Electronic device

Abstract

The present application relates to the technical field of electronics, and provides an electronic device, enabling the electronic device to be further thinned. The electronic device comprises: a body comprising an annular appearance member and a support member, a sealing platform being provided at an edge of the support member, a side wall of the sealing platform being connected to the appearance member, a sound pickup duct being provided on the body, the sealing platform comprising a sealing surface, and a sealing platform opening being formed in the sealing surface; a bearing structure located in the annular appearance member, an edge of the bearing structure being fixed to the side of the sealing surface facing away from the support member, the bearing structure comprising a first hollow portion and a second hollow portion, the sealing platform opening being opposite to the first hollow portion and communicating the sound pickup duct with the first hollow portion; an enclosure cover provided on the side of the bearing structure facing away from the sealing platform, and covering the first hollow portion and the second hollow portion so as to form a ventilation cavity; and a microphone, which is located on the bearing structure and is on the same side as the sealing surface, wherein the microphone comprises a sound pickup hole, and the second hollow portion is opposite to the sound pickup hole and communicates the sound pickup hole with the ventilation cavity.

Description

Electronic device

[0001] This application claims priority from the Chinese patent application No. 202410949634.5 filed on July 15, 2024, and entitled "Electronic device", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the field of electronic technology, in particular to an electronic device. BACKGROUND

[0003] A microphone (MIC) is a very important component in electronic devices such as mobile phones, tablets, laptops, and smart wearable devices. It is a device that converts sound signals into electrical signals, which can convert sound signals into analog or digital signals for recording, calling, voice recognition, and other operations. Microphones can also be referred to as microphones, microphones, or microphones.

[0004] A microphone includes a protective shell, a pickup, a signal amplification circuit, a power supply circuit, and other structures arranged in the protective shell. The microphone has many components and is difficult to further reduce in size. However, for electronic devices with microphones, especially foldable electronic devices, in order to improve the portability and use of the electronic device, the electronic device needs to be further thinned. Therefore, how to layout the microphone in the electronic device to further thin the electronic device is a technical problem that needs to be solved. SUMMARY

[0005] To solve the above technical problems, the present application provides an electronic device which can further thin the electronic device.

[0006] The electronic device provided by the embodiment of the present application includes a body, the body includes an annular appearance piece and a support piece located in the appearance piece, an edge of the support piece is provided with a sealing table, a side wall of the sealing table is connected with the appearance piece, the body has a pickup pipeline, the sealing table includes a sealing surface, and a sealing table opening is formed in the sealing surface; a bearing structure is located in the appearance piece and opposite to the support piece, and an edge of the bearing structure is located on the sealing surface, the bearing structure includes a first hollow part and a second hollow part, the sealing table opening is opposite to the first hollow part and communicates the pickup pipeline and the first hollow part; a blocking cover is arranged on a side of the bearing structure away from the sealing surface and covers the first hollow part and the second hollow part to form an air passage cavity; a microphone is arranged on the bearing structure and on the same side of the sealing surface, the microphone includes a pickup hole, and the second hollow part is opposite to the pickup hole and communicates the pickup hole and the air passage cavity.

[0007] By arranging the microphone on the same side of the sealing table, the thickness of the electronic device can be reduced without reducing the height of the microphone, and the thickness of the electronic device can be reduced. In addition, the sound pickup pipe is arranged in the body, the sealing effect of the sound pickup pipe is good, air leakage is avoided, and the sound pickup effect is good.

[0008] Exemplarily, the bearing structure can be a printed circuit board; it can also be a printed circuit board and an auxiliary board; it can also be a printed circuit board and a connecting plate.

[0009] Exemplarily, the first hollow part can be a first through hole, and the second hollow part can be a second through hole; the first hollow part can also be a third through hole, and the second hollow part can be a second through hole and a fourth through hole; the first hollow part can also be a sixth through hole, and the second hollow part can be a seventh through hole.

[0010] In a possible implementation, the sound pickup pipe includes a first sound pickup section and a second sound pickup section, and the second sound pickup section includes a first sound pickup subsection, a second sound pickup subsection and a third sound pickup subsection; the first sound pickup section is located on the appearance part; the support part includes an upper surface and a lower surface, and the sealing table is arranged on the lower surface; the position of the sealing table on the support part is a preset position; the upper surface of the preset position is recessed to form the first sound pickup subsection, the second sound pickup subsection and the third sound pickup subsection; the second sound pickup subsection is located between the first sound pickup subsection and the third sound pickup subsection, and communicates the first sound pickup subsection and the third sound pickup subsection; the first sound pickup section communicates the first sound pickup subsection, and the third sound pickup subsection communicates the opening of the sealing table.

[0011] By slotting the upper surface of the preset position to form the first sound pickup subsection, the second sound pickup subsection and the third sound pickup subsection, the problem that the second sound pickup section is not easy to process due to the small height of the sealing table is avoided, and the processing difficulty is reduced; and the size of the second sound pickup section is no longer limited by the size in the height direction (i.e. the Z-axis direction), for example, the size of the first sound pickup subsection and / or the third sound pickup subsection in the horizontal direction (i.e. the Y-axis direction) can be increased to increase the width of the sound pickup pipe, thereby avoiding the problem that the size of the second sound pickup section in the height direction is small, i.e. the sound pickup pipe is very narrow, which affects the sound pickup performance.

[0012] In a possible implementation, the first sound pickup subsection extends through the upper surface and the lower surface of the preset position and extends to the sealing table without penetrating the sealing table; the third sound pickup subsection extends through the upper surface and the lower surface of the preset position and extends to the sealing table and penetrates the sealing table to communicate with the opening of the sealing table. In this way, the sound pickup channel is sealed, and the processing difficulty of the electronic device is reduced.

[0013] In a possible implementation, the electronic device further includes a first sealing structure located on the upper surface and configured to seal the first pickup sub-section, the second pickup sub-section and the third pickup sub-section.

[0014] The first sealing structure can prevent air from leaking through the first pickup sub-section, the second pickup sub-section and the third pickup sub-section, and improve the pickup performance.

[0015] In a possible implementation, the first sealing structure covers the openings of the first pickup sub-section, the second pickup sub-section and the third pickup sub-section on the upper surface. For example, the first sealing structure can include a cover plate or the like.

[0016] In a possible implementation, the electronic device further includes a display screen located on the side of the upper surface away from the lower surface; the first sealing structure is located between the upper surface and the display screen and surrounds the openings of the first pickup sub-section, the second pickup sub-section and the third pickup sub-section on the upper surface. In this way, the structure of the first sealing structure is simple. For example, the first sealing structure can be foam or double-sided tape or the like.

[0017] In a possible implementation, the bearing structure forms a step at the position corresponding to the sealing platform, and the sealing platform extends to the step.

[0018] By extending the sealing platform to the step and increasing the height of the sealing platform, an L-shaped pickup pipeline can be formed, that is, the length of the formed pickup pipeline is relatively short, which is beneficial to the pickup effect.

[0019] For example, when the bearing structure is a printed circuit board, the step is a step formed by the printed circuit board; when the bearing structure is a printed circuit board and an auxiliary plate, the gap between the auxiliary plate and the printed circuit board forms the step; when the bearing structure is a printed circuit board and a connecting plate, the gap between the connecting plate and the printed circuit board forms the step.

[0020] In a possible implementation, the bearing structure includes a printed circuit board, the printed circuit board forms a step at the position corresponding to the sealing platform; the printed circuit board is provided with a first through hole and a second through hole, the first hollow part includes the first through hole, and the second hollow part includes the second through hole; the first through hole is opposite to and communicates with the opening of the sealing platform; and the second through hole is opposite to and communicates with the pickup hole.

[0021] For example, the electronic device can be applied to a straight bar type electronic device, and the height of the sealing platform is increased while the structure is simple.

[0022] In a possible implementation, the bearing structure comprises a printed circuit board and an auxiliary plate, the auxiliary plate is located on the side of the printed circuit board away from the support; the printed circuit board forms a notch corresponding to the position of the sealing table, the auxiliary plate covers at least part of the notch, and the auxiliary plate and the notch form a step; the enclosing cover is arranged on the side of the auxiliary plate away from the sealing table and covers the first hollow part and the second hollow part to form the air passage cavity.

[0023] The auxiliary plate can seal the position of the notch, prevent air leakage due to the notch, and further improve the pickup effect.

[0024] In a possible implementation, the printed circuit board is provided with a second through hole; the auxiliary plate is provided with a third through hole and a fourth through hole, the third through hole is opposite and communicates with the sealing table opening, and the fourth through hole is opposite and communicates with the second through hole; the first hollow part comprises the third through hole, and the second hollow part comprises the second through hole and the fourth through hole.

[0025] In a possible implementation, the printed circuit board is provided with a fifth through hole corresponding to the position of the microphone; the auxiliary plate comprises a connecting plate, the microphone is arranged on the connecting plate and located in the fifth through hole; the connecting plate is provided with a sixth through hole and a seventh through hole, the sixth through hole is opposite and communicates with the sealing table opening, and the seventh through hole is opposite and communicates with the pickup hole; the first hollow part comprises the sixth through hole, and the second hollow part comprises the seventh through hole.

