Electronic device including rear plate

Abstract

According to an embodiment of the present disclosure, an electronic device may be provided. The electronic device may comprise: a housing including a support structure and a rear plate disposed to face at least a portion of the support structure with a first gap interposed therebetween, the support structure including a first hole and a second hole formed around the first hole and connected to a first space in the housing; a socket disposed to close the first hole and the second hole and configured to be at least partially accommodated in the housing; an adhesive member coupled to the rear plate and the support structure, the adhesive member including a first adhesive member and a second adhesive member disposed in different sections of the first gap; and a handle coupled to the first adhesive member and accommodated in the first space while being folded at least once.

Description

Electronic device including back plate

[0001] The present disclosure relates to an electronic device including a back plate.

[0002] Advances in information and communication technology and semiconductor technology are integrating diverse functions into a single portable electronic device. For example, electronic devices can implement not only communication functions but also entertainment functions such as gaming, multimedia functions such as music and video playback, communication and security functions for mobile banking, or even calendar management and electronic wallet functions. These electronic devices are becoming smaller and more portable for users.

[0003] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] According to an embodiment of the present disclosure, an electronic device may be provided. The electronic device may include a housing including a support structure and a rear plate facing at least a portion of the support structure with a first gap interposed therebetween, the support structure including a first hole and a second hole formed around the first hole and connected to a first space within the housing, a socket arranged to close the first hole and the second hole and configured to be at least partially received within the housing, an adhesive member coupled to the rear plate and the support structure, the adhesive member including a first adhesive member and a second adhesive member disposed in different sections of the first gap, and a handle coupled to the first adhesive member and received in a folded state at least once within the first space.

[0005] According to an embodiment of the present disclosure, an electronic device may be provided. The electronic device may include a housing including a support structure and a rear plate facing at least a portion of the support structure with a first gap interposed therebetween, the support structure including a first hole and a second hole formed around the first hole and connected to a first space within the housing, a socket arranged to close the first hole and the second hole and configured to be at least partially received within the housing, an adhesive member coupled to the rear plate and the support structure, the adhesive member including a first adhesive member and a second adhesive member disposed at different sections of the first gap, and a handle coupled to the first adhesive member and received in a folded state at least once within the first space. The first adhesive member may include a first coupling structure, and the second adhesive member may include a second coupling structure having a shape that engages the first coupling structure and is spaced apart from the first coupling structure by a predetermined gap.

[0006] The above-described aspects or other aspects, configurations and / or advantages of one embodiment of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.

[0007] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment of the present disclosure.

[0008] FIG. 2 is a front perspective view of an electronic device according to one embodiment of the present disclosure.

[0009] FIG. 3 is a rear perspective view of an electronic device according to one embodiment of the present disclosure.

[0010] FIG. 4 is a front exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0011] FIG. 5 is a rear exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0012] FIG. 6 is an exploded perspective view of a portion of an electronic device according to one embodiment of the present disclosure.

[0013] FIG. 7 is an exploded perspective view of a portion of an electronic device according to one embodiment of the present disclosure.

[0014] FIG. 8A is a rear view of an electronic device according to one embodiment of the present disclosure.

[0015] FIG. 8b is a cross-sectional side view taken along line A-A' of FIG. 8a according to one embodiment of the present disclosure.

[0016] FIG. 8c is a cross-sectional perspective view taken along line A-A' of FIG. 8a according to one embodiment of the present disclosure.

[0017] FIG. 8d is a drawing for explaining a first hole, a second hole, a first space, and a guide pin of a support structure according to one embodiment of the present disclosure.

[0018] FIG. 9A is a front view showing a rear plate and an adhesive member of an electronic device according to one embodiment of the present disclosure.

[0019] FIG. 9b is an exploded perspective view of a rear plate and a removal structure of an electronic device according to one embodiment of the present disclosure.

[0020] FIG. 10 is an enlarged view illustrating an adhesive member disposed on a rear plate according to one embodiment of the present disclosure.

[0021] FIG. 11 is a plan view of a handle according to one embodiment of the present disclosure.

[0022] FIG. 12A is a drawing showing a socket partially inserted into a support structure of an electronic device according to one embodiment of the present disclosure.

[0023] FIG. 12b is a drawing showing a socket removed from an electronic device according to one embodiment of the present disclosure.

[0024] FIG. 12c is a drawing showing a handle of an electronic device in an unfolded state according to one embodiment of the present disclosure.

[0025] FIG. 12d is a drawing showing a state in which a handle and a first adhesive member are pulled out from a support structure according to one embodiment of the present disclosure.

[0026] FIG. 12e is a drawing showing a state in which a rear plate of an electronic device is separated from a support structure according to one embodiment of the present disclosure.

[0027] FIG. 13a is an exploded view of a handle and a first adhesive member according to one embodiment of the present disclosure.

[0028] FIG. 13b is an exploded view of a first release sheet and a second release sheet for a handle, a first adhesive member, and a second adhesive member according to one embodiment of the present disclosure.

[0029] FIG. 13c is an exploded view of a separation structure and a rear plate according to one embodiment of the present disclosure.

[0030] FIG. 13d is a perspective view showing a separation structure coupled to a rear plate according to one embodiment of the present disclosure.

[0031] FIG. 14a is a drawing for explaining a folding structure of a handle of a separation structure according to one embodiment of the present disclosure.

[0032] FIG. 14b is a drawing for explaining a structure for placing a folded handle in a first space of a support structure according to one embodiment of the present disclosure.

[0033] FIG. 14c is a drawing for explaining a structure for placing a folded handle in a first space of a support structure according to one embodiment of the present disclosure.

[0034] FIG. 15 may illustrate a method of coupling a separation structure to a support structure for re-coupling a rear plate according to one embodiment of the present disclosure.

[0035] FIG. 16A is a rear perspective view of an electronic device according to one embodiment of the present disclosure.

[0036] FIG. 16b is a partial cross-sectional side view of an electronic device according to one embodiment of the present disclosure.

[0037] FIG. 17A is a partial cross-sectional side view of an electronic device according to one embodiment of the present disclosure.

[0038] FIG. 17b is a partial cross-sectional side view of an electronic device according to one embodiment of the present disclosure.

[0039] FIG. 18A is a partial cross-sectional side view of an electronic device according to one embodiment of the present disclosure.

[0040] FIG. 18b is an exploded perspective view of a portion of an electronic device according to one embodiment of the present disclosure.

[0041] FIG. 18c is a plan view of a handle according to one embodiment of the present disclosure.

[0042] FIG. 18d is a view of the handle of FIG. 18c viewed from the opposite side according to one embodiment of the present disclosure.

[0043] FIG. 19A is a partial cross-sectional side view of an electronic device according to one embodiment of the present disclosure.

[0044] FIG. 19b is a drawing showing a first adhesive member and a handle in an unfolded state according to one embodiment of the present disclosure.

[0045] FIG. 19c is a drawing showing a first adhesive member and a handle in a folded state according to one embodiment of the present disclosure.

[0046] FIG. 20A is a partial cross-sectional side view of an electronic device according to one embodiment of the present disclosure.

[0047] FIG. 20b is a drawing showing a handle coupled to a support structure according to one embodiment of the present disclosure.

[0048] FIG. 20c is a drawing showing a handle completed by being connected to a support structure according to one embodiment of the present disclosure.

[0049] FIG. 20d is a drawing showing a state in which a rear plate is completely bonded to a support structure according to one embodiment of the present disclosure.

[0050] FIG. 21a is a rear view showing the separation direction of the socket and the arrangement of the first adhesive member for the rear plate according to one embodiment of the present disclosure.

[0051] FIG. 21b is a rear view showing the separation direction of the socket and the arrangement of the first adhesive member for the rear plate according to one embodiment of the present disclosure.

[0052] FIG. 21c is a rear view showing the separation direction of the socket and the arrangement of the first adhesive member for the rear plate according to one embodiment of the present disclosure.

[0053] FIG. 21d is a rear view showing the separation direction of the socket and the arrangement of the first adhesive member for the rear plate according to one embodiment of the present disclosure.

[0054] FIG. 21e is a rear view showing the separation direction of the socket and the arrangement of the first adhesive member for the rear plate according to one embodiment of the present disclosure.

[0055] FIG. 21f is a rear view showing the separation direction of the socket and the arrangement of the first adhesive member for the rear plate according to one embodiment of the present disclosure.

[0056] FIG. 22a is a rear view showing the arrangement of a first adhesive member on a rear plate according to one embodiment of the present disclosure.

[0057] FIG. 22b is a rear view showing the arrangement of the first adhesive member on the rear plate according to one embodiment of the present disclosure.

