Electronic device comprising antenna

Abstract

This electronic device comprises: a first housing; a second housing rotatably connected to the first housing through a hinge module; a first conductive portion; a second conductive portion at least partially overlapping the first conductive portion in a folded state; a third conductive portion disposed adjacent to the second conductive portion; a first substrate; a phase change induction circuit disposed on an electrical path that connects the third conductive portion and a ground of the substrate on the first substrate; and a wireless communication circuit for transmitting and / or receiving a wireless signal through at least the first conductive portion and the third conductive portion, wherein, in the folded state, the phase of the second conductive portion can be adjusted through a phase change of the third conductive portion under control of the phase change induction circuit.

Description

Electronic device including an antenna

[0001] Embodiments of the present disclosure relate to an electronic device including an antenna.

[0002] Electronic devices are becoming increasingly slimmer, more rigid, and more aesthetically pleasing, while simultaneously differentiating their functional elements. Electronic devices may have a flexible structure that allows for portability and the use of large-screen displays. An electronic device (e.g., a foldable electronic device) may include at least two flexible housings that fold or unfold relative to each other and a flexible display positioned to support the housings. The electronic device may include an antenna that operates in at least one frequency band utilizing a portion of a metal bezel (e.g., a metal frame).

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] An electronic device (e.g., a portable communication device or a mobile terminal) may include a foldable electronic device having a foldable housing structure in which a first housing and a second housing are rotatably connected to each other via a hinge module (e.g., a hinge, a hinge module, a hinge assembly, a hinge structure, or a hinge device). The first housing and the second housing may include a side member used as at least a portion of a side of the electronic device. The side member may be formed by combining a metal (e.g., a conductive member, a conductive portion, or a conductive material) and a polymer combined with the metal (e.g., a non-conductive member, a non-conductive portion, or a non-conductive material) to reinforce the rigidity of the electronic device and / or perform a specific function (e.g., an antenna function). For example, the side member may include at least one conductive portion segmented via at least one non-conductive portion (e.g., a segmented portion, a gap, or a slit). At least one conductive portion may be electrically connected to a wireless communication circuit of the electronic device such that it operates as at least one antenna (e.g., a bezel antenna or a metal frame antenna) operating in at least one frequency band. For example, the at least one antenna may include at least one of a legacy antenna operating in a frequency band ranging from about 600 MHz to 6000 MHz, a 5G antenna operating in a frequency band ranging from about 3 GHz to 300 GHz, an ultra wide band (UWB) antenna operating in a frequency band ranging from about 6 GHz to 8.5 GHz, a GPS antenna, a WiFi antenna, or a Bluetooth antenna.

[0005] An antenna utilizing a conductive portion of a side member arranged in one housing may have a phase shift and thus a reduction in radiation performance if, in a folded state of the electronic device, the conductive portion of the other overlapping housing at least partially overlaps with the conductive portion of the other overlapping housing. Therefore, the phase can be aligned by designing the arrangement structure of the two conductive portions to be substantially identical (e.g., identically aligned). However, this may cause design constraints on the electronic device and reduce the layout efficiency of the internal electrical components.

[0006] Additionally, a separate power divider may be provided to ensure that the two antennas are in phase by positioning it between the signal lines. However, this limits the frequency range to approximately 500 MHz to minimize signal distribution loss, limiting the antenna's usable bandwidth. This is inherently limiting in practical situations where multiple frequency bands must be supported through a single conductive portion.

[0007] Various embodiments of the present disclosure may provide an electronic device including an antenna that may help improve radiation performance through phase shifting of conductive portions that at least partially overlap in a folded state.

[0008] According to various embodiments, an electronic device including an antenna that can help improve the layout efficiency of electrical components can be provided.

[0009] According to various embodiments, an electronic device can be provided that includes an antenna configured to support multiple band frequencies by switching only passive elements, without a power divider having a relatively narrow width limitation, even in a folded state.

[0010] However, the problem to be solved in this disclosure is not limited to the problem mentioned above, and may be expanded in various ways without departing from the spirit and scope of this disclosure.

[0011] According to various embodiments, an electronic device includes a first housing including a first side member, a second housing including a second side member and rotatably connected to the first housing through a hinge module, a first conductive portion disposed through a portion of the second side member, a second conductive portion disposed through a portion of the first side member and at least partially aligned with the first conductive portion in a folded state, a third conductive portion disposed near the second conductive portion through a portion of the first side member, a first substrate disposed in an internal space of the first housing, a phase shift induction circuit disposed in an electrical path connecting the third conductive portion and a ground of the substrate in the first substrate, and a wireless communication circuit disposed in an internal space of the electronic device and configured to transmit and / or receive a wireless signal through at least the first conductive portion and the third conductive portion, wherein in the folded state, a phase of the second conductive portion is set to be adjusted through a phase shift of the third conductive portion through control of the phase shift induction circuit. Can be.

[0012] An electronic device according to exemplary embodiments of the present disclosure can help improve the radiation performance of the antenna in a folded state by including a phase shift induction circuit arranged in the electrical path of at least one conductive portion operating as an antenna and a peripheral conductive portion operating as another antenna without a power divider having a relatively narrow frequency bandwidth limitation, and can be relatively free from the layout design and design constraints of internal electrical components depending on the alignment of the two conductive portions.

[0013] In addition, various effects may be provided directly or indirectly through this document.

[0014] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure pertains from the description below.

[0015] In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

[0016] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

[0017] FIG. 2A is a front perspective view of an electronic device illustrating a folded state or unfolded state according to various embodiments of the present disclosure.

[0018] FIG. 2b is a plan view illustrating the front of an electronic device in an unfolded state according to various embodiments of the present disclosure.

[0019] FIG. 2c is a plan view illustrating the rear surface of an electronic device in an unfolded state according to various embodiments of the present disclosure.

[0020] FIG. 3A is a perspective view of an electronic device illustrating a folded state according to various embodiments of the present disclosure.

[0021] FIG. 3b is a perspective view of an electronic device illustrating an intermediate state according to various embodiments of the present disclosure.

[0022] FIG. 4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.

[0023] FIG. 5 is a schematic diagram of an electronic device including an antenna arrangement structure according to various embodiments of the present disclosure.

[0024] FIG. 6 is a diagram illustrating a phase change induction circuit according to various embodiments of the present disclosure.

[0025] FIG. 7A is a graph showing a phase change of a second antenna according to a change in the inductance value of an inductor of a phase change induction circuit according to various embodiments of the present disclosure.

[0026] FIG. 7b is a graph showing a phase change of a second antenna according to a change in the capacitance value of a capacitor of a phase change induction circuit according to various embodiments of the present disclosure.

[0027] FIG. 7c is a graph showing a phase change of a second antenna according to changes in the capacitance value of a capacitor and the inductance value of an inductor of a phase change induction circuit according to various embodiments of the present disclosure.

[0028] FIG. 8A is a graph comparing changes in radiation performance of a first antenna before and after a phase change of a second antenna according to various embodiments of the present disclosure.

[0029] FIG. 8b and FIG. 8c are diagrams comparing the current distribution of the third antenna before and after the phase change of the second antenna according to various embodiments of the present disclosure.

[0030] FIG. 9A is a graph comparing changes in radiation performance of a first antenna before and after a phase change of a second antenna according to various embodiments of the present disclosure.

[0031] FIG. 9b and FIG. 9c are diagrams comparing the current distribution of the third antenna before and after the phase change of the second antenna according to various embodiments of the present disclosure.

[0032] FIG. 10 is a schematic diagram of an electronic device including an antenna arrangement structure according to various embodiments of the present disclosure.

[0033] FIG. 11A is a graph comparing changes in radiation performance of a first antenna before and after a phase change of a second antenna according to various embodiments of the present disclosure.

[0034] FIG. 11b and FIG. 11c are diagrams comparing the current distribution of the third antenna before and after the phase change of the second antenna according to various embodiments of the present disclosure.

[0035] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0036] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0037] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0038] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0039] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0040] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0041] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0042] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0043] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0044] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0045] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0046] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0047] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0048] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0049] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0050] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0051] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0052] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0053] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0054] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0055] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0056] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0057] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0058] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0059] FIG. 2A is a perspective view of an electronic device (300) in a flat state (or unfolding state) according to various embodiments of the present disclosure. FIG. 2B is a diagram illustrating a front side of the electronic device (300) in a flat state according to various embodiments of the present disclosure. FIG. 2C is a diagram illustrating a rear side of the electronic device (300) in a unfolding state according to various embodiments of the present disclosure. FIG. 3A is a perspective view of an electronic device (300) in a folded state according to various embodiments of the present disclosure. FIG. 3B is a perspective view of an electronic device (300) in an intermediate state according to various embodiments of the present disclosure.

