Wearable ring device comprising antenna

Abstract

A wearable ring device comprises: a metal part that includes a ring structure having a ring shape; a non-metal part coupled to the metal part; a first PCB which is partially disposed between the ring structure and the non-metal part along the ring shape and which includes a first flexible portion extending from a first rigid portion; a support member positioned between the first flexible portion and the ring structure so as to support an inclined section so that the first flexible portion has the inclined section disposed such that the distance spaced apart from the ring structure is increased along a portion of the ring shape; a first conductive pattern of which at least a portion is positioned in the inclined section of the first flexible portion; and a wireless communication circuit for transmitting / receiving wireless signals to / from an external device through the first conductive pattern.

Description

Wearable ring device including an antenna

[0001] The present disclosure relates to a wearable ring device including an antenna.

[0002] A wearable device (or wearable electronic device) is a smart device that can be worn, such as glasses, watches, clothing, or accessories.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above-described matters constitute prior art related to the present disclosure.

[0004] Wireless communication is expanding and diversifying with the advent of wearable devices. Wearable devices are being offered in lightweight and compact forms to reduce discomfort, which can complicate the design of antennas for wireless communication.

[0005] Embodiments of the present disclosure provide a wearable ring device including an antenna capable of securing and / or improving antenna radiation performance by overcoming antenna design constraints due to miniaturization and weight reduction. Various embodiments of the present disclosure are provided to reduce variations in the antenna radiation performance of a wearable device.

[0006] The technical problems to be achieved in the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned can be understood by a person having ordinary skill in the technical field to which the present disclosure belongs from the description below.

[0007] According to various embodiments of the present disclosure, a wearable ring device is provided, the wearable ring device including a metal portion, a non-metal portion, a first PCB, a support member, a first conductive pattern, and a wireless communication circuit. The metal portion includes a ring structure having a ring shape and disposed on an outer side of the wearable ring device. The non-metal portion is disposed on an inner side of the wearable ring device and is coupled to the metal portion. The first PCB is disposed at least partially between the ring structure and the non-metal portion along the ring shape of the ring structure. The first PCB includes a first rigid portion and a first flexible portion extending from the first rigid portion. The support member is configured to support the inclined portion, the inclined portion being disposed between the first flexible portion and the ring structure such that the first flexible portion has an inclined portion disposed along a portion of the ring shape of the ring structure such that a distance apart from the ring structure increases. The first conductive pattern is positioned at least partially in the inclined portion of the first flexible portion. A wireless communication circuit is arranged on the first PCB and is configured to transmit or receive a wireless signal to or from an external device through the first conductive pattern.

[0008] A wearable ring device including an antenna according to various embodiments of the present disclosure can not only secure and / or improve antenna radiation performance by overcoming antenna design constraints, but also reduce external dielectrics or external conductors from deteriorating antenna radiation performance.

[0009] In addition, the effects that can be obtained or expected from various embodiments of the present disclosure are disclosed directly or implicitly in the detailed description of the embodiments of the present disclosure.

[0010] The above and other aspects, features, and advantages of the embodiments of the present disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings.

[0011] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments of the present disclosure.

[0012] FIG. 2 illustrates a wearable ring device worn on a user's body according to various embodiments of the present disclosure.

[0013] FIG. 3 is a perspective view of a wearable ring device according to various embodiments of the present disclosure.

[0014] FIG. 4 is a cross-sectional view of a portion of a wearable ring device according to various embodiments of the present disclosure.

[0015] FIG. 5 is a perspective view of a portion of a wearable ring device according to various embodiments of the present disclosure.

[0016] FIG. 6 is a diagram illustrating a portion of a wearable ring device according to various embodiments of the present disclosure.

[0017] FIG. 7 is a drawing showing a substrate assembly in an unfolded state according to various embodiments of the present disclosure.

[0018] FIG. 8 is a drawing showing an unfolded substrate assembly, a first adhesive member, a second adhesive member, and a support member according to various embodiments of the present disclosure.

[0019] FIG. 9 is a drawing showing a portion of a substrate assembly in an unfolded state, a first adhesive member, a second adhesive member, and a support member, according to various embodiments of the present disclosure.

[0020] FIG. 10 is a drawing showing a portion of a first printed circuit board in an unfolded state according to various embodiments of the present disclosure.

[0021] Hereinafter, various embodiments of the present disclosure will be described in more detail. The following description, with reference to the accompanying drawings, is provided to facilitate a comprehensive understanding of various embodiments of the present disclosure as defined by the claims and their equivalents. While numerous specific details are included herein to aid understanding, they are to be considered merely exemplary. Accordingly, those skilled in the art will recognize that various changes and modifications can be made to the various embodiments described herein without departing from the scope and spirit of the present disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0022] The terms and words used in the following description and claims are not limited to their bibliographic meanings, but are merely used to ensure a clear and consistent understanding of the present disclosure by the inventors. Accordingly, it should be apparent to those skilled in the art that the following description of various embodiments of the present disclosure is provided for illustrative purposes only and is not intended to limit the present disclosure as defined by the appended claims and their equivalents.

[0023] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments of the present disclosure.

[0024] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an external electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an external electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). The electronic device (101) may communicate with the external electronic device (104) via the server (108). The external electronic device (102 or 104) may include, but is not limited to, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device, for example. The electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), and / or an antenna module (197). In various embodiments of the present disclosure, at least one of these components may be omitted, or one or more other components may be added to the electronic device (101). In various embodiments of the present disclosure, some of these components may be implemented as a single integrated circuitry. For example, a sensor module (176), a camera module (180), or an antenna module (197) may be implemented embedded in one component (e.g., a display module (160)).

[0025] The processor (120) may include various processing circuits and / or multiple processors. For example, the term "processor" as used in this disclosure, including the claims, may include various processing circuits, including at least one processor, wherein one or more of the at least one processor may be individually and / or collectively configured to perform the various functions described in this disclosure in a distributed manner. When the terms "processor," "at least one processor," and "one or more processors" as used in this disclosure are described as being configured to perform a number of functions, these terms encompass, for example, without limitation, situations where one processor performs some of the recited functions and other processor(s) perform other of the recited functions, and situations where a single processor may perform all of the recited functions. Furthermore, the at least one processor may include a combination of processors that perform the various recited / disclosed functions, for example, in a distributed manner. The at least one processor may execute program instructions to achieve or perform the various functions.

[0026] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. As at least part of the data processing or operations, the processor (120) may load commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) into the volatile memory (132), process the commands or data stored in the volatile memory (132), and store the resulting data in the non-volatile memory (134). The processor (120) may include a main processor (121) (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor (123) (e.g., a graphics processing unit (GPU)), a neural processing unit (NPU)), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that can operate independently or together with the main processor (121). Additionally or alternatively, the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0027] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. The auxiliary processor (123) (e.g., an image signal processor (ISP) or a communication processor (CP)) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). According to various embodiments of the present disclosure, the auxiliary processor (123) (e.g., a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. This learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or may be performed through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include multiple artificial neural network layers.The artificial neural network may be any one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent DNN (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may additionally or alternatively include a software structure.

[0028] The memory (130) can store various data used by at least one component (e.g., a processor (120) or a sensor module (176)) of the electronic device (101). The various data can include, for example, software (e.g., a program (140)) and input data or output data for commands related thereto. The memory (130) can include a volatile memory (132) and / or a non-volatile memory (134).

[0029] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), and / or an application (146).

[0030] The input module (150) can receive commands or data to be used in other components of the electronic device (101) (e.g., the processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, but is not limited to, a microphone or a key (e.g., a button), for example.

[0031] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback, and the receiver can be used for incoming calls. The receiver can be implemented separately from the speaker or as part of the speaker.

[0032] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. The display module (160) may include a touch circuit configured to detect a touch (e.g., a touch sensor), or a sensor circuit configured to measure the intensity of a force generated by the touch (e.g., a pressure sensor).

[0033] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. The audio module (170) can acquire sound through the input module (150), or output sound through an audio output module (155), or an external electronic device (e.g., an external electronic device (102)) (e.g., a speaker or headphones) directly or wirelessly connected to the electronic device (101).

[0034] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. The sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0035] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) to an external electronic device (e.g., the external electronic device (102)). The interface (177) may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface.

[0036] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., an external electronic device (102)). The connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, and / or an audio connector (e.g., a headphone connector).

[0037] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. The haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0038] The camera module (180) can capture still images and videos. The camera module (180) may include one or more lenses, image sensors, image signal processors (ISPs), or flashes.

[0039] The power management module (188) can manage power supplied to or consumed by the electronic device (101). The power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0040] A battery (189) may power at least one component of the electronic device (101). The battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, and / or a fuel cell.

[0041] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., external electronic device (102), external electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor (AP)) and may include one or more communication processors (CPs) that support direct (e.g., wired) communication or wireless communication. The communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Of these communication modules, the corresponding communication module is a first network (198) (e.g., a short-range communication network such as BLUETOOTH, WiFi (wireless fidelity) direct, or IrDA (IR data association)) or a second network (199) (e.g., a legacy cellular network, 5G (5 thThe wireless communication module (192) can communicate with an external electronic device (104) via a wide area network (e.g., a LAN or WAN), a next generation communication network, the Internet, or a computer network (e.g., a LAN or WAN). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network, such as the first network (198) or the second network (199), using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in a subscriber identity module (SIM) (196).

[0042] The wireless communication module (192) is 4G (4 thThe wireless communication module (192) can support 5G networks and next-generation communication technologies after the 5G network, for example, new radio access technology (NR). The NR access technology can support high-speed transmission of large amounts of data (i.e., enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency communications (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., millimeter wave band) to achieve a high data transmission rate. The wireless communication module (192) may support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) may support various requirements specified in the electronic device (101), an external electronic device (e.g., an external electronic device (104)), or a network system (e.g., a second network (199)). According to various embodiments of the present disclosure, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0043] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). The antenna module (197) may include an antenna including a radiator including a conductor or a conductive pattern formed on a substrate (e.g., a printed circuit board (PCB)). The antenna module (197) may include a plurality of antennas (e.g., an antenna array). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0044] According to various embodiments of the present disclosure, the antenna module (197) may form a mmWave antenna module. According to various embodiments of the present disclosure, the mmWave antenna module may include a printed circuit board (PCB), an RFIC disposed on or adjacent to a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent to a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0045] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0046] Commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be of the same or a different type of device as the electronic device (101). All or part of the operations executed by the electronic device (101) may be executed by one or more external electronic devices among the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of executing the function or service itself or in addition, request one or more external electronic devices to execute the function or at least a part of the service. The one or more external electronic devices that receive the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result, either as is or by further processing, as at least part of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technologies may be utilized, for example. The electronic device (101) may provide an ultra-low delay service using, for example, distributed computing or mobile edge computing (MEC). In other embodiments of the present disclosure, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network.According to various embodiments of the present disclosure, an external electronic device (104) or server (108) may be included in a second network (199). The electronic device (101) may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology and IoT-related technology.

[0047] An electronic device according to various embodiments of the present disclosure may include a wearable electronic device (e.g., a wearable ring device (2) of FIGS. 2 and 3).

[0048] The various embodiments of the present disclosure and the terminology used therein are not intended to limit the technical features described in the present disclosure to specific embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly dictates otherwise. In the present disclosure, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish the corresponding component from other corresponding components and do not limit the corresponding components in any other respect (e.g., importance or order). When one element (e.g., a first component) is referred to as being “coupled” or “connected” to another element (e.g., a second component), with or without the terms “functionally” or “communicatively,” the element can be connected to the other element directly (e.g., wired), wirelessly, or through a third component.

[0049] The term "module" may include a unit implemented in hardware, software, or firmware, or any combination thereof, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or portion of such a component that performs one or more functions. For example, according to various embodiments of the present disclosure, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0050] Various embodiments of the present disclosure may be implemented as software (e.g., a program (140)) including one or more commands stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one command among the one or more commands stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one command called. The one or more commands may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, a 'non-transitory' storage medium is a tangible device, may not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0051] The methods according to various embodiments of the present disclosure may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., CD-ROM (compact disc read-only memory)) or an application store (e.g., PLAYSTORE). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0052] Each component (e.g., a module or a program) of the above-described components may comprise one or more entities. One or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the multiple components identically or similarly to those performed by the corresponding component of the multiple components prior to the integration. The operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0053] In the present disclosure, “disposed on XX” may be understood as disposed adjacent to or substantially in contact with XX, coupled to XX, or included in XX.