[0026] The cooperation of the connecting plate and the fifth through hole of the printed circuit board can further reduce the size of the electronic device in the thickness direction (for example, on the basis of the above scheme, the thickness of one printed circuit board is reduced).

[0027] For example, the thickness of the connecting plate is less than the thickness of the printed circuit board.

[0028] In a possible implementation, a second sealing structure is arranged between the auxiliary plate and the sealing table, the second sealing structure surrounds the sealing table opening, and surrounds the first hollow part.

[0029] The arrangement of the second sealing structure can prevent air leakage from the gap between the surfaces of the auxiliary plate and the sealing table away from the support.

[0030] For example, the second sealing structure can comprise foam, double-sided tape, etc.

[0031] In a possible implementation, the enclosing cover is formed by the existing structure of the electronic device. In this way, the enclosing cover does not need to be arranged separately, which can simplify the structure of the electronic device and the process steps for forming the electronic device.

[0032] In a possible implementation, the electronic device further includes a bracket located on the side of the bearing structure away from the support; the bracket is provided with a first enclosing wall on the side of the bracket facing the bearing structure, and the first enclosing wall surrounds the first hollow part and the second hollow part; and the first enclosing wall and the bracket form an enclosing cover. That is, the enclosing cover is formed by the bracket in the electronic device, which can include a printed circuit board bracket and the like. The first enclosing wall can be formed by a partial protrusion on the side of the bracket facing the bearing structure, or by a structure such as foam having a certain height.

[0033] In a possible implementation, the body further includes a shell located on the side of the bearing structure away from the support; the shell is provided with a second enclosing wall on the side of the shell facing the bearing structure, and the second enclosing wall surrounds the first hollow part and the second hollow part; and the second enclosing wall and the shell form an enclosing cover. That is, the enclosing cover is formed by the shell of the electronic device. The second enclosing wall can be formed by a partial protrusion on the side of the shell facing the bearing structure, or by a structure such as foam having a certain height.

[0034] In a possible implementation, the electronic device further includes a functional component located on the side of the bearing structure away from the sealing table, and the functional component is provided with a shielding cover around the functional component, the shielding cover is multiplexed as an enclosing cover, and the shielding cover is arranged on the first hollow part and the second hollow part. That is, the enclosing cover is formed by the existing shielding cover in the electronic device.

[0035] In a possible implementation, the electronic device further includes a dustproof net located between the sealing table and the bearing structure and covering the opening of the sealing table or the first hollow part. The dustproof net can isolate dust and the like from the outside.

[0036] In a possible implementation, the height of the enclosing cover is less than the height of the microphone, the enclosing cover reduces the height of the electronic device in the thickness direction while achieving the enclosing, which is beneficial to the thin design of the electronic device.

[0037] In a possible implementation, the electronic device is a foldable electronic device. Of course, this does not constitute a limitation on the present application, and the electronic device can also include a straight bar type electronic device and the like.

[0038] For example, when the electronic device is a foldable electronic device, the foldable electronic device includes a foldable mobile phone folded at two or more places. BRIEF DESCRIPTION OF DRAWINGS

[0039] FIG. 1a is a structural schematic diagram of an electronic device provided by an embodiment of the present application;

[0040] FIGS. 1b-1d are folding process diagrams of the electronic device in different folding states, respectively, provided by an embodiment of the present application;

[0041] FIG. 2 is a sectional view of the electronic device shown in FIG. 1 along the direction of AA'.

[0042] Fig. 3 is a cross-sectional view of the electronic device shown in Fig. 1 along the direction of BB';

[0043] Fig. 4 is another cross-sectional view of the electronic device shown in Fig. 1 along the direction of BB';

[0044] Fig. 5 is an enlarged view of a portion of the cross-sectional view shown in Fig. 4;

[0045] Fig. 6 is another cross-sectional view of the electronic device shown in Fig. 1 along the direction of BB';

[0046] Fig. 7a is another cross-sectional view of the electronic device shown in Fig. 1 along the direction of BB';

[0047] Fig. 7b is another cross-sectional view of the electronic device shown in Fig. 1 along the direction of BB';

[0048] Fig. 8a is another cross-sectional view of the electronic device shown in Fig. 1 along the direction of BB';

[0049] Fig. 8b is another cross-sectional view of the electronic device shown in Fig. 1 along the direction of BB';

[0050] Fig. 9 is another cross-sectional view of the electronic device shown in Fig. 1 along the direction of BB';

[0051] Fig. 10 is another cross-sectional view of the electronic device shown in Fig. 1 along the direction of BB';

[0052] Fig. 11 is a side view of a printed circuit board according to an embodiment of the present application;

[0053] Fig. 12 is another cross-sectional view of the electronic device shown in Fig. 1 along the direction of BB';

[0054] Fig. 13 is a structural schematic view of a printed circuit board according to an embodiment of the present application;

[0055] Fig. 14 is a positional relationship view of a printed circuit board and a support plate according to an embodiment of the present application;

[0056] Fig. 15 is another cross-sectional view of the electronic device shown in Fig. 1 along the direction of BB';

[0057] Fig. 16 is a structural schematic view of another printed circuit board according to an embodiment of the present application;

[0058] Fig. 17 is a positional relationship view of a printed circuit board and a support plate according to an embodiment of the present application. DETAILED DESCRIPTION

[0059] With reference to the drawings and the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described. Obviously, the described embodiments are some of the embodiments of the present application, but not all of the embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts should fall within the scope of the present application.

[0060] The term "and / or" used in this document merely describes an association relationship of associated objects, and indicates that three relationships can exist, for example, A and / or B can represent three cases of A existing alone, A and B existing together, and B existing alone.

[0061] The terms "first" and "second" and the like in the specification and claims of the embodiments of the present application are used to distinguish different objects, and are not used to describe a specific order of the objects. For example, the first target object and the second target object are used to distinguish different target objects, and are not used to describe a specific order of the target objects.

[0062] In the embodiments of the present application, the words "exemplary" or "for example" are used to mean serving as an example, instance, or illustration. Any embodiment or design presented as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being preferred or superior to other embodiments or design solutions. Rather, the use of "exemplary" or "for example" is intended to present relevant concepts in a specific manner.

[0063] In the description of the embodiments of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more. For example, a plurality of processing units means two or more processing units; a plurality of systems means two or more systems.

[0064] In describing some embodiments, the expression "connected" and its derivatives can be used. For example, the term "connected" can be used in describing some embodiments to indicate that two or more components are in direct physical or electrical contact with each other.

[0065] As used herein, "parallel," "perpendicular," "equal" include the recited condition and conditions that are approximately the recited condition, the range of which is within an acceptable deviation range, as determined by one of ordinary skill in the art taking into account the measurement being discussed and the error associated with the measurement of the particular quantity (i.e., limitations of the measurement system). For example, "parallel" includes absolute parallel and approximately parallel, where the acceptable deviation range for approximately parallel can be, for example, within 5° of deviation; "perpendicular" includes absolute perpendicular and approximately perpendicular, where the acceptable deviation range for approximately perpendicular can also be, for example, within 5° of deviation. "Equal" includes absolute equality and approximate equality, where the acceptable deviation range for approximate equality can be, for example, a difference between the two that is less than or equal to 5% of either.

[0066] An electronic device provided in an embodiment of the present application can be a mobile phone, a tablet computer, a personal digital assistant (PDA), a vehicle-mounted computer, a television, a smart wearable device (including but not limited to a smart watch, a bracelet, smart glasses, smart clothes, etc.), a smart home device, or any other electronic device provided with a microphone. In addition, the electronic device provided in an embodiment of the present application can be a straight-line electronic device or a folding electronic device. When the electronic device is a folding electronic device, it can be a folding electronic device that can be folded at one place or a folding electronic device that can be folded at multiple places (two places or more than two places). The specific form of the electronic device is not limited in the embodiments of the present application. For the convenience of description, the electronic device is taken as a folding electronic device that can be folded at two places in the following description.

[0067] Referring to FIG. 1a, FIG. 1a is a structural schematic diagram of an electronic device provided in an embodiment of the present application. As shown in FIG. 1a, the folding mobile phone 100 includes a flexible display screen (also referred to as a folding screen or a flexible screen) 10.

[0068] The flexible display screen 10 is a display screen with flexibility. The flexible display screen 10 can include an organic light emitting diode (OLED) display screen. The OLED display screen does not need a backlight module, and a substrate substrate in the OLED display screen can be made of a flexible resin material, for example, polyethylene terephthalate (PET), so that the OLED display screen has a bendable characteristic. Of course, the type of the flexible display screen 10 includes but is not limited to the OLED display screen, as long as the display screen that can be bent is within the protection scope of the present application, for example, it can also be a liquid crystal display (LCD) screen, an LED display screen (for example, including a Micro-LED display screen, a Mini-LED display screen), etc.

