Displacement sensor, vehicle, and displacement detection method

Abstract

Provided in the present application are a displacement sensor, a vehicle, and a displacement detection method. A displacement sensor (100) comprises a measured magnetic grating ruler (110) and an inductive reading apparatus (120), wherein the measured magnetic grating ruler (110) comprises a first magnetic track (111) and a second magnetic track (112); the inductive reading apparatus (120) comprises a first sensing chip (1211) and a second sensing chip (1221), and the first sensing chip (1211) obtains, when a part to be subjected to measurement is displaced, a first group of magnetic induction intensities in at least two different directions by means of performing sensing on the first magnetic track (111); and the second sensing chip (1221) is used for obtaining, when said part is displaced, a second group of magnetic induction intensities in at least two different directions by means of performing sensing on the second magnetic track (112).

Description

A displacement sensor, a vehicle, and a displacement detection method

[0001] This application claims priority to Chinese Patent Application No. 202410944241.5, filed on July 12, 2024, entitled "A Displacement Sensor, Vehicle and Displacement Detection Method", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of displacement sensor technology, and more particularly to a displacement sensor, a vehicle, and a displacement detection method. Background Technology

[0003] With the continuous development of society and the economy, automobiles, as the most commonly used means of transportation, are becoming increasingly prevalent in people's lives. As vehicle technology continues to advance, people's requirements for vehicles are no longer limited to drivability and safety; vehicle comfort is receiving increasing attention.

[0004] During vehicle operation, it is necessary to monitor the vehicle's vibration. Specifically, displacement sensors are typically installed between the vehicle chassis and the tires to detect vibrations. The displacement sensor includes a magnetic scale being measured and a sensing device. The sensing device contains an anisotropic magnetoresistive (AMR) sensor chip and a Hall effect sensor chip. The AMR sensor chip and the Hall effect sensor chip sense changes in the magnetic field of the magnetic scale being measured to obtain its displacement.

[0005] However, the aforementioned sensors have high requirements for the accuracy of the installation environment, while vehicles experience significant vibrations, making it impossible to meet the installation environment requirements of these sensors and thus hindering their application in vehicles. Summary of the Invention

[0006] This application provides a displacement sensor, a vehicle, and a displacement detection method, which can effectively simplify the assembly process of the displacement sensor and thus effectively improve the assembly efficiency of the displacement sensor.

[0007] One aspect of this application provides a displacement sensor, comprising:

[0008] The magnetic scale to be measured includes a first magnetic track and a second magnetic track arranged in parallel.

[0009] A sensing and reading device is disposed adjacent to the magnetic scale being measured. One of the magnetic scale being measured and the sensing and reading device is used to connect to the device under test. The sensing and reading device includes a first sensing chip and a second sensing chip.

[0010] The first sensing chip is used to obtain a first signal by sensing the first magnetic track when the test piece is displaced. The first signal includes a first set of magnetic induction intensities in at least two different directions.

[0011] The second sensing chip is used to obtain a second signal by sensing the second magnetic track when the test piece is displaced, the second signal including a second set of magnetic induction intensities in at least two different directions;

[0012] The first set of magnetic induction intensities and the second set of magnetic induction intensities are used to calculate the displacement of the test piece.

[0013] This application embodiment incorporates a first sensing chip and a second sensing chip in the sensing and reading device. These chips can acquire magnetic induction intensity in at least two directions to determine the relative displacement relationship between the measured magnetic grating and the sensing and reading device. The first and second sensing chips can sense magnetic fields at relatively long distances. This allows for a longer detection distance between the measured magnetic grating and the sensing and reading device. Applying this displacement sensor to a vehicle effectively reduces the impact of vehicle vibration on the sensor's detection results, enabling the sensor to effectively meet the displacement detection requirements in vehicles.

[0014] In one possible implementation, the first set of magnetic induction intensities includes a first magnetic induction intensity Bx1 and a second magnetic induction intensity Bz1 in two mutually perpendicular directions;

[0015] The second set of magnetic induction intensities includes a third magnetic induction intensity Bx2 and a fourth magnetic induction intensity Bz2 in two mutually perpendicular directions.

[0016] In one possible implementation, the sensing and reading device further includes:

[0017] The processor is electrically connected to both the first sensing chip and the second sensing chip.

[0018] The processor is configured to obtain a first angle of the magnetic field strength of the test piece based on the first magnetic induction intensity Bx1 and the second magnetic induction intensity Bz1, and to obtain a second angle of the magnetic field strength of the test piece based on the third magnetic induction intensity Bx2 and the fourth magnetic induction intensity Bz2, and to calculate the displacement of the test piece based on the first angle and the second angle.

[0019] In one possible implementation, the first magnetic track includes a plurality of first and second magnets with opposite magnetic poles, the first and second magnets being alternately arranged along the length of the first magnetic track;

[0020] The second magnetic track includes a plurality of third and fourth magnets with opposite magnetic poles, the third and fourth magnets being alternately arranged along the length of the second magnetic track;

[0021] Furthermore, the first magnet, the second magnet, the third magnet, and the fourth magnet are arranged in a staggered manner.

[0022] In one possible implementation, the pole lengths of the first magnet and the second magnet are equal, and the pole lengths of the third magnet and the fourth magnet are equal;

[0023] Furthermore, the pole lengths of the first magnet and the second magnet are greater than or less than the pole lengths of the third magnet and the fourth magnet.

[0024] In one possible implementation, the cross-sections of the first and second magnetic tracks are both arc-shaped, perpendicular to the length direction of the first and second magnetic tracks, and the first and second magnetic tracks are set at an angle.

[0025] In one possible implementation, the measured magnetic scale further includes a mounting base having a first mounting groove and a second mounting groove, wherein the first magnetic track and the second magnetic track are respectively located in the first mounting groove and the second mounting groove;

[0026] The first mounting slot and the second mounting slot are set at an angle so that the first magnetic track and the second magnetic track are set at an angle.

[0027] In one possible implementation, the bottom of the first mounting slot and the second mounting slot have a back plate, and the first magnetic track and the second magnetic track are attracted to the first mounting slot and the second mounting slot through the back plate.

[0028] In one possible implementation, the sensing and reading device further includes a housing and a circuit board assembly located within the housing, wherein the first sensing chip, the second magnetic sensing chip, and the processor are all located on the circuit board assembly;

[0029] Furthermore, the first sensing chip is opposite to the first magnetic track, and the distance between the first sensing chip and the first magnetic track is 2mm to 6mm;

[0030] The second sensing chip is opposite to the second magnetic track, and the distance between the second sensing chip and the second magnetic track is 2mm to 6mm.

[0031] In one possible implementation, the distance between the first sensing chip and the first magnetic track is equal to the distance between the second sensing chip and the second magnetic track.

[0032] In one possible implementation, the circuit board assembly includes a first circuit board and a second circuit board that are electrically connected to each other;

[0033] The processor is located on one of the first circuit board and the second circuit board, the first sensing chip is located on the first circuit board, and the second sensing chip is located on the second circuit board;

[0034] The first circuit board corresponds to the first magnetic track, and the second circuit board corresponds to the second magnetic track.

[0035] In one possible implementation, the housing is arc-shaped in a cross-section perpendicular to the length direction of the first and second magnetic tracks, and the first and second circuit boards are angled together so that the first and second circuit boards correspond to the first and second magnetic tracks, respectively.

[0036] In one possible implementation, the sensing and reading device further includes a flexible circuit board, through which the first circuit board and the second circuit board are electrically connected.

[0037] In one possible implementation, a fixing member is provided inside the housing, and the fixing member has a first slot and a second slot, in which the first circuit board and the second circuit board are respectively secured.

[0038] In one possible implementation, the sensing and reading device further includes a third circuit board, which is disposed on the housing and electrically connected to the second circuit board and to an external terminal device.

[0039] In one possible implementation, a connecting harness is also included, one end of which is electrically connected to the third circuit board and the other end of which is electrically connected to an external terminal device.

[0040] In one possible implementation, the third circuit board has connection pads, and one end of the connection harness has a first connection block with a connection solder head connected to the first connection block.

[0041] The housing has a mating hole, the first connecting block is engaged in the mating hole, the connecting welding head passes through the mating hole and is welded to the connecting pad, and the third circuit board and the connecting wire harness are electrically connected by welding between the connecting welding head and the connecting pad.

[0042] In one possible implementation, the housing also includes a sealant that fills the housing and covers the first circuit board and the second circuit board.

[0043] In one possible implementation, the fastener also has a connecting post, the third circuit board has a connecting hole, the connecting post passes through the connecting hole, and the third circuit board is connected to the housing through the cooperation of the connecting post and the connecting hole;

[0044] The connecting column is a hot-melt column, and the connecting column is fused together with the connecting hole.

