Driving circuit, optical transmission assembly, optical module, and device

Abstract

A driving circuit, an optical transmission assembly (100), an optical module, and a device. The driving circuit comprises: a first connecting end, a second connecting end, a laser module, a first AC coupling module, and a reference node. One end of a first connecting end (31) is electrically connected to a reference node (35), and the other end of the first connecting end (31) is used for receiving a first bias voltage; one end of a second connecting end (32) is electrically connected to the reference node (35), and the other end of the second connecting end (32) is used for externally connecting to a driving module; the second connecting end (32) is used for providing a bias working voltage for the driving module on the basis of the first bias voltage, and transmitting a high-frequency signal sent by the driving module to the reference node (35); a first end of a laser module (33) is electrically connected to the reference node (35), and a second end of the laser module (33) is used for receiving a second bias voltage; the laser module (33) is used for acquiring a bias working voltage on the basis of the first bias voltage acquired at the first end and the second bias voltage acquired at the second end, and converting the high-frequency signal into an optical signal; and a first end of a first AC coupling module (34) is electrically connected to the second end of the laser module (33), and a second end of the first AC coupling module (34) is electrically connected to a ground end and is used for providing a return path to the ground end for the high-frequency signal.

Description

A driving circuit, an optical emitting component, an optical module, and a device.

[0001] This application claims priority to Chinese Patent Application No. 202410925361.0, filed on July 10, 2024, entitled "A Driving Circuit, Optical Emitting Component, Optical Module and Device", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of electronic circuit technology, specifically to a driving circuit, an optical emitting component, an optical module, and a device. Background Technology

[0003] With the rapid development of high technologies such as streaming media, industrial internet, and cloud computing, the amount of communication data is growing exponentially. To meet the surge in communication demands, optical modules are constantly evolving towards multi-channel and high-speed capabilities. EML (Electro-absorption modulated laser) is widely used in the field of optical communication due to its cost and performance advantages.

[0004] To fully utilize the optimal performance of each component, the EML and its driver module need to operate under different bias voltages. In some technologies, a Bias-T (Bias Tee) is typically used to provide different bias voltages for the EML and driver module, as shown in Figure 1a. However, using a Bias-T requires significant space, which is detrimental to multi-channel layouts. Furthermore, the presence of a Bias-T between the EML and driver module results in an excessively long link, increasing reflected ripple and reducing the circuit's high-frequency performance. Summary of the Invention

[0005] In view of this, this application provides a driving circuit, an optical emitting component, an optical module, and a device to provide different bias voltages for the EML and the driving module, thereby improving the high-frequency performance of the circuit.

[0006] In a first aspect, embodiments of this application provide a driving circuit, including: a first connection terminal, a second connection terminal, a laser module, a first AC coupling module, and a reference node; wherein, one end of the first connection terminal is electrically connected to the reference node, and the other end of the first connection terminal is used to receive a first bias voltage; one end of the second connection terminal is electrically connected to the reference node, and the other end of the second connection terminal is used to connect an external driving module; the second connection terminal is used to provide a bias operating voltage to the driving module according to the first bias voltage, and to transmit a high-frequency signal sent by the driving module to the reference node; the first end of the laser module is electrically connected to the reference node, and the second end of the laser module is used to receive a second bias voltage; the laser module is used to obtain a bias operating voltage according to the first bias voltage obtained by the first end and the second bias voltage obtained by the second end, and to obtain a high-frequency signal sent by the driving module based on the second connection terminal, and to convert the high-frequency signal into an optical signal; the first end of the first AC coupling module is electrically connected to the second end of the laser module, and the second end of the first AC coupling module is electrically connected to a ground terminal; the first AC coupling module is used to return the high-frequency signal to the ground terminal. In this way, a first bias voltage can be used to provide a bias operating voltage for the drive module, and a second bias voltage can be used to provide a bias operating voltage for the laser module. This allows for different bias operating voltages to be provided for the drive module and the laser module, enabling them to achieve optimal operating performance and improving the high-frequency performance of the drive circuit. Furthermore, by providing different bias operating voltages for the drive module and the laser module, the use of Bias-T devices is eliminated, reducing the area of ​​the drive circuit and the link length between the drive module and the laser module, further improving the high-frequency performance of the drive circuit.

[0007] In one possible implementation of the first aspect, the method further includes: a second AC coupling module; a first end of the second AC coupling module is electrically connected to one end of the first connection terminal, and a second end of the second AC coupling module is electrically connected to the first end of the first AC coupling module; the second AC coupling module is used to return the high-frequency signal at the first connection terminal to the ground terminal. In this way, a low-impedance path for the high-frequency signal is provided through the second AC coupling module, allowing the high-frequency signal of the branch where the first connection terminal is located to be transmitted to the first AC coupling module through the second AC coupling module and then returned to ground through the first AC coupling module, thus ensuring the high-frequency performance of the driving circuit.

[0008] In one possible implementation of the first aspect, the method further includes: a matching resistor; one end of the matching resistor is electrically connected to a reference node, and the other end of the matching resistor is electrically connected to one end of the first connection terminal; the matching resistor is used to adjust the equivalent impedance of the laser module. In this way, the matching resistor is connected in parallel with the laser module, and by adjusting the resistance value of the matching resistor, the equivalent impedance of the laser module can be adjusted, so that the equivalent impedance of the laser module matches the impedance of the second connection terminal, thereby improving the integrity of the high-frequency signal.

[0009] In one possible implementation of the first aspect, it further includes: a first inductor; one end of the first inductor is electrically connected to a reference node, and the other end of the first inductor is electrically connected to one end of a matching resistor. In this way, the high-frequency input impedance characteristics of the laser module can be improved by using the first inductor and the matching resistor, thereby reducing the loss of high-frequency signals.

[0010] In one possible implementation of the first aspect, a second inductor is further included; one end of the second inductor is electrically connected to the second connection terminal, and the other end of the second inductor is electrically connected to the reference node. In this way, by adjusting the second inductor, the impedance of the second connection terminal can be adjusted so that the impedance of the second connection terminal matches the equivalent impedance of the laser module, thereby improving high-frequency signal integrity.

