Electrical connection device and manufacturing process therefor

Abstract

The present application discloses an electrical connection device and a manufacturing process therefor, used for connecting an electrical device to a wire and transferring electrical energy. The electrical connection device comprises a contact portion and a connection portion which are connected to each other; at least partial area on the contact portion is a contact area connected to the electrical device; at least partial area on the connection portion is a connection area connected to the wire; the surface of the contact area is electroplated with a plating layer; and an insulating coating is provided on an area of the electrical connection device other than the contact area surface and the connection area surface. By means of the described technical solution, a partial plating method is used instead of electroplating the entire device surface with a plating layer, thereby significantly reducing the usage amount of noble metals, and thus effectively reducing production costs.

Description

An electrical connection device and a manufacturing process thereof

[0001] Related applications

[0002] This application claims priority to Chinese Patent Application No. 202410964037.X, filed on July 18, 2024, and incorporates by reference the entire disclosure of the aforementioned patent application as part of this application. TECHNICAL FIELD

[0003] The present disclosure relates to the technical field of electrical connection, and more particularly, to an electrical connection device and a manufacturing process thereof. BACKGROUND

[0004] Generally, an electrical connection device is provided with a plating layer on its surface by means of overall electroplating or chemical plating before use, so as to meet the requirements of electrical connection with electrical devices and wires.

[0005] The conventional method is to provide a plating layer on the overall electrical connection surface, but this method results in a large area of non-functional zones or zones where no plating layer is needed on the electrical connection device, and there is a problem of serious waste of noble metals and high production cost.

[0006] Therefore, there is a need for a new structure and method to solve the above problems. SUMMARY

[0007] The present disclosure provides an electrical connection device for connecting electrical devices and wires and transmitting electrical energy, comprising a contact part and a connection part connected to each other, at least part of the surface of the contact part is a contact zone for connecting with the electrical device, and at least part of the surface of the connection part is a connection zone for connecting with the wire; a plating layer is provided on the surface of the contact zone, and an insulating coating is provided on the zones other than the surface of the contact zone and the surface of the connection zone on the electrical connection device.

[0008] Optionally, the melting point of the insulating coating is greater than the working environment temperature during electroplating.

[0009] Optionally, when the plating layer and the insulating coating are located on the same surface of the electrical connection device, the surface of the plating layer is higher than the surface of the insulating coating.

[0010] Optionally, a corrosion-resistant coating covering the boundary between the plating layer and the insulating coating is further provided.

[0011] Optionally, the contact part is a plate structure and a connection hole is provided through the contact part, and the contact zone is at least part of the surface of the contact part near the inner wall of the connection hole and both ends of the connection hole.

[0012] Optionally, the connecting part is a plate structure, and the connecting area is one surface in contact with the wire or one end in contact with the wire.

[0013] Optionally, the contact part is a cylindrical structure, and the contact area is at least part of the inner wall surface of the cylindrical structure.

[0014] Optionally, the connecting part is a cylindrical structure or a U-shaped structure, and the connecting area is at least part of the inner wall surface of the cylindrical structure or at least part of the inner surface of the U-shaped structure.

[0015] Optionally, a transition part is further arranged between the contact part and the connecting part, and the insulating coating includes a general coating and a temperature-resistant coating, and the temperature-resistant coating is arranged on the surface of the transition part and / or part of the surface of the connecting part.

[0016] Optionally, the melting point of the temperature-resistant coating is greater than the melting point of the general coating.

[0017] According to another aspect of the embodiments of the present disclosure, a manufacturing process of an electrical connection device is further provided, including the following steps:

[0018] S10, determining a contact area and a connecting area on the electrical connection device, and arranging a first shielding layer on the contact area and a second shielding layer on the connecting area;

[0019] S20, arranging the insulating coating on the surface of the electrical connection device;

[0020] S30, removing the first shielding layer to expose the contact area, and retaining the second shielding layer;

[0021] S40, electroplating, and electroplating the plating layer on the surface of the contact area;

[0022] S50, removing the second shielding layer to expose the connecting area.

