Laminated product, housing and electronic device

By introducing a buffer layer into the coated product, the problem of the influence of optical layer stress on the substrate is solved, the impact resistance and strength are improved, and better optical performance and service life are achieved.

WO2026007424A1PCT designated stage Publication Date: 2026-01-08BYD CO LTD
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Patent Information

Application Number
PCT/CN2025/078110
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-07-03
Filing Date
2025-02-19
Publication Date
2026-01-08

AI Technical Summary

Technical Problem

Existing coated products have insufficient impact resistance and strength, especially due to the stress effect of the optical layer, which reduces the impact resistance of the substrate.

Method used

A buffer layer is introduced into the coated product, located between the substrate and the optical layer. The thickness of the buffer layer is related to the thickness of the optical layer. Through the alternating layering of the first and second sub-layers, the buffer layer material is selected as a small molecule siloxane to improve flexibility and bonding strength.

Benefits of technology

It effectively alleviates the impact of optical layer stress on the substrate, improves the impact resistance and strength of coated products, and maintains good optical performance and service life.

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Abstract

A laminated product, a housing and an electronic device. The laminated product comprises a substrate, a buffer layer and an optical layer. The buffer layer is located on at least part of the surface of one side of the substrate. The optical layer is located on the surface of the buffer layer away from the substrate. The optical layer comprises at least one first sub-layer and at least one second sub-layer, wherein the first sub-layer and the second sub-layer are alternately stacked; and the refractive index of the first sub-layer is greater than that of the second sub-layer. The optical layer further comprises a region with the maximum thickness, and a region with the minimum thickness. The thickness of the buffer layer is positively correlated with a first preset total thickness and a second preset total thickness, wherein the first preset total thickness is the thickness of the buffer layer required by the region with the maximum thickness, and is obtained on the basis of at least the maximum thickness of the optical layer; and the second preset total thickness is the thickness of the buffer layer required by the region with the minimum thickness, and is obtained on the basis of at least the minimum thickness of the optical layer.
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Description

Covered product, shell and electronic device

[0001] This application claims priority to the Chinese patent application No. 202410892950.3, filed on July 03, 2024, the entire content of which is incorporated herein by reference. TECHNICAL FIELD

[0002] The present disclosure relates to the technical field of material processing, in particular to a covered product, a shell and an electronic device. BACKGROUND

[0003] Covered products are widely used in people's daily life. The material of the covered product usually includes at least one of glass, plastic and metal. SUMMARY

[0004] The present disclosure provides a covered product, a shell and an electronic device, aiming to improve the impact resistance of the covered product and improve the strength of the covered product.

[0005] In one aspect, a covered product is provided. The covered product includes a substrate, a buffer layer and an optical layer. The buffer layer is located on at least part of the surface of one side of the substrate. The optical layer is located on the surface of one side of the buffer layer away from the substrate. The optical layer includes at least one first sub-layer and at least one second sub-layer, and the first sub-layer and the second sub-layer are alternately stacked. The refractive index of the first sub-layer is greater than the refractive index of the second sub-layer. The optical layer further includes a maximum thickness region and a minimum thickness region.

[0006] The thickness of the buffer layer is positively correlated with a first preset total thickness and a second preset total thickness. The first preset total thickness is the thickness of the buffer layer required for the maximum thickness region of the optical layer, and the first preset total thickness is obtained at least according to the maximum thickness of the optical layer. The second preset total thickness is the thickness of the buffer layer required for the minimum thickness region of the optical layer, and the second preset total thickness is obtained at least according to the minimum thickness of the optical layer.

[0007] By arranging the buffer layer in the covered product, and locating the buffer layer on at least part of the surface of one side of the substrate and the optical layer on the surface of one side of the buffer layer away from the substrate, the buffer layer can play a buffering role between the substrate and the optical layer, effectively alleviate the influence of the stress of the optical layer itself on the substrate, improve the impact resistance of the substrate, and further improve the impact resistance of the covered product and the strength of the covered product.

[0008] By positively correlating the thickness of the buffer layer with the first preset total thickness and the second preset total thickness, the first preset total thickness being the thickness of the buffer layer required by the maximum thickness region of the optical layer, the second preset total thickness being the thickness of the buffer layer required by the minimum thickness region of the optical layer, and the first preset total thickness being obtained at least according to the maximum thickness of the optical layer, and the second preset total thickness being obtained at least according to the minimum thickness of the optical layer, the stress buffering effect of the buffer layer on the substrate and the optical layer can be ensured, while the influence of the buffer layer on the bonding strength between the substrate and the optical layer is avoided, and the service life of the laminated product is improved.

[0009] In another aspect, a laminated product is also provided. The laminated product includes a substrate, a buffer layer, and an optical layer. The buffer layer is located on at least part of the surface of one side of the substrate. The optical layer is located on the surface of one side of the buffer layer away from the substrate. The optical layer includes at least one first sub-layer and at least one second sub-layer, and the first sub-layer and the second sub-layer are alternately stacked. The refractive index of the first sub-layer is greater than the refractive index of the second sub-layer. The thickness of the buffer layer increases with the increase of the thickness of the optical layer.

[0010] In yet another aspect, a housing is also provided. The housing includes the laminated product as described above.

[0011] In yet another aspect, an electronic device is also provided. The electronic device includes a display panel and the housing as described above, and the display panel and the housing are arranged in a stacked manner.

[0012] It can be understood that the housing and the electronic device provided by the above embodiments of the present disclosure can achieve the beneficial effects as described above for the laminated product, which will not be described here again. BRIEF DESCRIPTION OF DRAWINGS

[0013] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings needed in the embodiment description will be briefly introduced below. However, the drawings in the following description are only some embodiments of the present disclosure, and other drawings can also be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0014] FIG. 1 is a structural diagram of an electronic device according to some embodiments;

[0015] FIG. 2 is another structural diagram of an electronic device according to some embodiments;

[0016] FIG. 3 is a plan structural diagram of a housing according to some embodiments;

[0017] FIG. 4A is a sectional view of a housing according to some embodiments;

[0018] FIG. 4B is another cross-sectional view of a housing, according to some embodiments;

[0019] FIG. 5A is a structural view of a substrate within a film-covered article, according to some embodiments;

[0020] FIG. 5B is a force schematic of a substrate within a film-covered article, according to some embodiments;

[0021] FIG. 6A is a cross-sectional view of a film-covered article, according to some embodiments;

[0022] FIG. 6B is another cross-sectional view of a film-covered article, according to some embodiments;

[0023] FIG. 6C is yet another cross-sectional view of a film-covered article, according to some embodiments;

[0024] FIG. 6D is yet another cross-sectional view of a film-covered article, according to some embodiments;

[0025] FIG. 7A is yet another cross-sectional view of a film-covered article, according to some embodiments;

[0026] FIG. 7B is yet another cross-sectional view of a film-covered article, according to some embodiments;

[0027] FIG. 7C is yet another cross-sectional view of a film-covered article, according to some embodiments;

[0028] FIG. 7D is yet another cross-sectional view of a film-covered article, according to some embodiments. DETAILED DESCRIPTION

[0029] The technical solutions in some embodiments of the present disclosure will be clearly and completely described below with reference to the drawings. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments of the present disclosure. Based on the embodiments provided in the present disclosure, all other embodiments obtained by a person of ordinary skill in the art belong to the scope of protection of the present disclosure.

[0030] In the description of the present disclosure, it should be understood that the terms "center", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate the orientation or positional relationship shown in the drawings, and are only used to facilitate the description of the present disclosure and simplify the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present disclosure.

[0031] Unless otherwise required by context, as used herein the term "comprises" or "comprising" or the like is used on the basis and mutually consistent manner that the term includes but is not limited to. As used in the description of the specification, the terms "an embodiment", "some embodiments", "exemplary embodiments", "exemplary", or "some examples" are used to indicate that the particular feature, structure, material, or characteristic being described is included in at least one embodiment or example of the disclosure. The illustrating representations of the above terms are not necessarily meant to refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics can be included in any one or more embodiments or examples in any appropriate manner.

[0032] Hereinafter, the terms "first", "second", etc. are used only for the purpose of description and should not be construed as indicating or implying relative importance or implying the number of the technical features indicated. Thus, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the embodiments of the disclosure, the meaning of "a plurality of" is two or more, unless otherwise specified.

[0033] In describing some embodiments, "coupled" and "connected", and variations thereof, can be used. For example, the term "connected" can be used to indicate that two or more components are in direct physical or electrical contact with each other. As another example, the term "coupled" can be used to indicate that two or more components are in direct physical or electrical contact with each other. However, the term "coupled" can also mean that two or more components are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited by the content herein.

[0034] In the context of the disclosure, the meanings of "on", "over", and "above" should be interpreted in the broadest manner, such that "on" means not only "directly on", but also includes the meaning of "on" with intermediate features or layers therebetween, and "over" or "above" means not only "over" or "above", but also includes the meaning of "over" or "above" without intermediate features or layers therebetween (i.e., directly on).

[0035] In the present disclosure, the term "layer" refers to a portion of material that includes a region having a thickness. A layer can extend over an entire underlying or overlying structure, or can have an area less than the area of the underlying or overlying structure. Further, a layer can be a region of a continuous structure that is homogenous or non-homogenous and has a thickness less than the thickness of the continuous structure. For example, a layer can be between any pair of horizontal planes that are between a top surface and a bottom surface of a continuous structure, or at the top and bottom surfaces of the continuous structure. Layers can extend horizontally, vertically, and / or along a tapered surface. A substrate can be a layer, can include one or more layers therein, and / or can have one or more layers thereon, thereabove and / or therebelow. A layer can include multiple layers. For example, an interconnect layer can include one or more conductor and contact layers in which interconnect lines and / or vertical interconnect via (PIV) contacts are formed, and one or more dielectric layers.

[0036] Exemplary embodiments are described herein with reference to cross-sectional and / or plan view illustrations that are idealized examples. In the drawings, the thickness of layers and regions are exaggerated for clarity. Accordingly, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and / or tolerances, are to be expected. Thus, the exemplary embodiments should not be construed as limited to the particular shapes of regions as illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, an etched region illustrated as a rectangle will typically have rounded or curved features. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of the exemplary embodiments.

[0037] To facilitate the following description, an XYZ coordinate system is established. A third direction Z is a thickness direction of the electronic device, an XY plane is perpendicular to the third direction Z, a first direction X and a second direction Y intersect each other. For example, the first direction X and the second direction Y are perpendicular to each other.

[0038] As shown in FIG. 1, some embodiments of the present disclosure provide an electronic device 1000.

[0039] For example, the electronic device 1000 described above can be at least one of a mobile phone, a tablet computer, a desktop computer, a laptop computer, a handheld computer, a notebook computer, an Ultra-mobile Personal Computer (UMPC), a netbook, a cellular phone, a Personal Digital Assistant (PDA), an Augmented Reality (AR) device, a Virtual Reality (VR) device, an Artificial Intelligence (AI) device, a wearable device, a vehicle-mounted device, a smart home device, or a smart city device, etc. The present disclosure does not specially limit the form of the electronic device 1000 described above. In FIG. 1, the electronic device 1000 is taken as an example of a mobile phone.

[0040] In some embodiments, as shown in FIG. 2, FIG. 2 is a structural diagram of the electronic device 1000 provided according to some embodiments. The electronic device 1000 includes a housing 100 and a display panel 200. The housing 100 and the display panel 200 are arranged in layers.

[0041] For example, as shown in FIG. 2, the housing 100 can be arranged in layers on the non-display side 200b of the display panel 200.

[0042] It should be noted that the display side 200a of the display panel 200 refers to the side on which the display panel 200 can display a picture. The "non-display side 200b of the display panel 200" described above refers to the side opposite to the display side 200a of the display panel 200.

[0043] The housing 100 described above is described in detail below.

