example, at least a portion of the second deformable rear support layer (140_r2_ch1) may be formed of a sponge or a plurality of embossments made of a non-conductive material. Correspondingly, the third structure contact area (140_r2_co1) and the fourth structure contact area (140_r2_co2) may include non-conductive areas.Even if the first guide structure (200_gd1) and the third structure contact area (140_r2_co1) are in physical contact, they may be in an electrically non-contact state. Even if the second guide structure (200_gd2) and the fourth structure contact area (140_r2_co2) are in physical contact, they may be in an electrically non-contact state.

[0129] The third modified rear support layer (140_r3_ch1) may include an adhesive layer separately adhered on the fourth modified rear support layer (140_r1_ch2). At least a portion of the third modified rear support layer (140_r3_ch1) may include a shape corresponding to at least a portion of the shape of the rear surface of the second type FPCB module (200_t2). The third modified rear support layer (140_r3_ch1) may include a conductive adhesive member. The third modified rear support layer (140_r3_ch1) may fix at least a portion of the second type FPCB module (200_t2) to the second modified rear portion (140r_ch2). A portion of the third modified rear support layer (140_r3_ch1) corresponding to an area where the display processor (200_ic) is disposed while the second type FPCB module (200_t2) is folded may be removed. Alternatively, while the second type FPCB module (200_t2) is folded, the areas of the third deformable rear support layer (140_r3_ch1) and the fourth deformable rear support layer (140_r1_ch2) corresponding to the area where the display processor (200_ic) is disposed may be removed to become an area where the second deformable rear support layer (140_r2_ch1) is exposed. The third deformable rear support layer (140_r3_ch1) may be disposed at a first distance from one edge (e.g., -y-axis edge) of the panel portion (140p) (or the display panel (display panel (140_pn) of FIG. 4)), and the second deformable rear support layer (140_r2_ch1) may be disposed at a second distance (e.g., a distance longer than the first distance) from one edge (e.g., -y-axis edge) of the panel portion (140p) (or the display panel (140_pn)).

[0130] The second deformable rear portion (140r_ch2) may include a first region (140_bsen_ar) in which a biometric sensor is arranged. The first region (140_bsen_ar) may be formed to penetrate the fourth deformable rear support layer (140_r1_ch2), the second deformable rear support layer (140_r2_ch1), and the third deformable rear support layer (140_r3_ch1) in the z-axis direction. When the second type FPCB module (200_t2) is in a folded state, the first region (140_bsen_ar) may be aligned with the second region (200_bsen_ar) formed in the second type FPCB module (200_t2).

[0131] The fourth type display device (140_t4) according to the above-described embodiment may include a structure in which a second type FPCB module (200_t2) includes a plurality of guide structures (200_gd1, 200_gd2), and the plurality of guide structures (200_gd1, 200_gd2) come into contact with a second deformable rear support layer (140_r2_ch1) corresponding to a non-conductive area of ​​a third type display module (140d3) while the second type FPCB module (200_t2) is folded. An inspection jig or main processor may be connected to a connector (200_co), and may be determined to be normal when the plurality of guide structures (200_gd1, 200_gd2) detect a signal value corresponding to a floating state. In this regard, a description will be made with reference to FIGS. 11 and 12.

[0132] Fig. 11 is a diagram showing an example of a fifth type display device in which a second type FPCB module is folded according to an embodiment. Fig. 11 is a simplified illustration of the display device in order to explain a technology for determining normality or defects based on a signal detected from a contact state between guide structures (200_gd1, 200_gd2) and the rear portion (140a). As an example, the fifth type display device (140_t5) of Fig. 11 may be replaced with at least one of the display devices illustrated in Figs. 2 to 10, and correspondingly, the normality or defect determination technology described in Fig. 11 may be applied in the same or similar manner.

[0133] Referring to FIGS. 1 to 11, a fifth type display device (140_t5) according to one embodiment may include a second type FPCB module (200_t2) and a fourth type display module (140d4).

[0134] The fourth type display module (140d4) may include a panel portion (140p) and a rear portion (140a). The panel portion (140p) may include at least a touch panel (140_tp) (e.g., the touch panel (140_tp) of FIG. 4 or FIG. 8), a display panel (140_pn) (e.g., the display panel (140_pn) of FIG. 4 or FIG. 8), and a window (140_wd) (e.g., the window (140_wd) of FIG. 4 or FIG. 8). The rear portion (140a) may include, for example, a first rear support layer (140ar1) and a second rear support layer (140ar2). Additionally or alternatively, the rear portion (140a) may further include the third rear support layer described above (e.g., the third rear support layer (140_r3) of FIG. 6) (or the third modified rear support layer of another drawing). In addition, at least a portion of the second rear support layer (140ar2) may have the same or similar structure as at least a portion of the second rear support layer (140_r2) or the second modified rear support layer (140_r2_ch1) described above in another drawing.