[0058] FIG. 22c is a rear view showing the arrangement of the first adhesive member on the rear plate according to one embodiment of the present disclosure.

[0059] Throughout the attached drawings, similar reference numbers may be assigned to similar parts, components and / or structures.

[0060] The following description, with reference to the accompanying drawings, is provided to facilitate a comprehensive understanding of various embodiments defined by the claims and their equivalents. While the following description includes numerous specific details to aid understanding, these should be considered merely illustrative. Accordingly, those skilled in the art will recognize that various modifications and variations of the various embodiments described herein may be made without departing from the scope of the present disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0061] The terms and words used in the following description and claims are not intended to be limited by their bibliographic meanings, but are merely used by the inventors to ensure a clear and consistent understanding of the disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various embodiments is provided solely for illustrative purposes, not for the purpose of limiting the invention, which is defined by the appended claims and their equivalents.

[0062] The singular forms "a," "an," and "the" should be understood to include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a surface of a part" includes reference to one or more of these surfaces.

[0063] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment of the present disclosure.

[0064] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In one embodiment, the electronic device (101) may have at least one of these components (e.g., the connection terminal (178)) omitted, or one or more other components added. In one embodiment, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0065] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0066] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0067] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0068] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0069] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0070] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0071] The display module (160) can visually provide information to an external device (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a hall area program device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0072] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0073] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0074] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0075] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0076] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0077] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0078] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0079] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0080] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0081] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0082] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In one embodiment, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0083] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0084] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0085] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0086] In the detailed description below, the longitudinal direction, the width direction, and / or the thickness direction of the electronic device may be mentioned, and the longitudinal direction may be defined as the 'Y-axis direction', the width direction as the 'X-axis direction', and / or the thickness direction as the 'Z-axis direction'. In one embodiment, with respect to the direction that a component is oriented, 'negative / positive (- / +)' may be mentioned together with the orthogonal coordinate system illustrated in the drawings. For example, the front of the electronic device or the housing may be defined as the 'side facing the +Z direction', and the back side may be defined as the 'side facing the -Z direction'. In one embodiment, the side of the electronic device or the housing may include a region facing the +X direction, a region facing the +Y direction, a region facing the -X direction, and / or a region facing the -Y direction. Also, in one embodiment, the 'X-axis direction' may mean both the '-X direction' and the '+X direction'. It should be noted that this is based on the orthogonal coordinate system illustrated in the drawings for the sake of brevity of description, and that the description of these directions or components does not limit one embodiment of the present disclosure. For example, the aforementioned front or rear facing direction may vary depending on whether the electronic device is unfolded or folded, and the aforementioned direction may be interpreted differently depending on the user's gripping habits.

[0087] FIG. 2 is a perspective view showing the front side of an electronic device according to one embodiment of the present disclosure. FIG. 3 is a perspective view showing the rear side of the electronic device illustrated in FIG. 2 according to one embodiment of the present disclosure. The configuration of the electronic device (101) of FIGS. 2 and 3 may be all or part of the same as the configuration of the electronic device (101) of FIG. 1.

[0088] Referring to FIGS. 2 and 3 , an electronic device (101) according to one embodiment may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In one embodiment (not shown), the housing (210) may refer to a structure that forms a portion of the first side (210A) of FIG. 2 , the second side (210B), and the side surface (210C) of FIG. 3 . According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The rear plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side structure (or “side bezel structure”) (218) that is coupled to the front plate (202) and the rear plate (211) and comprises a metal and / or polymer. In one embodiment, the rear plate (211) and the side structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0089] Although not shown, the front plate (202) may include a seamlessly extending region(s) that curves toward the rear plate (211) at least along a portion of an edge. In one embodiment, the front plate (202) (or the rear plate (211)) may include only one of the curved extending regions toward the rear plate (211) (or the front plate (202)) at one edge of the first surface (210A). In some embodiments, the front plate (202) or the rear plate (211) may be substantially flat, in which case it may not include a curved extending region. When it includes a curved extending region, the thickness of the electronic device (101) in the portion that includes the curved extending region may be less than that of the other portions.

[0090] According to one embodiment, the electronic device (101) may include one or more of a display (201), an audio module (not shown) including at least one sound hole (203, 207, 214) (e.g., audio module (170) of FIG. 1), a sensor module (204) (e.g., sensor module (176) of FIG. 1), a camera module (205, 212, 213) (e.g., camera module (180) of FIG. 1), a key input device (217) (e.g., input module (150) of FIG. 1), or a connector hole (208, 209) (e.g., connection terminal (178) of FIG. 1). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., key input device (217) or light emitting element (206)) or may additionally include other components.

[0091] In one embodiment, the display (201) may be visually exposed, for example, through a substantial portion of the front plate (202). In one embodiment, at least a portion of the display (201) may be visually exposed through the front plate (202) forming the first surface (210A) or through a portion of a side surface (210C). In one embodiment, the corners of the display (201) may be formed to be substantially the same as the adjacent outer shape of the front plate (202). In one embodiment (not shown), in order to expand the area over which the display (201) is visually exposed, the gap between the outer edge of the display (201) and the outer edge of the front plate (202) may be formed to be substantially the same.

[0092] In one embodiment (not shown), a recess or opening may be formed in a part of a screen display area of ​​the display (201), and at least one of an acoustic hole (214), a sensor module (204), a camera module (205), and a light-emitting element (206) may be included that are aligned with the recess or opening. In one embodiment (not shown), at least one of an acoustic hole (214), a sensor module (204), a camera module (205), a fingerprint sensor (not shown), and a light-emitting element (206) may be included on a back surface of the screen display area of ​​the display (201). In one embodiment (not shown), the display (201) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen. In one embodiment, at least a portion of the sensor module (204) and / or at least a portion of the key input device (217) may be positioned on the side (210C).

[0093] According to one embodiment, the audio module (not shown) may include a microphone hole (203) and sound holes (207, 214). The microphone hole (203) may have a microphone disposed inside to acquire external sound, and in one embodiment, multiple microphones may be disposed to detect the direction of the sound. According to one embodiment, the sound holes (207, 214) may include an external sound hole (207) and a receiver hole (214) for calls. In one embodiment, the sound holes (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included in the audio module without the sound holes (207, 214) (e.g., a piezo speaker).

[0094] According to one embodiment, the sensor module (204) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module (204) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210). According to an embodiment, an additional sensor module may be disposed on a second surface (210B) of the housing (210). The fingerprint sensor (not shown) may be disposed on not only the first surface (210A) (e.g., the display (201)) of the housing (210) but also the second surface (210B) or the side surface (210C). The electronic device (101) may further include, for example, at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0095] In one embodiment, the camera modules (205, 212, 213) may include a first camera module (205) facing the first side (210A) of the electronic device (101), and a second camera module (212) and / or a flash (213) facing the second side (210B). For example, the first camera module (205) and / or the second camera module (212) may include one or more lenses, an image sensor, and / or an image signal processor. In one embodiment, some of the camera modules (205) and / or some of the sensor modules (e.g., the sensor module (204)) among the camera modules (205, 212) may be arranged to be exposed to the outside through at least a portion of the display (201). In one embodiment, the first camera module (205) may include a punch hole camera arranged inside a hole or recess formed on the back surface of the display (201). For example, the first camera module (205) may receive at least a portion of light incident on the first side (210A) (or front side) of the electronic device (101) through the display (201) within the electronic device (101). According to one embodiment, the first camera module (205) and / or the sensor module (204) may be arranged so as to be in contact with the external environment through a transparent area from the internal space of the electronic device (101) to the front plate (202) of the display (201). Additionally, some of the sensor modules (204) may be arranged so as to perform their functions without being visually exposed through the front plate (202) within the internal space of the electronic device.

[0096] In one embodiment, the second camera module (212) may be disposed inside the housing (210) such that the lens is exposed to the second side (210B) (or back) of the electronic device (101). For example, the camera module (212) may be electrically connected to a printed circuit board (e.g., the printed circuit board (240a) of FIG. 4). For example, the flash (213) may include a light-emitting diode or a xenon lamp. In one embodiment, one or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and image sensors may be disposed on one side of the electronic device (101). In one embodiment, the flash (213) may emit infrared light. For example, infrared light emitted from the flash (213) and reflected by a subject may be received through a sensor module (not shown) disposed on the second side (210B) of the housing (210). An electronic device (101) or a processor (e.g., processor (120) of FIG. 1) can detect depth information of a subject based on the point in time when infrared rays are received from the sensor module.

[0097] The camera modules (205, 212, 213) are not limited to the above structure, and may be designed in various ways, such as by mounting only some camera modules or adding new camera modules, depending on the structure of the electronic device (101).