[0054] In the present disclosure, “located on XX” may be understood as being located adjacent to or substantially in contact with XX, coupled to XX, or included in XX.

[0055] In the present disclosure, when a first component (or region, layer, portion, etc.) is referred to as being “on,” “connected to,” or “coupled to” a second component, it can be understood that it can be directly disposed, connected, or coupled to the second component, or that a third component can be disposed therebetween.

[0056] In the present disclosure, "ZZ between XX and YY" can be understood as ZZ being positioned in substantial contact with XX or YY, or ZZ being directly bonded to XX or YY. "ZZ between XX and YY" can be understood as ZZ being positioned between XX and YY with at least one other component between XX and ZZ, and / or at least one component between YY and ZZ interposed therebetween. "ZZ between XX and YY" can be understood as at least one other component between XX and ZZ connecting XX and ZZ, and / or at least one other component between YY and ZZ connecting YY and ZZ.

[0057] In this disclosure, unless otherwise stated, "conductivity" may be understood as "electrical conductivity," and "non-conductivity" may be understood as "electrical insulation." When referring to thermal properties, "conductivity" may be understood as "thermal conductivity."

[0058] In the present disclosure, when the term "substantially" is used to define a structural part, the expression including the term "substantially" is understood or interpreted as a technical feature produced within the technical tolerances of the method used to manufacture it.

[0059] In this disclosure, the term "and / or" may be understood to include any combination of one or more of the associated configurations that may be defined.

[0060] In this disclosure, the expression "comprising" means that a particular effect or result can be achieved within a certain tolerance, and that a person skilled in the art knows how to achieve the tolerance. It should be understood that terms such as "comprising" or "having" indicate the presence of a feature, number, step, operation, component, part, or combination thereof described in this disclosure, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0061] In the drawings of the present disclosure, the shapes, thicknesses, ratios, and / or dimensions of the components are only for the effective explanation of the technical contents and are not limited to the shapes, thicknesses, ratios, and / or dimensions shown.

[0062] FIG. 2 illustrates a wearable ring device (2) worn on a user's body according to various embodiments of the present disclosure.

[0063] FIG. 3 is a perspective view of a wearable ring device (2) according to various embodiments of the present disclosure.

[0064] FIG. 4 is a cross-sectional view of a portion of a wearable ring device (2) according to various embodiments of the present disclosure (e.g., a cross-sectional view in an xy plane perpendicular to the z-coordinate axis).

[0065] FIG. 5 is a perspective view of a portion of a wearable ring device (2) according to various embodiments of the present disclosure.

[0066] FIG. 6 is a drawing showing a part of a wearable ring device (2) according to various embodiments of the present disclosure.

[0067] FIG. 7 is a drawing showing a substrate assembly (23) in an unfolded state according to various embodiments of the present disclosure.

[0068] FIG. 8 is a drawing showing a substrate assembly (23), a first adhesive member (41), a second adhesive member (42), and a support member (5) in an unfolded state according to various embodiments of the present disclosure.

[0069] FIG. 9 is a drawing showing a portion of a substrate assembly (23) in an unfolded state, a first adhesive member (41), a second adhesive member (42), and a support member (5) according to various embodiments of the present disclosure.

[0070] It is to be understood that the present disclosure encompasses and includes all combinations of the features and / or embodiments disclosed with respect to FIGS. 2, 3, 4, 5, 6, 7, 8, and 9. All combinations of the features described below with respect to FIGS. 2, 3, 4, 5, 6, 7, 8, and 9 may be considered to be encompassed by the present disclosure as specific examples.

[0071] Referring to FIGS. 2, 3, 4, 5, 6, 7, 8, and 9, a wearable ring device (referred to as a ring-type wearable electronic device) (2) is a wearable device including electrical components and can be worn on a user's finger (3). The wearable ring device (2) may be the electronic device (101) of FIG. 1 or may include at least some of the components included in the electronic device (101) of FIG. 1.

[0072] According to various embodiments, the wearable ring device (2) may include a metal part (also referred to as a metal frame) (21), a non-metal part (also referred to as a non-metal frame) (22), a substrate assembly (23), and a battery (24). The wearable ring device (2) may include a first adhesive member (41) and a second adhesive member (42). The wearable ring device (2) may include a support member (also referred to as a spacer) (5).

[0073] According to various embodiments, the metal portion (21) may be disposed at least partially on the outside of the wearable ring device (2). The metal portion (21) may provide (or form) a portion (e.g., a metal surface) of the outer surface of the wearable ring device (2). The non-metal portion (22) may be coupled to the metal portion (21) and disposed at least partially on the inside of the wearable ring device (2). The non-metal portion (22) may provide (or form) a portion (e.g., a non-metal surface) of the outer surface of the wearable ring device (2). The metal portion (21) may have a ring shape disposed in a loop shape. The metal portion (21) may include, for example, a metal ring. The non-metal portion (22) may have a ring shape disposed in a loop shape along the metal portion (21). The non-metal portion (22) may include, for example, a non-metal ring. When the wearable ring device (2) is worn on the user's finger (3), the non-metallic portion (22) can come into contact with the finger (3).

[0074] According to various embodiments, a plurality of internal components (e.g., a substrate assembly (23), a battery (24), a first adhesive member (41), a second adhesive member (42), and a support member (5)) may be positioned between the metal portion (21) and the non-metal portion (22). The plurality of internal components may not be exposed to the outside and may be supported by the metal portion (21) and the non-metal portion (22).

[0075] According to various embodiments, the non-metal portion (22) can be formed through molding. The non-metal portion (22) can be disposed on the metal portion (21) through, for example, insert injection molding. The metal portion (21) having a plurality of internal components (e.g., a substrate assembly (23), a battery (24), a first adhesive member (41), a second adhesive member (42), and a support member (5)) disposed thereon is positioned inside a mold, a non-metal (e.g., a polymer) molding liquid (e.g., a molten resin) is injected into the mold, and the injected molding liquid is cooled, and a molded product is taken out from the mold, thereby forming the non-metal portion (22) combined with the metal portion (21) and the plurality of internal components. In order to reduce the internal empty space of the wearable ring device (2), the molding liquid may be filled in the gaps between the metal portion (21) and the plurality of internal components during injection. The non-metal portion (22) formed by filling the molding liquid to reduce the internal empty space of the wearable ring device (2) may improve the durability of the wearable ring device (2). The non-metal portion (22) may stably arrange the plurality of internal components inside the wearable ring device (2), and may reduce or prevent the plurality of internal components from being damaged or deformed due to external impact or external pressure. The non-metal portion (22) may include a buffering material capable of alleviating the external impact. The non-metal portion (22) may be in close contact with the metal portion (21) and the plurality of internal components, thereby reducing or preventing external foreign substances (e.g., moisture or dust) from entering the interior of the wearable ring device (2).

[0076] According to various embodiments, the metal portion (21) and the non-metal portion (22) can serve as a heat spreader capable of diffusing or dispersing heat generated from electrical components such as the substrate assembly (23) and the battery (24). The non-metal portion (22) formed by filling the molding liquid to reduce the internal empty space of the wearable ring device (2) can improve the performance of diffusing or dispersing heat generated from the electrical components to the outer surface of the wearable ring device (2).

[0077] According to various embodiments, the metal portion (21) may include a ring structure (211) having a ring shape. The ring structure (211) may surround the reference axis (C) in a direction parallel to the reference axis (C) (also referred to as a reference line or a center line) of the wearable ring device (2) and spaced apart from the reference axis (C) in a direction parallel to the reference axis (C) (e.g., an imaginary straight line parallel to the z-coordinate axis). In various embodiments, the ring structure (211) may include a ring metal formed of a metallic material. The ring structure (211) may include a circular inner curved surface, for example, when viewed in a cross-section perpendicular to the reference axis (C) of the wearable ring device (2) (e.g., see the cross-sectional view of FIG. 4). Components such as a substrate assembly (23) and a battery (24) may be arranged or coupled to the inner curved surface of the ring structure (211). The ring structure (211) can provide (or form) a portion (e.g., a metal surface) formed by the metal portion (21) of the outer surface.

[0078] According to various embodiments, when viewed in a direction parallel to the reference axis (C), the wearable ring device (2) may be formed with a substantially constant thickness along the ring shape, but is not limited thereto, and the shape of the wearable ring device (2) may be various other than this, such as being provided in a form in which one side is relatively thicker than the other opposite side (not shown separately).

[0079] According to various embodiments, the metal portion (21) may have a ring shape, and the non-metal portion (22) may have at least one partial ring shape (not separately illustrated). In various embodiments, corresponding to the reduction of the non-metal portion (22) from a ring shape to at least one partial ring shape, the metal portion (21) may be implemented to further include a shape expanded into the reduced area.

[0080] According to various embodiments, the non-metal portion (22) may have a ring shape, and the metal portion (21) may have at least one partial ring shape (not separately illustrated). In various embodiments, corresponding to the reduction of the metal portion (21) from a ring shape to at least one partial ring shape, the non-metal portion (22) may be implemented to further include a shape expanded into the reduced area.

[0081] According to various embodiments, the substrate assembly (23) may include at least one printed circuit board and a plurality of electronic components disposed on the at least one printed circuit board. The substrate assembly (23) may include a support member or a reinforcing member (not separately shown) disposed or coupled to the at least one printed circuit board. The substrate assembly (23) may include a support member or a reinforcing member (not separately shown) disposed or coupled to at least one of the plurality of electronic components disposed on the at least one printed circuit board. In various embodiments, the substrate assembly (23) may include a first printed circuit board (PCB) (231) and a second PCB (232). The first PCB (231) may include at least a portion configured to be bendable and may extend from a first end (2301) to a second end (2302) along a portion of a ring shape of the wearable ring device (2). The second PCB (232) may include at least a portion configured to be bendable and may extend from a third end (2303) to a fourth end (2304) along a portion of the ring shape of the wearable ring device (2). The first PCB (231) and the second PCB (232) may be electrically connected. The first PCB (231) and the second PCB (232) may extend in opposite directions along the ring shape of the wearable ring device (2). The first PCB (231) may include a first connector (C1) disposed on a portion (e.g., a fourth rigid portion (R4)) that provides (or forms) the second end (2302). The second PCB (232) may include a second connector (C2) disposed on a portion (2321) that provides (or forms) the fourth end (2304). The first connector (C1) and the second connector (C2) can be electrically connected.The first end (2301) of the first PCB (231) and the third end (2303) of the second PCB (232) can face each other adjacent to each other on the battery (24) when viewed in a direction parallel to the reference axis (C) of the wearable ring device (2).

[0082] According to various embodiments, the first PCB (231) and / or the second PCB (232) may include a plurality of pattern layers including conductive patterns, and one or more non-conductive layers (e.g., insulating layers) between the plurality of pattern layers. The pattern layers may include signal line patterns (e.g., patterns of conductive lines) utilized as signal lines (also referred to as electrical paths). The pattern layers may include ground patterns utilized as ground planes.

[0083] According to various embodiments, the first PCB (231) and / or the second PCB (232) may include at least one conductive via. The at least one conductive via may be a conductive inner wall having a connecting wire disposed therein for electrically connecting conductive patterns of different pattern layers. The conductive inner wall may form a conductive hole. The at least one conductive via may electrically connect signal line patterns included in different pattern layers, for example, as part of a signal line. The at least one conductive via may electrically connect ground patterns included in different pattern layers, for example, as part of a ground region.

