Display panel and manufacturing method therefor, and display terminal

Abstract

Disclosed in the present application are a display panel and a manufacturing method therefor, and a display terminal. The display panel comprises a display portion, a bending portion and a bonding portion that are sequentially connected. The display panel further comprises a first backplate, a second backplate, a bonding terminal portion and a functional portion, wherein the first backplate is disposed on the back face of the display portion; the second backplate is disposed on the side of the bonding portion close to the display portion and is provided with an opening; the bonding terminal portion is disposed on the side of the bonding portion facing away from the display portion; the functional portion is arranged corresponding to the opening, with the modulus thereof being greater than that of the second backplate; and the orthographic projection of the bonding terminal portion on the functional portion falls within the functional portion.

Description

Display panel, manufacturing method and display terminal

[0001] This application claims priority to Chinese patent application No. 202410917668.6, filed on July 9, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of display technology, and in particular to display panels, manufacturing methods, and display terminals. Background Technology

[0003] Flexible display panels can be folded or bent, allowing for narrower bezels or smaller sizes, which is why they are favored by consumers.

[0004] To ensure folding or bending performance, display panels often use flexible film layers, such as polyethylene terephthalate (PET), as their substrates. However, due to the poor support of these flexible film layers, when driver chips, flexible circuit boards, and other components are bonded to them, the flexible film layer deforms under temperature and pressure conditions. This results in uneven stress distribution within the film layer, leading to microcracks at stress concentration points. Moisture and other substances can easily penetrate along these microcracks, causing corrosion of the display panel's circuitry and resulting in functional defects.

[0005] Therefore, it is urgent to solve the above-mentioned technical problems. Summary of the Invention

[0006] This application provides a display panel, a manufacturing method, and a display terminal to improve the technical problem that the display panel deforms under temperature and pressure conditions, resulting in uneven stress distribution inside the film layer, forming microcracks at stress concentration points, and allowing moisture and other substances to easily invade along the microcracks, leading to circuit corrosion of the display panel and causing functional defects.

[0007] To solve the above-mentioned technical problems, the technical solution provided in this application is as follows:

[0008] This application provides a display panel, the display panel including a display part, a binding part, and a bent part connecting the display part and the binding part, the binding part being disposed on the side of the display part away from the light emission direction of the display panel, and the display panel further including:

[0009] The first back plate is disposed on the side of the display unit opposite to the light emission direction of the display panel;

[0010] A second back plate is disposed on the side of the binding part near the display part, and the second back plate is provided with an opening;

[0011] A binding terminal portion is provided on the side of the binding portion opposite to the display portion;

[0012] Functional parts are provided corresponding to the openings;

[0013] The orthographic projection of the bonding terminal portion onto the functional portion is located within the functional portion, and the modulus of the functional portion is greater than the modulus of the second back plate.

[0014] This application also provides a method for manufacturing a display panel, the method comprising:

[0015] A backplate base material is provided, and the backplate base material is cut to form a first backplate and a second backplate, wherein the second backplate is provided with an opening;

[0016] A functional part is provided, the functional part being disposed corresponding to the opening, and the modulus of the functional part being greater than the modulus of the second back plate;

[0017] The system provides a flattened display section, a binding section, and a bent section connecting the display section and the binding section. The binding section has a binding terminal section on the side facing away from the light emission direction of the display panel.

[0018] The first back plate, the second back plate, and the functional part are disposed on the side of the display part away from the light emission direction of the display panel. The first back plate is disposed corresponding to the display part, the second back plate is disposed corresponding to the bonding part, and the orthogonal projection of the bonding terminal part on the functional part is located inside the functional part.

[0019] This application also provides a display terminal, the display terminal including the above-described display panel, the display panel including a display part, a binding part, and a bent part connecting the display part and the binding part, the binding part being disposed on the side of the display part away from the light emission direction of the display panel, and the display panel further including:

[0020] The first back plate is disposed on the side of the display unit opposite to the light emission direction of the display panel;

[0021] A second back plate is disposed on the side of the binding part near the display part, and the second back plate is provided with an opening;

[0022] A binding terminal portion is provided on the side of the binding portion opposite to the display portion;

[0023] Functional parts are provided corresponding to the openings;

[0024] The orthographic projection of the bonding terminal portion onto the functional portion is located within the functional portion, and the modulus of the functional portion is greater than the modulus of the second back plate. Attached Figure Description

[0025] Figure 1 is a top view of a display panel provided in an embodiment of this application;

[0026] Figures 2a to 2d are schematic diagrams of a cross-sectional structure at point BB in Figure 1;

[0027] Figure 3 is a schematic diagram of the flattened structure of a portion of the film layer in the display panel shown in Figure 2a;

[0028] Figure 4 is a schematic diagram of another partial film layer flattening structure of the display panel in Figure 2a;

[0029] Figures 5a to 5e are process flow diagrams of the backplate in Figure 3;

[0030] Figure 6 is a schematic diagram of the structure of a display terminal provided in an embodiment of this application. Embodiments of the present invention

[0031] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. Furthermore, it should be understood that the specific embodiments described herein are only for illustration and explanation of this application and are not intended to limit this application. In this application, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in its actual use or working state, specifically the drawing directions in the accompanying drawings; while "inner" and "outer" refer to the outline of the device.

