Device for manufacturing disk-shaped substrate, and method for manufacturing disk-shaped substrate

Abstract

This device for manufacturing a disk-shaped substrate comprises: a lower surface plate on which a disk-shaped substrate is placed; an upper surface plate that together with the lower surface plate sandwiches and rotates the disk-shaped substrate, and polishes or grinds the disk-shaped substrate; a detection unit that detects the rotational position of the upper surface plate; a control unit that controls the drive of the upper surface plate on the basis of the rotational position detected by the detection unit and stops the rotation of the upper surface plate; an insertion part provided to one of the upper surface plate and the device body; and an inserted part that is provided to the other of the upper surface plate and the device body, is inserted into the insertion part, and positions the upper surface plate at a preset set position in the rotational direction.

Description

Disk-shaped substrate manufacturing apparatus and disk-shaped substrate manufacturing method

[0001] The present disclosure relates to a disk-shaped substrate manufacturing apparatus and a disk-shaped substrate manufacturing method.

[0002] Known examples of disk-shaped substrate manufacturing apparatuses include a lower surface plate and an upper surface plate, as disclosed in Japanese Patent Application Laid-Open No. 2007-283457. In the manufacturing apparatus disclosed in Japanese Patent Application Laid-Open No. 2007-283457, a disk-shaped substrate is placed between the lower surface plate and the upper surface plate. Both surfaces of the disk-shaped substrate are polished by rotating the lower surface plate and the upper surface plate. In this manufacturing apparatus, the polished disk-shaped substrate may adhere to the upper surface plate, preventing the disk-shaped substrate from being separated from the upper surface plate. To solve this problem, a separation fluid such as air or water is supplied to the disk-shaped substrate through a supply hole provided in the upper surface plate, causing the disk-shaped substrate to be separated from the upper surface plate.

[0003] Here, when a structure in which a reducer is provided between the drive motor and the upper surface plate is used as the structure for driving and rotating the upper surface plate, since the upper surface plate is driven to rotate by the drive motor via the reducer, even if the drive motor is controlled to stop the rotation of the upper surface plate, the upper surface plate may not stop at a preset position, which may cause a misalignment between the supply hole provided in the upper surface plate and the disk-shaped substrate, resulting in poor peeling of the disk-shaped substrate.

[0004] Therefore, an object of the present disclosure is to provide a disk-shaped substrate manufacturing apparatus and a disk-shaped substrate manufacturing method that can position an upper surface plate at a preset position.

[0005] The present disclosure includes the following aspects: <1> A manufacturing device for a disk-shaped substrate, comprising: a lower surface plate on which a disk-shaped substrate is placed, an upper surface plate that rotates together with the lower surface plate, sandwiching the disk-shaped substrate therebetween, and polishes or grinds the disk-shaped substrate, a detection unit that detects the rotational position of the upper surface plate, a control unit that controls the drive of the upper surface plate based on the rotational position detected by the detection unit and stops the rotation of the upper surface plate, an inserted unit that is provided on either the upper surface plate or an apparatus main body, and an inserting unit that is provided on the other of the upper surface plate or the apparatus main body, is inserted into the inserted unit, and positions the upper surface plate at a preset position in the rotational direction. <2> The disk-shaped substrate manufacturing apparatus according to <1>, wherein the inserted portion has a pair of rotors rotatably mounted on one of the upper surface plate and the apparatus main body, the pair of rotors having grooves formed on their outer peripheral surfaces along the rotational direction of the rotors, the grooves facing each other to form an insertion space between the pair of rotors, and the inserting portion is inserted into the insertion space in the inserted portion to position the upper surface plate at a preset position in the rotational direction and radial direction of the upper surface plate. <3> The upper surface plate is rotationally driven by a drive motor via a reducer, and the range between the axes of the pair of rotors is set to a range wider than the maximum dimension of the range over which the inserting portion deviates from the insertion space when the rotation of the upper surface plate is stopped. <4> The disk-shaped substrate manufacturing apparatus according to any one of <1> to <3>, wherein the upper surface plate further has a supply hole through which a release fluid passes to release the disk-shaped substrate from the upper surface plate. <5> The disk-shaped substrate manufacturing apparatus according to any one of <1> to <4>, wherein the apparatus body includes a support part that is disposed above the upper surface plate and rotatably supports the upper surface plate, the inserted part is provided on an upper surface of the upper surface plate, and the inserting part is provided on the support part and is lowered to be inserted into the inserted part.<6> A method for manufacturing a disk-shaped substrate, comprising: a first step of sandwiching a disk-shaped substrate between an upper surface plate and a lower surface plate, rotating the upper surface plate and the lower surface plate, and polishing or grinding the disk-shaped substrate; a second step of controlling the drive of the upper surface plate based on a rotational position detected by a detection unit that detects the rotational position of the upper surface plate, and stopping the rotation of the upper surface plate; and a third step of inserting an insertion portion provided on one of the upper surface plate and the device main body into an insertion receiving portion provided on the other of the upper surface plate and the device main body, after the upper surface plate has stopped rotating, to position the upper surface plate at a preset setting position in the rotational direction. <7> The method for manufacturing a disk-shaped substrate according to <6>, wherein the inserted portion has a pair of rotors rotatably provided on one of the upper surface plate and the apparatus main body, the pair of rotors having grooves formed on their outer peripheral surfaces along a rotational direction of the rotors, the grooves facing each other to form an insertion space between the pair of rotors, and in the third step, the inserting portion is inserted into the insertion space in the inserted portion, and the upper surface plate is positioned at a preset position in the rotational direction and radial direction of the upper surface plate. <8> The method for manufacturing a disk-shaped substrate according to <7>, wherein the upper surface plate is rotationally driven by a drive motor via a reducer, and a range between the axes of the pair of rotors is set to a range wider than a maximum dimension of a range over which the inserting portion deviates from the insertion space when the rotation of the upper surface plate is stopped. <9> The method for manufacturing a disk-shaped substrate according to any one of <6> to <8>, wherein the upper surface plate further includes a supply hole through which a separation fluid passes to separate the disk-shaped substrate from the upper surface plate, the set position is set as a position where the supply hole faces the disk-shaped substrate, and in the third step, the insertion part is inserted into the inserted part after the upper surface plate stops rotating and before the separation fluid is supplied through the supply hole.