[0084] According to various embodiments, the first PCB (231) may include a rigid-flexible (RF) PCB. The first PCB (231) may include, for example, a first flexible portion (F1), a second flexible portion (F2), a third flexible portion (F3), a fourth flexible portion (F4), a first rigid portion (R1), a second rigid portion (R2), a third rigid portion (R3), and / or a fourth rigid portion (R4). The first rigid portion (R1), the second rigid portion (R2), the third rigid portion (R3), and the fourth rigid portion (R4) may be substantially flat. The first flexible portion (F1) may extend from the first rigid portion (R1). The first flexible portion (F1) can provide a first end (2301) of the first PCB (231). The second flexible portion (F2) can extend the first rigid portion (R1) and the second rigid portion (R2) and physically and electrically connect the first rigid portion (R1) and the second rigid portion (R2). The third flexible portion (F3) can extend the second rigid portion (R2) and the third rigid portion (R3) and physically and electrically connect the second rigid portion (R2) and the third rigid portion (R3). The fourth flexible portion (F4) extends the third rigid portion (R3) and the fourth rigid portion (R4), and can physically and electrically connect the third rigid portion (R3) and the fourth rigid portion (R4). The fourth rigid portion (R4) can provide a second end (2302) of the first PCB (231). The first connector (C1) can be arranged on the fourth rigid portion (R4). The first PCB (231) can be arranged along a portion of the ring shape of the wearable ring device (2) through the bending of the first flexible portion (F1), the second flexible portion (F2), the third flexible portion (F3), and the fourth flexible portion (F4).The number of rigid parts and flexible parts included in the first PCB (231) is not limited to the example shown.

[0085] According to various embodiments, the first rigid portion (R1), the second rigid portion (R2), and the third rigid portion (R3) of the first PCB (231) may be disposed, fixed, or coupled to the metal portion (21). The metal portion (21) may be configured, for example, to stably place or fit the first rigid portion (R1), the second rigid portion (R2), and the third rigid portion (R3) to the metal portion (21). In various embodiments, the first rigid portion (R1), the second rigid portion (R2), and / or the third rigid portion (R3) may be coupled to the metal portion (21) via an adhesive material (or adhesive material) (not shown separately) disposed between the first PCB (231) and the metal portion (21) (e.g., a ring structure (211)). In various embodiments, the first rigid portion (R1), the second rigid portion (R2), and / or the third rigid portion (R3) may be coupled to the metal portion (21) via a mechanical fastening (not shown) such as a screw fastening or a snap-fit ​​fastening. The snap-fit ​​fastening is, for example, a fastening structure that resiliently couples interlocking elements of the first PCB (231) and the metal portion (21). The second flexible portion (F2) may be arranged to be bent corresponding to the relative positions between the first rigid portion (R1) and the second rigid portion (R2). The third flexible portion (F3) may be arranged to be bent corresponding to the relative positions between the second rigid portion (R2) and the third rigid portion (R3). The fourth flexible portion (F4) can be bent and arranged corresponding to the relative position between the third rigid portion (R3) and the first connector (C1).

[0086] According to various embodiments, with reference to FIGS. 5 and 6, the metal portion (21) may include a first support portion (212) and / or a second support portion (213). The first support portion (212) may extend from the ring structure (211) and be arranged at least partially along the ring shape of the ring structure (211). The first support portion (212) may include, for example, a first support wall that is perpendicular to the reference axis (C) of the wearable ring device (2) from the ring structure (211). The second support portion (213) may extend from the ring structure (211) and be arranged at least partially along the ring shape of the ring structure (211). The second support portion (213) may include, for example, a second support wall that is perpendicular to the reference axis (C) of the wearable ring device (2) from the ring structure (211). The first support portion (212) and the second support portion (213) may overlap at least partially in a direction parallel to the reference axis (C) of the wearable ring device (2). The first support portion (212) and the second support portion (213) may be positioned at least partially spaced apart from each other in a direction parallel to the reference axis (C) of the wearable ring device (2). The first support portion (212) and the second support portion (213) may not be exposed to the outside of the wearable ring device (2) and may increase the bonding strength with the metal portion (21) and the non-metal portion (22). When forming the non-metal portion (22) through molding, the molding liquid may be disposed so that the non-metal portion (22) may have a form in which it is bonded or fastened with the first support portion (212) and the second support portion (213).

[0087] According to various embodiments, the first PCB (231) may be positioned at least partially between the first support portion (212) and the second support portion (213) of the metal portion (21). The first support portion (212) and the second support portion (213) may support the first PCB (231) together with the ring structure (211) of the metal portion (21).

[0088] According to various embodiments, the metal portion (21) may be configured to guide or designate positions at which the first rigid portion (R1), the second rigid portion (R2), and the third rigid portion (R3) of the first PCB (231) are arranged on the metal portion (21). For example, the first rigid portion (R1) may include a first protrusion (also referred to as a first guide protrusion) (P1) (see FIGS. 5 and 8), and the first support portion (212) may include a first notch (also referred to as a first groove, a first fixing groove, or a first fastening groove) (not shown separately) configured to fit the first protrusion (P1). For example, the first rigid portion (R1) may include a second protrusion (also referred to as a second guide protrusion) (P2) (see FIGS. 8 and 9), and the second support portion (213) may include a second notch (also referred to as a second groove, a second fixing groove, or a second fastening groove) (not shown separately) configured to fit the second protrusion (P2). By arranging the first protrusion (P1) of the first rigid portion (R1) in the first notch of the first support portion (212), and arranging the second protrusion of the first rigid portion (R1) in the second notch of the second support portion (213), the first rigid portion (R1) may be arranged or fixed at the first position of the metal portion (21). In substantially the same manner as the first rigid portion (R1) is arranged at the first position of the metal portion (21), the second rigid portion (R2) of the first PCB (231) can be arranged at the second position of the metal portion (21), and the third rigid portion (R3) of the first PCB (231) can be arranged at the third position of the metal portion (21).

[0089] According to various embodiments, the wearable ring device (2) may include one or more first electronic components (301) (see FIGS. 4, 5, 6, 8, and 9) disposed on a first rigid portion (R1) of a first PCB (231). The wearable ring device (2) may include one or more second electronic components (302) (see FIGS. 4, 6, and 8) disposed on a second rigid portion (R2) of the first PCB (231). The wearable ring device (2) may include one or more third electronic components (303) (see FIGS. 4, 6, and 8) disposed on a third rigid portion (R3) of the first PCB (231).

[0090] According to various embodiments, one or more first electronic components (301) (see FIGS. 4, 5, 6, 8, and 9) may include a first sensor, and the first sensor may be aligned with a first transparent member disposed in a first hole (221) of the non-metal portion (22). When the wearable ring device (2) is worn on a user's finger (3), the first sensor may be directed toward the user's finger (3) through the first transparent member. In various embodiments, one or more second electronic components (302) (see FIGS. 4, 6, and 8) may include a second sensor, and the second sensor may be aligned with a second transparent member disposed in a second hole (222) of the non-metal portion (22). When the wearable ring device (2) is worn on the user's finger (3), the second sensor may be directed toward the user's finger (3) through the second transparent member. In various embodiments, one or more third electronic components (303) (see FIGS. 4, 6, and 8) may include a third sensor, and the third sensor may be aligned with a third transparent member disposed in the third hole (223) of the non-metal portion (22). When the wearable ring device (2) is worn on the user's finger (3), the third sensor may be directed toward the user's finger (3) through the third transparent member. In various embodiments, the wearable ring device (2) may be configured to determine whether the wearable ring device (2) is worn on the user's finger (3) through the first sensor, the second sensor, or the third sensor. In various embodiments, the wearable ring device (2) may be configured to acquire biometric data such as body temperature, heart rate, or blood flow through the first sensor, the second sensor, or the third sensor.

[0091] According to various embodiments, the wearable ring device (2) may include a display (not shown separately) electrically connected to the first PCB (231). The display may be, for example, positioned in an opening included in a ring structure (211) of the metal portion (21), or may be arranged or coupled to the metal portion (21) so as to be visible to the outside through the opening. In various embodiments, the display may be provided in the form of a film and may be arranged on the ring structure (211) so as to be visible to the outside. The wearable ring device (2) may include various other functional elements.

[0092] According to various embodiments, the first PCB (231) may include a first conductive pattern (6) (see FIG. 7) configured to operate as an antenna radiator. The first conductive pattern (6) may be at least partially positioned on a first flexible portion (F1) (see FIGS. 4, 6, 8, and 9) of the first PCB (231). A wireless communication circuit (not shown separately) disposed on the first PCB (231) may provide (or power) an electromagnetic signal (or, a wireless signal, a radio frequency (RF) signal, or a radiated current) of a frequency band designated by the first conductive pattern (6). The wireless communication circuit may include, for example, a wireless communication module (192) of FIG. 1. The wireless communication circuit may include, for example, a communication processor (CP) of FIG. 1.

[0093] According to various embodiments, a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) may be configured to transmit and / or receive a signal of a designated frequency band via a first conductive pattern (6) positioned at least partially on a first flexible portion (F1) of a first PCB (231). In various embodiments, the designated frequency band may be for short-range communication such as Bluetooth, Bluetooth low energy (BLE), WiFi direct, or IrDA. In various embodiments, the designated frequency band may include a low band (LB) (about 600 MHz (megahertz) to about 1 GHz (gigahertz), a middle band (MB) (about 1 GHz to about 2.3 GHz), a high band (HB) (about 2.3 GHz to about 2.7 GHz), or an ultra-high band (UHB) (about 2.7 GHz to about 6 GHz). The designated frequency band may include various other frequency bands.

[0094] According to various embodiments, the wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) may be disposed on the second rigid portion (R2) of the first PCB (231) (see FIGS. 4, 6, 8, and 9). Without being limited thereto, the wireless communication circuit may be disposed on the first rigid portion (R1) or the third rigid portion (R3) of the first PCB (231).

[0095] According to various embodiments, a first conductive pattern (6) positioned at least partially on a first flexible portion (F1) of a first PCB (231) may be configured to operate as a planar inverted F antenna (PIFA). The first conductive pattern (6) may include a feeding point (also referred to as a feeding portion) (e.g., a feeding point (FP) in FIG. 10) and a ground point (also referred to as a ground portion) (GP) (e.g., a ground point (GP) in FIG. 10). The feeding point of the first conductive pattern (6) may be configured to receive (or be fed) an electromagnetic signal from a wireless communication circuit disposed on the first PCB (231). The ground point of the first conductive pattern (6) may be electrically connected to a first ground area (e.g., a first ground area (G1) in FIG. 10) included in the first PCB (231). When a wireless communication circuit provides (or feeds) an electromagnetic signal to a feeding point of a first conductive pattern (6), a current path (also referred to as a signal path) through which a current (also referred to as a radiated current) flows through the first conductive pattern (6) between the feeding point and the ground point can be formed. The distribution of the current along the current path can form an electromagnetic field (or magnetic field distribution) through the first conductive pattern (6). The first conductive pattern (6) located at least partially on the first flexible portion (F1) of the first PCB (231) is not limited to a PIFA and can be configured to operate as various antennas (or antenna radiators), such as a monopole antenna or a loop antenna.

[0096] According to various embodiments, the power supply point (e.g., the power supply point (FP) of FIG. 10) of the first conductive pattern (6) may be located in the first rigid portion (R1) of the first PCB (231). Without being limited thereto, the power supply point of the first conductive pattern (6) may also be located in the first flexible portion (F1) of the first PCB (231).

[0097] According to various embodiments, the grounding point of the first conductive pattern (6) (e.g., the grounding point (GP) of FIG. 10) may be located at the first rigid portion (R1) of the first PCB (231). Without being limited thereto, the grounding point of the first conductive pattern (6) may be located at the first flexible portion (F1) of the first PCB (231).

[0098] According to various embodiments, when radiating (e.g., transmitting or receiving) an electromagnetic wave through the first conductive pattern (6) at least partially positioned on the first flexible portion (F1), the first flexible portion (F1) may be positioned at least partially spaced apart from the metal portion (21) (or the ring structure (211) of the metal portion (21)) when viewed in a direction parallel to the reference axis (C) of the wearable ring device (2), so as to reduce degradation of the antenna radiation performance (also referred to as radio wave transmission / reception performance or communication performance) and / or degradation of the coverage (also referred to as communication range) for the first conductive pattern (6). In various embodiments, the metal portion (21) may be configured to be in an electrically floating state that is electrically isolated from other conductive portions included in the wearable ring device (2). Since the metal portion (21) in an electrically floating state can deteriorate the antenna radiation performance and / or coverage for the first conductive pattern (6) at least partially positioned on the first flexible portion (F1), in order to reduce the electromagnetic influence (e.g., electromagnetic interference (EMI)) of the metal portion (21) on the first conductive pattern (6), at least a portion of the first flexible portion (F1) can be positioned apart from the metal portion (21) (or the ring structure (211) of the metal portion (21)) when viewed in a direction parallel to the reference axis (C) of the wearable ring device (2). In order to have a designated degree of isolation that can secure the antenna radiation performance and / or coverage, the first flexible portion (F1) and the metal portion (21) (or the ring structure (211) of the metal portion (21)) when viewed in a direction parallel to the reference axis (C) of the wearable ring device (2) A gap between structures (211)) can be formed.

