Flexible display module and foldable electronic device comprising same

Abstract

A foldable electronic device according to one embodiment of the present invention may comprise: a first housing; a second housing; a hinge module foldably coupled between the first housing and the second housing; a flexible display disposed on the first housing and the second housing; a circuit board electrically connected to the flexible display; an integrated circuit (IC) disposed on the circuit board; and an adhesive member for bonding the circuit board to the flexible display. The adhesive member may include an escape portion, which is an empty space formed between the flexible display and the circuit board so as to correspond to a first area of the circuit board overlapping the IC. The width of the escape portion parallel to the width direction of the IC may be smaller than the width of the IC.

Description

Flexible display module and foldable electronic device including the same

[0001] Various embodiments disclosed in this document relate to a flexible display module and a foldable electronic device including the same.

[0002] Thanks to remarkable advancements in information and communication technology and semiconductor technology, the proliferation and use of various electronic devices is rapidly increasing. In particular, recent electronic devices are being developed to enable portable communication.

[0003] Electronic devices can refer to devices that perform specific functions according to the programs installed on them, ranging from home appliances to electronic organizers, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, and car navigation systems. For example, these electronic devices can output stored information as audio or video. As the integration of electronic devices increases and ultra-high-speed, high-capacity wireless communication becomes more widespread, a single electronic device, such as a mobile communication terminal, can now be equipped with various functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions for mobile banking, and functions such as schedule management and electronic wallets are being integrated into a single electronic device. These electronic devices are becoming smaller so that users can conveniently carry them.

[0004] The display module of an electronic device is an output device that outputs visual information, and can also provide a virtual keypad that replaces a mechanical input device (e.g., a button-type input device). For the display module to operate stably within the electronic device, when subjected to impact, the shock transmitted to the IC (e.g., a touch IC) electrically connected to the display module needs to be dispersed.

[0005] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0006] A foldable electronic device according to one embodiment of the present disclosure may provide a conductive adhesive member including an escape portion, which is a void space (or gap) formed between a flexible display and a circuit board by escaping at least a portion corresponding to a vulnerable portion of an IC.

[0007] A foldable electronic device according to one embodiment of the present disclosure may include a first housing, a second housing, a hinge module foldably coupled between the first housing and the second housing, a flexible display disposed on the first housing and the second housing, a circuit board electrically connected to the flexible display, an integrated circuit (IC) disposed on the circuit board, and an adhesive member for adhering the circuit board to the flexible display. The adhesive member may include a relief portion, which is an empty space formed between the flexible display and the circuit board to correspond to a first region of the circuit board overlapping the IC. A width of the relief portion parallel to a width direction of the IC may be smaller than a width of the IC.

[0008] According to one embodiment of the present disclosure, a flexible display module may include a flexible display, a circuit board electrically connected to the flexible display, an IC mounted on the circuit board, and an adhesive member for adhering the circuit board to the flexible display. The adhesive member may include a relief portion, which is an empty space formed between the flexible display and the circuit board to correspond to a first region of the circuit board overlapping the IC. A width of the relief portion, which is parallel to a width direction of the IC, may be smaller than a width of the IC.

[0009] However, the problem to be solved in this disclosure is not limited to the problem mentioned above, and may be determined in various ways without departing from the spirit and scope of this disclosure.

[0010] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment of the present disclosure.

[0011] FIG. 2A is a front perspective view of an electronic device according to one embodiment of the present disclosure.

[0012] FIG. 2b is a plan view of the rear side of an electronic device according to one embodiment of the present disclosure.

[0013] FIG. 3 is an exploded perspective view of a portion of the electronic device of FIGS. 2A and 2B including a hinge device according to one embodiment of the present disclosure.

[0014] FIG. 4 is a drawing illustrating a portion of the front surface of an electronic device according to one embodiment of the present disclosure.

[0015] Figure 5 is a cross-sectional view taken along line I-I' shown in Figure 4.

[0016] FIG. 6 is a schematic diagram of a cross-section of an electronic device according to one embodiment of the present disclosure.

[0017] FIG. 7 is a rear view of a flexible display combined with a circuit board according to one embodiment of the present disclosure.

[0018] Figure 8 is a rear view of an adhesive member according to one embodiment of the present disclosure.

[0019] FIG. 9 is an enlarged view of a portion of an adhesive member showing an area where an IC is to be placed according to one embodiment of the present disclosure.

[0020] FIG. 10 is a schematic diagram of a drop test of a flexible display according to one embodiment of the present disclosure.

[0021] The following description refers to the attached drawings, and specific examples of implementations are illustrated within the drawings. Furthermore, other examples may be utilized and structural changes may be made without departing from the scope of the various examples.

[0022] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment disclosed in this document.