[0045] In one possible implementation, both the first sensing chip and the second sensing chip are 3D Hall effect sensing chips.

[0046] A second aspect of this application provides a vehicle including at least one displacement sensor, said displacement sensor being any of the displacement sensors described above.

[0047] In one possible implementation, wheels and a chassis are also included, with the wheels connected to the chassis via a suspension.

[0048] The magnetic scale of the displacement sensor is installed on one of the wheel and the chassis, and the sensing and reading device of the displacement sensor is installed on the other of the wheel and the chassis.

[0049] In one possible implementation, it further includes: a linear motor, the linear motor comprising a motor mover and a motor stator, one of the motor mover and the motor stator being connected to the chassis, and the other of the motor mover and the motor stator being connected to the tire;

[0050] The magnetic scale being measured in the displacement sensor is mounted on one of the motor mover and the motor stator, and the sensing and reading device in the displacement sensor is mounted on the other of the motor mover and the motor stator.

[0051] A third aspect of this application provides a displacement detection method, employing any of the displacement sensors described above, the method comprising:

[0052] The first sensing chip of the displacement sensor obtains a first signal by sensing the first magnetic track when the device under test is displaced. The first signal includes a first set of magnetic induction intensities in at least two different directions.

[0053] The second sensing chip of the displacement sensor is used to obtain a second signal by sensing the second magnetic track when the test piece is displaced. The second signal includes a second set of magnetic induction intensities in at least two different directions.

[0054] The displacement of the test piece is obtained based on the first set of magnetic induction intensities and the second set of magnetic induction intensities.

[0055] In one possible implementation, the first set of magnetic induction intensities includes a first magnetic induction intensity Bx1 and a second magnetic induction intensity Bz1 in two mutually perpendicular directions, and the second set of magnetic induction intensities includes a third magnetic induction intensity Bx2 and a fourth magnetic induction intensity Bz2 in two mutually perpendicular directions.

[0056] The step of obtaining the displacement of the test piece based on the first set of magnetic induction intensities and the second set of magnetic induction intensities includes:

[0057] The first angle of the magnetic field strength of the test piece is obtained based on the first magnetic induction intensity Bx1 and the second magnetic induction intensity Bz1.

[0058] The second angle of the magnetic field strength of the test piece is obtained based on the third magnetic induction intensity Bx2 and the fourth magnetic induction intensity Bz2;

[0059] The displacement of the test piece is calculated based on the first angle and the second angle.

[0060] In one possible implementation, obtaining the first angle of the magnetic field strength of the test object based on the first magnetic induction intensity Bx1 and the second magnetic induction intensity Bz1 includes:

[0061] The first angle is calculated using the following formula:

[0062] α1 is the first angle, Bx1 is the first magnetic induction intensity, Bz1 is the second magnetic induction intensity, and k is a coefficient.

[0063] The step of obtaining the second angle of the magnetic field strength of the test object based on the third magnetic induction intensity Bx2 and the fourth magnetic induction intensity Bz2 includes:

[0064] The second angle is calculated using the following formula:

[0065] α2 is the first angle, Bx2 is the third magnetic induction intensity, Bz2 is the fourth magnetic induction intensity, and k is a coefficient.

[0066] In one possible implementation, calculating the displacement of the test piece based on the first angle and the second angle includes:

[0067] The displacement during the first period is calculated using the following formula:

[0068] Wherein, α1 is the first angle, 2L1 is the first period length, and the first period length is the sum of the magnetic pole lengths of the first magnet and the second magnet;

[0069] The displacement during the second period is calculated using the following formula:

[0070] Wherein, α2 is the second angle, 2L2 is the second period length, and the second period length is the sum of the magnetic pole lengths of the third magnet and the fourth magnet;

[0071] The number of cycles T that the test piece passes through is calculated based on the displacement within the first cycle and the displacement within the second cycle, combined with a vernier algorithm.

[0072] The total displacement of the test piece is calculated using the following formula:

[0073] Wherein, α1 is the first angle, 2L1 is the first cycle length, and T is the number of cycles that the test piece passes through;

[0074] Alternatively, the total displacement of the test piece can be calculated using the following formula:

[0075] Wherein, α2 is the second angle, 2L2 is the second period length, and T is the number of periods that the test piece passes through. Attached Figure Description

[0076] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0077] Figure 1 is a schematic diagram of the structure of a displacement sensor provided in an embodiment of this application;

[0078] Figure 2 is a schematic diagram of the structure of a magnetic grating ruler under test provided in an embodiment of this application;

[0079] Figure 3 is a schematic diagram of the magnetic pole distribution of a first magnet provided in an embodiment of this application;

[0080] Figure 4 is a schematic diagram of the magnetic pole distribution of a second magnet provided in an embodiment of this application;

[0081] Figure 5 is an analytical diagram of a measuring magnetic scale vernier algorithm provided in an embodiment of this application;

[0082] Figure 6 is a structural schematic diagram of a mounting base provided in an embodiment of this application;

[0083] Figure 7 is a schematic diagram of the dimensions of a magnetic scale under test provided in an embodiment of this application;

[0084] Figure 8 is an exploded view of a sensor reading device provided in an embodiment of this application;

[0085] Figure 9 is a schematic diagram of a shell provided in an embodiment of this application;

[0086] Figure 10 is an exploded view of the connection between a first circuit board, a second circuit board, and a third circuit board according to an embodiment of this application.

[0087] Figure 11 is a schematic diagram of a connecting wire harness provided in an embodiment of this application;

[0088] Figure 12 is a flowchart illustrating a displacement detection method provided in an embodiment of this application;

[0089] Figure 13 is a relationship diagram of a first magnetic induction intensity Bx1, a second magnetic induction intensity Bz1, a third magnetic induction intensity Bx2, and a third magnetic induction intensity Bz2 provided in an embodiment of this application.

[0090] Figure 14 is a structural schematic diagram of a vehicle provided in an embodiment of this application.

[0091] Reference numerals: 100-Displacement sensor; 110-Measured magnetic scale; 111-First magnetic track; 1111-First magnet; 1112-Second magnet; 112-Second magnetic track; 1121-Third magnet; 1122-Fourth magnet; 113-Mounting base; 1131-First mounting slot; 1132-Second mounting slot; 1133-Mounting part; 120-Sensing reading device; 121-First circuit board; 1211-First sensing chip; 1212-Processor; 122-Second circuit board; 1221-Second sensing chip; 1222-First solder joint; 123-Third circuit board; 1231-Connecting pad; 1232-Connecting hole; 1233-Second solder joint; 1234-Third slot; 1235-Fourth slot; 124-Housing; 1241-Fixing component; 1242-First slot; 1243-Second slot; 1244-Connecting post; 1245-Mating hole; 125-Flexible circuit board; 126-Connecting wire harness; 1261-First connecting block; 1262-Connecting welding head; 1263-Second connecting block; 1264-Third connecting block; 1265-Fourth connecting block; 200-Vehicle. Detailed Implementation

[0092] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0093] This application provides a displacement sensor and a vehicle 200 including the displacement sensor (see Figure 14), wherein the vehicle 200 can be a sedan, bus, or truck. For example, the vehicle 200 can be any one of an electric vehicle (EV), a pure electric vehicle / battery electric vehicle (PEV / BEV), a hybrid electric vehicle (HEV), a range-extended electric vehicle (REEV), a plug-in hybrid electric vehicle (PHEV), and a new energy vehicle.

[0094] The vehicle 200 may also include a chassis and a body mounted on the chassis. The body may have a passenger compartment, which may include a driver's seat, passenger seats, etc., where the driver can operate the vehicle 200. For example, the vehicle body may also include structural components such as a steering wheel, clutch, and brakes to enable the vehicle 200 to perform its full functions; this application does not impose any limitations on these components.

[0095] Wheels can also be connected to the chassis, and the chassis and wheels are connected via axles. A linear motor can be connected between the chassis and the axles, and the linear motor can be used to control the movement between the chassis and the wheels of vehicle 200. During the operation of vehicle 200, the vibration of vehicle 200 needs to be detected so that the linear motor can be controlled according to the detected situation, thereby controlling the movement of the chassis and improving the vibration of vehicle 200. Specifically, a displacement sensor can be installed between the chassis and the wheels to detect changes in the position between the chassis and the wheels, so that the system can drive the linear motor to control the movement of the chassis according to the changes in position.

