Carrying apparatus, wafer transfer apparatus, and semiconductor processing device

Abstract

The present application relates to the technical field of semiconductors, and discloses a carrying apparatus, a wafer transfer apparatus, and a semiconductor processing device. The carrying apparatus comprises a base, multiple carrying trays, and multiple carrying rings disposed corresponding one-to-one with the multiple carrying trays. The carrying trays are rotatably disposed on the base, and upper surfaces of the carrying trays are provided with multiple wafer placement regions. The carrying rings overlap on the corresponding carrying trays, and the carrying rings are provided with multiple wafer carrying regions corresponding one-to-one with the multiple wafer placement regions on the corresponding carrying trays. The wafer carrying regions are used to carry wafers after the carrying rings are separated from the carrying trays, and the wafer placement regions are used to carry the wafers when the carrying rings overlap on the carrying trays. The base is provided with a transfer channel, used to receive a wafer transfer apparatus when the carrying rings of the wafer transfer apparatus are lowered, so that the carrying rings overlap on the corresponding carrying trays. Outer peripheral walls of the carrying trays are each provided with a first location structure, and the first location structures and the wafer transfer apparatus can have a location fit with each other in a rotation direction of the carrying trays.

Description

Bearing device, wafer conveying device and semiconductor process equipment TECHNICAL FIELD

[0001] The present application belongs to the technical field of semiconductor, and particularly relates to a bearing device, a wafer conveying device and a semiconductor process equipment. BACKGROUND

[0002] In the technical field of semiconductor, a wafer conveying device such as a robot is needed to transfer a wafer into a process chamber of a semiconductor process equipment or to remove the wafer from the process chamber. Specifically, the wafer conveying device conveys a bearing disc carrying a wafer, the wafer is placed on the bearing disc, the wafer conveying device transports the bearing disc to a susceptor in the process chamber, and after the wafer is processed, the wafer conveying device transports the bearing disc carrying the wafer out of the process chamber.

[0003] In the related art, in order to improve the conveying efficiency and the processing efficiency, each bearing disc carries multiple wafers at the same time. However, since the bearing disc drives the wafers to rotate relative to the susceptor by means of air suspension during the process, when the bearing disc is replaced with wafers outside the process chamber, the position of each wafer placed on the bearing disc is uncertain, and the wafer can only be manually controlled by a suction member or the like to be adsorbed, so as to be placed on the bearing disc or separated from the bearing disc. This results in that the whole transfer process needs manual participation, and the automation degree is low. In addition, the environment for manually taking and placing the wafer is difficult to control, which easily increases the number of particles of the wafer and affects the process effect. Moreover, the manual taking and placing of the wafer needs to build a special environment, which increases the cost of the semiconductor process equipment. SUMMARY

[0004] The purpose of the embodiments of the present application is to provide a bearing device, a wafer conveying device and a semiconductor process equipment, which can solve the problem of poor process effect caused by manual participation in taking and placing wafers in the related art.

[0005] In a first aspect, the embodiments of the present application provide a bearing device, comprising: a susceptor, a plurality of bearing discs and a plurality of bearing rings corresponding to the plurality of bearing discs one by one.

[0006] The plurality of bearing discs are rotatably arranged on the susceptor, and the upper surfaces of the bearing discs are each provided with a plurality of wafer placement areas.

[0007] The bearing ring is lapped on the corresponding bearing disc, and the bearing ring is provided with a plurality of wafer carrying areas corresponding to the plurality of wafer placement areas on the corresponding bearing disc one by one.

[0008] The wafer carrying area is used to carry the wafer after the bearing ring is separated from the bearing disc, and the wafer placement area is used to carry the wafer when the bearing ring is lapped on the bearing disc.

[0009] The base is provided with a transmission channel for avoiding the wafer transmission device when the wafer transmission device carries the carrier ring to be lowered to make the carrier ring lap on the corresponding carrier disc;

[0010] The outer peripheral wall of the carrier disc is provided with a first limiting structure, which is used for limiting cooperation with the wafer transmission device in the rotating direction of the carrier disc when the wafer transmission device transmits the carrier ring to the upper side of the carrier disc.

[0011] In a second aspect, the embodiments of the present application further provide a wafer transmission device for transmitting a carrier ring carrying wafers, the wafer transmission device is provided with a second limiting structure,

[0012] The second limiting structure is used for limiting cooperation with the carrier disc in the rotating direction of the carrier disc when the wafer transmission device transmits the carrier ring to the upper side of the carrier disc.

[0013] In a third aspect, the embodiments of the present application further provide a semiconductor process equipment, which comprises the above-mentioned carrier device and the above-mentioned wafer transmission device.

[0014] In the embodiments of the present application, the carrier ring has a plurality of wafer carrying areas, so the carrier ring can place a plurality of wafers at the same time, and then the wafer transmission device can be used to transmit the carrier ring carrying a plurality of wafers, and when the wafer transmission device transmits the carrier ring to the upper side of the carrier disc, since the carrier disc and the wafer transmission device can be limited by the first limiting structure, even if the position of the wafer placed on the carrier disc is uncertain, the rotation of the carrier disc is limited by the first limiting structure, which can fix the relative position of the carrier disc and the carrier ring, so as to determine the placement position of the wafer, and then the plurality of wafers carried by the carrier ring can accurately fall on the plurality of wafer placement areas on the carrier disc. In this way, the process of manually placing wafers is not needed, the human labor is avoided, the automation degree is improved, and the manual control of taking and placing wafers is avoided, which is beneficial to reducing the number of particles of the wafer, improving the process effect, and also does not need to build a special environment, which is beneficial to reducing the cost of the semiconductor process equipment. BRIEF DESCRIPTION OF DRAWINGS