[0032] This application provides a display panel 1, as shown in Figures 1 to 4. The display panel 1 includes a display part 11, a binding part 13, and a bent part 12 connecting the display part 11 and the binding part 13. The binding part 13 is disposed on the side of the display part 11 away from the light emission direction of the display panel 1. The display panel 1 also includes a first back plate 21, a second back plate 22, a binding terminal part 130, and a functional part 40. The first back plate 21 is disposed on the back of the display part 11. The second back plate 22 is disposed on the side of the binding part 13 near the display part 11, and the second back plate 22 is provided with an opening 22a. The binding terminal part 130 is disposed on the side of the binding part 13 away from the display part 11. The functional part 40 is provided corresponding to the opening 22a. The orthographic projection of the binding terminal part 130 on the functional part 40 is located inside the functional part 40, and the modulus of the functional part 40 is greater than the modulus of the second back plate 22.

[0033] In this embodiment, the display panel 1 is a flexible panel, which can be an OLED panel, a Mini-LED panel, a Micro-LED panel, etc.

[0034] In this embodiment, the display part 11, the bending part 12, and the binding part 13 are integrally formed. The display part 11 includes a light-emitting surface and a back surface. The light-emitting surface is used to display the image, and the back surface is the surface opposite to the light-emitting surface. The light-emitting surface of the display part 11 is the side surface of the display part 11 that is away from the binding part 13, and the direction of the light-emitting surface of the display part 11 is the light-emitting direction of the display panel 1.

[0035] As shown in Figure 1, the display unit 11 includes a display area AA and a non-display area NA disposed around the display area AA. The display area AA is provided with a plurality of sub-pixels (not shown in the figure), which may include red sub-pixels, green sub-pixels, and blue sub-pixels, thereby realizing color image display. The non-display area NA may be provided with a driving circuit, such as a gate driving circuit, which is used to provide driving signals to the sub-pixels.

[0036] As shown in Figure 2a, a bonding terminal portion 130 is provided on the side of the bonding portion 13 opposite to the display portion 11, and the bonding terminal portion 130 is used for bonding and connecting with the bonding member 30. The bonding member 30 can be at least one of the following, but is not limited to: a driver chip 51, a flexible circuit board 52, a flip-chip film, etc. The bonding terminal portion 130 is used to input the driving signal of the bonding member 30 to the display panel 1.

[0037] The bonding terminal section 130 includes multiple bonding terminals, which are made of conductive material. Multiple connection traces are provided inside the bonding section 130, each connecting trace connecting to one or more bonding terminals. The surfaces of the bonding terminals are exposed for bonding with the bonding member 30. Bonding connection refers to connecting the conductive materials on both sides of anisotropic conductive adhesive using anisotropic conductive adhesive or the like, thereby achieving electrical connection between the conductive materials on the upper and lower sides of the anisotropic conductive adhesive. However, it is not limited to this. Specifically, the bonding member 30 has multiple bonding terminals on its surface near the bonding section 13. Anisotropic conductive adhesive is placed between the bonding terminals of the bonding terminal section 130 and the bonding terminals of the bonding member 30, and electrical connection between the bonding terminals of the bonding terminal section 130 and the bonding terminals of the bonding member 30 is achieved through heat pressing. The bonding terminals of the bonding terminal section 130 can be electrically connected one-to-one with the bonding terminals of the bonding member 30.

[0038] The bending section 12 includes multiple traces (not shown in the figure). One end of the trace can be connected to a sub-pixel in the display section 11, and the other end can be connected to the bonding terminal section 130, thereby realizing the transmission of drive signals.

[0039] In this embodiment, as shown in FIG2a, the bending portion 12 can be semi-circular, and the binding portion 13 is disposed on the back side of the display portion 11. With the above arrangement, the binding portion 13 can overlap with the display portion 11, thereby reducing the border width occupied by the binding portion 13 and achieving the effect of a narrow border.

[0040] In this embodiment, as shown in Figures 2a to 2d, a first back plate 21 is provided on the back side of the display unit 11, and a second back plate 22 is provided on the side surface of the bonding part 13 near the display unit 11. The materials of the first back plate 21 and the second back plate 22 can be the same or different. The materials of the first back plate 21 and the second back plate 22 may include one or more of silicon dioxide, polyester resin, polyethylene, polypropylene, polystyrene, polylactic acid, polyethylene terephthalate, polyimide, or polyurethane, but are not limited thereto. The first back plate 21 can prevent the display unit 11 from being damaged by external forces and can block moisture, and the second back plate 22 can prevent the bonding part 13 from being damaged by external forces and can block moisture.