[0023] Optionally, before the step S10, there is a step S05: a pretreatment process, and the pretreatment process includes ultrasonic degreasing, alkali etching and acid etching performed on the electrical connection device in sequence. Alternatively, the pretreatment process includes ultrasonic degreasing, electrolytic degreasing and acid etching performed on the electrical connection device in sequence.

[0024] Optionally, the melting point of the first shielding layer is lower than 100℃, and in the step S30, the first shielding layer is removed by putting the electrical connection device into boiling water.

[0025] Optionally, the melting point of the second shielding layer and the insulating coating is greater than the working environment temperature during electroplating.

[0026] Optionally, the melting point of the insulating coating is greater than the melting point of the second shielding layer, and in step S50, the electrical connection device is placed in an environment with a temperature greater than the melting point of the second shielding layer but less than the melting point of the insulating coating, so that the second shielding layer melts and is removed.

[0027] Optionally, a transition portion is further arranged between the contact portion and the connecting portion, and in step S10, a third shielding layer is further arranged on the surface of the transition portion; and after step S10, step S15 of removing the third shielding layer to expose the surface of the transition portion and arranging a temperature-resistant coating on the surface of the transition portion is further included.

[0028] Optionally, the melting point of the third shielding layer is greater than the working environment temperature during electroplating and less than the melting point of the temperature-resistant coating.

[0029] Optionally, after step S50, step S60 of further arranging a corrosion-resistant coating covering the boundary between the plating layer and the insulating coating in the junction area between the plating layer and the insulating coating is further included.

[0030] The embodiments of the present disclosure have the following technical effects:

[0031] By electroplating a surface layer on the contact area of the electrical connection device, the stability of signal transmission and power transmission between the electrical connection device and the electrical device is improved; the insulating coating arranged in the area other than the contact area and the connecting area can effectively prevent electrical short circuit, electric leakage and corrosion of the electrical connection device; by adopting the local plating manner instead of arranging a plating layer on the entire surface of the device, the use amount of noble metal is significantly reduced, and the production cost is effectively reduced, thereby solving the problem of serious waste of noble metal and high production cost caused by the overall plating on the surface of the electrical connection device.

[0032] Other features and advantages of the present disclosure will become apparent from the following detailed description of exemplary embodiments thereof, with reference to the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0033] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0034] FIG. 1 is a structural schematic diagram of a chip-type electrical connection device in an embodiment of the present disclosure;

[0035] FIG. 2 is a partial cross-sectional structural schematic diagram of a chip-type electrical connection device in an embodiment of the present disclosure;

[0036] FIG. 3 is a partial cross-sectional structural schematic diagram of another embodiment of a chip-type electrical connection device in an embodiment of the present disclosure;

[0037] Fig. 4 is a schematic diagram of the overall structure of the contact portion in a cylindrical structure according to an embodiment of the present disclosure;

[0038] Fig. 5 is a schematic diagram of a partial cross-section of a sheet-type electrical connection device according to an embodiment of the present disclosure;

[0039] Fig. 6 is a schematic diagram of a partial cross-section of another embodiment of a sheet-type electrical connection device according to the present disclosure;

[0040] Fig. 7 is a schematic diagram of a partial cross-section of yet another embodiment of a sheet-type electrical connection device according to the present disclosure;

[0041] Fig. 8 is a flowchart of a manufacturing process for an electrical connection device;

[0042] Fig. 9 is a flowchart of a manufacturing process for a connection portion having an entire surface of the connection portion as a connection region;

[0043] Fig. 10 is a flowchart of a manufacturing process for a connection portion having a partial surface of the connection portion as a connection region;

[0044] Fig. 11 is a flowchart of a manufacturing process for a connection portion having a transition portion and an entire surface of the connection portion as a connection region;

[0045] Fig. 12 is a flowchart of a manufacturing process for a connection portion having a transition portion and a partial surface of the connection portion as a connection region.