[0060] The electronic device (300) of FIGS. 2A to 3B may be at least partially similar to the electronic device (101) of FIG. 1, or may further include other embodiments of the electronic device.

[0061] Referring to FIGS. 2A and 3B , an electronic device (300) (e.g., a portable communication device) may include a pair of housings (310, 320) (e.g., a foldable housing) that are rotatably coupled to face each other and foldable based on a hinge module (340) (e.g., a hinge device, a hinge structure, or a hinge assembly). In some embodiments, the hinge modules (340) may be arranged in the x-axis direction or the y-axis direction. In some embodiments, two or more hinge modules (340) may be arranged so as to fold in the same direction or in different directions. In one embodiment, the electronic device (300) may include a first display (330) (e.g., a flexible display) that is arranged in an area formed by the pair of housings (310, 320). In one embodiment, the first housing (310) and the second housing (320) are arranged on both sides with respect to the folding axis (F) and may have a shape that is substantially symmetrical with respect to the folding axis (F). In one embodiment, the angle or distance between the first housing (310) and the second housing (320) may vary depending on whether the state of the electronic device (300) is a flat state (or unfolding state), a folding state, or an intermediate state.

[0062] According to various embodiments, a pair of housings (310, 320) may include a first housing (310) (e.g., a first housing structure) coupled with a hinge module (340) and a second housing (320) (e.g., a second housing structure) coupled with the hinge module (340). In one embodiment, the first housing (310) may include, in an unfolded state, a first surface (311) (e.g., a front surface) facing in a front direction (e.g., a z-axis direction) and a second surface (312) (e.g., a rear surface) facing in a rear direction (e.g., a -z-axis direction) opposite the first surface (311). In one embodiment, the second housing (320) may include, in an unfolded state, a third surface (321) (e.g., a front surface) facing in a front direction (e.g., a z-axis direction) and a fourth surface (322) (e.g., a rear surface) facing in a rear direction (e.g., a -z-axis direction). In one embodiment, the electronic device (300) may be operated in such a way that, in the unfolded state, the first surface (311) of the first housing (310) and the third surface (321) of the second housing (320) face substantially the same first direction (e.g., the z-axis direction), and in the folded state, the first surface (311) and the third surface (321) face each other. In one embodiment, the electronic device (300) may be operated in such a way that, in the unfolded state, the second surface (312) of the first housing (310) and the fourth surface (322) of the second housing (320) face substantially the same second direction (e.g., the -z-axis direction), and in the folded state, the second surface (312) and the fourth surface (322) face opposite directions. For example, in the folded state, the second side (312) may face in the first direction (e.g., the z-axis direction), and the fourth side (322) may face in the second direction (e.g., the -z-axis direction).

[0063] According to various embodiments, the first housing (310) may include a first side member (313) that at least partially forms an exterior of the electronic device (300) and a first rear cover (314) that is coupled with the first side member (313) and forms at least a portion of a second side (312) of the electronic device (300). In one embodiment, the first side member (313) may include a first side member (313a), a second side member (313b) that extends from one end of the first side member (313a), and a third side member (313c) that extends from the other end of the first side member (313a). In one embodiment, the first side member (313) may be formed into a rectangular (e.g., square or rectangular) shape through the first side member (313a), the second side member (313b), and the third side member (313c).

[0064] According to various embodiments, the second housing (320) may include a second side member (323) that at least partially forms an exterior of the electronic device (300) and a second rear cover (324) that is coupled with the second side member (323) and forms at least a portion of a fourth side (322) of the electronic device (300). In one embodiment, the second side member (323) may include a fourth side member (323a), a fifth side member (323b) that extends from one end of the fourth side member (323a), and a sixth side member (323c) that extends from the other end of the fourth side member (323a). In one embodiment, the second side member (323) may be formed into a rectangular shape through the fourth side member (323a), the fifth side member (323b), and the sixth side member (323c). In one embodiment, the first housing (310) and the second housing (320) may be configured as a foldable housing (e.g., a foldable housing structure or a housing structure).

[0065] According to various embodiments, the pair of housings (310, 320) are not limited to the illustrated shapes and combinations, and may be implemented by other shapes or combinations and / or combinations of parts. For example, in some embodiments, the first side member (313) may be formed integrally with the first rear cover (314), and the second side member (323) may be formed integrally with the second rear cover (324).

[0066] According to various embodiments, the electronic device (300) may be configured such that, in an unfolded state, the second side (313b) of the first side member (313) and the fifth side (323b) of the second side member (323) are connected. In one embodiment, the electronic device (300) may be configured such that, in an unfolded state, the third side (313c) of the first side member (313) and the sixth side (323c) of the second side member (323) are connected. In one embodiment, the electronic device (300) may be configured such that, in an unfolded state, the combined length of the second side (313b) and the fifth side (323b) is longer than the length of the first side (313a) and / or the fourth side (323a). Additionally, the combined length of the third side (313c) and the sixth side (323c) may be configured to be longer than the length of the first side (313a) and / or the fourth side (323a). In some embodiments, the electronic device (300) may be configured such that, in the unfolded state, the combined length of the second side (313b) and the fifth side (323b) is shorter than the length of the first side (313a) and / or the fourth side (323a). Additionally, the combined length of the third side (313c) and the sixth side (323c) may be configured to be shorter than the length of the first side (313a) and / or the fourth side (323a).

[0067] According to various embodiments, the first rear cover (314) and / or the second rear cover (324) may be formed by, for example, at least one or a combination of two of coated or colored glass, ceramic, polymer, or metal (e.g., aluminum, stainless steel (STS), or magnesium).

[0068] According to various embodiments, the first display (330) may be arranged to extend from a first side (311) of the first housing (310) across a hinge module (340) (e.g., a hinge structure or hinge assembly) to at least a portion of a third side (321) of the second housing (320). For example, the first display (330) may include a first portion (330a) substantially corresponding to the first side (311), a second portion (330b) substantially corresponding to the third side (321), and a third portion (330c) (e.g., a bendable area) connecting the first portion (330a) and the second portion (330b) and corresponding to the hinge module (340). In some embodiments, the third portion (330c) may include an area that does not at least partially correspond to the hinge module (340).

[0069] According to various embodiments, the electronic device (300) may include a hinge housing (341) (e.g., a hinge cover) that supports the hinge module (340) and is exposed to the outside when the electronic device (300) is in a folded state and is positioned so as to be invisible from the outside by being inserted into the first space (3101) of the first housing (310) and the second space (3201) of the second housing (320) when the electronic device (300) is in an unfolded state. In some embodiments, the first display (330) may be positioned to extend from at least a portion of the second surface (312) to at least a portion of the fourth surface (322). In this case, the electronic device (300) may be folded so that the first display (330) is exposed to the outside (out-folding method).

[0070] According to various embodiments, the electronic device (300) may include a second display (350) (e.g., a sub-display) disposed separately from the first display (330). In one embodiment, the second display (350) is disposed so as to be at least partially exposed on the second side (312) of the first housing (310), so as to replace the display function of the first display (330) when in a folded state, thereby displaying status information of the electronic device (300). In one embodiment, the second display (350) may be disposed so as to be visible from the outside through at least a portion of the first rear cover (314). In some embodiments, the second display (350) may be disposed on the fourth side (322) of the second housing (320). In such a case, the second display (350) may be disposed so as to be visible from the outside through at least a portion of the second rear cover (324).

[0071] According to various embodiments, the electronic device (300) may include at least one of an input device (303) (e.g., a microphone), an audio output device (301, 302), a sensor module (304), a camera device (305, 308), a key input device (306), or a connector port (307). In the illustrated embodiment, the input device (303) (e.g., a microphone), an audio output device (301, 302), a sensor module (304), a camera device (305, 308), a key input device (306), or a connector port (307) refers to a hole or shape formed in the first housing (310) or the second housing (320), but may also include an actual electronic component (e.g., an input device, an audio output device, a sensor module, or a camera device) disposed inside the electronic device (300) and operating through the hole or shape.