[0099] According to various embodiments, the metal portion (21) may be electrically connected to a first ground area (e.g., the first ground area (G1) of FIG. 10) included in the first PCB (231). The metal portion (21) may be electrically connected to the first ground area, for example, through at least one flexible conductive member (not separately illustrated) disposed between the metal portion (21) and the first ground area. At least one flexible conductive member may include, for example, a conductive clip (e.g., a metal structure including a resilient structure, a pogo-pin, a conductive spring, a conductive poron, a conductive rubber, a conductive tape, or a conductive connector). The metal portion (21) may be electrically connected to the first ground region, for example, via at least one conductive adhesive member (or conductive bonding member) disposed between the metal portion (21) and the first ground region. In various embodiments, when a wireless communication circuit supplies an electromagnetic signal to the first conductive pattern (6) at least partially positioned on the first flexible portion (F1) of the first PCB (231), an electromagnetic field (also called a radiating field) capable of transmitting and / or receiving a signal in a designated frequency band may be generated (or formed) via electromagnetic coupling between the first conductive pattern (6) and the metal portion (21).

[0100] According to various embodiments, the first flexible portion (F1) of the first PCB (231) may include a partial ground area. The partial ground area may be a part of the first ground area of ​​the first PCB (231) (e.g., the first ground area (G1) of FIG. 10). The first conductive pattern (6) positioned at least partially on the first flexible portion (F1) may be positioned at least partially between the metal portion (21) and the partial ground area of ​​the first flexible portion (F1). In various embodiments, the partial ground area of ​​the first flexible portion (F1) may be electrically connected to the metal portion (21) via an electrical connection member, such as a flexible conductive member or a conductive adhesive member (or a conductive bonding member). When an electromagnetic signal is supplied to a first conductive pattern (6) at least partially positioned on a first flexible portion (F1), energy (also called electromagnetic wave energy or wave energy) of a designated frequency band can be substantially or relatively concentrated between a partial ground area of ​​the first flexible portion (F1) and a metal portion (21). The substantial or relatively large concentration of electromagnetic wave energy between a partial ground area of ​​the first flexible portion (F1) and a metal portion (21) can reduce an external dielectric (e.g., a user's body) or an external conductor around the wearable ring device (2) from degrading the antenna radiation performance. When the electromagnetic signal is supplied, the electromagnetic wave energy is substantially or relatively concentrated between the partial ground area of ​​the first flexible portion (F1) and the metal portion (21), which can reduce the deterioration of the antenna radiation performance by the finger (3) fitted into the wearable ring device (2) and the dielectric around the wearable ring device (2) (e.g., another part of the hand) while the wearable ring device (2) is worn by the user.

[0101] According to various embodiments, the second PCB (232) may include a flexible printed circuit board (FPCB). The first connector (C1) and the second connector (C2) may be positioned between the fourth rigid portion (R4) of the first PCB (231) and a portion (2321) of the second PCB (232) on which the second connector (C2) is disposed (see FIG. 4). The portion (2321) of the second PCB (232) on which the second connector (C2) is disposed may be disposed or coupled to the metal portion (21). The portion (2321) of the second PCB (232) on which the second connector (C2) is disposed may be coupled to the metal portion (21) via, for example, an adhesive member (or adhesive member) (not separately illustrated). A portion (2321) of the second PCB (232) on which the second connector (C2) is arranged can be joined to the metal portion (21) through a mechanical fastening (not shown separately), such as a screw fastening or a snap fit fastening, for example.

[0102] According to various embodiments, the second PCB (232) may include at least one second conductive pattern (7) (see FIG. 7) configured to operate as an antenna radiator. The at least one second conductive pattern (7) may include a coil (also called a coil-shaped conductive pattern or a spiral conductive pattern) extending from a first end to a second end and including a plurality of turns (e.g., a coil in a planar shape or a pattern coil).

[0103] According to various embodiments, at least one second conductive pattern (7) included in the second PCB (232) may be electrically connected to a power receiving circuit (not shown separately) disposed on the first PCB (231). The power receiving circuit may include, for example, a wireless charging circuit configured to wirelessly receive power from an external electronic device or wirelessly transmit power to an external electronic device through the at least one second conductive pattern (7). The power receiving circuit may include a power management module (e.g., the power management module (188) of FIG. 1). The power receiving circuit may include, for example, a power management integrated circuit (PMIC) or a charger integrated circuit (IC). The power receiving circuit may charge the battery (24) using power wirelessly received through the at least one second conductive pattern (7).

[0104] According to various embodiments, the power receiving circuit arranged on the first PCB (231) may provide an electromagnetic induction method. For example, when a magnetic field flowing in an antenna radiator (e.g., a coil) of an external electronic device is applied to at least one second conductive pattern (7) included in the second PCB (232), an induced current may flow through the at least one second conductive pattern (7). The power receiving circuit may use this induced current to provide power to a load of the wearable ring device (2) (e.g., charging a battery (24)). The electromagnetic induction type power receiving circuit may follow, for example, the WPC (Wireless Power Consortium) standard. In various embodiments, the electromagnetic induction type power receiving circuit according to the WPC standard may wirelessly receive power from an external electronic device through a frequency band of about 110 kHz (kilohertz) to about 205 kHz. The power receiving circuit using electromagnetic induction may, for example, follow the near field communication (NFC) forum standard. In various embodiments, the power receiving circuit using electromagnetic induction according to the NFC forum standard may wirelessly receive power from an external electronic device via a frequency band of about 13553 kHz to about 13567 kHz (e.g., the frequency band of NFC). The power receiving circuit using electromagnetic induction may, for example, follow the power matter alliance (PMA) standard. The power receiving circuit using electromagnetic induction according to the PMA standard may wirelessly receive power from an external electronic device via a frequency band of about 227 kHz to about 357 kHz, or a frequency band of about 118 kHz to about 153 kHz.

[0105] According to various embodiments, at least one second conductive pattern (7) included in the second PCB (232) may be electrically connected to a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) disposed on the first PCB (231). A first end of the at least one second conductive pattern (7) may be electrically connected to the wireless communication circuit via a first power supply path. A second end of the at least one second conductive pattern (7) may be electrically connected to the wireless communication circuit via a second power supply path. The first power supply path may include a combination of one or more conductive paths (or conductors or conductive structures) between the first end of the at least one second conductive pattern (7) and the wireless communication circuit. The second power supply path may include a combination of one or more conductive paths (or conductors or conductive structures) between the second end of the at least one second conductive pattern (7) and the wireless communication circuit. A wireless communication circuit arranged on a first PCB (231) can provide a first power supply and a second power supply to at least one second conductive pattern (7) included in a second PCB (232). The wireless communication circuit can provide the first power supply to a first end of at least one second conductive pattern (7) of the second PCB (232) via a first power supply path. The wireless communication circuit can provide the second power supply to a second end of at least one second conductive pattern (7) of the second PCB (232) via a second power supply path. Voltages (also referred to as power supply voltages or power supply signals) (+ voltage and - voltage) of opposite polarities can be provided to at least one second conductive pattern (7) of the second PCB (232) via the first power supply and the second power supply.For example, a + voltage may be provided to a first end of at least one second conductive pattern (7) of the second PCB (232) by the first feed, and a - voltage may be provided to a second end of at least one second conductive pattern (7) of the second PCB (232) by the second feed. For example, a - voltage may be provided to a first end of at least one second conductive pattern (7) of the second PCB (232) by the first feed, and a + voltage may be provided to a second end of at least one second conductive pattern (7) of the second PCB (232) by the second feed. The feeding of + voltage and - voltage from the wireless communication circuit can be understood as 'differential feeding'. When + voltage and - voltage are supplied from the wireless communication circuit arranged on the first PCB (231), a current path (also called a signal path or loop) through which a current (also called a radiation current) flows through the at least one second conductive pattern (7) may be formed due to a potential difference between the first end and the second end of the at least one second conductive pattern (7) of the second PCB (232). The distribution of the current along the current path may form an electromagnetic field (or magnetic field distribution) through the at least one second conductive pattern (7).

[0106] According to various embodiments, a first end of at least one second conductive pattern (7) included in the second PCB (232) may be electrically connected to a wireless communication circuit disposed on the first PCB (231) via a power supply path. A second end of at least one second conductive pattern (7) included in the second PCB (232) may be electrically connected to a first ground area (e.g., the first ground area (G1) of FIG. 10) included in the first PCB (231) via a ground path. The wireless communication circuit disposed on the first PCB (231) may provide power to the first end of at least one second conductive pattern (7) of the second PCB (232) via the power supply path. When power is supplied from a wireless communication circuit, a current path (also called a signal path or loop) through which a current (also called a radiated current) flows through the at least one second conductive pattern (7) may be formed due to a potential difference between the first end and the second end of the at least one second conductive pattern (7) of the second PCB (232). The distribution of the current along the current path may form an electromagnetic field (or magnetic field distribution) through the at least one second conductive pattern (7).

[0107] According to various embodiments, the wireless communication circuit disposed on the first PCB (231) may be configured to transmit and / or receive a signal in the NFC band via an electromagnetic field radiated (or formed or generated) through at least one second conductive pattern (7) included in the second PCB (232). The signal in the NFC band may have a frequency in a frequency band of, for example, about 13553 kHz to about 13567 kHz.

[0108] According to various embodiments, at least one second conductive pattern (7) included in the second PCB (232) may be used not only as an antenna radiator for wireless communication for NFC, but also as an antenna radiator for wireless charging. In various embodiments, an electromagnetic induction type power receiving circuit according to the NFC forum standard may be configured to wirelessly receive power from an external electronic device in an NFC band (e.g., about 13553 kHz to about 13567 kHz) through at least one second conductive pattern (7). The at least one second conductive pattern (7) may be defined as, for example, an antenna radiator for NFC wireless charging.

[0109] According to various embodiments, the wireless communication circuit arranged on the first PCB (231) may be configured to transmit and / or receive a magnetic secure transmission (MST) signal via an electromagnetic field radiated (or formed or generated) through at least one second conductive pattern (7) included in the second PCB (232). The MST signal may have, for example, a frequency of about 200 kHz or less (e.g., about 70 kHz). MST is a technology for wirelessly transmitting and receiving card information (also called magnetic card information) via a magnetic field. When a wearable ring device (2) containing card information is placed against a card payment terminal, the card payment terminal can read the card information and make a payment.

[0110] According to various embodiments, the substrate assembly (23) may include at least one of a plurality of electronic components arranged on the first PCB (231) and / or the second PCB (232) including a matching circuit (not shown separately). The matching circuit may include, for example, an electrical element having components such as inductance, capacitance, or conductance. The matching circuit may include various elements such as, for example, a lumped element or a passive element. The matching circuit may shift, for example, a resonant frequency of a first conductive pattern (6) positioned at least partially on a first flexible portion (F1) of the first PCB (231) or a resonant frequency of at least one second conductive pattern (7) included in the second PCB (232) to a specified frequency or shift it by a specified amount. The matching circuit can perform impedance matching, for example, with respect to a first conductive pattern (6) at least partially positioned on a first flexible portion (F1) of a first PCB (231), or with respect to at least one second conductive pattern (7) included in a second PCB (232). The matching circuit can substantially match an impedance of a first electrical path (e.g., a first transmission line or a first feed line) electrically connecting, for example, a wireless communication circuit and the first conductive pattern (6) at least partially positioned on the first flexible portion (F1) of the first PCB (231), and an impedance of the first conductive pattern (6). The impedance matching can reduce the amount of reflection at the connection between the first electrical path and the first conductive pattern (6), thereby reducing degradation of antenna radiation performance.The matching circuit can substantially match the impedance of a second electrical path (e.g., a second transmission line or a second feed line) electrically connecting, for example, a wireless communication circuit (or a power receiving circuit) and at least one second conductive pattern (7) included in a second PCB (232) and the impedance of the at least one second conductive pattern (7). The impedance matching can reduce the amount of reflection at the connection between the second electrical path and the at least one second conductive pattern (7), thereby reducing degradation of antenna radiation performance.