[0135] The first rear support layer (140ar1) may include a portion (or structure) formed of a metal material. The first rear support layer (140ar1) may be in contact with at least a portion of one side of the second type FPCB module (200_t2) while the second type FPCB module (200_t2) is folded. The first rear support layer (140ar1) may have a structure identical to or similar to at least a portion of the first rear support layer, the first modified rear support layer, or the fourth modified rear support layer described above with reference to FIGS. 1 to 10.

[0136] The second rear support layer (140ar2) may be formed by removing a portion of the first rear support layer (140ar1). For example, the second rear support layer (140ar2) may include a first detection area (140_ar2_co1) and a second detection area (140_ar2_co2). The first and second detection areas (140_ar2_co1, 140_ar2_co2) may correspond to the structure contact areas described above. Since the second rear support layer (140ar2) is formed of a non-conductive material, the first and second detection areas (140_ar2_co1, 140_ar2_co2) may include a non-conductive area.

[0137] In a fifth type display device (140_t5) (or portable communication device) including the second type FPCB module (200_t2) and the fourth type display module (140d4), the positions of the first guide structure (200_gd1) and the second guide structure (200_gd2) can be designed so that they are normally in contact with one area or one position (e.g., position 1) of the first rear support layer (140ar1). Accordingly, the main processor of the inspection jig or portable communication device can determine that the first and second guide structures (200_gd1, 200_gd2) are in contact with the positions (e.g., position 2) corresponding to the first and second detection areas (140_ar2_co1, 140_ar2_co2), respectively, when the signals detected from the first guide structure (200_gd1) and the second guide structure (200_gd2) correspond to a floating state, determine that the fifth type display device (140_t5) is in a defective state, and output a result accordingly. Alternatively, if the signals detected from the first guide structure (200_gd1) and the second guide structure (200_gd2) correspond to a ground state, the main processor of the inspection jig or the portable communication device may determine that the first and second guide structures (200_gd1, 200_gd2) are in contact with one area or one position (e.g., position 1) of the first rear support layer (140ar1), determine that the portable communication device (or the fifth type display device (140_t5)) is in a normal state, and output a result accordingly.

[0138] Fig. 12 is a drawing showing an example of a sixth type display device in which a second type FPCB module is folded according to one embodiment. Fig. 12 is a simplified illustration of a display device in order to explain a technology for determining normality or defects based on a signal detected from a contact state between guide structures (200_gd1, 200_gd2) and a rear portion (140b). The sixth type display device (140_t6) of Fig. 12 may be replaced with at least one of the display devices illustrated in Figs. 2 to 10. Accordingly, the normality or defect determination technology described in Fig. 12 may be applied identically or similarly to at least one of the display devices illustrated in Figs. 2 to 10.

[0139] Referring to FIGS. 1 to 12, a sixth type display device (140_t6) according to one embodiment may include a second type FPCB module (200_t2) and a fifth type display module (140_d5).

[0140] The fifth type display module (140_d5) may include a panel portion (140p) and a rear portion (140b). The panel portion (140p) may include at least a touch panel (140_tp) (e.g., the touch panel (140_tp) of FIG. 4 or FIG. 8), a display panel (140_pn) (e.g., the display panel (140_pn) of FIG. 4 or FIG. 8), and a window (140_wd) (e.g., the window (140_wd) of FIG. 4 or FIG. 8). In addition, the panel portion (140p) may further include other components described above, such as a polarizing plate or an adhesive layer.

[0141] The rear portion (140b) may include, for example, a first rear support layer (140br1) and a second rear support layer (140br2). Additionally or alternatively, the rear portion (140b) may further include the third rear support layer (or the third modified rear support layer) described above. At least a portion of the second rear support layer (140br2) may have a structure identical to or similar to at least a portion of the second rear support layer (140_r2) or the second modified rear support layer (140_r2_ch1) described above.