[0044] In some embodiments, as shown in FIG. 3, FIG. 3 is a planar structural diagram of the housing 100 according to some embodiments. The housing 100 can have a rectangular structure. It should be noted that the "rectangular structure" described above refers to the shape of the boundary of the housing 100 as a whole, which is a rectangular shape, but is not limited to a standard rectangle. That is, the "rectangle" here not only includes the shape of a standard rectangle, but also includes shapes similar to a rectangle considering process conditions. For example, as shown in FIG. 3, the long side and the short side of the rectangle are curved at each intersection (i.e., the corner G), that is, the corner G is smooth, so that the shape of the boundary of the housing 100 in the plan view is a rounded rectangle.

[0045] In other embodiments, the housing 100 can have a circular structure, or other shapes with corners.

[0046] In some embodiments, the housing 100 can be a multi-color gradient housing. That is, the housing 100 exhibits at least two different colors.

[0047] For example, the housing 100 can exhibit two different colors. For example, the housing 100 can be a green-blue gradient housing. For another example, the housing 100 can be a green-blue-green-blue-green-blue multi- gradient housing.

[0048] In some examples, the housing 100 can exhibit three or more different colors. For example, the housing 100 can be a green-blue-purple gradient housing. For another example, the housing 100 can be a green-blue-purple-green-blue-purple multi- gradient housing.

[0049] In some embodiments, in the case that the housing 100 can be a multi-color gradient housing, the color difference between the at least two different colors exhibited by the housing 100 is greater than or equal to 40. For example, the color difference between the at least two different colors exhibited by the housing 100 is 40, 42, 45, 46, 47, 50, or 54.

[0050] In some embodiments, as shown in FIGS. 4A and 4B, each of FIGS. 4A and 4B is a cross-sectional view of the housing 100 according to some embodiments. The housing 100 includes the film product 10.

[0051] The film product 10 described above is explained in detail as follows.

[0052] In some embodiments, as shown in FIGS. 4A and 4B, the film product 10 includes the substrate 1 and the optical layer 3. The optical layer 3 is located on at least part of the surface of one side of the substrate 1.

[0053] In some embodiments, the material of the substrate 1 can include glass. For example, the material of the substrate 1 can include any one of a raw sheet glass, a soda-lime glass, a high-alumina glass, a fully tempered glass, a semi-tempered glass, and a heat-strengthened glass.

[0054] In some embodiments, as shown in FIGS. 4A and 4B, the thickness (i.e., the dimension of the optical layer 3 along the third direction Z) h3 of the optical layer 3 within the film product 10 is not uniform. That is, the optical layer 3 within the film product 10 includes a thickness maximum region 3a and a thickness minimum region 3b.

[0055] It can be understood that the thickness (i.e., the dimension of the thickness maximum region 3a of the optical layer 3 along the third direction Z) h 3a of the thickness maximum region 3a included by the optical layer 3 within the film product 10 is greater than the thickness (i.e., the dimension of the thickness minimum region 3b of the optical layer 3 along the third direction Z) h 3b .

[0056] In some embodiments, as shown in FIGS. 4A and 4B, the thickness h of the optical layer 3 at the thickness maximum region 3a within the film product 10 can be 50 nm to 3000 nm. 3a The thickness h of the optical layer 3 at the thickness maximum region 3a within the film product 10 can be 50 nm, 100 nm, 200 nm, 300 nm, 400 nm, 500 nm, 600 nm, 700 nm, 800 nm, 900 nm, 1000 nm, 1100 nm, 1200 nm, 1300 nm, 1400 nm, 1500 nm, 1600 nm, 1700 nm, 1800 nm, 1900 nm, 2000 nm, 2100 nm, 2200 nm, 2300 nm, 2400 nm, 2500 nm, 2600 nm, 2700 nm, 2800 nm, 2900 nm, or 3000 nm, etc.

[0057] For example, the thickness h of the optical layer 3 at the thickness maximum region 3a within the film product 10 can be 50 nm to 3000 nm. 3a The thickness h of the optical layer 3 at the thickness maximum region 3a within the film product 10 can be 50 nm, 100 nm, 200 nm, 300 nm, 400 nm, 500 nm, 600 nm, 700 nm, 800 nm, 900 nm, 1000 nm, 1100 nm, 1200 nm, 1300 nm, 1400 nm, 1500 nm, 1600 nm, 1700 nm, 1800 nm, 1900 nm, 2000 nm, 2100 nm, 2200 nm, 2300 nm, 2400 nm, 2500 nm, 2600 nm, 2700 nm, 2800 nm, 2900 nm, or 3000 nm, etc.

[0058] In some embodiments, as shown in FIGS. 4A and 4B, the optical layer 3 within the film product 10 includes a thickness h at the thickness minimum region 3b. 3b The thickness h of the optical layer 3 at the thickness minimum region 3b within the film product 10 can be less than 2000 nm.

[0059] For example, the thickness h of the optical layer 3 at the thickness minimum region 3b within the film product 10 can be 50 nm to 3000 nm. 3b The thickness h of the optical layer 3 at the thickness minimum region 3b within the film product 10 can be 50 nm, 100 nm, 200 nm, 300 nm, 400 nm, 500 nm, 600 nm, 700 nm, 800 nm, 900 nm, 1000 nm, 1100 nm, 1200 nm, 1300 nm, 1400 nm, 1500 nm, 1600 nm, 1700 nm, 1800 nm, 1900 nm, or 2000 nm, etc.

[0060] The structure of the optical layer 3 described above is explained in detail as follows.

[0061] In some embodiments, as shown in FIGS. 4A and 4B, the optical layer 3 in the film product 10 includes at least one first sub-layer 31 and at least one second sub-layer 32. The first sub-layer 31 and the second sub-layer 32 are alternately stacked.

[0062] The refractive index of the first sub-layer 31 is greater than the refractive index of the second sub-layer 32.

[0063] It should be noted that the number of the first sub-layer 31 and the second sub-layer 32 within the optical layer 3 shown in FIGS. 4A and 4B is only illustrative, and the number of the first sub-layer 31 and the second sub-layer 32 within the optical layer 3 can be set based on actual needs, and each embodiment of the present disclosure does not make any limitation on this.

[0064] For example, the first sub-layer 31 has a refractive index greater than 1.9. The second sub-layer 32 has a refractive index of 1-1.8. For example, the first sub-layer 31 has a refractive index of 2.0, 2.1, 2.2, 2.3, 2.5, 2.7, 2.9, or 3.1, etc. The second sub-layer 32 has a refractive index of 1, 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, or 1.8, etc.

[0065] In some embodiments, the material of the first sub-layer 31 can include at least one of titanium oxide, zirconium oxide, tantalum oxide, niobium oxide, antimony oxide, hafnium oxide, zinc oxide, cerium oxide, lanthanum titanate, and silicon nitride.

[0066] The material of the second sub-layer 32 can include at least one of silicon oxide, aluminum oxide, and magnesium fluoride.

[0067] In some embodiments, as shown in FIGS. 4A and 4B, in the case where the optical layer 3 in the film product 10 includes at least one first sub-layer 31 and at least one second sub-layer 32, the first sub-layer 31 and the second sub-layer 32 with different refractive indices can be matched, and the thickness h3 of the optical layer 3 in the film product 10 is designed so that the thickness h3 of the optical layer 3 in the film product 10 is not uniform, and thus the optical path of light passing through different thickness regions (e.g., the maximum thickness region 3a and the minimum thickness region 3b) of the optical layer 3 is different, so that different thickness regions of the optical layer 3 exhibit different colors, so that the film product 10 including the optical layer 3 can exhibit at least two different colors, which is beneficial to the film product 10 and the shell 100 including the film product 10 to exhibit a multi-color gradient effect and improve the aesthetic appearance of the film product 10 and the shell 100 including the film product 10.

[0068] In some embodiments, as shown in FIGS. 5A and 5B, FIG. 5A is a structural diagram of the substrate 1 in the film product 10 according to some embodiments, and FIG. 5B is a force diagram of the substrate 1 in the film product 10 according to some embodiments. For example, the material of the substrate 1 includes glass, which has typical brittle failure characteristics, i.e., brittle fracture and failure of the glass under impact or concentrated force.

[0069] The essence of brittle fracture of glass is crack propagation, for example: there are many small microcracks (Griffith cracks) on the surface of the glass, once the tangential tension around the crack reaches the tensile strength of the material, the microcrack starts to expand, and when it expands to a certain extent, it will cause the overall fracture of the glass structure.

[0070] As shown in FIG. 5B, when the glass is impacted by the steel ball, corresponding deformation occurs, the impact surface of the glass is under pressure, and the back impact surface of the glass is under tension. When the tangential tension of the microcrack on the back impact surface of the glass reaches the tensile strength value, the microcrack expands until the glass is completely broken.

[0071] It should be noted that, in order to clearly show the process of microcrack expansion on the surface of the glass leading to glass breakage, the microcracks on the surface of the glass in FIGS. 5A and 5B are enlarged.

[0072] As shown in FIGS. 4A and 4B, when the optical layer 3 is arranged on one side of the substrate 1 (e.g., glass), and the optical layer 3 is located on at least part of the surface of the substrate 1 on one side, due to the internal stress of the optical layer 3 itself and the interaction with the microcracks existing in the substrate 1 itself, the substrate 1 is warped or twisted and deformed, so that the microcracks on the surface of the substrate 1 are more likely to expand and lead to breakage of the substrate 1, thereby reducing the impact resistance of the substrate 1, and further reducing the impact resistance of the film-coated product 10.

[0073] Based on this, in some embodiments, as shown in FIGS. 6A to 6D, FIGS. 6A, 6B, 6C and 6D are all sectional views of a film-coated product 10 according to some embodiments. The film-coated product 10 further comprises a buffer layer 2. The buffer layer 2 is located between the substrate 1 and the optical layer 3. The buffer layer 2 is located on at least part of the surface of the substrate 1 on one side, and the optical layer 3 is located on the surface of the buffer layer 2 away from the substrate 1.

[0074] By arranging the buffer layer 2 in the film-coated product 10, and making the buffer layer 2 located on at least part of the surface of the substrate 1 on one side, and the optical layer 3 located on the surface of the buffer layer 2 away from the substrate 1, the buffer layer 2 can play a buffering role between the substrate 1 and the optical layer 3, effectively alleviate the influence of the stress of the optical layer 3 itself on the substrate 1, improve the impact resistance of the substrate 1, and further improve the impact resistance of the film-coated product 10, and improve the strength of the film-coated product 10.

[0075] In some embodiments, the material of the buffer layer 2 comprises a silicon-containing organic matter. For example, the material of the buffer layer 2 can comprise a small molecule siloxane. The small molecule siloxane has an unhydrolyzed organic group in a hydrolysis reaction. In one aspect, the unhydrolyzed organic group can generate a steric hindrance effect when the Si-OH groups between adjacent small molecule siloxanes are dehydrated and condensed, eventually forming a network structure with a certain degree of cross-linking. The network structure is accompanied by hydroxyl groups and unhydrolyzed organic groups on the surface, and the accompanying hydroxyl groups can be dehydrated and condensed with the hydroxyl groups (-OH) on the microcrack surface of the substrate 1 to form a connection, which can blunt the tip of the microcrack of the substrate 1. And because the unhydrolyzed organic group generates a steric hindrance effect when the Si-OH groups between adjacent small molecule siloxanes are dehydrated and condensed, the degree of cross-linking of the network structure can be reduced, i.e., the particle size of the formed particles is smaller, which is beneficial to filling the tip of the microcrack of the substrate 1.

[0076] On the other hand, the unhydrolyzed organic group can also impart a certain flexibility to the buffer layer 2. The flexible buffer layer 2 can act as a buffer between the substrate 1 and the optical layer 3, effectively alleviating the influence of the stress of the optical layer 3 on the substrate 1, improving the impact resistance of the substrate 1, and further improving the impact resistance of the film-coated product 10 and the strength of the film-coated product 10.

