Electronic device comprising shielding structure

Abstract

According to one embodiment of the present disclosure, an electronic device may be provided. The electronic device may comprise: a housing including a first housing portion and a second housing portion configured to be movable with respect to the first housing portion; a first substrate assembly disposed within the first housing portion, the first substrate assembly including a first substrate, a sensor integrated circuit disposed on a first surface of the first substrate, a first electronic component disposed on the first surface, and a shield can disposed on the first surface of the first substrate so as to surround the first electronic component; a conductive plate disposed on an upper portion of the shield can; and a second substrate assembly disposed within the first housing portion above the first substrate, the second substrate assembly including a second substrate and a second electronic component positioned adjacent to the sensor integrated circuit on a surface of the second substrate facing the first surface of the first substrate. The conductive plate may include: a first region parallel to the first surface of the first substrate; an extension extending perpendicularly to the first region so as to cover at least a portion of a surface of the sensor integrated circuit facing the second electronic component so as to shield the sensor integrated circuit from noise generated from the second electronic component.

Description

Electronic devices including shielding structures

[0001] Examples of the present disclosure relate to electronic devices including shielding structures.

[0002] Advances in information and communication technology and semiconductor technology are integrating diverse functions into a single portable electronic device. For example, electronic devices can implement not only communication functions but also entertainment functions such as gaming, multimedia functions such as music and video playback, communication and security functions for mobile banking, or even calendar management and electronic wallet functions. These electronic devices are becoming smaller and more portable for users.

[0003] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] According to one embodiment of the present disclosure, an electronic device may be provided. The electronic device may include a housing comprising a first housing portion and a second housing portion configured to be movable relative to the first housing, a first substrate assembly disposed within the first housing portion, the first substrate assembly comprising a first substrate, a sensor integrated circuit disposed on a first surface of the first substrate, a first electronic component disposed on the first surface, and a shield can disposed on the first surface of the first substrate to surround the first electronic component, a conductive plate disposed on an upper portion of the shield can, and a second substrate assembly disposed on the first substrate within the first housing portion, the second substrate assembly comprising a second substrate and a second electronic component positioned adjacent to the sensor integrated circuit on a surface of the second substrate facing the first surface of the first substrate. The conductive plate may include a first region parallel to the first surface of the first substrate and an extension formed to extend perpendicular to the first region to cover at least a portion of a surface of the sensor integrated circuit facing the second electronic component to shield the sensor integrated circuit from noise generated from the second electronic component.

[0005] According to one embodiment of the present disclosure, an electronic device may be provided. The electronic device may include a housing forming an exterior of the electronic device, the housing including a first housing portion including a first opening and a second housing portion configured to be movable with respect to the first housing, a sub-display arranged to display an image through the first opening, a first substrate assembly arranged within the first housing portion, the first substrate assembly including a first substrate and a sensor integrated circuit arranged on a first surface of the first substrate, a second substrate assembly arranged between the sub-display and the first substrate assembly, the second substrate assembly including electronic components and electrically connected to the sub-display, and a conductive plate at least partially arranged between the first substrate assembly and the second substrate assembly. The conductive plate may include an extension formed to surround a surface of the sensor integrated circuit facing the electronic component so as to shield the sensor integrated circuit from the electronic component.

[0006] The above-described aspects or other aspects, configurations and / or advantages of one embodiment of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.

[0007] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment of the present disclosure.

[0008] FIG. 2 is a diagram illustrating an unfolded state of an electronic device according to one embodiment of the present disclosure.

[0009] FIG. 3 is a diagram illustrating an unfolded state of an electronic device according to one embodiment of the present disclosure.

[0010] FIG. 4 is a diagram illustrating a folded state of an electronic device according to one embodiment of the present disclosure.

[0011] FIG. 5 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0012] FIG. 6A is a perspective view of a first substrate assembly, a second substrate assembly, and a conductive plate according to one embodiment of the present disclosure.

[0013] FIG. 6b is a cross-sectional side view taken along line A-A' of FIG. 6a according to one embodiment of the present disclosure.

[0014] FIG. 6c is an enlarged view of portion E of FIG. 6b according to one embodiment of the present disclosure.

[0015] FIG. 7A is a plan view illustrating a first housing, a sub-display, and a second substrate assembly of an electronic device according to one embodiment of the present disclosure.

[0016] FIG. 7b is an enlarged view of portion E of FIG. 7a according to one embodiment of the present disclosure.

[0017] Figure 8a is a perspective view of a first substrate assembly and a conductive plate of a conventional electronic device.

[0018] FIG. 8b is a plan view of a first substrate assembly, a second substrate assembly, and a conductive plate according to one embodiment of the present disclosure.

[0019] Figure 9a is a graph showing the distribution of measurement values ​​of a sensor integrated circuit of a conventional electronic device.

[0020] FIG. 9b is a graph showing the distribution of measurement values ​​of a sensor integrated circuit when a shielding structure according to one embodiment of the present disclosure is used.

[0021] Figure 10a is a graph for explaining the failure rate of a sensor integrated circuit of a conventional electronic device.

[0022] FIG. 10b is a graph illustrating a failure rate of a sensor integrated circuit of an electronic device including a shielding structure according to one embodiment of the present disclosure.

[0023] FIG. 11 is a perspective view of a first substrate assembly and a conductive plate of an electronic device according to one embodiment of the present disclosure.

[0024] FIG. 12 is a perspective view of a first substrate assembly and a conductive plate of an electronic device according to one embodiment of the present disclosure.

[0025] FIG. 13A is a perspective view of a first substrate assembly and a shielding member of an electronic device according to one embodiment of the present disclosure.

[0026] FIG. 13b is a perspective view of a first substrate assembly and a shielding member of an electronic device according to one embodiment of the present disclosure.

[0027] FIG. 14 is a perspective view of a first substrate assembly and a shielding member of an electronic device according to one embodiment of the present disclosure.

[0028] Throughout the attached drawings, similar reference numbers may be assigned to similar parts, components and / or structures.

[0029] The following description, with reference to the accompanying drawings, is provided to facilitate a comprehensive understanding of various embodiments of the present invention as defined by the claims and their equivalents. While the following description includes numerous specific details to aid understanding, these should be considered merely illustrative. Accordingly, those skilled in the art will recognize that various modifications and variations of the various embodiments described herein may be made without departing from the scope and spirit of the present disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0030] The terms and words used in the following description and claims are not intended to be limited by their bibliographic meanings, but are merely used by the inventors to ensure a clear and consistent understanding of the disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various embodiments of the present invention is provided solely for illustrative purposes, not for the purpose of limiting the present invention, which is defined by the appended claims and their equivalents.

[0031] The singular forms "a," "an," and "the" should be understood to include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a surface of a part" includes reference to one or more of these surfaces.

[0032] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment of the present disclosure.

[0033] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In one embodiment, the electronic device (101) may have at least one of these components (e.g., the connection terminal (178)) omitted, or one or more other components added. In one embodiment, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0034] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0035] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0036] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0037] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0038] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0039] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0040] The display module (160) can visually provide information to an external device (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a hall area program device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0041] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0042] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0043] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0044] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0045] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0046] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0047] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0048] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0049] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0050] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0051] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In one embodiment, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0052] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent to a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0053] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0054] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0055] FIG. 2 and FIG. 3 are diagrams illustrating an unfolded state of an electronic device according to one embodiment of the present disclosure. FIG. 4 is a diagram illustrating a folded state of an electronic device according to one embodiment of the present disclosure.

[0056] The configuration of the electronic device (101) of FIGS. 2 to 4 may be partially or entirely identical to the configuration of the electronic device (101) of FIG. 1.