[0098] According to one embodiment, the electronic device (101) may include a plurality of camera modules (e.g., dual cameras or triple cameras) each having different properties (e.g., angles of view) or functions. For example, the electronic device (101) may include a plurality of camera modules (205, 212) each having a different angle of view, and the electronic device (101) may control the camera modules (205, 212) to change the angle of view of the camera modules (205, 212) operated in the electronic device (101) based on a user's selection. For example, at least one of the plurality of camera modules (205, 212) may be a wide-angle camera, and at least another may be a telephoto camera. Similarly, at least one of the plurality of camera modules (205, 212) may be a front camera, and at least another may be a rear camera. Additionally, the plurality of camera modules (205, 212) may include at least one of a wide-angle camera, a telephoto camera, or an infrared (IR) camera (e.g., a time of flight (TOF) camera, a structured light camera). In one embodiment, the IR camera may be operated as at least a part of a sensor module. For example, the TOF camera may be operated as at least a part of a sensor module (not shown) for detecting a distance to a subject.

[0099] In one embodiment, the key input device (217) may be disposed on a side surface (210C) of the housing (210). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (201). In one embodiment, the key input device may include a sensor module disposed on a second surface (210B) of the housing (210).

[0100] In one embodiment, the light emitting element (206) may be disposed, for example, on the first surface (210A) of the housing (210). The light emitting element (206) may provide, for example, status information of the electronic device (101) in the form of light. In one embodiment, the light emitting element (206) may provide a light source that is linked to a process of, for example, the camera module (205). The light emitting element (206) may include, for example, an LED, an IR LED, and a xenon lamp.

[0101] According to one embodiment, the connector holes (208, 209) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (e.g., an earphone jack) (209) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0102] FIG. 4 is a front exploded perspective view of an electronic device according to one embodiment of the present disclosure. FIG. 5 is a rear exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0103] Referring to FIGS. 4 and 5, an electronic device (101) (e.g., the electronic device (101) of FIG. 1 and / or the electronic device (101) of FIG. 2 or FIG. 3) includes a display (201) (e.g., the display (201) of FIG. 2), a front plate (202) (e.g., the front plate (202) of FIG. 2), a support structure (221) (e.g., a bracket), a side bezel structure (or side bezel structure) (222), a camera module (230) (e.g., the camera module (180) of FIG. 1), at least one printed circuit board (or board assembly) (240a, 240b), a battery (245) (e.g., the battery (189) of FIG. 1), a rear case (250), an antenna (not shown) (e.g., the antenna module (197) of FIG. 1) and / or a rear plate (290) (e.g., the rear of FIG. 3). It may include a plate (211)). According to one embodiment, when including a plurality of printed circuit boards (240a, 240b), the electronic device (101) may include at least one flexible circuit board (240c) to electrically connect different printed circuit boards. For example, the printed circuit boards (240a, 240b) may include a first circuit board (240a) positioned above the battery (245) (e.g., in the +Y-axis direction) and a second circuit board (240b) positioned below the battery (245) (e.g., in the -Y-axis direction), and the flexible circuit board (240c) may electrically connect the first circuit board (240a) and the second circuit board (240b).

[0104] According to one embodiment, the electronic device (101) may omit at least one of the components (e.g., the support structure (221), the rear case (250), or the flexible circuit board (240c)) or may additionally include other components. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 2 or FIG. 3, and any redundant description thereof will be omitted below.

[0105] In one embodiment, the support structure (221) may be provided at least in a flat shape. In one embodiment, the support structure (221) may be disposed inside the electronic device (101) and connected to or formed integrally with the side bezel structure (222). For example, the support structure (221) may be formed of a conductive material and / or a non-conductive material (e.g., a polymer). When the support structure (221) at least partially includes a conductive material such as a metal, the side bezel structure (222) or a portion of the support structure (221) may function as an antenna. The support structure (221) may include two sides facing opposite directions. The display (201) may be disposed on one of the two sides of the support structure (221), and the printed circuit board (240a, 240b) may be disposed on the other side.

[0106] In one embodiment, the support structure (221) and the side bezel structure (222) may be combined and referred to as a front case or housing (220). In one embodiment, the housing (220) may be generally understood as a structure for accommodating, protecting, or arranging electrical / electronic components, such as printed circuit boards (240a, 240b) or batteries (245). In one embodiment, the housing (220) may be understood as including structures that can be visually or tactilely perceived by a user in the appearance of the electronic device (101), for example, a side bezel structure (222), a front plate (202), and / or a back plate (290). In one embodiment, the front or back of the housing (220) may refer to the first side (210A) of FIG. 2 or the second side (210B) of FIG. 3. In one embodiment, the support structure (221) is disposed between the front plate (202) (e.g., the first side (210A) of FIG. 2) and the back plate (290) (e.g., the second side (210B) of FIG. 3) and may function as a structure for arranging electrical / electronic components such as a printed circuit board (240a, 240b) or a camera module (230). In the detailed description below, the camera module (230) of the electronic device (101) may be generally illustrated as including a configuration that receives light incident through the second side (210B) of the electronic device (101), but the electronic device (101) may further include a camera module (e.g., the camera module (205) of FIG. 2) and / or a sensor module (e.g., the sensor module (204) of FIG. 2) disposed to be exposed to the outside through at least a portion of the display (201).

[0107] In one embodiment, the camera module (230) may include at least one camera module, for example, at least one of the plurality of camera modules illustrated in FIGS. 4 and 5. In one embodiment, the camera module (230) may be disposed on a portion of the support structure (221) adjacent to the printed circuit board (240a, 240b). In one embodiment, the camera module (230) may be at least partially enclosed by the rear case (250) (e.g., the upper rear case (250a)). In one embodiment, the camera module (230) may receive at least a portion of light incident through an optical hole or a cover window (232, 233) disposed on the rear of the electronic device (101) (e.g., the second side (210B) of FIG. 3) within the electronic device (101). According to one embodiment, the camera module (230) may be aligned with one or more of the cover window(s) (232, 233).

[0108] According to one embodiment, a circuit device (e.g., a processor), a communication module (e.g., a communication module (190) of FIG. 1), a power management module (e.g., a power management module (188)), or a memory (e.g., a memory (130) of FIG. 1), an interface (e.g., an interface (177) of FIG. 1), or various electrical / electronic components implemented in the form of an integrated circuit chip may be disposed on the printed circuit board (240a, 240b). The processor (e.g., the processor (120) of FIG. 1) may include one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, a volatile memory or a non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device (101) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector. In some embodiments, the printed circuit board (240a, 240b) may be provided with an electromagnetic shielding environment from the rear case (250).

[0109] According to one embodiment, the battery (245) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (245) may be disposed substantially on the same plane as, for example, the printed circuit boards (240a, 240b). The battery (245) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0110] In one embodiment, the rear case (250) may include an upper rear case (250a) and a lower rear case (250b). In one embodiment, the upper rear case (250a) may be arranged to surround a printed circuit board (240a, 240b) (e.g., a first circuit board (240a)) together with a portion of a support structure (221). For example, the upper rear case (250a) may be arranged to face the support structure (221) with the first circuit board (240a) interposed therebetween.

[0111] In one embodiment, the lower rear case (250b) can be utilized as a structure on which various electrical / electronic components, including interfaces (e.g., a USB connector, an SD card / MMC connector, or an audio connector), can be placed. In one embodiment, electrical / electronic components, such as interfaces (e.g., a USB connector, an SD card / MMC connector, or an audio connector), can be placed on an additional printed circuit board (not shown). In this case, the lower rear case (250b) can be placed to surround the additional printed circuit board (not shown) together with another part of the support structure (221). For example, the interfaces placed on the additional printed circuit board (not shown) or the lower rear case (250b) (not shown) can be placed corresponding to the sound hole (207) or the connector holes (208, 209) of FIG. 2.

[0112] In one embodiment, the antenna (not shown) may include a conductive pattern implemented on the surface of the rear case (250), for example, through a laser direct structuring method. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the thin film-type antenna may be disposed between the rear plate (290) and the battery (245). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, another antenna structure may be formed by a part or a combination of the support structure (221) and / or the side bezel structure (222).