[0023] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In one embodiment, the electronic device (101) may have at least one of these components (e.g., the connection terminal (178)) omitted, or one or more other components added. In one embodiment, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0024] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0025] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0026] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0027] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0028] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0029] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0030] The display module (160) can visually provide information to an external device (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a hall area program device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0031] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0032] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0033] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0034] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0035] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0036] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0037] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0038] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0039] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0040] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0041] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In one embodiment, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0042] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0043] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0044] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0045] FIG. 2A is a front perspective view of an electronic device according to one embodiment.

[0046] FIG. 2b is a plan view of the rear side of an electronic device according to one embodiment.

[0047] Referring to FIGS. 2A and 2B, the electronic device (200) may include a first housing (210) (e.g., a first housing structure) including a first side member (213) (e.g., a side bezel) and a second housing (220) (e.g., a second housing structure) including a second side member (223) (e.g., a side bezel) that are foldably coupled to each other with respect to a folding axis (F) through at least one hinge device (240, 240-1) (e.g., a hinge module or a hinge structure). For example, the first housing (210) and the second housing (220) may be configured as a foldable housing (e.g., a housing structure). For example, the electronic device (200) may include a first display (230) (e.g., a flexible display, a foldable display, or a main display) arranged to be supported by a first housing (210) and a second housing (220). For example, the first housing (210) may include a first side (211) and a second side (212) facing in an opposite direction (e.g., a -z-axis direction) of the first side (211). For example, the second housing (220) may include a third side (221) and a fourth side (222) facing in an opposite direction (e.g., a -z-axis direction) of the third side (221). For example, the first housing (210) may include a first rear cover (214) coupled with a first side member (213). For example, the second housing (220) may include a second rear cover (224) coupled with a second side member (223). For example, when the electronic device (200) is in a fully unfolded first state (e.g., an unfolded state or an unfolded state), the first side (211) and the third side (221) may be operated so that they face substantially the same direction (e.g., a z-axis direction). For example, when the electronic device (200) is in a fully folded second state (e.g., a folded state or a folded state), the first side (211) and the third side (221) may face each other or face opposite directions.For example, the electronic device (200) may be operated to maintain a third state (e.g., an intermediate state) between the first state and the second state.

[0048] According to one embodiment, the electronic device (200) may include a first receiver (201), at least one first sensor module (204) (e.g., an ambient light sensor) and / or at least one first camera module (205) (e.g., a UDC, under display camera) disposed on a first side (211) of the first housing (210). For example, the electronic device (200) may include at least one key (206) disposed on a first side member (213). For example, the electronic device (200) may include at least one second camera module (208) and / or a flash (209) disposed on a second side (212) of the first housing (210) (e.g., a first rear cover (214)). For example, the electronic device (200) may include a second display (231) disposed on a fourth side (222) of a second housing (220), at least one third camera module (225) (e.g., UDC, under display camera), at least one second sensor module (226), and / or a second receiver (227). For example, the second display (231) may be disposed to be visible from the outside through at least a portion of the second rear cover (224). For example, the electronic device (200) may include a speaker (202) disposed on a second side member (223), a microphone (203) disposed on a first side member (213), and / or a connector port (207). At least some of the aforementioned components may be disposed in the first housing (210) and / or the second housing (220).

[0049] According to one embodiment, the first display (230) (e.g., a flexible display) may include a first region (230a) (e.g., a first planar portion) corresponding to at least a portion of the first surface (211), a second region (230b) (e.g., a second planar portion) corresponding to at least a portion of the third surface (221), and a third region (230c) (e.g., a flexible portion) connecting the first region (230a) and the second region (230b) and allowing the electronic device (200) to be deformed in a second state (e.g., a folded state) and / or a third state. For example, the third region (230c) may be positioned to at least partially overlap at least one hinge device (240, 240-1) when the first display (230) is viewed from above (e.g., in the z-axis direction). For example, the first display (230) may be arranged so that it is not visible from the outside in the second state by having the first side (211) and the third side (221) face each other (e.g., inward-fold type). For example, the first display (230) may be arranged so that it is visible from the outside in the second state by having the first side (211) and the third side (221) face each other in opposite directions (e.g., outward-fold type).

[0050] FIG. 3 is an exploded perspective view of a portion of the electronic device of FIGS. 2A and 2B including a hinge device according to various embodiments of the present disclosure.

[0051] Referring to FIG. 3, the electronic device (200) may include at least one hinge device (240, 240-1) (e.g., a hinge module or a hinge structure) connecting the first housing (210) and the second housing (220) under the first display (230) (e.g., in the -z-axis direction). For example, the at least one hinge device (240, 240-1) may include a first hinge device (240) and a second hinge device (240-1) spaced apart from the first hinge device (240) along a direction parallel to the folding axis (F) (e.g., in the ±y-axis direction). For example, at least one hinge device (240, 240-1) may be supported by a first support member (2131) extending from the first side member (213) to the first space (2101) of the first housing (210) and a second support member (2231) extending from the second side member (223) to the second space (2201) of the second housing (220). For example, at least one hinge device (240, 240-1) may be arranged between the first housing (210) and the second housing (220) so as to be invisible from the outside through a hinge housing (250) (e.g., a hinge cover).