[0057] The embodiments of FIGS. 2 to 4 may be combined with the embodiment of FIG. 1, or the embodiments of FIGS. 5 to 15c below.

[0058] In the detailed description below in FIG. 2, the length direction of the electronic device (101) may be defined as the 'Y-axis direction', the width direction as the 'X-axis direction', and / or the height direction (thickness direction) as the 'Z-axis direction'. In the detailed description below, references to the length direction, the width direction, and / or the height direction (or thickness direction) may indicate the length direction, the width direction, and / or the height direction (or thickness direction) of the electronic device (10). In some embodiments, with respect to the direction in which the components are oriented, 'negative / positive (- / +)' may be mentioned together with the rectangular coordinate system illustrated in the drawings. In FIG. 2 to FIG. 4, the arrangement relationship in the height direction of any component or another component, i.e., the reference for up / down, may follow the +Z-axis direction / -Z-axis direction.

[0059] Referring to FIGS. 2 to 4, the electronic device (101) may include a housing (201) for accommodating components of the electronic device (101) and a flexible display (hereinafter, referred to as a display (240)) disposed within a space formed by the housing (201). According to one embodiment, the housing (201) may be referred to as a foldable housing. According to one embodiment, the display (240) may be referred to as a foldable display. The electronic device (101) may also be referred to as a foldable electronic device. The term "foldable electronic device" may refer to an electronic device that can be folded so that two different regions of the display face each other or face opposite to each other. Typically, in a portable state, the display of a foldable electronic device is folded so that the two different regions face each other or face each other, and in an actual use state, the user can unfold the display so that the two different regions form a substantially flat form.

[0060] According to one embodiment, the housing (201) may include a first housing portion (210) and a second housing portion (220) configured to rotate relative to the first housing portion (210). According to one embodiment, the first housing portion (210) and the second housing portion (220) may be integrally formed and form part of the housing (201), or may be provided in a separable configuration according to an embodiment and may be connected or assembled to each other.

[0061] According to one embodiment, the first housing portion (210) and / or the second housing portion (220) may form at least a portion of the exterior of the electronic device (101). According to one embodiment, the surface on which the display (240) is visually exposed may be defined as a front surface (e.g., a first front surface (210a) and a second front surface (220a)) of the electronic device (101) and / or the housing (201). The surface opposite the front surface may be defined as a back surface (e.g., a first back surface (210b) and a second back surface (220b)) of the electronic device (101). The surface surrounding at least a portion of the space between the front surface and the back surface may be defined as a side surface (e.g., a first side surface (210c) and a second side surface (220c)) of the electronic device (101).

[0062] According to one embodiment, the first housing portion (210) can be rotatably connected to the second housing portion (220) using a hinge assembly (e.g., hinge assembly (280) of FIG. 5) including a hinge cover (230). For example, the first housing portion (210) and the second housing portion (220) can each be rotatably connected to the hinge assembly (e.g., hinge assembly (280) of FIG. 5). Accordingly, the electronic device (101) can be changed into a folded state (e.g., FIG. 4) or an unfolded state (e.g., FIGS. 2 and 3). In the above electronic device (101), in a folded state, the first front surface (210a) may face the second front surface (220a), and in an unfolded state, the direction in which the first front surface (210a) faces may be substantially the same as the direction in which the second front surface (220a) faces. For example, in an unfolded state, the first front surface (210a) may be positioned on substantially the same plane as the second front surface (220a). According to one embodiment, the second housing portion (220) may provide relative movement with respect to the first housing portion (210).

[0063] According to one embodiment, the first housing portion (210) and the second housing portion (220) are arranged on both sides with respect to the folding axis (A) as the center, and may have a shape that is overall symmetrical with respect to the folding axis (A). The angle between the first housing portion (210) and the second housing portion (220) may change depending on whether the state of the electronic device (101) is an unfolded state, a folded state, or an intermediate state between the unfolded state and the folded state.

[0064] According to one embodiment, the electronic device (101) may include a hinge cover (230). At least a portion of the hinge cover (230) may be disposed between the first housing portion (210) and the second housing portion (220). According to one embodiment, the hinge cover (230) may be covered by a portion of the first housing portion (210) and the second housing portion (220) or may be exposed to the outside of the electronic device (101) depending on the state of the electronic device (101). According to one embodiment, the hinge cover (230) may protect the hinge assembly (e.g., the hinge assembly (280) of FIG. 5) from an external impact of the electronic device (101). According to one embodiment, the hinge cover (230) may be interpreted as a hinge housing for protecting the hinge assembly (e.g., the hinge assembly (280) of FIG. 5).

[0065] According to one embodiment, as illustrated in FIGS. 2 and 3, when the electronic device (101) is in an unfolded state, the hinge cover (230) may be covered by the first housing portion (210) and the second housing portion (220) and may not be exposed. As another example, as illustrated in FIG. 4, when the electronic device (101) is in a folded state (e.g., a fully folded state), the hinge cover (230) may be exposed to the outside between the first housing portion (210) and the second housing portion (220). As another example, when the first housing portion (210) and the second housing portion (220) are in an intermediate state where they are folded with a certain angle, the hinge cover (230) may be partially exposed to the outside between the first housing portion (210) and the second housing portion (220). However, in this case, the exposed area may be less than in the fully folded state. In one embodiment, the hinge cover (230) may include a curved surface.

[0066] In one embodiment, the display (240) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display (240) may include, for example, a holographic device or a projector and a control circuit for controlling the device. In one embodiment, the display (240) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0067] According to one embodiment, the display (240) may refer to a display in which at least a portion of the display can be transformed into a flat or curved surface. For example, the display (240) may be formed to be variable in response to the relative movement of the second housing portion (220) with respect to the first housing portion (210). According to one embodiment, the display (240) may include a folding area (243), a first display area (241) disposed on one side (e.g., upper (+Y direction)) of the folding area (243), and a second display area (242) disposed on the other side (e.g., lower (-Y direction)). According to one embodiment, the folding area (243) may be positioned on a hinge assembly (e.g., hinge assembly (280) of FIG. 5). For example, at least a portion of the folding area (243) may face a hinge assembly (e.g., hinge assembly (280) of FIG. 5). In one embodiment, the first display area (241) may be disposed on the first housing portion (210), and the second display area (242) may be disposed on the second housing portion (220). In one embodiment, the display (240) may be accommodated in the first housing portion (210) and the second housing portion (220).

[0068] However, the division of the areas of the display (240) illustrated in FIGS. 2 and 3 is exemplary, and the display (240) may be divided into multiple areas (for example, four or more or two) depending on the structure or function.

[0069] Also, in the embodiments illustrated in FIGS. 2 and 3, the display (240) may be divided into regions by a folding region (243) extending parallel to the X-axis or a folding axis (A-axis), but in other embodiments, the display (240) may be divided into regions based on another folding region (e.g., a folding region parallel to the Y-axis) or another folding axis (e.g., a folding axis parallel to the Y-axis). According to one embodiment, the display (240) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer configured to detect a magnetic field-type digital pen (e.g., a stylus pen).

[0070] According to one embodiment, the electronic device (101) may include a rear display (244). The rear display (244) may be arranged to face a different direction than the display (240). For example, the display (240) may be visually exposed through the front side of the electronic device (101) (e.g., the first front side (210a) and / or the second front side (220a)), and the rear display (244) may be visually exposed through the rear side of the electronic device (101) (e.g., the first rear side (210b)).

