Refrigeration system and control method therefor

Abstract

The present disclosure relates to the technical field of refrigeration. Disclosed are a refrigeration system and a control method therefor. The system comprises a refrigeration chamber, a heat exchange apparatus and a heat exchange chamber, wherein a vacuum apparatus is provided in the refrigeration chamber, and the vacuum apparatus is used for adjusting the vacuum pressure in the refrigeration chamber, so that the refrigeration chamber enters a negative pressure state; a hot end of the heat exchange apparatus is in contact with the refrigeration chamber, and in the negative pressure state, a first fluid in a liquid state in the refrigeration chamber absorbs heat and then vaporizes; and a heat exchange channel is provided in the heat exchange chamber, the heat exchange channel is in contact with a cold end of the heat exchange apparatus, and the heat exchange channel is configured to be in communication with a target refrigeration object, so that a second fluid of the target refrigeration object exchanges heat with the cold end of the heat exchange apparatus through the heat exchange channel.

Description

Refrigeration system and its control method

[0001] Cross-reference to related applications

[0002] This application claims priority to Chinese Patent Application No. 202410925362.5, filed on July 10, 2024, entitled "Refrigeration System and Control Method Thereof", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure relates to the field of refrigeration technology, specifically to refrigeration systems and their control methods. Background Technology

[0004] Currently, when a data center experiences a cooling failure, water storage tanks are typically used to cool the data center, taking advantage of water's high specific heat capacity to effectively absorb the heat from the data center. Summary of the Invention

[0005] In view of this, the present disclosure provides a cooling system and its control method to solve the problem of limited emergency cooling effect for data centers.

[0006] In a first aspect, this disclosure provides a refrigeration system, the refrigeration system comprising:

[0007] A refrigeration chamber is provided with a vacuum device, which is used to adjust the vacuum pressure inside the refrigeration chamber so that the refrigeration chamber enters a negative pressure state;

[0008] A heat exchange device, wherein the hot end of the heat exchange device is in contact with the refrigeration chamber, and the first liquid in the refrigeration chamber absorbs heat and vaporizes under negative pressure;

[0009] A heat exchange chamber is provided, wherein a heat exchange channel is provided, the heat exchange channel is in contact with the cold end of the heat exchange device, and the heat exchange channel is used to connect with the target refrigeration object so that the second fluid of the target refrigeration object exchanges heat with the cold end of the heat exchange device through the heat exchange channel.

[0010] Secondly, this disclosure provides a control method for a refrigeration system, applicable to the aforementioned refrigeration system; the control method includes:

[0011] If the first temperature of the target object to be cooled is higher than a preset temperature threshold, then the vacuum device is activated.

[0012] The vacuum device is controlled to adjust the vacuum pressure inside the cooling chamber so that the cooling chamber enters a negative pressure state;

[0013] The second fluid flowing through the target object in the heat exchange channel is subjected to heat exchange at the cold end of the heat exchange device to reduce the temperature of the target object.

[0014] The refrigeration system provided in this embodiment features a vacuum device within the refrigeration chamber. This device allows for adjustment of the vacuum pressure within the refrigeration chamber, enabling it to enter a negative pressure state. When the refrigeration chamber enters a negative pressure state, the boiling point of the first liquid fluid within the chamber decreases, making it easier for the first fluid to boil and absorb heat from the hot end of the heat exchange device and the refrigeration chamber, thus undergoing a phase change and lowering the temperature of both the refrigeration chamber and the hot end of the heat exchange device. Simultaneously, the temperature of the cold end of the heat exchange device also decreases. Therefore, the second fluid, representing the target object to be refrigerated, can exchange heat with the cold end of the heat exchange device through the heat exchange channel, cooling the second fluid. The cooled second fluid can then be used to refrigerate the target object. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the specific embodiments of this disclosure or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0016] Figure 1 is a schematic diagram of a first refrigeration system according to an embodiment of the present disclosure;

[0017] Figure 2 is a schematic diagram of a second refrigeration system according to an embodiment of the present disclosure;

[0018] Figure 3 is a schematic diagram of an application scenario of a first refrigeration system according to an embodiment of the present disclosure;

[0019] Figure 4 is a schematic diagram of a third refrigeration system according to an embodiment of the present disclosure;

[0020] Figure 5 is a schematic diagram of an application scenario of a second refrigeration system according to an embodiment of the present disclosure;

[0021] Figure 6 is a schematic diagram of an application scenario of a third refrigeration system according to an embodiment of the present disclosure;

[0022] Figure 7 is a schematic diagram of a fourth refrigeration system according to an embodiment of the present disclosure;

[0023] Figure 8 is a flowchart illustrating a control method for a refrigeration system according to an embodiment of the present disclosure.

[0024] The attached figures are labeled as follows: 100, refrigeration system; 1, refrigeration chamber; 11, vacuum device; 2, heat exchange device; 21, hot end of heat exchange device; 211, heat exchange element; 22, cold end of heat exchange device; 3, heat exchange chamber; 31, air supply device; 32, circulation device; 200, liquid cooling system; 4, cold aisle; 5, hot aisle; 6, frame; 7, coolant distribution unit; 8, immersion chamber. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0026] Currently, when a data center experiences a cooling failure, water tanks, ice stacks, or dry ice release are commonly used to cool the data center. However, water tanks typically have a cooling time of only 10 to 15 minutes, which is limited. Ice stacks have limited emergency cooling effects, as latent heat cannot be released quickly, resulting in low cooling efficiency and a limited quantity of ice available. Dry ice release has limited emergency cooling effects, a limited quantity of dry ice available, and poses certain safety risks.