[0096] The displacement sensor includes a magnetic scale under test and a sensing and reading device. One of these components can be mounted on the chassis, while the other can be mounted on the wheel. The sensing and reading device contains an anisotropic magnetoresistive sensing chip (AMR sensing chip) and a switched Hall sensor chip. The AMR sensing chip and the switched Hall sensor chip sense changes in the magnetic field of the magnetic scale under test to obtain its displacement.

[0097] Specifically, the switch Hall sensor chip acquires the value of the incremental code track to determine the approximate area of ​​movement of the measured magnetic grating, while the AMR sensor chip acquires the value of the absolute code track to determine the precise position of movement of the measured magnetic grating.

[0098] However, the aforementioned sensors have high requirements for the precision of the installation environment. The magnetic scale being measured and the sensing device need to be within a relatively close sensing distance for detection; typically, the distance between the two needs to be less than 0.8 mm to obtain a sensing signal. The vehicle 200 experiences significant vibration, making it impossible to meet the installation environment requirements of the aforementioned sensors, thus hindering their application in the vehicle 200.

[0099] To address the aforementioned problems, this application provides a displacement sensor. By incorporating a first sensing chip and a second sensing chip in a sensing and reading device, the first and second sensing chips can acquire magnetic induction intensity in at least two directions to obtain the relative displacement relationship between the measured magnetic grating and the sensing and reading device. The first and second sensing chips can sense magnetic fields at relatively long distances. This allows for a longer detection distance between the measured magnetic grating and the sensing and reading device. Therefore, applying the displacement sensor to a vehicle 200 can effectively reduce the impact of vehicle 200 vibration on the displacement sensor's detection results, enabling the displacement sensor to effectively meet the displacement detection requirements of the vehicle 200.

[0100] The sensors provided in the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0101] Figure 1 is a schematic diagram of the structure of a displacement sensor provided in an embodiment of this application.

[0102] This application provides a displacement sensor 100, as shown in FIG1. ​​The displacement sensor 100 may include a measured magnetic scale 110 and a sensing and reading device 120. The measured magnetic scale 110 may include a first magnetic track 111 and a second magnetic track 112 arranged in parallel. The sensing and reading device 120 may be disposed adjacent to the measured magnetic scale 110. One of the measured magnetic scale 110 and the sensing and reading device 120 may be used to connect to the device under test. For example, the measured magnetic scale 110 may be connected to the chassis of a vehicle 200, and the sensing and reading device 120 may be connected to the wheel; alternatively, the measured magnetic scale 110 may be connected to the wheel, and the sensing and reading device 120 may be connected to the chassis of the vehicle 200.

[0103] For example, the chassis of vehicle 200 can be connected to the wheels via a linear motor. The linear motor can include a motor mover and a motor stator. One of the motor mover and the motor stator can be connected to the chassis, and the other can be connected to the wheels. The magnetic scale 110 to be measured can be installed on one of the motor mover and the motor stator, and the sensing and reading device 120 can be installed on the other of the motor mover and the motor stator.

[0104] The displacement sensor 100 can be used to detect the relative displacement relationship between the wheel and the axle, so that the linear motor can control the movement of the chassis according to the displacement relationship, thereby improving the bumps of the vehicle 200 and enhancing the comfort of the vehicle 200.

[0105] The sensing and reading device 120 may include a first sensing chip 1211 and a second sensing chip 1221 (see Figure 8). When the chassis and the wheel are in relative displacement, the first sensing chip 1211 can be used to obtain a first signal by sensing the first magnetic track 111 when the test object (i.e., the chassis or the wheel) is in displacement. The first signal may include a first set of magnetic induction intensities in at least two different directions.

[0106] The second sensing chip 1221 can be used to obtain a second signal by sensing the second magnetic track 112 when the device under test (i.e., chassis or wheel) is displaced. The second signal may include a second set of magnetic induction intensities in at least two different directions.

[0107] Specifically, when the chassis and wheels are relatively displaced, the relative position between the first sensing chip 1211 and the first magnetic track 111 will change, causing the first sensing chip 1211 to sense a change in the magnetic field strength of the first magnetic track 111. At this time, the first sensing chip 1211 can obtain the magnetic induction intensity values ​​in two directions according to the different magnetic field strengths, thereby obtaining the first set of magnetic induction intensities.

[0108] Correspondingly, when the chassis and wheels are relatively displaced, the relative position between the first sensing chip 1211 and the first magnetic track 111 will change, causing the magnetic field strength of the first magnetic track 111 sensed by the first sensing chip 1211 to also change. At this time, the first sensing chip 1211 can obtain the magnetic induction intensity values ​​in two directions according to the different magnetic field strengths, thereby obtaining the first set of magnetic induction intensities.

[0109] The first sensing chip 1211 and the second sensing chip 1221 can acquire the first set of magnetic induction intensity and the second set of magnetic induction intensity and transmit them to the terminal control device. The control device can then calculate the displacement of the test piece, i.e. the relative displacement between the chassis and the wheels, based on the first set of magnetic induction intensity and the second set of magnetic induction intensity. Based on the displacement of the test piece, the linear motor can be controlled to change the movement of the chassis of the vehicle 200, thereby reducing the bumps of the vehicle 200 and improving the comfort of the vehicle 200.

[0110] The first sensing chip 1211 and the second sensing chip 1221 can sense magnetic fields at a relatively long distance. This allows the detection distance between the magnetic grating ruler 110 and the sensing and reading device 120 to be set to a relatively long distance, while still being able to detect the relative displacement between them. For example, the detection distance between the magnetic grating ruler 110 and the sensing and reading device 120 is greater than 3 mm.

[0111] Compared with displacement sensors in related technologies, this embodiment of the application, by setting a first sensing chip 1211 and a second sensing chip 1221 in the sensing and reading device 120, allows the first sensing chip 1211 and the second sensing chip 1221 to acquire magnetic induction intensity in at least two directions, thereby obtaining the relative displacement relationship between the measured magnetic grating ruler 110 and the sensing and reading device 120. The first sensing chip 1211 and the second sensing chip 1221 can sense magnetic fields at a relatively long distance. This allows the detection distance between the measured magnetic grating ruler 110 and the sensing and reading device 120 to be set at a greater distance. Therefore, applying the displacement sensor 100 to the vehicle 200 can effectively reduce the impact of vehicle 200 vibration on the detection results of the displacement sensor 100, enabling the displacement sensor 100 to effectively meet the displacement detection requirements of the vehicle 200.

[0112] The first set of magnetic induction intensities may include a first magnetic induction intensity Bx1 and a second magnetic induction intensity Bz1 in two mutually perpendicular directions. The second set of magnetic induction intensities may include a third magnetic induction intensity Bx2 and a fourth magnetic induction intensity Bz2 in two mutually perpendicular directions.

[0113] That is, the first magnetic induction intensity Bx1 and the second magnetic induction intensity Bz1 are two mutually perpendicular vector values, and the third magnetic induction intensity Bx2 and the fourth magnetic induction intensity Bz2 are two mutually perpendicular vector values. This makes it easy to calculate the relative displacement between the measured magnetic grating ruler 110 and the sensing and reading device 120 based on the angle between the first magnetic induction intensity Bx1 and the second magnetic induction intensity Bz1, and the angle between the third magnetic induction intensity Bx2 and the fourth magnetic induction intensity Bz2. This effectively detects the relative motion relationship between the chassis and wheels of the vehicle 200, so that the terminal control device can control the linear motor based on the relative motion relationship between the chassis and wheels of the vehicle 200.

[0114] For example, the first sensing chip 1211 and the second sensing chip 1221 can both be 3D Hall sensing chips. The 3D Hall sensing chip can sense the magnetic field of the first magnetic track 111 and the second magnetic track 112. When a relative displacement occurs between the 3D Hall sensing chip and the first magnetic track 111 and the second magnetic track 112, the 3D Hall sensing chip can obtain the magnetic field strength in two vertical directions, so that the terminal control device can calculate the relative displacement between the measured magnetic grating ruler 110 and the sensing reading device 120 based on the magnetic field strength in the two vertical directions.

[0115] The sensing and reading device 120 may further include a processor 1212 (see Figure 10), which is electrically connected to both the first sensing chip 1211 and the second sensing chip 1221. The processor 1212 can be used to obtain a first angle of the magnetic field strength of the test component (i.e., chassis or wheel) based on a first magnetic induction intensity Bx1 and a second magnetic induction intensity Bz1, and to obtain a second angle of the magnetic field strength of the test component based on a third magnetic induction intensity Bx2 and a fourth magnetic induction intensity Bz2, and to calculate the displacement of the test component (i.e., chassis or wheel) based on the first and second angles.