[0015] Fig. 1 is a schematic view of the cooperation of the process chamber, the wafer transmission device and the carrier ring disclosed by the embodiments of the present application;

[0016] Fig. 2 is a partial sectional view of the internal structure of the process chamber disclosed by the embodiments of the present application;

[0017] Fig. 3 is a schematic view of the cooperation of the wafer transmission device and the carrier disc disclosed by the embodiments of the present application;

[0018] Fig. 4 is a partial schematic view of the cooperation structure of the wafer transmission device and the carrier disc disclosed by the embodiments of the present application;

[0019] Fig. 5 is a partial schematic view of the wafer conveying device and the cooperation structure of the carrier disc from another perspective according to an embodiment of the present application;

[0020] Fig. 6 is a schematic view of the cooperation of the wafer conveying device, the carrier disc and the carrier ring according to an embodiment of the present application;

[0021] Fig. 7 is a schematic view of the structure of the carrier ring according to an embodiment of the present application;

[0022] Fig. 8 is a schematic view of the structure of the wafer separating device according to an embodiment of the present application;

[0023] Fig. 9 is a schematic view of the assembly of the carrier ring and the wafer separating device according to an embodiment of the present application.

[0024] Legend: 100 - base, 110 - first support shaft, 200 - carrier disc, 210 - wafer placement area, 220 - limiting protrusion, 230 - third positioning structure, 231 - first groove, 300 - carrier ring, 310 - wafer carrying area, 320 - first positioning structure, 330 - second positioning structure, 331 - first protruding strip, 340 - step structure, 400 - wafer conveying device, 410 - limiting groove, 411 - first groove wall surface, 412 - second groove wall surface, 420 - lifting part, 500 - wafer separating device, 510 - fourth positioning structure, 511 - second groove, 520 - second support shaft, 530 - thimble, 600 - pressure detecting element, 710 - inner covering assembly, 720 - outer covering assembly, 721 - conveying channel, 800 - wafer. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present application will be clearly described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present application.

[0026] The terms "first", "second", and the like in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than that illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally of a kind and are not limited in number, for example, the first object can be one or more. In addition, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / ", generally indicates that the front and rear associated objects are in an "or" relationship.

[0027] The semiconductor process equipment provided by the embodiments of the present application will be described in detail below in combination with the drawings, specific embodiments and application scenarios thereof.

[0028] Please refer to FIGS. 1-9, the bearing device disclosed by the embodiments of the present application comprises a base 100, a plurality of bearing discs 200 and a plurality of bearing rings 300, wherein the base 100 serves as the mounting basis of the plurality of bearing discs 200, and the base 100 can drive the plurality of bearing discs 200 to rotate; the bearing disc 200 and the bearing ring 300 are respectively used for bearing a plurality of wafers 800.

[0029] Referring to FIG. 2, the plurality of bearing discs 200 are respectively rotatably arranged on the base 100. In some embodiments, the base 100 is provided with a first support shaft 110, which can be a positioning pin. The bottom of each bearing disc 200 is provided with a shaft hole, and the first support shaft 110 can extend into the shaft hole. When the bearing disc 200 is rotated relative to the base 100 in a gas suspension manner, the first support shaft 110 can realize the rotation of the bearing disc 200 relative to the base 100 about the axis of the first support shaft 110. Referring to FIG. 1, the upper surface of each bearing disc 200 is provided with a plurality of wafer placing areas 210, and each wafer placing area 210 places one wafer 800, so that the plurality of wafers 800 can be placed on the bearing disc 200 at the same time. In some embodiments, the plurality of wafer placing areas 210 are distributed at intervals in the circumferential direction of the bearing disc 200, and in the process of rotating the bearing disc 200, the positions of the wafers 800 borne by each wafer placing area 210 are uniformly processed, which is beneficial to improving the process effect.

[0030] The plurality of bearing rings 300 are arranged in one-to-one correspondence with the plurality of bearing discs 200, and the bearing ring 300 is lapped on the corresponding bearing disc 200. The bearing ring 300 is provided with a plurality of wafer bearing areas 310, and the plurality of wafer bearing areas 310 correspond one-to-one to the plurality of wafer placing areas 210 on the corresponding bearing disc 200. Each wafer bearing area 310 bears one wafer 800, that is, the bearing ring 300 can also bear a plurality of wafers 800 at the same time. The number of wafer bearing areas 310 of the bearing ring 300 is equal to the number of wafer placing areas 210 of the bearing disc 200, and the plurality of wafers 800 borne by the bearing ring 300 are sequentially arranged on each wafer placing area 210 on the corresponding bearing disc 200.

[0031] The wafer bearing area 310 is used to bear the wafer 800 after the bearing ring 300 is separated from the bearing disc 200, and the wafer placing area 210 is used to bear the wafer 800 when the bearing ring 300 is lapped on the bearing disc 200. Specifically, in the process that the bearing ring 300 bearing the wafer 800 is located above the bearing disc 200 and the wafer transport device 400 drives the bearing ring 300 to descend, the wafer 800 is first stopped from descending under the restriction of the bearing disc 200, that is, the wafer 800 is first separated from the wafer bearing area 310 and falls on the wafer placing area 210, and then the bearing ring 300 is lapped on the bearing disc 200.

[0032] In some embodiments, the bearing ring 300 is provided with a plurality of circular holes for accommodating the wafer 800, the circular holes form the wafer bearing area 310, the aperture of the circular hole corresponding to the aperture of the upper surface of the bearing ring 300 is larger than the diameter of the wafer 800, and the aperture of the circular hole corresponding to the aperture of the lower surface of the bearing ring 300 is smaller than the diameter of the wafer 800, so that the wafer 800 can be placed in the circular hole. In one embodiment, the number of the bearing ring 300 and the bearing disc 200 is five, each bearing ring 300 is provided with three wafer bearing areas 310, and each bearing disc 200 is also provided with three wafer placing areas 210.