[0027] However, the cooling time of a water storage tank is generally only 10 to 15 minutes, which is limited. Therefore, in the event of prolonged cooling failure, the water storage tank cannot continuously provide effective emergency cooling, and the emergency cooling effect is limited.

[0028] In summary, the relevant technologies have limited effectiveness in emergency cooling of data centers.

[0029] In view of the above, according to an embodiment of the present disclosure, a refrigeration system 100 is provided. Figure 1 is a schematic diagram of the structure of a refrigeration system 100 according to an embodiment of the present disclosure. As shown in Figure 1, the system includes: a refrigeration chamber 1, a heat exchange device 2, and a heat exchange chamber 3. The refrigeration chamber 1 is equipped with a vacuum device 11, such as a vacuum pump. The vacuum device 11 is used to adjust the vacuum pressure inside the refrigeration chamber 1 to bring the refrigeration chamber 1 into a negative pressure state. The hot end 21 of the heat exchange device is in contact with the refrigeration chamber 1. Under the negative pressure state, the first liquid fluid in the refrigeration chamber 1 absorbs heat and vaporizes. The heat exchange chamber 3 is equipped with a heat exchange channel, which is in contact with the cold end 22 of the heat exchange device. The heat exchange channel is used to connect with a target object to be refrigerated, so that the second fluid of the target object to be refrigerated exchanges heat with the cold end 22 of the heat exchange device through the heat exchange channel.

[0030] Specifically, the first fluid is water or other coolant. The second fluid is air, water, or other coolant.

[0031] Specifically, when the cooling system 100 of this disclosure is used to cool a data center computer room, the target object of cooling is the computer room.

[0032] The refrigeration system provided in this embodiment, because a vacuum device 11 is provided in the refrigeration chamber 1, can adjust the vacuum pressure inside the refrigeration chamber 1 to bring it into a negative pressure state. When the refrigeration chamber 1 enters a negative pressure state, the boiling point of the first liquid fluid inside the refrigeration chamber 1 decreases accordingly, making it easier for the first fluid to boil and absorb heat from the hot end 21 of the heat exchange device and the refrigeration chamber 1, thus undergoing a phase change and reducing the temperature of the refrigeration chamber 1 and the hot end 21 of the heat exchange device. At the same time, the temperature of the cold end 22 of the heat exchange device also decreases accordingly. Therefore, the second fluid of the target refrigeration object can exchange heat with the cold end 22 of the heat exchange device through the heat exchange channel, cooling the second fluid. The cooled second fluid can then be used to refrigerate the target refrigeration object. On the one hand, since the refrigeration system 100 of this disclosure utilizes the boiling effect and latent heat of the first fluid under negative pressure to refrigerate the target refrigeration object, it can generate a large amount of cooling capacity. On the other hand, since the first fluid can be an easily accessible fluid such as water, the cooling time can be greatly extended, thereby effectively improving the emergency cooling effect for target cooling objects such as data centers.

[0033] For ease of understanding, please refer to Table 1. Table 1 shows that at a vacuum pressure of 0 (i.e., standard atmospheric pressure), the boiling point of water is 100℃, and the latent heat of vaporization is 2256.4 kJ / kg. At a vacuum pressure of -89 kPa, the boiling point of water is 50℃, and the latent heat of vaporization is 2381.9 kJ / kg. At a vacuum pressure of -91.5 kPa, the boiling point of water is 45℃, and the latent heat of vaporization is 2394 kJ / kg. At a vacuum pressure of -94 kPa, the boiling point of water is 40℃, and the latent heat of vaporization is 2406.0 kJ / kg. At a vacuum pressure of -95.6 kPa, the boiling point of water is 35℃, and the latent heat of vaporization is 2417.9 kJ / kg. At a vacuum pressure of -97.1 kPa, the boiling point of water is 30℃, and the latent heat of vaporization is 2429.8 kJ / kg. At a vacuum pressure of -97.9 kPa, the boiling point of water is 27 °C, and the latent heat of vaporization is 2436.9 kJ / kg. It can be seen that as the vacuum pressure decreases, the boiling point of water gradually decreases, while the latent heat of vaporization gradually increases.

[0034] Assuming a cooling capacity of 100kW Q is needed to cool a space for one hour, and the latent heat of vaporization of the first fluid Lv is 2400kJ / kg; where Q = mLv, and m is the mass flow rate. Therefore, we can calculate m = 100kW / 2400kJ / kg, m = 0.0417kg / s, or 0.0417 lps. We know that Volume = m * time * density. For the liquid first fluid, the density is usually close to 1kg / L, which is equivalent to 1 lps. Therefore, we calculate Volume = 0.0417 lps * 60s * 60min = 150 liters = 0.15m. 3 Therefore, to cool a space for one hour, 100kW of cooling capacity requires approximately 0.15m³ of space. 3 The cooling chamber 1 generates cooling capacity. Therefore, it can be more easily accommodated in the space of a data center.

[0035] Based on this, the refrigeration system 100 of this disclosure extracts gas (such as a gaseous first fluid) from the refrigeration chamber 1 through the vacuum device 11, which can increase the vacuum pressure in the refrigeration chamber 1, thereby reducing the boiling point of the first fluid and increasing the latent heat of vaporization, so as to transfer heat more effectively during the phase change process of the first fluid and reduce the temperature of the refrigeration chamber 1.

[0036] Table 1. Boiling point and latent heat of vaporization of water under different vacuum pressures.

[0037] In some optional embodiments, the cooling chamber 1 is provided with a fluid inlet and a fluid outlet; wherein, the fluid inlet of the cooling chamber 1 is used to introduce a liquid first fluid from the outside. The fluid outlet of the cooling chamber 1 is located at the outlet of the vacuum device 11, and the vaporized first fluid sucked out by the vacuum device 11 is discharged to the external environment through the fluid outlet of the cooling chamber 1.