[0116] For example, the first sensing chip 1211 and the second sensing chip 1221 can transmit the detected first magnetic induction intensity Bx1 and second magnetic induction intensity Bz1, as well as the third magnetic induction intensity Bx2 and the fourth magnetic induction intensity Bz2, to the processor 1212. The processor 1212 can calculate the first angle and the second angle of the magnetic field intensity when the device under test moves according to its internal algorithm, and calculate the specific displacement of the device under test by combining the first angle and the second angle.

[0117] For example, when the device under test moves, it can cause relative displacement between the first sensing chip 1211 and the first magnetic track 111, and between the second sensing chip 1221 and the second magnetic track 112, thereby causing changes in the magnetic field around the first sensing chip 1211 and the second sensing chip 1221. Based on the first set of magnetic field strengths and the second set of magnetic field strengths obtained by the first sensing chip 1211 and the second sensing chip 1221, the processor 1212 can calculate the changes in magnetic field strength between the first sensing chip 1211 and the first magnetic track 111, and between the second sensing chip 1221 and the second magnetic track 112. Since there is a specific relationship between the change in magnetic field strength and the displacement, the processor 1212 can calculate the displacement based on the change in magnetic field strength, thereby obtaining the relative displacement between the measured magnetic scale 110 and the sensing and reading device 120.

[0118] Figure 2 is a structural schematic diagram of a magnetic grating ruler under test provided in an embodiment of this application; Figure 3 is a schematic diagram of the magnetic pole distribution of a first magnet provided in an embodiment of this application; Figure 4 is a schematic diagram of the magnetic pole distribution of a second magnet provided in an embodiment of this application; and Figure 5 is an analytical diagram of a vernier algorithm for a magnetic grating ruler 110 under test provided in an embodiment of this application.

[0119] Referring to Figure 2, the first magnetic track 111 may include multiple first magnets 1111 and second magnets 1112 with opposite magnetic poles. The first magnets 1111 and second magnets 1112 may be alternately arranged along the length of the first magnetic track 111. For example, as shown in Figures 3 and 4, the side of the first magnet 1111 facing the first sensing chip 1211 may be the N pole, and the side of the second magnet 1112 facing the first sensing chip 1211 may be the S pole. Correspondingly, the side of the first magnet 1111 facing away from the first sensing chip 1211 is the S pole, and the side of the second magnet 1112 facing away from the first sensing chip 1211 is the N pole.

[0120] The second magnetic track 112 may include multiple third magnets 1121 and fourth magnets 1122 with opposite magnetic poles, which are alternately arranged along the length of the second magnetic track 112. Accordingly, the side of the third magnet 1121 facing the second sensing chip 1221 can be the N pole, and the side of the fourth magnet 1122 facing the second sensing chip 1221 can be the S pole. Conversely, the side of the third magnet 1121 facing away from the second sensing chip 1221 is the S pole, and the side of the fourth magnet 1122 facing away from the second sensing chip 1221 is the N pole.

[0121] The first magnet 1111, the second magnet 1112, the third magnet 1121, and the fourth magnet 1122 are staggered.

[0122] By misaligning the first magnet 1111, the second magnet 1112 with the third magnet 1121 and the fourth magnet 1122, a certain difference is created between the magnetic field signals generated by the first magnetic track 111 and the second magnetic track 112. The signal difference varies at different positions within the magnet sequence period. This signal difference transmits periodic information, allowing the processor 1212 to combine the current magnetic field signal with the absolute position information of the device under test, thus calculating the displacement of the device.

[0123] For example, referring to Figure 5, the pole lengths of the first magnet 1111 and the second magnet 1112 can be equal, and the pole lengths of the third magnet 1121 and the fourth magnet 1122 can also be equal. Here, pole length can be understood as the length of the magnet. For example, referring to Figure 4, the pole lengths of the first magnet 1111 and the second magnet 1112 can both be L1, and the alternating arrangement of the first magnet 1111 and the second magnet 1112 forms a first magnetic track 111 with a pole pitch of L1. The pole lengths of the third magnet 1121 and the fourth magnet 1122 can both be L2, and the alternating arrangement of the third magnet 1121 and the fourth magnet 1122 forms a second magnetic track 112 with a pole pitch of L2.

[0124] In this configuration, the pole lengths of the first magnet 1111 and the second magnet 1112 are either greater than or less than the pole lengths of the third magnet 1121 and the fourth magnet 1122. In other words, the pole lengths of the first magnet 1111 and the second magnet 1112 are not equal to the pole lengths of the third magnet 1121 and the fourth magnet 1122. Thus, along the length direction of the first magnetic track 111 and the second magnetic track 112, the misalignment values ​​between the magnets in the first magnetic track 111 and the second magnetic track 112 will accumulate and be superimposed. The processor 1212 can then calculate the displacement of the measured component using a vernier algorithm.

[0125] Because the pole pitches of the first magnetic track 111 and the second magnetic track 112 are different, the magnetic field signals generated by the first magnetic track 111 and the second magnetic track 112 are also different, and there will be a certain difference between the magnetic field signals. Within the period of the magnet sequence, the signal difference is different at different positions. By reading the current magnetic field signal and calculating the signal difference, the absolute position information of the device under test can be obtained. The pole length of the magnet is equal to the pole pitch of the track. The relationship between the range and the pole length is as follows: (2L1×2L2) / m>L

[0126] Where: L is the range of the magnetic track, L1 is the pole length of the first magnet 1111 and the second magnet 1112, L2 is the pole length of the third magnet 1121 and the fourth magnet 1122, and m is the greatest common divisor of the pole lengths of the first magnet 1111 and the second magnet 1112 and the pole lengths of the third magnet 1121 and the fourth magnet 1122.

[0127] Since a longer magnetic pole length results in lower signal quality and measurement accuracy, the magnetic pole length should be selected to improve signal quality and measurement accuracy while still satisfying the relationship between the measurement range and the magnetic pole length. At the same time, errors introduced by plating and assembly must be fully considered.

[0128] Referring again to Figure 2, in a cross-section perpendicular to the length of the first magnetic track 111 and the second magnetic track 112, both the cross-sections of the first magnetic track 111 and the second magnetic track 112 are arc-shaped, meaning the first magnet 1111, the second magnet 1112, the third magnet 1121, and the fourth magnet 1122 are arc-shaped. Furthermore, the first magnetic track 111 and the second magnetic track 112 are set at an angle. This ensures that the magnetic field lines between the first magnetic track 111 and the second magnetic track 112 are also angularly distributed, reducing or avoiding overlap of the magnetic field lines and preventing interference between them. This improves the accuracy of the first sensing chip 1211 and the second sensing chip 1221 in acquiring the first and second signals.

[0129] Moreover, the magnetic field lines of the arc-shaped magnetic track (i.e., the first magnetic track 111 and the second magnetic track 112) are regularly distributed along the central arc of the cross section. The deviation of the circumferential angle between the magnetic track and the sensing chip (the first sensing chip 1211 and the second sensing chip 1221) has little impact on the measurement, which can reduce the circumferential angle requirements of the sensing reading device 120 and the measured magnetic grating ruler 110.

[0130] Referring to Figures 3 and 4, the side of the arc-shaped first magnet 1111 facing away from the center can be the N pole, and the side facing the circle can be the S pole. Correspondingly, the side of the second magnet 1112 facing away from the center can be the S pole, and the side facing the circle can be the N pole. The side of the arc-shaped third magnet 1121 facing away from the center can be the N pole, and the side facing the circle can be the S pole. The side of the fourth magnet 1122 facing away from the center can be the S pole, and the side facing the circle can be the N pole.

[0131] Figure 6 is a schematic diagram of the structure of a mounting base provided in an embodiment of this application.

[0132] Referring again to Figure 2, the magnetic scale 110 under test may further include a mounting base 113. Referring to Figure 6, the mounting base 113 may have a first mounting groove 1131 and a second mounting groove 1132, with the first magnetic track 111 and the second magnetic track 112 located within the first mounting groove 1131 and the second mounting groove 1132, respectively. The first mounting groove 1131 and the second mounting groove 1132 can install and fix the magnets in the first magnetic track 111 and the second magnetic track 112, which helps to improve the overall structural stability of the magnetic scale 110 under test.

[0133] Moreover, the aforementioned magnetic scale 110 has a simple structure and fewer parts, which can effectively reduce the assembly difficulty of the magnetic scale 110 and improve assembly efficiency.

[0134] The first mounting groove 1131 and the second mounting groove 1132 can be angled so that the first magnetic track 111 and the second magnetic track 112 are angled together. This way, when the first magnetic track 111 and the second magnetic track 112 are installed on the mounting base 113, no further adjustments to the first magnetic track 111 and the second magnetic track 112 are required, allowing them to be angled together and improving the installation efficiency of the first magnetic track 111 and the second magnetic track 112.