[0041] In this embodiment, as shown in Figures 2a to 2c, the display panel 1 may further include a stacked composite functional layer 60 and a second support plate 642. The composite functional layer 60 may be composed of multiple film layers. The composite functional layer 60 may protect and support the display unit 11. The film layers of the composite functional layer 60 may be configured as needed, and this application does not impose any restrictions on this.

[0042] In this embodiment, as shown in Figures 2a to 2c, a statically folded display panel 1 is illustrated. In the statically folded display panel 1, the composite functional layer 60 may include a layered mesh adhesive 62, a buffer layer 63, etc. The mesh adhesive 62 is located on the side of the buffer layer 63 closest to the first back plate 21.

[0043] The mesh adhesive 62 has the functions of bonding and venting, and will not affect the flexibility of the display panel 1.

[0044] The buffer layer 63 can be made of at least one of foam, rubber, silicone, and plastic, but is not limited to these. The buffer layer 63 can absorb shock and prevent damage to the display layer caused by external stress.

[0045] In this embodiment, as shown in Figures 2a to 2c, the second support plate 642 is disposed on the side of the composite functional layer 60 near the second back plate 22. The second support plate 642 has a certain rigidity, which can provide back support and protection for the display panel 1, making the back of the display panel 1 less susceptible to impact damage. The material of the second support plate 642 can be a metal material such as copper, but is not limited to this.

[0046] In this embodiment, as shown in Figures 2a to 2c, a second padding layer 612 is provided between the second support plate 642 and the second back plate 22. The second padding layer 612 can be made of glass fiber, polymer material, aluminum sheet, or steel sheet, etc. Adhesive layers (not shown in the figures) are provided on opposite side surfaces of the second padding layer 612. The adhesive layers on both side surfaces are used to bond with the second support plate 642 and the second back plate 22, respectively, thereby fixing the binding part 13.

[0047] In this embodiment, as shown in FIG2d, a dynamically folded display panel 1 is included. The dynamically folded display panel 1 includes a stacked composite functional layer 60 and a first support plate 641. The composite functional layer 60 may include a pressure-sensitive adhesive 66, a substrate layer 67, etc., stacked sequentially. The substrate layer 67 may be made of flexible materials such as polyimide or polyethylene terephthalate. The pressure-sensitive adhesive 66 is disposed on both sides of the substrate layer 67. The pressure-sensitive adhesive 66 is adhesive and can achieve bonding between film layers.

[0048] In this embodiment, the material of the first support plate 641 can be stainless steel or other metal materials, but is not limited to this.

[0049] In this embodiment, as shown in FIG2d, a first padding layer 611 is provided between the first support plate 641 and the second back plate 22. Adhesive layers (not shown in the figure) are provided on opposite sides of the first padding layer 611. The adhesive layers on both sides are used to bond to the first support plate 641 and the second back plate 22, thereby fixing the binding part 13. The first padding layer 611 can be polyimide, polyester fiber, etc.

[0050] In this embodiment, the material of the first support plate 641 can be the same as the material of the functional part 40. For example, both the material of the first support plate 641 and the material of the functional part 40 can be stainless steel. Stainless steel has a relatively low cost and a large modulus. By setting the material of the first support plate 641 and the material of the functional part 40 to stainless steel, the production cost of the display panel 1 can be reduced.

[0051] In this embodiment, the display panel 1 includes a polarizer 43 disposed on the light-emitting surface of the display unit 11. The polarizer 43 is used to reduce reflected light and improve the glare problem of the display panel 1.

[0052] In this embodiment, the display panel 1 includes a cover plate 44, which is disposed on the side of the polarizer 43 opposite to the display section 11. The material of the cover plate 44 can be polyimide or glass, but is not limited thereto. The cover plate 44 can protect the display section 11 and prevent it from being damaged by external impact.

[0053] In this embodiment, the second back plate 22 is provided with an opening 22a, which can penetrate or partially penetrate the second back plate 22. That is to say, the opening 22a can be a through hole or a blind hole. The shape of the opening 22a can match the shape of the binding terminal portion 130, and this application does not limit it in this regard. For example, the shape of the opening 22a can be rectangular, etc.

[0054] In this embodiment, the functional part 40 is provided corresponding to the opening 22a, and the functional part 40 can fill the opening 22a. The side surface of the functional part 40 away from the binding part 13 can be flush with the side surface of the second back plate 22 away from the binding part 13, or the side surface of the functional part 40 away from the binding part 13 can be slightly higher than the side surface of the second back plate 22 away from the binding part 13.

[0055] In this embodiment, the modulus of the functional part 40 is greater than that of the second back plate 22. Under heat and pressure, the functional part 40, having a higher modulus, is less prone to deformation. When the bonding member 30 is bonded to the bonding part 13, the deformation of the functional part 40 under the heat and pressure during the bonding process is lower than that of the second back plate 22 under the same conditions. This reduces the deformation of the bonding part 13, decreases the uneven stress distribution within the bonding part 13, and reduces the risk of microcracks forming inside the film layer of the bonding part 13. Since microcracks are less likely to form inside the film layer of the bonding part 13, it is less likely to provide an intrusion path for moisture, reducing the risk of corrosion of the bonding member 30 due to moisture.