[0077] In some embodiments, the elastic modulus of the buffer layer 2 can be 1 Gpa to 30 Gpa.

[0078] For example, the elastic modulus of the buffer layer 2 can be 1 Gpa, 3 Gpa, 5 Gpa, 8 Gpa, 9 Gpa, 10 Gpa, 12 Gpa, 16 Gpa, 18 Gpa, 23 Gpa, 26 Gpa, 28 Gpa or 30 Gpa, etc.

[0079] By setting the elastic modulus of the buffer layer 2 to 1 Gpa to 30 Gpa, the buffer layer 2 can resist larger deformation, and the film-coated product 10 including the buffer layer 2 can improve the ability to resist external loads, which is beneficial to improving the strength of the film-coated product 10.

[0080] In some embodiments, the buffer layer 2 is colorless and transparent.

[0081] By making the buffer layer 2 colorless and transparent, the influence of the buffer layer 2 on the average reflectance or average transmittance of the film-coated product 10 can be reduced, and the adverse effects of setting the buffer layer 2 on the optical performance of the film-coated product 10 can be avoided.

[0082] For example, the difference between the refractive index of the buffer layer 2 and the refractive index of the substrate 1 is less than or equal to 0.1. That is, the refractive index of the buffer layer 2 and the refractive index of the substrate 1 are close to each other. For example, the difference between the refractive index of the buffer layer 2 and the refractive index of the substrate 1 is 0, 0.01, 0.02, 0.03, 0.04, 0.05, 0.06, 0.07, 0.08, 0.09, or 0.1.

[0083] By making the difference between the refractive index of the buffer layer 2 and the refractive index of the substrate 1 less than or equal to 0.1, the refractive index of the buffer layer 2 and the refractive index of the substrate 1 are close to each other, which can reduce the influence of the buffer layer 2 on the light propagation path in the film product 10, and further reduce the influence of the buffer layer 2 on the average reflectivity or average transmittance of the film product 10, thereby avoiding the adverse effects on the optical performance of the film product 10 due to the setting of the buffer layer 2.

[0084] In some embodiments, as shown in FIGS. 6A and 6C, the thickness (i.e., the size of the buffer layer 2 along the third direction Z) h2 of the buffer layer 2 in the film product 10 is uniform.

[0085] It should be noted that the above-mentioned “the thickness (i.e., the size of the buffer layer 2 along the third direction Z) h2 of the buffer layer 2 is uniform” means that the difference between the thickness h2 of the buffer layer 2 at multiple positions is within a preset threshold range. The threshold range is a relatively small numerical range, for example, the threshold range can be the process accuracy range when forming the thickness-uniform buffer layer 2.

[0086] In the case where the thickness h2 of the buffer layer 2 is uniform, the threshold range of the difference between the thickness h2 of the buffer layer 2 at multiple positions can be 0-10 nm. For example, the difference between the thickness h2 of the buffer layer 2 at multiple positions is 0 nm, 2 nm, 4 nm, 5 nm, 6 nm, 8 nm, or 10 nm.

[0087] In other embodiments, as shown in FIGS. 6B and 6D, the thickness h2 of the buffer layer 2 in the film product 10 increases with the increase of the thickness h3 of the optical layer 3.

[0088] In some embodiments, as shown in FIGS. 6A, 6B, 6C, and 6D, the thickness h2 of the buffer layer 2 is less than or equal to 1000 nm.

[0089] For example, the thickness h2 of the buffer layer 2 can be 50 nm, 70 nm, 80 nm, 100 nm, 120 nm, 150 nm, 200 nm, 300 nm, 500 nm, 550 nm, 600 nm, 650 nm, 700 nm, 750 nm, 800 nm, 850 nm, 900 nm, 950 nm, or 1000 nm, etc.

[0090] As shown in FIGS. 6A-6D, when the thickness h2 of the buffer layer 2 in the laminated article 10 is too small, the buffer layer 2 in the laminated article 10 cannot form an effective continuous film layer, and is prone to cause insufficient stress buffering between the substrate 1 and the optical layer 3.

[0091] When the thickness h2 of the buffer layer 2 in the laminated article 10 is too large, the bonding strength between the substrate 1 and the optical layer 3 is affected, and the service life of the laminated article 10 is prone to be reduced.

[0092] Therefore, the following describes the setting manner of the thickness h2 of the buffer layer 2 in the laminated article 10.

[0093] As shown in FIGS. 6A and 6C, the following first describes the setting manner of the thickness h2 of the buffer layer 2 in the case where the thickness h2 of the buffer layer 2 is uniform.

[0094] In some embodiments, the thickness h2 of the buffer layer 2 is positively correlated with the first preset total thickness h Z1 and the second preset total thickness h Z2 .

[0095] The first preset total thickness h Z1 is the thickness of the buffer layer 2 required by the thickness maximum region 3a of the optical layer 3, and the first preset total thickness h Z1 is at least obtained according to the maximum thickness h3 of the optical layer 3.

[0096] The second preset total thickness h Z2 is the thickness of the buffer layer 2 required by the thickness minimum region 3b of the optical layer 3, and the second preset total thickness h Z2 is at least obtained according to the minimum thickness h3 of the optical layer 3.

[0097] For example, the first preset total thickness h Z1 is the sum of the first preset thickness h 21 and the second preset thickness h 22 , and the second preset total thickness h Z2 is the sum of the third preset thickness h 23 and the fourth preset thickness h 24 .

[0098] The first preset thickness h 21 is the thickness of the buffer layer 2 required by all the first sub-layers 31 in the thickness maximum region 3a of the optical layer 3, and the first preset thickness h 21 is at least obtained according to the thickness (i.e., the size of the first sub-layer 31 along the third direction Z) h 311 of the first sub-layer 31 in the thickness maximum region 3a of the optical layer 3.

[0099] The second preset thickness h 22The second preset thickness h is the thickness of the buffer layer 2 required for all the second sublayers 32 in the region 3a with the maximum thickness of optical layer 3. 22 At least based on the thickness of the second sublayer 32 in the region 3a with the maximum thickness of optical layer 3 (i.e., the dimension of the second sublayer 32 along the third direction Z) h 321 get.

[0100] Third preset thickness h 23 The third preset thickness h is the thickness of the buffer layer 2 required for all the first sublayers 31 in the minimum thickness region 3b of the optical layer 3. 23 At least based on the thickness of the first sublayer 31 in the minimum thickness region 3b of the optical layer 3 (i.e., the dimension of the first sublayer 31 along the third direction Z) h 312 get.

[0101] Fourth preset thickness h 24 The fourth preset thickness h is the thickness of the buffer layer 2 required for all the second sublayers 32 in the minimum thickness region 3b of the optical layer 3. 24 At least based on the thickness of the second sublayer 32 in the minimum thickness region 3b of the optical layer 3 (i.e., the dimension of the second sublayer 32 along the third direction Z) h 322 get.

[0102] In some embodiments, the inner optical layer 3 of the coated article 10 comprises a first sublayer 31 of at least one material. First preset thickness h 21 The thickness h of all the first sublayers 31 of each material in the maximum thickness region 3a of optical layer 3. 311 The sum is positively correlated. That is, the first preset thickness h 21 With the thickness h of all the first sublayers 31 of each material in the maximum thickness region 3a of optical layer 3, 311 It increases as the sum of its components increases.

[0103] Third preset thickness h 23 The thickness h of all the first sublayers 31 of each material in the minimum thickness region 3b of optical layer 3. 312 The sum is positively correlated. That is, the third preset thickness h 23 With the thickness h of all the first sublayers 31 of each material in the minimum region 3b of the optical layer 3, 312 It increases as the sum of its components increases.

[0104] In some embodiments, the inner optical layer 3 of the coated article 10 includes a second sublayer 32 of at least one material. Second preset thickness h 22 The thickness h of all the second sublayers 32 of each material in the region 3a with the maximum thickness of optical layer 3. 321 The sum is positively correlated. That is, the second preset thickness h 22With the thickness h of the entire second sublayer 32 of each material in the maximum thickness region 3a of the optical layer 3, 321 It increases as the sum of its components increases.

[0105] Fourth preset thickness h 24 The thickness h of all the second sublayers 32 of each material in the minimum thickness region 3b of optical layer 3. 322 The sum is positively correlated. That is, the fourth preset thickness h 24 With the thickness h of the entire second sublayer 32 of each material in the minimum region 3b of the optical layer 3, 322 It increases as the sum of its components increases.

[0106] In some embodiments, the first preset thickness h 21 and the third preset thickness h 23 Also based on the elastic modulus E of buffer layer 2 OBF The elastic modulus E of substrate 1 and the elastic modulus E of the first sublayer 31 H Obtained. Second preset thickness h 22 and the fourth preset thickness h 24 Also based on the elastic modulus E of buffer layer 2 OBF The elastic modulus E of substrate 1 and the elastic modulus E of the second sublayer 32 L get.

[0107] It is understandable that the elastic modulus represents the stiffness of a material and is an indicator of the material's ability to resist elastic deformation. The smaller the elastic modulus, the easier it is for the material to deform under external force.

[0108] For example, the first preset thickness h 21 Second preset thickness h 22 The third preset thickness h 23 and the fourth preset thickness h 24 All are negatively correlated with the elastic modulus E of substrate 1. That is, the first preset thickness h 21 Second preset thickness h 22 The third preset thickness h 23 and the fourth preset thickness h 24 Both decrease as the elastic modulus E of substrate 1 increases.

[0109] First preset thickness h 21 Second preset thickness h 22 The third preset thickness h 23 and the fourth preset thickness h 24 Both are related to the elastic modulus E of buffer layer 2 OBF Positive correlation. That is, the first preset thickness h. 21 Second preset thickness h 22 The third preset thickness h 23 and the fourth preset thickness h24 All change with the elastic modulus E of buffer layer 2 OBF It increases as it increases.

[0110] First preset thickness h 21 and the third preset thickness h 23 Both are related to the elastic modulus E of the first sublayer 31 H Positive correlation. That is, the first preset thickness h. 21 and the third preset thickness h 23 All of them are related to the elastic modulus E of the first sublayer 31 H It increases as it increases.

[0111] Second preset thickness h 22 and the fourth preset thickness h 24 Both are related to the elastic modulus E of the second sublayer 32 L Positive correlation. That is, the second preset thickness h. 22 and the fourth preset thickness h 24 All of these change with the elastic modulus E of the second sublayer 32 L It increases as it increases.

[0112] In some embodiments, the first preset thickness h 21 and the third preset thickness h 23 Also based on the Poisson's ratio υ of buffer layer 2 OBF The Poisson's ratio υ of substrate 1 and the Poisson's ratio υ of the first sublayer 31 H get.

[0113] Second preset thickness h 22 and the fourth preset thickness h 24 Also based on the Poisson's ratio υ of buffer layer 2 OBF The Poisson's ratio υ of substrate 1 and the Poisson's ratio υ of the second sublayer 32 L get.

[0114] As can be understood, Poisson's ratio refers to the ratio of the absolute values ​​of the transverse normal strain to the axial normal strain when a material is subjected to uniaxial tension or compression; it is also known as the transverse deformation coefficient.

[0115] For example, the first preset thickness h 21 Second preset thickness h 22 The third preset thickness h 23 and the fourth preset thickness h 24 All are negatively correlated with the Poisson's ratio υ of substrate 1. That is, the first preset thickness h 21 Second preset thickness h 22 The third preset thickness h 23 and the fourth preset thickness h 24 Both decrease as the Poisson's ratio υ of substrate 1 increases.

[0116] First preset thickness h 21 Second preset thickness h 22 The third preset thickness h 23 and the fourth preset thickness h 24 Both are related to the Poisson's ratio υ of buffer layer 2 OBF Positive correlation. That is, the first preset thickness h. 21 Second preset thickness h 22 The third preset thickness h 23 and the fourth preset thickness h 24 All change with the Poisson's ratio υ of buffer layer 2 OBF It increases as it increases.