[0011] In one possible implementation of the first aspect, the first AC coupling module includes a first capacitor.

[0012] In one possible implementation of the first aspect, the second AC coupling module includes a second capacitor.

[0013] Secondly, embodiments of this application provide a light emitting component, including: a substrate and a laser chip; the substrate is provided with a ground terminal, a high-frequency signal line, a first connection terminal, a reference node, and a first capacitor; one end of the first connection terminal is connected to the reference node, and the other end of the first connection terminal is used to receive a first bias voltage; the first end of the high-frequency signal line is connected to the reference node; the second end of the high-frequency signal line is used to connect an external driving module; the laser chip is mounted on the substrate, the first end of the laser chip is connected to the reference node, and the second end of the laser chip is used to receive a second bias voltage; one end of the first capacitor is connected to the second end of the laser chip, and the other end of the first capacitor is connected to the ground terminal. In this way, a bias operating voltage can be provided to the driving module through the first bias voltage, and a bias operating voltage can be provided to the laser module through the first bias voltage and the second bias voltage, thereby providing different bias operating voltages to the driving module and the laser module so that the driving module and the laser module can achieve optimal operating performance and improve the high-frequency performance of the driving circuit. Furthermore, it eliminates the need for BiasT devices when providing different bias operating voltages to the drive module and laser module, reducing the area of ​​the drive circuit and decreasing the link length between the drive module and laser module, thereby further improving the high-frequency performance of the drive circuit.

[0014] In one possible implementation of the second aspect, it further includes: a connection ground region; a second end of the laser chip connected to the connection ground region, and one end of the first capacitor connected to the connection ground region; the connection ground region is used to receive a second bias voltage. In this way, the connection ground region enables the second end of the laser chip to be connected to one end of the first capacitor, simplifying the implementation of the optical emitting component structure and reducing the complexity of the optical emitting component implementation.

[0015] In one possible implementation of the second aspect, a second capacitor is further included; one end of the second capacitor is connected to one end of the first connection terminal, and the other end of the second capacitor is connected to the ground area. In this way, a low-impedance path for high-frequency signals is provided through the second capacitor. The high-frequency signal of the branch containing the first connection terminal can be transmitted to the first capacitor through the second capacitor and then returned to ground through the first capacitor, ensuring the high-frequency performance of the driving circuit.

[0016] In one possible implementation of the second aspect, a matching resistor is also included; one end of the matching resistor is connected to the reference node, and the other end of the matching resistor is connected to one end of the first connection terminal. In this way, by adjusting the resistance value of the matching resistor, the equivalent impedance of the laser chip can be adjusted, making the equivalent impedance of the laser chip match the impedance of the high-frequency signal line, thereby improving the integrity of the high-frequency signal.

[0017] In one possible implementation of the second aspect, a first inductor is further included; one end of the first inductor is connected to a reference node, and the other end of the first inductor is connected to one end of a matching resistor. This can improve the high-frequency input impedance characteristics of the laser chip and reduce the loss of high-frequency signals.

[0018] In one possible implementation of the second aspect, a second inductor is further included; one end of the second inductor is connected to the high-frequency signal line, and the other end of the second inductor is connected to a reference node. This allows for the improvement of high-frequency signal integrity by adjusting the second inductor.

[0019] In one possible implementation of the second aspect, the first end of the laser chip is a reference node.

[0020] In one possible implementation of the second aspect, the laser chip includes a first surface and a second surface. A first end is disposed on the first surface of the laser chip, and the second surface of the laser chip is attached to a substrate. The first end is connected to the first end of a high-frequency signal line and a first connection end via wire bonding.

[0021] In one possible implementation of the second aspect, a second end is disposed on the second surface of the laser chip, and the second end of the laser chip is attached to the connection area of ​​the substrate.

[0022] In one possible implementation of the second aspect, a second end is also disposed on the first surface of the laser chip, and the second end is connected to the connection area by wire bonding.

[0023] In one possible implementation of the second aspect, the laser chip includes a first surface and a second surface. A first end and a second end are disposed on the first surface of the laser chip. The first surface of the laser chip is attached to a substrate. The first end is soldered to the first end of a high-frequency signal line and connected to a first connection end through a substrate trace. The second end is soldered to a connection ground area.

[0024] In one possible implementation of the second aspect, the connection area includes a first connection ground sub-region and a second connection ground sub-region; the grounding terminal includes a first sub-grounding terminal and a second sub-grounding terminal; the first capacitor includes a first sub-capacitor and a second sub-capacitor; the first connection ground sub-region and the first sub-grounding terminal are located on one side of the high-frequency signal line, and the second connection ground area and the second sub-grounding terminal are located on the other side of the high-frequency signal line; one end of the first sub-capacitor is connected to the first connection ground sub-region, and the other end of the first sub-capacitor is connected to the first sub-grounding terminal; one end of the second sub-capacitor is connected to the second connection ground area, and the other end of the second sub-capacitor is connected to the second sub-grounding terminal. In this way, the energy radiated by the high-frequency signal line 104 can be returned to ground, improving high-frequency performance.

[0025] Thirdly, embodiments of this application provide an optical module, including the driving circuit of any of the first aspects or the optical emitting component of any of the second aspects.