[0111] According to various embodiments, the second PCB (232) may be omitted, and the first PCB (231) may be provided (or formed) as an integrated or single PCB (not shown separately) that further includes a portion that replaces the second PCB (232). In this case, the first connector (C1) and the second connector (C2) may be omitted, and the first PCB (231) may further include an additional flexible portion that includes at least one second conductive pattern (7).

[0112] According to various embodiments, the battery (24) (see FIGS. 4, 5, and 6) may be disposed inside the wearable ring device (2) and may be disposed along a portion of the ring shape of the wearable ring device (2). The battery (24) may be provided (or formed) in a curved shape that follows a portion of the ring shape. In various embodiments, the battery (24) may be coupled to the ring structure (211) of the metal portion (21) via a third adhesive member (or bonding member) (43) (see FIG. 4) disposed between the battery (24) and the metal portion (21). The battery (24) may be electrically connected to the first PCB (231) via an electrical connection member (not shown separately), such as a flexible printed circuit board (FPCB) or a cable. The battery (24) may supply power to a plurality of electrical elements included in the wearable ring device (2). The battery (24) may include, for example, a rechargeable secondary battery.

[0113] According to various embodiments, the battery (24) may include a first portion (241) (see FIG. 4) disposed between a first flexible portion (F1) of a first PCB (231) and a metal portion (21). The battery (24) may include a second portion (242) (see FIG. 4) disposed between a second PCB (232) and the metal portion (21). The first portion (241) and the second portion (242) may not overlap each other in a direction parallel to the reference axis (C) of the wearable ring device (2). The first flexible portion (F1) of the first PCB (231) may not be disposed between the second PCB (232) and the battery (24), and the second PCB (232) may not be disposed between the first flexible portion (F1) and the battery (24).

[0114] According to various embodiments, with reference to FIGS. 8 and 9, the first flexible portion (F1) of the first PCB (231) may include a first region (F11), a second region (F12), and a third region (F13). The first region (F11) may provide a first end (2301) of the first PCB (231). The second region (F12) may be a portion of the first flexible portion (F1) extending from the first rigid portion (R1) of the first PCB (231). The third region (F13) may extend between the first region (F11) and the second region (F12).

[0115] According to various embodiments, the first region (F11) of the first flexible portion (F1) may be disposed in the battery (24). The first portion (241) of the battery (24) may be disposed between the first region (F11) and the ring structure (211) of the metal portion (21). The first region (F11) may be spaced apart from the ring structure (211) of the metal portion (21) with the first portion (241) of the battery (24) interposed therebetween.

[0116] According to various embodiments, the first adhesive member (or first bonding member) (41) (see FIG. 4) may be disposed between the first area (F11) of the first flexible portion (F1) (see FIGS. 8 and 9) and the first portion (241) of the battery (24) (see FIG. 4). The first area (F11) of the first flexible portion (F1) may be disposed or coupled to the first portion (241) of the battery (24) via the first adhesive member (41). In various embodiments, the first area (F11) of the first flexible portion (F1) may be disposed in a curved shape corresponding to a curved surface of the battery (24) when viewed in a direction parallel to the reference axis (C) of the wearable ring device (2).

[0117] According to various embodiments, the first conductive pattern (6) positioned at least on the first flexible portion (F1) may extend across the third portion (F13) (see FIGS. 8 and 9) to the first portion (F11) (see FIGS. 8 and 9). Positioning the first portion (F11) on the first portion (241) of the battery (24) may facilitate the expansion of the first conductive pattern (6) while slimming down the wearable ring device (2). In various embodiments, the first flexible portion (F1) may be provided (or formed) with a thinner thickness than other flexible portions of the first PCB (231) (e.g., the second flexible portion (F2), the third flexible portion (F3), or the fourth flexible portion (F4)). In order to reduce the electromagnetic influence (e.g., EMI) of the metal portion (21) on the first conductive pattern (6), the first area (F11) of the first flexible portion (F1) including a part of the first conductive pattern (6) can be spaced apart from the ring structure (211) of the metal portion (21) with the first portion (241) of the battery (24) and the first adhesive member (41) interposed therebetween.

[0118] According to various embodiments, the first adhesive member (41) (see FIG. 4) may have a thickness of about 0.2 mm (millimeter) or less to enhance slimming of the wearable ring device (2), but is not limited thereto.

[0119] According to various embodiments, the first adhesive member (41) may include, but is not limited to, a double-sided tape.

[0120] According to various embodiments, the second adhesive member (or second bonding member) (42) (see FIG. 4) may be disposed between the second region (F12) of the first flexible portion (F1) and the ring structure (211) of the metal portion (21). The second region (F12) of the first flexible portion (F1) (see FIGS. 8 and 9) may be disposed or coupled to the ring structure (211) of the metal portion (21) via the second adhesive member (42). In various embodiments, the second adhesive member (42) may be in contact with the boundary between the first rigid portion (R1) and the first flexible portion (F1). Without being limited thereto, the second adhesive member (42) may also be positioned apart from the boundary between the first rigid portion (R1) and the first flexible portion (F1).

[0121] According to various embodiments, the second region (F12) (see FIGS. 8 and 9) of the first flexible portion (F1) including a portion of the first conductive pattern (6) may be spaced apart from the ring structure (211) of the metal portion (21) with the second adhesive member (42) interposed therebetween, so as to reduce the electromagnetic influence (e.g., EMI) of the metal portion (21) on the first conductive pattern (6).

[0122] According to various embodiments, the feeding point (e.g., the feeding point (FP) of FIG. 10) of the first conductive pattern (6) may be located in the second region (F12) (see FIGS. 8 and 9) of the first flexible portion (F1). When viewed in a direction parallel to the reference axis (C) of the wearable ring device (2), the second adhesive member (42) increases the separation distance between the feeding point of the first conductive pattern (6) and the ring structure (211) of the metal portion (21), thereby reducing the electromagnetic influence (e.g., EMI) of the metal portion (21) on the feeding point of the first conductive pattern (6).

[0123] According to various embodiments, the grounding point (e.g., the grounding point (GP) of FIG. 10) of the first conductive pattern (6) may be located in the second area (F12) (see FIGS. 8 and 9) of the first flexible portion (F1). When viewed in a direction parallel to the reference axis (C) of the wearable ring device (2), the second adhesive member (42) increases the separation distance between the grounding point of the first conductive pattern (6) and the ring structure (211) of the metal portion (21), thereby reducing the electromagnetic influence (e.g., EMI) of the metal portion (21) on the grounding point of the first conductive pattern (6).

[0124] According to various embodiments, when viewed in a direction parallel to the reference axis (C) of the wearable ring device (2) (or, when viewed in a cross-section of a plane perpendicular to the reference axis (C), the non-metal portion (22) may have a thickness of about 0.3 mm in a portion corresponding to the second adhesive member (42). In various embodiments, the second adhesive member (42) may be about 0.2 mm thinner than the thickness of the non-metal portion (22) while spacing the second region (F12) of the first flexible portion (F1) from the ring structure (211) of the metal portion (21), but is not limited thereto.

[0125] According to various embodiments, the second adhesive member (42) may include, but is not limited to, a double-sided tape.

[0126] According to various embodiments, since the first area (F11) of the first flexible portion (F1) is disposed on the first portion (241) of the battery (24) and the second area (F12) of the first flexible portion (F1) is disposed on the ring structure (211) of the metal portion (21), when viewed in a direction parallel to the reference axis (C) of the wearable ring device (2), the first area (F11) can be positioned further from the ring structure (211) of the metal portion (21) than the second area (F12). The third region (F13) of the first flexible portion (F1) can be arranged in a stable form to reduce bending stress or at least not concentrate bending stress in any one location between the first region (F11) arranged in the first portion (241) of the battery (24) and the second region (F12) arranged in the ring structure (211) of the metal portion (21).

[0127] According to various embodiments, when viewed in a direction parallel to the reference axis (C) of the wearable ring device (2), the third region (F13) (see FIGS. 8 and 9) of the first flexible portion (F1) may have a first bending portion (B1) (see FIGS. 4 and 5) and a second bending portion (B2) (see FIGS. 4 and 5) in a stable form between the first region (F11) disposed in the first portion (241) of the battery (24) and the second region (F12) disposed in the ring structure (211) of the metal portion (21). The third region (F13) may be disposed in a form that smoothly extends the first region (F11) and the second region (F12) while having the first bending portion (B1) and the second bending portion (B2). The first bending portion (B1) is positioned closer to the first region (F11) than the second bending portion (B2) and may include a first curve. The second bending portion (B2) is positioned closer to the second region (F12) than the first bending portion (B1) and may include a second curve. The second curve is formed to be convex toward the ring structure (211) of the metal portion (21), and the first curve may be bent in the opposite direction to the second curve. The first curve may be formed with a first radius of curvature, and the second curve may be formed with a second radius of curvature that is different from or substantially the same as the first radius of curvature. Since the first bending portion (B1) and the second bending portion (B2) are bent in opposite directions, a part of the third region (F13) between the first bending portion (B1) and the second bending portion (B2) may be arranged to have a section (hereinafter referred to as an inclined section (or inclined section) (I)) in which the distance from the ring structure (211) of the metal portion (21) increases when viewed in a direction parallel to the reference axis (C) of the wearable ring device (2) (see FIGS. 4 and 5).

[0128] According to various embodiments, the first conductive pattern (6) may be positioned at least partially in the inclined section (I) of the first flexible portion (F1).

[0129] According to various embodiments, referring to FIG. 8, the third region (F13) of the first flexible portion (F1) is arranged to include the first bending portion (B1), the second bending portion (B2), and the inclined section (I), thereby spacing the third region (F13) including a part of the first conductive pattern (6) apart from the ring structure (211) of the metal portion (21), thereby reducing the electromagnetic influence (e.g., EMI) that the metal portion (21) has on the first conductive pattern (6).

[0130] According to various embodiments, the first region (F11) of the first flexible portion (F1) being arranged or coupled to the first portion (241) of the battery (24) via the first adhesive member (41), and the second region (F12) of the first flexible portion (F1) being arranged or coupled to the ring structure (211) of the metal portion (21) via the second adhesive member (42) can improve the maintenance of the first flexible portion (F1) in a designated shape so as to reduce the electromagnetic influence (e.g., EMI) of the metal portion (21) on the first conductive pattern (6).

[0131] According to various embodiments, in the case of an example (not shown separately) in which the second adhesive member (42) (see FIG. 4) is omitted, a portion of the first flexible portion (F1) between the first region (F11) and the first rigid portion (R1) may be arranged in a form including a first bending portion and a second bending portion that are bent opposite to each other in a stable form between the first region (F11) and the first rigid portion (R1) disposed in the first portion (241) of the battery (24). In the case of an example in which the second adhesive member (42) is omitted, compared to embodiments of the present disclosure including the second adhesive member (42), the second bending portion may be formed to come into contact with the ring structure (211) of the metal portion (21) and be supported by the ring structure (211), or it may be difficult to increase the distance between the second bending portion and the ring structure (211). The embodiment of the present disclosure including the second adhesive member (42) can position and form the second bending member (B2) (see FIGS. 4 and 5) so as to increase the distance from the ring structure (211) of the metal portion (21), compared to the example in which the second adhesive member (42) is omitted, thereby improving the antenna radiation performance and / or coverage for the first conductive pattern (6).