[0113] FIG. 6 is an exploded perspective view of some components of an electronic device according to an embodiment of the present disclosure. FIG. 7 is an exploded perspective view of some components of an electronic device according to an embodiment of the present disclosure. FIG. 8A is a rear view of an electronic device according to an embodiment of the present disclosure. FIG. 8B is a side cross-sectional view taken along line A-A' of FIG. 8A according to an embodiment of the present disclosure. FIG. 8C is a cross-sectional perspective view taken along line A-A' of FIG. 8A according to an embodiment of the present disclosure. FIG. 8D is a drawing for explaining a first hole, a second hole, a first space, and a guide pin of a support structure according to an embodiment of the present disclosure. FIG. 9A is a front view illustrating a rear plate and an adhesive member of an electronic device according to an embodiment of the present disclosure. FIG. 9B is an exploded perspective view of a rear plate and a removal structure of an electronic device according to an embodiment of the present disclosure. FIG. 10 is an enlarged view for explaining an adhesive member disposed on a rear plate according to an embodiment of the present disclosure. FIG. 11 is a plan view of a handle according to an embodiment of the present disclosure.

[0114] All or part of the configuration of the electronic device (101) of FIGS. 6, 7 and 8a may be identical to or similar to the configuration of the electronic device (101) of FIGS. 1 to 5.

[0115] Referring to FIGS. 5 to 8C, in one embodiment, the electronic device (101) may include a housing (303) and a display (301) (e.g., display (201) of FIGS. 2, 4, and 5) disposed in the housing (303) and a front plate (302) (e.g., front plate (202) of FIGS. 2, 4, and 5), at least one circuit board (340) disposed within the housing (303) (e.g., circuit boards (240a, 240b, 240c) of FIGS. 4 and 5), a battery (350) (e.g., battery (245) of FIGS. 4 and 5), a socket (360), and a separation structure (305) (or a rear plate separation structure). For example, the circuit board (340) may include a first circuit board (e.g., the first circuit board (240a) of FIGS. 4 and 5), a second circuit board (e.g., the second circuit board (240b) of FIGS. 4 and 5), and a flexible circuit board (e.g., the flexible circuit board (240c) of FIGS. 4 and 5). Referring to FIGS. 6 and 7, according to one embodiment, the electronic device (101) may include windows (332, 333) (e.g., windows (232, 233) of FIGS. 4 and 5) disposed on the rear plate (390).

[0116] According to one embodiment of the present disclosure, as described below, the separation structure (305) may be provided in a structure that allows a user to easily separate the rear plate (390) from the electronic device (101) by manipulating the handle (370) without a separate tool or special tool. Accordingly, the separation structure (305) may help the user perform repair or replacement (e.g., self-replacement of the battery (350)) of the internal structure or electric / electronic components of the electronic device (101) disposed inside the rear plate (390) by himself / herself without the help of a specialist.

[0117] In one embodiment, the housing (303) may include a front support structure (310) (or a first support structure, front), a support structure (320) (e.g., support structure (220) of FIGS. 4 and 5) (or a second support structure, rear support structure, rear), and a rear plate (390) (e.g., rear plate (211) of FIG. 3, rear plate (290) of FIGS. 4 and 5) facing at least a portion of the support structure (320). In one embodiment, the front support structure (310) and the support structure (320) may be connected to each other as separate members, but are not limited thereto, and in one embodiment (e.g., FIGS. 15A, 15B, and 16B), the front support structure (310) and the support structure (320) may be integrally formed as one member. According to one embodiment, the back plate (390) may be spaced apart from the support structure (320) by a first gap (325), and an adhesive member (380) may be placed in the first gap (325).

[0118] According to one embodiment, the support structure (320) of the housing (303) may include a plate portion (320a) disposed at least partially facing the rear plate (390) and a side portion (320b) disposed along at least a portion of an edge of the plate portion (320a).

[0119] According to one embodiment, the support structure (320) may include a first hole (321) formed in the side portion (320b), a second hole (322) formed around the first hole (321), and a first space (323) positioned within the housing (303) or the support structure (320) (e.g., plate portion (320a)). According to one embodiment, the first space (323) may be connected to the second hole (322), and may be, for example, a space extending inwardly of the plate portion (320a) from the second hole (322). As described below, according to one embodiment, a socket (360) may be disposed in the first hole (321) and the second hole (322), and a handle (370) may be disposed in the first space (323).

[0120] Referring to FIGS. 8b, 8c and 8d, according to one embodiment, the support structure (320) may further include a guide pin (324) protruding from a portion of the surface surrounding the first space (323) into the first space (323). According to one embodiment, the guide pin (324) may be formed to pass through a guide hole (374) formed in the handle (370) and may serve to support and maintain the handle (370) within the first space (323). For example, the guide pin (342) may help support the back plate (390) above the first space (323) that is not supported by the support structure (320) by maintaining the handle (370) in an assembled position.

[0121] Referring to FIGS. 8A, 9A and 9B, according to one embodiment, the back plate (390) may include window holes (391, 392) formed to position windows (332, 333).

[0122] According to one embodiment, the socket (360) may be arranged in the support structure (320) (e.g., the side portion (320b)) so that the first hole (321) and the second hole (322) are not visually exposed or so as to close the first hole (321) and the second hole (322). According to one embodiment, the socket (360) may be formed so that at least one storage medium may be arranged therein. For example, the socket (360) may be a tray member including a seating portion or a recessed portion on one surface (e.g., a +Z-axis direction surface) in which a storage medium may be seated. For example, the storage medium may include a subscriber identification module card (or a user authentication module card) or a memory card.

[0123] In one embodiment, the adhesive member (380) may be configured to couple the back plate (390) to the support structure (320) of the electronic device (101) or to separate the back plate (390) from the support structure (320). In one embodiment, the adhesive member (380) may include a first adhesive member (381) and a second adhesive member (382) disposed in different sections (or regions) of the first gap (325). For example, the first adhesive member (381) may be disposed in a first region of the first gap (325) and the second adhesive member (382) may be disposed in a second region around the first region of the first gap (325). In other words, the first adhesive member (381) and the second adhesive member (382) may be disposed so as not to overlap in the thickness direction (e.g., the Z-axis direction) of the electronic device (101).

[0124] According to one embodiment, the first adhesive member (381) may be coupled or fixed to a portion of the handle (370) (e.g., the first region (370a) or the adhesive portion (371)). According to one embodiment, when the handle (370) is pulled out of the electronic device (101) through the second hole (322), the first adhesive member (381) may be configured to be pulled out of the electronic device (101) through the first space (323) and the second hole (322) together with the handle (370).

[0125] In one embodiment, the first adhesive member (381) may be formed of a material that is more flexible, elastic, and / or stretchable than the second adhesive member (382). For example, the first adhesive member (381) may be configured to have a lower adhesive strength when pulled and stretched, and may be more easily separated from the adherend when pulled and stretched than the second adhesive member (382). For example, the first adhesive member (381) may include only an adhesive layer (or adhesive layer) without a substrate layer.

[0126] According to one embodiment, the second adhesive member (382) may include a plurality of layers including a substrate layer and an adhesive layer (or adhesive layer). For example, the adhesive layer of the second adhesive member (382) may include an adhesive that can be adhered to an adherend by pressure without a chemical reaction. For example, the substrate layer of the second adhesive member (382) may be formed of a material that can be coated with an adhesive and that can support the adhesive layer. For example, the second adhesive member (382) (e.g., a double-sided tape) may include an adhesive layer that can be releasably bonded to an adherend (e.g., the support structure (320) and the back plate (390)) on one or both sides.

[0127] Referring to FIGS. 9A and 9B, FIG. 9A may show an appearance of an adhesive member (380) that has been completely bonded to a rear plate (390), and FIG. 9B may be an exploded perspective view of the adhesive member (380) and the handle (370) before being bonded to the rear plate (390) as in FIG. 9. Referring to FIG. 9B, according to one embodiment, the adhesive member (380) may further include a first release sheet (383) and a second release sheet (384). According to one embodiment, the first release sheet (383) and the second release sheet (384) may be provided in a state in which they are arranged to correspond to the bonding surfaces of the first adhesive member (381) and the second adhesive member (382), respectively. For example, the first release paper (383) and the second release paper (384) can be removed after the first adhesive member (381) and the second adhesive member (382) are bonded to the back plate (390), and the adhesive surfaces of the first adhesive member (381) and the second adhesive member (382) exposed by the removal of the first release paper (383) and the second release paper (384) can be attached to the support structure (320).