[0071] According to one embodiment, the electronic device (101) may include at least one camera module (204, 206) and a flash (208). According to one embodiment, the electronic device (101) may include a front camera module (204) exposed through a front side (e.g., a first front side (210a)) and / or a rear camera module (206) exposed through a rear side (e.g., a first rear side (210b)). The camera modules (204, 206) may include one or more lenses, an image sensor, a flash, and / or an image signal processor. The flash (208) may include a light emitting diode or a xenon lamp. According to one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (101). The configuration of the front camera module (204) and / or the rear camera module (206) may be partially or entirely identical to the configuration of the camera module (180) of FIG. 1.

[0072] Although the electronic device (101) disclosed in FIGS. 2 to 4 has the appearance of a foldable electronic device, the present disclosure is not limited thereto. For example, the illustrated electronic device may be a part of a rollable electronic device or a bar-type or plate-type electronic device. The term "rollable electronic device" may refer to an electronic device in which a display (e.g., a display (240) of FIGS. 2 and 3) is capable of bending deformation, such that at least a portion thereof can be wound or rolled, or can be accommodated inside a housing (e.g., a housing (210) of FIGS. 2 and 3). Depending on the user's needs, the rollable electronic device can be used by expanding the screen display area by unfolding the display or exposing a wider area of ​​the display to the outside.

[0073] Although the electronic device (101) disclosed in FIGS. 2 to 4 has the appearance of a foldable electronic device, the present invention is not limited thereto. For example, the illustrated electronic device may be a bar type, a plate type, or a rollable electronic device. The term "rollable electronic device" may refer to an electronic device in which a display (e.g., the display (240) of FIG. 5) is capable of bending deformation, such that at least a portion thereof can be wound or rolled, or can be accommodated inside a housing (e.g., the housing (201) of FIG. 2). Depending on the user's needs, the rollable electronic device can be used by expanding the screen display area by unfolding the display or exposing a wider area of ​​the display to the outside.

[0074] FIG. 5 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0075] The embodiment of FIG. 5 can be combined with the embodiments of FIGS. 1 to 4.

[0076] Referring to FIG. 5, the electronic device (101) may include a first housing portion (210), a second housing portion (220), a display (240), a hinge cover (230), a battery (250), a printed circuit board (260), a flexible printed circuit board (270), and a hinge assembly (280). The configuration of the first housing portion (210), the second housing portion (220), the display (240), and the hinge cover (230) of FIG. 5 may be all or part of the same as the configuration of the first housing portion (210), the second housing portion (220), the display (240), and the hinge cover (230) of FIG. 2 and / or FIG. 4.

[0077] In one embodiment, the electronic device (101) may include a first support structure (212) and a second support structure (222). For example, the first housing portion (210) may include the first support structure (212), and the second housing portion (220) may include the second support structure (222). In one embodiment, the first support structure (212) and / or the second support structure (222) may support components of the electronic device (101), such as a display (240), a battery (250), and a printed circuit board (260).

[0078] In one embodiment, the first support structure (212) and / or the second support structure (222) may be formed of a metallic material and / or a non-metallic (e.g., polymer) material. In one embodiment, the first support structure (212) may be disposed between the display (240) and the battery (250). For example, the display (240) may be coupled to one surface of the first support structure (212), and the battery (250) and the printed circuit board (260) may be disposed on the other surface.

[0079] According to one embodiment, the electronic device (101) may include a first protective member (214) and a second protective member (224). For example, the first housing portion (210) may include the first protective member (214), and the second housing portion (220) may include the second protective member (224). According to one embodiment, the protective members (214, 224) may protect the display (240) from external impact. For example, the first protective member (214) may surround at least a portion of a part of the display (240) (e.g., the first display area (231) of FIG. 2), and the second protective member (224) may surround at least a portion of another part of the display (240) (e.g., the second display area (232) of FIG. 2). In one embodiment, the first protective member (214) may be referred to as a first fixing member, and the second protective member (214) may be referred to as a second fixing member.

[0080] In one embodiment, the housing (210, 220) may include a first back plate (216) and a second back plate (226). For example, the first housing portion (210) may include a first back plate (216) connected to a first support structure (212), and the second housing portion (220) may include a second back plate (226) connected to a second support structure (222). In one embodiment, the back plates (216, 226) may form a portion of the exterior of the electronic device (101). For example, the first back plate (216) may form a first back surface (e.g., the first back surface (210b) of FIGS. 2 to 4), and the second back plate (226) may form a second back surface (e.g., the second back surface (220b) of FIGS. 2 to 4). According to one embodiment, the first battery (252) and the first printed circuit board (262) may be disposed between the first support structure (212) and the first back plate (216), and the second battery (254) and the second printed circuit board (264) may be disposed between the second support structure (222) and the second back plate (226).

[0081] In one embodiment, the hinge cover (230) can accommodate at least a portion of the hinge assembly (280). For example, the hinge cover (230) can include a receiving groove (232) for accommodating the hinge assembly (280). In one embodiment, the hinge cover (230) can be coupled with the hinge assembly (280). In one embodiment, when the electronic device (101) is unfolded, at least a portion of the hinge cover (230) can be positioned between the hinge assembly (280) and the housing (210, 220).

[0082] According to one embodiment, the battery (250) is a device for supplying power to at least one component of the electronic device (101), and may include a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. The battery (250) may be integrally disposed within the electronic device (101), or may be detachably disposed with the electronic device (101). According to one embodiment, the battery (250) may include a first battery (252) disposed within a first housing portion (210) and a second battery (254) disposed within a second housing portion (220). For example, the first battery (252) may be disposed on a first support structure (212), and the second battery (254) may be disposed on a second support structure (222).

[0083] According to one embodiment, the printed circuit board (260) may be equipped with a processor (e.g., processor (120) of FIG. 1), memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1). According to one embodiment, the printed circuit board (260) may include a first printed circuit board (262) disposed within a first housing portion (210) and a second printed circuit board (264) disposed within a second housing portion (220).

[0084] In one embodiment, a flexible printed circuit board (270) can electrically connect a component (e.g., a first printed circuit board (262)) located in a first housing portion (210) and a component (e.g., a second printed circuit board (264)) located in a second housing portion (220). In one embodiment, the flexible printed circuit board (270) can be a flexible printed circuit board (FPCB). In one embodiment, at least a portion of the flexible printed circuit board (270) can traverse the hinge cover (230) and / or the hinge assembly (280). For example, a portion of the flexible printed circuit board (270) can be disposed within the first housing portion (210) and another portion can be disposed within the second housing portion (220). In one embodiment, the flexible printed circuit board (270) can be connected to an antenna or connected to a display (240). According to one embodiment, the flexible printed circuit board (270) can be configured such that at least one portion is bendable.

[0085] In one embodiment, a hinge assembly (280) can be connected to a first housing portion (210) and a second housing portion (220). In one embodiment, the first housing portion (210) can be rotated relative to the second housing portion (220) using the hinge assembly (280). In one embodiment, the hinge assembly (280) can rotatably connect the first housing portion (210) and the second housing portion (220) from a folded state (e.g., FIG. 4) to an unfolded state (e.g., FIG. 2).

[0086] In one embodiment, the hinge assembly (280) may include a plurality of hinge assemblies (280-1, 280-2) arranged in parallel. For example, the hinge assembly (280) may include a first hinge assembly (280-1) and a second hinge assembly (280-2) spaced apart from the first hinge assembly (280-1). In one embodiment, the first hinge assembly (280-1) may be symmetrical with respect to the second hinge assembly (280-2) with respect to the longitudinal direction (e.g., Y-axis direction) of the electronic device (101).