[0006] According to the present disclosure, there is provided a disk-shaped substrate manufacturing apparatus and a disk-shaped substrate manufacturing method that can position an upper surface plate at a preset position.

[0007] Fig. 4 is a perspective view showing a manufacturing apparatus according to an embodiment of the present disclosure. Fig. 5 is a side cross-sectional view showing a positioning portion according to an embodiment of the present disclosure. Fig. 6 is a side view showing an inserted portion and an inserting portion according to an embodiment of the present disclosure. Fig. 7 is a plan cross-sectional view (cross-sectional view along line 4A-4A in Fig. 3) showing an inserted portion and an inserting portion according to an embodiment of the present disclosure. Fig. 8 is a flow chart showing a manufacturing method according to an embodiment of the present disclosure.

[0008] Embodiments of the present disclosure will be described below. However, the present disclosure is not limited to the following embodiments. In the following embodiments, components are not essential unless otherwise specified. When embodiments are described with reference to drawings in the present disclosure, the configuration of the embodiment is not limited to the configuration shown in the drawings. Furthermore, the sizes of the components in each drawing are conceptual. Therefore, the front-to-back, left-to-right, and top-to-bottom dimensional ratios of each component, and the front-to-back, left-to-right, and top-to-bottom dimensional ratios between each component, are not limited to the illustrated dimensional ratios. Furthermore, the front-to-back, left-to-right, and top-to-bottom dimensional ratios of each component may differ from the actual dimensional ratios. Furthermore, unless otherwise specified in the present disclosure, the number of each component of the present disclosure is not limited to one, and multiple components may be present. Note that in the following description of the drawings, similar parts are designated by similar symbols.

[0009] <Manufacturing Apparatus 10> A manufacturing apparatus 10 according to this embodiment will be described with reference to the drawings. Note that the manufacturing apparatus for disk-shaped substrates of the present disclosure is not limited to the manufacturing apparatus 10. As an example, the manufacturing apparatus 10 is an apparatus that polishes a disk-shaped substrate 100 to manufacture a disk-shaped substrate 200. The disk-shaped substrate 200 is a processed disk-shaped substrate in which at least a polishing process has been performed on the disk-shaped substrate 100.

[0010] 1 and 2, the manufacturing apparatus 10 specifically includes a lower surface plate 12, an upper surface plate 20, a sun gear 40, an internal gear 42, a carrier 44, an encoder 32, a control unit 34, a supply unit 50, and a positioning mechanism 80. Below, the disk-shaped substrate 100, each part of the manufacturing apparatus 10, modified examples of the manufacturing apparatus 10, a manufacturing method for the disk-shaped substrate 200, and modified examples of the manufacturing method will be described.