[0135] The bottom of the first mounting groove 1131 can also be arc-shaped. For example, the bottom of the first mounting groove 1131 can match the shape of the first magnetic track 111. This can improve the fit between the first mounting groove 1131 and the first magnetic track 111, allowing for full contact between them. This can effectively reduce or avoid the interaction force between the first magnetic track 111 and the first mounting groove 1131 that might affect the connection between the first magnetic track 111 and the mounting base 113.

[0136] Correspondingly, the bottom of the second mounting groove 1132 can also be arc-shaped. For example, the bottom of the second mounting groove 1132 can match the shape of the second magnetic track 112. This can improve the fit between the second mounting groove 1132 and the second magnetic track 112, allowing for sufficient contact between them. This can effectively reduce or avoid the interaction force between the second magnetic track 112 and the second mounting groove 1132 that might affect the connection between the second magnetic track 112 and the mounting base 113.

[0137] The bottom of the first mounting groove 1131 and the second mounting groove 1132 has a back plate, and the first magnetic track 111 and the second magnetic track 112 are adsorbed into the first mounting groove 1131 and the second mounting groove 1132 through the back plate. For example, the back plate can be an iron plate, which can effectively reduce or avoid the first magnetic track 111 and the second magnetic track 112 from falling off the mounting base 113, and can effectively improve the reliability and stability of the first magnetic track 111 and the second magnetic track 112 on the mounting base 113.

[0138] Adhesive can also be provided between the mounting groove (first mounting groove 1131 and second mounting groove 1132) and the magnetic track (first magnetic track 111 and second magnetic track 112), which can effectively improve the firmness and reliability of the magnetic track in the mounting groove and effectively prevent the magnetic track from falling off.

[0139] Referring again to Figure 6, one end of the mounting base 113 may have a mounting portion 1133. The width of the mounting portion 1133 may be greater than the width of other parts of the mounting base 113. This facilitates the assembly and matching of the mounting base 113 with the test piece (DPT), providing a certain degree of error prevention. The mounting base 113 can mate with the DPT through the mounting portion 1133, allowing the mounting base 113 to be connected to the DPT. For example, the mounting portion 1133 and the DPT can be connected by an interference fit, which can effectively reduce or prevent separation between the mounting portion 1133 and the DPT, effectively improving the firmness and reliability of the fit between the mounting portion 1133 and the DPT.

[0140] In the embodiments of this application, the materials of the first magnet 1111, the second magnet 1112, the third magnet 1121 and the fourth magnet 1122 can be neodymium iron boron. Neodymium iron boron magnets have stronger magnetism and higher high temperature resistance, and their heat resistance temperature can reach 150°C, which can effectively meet the requirements of automotive-grade applications.

[0141] The first magnet 1111, the second magnet 1112, the third magnet 1121, and the fourth magnet 1122 can be individually magnetized and then spliced ​​together to form the first magnetic track 111 and the second magnetic track 112. In this way, while improving the high temperature resistance of the first magnetic track 111 and the second magnetic track 112, the processing difficulty of the first magnetic track and the second magnetic track can be effectively reduced.

[0142] Figure 7 is a schematic diagram of the dimensions of a magnetic scale under test provided in an embodiment of this application.

[0143] Referring to Figure 7, along the length of the magnetic scale 110 being measured, the length of the magnetic scale 110 can be L3, and the effective measurement interval length can be L4. The length of L4 is less than the length of L3. Because the magnetic field of the magnets at the edges is relatively weak, it will affect the measurement accuracy. Therefore, the effective measurement interval of the magnetic scale 110 can be calculated starting from the second magnet at each edge. In practical applications, the actual theoretical working interval can be freely divided according to actual application requirements. For example, the length of the theoretical working interval can be L5, and the length of L5 can be less than the effective measurement interval length L4.

[0144] Figure 8 is an exploded view of a sensing reading device provided in an embodiment of this application.

[0145] Referring to Figure 8, the sensing and reading device 120 may further include a housing 124 and a circuit board assembly located within the housing 124. The first sensing chip 1211, the second magnetic sensing chip 1221, and the processor 1212 may all be located on the circuit board assembly. Furthermore, the first sensing chip 1211 may be opposite to the first magnetic track 111, and the distance between the first sensing chip 1211 and the first magnetic track 111 may be 2mm to 6mm. This can improve the accuracy of the magnetic induction intensity measurement of the first magnetic track 111 by the first sensing chip 1211, contributing to improved overall measurement accuracy of the displacement sensor 100.

[0146] The second sensing chip 1221 is opposite to the second magnetic track 112, and the distance between the second sensing chip 1221 and the second magnetic track 112 is 2mm to 6mm. This can improve the accuracy of the magnetic induction intensity measurement of the second magnetic track 112 by the second sensing chip 1221, and help improve the overall measurement accuracy of the displacement sensor 100.

[0147] Furthermore, the distance between the first sensing chip 1211 and the first magnetic track 111 can be equal to the distance between the second sensing chip 1221 and the second magnetic track 112. This can effectively improve the measurement accuracy of the sensing and reading device 120.

[0148] For example, in some examples, the circuit board device may be a flexible circuit board that can be bent so that the first sensing chip 1211 and the second magnetic sensing chip 1221 can be set at an angle, so that the first sensing chip 1211 and the second magnetic sensing chip 1221 can be opposite to the first magnetic track 111 and the second magnetic track 112, respectively.

[0149] Alternatively, in other examples, referring to FIG8, the circuit board assembly may include a first circuit board 121 and a second circuit board 122 electrically connected to each other. A processor 1212 may be located on one of the first circuit board 121 and the second circuit board 122; for example, the processor 1212 may be located on the first circuit board 121, or it may be located on the second circuit board 122. A first sensing chip 1211 may be located on the first circuit board 121, and a second sensing chip 1221 may be located on the second circuit board 122. The first circuit board 121 may correspond to a first magnetic track 111, and the second circuit board 122 may correspond to a second magnetic track 112.

[0150] For example, the first sensing chip 1211 can be disposed on the side of the first circuit board 121 facing the first magnetic track 111, so that the first sensing chip 1211 can sense the magnetic field strength of the first magnetic track 111. The second sensing chip 1221 can be disposed on the side of the second circuit board 122 facing the second magnetic track 112, so that the second sensing chip 1221 can sense the magnetic field strength of the second magnetic track 112.

[0151] The first circuit board 121 and the second circuit board 122 can supply power to the first sensing chip 1211 and the second sensing chip 1221, and the first signal and the second signal acquired by the first sensing chip 1211 and the second sensing chip 1221 can be transmitted to the processor 1212 through the first circuit board 121 and the second circuit board 122, so that the processor 1212 can calculate the displacement of the device under test based on the first signal and the second signal.

[0152] The first circuit board 121 and the second circuit board 122 may also include a high-precision linear regulator and a high-precision analog-to-digital converter. The high-precision linear regulator can regulate the current transmitted to the circuit board. The analog-to-digital converter can convert the signals transmitted to the processor 1212. The processor 1212 can use the high-precision analog-to-digital converter to receive the signals transmitted from the first sensing chip 1211 and the second sensing chip 1221, calculate the current displacement using the two signals, and calculate the precise position of the device under test using a vernier algorithm.

[0153] Specifically, when the object under test (DUT) undergoes displacement, the magnetic scale 110 and the sensing and reading device 120 experience relative displacement. The first magnetic track 111 and the second magnetic track 112 move relative to the first sensing chip 1211 and the second sensing chip 1221. The X and Z magnetic field sensing terminals integrated within the first and second sensing chips 1211 and 1221, representing mutually perpendicular magnetic field components, generate mutually orthogonal differential signals. These signals are then sent to the processor via a high-precision analog-to-digital converter for processing. The processor calculates the current displacement value using the two signals, then segments the data using a vernier algorithm to initially determine the interval in which the DUT is located. Finally, one of the output signals is used to confirm the precise position of the DUT.

[0154] For example, the processor can be a 32-bit processor with a clock speed of 80MHz, and the high-precision analog-to-digital converter can be a 14-bit high-precision analog-to-digital converter. This eliminates the need for a microstepping driver, enabling high-speed acquisition of the output signal from the sensing chip. Algorithms are then used to process the acquired data to achieve high-precision ranging requirements.

[0155] Figure 9 is a schematic diagram of the structure of a shell provided in an embodiment of this application.