[0056] In this embodiment, the modulus of the functional part is greater than or equal to 50 kPa.

[0057] In this embodiment, the orthographic projection of the bonding terminal portion 130 onto the functional portion 40 is located within the functional portion 40. For example, the orthographic projection of the bonding terminal portion 130 onto the functional portion 40 may coincide with the functional portion 40, or the area of ​​the orthographic projection of the bonding terminal portion 130 onto the functional portion 40 may be smaller than the area of ​​the functional portion 40. When the area of ​​the orthographic projection of the bonding terminal portion 130 onto the functional portion 40 is smaller than the area of ​​the functional portion 40, the orthographic projection pattern of the bonding terminal portion 130 may be spaced apart from the sidewall of the functional portion 40, with a spacing of 3 mm to 5 mm, thereby allowing the functional portion 40 to have a larger area, providing better support for the bonding portion 13 in the area corresponding to the bonding terminal portion 130. This is because when the functional portion 40 has a larger area, the pressure applied to the functional portion 40 during the bonding process is reduced, the degree of deformation of the functional portion 40 is reduced, thereby reducing the degree of uneven stress distribution within the bonding portion 13, and further reducing the risk of microcracks forming inside the film layer of the bonding portion 13.

[0058] The area of ​​the functional part 40 refers to the area of ​​its largest surface. The functional part 40 has a flat plate structure, and its largest surface is parallel to the back of the display part 11 and parallel to the largest surface of the bonding part 13.

[0059] In the display panel 1 of this application, as shown in FIG2a, the second back plate 22 includes a first base layer 221 and a first adhesive layer 222 stacked together. The first base layer 221 is disposed on the side of the first adhesive layer 222 near the display part 11. The functional part 40 includes a support layer 41 and a second adhesive layer 42 stacked together. The support layer 41 is disposed on the side of the second adhesive layer 42 near the display part 11. The modulus of the support layer 41 is greater than the modulus of the first base layer 221, and / or the modulus of the second adhesive layer 42 is greater than the modulus of the first adhesive layer 222.

[0060] In this embodiment, the first adhesive layer 222 and the second adhesive layer 42 can be adhesive materials or the like. The surface of the first adhesive layer 222 facing away from the first base layer 221 can be bonded to the bonding portion 13. The surface of the second adhesive layer 42 facing away from the support layer 41 can be bonded to the bonding portion 13.

[0061] In this embodiment, the modulus of the support layer 41 is greater than the modulus of the first base layer 221, and / or the modulus of the second adhesive layer 42 is greater than the modulus of the first adhesive layer 222. That is to say, the overall modulus of the functional portion 40 is greater than the modulus of the second backplate 22. Furthermore, the modulus of at least one of the laminated film layers of the functional portion 40 is greater than the modulus of at least one of the laminated film layers of the second backplate 22.

[0062] For example, when the material of the support layer 41 is different from the material of the first base layer 221, and the material of the first adhesive layer 222 is different from the material of the second adhesive layer 42, the modulus of the support layer 41 can be greater than the modulus of the first base layer 221, and the modulus of the second adhesive layer 42 can be greater than the modulus of the first adhesive layer 222.

[0063] When the material of the support layer 41 is the same as that of the first base layer 221, that is, when the modulus of the support layer 41 is equal to the modulus of the first base layer 221, the modulus of the second adhesive layer 42 can be greater than the modulus of the first adhesive layer 222.

[0064] When the material of the second adhesive layer 42 is the same as that of the first adhesive layer 222, that is, when the modulus of the second adhesive layer 42 is equal to the modulus of the first adhesive layer 222, the modulus of the support layer 41 can be greater than the modulus of the first base layer 221.

[0065] In this embodiment, the thickness of the functional part 40 can be equal to the thickness of the second back plate 22. For example, the thickness of the second adhesive layer 42 can be equal to the thickness of the first adhesive layer 222, and the thickness of the support layer 41 can be equal to the thickness of the first base layer 221. The thickness of the second back plate 22 and the thickness of the functional part 40 can both be 0.075 mm. Specifically, the thickness of the first adhesive layer 222 and the second adhesive layer 42 can be 0.025 mm, and the thickness of the support layer 41 and the first base layer 221 can be 0.05 mm.

[0066] It should be understood that the thickness of the second back plate 22 and the thickness of the functional part 40 can be adjusted as needed, and this application does not impose any restrictions on this.