[0069] It should be noted that in order to clearly describe the subsequent structural features and the positional relationship of the structural features, the X-axis direction, the Y-axis direction and the Z-axis direction are used to define the positional relationship of the structures in the folding mobile phone 100. Among them, the X-axis direction is the width direction of the folding mobile phone 100 after being unfolded, the Y-axis direction is the length direction of the folding mobile phone 100 after being unfolded, and the Z-axis direction is the thickness direction of the folding mobile phone 100 after being unfolded.

[0070] Continuing to refer to FIG. 1, the folding mobile phone 100 further includes at least two bodies 20 and at least one hinge structure 30. Two adjacent bodies 20 are connected through one hinge structure 30, and the at least two bodies 20 and the at least one hinge structure 30 are used to carry the flexible display screen 10. The two bodies 20 on both sides of the hinge structure 30 can rotate around the hinge structure 30, so that the flexible display screen 10 is in a folded or unfolded state, that is, the folding mobile phone 100 is in a folded or unfolded state.

[0071] In the figure 1, the folding mobile phone 100 is taken as an example for illustration, which includes three body 20 and two hinge structure 30, i.e. the folding mobile phone 100 has two folding positions (i.e. two folding positions mentioned above). Specifically, the three body 20 includes the first body 20a, the second body 20b and the third body 20c, and the two hinge structure 30 includes the first hinge structure 30a and the second hinge structure 30b. Along the X-axis direction, the first body 20a and the second body 20b are located on both sides of the first hinge structure 30a, the first hinge structure 30a is connected with the first body 20a and the second body 20b respectively, and the first body 20a and the second body 20b can rotate around the first hinge structure 30a respectively. Along the X-axis direction, the second body 20b and the third body 20c are located on both sides of the second hinge structure 30b, the second hinge structure 30b is connected with the second body 20b and the third body 20c respectively, and the second body 20b and the third body 20c can rotate around the second hinge structure 30b respectively.

[0072] It can be understood that the folding mobile phone 100 includes two states in use, namely a folded state and an unfolded state. In the unfolded state, the first body 20a, the second body 20b and the third body 20c are substantially located in the same plane, so that the flexible display screen 10 is substantially planar, the user can operate the flexible display screen 10, and the flexible display screen 10 can display image or video information to realize large-screen display and improve the user's viewing experience. When the folding mobile phone 100 is in the unfolded state, the first body 20a and the second body 20b can rotate towards each other (i.e., relative rotation of the first body 20a and the second body 20b towards each other), thereby driving the first shaft structure 30a to fold, and the second body 20b and the third body 20c can rotate towards each other (i.e., relative rotation of the second body 20b and the third body 20c towards each other), thereby driving the second shaft structure 30b to fold. As shown in FIG. 1b, in the folding process, the ends of the first body 20a and the second body 20b away from the first shaft structure 30a move towards each other until they contact, and the ends of the second body 20b and the third body 20c away from the second shaft structure 30b move towards each other until they contact. At this time, the folding mobile phone 100 is in a folded state, and in the folded state, the first body 20a and the third body 20c are located on the two sides of the second body 20b along the Z-axis direction. This folding state can also be referred to as a "Z" shape folding state. When the folding mobile phone 100 is in the folded state, the folding mobile phone 100 is convenient to store and carry. Of course, the folding mobile phone 100 provided by the embodiment of the present application is not limited to this folding state. In other optional embodiments of the present application, the folding state can also be an inward folding form, that is, the third body 20c is folded in the middle, and the first body 20a and the second body 20b are located on the two sides of the third body 20c, as shown in FIG. 1c; or the first body 20a is folded in the middle along the Z-axis direction, and the second body 20b and the third body 20c are located on the two sides of the first body 20a along the Z-axis direction, as shown in FIG. 1d.

[0073] It should be noted that FIG. 1 is described by way of example of folding the folding mobile phone 100 along the longitudinal direction (i.e., the Y-axis direction), but does not constitute a limitation on the present application. In other optional embodiments of the present application, the folding mobile phone 100 can also be folded along the transverse direction (i.e., the X-axis direction). The following description is described by way of example of folding the folding mobile phone 100 along the longitudinal direction.

[0074] Continuing to refer to FIG. 1, the flexible display screen 10 can be divided into different parts. When folded, the parts of the flexible display screen 10 that are folded are the first bent display segment 12 and the second bent display segment 14, where the first bent display segment 12 is opposite the first rotating shaft structure 30a, i.e., the projection of the first bent display segment 12 on the plane formed by the X axis and the Y axis overlaps the projection of the first rotating shaft structure 30a on the plane formed by the X axis and the Y axis; and the second bent display segment 14 is opposite the second rotating shaft structure 30b, i.e., the projection of the second bent display segment 14 on the plane formed by the X axis and the Y axis overlaps the projection of the second rotating shaft structure 30b on the plane formed by the X axis and the Y axis. In the flexible display screen 10, along the X axis direction, the parts on both sides of the first bent display segment 12 are the first flat display segment 11 and the second flat display segment 13, respectively, and the parts on both sides of the second bent display segment 14 are the second flat display segment 13 and the third flat display segment 15, respectively. In the process of the folding mobile phone 100 changing from the unfolded state to the folded state, the angle between the plane where the first flat display segment 11 is located and the plane where the second flat display segment 13 is located changes with the bending of the first bent display segment 12, e.g., from 180° to 0°, and the angle between the plane where the second flat display segment 13 is located and the plane where the third flat display segment 15 is located changes with the bending of the second bent display segment 14, e.g., from 180° to 0°.

[0075] Referring to FIG. 2, FIG. 2 is a cross-sectional view of the electronic device shown in FIG. 1 along the AA' direction. As shown in FIG. 2, the first body 20a includes a first outer shell 21 and a first middle frame 22, the second body 20b includes a second outer shell 23 and a second middle frame 24, and the third body 20c includes a third outer shell 25 and a third middle frame 26.

[0076] The first outer shell 21 can be a back cover (also referred to as a battery cover) of the folding mobile phone 100; or can be a display screen for display, which is not limited in the embodiments of the present application. The second outer shell 23 can be a back cover (also referred to as a battery cover) of the folding mobile phone 100; or can be a display screen for display, which is not limited in the embodiments of the present application. The third outer shell 25 can be a back cover (also referred to as a battery cover) of the folding mobile phone 100; or can be a display screen for display, which is not limited in the embodiments of the present application.

[0077] The first middle frame 22 comprises a first appearance piece (structure exposed to the outside in the first middle frame 22) 221 and a first support piece 222 located between the first flat display section 11 and the first shell 21, and the first appearance piece 221 is fixedly connected with the first support piece 222, wherein the first appearance piece 221 and the first support piece 222 can be integrally formed, or separately formed and then fixed together by welding or adhesion.

[0078] The first appearance piece 221, the second appearance piece 241 and the third appearance piece 261 are all annular, the first flat display section 11, the first appearance piece 221 and the first shell 21 enclose a first accommodating cavity, and the first support piece 222 is located in the first accommodating cavity; the second flat display section 13, the second appearance piece 241 and the second shell 23 enclose a second accommodating cavity, and the second support piece 242 is located in the second accommodating cavity; and the third flat display section 15, the third appearance piece 261 and the third shell 25 enclose a third accommodating cavity, and the third support piece 262 is located in the third accommodating cavity.

[0079] The folding mobile phone 100 further comprises a printed circuit board 40, a microphone 50, a printed circuit board support 60, a loudspeaker (not shown in the figure), a camera (not shown in the figure) and a battery (not shown in the figure) and the like components. The printed circuit board 40 comprises a first surface M1 and a second surface M2, and along the Z-axis direction, the second surface M2 is located on the side away from the flexible display screen 10 of the first surface M1. The first surface M1 and / or the second surface M2 are provided with functional components such as a processor and a display driving chip (a chip for driving the flexible display screen 10 to display), and in order to avoid some functional components (such as the processor) from being interfered by other signals and affecting the performance, a shielding cover (not shown in the figure) is arranged around some functional components, that is, the shielding cover is arranged on the printed circuit board 40, and the printed circuit board 40 and the shielding cover form a sealed space, and some functional components which need to be shielded from other signal interference are arranged in the sealed space.

[0080] It can be understood that FIG. 1 and FIG. 2 and the relevant drawings below only schematically show some components included in the folding mobile phone 100, and the actual shape, actual size, actual position and actual structure of these components are not limited by FIG. 1 and FIG. 2 and the drawings below. In addition, when the electronic device is some other form of device, the electronic device 100 can also not include at least one of the flexible display 10, the body 20, the hinge structure 30, the printed circuit board support 60, the speaker (not shown in the figure), the camera (not shown in the figure) and the battery (not shown in the figure) and the like.

[0081] The first accommodating cavity, the second accommodating cavity and / or the third accommodating cavity are used to accommodate components such as the printed circuit board 40 (including functional components and shielding covers located thereon), the microphone 50, the printed circuit board support 60, the speaker, the camera and the battery, and the flexible display 10 and some components in the accommodating cavities are supported by the first support 222, the second support 242 and the third support 262, for example, the flexible display 10 can be bonded to the first support 222, the second support 242 and the third support 262 by an adhesive (not shown in the figure), the first flat display segment 11 of the flexible display 10 is supported by the first support 222, the second flat display segment 13 of the flexible display 10 is supported by the second support 242, and the third flat display segment 15 of the flexible display 10 is supported by the third support 262.

