MEMS probe

Abstract

The present invention provides a MEMS probe, comprising a head, a base, and a cantilever. The head comprises a contact portion in contact with an electrode terminal of a test product and an identification portion arranged on a side of the contact portion and configured to perform CCD identification, wherein the identification portion is arranged on a cantilever side. The cantilever comprises a cantilever beam which is formed by extending the base in a horizontal direction and which is connected to the contact portion. There is a height difference between a connection fixing point of the cantilever beam and the contact portion and a connection fixing point of the cantilever beam and the base. The cantilever and the base are integrated. The present invention has the beneficial effects that the probe of the present invention improves the precision and accuracy of CCD identification, and effectively controls a contact surface with a PAD, thereby reducing the probability of damaging a test semiconductor circuit.

Description

A MEMS probe Technical Field

[0001] This invention belongs to the field of semiconductor technology, and specifically relates to a MEMS probe. Background Technology

[0002] With the advancement of semiconductor technology, integrated circuit chips are continuously developing towards higher speeds and higher integration levels. Simultaneously, this places design requirements on wafer testing systems, demanding high-frequency, small-pitch, and parallel testing. Probes are indispensable components in the integrated circuit chip packaging and testing process, used for testing integrated circuit products before packaging. To improve testing efficiency, probes utilizing MEMS technology have emerged. These probe cards can significantly increase the number of probes, thereby improving the efficiency of integrated circuit chip packaging and testing. The main principle of MEMS probe structures is to utilize MEMS technology to create a movable probe with micrometer-sized dimensions. Through the interaction between the probe and the object under test (DUT), functions such as detection, positioning, and identification of the DUT are achieved. Technical issues

[0003] Existing MEMS probes typically include a head that contacts the product to be inspected, with a recognition section connected to one side of the head for easy CCD recognition. However, in practical use, it has been found that the CCD's recognition accuracy for the recognition section is not high. Technical solutions

[0004] This invention provides a MEMS probe that can improve detection accuracy and reduce the probability of damaging the semiconductor circuit under test.

[0005] The objective of this invention is achieved through the following technical solution: A MEMS probe, comprising: a head, the head including a contact portion that contacts the electrode terminals of a product to be tested and a recognition portion for CCD recognition disposed on one side of the contact portion; the recognition portion having recognition protrusions with a spacing difference; the contact portion having an angled cross section with the surface of the product to be tested; a base for mounting the MEMS probe and fixing it on a probe substrate, the base being plate-shaped; a cantilever connecting the head and the base, including a cantilever beam extending horizontally upward from the base and connecting to the contact portion; a height difference being provided between the connection and fixing point of the cantilever beam and the contact portion and the connection and fixing point of the cantilever beam and the base, the cantilever and the base being integrated.

[0006] Preferably, the cross-sectional size of the identification protrusions is the same.

[0007] Preferably, the identification protrusion includes an inclined portion that slopes toward the contact portion and a vertical identification head disposed above the inclined portion.

[0008] Preferably, at least three identification protrusions are provided and arranged in a straight line.

[0009] Preferably, the cross-sectional area of ​​the contact portion gradually increases from top to bottom, and includes a first surface and a second surface that are angled to the product contact surface. The first surface and the second surface are respectively disposed on both sides of the product contact surface, and the second surface is disposed near the proximal end of the identification protrusion. The surface of the second surface is arc-shaped.

[0010] Preferably, the angle between the first surface and the vertical product contact surface is -5° to 10°, and the angle between the second surface and the vertical product contact surface is 5° to 45°. Beneficial effects

[0011] The beneficial effects of this invention are as follows: the probe of this invention improves the accuracy and precision of CCD recognition, and at the same time, effectively controls the contact surface with the PAD, thereby reducing the probability of damaging the semiconductor circuit under test. Attached Figure Description

[0012] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1: Schematic diagram of the structure of the present invention.

[0014] Figure 2: An enlarged schematic diagram of the head structure of the present invention.

[0015] Figure 3: A schematic diagram of the structure of the present invention, which better illustrates the cantilever beam. Embodiments of the present invention

[0016] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to Figures 1-3 and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0017] The present invention proposes a MEMS probe comprising a head, a base 2 and a cantilever 3 connecting the head and the base.

[0018] The head includes a contact portion 11 that contacts the electrode terminals of the product to be tested, and a recognition portion 12 for CCD recognition disposed on one side of the contact portion 11, the recognition portion being disposed on the cantilever side. The base portion 3 is used to mount the MEMS probe, fixing it to the probe substrate, and the base portion is plate-shaped. The cantilever includes a cantilever beam extending horizontally upward from the base to connect with the contact portion; a height difference is provided between the connection fixing point of the cantilever beam and the contact portion 11 and the connection fixing point of the cantilever beam and the base, and the cantilever and the base are integrated.