[0026] Fourthly, embodiments of this application provide a device including the driving circuit of any of the first aspects, the optical emitting component of any of the second aspects, or the optical module of the third aspect. Attached Figure Description

[0027] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1a is a schematic diagram of the structure of a drive circuit in some technologies;

[0029] Figure 1b is a schematic diagram of another driving circuit in some technologies;

[0030] Figure 2 is a schematic diagram of a drive circuit in some other technologies;

[0031] Figure 3 is a schematic diagram of a driving circuit provided in an embodiment of this application;

[0032] Figure 4 is a schematic diagram of another driving circuit provided in an embodiment of this application;

[0033] Figure 5 is a schematic diagram of another driving circuit provided in an embodiment of this application;

[0034] Figure 6 is a schematic diagram of another driving circuit provided in an embodiment of this application;

[0035] Figure 7 is a schematic diagram of another driving circuit provided in an embodiment of this application;

[0036] Figure 8 is a schematic diagram of another driving circuit provided in an embodiment of this application;

[0037] Figure 9 is a schematic diagram of the structure of a light emitting component provided in an embodiment of this application;

[0038] Figure 10 is a schematic diagram of another optical emitting component provided in an embodiment of this application;

[0039] Figure 11 is a schematic diagram of the structure of a laser chip provided in an embodiment of this application;

[0040] Figure 12 is a schematic diagram of another optical emitting component provided in an embodiment of this application;

[0041] Figure 13 is a schematic diagram of another optical emitting component provided in an embodiment of this application;

[0042] Figure 14a is a schematic diagram of an application scenario of an optical emitting component provided in an embodiment of this application;

[0043] Figure 14b is a schematic diagram of another application scenario of the optical emitting component provided in the embodiment of this application. Detailed Implementation

[0044] To better understand the technical solution of this application, the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0045] It should be understood that the described embodiments are merely some, not all, of the embodiments in this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0046] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0047] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0048] To fully utilize the optimal performance of each component, the EML and its driver module need to operate under different bias voltages. In some technologies, a Bias Tee (Bias T) is typically used to provide different bias voltages for the EML and driver module, as shown in Figures 1a and 1b. However, using a Bias Tee requires significant space, which is detrimental to multi-channel layouts. Furthermore, the presence of a Bias Tee between the EML and driver module results in an excessively long link, increasing reflected ripple and reducing the circuit's high-frequency performance.

[0049] In other technologies, a bias voltage can be provided to both the EML and the driver module by integrating a bias power supply within the driver module, as shown in Figure 2. However, this method provides the same bias voltage to both the EML and the driver module, which cannot achieve optimal performance for both. This results in some performance and power consumption loss for both the EML and the driver module, reducing the high-frequency performance of the circuit.

[0050] To address the aforementioned problems, this application provides a driving circuit comprising: a first connection terminal, a second connection terminal, a laser module, a first AC coupling module, and a reference node; wherein, one end of the first connection terminal is electrically connected to the reference node, and the other end of the first connection terminal is used to receive a first bias voltage; one end of the second connection terminal is electrically connected to the reference node, and the other end of the second connection terminal is used to connect an external driving module; the second connection terminal is used to provide a bias operating voltage to the driving module according to the first bias voltage, and to transmit the high-frequency signal sent by the driving module to the reference node; the first end of the laser module is electrically connected to the reference node, and the second end of the laser module is used to receive a second bias voltage; the laser module is used to obtain a bias operating voltage based on the first bias voltage obtained from the first end and the second bias voltage obtained from the second end, and to obtain the high-frequency signal sent by the driving module based on the second connection terminal, and to convert the high-frequency signal into an optical signal; the first end of the first AC coupling module is electrically connected to the second end of the laser module, and the second end of the first AC coupling module is electrically connected to a ground terminal; the first AC coupling module is used to return the high-frequency signal to the ground terminal. In this way, a first bias voltage can be used to provide a bias operating voltage for the drive module, and a second bias voltage can be used to provide a bias operating voltage for the laser module. This allows for different bias operating voltages to be provided for the drive module and the laser module, enabling them to achieve optimal operating performance and improving the high-frequency performance of the drive circuit. Furthermore, in this embodiment, the use of a Bias-T device is eliminated when providing different bias operating voltages for the drive module and the laser module, reducing the space required for the drive circuit and shortening the link length between the drive module and the laser module, further improving the high-frequency performance of the drive circuit. A detailed explanation follows.

[0051] Referring to Figure 3, a schematic diagram of a driving circuit provided in an embodiment of this application is shown. As shown in Figure 3, the driving circuit includes: a first connection terminal 31, a second connection terminal 32, a laser module 33, a first AC coupling module 34, and a reference node 35. One end of the first connection terminal 31 is electrically connected to the reference node 35, and the other end of the first connection terminal 31 is used to receive a first bias voltage.

[0052] One end of the second connection terminal 32 is electrically connected to the reference node 35, and the other end of the second connection terminal 32 is used to connect an external drive module.

[0053] The second connection terminal 32 is used to provide a bias operating voltage to the drive module according to the first bias voltage, and to transmit the high-frequency signal sent by the drive module to the reference node 35.

[0054] The first end of the laser module 33 is electrically connected to the reference node 35, and the second end of the laser module 33 is used to receive the second bias voltage. The laser module 33 is used to obtain a bias operating voltage based on the first bias voltage obtained from the first end and the second bias voltage obtained from the second end, and to obtain the high-frequency signal sent by the driving module based on the second connection end 32, and convert the high-frequency signal into an optical signal.

[0055] The first end of the first AC coupling module 34 is electrically connected to the second end of the laser module 33, and the second end of the first AC coupling module 34 is electrically connected to the ground terminal; the first AC coupling module 34 is used to return the high-frequency signal to the ground terminal.

[0056] In this embodiment, the driving circuit includes a first connection terminal 31, a second connection terminal 32, a laser module 33, a first AC coupling module 34, and a reference node 35. One end of the first connection terminal 31 is electrically connected to the reference node 35, and the other end of the first connection terminal 31 is used to connect an external first bias voltage. One end of the second connection terminal 32 is electrically connected to the reference node 35, and the other end of the second connection terminal 32 is used to connect an external driving module. Thus, the first bias voltage can be transmitted to the second connection terminal 32 through the first connection terminal 31 and the reference node 35. The second connection terminal 32 can provide a bias operating voltage to the driving module based on the first bias voltage. In some embodiments, the second connection terminal 32 can transmit the first bias voltage to the driving module to provide a bias voltage. To optimize the performance of the driving module, the magnitude of the first bias voltage can be adjusted to achieve the optimal bias operating voltage required for the driving module to perform optimally.