[0117] First preset thickness h 21 and the third preset thickness h 23 Both are related to the Poisson ratio υ of the first sublayer 31 H Positive correlation. That is, the first preset thickness h. 21 and the third preset thickness h 23 All follow the Poisson ratio υ of the first sublayer 31 H It increases as it increases.

[0118] Second preset thickness h 22 and the fourth preset thickness h 24 Both are related to the Poisson ratio υ of the second sublayer 32. L Positive correlation. That is, the second preset thickness h. 22 and the fourth preset thickness h 24 All follow the Poisson ratio υ of the second sublayer 32 L It increases as it increases.

[0119] In summary, by making the thickness h2 of the buffer layer 2 equal to the first preset total thickness h... Z1 and the second preset total thickness h Z2 Positive correlation, first preset total thickness h Z1 The thickness of the buffer layer 2 required for the maximum thickness region 3a of the optical layer 3, and the first preset total thickness h Z1 The first preset thickness h 21 Second preset thickness h 22 The sum of the two, the second preset total thickness h Z2 The thickness of the buffer layer 2 required for the minimum thickness region 3b of the optical layer 3, and the second preset total thickness h. Z2 The third preset thickness h 23 and the fourth preset thickness h 24 The sum of, and the first preset thickness h 21 Based on the thickness h of the first sublayer 31 in the region 3a with the maximum thickness of optical layer 3. 311The second preset thickness h is obtained by taking at least one of the elastic modulus of the buffer layer 2, the substrate 1, and the first sublayer 31, and the Poisson's ratio of the buffer layer 2, the substrate 1, and the first sublayer 31. 22 Based on the thickness h of the second sublayer 32 in the region 3a with the maximum thickness of optical layer 3 321 The third preset thickness h is obtained by taking at least one of the elastic modulus of the buffer layer 2, the substrate 1, and the second sublayer 32, and the Poisson's ratio of the buffer layer 2, the substrate 1, and the second sublayer 32. 23 Based on the thickness h of the first sublayer 31 in the minimum thickness region 3b of optical layer 3 312 The fourth preset thickness h is obtained by taking at least one of the elastic modulus of the buffer layer 2, the substrate 1, and the first sublayer 31, and the Poisson's ratio of the buffer layer 2, the substrate 1, and the first sublayer 31. 24 Based on the thickness h of the second sublayer 32 in the minimum thickness region 3b of optical layer 3 322 The thickness h2 of the buffer layer 2 can be designed by obtaining at least one of the elastic modulus of the buffer layer 2, the substrate 1, and the second sub-layer 32, and the Poisson's ratio of the buffer layer 2, the substrate 1, and the second sub-layer 32. This ensures that the buffer layer 2 provides stress buffering between the substrate 1 and the optical layer 3, and avoids the buffer layer 2 affecting the bonding strength between the substrate 1 and the optical layer 3, thus improving the service life of the coated product 10.

[0120] In some embodiments, the thickness h2 of the buffer layer 2 in the coated article 10 is equal to the first preset total thickness h. Z1 and the second preset total thickness h Z2 Positive correlation, first preset total thickness h Z1 The first preset thickness h 21 Second preset thickness h 22 The sum of the two, the second preset total thickness h Z2 The third preset thickness h 23 and the fourth preset thickness h 24 The sum of, and the first preset thickness h 21 Based on the thickness h of the first sublayer 31 in the region 3a with the maximum thickness of optical layer 3. 311 The second preset thickness h is obtained by considering the elastic modulus of the buffer layer 2, the substrate 1, and the first sublayer 31, and the Poisson's ratio of the buffer layer 2, the substrate 1, and the first sublayer 31. 22 Based on the thickness of the second sublayer 32 in the region 3a with the maximum thickness of optical layer 3 321 The elastic modulus of the buffer layer 2, the substrate 1, and the second sub-layer 32, and the Poisson's ratio of the buffer layer 2, the substrate 1, and the second sub-layer 32 are used to obtain the third preset thickness h. 23 Based on the thickness h of the first sublayer 31 in the minimum thickness region 3b of optical layer 3 312the elastic modulus of the buffer layer 2, the substrate 1 and the first sub-layer 31, and the Poisson's ratio of the buffer layer 2, the substrate 1 and the first sub-layer 31, the thickness h2 of the buffer layer 2 in the film product 10 can be calculated by the following formula: h2 = (k1h 24 the thickness h of the second sub-layer 32 in the thickness minimum region 3b of the optical layer 3 322 , the elastic modulus of the buffer layer 2, the substrate 1 and the second sub-layer 32, and the Poisson's ratio of the buffer layer 2, the substrate 1 and the second sub-layer 32, the thickness h2 of the buffer layer 2 in the film product 10 can be calculated by the following formula: h2 = (k1h Z1 +k2h Z2 ) / 2 h Z1 =h 21 +h 22 h Z2 =h 23 +h 24

[0121] wherein h2 represents the thickness of the buffer layer 2 in the film product 10.

[0122] h Z1 represents the first preset total thickness, i.e. the thickness of the buffer layer 2 required by the thickness maximum region 3a of the optical layer 3. h Z2 represents the second preset total thickness, i.e. the thickness of the buffer layer 2 required by the thickness minimum region 3b of the optical layer 3.

[0123] h 21 represents the first preset thickness, i.e. the thickness of the buffer layer 2 required by all the first sub-layers 31 in the thickness maximum region 3a of the optical layer 3. h 22 represents the second preset thickness, i.e. the thickness of the buffer layer 2 required by all the second sub-layers 32 in the thickness maximum region 3a of the optical layer 3. h 23 represents the third preset thickness, i.e. the thickness of the buffer layer 2 required by all the first sub-layers 31 in the thickness minimum region 3b of the optical layer 3. h 24 represents the fourth preset thickness, i.e. the thickness of the buffer layer 2 required by all the second sub-layers 32 in the thickness minimum region 3b of the optical layer 3.

[0124] k1 represents the interaction coefficient between the first sub-layer 31 and the second sub-layer 32 in the thickness maximum region 3a of the optical layer 3.

[0125] k2 represents the interaction coefficient between the first sub-layer 31 and the second sub-layer 32 in the thickness minimum region 3b of the optical layer 3.

[0126] In some examples, the value of k1 can range from 0.5 to 1.5. For example, k1 can be 0.5, 0.8, 1, 1.2, 1.3 or 1.5, etc.

[0127] In some examples, k2 can be in the range of 0.3 to 1.2. For example, k2 can be 0.3, 0.5, 0.6, 0.8, 0.9, 1, or 1.2, etc.

[0128] The following describes the calculation method of the first preset thickness h 21 of the optical layer 3 in the film product 10.

[0129] In the case where the optical layer 3 in the film product 10 comprises a first sub-layer 31 of one material, the first preset thickness h 21 can be calculated using the following formula:

[0130] wherein h 21 represents the first preset thickness, i.e. the thickness of the buffer layer 2 required by all the first sub-layers 31 in the thickness maximum region 3a of the optical layer 3. E OBF represents the elastic modulus of the buffer layer 2. E represents the elastic modulus of the substrate 1. υ H represents the elastic modulus of the first sub-layer 31. υ OBF represents the Poisson's ratio of the buffer layer 2. υ represents the Poisson's ratio of the substrate 1. t H represents the Poisson's ratio of the first sub-layer 31. t HB represents the sum of the thicknesses h 311 of all the first sub-layers 31 contained in the thickness maximum region 3a of the optical layer 3.

[0131] In the case where the optical layer 3 in the film product 10 comprises first sub-layers 31 of multiple materials, the first preset thickness h 21 can be calculated using the following formula:

[0132] wherein h 21 represents the first preset thickness, i.e. the thickness of the buffer layer 2 required by all the first sub-layers 31 in the thickness maximum region 3a of the optical layer 3. E OBF represents the elastic modulus of the buffer layer 2. E represents the elastic modulus of the substrate 1. υ OBF represents the Poisson's ratio of the buffer layer 2. υ represents the Poisson's ratio of the substrate 1.

[0133] In the case where the optical layer 3 in the film product 10 comprises first sub-layers 31 of multiple materials, in order to facilitate the differentiation of the elastic modulus of the first sub-layers 31 of different materials in the optical layer 3, E H1 to E Hn (n>1) are used to represent the elastic modulus of the first sub-layers 31 of different materials in the optical layer 3, respectively.

[0134] In order to facilitate the differentiation of the Poisson's ratio of the first sub-layers 31 of different materials in the optical layer 3, υ H1 to υ Hn(n > 1) represent the Poisson's ratios of the first sub-layers 31 of different materials in the optical layer 3, respectively.

[0135] In order to distinguish the thickness h 311 (n > 1) represent the thickness h HB1 (n > 1) represent the thickness h HBn (n > 1) represent the thickness h 311 (n > 1) represent the thickness h 22 of all the first sub-layers 31 of each material in the thickness maximum region 3a of the optical layer 3, respectively.

[0136] The calculation method of the above-mentioned second preset thickness h 22 is described as follows.

[0137] In the case where the optical layer 3 in the film product 10 comprises the second sub-layers 32 of one material, the second preset thickness h 22 can be calculated by the following formula:

[0138] wherein h 22 represents the second preset thickness, i.e. the thickness of the buffer layer 2 required by all the second sub-layers 32 in the thickness maximum region 3a of the optical layer 3. E OBF represents the elastic modulus of the buffer layer 2. E represents the elastic modulus of the substrate 1. υ L represents the Poisson's ratio of the buffer layer 2. υ represents the Poisson's ratio of the substrate 1. υ OBF represents the Poisson's ratio of the second sub-layers 32. t L represents the thickness h LB (n > 1) represent the thickness h 321 of all the second sub-layers 32 in the thickness maximum region 3a of the optical layer 3, respectively.

[0139] In the case where the optical layer 3 in the film product 10 comprises the second sub-layers 32 of multiple materials, the second preset thickness h 22 can be calculated by the following formula:

[0140] wherein h 22 represents the second preset thickness, i.e. the thickness of the buffer layer 2 required by all the second sub-layers 32 in the thickness maximum region 3a of the optical layer 3. E OBF represents the elastic modulus of the buffer layer 2. E represents the elastic modulus of the substrate 1. υ OBF represents the Poisson's ratio of the buffer layer 2. υ represents the Poisson's ratio of the substrate 1.

[0141] In the case where the optical layer 3 in the coated article 10 comprises second sub-layers 32 of multiple materials, in order to facilitate the differentiation of the elastic modulus of the second sub-layers 32 of different materials in the optical layer 3, the use of E L1 ~ E Ln (n > 1) respectively represents the elastic modulus of the second sub-layers 32 of different materials in the optical layer 3.

[0142] In order to facilitate the differentiation of the Poisson's ratio of the second sub-layers 32 of different materials in the optical layer 3, the use of υ L1 ~ υ Ln (n > 1) respectively represents the Poisson's ratio of the second sub-layers 32 of different materials in the optical layer 3.

[0143] In order to facilitate the differentiation of the sum of the thickness h 321 of all the second sub-layers 32 of each material within the thickness maximum region 3a of the optical layer 3, the use of t LB1 ~ t LBn (n > 1) respectively represents the sum of the thickness h 321 of all the second sub-layers 32 of each material within the thickness maximum region 3a of the optical layer 3.

[0144] The calculation method of the above-mentioned third preset thickness h 23 is described below.

[0145] In the case where the optical layer 3 in the coated article 10 comprises first sub-layers 31 of one material, the third preset thickness h 23 may be calculated using the following formula:

[0146] wherein h 23 represents the third preset thickness, i.e. the thickness of the buffer layer 2 required by all the first sub-layers 31 in the thickness minimum region 3b of the optical layer 3.E OBF represents the elastic modulus of the buffer layer 2. E represents the elastic modulus of the substrate 1.E H represents the elastic modulus of the first sub-layer 31. υ OBF represents the Poisson's ratio of the buffer layer 2. υ represents the Poisson's ratio of the substrate 1. υ H represents the Poisson's ratio of the first sub-layer 31. t HS represents the sum of the thickness h 312 of all the first sub-layers 31 contained in the thickness minimum region 3b of the optical layer 3.