[0156] Referring to Figures 8 and 9, in a cross-section perpendicular to the length direction of the first magnetic track 111 and the second magnetic track 112, the housing 124 can be arc-shaped, and the first circuit board 121 and the second circuit board 122 can be angled together so that the first circuit board 121 and the second circuit board 122 correspond to the first magnetic track 111 and the second magnetic track 112, respectively. Because the first magnetic track 111 and the second magnetic track 112 are angled together, and the first circuit board 121 and the second circuit board 122 are also angled, the first sensing chip 1211 and the second sensing chip 1221 located on the first circuit board 121 and the second circuit board 122 are also angled. This allows the first sensing chip 1211 and the second sensing chip 1221 to correspond to the first magnetic track 111 and the second magnetic track 112, respectively. This effectively improves the alignment rate between the first sensing chip 1211 and the first magnetic track 111, and between the second sensing chip 1221 and the second magnetic track 112, thereby improving the detection accuracy of the first sensing chip 1211 and the second sensing chip 1221.

[0157] Referring again to Figure 8, the sensing and reading device 120 also includes a flexible circuit board 125, through which the first circuit board 121 and the second circuit board 122 are electrically connected. The flexible circuit board 125 is relatively flexible and can be bent to a certain extent, which facilitates the angled arrangement of the first circuit board 121 and the second circuit board 122. This reduces or avoids open circuits between the first circuit board 121 and the second circuit board 122, helping to improve the stability and reliability of signal transmission between them, and enhancing the reliability of the sensing and reading device 120.

[0158] The flexible circuit board 125 can be integrally formed with the first circuit board 121 and the second circuit board 122. This can improve the reliability between the flexible circuit board 125 and the first circuit board 121 and the second circuit board 122, reduce the number of steps in connecting the first circuit board 121 and the second circuit board 122, reduce assembly difficulty, and improve connection stability.

[0159] Referring to Figure 9, a fixing member 1241 may be provided inside the housing 124. The fixing member 1241 has a first slot 1242 and a second slot 1243. The first circuit board 121 and the second circuit board 122 are respectively secured in the first slot 1242 and the second slot 1243. The first slot 1242 and the second slot 1243 can respectively install and fix the first circuit board 121 and the second circuit board 122, which can reduce and prevent the first circuit board 121 and the second circuit board 122 from shaking or falling off. This can effectively improve the reliability and firmness of the first circuit board 121 and the second circuit board 122 in the housing 124, and improve the overall structural stability of the sensing and reading device 120.

[0160] Figure 10 is an exploded view of the connection of a first circuit board, a second circuit board and a third circuit board provided in an embodiment of this application, and Figure 11 is a structural schematic diagram of a connecting wire harness provided in an embodiment of this application.

[0161] Referring to Figures 8 and 10, the sensing and reading device 120 also includes a third circuit board 123. The third circuit board 123 can be mounted on the housing 124 and can be electrically connected to the second circuit board 122. The third circuit board 123 can also be electrically connected to an external terminal device. The displacement information of the device under test calculated by the processor 1212 can be transmitted from the second circuit board 122 to the third circuit board 123 and then from the third circuit board 123 to the terminal device.

[0162] For example, referring to Figure 10, the second circuit board 122 may have a first solder joint 1222, and the third circuit board 123 may have a second solder joint 1233. The second circuit board 122 and the third circuit board 123 can be electrically connected by soldering the first solder joint 1222 and the second solder joint 1233. For example, the second circuit board 122 and the third circuit board 123 can be soldered together using a "gold finger" method to enable the transmission of current and signals between the second circuit board 122 and the third circuit board 123.

[0163] Referring again to Figure 11, the displacement sensor 100 may further include a connecting harness 126. One end of the connecting harness 126 can be electrically connected to the third circuit board 123, and the other end can be electrically connected to an external terminal device, so that the third circuit board 123 can transmit data from the processor 1212 to the terminal device through the connecting harness 126. Furthermore, external power can also be transmitted through the connecting harness 126 to the third circuit board 123, the second circuit board 122, and the first circuit board 121 to power the devices on these circuit boards.

[0164] Referring again to Figure 10, the third circuit board 123 may have a connecting pad 1231, and one end of the connecting wire harness 126 may have a first connecting block 1261, on which a connecting solder head 1262 may be connected. The housing 124 may have a mating hole 1245, and the first connecting block 1261 may be engaged within the mating hole 1245. The connecting solder head 1262 may pass through the mating hole 1245 and be soldered to the connecting pad 1231. The third circuit board 123 and the connecting wire harness 126 may be electrically connected through the soldering between the connecting solder head 1262 and the connecting pad 1231.

[0165] The first connecting block 1261 can restrict the order and spacing of the core wires at the connecting welding head 1262, so that the connecting welding head 1262 can be smoothly inserted into the connecting pad 1231 for welding with the connecting pad 1231, which can effectively reduce errors and improve assembly efficiency.

[0166] The first connecting block 1261 can be in the form of a "T" shape. The first connecting block 1261 and the mating hole 1245 on the housing 124 can be an interference fit. This can provide the insertion and removal force for the connection of the wire harness 126, and at the same time improve the waterproof performance between the first connecting block 1261 and the housing 124.

[0167] Referring again to Figure 11, the third circuit board 123 may also have a third slot 1234 and a fourth slot 1235. The first circuit board 121 and the second circuit board 122 can be respectively inserted into the third slot 1234 and the fourth slot 1235 on the third circuit board 123 to connect with the third circuit board 123. This can effectively improve the reliability and firmness of the connection between the first circuit board 121 and the second circuit board 122 and the third circuit board 123.

[0168] A sealant may also be provided inside the housing 124. The sealant can fill the housing 124 and cover the first circuit board 121 and the second circuit board 122. For example, the third circuit board and the housing 124 can form a cavity, and the sealant can be poured into the cavity. The sealant can seal and protect the second circuit board 122 and the third circuit board 123, preventing external water, stains, etc. from entering the housing 124 and damaging the circuit boards. This helps to improve the sealing and protection of the first circuit board 121 and the second circuit board 122, and improves the reliability and stability of the sensing and reading device 120.

[0169] Furthermore, the sealant can also fix the first circuit board 121 and the second circuit board 122, which helps to improve the reliability and stability of the first circuit board 121 and the second circuit board 122 within the housing 124.

[0170] Referring again to Figure 9, the fastener 1241 may also have a connecting post 1244. Referring to Figure 10, the third circuit board 123 may have a connecting hole 1232. The connecting post 1244 can pass through the connecting hole 1232, allowing the third circuit board 123 to be connected to the housing 124 through the engagement of the connecting post 1244 and the connecting hole 1232. The connecting post 1244 can be a thermoplastic post, fused together within the connecting hole 1232. This effectively reduces or prevents separation between the third circuit board 123 and the housing 124, significantly improving the reliability and strength of the connection between them.

[0171] Referring to Figure 11, the displacement sensor 100 may further include a second connecting block 1263, a third connecting block 1264, and a fourth connecting block 1265, which may be spaced apart on the connecting harness 126. The connecting harness 126 can be connected to an external structural component (e.g., a vehicle body) through the second connecting block 1263, the third connecting block 1264, and the fourth connecting block 1265, so that the connecting harness 126 can be installed and fixed through the second connecting block 1263, the third connecting block 1264, and the fourth connecting block 1265.

[0172] The following describes in detail a displacement detection method provided by an embodiment of this application, with reference to the accompanying drawings.

[0173] Figure 12 is a flowchart illustrating a displacement detection method provided in an embodiment of this application.

[0174] This application embodiment also provides a displacement detection method. The displacement detection method can use the displacement sensor 100 in any of the above-mentioned scenarios. Referring to Figure 12, the detection method may include:

[0175] S101: When the device under test is displaced, the first sensing chip 1211 of the displacement sensor 100 obtains a first signal by sensing the first magnetic track 111. The first signal includes a first set of magnetic induction intensities in at least two different directions.

[0176] S102: The second sensing chip 1221 of the displacement sensor 100 is used to obtain a second signal by sensing the second magnetic track 112 when the device under test is displaced. The second signal includes a second set of magnetic induction intensities in at least two different directions.

[0177] S103: Obtain the displacement of the test piece based on the first set of magnetic induction intensities and the second set of magnetic induction intensities.

[0178] The first set of magnetic induction intensity and the second set of magnetic induction intensity can be obtained through the first sensing chip 1211 and the second sensing chip 1221, and the two sets of magnetic induction intensity can be transmitted to the control device of the terminal so that the control device can calculate the displacement of the test piece based on the first set of magnetic induction intensity and the second set of magnetic induction intensity.

[0179] The first set of magnetic induction intensities may include a first magnetic induction intensity Bx1 and a second magnetic induction intensity Bz1 in two mutually perpendicular directions, and the second set of magnetic induction intensities may include a third magnetic induction intensity Bx2 and a fourth magnetic induction intensity Bz2 in two mutually perpendicular directions.