[0057] The first terminal of the laser module 33 is electrically connected to the reference node 35, and the second terminal of the laser module 33 is used to receive the second bias voltage. Thus, the first terminal of the laser module 33 can obtain the first bias voltage through the reference node 35, and the second terminal of the laser module 33 receives the second bias voltage. The first and second bias voltages provide the bias operating voltage for the laser module 33. To optimize the operating performance of the laser module 33, after the first bias voltage is determined, the magnitude of the second bias voltage is adjusted so that the voltage difference between the first and second bias voltages is the bias operating voltage required for optimal performance of the laser module 33.

[0058] The driving module transmits the high-frequency signal to the laser module 33 through the second connection terminal 32. The laser module 33 converts the high-frequency signal into an optical signal. To ensure the high-frequency performance of the driving circuit, the high-frequency signal generated in the driving circuit needs to be returned to the ground terminal. Therefore, a first AC coupling module 34 is also provided in the driving circuit. The first terminal of the first AC coupling module 34 is electrically connected to the second terminal of the laser module 33, and the second terminal of the first AC coupling module 34 is electrically connected to the ground terminal. In this way, the first AC coupling module 34 provides a low-impedance path for the high-frequency signal, allowing the high-frequency signal in the branch where the laser module 33 is located to return to the ground terminal.

[0059] In this embodiment, the bias operating voltage required by the driver and the laser module 33 is a DC voltage, therefore the first bias voltage and the second bias voltage are both DC voltages.

[0060] In order for the drive circuit to provide a bias operating voltage for the drive module and the laser module 33, the first AC coupling module 34 presents a high impedance state to DC signals, and cannot transmit DC signals to the ground terminal, but can only allow high-frequency signals to flow back to the ground terminal. In some embodiments, the first AC coupling module 34 includes a first capacitor. That is, the first capacitor is used to allow high-frequency signals to flow back to ground and block the transmission of DC signals to the ground terminal.

[0061] In this way, in this embodiment of the application, not only can a bias operating voltage be provided for the driving module, but also a bias operating voltage can be provided for the laser module 33, without the need to use additional BiasT devices, thus reducing the area of ​​the driving circuit while taking into account the high-frequency performance of the driving circuit.

[0062] As one possible implementation, as shown in Figure 4, the above-mentioned driving circuit also includes a second AC coupling module 36.

[0063] The first end of the second AC coupling module 36 is electrically connected to one end of the first connection terminal 31, and the second end of the second AC coupling module 36 is electrically connected to the first end of the first AC coupling module 34; the second AC coupling module 36 is used to return the high-frequency signal at the first connection terminal 31 to the ground terminal.

[0064] That is, since the driving module first transmits the high-frequency signal to the second connection terminal 32, and the second connection terminal 32 transmits the high-frequency signal to the laser module 33 via the reference node 35, the high-frequency signal is transmitted to the first connection terminal 31 via the reference node 35. In order to ensure the high-frequency performance of the driving circuit, the high-frequency signal in the branch where the first connection terminal 31 is located needs to be returned to the ground terminal. At this time, a second AC coupling module 36 is also provided in the driving circuit. The first end of the second AC coupling module 36 is electrically connected to one end of the first connection terminal 31, and the second end of the second AC coupling module 36 is electrically connected to the first end of the first AC coupling module 34. In this way, the second AC coupling module 36 provides a low-impedance path for the high-frequency signal. The high-frequency signal in the branch where the first connection terminal 31 is located can be transmitted to the first AC coupling module 34 through the second AC coupling module 36, and then returned to ground through the first AC coupling module 34.

[0065] In order for the driving circuit to provide the required bias operating voltages for the driving module and the laser module 33, the second AC coupling module 36 presents a high impedance state to DC signals, preventing the DC signals from being transmitted to the ground terminal, and only allowing the high-frequency signals to flow back to the ground terminal. In some embodiments, the second AC coupling module 36 includes a second capacitor. That is, the second capacitor is used to allow the high-frequency signals to flow back to ground and to block the transmission of DC signals to the ground terminal.

[0066] As one possible implementation, as shown in Figure 5, the driving circuit described above also includes a matching resistor 37.

[0067] One end of the matching resistor 37 is electrically connected to the reference node 35, and the other end of the matching resistor 37 is electrically connected to one end of the first connection terminal 31; the matching resistor 37 is used to adjust the impedance of the laser module 33.

[0068] In this embodiment, a matching resistor 37 is provided in the driving circuit to achieve the electrical connection between the first connection terminal 31 and the reference node 35. That is, one end of the matching resistor 37 is electrically connected to the reference node 35, and the other end of the matching resistor 37 is electrically connected to one end of the first connection terminal 31. The matching resistor 37 is connected in parallel with the laser module 33. By adjusting the resistance value of the matching resistor 37, the equivalent impedance of the laser module 33 can be adjusted so that the equivalent impedance of the laser module 33 matches the impedance of the second connection terminal 32, thereby improving the integrity of the high-frequency signal.

[0069] As one possible implementation, as shown in Figure 6, the driving circuit also includes a first inductor 38.

[0070] One end of the first inductor 38 is electrically connected to the reference node 35, and the other end of the first inductor 38 is electrically connected to one end of the matching resistor 37.

[0071] In this embodiment, to achieve good high-frequency performance, a first inductor 38 is provided on the driving circuit. The first inductor 38 connects one end of the matching resistor 37 to the reference node 35. Specifically, one end of the first inductor 38 is electrically connected to the reference node 35, and the other end of the first inductor 38 is electrically connected to one end of the matching resistor 37. This improves the high-frequency input impedance characteristics of the laser module 33 and reduces high-frequency signal loss.

[0072] As one possible implementation, to further improve high-frequency performance, as shown in Figure 7, the above-mentioned driving circuit also includes a second inductor 39.

[0073] One end of the second inductor 39 is electrically connected to the second connection terminal 32, and the other end of the second inductor 39 is electrically connected to the reference node 35.