[0067] In some embodiments, due to the thickness tolerance of the functional part 40, the thickness of the functional part 40 can be greater than the thickness of the second back plate 22. That is, the thickness of the functional part 40 has an upper tolerance, and the thickness of the functional part 40 can be slightly greater than the thickness of the second back plate 22. The difference between the thickness of the functional part 40 and the thickness of the second back plate 22 can be a tolerance; for example, the difference between the thickness of the functional part 40 and the thickness of the second back plate 22 can be greater than 0 and less than 0.01 mm. With the above arrangement, the functional part 40 slightly protrudes from the surface of the second back plate 22, thereby allowing the functional part 40 to withstand the bonding pressure during the bonding process. At the same time, the small difference between the thickness of the functional part 40 and the thickness of the second back plate 22 will not affect the adhesion of the padding layer 61 to the surface of the second back plate 22 near the display part 11.

[0068] In this embodiment, the first backplate 21 and the second backplate 22 can be made of the same material. When the second backplate 22 includes a stacked first base layer 221 and a first adhesive layer 222, the first backplate 21 can include a stacked second base layer 211 and a third adhesive layer 212. The material of the second base layer 211 is the same as that of the first base layer 221, and the material of the third adhesive layer 212 is the same as that of the first adhesive layer 222, so that the first backplate 21 and the second backplate 22 can be formed using the same die-cutting process.

[0069] In the display panel 1 of this application, as shown in FIG2a, the modulus of the support layer 41 is greater than the modulus of the first base layer 221, and the modulus of the second adhesive layer 42 is greater than the modulus of the first adhesive layer 222. The support layer 41 and the second adhesive layer 42 are both spaced apart from the sidewall of the opening 22a.

[0070] In this embodiment, the material of the support layer 41 is different from the material of the first base layer 221, and the modulus of the support layer 41 is greater than that of the first base layer 221. For example, the material of the support layer 41 can be stainless steel, copper, or other metals. The material of the first base layer 221 can be polyethylene terephthalate, polyimide, or other materials.

[0071] In this embodiment, the material of the second adhesive layer 42 is different from the material of the first adhesive layer 222. The material of the second adhesive layer 42 has a higher modulus than that of the first adhesive layer 222. For example, the material of the first adhesive layer 222 can be optically clear adhesive (OCA), but is not limited thereto; the material of the second adhesive layer 42 can be hot melt adhesive, but is not limited thereto. The modulus of optical adhesive is approximately 30 kPa, and the modulus of hot melt adhesive is approximately 50 kPa.

[0072] In this embodiment, as shown in FIG2a, the support layer 41 is spaced apart from the sidewall of the opening 22a. This means that the area of ​​the support layer 41 is smaller than the area of ​​the bottom wall of the opening 22a, allowing the support layer 41 to be accommodated within the opening 22a. Furthermore, considering the manufacturing tolerances of the opening 22a and the functional part 40, the distance between the support layer 41 and the sidewall of the opening 22a can be 0.2 mm to 0.5 mm. For example, the distance between the support layer 41 and the sidewall of the opening 22a can be 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, etc.

[0073] Similarly, as shown in Figure 2a, the distance between the second adhesive layer 42 and the sidewall of the opening 22a can also be 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, etc.

[0074] It should be noted that when the distance between the support layer 41 and the sidewall of the opening 22a is small, the precision requirements of the process are higher. When the distance between the support layer 41 and the sidewall of the opening 22a is large, the precision requirements of the process are lower.

[0075] In the display panel 1 of this application, as shown in FIG2a, the orthographic projection of the support layer 41 on the second adhesive layer 42 is located within the second adhesive layer 42, and the area of ​​the second adhesive layer 42 is greater than or equal to the area of ​​the support layer 41.

[0076] In this embodiment, the area of ​​the second adhesive layer 42 is larger than the area of ​​the support layer 41, meaning that the sidewalls of the second adhesive layer 42 can extend beyond the sidewalls of the support layer 41. This arrangement increases the area of ​​the second adhesive layer 42, reducing the risk of the support layer 41 forming embossed marks on the bonding portion 13.

[0077] In this embodiment, the area of ​​the second adhesive layer 42 is equal to the area of ​​the support layer 41, so that the second adhesive layer 42 and the support layer 41 can be manufactured using the same die-cutting process, simplifying the processing technology of the functional part 40.

[0078] During the bonding process, the second adhesive layer 42 will produce excess adhesive under heat and pressure, which will fill the gap between the second adhesive layer and the sidewall of the opening 22a. The excess adhesive of the second adhesive layer 42 can absorb some of the pressure in the bonding process, further reducing the risk of the support layer 41 forming embossed marks on the bonding portion 13.

[0079] In the display panel 1 of this application, as shown in FIG2b, the modulus of the support layer 41 is greater than the modulus of the first base layer 221, and the materials of the first adhesive layer 222 and the second adhesive layer 42 are the same.

[0080] In this embodiment, the first adhesive layer 222 and the second adhesive layer 42 are made of the same material. For example, both the first adhesive layer 222 and the second adhesive layer 42 can be made of optical adhesive. The modulus of the support layer 41 is greater than that of the first base layer 221, and the material of the support layer 41 can be stainless steel, copper, or other metals. The material of the first base layer 221 can be polyethylene terephthalate, polyimide, or other materials.