[0087] Although the electronic device (101) disclosed in FIGS. 2 to 5 has the appearance of a foldable electronic device, the present invention is not limited thereto. For example, the illustrated electronic device may be a bar type, a plate type, or a rollable electronic device. The term "rollable electronic device" may refer to an electronic device in which a display (e.g., the display (240) of FIG. 5) is capable of bending deformation, such that at least a portion thereof can be wound or rolled, or can be accommodated inside a housing (e.g., the housing (201) of FIG. 2). Depending on the user's needs, the rollable electronic device can be used by expanding the screen display area by unfolding the display or exposing a wider area of ​​the display to the outside.

[0088] FIG. 6A is a perspective view of a first substrate assembly and a conductive plate according to an embodiment of the present disclosure. FIG. 6B is a side cross-sectional view taken along line A-A' of FIG. 6A according to an embodiment of the present disclosure. FIG. 6C is an enlarged view of portion D of FIG. 6B according to an embodiment of the present disclosure. FIG. 7A is a plan view illustrating a first housing, a sub-display, and a second substrate assembly of an electronic device according to an embodiment of the present disclosure. FIG. 7B is an enlarged view of portion E of FIG. 7A according to an embodiment of the present disclosure. FIG. 8A is a perspective view of a first substrate assembly and a conductive plate of a conventional electronic device. FIG. 8B is a plan view of the first substrate assembly, the second substrate assembly, and the conductive plate according to an embodiment of the present disclosure.

[0089] Referring to FIGS. 6A to 7B, in one embodiment, an electronic device (e.g., an electronic device (101) of FIGS. 1, 2 to 5) includes a housing (e.g., a housing (201) of FIGS. 2 to 5) that forms an exterior of the electronic device (101) and includes a first housing portion (310) (e.g., a first housing portion (210) of FIGS. 2 to 5) and a second housing portion (220) of FIGS. 2 to 5) that is configured to be movable (e.g., rotatable) relative to the first housing portion (310), a flexible display (e.g., a flexible display (240) of FIGS. 2 and 5) disposed on the first housing portion (310) and the second housing portion (220), a first substrate assembly (304) that includes a first substrate (340) and a sensor integrated circuit (341), and a second electronic component (352). The electronic device (101) may further include a second substrate assembly (350) including a conductive plate (360) and an extension portion (361). Referring to FIGS. 7A and 7B , in one embodiment, the electronic device (101) may further include a sub-display (330) (e.g., the sub-display (234) of FIGS. 4 and 4 ) disposed in the first housing portion (310). Referring to FIG. 6B , according to one embodiment, the electronic device (101) may further include a front structure (313). For example, the front structure (313) may be disposed between the flexible display (240) and the substrate assembly (304) and may include a structure (e.g., a storage medium tray) and / or electrical / electronic components. In the present disclosure, the extension portion (361) of the conductive plate (360) may be referred to as a shielding structure.

[0090] In one embodiment, the first substrate assembly (304) may include a first substrate (340), a third substrate (370), a sensor integrated circuit (341), a first electronic component (342), a shielded can (343), and a third electronic component (371). In one embodiment, the first substrate (340) may include a first surface (340a) and a second surface (340b) facing in an opposite direction to the first surface (340a) or in a direction (e.g., a +Z direction) in which a flexible display (e.g., the flexible display (240) of FIGS. 2 and 5) is disposed. In one embodiment, the sensor integrated circuit (341) and the first electronic component (342) may be disposed on the first surface (340a) of the first substrate (340). The first substrate (340) and the third substrate (370) may be arranged in parallel while being spaced apart from each other, and may be physically and electrically connected to each other. In some embodiments, the first substrate (340) and the third substrate (370) may be configured as a single substrate. For example, the third electronic component (371) may refer to various electrical / electronic components (e.g., integrated circuits) arranged on the third substrate (370).

[0091] According to one embodiment, the sensor integrated circuit (341) may include at least one sensor, including a gyro sensor. For example, the gyro sensor may be a MEMS sensor. For example, the sensor integrated circuit (341) may be a component (e.g., a surface mounted device, SMD) surface-mounted on the first surface (340a) of the first substrate (340). For example, the first electronic component (342) may refer to various electrical / electronic components (e.g., integrated circuits) disposed on the first surface (340a) of the first substrate (340) and positioned around the sensor integrated circuit (341).

[0092] For example, a shielded can (343) may be placed on a first surface (340a) of a first substrate (340) and positioned around a sensor integrated circuit (341). According to one embodiment, the shielded can (343) may be placed so as not to overlap with the sensor integrated circuit (341) when looking down at the first surface (340a) of the first substrate (340) from above. In the present disclosure, looking down at certain configurations from above at the first surface (340a) of the first substrate (340) may be understood to have the same meaning as looking at certain configurations in the thickness direction (e.g., +Z direction) of the electronic device (101). Referring to FIG. 6b, according to one embodiment, the minimum value of the second distance (d2) between the shield can (343) and the conductive plate (360) may be smaller than the first distance (d1) between the first extension (361) and the first surface (340a) of the first substrate (340).

[0093] In one embodiment, the second substrate assembly (350) may include a second substrate (351) and a second electronic component (352). The second substrate assembly (350) may be disposed facing a portion of a flexible display (e.g., the flexible display (240) of FIGS. 2 and 5) with the first substrate assembly (304) interposed therebetween. In one embodiment, the second substrate assembly (350) may be disposed between the sub-display (330) and the conductive plate (360).

[0094] In one embodiment, the second substrate assembly (350) may be electrically connected to the display panel of the sub-display (330). In one embodiment, the second substrate assembly (350) may be disposed inside the sub-display (330). For example, the second substrate assembly (350) may be a component (e.g., a sub-display module) that is integrated or modularized with the sub-display (330). In one embodiment, the second substrate assembly (350) may be electrically connected to the first substrate assembly (304).

[0095] In one embodiment, the second substrate assembly (350) may include a display driver IC electrically connected to the sub-display (330) (e.g., a display panel). As an example, if the sub-display (330) includes a touch sensor, the second substrate assembly (350) may include a touch sensor panel IC (TSP-IC).

[0096] According to one embodiment, the second substrate assembly (350) or the first substrate assembly (304) may include a control circuit electrically connected to a display driver IC of the sub-display (330). The control circuit may be configured to receive and process image information including image data or an image control signal corresponding to a command for controlling the image data in conjunction with the display driver circuit, so that visual information (e.g., text, an image, or an icon) is displayed on the sub-display (330).

[0097] According to one embodiment, the second electronic component (352) may be disposed on one side (e.g., the +Z direction side) of the second substrate (351) facing the first side (340a) of the first substrate (440). According to one embodiment, the second electronic component (352) may include a capacitor. For example, the second electronic component (352) may include a converter (e.g., a DC to DC converter or a charge pump) including a capacitor. As an example, the second electronic component (352) may be a converter that uses a capacitor to step up or step down the voltage of a power source supplied to a display driving circuit included in the second substrate assembly (350). For example, the capacitor of the second electronic component (352) may operate at a specific frequency (e.g., about 23 KHz), and electromagnetic noise (e.g., indicated by N in FIG. 6B) may be emitted to the outside from the capacitor. For example, electromagnetic noise (e.g., indicated as N in FIG. 6b) generated from the second electronic component (352) and radiated to the outside of the second substrate assembly (350) can be measured at about 23 KHz at about 240 mV.