[0011] <Disc-shaped substrate 100> The disc-shaped substrate 100 is a substrate formed in a disc shape. Specifically, the disc-shaped substrate 100 is formed in an annular shape having holes in a plan view. Note that the plan view here refers to the case where the disc-shaped substrate 100 is viewed from one side in the thickness direction of the disc-shaped substrate 100. The disc-shaped substrate 100 is a substrate before a polishing process is performed.

[0012] The disk-shaped substrate 100 may be, for example, a substrate for a magnetic recording medium. Furthermore, the disk-shaped substrate 100 may be a substrate made of a metal material such as aluminum or an aluminum alloy substrate, or glass. Hereinafter, aluminum substrates, aluminum alloy substrates, glass substrates, etc. will also be collectively referred to as "substrates." Hereinafter, aluminum substrates and aluminum alloy substrates will also be collectively referred to as "aluminum substrates." A plating layer may be formed on the surface of the aluminum substrate. Note that the use, material, type, shape, etc. of the disk-shaped substrate 100 are not limited to those described above, and various disk-shaped substrates may be used as the disk-shaped substrate 100.

[0013] <Lower surface plate 12> As shown in Figures 1 and 2, the lower surface plate 12 is a disk-shaped member. The lower surface plate 12 has a circular, horizontal upper surface. A polishing cloth 14 is disposed on the upper surface of the lower surface plate 12. A disk-shaped substrate 100 is placed on this polishing cloth 14. The lower surface plate 12 is supported by a support unit (not shown) so as to be rotatable about a vertical axis VA. The lower surface plate 12 rotates by receiving a rotational force from a drive unit 16. The drive unit 16 has, for example, a drive motor that rotates the lower surface plate 12.

[0014] <Upper surface plate 20> As shown in Figures 1 and 2, the upper surface plate 20 is a disk-shaped member. The upper surface plate 20 has a horizontal, annular lower surface. A polishing cloth 24 is disposed on the lower surface of the upper surface plate 20. The polishing cloth 24 disposed on the upper surface plate 20 is positioned opposite the polishing cloth 14 disposed on the lower surface plate 12. The upper surface plate 20 is supported by a support unit 22 so as to be rotatable about a vertical axis VA. The upper surface plate 20 rotates by receiving a rotational force from a drive unit 26. Specifically, the drive unit 26 has, for example, a drive motor and a reducer provided between the drive motor and the upper surface plate 20. The drive unit 26 drives the upper surface plate 20 to rotate via the reducer using the drive motor. The reducer has the function of increasing the rotational torque of the upper surface plate 20. In this embodiment, the disk-shaped substrate 100 is sandwiched between the upper surface plate 20 and the lower surface plate 12 and rotated to polish the disk-shaped substrate 100 .

[0015] The support part 22 is disposed above the upper surface plate 20. This support part 22 is supported by an elevator part 23 so that the upper surface plate 20 can be raised and lowered along the vertical axis VA. The support part 22 and the upper surface plate 20 are raised and lowered by driving the elevator part 23. The upper surface plate 20 approaches and moves away from the lower surface plate 12 by being raised and lowered. The support part 22 is provided in an apparatus main body 21. Here, the apparatus main body 21 refers to components other than the upper surface plate 20 and does not rotate together with the upper surface plate 20. The upper surface plate 20 has a plurality of supply holes 28 formed therein through which a separation fluid passes to separate the disk-shaped substrate 100 from the upper surface plate 20. The supply holes 28 penetrate the upper surface plate 20 and the polishing cloth 24 in the vertical direction.

[0016] 1 and 2, the sun gear 40 is provided at the center of the lower surface plate 12. The sun gear 40 rotates about the vertical axis VA by being driven by a drive unit 41. The sun gear 40 may be a spur gear or a pin gear having a row of teeth integrally formed on its side surface. The drive unit 41 may have, for example, a drive motor that drives the sun gear 40 to rotate.

[0017] The internal gear 42 is arranged concentrically with the sun gear 40. The internal gear 42 has an annular cylindrical body 49. Internal teeth are formed on the inner peripheral surface of the cylindrical body 49. The internal gear 42 of this embodiment is held non-rotatably by a holding member (not shown). Alternatively, a drive unit that rotates the internal gear 42 may be provided, and the internal gear 42 may be rotated around the vertical axis VA. When the internal gear 42 is rotated, the sun gear 40 may be held non-rotatably. Furthermore, the internal gear 42 may be a pin gear or the like in addition to a spur gear.