[0033] In some embodiments, as shown in FIG. 7, the edge of the bearing ring 300 is provided with a stepped structure 340, the stepped structure 340 is limited in the vertical direction with the wafer transport device 400, so that the wafer transport device 400 drives the bearing ring 300 to ascend or descend through the stepped structure 340, thereby making the bearing ring 300 lap on the bearing disc 200 or separate from the bearing disc 200.

[0034] As shown in FIG. 1, the base 100 is provided with a transmission channel 721, which is used to avoid the wafer transport device 400 in specific cases, specifically, when the wafer transport device 400 bearing the bearing ring 300 descends to make the bearing ring 300 lap on the corresponding bearing disc 200, to ensure the descending stroke of the wafer transport device 400 and the bearing ring 300, and to ensure that the bearing ring 300 can be smoothly lapped on the bearing disc 200. Specifically, the number of the transmission channel 721 can be set according to the structure of the wafer transport device 400, in this application, the wafer transport device 400 has two lifting parts 420, which are used to lift the edge of the bearing ring 300, and each bearing disc 200 corresponds to two transmission channels 721, which are used to accommodate the two lifting parts 420 when the wafer transport device 400 takes or places the wafer 800, that is, the number of the transmission channel 721 is twice the number of the bearing disc 200. Of course, when the wafer transport device 400 has other structures, each bearing disc 200 can also correspond to one or more than two transmission channels 721.

[0035] Referring to FIGS. 3 and 5, the outer peripheral wall of the carrier disk 200 is provided with a first limiting structure, which is used for limiting cooperation with the wafer transfer device 400 in the rotation direction of the carrier disk 200 when the wafer transfer device 400 transfers the carrier ring 300 to the upper side of the carrier disk 200. In some embodiments, the first limiting structure can be a protrusion or a limiting groove, and in general, it can limit cooperation with the wafer transfer device 400 in the rotation direction of the carrier disk 200, and the specific structure of the first limiting structure is not limited in the embodiments of the present application.

[0036] In the embodiments of the present application, the carrier ring 300 has a plurality of wafer carrying areas 310, so that the carrier ring 300 can place a plurality of wafers 800 at the same time, and then the wafer transfer device 400 can be used to transfer the carrier ring 300 carrying a plurality of wafers 800, and when the wafer transfer device 400 transfers the carrier ring 300 to the upper side of the carrier disk 200, since the carrier disk 200 and the wafer transfer device 400 can be limited by the first limiting structure, even if the position of the wafer 800 placed on the carrier disk 200 is uncertain, the rotation of the carrier disk 200 is limited by the first limiting structure, so that the relative position of the carrier disk 200 and the carrier ring 300 is fixed, thereby determining the placement position of the wafer 800, and then the plurality of wafers 800 carried by the carrier ring 300 can accurately fall on the plurality of wafer placement areas 210 on the carrier disk 200.

[0037] In this way, the process of manually placing the wafer 800 is not required, the labor participation is avoided, the automation degree is improved, and the manual control of taking and placing the wafer 800 is avoided, which is beneficial to reduce the particle number of the wafer 800, improve the process effect, and also does not need to build a special environment, which is beneficial to reduce the cost of the semiconductor process equipment.

[0038] In some embodiments, referring to FIG. 5, the first limiting structure is a limiting protrusion 220, which is used for extending into the limiting groove 410 of the wafer transfer device 400 to limit cooperation with the groove wall surface of the limiting groove 410 in the rotation direction of the carrier disk 200. In some embodiments, the limiting protrusion 220 can be a triangular structure or other shaped structure, and the structure of the limiting protrusion 220 is not limited in the embodiments of the present application.

[0039] It should be noted that the process chamber of the semiconductor process equipment drives the carrier disk 200 to rotate relative to the base 100 by using the air suspension principle, the weight of the limiting protrusion 220 is less than 1% of the total weight of the carrier disk 200 and the carrier ring 300, so as to avoid affecting the dynamic balance state of the air suspension process by the limiting protrusion 220.

[0040] By using the limiting protrusion 220, the bearing disc 200 and the wafer conveying device 400 are limited and matched, the protrusion structure is directly arranged on the outer peripheral wall of the bearing disc 200, and the bearing disc 200 does not need to be separately provided with a complex limiting structure, which is beneficial to simplify the structure of the limiting and matching.

[0041] In some embodiments, the surface of the limiting protrusion 220 and the bearing disc 200 are transitionally connected through the first arc structure, that is, the limiting protrusion 220 and the bearing disc 200 are transitionally connected through the first arc surface. In this way, the limiting protrusion 220 and the structure in which the limiting protrusion 220 is arranged are smoothly connected, and the process of the limiting protrusion 220 being stuck in the limiting groove 410 due to the too sharp connection is avoided.

[0042] Of course, in other embodiments, the limiting protrusion 220 is directly arranged on the edge of the bearing disc 200, and the limiting protrusion 220 and the bearing disc 200 can not be transitionally connected through the first arc structure.

[0043] In some embodiments, as shown in FIG. 6, the edge of the bearing ring 300 is provided with a first positioning structure 320, and the first positioning structure 320 is used for positioning the position of the bearing ring 300 relative to the wafer conveying device 400. Further, in some embodiments, the first positioning structure 320 can be a protrusion structure, for example, protruding relative to the upper surface of the bearing ring 300. The protrusion structure can be a triangular protrusion, the corner of which needs to be rounded, or other shapes of protrusion structures. Further, in some embodiments, the bearing ring 300 has three wafer bearing areas 310, the center of the protrusion structure, the center of one of the wafer bearing areas 310, and the center of the bearing ring 300 are on the same straight line; or, the first positioning structure 320 can also be a scale line, of course, the first positioning structure 320 can also be other structures.