[0038] Optionally, the fluid inlet of the refrigeration chamber 1 can be located at the top of the refrigeration chamber 1, so that the liquid first fluid flows into the refrigeration chamber 1 under the action of gravity. Of course, the fluid inlet of the refrigeration chamber 1 can also be located in other positions, such as the side of the refrigeration chamber 1, as long as the liquid first fluid can flow into the refrigeration chamber 1.

[0039] Optionally, taking water as the first fluid as an example, water vapor tends to float above liquid water. Therefore, the fluid outlets of the vacuum device 11 and the cooling chamber 1 can be set near the top of the cooling chamber 1 or on the upper side to better discharge the first fluid after absorbing heat and vaporizing to the external environment.

[0040] Specifically, a hose can be used to connect to the outlet of the vacuum device 11 and extend the hose from the fluid outlet of the refrigeration chamber 1 to the external environment to avoid the first fluid after absorbing heat affecting the temperature of the refrigeration chamber 1 and the hot end 21 of the heat exchange device, thus ensuring efficient refrigeration.

[0041] The refrigeration system provided in this embodiment places the fluid outlet of the refrigeration chamber 1 at the outlet of the vacuum device 11. Therefore, the first fluid flowing into the refrigeration chamber 1 through the fluid inlet absorbs heat and vaporizes. The vaporized first fluid can then be discharged into the external environment through the outlet of the vacuum device 11 and the fluid outlet of the refrigeration chamber 1 under the suction of the vacuum device 11. This avoids mixing of the low-temperature first fluid with the high-temperature first fluid, thus ensuring the refrigeration effect.

[0042] In some optional embodiments, as shown in FIG2, the heat exchange device 2 further includes a heat exchange element 211; wherein, the heat exchange element 211 is disposed on the side of the heat exchange device 2 close to the refrigeration chamber 1, and the heat exchange element 211 is used to increase the heat exchange area between the heat exchange device 2 and the refrigeration chamber 1.

[0043] It should be noted that the heat exchanger 211 can be a finned heat exchange tube, a heat transfer corrugated plate, or other components that can increase the heat exchange area.

[0044] The refrigeration system provided in this embodiment increases the heat exchange area between the heat exchange device 2 and the refrigeration chamber 1 by configuring a heat exchange element 211 in the heat exchange device 2, thereby improving the heat exchange efficiency and refrigeration efficiency.

[0045] In some optional embodiments, the heat exchange device 2 is a thermoelectric cooling device; wherein the thermoelectric cooling device includes a first heat exchanger and a second heat exchanger; wherein the first heat exchanger is located at the cold end of the thermoelectric cooling device; and the second heat exchanger is located at the hot end of the thermoelectric cooling device.

[0046] The refrigeration system provided in this embodiment uses a thermoelectric cooling device 2 for heat exchange. Therefore, it can utilize the thermoelectric effect to raise the temperature of the medium-temperature cold source and transfer the cooling capacity to the cold end of the thermoelectric cooling device, so that the cooling capacity generated by the refrigeration chamber 1 can be used to cool the second fluid flowing through the heat exchange channel.

[0047] In some alternative implementations, the first heat exchanger and / or the second heat exchanger are provided with multiple rows of finned heat exchange tubes.

[0048] The refrigeration system provided in this embodiment has multiple rows of finned heat exchange tubes in the first and / or second heat exchangers of the thermoelectric cooling device. Therefore, the heat exchange area of ​​the thermoelectric cooling device can be increased to improve the heat exchange efficiency between the thermoelectric cooling device and the refrigeration chamber 1 and / or the heat exchange channel.

[0049] In some optional implementations, as shown in Figure 2, taking a data center server room as an example, if the cooling system 100 and the server room exchange heat using gas (such as air), then the cooling system 100 further includes an air supply device 31; wherein the air supply device 31 is located in the heat exchange channel, the suction side of the air supply device 31 faces the cold end 22 of the heat exchange device, and the outlet side of the air supply device 31 faces the target cooling object.

[0050] Optionally, the air supply device 31 is a fan.

[0051] In the refrigeration system provided in this embodiment, when the second fluid used for heat exchange between the target object and the refrigeration system 100 is a gas, an air supply device 31 is installed in the heat exchange channel. Therefore, the cooled second fluid can be better directed towards the target object to improve refrigeration efficiency.

[0052] As a specific application, if a data center server room uses air-cooled servers, the required air supply temperature is approximately 25°C. Then, by activating the vacuum device 11, the vacuum pressure inside the cooling chamber 1 can be reduced to -95.6 kPa. Assuming that at a vacuum pressure of -95.6 kPa, the temperature inside the cooling chamber 1 can be reduced to 35°C through the vaporization of the first fluid, and the temperature difference between the cold and hot ends of the thermoelectric cooling device is approximately 11°C, the temperature of the cold end of the thermoelectric cooling device is approximately 24°C. Therefore, after heat exchange between the gas (such as air) in the heat exchange channel and the cold end of the thermoelectric cooling device, the temperature can be reduced to approximately 24°C. The air supply device 31 blows the gas at approximately 24°C into the server room, thus cooling the server room and reducing its temperature to approximately 24°C (e.g., 25°C).

[0053] As shown in Figure 3, to meet the ever-increasing heat dissipation requirements of data center server rooms, improve the existing local heat island problem within the server room, and avoid direct mixing of cold and hot air, the server room typically has hot aisles 5 and cold aisles 4 at both ends of the racks 6 (also known as racks). The cooling system 100 disclosed herein can be arranged in the cold aisle 4 of the server room. The heat exchange channel of the cooling system 100 faces or is arranged in the cold aisle 4 of the server room, while the fluid outlet of the cooling chamber of the cooling system 100 is connected to the external environment to avoid affecting the temperature of the cold aisle 4.