[0018] The carrier 44 is a thin, disk-shaped member. External teeth are formed on the outer circumferential surface of the carrier 44. As shown in Fig. 1, the carrier 44 has a plurality of holding holes 46 formed therein. The holding holes 46 hold the disk-shaped substrates 100.

[0019] A plurality of carriers 44 are arranged on the lower surface plate 12. The carriers 44 mesh with the sun gear 40 and the internal gear 42, and rotate around the sun gear 40 while revolving around the sun gear 40 in response to the rotation of at least one of the sun gear 40 and the internal gear 42.

[0020] In this embodiment, the upper surface plate 20 contacts the upper surface of the disk-shaped substrate 100 held by the carrier 44, and the lower surface plate 12 contacts the lower surface of the disk-shaped substrate 100. By revolving and rotating the carrier 44 in this state, both the upper and lower surfaces of the disk-shaped substrate 100 are polished by the polishing cloths 14, 24.

[0021] <Encoder 32 and control unit 34> The encoder 32 detects the rotational position of the upper surface plate 20. The encoder 32 detects the rotational position of the upper surface plate 20 by, for example, using a sensor to detect a mark such as a slit or mark provided on a rotating body that rotates as the upper surface plate 20 rotates. The mark may be provided on the upper surface plate 20 itself. For example, a reflective or transmissive optical sensor is used as the sensor. The encoder 32 is an example of a detection unit. The detection unit of the present disclosure may be any element that can detect the rotational position of the upper surface plate 20, and is not limited to the encoder 32.

[0022] The control unit 34 controls the drive unit 16, the drive unit 41, and the drive unit 26. The control unit 34 controls the drive unit 16 to rotate and stop the rotation of the lower surface plate 12. The control unit 34 controls the drive unit 41 to rotate and stop the rotation of the sun gear 40 and the carrier 44. The control unit 34 controls the drive motor of the drive unit 26 to rotate and stop the rotation of the upper surface plate 20. The control unit 34 controls the drive of the upper surface plate 20 based on the rotation position detected by the encoder 32, and stops the rotation of the upper surface plate 20. Note that in this embodiment, the drive unit 26 drives the upper surface plate 20 to rotate using the drive motor via a reducer. Therefore, even if the drive motor is controlled to stop the rotation of the upper surface plate 20, the upper surface plate 20 may stop at a position deviated from a preset position.

[0023] The control unit 34 includes, for example, a processor, memory, storage, etc. The storage stores a control program that controls the drive units 16, 41, and 26. In the control unit 34, for example, a processor reads the control program stored in the storage into memory and executes the control program using the memory as a work area. This controls the drive units 16, 41, and 26. The control unit of the present disclosure may be any element that controls the drive of the upper surface plate 20, and is not limited to having the above configuration.

[0024] 2, the supply unit 50 has a pipe 52 connected to the supply hole 28 formed in the upper surface plate 20. The supply unit 50 supplies a stripping fluid to the disk-shaped substrate 100 that has been polished, through the pipe 52 and the supply hole 28. As the stripping fluid, for example, a known liquid such as pure water or a known gas such as air can be appropriately used.

[0025] <Positioning Mechanism 80> The positioning mechanism 80 is a mechanism that positions the upper surface plate 20 at a preset position in the rotational direction and radial direction of the upper surface plate 20. Specifically, the positioning mechanism 80 has an inserted portion 81, an inserting portion 82, and a driving portion 83, as shown in FIGS.

[0026] The inserted portion 81 is a component into which the inserting portion 82 is inserted. Specifically, as shown in FIGS. 1 , 3 , and 4 , the inserted portion 81 has a pair of rolling bearings 81A rotatably mounted on the upper surface plate 20. The pair of rolling bearings 81A are supported on the upper surface plate 20 so as to be rotatable with their axial direction along the upper surface of the upper surface plate 20. Specifically, the pair of rolling bearings 81A are supported by support portions 85 attached to the upper surface of the upper surface plate 20. In this embodiment, the axial directions of the pair of rolling bearings 81A are parallel and perpendicular to the axial direction of the inserting portion 82. The pair of rolling bearings 81A are an example of a pair of rotating bodies. The rotating body of the present disclosure may be a roll or the like, and any rotating body can be used.