[0098] FIG. 8A is a drawing for explaining an existing conductive plate (60) and an existing sensor integrated circuit (41) arranged on a substrate (40). For example, the existing conductive plate (60) may be connected or fixed to the substrate (40) through connecting portions (C1, C2, C3, C4, C5). Referring to FIG. 8A, the existing conductive plate (60) and the existing sensor integrated circuit (41) may be arranged to overlap in the thickness direction of the electronic device (e.g., the Z-axis direction). The existing conductive plate (60) may not include a structure for shielding the existing sensor integrated circuit (41) from electromagnetic noise (e.g., indicated by N in FIG. 6B) emitted from a main noise source (e.g., the second electronic component (352) of FIG. 6B, FIG. 7A, FIG. 7B, and FIG. 8B). Referring to FIG. 8a, since there is no shielding structure between the existing sensor integrated circuit (41) and the main noise source (e.g., the second electronic component (352) of FIGS. 6b, 7a, 7b, and 8b), electromagnetic noise (e.g., indicated by N in FIG. 6b) emitted from the main noise source (e.g., the second electronic component (352) of FIGS. 6b, 7a, 7b, and 8b) may be induced in the existing sensor integrated circuit (41), and performance degradation and malfunction of the existing sensor integrated circuit (41) may occur.

[0099] Referring to FIG. 8B, in one embodiment, the second electronic component (352) of the second substrate assembly (350) may be arranged so as not to overlap the sensor integrated circuit (341) when looking down at the first surface (340a) of the first substrate (340) from above. In the present disclosure, when certain configurations are viewed from above at the first surface (340a) of the first substrate (340), it may be understood to mean the same as when certain configurations are viewed in the thickness direction (e.g., +Z direction) of the electronic device (101). In other words, according to one embodiment, the second electronic component (352) of the second substrate assembly (350) may be arranged spaced apart from the sensor integrated circuit (341).

[0100] Referring to FIGS. 6A and 6B, according to one embodiment, a conductive plate (360) may be at least partially disposed between the first substrate assembly (304) and the second substrate assembly (350). According to one embodiment, the conductive plate (360) may include a first region (360a) and an extension (361) protruding from one side of the first region (360a).

[0101] According to one embodiment, the first region (360a) may be arranged parallel to the first surface (340a) of the first substrate (340) and facing the sensor integrated circuit (341).

[0102] In one embodiment, the extension (361) can be formed or arranged to surround at least one side (e.g., the +X direction side) of the first substrate assembly (304) of the sensor integrated circuit (341) facing the second electronic component (352). In one embodiment, the extension (361) can be configured to shield the sensor integrated circuit (341) (e.g., the gyro sensor) from electromagnetic noise (e.g., indicated by N in FIG. 6B) emitted from the second electronic component (352) (e.g., a capacitor) of the second substrate assembly (350). For example, the conductive plate (360) and a portion thereof, the extension (361), can be made of a conductive material, such as a metal (e.g., stainless steel). According to one embodiment, the extension (361) may be formed or arranged to protrude from one side of the first region (340a) toward the first surface (340a) of the first substrate (340) in a direction intersecting the first region (340a). According to one embodiment, the extension (361) may have a flat shape. However, the shape of the extension (361) in the present disclosure is not limited, and may be changed according to the arrangement relationship between the sensor integrated circuit (341), the second electronic component (352), and / or the conductive plate (360), and may, for example, have a shape including a plurality of surfaces inclined with respect to each other (e.g., see FIGS. 11 and 12).

[0103] According to one embodiment, the extension portion (361) may be spaced apart from the first surface (340a) of the first substrate (340) by a first distance (d1). For example, when the extension portion (361) is spaced apart from the first surface (340a) of the first substrate (340) by the first distance (d1), compared to a case where the extension portion (361) comes into contact with the first surface (340a) of the first substrate (340), the phenomenon of the first substrate (340) being damaged due to the extension portion (361) being displaced by an external impact and coming into contact with the first substrate (340) can be reduced or prevented. Referring to FIG. 6B, according to one embodiment, the first distance (d1) between the first extension (361) and the first surface (340a) of the first substrate (340) may be greater than the minimum value of the second distance (d2) between the shield can (343) and the conductive plate (360). In this case, when the first distance (d1) is greater than the minimum value of the second distance (d2), even if the extension (361) and the first substrate (340) are moved closer together due to an external impact, the shield can (343) and the conductive plate (360) having a narrower gap come into contact with each other before the extension (361) and the first substrate (340) having a relatively larger gap, thereby reducing or preventing damage to the first substrate (340) by the extension (361).

[0104] In one embodiment, the conductive plate (360) can be grounded to a first substrate assembly (304) (e.g., the first substrate (340)) and / or a second substrate assembly (350) and / or a conductive structure (e.g., the conductive portion of the first housing portion (310)) within the electronic device (101). For example, the conductive plate (360) can be grounded to a ground of the first substrate (340) of the first substrate assembly (304) and / or a ground of the third substrate (370). For example, the conductive plate (360) can be grounded to a conductive structure (e.g., the conductive portion of the first housing portion (310)) within the electronic device (101).

[0105] Referring to FIG. 8B, according to one embodiment, the conductive plate (360) can be connected or secured to the first substrate assembly (304) (e.g., the first substrate (340)) and / or the second substrate assembly (350) and / or another structure (e.g., the first housing portion (310)) within the electronic device (101) via a plurality of connecting portions (C1, C2, C3, C4, C5). For example, the connecting portions (C1, C2, C3, C4, C5) can include through holes and / or fastening members. For example, the fastening member included in the connecting portions (C1, C2, C3, C4, C5) may be configured to be conductive and ground the conductive plate (360) to the first substrate assembly (304) (e.g., the first substrate (340)) and / or the second substrate assembly (350) and / or the conductive structure of the electronic device (101) (e.g., the conductive portion of the first housing portion (310)). For example, the connecting portions (C1, C2, C3, C4, C5) may not include a detachable fastening member but may include a protruding structure that is part of the conductive plate (360).

[0106] FIG. 9A is a graph illustrating the distribution of measurement values ​​of a sensor integrated circuit of a conventional electronic device. FIG. 9B is a graph illustrating the distribution of measurement values ​​of a sensor integrated circuit when a shielding structure according to an embodiment of the present disclosure is used. FIG. 10A is a graph illustrating the failure rate of a sensor integrated circuit of a conventional electronic device. FIG. 10B is a graph illustrating the failure rate of a sensor integrated circuit of an electronic device including a shielding structure according to an embodiment of the present disclosure.

[0107] The horizontal axis (or X-axis) of FIGS. 9A and 9B may represent time, and the vertical axis (or Y-axis) may represent angular velocity (degree per second, dps). FIG. 9A may represent a data value of a sensor integrated circuit (41) in an electronic device including a conventional structure (e.g., a substrate (40), a conventional sensor integrated circuit (41), and a conventional conductive plate (60) of FIG. 7A). FIG. 9A may represent a data value of a sensor integrated circuit (41) exposed to electromagnetic noise of about 23 KHz emitted from a major noise source (e.g., a second electronic component (352) of FIGS. 6B, 7A, 7B, and 8B).

[0108] FIG. 9B may represent a distribution of data values ​​of a sensor integrated circuit (341) when a conductive plate (360) including an extension portion (361), which is a shielding structure according to an embodiment of the present disclosure described above with reference to FIGS. 6A to 7B and 8B, is applied. FIG. 9B may be substantially the same as or similar to the data values ​​of the sensor integrated circuit (41) when no electromagnetic noise is induced in the sensor integrated circuit (41) when other conditions are the same as those of FIG. 9A except for the presence or absence of the extension portion (361). Referring to FIG. 9B, when there is no electromagnetic noise, the data values ​​show a stable distribution within -0.5 to +0.5, whereas, referring to FIG. 9A, it can be confirmed that when electromagnetic noise is induced, the data values ​​increase in width from -1 to +1. For example, values ​​less than -0.5 or greater than +0.5 in the data of FIG. 9b may be values ​​derived from noise caused by the operation of an electronic device (e.g., keyboard input) rather than electromagnetic noise.