[0142] At least a part or all of the first rear support layer (140br1) may be formed of a metal material. The first rear support layer (140br1) may come into contact with at least a part of one side of the second type FPCB module (200_t2) while the second type FPCB module (200_t2) is folded. The first rear support layer (140br1) may have a structure identical to or similar to at least a part of the first rear support layer, the first modified rear support layer, or the fourth modified rear support layer described above with reference to FIGS. 1 to 10. The first rear support layer (140br1) may partially vary depending on a change in the size of a portion where the second rear support layer (140br2) is exposed.

[0143] The second rear support layer (140br2) may be formed by removing a portion of the first rear support layer (140br1). For example, the second rear support layer (140br2) may include a third detection area (140_br2_co3) and a fourth detection area (140_br2_co4). The third and fourth detection areas (140_br2_co3, 140_br2_co4) may have different positions and sizes from the first and second detection areas (140_br2_co3, 140_br2_co4) described above with reference to FIG. 11. Since the second rear support layer (140br2) is formed of a non-conductive material, the third and fourth detection areas (140_br2_co3, 140_br2_co4) may include non-conductive areas.

[0144] In a portable communication device (or a sixth type display device (140_t6)) including the second type FPCB module (200_t2) and the fifth type display module (140_d5) shown in FIG. 12, the positions of the first guide structure (200_gd1) and the second guide structure (200_gd2) can be designed so that contacting one area or one position (e.g., position 1) of the first rear support layer (140br1) becomes an abnormal state, and contacting one position (e.g., position 2) corresponding to the third and fourth detection areas (140_br2_co3, 140_br2_co4) becomes a normal state. According to one embodiment, in the 6th type display device (140_t6) (or portable communication device), when the 2nd type FPCB module (200_t2) is folded so that the first guide structure (200_gd1) and the 2nd guide structure (200_gd2) come into contact with the positions (e.g., position 2) corresponding to the 3rd and 4th detection areas (140_br2_co3, 140_br2_co4), respectively, the main processor of the inspection jig or the portable communication device may determine that the state is normal (e.g., a state in which the separation distance between the folded portion of the 2nd type FPCB module (200_t2) and the housing antenna has a pre-designed distance) when a signal according to the floating state is detected from the 1st guide structure (200_gd1) and the 2nd guide structure (200_gd2). When the main processor of the above inspection jig or portable communication device determines that the condition is normal, it can output a corresponding signal (or information, text, image) to a specific display or display panel of the portable communication device.The main processor of the inspection jig or portable communication device may determine that the guide structures (200_gd1, 200_gd2) are in contact with a certain position (e.g., position 1) of the first rear support layer (140_br1) when the signals detected from the first guide structure (200_gd1) and the second guide structure (200_gd2) correspond to a ground state, determine that the sixth type display device (140_t6) is in an abnormal state, and output a result accordingly.

[0145] Meanwhile, in the above description, the first rear support layer (140br1) is arranged as the outermost layer in the -z-axis direction, and the second rear support layer (140br2) is arranged below the first rear support layer (140br1) based on the direction from the -z-axis toward the z-axis (or the direction from the rear of the portable communication device toward the front of the display), but the portable communication device of the present disclosure is not limited thereto. For example, the first rear support layer (140br1) made of a metal material may be arranged below the second rear support layer (140br2) made of a non-conductive material based on the direction from the -z-axis toward the z-axis. In this structure, the display module can be configured such that at least a portion of the second rear support layer (140br2) is removed so that at least a portion of the first rear support layer (140br1) is exposed in the -z-axis direction, and the exposure position and size of the first rear support layer (140br1) can vary depending on whether the contact state with at least one guide structure is determined to be normal or the non-contact state is determined to be normal.

[0146] FIG. 13 is a drawing showing at least one example of a detection circuit according to one embodiment of the present disclosure.

[0147] Referring to FIGS. 1 to 13, the portable electronic device of the present disclosure mentioned in the description with reference to FIG. 2 above can have a detection circuit (200_cir) disposed in a certain portion of the display FPCB module (200), a certain portion of the printed circuit board, or a certain portion of the inspection jig. In this way, the detection circuit (200_cir) for detecting the electrical state of the guide structure (or guide structures) of the present disclosure can be disposed in the portable communication device (or display device) or in a separate inspection jig. When the detection circuit (200_cir) is disposed in the inspection jig, the display FPCB module (200) of the present disclosure can be configured to include only a signal line (e.g., 200sl1, 200sl3 of FIGS. 7 to 10) connecting the connector (200_co) and the guide structure (or guide structures), and not include the detection circuit (200_cir) illustrated in FIG. 13.