[0128] Referring to FIG. 10, according to one embodiment, the first adhesive member (381) may include a first coupling structure (3811), and the second adhesive member (382) may include a second coupling structure (3821) that is formed to be interlocked with the first coupling structure (3811). For example, the first coupling structure (3811) and the second coupling structure (3821) may include at least one protrusion and / or concave shape at a portion facing each other. According to one embodiment, the first coupling structure (3811) and the second coupling structure (3821) may be provided as a structure (e.g., a segmented structure) positioned at a boundary surface of the first adhesive member (381) and the second adhesive member (382) so as to enable the first adhesive member (381) and the second adhesive member (382) to be easily separated. According to one embodiment, the first coupling structure (3811) and the second coupling structure (3821) may be spaced apart from each other by a predetermined interval. However, the arrangement relationship between the first coupling structure (3811) and the second coupling structure (3821) is not limited, and as an example, the first coupling structure (3811) and the second coupling structure (3821) may be provided in a state of being in contact with each other and weakly coupled to each other. According to one embodiment, when the handle (370) is pulled out of the electronic device (101) through the second hole (322), the first adhesive member (381) can be separated from the second adhesive member (382) at the boundary between the first coupling structure (3811) and the second coupling structure (3821), and the first adhesive member (381) can be pulled out of the electronic device (101) together with the handle (370), and the second adhesive member (382) can be configured to remain (or be maintained) in the first gap (325).

[0129] According to one embodiment, the handle (370) may be disposed within the first space (323). According to one embodiment, a portion of the handle (370) (e.g., the first region (370a) or the adhesive portion (371)) may be coupled to the first adhesive member (381). According to one embodiment, when the rear plate (390) is viewed in the direction in which the first space (323) is positioned or in the thickness direction (e.g., the Z-axis direction) of the electronic device (101), the handle (370) may be disposed to at least partially overlap the first adhesive member (381).

[0130] According to one embodiment, the handle (370) can be accommodated in the first space (323) in a folded state one or more times. According to the embodiments of FIGS. 6 to 11, the handle (370) is configured to be accommodated in the first space (323) in a folded state once, but the number of times the handle (370) can be folded is not limited, and for example, the handle (370) can be configured to be accommodated in the first space (323) in a folded state two times (e.g., see FIGS. 18A to 18C) or three or more times (e.g., see FIGS. 19A to 19C). For example, the handle (370) can be formed of an elastically deformable material.

[0131] According to one embodiment, the handle (370) may be provided to be withdrawable to the outside of the electronic device (101) through the second hole (322). According to one embodiment, when the handle (370) is withdrawn to the outside of the electronic device (101) through the second hole (322), the first adhesive member (381) may be configured to be withdrawn to the outside of the electronic device (101) through the first space (323) and the second hole (322) together with the handle (370), and the second adhesive member (382) may remain in the first gap (325).

[0132] Referring to FIG. 11, according to one embodiment, the handle (370) may include a first region (370a), a second region (370b) extending from the first region (370a), and a third region (370c) extending from the second region (370b). According to one embodiment, the handle (370) may be configured such that the second region (370b) can be bent or folded so that the first region (370a) and the third region (370c) face each other. For example, the handle (370) may be placed in the first space (323) in a state in which the second region (370b) is folded at least once.

[0133] According to one embodiment, the handle (370) may further include an adhesive portion (371) disposed on one surface of the first region (370a) and configured to be coupled with the first adhesive member (381). According to one embodiment, the handle (370) may further include a bending hole (372) (or main bending hole, first bending holes) formed in the second region (370b). For example, the bending hole (372) may have a long hole shape. For example, the handle (370) may include additional bending holes (373) (or second bending holes) formed around the bending hole (372) in the second region (370b) and having a smaller size than the bending hole (372). For example, the additional bending holes (373) may be spaced apart from each other. For example, the additional banding holes (373) may be arranged to be aligned with each other and in a row with the banding holes (372). For example, the handle (370) may be configured to fold along the banding holes (372) and / or the additional banding holes (373). For example, the banding holes (372) and / or the additional banding holes (373) may serve to guide the handle (370) to fold into a designed shape.

[0134] According to one embodiment, the handle (370) may further include a guide hole (374) formed in the third region (370c). The guide hole (374) may be formed to be positioned on a guide pin (324) disposed within the first space (323). According to one embodiment, the handle (370) may further include a guide slit (374a) connected to the guide hole (374). According to one embodiment, the guide slit (374a) may pass through the guide pin (324) when the handle (370) is pulled out of the electronic device (101) through the second hole (322). For example, a portion surrounding the guide slit (374a) of the handle (370) may be configured to be elastically deformable when passing through the guide pin (324). According to one embodiment, the guide slit (374a) may serve to separate the handle (370) connected to the guide pin (324) through the guide hole (374) from the guide pin (324).

[0135] According to one embodiment, the handle (370) may further include a guide mark (375) formed around the guide hole (374) in the third region (370c). For example, the guide mark (375) may be a design, pattern, or figure mark in the shape of an arrow to guide the direction in which the handle (370) should be pulled out.

[0136] FIG. 12A is a diagram illustrating a state in which a socket is partially inserted into a support structure of an electronic device according to an embodiment of the present disclosure. FIG. 12B is a diagram illustrating a state in which a socket is removed from an electronic device according to an embodiment of the present disclosure. FIG. 12C is a diagram illustrating a state in which a handle of an electronic device is unfolded according to an embodiment of the present disclosure. FIG. 12D is a diagram illustrating a state in which a handle and a first adhesive member are pulled out from a support structure according to an embodiment of the present disclosure. FIG. 12E is a diagram illustrating a state in which a rear plate of an electronic device is separated from a support structure according to an embodiment of the present disclosure. FIG. 13A is an exploded view of a handle and a first adhesive member according to an embodiment of the present disclosure. FIG. 13B is an exploded view of a first release sheet and a second release sheet for a handle, a first adhesive member, and a second adhesive member according to an embodiment of the present disclosure. FIG. 13C is an exploded view of a separation structure and a rear plate according to an embodiment of the present disclosure. FIG. 13D is a perspective view illustrating a state in which a separation structure is coupled to a rear plate according to an embodiment of the present disclosure. FIG. 14A is a diagram illustrating a folding structure of a handle of a separation structure according to an embodiment of the present disclosure. FIG. 14B is a diagram illustrating a structure for arranging a handle in a folded state in a first space of a support structure according to an embodiment of the present disclosure. FIG. 14C is a diagram illustrating a structure for arranging a handle in a folded state in a first space of a support structure according to an embodiment of the present disclosure. FIG. 15 may illustrate a state in which a separation structure is coupled to a support structure for reattachment of a rear plate according to an embodiment of the present disclosure.

[0137] Referring to FIG. 12a, according to one embodiment, the socket (360) can be removed or separated from the electronic device (e.g., the electronic device (101) of FIGS. 1 to 7) by being withdrawn from the first hole (321). According to one embodiment, the socket (360) can be positioned in the support structure (320) (e.g., the side portion (320b)) such that the first hole (321) and the second hole (322) are not visually exposed (e.g., see FIG. 8b). Referring to FIG. 12b, according to one embodiment, when the socket (360) is removed, the first hole (321) and the second hole (322) can be visually exposed to the outside of the electronic device (101). According to one embodiment, when the socket (360) is removed, the handle (370) disposed in the first space (323) through the second hole (322) can be visually exposed to the outside of the electronic device (101). Referring to FIG. 12C, according to one embodiment, the third region (370c) of the handle (370) in the state illustrated in FIG. 12B can be pulled out of the electronic device (101) from the first space (323) through the second hole (322). At this time, the handle (370) can be separated from the guide pin (e.g., the guide pin (324) of FIGS. 8B to 8D) by the guide slit (374a). For example, the third region (370c) of the handle (370) can be pulled out of the second hole (322) by a sharp tool (e.g., a pen tip, tweezers) or the user's hand. Referring to FIG. 12d, according to one embodiment, when the handle (370) is pulled, the first adhesive member (381) can be pulled out of the electronic device (101) through the second hole (322) through the first space (323) together with the handle (370).Referring to FIG. 12e, according to one embodiment, the first adhesive member (381) disposed between the rear plate (390) and the support structure (320) can be removed from the electronic device (101) as in the example of FIG. 12d, and the area where the first adhesive member (381) is removed from the rear plate (390) can be exposed in the direction of the arrow in FIG. 12e, thereby separating the rear plate (390) from the support structure (320).

[0138] FIGS. 13A to 13D are drawings for explaining a process in which a separation structure (305) is coupled to a rear plate (390) according to one embodiment of the present disclosure.

[0139] Referring to FIG. 13a, according to one embodiment, a portion of the handle (370) (e.g., the first region (370a) of FIG. 11) may be coupled to a portion of the first adhesive member (381). Referring to FIG. 13b, the separation structure (305) may further include a first release sheet (383) and a second release sheet (384) disposed on the bonding surfaces of the first adhesive member (381) and the second adhesive member (382). Referring to FIGS. 13c and 13d, according to one embodiment, the separation structure (305) may be coupled to the rear plate (390) with the first release sheet (383) and the second release sheet (384) coupled to the first adhesive member (381) and the second adhesive member (382). For example, when the separation structure (305) is completely bonded to the rear plate (390), the first release layer (383) and the second release layer (384) can be removed.