[0109] The horizontal axis (or X-axis) of FIGS. 10A and 10B may represent the number (or objects) of electronic devices used for measuring angular velocity, and the vertical axis (or Y-axis) may represent angular velocity (degrees per second, dps). For example, one dot in FIGS. 10A and 10B may correspond to one electronic device.

[0110] FIG. 10A may represent a distribution of data values ​​and occurrence of defects of a sensor integrated circuit (41) in an electronic device including a conventional structure (e.g., a substrate (40) of FIG. 7A, a conventional sensor integrated circuit (41), and a conventional conductive plate (60)). FIG. 10A may represent data values ​​of a sensor integrated circuit (41) exposed to electromagnetic noise of about 23 KHz emitted from a major noise source (e.g., a second electronic component (352) of FIGS. 6B, 7A, 7B, and 8B). Referring to FIG. 10A, in the conventional structure, defective entities indicated as f1, f2, and f3 may be observed, and here, the defective entities (f1, f2, f3) may be entities classified as defective because the data of the sensor integrated circuit (41) is measured to deviate from a specific value (F).

[0111] FIG. 10B may represent the numerical value of data of a sensor integrated circuit (341) and the distribution of occurrence of defects in an electronic device (101) that applies a conductive plate (360) including an extension portion (361), which is a shielding structure according to an embodiment of the present disclosure described above with reference to FIGS. 6A to 7B and 8B. FIG. 10B may be substantially the same as or similar to the numerical value of data of a sensor integrated circuit (41) when no electromagnetic noise is induced in the sensor integrated circuit (41) when other conditions are the same as those of FIG. 10A except for the presence or absence of the extension portion (361). Referring to FIG. 10B, when there is no electromagnetic noise, the numerical value of data may show a stable distribution of about +0.5, and, as in FIG. 10A, defective objects (f1, f2, f3) may not be observed.

[0112] Referring to the graphs of FIGS. 9A to 10B, according to one embodiment of the present disclosure, by shielding the sensor integrated circuit (41) (e.g., a gyro sensor) from electromagnetic noise emitted from a main noise source (e.g., the second electronic component (352) of FIGS. 6B, 7A, 7B, and 8B), distortion of data measured by the sensor integrated circuit (41) and resulting functional errors of the electronic device (e.g., malfunction of OIS (optical image stabilization)) can be prevented, and it can be confirmed that the measurement accuracy of the sensor integrated circuit (41) is improved.

[0113] FIG. 11 is a perspective view of a first substrate assembly and a conductive plate of an electronic device according to one embodiment of the present disclosure. FIG. 12 is a perspective view of a first substrate assembly and a conductive plate of an electronic device according to one embodiment of the present disclosure.

[0114] The embodiments of FIGS. 11 and 12 may differ in the shape of the extension portion (361) from the embodiments described above with reference to FIGS. 6A to 7B and FIG. 8B. The description of other components of the electronic device (101) excluding the extension portion (361) described above with reference to FIGS. 6A to 7B and FIG. 8B may also be equally applied to the embodiments of FIGS. 11 and 12.

[0115] Referring to FIG. 11, according to one embodiment, the extension portion (361) may include a first extension portion (361a) and a second extension portion (361b) disposed around the first extension portion (361a).

[0116] According to one embodiment, the first extension portion (361a) and the second extension portion (361b) may be formed or arranged to surround at least one side (e.g., the +X direction side and the +Y direction side) of the first substrate assembly (304) of the sensor integrated circuit (341) facing the second electronic component (352). According to one embodiment, the first extension portion (361a) and the second extension portion (361b) may be configured to shield the sensor integrated circuit (341) (e.g., the gyro sensor) from electromagnetic noise (e.g., indicated by N in FIG. 6b) emitted from the second electronic component (e.g., the second electronic component (352) of FIG. 6b) of the second substrate assembly (e.g., the second substrate assembly (350) of FIG. 6b) (e.g., a capacitor).

[0117] In one embodiment, the second extension (361b) may form an angle other than 0 or 180 degrees (e.g., about 90 degrees) with the first extension (361a). In one embodiment, the first extension (361a) may be formed to protrude from one side of the first region (360a), and the second extension (361b) may be formed to protrude from the other side extending from the one side of the first region (360a), in a direction intersecting the first region (360a) or in a direction (e.g., +Z direction) toward the first surface (340a) of the first substrate (340). For example, a second electronic component (e.g., a second electronic component (352) of FIG. 6B) of a second substrate assembly (e.g., a second substrate assembly (350) of FIG. 6B) may be positioned to face the first extension portion (361a) and the second extension portion (361b), for example, to face the boundary between the first extension portion (361a) and the second extension portion (361b).

[0118] However, the shape of the extension portion (361) in the present disclosure is not limited and may be changed depending on the arrangement relationship between the sensor integrated circuit (341), the second electronic component (352) and / or the conductive plate (360).

[0119] Referring to FIG. 12, according to one embodiment, the extension portion (361) may include a first extension portion (361a), a second extension portion (361b) disposed around the first extension portion (361a), and a third extension portion (361c) facing the first extension portion (361a). For example, the first extension portion (361a) may be disposed on one side of the second extension portion (361b), and the third extension portion (361c) may be disposed on the opposite side of the second extension portion (361b). In other words, at least a portion of the second extension portion (361b) may be disposed between the first extension portion (361a) and the third extension portion (361c).

[0120] According to one embodiment, the first extension portion (361a), the second extension portion (361b), and the third extension portion (361c) may be formed or arranged to surround a plurality of surfaces (e.g., +X direction surface, +Y direction surface, and -Y direction surface) facing the second electronic component (352) of the first substrate assembly (304) of the sensor integrated circuit (341). According to one embodiment, the first extension portion (361a), the second extension portion (361b), and the third extension portion (361c) may be configured to shield the sensor integrated circuit (341) (e.g., a gyro sensor) from electromagnetic noise (e.g., indicated by N in FIG. 6b) emitted from a second electronic component (e.g., a second electronic component (352) of FIG. 6b) (e.g., a capacitor) of the second substrate assembly (e.g., the second substrate assembly (350) of FIG. 6b).

[0121] In one embodiment, the first extension portion (361a) and the third extension portion (361c) may form an angle other than 0 or 180 degrees (e.g., about 90 degrees) with the second extension portion (361b). In one embodiment, the first extension portion (361a), the second extension portion (361b), and the third extension portion (361c) may be formed to protrude from different adjacent side surfaces of the first region (360a) in a direction intersecting the first region (360a) or in a direction (e.g., +Z direction) toward the first surface (340a) of the first substrate (340). For example, a second electronic component (e.g., a second electronic component (352) of FIG. 6B) of a second substrate assembly (e.g., a second substrate assembly (350) of FIG. 6B) may face the first extension portion (361a), the second extension portion (361b) and / or the third extension portion (361c), and may be arranged to face, for example, a boundary between the first extension portion (361a) and the second extension portion (361b) and / or a boundary between the second extension portion (361b) and the third extension portion (361c). However, the shape of the extension portion (361) in the present disclosure is not limited and may be changed depending on the arrangement relationship between the sensor integrated circuit (341), the second electronic component (352) and / or the conductive plate (360).

[0122] FIG. 13A is a perspective view of a first substrate assembly and a shielding member of an electronic device according to an embodiment of the present disclosure. FIG. 13B is a perspective view of a first substrate assembly and a shielding member of an electronic device according to an embodiment of the present disclosure. FIG. 14 is a perspective view of a first substrate assembly and a shielding member of an electronic device according to an embodiment of the present disclosure.