[0148] The above detection circuit (200_cir) may include a first capacitor (C1002) and distribution resistors (R1001, R1000). The detection circuit (200_cir) may be electrically connected to a first signal line (200_sl1) (e.g., the first signal line (200_sl1) described in FIG. 5 or FIG. 6) used to supply a specified voltage (e.g., 1.8 V, VDD). The VDD may be a component that supplies power to the detection circuit (200_cir) and may correspond to a part (or a part of a terminal) of a power supply unit of an inspection jig or a power supply unit (or a processor controlling the power supply unit) of a portable communication device. The guide structure (Guide PAD) may include at least one of the first guide structure (200_gd1) and the second guide structure (200_gd2) described above with reference to FIGS. 1 to 12. The above guide structure (Guide PAD) may be arranged between the first distribution resistor (R1000) and the second distribution resistor (R1001). The detection terminal (Detection) may be connected to one side of the detection circuit (200_cir) (e.g., one end of the second distribution resistor (R1001)) through a second signal line (200_sl2). The detection terminal (Detection) may be included in one end of a processor (e.g., a main processor of a test jig or a portable communication device) connected to a connector (200_co), for example. The processor may determine, based on a signal change detected through the detection terminal, whether the arrangement state of the FPCB module of the display device is arranged in a set state (e.g., normal) or is arranged differently from the set state (e.g., abnormal).

[0149] In this process, the judgment of normal or abnormal may vary depending on the pre-designed value. For example, when the display FPCB module is folded, a state in which a signal transmitted from the guide structure (or guide structures) is detected as a value corresponding to a floating state (or 1.8 V or higher than a preset specific reference value) may be designed as a normal state. Alternatively, when the display FPCB module is folded, a state in which a signal transmitted from the guide structure (or guide structures) is detected as a value corresponding to a ground state (or 0 V or GND value) may be designed as a normal state. The main processor of the inspection jig or portable communication device may compare the signal transmitted from the guide structure (or guide structures) with a value set as a normal value in advance to determine whether the display device (or portable communication device) is in a normal state, and output a result accordingly.

[0150] According to various embodiments, the detection circuit described in FIG. 13 may be applied to one first guide structure (200_gd1) described above, or, when there are a plurality of first guide structures (200_gd1) and second guide structures (200_gd2) as in FIG. 9 or FIG. 10, the detection circuit of FIG. 13 may be applied equally to each of the plurality of guide structures. Alternatively, the portable communication device may be configured to include one detection circuit and a plurality of guide structures, and a plurality of signal lines connecting the plurality of guide structures and one detection circuit.

[0151] Fig. 14 is a diagram showing an example of a circuit that determines whether a normal condition is determined using electrostatic capacity detection according to one embodiment.

[0152] Referring to FIG. 14, the portable communication device or inspection jig of the present invention can detect a change in electrostatic capacity transmitted by a guide structure (Guide PAD) and determine whether the display device is normal or abnormal through the detected change in electrostatic capacity. In this regard, the portable communication device or inspection jig can electrically connect the electrostatic capacity detection sensor (303) (or grip sensor) included in the portable communication device to the guide structure (Guide PAD) and detect a change in electrostatic capacity of the guide structure (Guide PAD).

[0153] As an example, a portable communication device or an inspection jig may be determined to be in a normal (or abnormal) state if the change in electrostatic capacity detected from a guide structure (Guide PAD) in a folded state of a display FPCB module is less than a preset value, and may be determined to be in an abnormal (or normal) state if it is greater than the preset value. The normal or abnormal state may be designed differently depending on which part of the guide structure (Guide PAD) and the rear portion of the display module is arranged to be in contact, or the distance between the first rear support layer (140_r1) or the second rear support layer (140_r2) and the guide structure (Guide PAD) or whether there is contact.

[0154] FIG. 15 is a diagram illustrating an example of a method for tuning an antenna of a portable communication device according to an embodiment. In this regard, the portable communication device (device 100 of FIG. 1 or 2) may include a main processor (or a communication processor, a communication circuit), a tunable antenna (or a tunable antenna, or a tunable antenna connected to a housing antenna), a display device (e.g., a display FPCB module and a display module described in FIGS. 2 to 12), a guide structure disposed on the display FPCB module (e.g., at least one guide structure (200_gd1, 200_gd2) described in FIGS. 2 to 12), and a signal line connecting between the at least one guide structure and a connector disposed on the display FPCB module (or a plurality of signal lines connecting between a detection circuit connected to the at least one guide structure and the connector). The portable communication device (100) can check the signal value of a specific terminal (a terminal to which a signal line electrically connected to a guide structure is connected) of a connector arranged in a display FPCB module, and check the position of a guide structure that comes into contact with the rear portion of the display module based on the signal value. According to one embodiment, the main processor of the portable communication device (100) can detect a change in capacitance between a housing antenna (e.g., housing antenna 188_at1 or 188_at2 of FIG. 3) and the display FPCB module, calculate an antenna tuning value according to the change value, and apply the calculated antenna tuning value to a tunable antenna to improve radiation deviation.