[0044] The first positioning structure 320 is set as a zero position in the embodiment, and by aligning the first positioning structure 320 with a certain position or other structure of the wafer conveying device 400, the relative position of the bearing ring 300 and the wafer conveying device 400 is ensured to be accurate, and deviation of the relative position of the bearing ring 300 and the wafer conveying device 400 when the wafer conveying device 400 conveys the bearing ring 300 is avoided.

[0045] Of course, in other embodiments, the bearing ring 300 can not be provided with the first positioning structure 320, and the center of the wafer bearing area 310 of the bearing ring 300 can be used as a positioning point, so that the center of the wafer bearing area 310 is aligned with a certain position or other structure of the wafer conveying device 400 to determine the relative position of the bearing ring 300 and the wafer conveying device 400.

[0046] In the scheme of the present application, the carrier ring 300 is provided with a second positioning structure 330, and the carrier disc 200 is provided with a third positioning structure 230. When the carrier ring 300 is overlapped on the corresponding carrier disc 200, and the carrier disc 200 is in a rotating state, the second positioning structure 330 and the third positioning structure 230 are positioned and matched. In some embodiments, one of the second positioning structure 330 and the third positioning structure 230 is a first protrusion, and the other is a first slot. The first protrusion and the first slot are the same in shape and size. Specifically, the second positioning structure 330 is the first protrusion, and the third positioning structure 230 is the first slot, or the second positioning structure 330 is the first slot, and the third positioning structure 230 is the first protrusion. When the carrier ring 300 is overlapped on the corresponding carrier disc 200, and the carrier disc 200 is in a rotating state, the first protrusion can be inserted into the first slot, so as to relatively fix the carrier ring 300 and the carrier disc 200.

[0047] By using the present embodiment, the relative position of the carrier ring 300 and the carrier disc 200 is ensured to be accurate through the positioning and matching of the second positioning structure 330 and the third positioning structure 230. The position of the carrier ring 300 is avoided from being deviated in the process of the wafer transfer device 400 transferring the carrier ring 300, thereby facilitating the wafer 800 of the carrier ring 300 to be accurately dropped on the wafer placing area 210.

[0048] Of course, in other embodiments, the carrier ring 300 can not be provided with the second positioning structure 330, and the carrier disc 200 can not be provided with the third positioning structure 230. The wafer transfer device 400 drives the carrier ring 300 to be accurately placed on the carrier disc 200.

[0049] In some embodiments, referring to FIGS. 3 and 7, one of the second positioning structure 330 and the third positioning structure 230 is a first protrusion 331, and the other is a first groove 231. The first protrusion 331 and the first groove 231 are substantially the same in shape and size. The first protrusion 331 and the first groove 231 both extend along the radial direction of the carrier disc 200. When the carrier ring 300 is overlapped on the corresponding carrier disc 200, and the carrier disc 200 is in a rotating state, the first protrusion 331 is inserted into the first groove 231. Specifically, the carrier ring 300 is provided with the first protrusion 331, and the carrier disc 200 is provided with the first groove 231, or the carrier ring 300 is provided with the first groove 231, and the carrier disc 200 is provided with the first protrusion 331.

[0050] The relative position of the carrier ring 300 and the carrier disk 200 is determined by the cooperation of the first protrusions 331 and the first grooves 231, which ensures the accuracy of the relative position of the carrier ring 300 and the carrier disk 200. Moreover, the first protrusions 331 and the first grooves 231 extend along the radial direction of the carrier disk 200, so the first protrusions 331 and the first grooves 231 can limit the relative position of the carrier ring 300 and the carrier disk 200 at various positions in the radial direction of the carrier disk 200, further improving the accuracy of the relative position of the carrier ring 300 and the carrier disk 200.

[0051] In an embodiment, the number of the second positioning structures 330 and the third positioning structures 230 is one. Further, in some embodiments, the number of the first protrusions 331 and the first grooves 231 is one.

[0052] In another embodiment, the number of the second positioning structures 330 and the third positioning structures 230 is at least two, and the second positioning structures 330 and the third positioning structures 230 are one-to-one corresponding. The at least two second positioning structures 330 are distributed along the circumferential direction of the carrier ring 300, and the at least two third positioning structures 230 are distributed along the circumferential direction of the carrier disk 200. In some embodiments, the number of the first protrusions 331 and the first grooves 231 is at least two, and the first protrusions 331 and the first grooves 231 are one-to-one corresponding.

[0053] By the cooperation of the at least two second positioning structures 330 and the at least two third positioning structures 230, the relative position of the carrier ring 300 and the carrier disk 200 can be limited at various positions in the circumferential direction of the carrier disk 200, further improving the accuracy of the relative position of the carrier ring 300 and the carrier disk 200.

[0054] In some embodiments, referring to FIG. 1, the first end of the transmission channel 721 extends to the edge of the base 100, and the second end of the transmission channel 721 extends to the position of the carrier disk 200. The transmission channel 721 is used for the partial extension of the wafer transfer device 400, so that the wafer transfer device 400 can transfer the carrier ring 300 to the upper side of the carrier disk 200 along the transmission channel 721. Further, in some embodiments, the transmission channel 721 can be a straight channel. Each carrier disk 200 corresponds to two transmission channels 721. During the process of transferring the carrier ring 300 to the position of the carrier disk 200 by the wafer transfer device 400, the two lifting parts 420 of the wafer transfer device 400 extend into the two transmission channels 721 and move along the extension direction of the two transmission channels 721, respectively.