[0052] According to one embodiment, the first hinge device (240) may include a first rotation member (241) (e.g., a first arm or a first rotator) disposed on a first support member (2131) of the first housing (210), a second rotation member (242) (e.g., a second arm or a second rotator) disposed on a second support member (2231) of the second housing (220), and a gear assembly (243) connected to the first rotation member (241) and the second rotation member (242) such that the first housing (210) and the second housing (220) rotate symmetrically with respect to each other. For example, the gear assembly (243) may include a plurality of gears (e.g., spur gears and / or worm gears) gear-coupled with respect to one another. For example, the gear assembly (243) may include a cam coupling structure for urging the first housing (210) and the second housing (220) in a direction in which they are to transition from a first state (e.g., an unfolded state or an unfolded state) to a second state (e.g., a folded state or a folded state) or in a direction in which they are to transition from the second state to the first state, based on a predetermined angle, and for providing a free stop at various folding angles. For example, the second hinge device (240-1) may have substantially the same configuration as the first hinge device (240).

[0053] According to one embodiment, the electronic device (200) may include a first hinge plate (261) connected to a first support member (2131) and / or a first rotation member (241). The electronic device (200) may include a second hinge plate (262) connected to a second support member (2231) and / or a second rotation member (242). For example, at least one hinge device (240, 240-1), the first rotation member (241), the second rotation member (242), the first hinge plate (261), and the second hinge plate (262) may form substantially the same plane as the first support member (2131) and the second support member (2231) when the electronic device (200) is in a first state. For example, the second hinge device (240-1) may be substantially symmetrical with the first hinge device (240) or may have a substantially identical configuration.

[0054] The configuration of the electronic device (200) may be all or part of the same as the configuration of the electronic device (101) of FIG. 1.

[0055] FIG. 4 is a drawing illustrating a portion of the front surface of an electronic device according to one embodiment of the present disclosure.

[0056] Figure 5 is a cross-sectional view taken along line I-I' shown in Figure 4.

[0057] The embodiments of FIGS. 4 and 5 can be optionally combined with the embodiments of FIGS. 1 to 3 and the embodiments of FIGS. 6 to 9.

[0058] Referring to FIGS. 4 and 5, an electronic device (200) according to one embodiment may include a first housing (210), a second housing (220), a flexible display (230) (e.g., the first display (230) of FIGS. 2a, 2b, and 2c), a circuit board (270), an integrated circuit (IC) (280), a buffer member (290), and an adhesive member (300).

[0059] According to one embodiment, the first housing (210) and the second housing (220) can be rotated toward or away from each other about the folding axis (F) by a hinge device (e.g., hinge device (240, 240-1) of FIG. 3).

[0060] According to one embodiment, the flexible display (230) can be arranged on the first housing (210) and the second housing (220). The shape of the flexible display (230) can be changed in response to the rotational state (e.g., folding state) of the first housing (210) and the second housing (220). For example, the flexible display (230) can be unfolded or folded along the folding axis (F) in response to the folding state of the first housing (210) and the second housing (220).

[0061] According to one embodiment, the flexible display (230), the adhesive member (300), the circuit board (270), the IC (280), and the buffer member (290) may be sequentially stacked in a vertical direction (e.g., ±Z-axis direction). The flexible display (230), the adhesive member (300), the circuit board (270), the IC (280), and the buffer member (290) may be referred to as a flexible display module.

[0062] According to one embodiment, the flexible display (230) may include a touch panel (not shown). The touch panel may be configured to receive a user's input operation (e.g., a touch). The touch panel may include various types of touch panels, such as a capacitive touch panel that detects a change in electrostatic capacity, a pressure-sensitive touch panel that detects a position by detecting pressure applied to the panel, an optical touch panel using infrared rays, and a transparent electrode touch panel that uses a contact point of a transparent conductive film. In addition, the touch panel may include various types of input position detection panels not previously mentioned, such as an electromagnetic resonance (EMR) touch panel. The touch panel may include a touch area for receiving a user's input operation. For example, when the touch panel is a capacitive touch panel, when a contact is generated on the touch area by a user's input operation, the electrostatic capacity for at least a portion of the touch area (e.g., an area touched by the user's finger) may change.

[0063] According to one embodiment, the circuit board (270) may be electrically connected to the flexible display (230). The circuit board (270) may be disposed on the lower side (e.g., in the -Z-axis direction) of the flexible display (230). The circuit board (270) may electrically connect a separate circuit board (not shown) included in the electronic device (200) and the flexible display (230). For example, the circuit board (270) may include a flexible printed circuit board (FPCB).