[0081] In this embodiment, the first adhesive layer 222 and the second adhesive layer 42 can be disposed continuously or intermittently. When the first adhesive layer 222 and the second adhesive layer 42 are disposed intermittently, the situation is similar to that in FIG2a, and will not be repeated here.

[0082] Optionally, in an embodiment, as shown in FIG2b, the first adhesive layer 222 and the second adhesive layer 42 are continuously disposed, that is, the opening 22a is a blind hole. The opening 22a only penetrates the first base layer 221, and the support layer 41 is located within the opening 22a. By continuously disposing of the first adhesive layer 222 and the second adhesive layer 42, moisture can be prevented from intruding along the gap between the functional part 40 and the sidewall of the opening 22a, further reducing the risk of moisture intrusion.

[0083] In the display panel 1 of this application, as shown in FIG2c, the modulus of the second adhesive layer 42 is greater than that of the first adhesive layer 222, and the materials of the first base layer 221 and the support layer 41 are the same.

[0084] In this embodiment, the material of the second adhesive layer 42 can be hot melt adhesive, etc., and the material of the first adhesive layer 222 can be optical adhesive, etc.

[0085] The materials of the first base layer 221 and the support layer 41 can both be polyethylene terephthalate, polyimide, etc.

[0086] In one embodiment, the first base layer 221 and the support layer 41 can be disposed continuously or spaced apart. When the first base layer 221 and the support layer 41 are spaced apart, the situation is similar to that in FIG2a, and will not be repeated here.

[0087] Optionally, in this embodiment, as shown in FIG2c, the first base layer 221 and the support layer 41 are continuously disposed. That is to say, the opening 22a is a blind hole. The opening 22a only penetrates the first adhesive layer 222, and the second adhesive layer 42 is located inside the opening 22a. The waterproof performance of the support layer 41 is better than that of the second adhesive layer 42. By continuously disposing of the first base layer 221 and the support layer 41, moisture can be further prevented from intruding along the gap between the functional part 40 and the sidewall of the opening 22a, reducing the risk of moisture intrusion.

[0088] In the display panel 1 of this application, as shown in Figures 2a and 3, the bonding member 30 includes a driving chip 51 and a flexible circuit board 52, with the flexible circuit board 52 located on the side of the driving chip 51 away from the bending portion 12.

[0089] In this embodiment, as shown in FIG2a, the flexible circuit board 52 can be bonded to the edge region of the bonding portion 13 via the bonding terminal portion 130, and the driving chip 51 can be bonded to the middle region of the bonding portion 13 via the bonding terminal portion 130. The orthographic projection of the bonding terminal portion 130 on the functional portion 40 is located within the functional portion 40.

[0090] When the bonding component 30 includes both the driver chip 51 and the flexible circuit board 52, the functional parts 40 corresponding to the driver chip 51 and the flexible circuit board 52 can be arranged continuously. This means that the same functional part 40 can support both the driver chip 51 and the flexible circuit board 52. Through this arrangement, the number of functional parts 40 can be reduced, thus lowering the processing difficulty of the display panel 1.

[0091] As shown in Figures 2a and 3, the opening 22a can be positioned close to the edge of the second back plate 22, and one side wall of the opening 22a can overlap with one side wall of the second back plate 22, meaning the pattern of the opening 22a is a non-closed pattern. The flexible circuit board 52 can be positioned corresponding to the non-closed side wall of the opening 22a. The flexible circuit board 52 has a portion that does not overlap with the bonding portion 13, and this non-overlapping portion can be fixed to the side of the second support plate 642 away from the light-emitting surface of the display panel 1 using double-sided adhesive 65.

[0092] Figure 4 shows another flattened structure of a portion of the film layer of the display panel 1. The difference between Figure 4 and Figure 3 is the opening 22a. In the embodiment of Figure 4, the opening 22a has a closed pattern and is located in the middle region of the bonding portion 13. In this case, the bonding member 30 may only include the driving chip 51.

[0093] This application also provides a method for manufacturing a display panel 1, as shown in Figures 5a to 5d. Taking one embodiment of this application as an example, the method for manufacturing the display panel 1 will be described.

[0094] As shown in Figure 5a, a back panel base material 20A is provided, and the back panel base material 20A is cut to form a first back panel 21 and a second back panel 22. The second back panel 22 is provided with an opening 22a.

[0095] In this embodiment, as shown in Figure 5a, a backplate mother material 20A is provided. The backplate mother material 20A is cut once to obtain a first backplate 21 and a second backplate 22. The first backplate 21 and the second backplate 22 are made of the same material, and the second backplate 22 has an opening 22a. This embodiment ensures the dimensional accuracy of the first dimension L1 and the second dimension L2 of the first backplate 21 and the second backplate 22 by forming them in one step. This is because when the first backplate 21 and the second backplate 22 are cut separately, the first dimension L1 and the second dimension L2 of the first backplate 21 and the second backplate 22 are affected by assembly process deviations, and the fluctuation range increases.