[0055] With the embodiment, the transmission channel 721 is not only used for avoiding the wafer transmission device 400, but also used for guiding the conveying direction of the wafer transmission device 400, so that the conveying direction of the wafer transmission device 400 is guided, which is beneficial to the wafer transmission device 400 to drive the carrier ring 300 to accurately move above the carrier disk 200, and avoids the deviation of the movement direction of the wafer transmission device 400.

[0056] Of course, in other embodiments, the transmission channel 721 can adopt other shapes or structures, that is, the first end of the transmission channel 721 does not extend to the edge of the base 100, the second end of the transmission channel 721 does not extend to the position of the carrier disk 200, and the transmission channel 721 is only used for avoiding the wafer transmission device 400 when the wafer transmission device 400 carries the carrier ring 300 to descend.

[0057] The embodiment of the application also discloses a wafer transmission device 400, which is used for transmitting the carrier ring 300 carrying the wafer 800, and specifically used for transmitting the carrier ring 300 carrying the wafer 800 between the carrier disk 200 and the wafer separation device 500. In some embodiments, the wafer transmission device 400 can be a mechanical hand or other automatic transmission device.

[0058] The wafer transmission device 400 is provided with a second limiting structure, which is used for limiting cooperation with the carrier disk 200 in the rotation direction of the carrier disk 200 when the wafer transmission device 400 transmits the carrier ring 300 to above the carrier disk 200. In some embodiments, the second limiting structure is used for the first limiting structure of the carrier disk 200 to limit cooperation in the rotation direction of the carrier disk 200. The second limiting structure can be a limiting protrusion or a limiting groove 410, and can limit cooperation with the carrier disk 200 in the rotation direction of the carrier disk 200, and the specific structure of the second limiting structure is not limited in the embodiment of the application.

[0059] With the embodiment, the carrier disk 200 and the wafer transmission device 400 can realize limiting cooperation through the second limiting structure, that is, even if the position of the wafer 800 placed on the carrier disk 200 is uncertain, the carrier disk 200 is limited to rotate through the second limiting structure, so that the relative position of the carrier disk 200 and the carrier ring 300 is fixed, and the wafer 800 is accurately placed on the plurality of wafer placing areas 210 of the carrier disk 200. In this way, the process of manually placing the wafer 800 is not needed, manual participation is avoided, the degree of automation is improved, manual control of taking and placing the wafer 800 is avoided, which is beneficial to reducing the particle number of the wafer 800, improving the process effect, and does not need to build a special environment, which is beneficial to reducing the cost of the semiconductor process equipment.

[0060] In some embodiments, the second limiting structure is a limiting groove 410, which is used for the limiting protrusion 220 of the carrier disk 200 to extend into and limit the rotation of the carrier disk 200 in the rotation direction. When the limiting protrusion 220 and the limiting groove 410 limit the rotation of the carrier disk 200 in the rotation direction, the limiting protrusion 220 extends into the limiting groove 410, and the limiting protrusion 220 and the groove wall of the limiting groove 410 limit each other. In some embodiments, the limiting groove 410 can be a triangular structure, or can be a groove of other shapes, and the embodiments of the present application do not limit the structure of the limiting groove 410.

[0061] By using the limiting groove 410 to limit the rotation of the carrier disk 200 and the wafer transfer device 400, the edge of the wafer transfer device 400 is directly grooved, and the wafer transfer device 400 does not need to be provided with a complex limiting structure, which is beneficial to simplify the structure of the limiting structure.

[0062] In some embodiments, the wafer transfer device 400 has two opposite lifting portions 420, which are used to lift the edge of the carrier ring 300. The limiting groove 410 is arranged in one of the lifting portions 420, and the other lifting portion 420 is provided with a avoiding groove for avoiding the limiting protrusion 220, so as to avoid the limiting protrusion 220 from colliding with the other lifting portion 420 during the rotation of the carrier disk 200.

[0063] In some embodiments, the groove wall of the limiting groove 410 and the wafer transfer device 400 are connected through a second arc structure, that is, the groove wall of the limiting groove 410 and the wafer transfer device 400 are connected through a second arc surface. In this way, the limiting groove 410 and the structure in which the limiting groove 410 is arranged are connected smoothly, so as to avoid the limiting protrusion 220 from being stuck during the process of extending into the limiting groove 410.

[0064] Of course, in other embodiments, the wafer transfer device 400 is directly provided with the limiting groove 410, and the limiting groove 410 and the wafer transfer device 400 can not be connected through a second arc structure.

[0065] In a further embodiment, the limiting groove 410 has opposite first and second groove walls 411 and 412, the first groove wall 411 is configured to limit the limiting protrusion 220, and the limiting groove 410 is further provided with a groove opening through which the limiting protrusion 220 extends into the limiting groove 410. The distance from the second groove wall 412 to the groove opening increases in the direction in which the second groove wall 412 and the first groove wall 411 are arranged in sequence. In some embodiments, the direction in which the second groove wall 412 and the first groove wall 411 are arranged in sequence is the X direction in FIG. 5, which is parallel to the extending direction of the lifting portion 420. In some embodiments, the second groove wall 412 can be an inclined plane relative to the first groove wall 411, or a convex or concave arc surface.

[0066] In some embodiments, the limiting groove 410 is also a triangular groove, and the first groove wall 411 is connected to the second groove wall 412, and when the limiting protrusion 220 is limited by the first groove wall 411, the plane on which the first groove wall 411 is located is perpendicular to the tangent direction of the position of the limiting protrusion 220.