[0074] In this embodiment, a second inductor 39 is provided in the driving circuit, which enables the electrical connection between the second connection terminal 32 and the reference node 35. Specifically, one end of the second inductor 39 is electrically connected to the second connection terminal 32, and the other end is electrically connected to the reference node 35. This allows adjustment of the impedance of the second connection terminal 32 by adjusting the second inductor 39, thereby improving high-frequency signal integrity.

[0075] Referring to Figure 8, this is a structural example diagram of a driving circuit provided in an embodiment of this application. As shown in Figure 8, in this driving circuit, the first AC coupling module 34 is a first capacitor, denoted by C3, and the second AC coupling module 36 is a second capacitor, denoted by C4. The first inductor 38 is denoted by inductor L4, and the second inductor 39 is denoted by inductor L5. The matching resistor 37 is denoted by resistor R3. The laser module 33 is denoted by EA. In this example, the first terminal of the laser module 22 is the positive terminal, and the second terminal of the laser module 22 is the cathode. The positive terminal of the laser module 33 is electrically connected to the reference node 35, the cathode of the laser module 33 is electrically connected to one end of capacitor C3, and the other end of capacitor C3 is electrically connected to the ground terminal. One end of capacitor C4 is electrically connected to one end of the first connection terminal 31, and the other end of capacitor C4 is electrically connected to one end of capacitor C3. The cathode of the laser module 33 receives a second bias voltage. The other end of the first connection terminal 31 receives a first bias voltage. One end of the second connection terminal 32 is electrically connected to one end of inductor L5, and the other end of the second connection terminal 32 is electrically connected to the drive module. The other end of inductor L5 is electrically connected to reference node 35. One end of inductor L4 is electrically connected to reference node 35, and the other end is electrically connected to one end of resistor R3. The other end of resistor R3 is electrically connected to one end of the first connection terminal 31. Thus, after the first connection terminal 31 receives the first bias voltage, since inductors L4 and L5 are both low-impedance DC devices, the first bias voltage obtained at the first connection terminal 31 can be transmitted to the second connection terminal 32 through resistor R3, inductors L4 and L5, and then transmitted to the drive module through the second connection terminal 32, providing the drive module with a bias operating voltage. The magnitude of the first bias voltage can be adjusted to determine the magnitude of the bias operating voltage provided to the drive module, thereby providing the drive module with the bias operating voltage required for optimal operating performance. The positive electrode of the laser module 33 can obtain a first bias voltage at the reference node 35, and the cathode can receive a second bias voltage. The first and second bias voltages provide a bias operating voltage for the laser module 33. The magnitude of the bias operating voltage provided to the laser module 33 can be adjusted by regulating the magnitude of the second bias voltage, thereby providing the bias operating voltage required for the laser module 33 to achieve optimal operating performance.

[0076] When the drive module transmits a high-frequency signal to the second connection terminal 32, the second connection terminal 32 can transmit the high-frequency signal to the laser module 33 via inductor L5 and reference node 35. In this way, the laser module 33 can convert the high-frequency signal into an optical signal. The high-frequency signal is also transmitted to the first connection terminal 31 at the reference node. Since capacitor C4 provides a low-impedance path for the high-frequency signal, the high-frequency signal can be transmitted through capacitor C4 to capacitor C3 and then flow back to ground via capacitor C3. Similarly, the high-frequency signal flowing out of the cathode of the laser module 33 flows back to ground via capacitor C3.

[0077] In this way, the driving circuit provided in this embodiment can provide a bias operating voltage to the driving module through a first bias voltage, and provide a bias operating voltage to the laser module 33 through the first bias voltage and a second bias voltage. This achieves different bias operating voltages for the driving module and the laser module 33, allowing them to achieve optimal operating performance and improving the high-frequency performance of the driving circuit. Furthermore, in this embodiment, no BiasT device is needed when providing different bias operating voltages to the driving module and the laser module 33, reducing the space of the driving circuit and the link length between the driving module and the laser module 33, further improving the high-frequency performance of the driving circuit.

[0078] Referring to Figure 9, it is a schematic diagram of the structure of a light emitting component provided in an embodiment of this application. As shown in Figure 9, the light emitting component 100 includes: a substrate 101 and a laser chip 102.

[0079] The substrate 101 is provided with a ground terminal 103, a high-frequency signal line 104, a first connection terminal 105, a reference node 106 and a first capacitor 107.

[0080] One end of the first connection terminal 105 is connected to the reference node 106, and the other end of the first connection terminal 105 is used to receive the first bias voltage; the first end of the high-frequency signal line 104 is connected to the reference node 106; the second end of the high-frequency signal line 104 is used to connect an external drive module.

[0081] The laser chip 102 is attached to the substrate 101. The first end of the laser chip 102 is connected to the reference node 106, and the second end of the laser chip 102 is used to receive the second bias voltage.

[0082] One end of the first capacitor 107 is connected to the second end of the laser chip 102, and the other end of the first capacitor 107 is connected to the ground terminal 103.