[0132] According to various embodiments, with reference to FIG. 8, a support member (e.g., a spacer) (5) may be positioned between the third region (F13) of the first flexible portion (F1) and the ring structure (211) of the metal portion (21). The support member (5) may be disposed in the third region (F13) between the third region (F13) of the first flexible portion (F1) (see FIGS. 8 and 9) and the ring structure (211) of the metal portion (21). The support member (5) may be disposed or coupled to the third region (F13), for example, via an adhesive material or an adhesive material disposed between the third region (F13) and the support member (5).

[0133] According to various embodiments, with reference to FIGS. 8 and 9, the third region (F13) of the first flexible portion (F1) may include a first partial region (F131), a second partial region (F132), and a third partial region (F133). The first partial region (F131) may extend from the first region (F11) of the first flexible portion (F1). The second partial region (F132) may extend from the second region (F12) of the first flexible portion (F1). The third partial region (F133) may extend from the first partial region (F131) and the second partial region (F132). The first bending portion (B1) (see FIGS. 4 and 5) may be formed in the first partial region (F131). The second bending portion (B2) may be formed in the second partial region (F132). The inclined section (I) (see FIGS. 4 and 5) may be formed in the third partial region (F133). In various embodiments, the shape of the inclined section (I) may be determined by a support member (5) that supports the third partial region (F133). The support member (5) may be positioned between the first flexible portion (F1) and the ring structure (211) of the metal portion (21), such that the third region (F13) may have the inclined section (I) with an increasing distance from the ring structure (211) along a part of the ring shape of the ring structure (211).

[0134] According to various embodiments, the support member (5) may include a plane supporting the third partial region (F133), and the shape of the inclined section (I) may be a straight line when viewed in a direction parallel to the reference axis (C) of the wearable ring device (2).

[0135] According to various embodiments, the support member (5) may include a curved surface supporting the third partial region (F133), and the shape of the inclined section (I) may be a curved shape when viewed in a direction parallel to the reference axis (C) of the wearable ring device (2).

[0136] According to various embodiments, the support member (5) may be rectangular when viewed in cross-section in a plane perpendicular to the reference axis (C) of the wearable ring device (2). Without being limited thereto, the support member (5) may be formed in various shapes, such as a triangle, a diamond, or a curved shape (e.g., a semicircle or a semi-ellipse), taking into account the shape of the space between the third partial region (F133) and the ring structure (211) (e.g., a ring metal) of the metal portion (21), when viewed in cross-section in a plane perpendicular to the reference axis (C) of the wearable ring device (2).

[0137] According to various embodiments, when viewed in a direction parallel to the reference axis (C) of the wearable ring device (2), the maximum distance that the inclined section (I) is spaced from the ring structure (211) of the metal portion (21) may be about 0.8 mm, but is not limited thereto.

[0138] According to various embodiments, the metal portion (21) may include a third support portion (not shown separately) configured to stably support the support member (5). The third support portion may, for example, extend from a ring structure (211) of the metal portion (21). When viewed in a cross-section perpendicular to the reference axis (C) of the wearable ring device (2), the support member (5) may be positioned between the inclined section (I) of the first flexible portion (F1) and the third support portion. The third support portion may, for example, be configured to stably position or fit the support member (5).

[0139] According to various embodiments, the support member (5) can be configured to determine the position where the inclined section (I) is formed in the third partial region (F133) and the shape of the inclined section (I) so that the first bending portion (B1) and the second bending portion (B2) can be positioned with a radius of curvature that can reduce bending stress.

[0140] According to various embodiments, the first region (F11) of the first flexible portion (F1) being arranged or coupled to the first portion (241) of the battery (24) via the first adhesive member (41), the second region (F12) of the first flexible portion (F1) being arranged or coupled to the ring structure (211) of the metal portion (21) via the second adhesive member (42), and the support member (5) being arranged or coupled to the third region (F13) of the first flexible portion (F1) can improve the maintenance of the first flexible portion (F1) in a designated shape so as to reduce the electromagnetic influence (e.g., EMI) of the metal portion (21) on the first conductive pattern (6).

[0141] According to various embodiments, the support member (5) can reduce or prevent the third region (F13) of the first flexible portion (F1) positioned relative to the ring structure (211) from being deformed and arranged from a designated shape during molding to form the non-metal portion (22). The designated shape of the third region (F13) may include, for example, the position of the first bending portion (B1), the radius of curvature of the first bending portion (B1), the position of the second bending portion (B2), the radius of curvature of the second bending portion (B2), and the shape of the inclined section (I). When forming the non-metal portion (22), the molding liquid can be injected into the mold based on designated molding conditions. The specified molding conditions are molding conditions for reducing defects in the non-metal part (22) and forming a high-quality non-metal part (22) when forming a desired non-metal part (22) by injecting the molding liquid into the mold, and may vary, for example, with injection molding temperature, injection pressure, injection speed, injection cooling time, or properties of the molding liquid (e.g., viscosity). The injection molding temperature may be set to the temperatures of a plurality of input elements such as the mold, the molding liquid, or the cooling water at conditions required by the non-metal part (22). The injection pressure refers to the force that injects the molding liquid in the cylinder into the mold. The injection speed refers to the speed at which the molding liquid is injected into the mold from the nozzle. The injection cooling time refers to the time for cooling the molding liquid injected into the mold. The molding liquid can be injected into the mold and flow at an injection pressure higher than atmospheric pressure and a temperature higher than room temperature. In the case of an example where the support member (5) is omitted, the third region (F13) of the first flexible portion (F1) positioned relative to the ring structure (211) may have difficulty maintaining a designated shape while the molding liquid is injected, so that the antenna radiation performance and / or coverage for the first conductive pattern (6) positioned at least partially on the first flexible portion (F1) may vary depending on the wearable ring device.The wearable ring device (2) of the present disclosure can improve the maintenance of a third region (F13) of a first flexible portion (F1) positioned relative to a ring structure (211) in a designated shape while a molding liquid is injected through a support member (5).

[0142] According to various embodiments, the non-metal portion (22) may include a portion disposed between the first flexible portion (F1) and the ring structure (211) of the metal portion (21) together with the support member (5). A portion of the non-metal portion (22) disposed between the first flexible portion (F1) and the ring structure (211) of the metal portion (21) together with the support member (5) may be coupled to the support member (5). A portion of the non-metal portion (22) disposed between the first flexible portion (F1) and the ring structure (211) of the metal portion (21) together with the support member (5) may be formed by filling a molding liquid between the first flexible portion (F1) and the ring structure (211) of the metal portion (21) during molding to form the non-metal portion (22).

[0143] According to various embodiments, the support member (5) may be formed of a material capable of reducing deformation of the third region (F13) of the first flexible portion (F1) from a designated shape during molding to form the non-metal portion (22), for example, a material having low shrinkage.

[0144] According to various embodiments, the support member (5) is configured to be attached to the third partial region (F133) to support the shape of the inclined section (I), and may be formed of a rigid member. Without being limited thereto, the support member (5) may also be formed of a flexible member, such as rubber or silicon.

[0145] According to various embodiments, the first region (F11) of the first flexible portion (F1) being arranged or coupled to the first portion (241) of the battery (24) via the first adhesive member (41), and the second region (F12) of the first flexible portion (F1) being arranged or coupled to the ring structure (211) of the metal portion (21) via the second adhesive member (42) can reduce or prevent the third region (F13) of the first flexible portion (F1) being positioned relative to the ring structure (211) from being deformed and arranged from a designated shape during molding to form the non-metal portion (22).

[0146] According to various embodiments, the first flexible portion (F1) may be configured to designate and distinguish a first attachment area of ​​a first region (F11) where the first adhesive member (41) is disposed, a second attachment area of ​​a second region (F12) where the second adhesive member (42) is disposed, and a third attachment area of ​​a third partial region (F133) where the support member (5) is disposed. In various embodiments, the reference of the first attachment area may be the first end (2301) of the first flexible portion (F1). In various embodiments, the reference of the second attachment area may be the boundary between the first rigid portion (R1) and the first flexible portion (F1). In various embodiments, the first flexible portion (F1) may include a silkscreen configured to include indications of a first attachment area, a second attachment area, and a third attachment area. The first flexible portion (F1) may include, for example, a line (e.g., a silk line) (800) indicating a reference of the third attachment area (see FIGS. 8 and 9 ).

[0147] According to various embodiments, the support member (5) may be arranged or coupled to the metal portion (21) corresponding to the inclined section (I) of the third region (F13), and may be in a state separated from the third region (F13).

[0148] According to various embodiments, when the first flexible portion (F1) is substantially maintained in a designated shape with respect to the ring structure (211) of the metal portion (21) during molding to form the non-metal portion (22), even if the second adhesive member (42) is omitted, the wearable ring device (2) can be implemented by omitting the second adhesive member (42).

[0149] According to various embodiments, when the first flexible portion (F1) is substantially maintained in a designated shape with respect to the ring structure (211) of the metal portion (21) during molding to form the non-metal portion (22), even if the support member (5) is omitted, the wearable ring device (2) can be implemented by omitting the support member (5).

[0150] According to various embodiments, in order to reduce the electromagnetic influence (e.g., EMI)) of the metal portion (21) on the first conductive pattern (6), the first support portion (e.g., the first support wall) (212) (see FIGS. 5 and 6) and / or the second support portion (e.g., the second support wall) (213) (see FIG. 5) of the metal portion (21) may be formed (or provided) so as not to overlap at least partially with the first conductive pattern (6) when viewed in a direction parallel to the reference axis (C) of the wearable ring device (2). For example, the first support portion (212) and / or the second support portion (213) of the metal portion (21) may be implemented so as not to overlap at least partially with the third region (F13) of the first flexible portion (F1) when viewed in a direction parallel to the reference axis (C) of the wearable ring device (2). For example, the first support portion (212) and / or the second support portion (213) of the metal portion (21) may be implemented so as not to overlap at least partially with the first bending portion (B1), the second bending portion (B2), and / or the inclined section (I) of the third region (F13) when viewed in a direction parallel to the reference axis (C) of the wearable ring device (2). In various embodiments, the first support portion (212) of the metal portion (21) may include a first opening (2121) (see FIG. 5) that prevents interference with an electromagnetic field from the first conductive pattern (6) when power is supplied to the first conductive pattern (6). In various embodiments, the second support portion (213) of the metal portion (21) may include a second opening (2131) (see FIG. 5) that prevents interference with an electromagnetic field from the first conductive pattern (6) when power is supplied to the first conductive pattern (6). The first opening (2121) and / or the second opening (2131) may be provided (or formed) in a notch shape, for example. The first opening (2121) and the second opening (2131) may overlap with the inclined section (I), for example, when viewed in a direction parallel to the reference axis (C) of the wearable ring device (2).

[0151] FIG. 10 is a drawing showing a portion of a first printed circuit board (231) in an unfolded state according to various embodiments of the present disclosure.

[0152] It is understood that the present disclosure encompasses and includes all combinations of the features and / or embodiments disclosed in connection with FIG. 10. All combinations of the features described below in connection with FIG. 10 may be considered to be encompassed by the present disclosure as specific examples.

[0153] Referring to FIG. 10, the first PCB (231) may include a first rigid portion (R1) and a first flexible portion (F1). Descriptions of some components having the same reference numerals as those in the previous embodiments will not be repeated.

[0154] According to various embodiments, the first flexible portion (F1) of the first PCB (231) may include a first region (F11), a second region (F12), and a third region (F13). The first region (F11) may be disposed or coupled to the battery (24) via a first adhesive member (41) (see FIG. 4). The second region (F12) may be disposed or coupled to the ring structure (211) of the metal portion (21) via a second adhesive member (42) (see FIG. 4). The third region (F13) may include a first partial region (F131), a second partial region (F132), and a third partial region (F133). The first partial region (F131) may be arranged to have a first bending portion (B1) (see Fig. 4), and the second partial region (F132) may be arranged to have a second bending portion (B2) (see Fig. 4). The third partial region (F133) may be supported by a support member (5) positioned between the third partial region (F133) and the ring structure (211) of the metal portion (21).

[0155] According to various embodiments, the first PCB (231) may include a first conductive pattern (6) positioned at least partially on the first flexible portion (F1). The first conductive pattern (6) may include a feed point (FP). The feed point (FP) may be positioned on the first rigid portion (R1). The first PCB (231) may include a transmission line (also referred to as a feed line) electrically connecting the feed point (FP) and a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) disposed on the first PCB (231). The wireless communication circuit may provide (or feed) an electromagnetic signal (or, a radio signal, an RF signal, or a radiated current) of a specified frequency band to the feed point (FP) of the first conductive pattern (6).