[0155] For example, referring to FIG. 15, a portable communication device (e.g., a main processor of the portable communication device (100) of FIG. 1) can detect a capacitance value (Display FPCB Tilt Detection) according to the distance between the guide structure and the rear portion of the display module in operation 1501.

[0156] The portable communication device (device 100 of FIG. 1 or 2) can check the capacitance value with a lookup table or pre-stored comparison information pre-stored in a memory (memory (120) of FIG. 1) and apply a tuning value according to the checked value to the tunable antenna. For example, the portable communication device (device 100 of FIG. 1 or 2) can apply a first antenna tune code value (Ant Tune Code 1) to the tunable antenna in step 1503 when the capacitance value (Display FPCB Tilt Detection) is a "Low" value. The portable communication device (device 100 of FIG. 1 or 2) can apply a second antenna tune code value (Ant Tune Code 2) to the tunable antenna in step 1505 when the capacitance value (Display FPCB Tilt Detection) is a "High" value.

[0157] As described above, the portable communication device (device 100 of FIG. 1 or 2) according to one embodiment can adjust the resonance frequency shift corresponding to the radiation deviation due to the distance deviation between the housing antenna and the display FPCB module (or the display processor or COP (chip on plastic or panel)) due to the assembly deviation of the display FPCB module. Consequently, the portable communication device (device 100 of FIG. 1 or 2) according to one embodiment can eliminate the radiation deviation due to the operation of the communication circuit of the portable communication device (device 100 of FIG. 1 or 2) by shifting the resonance frequency through tuning.

[0158] As described above, a display device included in a portable electronic device according to an embodiment of the present invention includes a display module (140d) including a panel portion (140p) - including a display panel - on which a plurality of pixels are arranged and a rear portion (140r) - including a rear portion - that supports the panel portion, a display FPCB (flexible printed circuit board) module (200) connected to the display module, and the display FPCB module is characterized in that it includes a guide structure (200_gd1) (or guide) arranged at a first position on the rear of the display FPCB module so as to be in contact with a portion of the rear portion when folded, a signal line (200_sl1) connected to the guide structure, and a connector (200_co) connected to the signal line.

[0159] According to one embodiment, in the display device, the rear portion includes a first rear support layer at least partially formed of a metal material (or including a metal material), a second rear support layer at least partially formed of a non-metal material (or including a non-metal material), and a first structure contact area (140_r1_co1) formed as a part of the first rear support layer and at least partially surrounded by the second rear support layer, wherein the first position corresponds to a position at which the guide structure comes into contact with the first structure contact area while the display FPCB module is folded.

[0160] According to one embodiment, in the display device, the rear portion includes a first rear support layer at least partially formed of a metal material (or including a metal material), a second rear support layer at least partially formed of a non-metal material (or including a non-metal material), and further includes a structure bonding area (140_r3_co1) disposed on a portion of the first rear support layer and having a conductive bonding member (or conductive adhesive) disposed thereon, wherein the first position corresponds to a position at which the guide structure comes into contact with the structure contact area while the display FPCB module is folded.

[0161] According to one embodiment, the display device further comprises a detection circuit connected to the guide structure, wherein the signal line comprises a first signal line (200_sl1) configured to supply power to the detection circuit and a second signal line (200_sl2) configured to detect a state change of the detection circuit.

[0162] According to one embodiment, in the display device, the display FPCB module includes a plurality of metal pattern layers and a plurality of insulating layers, the guide structure and the first signal line (or at least one of the first signal line and the second signal line) are disposed on a first metal pattern layer among the plurality of metal pattern layers, the first signal line (or at least one of the first signal line and the second signal line) is covered by the first insulating layer among the plurality of insulating layers, and the guide structure is characterized in that it is located in a portion from which a portion of the first insulating layer is removed.

[0163] According to one embodiment, in the display device, the display FPCB module includes a plurality of metal pattern layers and a plurality of insulating layers, a first metal pattern layer of the plurality of metal pattern layers includes ground terminals, and the guide structure, the first signal line (or at least one of the first signal line and the second signal line) is formed to be spaced apart from the ground terminals while being disposed on the first metal pattern layer.