[0027] Furthermore, as shown in Figures 3 and 4, the pair of rolling bearings 81A have grooves 81C formed on their outer circumferential surfaces along the direction of rotation of the rolling bearings 81A. As shown in Figure 4, the grooves 81C are, for example, U-shaped grooves. The grooves 81C of the pair of rolling bearings 81A face each other, forming an insertion space 81B between the pair of rolling bearings 81A. The insertion space 81B is a space into which the insertion portions 82 are inserted. The pair of rolling bearings 81A rotate as the insertion portions 82 are inserted toward the insertion space 81B, guiding the insertion portions 82 into the insertion space 81B.

[0028] The inserting portion 82 is a component that is inserted into the inserted portion 81. Specifically, the inserting portion 82 is configured as a rod-shaped pin extending downward from the support portion 22. The tip end (i.e., the lower end) of the inserting portion 82 is formed in a hemispherical shape. The driving portion 83 is a component that drives the inserting portion 82 to insert it into the inserted portion 81. Specifically, the driving portion 83 is configured as an air cylinder that moves the inserting portion 82 up and down. The driving portion 83 is fixed to the side surface 22A of the support portion 22. When the driving portion 83 lowers the inserting portion 82, the inserting portion 82 is inserted into the insertion space 81B between the pair of rolling bearings 81A.

[0029] When the inserting portion 82 is inserted into the insertion space 81B between the pair of rolling bearings 81A, it contacts the inner surfaces of the pair of grooves 81C, restricting the rotational and radial movement of the upper surface plate 20. This allows the upper surface plate 20 to be positioned at a set position in the rotational and radial directions of the upper surface plate 20. The set position is set, for example, as a position where the supply hole 28 faces the disk-shaped substrate 100 housed in the carrier 44. In this embodiment, the inserting portion 82 is inserted into the inserted portion 81 after the upper surface plate 20 stops rotating and before the supplying unit 50 supplies the stripping fluid through the supply hole 28. The driving unit 83 raises the inserting portion 82, thereby removing the inserting portion 82 from the insertion space 81B between the pair of rolling bearings 81A. This allows the upper surface plate 20 to rotate. The raising of the inserting portion 82 is performed after the supplying unit 50 supplies the stripping fluid.

[0030] In this embodiment, as described above, when the drive motor of the drive unit 26 is controlled to stop the rotation of the upper surface plate 20, the upper surface plate 20 may stop at a position that is offset from the preset position. Therefore, the insertion portion 82 may be positioned at a position that is offset from the insertion space 81B. In this embodiment, the range GA ( FIGS. 3 and 4 ) between the axes of the pair of rolling bearings 81A is set to a range wider than the maximum dimension of the range by which the insertion portion 82 deviates from the insertion space 81B when the rotation of the upper surface plate 20 is stopped. Therefore, when the drive motor of the drive unit 26 is controlled to stop the rotation of the upper surface plate 20, the insertion portion 82 is positioned within the range GA between the axes of the pair of rolling bearings 81A. In the inserted portion 81, the insertion portion 82 descends within the range GA between the axes of the pair of rolling bearings 81A, causing the pair of rolling bearings 81A to rotate and guide the insertion portion 82 into the insertion space 81B.

[0031] <Modifications of the Manufacturing Apparatus 10> In the above-described embodiment, the inserting portion 82 is configured as a rod-shaped pin, but is not limited to this. The inserting portion 82 may be, for example, plate-shaped, and may be any component that is inserted into the inserted portion 81. In the above-described embodiment, the inserted portion 81 is configured as a pair of rolling bearings 81A, but is not limited to this. The inserted portion 81 may be, for example, a tapered cylinder whose diameter decreases downward, and may be any component that the inserting portion 82 is inserted into. In the above-described embodiment, the driving unit 83 is configured as an air cylinder, but is not limited to this. Other actuators, such as a hydraulic cylinder, may be used as the driving unit 83, and may be any component that drives the inserting portion 82 to insert it into the inserted portion 81.

[0032] In the manufacturing apparatus 10 of the above-described embodiment, the inserted portion 81 is provided on the upper surface of the upper surface plate 20, but this is not limiting. For example, the inserted portion 81 may be provided on a side surface of the upper surface plate 20, and the inserting portion 82 may be inserted into the inserted portion 81 from the side of the upper surface plate 20. In the manufacturing apparatus 10 of the above-described embodiment, the inserting portion 82 is provided on the support portion 22, and the inserted portion 81 is provided on the upper surface plate 20, but this is not limiting. The inserted portion 81 may be provided on the support portion 22, and the inserting portion 82 may be provided on the upper surface plate 20. In this case, for example, the inserted portion 81 is moved up and down by the driving portion 83, whereby the inserting portion 82 is inserted into the inserted portion 81.