[0046] In the drawings, the following signs are indicated: 10, contact portion; 20, connection portion; 30, connection hole; 40, transition portion; 3, plating layer; 5, insulating coating layer; 501, general coating layer; 502, temperature-resistant coating layer; 6, anticorrosion coating layer; 110, contact region; 210, connection region. DETAILED DESCRIPTION

[0047] Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, numerical expressions, and numerical values set forth in these embodiments are not limiting of the scope of the present disclosure unless otherwise specifically stated.

[0048] The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the scope of the present disclosure, its application, or uses.

[0049] Techniques, methods, and devices known to those of ordinary skill in the relevant art can not be discussed in detail herein. However, where appropriate, such techniques, methods, and devices can be viewed as part of the specification.

[0050] In all of the examples shown and discussed herein, any specific values should be interpreted as merely exemplary, and not as a limitation. Thus, other examples of exemplary embodiments can have different values.

[0051] The electric connection device shown in Figs. 1-7 is used to connect electrical devices and wires at two ends and transmit electric energy. The electric connection device specifically comprises a contact part 10 and a connection part 20 connected to each other. At least part of the contact part 10 is a contact area 110 used to connect electrical devices, and at least part of the connection part 20 is a connection area 210 used to connect wires. The surface of the contact area 110 is provided with a plating layer 3, and the area of the electric connection device other than the surface of the contact area 110 and the surface of the connection area 210 is provided with an insulating coating 5.

[0052] The material of the electric connection device is generally copper or copper alloy, or aluminum or aluminum alloy. The connection between the connection area 210 and the wire can be achieved by welding, crimping or other methods.

[0053] The present disclosure only provides the plating layer 3 on the contact area 110, which not only ensures the stability of signal transmission and electric energy transmission between the electric connection device and the electrical device, but also saves costs. In addition, the area of the electric connection device other than the surface of the contact area 110 and the surface of the connection area 210 is provided with an insulating coating 5, which can prevent corrosion of the electric connection device. The material of the insulating coating 5 is epoxy vinyl alcohol resin material, which has good insulating properties and mechanical strength. The epoxy vinyl alcohol resin has good fluidity and processability, and can be coated on the electric connection device by spraying, dipping and other process methods, which is simple to operate and can improve work efficiency. The electric connection device of the present disclosure has good conductivity, good corrosion resistance and is suitable for mass production.

[0054] The working temperature during general electroplating is 60-70℃. In order to avoid the insulating coating 5 from falling off, the melting point of the insulating coating 5 is set to be higher than the working temperature of the electroplating environment. The insulating properties of the insulating coating 5 can be maintained at high temperature, preventing the insulating failure caused by temperature rise. In addition, the insulating coating 5 with high melting point has better durability and stability, which can reduce the equipment maintenance and replacement costs caused by the failure of the insulating coating 5, and can also reduce the process fluctuation caused by temperature change, improving the stability and reliability of the electroplating process.

[0055] As shown in Figs. 5-7, when the plating layer 3 and the insulating coating 5 are located on the same surface of the electric connection device, the thickness of the plating layer 3 can be ensured to be the same as that of the insulating coating 5; or the surface of the plating layer 3 is higher than that of the insulating coating 5.

[0056] When the height of the surface of the plating layer 3 is higher than the height of the insulating coating 5, the contact point of the electrical connection device can be ensured to be fully connected with the electrical device, so as to maintain the high efficiency of the electrical conduction. In addition, the thickness of the plating layer 3 is higher than the insulating coating 5, which can clearly define the conductive part and the non-conductive part, so as to avoid the mis-touching of the conductive part by the operating and maintenance personnel, and improve the work safety. At the same time, it is also helpful to more easily identify and adjust the connection point during assembly and debugging, and improve the work efficiency.

[0057] It should be noted that the boss structure can be designed in the contact area 110 when the electrical connection device is punched, so as to more accurately make the surface of the plating layer 3 higher than the surface of the insulating coating 5 during plating.

[0058] In an embodiment, as shown in FIG. 2 and FIG. 6, the surface of the connecting part 20 is the connecting area 210, which is used for electrical connection with the wire, and the insulating coating 5 includes the general coating 501, which is arranged on the electrical connection device except the surface of the contact area 110 and the surface of the connecting area 210.