[0123] In the embodiments of FIGS. 13A to 14, the shielding structure may be replaced with a shield can (or second shielding member) (380, 390) instead of the extension portion (361) in the embodiments described above with reference to FIGS. 6A to 7B and 8B. The description of other components of the electronic device (101) excluding the extension portion (361) described above with reference to FIGS. 6A to 7B and 8B may be equally applied to the embodiments of FIGS. 13A to 14.

[0124] Referring to FIGS. 13A and 13B , according to one embodiment, the first substrate assembly may further include a shielding member (380) disposed on a first surface (340a) of the first substrate (340). For example, the shielding member (380) may be conductive and may be, for example, a shielded can. According to one embodiment, the shielding member (380) may include a first portion (381), a first space (S1) formed between the first portion (381) and the first substrate (340), a second portion (382) extending from the first portion (381), and a second space (S2) formed between the second portion (382) and the first substrate (340). For example, the shielding member (380) may further include a slit (383) formed between the first portion (381) and the second portion (382). For example, the first space (S1) and the second space (S2) can be electrically isolated. For example, the first portion (381) can include a partition wall (381a) arranged at the boundary with the second portion (382).

[0125] According to one embodiment, the sensor integrated circuit (341) may be disposed in the second space (S2). According to one embodiment, the second portion (382) may include an upper wall (382a) facing an upper surface (e.g., a -Z direction surface) of the sensor integrated circuit (341) and a side wall (382b) extending from the upper wall (382a) and facing a side surface of the sensor integrated circuit (341). According to one embodiment, the second portion (382) may be configured to shield the sensor integrated circuit (341) (e.g., a gyro sensor) from electromagnetic noise (e.g., indicated by N in FIG. 6b) emitted from a second electronic component (e.g., a second electronic component (352) in FIG. 6b) (e.g., a capacitor) of a second substrate assembly (e.g., the second substrate assembly (350) in FIG. 6b).

[0126] According to one embodiment, the first substrate assembly further includes a shielding member (390) disposed on the first surface of the first substrate,

[0127] Referring to FIGS. 13A and 13B , according to one embodiment, the first substrate assembly may further include a shielding member (390) disposed on the first surface (340a) of the first substrate (340). For example, the shielding member (390) may be conductive and may be, for example, a shielded can. According to one embodiment, the shielding member (390) may include a main body (391) and a protrusion (392) extending from the main body (391). According to one embodiment, the protrusion (392) may be a portion that protrudes outwardly from the main body (391) in a cantilever shape. For example, the main body (391) of the shielding member (390) may form a third space between the main body (391) and the first surface (340a) on the inside, and the protrusion (392) may be located outside the third space. For example, the protrusion (392) may extend parallel to the first surface (340a). In one embodiment, the protrusion (392) may be disposed to face the upper surface (e.g., the -Z direction surface) of the sensor integrated circuit (341). In one embodiment, the protrusion (392) may be configured or disposed to shield the sensor integrated circuit (341) (e.g., a gyro sensor) from electromagnetic noise (e.g., indicated by N in FIG. 6b) emitted from a second electronic component (e.g., a second electronic component (352) in FIG. 6b) (e.g., a capacitor) of a second substrate assembly (e.g., the second substrate assembly (350) in FIG. 6b).

[0128] Electronic devices (e.g., smartphones) may be equipped with a gyro sensor to measure angular velocity and thus the tilt and displacement of the electronic device. Such gyro sensors (e.g., gyro MEMS sensors) may be relatively more vulnerable to external shocks, heat, and electromagnetic noise than other sensors. Therefore, due to their vulnerability to heat, gyro sensors cannot be mounted inside a shield can that accommodates heat sources (e.g., AP chips), and due to their vulnerability to electromagnetic noise, they must be sufficiently separated from noise sources (e.g., PMICs). Therefore, the gyro sensor may be placed on a circuit board at a location around the shield can that ensures a distance from noise sources. For example, in the case of a foldable terminal (or foldable electronic device), an additional display (or sub-display) may be provided that is displayed on the exterior of the terminal when the main display is folded so that it is not exposed to the outside. In such foldable terminals, when the gyro sensor is placed around a shield can on the circuit board, noise emitted to the gyro sensor from a noise source (e.g., a charge pump DCDC converter capacitor) placed between the sub-display and the gyro sensor may cause the gyro sensor to malfunction. To shield the gyro sensor, a separate shield can for the gyro sensor or a method of securing a sufficient distance from the noise source may be used. However, such methods may be difficult to apply to foldable terminals due to the mounting space.

[0129] Aspects of the present disclosure are intended to solve at least the problems and / or disadvantages described above and to provide at least the advantages described below.

[0130] According to an embodiment of the present disclosure, a shielding structure may be provided that is a modification of a conventional conductive plate adjacent to a gyro sensor, in order to shield a gyro sensor (or a sensor integrated circuit) from a major noise source (e.g., a capacitor (or a second electronic component) of a display driver circuit (DDI)) in an electronic device (e.g., a foldable electronic device). According to an embodiment of the present disclosure, the conductive plate may include an extension portion arranged to surround a side of the gyro sensor facing a major noise source, in order to shield the gyro sensor from the major noise source.

[0131] According to one embodiment of the present disclosure, by shielding a gyro sensor from electromagnetic noise emitted from a major noise source (e.g., a capacitor), distortion of data measured by the gyro sensor and resulting functional errors in an electronic device (e.g., malfunction of optical image stabilization (OIS)) can be prevented, and the measurement accuracy of the gyro sensor can be improved. However, the problem to be solved in the present disclosure is not limited to the problem mentioned above, and various changes can be made without departing from the spirit and scope of the present disclosure.

[0132] The effects that can be obtained from this disclosure are not limited to the effects mentioned above, and various effects that can be directly or indirectly identified through this document may be provided.

[0133] The shielding structure of the present disclosure described above and the electronic device including the same are not limited to the above-described embodiments and drawings, and it will be apparent to a person skilled in the art to which the present disclosure pertains that various substitutions, modifications, and changes are possible within the technical scope of the present disclosure.

[0134] According to one embodiment of the present disclosure, an electronic device (101) may be provided. The electronic device comprises a housing including a first housing portion (210, 310) and a second housing portion (220) configured to be movable relative to the first housing, a first substrate assembly (304) disposed within the first housing portion, the first substrate assembly including a first substrate (340), a sensor integrated circuit (341) disposed on a first surface (340a) of the first substrate, a first electronic component (342) disposed on the first surface, and a shield can (343) disposed on the first surface of the first substrate to surround the first electronic component, a conductive plate (360) disposed on an upper portion of the shield can, and a second substrate assembly (350) disposed on an upper portion of the first substrate within the first housing portion, the second substrate including a second substrate (351) and a second electronic component (352) positioned adjacent to the sensor integrated circuit on one surface of the second substrate facing the first surface of the first substrate. A substrate assembly may be included. The conductive plate may include a first region (360a) parallel to the first surface of the first substrate and an extension portion (361) extending perpendicularly to the first region to cover at least a portion of a surface of the sensor integrated circuit facing the second electronic component to shield the sensor integrated circuit from noise generated from the second electronic component.

[0135] According to one embodiment, one end of the extension may be spaced apart from the first surface of the first substrate by a first distance (d1).

[0136] According to one embodiment, the shield can is positioned so as not to overlap the sensor integrated circuit when looking down at the first surface of the first substrate, and a minimum value of a second distance (d2) between the shield can and the conductive plate may be smaller than the first distance.

[0137] According to one embodiment, the conductive plate may further include a first region (360a) that is parallel to the first surface of the first substrate and faces the sensor integrated circuit. The extension may protrude from one side of the first region toward the first surface in a direction intersecting the first region.

[0138] In one embodiment, the extension may be in the form of a flat plate.