[0083] In this embodiment, the light emitting component 100 includes a substrate 101 and a laser chip 102. The substrate 101 is provided with a ground terminal 103, a high-frequency signal line 104, a first connection terminal 105, a reference node 106, and a first capacitor 107. The reference node 106 is located between the first connection terminal 105 and the high-frequency signal line 104. One end of the first connection terminal 105 is connected to the reference node 106, and the other end of the first connection terminal 105 is used to receive a first bias voltage. Thus, the first connection terminal 105 can transmit the received first bias voltage signal to the reference node 106. The first end of the high-frequency signal line 104 is connected to the reference node 106, and the second end of the high-frequency signal line 104 is used to connect an external driving module. The first bias voltage signal received by the first connection terminal 105 is transmitted to the high-frequency signal line 104 via the reference node 106. The high-frequency signal line 104 can transmit the first bias voltage signal to the driving module, providing a bias operating voltage for the driving module. The optimal bias voltage for the driving module can be provided by adjusting the magnitude of the first bias voltage. The laser chip 102 is mounted on the substrate 101. The first end of the laser chip 102 is connected to the reference node 106, and the second end of the laser chip 102 receives the second bias voltage. Thus, the first end of the laser chip 102 can obtain the first bias voltage through the reference node 106, and the first and second bias voltages provide the optimal bias voltage for the laser chip 102. In some embodiments, the first end of the laser chip 102 is its positive terminal, and the second end is its negative terminal; the voltage difference between the first and second bias voltages is the optimal bias voltage provided to the laser chip 102. After determining the magnitude of the first bias voltage, the optimal bias voltage for the laser chip 102 can be provided by adjusting the magnitude of the second bias voltage. The driving module can transmit a high-frequency signal to the laser chip 102 via the reference node 106 through the high-frequency signal line 104, so that the laser chip 102 can convert the high-frequency signal into an optical signal. To improve the high-frequency performance of the optical emitting component 100 and reduce high-frequency signal radiation, the high-frequency signal of the laser chip 102 needs to be returned to ground. A first capacitor 107 is disposed on the substrate 101, with one end of the first capacitor 107 connected to the second end of the laser chip 102 and the other end of the first capacitor 107 connected to the ground terminal 103. In this way, the first capacitor 107 can provide a low-impedance path for the high-frequency signal, allowing the high-frequency signal of the laser chip 102 to return to ground.

[0084] As one possible implementation method, and for the convenience of structural implementation, as shown in Figure 9, a connection area 108 is also provided on the substrate 101.

[0085] The second end of the laser chip 102 is connected to the connection area 108, and one end of the first capacitor 107 is connected to the connection area 108; the connection area 108 is used to receive the second bias voltage.

[0086] In this embodiment, to facilitate the application of a second bias voltage to the second terminal of the laser chip 102, a ground connection region 108 is also provided on the substrate 101. Thus, one end of the first capacitor 107 and the second bias voltage can both be connected to the second terminal of the laser chip 102 through the ground connection region 108. Specifically, the ground connection region 108 is connected to one end of the first capacitor 107, and the ground connection region 108 receives the second bias voltage, which is transmitted to the second terminal of the laser chip 102 through the ground connection region 108. The high-frequency signal flowing out of the laser chip 102 is transmitted to the ground connection region 108, and then through the ground connection region 108 to the first capacitor 107, before returning to the ground terminal 103 via the first capacitor 107.

[0087] As one possible implementation, as shown in Figure 9, a second capacitor 109 is also provided on the substrate 101.

[0088] One end of the second capacitor 109 is connected to one end of the first connection terminal 105, and the other end of the second capacitor 109 is connected to the connection ground area 108.

[0089] To ensure the high-frequency performance of the optical emitting component, the high-frequency signal transmitted from the reference node 106 to the first connection terminal 105 needs to be returned to ground. At this time, a second capacitor 109 is provided on the substrate 101. One end of the second capacitor 109 is connected to one end of the first connection terminal 105, and the other end of the second capacitor 109 is connected to the ground connection region 108. This allows the second capacitor 109 to provide a low-impedance path for the high-frequency signal at the first connection terminal 105, transmitting the high-frequency signal through the second capacitor 109 to the ground connection region 108, and then through the ground connection region 108 to the first capacitor 107, before returning to the ground terminal 103 via the first capacitor 107.

[0090] As one possible implementation, as shown in Figure 9, a matching resistor 110 is also provided on the substrate 101. One end of the matching resistor 110 is connected to the reference node 106, and the other end of the matching resistor 110 is connected to one end of the first connection terminal 105.

[0091] In this embodiment, a matching resistor 110 is also provided on the substrate 101. The matching resistor 110 connects one end of the first connection terminal 105 to the reference node 106. Specifically, one end of the matching resistor 110 is connected to the reference node 106, and the other end is connected to one end of the first connection terminal 105. The matching resistor 110 is connected in parallel with the laser chip 102. Thus, by adjusting the resistance value of the matching resistor 110, the equivalent impedance of the laser chip 102 can be adjusted, making the equivalent impedance of the laser chip 102 match the impedance of the high-frequency signal line 104, thereby improving the integrity of the high-frequency signal.

[0092] In some embodiments, for ease of implementation, the first end of the laser chip 102 can be used as a reference node 106, as shown in FIG12.

[0093] In some embodiments, the matching resistor 110 and the second capacitor 109 are both located on the side of the laser chip 102 away from the high-frequency signal line 104.

[0094] In some embodiments, the laser chip 102 may be disposed on the substrate 101 near the first end of the high-frequency signal line 104, as shown in FIG10.

[0095] As one possible implementation, the light emitting component 100 also includes a first inductor 111.

[0096] One end of the first inductor 111 is connected to the reference node 106, and the other end of the first inductor 111 is connected to one end of the matching resistor 110.

[0097] Specifically, the optical emitting component 100 includes a first inductor 111. The first inductor 111 connects one end of the reference node 106 to one end of the matching resistor 110; that is, one end of the first inductor 111 is connected to the reference node 106, and the other end of the first inductor 111 is connected to one end of the matching resistor 110. This improves the high-frequency input impedance characteristics of the laser chip 102 and reduces high-frequency signal loss.

[0098] In some embodiments, the first inductor 111 may be disposed on the substrate 101. In other embodiments, the first inductor 111 may be integrated within the laser chip 102.

[0099] In some embodiments, when the reference node 106 is the first end of the laser chip 102, the first end of the laser chip 102 can be connected to the matching resistor 110 via wire bonding. For ease of implementation, the wire bonding to the matching resistor 110 can be used as a first inductor 111, as shown in FIG9.

[0100] As one possible implementation, the light emitting component 100 also includes a second inductor 112.

[0101] One end of the second inductor 112 is connected to the high-frequency signal line 104, and the other end of the second inductor 112 is connected to the reference node 106.