[0054] In some optional implementations, if the target cooling object is a computer room, and the computer room uses a liquid cooling system 200, that is, the cooling system 100 and the computer room exchange heat using a liquid (such as water). Then, as shown in Figure 4, the heat exchange channel includes a first heat exchange pipe and a second heat exchange pipe; wherein, the fluid inlet of the first heat exchange pipe is connected to the return liquid pipe of the liquid cooling system 200 in the computer room, and the fluid outlet of the first heat exchange pipe is connected to the fluid inlet of the first heat exchanger; the fluid inlet of the second heat exchange pipe is connected to the fluid outlet of the first heat exchanger, and the fluid outlet of the second heat exchange pipe is connected to the liquid supply pipe of the liquid cooling system 200.

[0055] It is worth noting that, in actual operation, a first switching assembly can be installed between the fluid inlet of the first heat exchange pipeline and the return pipeline of the liquid cooling system 200 in the computer room. This first switching assembly controls the opening and closing of the channel between the fluid inlet of the first heat exchange pipeline and the return pipeline of the liquid cooling system 200 in the computer room. Similarly, a second switching assembly can be installed between the fluid outlet of the second heat exchange pipeline and the supply pipeline of the liquid cooling system 200. This second switching assembly controls the opening and closing of the channel between the fluid outlet of the second heat exchange pipeline and the supply pipeline of the liquid cooling system 200.

[0056] When the cooling system in the data center is functioning properly or has sufficient cooling capacity, the first switching assembly can be used to close the channel between the fluid inlet of the first heat exchange pipe and the return pipe of the liquid cooling system 200 in the data center, and the second switching assembly can be used to close the channel between the fluid outlet of the second heat exchange pipe and the supply pipe of the liquid cooling system 200. The existing liquid cooling system 200 in the data center can then be used to cool the data center.

[0057] When the cooling system in the data center malfunctions or the cooling capacity is insufficient, the channel between the fluid inlet of the first heat exchange pipeline and the return pipeline of the liquid cooling system 200 in the data center can be opened by the first switching component, and the channel between the fluid outlet of the second heat exchange pipeline and the supply pipeline of the liquid cooling system 200 can be opened by the second switching component, so as to use the cooling system 100 of this disclosure to provide emergency cooling for the data center.

[0058] The cooling system provided in this embodiment has a first heat exchange pipe whose fluid inlet is connected to the return pipe of the liquid cooling system 200 in the computer room, and a second heat exchange pipe whose fluid inlet is connected to the fluid outlet of the first heat exchanger, and a third heat exchange pipe whose fluid outlet is connected to the supply pipe of the liquid cooling system 200. Therefore, the first heat exchanger of the thermoelectric cooling device can be used to cool the second fluid, and then the cooled second fluid can be transferred to the supply pipe of the liquid cooling system 200 through the second heat exchange pipe to cool the data center computer room.

[0059] In some optional embodiments, the refrigeration system 100 further includes a first extension pipe and a second extension pipe; wherein the fluid inlet of the first extension pipe is selectively connected to the return pipe of the target component in the liquid cooling system 200, the fluid outlet of the first extension pipe is connected to the fluid inlet of the first heat exchange pipe, and the target component includes at least one of the immersion chamber 8, the frame 6, and the coolant distribution unit 7; the fluid inlet of the second extension pipe is connected to the fluid outlet of the second heat exchange pipe, and the fluid outlet of the second extension pipe is selectively connected to the supply pipe of the target component.

[0060] It should be noted that if the data center uses liquid-cooled servers, the single point of failure of the liquid cooling system 200 is usually located at the connection between the secondary loop and the manifold. Therefore, the supply and return connection design of the quick connector or main connector at the secondary loop of the manifold or coolant distribution unit 7 (also known as CDU) can be modified to connect the rack 6 or coolant distribution unit 7 to the cooling system 100 of this disclosure, so as to configure different levels of emergency cooling granularity.

[0061] For example, as shown in FIG5, a first extension pipe can be used to connect the first heat exchange pipe to the return pipe of the rack 6 or coolant distribution unit 7 in the liquid cooling system 200 that needs to be cooled, and a second extension pipe can be used to connect the second heat exchange pipe to the supply pipe of the rack 6 or coolant distribution unit 7 in the liquid cooling system 200 that needs to be cooled. This allows the high-temperature second fluid flowing through the rack 6 or coolant distribution unit 7 to be transported to the first heat exchange pipe, thereby cooling the high-temperature second fluid using the cold end of the thermoelectric cooling device. The cooled second fluid is then transferred back to the rack 6 or coolant distribution unit 7 to cool the rack 6 or coolant distribution unit 7.

[0062] It should be noted that when connected to the coolant distribution unit 7, the second fluid is pure water.

[0063] For the immersion liquid cooling system 200, a single point of failure occurs at the connection between the primary loop of the immersion liquid cooling system and the supply and return connections of the immersion tank 8 (also known as the Immersion Tank). Alternatively, when the cold source on the primary side of the immersion liquid cooling system fails, a significant leak occurs at any point on the primary side. Therefore, as shown in Figure 6, by modifying the connection at the supply and return connections of the immersion tank 8, the faulty immersion tank 8 can be connected to the refrigeration system 100 of this disclosure via a first extension pipe and a second extension pipe to cool the immersion tank 8, thereby achieving emergency cooling.

[0064] Specifically, the first switching assembly includes first switching valves corresponding to various components such as the frame 6, coolant distribution unit 7, and immersion chamber 8, and the second switching assembly includes second switching valves corresponding to various components such as the frame 6, coolant distribution unit 7, and immersion chamber 8. Thus, by controlling the opening and closing of the corresponding first and second switching valves, fine-grained cooling is achieved for the components requiring cooling.