[0067] With the embodiment, the limiting groove 410 formed by the first groove wall 411 and the second groove wall 412 tends to be a triangular groove, the second groove wall 412 guides the extending process of the limiting protrusion 220, and ensures that the limiting protrusion 220 extends smoothly to limit the first groove wall 411 and the limiting protrusion 220, which is beneficial to reduce the opening area of the limiting groove 410 and ensure the structural stability of the wafer transfer device 400.

[0068] Of course, in other embodiments, the limiting groove 410 can be a square groove, the first groove wall 411 is connected to and perpendicular to the second groove wall 412, and the distance from the second groove wall 412 to the groove opening is constant in the direction in which the second groove wall 412 and the first groove wall 411 are arranged in sequence.

[0069] Based on the disclosed wafer carrier and wafer transfer device 400, the present embodiment further discloses a semiconductor process equipment, which includes the wafer carrier in the above embodiments and the wafer transfer device 400 in the above embodiments.

[0070] In this way, the carrier disc 200 of the carrier device is provided with the first limiting structure, and the wafer transfer device 400 is provided with the second limiting structure. When the wafer transfer device 400 transfers the carrier ring 300 to the upper side of the carrier disc 200, the carrier disc 200 and the wafer transfer device 400 are limited and matched by the first limiting structure and the second limiting structure, so as to limit the relative position of the carrier disc 200 relative to the carrier ring 300, and make the plurality of wafers 800 carried by the carrier ring 300 accurately fall on the wafer placing areas 210 on the carrier disc 200. The process of manually placing the wafers 800 is not needed, the human labor is avoided, the automation degree is improved, and the manual control of taking and placing the wafers 800 is avoided, which is beneficial to reducing the particle number of the wafers 800, improving the process effect, and also does not need to build a special environment, which is beneficial to reducing the cost of the semiconductor process equipment.

[0071] In some embodiments, the semiconductor process equipment further includes a process chamber, the process chamber serves as a place for processing the wafers 800, and provides a vacuum environment required for processing the wafers 800. The carrier device is arranged in the process chamber, and the wafer transfer device 400 can transfer the carrier ring 300 carrying the wafers 800 between the process chamber and outside the process chamber.

[0072] In some embodiments, the wafer transfer device 400 can drive the carrier ring 300 to switch between the first height position and the second height position, and the first height position is higher than the second height position. Specifically, the wafer transfer device 400 transfers the carrier ring 300 from outside the process chamber to the first height position above the carrier disc 200. When the carrier disc 200 is rotated to the case that the first limiting structure and the second limiting structure are limited and matched, the wafer transfer device 400 drives the carrier disc 200 to descend to the second height position, so as to make the plurality of wafers 800 carried by the carrier ring 300 located in the plurality of wafer placing areas 210 of the carrier disc 200, and realize the separation of the wafers 800 and the carrier ring 300.

[0073] As shown in FIG. 4, the semiconductor process equipment further includes a pressure detection element 600, and the pressure detection element 600 is arranged in one of the first limiting structure and the second limiting structure. Further, in some embodiments, the pressure detection element 600 is arranged on one of the surface of the limiting protrusion 220 and the groove wall surface of the limiting groove 410. Specifically, the pressure detection element 600 can be arranged on the surface of the limiting protrusion 220, that is, the pressure detection element 600 protrudes from the surface of the limiting protrusion 220; or the pressure detection element 600 can be arranged on the groove wall surface of the limiting groove 410, and the pressure detection element 600 protrudes from the groove wall surface of the limiting groove 410.

[0074] When the wafer transfer device 400 transfers the carrier ring 300 to above the carrier disk 200 and the carrier ring 300 is located at the second height position, the other one of the first limiting structure and the second limiting structure acts on the pressure detection element 600, so that the pressure detection element 600 bears a pressure value greater than or equal to a preset pressure value. The pressure detection element 600 can be, but is not limited to, a pressure sensor.

[0075] When the pressure value detected by the pressure detection element 600 is less than the preset pressure value, it indicates that the limiting cooperation effect of the first limiting structure and the second limiting structure is poor, or the relative position of the first limiting structure and the second limiting structure deviates, so that the pressure value of the other one of the first limiting structure and the second limiting structure acting on the pressure detection element 600 is smaller. At this time, the wafer transfer device 400 drives the carrier ring 300 to move from the second height position to the first height position, and further the wafer transfer device 400 re-drives the carrier ring 300 to descend from the first height position to the second height position, so that the first limiting structure and the second limiting structure cooperate again.

[0076] In some embodiments, the semiconductor process equipment can further include a control device, which is in communication connection with the pressure detection element 600 and the wafer transfer device 400 respectively, and controls the wafer transfer device 400 according to the pressure value detected by the pressure detection element 600.

[0077] It should be noted that the preset pressure value is the pressure value borne by the pressure detection element 600 when the limiting groove 410 and the limiting protrusion 220 normally cooperate.

[0078] By using the pressure value detected by the pressure detection element 600 to indirectly feedback the cooperation state of the first limiting structure and the second limiting structure when the carrier ring 300 is at the second height position, the wafer transfer device 400 can conveniently drive the carrier ring 300 to cooperate again when the cooperation effect of the first limiting structure and the second limiting structure is poor, so as to ensure the accurate cooperation of the wafer transfer device 400, the carrier disk 200 and the carrier ring 300.

[0079] Of course, in other embodiments, the semiconductor process equipment can not be provided with the pressure detection element 600, and the cooperation state of the first limiting structure and the second limiting structure can be fed back by other ways.