[0102] Specifically, a second inductor 112 is provided in the optical emitting component 100. The second inductor 112 connects the reference node 106 to the high-frequency signal line 104. Specifically, one end of the second inductor 112 is connected to the high-frequency signal line 104, and the other end is connected to the reference node 106. This allows adjustment of the second inductor 112 to adjust the impedance of the high-frequency signal line 104, ensuring that the impedance of the high-frequency signal line 104 matches the equivalent impedance of the laser chip 102, thereby improving the integrity of the high-frequency signal.

[0103] In some embodiments, when the reference node 106 is the first end of the laser chip 102, the first end of the laser chip 102 can be connected to the high-frequency signal line 104 via wire bonding. For ease of implementation, the wire bonded to the high-frequency signal line 104 can be used as a second inductor 112, as shown in FIG9.

[0104] As one possible implementation, the laser chip 102 can be directly attached to the substrate 101. In this case, the laser chip 102 includes a first surface 1021 and a second surface 1022. A first end 1023 is disposed on the first surface 1021 of the laser chip 102, and the second surface 1022 of the laser chip 102 is attached to the substrate 101. The first end 1023 is connected to the first end of the high-frequency signal line 104 and the first connection end 105 through wire bonding.

[0105] In this embodiment, the laser chip 102 includes a first surface 1021 and a second surface 1022, as shown in FIG11. The second surface 1022 of the laser chip 102 is attached to the substrate 101. The first end on the first surface 1021 is connected to the first end of the high-frequency signal line 104 through wire bonding, and is also connected to the first connection end 105 through wire bonding.

[0106] The second end of the laser chip 102 can be disposed on the same surface as the first end of the laser chip 102, or on different surfaces. In some embodiments, the second end of the laser chip 102 and the first end of the laser chip 102 are disposed on the same surface, that is, both the second end and the first end of the laser chip 102 are disposed on the first surface 1021 of the laser chip 102, as shown in FIG9. In this case, the second end of the laser chip 102 is connected to the connection area 108 on the substrate 101 by wire bonding.

[0107] In other embodiments, the second end of the laser chip 102 is disposed on different surfaces from the first end of the laser chip 102; that is, the first end of the laser chip 102 is disposed on the first surface 1021 of the laser chip 102, and the second end of the laser chip 102 is disposed on the second surface 1022 of the laser chip 102. In this case, the second end of the laser chip 102 can be directly soldered to the connection area 108 on the substrate 102, thereby achieving connection with the connection area 108 on the substrate 102, as shown in FIG10.

[0108] As one possible implementation, the laser chip 102 can also be mounted upside down on the substrate 101. In this case, the laser chip 102 includes a first surface 1021 and a second surface 1022. A first end and a second end are disposed on the first surface 1021 of the laser chip 1021. The first surface 1021 of the laser chip 102 is mounted on the substrate 102, the first end is soldered to the first end of the high-frequency signal line 104, and is connected to the first connection end 105 through a substrate trace. The second end is soldered to the connection ground area 108.

[0109] Specifically, the laser chip 102 includes a first surface 1021 and a second surface 1022. The first surface 1021 of the laser chip 102 has a first end and a second end. The laser chip 102 is upside down mounted on the substrate 101. The first end is soldered to the high-frequency signal line 104. The first end of the laser chip 102 is connected to the first connection end 105 through substrate traces. The second end is soldered to the connection ground area 108 on the substrate 101, as shown in Figure 12.

[0110] As one possible implementation, as shown in Figure 13, the aforementioned connection area 108 includes a first connection sub-area 1081 and a second connection sub-area 1082; the grounding terminal 103 includes a first sub-grounding terminal 1031 and a second sub-grounding terminal 1032. The first capacitor 107 includes a first sub-capacitor 1071 and a second sub-capacitor 1072.

[0111] The first ground sub-region 1081 and the first sub-ground terminal 1031 are located on one side of the high-frequency signal line 104, and the second ground sub-region 1082 and the second sub-ground terminal 1032 are located on the other side of the high-frequency signal line 104. One end of the first sub-capacitor 1071 is connected to the first ground sub-region 1081, and the other end of the first sub-capacitor 1071 is connected to the first sub-ground terminal 1031. One end of the second sub-capacitor 1072 is connected to the second ground sub-region 1082, and the other end of the second sub-capacitor 1072 is connected to the second sub-ground terminal 1032. In this way, the energy radiated by the high-frequency signal line 104 can be returned to ground, improving high-frequency performance.

[0112] Thus, the connection area 108 includes a first connection sub-region 1081 and a second connection sub-region 1082. The first connection sub-region 1081 and the second connection sub-region 1082 are located on both sides of the high-frequency signal line 104, that is, the first connection sub-region 1081 and the second connection sub-region 1082 surround the high-frequency signal line 104. The first connection sub-region 1081 is connected to the first ground terminal 1031 through the first sub-capacitor 1071, and the second connection sub-region 1082 is connected to the second ground terminal 1032 through the second sub-capacitor 1072. The energy radiated when the high-frequency signal line transmits high-frequency signals can be returned to the first ground terminal 1031 and the second ground terminal 1032 respectively, which can improve high-frequency performance.

[0113] In some embodiments, the driving module corresponding to the optical emitting component can be a DRV (Driver), meaning the laser chip in the optical emitting component can be driven by a DRV, as shown in Figure 14a. In other embodiments, the driving module corresponding to the optical emitting component can also be an application-specific integrated circuit (ASIC) for optical digital signal processing (oDSP), meaning the laser chip in the optical emitting component can be directly driven by an ASIC for optical digital signal processing, as shown in Figure 14b. Of course, the driving module corresponding to the optical emitting component can also be other types of driving devices, and this application does not limit this.

[0114] Corresponding to the above embodiments, this application also provides an optical module. The optical module includes the driving circuit described in the above embodiments or the optical emitting component described in the above embodiments.

[0115] Corresponding to the above embodiments, this application also provides a device. The device includes the driving circuit or the optical emitting component described in the above embodiments, or includes the optical module described in the above embodiments.

[0116] The same or similar parts between the various embodiments in this specification can be referred to mutually. In particular, the device embodiments and terminal embodiments are basically similar to the method embodiments, so the description is relatively simple, and the relevant parts can be referred to the description in the method embodiments.