[0096] In this embodiment, the first backplate 21 may include a stacked second base layer 211 and a third adhesive layer 212; the second backplate 22 includes a stacked first base layer 221 and a first adhesive layer 222. The material of the second base layer 211 is the same as the material of the first base layer 221, and the material of the third adhesive layer 212 is the same as the material of the first adhesive layer 222, so that the first backplate 21 and the second backplate 22 can be formed by the same die-cutting process.

[0097] As shown in Figures 5b and 5c, a functional part 40 is provided, which is provided corresponding to the opening 22a. The modulus of the functional part 40 is greater than the modulus of the second back plate 22.

[0098] In this embodiment, as shown in FIG5b, a functional base material 40A can be provided, and the functional base material 40A can be cut once to obtain the functional part 40.

[0099] In this embodiment, the functional part 40 includes a support layer 41 and a second adhesive layer 42 stacked together. As shown in FIG. 5c, the functional part 40 is attached to the opening 22a. It should be noted that the second adhesive layer 42 is located on the side of the support layer 41 closest to the second back plate 22. Then, the first back plate 21, the second back plate 22, and the functional part 40 are attached together with the display part 11 and the bonding part 13. At this time, the bending part 12 is not bent, and the first back plate 21, the second back plate 22, and the functional part 40 can be achieved through the same bonding process, simplifying the processing technology of the display panel 1, while ensuring that the first dimension L1 and the second dimension L2 are not affected by assembly process deviations. Specifically, the first back plate is attached to the display part 11, and the second back plate 22 and the functional part 40 are attached to the bonding part 13.

[0100] As shown in Figure 5d, a flattened display section 11, a binding section 13, and a bent section 12 connecting the display section 11 and the binding section 13 are provided. A binding terminal section 130 is provided on the side of the binding section 13 away from the light emission direction of the display panel 1.

[0101] In this embodiment, the display part 11, the binding part 13, and the bending part 12 are flattened, that is, the display part 11, the binding part 13, and the bending part 12 are arranged on the same plane.

[0102] In this embodiment, a bonding terminal portion 130 is provided on the side of the bonding portion 13 facing away from the light emission direction of the display panel 1. The bonding terminal portion 130 is shown in dashed line form in FIG5d. The bonding terminal portion 130 is not visible in FIG5d and is located on the other side surface of the bonding portion 13 in the view.

[0103] As shown in Figure 5e, the first back plate 21, the second back plate 22, and the functional part 40 are disposed on the side of the display part 11 away from the light emission direction of the display panel 1. The first back plate 21 is disposed corresponding to the display part 11, the second back plate 22 is disposed corresponding to the binding part 13, and the orthogonal projection of the binding terminal part 130 on the functional part 40 is located inside the functional part 40.

[0104] In this embodiment, within the allowable range of machining tolerances, the outer contour of the first back plate 21 and the display part 11 are approximately coincident, and the outer contour of the second back plate 22 and the binding part 13 are approximately coincident.

[0105] In this embodiment, the orthographic projection of the binding terminal portion 130 onto the functional portion 40 is located within the functional portion 40. The area of ​​the orthographic projection of the binding terminal portion 130 may be less than or equal to the area of ​​the functional portion 40.

[0106] After completing the above steps, a bonding process can be performed to connect the bonding member 30 to the bonding terminal 130. Since the functional part 40 can support the bonding member 30, and the modulus of the functional part 40 is greater than that of the second back plate 22, the deformation of the bonding part 13 can be reduced, thereby reducing the degree of uneven stress distribution within the bonding part 13 and reducing the risk of microcracks forming inside the film layer.

[0107] After the bonding process is completed, the bending part 12 can be bent so that the bonding part 13 is located on the back of the display part 11.

[0108] As shown in Figure 6, this application also provides a display terminal 2, which includes the display panel 1 described above.

[0109] In this embodiment, the display terminal 2 includes a display panel 1 and a terminal body 3, which are combined into one unit.

[0110] In this embodiment, the display terminal 2 can be any product or component with display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator.

[0111] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0112] The display panel, manufacturing method, and display terminal provided in the embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the technical solutions and core ideas of this application. Those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A display panel, the display panel comprising a display portion, a mounting portion, and a bent portion connecting the display portion and the mounting portion, the mounting portion being disposed on a side of the display portion opposite to the light emission direction of the display panel, the display panel further comprising: The first back plate is disposed on the side of the display unit opposite to the light emission direction of the display panel; A second back plate is disposed on the side of the binding part near the display part, and the second back plate is provided with an opening; A binding terminal portion is provided on the side of the binding portion opposite to the display portion; Functional parts are provided corresponding to the openings; The orthographic projection of the bonding terminal portion onto the functional portion is located within the functional portion, and the modulus of the functional portion is greater than the modulus of the second back plate.