[0072] According to various embodiments, the input device (303) may include at least one microphone (303) disposed in the second housing (320). In some embodiments, the input device (303) may include a plurality of microphones (303) disposed so as to detect the direction of sound. In some embodiments, the plurality of microphones (303) may be disposed at appropriate locations in the first housing (310) and / or the second housing (320). In one embodiment, the audio output devices (301, 302) may include speakers (301, 302). In one embodiment, the speakers (301, 302) may include a call receiver (301) disposed in the first housing (310) and a speaker (302) disposed in the second housing (320). In some embodiments, the input device (303), the audio output device (301, 302), and the connector port (307) are disposed in a space provided in the first housing (310) and / or the second housing (320) of the electronic device (300) and can be exposed to the external environment through at least one hole formed in the first housing (310) and / or the second housing (320). In one embodiment, the at least one connector port (307) can be used to transmit and receive power and / or data with an external electronic device. In some embodiments, the at least one connector port (e.g., an ear jack hole) can also accommodate a connector (e.g., an ear jack) for transmitting and receiving audio signals with the external electronic device. In some embodiments, the hole formed in the first housing (310) and / or the second housing (320) can be used in common for the input device (303) and the audio output device (301, 302). In some embodiments, the audio output device (301, 302) may include a speaker (e.g., a piezo speaker) that operates without the holes formed in the first housing (310) and / or the second housing (320).

[0073] According to various embodiments, the sensor module (304) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (300) or an external environmental state. The sensor module (304) may detect an external environment, for example, through a first surface (311) of the first housing (310). In some embodiments, the electronic device (300) may further include at least one sensor module arranged to detect an external environment through a second surface (312) of the first housing (310). In one embodiment, the sensor module (304) (e.g., an illuminance sensor) may be arranged under the first display (330) to detect an external environment through the first display (330). In one embodiment, the sensor module (304) may include at least one of a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, an ambient light sensor, a proximity sensor, a biometric sensor, an ultrasonic sensor, or an ambient light sensor.

[0074] According to various embodiments, the camera devices (305, 308) may include a first camera device (305) (e.g., a front camera device) disposed on a first side (311) of a first housing (310) and a second camera device (308) disposed on a second side (312) of the first housing (310). The electronic device (300) may further include a flash (309) disposed near the second camera device (308). In one embodiment, the camera devices (305, 308) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (309) may include, for example, a light emitting diode or a xenon lamp. In one embodiment, the camera devices (305, 308) may be arranged such that two or more lenses (e.g., a wide-angle lens, an ultra-wide-angle lens, or a telephoto lens) and image sensors are positioned on one side of the electronic device (300) (e.g., a first side (311), a second side (312), a third side (321), or a fourth side (322)). In some embodiments, the camera devices (305, 308) may also include lenses and / or image sensors for time of flight (TOF).

[0075] According to various embodiments, the key input device (306) (e.g., a key button) may be disposed on a third side (313c) of the first side member (313) of the first housing (310). In some embodiments, the key input device (306) may also be disposed on at least one of the other sides (313a, 313b) of the first housing (310) and / or the sides (323a, 323b, 323c) of the second housing (320). In some embodiments, the electronic device (300) may not include some or all of the key input devices (306), and the key input devices (306) that are not included may be implemented in another form, such as a soft key, on the first display (330). In some embodiments, the key input device (306) may be implemented using a pressure sensor included in the first display (330).

[0076] According to various embodiments, some of the camera devices (305, 308) (e.g., the first camera device (305)) or the sensor module (304) may be arranged to be exposed through the first display (330). For example, the first camera device (305) or the sensor module (304) may be arranged to be in contact with the external environment through an opening (e.g., a through hole) at least partially formed in the first display (330) in the internal space of the electronic device (300). In another embodiment, some of the sensor modules (304) may be arranged to perform their functions without being visually exposed through the first display (330) in the internal space of the electronic device (300). For example, in this case, the opening may be omitted from the area of ​​the first display (330) that faces the sensor module (304).

[0077] Referring to FIG. 3B, the electronic device (300) may be operated to maintain an intermediate state via the hinge module (340). In one embodiment, in the intermediate state, the electronic device (300) may control the first display (330) to display different contents on the display area corresponding to the first side (311) and the display area corresponding to the third side (321). In one embodiment, the electronic device (300) may be operated in a substantially unfolded state (e.g., the unfolded state of FIG. 2A) and / or a substantially folded state (e.g., the folded state of FIG. 3A) based on a certain inflection angle (e.g., the angle between the first housing (310) and the second housing (320) when in the intermediate state) via the hinge module (340). For example, the electronic device (300) may be operated to transition to an unfolded state (e.g., the unfolded state of FIG. 2a) when a pressure is applied in the unfolding direction (R1 direction) from an intermediate state in which the device is unfolded at a certain inflection angle through the hinge module (340). For example, the electronic device (300) may be operated to transition to a closed state (e.g., the folded state of FIG. 3a) when a pressure is applied in the folding direction (R2 direction) from an intermediate state in which the device is unfolded at a certain inflection angle through the hinge module (340). In one embodiment, the electronic device (300) may be operated to maintain an unfolded state (not shown) at various angles through the hinge module (340).

[0078] According to various embodiments, the first side member (313) and the second side member (323) may be formed at least partially of a conductive material (e.g., metal) to include at least one antenna operating in at least one frequency band.

[0079] According to various embodiments, the electronic device (300) may include a first conductive portion (211) disposed on at least a portion of a fourth side (323a) of a second side member (323), a second conductive portion (212) disposed on at least a portion of a first side (313a) of the first side member (313) and positioned so as to be at least partially aligned with (e.g., facing) the first conductive portion (211) when folded, and a third conductive portion (213) disposed on one side of the second conductive portion (212). In one embodiment, the first conductive portion (212) may be disposed through a first non-conductive portion (231) (e.g., a gap, a segment, or a space) and a second non-conductive portion (232) spaced apart from the fourth side (323a). In one embodiment, the second conductive portion (212) may be disposed through a third non-conductive portion (233) and a fourth non-conductive portion (234) spaced apart from the first side (313a). In one embodiment, in a folded state, the first non-conductive portion (231) may be aligned with (e.g., overlaps with) the third non-conductive portion (233), and the second non-conductive portion (232) may be aligned with (e.g., overlaps with) the fourth non-conductive portion (234). In some embodiments, in a folded state, the first non-conductive portion (231) and the second non-conductive portion (232) may not overlap with the third non-conductive portion (233) and the fourth non-conductive portion (234), respectively.

[0080] According to various embodiments, the third conductive portion (213) may be spaced apart from the third non-conductive portion (333) and disposed through the fifth non-conductive portion (335) disposed on the second side (313b). Accordingly, the third conductive portion (213) may include a corner where the first side (313a) and the second side (313b) meet. In some embodiments, the third conductive portion (213) may also be disposed on the first side (313a). In one embodiment, the electronic device (300) may include a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) disposed in an internal space (e.g., the first space (3101) and / or the second space (3201)). In one embodiment, the wireless communication circuit (192) may be disposed on a first substrate (e.g., the first substrate (361) of FIG. 4) disposed in an internal space (e.g., the first space (3101)) of the first housing (310). In one embodiment, the wireless communication circuit (192) may be electrically connected to a second substrate (e.g., the second substrate (362) of FIG. 4) disposed in a second space (3201) of the second housing (320).

[0081] According to various embodiments, the first conductive portion (211) may be electrically connected to the wireless communication circuit (192) to operate as a first antenna (A1) (e.g., a first radiator) configured to transmit and / or receive a wireless signal in a first frequency band. In one embodiment, the first conductive portion (211) may be electrically connected to a second substrate (e.g., the second substrate (362) of FIG. 4). In one embodiment, the third conductive portion (213) may be electrically connected to the wireless communication circuit (192) to operate as a second antenna (A2) (e.g., a second radiator) configured to transmit and / or receive a wireless signal in a second frequency band. In one embodiment, the second conductive portion (212) may also be electrically connected to the wireless communication circuit (192) to operate as a third antenna (A3) (e.g., a third radiator) configured to transmit and / or receive a wireless signal in a third frequency band. In one embodiment, the second conductive portion (212) and the third conductive portion (213) may be electrically connected to a first substrate (e.g., the first substrate (361) of FIG. 4). In some embodiments, the second conductive portion (212) may not be connected to the wireless communication circuit (192) and may simply be arranged as a conductor. In some embodiments, the first antenna (A1) may include at least a portion of the first conductive portion (211) and a fourth conductive portion (214) connected to the first conductive portion (211) by the first non-conductive portion (231).