[0140] FIGS. 14A to 14C are drawings illustrating a process of assembling a handle (370) to a support structure (320) when a separation structure (305) is coupled to a rear plate (390) according to one embodiment of the present disclosure. Referring to FIG. 14A , according to one embodiment, a second region (370b) of the handle (370) may be folded or bent in a direction toward an inner surface (e.g., a +Z direction surface) of the rear plate (390) or in the direction of an arrow in FIG. 12A . Referring to FIGS. 14B and 14C , according to one embodiment, the rear plate (390) may be coupled to the support structure (320) such that the handle (370) is placed in a first space (323) of the support structure (320) in a folded state as illustrated in FIG. 14A . Referring to FIG. 14c, according to one embodiment, the handle (370) may be positioned in the first space (323) such that the guide hole (374) is positioned around the guide pin (324) or the guide pin (324) is positioned in the guide hole (374).

[0141] FIG. 15 illustrates a process of coupling a newly provided separation structure (305) to a support structure (320) to re-couple the rear plate (390) to the support structure (320) in a state before separation after the rear plate (390) has been separated using a separation structure (305) according to one embodiment of the present disclosure. Referring to FIG. 15 , according to one embodiment, the adhesive member (380) of the newly provided separation structure (305) may further include a release sheet for reassembly (385). For example, the release sheet for reassembly (385) may include at least one wing (385a) and / or at least one central hole (385b). For example, a user may hold the wing (385a) and position and couple the first coupling member (381) and the second coupling member (382) coupled to the release sheet for reassembly (385) to the support structure (320). For example, when the first joining member (381) and the second joining member (382) are completely joined to the support structure (320), the reassembly release sheet (385) can be separated or removed through the wing (385a) and / or the central hole (385b).

[0142] FIG. 16A is a rear perspective view of an electronic device according to an embodiment of the present disclosure. FIG. 16B is a partial cross-sectional side view of an electronic device according to an embodiment of the present disclosure.

[0143] Referring to FIG. 16A, an electronic device (e.g., an electronic device (101) of FIGS. 1 to 7) may include a housing (403) (or a support structure), a rear plate (390), a battery (350) disposed in a space between the housing (403) and the rear plate (390), a circuit board (e.g., a flexible circuit board (343)), a first adhesive member (381) for coupling or separating the rear plate (390) to the housing (403), a second adhesive member (382), and a handle (370).

[0144] The embodiments of FIGS. 16A and 16B are embodiments in which a housing (403) is disclosed in which the support structure (320) and the front support structure (310) of the housing (303) of the embodiments described above with reference to FIGS. 6 to 15 are integrated. With respect to the components assigned the same drawing reference numerals in the embodiments of FIGS. 16A to 16B and the embodiments of FIGS. 6 to 15, excluding the housing (403), the descriptions given above with reference to FIGS. 6 to 15 may be applied identically or similarly, and may not be described repeatedly herein. Referring to FIG. 16B, according to one embodiment, the housing (403) may further include a guide pin (e.g., a guide pin (324) of FIGS. 8B to 8B).

[0145] FIG. 17A is a partial cross-sectional side view of an electronic device according to one embodiment of the present disclosure. FIG. 17B is a partial cross-sectional side view of an electronic device according to one embodiment of the present disclosure.

[0146] The embodiment of FIG. 17a is an embodiment in which a back plate (390) is disclosed that includes a flat section (390a) and a curved or diagonal section (390b) arranged at the edge of the flat section (390a), unlike the back plates (390) of the embodiments described above with reference to FIGS. 6 to 15. With respect to the components assigned the same drawing reference numerals in the embodiments of FIG. 17a and FIGS. 6 to 15, excluding the back plate (390), the descriptions given above with reference to FIGS. 6 to 15 may be applied identically or similarly, and may not be described redundantly herein.

[0147] The embodiment of FIG. 17b is an embodiment in which a housing (403) is disclosed in which the support structure (320) and the front support structure (310) of the housing (303) of the embodiments described above with reference to FIGS. 6 to 15 are integrated, and a rear plate (390) is disclosed that includes a flat section (390a) and a curved or diagonal section (390b) arranged at the edge of the flat section (390a), unlike the rear plate (390) of the embodiments described above with reference to FIGS. 6 to 15. With respect to the components assigned the same drawing reference numerals in the embodiments of FIG. 17b and FIGS. 6 to 15, except for the housing (403) and the rear plate (390), the descriptions given above with reference to FIGS. 6 to 15 may be applied identically or similarly, and may not be described repeatedly herein. Referring to FIG. 17b, according to one embodiment, the housing (403) may further include a guide pin (e.g., guide pin (324) of FIGS. 8b to 8b).

[0148] FIG. 18A is a partial cross-sectional side view of an electronic device according to an embodiment of the present disclosure. FIG. 18B is an exploded perspective view of some components of the electronic device according to an embodiment of the present disclosure. FIG. 18C is a plan view of a handle according to an embodiment of the present disclosure. FIG. 18D is a view of the handle of FIG. 18C viewed from the opposite side according to an embodiment of the present disclosure.

[0149] The embodiment of FIGS. 18A to 18C discloses a handle (470) configured to be placed in the first space (323) in a folded state multiple times (e.g., twice), unlike the handle (370) of the embodiments described above with reference to FIGS. 6 to 15. With respect to the components assigned the same drawing reference numerals in the embodiments of FIGS. 18A to 18C and FIGS. 6 to 15, excluding the handle (470), the descriptions given above with reference to FIGS. 6 to 15 may be applied identically or similarly, and may not be described redundantly herein.

[0150] Referring to FIGS. 18B and 18C , according to one embodiment, the handle (470) may include a first region (470a), a second region (470b) extending from the first region (470a), a third region (370c) extending from the second region (470b), a fourth region (470d) extending from the third region (370c), and a fifth region (470e) extending from the fourth region (470d). According to one embodiment, the handle (470) may be configured such that the second region (370b) and the fourth region (370d) may be bendable or foldable such that the first region (370a), the third region (370c), and the fifth region (370e) are at least partially facing or parallel to each other. For example, the handle (470) may be placed in the first space (323) in a folded state at least once in each of the first area (370a), the third area (370c), and the fifth area (370e).

[0151] According to one embodiment, the handle (470) may further include an adhesive portion (471) disposed on one surface of the first region (470a) and configured to be coupled with the first adhesive member (381). According to one embodiment, the handle (470) may further include a first bending hole (472a) formed from the second region (470b) to the third region (470c). For example, the first bending hole (472a) may have a long hole shape. For example, the handle (470) may include first additional bending holes (473a) formed around the first bending hole (472a) in the second region (470b) and having a smaller size than the first bending hole (472a). For example, the first additional bending holes (473a) may be spaced apart from each other. For example, the first additional banding holes (473a) can be arranged to be aligned with each other and in a row with the first banding holes (472a).

[0152] According to one embodiment, the handle (470) may further include a second bending hole (472b) formed in the fourth region (470d). For example, the second bending hole (472b) may have a long hole shape, and for example, a longitudinal direction of the second bending hole (472b) may intersect a longitudinal direction of the first bending hole (472a). For example, the handle (470) may include second additional bending holes (473b) formed around the second bending hole (472b) in the second region (470b) and having a smaller size than the second bending hole (472b). For example, the second additional bending holes (473b) may be spaced apart from each other. For example, the second additional bending holes (473b) may be arranged to be aligned with each other and in a row with the second bending hole (472b). For example, the handle (470) may be configured to fold along a banding hole (472) (e.g., a first banding hole (472a) and / or a second banding hole (472b)) and / or additional banding holes (473) (e.g., a first additional banding hole (473a) and / or a second additional banding hole (473b)). For example, the banding hole (472) and / or the additional banding holes (473) may serve to guide the handle (470) to fold into a designed shape.

[0153] According to one embodiment, the handle (470) may further include a guide hole (474) formed in the fifth region (470e). The guide hole (474) may be formed to be positioned on a guide pin (424) positioned within the first space (323). According to one embodiment, the handle (470) may further include a guide slit (474a) connected to the guide hole (474). According to one embodiment, the guide slit (474a) may pass through the guide pin (424) when the handle (470) is pulled out of the electronic device (101) through the second hole (322). For example, a portion surrounding the guide slit (474a) of the handle (470) may be configured to be elastically deformable when passing through the guide pin (424). According to one embodiment, the guide slit (474a) may serve to separate the handle (470) connected to the guide pin (424) through the guide hole (474) from the guide pin (424).

[0154] According to one embodiment, the handle (470) may further include a guide mark (475) formed around the guide hole (474) in the fifth region (470e). For example, the guide mark (475) may be a design, pattern, or figure mark, such as an arrow, to guide the direction in which the handle (470) should be pulled out.