[0082] In some embodiments, the printed circuit board 40, the microphone 50 and the printed circuit board support 60 are located in the first accommodating cavity, but this does not constitute a limitation of the present application, and in other optional embodiments of the present application, the printed circuit board 40, the microphone 50 and the printed circuit board support 60 can also be located in the second accommodating cavity or the third accommodating cavity. The embodiments of the present application take the case where the printed circuit board 40, the microphone 50 and the printed circuit board support 60 are located in the first accommodating cavity as an example for description.

[0083] Similarly, other components (such as the speaker, the battery and the like) can be located in the first accommodating cavity, can also be located in the second accommodating cavity, and can also be located in the third accommodating cavity. In addition, different components can be located in the same accommodating cavity, or can be located in different accommodating cavities, for example, the speaker is located in the second accommodating cavity, and the battery is located in the third accommodating cavity. Those skilled in the art can set the positions of the components according to the actual situation.

[0084] Continuing to refer to FIG. 2, the microphone 50 is disposed on the printed circuit board 40, and the microphone 50 interacts with other functional components (such as a processor) on the printed circuit board 40 through the printed circuit board 40. The printed circuit board support 60 is located between the printed circuit board 40 and the first housing 21, and the printed circuit board support 60 is used to press-fit some components on the printed circuit board 40, and / or is used to carry some components. For example, when the speaker is located in the first accommodating cavity, the printed circuit board support 60 press-fits the speaker with interference to prevent the speaker from shaking and affecting the sound quality and the like.

[0085] The microphone 50 can convert a sound signal into an analog signal or a digital signal for recording, calling, voice recognition and the like. Specifically, in combination with FIG. 1, the microphone 50 has a sound collection hole for collecting a sound signal and a sound collector for processing the sound signal, and correspondingly, the first middle frame 22 is provided with a sound collection pipeline p in communication with the sound collection hole. A sound signal outside the electronic device is transmitted to the sound collection hole of the microphone 50 through the sound collection pipeline p of the first middle frame 22, and the sound signal is converted into an analog signal or a digital signal by the sound collector of the microphone 50 and is sent to the processor for recording, calling, voice recognition and the like. The shorter the length of the sound collection pipeline p is, the more conducive to the sound collection effect.

[0086] In combination with FIG. 3, which is a sectional view of the electronic device shown in FIG. 1 along the direction of BB', along the Z-axis direction, the first support 222 includes opposite upper and lower surfaces M3 and M4. The upper surface M3 is adjacent to the flexible display screen 10, and the lower surface M4 is located on the side of the upper surface M3 away from the flexible display screen 10. Along the Z-axis direction, the lower surface M4 of the first support 222 is provided with a sealing table 2221 located at the edge of the first support 222, and the side wall of the sealing table 2221 is connected with the first appearance member 221. For example, the first appearance member 221 includes a top edge frame (not shown in the drawings), a bottom edge frame 2211, a left side edge frame 2212 and a right side edge frame 2213, and the top edge frame, the bottom edge frame 2211, the left side edge frame 2212 and the right side edge frame 2213 form a ring-shaped (such as a square ring-shaped) first appearance member 221. Along the Y-axis direction, the top edge frame and the bottom edge frame 2211 are oppositely arranged; along the X-axis direction, the left side edge frame 2212 and the right side edge frame 2213 are oppositely arranged. The sealing table 2221 can be integrally formed with the bottom edge frame 2211 of the first appearance member 221. Of course, in other optional embodiments of the present application, the sealing table 2221 can also be integrally formed with the top edge frame, the left side edge frame 2212 or the right side edge frame 2213.

[0087] It should be noted that the top, bottom, left and right are the positions of various regions of the first appearance member 221 when the user holds the foldable mobile phone 100 with the flexible display screen 10 of the foldable mobile phone 100 facing the user.

[0088] Of course, the sealing platform 2221 can also be located at the edge of other support members (such as the second support member 242 or the third support member 262), and the side wall thereof is connected with the appearance member (such as the second appearance member 241 or the third appearance member 261) corresponding to the other support member. The embodiment of the present application is described by taking the sealing platform 2221 located at the edge of the first support member 222 and the side wall thereof connected with the first appearance member 221 as an example.

[0089] In the Z-axis direction, the printed circuit board 40 overlaps the sealing platform 2221, and the first surface M1 of the portion of the printed circuit board 40 overlapping the sealing platform 2221 is provided with a sealing member 70 between the sealing surface of the sealing platform 2221 (the side of the sealing platform 2221 facing the printed circuit board 40 and overlapping the printed circuit board 40), wherein the sealing member 70 can include sealing foam, rubber, or adhesive, etc., which can play a sealing role.

[0090] The microphone 50 is arranged on the second surface M2 of the printed circuit board 40 and corresponds to the sealing platform 2221, that is, in the Z-axis direction, the microphone 50 and the sealing platform 2221 are respectively located on the opposite sides of the printed circuit board 40, and the projection of the microphone 50 on the plane composed of the X-axis and the Y-axis overlaps the projection of the sealing platform 2221 on the plane composed of the X-axis and the Y-axis.

[0091] In this case, the sound pickup pipeline p includes a first sound pickup section p1 and a second sound pickup section p2. The bottom frame 2211 connected with the sealing platform 2221 is provided with the first sound pickup section p1, and the sealing platform 2221 is provided with the second sound pickup section p2. Correspondingly, the printed circuit board 40 is provided with a first through hole 41, and the first through hole 41 penetrates the first surface M1 and the second surface M2 of the printed circuit board 40 to communicate the second sound pickup section p2 with the sound pickup hole of the microphone 50, so that the sound signal outside the electronic device is transmitted to the sound pickup hole of the microphone 50 through the first sound pickup section p1, the second sound pickup section p2 and the first through hole 41. The cooperation of the sealing platform 2221 and the sealing member 70 can achieve a better sealing effect, preventing the sound signal from leaking during the transmission from the first sound pickup section p1 of the bottom frame 2211 to the sound pickup hole of the microphone 50.

[0092] In addition, the arrangement of the sealing platform 2221 can also form an accommodation space between the first surface M1 of the printed circuit board 40 and the lower surface M4 of the first support member 222, so that functional components can be arranged on the first surface M1 of the printed circuit board 40 in addition to the functional components arranged on the second surface M2 of the printed circuit board 40, thereby increasing the number of functional components integrated on the printed circuit board 40.

[0093] It can be understood that, since FIG. 3 is described by taking the example that the sealing platform 2221 is connected with the bottom frame 2211, the bottom frame 2211 is provided with the first pickup section p1. However, this does not constitute a limitation on the present application, when the sealing platform 2221 is connected with the top frame, the top frame can be provided with the first pickup section p1; or, when the sealing platform 2221 is connected with the left side frame 2212, the left side frame 2212 can be provided with the first pickup section p1; or, when the sealing platform 2221 is connected with the right side frame 2213, the right side frame 2213 can be provided with the first pickup section p1.

[0094] Continuing to refer to FIG. 3, since the microphone 50 and the sealing platform 2221 are respectively located on the opposite sides of the printed circuit board 40, a distance H0 between the lower surface M4 of the first support 222 and the surface of the microphone 50 away from the printed circuit board 40 (including the height of the microphone 50, the thickness of the printed circuit board 40, the thickness of the sealing member 70 and the distance from the sealing surface of the sealing platform 2221 to the lower surface M4 of the first support 222) is large, which cannot meet the design of thin and light electronic equipment. In order to reduce the distance H0 between the lower surface M4 of the first support 222 and the surface of the microphone 50 away from the printed circuit board 40, the height of the microphone 50 can be reduced, but this will cause the performance of the microphone 50 to decrease; or the microphone 50 is placed at other positions (not provided on the printed circuit board 40) and a flexible printed circuit (FPC) is arranged, and then the microphone 50 is connected to the printed circuit board 40 through a spring or a connector (such as a BTB), but this will cause the microphone 50 to occupy a large space of the whole machine.

[0095] In addition, in order to avoid the influence of the sealing platform 2221 on the design of thin and light electronic equipment, the height (the size in the Z-axis direction) of the sealing platform 2221 is generally small, so that the size of the second pickup section p2 in the Z-axis direction is small, that is, the pickup pipeline p becomes very narrow, which affects the pickup performance; in addition, it is not conducive to the processing of the second pickup section p2, that is, the processing difficulty of forming the second pickup section p2 is increased.

[0096] Based on this, the present application further provides an electronic device. The specific structure of the electronic device is described below.