[0065] The cooling system provided in this embodiment includes a first extension pipe and a second extension pipe in the cooling system 100. The fluid inlet of the first extension pipe is selectively connected to the return liquid pipe of the target component in the liquid cooling system 200, and the fluid outlet of the first extension pipe is connected to the fluid inlet of the first heat exchange pipe. The fluid inlet of the second extension pipe is connected to the fluid outlet of the second heat exchange pipe, and the fluid outlet of the second extension pipe is selectively connected to the supply liquid pipe of the target component. Therefore, the cooling system 100 can be selectively used to cool components in the data center computer room that require more cooling, thereby achieving a better cooling effect.

[0066] In some optional embodiments, the heat exchange device 2 is a plate heat exchanger; wherein the plate heat exchanger includes a first fluid line and a second fluid line; wherein the first fluid line is located at the cold end of the plate heat exchanger; and the second fluid line is located at the hot end of the plate heat exchanger.

[0067] It should be noted that plate heat exchangers are mainly used in data center computer rooms that employ liquid cooling systems.

[0068] The refrigeration system provided in this embodiment uses a plate heat exchanger as the heat exchange device 2. Because the flow direction and velocity of the fluid within the plate heat exchanger constantly change, fluid turbulence is increased. Therefore, this effectively improves heat exchange efficiency.

[0069] In some optional implementations, if the target cooling object is a computer room, and the computer room uses a liquid cooling system 200, that is, the cooling system 100 and the computer room exchange heat using a liquid (such as water). Then, as shown in Figure 7, the heat exchange channel includes a third heat exchange pipe and a fourth heat exchange pipe; wherein, the fluid inlet of the third heat exchange pipe is connected to the return liquid pipe of the liquid cooling system 200 in the computer room, and the fluid outlet of the third heat exchange pipe is connected to the fluid inlet of the second fluid pipe; the fluid inlet of the fourth heat exchange pipe is connected to the fluid outlet of the first fluid pipe, and the fluid outlet of the fourth heat exchange channel is connected to the liquid supply pipe of the liquid cooling system 200.

[0070] It is worth noting that, in actual operation, a third switching assembly can be installed between the fluid inlet of the third heat exchange pipeline and the return pipeline of the liquid cooling system 200 in the computer room. This third switching assembly controls the opening and closing of the channel between the fluid inlet of the third heat exchange pipeline and the return pipeline of the liquid cooling system 200 in the computer room. Similarly, a fourth switching assembly can be installed between the fluid outlet of the fourth heat exchange pipeline and the supply pipeline of the liquid cooling system 200. This fourth switching assembly controls the opening and closing of the channel between the fluid outlet of the fourth heat exchange pipeline and the supply pipeline of the liquid cooling system 200.

[0071] When the cooling system in the data center is functioning properly or has sufficient cooling capacity, the fluid inlet of the third heat exchange pipe can be closed to the return pipe of the liquid cooling system 200 in the data center via the third switch assembly, and the fluid outlet of the fourth heat exchange pipe can be closed to the supply pipe of the liquid cooling system 200 via the fourth switch assembly. The existing liquid cooling system 200 in the data center can then be used to cool the data center.

[0072] When the cooling system in the data center malfunctions or the cooling capacity is insufficient, the fluid inlet of the third heat exchange pipeline can be opened by the third switch assembly and the return pipeline of the liquid cooling system 200 in the data center, and the fluid outlet of the fourth heat exchange pipeline can be opened and the supply pipeline of the liquid cooling system 200 can be opened by the fourth switch assembly, so as to use the cooling system 100 of this disclosure to provide emergency cooling for the data center.

[0073] The refrigeration system provided in this embodiment has a third heat exchange pipeline whose fluid inlet is connected to the return pipeline of the liquid cooling system 200 in the computer room, and whose fluid outlet is connected to the fluid inlet of the second fluid pipeline. The fourth heat exchange pipeline's fluid inlet is connected to the fluid outlet of the first fluid pipeline, and its fluid outlet is connected to the supply pipeline of the liquid cooling system 200. Therefore, the high-temperature second fluid from the liquid cooling system 200 can be transported to the second fluid pipeline of the plate heat exchanger, providing heat for the vaporization of the first fluid in the cooling chamber 1 to cool the second fluid. The cooled second fluid is then transferred to the supply pipeline of the liquid cooling system 200 via the fourth heat exchange pipeline to cool the data center computer room.

[0074] In some optional embodiments, the refrigeration system 100 further includes a third extension pipe and a fourth extension pipe; wherein the fluid inlet of the third extension pipe is selectively connected to the return pipe of the target component in the liquid cooling system 200, the fluid outlet of the third extension pipe is connected to the fluid inlet of the third heat exchange pipe, and the target component includes at least one of the immersion chamber 8, the frame 6, and the coolant distribution unit 7; the fluid inlet of the fourth extension pipe is connected to the fluid outlet of the fourth heat exchange pipe, and the fluid outlet of the fourth extension pipe is selectively connected to the supply pipe of the target component.

[0075] For example, as shown in FIG5, a third extension pipe can be used to connect the third heat exchange pipe to the return pipe of the rack 6 or coolant distribution unit 7 in the liquid cooling system 200 that needs to be cooled, and a fourth extension pipe can be used to connect the fourth heat exchange pipe to the supply pipe of the rack 6 or coolant distribution unit 7 in the liquid cooling system 200 that needs to be cooled, so as to transport the high-temperature second fluid flowing through the rack 6 or coolant distribution unit 7 to the third heat exchange pipe, thereby cooling the high-temperature second fluid using a plate heat exchanger. The cooled second fluid is then transferred back to the rack 6 or coolant distribution unit 7 to cool the rack 6 or coolant distribution unit 7.