[0147] In the case where the optical layer 3 in the coated article 10 comprises first sub-layers 31 of multiple materials, the third preset thickness h 23 may be calculated using the following formula:

[0148] wherein h23 represents the fourth preset thickness, i.e. the thickness of the buffer layer 2 required by all the second sub-layers 32 in the thickness minimum region 3b of the optical layer 3. E OBF represents the elastic modulus of the buffer layer 2. E represents the elastic modulus of the substrate 1. E OBF represents the Poisson's ratio of the buffer layer 2. υ represents the Poisson's ratio of the substrate 1.

[0149] In the case where the optical layer 3 in the film product 10 comprises first sub-layers 31 of multiple materials, in order to facilitate the differentiation of the elastic modulus of the first sub-layers 31 of different materials in the optical layer 3, the use of E H1 ~ E Hn (n>1) respectively represents the elastic modulus of the first sub-layers 31 of different materials in the optical layer 3.

[0150] In order to facilitate the differentiation of the Poisson's ratio of the first sub-layers 31 of different materials in the optical layer 3, the use of υ H1 ~ υ Hn (n>1) respectively represents the Poisson's ratio of the first sub-layers 31 of different materials in the optical layer 3.

[0151] In order to facilitate the differentiation of the sum of the thickness h 312 of all the first sub-layers 31 of each material in the thickness minimum region 3b of the optical layer 3, the use of t HS1 ~ t HSn (n>1) respectively represents the sum of the thickness h 312 of all the first sub-layers 31 of each material in the first sub-layers 31 of multiple materials within the thickness minimum region 3b of the optical layer 3.

[0152] The calculation method of the above-mentioned fourth preset thickness h 24 is described below.

[0153] In the case where the optical layer 3 in the film product 10 comprises second sub-layers 32 of one material, the fourth preset thickness h 24 can be calculated by the following formula:

[0154] wherein h 24 represents the fourth preset thickness, i.e. the thickness of the buffer layer 2 required by all the second sub-layers 32 in the thickness minimum region 3b of the optical layer 3. E OBF represents the elastic modulus of the buffer layer 2. E represents the elastic modulus of the substrate 1. E L represents the elastic modulus of the second sub-layer 32. υ OBF represents the Poisson's ratio of the buffer layer 2. υ represents the Poisson's ratio of the substrate 1. υ L represents the Poisson's ratio of the second sub-layer 32. t LSrepresents the thickness h of all the second sub-layers 32 of the optical layer 3 in the thickness minimum region 3b 322 .

[0155] In the case where the optical layer 3 in the film product 10 includes the second sub-layers 32 of multiple materials, the fourth preset thickness h 24 may be calculated by the following formula:

[0156] wherein h 24 represents the fourth preset thickness, i.e. the thickness of the buffer layer 2 required by all the second sub-layers 32 in the thickness minimum region 3b of the optical layer 3.E OBF represents the elastic modulus of the buffer layer 2.E represents the elastic modulus of the substrate 1.υ OBF represents the Poisson's ratio of the buffer layer 2.υ represents the Poisson's ratio of the substrate 1.

[0157] In the case where the optical layer 3 in the film product 10 includes the second sub-layers 32 of multiple materials, in order to facilitate the differentiation of the elastic modulus of the second sub-layers 32 of different materials in the optical layer 3, E L1 ~ E Ln (n>1) represent the elastic modulus of the second sub-layers 32 of different materials in the optical layer 3, respectively.

[0158] In order to facilitate the differentiation of the Poisson's ratio of the second sub-layers 32 of different materials in the optical layer 3,υ L1 ~ υ Ln (n>1) represent the Poisson's ratio of the second sub-layers 32 of different materials in the optical layer 3, respectively.

[0159] In order to facilitate the differentiation of the thickness h 322 of all the second sub-layers 32 of each material in the thickness minimum region 3b of the optical layer 3, t LS1 ~ t LSn (n>1) represent the thickness h 322 of all the second sub-layers 32 of each material in the second sub-layers 32 of multiple materials within the thickness minimum region 3b of the optical layer 3, respectively.

[0160] As shown in FIGS. 6B and 6D, the following describes the setting manner of the thickness h2 of the buffer layer 2 in the case where the thickness h2 of the buffer layer 2 increases with the increase of the thickness h3 of the optical layer 3.

[0161] In some embodiments, as shown in FIGS. 6B and 6D, the optical layer 3 within the film product 10 includes multiple thickness regions 3m, and the thickness h3 of the optical layer 3 in different thickness regions 3m ranges differently. The thickness h2 of the buffer layer 2 corresponding to different thickness regions 3m in the optical layer 3 are all the fifth preset thickness h 25 and the sixth preset thickness h26 is positively correlated.

[0162] a fifth predetermined thickness h 25 is the thickness of the buffer layer 2 required for all of the first sub-layers 31 of one thickness region 3m in the optical layer 3. The fifth predetermined thickness h 25 is at least according to the thickness h of the first sub-layers 31 of one thickness region 3m in the optical layer 3 31 is obtained.

[0163] a sixth predetermined thickness h 26 is the thickness of the buffer layer 2 required for all of the second sub-layers 32 of one thickness region 3m in the optical layer 3. The sixth predetermined thickness h 26 is at least according to the thickness h of the second sub-layers 32 of one thickness region 3m in the optical layer 3 32 is obtained.

[0164] For example, the optical layer 3 within the film product 10 includes first sub-layers 31 of at least one material. The fifth predetermined thickness h 25 and the thickness h of all of the first sub-layers 31 of each material of one thickness region 3m in the optical layer 3 31 are positively correlated. That is, the fifth predetermined thickness h 25 increases as the thickness h of all of the first sub-layers 31 of each material of one thickness region 3m in the optical layer 3 31 increases.

[0165] For another example, the optical layer 3 within the film product 10 includes second sub-layers 32 of at least one material. The sixth predetermined thickness h 26 and the thickness h of all of the second sub-layers 32 of each material of one thickness region 3m in the optical layer 3 32 are positively correlated. That is, the sixth predetermined thickness h 26 increases as the thickness h of all of the second sub-layers 32 of each material of one thickness region 3m in the optical layer 3 32 increases.

[0166] For yet another example, the optical layer 3 within the film product 10 includes first sub-layers 31 of at least one material and second sub-layers 32 of at least one material. The fifth predetermined thickness h 25 and the thickness h of all of the first sub-layers 31 of each material of one thickness region 3m in the optical layer 3 31 are positively correlated. The sixth predetermined thickness h 26 and the thickness h of all of the second sub-layers 32 of each material of one thickness region 3m in the optical layer 3 32 are positively correlated.

[0167] In some embodiments, the fifth predetermined thickness h 25 is also according to the elastic modulus E of the buffer layer 2OBF the elastic modulus E of the substrate 1 and the elastic modulus E of the first sub-layer 31 H is obtained. The sixth preset thickness h 26 is also inversely related to the elastic modulus E of the buffer layer 2 OBF the elastic modulus E of the substrate 1 and the elastic modulus E of the second sub-layer 32 L is obtained.

[0168] For example, the fifth preset thickness h 25 and the sixth preset thickness h 26 are inversely related to the elastic modulus E of the substrate 1. That is, the fifth preset thickness h 25 and the sixth preset thickness h 26 decrease as the elastic modulus E of the substrate 1 increases.

[0169] The fifth preset thickness h 25 and the sixth preset thickness h 26 are positively related to the elastic modulus E of the buffer layer 2 OBF . That is, the fifth preset thickness h 25 and the sixth preset thickness h 26 increase as the elastic modulus E of the buffer layer 2 OBF increases.

[0170] The fifth preset thickness h 25 and the elastic modulus E of the first sub-layer 31 H are positively related. That is, the fifth preset thickness h 25 increases as the elastic modulus E of the first sub-layer 31 H increases.

[0171] The sixth preset thickness h 26 and the elastic modulus E of the second sub-layer 32 L are positively related. That is, the sixth preset thickness h 26 increases as the elastic modulus E of the second sub-layer 32 L increases.

[0172] In some embodiments, the fifth preset thickness h 25 is also inversely related to the Poisson's ratio υ of the buffer layer 2 OBF the Poisson's ratio υ of the substrate 1 and the Poisson's ratio υ of the first sub-layer 31 H is obtained. The sixth preset thickness h 26 is also inversely related to the Poisson's ratio υ of the buffer layer 2 OBF the Poisson's ratio υ of the substrate 1 and the Poisson's ratio υ of the second sub-layer 32 L is obtained.

[0173] For example, the fifth preset thickness h 25 and the sixth preset thickness h 26are all negatively correlated with the Poisson's ratio υ of the substrate 1. That is, the fifth preset thickness h 25 and the sixth preset thickness h 26 are all decreased as the Poisson's ratio υ of the substrate 1 is increased.

[0174] The fifth preset thickness h 25 and the sixth preset thickness h 26 are all positively correlated with the Poisson's ratio υ of the buffer layer 2. OBF That is, the fifth preset thickness h 25 and the sixth preset thickness h 26 are all increased as the Poisson's ratio υ of the buffer layer 2 is increased. OBF

[0175] The fifth preset thickness h 25 and the Poisson's ratio υ of the first sub-layer 31. H That is, the fifth preset thickness h 25 is increased as the Poisson's ratio υ of the first sub-layer 31 is increased. H

[0176] The sixth preset thickness h 26 and the Poisson's ratio υ of the second sub-layer 32. L That is, the sixth preset thickness h 26 is increased as the Poisson's ratio υ of the second sub-layer 32 is increased. L

[0177] In summary, by making the thickness h2 of the buffer layer 2 corresponding to each thickness region 3m in the optical layer 3 positively correlated with the sum of the fifth preset thickness h 25 and the sixth preset thickness h 26 , the fifth preset thickness h 25 is the thickness of the buffer layer 2 required by all the first sub-layers 31 of one thickness region 3m in the optical layer 3, the sixth preset thickness h 26 is the thickness of the buffer layer 2 required by all the second sub-layers 32 of one thickness region 3m in the optical layer 3, and the fifth preset thickness h 25 is obtained according to at least one of the thickness h 31 of the first sub-layer 31, the elastic modulus of the buffer layer 2, the substrate 1 and the first sub-layer 31, and the Poisson's ratio of the buffer layer 2, the substrate 1 and the first sub-layer 31 of one thickness region 3m in the optical layer 3, the sixth preset thickness h 26 is obtained according to at least one of the thickness h 32 ​​​At least one of the elastic modulus of the buffer layer 2, the substrate 1 and the second sub-layer 32 and the Poisson's ratio of the buffer layer 2, the substrate 1 and the second sub-layer 32 is obtained, and the thickness h2 of the buffer layer 2 corresponding to the different thickness regions 3m in the optical layer 3 can be designed. In this way, the stress buffering effect of the buffer layer 2 between the substrate 1 and the optical layer 3 can be ensured, and the influence of the buffer layer 2 on the bonding strength between the substrate 1 and the optical layer 3 is avoided, which is beneficial to improve the service life of the film product 10.

[0178] In some embodiments, the thickness h2 of the buffer layer 2 corresponding to the different thickness regions 3m in the optical layer 3 is positively correlated with the sum of the fifth preset thickness h 25 and the sixth preset thickness h 26 . 25 According to the thickness h 31 of the first sub-layer 31 of one thickness region 3m in the optical layer 3, the elastic modulus of the buffer layer 2, the substrate 1 and the first sub-layer 31 and the Poisson's ratio of the buffer layer 2, the substrate 1 and the first sub-layer 31, the sixth preset thickness h 26 of the buffer layer 2 corresponding to the different thickness regions 3m in the optical layer 3 can be calculated as follows: h 32 6= k1(h 25 + h 26 )

[0179] Wherein, h2 represents the thickness of the buffer layer 2 in the film product 10.