[0156] According to various embodiments, the first conductive pattern (6) may include a ground point (GP). The ground point (GP) may be located at the first rigid portion (R1). The ground point (GP) may be electrically connected to a first ground area (G1) included in the first PCB (231). When the wireless communication circuit provides (or supplies) an electromagnetic signal to the power supply point (FP), a current path (also referred to as a signal path) through which a current (also referred to as a radiated current) flows between the power supply point (FP) and the ground point (GP) may be formed through the first conductive pattern (6). The distribution of the current along the current path may form an electromagnetic field (or magnetic field distribution) through the first conductive pattern (6).

[0157] According to various embodiments, the first conductive pattern (6) may include a first partial conductive pattern (601) and a second partial conductive pattern (602) extending from a power supply point (FP) located in the first rigid portion (R1) across the second region (F12) and the third region (F13) of the first flexible portion (F1) to the first region (F11) of the first flexible portion (F1). The first flexible portion (F1) may include a first edge (E1) and a second edge (E2). The first edge (E1) and the second edge (E2) may be positioned spaced apart from each other in a direction parallel to the reference axis (C) of the wearable ring device (2). For example, when looking at the first printed circuit board (231) in an unfolded state, the first edge (E1) and the second edge (E2) may be arranged in a straight line shape that is substantially parallel to each other. The first partial conductive pattern (601) may be positioned closer to the first edge (E1) than the second partial conductive pattern (602). The second partial conductive pattern (602) may be positioned closer to the second edge (E2) than the first partial conductive pattern (601). In various embodiments, the first partial conductive pattern (601) may extend substantially parallel to the first edge (E1), but is not limited thereto. In various embodiments, the second partial conductive pattern (602) may extend substantially parallel to the second edge (E2), but is not limited thereto. The first partial conductive pattern (601) and the second partial conductive pattern (602) may include a third partial conductive pattern (603), a fourth partial conductive pattern (604), and / or a fifth partial conductive pattern (605) that are connected thereto. The third partial conductive pattern (603) is positioned in the first region (F11) of the first flexible portion (F1) and may connect or extend an end of the first partial conductive pattern (601) and an end of the second partial conductive pattern (602).The fourth partial conductive pattern (604) may be positioned in the third region (F13) (e.g., the second partial region (F132)) of the first flexible portion (F1). The fifth partial conductive pattern (605) may be positioned in the second region (F12) (e.g., the second partial region (F132)) of the first flexible portion (F1). The positions or numbers of other partial conductive patterns (e.g., the third partial conductive pattern (603), the fourth partial conductive pattern (604), and / or the fifth partial conductive pattern (605)) that electrically connect the first partial conductive pattern (601) and the second partial conductive pattern (602) are not limited to the examples shown. The shape of the first conductive pattern (6) at least partially positioned in the first flexible portion (F1) is not limited to the examples shown.

[0158] According to various embodiments, the first conductive pattern (6) located at least partially in the first flexible portion (F1) may not extend into the first region (F11).

[0159] According to various embodiments, the location of the power supply point (FP) of the first partial conductive pattern (601) is not limited to the illustrated example. For example, although not illustrated separately, the power supply point (FP) of the first partial conductive pattern (601) may be located in the second region (F12) of the first flexible portion (F1).

[0160] According to various embodiments, the location of the grounding point (GP) of the first partial conductive pattern (601) is not limited to the illustrated example. For example, although not illustrated separately, the grounding point (GP) of the first partial conductive pattern (601) may be located in the second region (F12) of the first flexible portion (F1).

[0161] According to various embodiments, the electromagnetic influence of a dielectric (e.g., a hand) surrounding the wearable ring device (2) on the first conductive pattern (6) may vary depending on the direction in which the wearable ring device (2) is worn on the user's finger (3) (see FIG. 2). The first partial conductive pattern (601) is positioned closer to the first edge (E1) of the first flexible portion (F1) than the second partial conductive pattern (602), and the second partial conductive pattern (602) is positioned closer to the second edge (E2) than the first partial conductive pattern (601), can reduce differences in antenna radiation performance and / or coverage for the first conductive pattern (6) depending on the direction in which the wearable ring device (2) is worn on the user's finger (3) (see FIG. 2). Since a first radiation field through the first partial conductive pattern (601) and a second radiation field through the second partial conductive pattern (602) can be formed when power is supplied to the first conductive pattern (6), the influence of the wearing direction of the wearable ring device (2) on the antenna radiation performance and / or coverage for the first conductive pattern (6) can be reduced compared to an example in which the second partial conductive pattern (602) is omitted or an example including only the first partial conductive pattern (601). For example, in an example including only the first partial conductive pattern (601), the first partial conductive pattern (601) can be configured to operate as a monopole antenna.

[0162] According to various embodiments, in the case of an example (not shown separately) in which the first conductive pattern included in the first flexible portion (F1) of the first PCB (231) is provided (or formed) in a form including only the first partial conductive pattern (601) corresponding to the first edge (E1), the first conductive pattern may be understood as a '1D (dimension) conductive pattern (1D antenna radiator or 1D antenna)' in the form of a pattern including, for example, one line extended corresponding to the first edge (E1). In the case of an example including a 1D conductive pattern, the 1D conductive pattern may be configured to operate as a monopole antenna. According to various embodiments of the present disclosure, the first conductive pattern (6) is a pattern including a first partial conductive pattern (601) in the form of a first line extending corresponding to a first edge (E1) and a second partial conductive pattern (602) in the form of a second line extending corresponding to a second edge (E2), and may be understood as a '2D (dimension) conductive pattern (2D antenna radiator or 2D antenna)' compared to a 1D conductive pattern. In various embodiments, the first conductive pattern (6) included in the first flexible portion (F1) of the first PCB (231) is arranged in a form including a first bending portion (B1) (see FIGS. 4 and 5), a second bending portion (B2) (see FIGS. 4 and 5), and an inclined section (I) (see FIGS. 4 and 5), and thus can be understood as a '3D (dimension) conductive pattern (3D antenna radiator or 3D antenna)'.

[0163] According to various embodiments, although not shown separately, the first conductive pattern (6) is not limited to the illustrated example and may be provided (or formed) in a form in which at least one of the fourth partial conductive pattern (604) and the fifth partial conductive pattern (605) is omitted.

[0164] According to various embodiments, although not separately illustrated, the first partial conductive pattern (601) and the second partial conductive pattern (602) may be arranged not to be parallel to each other. For example, the first partial conductive pattern (601) may be substantially parallel to the first edge (E1), and the second partial conductive pattern (602) may not be parallel to the second edge (E2). For example, the second partial conductive pattern (602) may be substantially parallel to the second edge (E2), and the first partial conductive pattern (601) may not be parallel to the first edge (E1).

[0165] According to various embodiments, although not separately illustrated, when looking at the first printed circuit board (231) in an unfolded state, the first partial conductive pattern (601) may be provided (or formed) in a shape that includes at least one curved portion rather than a straight line. The first partial conductive pattern (601) may be formed in a shape that includes at least one of a straight line, a curved line, and a broken line. In various embodiments, the first partial conductive pattern (601) may include a meander pattern.

[0166] According to various embodiments, although not separately illustrated, when looking at the first printed circuit board (231) in an unfolded state, the second partial conductive pattern (602) may be provided (or formed) in a shape that includes at least one curved portion rather than a straight line. The second partial conductive pattern (602) may be formed in a shape that includes at least one of a straight line, a curved line, and a broken line. In various embodiments, the second partial conductive pattern (602) may include a meander pattern.

[0167] According to various embodiments, although not separately illustrated, the first conductive pattern (6) may be provided (or formed) as a pattern of a monopole antenna extending from one end including a feed point (FP) to the other end. The first conductive pattern (6) may be formed in a shape including, for example, at least one of a straight line, a curved line, and a broken line. The first conductive pattern (6) may be provided (or formed) in a shape including, for example, one or more pattern portions closer to the first edge (E1) than the second edge (E2) and one or more pattern portions closer to the second edge (E2) than the first edge (E1).

[0168] According to various embodiments, the first conductive pattern (6) may be provided (or formed) to include a shape substantially identical to or at least partially similar to an 'A' shape, an '8' shape, a 'ㄷ' shape, or an 'ㄹ' shape, although not separately illustrated. The pattern shape of the first conductive pattern (6) may also be diverse.

[0169] According to various embodiments, the present disclosure discloses a wearable ring device (2) worn on a user's finger, but the wearable ring device (2) may be provided (or formed) in a form that can be worn on various parts of the user's body. The wearable ring device (2) may be implemented so as to be wearable on, for example, an arm, a wrist, a neck, or a head. The wearable ring device (2) may be implemented as, for example, an earring.

[0170] According to various embodiments of the present disclosure, a wearable ring device (e.g., a wearable ring device (2)) includes a metal portion (e.g., a metal portion (21)), a non-metal portion (e.g., a non-metal portion (22)), a first PCB (e.g., a first PCB (231)), a support member (e.g., a support member (5)), a first conductive pattern (e.g., a first conductive pattern (6)), and a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1). The metal portion includes a ring structure (e.g., a ring structure (211)) having a ring shape disposed on the outside of the wearable ring device. The non-metal portion is disposed on the inside of the wearable ring device and is coupled to the metal portion. The first PCB is disposed at least partially between the ring structure and the non-metal portion along the ring shape of the ring structure. A first PCB includes a first rigid portion (e.g., a first rigid portion (R1)) and a first flexible portion (e.g., a first flexible portion (F1)) extending from the first rigid portion. A support member is configured to support the inclined portion (e.g., an inclined portion (I)) positioned between the first flexible portion and the ring structure so that the first flexible portion has an inclined portion arranged such that a distance apart from the ring structure increases along a portion of a ring shape of the ring structure. A first conductive pattern is positioned at least partially in the inclined portion of the first flexible portion. A wireless communication circuit is arranged on the first PCB and is configured to transmit or receive a wireless signal via the first conductive pattern.

[0171] According to various embodiments of the present disclosure, a wearable ring device (e.g., wearable ring device (2)) may include a battery (e.g., battery (24)) disposed between a ring structure (e.g., ring structure (211)) and a non-metal portion (e.g., non-metal portion (22)). A first flexible portion (e.g., first flexible portion (F1)) of a first PCB (e.g., first PCB (231)) may include a first region (e.g., first region (F11)), a second region (e.g., second region (F12)), and a third region (e.g., third region (F13)) between the first region and the second region. The first region may be coupled to the battery via a first adhesive member (e.g., first adhesive member (41)) so as to be spaced apart from the ring structure with the battery therebetween. The second region may extend from a first rigid portion of the first PCB (e.g., the first rigid portion (R1)). The third region may extend between the first region and the second region. A support member (e.g., support member (5)) may be positioned between the third region and the ring structure, and an inclined section (e.g., an inclined section (I)) may be formed in the third region.

[0172] According to various embodiments of the present disclosure, a third region (e.g., a third region (F13)) may include a first sub-region (e.g., a first sub-region (F131)), a second sub-region (e.g., a second sub-region (F132)), and a third sub-region (e.g., a third sub-region (F133)) between the first sub-region and the second sub-region. The first sub-region may extend from the first region (e.g., the first region (F11)) and include a first bending portion (e.g., a first bending portion (B1)). The second sub-region may extend from the second region (e.g., the second region (F12)) and include a second bending portion (e.g., a second bending portion (B2)) that is bent in an opposite direction to the first bending portion. The third sub-region extends between the first sub-region and the second sub-region (F132) and may include an inclined section (e.g., inclined section (I)).

[0173] According to various embodiments of the present disclosure, a second region (e.g., a second region (F12)) of a first flexible portion (e.g., a first flexible portion (F1)) can be coupled to a ring structure via a second adhesive member (e.g., a second adhesive member (42)) disposed between the second region and the ring structure (e.g., a ring structure (211)).