[0082] According to various embodiments, the electronic device (300) may include a fourth conductive portion (214) spaced apart from the first non-conductive portion (231) and disposed through a sixth non-conductive portion (236) disposed on a portion of the fifth side (323b). In one embodiment, the fourth conductive portion (214) may include a corner where the fourth side (323a) and the fifth side (323b) meet. In one embodiment, when the electronic device (300) is in a folded state, the third conductive portion (213) and the fourth conductive portion (214) may be disposed such that they are at least partially aligned (e.g., overlap).

[0083] According to various embodiments, the electronic device (300) may include a fifth conductive portion (215) spaced apart from the second non-conductive portion (232) and disposed through a seventh non-conductive portion (237) disposed on a portion of the sixth side (323c). In one embodiment, the fifth conductive portion (215) may include a corner where the fourth side (323a) and the sixth side (323c) meet. In one embodiment, the electronic device (300) may include a sixth conductive portion (216) spaced apart from the fourth non-conductive portion (234) and disposed through an eighth non-conductive portion (238) disposed on a portion of the third side (313c). In one embodiment, the sixth conductive portion (216) may include a corner where the first side (313a) and the third side (313c) meet. In one embodiment, when the electronic device (300) is in a folded state, the fifth conductive portion (215) and the sixth conductive portion (216) may be positioned so as to be at least partially aligned (e.g., overlapped).

[0084] According to various embodiments, the electronic device (300) may include a seventh conductive portion (217) disposed through a ninth non-conductive portion (239) spaced apart from the sixth non-conductive portion (236) on the fifth side (323b). In one embodiment, the electronic device (300) may include an eighth conductive portion (218) disposed through a tenth non-conductive portion (240) spaced apart from the fifth non-conductive portion (235) on the second side (313b). In one embodiment, when the electronic device (300) is in a folded state, the seventh conductive portion (217) and the eighth conductive portion (218) may be disposed such that they are at least partially aligned (e.g., overlap).

[0085] According to various embodiments, the electronic device (300) may include a ninth conductive portion (219) disposed through an eleventh non-conductive portion (241) spaced apart from a seventh non-conductive portion (237) on the sixth side (323c). In one embodiment, the electronic device (300) may include a tenth conductive portion (220) disposed through a twelfth non-conductive portion (242) spaced apart from an eighth non-conductive portion (238) on the third side (313c). In one embodiment, when the electronic device is in a folded state, the ninth conductive portion (219) and the tenth conductive portion (220) may be disposed such that they are at least partially aligned (e.g., overlap). In some embodiments, at least one of the fourth through tenth conductive portions (214, 215, 216, 217, 218, 219, 220) may be omitted.

[0086] According to various embodiments, the non-conductive portions (231, 232, 233, 234, 235, 236, 237, 238, 239, 240, 241, 242) may be defined as gaps, openings or segments disposed between the conductive portions (211, 212, 213, 214, 215, 216, 217, 218, 219, 220). In one embodiment, the non-conductive portions (231, 232, 233, 234, 235, 236, 237, 238, 239, 240, 241, 242) may include a polymer that is bonded to the conductive portions (211, 212, 213, 214, 215, 216, 217, 218, 219, 220) via injection. In some embodiments, the non-conductive portions (231, 232, 233, 234, 235, 236, 237, 238, 239, 240, 241, 242) may be arranged to be invisible from the outside through a painting process together with the conductive portions (211, 212, 213, 214, 215, 216, 217, 218, 219, 220). In some embodiments, at least one of the fourth to tenth conductive portions (214, 215, 216, 217, 218, 219, 220) may also be electrically connected to the wireless communication circuitry (192) so as to operate as at least one antenna configured to transmit and / or receive wireless signals in various frequency bands. The antennas configured to operate via the first antenna (A1), the second antenna (A2), the third antenna (A3) or other conductive parts (214, 215, 216, 217, 218, 219, 220) are configured to operate in a low band of about 600 MHz to 960 MHz, a mid band of about 1700 MHz to 2200 MHz, a high band of about 2300 MHz to 2800 MHz, a sub-6 band of about 5 GHz to 6 GHz, and a sub-6 band of about 3.2 GHz to 4.It can operate in at least one of the frequency bands of 5GHz UHB band, BT (bluetooth), GPS (global positioning system), or WiFi (wireless fidelity).

[0087] According to various embodiments, the first antenna (A1) operating through the first conductive portion (211) may be changed to have a different phase from the third antenna (A3) operating through the second conductive portion (212) by coming into proximity with the third antenna (A3) when the electronic device (300) transitions to a folded state (e.g., a first state). An unintentional phase change of the first antenna (A1) may reduce radiation performance (e.g., gain).

[0088] An electronic device (300) according to an exemplary embodiment of the present disclosure may include a phase shift induction circuit (e.g., a phase shift induction circuit, a phase shift induction circuit, or a phase shift induction circuit) (e.g., a phase shift induction circuit (250) of FIG. 5) disposed on a first substrate (e.g., a first substrate (361) of FIG. 4) and electrically connected to a third conductive portion (213). In one embodiment, a processor of the electronic device (300) (e.g., a processor (120) of FIG. 1) may control the phase shift induction circuit (240) in a folded state of the electronic device (300), thereby changing the phase of a second antenna (A2) operating through the third conductive portion (213). In one embodiment, the phase of the third antenna (A3), which is arranged adjacent to the second antenna (A2) and overlaps the first antenna (A1) in a folded state, can be changed to have the same phase as the first antenna (A1), and through this phase adjustment, the radiation performance of the first antenna (A1) can be improved. In some embodiments, when the processor (120) of the electronic device (300) detects that the phases of the first antenna (A1) and the third antenna (A3) do not match based on phase information detected through the coupler in the folded state, the processor (120) of the electronic device (300) can control the phase change induction circuit (250) to change the phase of the second antenna (A2), thereby inducing a phase change of the third antenna (A3). By changing the third antenna (A3) and the first antenna (A1) to be in phase, the degradation of the radiation performance of the first antenna (A1) can be reduced. In one embodiment, the processor (120) of the electronic device (300) can, in the unfolded state, control the phase change induction circuit (250) to change the phase again to have the best radiation performance for the second antenna (A2).

[0089] FIG. 4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.

[0090] Referring to FIG. 4, the electronic device (300) may include a first side member (313) (e.g., a first side frame or a first side bezel), a second side member (323) (e.g., a second side frame or a second side bezel), and a hinge module (340) (e.g., a hinge device, a hinge structure, or a hinge assembly) that rotatably connects the first side member (213) and the second side member (223). In one embodiment, the electronic device (300) may include a first extension member (3131) that extends at least partially from the first side member (313), or a second extension member (3231) that extends at least partially from the second side member (323). In one embodiment, the first extension member (3131) may include a first face (3131a) facing the front direction of the electronic device (300) (e.g., in the z-axis direction) and a second face (3131b) facing in a direction opposite to the first face (3131a) (e.g., in the -z-axis direction). In one embodiment, the second extension member (3231) may include a third face (3231a) facing in the front direction (e.g., in the z-axis direction) and a fourth face (3231b) facing in a direction opposite to the third face (3231a) (e.g., in the -z-axis direction). In one embodiment, the first extension member (3131) may be formed integrally with the first side member (313) or may be structurally coupled with the first side member (313). In one embodiment, the second extension member (3231) may be formed integrally with the second side member (323) or structurally coupled with the second side member (323). In one embodiment, the electronic device (300) may include a first display (330) (e.g., a flexible display) arranged to be supported by a first side (3131a) of the first extension member (3131) and a third side (3231a) of the second extension member (3231).In one embodiment, the electronic device (300) may include a first back cover (314) coupled with the first side member (313) and providing a first space (e.g., the first space (3101) of FIG. 2B) between the first side member (313) and the second side member (323) and providing a second space (e.g., the second space (3201) of FIG. 2B) between the second side member (323) and the fourth side member (3231) of the second extension member (3231). In one embodiment, the electronic device (300) may include a first housing (e.g., the first housing (310) of FIG. 2A) (e.g., a first housing structure) provided through the first side member (313), the first extension member (3131), and the first back cover (314). In one embodiment, the electronic device (300) may include a second housing (e.g., the second housing (320) of FIG. 2A) (e.g., a second housing structure) provided through a second side member (323), a second extension member (3231), and a second rear cover (324). In one embodiment, the electronic device (300) may include a second display (350) (e.g., a sub-display) positioned between the first rear cover (314) and a second side (3131b) of the first extension member (3131) so as to be visible from the outside through at least a portion of the first rear cover (314).