[0059] The material of the general coating 501 is epoxy vinyl alcohol resin material, and the melting point of the epoxy vinyl alcohol is 130-150℃.

[0060] In another embodiment, as shown in FIG. 3 and FIG. 7, the insulating coating 5 further includes the temperature-resistant coating 502, and the connecting area 210 is part of the surface of the connecting part 20. After the connecting part 20 is connected with the wire, the temperature-resistant coating 502 is arranged on the connecting part 20 except the connecting area 210, and the general coating 501 is used on the contact part 10 except the contact area 110 based on its good insulation performance and cost-effective consideration.

[0061] The temperature-resistant coating 502 not only can provide basic insulation performance, but also can effectively isolate the direct effect of high temperature on the general coating 501, prevent the melting of the general coating 501, and protect the insulation of the connection.

[0062] The material of the temperature-resistant coating 502 can be polytetrafluoroethylene, which has high temperature resistance, excellent insulation and corrosion resistance, and the melting point is 327℃. The melting point of the temperature-resistant coating 502 is greater than the melting point of the general coating 501.

[0063] In yet another embodiment, as shown in FIG. 6, the transition part 40 is further arranged between the contact part 10 and the connecting part 20, and the connecting area 210 is the entire surface of the connecting part 20. The general coating 501 is arranged on the contact part 10 except the surface of the contact area 110, and the temperature-resistant coating 502 is arranged on the surface of the transition part 40.

[0064] Alternatively, a transition section 40 is provided between the contact section 10 and the connection section 20, and the connection region 210 is part of the surface of the connection section 20. In this case, the normal coating 501 is applied to the area of the contact section 10 other than the surface of the contact region 110, and the temperature-resistant coating 502 is applied to the surface of the transition section 40 and the area of the connection section 20 other than the surface of the connection region 210.

[0065] The above solutions can prevent the high temperature generated during the welding of the wire and the connection section 20 from affecting the normal coating 501 applied to the contact section 10. At the same time, additional insulation protection can be provided in the electrical connection to prevent current leakage in the path where current should not flow, thereby ensuring the safety and stability of the electrical system.

[0066] Further, as shown in FIGS. 6 and 7, in order to prevent the position where the plating layer 3 and the insulating coating 5 meet from being exposed and corroded, a corrosion-resistant coating 6 is provided at the boundary between the plating layer 3 and the insulating coating 5, that is, the position where the plating layer 3 and the insulating coating 5 meet is covered by the corrosion-resistant coating 6.

[0067] The boundary area is often the starting point of coating failure because there can be differences in physical and chemical properties between the insulating coating 5 and the plating layer 3. The corrosion-resistant coating 6 can act as a "bridge" between the plating layer 3 and the insulating coating 5, reducing interface problems such as peeling and blistering caused by the mismatch between the coating and the plating layer 3, and enhancing the adhesion between the insulating coating 5 and the plating layer 3 through its good adhesion and compatibility, making the entire coating system more stable and reliable. Moreover, the corrosion-resistant coating 6 also provides an effective protective layer for the plating layer 3 and the insulating coating 5, effectively blocking water, oxygen, corrosive gases and other media from directly contacting the electrical connection device, thereby slowing down or preventing the corrosion process. This can significantly enhance the corrosion resistance of the entire electrical connection device and prolong its service life. In addition, the provision of the corrosion-resistant coating 6 makes it easier to detect potential problems in the boundary area during inspection and maintenance. Once signs of coating damage or corrosion are detected, repairs or replacements can be made in a timely manner to prevent the problem from getting worse. The presence of the corrosion-resistant coating 6 enhances the durability of the entire coating system, thereby extending the replacement cycle of the electrical connection device and reducing maintenance costs.

[0068] It should be noted that in the present embodiment, the material of the corrosion-resistant coating 6 can be epoxy resin, which has excellent mechanical properties and adhesion strength to the metal substrate, and can effectively block water, oxygen, corrosive gases and other media from directly contacting the electrical connection device, thereby slowing down or preventing the corrosion process. In other embodiments, isocyanate or silyl ester materials can also be used, which can be set according to actual needs without any limitation.