2. The display panel according to claim 1, wherein, The second backplate includes a first base layer and a first adhesive layer stacked together, wherein the first base layer is disposed on the side of the first adhesive layer near the display portion; The functional part includes a stacked support layer and a second adhesive layer, wherein the support layer is disposed on the side of the second adhesive layer near the display part; Wherein, the modulus of the support layer is greater than the modulus of the first base layer, and / or, the modulus of the second adhesive layer is greater than the modulus of the first adhesive layer.

3. The display panel according to claim 2, wherein, The modulus of the support layer is greater than that of the first base layer, and the modulus of the second adhesive layer is greater than that of the first adhesive layer. Both the support layer and the second adhesive layer are spaced apart from the sidewall of the opening.

4. The display panel according to claim 2, wherein, The modulus of the support layer is greater than that of the first base layer, and the materials of the first adhesive layer and the second adhesive layer are the same.

5. The display panel according to claim 4, wherein, The first adhesive layer and the second adhesive layer are continuously disposed.

6. The display panel according to claim 2, wherein, The modulus of the second adhesive layer is greater than that of the first adhesive layer, and the material of the first base layer is the same as that of the support layer.

7. The display panel according to claim 6, wherein, The first base layer and the support layer are continuously disposed.

8. The display panel according to any one of claims 3 to 7, wherein, The orthographic projection of the support layer onto the second adhesive layer lies within the second adhesive layer, and the area of ​​the second adhesive layer is greater than or equal to the area of ​​the support layer.

9. The display panel according to claim 1, wherein, The area of ​​the orthographic projection of the binding terminal portion onto the functional portion is smaller than the area of ​​the functional portion.

10. The display panel according to claim 1, wherein, The thickness of the functional part is greater than or equal to the thickness of the second back plate.

11. The display panel according to claim 1, wherein, The modulus of the functional part is greater than or equal to 50 kPa.

12. The display panel according to claim 1, wherein, The display panel includes a bonding member, and the bonding terminal is bonded to the bonding member. The bonding member includes at least one of a driver chip and a flexible circuit board.

13. The display panel according to claim 1, wherein, The display panel includes a stacked composite functional layer and a first support plate. The composite functional layer is disposed on the side of the first support plate near the first back plate. The material of the first support plate is the same as the material of the functional part.

14. A method for manufacturing a display panel, comprising: A backplate base material is provided, and the backplate base material is cut to form a first backplate and a second backplate, wherein the second backplate is provided with an opening; A functional part is provided, the functional part being disposed corresponding to the opening, and the modulus of the functional part being greater than the modulus of the second back plate; The system provides a flattened display section, a binding section, and a bent section connecting the display section and the binding section. The binding section has a binding terminal section on the side facing away from the light emission direction of the display panel. The first back plate, the second back plate, and the functional part are disposed on the side of the display part away from the light emission direction of the display panel. The first back plate is disposed corresponding to the display part, the second back plate is disposed corresponding to the bonding part, and the orthogonal projection of the bonding terminal part on the functional part is located inside the functional part.

15. A display terminal, the display terminal comprising a display panel, the display panel comprising a display portion, a mounting portion, and a bent portion connecting the display portion and the mounting portion, the mounting portion being disposed on a side of the display portion opposite to the light emission direction of the display panel, the display panel further comprising: The first back plate is disposed on the side of the display unit opposite to the light emission direction of the display panel; A second back plate is disposed on the side of the binding part near the display part, and the second back plate is provided with an opening; A binding terminal portion is provided on the side of the binding portion opposite to the display portion; Functional parts are provided corresponding to the openings; The orthographic projection of the bonding terminal portion onto the functional portion is located within the functional portion, and the modulus of the functional portion is greater than the modulus of the second back plate.

16. The display terminal according to claim 15, wherein, The second backplate includes a first base layer and a first adhesive layer stacked together, wherein the first base layer is disposed on the side of the first adhesive layer near the display portion; The functional part includes a stacked support layer and a second adhesive layer, wherein the support layer is disposed on the side of the second adhesive layer near the display part; Wherein, the modulus of the support layer is greater than the modulus of the first base layer, and / or, the modulus of the second adhesive layer is greater than the modulus of the first adhesive layer.

17. The display terminal according to claim 16, wherein, The modulus of the support layer is greater than that of the first base layer, and the modulus of the second adhesive layer is greater than that of the first adhesive layer. Both the support layer and the second adhesive layer are spaced apart from the sidewall of the opening.

18. The display terminal according to claim 16, wherein, The modulus of the support layer is greater than that of the first base layer, and the materials of the first adhesive layer and the second adhesive layer are the same.

19. The display terminal according to claim 16, wherein, The modulus of the second adhesive layer is greater than that of the first adhesive layer, and the material of the first base layer is the same as that of the support layer.

20. The display terminal according to any one of claims 17 to 19, wherein, The orthographic projection of the support layer onto the second adhesive layer lies within the second adhesive layer, and the area of ​​the second adhesive layer is greater than or equal to the area of ​​the support layer.

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