[0091] According to various embodiments, the electronic device (300) may include a first substrate (361) (e.g., a first printed circuit board (PCB) or main printed circuit board) disposed in a first space between a first side member (313) and a first rear cover (314), a camera assembly (363), a first battery (371), or a first bracket (351). In one embodiment, the camera assembly (363) may include a plurality of camera devices (e.g., camera devices (305, 308) of FIGS. 2A and 3A) and may be electrically connected to the first substrate (361). In one embodiment, the first bracket (351) may provide a support structure and enhanced rigidity for supporting the first substrate (361) and / or the camera assembly (363).

[0092] According to various embodiments, the electronic device (300) may include a second substrate (362) (e.g., a second PCB or sub-printed circuit board), a conductive coil (390) (e.g., an antenna member), a second battery (372), or a second bracket (352) disposed in a second space between the second side member (323) and the second rear cover (324). In one embodiment, the electronic device (300) may include a wiring member (380) (e.g., a flexible printed circuit board (FPCB)) that extends from the first substrate (361) across the hinge module (340) to a plurality of electrical components (e.g., a second substrate (362), a second battery (372), or a conductive coil (390)) disposed between the second side member (323) and the second rear cover (324) and provides an electrical connection. In one embodiment, the conductive coil (390) may operate as at least one of a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The conductive coil (390) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging.

[0093] According to various embodiments, the electronic device (300) may include a hinge housing (341) (e.g., a hinge cover) that supports the hinge module (340) and is exposed to the outside when the electronic device (300) is in a folded state (e.g., the folded state of FIG. 3A) and is positioned so as to be invisible from the outside by being introduced into the first space and / or the second space when the electronic device (300) is in an unfolded state (e.g., the unfolded state of FIG. 2A).

[0094] According to various embodiments, the electronic device (300) may include a first protective cover (315) coupled along an edge of the first side member (313). In one embodiment, the electronic device (300) may include a second protective cover (325) coupled along an edge of the second side member (323). In one embodiment, the first display (330) may have an edge (e.g., an edge) of a first planar portion (e.g., a first portion (330a) of FIG. 3B) protected by the first protective cover (315). In one embodiment, the first display (330) may have an edge (e.g., an edge) of a second planar portion (e.g., a second portion (330b) of FIG. 3B) protected by the second protective cover (325). In one embodiment, the electronic device (300) may include a protective cap (335) positioned to protect an edge of a flexible portion (e.g., the third portion (330c) of FIG. 3B) corresponding to a hinge module (340) of the first display (330). In some embodiments, the protective cap (335) and / or the protective covers (315, 325) may be omitted.

[0095] FIG. 5 is a schematic diagram of an electronic device including an antenna arrangement structure according to various embodiments of the present disclosure.

[0096] Referring to FIG. 5, an electronic device (300) (e.g., the electronic device (101) of FIG. 1 or the electronic device (300) of FIG. 2a) may include a first housing (310) including a first side member (313), a second housing (320) rotatably coupled to the first housing (310) via a hinge module (e.g., the hinge module (340) of FIG. 2b), and including a second side member (323). In one embodiment, the first side member (313) may include a first side member (313a), a second side member (313b) extending from one end of the first side member (313a), and a third side member (313c) extending from the other end of the first side member (313a). In one embodiment, the second side member (323) may include a fourth side (323a), a fifth side (323b) extending from one end of the fourth side (323a), and a sixth side (323c) extending from the other end of the fourth side (323a). In one embodiment, in a folded state, the first side (313a), the second side (313b), and the third side (313c) may be arranged to face the fourth side (323a), the fifth side (323b), and the sixth side (323c), respectively. In one embodiment, in an unfolded state, the second side (313b) and the fifth side (323b) may form the same side of the electronic device (300) (e.g., the left side when the flexible display is viewed from above). In one embodiment, in the unfolded state, the third side (313c) and the sixth side (323c) may form the same side of the electronic device (300) (e.g., the right side when the flexible display is viewed from above).

[0097] According to various embodiments, the electronic device (300) may include a first conductive portion (211) disposed on at least a portion of a fourth side (323a) of a second side member (323), a second conductive portion (212) disposed on at least a portion of a first side (313a) of the first side member (313) and positioned so as to be at least partially aligned with (e.g., facing) the first conductive portion (211) when folded, and a third conductive portion (213) disposed on one side of the second conductive portion (212). In one embodiment, the first conductive portion (212) may be disposed through a first non-conductive portion (231) and a second non-conductive portion (232) spaced apart from the fourth side (323a). In one embodiment, the second conductive portion (212) may be disposed through a third non-conductive portion (233) and a fourth non-conductive portion (234) spaced apart from the first side (313a). In one embodiment, in a folded state, the first non-conductive portion (231) may be aligned with (e.g., overlaps with) the third non-conductive portion (233), and the second non-conductive portion (232) may be aligned with (e.g., overlaps with) the fourth non-conductive portion (234). In some embodiments, in a folded state, the first non-conductive portion (231) and the second non-conductive portion (232) may not overlap with the third non-conductive portion (233) and the fourth non-conductive portion (234), respectively. In some embodiments, in the folded state, the first non-conductive portion (231) may overlap with the third non-conductive portion (233), and the second non-conductive portion (232) may not overlap with the fourth non-conductive portion (234). In some embodiments, in the folded state, the first non-conductive portion (231) may not overlap with the third non-conductive portion (233), and the second non-conductive portion (232) may overlap with the fourth non-conductive portion (234). In one embodiment, the first conductive portion (211) may be arranged to overlap with the second conductive portion (212) in the folded state.In some embodiments, the first conductive portion (211) may be positioned so that, in the folded state, it is at least partially out of alignment with (e.g., not overlapping with) the second conductive portion (212).

[0098] According to various embodiments, the third conductive portion (213) may be spaced apart from the third non-conductive portion (233) and disposed through a fifth non-conductive portion (235) disposed on the second side (313b). Accordingly, the third conductive portion (213) may include a corner where the first side (313a) and the second side (313b) meet. In one embodiment, the electronic device (300) may include a fourth conductive portion (214) spaced apart from the first non-conductive portion (231) and disposed through a sixth non-conductive portion (236) disposed on a portion of the fifth side (323b). In one embodiment, the fourth conductive portion (214) may include a corner where the fourth side (323a) and the fifth side (323b) meet. In one embodiment, when the electronic device (300) is in a folded state, the third conductive portion (213) and the fourth conductive portion (214) may be positioned so as to be at least partially aligned (e.g., overlapped).

[0099] In one embodiment, the first point (L1) may be positioned closer to the first non-conductive portion (231) than to the second non-conductive portion (232). In one embodiment, the first conductive portion (211) and the fourth conductive portion (214) may be positioned so as to be coupled, or may be connected via separate connection circuits (e.g., a variable circuit and / or a switchable ground (e.g., an X-ground)). In one embodiment, the first frequency band may include a range of about 600 MHz to 960 MHz (e.g., a low band) and / or a range of about 1700 MHz to 2200 MHz (e.g., a mid band).

[0100] According to various embodiments, the electronic device (300) may include a second antenna (A2) configured to operate in at least one second frequency band by being electrically connected to the wireless communication circuit (F) at a second point (L2) of the third conductive portion (213). In one embodiment, the second point (L2) may be located closer to the fifth non-conductive portion (235) than to the third non-conductive portion (232). In one embodiment, the second frequency band may include a range of about 2 GHz to 5.5 GHz.

[0101] According to various embodiments, the electronic device (300) may include a third antenna (A3) configured to operate in at least one third frequency band by being electrically connected to the wireless communication circuit (F) at a third point (L3) of the second conductive portion (212). In one embodiment, the third point (L3) may be located closer to the third non-conductive portion (233) than to the fourth non-conductive portion (234). In one embodiment, the third frequency band may include a range of about 600 MHz to 960 MHz (e.g., low band) and / or a range of about 1700 MHz to 2200 MHz (e.g., mid band). In some embodiments, the second conductive portion (212) may not be connected to the wireless communication circuit (F) and may be disposed as a conductor.