[0069] As shown in Fig. 1, the contact part 10 is in a plate structure, and a connecting hole 30 is provided through the contact part 10. The contact area 110 is at least part of the surface of the contact part 10 near the inner wall of the connecting hole 30 and the two ends of the connecting hole 30. The shape of the contact area 110 can be matched with the shape of the electrical device connected thereto.

[0070] As shown in Fig. 4, the contact part 10 is in a cylindrical structure, and the contact area 110 is at least part of the inner wall surface of the cylindrical structure.

[0071] Regardless of whether the contact part 10 is in a plate structure or a cylindrical structure, the connecting part 20 can be set to be in a plate structure according to actual needs. The connecting area 210 of the plate structure is the side in contact with the wire or the end in contact with the wire.

[0072] Alternatively, the connecting part 20 can set the contact part 10 to be in a cylindrical structure or a U-shaped structure according to actual needs. The connecting area 210 is at least part of the inner wall surface of the cylindrical structure or at least part of the inner surface of the U-shaped structure.

[0073] As shown in Figs. 8-12, the manufacturing process of the electrical connection device is also provided in the present disclosure, which includes the following steps:

[0074] S10, determining the contact area 110 and the connecting area 210 on the electrical connection device, and providing a first shielding layer on the contact area 110 and a second shielding layer on the connecting area 210;

[0075] S20, providing an insulating coating 5 on the surface of the electrical connection device;

[0076] S30, removing the first shielding layer to expose the contact area 110, and retaining the second shielding layer;

[0077] S40, electroplating, and electroplating a plating layer 3 on the surface of the contact area 110;

[0078] S50, removing the second shielding layer to expose the connecting area 210.

[0079] In S10, after the contact area 110 and the connecting area 210 are determined, the first shielding layer and the second shielding layer are provided on the contact area 110 and the connecting area 210, respectively. The provision of the shielding layer can accurately control the application area of the plating layer 3, avoid unnecessary waste of the plating layer 3, and ensure the protection and function realization of the key area.

[0080] In S20, an insulating coating 5 is provided on the surface of the entire electrical connection device (except the part covered by the shielding layer) to protect the non-conductive area, prevent safety hazards such as short circuit and electric shock, improve the safety of the electrical connection device, and ensure the insulation performance of the non-conductive area.

[0081] In S30, the first shielding layer on the contact area 110 is removed, exposing the area that needs to be plated with layer 3, and the contact area 110 is subjected to the next plating process, ensuring that the plating layer 3 can be directly attached to the contact area 110. The second shielding layer is retained to avoid forming a plating layer 3 on the connection area 210, causing waste.

[0082] In S40, a plating layer 3 is plated on the surface of the contact area 110 using a plating process, which can further improve the conductivity, wear resistance and corrosion resistance of the contact area 110, and prolong its service life.

[0083] In S50, the second shielding layer on the connection area 210 is removed, exposing the area that needs to be connected to the wire, providing a clear connection interface for the connection area 210, and ensuring reliable connection between the two.

[0084] In S10, the contact area 110 and the connection area 210 are determined on the electrical connection device, and the first shielding layer is provided on the contact area 110, and the second shielding layer is provided on the connection area 210.

[0085] According to the connection mode of the electrical device and the wire, the electrical connection device is functionally divided into contact area 110 and connection area 210.

[0086] The first shielding layer is a paraffin substance with a melting point of 47-64°C.

[0087] The coating process of the first shielding layer is as follows:

[0088] (1) Place the electrical connection device in A mold and fix it, and only expose the contact area 110 in the mold;

[0089] (2) Inject paraffin into the mold and coat it on the surface of the exposed contact area 110;

[0090] (3) Cool for 10 minutes to allow the paraffin to cool and solidify;

[0091] (4) Use a knife to remove the paraffin that has overflowed from the mold, so that the first shielding layer substance (paraffin) uniformly covers the surface of the exposed contact area 110;

[0092] (5) Remove the A mold

[0093] The second shielding layer is an epoxy vinyl ether resin substance with a melting point of 90-110°C.