[0164] According to one embodiment, in the display device, the guide structure is characterized by including a first guide structure (200_gd1) (e.g., a first guide) arranged at the first position, and a second guide structure (200_gd2) (e.g., a first guide) arranged at a second position different from the first position.

[0165] According to one embodiment, in the display device, the signal line is characterized by including a first signal line connecting the connector and the first guide structure, and a second signal line connecting the connector and the second guide structure (e.g., signal line 200_sl3 of FIG. 9).

[0166] According to one embodiment, in the display device, the display FPCB module includes a plurality of metal pattern layers and a plurality of insulating layers, and the first guide structure, the second guide structure, the first signal line, and the second signal line (e.g., signal line 200_sl3 of FIG. 9) are disposed on a first metal pattern layer among the plurality of metal pattern layers, and the first signal line and the second signal line (e.g., signal line 200_sl3 of FIG. 9) are covered by a first insulating layer among the plurality of insulating layers, and the first guide structure and the second guide structure are characterized in that they are located in portions where a portion of the first insulating layer is removed.

[0167] According to one embodiment, in the display device, the rear portion includes a first rear support layer at least partially formed of a metal material (or including a metal material), a second rear support layer at least partially formed of a non-metal material (or including a non-metal material), and the first rear support layer is characterized in that it includes a first structure contact area with which the first guide structure comes into contact while the display FPCB module is folded, and a second structure contact area with which the second guide structure comes into contact.

[0168] According to one embodiment, in the display device, the rear portion includes a first rear support layer at least partially formed of a metal material (or including a metal material), a second rear support layer at least partially formed of a non-metal material (or including a non-metal material), and the second rear support layer is characterized in that it includes the third structure contact area configured to be in contact with the first guide structure while the display FPCB module is folded, and the fourth structure contact area configured to be in contact with the second guide structure.

[0169] According to an embodiment of the present invention, a portable communication device includes a display device, a housing on which the display device is placed and which has a side wall portion formed of (or including) a metal material and used as an antenna, wherein the display device includes a display module (140d) including a panel portion (140p) (or display panel) on which a plurality of pixels are arranged and a rear portion (140r) (or support portion) that supports the panel portion, a display FPCB (flexible printed circuit board) module (200) (or display FPCB, FPCB) that is connected to the display module and includes a folding area positioned within a certain distance from the side wall portion while the display FPCB module is placed in the housing, and wherein the display FPCB module includes a guide structure (200_gd1) (or guide) that is arranged at a first position on the rear of the display FPCB module and is configured to come into contact with a portion of the rear portion when folded, a signal line (200_sl1) that is connected to the guide structure, and a connector (200_co) that is connected to the signal line.

[0170] According to one embodiment, in the portable communication device, the rear portion includes a first rear support layer at least partially formed of a metal material (or including a metal material), a second rear support layer at least partially formed of a non-metal material (or including a non-metal material), and a first structure contact area (140_r1_co1) formed as a part of the first rear support layer and at least partially surrounded by the second rear support layer; wherein the first position corresponds to a position at which the guide structure comes into contact with the first structure contact area while the display FPCB module is folded.

[0171] According to one embodiment, in the portable communication device, the rear portion includes a first rear support layer at least partially formed of a metal material (or including a metal material), a second rear support layer at least partially formed of a non-metal material (or including a non-metal material), and further includes a structure bonding area (140_r3_co1) disposed on a portion of the first rear support layer and having a conductive bonding member (or conductive adhesive) disposed thereon, wherein the first position corresponds to a position at which the guide structure comes into contact with the structure contact area while the display FPCB module is folded.

[0172] According to one embodiment, the portable communication device further includes a detection circuit connected to the guide structure, and the signal line includes a first signal line (200_sl1) configured to supply power to the detection circuit, and a second signal line (200_sl2) configured to detect a state change of the detection circuit, and the display FPCB module includes a plurality of metal pattern layers and a plurality of insulating layers, and a first metal pattern layer of the plurality of metal pattern layers includes at least one ground terminal, the guide structure, the first signal line, and a second signal line, and the first signal line and the second signal line are covered by the first insulating layer of the plurality of insulating layers, and the guide structure and the ground terminal are characterized in that they are disposed at portions (or locations) from which a portion of the first insulating layer is removed.