[0064] According to one embodiment, the electronic device (200) may include a processor (e.g., the processor (120) of FIG. 1). The processor may, for example, execute software (e.g., a program) to control at least one other component (e.g., a hardware or software component) of the electronic device (200) connected to the processor, and may perform various data processing or operations. As at least a part of the data processing or operations, the processor may store commands or data received from other components (e.g., the sensor module (176) or the communication module (190) of FIG. 1) in a volatile memory (e.g., the volatile memory (132) of FIG. 1), process the commands or data stored in the volatile memory, and store resulting data in a non-volatile memory (e.g., the non-volatile memory (134) of FIG. 1). The processor may include a main processor (e.g., a central processing unit or an application processor) (e.g., a main processor (121) of FIG. 1) or an auxiliary processor (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith (e.g., an auxiliary processor (123) of FIG. 1).

[0065] According to one embodiment, the IC (280) can generate a signal for controlling the electronic device (200). The IC (280) can be understood as a component included in the auxiliary processor. The IC (280) can include a touch IC that performs data processing or calculation based on a signal input to the touch panel and controls the touch panel. Hereinafter, when describing the IC (280), it is assumed that the IC (280) is implemented as a touch IC. However, the type of the IC (280) is not limited thereto.

[0066] According to one embodiment, the IC (280) may be electrically connected to the flexible display (230) (e.g., a touch panel) via the circuit board (270). The IC (280) may be configured to detect a change in electrostatic capacity due to contact (e.g., contact by a user) of a touch area from the touch panel of the display (230). For example, the IC (280) may generate a signal for controlling an operation of the electronic device (200) corresponding to contact of the touch area.

[0067] According to one embodiment, the IC (280) may be mounted (or placed) on a circuit board (270). For example, the IC (280) may be mounted on the circuit board (270) using surface mount technology (SMT). The IC (280) may be placed on the lower side (e.g., in the -Z-axis direction) of the circuit board (270).

[0068] According to one embodiment, the IC (280) may include a plurality of connecting members (e.g., solder balls) for physical or electrical connection with the circuit board (270) disposed on one side facing the circuit board (270) (e.g., the side facing the +Z-axis direction).

[0069] According to one embodiment, the buffer member (290) may be positioned on the lower side (e.g., in the -z-axis direction) of the IC (280). For example, the buffer member (290) may be positioned between the IC (280) and a housing (e.g., a second housing (220)).

[0070] According to one embodiment, the buffer member (290) may be provided to absorb at least a portion of a force (e.g., impact) applied to the flexible display (230) from the outside of the electronic device (200). For example, the buffer member (290) may disperse the impact transmitted to the IC (280) through the flexible display (230) when an impact is applied to the front side (e.g., the side facing the +Z-axis direction) of the flexible display (230). The buffer member (290) may be formed of a compressible material for impact absorption. For example, the buffer member (290) may include at least one of an optical clear adhesive (OCA) or a pressure sensitive adhesive (PSA).

[0071] According to one embodiment, the thickness of the buffer member (290) may be designed in consideration of the thickness of the electronic device (200). For example, when the mounting space inside the electronic device (200) is reduced due to the thin design of the electronic device (200) for portability of the electronic device (200), the thickness of the buffer member (290) may also be reduced. However, when the thickness of the buffer member (290) is reduced, the impact applied to the IC (280) disposed on the back surface of the flexible display (230) may increase, resulting in damage (e.g., crack) of the IC (280). In order to prevent damage to the IC (280), the adhesive member (300) may have a shock dissipating structure (e.g., escape portion (310)).

[0072] According to one embodiment, an adhesive member (300) may be disposed between the flexible display (230) and the circuit board (270). The adhesive member (300) may be composed of a conductive material. For example, the adhesive member (300) may include conductive foam (POM), a conductive film, or a conductive tape. The adhesive member (300) may have an adhesive layer provided on both sides (e.g., upper / lower sides) to fix the circuit board (270) to the back surface (e.g., the surface facing the -Z-axis direction) of the flexible display (230).

[0073] According to one embodiment, the adhesive member (300) may have a structure (e.g., a escaping portion (310)) for dispersing an impact applied to the flexible display (230). For example, when the flexible display module is viewed from above (e.g., in the +z-axis direction), the adhesive member (300) may include an escaping portion (310) in which a portion of the adhesive member (300) is escaping (or removed) in an area overlapping the IC (280). Hereinafter, the structure, function, and / or shape of the adhesive member (300) will be described with reference to FIGS. 6 to 9.

[0074] FIG. 6 is a schematic diagram of a cross-section of an electronic device according to one embodiment of the present disclosure.