[0097] In one example, referring to FIG. 4 and FIG. 5, FIG. 4 is another cross-sectional view of the electronic device shown in FIG. 1 along the direction of BB', and FIG. 5 is an enlarged view of part of the structure in the cross-sectional view shown in FIG. 4. As shown in FIG. 4 and FIG. 5, different from the above-mentioned embodiments, the microphone 50 is arranged on the first surface M1 of the printed circuit board 40, the printed circuit board 40 is provided with a second through hole 42 at the position corresponding to the pickup hole of the microphone 50, and the second through hole 42 penetrates the first surface M1 and the second surface M2 of the printed circuit board 40.

[0098] The folding mobile phone 100 further comprises a surrounding cover 80 arranged on the second surface M2 of the printed circuit board 40 and covering the first through hole 41 and the second through hole 42. The second surface M2 of the printed circuit board 40 and the surrounding cover 80 form a ventilation cavity P3, and the sound pickup duct p and the ventilation cavity P3 jointly form a sound pickup channel of the microphone 50. The ventilation cavity can only ventilate at the positions of the first through hole 41 and the second through hole 42, so that sound signals entering from the first through hole 41 or the second through hole 42 can be prevented from being transmitted to other areas.

[0099] The position of the first support 222 corresponding to the sealing table 2221 is defined as a preset position, i.e., the sealing table 2221 is arranged on the lower surface M4 of the first support 222 at the preset position.

[0100] The second sound pickup section p2 comprises a first sound pickup subsection p21, a second sound pickup subsection p22 and a third sound pickup subsection p23.

[0101] The upper surface M3 of the preset position comprises a first preset area, a second preset area and a third preset area, and the first preset area, the second preset area and the third preset area are different in position on the upper surface M3. The first preset area of the upper surface M3 of the preset position is recessed to form the first sound pickup subsection p21, the second preset area of the upper surface M3 of the preset position is recessed to form the second sound pickup subsection p22, and the third preset area of the upper surface M3 of the preset position is recessed to form the third sound pickup subsection p23. The second sound pickup subsection p22 is connected to the first sound pickup subsection p21 and the third sound pickup subsection p23, the first sound pickup subsection p21 is connected to the second sound pickup subsection p22 and the first sound pickup section p1, and the third sound pickup subsection p23 is connected to the second sound pickup subsection p22 and the first through hole 41 of the printed circuit board 40.

[0102] In this case, the sound signals outside the electronic device are transmitted to the sound pickup hole of the microphone 50 through the first sound pickup section p1, the first sound pickup subsection p21, the second sound pickup subsection p22, the third sound pickup subsection p23, the first through hole 41, the ventilation cavity P3 formed by the second surface M2 of the printed circuit board 40 and the surrounding cover 80, and the second through hole 42.

[0103] It should be noted that the specific arrangement (including the height in the Z-axis direction and the width in the direction parallel to the XY-axis plane) of the first sound pickup subsection p21, the second sound pickup subsection p22 and the third sound pickup subsection p23 is not limited in the embodiments of the present application, and can be arranged according to actual conditions by those skilled in the art.

[0104] In some embodiments, the first pickup sub-section p21 can penetrate the upper surface M3 and the lower surface M4 of the preset position, and the first pickup sub-section p21 extends to the sealing platform 2221 but does not penetrate the sealing platform 2221, so as to communicate with the first pickup section p1 on the bottom frame 2211 connected with the sealing platform 2221. The second pickup sub-section p22 does not penetrate the upper surface M3 and the lower surface M4 of the preset position; or, the second pickup sub-section p22 penetrates the upper surface M3 and the lower surface M4 of the preset position, and the second pickup sub-section p22 extends to the sealing platform 2221 but does not penetrate the sealing platform 2221. In the Z-axis direction, the depth of the second pickup sub-section p22 can be less than the depth of the first pickup sub-section p21, that is, the distance between the bottom wall of the second pickup sub-section p22 and the upper surface M3 is less than the distance between the bottom wall of the first pickup sub-section p21 and the upper surface M3. Of course, the depth of the second pickup sub-section p22 and the depth of the first pickup sub-section p21 are not limited to this relationship, and in other alternative embodiments of the present application, the depth of the second pickup sub-section p22 can also be equal to or greater than the depth of the first pickup sub-section p21. The third preset area of the upper surface M3 of the preset position is recessed to form a third pickup sub-section p23, the third pickup sub-section p23 penetrates the upper surface M3 and the lower surface M4 of the preset position, and the third pickup sub-section p23 extends to the sealing platform 2221 and penetrates the sealing platform 2221, so as to communicate with the first through hole 41 of the printed circuit board 40. The second pickup sub-section p22 also communicates with the third pickup sub-section p23.

[0105] In this way, along the Z-axis direction, the distance H0 between the lower surface M4 of the first support 222 and the surface of the microphone 50 away from the side of the printed circuit board 40 becomes the distance H1 between the lower surface M4 of the first support 222 and the surface of the enclosure 80 away from the side of the printed circuit board 40, where H0 includes the height of the microphone 50, the thickness of the printed circuit board 40, the thickness of the sealing member 70, and the distance from the sealing surface of the sealing platform 2221 to the lower surface M4 of the first support 222, and H1 includes the height of the enclosure 80, the thickness of the printed circuit board 40, the thickness of the sealing member 70, and the distance from the sealing surface of the sealing platform 2221 to the lower surface M4 of the first support 222, that is, the difference between H0 and H1 is only the height of the microphone 50 and the height of the enclosure 80. Since the microphone 50 has many components, its height (generally about 1 mm) is difficult to further reduce (reducing the height of the microphone 50 will cause the performance of the microphone 50 to decrease), and according to the characteristics of the pickup channel of the microphone 50: the closer to the microphone 50, the smaller the width (i.e., the size in the Z-axis direction) of the pickup channel, therefore, the width (i.e., the size in the Z-axis direction) of the air cavity P3 enclosed by the second surface M2 of the printed circuit board 40 and the enclosure 80 is smaller than the width (i.e., the size in the Z-axis direction) of the first pickup section p1, and the width of the first pickup section p1 is generally about 1 mm, so the height of the enclosure 80 (i.e., the size in the Z-axis direction of the air cavity P3) is generally less than 1 mm, such as 0.5 mm. Therefore, the distance H1 between the lower surface M4 of the first support 222 and the surface of the enclosure 80 away from the side of the printed circuit board 40 is small, thereby being able to reduce the size of the electronic device in the Z-axis direction, which is conducive to reducing the overall thickness of the electronic device. Moreover, without changing the height of the microphone 50 and without setting the microphone 50 on the FPC and converting to the printed circuit board 40 through the spring or the connector. Further, the distance H1 between the lower surface M4 of the first support 222 and the surface of the enclosure 80 away from the side of the printed circuit board 40 is small, and accordingly, the height of the bottom bezel 2211 having the first pickup section p1 is also small. In order to facilitate the processing of the first pickup section p1 (i.e., the first pickup section p1 needs a certain wall thickness above and below), the appearance requirement, or the limitation of the arc surface of the edge of the display screen, the first pickup section p1 is generally located at the middle position of the bottom bezel 2211, and if the pickup pipeline p is formed in the manner of FIG. 3, it will affect the printed circuit board 40, therefore, the present application forms the first pickup sub-section p21, the second pickup sub-section p22, and the third pickup sub-section p23 by slotting the upper surface M3 of the preset position, which can avoid the influence on the printed circuit board 40 when the pickup pipeline p is formed.

[0106] In addition, the upper surface M3 of the preset position is slotted to form the first pickup sub-section p21, the second pickup sub-section p22 and the third pickup sub-section p23, and the problem that the second pickup section p2 is not easy to process due to the small height of the sealing table 2221 can be avoided, and the processing difficulty is reduced; and the size of the second pickup section p2 is no longer limited by the size in the Z-axis direction (for example, the size of the first pickup sub-section p21 and / or the third pickup sub-section p23 in the Y-axis direction can be increased to increase the width of the pickup pipeline), and the problem that the size of the second pickup section p2 in the Z-axis direction is small, that is, the pickup pipeline p becomes very narrow, which affects the pickup performance, is avoided.

[0107] In some embodiments, the folding mobile phone 100 further comprises a first sealing structure 90 for sealing the first pickup sub-section p21, the second pickup sub-section p22 and the third pickup sub-section p23 to prevent air leakage from the gap between the flexible display screen 10 and the preset position of the first support 222, and to improve the pickup performance.

[0108] For the specific structure of the first sealing structure 90, the embodiments of the present application are not limited. In one possible implementation, continuing to refer to FIG. 4, the first sealing structure 90 can be a cover plate covering the openings of the first pickup sub-section p21, the second pickup sub-section p22 and the third pickup sub-section p23 on the upper surface M3, and the edge of the cover plate 90 is fixed on the upper surface M3 of the first support 222. For example, the cover plate can be a steel sheet, glass or the like.

[0109] In another possible implementation, referring to FIG. 6, which is another sectional view of the electronic device shown in FIG. 1 along the direction of BB', as shown in FIG. 6, the first sealing structure 90 can be a sealing ring located between the upper surface M3 of the first support 222 and the flexible display screen 10, and surrounding the openings of the first pickup sub-section p21, the second pickup sub-section p22 and the third pickup sub-section p23 on the upper surface M3. The sealing ring includes a ring of structures such as back glue, glue dots or foam that have a sealing effect.

