Vacuum chamber and solar cell processing device

Abstract

A vacuum chamber and a solar cell processing device. The vacuum chamber comprises a chamber body (100), a chamber cover (200) and a heating assembly (500). The chamber body (100) has an opening, the chamber cover (200) hermetically covering the opening. The chamber cover (200) and the chamber body (100) define an accommodating space (300) for accommodating a carrier plate (10). The heating assembly (500) is arranged in the accommodating space (300), and is configured to heat the carrier plate (10) and a substrate (101) on the carrier plate (10). At least one of the chamber body (100) and the chamber cover (200) is constituted by a multi-layer structure, the multi-layer structure at least comprising an inner layer (110) and an outer layer (120).

Description

Vacuum chamber and solar cell processing equipment

[0001] This application claims priority to Chinese Patent Application No. 202421608435.X, filed on July 9, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of vacuum coating technology, for example to a vacuum cavity and solar cell processing equipment. Background Technology

[0003] When processing products using vacuum deposition technology, the corresponding thin film deposition process is typically completed within a vacuum chamber. The chamber itself needs a certain level of mechanical strength to prevent deformation. It also needs to have a certain degree of corrosion resistance to avoid contamination during normal processes and cleaning / maintenance, thus ensuring the equipment's lifespan. Related technologies, such as plasma-enhanced chemical vapor deposition (PECVD) equipment commonly used in solar cell production for depositing silicon-based thin films, typically employ multiple vacuum chambers. Process chambers usually use aluminum-based structures, while non-process chambers use stainless steel structures. However, these technologies all suffer from high costs, excessive equipment weight, and increased power consumption due to significant heat dissipation from the chambers. Summary of the Invention

[0004] This application proposes a vacuum chamber and solar cell processing equipment. The vacuum chamber has high mechanical strength, extends service life, and saves costs.

[0005] This application provides a vacuum cavity, including a cavity body, a cavity cover, and a heating assembly. The cavity body has an opening, and the cavity cover is sealed and closed at the opening. The cavity cover and the cavity body enclose a receiving space for accommodating a carrier plate. The heating assembly is disposed within the receiving space and is configured to heat the carrier plate and a substrate on the carrier plate.

[0006] The cavity body and the cavity cover are composed of at least one of multiple layers, and the multiple layers include at least an inner layer and an outer layer.

[0007] This application provides a solar cell processing apparatus, including the vacuum chamber described above. Attached Figure Description

[0008] Figure 1 is a schematic diagram of the structure of the vacuum cavity (process cavity) provided in Embodiment 1 of this application;

[0009] Figure 2 is a schematic diagram of the structure of the vacuum cavity (non-process cavity) provided in Embodiment 1 of this application;

[0010] Figure 3 is a schematic diagram of the inner and outer layers provided in Embodiment 1 of this application;

[0011] Figure 4 is a schematic diagram of the inner layer, middle layer and outer layer provided in Embodiment 2 of this application;

[0012] Figure 5 is a schematic diagram of the structure of the vacuum cavity (process cavity) provided in Embodiment 1 of this application;

[0013] Figure 6 is a schematic diagram of the structure of the vacuum cavity (non-process cavity) provided in Embodiment 1 of this application;

[0014] Figure 7 is a schematic diagram of the structure of the solar cell processing equipment provided in Embodiment 1 of this application.

[0015] In the diagram, 10 is the carrier plate; 101 is the substrate; 100 is the cavity body; 110 is the inner layer; 120 is the outer layer; 200 is the cavity cover; 300 is the accommodating space; 400 is the intermediate layer; 500 is the heating component; 600 is the vacuum pump assembly; 700 is the gas diffusion module; 800 is the gas supply assembly; 1 is the vacuum cavity; 2 is the conveying component; and 3 is the solar cell processing equipment. Detailed Implementation

[0016] The technical solution of this application will be described below with reference to the accompanying drawings and specific embodiments.

[0017] In the description of this application, unless otherwise expressly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the meaning of the above terms in this application as appropriate.

[0018] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or indicating that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or indicating that the first feature is at a lower horizontal level than the second feature.

[0019] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0020] In the description of this embodiment, unless otherwise specified, the term "multiple" refers to two or more quantities.