[0033] The manufacturing apparatus 10 in the above-described embodiment is a polishing apparatus that polishes the disk-shaped substrate 100, but is not limited to this. The manufacturing apparatus 10 may also be an apparatus that grinds the disk-shaped substrate 100. The manufacturing apparatus 10 in the above-described embodiment may further include one or more other devices. Examples of such other devices include a storage rack that stores the disk-shaped substrate 100 before processing or the disk-shaped substrate 200 after processing, a cleaning device that cleans the disk-shaped substrate 200, a drying device that dries the disk-shaped substrate 200, and the like.

[0034] <Method for manufacturing disk-shaped substrate 200> An example of a method for manufacturing a disk-shaped substrate according to the present disclosure will be described below with reference to the drawings. Note that the method for manufacturing a disk-shaped substrate according to the present disclosure is not limited to the following example. The manufacturing method of this embodiment is a method for manufacturing a disk-shaped substrate 200. The manufacturing method of this embodiment is performed using a manufacturing apparatus 10, as an example.

[0035] For example, when the disk-shaped substrate 100 is an aluminum substrate, the manufacturing method of the disk-shaped substrate 200 includes the following steps as shown in FIG. 5 : Blank substrate preparation step: An aluminum substrate of the desired dimensions is prepared. The aluminum substrate of the desired dimensions can be obtained, for example, by rolling an aluminum alloy ingot to obtain an aluminum alloy plate material of approximately 2 mm or less in thickness, and then punching the obtained aluminum alloy plate material into a disk shape. Cutting step: The prepared aluminum substrate is subjected to chamfering of the inner and outer diameters and cutting of both main surfaces. Grinding step: Both main surfaces of the cut aluminum substrate are subjected to grinding using a grinding wheel. The grinding step can reduce, for example, the surface roughness and waviness of the cut aluminum substrate. Plating step: The ground aluminum substrate is plated with NiP or the like. Plating can, for example, harden the surface or suppress surface defects. Polishing step: Both main surfaces of the aluminum substrate on which the plating film has been formed are polished.

[0036] When the disk-shaped substrate 100 is a glass substrate, the manufacturing method of the disk-shaped substrate 200 includes, for example, the following steps. Note that when the disk-shaped substrate 100 is a glass substrate, the manufacturing method differs from when the disk-shaped substrate 100 is an aluminum substrate in that it does not include a cutting step. Manufacturing apparatus preparation step: A manufacturing apparatus 10 is prepared. Blank substrate preparation step: A glass blank substrate of the desired size is prepared. The glass blank substrate of the desired size is, for example, produced by press molding or the like from a glass blank that serves as the material for a plate-shaped glass substrate for a magnetic recording medium having a pair of main surfaces, and a circular hole is formed in the center of the produced glass blank to form an annular shape. Next, shaping is performed to obtain a glass substrate having a chamfered surface. The inner and outer peripheral end surfaces of the shaped glass substrate are ground and polished. Grinding step: The main surfaces of the glass substrate after the edge polishing are ground using a fixed abrasive. Polishing step: The main surfaces of the glass substrate after the grinding step are polished using a predetermined abrasive. During the polishing process, the glass substrate may be subjected to a chemical strengthening treatment.

[0037] The polishing process according to this embodiment will be described in detail below. As shown in Fig. 5, the polishing process includes a rotating process, a stopping process, a positioning process, and a peeling process. The rotating process is an example of a first process. The stopping process is an example of a second process. The positioning process is an example of a third process.

[0038] <Rotation Process> In the rotation process, the disk-shaped substrate 100 is sandwiched between the upper surface plate 20 and the lower surface plate 12, and the upper surface plate 20 and the lower surface plate 12 are rotated. Specifically, with the lower surface plate 12 and the upper surface plate 20 in contact with the disk-shaped substrate 100, the sun gear 40, the lower surface plate 12, and the upper surface plate 20 are rotated by the drive units 16, 41, and 26. As a result, the surface of the disk-shaped substrate 100 is polished by the lower surface plate 12 and the upper surface plate 20. In this embodiment, the sun gear 40, the lower surface plate 12, and the upper surface plate 20 are rotated while a polishing liquid is supplied between the lower surface plate 12 and the upper surface plate 20. There are no particular limitations on the polishing liquid used when polishing an aluminum substrate, as long as it is a commonly used liquid, and examples thereof include slurries containing aluminum oxide, colloidal silica, etc. The polishing liquid used for polishing the glass substrate is not particularly limited as long as it is a commonly used one, and examples thereof include slurries containing cerium oxide, zirconia, colloidal silica, etc.