[0173] According to one embodiment, in the portable communication device, the guide structure includes a first guide structure (200_gd1) (or first guide) arranged at the first position, a second guide structure (200_gd2) (or second guide) arranged at a second position different from the first position, and the signal line includes a first signal line connecting the connector and the first guide structure, and a second signal line (e.g., signal line 200_sl3 of FIG. 9) connecting the connector and the second guide structure.

[0174] According to one embodiment, in the portable communication device, the rear portion includes a first rear support layer at least partially formed of a metal material (or including a metal material), a second rear support layer at least partially formed of a non-metal material (or including a non-metal material), and the first rear support layer is characterized in that it includes a first structure contact area configured to be in contact with the first guide structure while the display FPCB module is folded, and a second structure contact area configured to be in contact with the second guide structure.

[0175] According to one embodiment, the portable communication device further comprises at least one processor (e.g., including a processing circuit) connected to the connector, wherein the at least one processor is individually and / or collectively configured to determine that the display FPCB module is in a normal state when the first guide structure and the second guide structure are in a grounded state, and to output information corresponding to the normal state.

[0176] According to one embodiment, in the portable communication device, the rear portion includes a first rear support layer at least partially formed of a metal material (or including a metal material), a second rear support layer at least partially formed of a non-metal material (or including a non-metal material), and the second rear support layer is characterized in that it includes the third structure contact area configured to be in contact with the first guide structure while the display FPCB module is folded, and the fourth structure contact area configured to be in contact with the second guide structure.

[0177] According to one embodiment, the portable communication device further comprises at least one processor (e.g., including a processing circuit) connected to the connector, wherein the at least one processor is individually and / or collectively configured to determine that the display FPCB module is in a normal state when the first guide structure and the second guide structure are in a floating state, and to output information corresponding to the normal state.

[0178] According to one embodiment, the portable communication device further includes at least one processor connected to the connector, a housing at least a portion of which is used as an antenna and in which the at least one processor is disposed, and a tunable antenna electrically connected to a portion of the housing, wherein the at least one processor may be individually and / or collectively configured to detect a change in capacitance between a portion of the housing used as the antenna and the display FPCB module, calculate an antenna tuning value according to the capacitance change value, and apply the calculated antenna tuning value to the tunable antenna.

[0179] While this disclosure has been described and illustrated with reference to various exemplary embodiments, it will be understood that the various exemplary embodiments are illustrative and not limiting. Those skilled in the art will further appreciate that various changes in form and detail may be made without departing from the true spirit and scope of this disclosure, including the appended claims and their equivalents. Furthermore, it will be appreciated that any of the specific embodiments described herein may be utilized with other embodiments described herein.