[0139] In one embodiment, the extension may include a first extension and a second extension disposed around the first extension and forming an angle other than 0 or 180 degrees with the first extension.

[0140] According to one embodiment, the extension portion further includes a third extension portion facing the first extension portion, wherein the first extension portion may be disposed on one side of the second extension portion and the third extension portion may be disposed on an opposite side of the second extension portion.

[0141] In one embodiment, the conductive plate can be grounded to at least one of the ground of the first substrate assembly or the conductive portion of the housing.

[0142] According to one embodiment, the flexible display (240) may further be disposed in the first housing portion and the second housing portion. The flexible display may further include a sub-display (234, 330) disposed between a first opening (2101) formed at least partially in the first housing portion and the second substrate assembly and configured to display an image through the first opening.

[0143] According to one embodiment, the second substrate assembly may include a display driver IC electrically connected to the display panel of the sub-display.

[0144] According to one embodiment, the second electronic component may be positioned so as not to overlap the sensor integrated circuit when looking down at the first surface of the first substrate.

[0145] According to one embodiment, the second electronic component may include a capacitor.

[0146] According to one embodiment, the sensor integrated circuit may include a gyro sensor.

[0147] According to one embodiment, the first substrate assembly further includes a shielding member (380) disposed on the first surface of the first substrate, the shielding member forming a first space (S1) therebetween and a second space (S2) electrically isolated from the first space, and the sensor integrated circuit can be disposed in the second space.

[0148] According to one embodiment, the first substrate assembly may further include a shielding member (390) disposed on the first surface of the first substrate. The shielding member may include a third space formed between the first surface and the first surface on the inside, and a protrusion (392) extending parallel to the first surface on the outside of the third space and disposed to face the sensor integrated circuit.

[0149] According to one embodiment of the present disclosure, an electronic device (101) may be provided. The electronic device may include a housing (201) forming an exterior of the electronic device, the housing including a first housing portion (210, 310) including a first opening (2101) and a second housing portion (220) configured to be movable with respect to the first housing, a sub-display (234, 330) arranged to display an image through the first opening, a first substrate assembly (304) arranged within the first housing portion, the first substrate assembly including a first substrate (340) and a sensor integrated circuit (341) arranged on a first surface (340a) of the first substrate, a second substrate assembly (350) arranged between the sub-display and the first substrate assembly, the second substrate assembly including an electronic component (352) and electrically connected to the sub-display, and a conductive plate (360) at least partially arranged between the first substrate assembly and the second substrate assembly. The conductive plate may include an extension (361) formed to surround a surface of the sensor integrated circuit facing the electronic component so as to shield the sensor integrated circuit from the electronic component.

[0150] According to one embodiment, one end of the extension may be spaced apart from the first surface of the first substrate by a first distance (d1).

[0151] According to one embodiment, the conductive plate may further include a first region (360a) that is parallel to the first surface of the first substrate and faces the sensor integrated circuit. The extension may protrude from one side of the first region toward the first surface in a direction intersecting the first region.

[0152] In one embodiment, the conductive plate can be grounded to at least one of the ground of the first substrate assembly or the conductive portion of the housing.

[0153] According to one embodiment, the second substrate assembly includes a display driver IC electrically connected to the display panel of the sub-display, the electronic component includes a capacitor, and the sensor integrated circuit may include a gyro sensor.

[0154] While this disclosure has been described by way of example and example, it should be understood that the specific embodiment is intended to be illustrative and not limiting. It will be apparent to those skilled in the art that various changes in form and detail may be made without departing from the overall scope of this disclosure, including the appended claims and their equivalents.

[0155] Electronic devices according to embodiments of the present disclosure may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of the present disclosure are not limited to the aforementioned devices.

[0156] It should be understood that the embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to a specific embodiment, but include various modifications, equivalents, or substitutes of the embodiment. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the item, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0157] The term "module" used in one embodiment of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0158] An embodiment of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0159] According to one embodiment, the method according to one embodiment of the present disclosure may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0160] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device (101), A housing comprising a first housing portion (210, 310) and a second housing portion (220) configured to be movable relative to the first housing; and A first substrate assembly (304) disposed within the first housing portion, comprising: a first substrate (340), a sensor integrated circuit (341) disposed on a first surface (340a) of the first substrate, a first electronic component (342) disposed on the first surface, and a shield can (343) disposed on the first surface of the first substrate to surround the first electronic component; A conductive plate (360) placed on the upper part of the shield can; and A second substrate assembly (350) disposed on top of a first substrate within the first housing portion, comprising a second substrate assembly (351) and a second electronic component (352) positioned adjacent to the sensor integrated circuit on one side of the second substrate facing the first side of the first substrate, An electronic device, wherein the conductive plate includes a first area (360a) parallel to the first surface of the first substrate and an extension portion (361) formed to extend perpendicularly to the first area to cover at least a portion of a surface of the sensor integrated circuit facing the second electronic component so as to shield the sensor integrated circuit from noise generated from the second electronic component.

2. In paragraph 1, An electronic device, wherein one end of the extension is spaced apart from the first surface of the first substrate by a first distance (d1).

3. In paragraph 2, An electronic device wherein the shield can is positioned so as not to overlap the sensor integrated circuit when looking down at the first surface of the first substrate from above, and the minimum value of the second distance (d2) between the shield can and the conductive plate is smaller than the first distance.

4. In any one of paragraphs 1 to 3, The conductive plate further includes a first area (360a) that is parallel to the first surface of the first substrate and faces the sensor integrated circuit, An electronic device wherein the extension protrudes from one side of the first region toward the first surface in a direction intersecting the first region.

5. In any one of paragraphs 1 to 4, An electronic device in which the above extension is in the form of a flat plate.

6. In any one of paragraphs 1 to 5, An electronic device, wherein the extension portion comprises a first extension portion and a second extension portion arranged around the first extension portion and forming an angle other than 0 or 180 degrees with the first extension portion.

7. In paragraph 6, An electronic device, wherein the extension portion further includes a third extension portion facing the first extension portion, the first extension portion being disposed on one side of the second extension portion and the third extension portion being disposed on the opposite side of the second extension portion.

8. In any one of paragraphs 1 to 7, An electronic device wherein the conductive plate is grounded to at least one of the ground of the first substrate assembly or the conductive portion of the housing.

9. In any one of paragraphs 1 to 8, Further comprising a flexible display (240) arranged in the first housing portion and the second housing portion, An electronic device further comprising a sub-display (234, 330) disposed between the first opening (2101) formed in at least part of the first housing portion and the second substrate assembly and configured to display an image through the first opening.

10. In paragraph 9, An electronic device, wherein the second substrate assembly includes a display driver IC electrically connected to the display panel of the sub-display.

11. In any one of paragraphs 1 to 10, An electronic device wherein the second electronic component is positioned so as not to overlap the sensor integrated circuit when looking down at the first surface of the first substrate.

12. In any one of paragraphs 1 to 11, An electronic device wherein the second electronic component includes a capacitor.

13. In paragraphs 1 to 12, An electronic device, wherein the sensor integrated circuit includes a gyro sensor.

14. In any one of paragraphs 1 to 13, An electronic device in which the first substrate assembly further includes a shielding member (380) disposed on the first surface of the first substrate, the shielding member forming a first space (S1) between the first substrate and the first space and a second space (S2) electrically isolated from the first space, and the sensor integrated circuit is disposed in the second space.

15. In any one of paragraphs 1 to 11, The first substrate assembly further includes a shielding member (390) disposed on the first surface of the first substrate, An electronic device in which the shielding member includes a third space formed between the first surface on the inside and a protrusion (392) extending parallel to the first surface on the outside of the third space and facing the sensor integrated circuit.

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