[0039] <Stopping Process> In the stopping process, the control unit 34 controls the driving of the drive unit 16 and the drive unit 41 to stop the rotation of the lower surface plate 12, the sun gear 40, and the carrier 44. The control unit 34 also controls the drive motor of the drive unit 26 based on the rotation position detected by the encoder 32 to stop the rotation of the upper surface plate 20. Here, in this embodiment, the range GA ( FIGS. 3 and 4 ) between the axes of the pair of rolling bearings 81A is set to a range wider than the maximum dimension GB ( FIGS. 3 and 4 ) of the range over which the insertion portion 82 deviates from the insertion space 81B when the upper surface plate 20 is stopped. Therefore, the rotation of the upper surface plate 20 stops at a position where the insertion portion 82 is located within the range GA between the axes of the pair of rolling bearings 81A.

[0040] <Positioning Process> In the positioning process, after the rotation of the upper surface plate 20 has stopped, the drive unit 83 lowers the insertion unit 82, so that the insertion unit 82 is inserted into the insertion space 81B between the pair of rolling bearings 81A. Note that, because the carrier 44 is engaged with the sun gear 40 and the internal gear 42, it is possible to stop the carrier 44 at a set position by controlling the driving of the drive units 16 and 41.

[0041] As described above, in the positioning process, the inserting portion 82 is inserted into the insertion space 81B between the pair of rolling bearings 81A, thereby positioning the upper surface plate 20 at a set position in the rotational direction and radial direction of the upper surface plate 20. Specifically, the set position is a position where the supply hole 28 faces the disk-shaped substrate 100 stored in the carrier 44. In the positioning process, the inserting portion 82 is inserted into the inserting portion 81 after the upper surface plate 20 stops rotating, thereby preventing improper insertion of the inserting portion 82. In this embodiment, the inserting portion 81 is provided on the upper surface of the upper surface plate 20. Meanwhile, the inserting portion 82 is provided on the support portion 22 and is lowered and inserted into the inserting portion 81. It is not necessary to secure a space to the side of the upper surface plate 20 for arranging the inserting portion 82. In this way, the positioning process is a process of mechanically or physically positioning the upper surface plate 20, while the stopping process is a process of electrically positioning the upper surface plate 20. The stopping step can be said to be a step of roughly positioning the rotational position of the upper surface plate 20 prior to the positioning step.

[0042] <Peeling Process> The peeling process is a process of peeling the disk-shaped substrate 100 from the upper surface plate 20. In the peeling process, the supply unit 50 supplies a peeling fluid to the disk-shaped substrate 100 that has been polished, through the piping 52 and the supply hole 28. Furthermore, the lifting unit 23 raises the support unit 22 and the upper surface plate 20, and separates the upper surface plate 20 from the lower surface plate 12. The timing of supplying the peeling fluid may be before or after the upper surface plate 20 starts to rise. The present disclosure does not exclude the case where the peeling fluid is supplied without the process of raising the upper surface plate 20.

[0043] In this embodiment, before the separation fluid is supplied through the supply hole 28, the inserting portion 82 is inserted into the inserted portion 81, and the upper surface plate 20 is positioned so that the supply hole 28 faces the disk-shaped substrate 100. As a result, the separation fluid is supplied from the supply hole 28 toward the opposing disk-shaped substrate 100, thereby suppressing poor separation of the disk-shaped substrate 100.

[0044] <Modification of Manufacturing Method> The method for manufacturing a disk-shaped substrate according to the present disclosure is not limited to the above-described example, and may include at least a rotation step and a positioning step. The manufacturing method according to the present embodiment is performed using the manufacturing apparatus 10 described above, but may also be performed without using the manufacturing apparatus 10 described above. In the present disclosure, the method for manufacturing a disk-shaped substrate 200 may include one or more other commonly known processes depending on the type of disk-shaped substrate 200. In the manufacturing method according to the present embodiment, the polishing step is performed using the manufacturing apparatus 10, but this is not limited to this. A grinding step may also be performed using the manufacturing apparatus 10. In the present embodiment, the manufacturing apparatus 10 may be used to perform, for example, either the grinding step or the polishing step, or both.