[0102] According to various embodiments, the electronic device (300) may include a phase shift inducing circuit (250) disposed in an electrical path (2501) (e.g., a wire or a trace) connecting a fourth point (L4) of the third conductive portion (213) and a ground (G) of the first substrate (361), and controlled by a processor (e.g., the processor (120) of FIG. 1) of the electronic device (300). In one embodiment, the phase shift inducing circuit (250) is electrically connected to the fourth point (L4), which is an end of the third conductive portion (213) adjacent to the third non-conductive portion (233), thereby inducing the third antenna (A3) to be easily influenced by a phase shift of the second antenna (A2) through the phase shift inducing circuit (250).

[0103] According to various embodiments, the phase shift induction circuit (250) may be disposed on the first substrate (361) in the first space (3101) of the first housing (310). In one embodiment, the electronic device (300) may, in a folded state, detect the phases of the first antenna (A1) and the third antenna (A3) through the coupler, and, if the detected phases are not the same, control the phase shift induction circuit (250) to change them to be in phase. For example, the phase of the third antenna (A3) may be changed to be in phase with the first antenna (A1) through the phase of the second antenna (A2) changed through the control of the phase shift induction circuit (250). In this case, the second antenna (A2) may be set to operate in a frequency band (e.g., approximately 2. GHz to 5.5 GHz) that is less affected by radiation performance even when the phase is changed in the folded state. In one embodiment, the electronic device (300) can control the phase shift induction circuit (250) so that the second antenna (A2) has optimized radiation performance in the unfolded state.

[0104] According to various embodiments, the first antenna (A1) may be electrically connected to the wireless communication circuit (F) at a first point (L1) that is closer to the first non-conductive portion (231) than to the second non-conductive portion (232), thereby having a first signal flow (EP1) formed in a direction (e.g., x-axis direction) from the first non-conductive portion (231) to the second non-conductive portion (232). In one embodiment, in order to change the phase of the first antenna (A1), the direction of the second signal flow (EP2) of the second antenna (A2) may be set to be substantially the same as the direction of the first signal flow (EP1) of the first antenna (A1). In one embodiment, in order to change the phase of the first antenna (A1), the direction of the third signal flow (EP3) of the third antenna (A3) may also be set to be substantially the same as the direction of the first signal flow (EP1). In some embodiments, the direction of the third signal flow (EP3) of the third antenna (A3) may be set to be opposite to the direction of the first signal flow (EP1).

[0105] According to various embodiments, the electronic device (300) may include an electrical path (2502) connecting the first conductive portion (211) and the fourth conductive portion (214) to form a first signal flow (EP1) of the first antenna (A1) through at least a portion of the first conductive portion (211) and at least a portion of the fourth conductive portion (214). In one embodiment, the electrical path (2502) may be formed on the second substrate (362). In one embodiment, the electronic device (300) may include a variable circuit (2503) (e.g., a matching circuit, a switch, or a switching circuit) disposed in the electrical path (2502). In one embodiment, the first antenna (A1) may be configured such that the length of the first signal flow (EP1) is adjusted or the operating frequency band is shifted through the variable circuit (2503).

[0106] For example, when the first conductive portion (211) and the fourth conductive portion (214) are electromagnetically connected to each other through the variable circuit (2503), they can be operated as an antenna (A1) having a length of the first signal flow (EP1). In some embodiments, the fourth conductive portion (214) can be configured to operate as another antenna through a separate power supply when it transitions to a state in which it is electrically disconnected from the first conductive portion (211) through the variable circuit (2503). In some embodiments, the first conductive portion (211) can be configured to have a signal flow length that is shorter than the length of the first signal flow (EP1) of FIG. 5 (e.g., the length of the signal flow (EP1) of FIG. 10) when it transitions to a state in which it is electrically disconnected from the fourth conductive portion (214) through the variable circuit (2503).

[0107] FIG. 6 is a diagram illustrating a phase change induction circuit according to various embodiments of the present disclosure.

[0108] Referring to FIG. 6, an electronic device (e.g., an electronic device (300) of FIG. 5) may include a phase shift induction circuit (250) electrically connecting a third conductive portion (213) and a ground (G) of a first substrate (e.g., a first substrate (361) of FIG. 5). In one embodiment, the phase shift induction circuit (250) may include a switch (253) (e.g., a switching circuit) under the control of a processor (120), a first element group (251) (e.g., a first passive element group) electrically connected to the switch (253), and a second element group (252) (e.g., a second passive element group) electrically connected to the switch (253). In one embodiment, the first element group (251) may include a plurality of inductors (L1, L2, L3...Ln) having different inductance values. In one embodiment, the second element group (252) may include a plurality of capacitors (C1, C2, C3...Cn) having different capacitance values. In one embodiment, the processor (120) may electrically connect the third conductive portion (213) and the ground (G) of the first substrate (361) through at least one inductor having an inductance value of any one of the first element group (251) and / or at least one capacitor having a capacitance value of any one of the second element group (252) by controlling the switch (253). For example, the processor (120) may detect the phases of the first antenna (A1) and the third antenna (A3) through the coupler in a folded state, and control the switch (253) to change them to the same phase if the detected phases are not the same. For example, the phase of the third antenna (A3) can be changed by connecting at least one inductor having a specific inductance value and / or at least one capacitor having a specific capacitance value to the third conductive portion (213) through control of the switch (253).In one embodiment, the phase of the third antenna (A3) can be changed to the same phase as that of the first antenna (A1) through the changed phase of the second antenna (A2). Accordingly, the first antenna (A1) can be influenced less by the second conductive portion (212), thereby helping to improve radiation performance.

[0109] FIG. 7A is a graph showing a phase change of a second antenna according to a change in the inductance value of an inductor of a phase shift induction circuit according to various embodiments of the present disclosure. FIG. 7B is a graph showing a phase change of a second antenna according to a change in the capacitance value of a capacitor of a phase shift induction circuit according to various embodiments of the present disclosure. FIG. 7C is a graph showing a phase change of a second antenna according to a change in the capacitance value of a capacitor and the inductance value of an inductor of a phase shift induction circuit according to various embodiments of the present disclosure.

[0110] Referring to Fig. 7a, the phase of the second antenna (A2) can be changed by being electrically connected to at least one inductor among the plurality of inductors (L1, L2, L3...Ln) of the phase change induction circuit (250). For example, the second antenna (A2) can be shifted to a high frequency band as the inductance value of the inductor increases.

[0111] Referring to Fig. 7b, the phase of the second antenna (A2) can be changed by being electrically connected to at least one capacitor among the plurality of capacitors (C1, C2, C3...Cn) of the phase change induction circuit (250). For example, the second antenna (A2) can be moved to a low frequency band as the capacitance value of the capacitor increases.

[0112] Referring to FIG. 7c, the second antenna (A2) can be adjusted to have a phase of a specific frequency band (e.g., GPS band) through a combination of at least one capacitor and / or at least one inductor of the phase change induction circuit (250). This may mean that the phase of the second antenna (A2) can be freely adjusted through the phase change induction circuit (250).

[0113] FIG. 8A is a graph comparing changes in radiation performance of a first antenna before and after a phase change of a second antenna according to various embodiments of the present disclosure.

[0114] Referring to FIG. 8A, in the folded state of the electronic device (300), when the second antenna (A2) is controlled by the phase shift induction circuit (250) (e.g., graph 802) compared to when the phase shift induction circuit (250) is not present (e.g., graph 801), it can be confirmed that the radiation performance (e.g., gain) of the first antenna (A1) is relatively improved in a specific frequency band (e.g., region 8101 and region 8102) (e.g., low band (approximately 600 MHz to 960 MHz)). This may mean that the changed phase of the second antenna (A2) through the control of the phase shift induction circuit (250) can induce an improvement in the radiation performance of the first antenna (A1) by changing the phase of the third antenna (A3) adjacent to the second antenna (A2) to be substantially identical to the phase of the first antenna (A1).

[0115] FIG. 8b and FIG. 8c are diagrams comparing the current distribution of the third antenna before and after the phase change of the second antenna according to various embodiments of the present disclosure.