[0075] The embodiment of FIG. 6 can be optionally combined with the embodiments of FIGS. 1 to 5 and the embodiments of FIGS. 7 to 9.

[0076] According to one embodiment, as a flexible display module, a flexible display (230), an adhesive member (300), a circuit board (270), an IC (280), and a buffer member (290) may be sequentially stacked on a housing (e.g., a second housing (220)).

[0077] Referring to FIG. 6, an IC (280) according to one embodiment may include a central portion (280c) as a portion of the IC (280), and a left portion (280a) and a right portion (280b) which are respectively positioned on the left and right sides (e.g., in the ±X-axis direction) of the central portion (280c). The left portion (280a) and the right portion (280b) may be referred to as a first portion and a second portion, respectively.

[0078] According to one embodiment, the circuit board (270) may include areas (270a, 270b) that overlap the IC (280) in the vertical direction (e.g., ±Z-axis direction). For example, the circuit board (270) may include a first area (e.g., mounting area) (270b) corresponding to the central portion (280c) of the IC (280), and a second area (270a) corresponding to the left portion (280a) and the right portion (280b) of the IC (280), as areas corresponding to the size (or area) of the IC (280) mounted on the circuit board (270). The second area (270a) of the circuit board (270) may surround at least one side (e.g., left and right sides) of the first area (270b).

[0079] According to one embodiment, the adhesive member (300) may include a release member (310) for dispersing a force (e.g., impact) applied to the flexible display (230) and a support member (320) surrounding one side of the release member (310).

[0080] According to one embodiment, the escape portion (310) may be an area where a portion of the raw material constituting the adhesive member (300) is escaped (or removed). The escape portion (310) may be positioned to correspond to a first area (270b) of the circuit board (270) that overlaps with a central portion (280c) of the IC (280). For example, when the flexible display module is viewed from above, the escape portion (310) may overlap with the central portion (280c) of the IC (280).

[0081] According to one embodiment, the escape portion (310) may be an empty space formed between the flexible display (230) and the circuit board (270). The escape portion (310) may be a space that accommodates a deformed portion of the flexible display (230) that is deformed by an impact (F) applied to the flexible display (230). The escape portion (310) may be referred to as a buffer space.

[0082] According to one embodiment, the escape portion (310) may have a hole shape penetrating the adhesive member (300) or a recess shape sunken from one side of the adhesive member (300) (e.g., one side facing the +Z-axis direction or one side facing the -Z-axis direction).

[0083] According to one embodiment, the support portion (320) may be an area where a portion of the material constituting the adhesive member (300) is not escaped, unlike the escape portion (310), and may surround at least one side of the escape portion (310). For example, the escape portion (310) may be an area of ​​the adhesive member (300) that overlaps with the circuit board (270) provided between the support portions (320). The support portion (320) may be positioned to correspond to a second area (270a) of the circuit board (270) that overlaps with the left side (280a) and the right side (280b) of the IC (280). For example, the support portion (320) may overlap with the left side (280a) and the right side (280b) of the IC (280) when the flexible display module is viewed from above (e.g., along the +Z axis).

[0084] According to one embodiment, the support member (320) may be an area of ​​the adhesive member (300) along which the impact force (F1, F2) transmitted along the flexible display (230) is distributed when an impact (F) is applied to the flexible display (230).

[0085] According to one embodiment, the adhesive member (300) can delay the time at which the deformation force (e.g., bending moment) is transmitted to the central portion (280c) of the IC (280) through the escape portion (310) when an impact (F) is applied to the flexible display (230). The adhesive member (300) can reduce the deformation force (e.g., bending moment) concentrated on the central portion (280c) of the IC (280) by dispersing the impact force (F1, F2) through the support portion (320) when an impact (F) is applied to the flexible display (230).

[0086] For example, when looking at the IC (280), when an impact is applied to the flexible display (230), the deformation force (e.g., bending moment) is greatest in the central portion (280c) of the IC (280) where the load intensity for the left and right loads is equal than in the left portion (280a) and right portion (280b). Accordingly, there is a risk that damage (e.g., crack) may occur in the central portion (280c) of the IC (280), which is a vulnerable portion.

[0087] However, the durability of the IC (280) can be improved by dispersing the impact transmitted to the IC (280) through the escape portion (310) and support portion (320) of the aforementioned adhesive member (300).

[0088] In addition, as the escape portion (310) and the support portion (320) of the adhesive member (300) are provided, the thickness of the buffer member (290) for shock absorption can be reduced, thereby enabling the electronic device (200) to be made thinner.