[0110] For the above-mentioned enclosing cover 80, it can be formed separately or enclosed by the structure inside the folding mobile phone 100. When the enclosing cover 80 is enclosed by the structure inside the folding mobile phone 100, the structure of the folding mobile phone 100 can be simplified, and the process steps for forming the folding mobile phone 100 are also simplified.

[0111] In a possible implementation, referring to FIG. 7a, which is another cross-sectional view of the electronic device shown in FIG. 1 along the direction of BB', the printed circuit board support 60 is partially protruded towards one side of the second surface M2 of the printed circuit board 40 to form a first enclosing wall 61, and the first enclosing wall 61 encloses the first through hole 41 and the second through hole 42. That is, the first enclosing wall 61 is annular, and the first through hole 41 and the second through hole 42 are located in the area enclosed by the first enclosing wall 61. In addition, a first annular enclosing adhesive 62 is arranged between the first enclosing wall 61 and the second surface M2 of the printed circuit board 40, which can better seal the gap between the first enclosing wall 61 and the second surface M2 of the printed circuit board 40. In this way, the printed circuit board support 60, the annular first enclosing wall 61 and the first annular enclosing adhesive 62 form an enclosing cover 80 covering the first through hole 41 and the second through hole 42. Alternatively, referring to FIG. 7b, which is another cross-sectional view of the electronic device shown in FIG. 1 along the direction of BB', the first annular enclosing adhesive 62 is an adhesive layer with a certain thickness, so that the side of the printed circuit board support 60 towards the second surface M2 of the printed circuit board 40 does not need to be provided with a protrusion, but forms an annular first enclosing wall through the first annular enclosing adhesive 62. That is, the printed circuit board support 60 and the first annular enclosing adhesive 62 form an enclosing cover 80 covering the first through hole 41 and the second through hole 42. The first annular enclosing adhesive 62 can include foam, dispensing, back adhesive, rubber or soft glue, etc.

[0112] In another possible implementation, referring to FIG. 8a, which is another cross-sectional view of the electronic device shown in FIG. 1 along the direction of BB', the first housing 21 is partially protruded towards the side of the second surface M2 of the printed circuit board 40 to form a second enclosing wall 210, which encloses the first through hole 41 and the second through hole 42. That is, the second enclosing wall 210 is annular, and the first through hole 41 and the second through hole 42 are located in the area enclosed by the second enclosing wall 210. In addition, a second annular enclosing glue 211 is arranged between the second enclosing wall 210 and the second surface M2 of the printed circuit board 40, which can better seal the gap between the second enclosing wall 210 and the second surface M2 of the printed circuit board 40. In this way, the first housing 21, the annular second enclosing wall 210 and the second annular enclosing glue 211 form an enclosing cover 80 covering the first through hole 41 and the second through hole 42. Alternatively, referring to FIG. 8b, which is another cross-sectional view of the electronic device shown in FIG. 1 along the direction of BB', the second annular enclosing glue 211 is a glue layer with a certain thickness, so that the side of the first housing 21 towards the second surface M2 of the printed circuit board 40 does not need to be provided with a protrusion, but forms a second enclosing wall through the second annular enclosing glue 211. That is, the printed circuit board support 60 and the second annular enclosing glue 211 form an enclosing cover 80 covering the first through hole 41 and the second through hole 42. The second annular enclosing glue 211 can include foam, dispensing glue, back glue, rubber or soft glue, etc.

[0113] In another possible implementation, the shielding cover of some functional components located on the second surface M2 of the printed circuit board 40 extends to the position of the first through hole 41 and the second through hole 42. That is, not only the functional components are located in the shielding cover, but also the first through hole 41 and the second through hole 42 are located in the area enclosed by the shielding cover. It can also be said that due to the good sealing effect of the shielding cover, the shielding cover of some functional components can also be reused as the enclosing cover 80.

[0114] It should be noted that the following description is based on the enclosing cover 80 being formed separately as an example.

[0115] In some embodiments, referring to FIG. 9, which is another cross-sectional view of the electronic device shown in FIG. 1 along the direction of BB', the folding mobile phone 100 further includes a dust screen 110 located between the sealing surface of the sealing table 2221 and the first surface M1 of the printed circuit board 40. Specifically, the dust screen 110 can be fixed on the sealing surface of the sealing table 2221 and cover the opening (which can also be referred to as the sealing table opening) of the third sound pickup sub-section p23 on the sealing table 2221; or the dust screen 110 can be fixed on the first surface M1 of the printed circuit board 40 and cover the opening of the first through hole 41 on the first surface M1. The arrangement of the dust screen 110 can isolate dust and the like from the outside.

[0116] In another example, referring to FIG. 10 and FIG. 11, FIG. 10 is another cross-sectional view of the electronic device shown in FIG. 1 along the direction of BB', and FIG. 11 is a side view of a printed circuit board provided in an embodiment of the present application. As shown in FIG. 10 and FIG. 11, different from the first example, a step 43 is formed at the position corresponding to the sealing platform 2221 of the printed circuit board 40, i.e., the position corresponding to the sealing platform 2221 of the printed circuit board 40 is thinned (i.e., the thickness is reduced), that is, the distance h1 from the bottom surface of the step 43 to the second surface M2 is less than the thickness h2 of the printed circuit board 40. In the direction of the Z axis, the sealing platform 2221 extends to the step 43 of the printed circuit board 40, so that the height of the sealing platform 2221 (i.e., the distance from the sealing surface of the sealing platform 2221 to the lower surface M4 of the first support 222) can be increased.

[0117] Correspondingly, the second pickup section p2 includes a fourth pickup subsection p24 and a fifth pickup subsection p25. The fourth pickup subsection p24 has the same extension direction as the first pickup section p1, and the extension direction of each of them is the Y axis direction. In this way, the first pickup section p1 and the fourth pickup subsection p24 can be formed simultaneously through one processing procedure. Since the height of the sealing platform 2221 is high, the size of the first pickup section p1 and the fourth pickup subsection p24 in the direction of the Z axis can be large, avoiding the problem that the height of the sealing platform 2221 is small, which is not conducive to the processing of the second pickup section p2, reducing the processing difficulty; and avoiding the problem that the size of the first pickup section p1 and the fourth pickup subsection p25 in the direction of the Z axis is small, i.e., the pickup pipeline p becomes very narrow, affecting the pickup performance.

[0118] The extension direction of the fifth pickup subsection p25 is the Z axis direction. For example, a groove can be formed in the sealing surface of the sealing platform 2221 (i.e., the opening of the groove is located in the sealing surface, and the opening of the groove is also called the sealing platform opening), and the groove is communicated with one end of the fourth pickup subsection p24 away from the first pickup section p1, forming the fifth pickup subsection p25 extending in the direction of the Z axis.

[0119] In this case, the sound signal outside the electronic device is transmitted to the pickup hole of the microphone 50 through the first pickup section p1, the fourth pickup subsection p24, the fifth pickup subsection p25, the first through hole 41, the ventilation cavity formed by the second surface M2 of the printed circuit board 40 and the enclosing cover 80, and the second through hole 42.

[0120] Since the first pickup section p1 and the fourth pickup subsection p24 extend along the Y-axis direction, the fifth pickup subsection p25 extends along the Z-axis direction, and one end of the fifth pickup subsection p25 (not included in the end of the sealing table 2221 having the sealing table opening formed in the sealing surface thereof) communicates with the end of the fourth pickup subsection p24 away from the first pickup section p1, the first pickup section p1, the fourth pickup subsection p24, and the fifth pickup subsection p25 form an L-shaped pickup pipeline p. In this way, the length of the formed pickup pipeline P is short, and the length of the formed pickup channel is also short, which is beneficial to the pickup effect. Further, as shown in FIG. 4, in order to facilitate the formation of the first pickup subsection p21, the second pickup subsection p22, and the third pickup subsection p23 (occupying a larger dimension along the Y-axis direction), the printed circuit board 40 needs to be moved away from the bottom frame 2211, that is, the edge of the printed circuit board 40 close to the bottom frame 2211 is far away from the bottom frame 2211. In this way, the length of the pickup pipeline p is long. In the present example, since the first pickup subsection p21, the second pickup subsection p22, and the third pickup subsection p23 do not need to be formed, the printed circuit board 40 can be moved towards the bottom frame 2211, that is, the edge of the printed circuit board 40 close to the bottom frame 2211 is close to the bottom frame 2211. Accordingly, the distance between the microphone 50 and the bottom frame 2211 is also reduced, and the length of the pickup channel is further reduced, which is beneficial to the pickup effect.