[0180] h 25 5 represents the fifth preset thickness, that is, the thickness of the buffer layer 2 required by all the first sub-layers 31 of one thickness region 3m in the optical layer 3. 26 h 25 6 represents the sixth preset thickness, that is, the thickness of the buffer layer 2 required by all the second sub-layers 32 of one thickness region 3m in the optical layer 3.

[0181] k3 represents the interaction coefficient between the first sub-layer 31 and the second sub-layer 32 in one thickness region 3m in the optical layer 3.

[0182] In some examples, the value range of k3 can be 0.3-1.5. For example, k3 is 0.3, 0.5, 0.8, 1, 1.2, 1.3 or 1.5, etc.

[0183] The calculation method of the above-mentioned fifth preset thickness h 25 is described below.

[0184] In the case where the optical layer 3 in the coated article 10 comprises a first sub-layer 31 of one material, the fifth predetermined thickness h 25 may be calculated using the following equation:

[0185] where h 25 represents the fifth predetermined thickness, i.e. the thickness of the buffer layer 2 required for all the first sub-layers 31 of one thickness region 3m in the optical layer 3. E OBF represents the modulus of elasticity of the buffer layer 2. E represents the modulus of elasticity of the substrate 1. υ H represents the modulus of elasticity of the first sub-layer 31. υ OBF represents the Poisson's ratio of the buffer layer 2. υ represents the Poisson's ratio of the substrate 1. t H represents the Poisson's ratio of the first sub-layer 31. t H represents the sum of the thicknesses h 31 of all the first sub-layers 31 comprised in one thickness region 3m in the optical layer 3.

[0186] In the case where the optical layer 3 in the coated article 10 comprises first sub-layers 31 of a plurality of materials, the fifth predetermined thickness h 25 may be calculated using the following equation:

[0187] where h 25 represents the fifth predetermined thickness, i.e. the thickness of the buffer layer 2 required for all the first sub-layers 31 of one thickness region 3m in the optical layer 3. E OBF represents the modulus of elasticity of the buffer layer 2. E represents the modulus of elasticity of the substrate 1. υ OBF represents the Poisson's ratio of the buffer layer 2. υ represents the Poisson's ratio of the substrate 1.

[0188] In the case where the optical layer 3 in the coated article 10 comprises first sub-layers 31 of a plurality of materials, in order to facilitate the differentiation of the modulus of elasticity of the first sub-layers 31 of different materials in the optical layer 3, E H1 ~ E Hn (n > 1) represent the modulus of elasticity of the first sub-layers 31 of different materials in the optical layer 3, respectively.

[0189] In order to facilitate the differentiation of the Poisson's ratio of the first sub-layers 31 of different materials in the optical layer 3, υ H1 ~ υ Hn (n > 1) represent the Poisson's ratio of the first sub-layers 31 of different materials in the optical layer 3, respectively.

[0190] In order to facilitate the differentiation of the sum of the thicknesses h 31 of all the first sub-layers 31 of each material in one thickness region 3m in the optical layer 3, t H1 ~ t Hn(n>1) represent the thickness h of all the first sublayers 31 of each material in a 3m thickness region of optical layer 3. 31 sum.

[0191] The following describes the sixth preset thickness h mentioned above. 26 The calculation method will be explained.

[0192] In the case where the optical layer 3 in the coated article 10 includes a second sublayer 32 of a material, the sixth preset thickness h 26 The following formula can be used for calculation:

[0193] Among them, h 26 E represents the sixth preset thickness, which is the thickness of the buffer layer 2 required for all the second sublayers 32 within a thickness region of 3m in the optical layer 3. OBF E represents the elastic modulus of buffer layer 2. E represents the elastic modulus of substrate 1. L This represents the elastic modulus of the second sublayer 32. OBF υ represents the Poisson's ratio of buffer layer 2. υ represents the Poisson's ratio of substrate 1. L This represents the Poisson's ratio of the second sublayer, 32. L The thickness h represents the total thickness of all the second sublayers 32 contained within a thickness region 3m in optical layer 3. 32 sum.

[0194] In the case where the optical layer 3 in the coated article 10 comprises a second sub-layer 32 of multiple materials, the second preset thickness h 22 The following formula can be used for calculation:

[0195] Among them, h 26 E represents the sixth preset thickness, which is the thickness of the buffer layer 2 required for all the second sublayers 32 within a thickness region of 3m in the optical layer 3. OBF This represents the elastic modulus of buffer layer 2. E represents the elastic modulus of substrate 1. OBF υ represents the Poisson's ratio of buffer layer 2. υ represents the Poisson's ratio of substrate 1.

[0196] In cases where the optical layer 3 in the coated article 10 comprises a second sublayer 32 of multiple materials, E is used to facilitate the differentiation of the elastic modulus of the second sublayer 32 of different materials in the optical layer 3. L1 ~E Ln (n>1) represent the elastic modulus of the second sublayer 32 of different materials in the optical layer 3.

[0197] To facilitate the differentiation of the Poisson's ratio of the second sublayer 32 made of different materials in optical layer 3, υ is used. L1 ~υLn (n>1) represent the Poisson's ratios of the second sublayer 32 of different materials in optical layer 3.

[0198] To facilitate the measurement of the thickness h of all second sublayers 32 of each material within a 3m thickness region in optical layer 3, 32 To distinguish between the sums, use t. L1 ~t Ln (n>1) represents the total thickness h of each of the second sublayers 32 of various materials within a thickness region of 3m in optical layer 3. 32 sum.

[0199] The following describes the technical solution of the coated product 10 including the buffer layer 2 in detail, taking the uniform setting of the thickness h2 of the buffer layer 2 in the coated product 10 as an example, and in conjunction with embodiments S1 to S3. In order to verify the beneficial effects of setting the buffer layer 2 in the coated product 10 in this disclosure, comparative examples D0 to D3 are also provided corresponding to embodiments S1 to S3 of the coated product 10 including the buffer layer 2.

[0200] It should be noted that in the following embodiments, when the coated product 10 includes a buffer layer 2, the calculation method for the thickness h2 of the buffer layer 2 is as described above, and will not be repeated here.

[0201] Comparative Example D0: The thickness of substrate 1 (i.e., the dimension of substrate 1 along the third direction Z) h1 is 0.55 mm. The material of substrate 1 is chemically strengthened glass.

[0202] Comparative Example D1: The coated product 10 includes a substrate 1 and an optical layer 3.

[0203] The thickness h1 of the substrate 1 in the coated product 10 is 0.55 mm. The material of the substrate 1 is chemically strengthened glass.

[0204] The thickness h3 of the optical layer 3 in the coated product 10 is approximately 388 nm to 484 nm. That is, the maximum value of the thickness h3 of the optical layer 3 is approximately 484 nm, and the minimum value of the thickness h3 of the optical layer 3 is approximately 388 nm.

[0205] Example S1: The coated article 10 includes a substrate 1, a buffer layer 2 and an optical layer 3 stacked in the third direction Z.

[0206] The thickness h1 of the substrate 1 in the coated product 10 is 0.55 mm. The material of the substrate 1 is chemically strengthened glass.

[0207] The thickness h3 of the optical layer 3 in the coated product 10 is approximately 388 nm to 484 nm. That is, the maximum value of the thickness h3 of the optical layer 3 is approximately 484 nm, and the minimum value of the thickness h3 of the optical layer 3 is approximately 388 nm.

[0208] The thickness h2 of the buffer layer 2 in the coated article 10 is 200 nm.

[0209] Comparative Example D2: The coated article 10 includes the substrate 1 and the optical layer 3.

[0210] The thickness h1 of the substrate 1 in the coated article 10 is 0.55 mm. The material of the substrate 1 is chemically strengthened glass.

[0211] The thickness h3 of the optical layer 3 in the coated article 10 is about 310 nm to 485 nm. That is, the maximum value of the thickness h3 of the optical layer 3 is about 485 nm, and the minimum value of the thickness h3 of the optical layer 3 is about 310 nm.

[0212] Example S2: The coated article 10 includes the substrate 1, the buffer layer 2, and the optical layer 3 stacked along the third direction Z.

[0213] The thickness h1 of the substrate 1 in the coated article 10 is 0.55 mm. The material of the substrate 1 is chemically strengthened glass.

[0214] The thickness h3 of the optical layer 3 in the coated article 10 is about 310 nm to 485 nm. That is, the maximum value of the thickness h3 of the optical layer 3 is about 485 nm, and the minimum value of the thickness h3 of the optical layer 3 is about 310 nm.

[0215] The thickness h2 of the buffer layer 2 in the coated article 10 is 200 nm.

[0216] Comparative Example D3: The coated article 10 includes the substrate 1 and the optical layer 3.

[0217] The thickness h1 of the substrate 1 in the coated article 10 is 0.55 mm. The material of the substrate 1 is chemically strengthened glass.

[0218] The thickness h3 of the optical layer 3 in the coated article 10 is about 383 nm to 480 nm. That is, the maximum value of the thickness h3 of the optical layer 3 is about 480 nm, and the minimum value of the thickness h3 of the optical layer 3 is about 383 nm.

[0219] Example S3: The coated article 10 includes the substrate 1, the buffer layer 2, and the optical layer 3 stacked along the third direction Z.

[0220] The thickness h1 of the substrate 1 in the coated article 10 is 0.55 mm. The material of the substrate 1 is chemically strengthened glass.

[0221] The thickness h3 of the optical layer 3 in the coated article 10 is about 383 nm to 480 nm. That is, the maximum value of the thickness h3 of the optical layer 3 is about 480 nm, and the minimum value of the thickness h3 of the optical layer 3 is about 383 nm.

[0222] The thickness h2 of the buffer layer 2 in the film-coated article 10 is 100 nm.

[0223] The film-coated articles 10 in Examples S1-S3 and Comparative Examples D0-D3 were subjected to performance tests, and the performance test results were described in detail.

[0224] Elastic modulus and Poisson's ratio tests of the buffer layer 2 and the optical layer 3 in the film-coated article 10.

[0225] In some embodiments, when the buffer layer 2 and the optical layer 3 (i.e., the first sub-layer 31 and the second sub-layer 32 in the optical layer 3) in the film-coated article 10 are subjected to elastic modulus and Poisson's ratio tests, the nano-mechanical properties of the buffer layer 2 and the optical layer 3 (i.e., the first sub-layer 31 and the second sub-layer 32 in the optical layer 3) in the film-coated article 10 can be tested using a nanoindenter.

[0226] For example, the nanoindenter can use a diamond material three-prism pyramid Berkovich indenter when performing the indentation test, and the tip curvature radius of the indenter is less than 20 nanometers.

[0227] Each film-coated article 10 is subjected to effective indentation tests at at least 4 different positions, and the spacing between the indentations is at least 30 times the maximum indentation depth to prevent mutual influence of the indentation stress fields.

[0228] The test results of the elastic modulus E of the buffer layer 2 in the film-coated articles 10 in Examples S1-S3 and Comparative Examples D1-D3 OBF , the Poisson's ratio υ of the buffer layer 2 OBF , the elastic modulus E of the first sub-layer 31 H , the Poisson's ratio υ of the first sub-layer 31 H , the elastic modulus E of the second sub-layer 32 L , and the Poisson's ratio υ of the second sub-layer 32 L are shown in the following table.

[0229] Film thickness test of the buffer layer 2 in the film-coated article 10.

[0230] In some embodiments, the scanning electron microscope-focused ion beam (SEM-FIB) technique can be used when performing the film thickness test on the buffer layer 2 in the film-coated article 10 in Examples S1-S3 and Comparative Examples D1-D3. The SEM-FIB technique is an advanced electron microscope technique that combines ion beam processing and scanning electron microscope imaging functions, which is beneficial to improve the test efficiency of the film thickness test on the buffer layer 2 in the film-coated article 10.