[0089] Although not specified in the drawing, if the vulnerable portion of the IC (280) does not correspond to the central portion (280c) unlike in FIG. 6 due to the asymmetrical arrangement of the multiple connecting members (e.g., solder balls) of the IC (280), the escape portion (310) may be formed by escaping (or removing) a portion of the adhesive member (300) corresponding to the vulnerable portion of the IC (280). For example, the escape portion (310) may be formed at a position overlapping with an area where the multiple connecting members, which are the vulnerable portions, are not arranged.

[0090] FIG. 7 is a rear view of a flexible display combined with a circuit board according to one embodiment of the present disclosure.

[0091] Figure 8 is a rear view of an adhesive member according to one embodiment of the present disclosure.

[0092] FIG. 9 is an enlarged view of a portion of an adhesive member showing an area where an IC is to be placed according to one embodiment of the present disclosure.

[0093] The embodiments of FIGS. 7 to 9 can be optionally combined with the embodiments of FIGS. 1 to 6.

[0094] Referring to FIGS. 7 to 9, an adhesive member (300) according to one embodiment may be attached to the back surface (e.g., the surface facing the -z axis) of a flexible display (230). The adhesive member (300) may secure a circuit board (270) to the back surface of the flexible display (230).

[0095] According to one embodiment, the adhesive member (300) may include an escape portion (310), a support portion (320), a noise removal portion (330), and a flattening layer (340).

[0096] According to one embodiment, the escape portion (310) may be formed by escaping (or removing) the raw material constituting the adhesive member (300) so that at least a portion overlaps with the central portion (280c) of the IC (280). The escape portion (310) may be formed by escaping (or removing) an area of ​​the adhesive member (300) corresponding to the central portion (280c) of the IC (280) in a direction perpendicular to the longitudinal direction (e.g., long axis direction) of the IC (280) (e.g., ±x-axis direction) (e.g., ±y-axis direction).

[0097] According to one embodiment, the escape portion (310) may extend along the central portion (280c), which is a vulnerable portion of the IC (280). The escape portion (310) may extend in a direction perpendicular to the longitudinal direction (e.g., the ±x-axis direction) of the IC (280) (e.g., the ±y-axis direction). For example, the extension length of the escape portion (310) (e.g., the length extended in the ±y-axis direction) may be substantially equal to or longer than the length of the IC (280) (e.g., the length parallel to the ±y-axis direction).

[0098] According to one embodiment, the width of the escape portion (310) (e.g., W2 in FIG. 10) may be designed to be smaller than the width of the IC (280) (e.g., W1 in FIG. 10). This is because, if the width of the escape portion (310) is designed to be larger than the width of the IC (280), when an impact is applied to the flexible display (230), it may be difficult to distribute the impact through the support portion (320).

[0099] According to one embodiment, the support member (320) may be provided on both sides of the escape member (310) so as to overlap the left / right sides (280a, 280b) of the IC (280), as illustrated in FIG. 9.

[0100] According to one embodiment, the noise removal unit (330) may be connected to the escape unit (310). The noise removal unit (330) may provide an air flow path to allow air to flow between the outside and inside of the escape unit (310). By being connected to the escape unit (310), the noise removal unit (330) may eliminate or reduce noise (e.g., noise) that may occur when the flexible display (230) is pressed.

[0101] In one embodiment, the noise removing unit (330) may extend from the escape unit (310) to the edge of the adhesive member (300). The noise removing unit (330) may include one end that is in communication with the escape unit (310) and the other end that is an open end positioned at the edge of the adhesive member (300). The noise removing unit (330) may be positioned on the outside of the support unit (320). For example, the noise removing unit (330) may be positioned in an area of ​​the adhesive member (300) that does not overlap with the IC (280).

[0102] According to one embodiment, the planarization layer (340) may be provided on the outer region of the escape portion (310). The planarization layer (340) may have a compressible material and may induce the flexible display (230) to have a substantially flat surface.

[0103] According to one embodiment, the flexible display module (or the electronic device (200) of FIGS. 2A to 4) may further include a shielding member (400) attached to a back surface (e.g., a surface facing the -Z axis) of the circuit board (270). The shielding member (400) may be attached to an area corresponding to an element of the circuit board (270) to reduce electrostatic discharge (ESD) emitted from the element.

[0104] FIG. 10 is a schematic diagram of a drop test of a flexible display according to one embodiment of the present disclosure.

[0105] Fig. 10 is a drawing schematically showing a drop test (e.g., ball drop test) in which a ball (B) is dropped from a predetermined height onto the surface of a flexible display (230) corresponding to the mounting area of ​​an IC (280).

[0106] Referring to FIG. 10, the size (e.g., width (W2)) and position of the escape portion (310) of the adhesive member (300) according to one embodiment may be determined according to the size (e.g., width (W1)) of the IC (280) and the shape (e.g., trace) of the impact applied to the flexible display (230).