[0021] Example 1

[0022] This embodiment provides a vacuum chamber that has high mechanical strength, extends service life, and saves costs.

[0023] As shown in Figures 1-3, the vacuum chamber mainly includes a chamber body 100 and a chamber cover 200. The chamber body 100 has an opening, and the chamber cover 200 seals and closes the opening. The chamber cover 200 and the chamber body 100 enclose a receiving space 300 for accommodating the carrier plate 10. At least one of the chamber body 100 and the chamber cover 200 is composed of a multi-layer structure. The multi-layer structure includes at least an inner layer 110 and an outer layer 120. The inner layer 110 and the outer layer 120 are welded together, and the thickness of the outer layer 120 is greater than the thickness of the inner layer 110.

[0024] For example, in this embodiment, both the cavity body 100 and the cavity cover 200 are constructed with a multi-layer structure, thereby improving the mechanical strength and corrosion resistance of the vacuum cavity. In this embodiment, the inner layer 110 refers to the vacuum side near the accommodating space 300, and the outer layer 120 refers to the atmospheric side away from the accommodating space 300. In actual process operations, the main stress-bearing surface of the vacuum cavity is the outer layer 120; that is, the outer layer 120 is mainly subjected to external atmospheric pressure, while the inner layer 110 is in contact with the process gas. The main function of the inner layer 110 is to ensure the corrosion resistance of the process gas. In other words, the external atmospheric pressure borne by the inner layer 110 is limited. Therefore, in this embodiment, the thickness of the outer layer 120 is greater than the thickness of the inner layer 110. This allows the outer layer 120 to have higher mechanical strength to withstand external atmospheric pressure, thereby improving the mechanical strength of the vacuum cavity, extending its service life, and saving costs.

[0025] Optionally, the inner layer 110 and the outer layer 120 in this embodiment can be welded together by friction welding or explosive welding. Other welding methods can also be used, such as ultrasonic welding.

[0026] Optionally, in this embodiment, at least one adjacent pair of layers in the multilayer structure is connected by one of the following methods: welding, explosive bonding, rolling, hot-press diffusion, and casting. For example, when both the inner layer 110 and the outer layer 120 are multilayered, any two adjacent layers can be connected by one of the above-mentioned methods: welding, explosive bonding, rolling, hot-press diffusion, and casting.

[0027] Any of the above-mentioned processes, such as welding, explosive bonding, rolling, hot-press diffusion, and casting, can be a conventional process.

[0028] In some embodiments, at least one layer of the multilayer structure is formed using an additive manufacturing process. Additive manufacturing is a conventional technology, also known as solid freeform manufacturing or 3D printing, which refers to a process of creating a three-dimensional object from a raw material (typically powder, liquid, suspension, or molten solid) using a series of two-dimensional layers or cross-sections. For example, the inner layer 110 can be formed by additive manufacturing on the outer layer 120, or the outer layer 120 can be formed on the inner layer 110 by additive manufacturing.

[0029] In some embodiments, at least one layer in the multilayer structure is formed using one of physical vapor deposition, chemical vapor deposition, and spraying. For example, the inner layer 110 may be formed using any one of physical vapor deposition, chemical vapor deposition, and spraying; the outer layer 120 may be formed using any one of physical vapor deposition, chemical vapor deposition, and spraying.

[0030] The physical vapor deposition, chemical vapor deposition, and spraying processes mentioned above are conventional processes in this field.

[0031] Optionally, the inner layer 110 in this embodiment is one of aluminum, stainless steel, Invar alloy, or Monel alloy. In other words, the inner layer 110 can be made of one of the following materials: aluminum, stainless steel, Invar alloy, or Monel alloy.

[0032] Optionally, in this embodiment, the outer layer 120 is one of carbon steel, stainless steel, or aluminum; that is, the outer layer 120 can be manufactured from one of carbon steel, stainless steel, or aluminum. For example, the type of carbon steel can be Q235, Q345, etc.

[0033] Optionally, in this embodiment, the thickness of the inner layer 110 is set between 1mm and 100mm, and the thickness of the outer layer 120 is set between 10mm and 200mm, with the outer layer 120 having a greater thickness than the inner layer 110. For example, the thickness of the inner layer 110 can be set to values ​​such as 1mm, 10mm, 50mm, 80mm, and 100mm. The thickness of the outer layer 120 can be set to values ​​such as 10mm, 50mm, 80mm, 150mm, and 200mm.