[0180] Step S103, which involves obtaining the displacement of the test piece based on the first set of magnetic induction intensities and the second set of magnetic induction intensities, may specifically include:

[0181] S1031: Obtain the first angle of the magnetic field strength of the test piece based on the first magnetic induction intensity Bx1 and the second magnetic induction intensity Bz1;

[0182] S1032: Obtain the second angle of the magnetic field strength of the test piece based on the third magnetic induction intensity Bx2 and the fourth magnetic induction intensity Bz2;

[0183] S1033: Calculate the displacement of the test piece based on the first angle and the second angle.

[0184] Specifically, based on the magnetic induction intensity values ​​on two perpendicular vectors, an angle value of the movement of the test piece can be calculated. In this way, two angles of the test piece can be obtained through the magnetic induction intensity values ​​on two sets of perpendicular vectors, and the displacement of the test piece can be calculated based on the two angles.

[0185] Figure 13 is a relationship diagram of a first magnetic induction intensity Bx1, a second magnetic induction intensity Bz1, a third magnetic induction intensity Bx2, and a third magnetic induction intensity Bz2 provided in an embodiment of this application.

[0186] Specifically, obtaining the first angle of the magnetic field strength of the test object based on the first magnetic induction intensity Bx1 and the second magnetic induction intensity Bz1 in step S1031 may include:

[0187] The first angle is calculated using the following formula:

[0188] Where α1 is the first angle of the magnetic field strength of the test object, Bx1 is the first magnetic induction intensity, Bz1 is the second magnetic induction intensity, and k is a coefficient.

[0189] Specifically, as shown in Figure 13, since the first magnetic induction intensity Bx1 and the second magnetic induction intensity Bz1 measured by the first magnetic induction chip are not standard sine and cosine values ​​(i.e., the obtained curve is an ellipse as shown in the figure), the second magnetic induction intensity Bz1 needs to be corrected and converted into a standard circle (i.e., the circle in Figure 13) in order to calculate the first angle using trigonometric functions. Therefore, when calculating the first angle, the second magnetic induction intensity Bz1 needs to be multiplied by a conversion factor k so that the first angle can be calculated according to the aforementioned trigonometric function formula.

[0190] Based on the relationship between the two magnetic induction intensities in two perpendicular directions, by substituting the first magnetic induction intensity Bx1 and the second magnetic induction intensity Bz1 into the above formula, one of the angles of the test piece (i.e., the first angle) can be calculated.

[0191] Step S1032, which obtains the second angle of the magnetic field strength of the test object based on the third magnetic induction intensity Bx2 and the fourth magnetic induction intensity Bz2, includes:

[0192] The second angle is calculated using the following formula:

[0193] In Figure 13, α2 is the first angle, Bx2 is the first magnetic induction intensity, Bz2 is the second magnetic induction intensity, and k is a coefficient.

[0194] Similarly, referring to Figure 13, since the third magnetic induction intensity Bx2 and the fourth magnetic induction intensity Bz2 measured by the second magnetic induction chip are not standard sine and cosine values, i.e., the obtained curve is an ellipse as shown in the figure, the second magnetic induction intensity Bz4 needs to be corrected and converted into a standard circle (i.e., the circle in Figure 13) so that the second angle can be calculated using trigonometric functions. Therefore, when calculating the second angle, the fourth magnetic induction intensity Bz2 needs to be multiplied by the conversion factor k so that the second angle can be calculated according to the above trigonometric function formula.

[0195] Based on the relationship between the two magnetic induction intensities in two perpendicular directions, by substituting the third magnetic induction intensity Bx2 and the fourth magnetic induction intensity Bz2 into the above formula, the other angle of the test piece (i.e., the second angle) can be calculated. Since there is a certain correlation between displacement and angle, the final displacement of the test piece can be calculated by combining the first angle and the second angle.

[0196] Specifically, step S1033 calculates the displacement of the test piece based on the first angle and the second angle, including:

[0197] The displacement during the first period is calculated using the following formula:

[0198] Where α1 is the first angle, 2L1 is the first cycle length, and the first cycle length can be understood as the sum of the magnetic pole lengths of the first magnet and the second magnet (i.e., 2L1). The displacement within the first cycle can be understood as the displacement of the first sensing chip within one magnetic pole cycle of the first magnetic track.

[0199] The displacement during the second period is calculated using the following formula:

[0200] Where α2 is the second angle, 2L2 is the second period length, and the second period length can be understood as the sum of the magnetic pole lengths of the third and fourth magnets (i.e., 2L2). The displacement within the second period can be understood as the displacement of the second sensing chip within one magnetic pole period of the second magnetic track.

[0201] The number of cycles T traversed by the test piece is calculated based on the displacement within the first cycle and the displacement within the second cycle, combined with a vernier algorithm. The vernier algorithm can be referenced from existing technologies and will not be elaborated upon here. The number of cycles T can be understood as the length of the first or second cycle traversed by the sensing and reading device as it moves along the first and second magnetic tracks.

[0202] The total displacement of the test piece is calculated using the following formula:

[0203] Where α1 is the first angle, 2L1 is the first cycle length, and T is the number of cycles the test piece passes through;

[0204] Alternatively, the total displacement of the test piece can be calculated using the following formula:

[0205] Where α2 is the second angle, 2L2 is the second period length, and T is the number of periods that the test piece passes through.

[0206] The specific displacement of the test piece can be calculated using either of the two formulas mentioned above.

[0207] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0208] In the description of this invention, it should be understood that the terms “comprising” and “having” as used herein, and any variations thereof, are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or device.

[0209] Unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can be a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features.

[0210] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A displacement sensor, characterized in that, include: The magnetic scale to be measured (110) includes a first magnetic track (111) and a second magnetic track (112) arranged in parallel. A sensing and reading device (120) is provided adjacent to the magnetic scale under test (110). One of the magnetic scale under test (110) and the sensing and reading device (120) is used to connect to the device under test. The sensing and reading device (120) includes a first sensing chip (1211) and a second sensing chip (1221). The first sensing chip (1211) is used to obtain a first signal by sensing the first magnetic track (111) when the test piece is displaced. The first signal includes a first set of magnetic induction intensities in at least two different directions. The second sensing chip (1221) is used to obtain a second signal by sensing the second magnetic track (112) when the test piece is displaced. The second signal includes a second set of magnetic induction intensities in at least two different directions. The first set of magnetic induction intensities and the second set of magnetic induction intensities are used to calculate the displacement of the test piece.

2. The displacement sensor according to claim 1, characterized in that, The first set of magnetic induction intensities includes a first magnetic induction intensity Bx1 and a second magnetic induction intensity Bz1 in two mutually perpendicular directions; The second set of magnetic induction intensities includes a third magnetic induction intensity Bx2 and a fourth magnetic induction intensity Bz2 in two mutually perpendicular directions.

3. The displacement sensor according to claim 2, characterized in that, The sensing and reading device (120) also includes: The processor (1212) is electrically connected to both the first sensing chip (1211) and the second sensing chip (1221). The processor (1212) is used to obtain a first angle of the magnetic field strength of the test piece based on the first magnetic induction intensity Bx1 and the second magnetic induction intensity Bz1, and to obtain a second angle of the magnetic field strength of the test piece based on the third magnetic induction intensity Bx2 and the fourth magnetic induction intensity Bz2, and to calculate the displacement of the test piece based on the first angle and the second angle.

4. The displacement sensor according to any one of claims 1 to 3, characterized in that, The first magnetic track (111) includes a plurality of first magnets (1111) and second magnets (1112) with opposite magnetic poles, and the first magnets (1111) and the second magnets (1112) are alternately arranged along the length direction of the first magnetic track (111); The second magnetic track (112) includes a plurality of third magnets (1121) and fourth magnets (1122) with opposite magnetic poles, the third magnets (1121) and the fourth magnets (1122) being alternately arranged along the length direction of the second magnetic track (112); Furthermore, the first magnet (1111), the second magnet (1112), the third magnet (1121), and the fourth magnet (1122) are misaligned.

5. The displacement sensor according to claim 4, characterized in that, The first magnet (1111) and the second magnet (1112) have equal pole lengths, and the third magnet (1121) and the fourth magnet (1122) have equal pole lengths. Furthermore, the pole lengths of the first magnet (1111) and the second magnet (1112) are greater than or less than the pole lengths of the third magnet (1121) and the fourth magnet (1122).

6. The displacement sensor according to claim 4, characterized in that, On a cross section perpendicular to the length direction of the first magnetic track (111) and the second magnetic track (112), the cross sections of the first magnetic track (111) and the second magnetic track (112) are both arc-shaped, and the first magnetic track (111) and the second magnetic track (112) are set at an angle.