[0045] The disclosures of Japanese Patent Application No. 2024-109912, filed on July 8, 2024, and Japanese Patent Application No. 2025-044064, filed on March 18, 2025, are incorporated herein by reference in their entirety. All documents, patent applications, and technical standards mentioned herein are incorporated herein by reference to the same extent as if each individual document, patent application, and technical standard was specifically and individually indicated to be incorporated by reference.

Claims

1. A manufacturing device for disk-shaped substrates, comprising: a lower surface plate on which a disk-shaped substrate is placed; an upper surface plate which rotates together with the lower surface plate, sandwiching the disk-shaped substrate therebetween, and polishes or grinds the disk-shaped substrate; a detection unit which detects the rotational position of the upper surface plate; a control unit which controls the drive of the upper surface plate based on the rotational position detected by the detection unit and stops the rotation of the upper surface plate; an insertion unit which is provided on either the upper surface plate or the device main body; and an insertion unit which is provided on the other of the upper surface plate or the device main body, is inserted into the insertion unit, and positions the upper surface plate at a predetermined setting position in the rotational direction.

2. The disk-shaped substrate manufacturing apparatus according to claim 1, wherein the inserted portion has a pair of rotating bodies rotatably mounted on one of the upper surface plate and the main body of the apparatus, the pair of rotating bodies having grooves formed on their outer surfaces along the direction of rotation of the rotating bodies, the grooves facing each other to form an insertion space between the pair of rotating bodies, and the inserting portion is inserted into the insertion space of the inserted portion and positions the upper surface plate at a preset position in the direction of rotation and radial direction of the upper surface plate.

3. The disk-shaped substrate manufacturing device according to claim 2, wherein the upper surface plate is driven to rotate by a drive motor via a reducer, and the range between the axes of the pair of rotating bodies is set to a range wider than the maximum dimension of the range in which the insertion portion deviates from the insertion space when the rotation of the upper surface plate is stopped.

4. The disk-shaped substrate manufacturing apparatus according to claim 1, wherein the upper surface plate further comprises a supply hole through which a separation fluid passes to separate the disk-shaped substrate from the upper surface plate.

5. The disk-shaped substrate manufacturing apparatus according to claim 1, wherein the apparatus main body comprises a support part arranged above the upper surface plate and rotatably supporting the upper surface plate, the inserted part is provided on the upper surface of the upper surface plate, and the inserting part is provided on the support part and is lowered and inserted into the inserted part.

6. A method for manufacturing a disk-shaped substrate, comprising: a first step of sandwiching a disk-shaped substrate between an upper surface plate and a lower surface plate, rotating the upper surface plate and the lower surface plate, and polishing or grinding the disk-shaped substrate; a second step of controlling the drive of the upper surface plate based on the rotational position detected by a detection unit that detects the rotational position of the upper surface plate, and stopping the rotation of the upper surface plate; and a third step of, after the rotation of the upper surface plate has stopped, inserting an insertion unit provided on one of the upper surface plate and the device main body into an insertion unit provided on the other of the upper surface plate and the device main body, thereby positioning the upper surface plate at a predetermined setting position in the rotational direction.

7. A method for manufacturing a disk-shaped substrate as described in claim 6, wherein the inserted portion has a pair of rotating bodies rotatably mounted on one of the upper surface plate and the device main body, the pair of rotating bodies having grooves formed on their outer surfaces along the rotational direction of the rotating bodies, the grooves facing each other to form an insertion space between the pair of rotating bodies, and in the third step, the inserting portion is inserted into the insertion space of the inserted portion, and the upper surface plate is positioned at a preset position in the rotational direction and radial direction of the upper surface plate.

8. A method for manufacturing a disk-shaped substrate as described in claim 7, wherein the upper surface plate is rotated by a drive motor via a reducer, and the range between the axes of the pair of rotating bodies is set to a range wider than the maximum dimension of the range in which the insertion portion deviates from the insertion space when the rotation of the upper surface plate is stopped.

9. A method for manufacturing a disk-shaped substrate as described in claim 6, wherein the upper surface plate further comprises a supply hole through which a release fluid passes to release the disk-shaped substrate from the upper surface plate, the set position is set so that the supply hole faces the disk-shaped substrate, and in the third step, the insertion portion is inserted into the inserted portion after the upper surface plate has stopped rotating and before the release fluid is supplied through the supply hole.

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