[0034] Optionally, in this embodiment, the elastic modulus of the outer layer 120 is not less than 2.0e+11, and the yield strength is not less than 2.0e+8.

[0035] In this embodiment, the outer layer 120 and the inner layer 110 are compositely stacked and welded together. The inner layer 110 is made of a material with corrosion resistance and acid resistance to meet the requirements of the process gas. The outer layer 120 is made of a material with high rigidity to increase the mechanical strength of the vacuum cavity.

[0036] As shown in Figures 1-2 and 5-6, in this embodiment, the vacuum chamber further includes a heating component 500 and a vacuum pump assembly 600. The heating component 500 is disposed within the accommodating space 300 and located below the carrier plate 10. The heating component 500 is configured to heat the carrier plate 10 and the substrate 101 on the carrier plate 10. The substrate 101 can be a silicon wafer, glass sheet, or other substrate for film deposition. The vacuum pump assembly 600 is connected to the accommodating space 300. The vacuum chamber also includes a gas diffusion module 700 and a gas supply assembly 800. The gas diffusion module 700 is disposed within the accommodating space 300 and located above the carrier plate 10. The gas diffusion module 700 is configured to uniformly diffuse process gas onto the substrate 101 on the carrier plate 10 for vapor deposition. The gas supply assembly 800 is connected to the accommodating space 300 and is configured to deliver process gas into the accommodating space 300. In other words, process gas is delivered to the containment space 300 through the gas diffusion module 700 to react and perform thin film deposition on the substrate 101 placed on the carrier plate 10.

[0037] Please refer to Figures 1-2 and 5-6. In this embodiment, the vacuum chamber can be either a process chamber or a non-process chamber. When the vacuum chamber is a process chamber, it includes a heating assembly 500, a vacuum pump assembly 600, a gas supply assembly 800, and a gas diffusion module 700. The heating assembly 500 is configured to preheat the carrier plate 10 and the substrate 101. The gas diffusion module 700 is configured to uniformly diffuse the process gas onto the substrate 101 on the carrier plate 10 for vapor deposition. The gas supply assembly 800 is configured to deliver the process gas into the accommodating space 300. The vacuum pump assembly 600 is configured to exhaust gas from the accommodating space 300 to maintain a high vacuum environment. When the vacuum chamber is a non-process chamber, it includes the heating assembly 500 and the vacuum pump assembly 600. The heating assembly 500 is configured to heat the carrier plate 10 and the substrate 101, and the vacuum pump assembly 600 is configured to evacuate the accommodating space 300 to make the accommodating space 300 a negative pressure environment, thereby meeting the valve opening and closing conditions of the adjacent vacuum chambers.

[0038] In this embodiment, the carrier plate 10 is conveyed by a conveying assembly, which can be configured as multiple conveying steel chains.

[0039] As shown in Figure 7, this embodiment also provides a solar cell processing apparatus 3, which includes the aforementioned vacuum chamber 1 and a conveying assembly 2. The conveying assembly 2 is configured to convey a carrier plate 10 carrying a substrate 101 into the vacuum chamber 1. This solar cell processing apparatus has high mechanical strength, extends its service life, and saves costs.

[0040] Example 2

[0041] As shown in Figure 4, this embodiment provides a vacuum cavity. The main difference between this vacuum cavity and the first embodiment is that at least one intermediate layer 400 is provided between the inner layer 110 and the outer layer 120. The two sides of the intermediate layer 400 are welded to the inner layer 110 and the outer layer 120 respectively.

[0042] For example, the intermediate layer 400 can be set to one, two, three, or other layers.

[0043] Optionally, the intermediate layer 400 can be welded to the inner layer 110 and the outer layer 120 by friction welding or explosive welding.

[0044] In some alternative implementations, the intermediate layer 400 and the outer layer 120 may both be made of a material with high mechanical strength, for example, both may be made of carbon steel, such as Q235 or Q345.

[0045] Optionally, the thickness of the intermediate layer 400 in this embodiment is set to between 10mm and 200mm. For example, the thickness of the intermediate layer 400 can be set to values ​​such as 10mm, 50mm, 80mm, 150mm, and 200mm.