[0080] In some embodiments, as shown in FIG. 8, the semiconductor process equipment further comprises a wafer separating device 500 for separating the carrier ring 300 from the wafers 800 carried thereby. Further, in some embodiments, the wafer separating device 500 is located outside the process chamber, and the wafer separating device 500 is provided with a plurality of pin groups corresponding to the positions where the wafers 800 are placed, each pin group comprising a plurality of spaced pins 530, when the wafer transferring device 400 transfers the carrier ring 300 carrying a plurality of wafers 800 to the wafer separating device 500, in the process of lowering the wafer transferring device 400, the plurality of pin groups respectively support the plurality of wafers 800, while the carrier ring 300 continues to fall to the surface of the wafer separating device 500, so as to realize the separation of the wafers 800 from the carrier ring 300.

[0081] The wafer transferring device 400 can be rotatably arranged, and in some embodiments, the bottom of the wafer separating device 500 is provided with a second support shaft 520, and a driving mechanism such as a motor is connected to the second support shaft 520, and the driving mechanism drives the wafer separating device 500 to rotate through the second support shaft 520, so as to facilitate the sequential replacement of the wafers 800. In some embodiments, the output shaft of the motor or the like driving mechanism can be connected to the second support shaft 520 by welding or the like.

[0082] The carrier ring 300 is provided with a second positioning structure 330, and as shown in FIGS. 8 and 9, the wafer separating device 500 is provided with a fourth positioning structure 510, and in the case that the carrier ring 300 is located on the wafer separating device 500 and the wafer transferring device 400 is in a rotating state, the second positioning structure 330 and the fourth positioning structure 510 are positioned and matched.

[0083] In some embodiments, in the case that the second positioning structure 330 is a first protrusion, the fourth positioning structure 510 is a second slot, and the shape and size of the first protrusion and the second slot are the same; in the case that the second positioning structure 330 is a first slot, the fourth positioning structure 510 is a second protrusion, and the shape and size of the second protrusion and the first slot are the same, so as to relatively fix the carrier ring 300 and the wafer transferring device 400.

[0084] By adopting the embodiment, the relative position of the wafer transferring device 400 and the carrier ring 300 is ensured to be accurate through the positioning and matching of the second positioning structure 330 and the fourth positioning structure 510, so as to avoid the deviation of the position of the carrier ring 300 in the process of transferring the carrier ring 300 by the wafer transferring device 400, and further facilitate the accurate falling of the plurality of wafers 800 carried by the carrier ring 300 on the wafer separating device 500.

[0085] Of course, in other embodiments, the wafer separating device 500 can not be provided with the fourth positioning structure 510, and the carrier ring 300 is accurately placed on the wafer separating device 500 by controlling the wafer transferring device 400.

[0086] Specifically, after the wafer transport device 400 transports the wafer 800 and the carrier ring 300 completing the processing to the wafer separating device 500, the wafer separating device 500 separates the wafer 800 and the carrier ring 300, the wafer transport device 400 needs to take off the wafer 800 completing the processing and replace the wafer 800 not processing, at this time, by means of the rotating process of the wafer separating device 500, the wafer transport device 400 only needs to be located at the same position to replace the wafer 800 in turn, thus, the wafer transport device 400 does not need to move to multiple positions to replace the wafer 800.

[0087] When the wafer 800 is replaced, the wafer transport device 400 drives the carrier ring 300 to rise, the carrier ring 300 contacts the wafer 800 again, and the carrier ring 300 carries the wafer 800 to move in the rising process, the wafer transport device 400 can transport the carrier ring 300 carrying the wafer 800 to the process chamber again to further process the wafer 800.

[0088] In a further embodiment, the second positioning structure 330 is a first protrusion 331, the fourth positioning structure 510 is a second groove 511, the second groove 511 extends along the radial direction of the carrier ring 300, and the first protrusion 331 and the second groove 511 are the same in shape and size; or, the second positioning structure 330 is a first groove 231, the fourth positioning structure 510 is a second protrusion, the second protrusion extends along the radial direction of the carrier ring 300, and the first groove 231 and the second protrusion are the same in shape and size.

[0089] By means of the matched first protrusion 331 and the second groove 511, or the matched first groove 231 and the second protrusion, the relative position of the carrier ring 300 and the wafer separating device 500 is accurate, and the relative position of the carrier ring 300 and the wafer transport device 400 can be limited at each position in the radial direction of the carrier ring 300, further improving the accuracy of the relative position of the carrier ring 300 and the wafer transport device 400.

[0090] In a further embodiment, the number of the fourth positioning structure 510 is at least two, the second positioning structure 330 corresponds to the fourth positioning structure 510 one by one, and the at least two fourth positioning structures 510 are distributed along the circumferential direction of the wafer transport device 400.

[0091] By means of the at least two fourth positioning structures 510 matched with the at least two second positioning structures 330, the relative position of the carrier ring 300 and the wafer separating device 500 can be limited at each position in the circumferential direction of the wafer separating device 500, further improving the accuracy of the relative position of the carrier ring 200 and the wafer transport device 400.

[0092] In some embodiments, as shown in FIG. 1, the semiconductor processing apparatus further comprises an inner cover assembly 710 and an outer cover assembly 720, which are used to adjust the temperature field and flow field in the processing chamber, and together cover the surface of the susceptor 100 except the carrier disk 200, the inner cover assembly 710 is located inside the outer cover assembly 720, i.e. the inner cover assembly 710 is located at the center of the susceptor 100, and the outer cover assembly 720 is located at the edge of the susceptor 100, and the transmission channel 721 is arranged in the outer cover assembly 720. When the carrier ring 300 is placed on the carrier disk 200, the outer cover assembly 720, the inner cover assembly 710, the carrier ring 300 and the wafer 800 together form a reaction zone, and the process gas in the process flows through the surfaces of these structures in turn, thereby depositing a thin film on the surface of the wafer 800.