[0116] Referring to FIG. 8b, in a folded state where the first antenna (A1) operating through the first conductive portion (211) and the fourth conductive portion (214) overlaps the second antenna (A2) operating through the third conductive portion (213) and the third antenna (A3) operating through the second conductive portion (212), when the phase change induction circuit (250) does not exist, it can be confirmed that the phase of the third antenna (A3) is different from the phase of the first antenna (A1). This may mean that the radiation performance of the first antenna (A1) may be reduced by the third antenna (A3) having a phase different from the phase of the first antenna (A1).

[0117] Referring to FIG. 8c, under the same conditions, when the phase of the second antenna (A2) is changed through the phase change induction circuit (250), it can be confirmed that the phase of the third antenna (A3) becomes identical to the phase of the first antenna (A1). This may mean that, through the phase change of the second antenna (A2), the phase of the third antenna (A3) can be changed to be substantially identical to the phase of the first antenna (A1), thereby improving the radiation performance of the first antenna (A1).

[0118] FIG. 9A is a graph comparing changes in radiation performance of a first antenna before and after a phase change of a second antenna according to various embodiments of the present disclosure.

[0119] Referring to FIG. 9A, in the folded state of the electronic device (300), when there is no phase shift induction circuit (250) (e.g., graph 901), it can be confirmed that parasitic resonance is generated by the third antenna (A3) in the designated frequency band (e.g., mid band of approximately 1800 MHz band) of the first antenna (A1) (region 9101). In one embodiment, in the folded state of the electronic device (300), when the second antenna (A2) is under the control of the phase shift induction circuit (250) (e.g., graph 902), it can be confirmed that the parasitic resonance generated in the designated frequency band (e.g., mid band of approximately 1800 MHz band) of the first antenna (A1) is shifted to another frequency band (out band) (e.g., region 9102). This may mean that the changed phase of the second antenna (A2) through the control of the phase change induction circuit (250) can induce improvement in the radiation performance of the first antenna (A1) by changing the phase of the third antenna (A3) adjacent to the second antenna (A2) to be substantially identical to the phase of the first antenna (A1).

[0120] FIG. 9b and FIG. 9c are diagrams comparing the current distribution of the third antenna before and after the phase change of the second antenna according to various embodiments of the present disclosure.

[0121] Referring to FIG. 9b, in a folded state where the first antenna (A1) operating through the first conductive portion (211) and the fourth conductive portion (214) overlaps the second antenna (A2) operating through the third conductive portion (213) and the third antenna (A3) operating through the second conductive portion (212), when the phase change induction circuit (250) does not exist, it can be confirmed that the phase of the third antenna (A3) is different from the phase of the first antenna (A1). This may mean that the radiation performance of the first antenna (A1) may be reduced by the third antenna (A3) having a phase different from the phase of the first antenna (A1).

[0122] Referring to FIG. 9c, under the same conditions, when the phase of the second antenna (A2) is changed through the phase change induction circuit (250), it can be confirmed that the phase of the third antenna (A3) becomes identical to the phase of the first antenna (A1). This may mean that, through the phase change of the second antenna (A2), the phase of the third antenna (A3) can be changed to be substantially identical to the phase of the first antenna (A1), thereby improving the radiation performance of the first antenna (A1).

[0123] FIG. 10 is a schematic diagram of an electronic device including an antenna arrangement structure according to various embodiments of the present disclosure.

[0124] In describing the components of the electronic device (300) of FIG. 10, the same symbols are given to components that are substantially the same as the components of the electronic device (300) of FIG. 5, and a detailed description thereof may be omitted.

[0125] Referring to FIG. 10, the first antenna (A1) may be configured to operate only through the first conductive portion (211) disposed through the spaced first non-conductive portion (231) and second non-conductive portion (232) on the fourth side (323a) of the second side member (323). In this case, in the folded state, the first antenna (A1) may be arranged to overlap at least a portion of the second conductive portion (212) that operates as the third antenna (A3) on the first side member (313), and may not be arranged to overlap the third conductive portion (213) that operates as the second antenna (A2).

[0126] Even in this case, in the folded state, the third antenna (A3) can be influenced by the second antenna (A2) whose phase is changed through the control of the phase change induction circuit (250), thereby changing to substantially the same phase as the first antenna (A1), thereby helping to improve the radiation performance of the first antenna (A1).

[0127] FIG. 11A is a graph comparing changes in radiation performance of a first antenna before and after a phase change of a second antenna according to various embodiments of the present disclosure.

[0128] Referring to FIG. 11A, in the folded state of the electronic device (300), when the second antenna (A2) is controlled by the phase shift induction circuit (250) (e.g., graph 1102) compared to when the phase shift induction circuit (250) is not present (e.g., graph 1101), it can be confirmed that the radiation performance (e.g., gain) of the first antenna (A1) is relatively improved in a specific frequency band (e.g., region 1103 and region 1103) (e.g., low band (approximately 600 MHz to 960 MHz)). This may mean that the changed phase of the second antenna (A2) through the control of the phase shift induction circuit (250) can induce an improvement in the radiation performance of the first antenna (A1) by changing the phase of the third antenna (A3) adjacent to the second antenna (A2) to be substantially identical to the phase of the first antenna (A1).

[0129] FIG. 11b and FIG. 11c are diagrams comparing the current distribution of the third antenna before and after the phase change of the second antenna according to various embodiments of the present disclosure.

[0130] Referring to FIG. 11b, when the first antenna (A1) operating through the first conductive portion (211) is in a folded state overlapping the third antenna (A3) operating through the second conductive portion (212), and the phase change induction circuit (250) does not exist, it can be confirmed that the phase of the third antenna (A3) is different from the phase of the first antenna (A1). This may mean that the radiation performance of the first antenna (A1) may be reduced by the third antenna (A3) having a phase different from the phase of the first antenna (A1).

[0131] Referring to FIG. 11c, under the same conditions, when the phase of the second antenna (A2) is changed through the phase change induction circuit (250), it can be confirmed that the phase of the third antenna (A3) becomes identical to the phase of the first antenna (A1). This may mean that, through the phase change of the second antenna (A2), the phase of the third antenna (A3) can be changed to be substantially identical to the phase of the first antenna (A1), thereby improving the radiation performance of the first antenna (A1).

[0132] According to various embodiments, an electronic device includes a first housing (e.g., the first housing (310) of FIG. 5) including a first side member (e.g., the side member (313) of FIG. 5), a second side member (e.g., the second side member (323) of FIG. 5), a second housing (e.g., the second housing (320) of FIG. 5) rotatably connected to the first housing via a hinge module (e.g., the hinge module (340) of FIG. 2A), a first conductive portion (e.g., the first conductive portion (211) of FIG. 5) disposed through a portion of the second side member, a second conductive portion (e.g., the second conductive portion (212) of FIG. 5) disposed through a portion of the first side member and at least partially aligned with the first conductive portion in a folded state, and a third conductive portion (e.g., the second conductive portion (212) of FIG. 5) disposed near the second conductive portion via a portion of the first side member. 5) and a third conductive portion (213) of the first housing, a first substrate (e.g., the first substrate (361) of FIG. 5) disposed in the internal space of the first housing, a phase change induction circuit (e.g., the phase change induction circuit (250) of FIG. 5) disposed in an electrical path connecting the third conductive portion and the ground of the substrate in the first substrate, and a wireless communication circuit (e.g., the wireless communication circuit (F) of FIG. 5) disposed in the internal space of the electronic device and configured to transmit and / or receive a wireless signal through at least the first conductive portion and the third conductive portion, wherein in the folded state, the phase of the second conductive portion can be controlled through a phase change of the third conductive portion through control of the phase change induction circuit.

[0133] According to various embodiments, in the folded state, the phase of the second conductive portion adjusted through the phase change of the third conductive portion can be set to be substantially the same as the phase of the first conductive portion.

[0134] According to various embodiments, in the folded state, the direction of signal flow of the second conductive portion can be set to be substantially the same as the direction of signal flow of the first conductive portion.

[0135] According to various embodiments, in the folded state, the direction of the signal flow of the third conductive portion (e.g., the second signal flow (EP2) of FIG. 5) may be set to be substantially the same as the direction of the signal flow of the first conductive portion (e.g., the first signal flow (EP1) of FIG. 5).

[0136] According to various embodiments, in the folded state, the third conductive portion may be positioned so as not to overlap the first conductive portion.

[0137] According to various embodiments, in the folded state, the third conductive portion may be arranged to at least partially overlap the first conductive portion.