Claims

1. A driving circuit, characterized in that, include: The system comprises a first connection terminal, a second connection terminal, a laser module, a first AC coupling module, and a reference node; wherein... One end of the first connection terminal is electrically connected to the reference node, and the other end of the first connection terminal is used to receive the first bias voltage; One end of the second connection terminal is electrically connected to the reference node, and the other end of the second connection terminal is used to connect an external drive module; The second connection terminal is used to provide a bias operating voltage to the drive module according to the first bias voltage, and to transmit the high-frequency signal sent by the drive module to the reference node; The first end of the laser module is electrically connected to the reference node, and the second end of the laser module is used to receive a second bias voltage. The laser module is used to obtain a bias operating voltage based on the first bias voltage obtained from the first end and the second bias voltage obtained from the second end, and to obtain a high-frequency signal sent by the driving module based on the second connection end, and convert the high-frequency signal into an optical signal. The first end of the first AC coupling module is electrically connected to the second end of the laser module, and the second end of the first AC coupling module is electrically connected to the ground terminal; the first AC coupling module is used to return the high-frequency signal to the ground terminal.

2. The circuit according to claim 1, characterized in that, Also includes: Second AC coupling module; The first end of the second AC coupling module is electrically connected to one end of the first connection end, and the second end of the second AC coupling module is electrically connected to the first end of the first AC coupling module; the second AC coupling module is used to return the high-frequency signal at the first connection end to the ground end.

3. The circuit according to claim 1 or 2, characterized in that, Also includes: Matching resistor; One end of the matching resistor is electrically connected to the reference node, and the other end of the matching resistor is electrically connected to one end of the first connection terminal; the matching resistor is used to adjust the equivalent impedance of the laser module.

4. The circuit according to claim 3, characterized in that, Also includes: First inductor; One end of the first inductor is electrically connected to the reference node, and the other end of the first inductor is electrically connected to one end of the matching resistor.

5. The circuit according to any one of claims 1-4, characterized in that, Also includes: Second inductor; One end of the second inductor is electrically connected to the second connection terminal, and the other end of the second inductor is electrically connected to the reference node.

6. The circuit according to claim 1, characterized in that, The first AC coupling module includes a first capacitor.

7. The circuit according to claim 2, characterized in that, The second AC coupling module includes a second capacitor.

8. A light-emitting component, characterized in that, include: Substrate and laser chip; The substrate is provided with a ground terminal, a high-frequency signal line, a first connection terminal, a reference node, and a first capacitor; One end of the first connection terminal is connected to the reference node, and the other end of the first connection terminal is used to receive the first bias voltage; the first end of the high-frequency signal line is connected to the reference node; the second end of the high-frequency signal line is used to connect an external driving module. The laser chip is attached to the substrate, with a first end of the laser chip connected to the reference node and a second end of the laser chip used to receive a second bias voltage. One end of the first capacitor is connected to the second end of the laser chip, and the other end of the first capacitor is connected to the ground terminal.

9. The optical emitting component according to claim 8, characterized in that, It also includes: connecting regions; The second end of the laser chip is connected to the connection area, and one end of the first capacitor is connected to the connection area; The connection area is used to receive the second bias voltage.

10. The light emitting component according to claim 9, characterized in that, Also includes: Second capacitor; One end of the second capacitor is connected to one end of the first connection terminal, and the other end of the second capacitor is connected to the connection area.

11. The light emitting component according to claim 10, characterized in that, It also includes matching resistors; One end of the matching resistor is connected to the reference node, and the other end of the matching resistor is connected to one end of the first connection terminal.

12. The light emitting component according to claim 11, characterized in that, Also includes: First inductor; One end of the first inductor is connected to the reference node, and the other end of the first inductor is connected to one end of the matching resistor.

13. The light emitting component according to any one of claims 8-12, characterized in that, Also includes: Second inductor; One end of the second inductor is connected to the high-frequency signal line, and the other end of the second inductor is connected to the reference node.

14. The light emitting component according to any one of claims 9-13, characterized in that, The laser chip includes a first surface and a second surface. A first end is disposed on the first surface of the laser chip, and the second surface of the laser chip is attached to the substrate. The first end is connected to the first end of the high-frequency signal line and the first connection end by wire bonding.

15. The light emitting component according to claim 14, characterized in that, A second end is disposed on the second surface of the laser chip, and the second end of the laser chip is attached to the connection area of ​​the substrate.

16. The light emitting component according to claim 14, characterized in that, The laser chip also has a second end on its first surface, and the second end is connected to the connection area by wire bonding.

17. The light emitting component according to any one of claims 9-13, characterized in that, The laser chip includes a first surface and a second surface. A first end and a second end are disposed on the first surface of the laser chip. The first surface of the laser chip is attached to the substrate. The first end is soldered to the first end of the high-frequency signal line and connected to the first connection end by wire bonding. The second end is soldered to the connection area.

18. The light emitting component according to any one of claims 9-17, characterized in that, The connection area includes a first connection sub-region and a second connection sub-region; the grounding terminal includes a first sub-grounding terminal and a second sub-grounding terminal; the first capacitor includes a first sub-capacitor and a second sub-capacitor; The first ground connection sub-region and the first sub-ground terminal are located on one side of the high-frequency signal line, and the second ground connection sub-region and the second sub-ground terminal are located on the other side of the high-frequency signal line. One end of the first sub-capacitor is connected to the first ground sub-region, and the other end of the first sub-capacitor is connected to the first sub-ground terminal; one end of the second sub-capacitor is connected to the second ground sub-region, and the other end of the second sub-capacitor is connected to the second sub-ground terminal.

19. An optical module, characterized in that, It includes the driving circuit according to any one of claims 1-7 or the light emitting component according to any one of claims 8-18.

20. A device, characterized in that, It includes the driving circuit according to any one of claims 1-7, or the optical emitting component according to any one of claims 8-18, or the optical module according to claim 19.

Images