Claims

In display devices, A display module (140d) including a panel portion (140p) on which a plurality of pixels are arranged and a rear portion (140r) supporting the panel portion; and Includes a display FPCB (flexible printed circuit board) module (200) connected to the above display module; The above display FPCB module, When the display FPCB module is in a folded state, a guide structure (200_gd1) positioned at a first position on the rear of the display FPCB module and in contact with a portion of the rear portion of the display module; A signal line (200_sl1) connected to the above guide structure; and A display device characterized by including a connector (200_co) connected to the signal line. In the first paragraph, The above rear part, A first rear support layer comprising at least a portion of a metallic material; a second rear support layer comprising at least a portion of a non-metallic material; A first structure contact area (140_r1_co1) formed as a part of the first rear support layer and at least partially surrounded by the second rear support layer; A display device characterized in that the first position corresponds to a position where the guide structure comes into contact with the first structure contact area while the display FPCB module is folded. In the first paragraph, The above rear part, a first rear support layer comprising at least a portion of a metal material; and a second rear support layer comprising at least a portion of a non-metallic material; It further includes a structural bonding area (140_r3_co1) disposed on a portion of the first rear support layer and having a conductive bonding member disposed thereon; A display device characterized in that the first position corresponds to a position where the guide structure comes into contact with the structure contact area while the display FPCB module is folded. In the first paragraph, Further comprising a detection circuit connected to the above guide structure (200_gd1); The above signal line is A first signal line (200_sl1) configured to supply power to the above detection circuit; A display device characterized by including a second signal line (200_sl2) configured to detect a change in the state of the detection circuit. In the first paragraph, The above display FPCB module It comprises multiple metal pattern layers and multiple insulating layers, The above guide structure and the signal line are arranged on the first metal pattern layer among the plurality of metal pattern layers, The above first signal line is covered by the first insulating layer among the plurality of insulating layers, A display device characterized in that the guide structure is positioned at a position where a portion of the first insulating layer is removed. In the first paragraph, The above display FPCB module It comprises multiple metal pattern layers and multiple insulating layers, Among the plurality of metal pattern layers, the first metal pattern layer includes ground terminals, A display device characterized in that the guide structure and the signal line are arranged on the first metal pattern layer and are spaced apart from the ground terminals. In the first paragraph, The above guide structure is, A first guide structure (200_gd1) arranged at the first position; and A display device characterized by including a second guide structure (200_gd2) positioned at a second position different from the first position. In paragraph 7, The above signal line is A first signal line connecting the connector and the first guide structure; a second signal line connecting the connector and the second guide structure; The above display FPCB module It comprises multiple metal pattern layers and multiple insulating layers, The first guide structure, the second guide structure, the first signal line, and the second signal line are arranged on the first metal pattern layer among the plurality of metal pattern layers, The first signal line and the second signal line are covered by the first insulating layer among the plurality of insulating layers, A display device characterized in that the first guide structure and the second guide structure are positioned at positions where a portion of the first insulating layer is removed. In paragraph 7, The above rear part, A first rear support layer comprising at least a portion of a metallic material; a second rear support layer comprising at least a portion of a non-metallic material; A display device characterized in that the first rear support layer includes a first structure contact area configured to contact the first guide structure while the display FPCB module is folded, and a second structure contact area configured to contact the second guide structure. In paragraph 7, The above rear part, A first rear support layer comprising at least a portion of a metallic material; a second rear support layer comprising at least a portion of a non-metallic material; A display device, characterized in that the second rear support layer includes a third structure contact area configured to contact the first guide structure while the display FPCB module is folded, and a fourth structure contact area configured to contact the second guide structure. display device; A housing in which the display device is placed and which has a side wall portion at least partially made of a metal material and used as an antenna; The above display device, A display module (140d) including a panel portion (140p) on which a plurality of pixels are arranged and a rear portion (140r) supporting the panel portion; and A display FPCB (flexible printed circuit board) module (200) including a folding area located within a certain distance from the side wall portion while being connected to the display module and placed in the housing; The above display FPCB module, A guide structure (200_gd1) arranged at a first position at the rear of the display FPCB module when the display FPCB module is in a folded state and configured to come into contact with a portion of the rear portion of the display module; A signal line (200_sl1) connected to the above guide structure; A portable communication device characterized by comprising a connector (200_co) connected to the signal line. In Article 11, The above rear part, a first rear support layer comprising at least a portion of a metal material; and a second rear support layer comprising at least a portion of a non-metallic material; A first structure contact area (140_r1_co1) formed as a part of the first rear support layer and at least partially surrounded by the second rear support layer; A portable communication device, characterized in that the first position corresponds to a position where the guide structure comes into contact with the first structure contact area while the display FPCB module is folded. In Article 11, The above rear part, A first rear support layer comprising at least a portion of a metallic material; a second rear support layer comprising at least a portion of a non-metallic material; It further includes a structural bonding area (140_r3_co1) disposed on a portion of the first rear support layer and having a conductive bonding member disposed thereon; A portable communication device characterized in that the first position corresponds to a position where the guide structure is configured to contact the structure contact area while the display FPCB module is folded. In Article 11, Further comprising a detection circuit connected to the above guide structure (200_gd1); The above signal line is A first signal line (200_sl1) configured to supply power to the above detection circuit; A second signal line (200_sl2) configured to detect a state change of the above detection circuit; The above display FPCB module It comprises multiple metal pattern layers and multiple insulating layers, Among the plurality of metal pattern layers, the first metal pattern layer includes at least one ground terminal, the guide structure, the first signal line, and the second signal line, The first signal line and the second signal line are covered by the first insulating layer among the plurality of insulating layers, A portable communication device, characterized in that the guide structure and the ground terminal are placed at positions where a portion of the first insulating layer is removed. In Article 11, The above guide structure is, A first guide structure (200_gd1) arranged at the first position; A second guide structure (200_gd2) disposed at a second position different from the first position; The above signal line is A first signal line connecting the connector and the first guide structure; a second signal line connecting the connector and the second guide structure; The above rear part, A first rear support layer comprising at least a portion of a metallic material; a second rear support layer comprising at least a portion of a non-metallic material; A portable communication device, characterized in that the first rear support layer includes a first structure contact area configured to contact the first guide structure while the display FPCB module is folded, and a second structure contact area configured to contact the second guide structure.

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