[0076] For the immersion liquid cooling system 200, a single point of failure occurs at the connection between the primary loop of the immersion liquid cooling system and the supply and return connection of the immersion chamber 8. Alternatively, when the cold source on the primary side of the immersion liquid cooling system fails, a large leak occurs at any point on the primary side. Therefore, as shown in Figure 6, by changing the connection at the supply and return connection of the immersion chamber 8, the faulty immersion chamber 8 can be connected to the refrigeration system 100 of this disclosure through the third and fourth extension pipes to cool the immersion chamber 8, thereby achieving emergency cooling.

[0077] Specifically, the third switching assembly includes third switching valves corresponding to various components such as the frame 6, coolant distribution unit 7, and immersion chamber 8, and the fourth switching assembly includes fourth switching valves corresponding to various components such as the frame 6, coolant distribution unit 7, and immersion chamber 8. Thus, by controlling the opening and closing of the corresponding third and fourth switching valves, fine-grained cooling is achieved for the components requiring cooling.

[0078] The cooling system provided in this embodiment includes a third extension pipe and a fourth extension pipe in the cooling system 100. The fluid inlet of the third extension pipe is selectively connected to the return liquid pipe of the target component in the liquid cooling system 200, and the fluid outlet of the third extension pipe is connected to the fluid inlet of the third heat exchange pipe. The fluid inlet of the fourth extension pipe is connected to the fluid outlet of the fourth heat exchange pipe, and the fluid outlet of the fourth extension pipe is selectively connected to the supply liquid pipe of the target component. Therefore, the cooling system 100 can be selectively used to cool components in the data center computer room that require more cooling, thereby achieving a better cooling effect.

[0079] In some optional implementations, if the target cooling object is a computer room, and the computer room uses a liquid cooling system 200, that is, the cooling system 100 and the computer room exchange heat using a liquid (such as water). Then, the heat exchange chamber 3 is provided with a fluid inlet, which is used to introduce a liquid third fluid from the outside.

[0080] Optionally, the third fluid is water. The heat exchange chamber 3 can be a reverse osmosis water tank.

[0081] It should be noted that the second and third fluids use the same fluid.

[0082] In some optional implementations, as shown in Figures 4 and 7, taking a data center server room as an example, if the cooling system 100 and the server room use a liquid (such as water) for heat exchange, the heat exchange chamber 3 also includes a circulation device 32; wherein, the circulation device 32 is located in the heat exchange channel, and the circulation device 32 is used to drive the second fluid of the target cooling object to flow in the direction of the heat exchange device 2.

[0083] Optionally, the circulation device 32 is a circulation pump.

[0084] In the refrigeration system provided in this embodiment, when the second fluid used for heat exchange between the target object and the refrigeration system 100 is a liquid, a circulation device 32 is provided in the heat exchange channel. Therefore, the second fluid of the target object can be driven to flow towards the heat exchange device 2 to improve refrigeration efficiency.

[0085] It is worth noting that the refrigeration system of this disclosure can create a negative pressure environment within the refrigeration chamber 1 using the vacuum device 11, lowering the boiling point of the liquid within the chamber 1 and making it easier for the liquid to boil and absorb heat to undergo a phase change. Due to the higher heat of vaporization, heat can be transferred more effectively during the phase change process. This allows the use of the boiling effect and latent heat of the intermediate-temperature liquid to generate a cooling capacity far exceeding that of current water storage tanks, thus providing long-term cooling for the target object (such as a data center). Furthermore, the electrothermal effect of the thermoelectric cooling device can be utilized to efficiently utilize the intermediate-temperature cold source to further generate a large amount of cooling capacity. Moreover, the refrigeration system of this disclosure can use readily available fluids such as water, which can greatly extend emergency response time in the event of an emergency. For cabinet-level failures in liquid cooling systems, the refrigeration system of this disclosure can also provide a cooling solution at this granular level.

[0086] This embodiment also provides a control method for a refrigeration system, which can be used in the aforementioned refrigeration system. Figure 8 is a schematic flowchart of a control method for a refrigeration system according to an embodiment of this disclosure. As shown in Figure 8, the flowchart includes the following steps:

[0087] Step S801: If the first temperature of the target object to be cooled is higher than the preset temperature threshold, then the vacuum device is activated.

[0088] Optionally, the target cooling object is a data center server room.

[0089] Specifically, a first temperature detection device can be installed on the outside of the refrigeration system, for example, at the location where the heat exchange channel is connected to the target object to be refrigerated, so as to detect the first temperature of the target object to be refrigerated using the first temperature detection device.

[0090] Step S802: Control the vacuum device to adjust the vacuum pressure inside the cooling chamber so that the cooling chamber enters a negative pressure state.

[0091] Specifically, the temperature difference between the cold and hot ends of the heat exchange device can be obtained. Based on this temperature difference and the first temperature of the target object being cooled, the target temperature of the cooling chamber is determined. The target operating power of the vacuum device is then determined based on the target temperature, and the operating power of the vacuum device is adjusted to the target operating power. Alternatively, a second temperature detection device can be installed in the cooling chamber to detect the temperature inside the cooling chamber. If the temperature inside the cooling chamber is higher than the target temperature, the operating power of the vacuum device is increased.