[0094] The coating process of the second shielding layer is as follows:

[0095] (1) Place the electrical connection device in B mold and fix it, and B mold will shield the entire contact part 10, leaving the entire connection part 20 exposed;

[0096] (2) Spray the second shielding layer (epoxy vinyl ether resin) on the connecting part 20 of the exposed part of the B mold;

[0097] (3) After the spraying is completed, remove the B mold;

[0098] (4) Set a hanging point at the side ridge position of the connecting part 20, and remove the second shielding layer at the hanging point position;

[0099] (5) Put the electrical connecting device into a curing oven, bake at 115°C for 30 minutes, then cool to 60°C to solidify for 1 hour, and then cool to room temperature.

[0100] It should be noted that before the electrical connecting device is put into the curing oven, the contact area 110 needs to be protected by the mold to avoid the first shielding layer from melting and flowing away, so that the first shielding layer loses its effect during the solidification of the second shielding layer.

[0101] In S20, an insulating coating 5 is provided on the surface of the electrical connecting device. Specifically, the electrical connecting device is provided with a coating in four ways, so the steps of providing the insulating coating 5 are set as four embodiments S21, S22, S23 and S24.

[0102] The insulating coating 5 includes a common coating 501 and a temperature-resistant coating 502. The common coating 501 is made of epoxy vinyl alcohol resin, and its melting point is 130-150°C. The temperature-resistant coating 502 is made of polytetrafluoroethylene, which has high temperature resistance, excellent insulation and corrosion resistance, and its melting point is 327°C.

[0103] The coating process of the insulating coating 5 is as follows:

[0104] In step S21, as shown in FIGS. 2 and 9, the common coating 501 is provided on the contact part 10 except the surface of the contact area 110, and the connecting part 20 is all the contact area 110 and is electrically connected with the wire.

[0105] (1) Put the electrical connecting device coated with the first shielding layer into the C mold and fix it well, and the mold shields the entire connecting area 210, so that the entire contact part 10 is completely exposed;

[0106] (2) Spray the common coating 501 on the exposed contact part 10 of the C mold;

[0107] (3) Remove the C mold;

[0108] (4) Put the electrical connecting device into the C mold, and only expose the contact area 110 to be electroplated, and the common coating 501 thereon is exposed;

[0109] (5) using a knife to remove the ordinary coating 501 and part of the thickness of the first shielding layer on the contact area 110, at this time, the contact area 110 is only covered with the first shielding layer, and the part of the contact 10 except the contact area 110 is covered with the ordinary coating 501;

[0110] (6) removing the C mold;

[0111] (7) placing the electrical connection device into a curing oven, baking at 155°C for 30 minutes, then cooling to 60°C to solidify for 1 hour, solidifying the ordinary coating 501, and finally cooling to room temperature.

[0112] At this point, the covering of the ordinary coating 501 is completed.

[0113] It should be noted that before placing the electrical connection device into the curing oven, the contact area 110 and the connection area 210 need to be respectively protected and buckled using different molds to avoid the melting and loss of the first shielding layer and the second shielding layer during the solidification of the ordinary coating 501, so that the shielding effect is lost.

[0114] In S30, the first shielding layer is removed to expose the contact area 110, and the second shielding layer is retained;

[0115] The process of removing the first shielding layer includes:

[0116] (1) placing the electrical connection device into the D mold to expose only the contact area 110 to be electroplated, and the ordinary coating 501 on the contact area 110 is exposed;

[0117] (2) using a knife to remove the ordinary coating 501 and part of the thickness of the first shielding layer on the contact area 110, at this time, the contact area 110 is only covered with the first shielding layer, and the part of the contact 10 except the contact area 110 is covered with the ordinary coating 501;

[0118] (3) removing the D mold;

[0119] (4) placing the electrical connection device into hot water at 70-80°C to melt and detach;

[0120] (5) air-drying and oven-drying the terminal with the first shielding layer detached at room temperature and 60°C for electroplating.