[0231] In some examples, the film thickness test on the buffer layer 2 is performed at multiple locations in each film-coated article 10, and the average value is taken.

[0232] For example, the film thickness test on the buffer layer 2 can be performed at three locations in each film-coated article 10, and the average value is taken.

[0233] In some embodiments, in order to prevent the buffer layer 2 in the film-coated article 10 from being damaged during FIB cutting, and to make it easier to observe the thickness h2 of the buffer layer 2 in the film-coated article 10, a layer of polyethylene glycol terephthalate (PET) can be provided on the surface of the film-coated article 10 before FIB cutting.

[0234] The thickness h2 of the buffer layer 2 in the film-coated article 10 in Examples S1-S3 and Comparative Examples D1-D3 is in the range shown in the following table, and the actual thickness h2 of the buffer layer 2 is also shown in the following table. In addition, the following table also shows the thickness h 311 of all the first sub-layers 31 contained in the thickness maximum region 3a of the optical layer 3 HB , the thickness h 321 of all the second sub-layers 32 contained in the thickness maximum region 3a of the optical layer 3 LB , the thickness h 312 of all the first sub-layers 31 contained in the thickness minimum region 3b of the optical layer 3 HS , the thickness h 322 of all the second sub-layers 32 contained in the thickness minimum region 3b of the optical layer 3 LS .

[0235] Lab (color model) value test of the film-coated article 10.

[0236] In some embodiments, when the coated article 10 in Examples S1-S3 and Comparative Examples D1-D3 is tested for Lab values, a color difference meter can be used to test the Lab values of the coated article 10 in Examples S1-S3 and Comparative Examples D1-D3 in reflection mode. The test results of the Lab values of the coated article 10 in Examples S1-S3 and Comparative Examples D1-D3 are shown in the following table.

[0237] Drop ball test of the coated article 10.

[0238] In some embodiments, when the coated article 10 in Examples S1-S3 and Comparative Examples D1-D3, and the substrate 1 in Comparative Example D0 are tested for drop ball, the side surface of the optical layer 3 of the coated article 10 is downwardly facing and fixed to a drop ball test fixture, and a steel ball with a mass of 32 g ± 1 g and a diameter of 20 mm is used for free-fall impact test. Four fixed points are tested in each coated article 10.

[0239] The surface of the coated article 10 is tested at different heights. The initial test height can be 10 cm, and the height is increased by 5 cm each time. The test is ended when a crack appears on the surface of the coated article 10, and the height of the steel ball when the crack appears on the coated article 10 is recorded.

[0240] The test results of the drop ball of the coated article 10 in Examples S1-S3 and Comparative Examples D1-D3, and the substrate 1 in Comparative Example D0 are shown in the following table.

[0241] As shown in the above table, when the coated article 10 in Examples S1-S3 is tested for drop ball using a steel ball with a diameter of 20 mm and a mass of 32 g ± 1 g, the height at which the coated article 10 in Examples S1-S3 is broken is greater than 50 cm.

[0242] Compared with the substrate 1 alone in Comparative Example D0, the coated article 10 obtained by directly disposing the optical layer 3 on one side of the substrate 1 without disposing the buffer layer 2 in Comparative Examples D1-D3 can deteriorate the impact resistance of the substrate 1, and thus the impact resistance of the coated article 10 is poor. However, by disposing the buffer layer 2 in the coated article 10 in Examples S1-S3, the impact resistance of the substrate 1 can be effectively alleviated by the optical layer 3, which is beneficial to eliminate or weaken the influence of the stress of the optical layer 3 on the substrate 1, and is beneficial to improve the impact resistance of the coated article 10, and thus the strength of the coated article 10 is improved.

[0243] In some embodiments, as shown in FIGS. 7A-7D, FIGS. 7A, 7B, 7C and 7D are each a cross-sectional view of a film-coated article 10 according to some embodiments. The film-coated article 10 further comprises a transition layer 4. The transition layer 4 is located between the buffer layer 2 and the substrate 1.

[0244] The transition layer 4 material comprises silicon element, and the content of silicon element in the transition layer 4 is higher than that in the substrate 1.

[0245] By setting the transition layer 4, and the content of silicon element in the transition layer 4 is higher than that in the substrate 1, the number of Si-O-Si bonds between the buffer layer 2 and the substrate 1 can be increased, thereby improving the bonding force between the buffer layer 2 and the substrate 1.

[0246] In some embodiments, the difference between the content of silicon element in the transition layer 4 and the content of silicon element in the substrate 1 is greater than or equal to 10%.

[0247] For example, the difference between the content of silicon element in the transition layer 4 and the content of silicon element in the substrate 1 can be 10%, 12%, 15%, 18%, 20%, 23%, 25%, 28%, 30% or 33%, etc.

[0248] In some embodiments, the transition layer 4 material can comprise at least one of silicon (Si) or silicon dioxide (SiO2). Si or SiO2 is a porous columnar crystal structure, which is beneficial to increase the contact area between the buffer layer 2 and the substrate 1, thereby improving the bonding force between the buffer layer 2 and the substrate 1.

[0249] In some embodiments, the thickness h4 of the transition layer 4 is less than 50 nm.

[0250] For example, the thickness h4 of the transition layer 4 can be 5 nm, 10 nm, 15 nm, 20 nm, 25 nm, 30 nm, 35 nm, 40 nm, 45 nm or 50 nm, etc.

[0251] The preparation method of the above film-coated article 10 is described in detail as follows.

[0252] In some embodiments, the preparation method of the film-coated article 10 comprises the following steps:

[0253] A1: providing a substrate 1.

[0254] A2: forming a buffer layer 2 on at least part of the surface of the substrate 1.

[0255] A3: forming an optical layer 3 on the side surface of the buffer layer 2 away from the substrate 1.

[0256] The following describes a method for manufacturing the film-coated article 10 in some embodiments of the present disclosure, in combination with the film-coated article 10 in the above-described Examples S1-S2.

[0257] The method for manufacturing the film-coated article 10 in Example S1 includes the following steps:

[0258] A1: providing the substrate 1.

[0259] The substrate 1 is cleaned. For example, when the thickness h1 of the substrate 1 is 0.55 mm, the planar size of the substrate 1 is 73 mm x 160 mm, and the material of the substrate 1 includes chemically strengthened glass, the step of cleaning the substrate 1 is as follows: the substrate 1 is placed on the conveying rollers of a horizontal cleaning line to pass through a neutral cleaning agent brushing tank (e.g., the tank solution temperature is 50°C), a weak alkali cleaning agent brushing tank (e.g., the pH value is 12), and at least one (e.g., two) pure water brushing tank at a preset speed (e.g., 50 mm / min) to achieve preliminary cleaning of the substrate 1.

[0260] The preliminarily cleaned substrate 1 is placed on a jig of a vacuum coating machine and is placed at a designated position in the coating machine. The chamber door is closed, the vacuum pump is turned on, and the vacuum degree of the coating chamber is reduced to 3 x 10 -3 Pa. Then, argon gas with a flow rate of 60 sccm is filled into the machine, and the turret is opened. After the gas stabilizes, the ion source (with an average energy of 800 eV) is turned on to perform ion cleaning on the surface of the substrate 1 for a preset time (e.g., 160 s).

[0261] A2: forming the buffer layer 2 on at least part of the surface of the substrate 1.

[0262] In some examples, the buffer layer 2 can be deposited on at least part of the surface of the substrate 1 by a physical vapor deposition (PVD) process. For example, after the ion cleaning of the substrate 1 is completed, the ion source is turned off, the argon gas filling is stopped, and the vacuum degree in the coating chamber is increased to 5 x 10 -3 Pa. Then, the electron beam is aimed at the crucible containing the film material for forming the buffer layer 2, the electron beam power is turned on at 4%, the evaporation speed of the buffer layer 2 is 0.25 nm / s, and the coating time is 800 s.

[0263] When the buffer layer 2 is deposited on at least part of the surface of the substrate 1 by a physical vapor deposition (PVD) process, the buffer layer 2 is grown at the molecular level, has better uniformity, better film layer quality, real-time monitoring of film thickness, and high precision.

[0264] A3: forming the optical layer 3 on the side surface of the buffer layer 2 away from the substrate 1.

[0265] In some examples, the optical layer 3 can be deposited on the side surface of the buffer layer 2 away from the substrate 1 by a physical vapor deposition (PVD) process. For example, a shielding jig is placed above a coating source, and the vacuum degree in the coating chamber is adjusted to 5x10 -3 The niobium oxide and the magnesium fluoride are deposited layer by layer. The deposition conditions of the niobium oxide are as follows: the electron beam is directed to the crucible site containing the niobium oxide film material, the electron beam power is turned on at 75%, 20 sccm of oxygen is filled into the coating chamber, the crucible site shutter is opened, and the niobium oxide is uniformly deposited at a rate of 0.2 nm / s for a certain time until the target sub-layer thickness is reached. The deposition conditions of the magnesium fluoride are as follows: the electron beam is directed to the crucible site containing the magnesium fluoride film material, the electron beam power is turned on at 70%, the oxygen flow is adjusted to 15 sccm, the crucible site shutter is opened, and the magnesium fluoride is uniformly deposited at a rate of 0.3 nm / s for a certain time until the target sub-layer thickness is reached. For example, the above-mentioned layer-by-layer deposition process is as follows: the niobium oxide is deposited for 455 s, the magnesium fluoride is deposited for 127 s, the niobium oxide is deposited for 485 s, the magnesium fluoride is deposited for 143 s, the niobium oxide is deposited for 475 s, the magnesium fluoride is deposited for 107 s, and the niobium oxide is deposited for 440 s.

[0266] When the buffer layer 2 and the optical layer 3 are both formed by a physical vapor deposition (PVD) process, the optical layer 3 can be completed in the same device as the buffer layer 2, which can reduce the loss of defective products during material transfer, thereby improving the yield of the coated product 10 and reducing the cost of the production equipment.

[0267] A4: After the deposition of the optical layer 3 is completed, the gas flux is turned off, air is introduced into the coating chamber, and when the coating chamber is at atmospheric pressure, the hatch is opened and the coated product 10 is removed.

[0268] The preparation method of the coated product 10 in the embodiment S2 includes the following steps:

[0269] A1: providing a substrate 1.

[0270] The substrate 1 is cleaned. Taking the thickness h1 of the substrate 1 as 0.55 mm, the planar size of the substrate 1 as 73 mm x 160 mm, and the material of the substrate 1 including chemically strengthened glass as an example, the steps of cleaning the substrate 1 are as follows: the substrate 1 is placed on the conveying rollers of a horizontal cleaning line to pass through a neutral cleaning agent brushing tank (for example, the tank liquid temperature is 50°C), a weak alkali cleaning agent brushing tank (for example, the pH value is 12), and at least one (for example, two) pure water brushing tank in sequence at a predetermined speed (for example, 50 mm / min), so as to achieve the preliminary cleaning of the substrate 1.

[0271] The substrate 1 after the initial cleaning is placed on a jig of a vacuum coating machine and is placed in a designated position in the coating machine. The chamber door is closed, the vacuum pump is turned on, and the vacuum degree in the coating chamber is reduced to 3x10 -3 Pa. After the vacuum degree is reduced, argon gas with a flow rate of 60 sccm is filled into the machine, and the turret is opened. After the gas is stabilized, the ion source (with an average energy of 800 eV) is turned on to perform ion cleaning on the surface of the substrate 1 for a preset time (for example, 160 s).

[0272] A2: A buffer layer 2 is formed on at least part of the surface of the substrate 1.

[0273] In some examples, the buffer layer 2 can be deposited on at least part of the surface of the substrate 1 by a physical vapor deposition (PVD) process. For example, after the ion cleaning of the substrate 1 is completed, the ion source is turned off, the argon gas filling is stopped, and the vacuum degree in the coating chamber is increased to 5x10 -3 Pa. The electron beam is aimed at the crucible site containing the film material for forming the buffer layer 2, the electron beam power is turned on at 4%, the evaporation rate of the buffer layer 2 is 0.3 nm / s, and the coating time is 800 s.

