Resist composition, method for forming resist pattern, fluorine-containing polymer compound, and compound

The resist composition addresses the challenge of achieving high sensitivity and improved lithography properties with reduced defects by using a resin component and fluorine-containing polymeric compound, enhancing pattern formation in semiconductor and liquid crystal display devices.

WO2026009829A1PCT designated stage Publication Date: 2026-01-08TOKYO OHKA KOGYO CO LTD
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Patent Information

Application Number
PCT/JP2025/023199
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-07-01
Filing Date
2025-06-27
Publication Date
2026-01-08

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Abstract

Provided is a resist composition that contains: a resin component (A1) for which the solubility thereof in a developing solution is changed by the action of an acid; and a fluorine-containing polymer compound (F0) having a constituent unit (f0) derived from a compound represented by general formula (f0-1). In the formula, W1 is a polymerizable group-containing group. Lf00 is an organic group having at least one hydroxyl group as a substituent group. Lf02 is a linking group having a valency of l. Rf01 is a group that includes a fluoroalcohol structure.
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Citation Information

Patent Citations

  • Compound, resin, resist composition, and method for producing resist pattern

    JP2022075557A

  • Resin composition, resin film, base material, polymer, and polymerizable monomer

    WO2022172889A1