[0155] FIG. 19A is a partial cross-sectional side view of an electronic device according to an embodiment of the present disclosure. FIG. 19B is a drawing illustrating a first adhesive member and a handle in an unfolded state according to an embodiment of the present disclosure. FIG. 19C is a drawing illustrating a first adhesive member and a handle in a folded state according to an embodiment of the present disclosure.

[0156] The embodiment of FIGS. 19A to 19C discloses a handle (570) configured to be arranged in the first space (323) in a folded state three or more times, unlike the handle (370) of the embodiments described above with reference to FIGS. 6 to 15. With respect to the components assigned the same drawing reference numerals in the embodiments of FIGS. 19A to 19C and FIGS. 6 to 15, excluding the handle (570), the descriptions given above with reference to FIGS. 6 to 15 may be applied identically or similarly, and may not be described repeatedly herein. Referring to FIG. 18A, according to one embodiment, the support structure (320) may further include a guide pin (e.g., the guide pin (324) of FIGS. 8B to 8B) arranged in the first space (323).

[0157] Referring to FIGS. 19A and 19B , according to one embodiment, the handle (570) can be folded more than three times (e.g., four times), and the number of times the handle (570) can be folded is not limited, as long as it can be stored in the first space (323). According to one embodiment, the handle (570) can include a guide hole (574). For example, the guide hole (574) can function as a hole that can be pulled by inserting a tool or a nail into the handle (570) to pull the handle (570) placed in the first space (323) out of the electronic device (101) through the second hole (322).

[0158] FIG. 20A is a partial cross-sectional side view of an electronic device according to an embodiment of the present disclosure. FIG. 20B is a drawing showing a handle being coupled to a support structure according to an embodiment of the present disclosure. FIG. 20C is a drawing showing a handle being fully coupled to a support structure according to an embodiment of the present disclosure. FIG. 20D is a drawing showing a back plate being fully coupled to a support structure according to an embodiment of the present disclosure.

[0159] The embodiments of FIGS. 20A to 20C disclose an embodiment in which a handle (670) is injection-molded to have a bent shape, unlike the handle (370) of the embodiments described above with reference to FIGS. 6 to 15. With respect to the components assigned the same drawing reference numerals in the embodiments of FIGS. 20A to 20C and FIGS. 6 to 15, excluding the handle (670), the descriptions given above with reference to FIGS. 6 to 15 may be applied identically or similarly, and may not be described repeatedly herein.

[0160] Referring to FIGS. 20A and 20B , according to one embodiment, the handle (670) may include an adhesive portion (671) and a guide hole (674) for being coupled to the first adhesive member (381). This is not a problem. For example, the guide hole (674) may function as a hole that can be pulled by inserting a tool or a nail into the handle (670) to pull the handle (670) disposed in the first space (323) out of the electronic device (101) through the second hole (322). Referring to FIG. 20A , according to one embodiment, an additional adhesive member (387) (e.g., a lower adhesive member) coupled to a surface surrounding the first space (323) may be further provided on the opposite side of the side of the handle (670) coupled to the first adhesive member (381) (e.g., an upper adhesive member). For example, the handle (670) may be formed through injection molding and may be formed of a material having flexibility and / or elasticity.

[0161] FIG. 21A is a rear view illustrating the separation direction of the socket and the arrangement of the first adhesive member with respect to the back plate according to one embodiment of the present disclosure. FIG. 21B is a rear view illustrating the separation direction of the socket and the arrangement of the first adhesive member with respect to the back plate according to one embodiment of the present disclosure. FIG. 21C is a rear view illustrating the separation direction of the socket and the arrangement of the first adhesive member with respect to the back plate according to one embodiment of the present disclosure. FIG. 21D is a rear view illustrating the separation direction of the socket and the arrangement of the first adhesive member with respect to the back plate according to one embodiment of the present disclosure. FIG. 21E is a rear view illustrating the separation direction of the socket and the arrangement of the first adhesive member with respect to the back plate according to one embodiment of the present disclosure. FIG. 21F is a rear view illustrating the separation direction of the socket and the arrangement of the first adhesive member with respect to the back plate according to one embodiment of the present disclosure. FIG. 22A is a rear view illustrating the arrangement of the first adhesive member with respect to the back plate according to one embodiment of the present disclosure. FIG. 22b is a rear view illustrating the arrangement of a first adhesive member on a rear plate according to one embodiment of the present disclosure. FIG. 22c is a rear view illustrating the arrangement of a first adhesive member on a rear plate according to one embodiment of the present disclosure.

[0162] The embodiments of FIGS. 21A to 21E are embodiments regarding the arrangement of the first adhesive member (381) on the rear plate (390) according to the position and separation direction (P) of the socket (360) of the embodiments described above with reference to FIGS. 6 to 20B.

[0163] Referring to FIG. 21A, according to one embodiment, the socket (360) may be disposed at the top (e.g., +Y direction end) of the back plate (390), and the separation direction (P) of the socket (360) may be toward the top (e.g., +Y direction end) of the back plate (390). For example, the first adhesive member (381) may be disposed at the top (e.g., +Y direction end) of the back plate (390) adjacent to the receiving space of the socket (360) and at a side end (e.g., X direction end) of the plate (390) extending therefrom.

[0164] Referring to FIG. 21B, according to one embodiment, the socket (360) may be disposed at a side end (e.g., a -X direction end) of the rear plate (390), and the separation direction (P) of the socket (360) may be in the direction of the side end (e.g., a -X direction end) of the rear plate (390). For example, the first adhesive member (381) may be disposed at a side end (e.g., a -X direction end) of the rear plate (390) adjacent to the receiving space of the socket (360) and an upper end (e.g., a +Y direction end) extending therefrom.

[0165] Referring to FIG. 21c, according to one embodiment, the socket (360) may be disposed at the lower end (e.g., -Y direction end) of the rear plate (390), and the separation direction (P) of the socket (360) may be toward the lower end (e.g., -Y direction end) of the rear plate (390). For example, the first adhesive member (381) may be disposed at the lower end (e.g., -Y direction end) of the rear plate (390) adjacent to the receiving space of the socket (360) and at the side end (e.g., +X direction end) of the plate (390) extending therefrom.

[0166] Referring to FIG. 21d, according to one embodiment, the socket (360) may be disposed at a side end (e.g., a +X direction end) of the rear plate (390), and the separation direction (P) of the socket (360) may be in the direction of the side end (e.g., a +X direction end) of the rear plate (390). For example, the first adhesive member (381) may be disposed at a side end (e.g., a +X direction end) of the rear plate (390) adjacent to the receiving space of the socket (360) and a lower end (e.g., a -Y direction end) extending therefrom.

[0167] Referring to FIG. 21e, according to one embodiment, the socket (360) may be disposed at the lower end (e.g., -Y direction end) of the rear plate (390), and the separation direction (P) of the socket (360) may be toward the lower end (e.g., -Y direction end) of the rear plate (390). For example, the first adhesive member (381) may be disposed at the lower end (e.g., -Y direction end) of the rear plate (390) adjacent to the receiving space of the socket (360) and at the side end (e.g., -X direction end) of the plate (390) extending therefrom.

[0168] Referring to FIG. 21b, according to one embodiment, the socket (360) may be disposed at a side end (e.g., -X direction end) of the rear plate (390), and the separation direction (P) of the socket (360) may be in the direction of the side end (e.g., -X direction end) of the rear plate (390). For example, the first adhesive member (381) may be disposed at a side end (e.g., -X direction end) of the rear plate (390) adjacent to the receiving space of the socket (360) and a lower end (e.g., -Y direction end) extending therefrom.

[0169] Referring to FIG. 22a, according to one embodiment, the first adhesive member (381) may be disposed at a plurality of ends among the ends of the rear plate (390), for example, at the top (e.g., the +Y direction end) and the side end (e.g., the -X direction end) extending therefrom. Referring to FIG. 22b, according to one embodiment, the first adhesive member (381) may be disposed at only one end of the rear plate (390), for example, at the side end (e.g., the -X direction end). Referring to FIG. 22c, according to one embodiment, the first adhesive member (381) may be disposed at only one end of the rear plate (390), for example, at the top (e.g., the +Y direction end).

[0170] The aspects of the present disclosure are intended to address at least the problems and / or disadvantages described above and provide at least the advantages described below. However, the problems addressed by the present disclosure are not limited to those described herein, and may be determined in various ways without departing from the spirit and scope of the present disclosure. The effects obtained by the present disclosure are not limited to those described above, and various effects may be provided, directly or indirectly, through this document.