[0274] A3: An optical layer 3 is formed on the side surface of the buffer layer 2 away from the substrate 1.

[0275] In some examples, the optical layer 3 can be deposited on the side surface of the buffer layer 2 away from the substrate 1 by a physical vapor deposition (PVD) process. For example, a shielding jig is placed above the coating source, the vacuum degree in the coating chamber is increased to 5x10 -3 Pa, and niobium oxide and silicon oxide are deposited layer by layer. The niobium oxide deposition conditions are: the electron beam is aimed at the crucible site containing the niobium oxide film material, the electron beam power is turned on at 75%, the oxygen flow rate in the chamber is adjusted to 20 sccm, the crucible site shutter is opened, and the niobium oxide is uniformly deposited at a rate of 0.2 nm / s for a certain time until the target sublayer thickness is reached. The silicon oxide deposition conditions are: the electron beam is aimed at the crucible site containing the silicon oxide film material, the electron beam power is turned on at 70%, the oxygen flow rate is adjusted to 15 sccm, the crucible site shutter is opened, and the silicon oxide is uniformly deposited at a rate of 0.3 nm / s for a certain time until the target sublayer thickness is reached. For example, the above-mentioned layer-by-layer deposition process is: niobium oxide is deposited for 445 s, silicon oxide is deposited for 130 s, niobium oxide is deposited for 465 s, silicon oxide is deposited for 167 s, niobium oxide is deposited for 460 s, silicon oxide is deposited for 117 s, and niobium oxide is deposited for 435 s.

[0276] A4: After the deposition of the optical layer 3 is completed, the gas flow is turned off, air is introduced into the coating chamber, and when the coating chamber is at atmospheric pressure, the chamber door is opened and the coated product 10 is taken out.

[0277] The above merely provides the specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto, and any person skilled in the art can easily think of the changes or replacements within the technical range disclosed by the present disclosure, which should be covered within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope of the claims.

Claims

1. A film-coated article, comprising: a substrate (1) ; a buffer layer (2) on at least part of a surface of one side of the substrate (1) ; and an optical layer (3) on a surface of one side of the buffer layer (2) away from the substrate (1) ; the optical layer (3) comprises at least one first sub-layer (31) and at least one second sub-layer (32), the first sub-layer (31) and the second sub-layer (32) are alternately stacked; the refractive index of the first sub-layer (31) is greater than the refractive index of the second sub-layer (32) ; the optical layer (3) further comprises a maximum thickness region and a minimum thickness region; wherein the thickness of the buffer layer (2) is positively correlated with a first preset total thickness and a second preset total thickness; the first preset total thickness is the thickness of the buffer layer (2) required for the maximum thickness region of the optical layer (3), and the first preset total thickness is obtained at least according to the maximum thickness of the optical layer (3) ; the second preset total thickness is the thickness of the buffer layer (2) required for the minimum thickness region of the optical layer (3), and the second preset total thickness is obtained at least according to the minimum thickness of the optical layer (3).

2. The coated article of claim 1, wherein, The first preset total thickness is the sum of a first preset thickness and a second preset thickness, and the second preset total thickness is the sum of a third preset thickness and a fourth preset thickness; The first preset thickness is the thickness of the buffer layer (2) required for all the first sub-layers (31) in the maximum thickness region of the optical layer (3), and the first preset thickness is obtained at least according to the thickness of the first sub-layer (31) in the maximum thickness region of the optical layer (3) ; The second preset thickness is the thickness of the buffer layer (2) required for all the second sub-layers (32) in the maximum thickness region of the optical layer (3), and the second preset thickness is obtained at least according to the thickness of the second sub-layer (32) in the maximum thickness region of the optical layer (3) ; The third preset thickness is the thickness of the buffer layer (2) required for all the first sub-layers (31) in the minimum thickness region of the optical layer (3), and the third preset thickness is obtained at least according to the thickness of the first sub-layer (31) in the minimum thickness region of the optical layer (3) ; The fourth preset thickness is the thickness of the buffer layer (2) required for all the second sub-layers (32) in the minimum thickness region of the optical layer (3), and the fourth preset thickness is obtained at least according to the thickness of the second sub-layer (32) in the minimum thickness region of the optical layer (3).

3. The coated article of claim 2, wherein, The film-coated article satisfies at least one of the following: The optical layer (3) comprises at least one first sub-layer (31) of a material; the first preset thickness is positively correlated with the sum of the thickness of all the first sub-layers (31) of each material in the maximum thickness region of the optical layer (3), and the third preset thickness is positively correlated with the sum of the thickness of all the first sub-layers (31) of each material in the minimum thickness region of the optical layer (3) ; or The optical layer (3) comprises at least one second sub-layer (32) of material; the first preset thickness and the third preset thickness are positively related to the sum of the thicknesses of all the second sub-layers (32) of each material in the maximum thickness region of the optical layer (3); and the second preset thickness and the fourth preset thickness are positively related to the sum of the thicknesses of all the second sub-layers (32) of each material in the minimum thickness region of the optical layer (3).

4. The coated article of claim 2, wherein, The first preset thickness and the third preset thickness are further obtained according to the elastic modulus of the buffer layer (2), the elastic modulus of the substrate (1), and the elastic modulus of the first sub-layer (31). The second preset thickness and the fourth preset thickness are further obtained according to the elastic modulus of the buffer layer (2), the elastic modulus of the substrate (1), and the elastic modulus of the second sub-layer (32). The first preset thickness, the second preset thickness, the third preset thickness, and the fourth preset thickness are all negatively related to the Poisson's ratio of the substrate (1). The first preset thickness, the second preset thickness, the third preset thickness, and the fourth preset thickness are all positively related to the Poisson's ratio of the buffer layer (2). The first preset thickness and the third preset thickness are both positively related to the Poisson's ratio of the first sub-layer (31). The second preset thickness and the fourth preset thickness are both positively related to the Poisson's ratio of the second sub-layer (32).

5. The coated article of claim 2, wherein, The first preset thickness and the third preset thickness are further obtained according to the Poisson's ratio of the buffer layer (2), the Poisson's ratio of the substrate (1), and the Poisson's ratio of the first sub-layer (31). The second preset thickness and the fourth preset thickness are further obtained according to the Poisson's ratio of the buffer layer (2), the Poisson's ratio of the substrate (1), and the Poisson's ratio of the second sub-layer (32). The first preset thickness, the second preset thickness, the third preset thickness, and the fourth preset thickness are all negatively related to the Poisson's ratio of the substrate (1). The first preset thickness, the second preset thickness, the third preset thickness, and the fourth preset thickness are all positively related to the Poisson's ratio of the buffer layer (2). The first preset thickness and the third preset thickness are both positively related to the Poisson's ratio of the first sub-layer (31). The second preset thickness and the fourth preset thickness are both positively related to the Poisson's ratio of the second sub-layer (32).

6. The coated article of any of claims 1-5, wherein, The thickness of the buffer layer (2) is uniform.

7. The coated article of any of claims 1-6, wherein, The thickness of the buffer layer (2) is less than or equal to 1000 nm.

8. The coated article of any of claims 1-7, wherein, The elastic modulus of the buffer layer (2) is 1 Gpa-30 Gpa.

9. The coated article of any of claims 1-8, wherein, The buffer layer (2) is colorless and transparent.

10. The coated article of any of claims 1-9, wherein, The difference between the refractive index of the buffer layer (2) and the refractive index of the substrate (1) is less than or equal to 0.

1.

11. The coated article of any of claims 1-10, wherein, The material of the buffer layer (2) comprises silicon-containing organic matter. The film product (10) further comprises a transition layer (4) between the substrate (1) and the buffer layer (2); the material of the transition layer (4) comprises silicon elements. The content of silicon elements in the transition layer (4) is higher than the content of silicon elements in the substrate (1).

12. The coated article of claim 11, wherein, The difference between the silicon content in the transition layer (4) and the silicon content in the substrate (1) is greater than or equal to 10%.

13. The coated article of any of claims 1-10, wherein, When a steel ball with a diameter of 20 mm and a mass of 31 g to 33 g is used to perform a ball drop test on the coated article (10), the height at which the coated article (10) breaks is greater than 50 cm.

14. A coated article, comprising: a substrate (1); a buffer layer (2) on at least part of a surface of one side of the substrate (1); and an optical layer (3) on a surface of one side of the buffer layer (2) away from the substrate (1); the optical layer (3) comprises at least one first sub-layer (31) and at least one second sub-layer (32), the first sub-layer (31) and the second sub-layer (32) are alternately stacked; the refractive index of the first sub-layer (31) is greater than the refractive index of the second sub-layer (32); wherein the thickness of the buffer layer (2) increases with the increase of the thickness of the optical layer (3).

15. The coated article of claim 14, wherein, The optical layer (3) comprises a plurality of thickness regions, the thickness of the optical layer (3) in different thickness regions of the plurality of thickness regions is different; The thickness of the buffer layer (2) corresponding to the different thickness regions is positively correlated with the sum of a fifth preset thickness and a sixth preset thickness; The fifth preset thickness is the thickness of the buffer layer (2) required by all first sub-layers (31) in a thickness region of the plurality of thickness regions, and the fifth preset thickness is obtained at least according to the thickness of the first sub-layer (31) in the thickness region of the plurality of thickness regions; The sixth preset thickness is the thickness of the buffer layer (2) required by all second sub-layers (32) in a thickness region of the plurality of thickness regions, and the sixth preset thickness is obtained at least according to the thickness of the second sub-layer (32) in the thickness region of the plurality of thickness regions.

16. The coated article of claim 15, wherein, The coated article satisfies at least one of the following: The optical layer (3) comprises at least one first sub-layer (31) of a material; the fifth preset thickness is positively correlated with the sum of the thickness of all first sub-layers (31) of each material in a thickness region of the plurality of thickness regions; or The optical layer (3) comprises at least one second sub-layer (32) of a material; the sixth preset thickness is positively correlated with the sum of the thickness of all second sub-layers (32) of each material in a thickness region of the plurality of thickness regions.

17. The coated article of claim 15, wherein, The fifth preset thickness is also obtained according to the elastic modulus of the buffer layer (2), the elastic modulus of the substrate (1), and the elastic modulus of the first sub-layer (31); The sixth preset thickness is also obtained according to the elastic modulus of the buffer layer (2), the elastic modulus of the substrate (1), and the elastic modulus of the second sub-layer (32); Wherein, the fifth preset thickness and the sixth preset thickness are negatively correlated with the elastic modulus of the substrate (1); The fifth preset thickness and the sixth preset thickness are positively correlated with the elastic modulus of the buffer layer (2); The fifth preset thickness is positively correlated with the elastic modulus of the first sub-layer (31); The sixth preset thickness is positively correlated with the elastic modulus of the second sub-layer (32). The sixth preset thickness is positively related to the elastic modulus of the second sub-layer (32).

18. The coated article of claim 15, wherein, The fifth preset thickness is further obtained according to the Poisson's ratios of the buffer layer (2), the substrate (1) and the first sub-layer (31); The sixth preset thickness is further obtained according to the Poisson's ratios of the buffer layer (2), the substrate (1) and the second sub-layer (32); The fifth preset thickness and the sixth preset thickness are negatively related to the Poisson's ratio of the substrate (1); The fifth preset thickness and the sixth preset thickness are positively related to the Poisson's ratio of the buffer layer (2); The fifth preset thickness is positively related to the Poisson's ratio of the first sub-layer (31); The sixth preset thickness is positively related to the Poisson's ratio of the second sub-layer (32).

19. A housing comprising the film-covered article (10) according to any one of claims 1 to 18.

20. An electronic device comprising a display panel (200) and a housing (100) according to claim 19, the display panel (200) and the housing (100) being arranged in a stacked manner.

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