[0046] Optionally, in this embodiment, the elastic modulus of the intermediate layer 400 is not less than 2.0e+11, and the yield strength is not less than 2.0e+8.

[0047] The inclusion of the intermediate layer 400 enhances the mechanical strength of the vacuum chamber, extends its service life, and saves costs.

[0048] The remaining structures of the vacuum cavity in this embodiment are the same as those in Embodiment 1, and will not be described in detail here.

[0049] This application provides a vacuum chamber comprising a chamber body, a chamber cover, and a heating assembly. The chamber body has an opening, and the chamber cover seals and closes to the opening, forming a receiving space for accommodating a carrier plate. The heating assembly is disposed within the receiving space and configured to heat the carrier plate and a substrate on the carrier plate. At least one of the chamber body and the chamber cover is composed of a multi-layer structure, which includes at least an inner layer and an outer layer. By configuring at least one of the chamber body and the chamber cover as a multi-layer structure, and the multi-layer structure including at least an inner layer and an outer layer, the mechanical strength of the vacuum chamber can be improved, its service life extended, and costs reduced.

[0050] This application also provides a solar cell processing apparatus, which includes the aforementioned vacuum chamber. This solar cell processing apparatus has high mechanical strength, extends its service life, and saves costs.

Claims

1. A vacuum chamber, comprising a chamber body (100), a chamber cover (200), and a heating assembly (500), wherein the chamber body (100) has an opening, the chamber cover (200) is sealed to the opening, the chamber cover (200) and the chamber body (100) enclose a receiving space (300) for accommodating a carrier plate (10); the heating assembly (500) is disposed within the receiving space (300), and the heating assembly (500) is configured to heat the carrier plate (10) and a substrate (101) on the carrier plate (10); in, At least one of the cavity body (100) and the cavity cover (200) is composed of a multi-layer structure, the multi-layer structure including at least an inner layer (110) and an outer layer (120).

2. The vacuum cavity according to claim 1, wherein, In the multi-layer structure, at least one adjacent pair of layers is connected by one of the following methods: welding, explosive bonding, rolling, hot-press diffusion, or casting.

3. The vacuum cavity according to claim 1, wherein, At least one layer of the multilayer structure is formed by additive manufacturing.

4. The vacuum cavity according to claim 1, wherein, At least one layer of the multilayer structure is formed using one of physical vapor deposition, chemical vapor deposition, and spraying.

5. The vacuum cavity according to claim 1, wherein, The outer layer (120) has a greater thickness than the inner layer (110).

6. The vacuum cavity according to claim 5, wherein, The thickness of the inner layer (110) is set between 1 mm and 100 mm, and the thickness of the outer layer (120) is set between 10 mm and 200 mm.

7. The vacuum cavity according to claim 1, wherein, The inner layer (110) is made of one of the following materials: aluminum, stainless steel, Invar alloy or Monel alloy.

8. The vacuum cavity according to claim 1, wherein, The outer layer (120) is made of carbon steel, stainless steel or aluminum.

9. The vacuum cavity according to claim 1, wherein, At least one intermediate layer (400) is provided between the inner layer (110) and the outer layer (120).

10. The vacuum cavity according to claim 9, wherein, The thickness of the intermediate layer (400) is set between 10mm and 200mm.

11. The vacuum cavity according to claim 9, wherein, The two sides of the intermediate layer (400) are welded to the inner layer (110) and the outer layer (120), respectively.

12. The vacuum cavity according to claim 9, wherein, The intermediate layer (400) is made of carbon steel.

13. The vacuum cavity according to claim 1 further includes a gas diffusion module (700), the gas diffusion module (700) being disposed within the accommodating space (300) and located above the carrier plate (10), the gas diffusion module (700) being configured to deliver process gas to the accommodating space (300) for reaction and to perform thin film deposition on a substrate (101) placed on the carrier plate (10).

14. A solar cell processing apparatus comprising a vacuum chamber (1) and a transfer assembly (2) according to any one of claims 1-13, the transfer assembly (2) being configured to transfer a carrier plate (10) carrying a substrate (101) into the vacuum chamber (1).

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