[0171] The separation structure of the present disclosure described above and the electronic device including the same are not limited to the above-described embodiments and drawings, and it will be apparent to a person skilled in the art to which the present disclosure pertains that various substitutions, modifications, and changes are possible within the technical scope of the present disclosure.

[0172] While this disclosure has been described by way of example and example, it should be understood that the specific embodiment is intended to be illustrative and not limiting. It will be apparent to those skilled in the art that various changes in form and detail may be made without departing from the overall scope of this disclosure, including the appended claims and their equivalents.

[0173] In one embodiment, an electronic device may be provided. The electronic device may include a housing (303) including a support structure (220; 320) and a rear plate (290; 390) disposed facing each other with a first gap interposed therebetween, the support structure including a first hole (321) and a second hole (322) formed around the first hole and connected to a first space (323) within the housing, a socket (360) arranged to close the first hole and the second hole and configured to be received at least partially within the housing, an adhesive member (380) coupled to the rear plate and the support structure, the adhesive member including a first adhesive member (381) and a second adhesive member (382) disposed at different sections of the first gap, and a handle (370) coupled to the first adhesive member and received in a folded state at least once within the first space.

[0174] In one embodiment, the handle may be positioned within the first space such that a portion of the handle is visually exposed to the outside of the electronic device through the second hole when the socket is removed.

[0175] According to one embodiment, the first adhesive member includes a first bonding structure (3811), and the second adhesive member may include a second bonding structure (3821) having a shape that is interlocked with the first bonding structure and spaced apart from the first bonding structure by a predetermined distance.

[0176] According to one embodiment, when the handle is pulled out of the electronic device through the second hole, the first adhesive member may be configured to be pulled out of the electronic device through the first space and the second hole together with the handle.

[0177] According to one embodiment, when the first adhesive member is pulled out of the electronic device, the second adhesive member may be configured to be separated from the first adhesive member and maintained in the first gap.

[0178] According to one embodiment, the first adhesive member may be formed of a material having greater ductility and elasticity than the second adhesive member.

[0179] According to one embodiment, the first adhesive member may be disposed in a first section extending from a section connected to the first space among the first gaps, and the second adhesive member may be disposed in a second section around the first section.

[0180] According to one embodiment, the support structure further includes a guide pin (324) protruding from a portion of the surface surrounding the first space into the first space, and the handle may include at least a guide hole (374; 474) formed to allow the guide pin to pass through.

[0181] In one embodiment, one end of the handle may be at least partially joined to the first adhesive member, and the handle may include a guide slit (374a, 474a) connected to the guide hole at the opposite end.

[0182] According to one embodiment, when the handle is pulled out of the electronic device through the second hole, the guide slit may be formed such that the guide hole is separated from the guide pin while passing through the guide pin.

[0183] According to one embodiment, the handle may include a first region coupled to the first adhesive member, and at least one banding hole (372; 472) disposed between the first region and the guide hole.

[0184] According to one embodiment, the handle may be placed in the first space in a folded state along the at least one banding hole.

[0185] According to one embodiment, when the rear plate is viewed in the direction in which the first space is located, the first adhesive member and the handle can at least partially overlap.

[0186] According to one embodiment, the socket may be formed such that at least one storage medium can be placed therein.

[0187] According to one embodiment, the support structure includes a plate portion (320a) facing the rear plate and a side portion (320b) disposed at an edge of the plate portion, the first hole and the second hole may be formed in the side portion, and the first space may be formed in the plate portion.

[0188] According to one embodiment, an electronic device may be provided. The electronic device may include a housing (303) including a support structure (220; 320) and a rear plate (290; 390) facing each other with a first gap interposed therebetween, the support structure including a first hole (321) and a second hole (322) formed around the first hole and connected to a first space (323) within the housing, an adhesive member (380) coupled to the rear plate and the support structure, the adhesive member including a first adhesive member (381) and a second adhesive member (382) disposed at different sections of the first gap, and a handle (370) coupled to the first adhesive member and accommodated in the first space in a folded state at least once. The first adhesive member may include a first bonding structure (3811), and the second adhesive member may include a second bonding structure (3821) that has a shape that is interlocked with the first bonding structure and is spaced apart from the first bonding structure by a predetermined interval.

[0189] According to one embodiment, the socket (360) may further include a socket formed to accommodate at least one storage medium, wherein the socket is arranged to close the first hole and the second hole and at least a portion of the first hole is accommodated in the housing.

[0190] In one embodiment, the handle may be positioned within the first space such that a portion of the handle is visually exposed to the outside of the electronic device through the second hole when the socket is removed.

[0191] According to one embodiment, when the handle is pulled out of the electronic device through the second hole, the first adhesive member is configured to be pulled out of the electronic device through the first space and the second hole together with the handle, and the second adhesive member may be configured to be maintained in the first gap while being separated from the first adhesive member by the second coupling structure.

[0192] According to one embodiment, the support structure further includes a guide pin (324) protruding from a portion of the surface surrounding the first space into the first space, and the handle may include at least a guide hole (374; 474) formed to allow the guide pin to pass through.

[0193] Electronic devices according to embodiments of the present disclosure may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of the present disclosure are not limited to the aforementioned devices.

[0194] It should be understood that the embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to a specific embodiment, but include various modifications, equivalents, or substitutes of the embodiment. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the item, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0195] The term "module" used in one embodiment of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0196] An embodiment of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0197] According to one embodiment, the method according to one embodiment of the present disclosure may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0198] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device (101), A housing (303) comprising a support structure (220; 320) and a rear plate (290; 390) disposed facing each other with a first gap interposed therebetween, wherein the support structure comprises a first hole (321) and a second hole (322) formed around the first hole and connected to a first space (323) within the housing; A socket (360) arranged to close the first hole and the second hole and configured to be at least partially accommodated within the housing; An adhesive member (380) coupled to the rear plate and the support structure, comprising a first adhesive member (381) and a second adhesive member (382) arranged in different sections of the first gap; and An electronic device comprising a handle (370) coupled to the first adhesive member and accommodated in a folded state at least once within the first space.

2. In paragraph 1, An electronic device wherein the handle is positioned within the first space such that a portion of the handle is visually exposed to the outside of the electronic device through the second hole when the socket is removed.

3. In paragraph 1 or 2, An electronic device, wherein the first adhesive member includes a first bonding structure (3811), and the second adhesive member includes a second bonding structure (3821) having a shape that is interlocked with the first bonding structure and is spaced apart from the first bonding structure by a predetermined distance.

4. In any one of paragraphs 1 to 3, An electronic device, wherein when the handle is pulled out of the electronic device through the second hole, the first adhesive member is configured to be pulled out of the electronic device through the first space and the second hole together with the handle.

5. In any one of paragraphs 1 to 4, An electronic device, wherein when the first adhesive member is pulled out of the electronic device, the second adhesive member is configured to be separated from the first adhesive member and maintained in the first gap.

6. In any one of paragraphs 1 to 5, An electronic device wherein the first adhesive member is formed of a material having greater flexibility and elasticity than the second adhesive member.

7. In any one of paragraphs 1 to 6, An electronic device wherein the first adhesive member is disposed in a first section extending from a section connected to the first space among the first gaps, and the second adhesive member is disposed in a second section around the first section.

8. In any one of paragraphs 1 to 7, An electronic device wherein the support structure further includes a guide pin (324) protruding from a portion of a surface surrounding the first space into the first space, and the handle includes at least a guide hole (374; 474) formed to allow the guide pin to pass through.

9. In paragraph 8, An electronic device, wherein one end of the handle is at least partially connected to the first adhesive member, and the handle includes a guide slit (374a, 474a) connected to the guide hole at the opposite end.

10. In paragraph 8 or 9, An electronic device, wherein when the handle is pulled out of the electronic device through the second hole, the guide slit is formed such that the guide hole is separated from the guide pin while passing through the guide pin.

11. In any one of paragraphs 8 to 10, An electronic device, wherein the handle comprises a first region coupled to the first adhesive member, and at least one banding hole (372; 472) disposed between the first region and the guide hole.

12. In paragraph 11, An electronic device wherein the handle is arranged in the first space in a folded state along the at least one banding hole.

13. In any one of paragraphs 1 to 12, An electronic device wherein, when the rear plate is viewed in the direction in which the first space is located, the first adhesive member and the handle at least partially overlap.

14. In any one of paragraphs 1 to 13, An electronic device in which the above socket is formed so that at least one storage medium can be placed.

15. In any one of paragraphs 1 to 14, An electronic device wherein the support structure includes a plate portion (320a) facing the rear plate and a side portion (320b) disposed at an edge of the plate portion, wherein the first hole and the second hole are formed in the side portion, and the first space is formed in the plate portion.

Images