[0092] Understandably, the operating power of the vacuum device affects the vacuum pressure within the cooling chamber, and the operating power of the vacuum device is negatively correlated with the vacuum pressure within the cooling chamber. Therefore, the higher the operating power of the vacuum device, the lower the vacuum pressure within the cooling chamber, which induces a phase change in the fluid within the cooling chamber (i.e., from liquid to gas), improving the fluid's heat exchange efficiency. This allows the fluid to absorb heat from the hot end of the cooling chamber and the heat exchange device, lowering their temperatures. Furthermore, heat exchange occurs between the heat exchange channel within the heat exchange chamber and the cold end of the heat exchange device, further reducing the temperature of the heat exchange channel and the heat exchange chamber. Thus, the target object being cooled exchanges heat with the heat exchange channel, absorbing heat from the target object and achieving the purpose of cooling it.

[0093] Step S803: Heat exchange is performed on the second fluid flowing through the target object in the heat exchange channel based on the cold end of the heat exchange device to reduce the temperature of the target object.

[0094] The control method of the refrigeration system provided in this embodiment utilizes a vacuum device within the refrigeration chamber. This device adjusts the vacuum pressure within the refrigeration chamber, creating a negative pressure environment. When the refrigeration chamber enters a negative pressure state, the boiling point of the first liquid fluid within the chamber decreases, making it easier for the first fluid to boil and absorb heat from the hot end of the heat exchanger and the refrigeration chamber, resulting in a phase change and lowering the temperature of both the refrigeration chamber and the hot end of the heat exchanger. Simultaneously, the temperature of the cold end of the heat exchanger also decreases. Therefore, the second fluid, representing the target refrigeration object, can exchange heat with the cold end of the heat exchanger through the heat exchange channel, thus cooling the second fluid. The cooled second fluid can then be used to refrigerate the target refrigeration object. On one hand, the boiling effect and latent heat of the first fluid under negative pressure can be used to refrigerate the target refrigeration object, generating a large amount of cooling capacity. On the other hand, since the first fluid can be an easily accessible fluid such as water, the refrigeration time can be significantly extended, effectively improving the emergency refrigeration effect for target refrigeration objects such as data centers.

[0095] In some optional embodiments, the control vacuum device in step S802 adjusts the vacuum pressure in the cooling chamber to bring the cooling chamber into a negative pressure state, including: when the vacuum device is activated, if the second temperature of the target object to be cooled is higher than a preset temperature threshold, the working power of the vacuum device is increased to reduce the vacuum pressure in the cooling chamber using the vacuum device.

[0096] Specifically, when the vacuum device is activated, the second temperature of the target object to be cooled can be periodically acquired. If the second temperature of the target object to be cooled is still higher than a preset temperature threshold, the operating power of the vacuum device is increased. For example, 5 minutes after the vacuum device is activated, the temperature of the target object to be cooled is acquired. If the temperature is still higher than the preset temperature threshold, the vacuum device is controlled to increase the preset power. After an interval of 5 minutes, the temperature of the target object to be cooled is acquired again. If the temperature is still higher than the preset temperature threshold, the vacuum device is controlled to continue to increase the preset power.

[0097] In some optional embodiments, if the heat exchange device is a thermoelectric cooling device, the control method of the refrigeration system of this disclosure further includes: if the first temperature of the target object to be refrigerated is higher than a preset temperature threshold, then controlling the thermoelectric cooling device to start. The heat exchange between the cold end of the heat exchange device and the second fluid flowing through the target object in the heat exchange channel in step S803 above includes: if the operating power of the vacuum device reaches a preset power threshold and the third temperature of the target object to be refrigerated is higher than the preset temperature threshold, then adjusting the operating parameters of the thermoelectric cooling device to increase the temperature difference between the hot end and the cold end of the thermoelectric cooling device.

[0098] It should be noted that, considering the efficiency of the vacuum device, if the operating power of the vacuum device reaches the preset power threshold, and the temperature of the target object being cooled still does not drop below the preset temperature threshold, the operating power of the vacuum device can be kept constant, and the temperature difference between the hot and cold ends of the thermoelectric cooling device can be adjusted instead. For example, if the original temperature difference between the hot and cold ends of the thermoelectric cooling device was 10°C, the temperature difference can be increased, for example, to 15°C, by adjusting the operating parameters of the thermoelectric cooling device, such as voltage and operating power.

[0099] In some optional embodiments, if the heat exchange channel of the refrigeration system is connected to the cooling space of the target object (such as a computer room), and the target object is cooled by gas (such as air), then an air supply device is provided in the heat exchange channel of the refrigeration system. The control method of the refrigeration system disclosed herein further includes: if the first temperature of the target object is higher than a preset temperature threshold, then controlling the air supply device to start.

[0100] It should be noted that, in addition to adjusting the operating parameters of the thermoelectric cooling device, the operating parameters of the air supply device, such as the rotation speed, can also be adjusted to accelerate the flow of the second fluid cooled by the heat exchange channel to the target object, thereby further reducing the temperature of the target object.

[0101] In some optional embodiments, the target cooling object is a computer room, which is cooled by a liquid cooling system. In this case, a circulation device is provided within the heat exchange channel of the cooling system. The circulation device drives the second fluid of the target cooling object to flow towards the heat exchange device. The control method of the cooling system disclosed herein further includes: if the first temperature of the target cooling object is higher than a preset temperature threshold, then controlling the circulation device to start.

[0102] The further functional descriptions of the various components used in the control method of the above-described refrigeration system are the same as those in the corresponding embodiments described above, and will not be repeated here.

[0103] Although embodiments of the present disclosure have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present disclosure, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A refrigeration system, the refrigeration system comprising: A refrigeration chamber is provided with a vacuum device, which is used to adjust the vacuum pressure inside the refrigeration chamber so that the refrigeration chamber enters a negative pressure state; A heat exchange device, wherein the hot end of the heat exchange device is in contact with the refrigeration chamber, and the first liquid in the refrigeration chamber absorbs heat and vaporizes under negative pressure; A heat exchange chamber is provided, wherein a heat exchange channel is provided, the heat exchange channel is in contact with the cold end of the heat exchange device, and the heat exchange channel is used to connect with the target refrigeration object so that the second fluid of the target refrigeration object exchanges heat with the cold end of the heat exchange device through the heat exchange channel.