7. The displacement sensor according to any one of claims 1 to 3, characterized in that, The magnetic scale (110) being measured also includes a mounting base (113), which has a first mounting groove (1131) and a second mounting groove (1132). The first magnetic track (111) and the second magnetic track (112) are located in the first mounting groove (1131) and the second mounting groove (1132), respectively. The first mounting groove (1131) and the second mounting groove (1132) are set at an angle so that the first magnetic track (111) and the second magnetic track (112) are set at an angle.

8. The displacement sensor according to claim 7, characterized in that, The bottom of the first mounting groove (1131) and the second mounting groove (1132) has a back plate, and the first magnetic track (111) and the second magnetic track (112) are adsorbed into the first mounting groove (1131) and the second mounting groove (1132) through the back plate.

9. The displacement sensor according to claim 3, characterized in that, The sensing and reading device further includes a housing (124) and a circuit board device located inside the housing (124), wherein the first sensing chip (1211), the second magnetic sensing chip (1221) and the processor (1212) are all located on the circuit board device; Furthermore, the first sensing chip (1211) is opposite to the first magnetic track (111), and the distance between the first sensing chip (1211) and the first magnetic track (111) is 2mm to 6mm; The second sensing chip (1221) is opposite to the second magnetic track (112), and the distance between the second sensing chip (1221) and the second magnetic track (112) is 2mm to 6mm.

10. The displacement sensor according to claim 9, characterized in that, The distance between the first sensing chip (1211) and the first magnetic track (111) is equal to the distance between the second sensing chip (1221) and the second magnetic track (112).

11. The displacement sensor according to claim 9, characterized in that, The circuit board assembly includes a first circuit board (121) and a second circuit board (122) that are electrically connected to each other; The processor (1212) is located on one of the first circuit board (121) and the second circuit board (122), the first sensing chip (1211) is located on the first circuit board (121), and the second sensing chip is located on the second circuit board (122); The first circuit board (121) corresponds to the first magnetic track (111), and the second circuit board (122) corresponds to the second magnetic track (112).

12. The displacement sensor according to claim 11, characterized in that, In a cross section perpendicular to the length direction of the first magnetic track (111) and the second magnetic track (112), the housing 124 is arc-shaped, and the first circuit board (121) and the second circuit board (122) are set at an angle so that the first circuit board (121) and the second circuit board (122) correspond to the first magnetic track (111) and the second magnetic track (112) respectively.

13. The displacement sensor according to claim 11, characterized in that, The sensing and reading device (120) further includes a flexible circuit board (125), through which the first circuit board (121) and the second circuit board (122) are electrically connected.

14. The displacement sensor according to claim 11, characterized in that, A fixing member (1241) is provided inside the housing 124. The fixing member (1241) has a first slot (1242) and a second slot (1243). The first circuit board (121) and the second circuit board (122) are respectively locked in the first slot (1242) and the second slot (1243).

15. The displacement sensor according to claim 14, characterized in that, The sensing and reading device (120) further includes a third circuit board (123), which is covered on the housing 124 and is electrically connected to the second circuit board (122) and to an external terminal device.

16. The displacement sensor according to claim 15, characterized in that, It also includes a connecting harness (126), one end of which is electrically connected to the third circuit board (123), and the other end is electrically connected to an external terminal device.

17. The displacement sensor according to claim 16, characterized in that, The third circuit board (123) has a connecting pad (1231), and one end of the connecting wire harness (126) has a first connecting block 1261, on which a connecting solder head (1262) is connected. The housing 124 has a mating hole 1245, the first connecting block 1261 is engaged in the mating hole 1245, the connecting welding head (1262) passes through the mating hole 1245 and is welded to the connecting pad (1231), and the third circuit board (123) and the connecting wire harness (126) are electrically connected by welding between the connecting welding head (1262) and the connecting pad (1231).

18. The displacement sensor according to any one of claims 11 to 17, characterized in that, The housing 124 also contains a sealant, which fills the housing 124 and covers the first circuit board (121) and the second circuit board (122).

19. The displacement sensor according to claim 15, characterized in that, The fastener (1241) also has a connecting post (1244), and the third circuit board (123) has a connecting hole (1232). The connecting post (1244) passes through the connecting hole (1232), and the third circuit board (123) is connected to the housing 124 through the cooperation of the connecting post (1244) and the connecting hole (1232). The connecting post (1244) is a hot-melt post, and the connecting post (1244) is fused to the connecting hole (1232).

20. The displacement sensor according to any one of claims 1 to 3, characterized in that, Both the first sensing chip (1211) and the second sensing chip (1221) are 3D Hall effect sensing chips.

21. A vehicle, characterized in that, It includes at least one displacement sensor, wherein the displacement sensor is the displacement sensor described in any one of claims 1 to 20.

22. The vehicle according to claim 21, characterized in that, It also includes wheels and a chassis, with the wheels connected to the chassis via a suspension; The measured magnetic scale (110) in the displacement sensor is installed on one of the wheel and the chassis, and the sensing and reading device (120) in the displacement sensor is installed on the other of the wheel and the chassis.

23. The vehicle according to claim 22, characterized in that, Also includes: A linear motor, comprising a motor mover and a motor stator, wherein one of the motor mover and the motor stator is connected to the chassis, and the other of the motor mover and the motor stator is connected to the wheel; The measured magnetic scale (110) in the displacement sensor is disposed on one of the motor mover and the motor stator, and the sensing and reading device (120) in the displacement sensor is disposed on the other of the motor mover and the motor stator.

24. A displacement detection method, characterized in that, The method, employing the displacement sensor according to any one of claims 1 to 20, comprises: The first sensing chip (1211) of the displacement sensor obtains a first signal by sensing the first magnetic track (111) when the device under test is displaced. The first signal includes a first set of magnetic induction intensities in at least two different directions. The second sensing chip (1221) of the displacement sensor is used to obtain a second signal by sensing the second magnetic track (112) when the test piece is displaced. The second signal includes a second set of magnetic induction intensities in at least two different directions. The displacement of the test piece is obtained based on the first set of magnetic induction intensities and the second set of magnetic induction intensities.

25. The displacement detection method according to claim 24, characterized in that, The first set of magnetic induction intensities includes a first magnetic induction intensity Bx1 and a second magnetic induction intensity Bz1 in two mutually perpendicular directions, and the second set of magnetic induction intensities includes a third magnetic induction intensity Bx2 and a fourth magnetic induction intensity Bz2 in two mutually perpendicular directions. The step of obtaining the displacement of the test piece based on the first set of magnetic induction intensities and the second set of magnetic induction intensities includes: The first angle of the magnetic field strength of the test piece is obtained based on the first magnetic induction intensity Bx1 and the second magnetic induction intensity Bz1. The second angle of the magnetic field strength of the test piece is obtained based on the third magnetic induction intensity Bx2 and the fourth magnetic induction intensity Bz2; The displacement of the test piece is calculated based on the first angle and the second angle.

26. The displacement detection method according to claim 25, characterized in that, The first angle for obtaining the magnetic field strength of the test object based on the first magnetic induction intensity Bx1 and the second magnetic induction intensity Bz1 includes: The first angle is calculated using the following formula: α1 is the first angle, Bx1 is the first magnetic flux density, Bz1 is the second magnetic flux density, and k is a coefficient; The step of obtaining the second angle of the magnetic field strength of the test object based on the third magnetic induction intensity Bx2 and the fourth magnetic induction intensity Bz2 includes: The second angle is calculated using the following formula: α2 is the first angle, Bx2 is the third magnetic induction intensity, Bz2 is the fourth magnetic induction intensity, and k is a coefficient.

27. The displacement detection method according to claim 25, characterized in that, The step of calculating the displacement of the test piece based on the first angle and the second angle includes: The displacement during the first period is calculated using the following formula: Wherein, α1 is the first angle, 2L1 is the first period length, and the first period length is the sum of the magnetic pole lengths of the first magnet and the second magnet; The displacement during the second period is calculated using the following formula: Wherein, α2 is the second angle, 2L2 is the second period length, and the second period length is the sum of the magnetic pole lengths of the third magnet and the fourth magnet; The number of cycles T that the test piece passes through is calculated based on the displacement within the first cycle and the displacement within the second cycle, combined with a vernier algorithm. The total displacement of the test piece is calculated using the following formula: Wherein, α1 is the first angle, 2L1 is the first cycle length, and T is the number of cycles that the test piece passes through; Alternatively, the total displacement of the test piece can be calculated using the following formula: Wherein, α2 is the second angle, 2L2 is the second period length, and T is the number of periods that the test piece passes through.

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