[0138] According to various embodiments, the phase shift induction circuit includes a switching circuit (e.g., a switch (253) of FIG. 6), a plurality of inductors having different inductance values ​​(e.g., a first element group (251) of FIG. 6) and a plurality of capacitors having different capacitance values ​​(e.g., a second element group (252) of FIG. 6), and the switching circuit may be configured to electrically connect the third conductive portion to the ground via at least one inductor among the plurality of inductors and / or at least one capacitor among the plurality of capacitors.

[0139] According to various embodiments, when a folding state of the electronic device is detected, the electronic device may include at least one processor (e.g., processor (120) of FIG. 6) that controls the phase change induction circuit so that the phase of the second conductive portion is set to be substantially the same phase as the phase of the first conductive portion.

[0140] According to various embodiments, the wireless communication circuit may be configured to transmit and / or receive a wireless signal via the second conductive portion.

[0141] According to various embodiments, the wireless communication circuit may be configured to transmit and / or receive a wireless signal in a frequency band ranging from 600 MHz to 2200 MHz via the first conductive portion and / or the second conductive portion.

[0142] According to various embodiments, the wireless communication circuit may be configured to transmit and / or receive a wireless signal in a frequency band ranging from 2 GHz to 5.5 GHz via the third conductive portion.

[0143] According to various embodiments, the first conductive portion is disposed through a first non-conductive portion (e.g., the first non-conductive portion (231) of FIG. 5) and a second non-conductive portion (e.g., the second non-conductive portion (232) of FIG. 5) that are spaced apart from each other in the second side member, and the wireless communication circuit can be electrically connected to the first conductive portion at a point (e.g., the first point (L1) of FIG. 5) that is closer to the first non-conductive portion than to the second non-conductive portion.

[0144] According to various embodiments, the second conductive portion is disposed through a third non-conductive portion (e.g., the third non-conductive portion (233) of FIG. 5) and a fourth non-conductive portion (e.g., the fourth non-conductive portion (234) of FIG. 5) that are spaced apart from the first side member, and in the folded state, the third non-conductive portion is aligned with the first non-conductive portion, the fourth non-conductive portion is aligned with the second non-conductive portion, and the wireless communication circuitry can be electrically connected to the second conductive portion at a point closer to the third non-conductive portion than to the fourth non-conductive portion (e.g., the third point (L3) of FIG. 5).

[0145] According to various embodiments, the third conductive portion is disposed through a fifth non-conductive portion (235) spaced apart from the third non-conductive portion in the first side member, and the wireless communication circuit can be electrically connected to the third conductive portion at a point closer to the fifth non-conductive portion than to the third non-conductive portion (e.g., the second point (L2) in FIG. 5).

[0146] According to various embodiments, the third conductive portion may be connected to the second conductive portion via the third non-conductive portion.

[0147] According to various embodiments, the phase change induction circuit may be electrically connected to an end of the third conductive portion adjacent to the third non-conductive portion (e.g., the fourth point (L4) in FIG. 5).

[0148] According to various embodiments, the second side member includes a fourth conductive portion (e.g., the fourth conductive portion (214) of FIG. 5) disposed through a sixth non-conductive portion (e.g., the sixth non-conductive portion (236) of FIG. 5) spaced apart from the first non-conductive portion, wherein the fourth conductive portion can be configured to transmit and / or receive a wireless signal together with the first conductive portion via a wireless communication circuit connected to the first point.

[0149] According to various embodiments, in the folded state, at least a portion of the fourth conductive portion may be arranged to overlap the third conductive portion.

[0150] According to various embodiments, the third conductive portion may be positioned to include a corner of the electronic device through a portion of a first side of the first side member (e.g., the first side (313a) of FIG. 5)) and a portion of a second side (e.g., the second side (313b) of FIG. 5) extending substantially perpendicularly from the portion of the first side.

[0151] According to various embodiments, the third conductive portion may be disposed as part of the first side of the first side member together with the second conductive portion.

[0152] In addition, the embodiments of the present disclosure disclosed in this specification and drawings are merely specific examples to easily explain the technical contents according to the embodiments of the present disclosure and to help understand the embodiments of the present disclosure, and are not intended to limit the scope of the embodiments of the present disclosure. Therefore, the scope of the various embodiments of the present disclosure should be interpreted as including all changes or modified forms derived based on the technical ideas of the various embodiments of the present disclosure in addition to the embodiments disclosed herein.

Claims

1. In electronic devices, A first housing (310) including a first side member (313); A second housing (320) including a second side member (323) and rotatably connected to the first housing through a hinge module (340); A first conductive portion (211) disposed through a portion of the second side member; A second conductive portion (212) disposed through a portion of the first side member and, in a folded state, at least partially aligned with the first conductive portion; A third conductive portion (213) disposed near the second conductive portion through a portion of the first side member; A first substrate (361) placed in the internal space of the first housing; In the first substrate, a phase change induction circuit (250) arranged in an electrical path connecting the third conductive portion and the ground of the substrate; and A wireless communication circuit (F) is disposed in the internal space of the electronic device and is configured to transmit and / or receive a wireless signal through at least the first conductive portion and the third conductive portion, An electronic device in which, in the above folded state, the phase of the second conductive portion is controlled by changing the phase of the third conductive portion through control of the phase change induction circuit.

2. In paragraph 1, An electronic device in which, in the above folded state, the phase of the second conductive portion adjusted through the phase change of the third conductive portion is set to be substantially the same as the phase of the first conductive portion.

3. In paragraph 1, An electronic device in which, in the above folded state, the direction of the signal flow (EP3) of the second conductive portion is set to be substantially the same as the direction of the signal flow (EP1) of the first conductive portion.

4. In paragraph 1, An electronic device in which, in the above folded state, the direction of the signal flow (EP2) of the third conductive portion is set to be substantially the same as the direction of the signal flow (EP1) of the first conductive portion.

5. In paragraph 1, An electronic device in which, in the above folded state, the third conductive portion is positioned so as not to overlap the first conductive portion.

6. In paragraph 1, An electronic device in which, in the folded state, the third conductive portion is arranged to at least partially overlap the first conductive portion.

7. In paragraph 1, The above phase change induction circuit, Switching circuit (253); A plurality of inductors (251) having different inductance values; and Contains a plurality of capacitors (252) having different capacitance values, An electronic device wherein the switching circuit is configured to electrically connect the third conductive portion to the ground via at least one inductor among the plurality of inductors and / or at least one capacitor among the plurality of capacitors.

8. In paragraph 1, When the folding state of the above electronic device is detected, An electronic device comprising at least one processor (120) for controlling the phase change induction circuit so that the phase of the second conductive portion is set to be substantially the same phase as the phase of the first conductive portion.

9. In paragraph 1, The above wireless communication circuit is an electronic device configured to transmit and / or receive a wireless signal through the second conductive portion.

10. In paragraph 1, The wireless communication circuit is an electronic device configured to transmit and / or receive a wireless signal in a frequency band ranging from 600 MHz to 2200 MHz through the first conductive portion and / or the second conductive portion.

11. In paragraph 1, The wireless communication circuit is an electronic device configured to transmit and / or receive a wireless signal in a frequency band ranging from 2 GHz to 5.5 GHz through the third conductive portion.

12. In paragraph 1, The first conductive portion is arranged through the first non-conductive portion (231) and the second non-conductive portion (232) that are spaced apart from each other in the second side member, The wireless communication circuit is an electronic device electrically connected to the first conductive portion at a point (L1) closer to the first non-conductive portion than to the second non-conductive portion.

13. In paragraph 12, The second conductive portion is arranged through the third non-conductive portion (233) and the fourth non-conductive portion (234) spaced apart from the first side member, In the folded state, the third non-conductive portion is aligned with the first non-conductive portion, and the fourth non-conductive portion is aligned with the second non-conductive portion. The wireless communication circuit is an electronic device electrically connected to the second conductive portion at a point (L3) closer to the third non-conductive portion than to the fourth non-conductive portion.

14. In paragraph 13, The third conductive portion is arranged through a fifth non-conductive portion (235) spaced apart from the third non-conductive portion in the first side member, The wireless communication circuit is an electronic device electrically connected to the third conductive portion at a point (L2) closer to the fifth non-conductive portion than to the third non-conductive portion.

15. In paragraph 14, An electronic device wherein the third conductive portion is connected to the second conductive portion via the third non-conductive portion.

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