[0107] For example, under the condition that the width (W1) of the IC (280) is 7 mm, when a ball (e.g., a steel ball) (B) weighing 70 g and having a diameter of 25 pi is dropped on a surface area of ​​a flexible display (230) corresponding to the size of the IC (280), the shape of the impact (e.g., a trace) generated on the surface of the flexible display (230) may have a radius of 3 to 4 mm. Based on this, the results of a drop test performed to drop the ball (B) from a height of 30 to 50 cm from the flexible display (230) are as follows [Table 1].

[0108] Width of escape part (310) (W2) 0mm3mm4mm7mm Test result #1: 40cm, NG #2: 40cm NG#1: 50cm, OK#2: 50cm OK#1: 50cm, NG#2: 50cm OK#1: 40cm, NG#2: 50cm NG

[0109] Referring to [Table 1], when the width (W2) of the escape portion (310) is 0 mm, i.e., when the escape portion (310) is not provided on the adhesive member (300), it was confirmed that damage (e.g., crack) occurred on the IC (280) from a height of 40 cm in both the first (#1) and second (#2) drop tests.

[0110] When the width (W2) of the escape portion (310) is 7 mm, i.e., when the widths of the escape portion (310) and the IC (280) are the same, it was confirmed that damage (e.g., cracks) occurred in the IC (280) in the first (#1) drop test from a height of 40 cm, and in the second (#2) drop test from a height of 50 cm. Consequently, when the widths of the escape portion (310) and the IC (280) are the same, the impact is not dispersed by the support portion (320), so the impact may be directly transmitted to the vulnerable part of the IC (280).

[0111] When the width (W2) of the escape portion (310) was 4 mm, the first (#1) drop test was passed, but the second (#2) drop test confirmed that damage (e.g., crack) occurred in the IC (280) from a height of 50 cm.

[0112] When the width (W2) of the escape portion (310) is 3 mm, it was confirmed that the IC (280) passed both the first (#1) drop test and the second (#2) drop test, thereby ensuring robustness.

[0113] A foldable electronic device (200) according to one embodiment of the present disclosure may include a first housing (210), a second housing (220), a hinge module (240) foldably coupled between the first housing (210) and the second housing (220), a flexible display (230) disposed on the first housing (210) and the second housing (220), a circuit board (270) electrically connected to the flexible display (230), an integrated circuit (IC) (280) disposed on the circuit board (270), and an adhesive member (300) for adhering the circuit board (270) to the flexible display (230). The adhesive member (300) may include a cover portion (310), which is an empty space formed between the flexible display (230) and the circuit board (270), so as to correspond to a first area (270b) of the circuit board (270) that overlaps the IC (280). The width (W2) of the cover portion (310) parallel to the width direction of the IC (280) may be smaller than the width (W1) of the IC (280).

[0114] According to one embodiment, the adhesive member (300) may include a support member (320) surrounding the escape portion (310) so as to overlap the IC (280) and face the second area (270a) of the circuit board (270) with the first area (270b) of the circuit board (270) interposed therebetween.

[0115] According to one embodiment, the circuit board (270) may include a first region (270b) corresponding to the escape portion (310) of the adhesive member (300), and a second region (270a) surrounding at least one side of the first region (270b), as a region corresponding to the size of the IC (280) mounted on the circuit board (270).

[0116] According to one embodiment, the escape portion (310) may extend in a direction perpendicular to the width direction of the IC (280).

[0117] According to one embodiment, the extension length of the escape portion (310) may be equal to or longer than the length of the IC (280).

[0118] According to one embodiment, the escape portion (310) may be formed by escaping (or removing) an area of ​​the adhesive member (300) corresponding to an area (280c) of the IC (280) in a direction perpendicular to the longitudinal direction of the IC (280).

[0119] According to one embodiment, the adhesive member (300) may include a noise removal member (330) that extends from the escape member (310) to the edge of the adhesive member (300) as an air flow channel communicating with the escape member (310).

[0120] According to one embodiment, the noise removal unit (330) may be located on the outside of the escape unit (310) and the support unit (320) of the adhesive member (300).

[0121] According to one embodiment, the escape portion (310) may be positioned to correspond to an area (270b) of the circuit board (270) that overlaps the central portion (280c) of the IC (280).

[0122] According to one embodiment, the IC (280) may be arranged on one surface of the IC (280) and may include a plurality of solder balls for electrical connection with the circuit board (270). The escape portion (310) may be positioned to correspond to an area of ​​the circuit board (270) overlapping the IC (280) where the plurality of solder balls are not connected.

[0123] According to one embodiment, the flexible display (230) may include a touch panel for detecting a touch signal. The IC (280) may include a touch IC electrically connected to the touch panel.

[0124] According to one embodiment, the flexible display (230), the adhesive member (300), the circuit board (270), and the IC (280) can be sequentially stacked in the vertical direction.

