MEMS-based wafer test probe

Abstract

The present application provides a MEMS-based wafer test probe, comprising: a contact head, which is in contact with an electrode terminal of a product under test; a base, which is used for mounting the MEMS-based wafer test probe so that the MEMS-based wafer test probe is fixed on a probe substrate; and a cantilever, which is connected to the contact head and the base and extends horizontally from the base to the contact head, wherein there is a height difference between the connection fixing point of the cantilever to the contact head and the connection fixing point of the cantilever to the base. In the present application, by adjusting the angular structure of the cantilever, low-stress operation can be achieved during testing, thereby prolonging the service life of the probe.

Description

MEMS wafer testing probes Technical Field

[0001] This utility model belongs to the field of semiconductor technology, specifically relating to a MEMS wafer test probe. Background Technology

[0002] With the advancement of semiconductor technology, integrated circuit chips are continuously developing towards higher speeds and higher integration levels. Simultaneously, this places demands on wafer testing systems, requiring high-frequency, small-pitch, and parallel testing capabilities. Wafer test probes are indispensable components in the integrated circuit chip packaging and testing process. They are used for testing integrated circuit products before packaging. To improve testing efficiency, probes utilizing MEMS technology have emerged. These probe cards can significantly increase the number of probes, thereby improving the efficiency of integrated circuit chip packaging and testing.

[0003] Existing MEMS wafer test probes are easily damaged under stress during use. Technical solutions

[0004] This invention provides a MEMS wafer testing probe that can improve the probe's lifespan.

[0005] The objective of this utility model is achieved through the following technical solution: a MEMS wafer test probe, comprising: a contact head for contacting the electrode terminals of the product to be tested; a base for mounting the MEMS wafer test probe and fixing it on a probe substrate; and a cantilever connecting the contact head and the base, extending horizontally upward from the base to the contact head, wherein a height difference is provided between the connection and fixing point of the cantilever and the contact head and the connection and fixing point of the cantilever and the base.

[0006] Preferably, there is one or more cantilever arms.

[0007] Preferably, the cantilever is configured as a first cantilever, a second cantilever, and a third cantilever from top to bottom, with the second and third cantilever forming an S-shape.

[0008] Preferably, the height of the connection and fixing points between the second cantilever, the third cantilever and the contact head is higher than the height of the connection and fixing points between the second cantilever, the third cantilever and the base.

[0009] Preferably, the first cantilever is arc-shaped, and the height of the connection and fixing point between the first cantilever and the contact head is lower than the height of the connection and fixing point between the first cantilever and the base.

[0010] Preferably, the angle of extension of the base fixing point of the second cantilever is smaller than the angle of extension of the base fixing point of the third cantilever.

[0011] Preferably, each cantilever is provided with a section with the smallest cross-sectional area. Beneficial effects

[0012] The beneficial effects of this utility model are reflected in the fact that by adjusting the angle structure of the cantilever, it can operate with low stress during detection, thereby improving the service life of the probe. Attached Figure Description

[0013] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1: Schematic diagram of the structure of this utility model.

[0015] Figure 2: A schematic diagram showing the motion deformation trajectory of the cantilever when the probe of this utility model is subjected to overspeed.

[0016] Among them, 1 is the base, 21 is the first cantilever, 22 is the second cantilever, 23 is the third cantilever, 211 is the base connection fixing point, 212 is the end connection fixing point, 221 is the base connection fixing point of the second cantilever, 222 is the end connection fixing point of the second cantilever, 231 is the base connection fixing point of the third cantilever, 232 is the end connection fixing point of the third cantilever, 31 is the circular trajectory of the first cantilever, 32 is the circular trajectory of the second cantilever, and 33 is the circular trajectory of the third cantilever. Embodiments of the present invention

[0017] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to Figures 1-2 and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the scope of the present utility model.

[0018] This invention discloses a MEMS wafer test probe, comprising a contact head 3 for contacting the electrode terminals of a product under test, a base 1 for mounting the MEMS wafer test probe and fixing it to a probe substrate, and one or more cantilever arms connecting the contact head 3 and the base 1. The cantilever arms extend horizontally upwards from the base to the contact head in an integral connection, and a height difference is provided between the connection point between the cantilever arm and the contact head and the connection point between the cantilever arm and the base.

[0019] In this embodiment, the cantilever arms are arranged sequentially from top to bottom as a first cantilever 21, a second cantilever 22, and a third cantilever 23. Each cantilever arm has a minimum cross-sectional area portion located between the base connection fixing point and the end connection fixing point. The first cantilever 21 is an arc-shaped arm with a certain curvature, and the height of the end connection fixing point 212 between the first cantilever arm and the contact head is lower than the height of the base connection fixing point 211 between the first cantilever arm and the base. The second cantilever 22 and the third cantilever 23 are S-shaped. The height of the connection fixing points between the second cantilever 22 and the third cantilever 23 and the contact head is higher than the height of the connection fixing points between the second cantilever 22 and the third cantilever 23 and the base. Specifically, the end connection fixing point 222 of the second cantilever arm is higher than the base connection fixing point 221, and the end connection fixing point 232 of the third cantilever arm is higher than the base connection fixing point 231.

[0020] The angle of inclination B at the base fixing point of the second cantilever 22 is less than the angle of inclination A at the base fixing point of the third cantilever 23. The angle of inclination refers to the angle formed by the line connecting the base to the contact head (i.e., the end point) and the horizontal line.

[0021] The probe of this invention is used similarly to existing MEMS probes. It is fixed to the probe substrate via the base 1, and its contact head 3 contacts the product to be tested. To better understand the principle behind this invention's low-stress, extended service life, the following description, in conjunction with Figure 2, illustrates this principle. When the probe is in use and an overspeed is applied, each cantilever deforms in a circular path, centered on its connection to the base, with a radius extending from the fixed point between the cantilever and the base to the fixed point between the cantilever and the end. Specifically, the first cantilever deforms counterclockwise along a circular trajectory 31, the second cantilever along a circular trajectory 32, and the third cantilever along a circular trajectory 33. At this time, the contact head 3 tilts linearly towards the base, thereby achieving low-stress operation and improving the probe's service life.

[0022] Finally, it should be noted that the terms "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used solely for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Industrial applicability

[0023] Furthermore, the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it; although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A MEMS wafer test probe, characterized by: The MEMS wafer test probe comprises a contact head, a base, and a cantilever. The contact head is used to contact the electrode terminal of the product to be detected. The base is used to mount the MEMS wafer test probe and fix it to the probe substrate. The cantilever is connected to the contact head and the base, and extends horizontally from the base to the contact head.

2. The MEMS wafer test probe of claim 1, wherein: The cantilever is provided with more than one.

3. The MEMS wafer test probe of claim 2, wherein: The cantilever is sequentially provided with a first cantilever, a second cantilever, and a third cantilever from top to bottom.

4. The MEMS wafer test probe of claim 3, wherein: The second cantilever and the third cantilever are S-shaped.

5. The MEMS wafer test probe of claim 4, wherein: The second cantilever and the third cantilever are higher than the base in the position of the connecting fixed point.

6. The MEMS wafer test probe of claim 4, wherein: The first cantilever is arc-shaped, and the position of the connecting fixed point of the first cantilever and the contact head is lower than the position of the connecting fixed point of the first cantilever and the base.

7. The MEMS wafer test probe of claim 3, wherein: The extension inclined angle of the base fixed point of the second cantilever is smaller than that of the third cantilever. Each cantilever is provided with a minimum cross-sectional area.

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