[0121] That is, in the present example, on the basis of reducing the dimension of the electronic device in the Z-axis direction (the distance H0 between the lower surface M4 of the first support 222 and the surface of the microphone 50 away from the printed circuit board 40, which becomes the distance H1 between the lower surface M4 of the first support 222 and the surface of the enclosure 80 away from the printed circuit board 40), by extending the sealing table 2221 to the step 43 of the printed circuit board 40 and increasing the height of the sealing table 2221, the L-shaped pickup pipeline p can be formed, that is, the length of the formed pickup pipeline P is short, and the length of the formed pickup channel is also short, which is beneficial to the pickup effect. Since the first pickup subsection p21, the second pickup subsection p22, and the third pickup subsection p23 do not need to be formed, the printed circuit board 40 can be moved towards the bottom frame 2211, that is, the edge of the printed circuit board 40 close to the bottom frame 2211 is close to the bottom frame 2211. Accordingly, the distance between the microphone 50 and the bottom frame 2211 is also reduced, and the length of the pickup channel is further reduced, which is beneficial to the pickup effect.

[0122] In another example, referring to FIG. 12, FIG. 13 and FIG. 14, FIG. 12 is another cross-sectional view of the electronic device shown in FIG. 1 along the direction of BB', FIG. 13 is a structural schematic diagram of a printed circuit board provided in the embodiment, and FIG. 14 is a diagram of the positional relationship between the printed circuit board and the auxiliary board provided in the embodiment. As shown in FIG. 12, FIG. 13 and FIG. 14, different from the second example, the printed circuit board 40 is hollowed out at a position corresponding to the sealing platform 2221, wherein the hollowed-out portion is located at the edge of the printed circuit board 40 and penetrates the first surface M1 and the second surface M2. That is, the printed circuit board 40 is hollowed out at a position corresponding to the sealing platform 2221. In the Z-axis direction, the sealing platform 2221 extends to the hollowed-out portion of the printed circuit board 40, so that the height of the sealing platform 2221 (i.e., the distance from the sealing surface of the sealing platform 2221 to the lower surface M4 of the first support 222) can be increased, and thus the L-shaped pickup tube p can be formed.

[0123] In addition, in the example, the foldable mobile phone 100 further includes an auxiliary board 120, which is fixed to the side of the printed circuit board 40 away from the sealing platform 2221, i.e., is fixed to the second surface M2 of the printed circuit board 40 and covers at least part of the area of the second through hole 42 and the hollowed-out portion 44. The part of the area of the hollowed-out portion 44 covered by the auxiliary board 120 can be the entire hollowed-out portion 44 or at least the area of the fifth pickup sub-segment p25 corresponding to the hollowed-out portion 44.

[0124] The embodiment does not limit the manner in which the auxiliary board 120 is fixed to the printed circuit board 40. For example, the auxiliary board 120 can be fixed to the printed circuit board 40 by means of surface mounting. For another example, the printed circuit board 40 is provided with at least one fixing hole 45 (two fixing holes are shown in FIG. 13), and the side surface of the auxiliary board 120 facing the printed circuit board 40 is provided with a fixing column (not shown in the figure), the fixing column of the auxiliary board 120 extends into the fixing hole 45 of the printed circuit board 40, thereby achieving the fixation of the auxiliary board 120 and the printed circuit board 40.

[0125] The auxiliary board 120 is provided with a third through hole 121 and a fourth through hole 122, both of which penetrate the auxiliary board 120 in the Z-axis direction. The third through hole 121 is opposite to the fifth pickup sub-segment p25, and the fourth through hole 122 is opposite to the second through hole 42.

[0126] The enclosure cover 80 is arranged on the side of the auxiliary plate 120 facing away from the second surface M2 of the printed circuit board 40, and covers the third through hole 121 and the fourth through hole 122. The surface of the side of the auxiliary plate 120 facing away from the second surface M2 of the printed circuit board 40 and the enclosure cover 80 enclose the above-mentioned ventilation cavity, which can only be ventilated at the positions of the third through hole 121 and the fourth through hole 122, so that the sound signal entering from the third through hole 121 or the fourth through hole 122 can be prevented from being transmitted to other areas.

[0127] It should be noted that the third through hole 121 is opposite to the fifth pickup sub-section p25, that is, the projection of the third through hole 121 on the plane composed of the X-axis and the Y-axis overlaps (coincides, at least partially overlaps, or one is located in the other) with the projection of the fifth pickup sub-section p25 on the plane composed of the X-axis and the Y-axis. The fourth through hole 122 is opposite to the second through hole 42, that is, the projection of the fourth through hole 122 on the plane composed of the X-axis and the Y-axis overlaps with the projection of the second through hole 42 on the plane composed of the X-axis and the Y-axis.

[0128] In addition, a second sealing structure 130 is arranged between the auxiliary plate 120 and the sealing surface of the sealing table 2221, the second sealing structure 130 surrounds the opening (also referred to as the sealing table opening) of the fifth pickup sub-section p25 on the sealing surface of the sealing table 2221, and surrounds the third through hole 121. The arrangement of the second sealing structure 130 can prevent air from leaking from the gap between the auxiliary plate 120 and the sealing surface of the sealing table 2221.

[0129] For example, the above-mentioned auxiliary plate 120 can include a structure such as a steel sheet that can carry the enclosure cover 80.

[0130] For example, the second sealing structure 130 can include a structure such as foam or double-sided tape that can achieve sealing and has a certain height.

[0131] A third sealing structure 140 is arranged between the auxiliary plate 120 and the printed circuit board 40, the third sealing structure 140 surrounds the second through hole 42 and surrounds the fourth through hole 122. The arrangement of the third sealing structure 140 can prevent air from leaking from the gap between the auxiliary plate 120 and the printed circuit board 40.

[0132] For example, the third sealing structure 140 can include a structure such as solder that can achieve a sealing effect.

[0133] In this case, the sound signal outside the electronic device is transmitted to the pickup hole of the microphone 50 through the first pickup section p1, the fourth pickup sub-section p24, the fifth pickup sub-section p25, the gap 44, the third through hole 121, the ventilation cavity enclosed by the surface of the side of the auxiliary plate 120 facing away from the second surface M2 of the printed circuit board 40 and the enclosure cover 80, the fourth through hole 122, and the second through hole 42.

[0134] That is, in the present example, on the basis of reducing the size of the electronic device in the Z-axis direction (the distance H0 between the lower surface M4 of the first support 222 and the surface of the printed circuit board 40 on the side away from the microphone 50, becomes the distance H1 between the lower surface M4 of the first support 222 and the surface of the enclosure 80 on the side away from the printed circuit board 40), by extending the sealing platform 2221 to the notch 44 of the printed circuit board 40, further increasing the height of the sealing platform 2221, and thus forming an L-shaped sound pickup pipe P, that is, the length of the formed sound pickup pipe P is short, which is conducive to the sound pickup effect. In addition, the setting of the auxiliary plate 120 can seal the position of the notch 44, prevent air leakage due to the setting of the notch 44, and further improve the sound pickup effect.

[0135] In yet another example, referring to FIG. 15, FIG. 16 and FIG. 17, FIG. 15 is another cross-sectional view of the electronic device shown in FIG. 1 along the BB' direction, FIG. 16 is a structural schematic view of another printed circuit board provided by the present application, and FIG. 17 is a view of the positional relationship between the printed circuit board and the connecting plate provided by the present application. As shown in FIG. 15, FIG. 16 and FIG. 17, different from the third example, the printed circuit board 40 corresponding to the position of the sealing platform 2221 is not only provided with a notch 44, but also is provided with a fifth through hole 46 corresponding to the position of the microphone 50, and the fifth through hole 46 penetrates the first surface M1 and the second surface M2 of the printed circuit board 40.

[0136] The auxiliary plate 120 includes a connecting plate 150 fixed to the second surface M2 of the printed circuit board 40 and connected with the printed circuit board 40. The microphone 50 is fixed to the side of the connecting plate 150 facing the printed circuit board 40 and located in the fifth through hole 46. The microphone 50 can realize signal interaction with some functional components on the printed circuit board 40 by means of the connecting plate 150 and the printed circuit board 40.

[0137] Since the microphone 50 is located in the fifth through hole 46 of the printed circuit board 40, the distance between the first surface M1 of the printed circuit board 40 and the lower surface M4 of the first support 222 can be further reduced, such as the distance of reducing the thickness of the printed circuit board 40, so that the distance between the lower surface M4 of the first support 222 and the surface of the enclosure 80 on the side away from the printed circuit board 40 changes from H1 to H2, wherein H2 = H1 - H3, and H3 is the thickness of the printed circuit board 40. The size of the electronic device in the Z-axis direction is further reduced.

[0138] The connecting plate 150 can include a printed circuit board or a raised plate and other structures that can realize signal transmission. The thickness of the connecting plate 150 is less than the thickness of the printed circuit board 40.

[0139] It can be understood that when the height of the microphone 50 is less than the height of the printed circuit board 40, the microphone 50 is located in the fifth through hole 46; when the height of the microphone 50 is greater than the height of the printed circuit board 40, part of the microphone 50 is located in the fifth through hole 46.

[0140] The connecting plate 150 is provided with a sixth through hole 151 and a seventh through hole 152, both of which pass through the connecting plate 150. The sixth through hole 151 is opposite the fifth pickup sub-segment p25, and the seventh through hole 152 is opposite the pickup hole of the microphone 50.