[0174] According to various embodiments of the present disclosure, a first adhesive member (e.g., a first adhesive member (41)) may be disposed in a first region (e.g., a first region (F11)) of the first flexible portion (e.g., a first end (2301)) based on an end of the first flexible portion (e.g., a first flexible portion (F1)). A second adhesive member (e.g., a second adhesive member (42)) may be disposed in a second region (e.g., a second region (F12)) of the first flexible portion based on a boundary between the first rigid portion (e.g., the first rigid portion (R1)) and the first flexible portion. A support member (e.g., support member (5)) can be placed in a third region (e.g., third region (F13)) of the first flexible portion based on a silk line (e.g., silk line (800)) indicated on the first flexible portion.

[0175] According to various embodiments of the present disclosure, a first conductive pattern (e.g., a first conductive pattern (6)) may extend from a first rigid portion (e.g., a first rigid portion (R1)) across a second region (e.g., a second region (F12)) and a third region (e.g., a third region (F13)) of a first flexible portion (e.g., a first region (F11)) of the first flexible portion.

[0176] According to various embodiments of the present disclosure, the first conductive pattern (e.g., the first conductive pattern (6)) may extend from the first rigid portion (e.g., the first rigid portion (R1)) across the second region (e.g., the second region (F12)) of the first flexible portion (e.g., the first flexible portion (F1)) to the third region (e.g., the third region (F13)) of the first flexible portion, and may not extend to the first region (e.g., the first region (F11)) of the first flexible portion.

[0177] According to various embodiments of the present disclosure, a wearable ring device (2) may include a second PCB (e.g., a second PCB (232)). The second PCB is disposed between a ring structure (e.g., a ring structure (211)) and a non-metal portion (e.g., a non-metal portion (22)), and may be at least partially flexible. The second PCB may extend in an opposite direction from the first PCB (e.g., the first PCB (231)) along a portion of a ring shape of the ring structure. The second PCB may include at least one second conductive pattern (e.g., a second conductive pattern (7)) configured to operate as an antenna radiator. A battery (e.g., battery (24)) may include a first portion (e.g., first portion (241)) disposed between a first region (e.g., first region (F11)) of a first flexible portion (e.g., first flexible portion (F1)) and a ring structure (e.g., ring structure (211)). The battery may include a second portion (e.g., second portion (242)) disposed between a second PCB and the ring structure.

[0178] According to various embodiments of the present disclosure, a metal portion (e.g., metal portion (21)) may include a first support wall (e.g., first support wall (212)) and a second support wall (e.g., second support wall (213)) extending from a ring structure (e.g., ring structure (211)). A first PCB (e.g., first PCB (231)) may be positioned at least partially between the first support wall and the second support wall. The first support wall may include a first opening (e.g., first opening (2121)) corresponding to an inclined section (e.g., inclined section (I)) of a first flexible portion (e.g., first flexible portion (F1)). The second support wall may include a second opening (e.g., second opening (2131)) corresponding to an inclined section (e.g., inclined section (I)) of the first flexible portion.

[0179] According to various embodiments of the present disclosure, the non-metal portion (e.g., non-metal portion (22)) can be formed through insert injection.

[0180] According to various embodiments of the present disclosure, a non-metal portion (e.g., non-metal portion (22)) may include a portion that is disposed between a first flexible portion (e.g., first flexible portion (F1)) and a ring structure (e.g., ring structure (211)) and is coupled to a support member (e.g., support member (5)).

[0181] According to various embodiments of the present disclosure, a first conductive pattern (e.g., the first conductive pattern (6)) may include a feed point (e.g., a feed point (FP)), a ground point (e.g., a ground point (GP)), a first partial conductive pattern (e.g., the first partial conductive pattern (601)), a second partial conductive pattern (e.g., the second partial conductive pattern (602)), and one or more third partial conductive patterns (e.g., the third partial conductive pattern (603)), a fourth partial conductive pattern (e.g., the fourth partial conductive pattern (604)), and / or a fifth partial conductive pattern (e.g., the fifth partial conductive pattern (605)). The feed point may be located in a first rigid portion (e.g., the first rigid portion (R1)) of a first PCB (e.g., the first PCB (231)) and configured to receive an electromagnetic signal from a wireless communication circuit. A point (e.g., a ground point (GP)) may be located on a first rigid portion (e.g., a first rigid portion (R1)) of a first PCB and may be electrically connected to a ground area (e.g., a first ground area (G1)) of the first PCB. The first partial conductive pattern may be arranged across an inclined section (e.g., an inclined section (I)) from a power supply point. The second partial conductive pattern may be arranged across an inclined section from a ground point. At least one third partial conductive pattern may electrically connect the first partial conductive pattern and the second partial conductive pattern. The first flexible portion (e.g., the first flexible portion (F1)) may include a first edge (e.g., a first edge (E1)) and a second edge (e.g., a second edge (E2)) positioned opposite to each other. The first partial conductive pattern may be further from the second partial conductive pattern than the first partial conductive pattern. The first portion conductive pattern may be positioned closer to the first edge of the first flexible portion. The second portion conductive pattern may be positioned closer to the second edge of the first flexible portion than the first portion conductive pattern.

[0182] According to various embodiments of the present disclosure, a first PCB (e.g., a first PCB (231)) may include a second rigid portion (e.g., a second rigid portion (R2)), and a second flexible portion (e.g., a second flexible portion (F2)) between the first rigid portion (e.g., the first rigid portion (R1)) and the second rigid portion. A wireless communication circuit may be disposed in the second rigid portion.

[0183] According to various embodiments of the present disclosure, the support member (e.g., the support member (5)) may include a flexible member.

[0184] According to various embodiments of the present disclosure, the support member (e.g., the support member (5)) may include a rigid member.

[0185] The embodiments disclosed in this disclosure and the drawings are merely examples to more easily explain the technical content and to help understand the present disclosure, and are not intended to limit the scope of the present disclosure. Therefore, it should be understood that the scope of various embodiments of the present disclosure includes various modifications or variations in addition to the embodiments disclosed herein. Additionally, it should be understood that any embodiment(s) described herein can be used in conjunction with any other embodiment(s) described herein. For example, although the present disclosure is presented in a form that provides multiple embodiments each defining multiple features, it is emphasized that some of these embodiments may be connected only by reference to the same drawing or drawings. The present disclosure should be understood to include all combinations of these embodiments, unless there is an apparent contradiction between two (or more) embodiments. For example, if features are presented as optional in the present disclosure, all combinations of such optional features are included in the present disclosure.

Claims

1. In the wearable ring device (2), A metal part (21) including a ring structure (211) having a ring shape arranged on the outside of the wearable ring device (2); A non-metal part (22) disposed on the inside of the wearable ring device (2) and combined with the metal part (21); A first PCB (printed circuit board) (231) disposed at least partially between the ring structure (211) and the non-metal portion (22) along the ring shape of the ring structure (211), and including a first rigid portion (R1) and a first flexible portion (F1) extending from the first rigid portion (R1); A support member (5) positioned between the first flexible portion (F1) and the ring structure (211) to support the inclined section (I) such that the first flexible portion (F1) has an inclined section (I) arranged such that the distance from the ring structure (211) increases along a part of the ring shape of the ring structure (211); A first conductive pattern (6) located at least partially in the inclined section (I) of the first flexible portion (F1); and A wearable ring device comprising a wireless communication circuit arranged on the first PCB (231) and configured to transmit or receive a wireless signal to or from an external device through the first conductive pattern (6).

2. In paragraph 1, It further includes a battery (24) arranged between the ring structure (211) and the non-metal part (22), The first flexible portion (F1) of the first PCB (231) is A first area (F11) connected to the battery (24) through a first adhesive member (41) so as to be spaced apart from the ring structure (211) with the battery (24) in between, A second region (F12) extending from the first rigid portion (R1) of the first PCB (231), and a third region (F13) extending between the first region (F11) and the second region (F12), and A wearable ring device in which the support member (5) is positioned between the third region (F13) and the ring structure (211), and the inclined section (I) is formed in the third region (F13).

3. In paragraph 2, The third area (F13) above is, A first partial region (F131) extending from the first region (F11) and including a first bending portion (B1), A second partial region (F132) including a second bending portion (B2) extending from the second region (F12) and bent in the opposite direction to the first bending portion (B1), and A wearable ring device including a third partial region (F133) extending between the first partial region (F131) and the second partial region (F132) and including the inclined section (I).

4. In the above paragraph 2, A wearable ring device in which the second region (F12) of the first flexible portion (F1) is coupled to the ring structure (211) through a second adhesive member (42) disposed between the second region (F12) and the ring structure (211).

5. In paragraph 4, The first adhesive member (41) is placed in the first area (F11) of the first flexible portion (F1) based on the end (2301) of the first flexible portion (F1), The second adhesive member (42) is arranged in the second region (F12) of the first flexible portion (F1) based on the boundary between the first rigid portion (R1) and the first flexible portion (F1), and A wearable ring device in which the support member (5) is placed in the third area (F13) of the first flexible portion (F1) based on the silk line (800) indicated on the first flexible portion (F1).

6. In paragraph 2, A wearable ring device in which the first conductive pattern (6) extends from the first rigid portion (R1) across the second region (F12) and the third region (F13) of the first flexible portion (F1) to the first region (F11) of the first flexible portion (F1).

7. In paragraph 2, A wearable ring device wherein the first conductive pattern (6) extends from the first rigid portion (R1) across the second region (F12) of the first flexible portion (F1) to the third region (F13) of the first flexible portion (F1), and does not extend to the first region (F11) of the first flexible portion (F1).

8. In paragraph 2, A second PCB (232) disposed between the ring structure (211) and the non-metal portion (22) and being at least partially flexible, further comprising a second PCB (232) extending in the opposite direction to the first PCB (231) along a part of the ring shape of the ring structure (211), and including at least one second conductive pattern (7) configured to operate as an antenna radiator, and A wearable ring device comprising a first part (241) disposed between the first area (F11) of the first flexible part (F1) and the ring structure (211), and a second part (242) disposed between the second PCB (232) and the ring structure (211).

9. In paragraph 1, The above metal part (21) includes a first support wall (212) and a second support wall (213) extending from the ring structure (211), The first PCB (231) is at least partially positioned between the first support wall (212) and the second support wall (213), The first support wall (212) includes a first opening (2121) corresponding to the inclined section (I) of the first flexible portion (F1), and A wearable ring device in which the second support wall (213) includes a second opening (2131) corresponding to the inclined section (I) of the first flexible portion (F1).

10. In the above paragraph 1, The above non-metallic portion (22) is a wearable ring device formed through insert injection.

11. In paragraph 10, A wearable ring device in which the non-metal portion (22) is disposed between the first flexible portion (F1) and the ring structure (211) and includes a part coupled to the support member (5).

12. In paragraph 1, The above first challenge pattern (6) is A power supply point (FP) located on the first rigid portion (R1) of the first PCB (231) and configured to receive an electromagnetic signal from the wireless communication circuit; A ground point (GP) located on the first rigid portion (R1) of the first PCB (231) and electrically connected to the ground area (G1) of the first PCB (231), A first partial conductive pattern (601) arranged across the slope section (I) from the above-mentioned power supply point (FP), A second partial conductive pattern (602) arranged across the slope section (I) from the grounding point (GP), and It includes one or more third partial conductive patterns (603, 604, 605) electrically connecting the first partial conductive pattern (601) and the second partial conductive pattern (602), The first flexible portion (F1) includes a first edge (E1) and a second edge (E2) positioned opposite to each other, The first partial conductive pattern (601) is positioned closer to the first edge (E1) of the first flexible portion (F1) than the second partial conductive pattern (602), and A wearable ring device in which the second partial conductive pattern (602) is positioned closer to the second edge (E2) of the first flexible portion (F1) than the first partial conductive pattern (601).

13. In paragraph 1, The first PCB (231) further includes a second rigid portion (R2), and a second flexible portion (F2) between the first rigid portion (R1) and the second rigid portion (R2), A wearable ring device wherein the wireless communication circuit is disposed in the second rigid portion (R2).

14. In paragraph 1, A wearable ring device in which the above support member (5) includes a flexible member.

15. In paragraph 1, A wearable ring device in which the above support member (5) includes a rigid member.

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