[0093] The embodiments of the present application are described above in conjunction with the drawings, but the present application is not limited to the specific embodiments described above, which are only illustrative but not restrictive, and those of ordinary skill in the art can make many forms under the inspiration of the present application without departing from the purpose of the present application and the scope protected by the claims.

Claims

1. A supporting device, characterized in that, The application relates to a wafer carrier device. The device comprises a base, a plurality of carrier discs and a plurality of carrier rings corresponding to the carrier discs; The carrier discs are rotatably arranged on the base, and the upper surfaces of the carrier discs are provided with a plurality of wafer placement areas; The carrier rings are overlapped on the corresponding carrier discs, and the carrier rings are provided with a plurality of wafer carrying areas corresponding to the wafer placement areas on the corresponding carrier discs; The wafer carrying areas are used for carrying wafers after the carrier rings are separated from the carrier discs, and the wafer placement areas are used for carrying the wafers when the carrier rings are overlapped on the carrier discs; The base is provided with a transmission channel for avoiding a wafer transmission device when the wafer transmission device is lowered to make the carrier rings overlapped on the corresponding carrier discs; The outer peripheral wall of the carrier disc is provided with a first limiting structure, and the first limiting structure is used for limiting cooperation with the wafer transmission device in the rotating direction of the carrier disc when the wafer transmission device transmits the carrier ring to the upper side of the carrier disc.

2. The load bearing device of claim 1, wherein, The first limiting structure is a limiting protrusion, and the limiting protrusion is used for extending into a limiting groove of the wafer transmission device to limit cooperation with the groove wall surface of the limiting groove in the rotating direction of the carrier disc.

3. The load bearing device of claim 2, wherein, The surface of the limiting protrusion and the carrier disc are connected through a first circular arc structure.

4. The load bearing device of claim 1, wherein, The edge of the carrier ring is provided with a first positioning structure, and the first positioning structure is used for positioning the position of the carrier ring relative to the wafer transmission device.

5. The load bearing device of claim 1, wherein, The carrier ring is provided with a second positioning structure, and the carrier disc is provided with a third positioning structure, and the second positioning structure and the third positioning structure are positioned and cooperated when the carrier ring is overlapped on the corresponding carrier disc and the carrier disc is in a rotating state.

6. The load bearing device of claim 5, wherein, One of the second positioning structure and the third positioning structure is a first convex strip, and the other is a first concave groove, and the first convex strip and the first concave groove extend along the radial direction of the carrier disc, The first convex strip extends into the first concave groove when the carrier ring is overlapped on the corresponding carrier disc and the carrier disc is in a rotating state.

7. The load bearing device of claim 5, wherein, The number of the second positioning structure and the third positioning structure is at least two, and the second positioning structure and the third positioning structure correspond to each other, at least two second positioning structures are distributed along the circumferential direction of the carrier ring, and at least two third positioning structures are distributed along the circumferential direction of the carrier disc.

8. The load bearing device of claim 1, wherein, The first end of the transmission channel extends to the edge of the base, the second end of the transmission channel extends to the position of the carrier disc, and the transmission channel is used for partially extending into the wafer transmission device, so that the wafer transmission device transmits the carrier ring to the upper side of the carrier disc along the transmission channel.

9. A wafer transfer device, comprising: The wafer transmission device is used for transmitting the carrier ring carrying the wafer, and the wafer transmission device is provided with a second limiting structure, The second limiting structure is used for limiting cooperation with the carrier disc in the rotating direction of the carrier disc when the wafer transmission device transmits the carrier ring to the upper side of the carrier disc.

10. The wafer transfer device of claim 9, wherein, The second limiting structure is a limiting groove, and the limiting groove is used for the limiting protrusion of the carrier disk to extend into the limiting groove to limit the limiting protrusion in the rotating direction of the carrier disk.

11. The wafer transfer device of claim 10, wherein, The groove wall surface of the limiting groove is connected to the wafer conveying device through a second arc structure.

12. The wafer transfer device of claim 10, wherein, The limiting groove has opposite first and second groove wall surfaces, the first groove wall surface is used for limiting cooperation with the limiting protrusion, the limiting groove is further provided with a groove opening, the groove opening is used for the limiting protrusion to extend into the limiting groove, The distance from the second groove wall surface to the groove opening increases in the direction in which the second groove wall surface and the first groove wall surface are sequentially arranged.

13. A semiconductor process apparatus, characterized by, The semiconductor process equipment comprises the carrier device and the wafer conveying device.

14. The semiconductor process apparatus according to claim 13, wherein The wafer conveying device can drive the carrier ring to switch between the first height position and the second height position, the first height position is higher than the second height position, The semiconductor process equipment further comprises a pressure detection element, the pressure detection element is arranged in one of the first limiting structure and the second limiting structure, in the case that the wafer conveying device conveys the carrier ring to above the carrier disk, and the carrier ring is located at the second height position, the other of the first limiting structure and the second limiting structure acts on the pressure detection element, In the case that the pressure value detected by the pressure detection element is less than a preset pressure value, the wafer conveying device drives the carrier ring to move from the second height position to the first height position.

15. The semiconductor process apparatus according to claim 13, wherein The semiconductor process equipment further comprises a wafer separating device, the wafer separating device is used for separating the carrier ring and the wafer carried by the carrier ring, The carrier ring is provided with a second positioning structure, and the wafer separating device is provided with a fourth positioning structure, in the case that the carrier ring is overlapped on the wafer separating device, and the wafer separating device is in a rotating state, the second positioning structure and the fourth positioning structure are positioned and cooperated.

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