[0019] The recognition section is composed of recognition protrusions with varying intervals. Specifically, at least three recognition protrusions are provided and arranged in a straight line. The recognition protrusions have the same cross-sectional size. Each recognition protrusion includes an inclined portion 121 that slopes towards the contact portion and a vertical recognition head 122 disposed above the inclined portion 121. The recognition heads 122 have the same cross-sectional size, and the intervals between adjacent recognition heads 122 are varied, as shown in Figure 2. The interval C between the first and second recognition heads is different from the interval D between the second and third recognition heads. In this embodiment, the interval C is greater than the interval D. By using recognition heads with the same cross-section, errors caused by differences in shape and size can be reduced during use. At the same time, the varying intervals between the recognition heads are more conducive to CCD recognition and judgment, and will not cause unnecessary misidentification with the probe contact portion.

[0020] The contact portion 11 has an angled cross-section with the surface of the product to be tested. The cross-sectional area of ​​the contact portion gradually increases from top to bottom, and includes a first surface 111 and a second surface 112 that are angled with the product contact surface A. The first surface 111 and the second surface 112 are respectively located on both sides of the product contact surface A. The second surface 112 is located near the proximal end of the identification protrusion, and the surface of the second surface has a gentle arc shape, so that the contact portion has an R-shaped tip. The angle between the first surface 111 and the product contact vertical surface B is -5° to 10°, and the angle between the second surface 112 and the product contact vertical surface B is 5° to 45°.

[0021] In this invention, the cantilever beam includes a first cantilever beam 31, a second cantilever beam 32, and a third cantilever beam 33. Each cantilever beam has a minimum cross-sectional area portion located between the base connection fixing point and the end connection fixing point. The first cantilever beam 31 is an arc-shaped structure with a certain curvature. The height of the end connection fixing point 312 between the first cantilever and the contact head is lower than the height of the base connection fixing point 311 between the first cantilever and the base. The second cantilever beam 32 and the third cantilever beam 33 are S-shaped. The height of the connection fixing points between the second cantilever beam 32 and the third cantilever beam 33 and the contact head is higher than the height of the connection fixing points between the second cantilever beam 32 and the third cantilever beam 33 and the base. The end connection fixing point 322 of the second cantilever is higher than the base connection fixing point 321 of the second cantilever, and the end connection fixing point 332 of the third cantilever is higher than the base connection fixing point 331 of the third cantilever.

[0022] The extended inclination angle E at the base fixing point of the second cantilever beam 32 is smaller than the extended inclination angle F at the base fixing point of the third cantilever beam 33. The inclination angle refers to the angle formed by the line connecting the base to the contact head (end point) and the horizontal line. In this invention, the cantilever beam causes it to tilt towards the cantilever direction as the probe contact wears during the detection process. Simultaneously, combined with the structural characteristics of the contact part, the risk of it deviating from the PAD area is further reduced, thereby also reducing the probability of damaging the detection semiconductor circuitry.

[0023] Finally, it should be noted that the terms "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the present invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Industrial applicability

[0024] Furthermore, the above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A MEMS probe, characterized by: The utility model relates to a MEMS probe, including The head includes the contact part who contacts the electrode terminal of the product to be detected and the identification part for the CCD identification set up in the contact part one side, the identification part is provided with the identification convex who sets up the interval difference, the contact part is provided with the angle cross section with the surface of the product to be detected, the base is used for installing the MEMS probe, makes it fixed on the probe base, and the base is plate -shaped, The cantilever connects the head with the base and includes the cantilever beam formed by the base and extended in the horizontal direction and connected with the contact part, the fixed point of the connection between the cantilever beam and the contact part and the fixed point of the connection between the cantilever beam and the base are provided with the height difference, and the cantilever and the base are integrated. The cross section size of the identification convex is same.

2. The MEMS probe of claim 1, wherein: The identification convex includes the inclined part inclined to the contact part and the vertical identification head part set up above the inclined part.

3. A MEMS probe as claimed in claim 2, wherein: The identification convex is provided with at least three and arranged in a straight line.

4. A MEMS probe as claimed in claim 3, wherein: The cross section area of the contact part gradually expands from top to bottom, which includes the first surface and the second surface, and the first surface and the second surface are respectively arranged on both sides of the product contact surface, the second surface is arranged at the proximal end of the identification convex, and the surface of the second surface is arc-shaped.

5. A MEMS probe as claimed in claim 4, wherein: The included angle between the first surface and the vertical product contact surface is -5°-10°, and the included angle between the second surface and the vertical product contact surface is 5°-45°.

6. A MEMS probe as claimed in claim 5, wherein: ​

Images