[0141] The enclosing cover 80 is arranged on the side of the second surface M2 of the connecting plate 150 away from the printed circuit board 40, and covers the sixth through hole 151 and the seventh through hole 152. The surface of the second surface M2 of the connecting plate 150 away from the printed circuit board 40 and the enclosing cover 80 enclose the above-mentioned ventilation cavity, which can only be ventilated at the positions of the sixth through hole 151 and the seventh through hole 152, so that the sound signal entering from the sixth through hole 151 and the seventh through hole 152 can be prevented from being transmitted to other areas.

[0142] It should be noted that the sixth through hole 151 is opposite the fifth pickup sub-segment p25, that is, the projection of the sixth through hole 151 on the plane composed of the X-axis and the Y-axis overlaps the projection of the fifth pickup sub-segment p25 on the plane composed of the X-axis and the Y-axis. The seventh through hole 152 is opposite the pickup hole of the microphone 50, that is, the projection of the seventh through hole 152 on the plane composed of the X-axis and the Y-axis overlaps the projection of the pickup hole of the microphone 50 on the plane composed of the X-axis and the Y-axis.

[0143] In addition, a second sealing structure (in order to distinguish from the above example, it can also be referred to as a fourth sealing structure 160 in this example) is also arranged between the connecting plate 150 and the sealing surface of the sealing table 2221, which surrounds the opening of the fifth pickup sub-segment p25 on the sealing surface of the sealing table 2221 (also referred to as the sealing table opening), and surrounds the sixth through hole 151. The arrangement of the fourth sealing structure 160 can prevent air leakage from the gap between the connecting plate 150 and the sealing surface of the sealing table 2221.

[0144] For example, the fourth sealing structure 160 can include foam or double-sided tape and other structures that can achieve sealing and have a certain height.

[0145] In this case, the sound signal outside the electronic device is transmitted to the pickup hole of the microphone 50 through the first pickup segment p1, the fourth pickup sub-segment p24, the fifth pickup sub-segment p25, the gap 44, the sixth through hole 151, the ventilation cavity enclosed by the second surface M2 of the printed circuit board 40 and the enclosing cover 80, and the seventh through hole 152.

[0146] That is, in the present example, by extending the sealing platform 2221 to the notch 44 of the printed circuit board 40, further increasing the height of the sealing platform 2221, and then forming an L-shaped pickup tube P, the length of the formed pickup tube P is shorter, which is beneficial to the pickup effect. In addition, the cooperation of the connecting plate 150 and the fifth through hole 46 of the printed circuit board 40 can further reduce the size of the electronic device in the Z-axis direction.

[0147] The above-described embodiments are only used to illustrate the technical solutions of the present application, but not limit the present application; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacements for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An electronic device, comprising: The electronic device comprises a machine body, a bearing structure, a baffle cover and a microphone. The machine body comprises a ring-shaped appearance member and a support member located in the appearance member. An edge of the support member is provided with a sealing table, a side wall of the sealing table is connected with the appearance member, and the machine body has a sound pickup pipeline. The sealing table comprises a sealing surface, and a sealing table opening is formed in the sealing surface. The bearing structure is located in the appearance member and opposite to the support member.

2. The electronic device of claim 1, wherein, An edge of the bearing structure is located on the sealing surface. The bearing structure comprises a first hollow part and a second hollow part. The sealing table opening is opposite to the first hollow part and communicates the sound pickup pipeline and the first hollow part. The baffle cover is arranged on a side of the bearing structure away from the sealing surface and covers the first hollow part and the second hollow part to form a ventilation cavity.

3. The electronic device of claim 2, wherein, The microphone is arranged on the bearing structure and on the same side of the sealing surface. The microphone comprises a sound pickup hole.

4. The electronic device of claim 2 or 3, wherein, The second hollow part is opposite to the sound pickup hole and communicates the sound pickup hole and the ventilation cavity.

5. The electronic device of claim 4, wherein, The sound pickup pipeline comprises a first sound pickup section and a second sound pickup section.

6. The electronic device of claim 4, wherein, The second sound pickup section comprises a first sound pickup subsection, a second sound pickup subsection and a third sound pickup subsection. The first sound pickup section is located in the appearance member.

7. The electronic device of claim 1, wherein, The support member comprises an upper surface and a lower surface.

8. The electronic device of claim 7, wherein, The sealing table is arranged on the lower surface. The upper surface of the preset position is recessed to form the first sound pickup subsection, the second sound pickup subsection and the third sound pickup subsection. The second sound pickup subsection is located between the first sound pickup subsection and the third sound pickup subsection and communicates the first sound pickup subsection and the third sound pickup subsection. The first sound pickup section communicates the first sound pickup subsection. The third sound pickup subsection communicates the sealing table opening. The first sound pickup subsection extends to the sealing table without penetrating the sealing table. The third sound pickup subsection extends to the sealing table and penetrates the sealing table to communicate the sealing table opening. The electronic device further comprises a first sealing structure located on the upper surface for sealing the first sound pickup subsection, the second sound pickup subsection and the third sound pickup subsection. The first sealing structure covers the openings of the first sound pickup subsection, the second sound pickup subsection and the third sound pickup subsection on the upper surface. The electronic device further comprises a display screen located on a side of the upper surface away from the lower surface. The first sealing structure is located between the upper surface and the display screen and surrounds the openings of the first sound pickup subsection, the second sound pickup subsection and the third sound pickup subsection on the upper surface. The bearing structure forms a step at the position corresponding to the sealing table. The sealing table extends to the step. The bearing structure comprises a printed circuit board. The printed circuit board forms the step at the position corresponding to the sealing table. The printed circuit board is provided with a first through hole and a second through hole. The first hollow part comprises the first through hole, and the second hollow part comprises the second through hole. The first through hole is opposite to and communicates with the sealing table opening; and the second through hole is opposite to and communicates with the pickup hole.

9. The electronic device of claim 7, wherein, The bearing structure comprises a printed circuit board and an auxiliary board, and the auxiliary board is located on the side of the printed circuit board away from the support; The printed circuit board is provided with a notch corresponding to the position of the sealing table, and the auxiliary board covers at least part of the notch, and the auxiliary board and the notch form the step; The surrounding cover is arranged on the side of the auxiliary board away from the sealing table and covers the first and second hollow parts to form the air cavity.

10. The electronic device of claim 9, wherein, The printed circuit board is provided with a second through hole; The auxiliary board is provided with a third through hole and a fourth through hole, the third through hole is opposite to and communicates with the sealing table opening, and the fourth through hole is opposite to and communicates with the second through hole; The first hollow part comprises the third through hole, and the second hollow part comprises the second and fourth through holes.

11. The electronic device of claim 9, wherein, The printed circuit board is provided with a fifth through hole corresponding to the position of the microphone; The auxiliary board comprises a connecting plate, and the microphone is arranged on the connecting plate and located in the fifth through hole; The connecting plate is provided with a sixth through hole and a seventh through hole, the sixth through hole is opposite to and communicates with the sealing table opening, and the seventh through hole is opposite to and communicates with the pickup hole; The first hollow part comprises the sixth through hole, and the second hollow part comprises the seventh through hole.

12. The electronic device of claim 11, wherein, The thickness of the connecting plate is less than the thickness of the printed circuit board.

13. The electronic device of any of claims 9-12, wherein, A second sealing structure is arranged between the auxiliary board and the sealing table, surrounds the sealing table opening, and surrounds the first hollow part.

14. The electronic device of any of claims 1-13, wherein, The surrounding cover is formed by the structure of the electronic device.

15. The electronic device of claim 14, wherein, The electronic device further comprises a bracket located on the side of the bearing structure away from the support; The bracket is provided with a first surrounding wall on the side thereof facing the bearing structure, and the first surrounding wall surrounds the first and second hollow parts; The first surrounding wall and the bracket form the surrounding cover.

16. The electronic device of claim 15, wherein, The bracket is partially protruded on the side thereof facing the bearing structure to form the first surrounding wall.

17. The electronic device of claim 14, wherein, The body further comprises an outer shell located on the side of the bearing structure away from the support; The outer shell is provided with a second surrounding wall on the side thereof facing the bearing structure, and the second surrounding wall surrounds the first and second hollow parts; The second surrounding wall and the outer shell form the surrounding cover.

18. The electronic device of claim 17, wherein, The outer shell is partially protruded on the side thereof facing the bearing structure to form the second surrounding wall.

19. The electronic device of claim 14, wherein, The electronic device further comprises a functional component arranged on the side of the bearing structure away from the sealing table, and a shielding cover is arranged around the functional component, the shielding cover is reused as the surrounding cover, and the shielding cover covers the first and second hollow parts.

20. The electronic device of any of claims 1-19, wherein, The electronic device further comprises a dust screen located between the sealing table and the bearing structure and covering the sealing table opening or the first hollow part.

21. The electronic device of any of claims 1-20, wherein, The height of the surrounding cover is less than the height of the microphone.

22. The electronic device of any of claims 1-21, wherein, The electronic device is a foldable electronic device.

23. The electronic device of claim 22, wherein, The foldable electronic device comprises two or more foldable mobile phones.

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