2. The refrigeration system according to claim 1, wherein the refrigeration chamber is provided with a fluid inlet and a fluid outlet; wherein, The fluid inlet of the refrigeration chamber is used to introduce the first liquid fluid from the outside; the fluid outlet of the refrigeration chamber is located at the outlet of the vacuum device, and the vaporized first fluid sucked out by the vacuum device is discharged to the external environment through the fluid outlet of the refrigeration chamber.

3. The refrigeration system according to claim 1, wherein the heat exchange device is a thermoelectric cooling device; wherein, The thermoelectric cooling device includes: The first heat exchanger is located at the cold end of the thermoelectric cooling device; The second heat exchanger is located at the hot end of the thermoelectric cooling device.

4. The refrigeration system according to claim 3, wherein the first heat exchanger and / or the second heat exchanger are provided with multiple rows of finned heat exchange tubes.

5. The refrigeration system according to claim 3, wherein the refrigeration system further comprises: An air supply device is provided inside the heat exchange channel, with the air intake side of the air supply device facing the cold end of the heat exchange device and the air outlet side of the air supply device facing the target object to be cooled.

6. The refrigeration system according to claim 3, wherein the target refrigeration object is a computer room; the heat exchange channel includes: The first heat exchange pipeline has its fluid inlet connected to the return liquid pipeline of the liquid cooling system in the computer room, and its fluid outlet connected to the fluid inlet of the first heat exchanger. The second heat exchange pipeline has its fluid inlet connected to the fluid outlet of the first heat exchanger, and its fluid outlet connected to the liquid supply pipeline of the liquid cooling system.

7. The refrigeration system according to claim 6, wherein the refrigeration system further comprises: A first extension pipeline, wherein the fluid inlet of the first extension pipeline is selectively connected to the return pipeline of the target component in the liquid cooling system, and the fluid outlet of the first extension pipeline is connected to the fluid inlet of the first heat exchange pipeline, wherein the target component includes at least one of an immersion chamber, a frame, and a coolant distribution unit. The second extension pipeline has a fluid inlet connected to the fluid outlet of the second heat exchange pipeline, and the fluid outlet of the second extension pipeline is selectively connected to the liquid supply pipeline of the target component.

8. The refrigeration system according to claim 1, wherein the heat exchange device is a plate heat exchanger; wherein, The plate heat exchanger includes: A first fluid line is provided at the cold end of the plate heat exchanger; The second fluid line is located at the hot end of the plate heat exchanger.

9. The refrigeration system according to claim 8, wherein the target refrigeration object is a computer room; the heat exchange channel includes: The third heat exchange pipeline has its fluid inlet connected to the return liquid pipeline of the liquid cooling system in the computer room, and its fluid outlet connected to the fluid inlet of the second fluid pipeline. The fourth heat exchange pipeline has its fluid inlet connected to the fluid outlet of the first fluid pipeline, and its fluid outlet connected to the liquid supply pipeline of the liquid cooling system.

10. The refrigeration system according to claim 9, wherein the refrigeration system further comprises: The third extension pipeline has a fluid inlet that is selectively connected to the return pipeline of the target component in the liquid cooling system, and a fluid outlet that is connected to the fluid inlet of the third heat exchange pipeline. The target component includes at least one of an immersion chamber, a frame, and a coolant distribution unit. A fourth extension pipeline, wherein the fluid inlet of the fourth extension pipeline is connected to the fluid outlet of the fourth heat exchange pipeline, and the fluid outlet of the fourth extension pipeline is selectively connected to the liquid supply pipeline of the target component.

11. The refrigeration system according to claim 1, wherein the heat exchange device further comprises: A heat exchanger is provided on the side of the heat exchange device close to the refrigeration chamber, and the heat exchanger is used to increase the heat exchange area between the heat exchange device and the refrigeration chamber.

12. The refrigeration system according to claim 1, wherein the heat exchange chamber further comprises: A circulation device is provided in the heat exchange channel, and the circulation device is used to drive the second fluid of the target cooling object to flow in the direction of the heat exchange device.

13. A control method for a refrigeration system, applicable to the refrigeration system according to any one of claims 1 to 12; the control method comprising: If the first temperature of the target object to be cooled is higher than a preset temperature threshold, then the vacuum device is activated. The vacuum device is controlled to adjust the vacuum pressure inside the cooling chamber so that the cooling chamber enters a negative pressure state; The second fluid flowing through the target object in the heat exchange channel is subjected to heat exchange at the cold end of the heat exchange device to reduce the temperature of the target object.

14. The control method for the refrigeration system according to claim 13, wherein controlling the vacuum device to adjust the vacuum pressure inside the refrigeration chamber includes: When the vacuum device is activated, if the second temperature of the target object to be cooled is higher than the preset temperature threshold, the operating power of the vacuum device is increased to reduce the vacuum pressure inside the cooling chamber.

15. The control method for a refrigeration system according to claim 14, wherein if the heat exchange device is a thermoelectric cooling device, the step of heat exchange between the cold end of the heat exchange device and the second fluid flowing through the target refrigeration object in the heat exchange channel includes: If the operating power of the vacuum device reaches a preset power threshold and the third temperature of the target object being cooled is higher than the preset temperature threshold, then the operating parameters of the thermoelectric cooling device are adjusted to increase the temperature difference between the hot and cold ends of the thermoelectric cooling device.

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