[0125] According to one embodiment, the adhesive member (300) may be composed of a conductive material.

[0126] According to one embodiment, the foldable electronic device (200) may further include a compressible buffer member (290) disposed on the lower side of the IC (280).

[0127] A flexible display module according to one embodiment of the present disclosure may include a flexible display (230), a circuit board (270) electrically connected to the flexible display (230), an integrated circuit (IC) (280) disposed on the circuit board (270), and an adhesive member (300) for adhering the circuit board (270) to the flexible display (230). The adhesive member (300) may include a shield (310), which is an empty space formed between the flexible display (230) and the circuit board (270), so as to correspond to a first region (270b) of the circuit board (270) overlapping the IC (280). A width (W2) of the shield (310) parallel to a width direction of the IC (280) may be smaller than a width (W1) of the IC (280).

[0128] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0129] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0130] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0131] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0132] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0133] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In a foldable electronic device (200), First housing (210); Second housing (220); A hinge module (240) foldably connected between the first housing (210) and the second housing (220); A flexible display (230) placed on the first housing (210) and the second housing (220); A circuit board (270) electrically connected to the above flexible display (230); An integrated circuit (IC) (280) placed on the circuit board (270); and It includes an adhesive member (300) for adhering the circuit board (270) to the flexible display (230), The above adhesive member (300) is It includes an escape portion (310), which is an empty space formed between the flexible display (230) and the circuit board (270) to correspond to the first area (270b) of the circuit board (270) overlapping with the IC (280), An electronic device in which the width (W2) of the escape portion (310) parallel to the width direction of the IC (280) is smaller than the width (W1) of the IC (280).

2. In paragraph 1, The above adhesive member (300) is An electronic device comprising a support member (320) surrounding the escape member (310) so as to face the second area (270a) of the circuit board (270) overlapping the IC (280) and sandwiching the first area (270b) of the circuit board (270).

3. In paragraph 1, The above circuit board (270) is An electronic device comprising a first region (270b) corresponding to the escape portion (310) of the adhesive member (300) and a second region (270a) surrounding at least one side of the first region (270b), as an region corresponding to the size of the IC (280) mounted on the circuit board (270).

4. In any one of paragraphs 1 to 3, The above escape portion (310) is an electronic device that extends in a direction perpendicular to the width direction of the IC (280).

5. In paragraph 4, The extended length of the above escape portion (310) is equal to or longer than the length of the IC (280), an electronic device.

6. In any one of paragraphs 1 to 5, The above-mentioned escape portion (310) is an electronic device in which an area of ​​an adhesive member (300) corresponding to an area (280c) of an IC (280) is escaped in a direction perpendicular to the longitudinal direction of the IC (280).

7. In paragraph 2, The above adhesive member (300) is An electronic device comprising a noise removal unit (330) extending from the escape unit (310) to the edge of the adhesive member (300) as an air flow channel communicating with the escape unit (310).

8. In paragraph 7, The above noise removal unit (330) An electronic device located on the outer side of the escape portion (310) and the support portion (320) of the adhesive member (300).

9. In any one of paragraphs 1 to 8, The above escape part (310) is, An electronic device positioned to correspond to an area (270b) of the circuit board (270) that overlaps the central portion (280c) of the IC (280).

10. In any one of paragraphs 1 to 9, The above IC (280) is, Arranged on one side of the IC (280), and including a plurality of solder balls for electrical connection with the circuit board (270), The above escape part (310) is, An electronic device, wherein the plurality of solder balls are positioned so as to correspond to an area of ​​the circuit board (270) that overlaps with the IC (280) and is not connected.

11. In any one of paragraphs 1 to 10, The above flexible display (230) is Includes a touch panel for detecting touch signals, The above IC (280) is an electronic device including a touch IC electrically connected to the touch panel.

12. In any one of paragraphs 1 to 11, An electronic device in which the flexible display (230), the adhesive member (300), the circuit board (270), and the IC (280) are sequentially stacked in the vertical direction.

13. In any one of paragraphs 1 to 12, The above adhesive member (300) is an electronic device composed of a conductive material.

14. In any one of paragraphs 1 to 13, An electronic device further comprising a compressible buffer member (290) disposed on the lower side of the IC (280).

15. In a flexible display module, Flexible display (230); A circuit board (270) electrically connected to the above flexible display (230); An integrated circuit (IC) (280) placed on the circuit board (270); and It includes an adhesive member (300) for adhering the circuit board (270) to the flexible display (230), The above adhesive member (300) is It includes an escape portion (310), which is an empty space formed between the flexible display (230) and the circuit board (270) to correspond to the first area (270b) of the circuit board (270) overlapping with the IC (280), A flexible display module in which the width (W2) of the escape portion (310) parallel to the width direction of the IC (280) is smaller than the width (W1) of the IC (280).

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