[0121] At this point, the removal of the first shielding layer is completed.

[0122] The melting point of the first shielding layer is set to be lower than 100°C, which means that the shielding layer can be easily removed at a slightly higher temperature. Moreover, the temperature of hot water is usually much higher than 65°C, which can quickly and effectively soften and remove the shielding layer, and also ensure that the first shielding layer can be removed without damaging other coating layers. Meanwhile, this method does not require complex equipment or chemicals, only a container that can accommodate the electrical connecting device and is heated to an appropriate temperature, which reduces the production cost and simplifies the process.

[0123] In an embodiment, the melting point of the second shielding layer and the insulating coating layer 5 is greater than the working environment temperature during electroplating.

[0124] During electroplating, the temperature of the working environment can increase due to factors such as equipment operation and chemical reactions. The working temperature during electroplating is generally 60-70°C, and if the melting point of the second shielding layer is lower than this temperature, the second shielding layer can soften and fall off, melt, or even fail, thereby failing to effectively protect the connecting area 210. Therefore, the second shielding layer can be selected to be an epoxy vinyl ether resin with a melting point much higher than the working environment temperature, which is 90-110°C. In this way, it can be ensured that the second shielding layer can still protect the connecting area 210 at high temperatures.

[0125] In S40, a plating layer 3 is electroplated on the surface of the contact area 110;

[0126] As shown in FIGS. 5-7, taking a chip-type electrical connecting device as an example, the plating layer 3 on the surface of the contact area 110 is designed to be electroplated with Ni (nickel sulfamate) 25-30 μm as a base and silver 3-6 μm on the surface; the remaining part is a non-plating layer 3 area.

[0127] As shown in FIG. 4, taking a charging base slot electrical connecting device as an example, the inner surface, i.e., the contact area 110, is designed to be electroplated with Ni as a base and silver on the surface, the Ni layer is 3-5 μm, and the surface electroplated hard silver is 10-15 μm; the remaining part is a non-plating layer 3.

[0128] In S50, the second shielding layer is removed to expose the connecting area 210.

[0129] The process for removing the second shielding layer includes:

[0130] (1) placing the electrical connecting device in boiling water at 100°C for soaking;

[0131] (2) the melting point of the second shielding layer is 90-110°C, so it melts and detaches in boiling water at 100°C;

[0132] (3) drying the electrical connecting device from which the second shielding layer has been detached at room temperature and at 60°C, to obtain the final state of the electrical connecting device.

[0133] At this point, the electrical connection device is completed. The melting point of the insulating coating 5 is greater than the melting point of the second shielding layer. In step S50, the electrical connection device is placed in an environment with a temperature greater than the melting point of the second shielding layer but less than the melting point of the insulating coating 5, so that the second shielding layer melts and is removed.

[0134] By precisely controlling the shielding and plating as described above, it is ensured that the contact area 110 of the electrical connection device can be precisely plated, which not only improves the overall performance and reliability of the electrical connection device, but also significantly reduces the use of precious metals and production costs. Thus, the problem of serious waste of precious metals and high production costs in the overall plating layer 3 on the surface of the electrical connection device is solved.

[0135] In another embodiment, as shown in FIGS. 3 and 10, the coating process of the insulating coating 5 is as follows: in step S22, the connection area 210 of the electrical connection device is part of the surface of the connection part 20, and the ordinary coating 501 is provided on the contact part 10 except the surface of the contact area 110, and the temperature-resistant coating 502 is provided on the connection part 20 except the surface of the connection area 210. And respectively, bake and cure to complete the coverage of the insulating coating 5.

[0136] In yet another embodiment, as shown in FIG. 11, the coating process of the insulating coating 5 is as follows: in step S23, the transition part 40 is further provided between the contact part 10 and the connection part 20, and the connection area 210 is the entire surface of the connection part 20. The ordinary plating layer 3 is provided on the contact part 10 except the surface of the contact area 110. In step S10, a third shielding layer is further provided on the surface of the transition part 40. The third shielding layer needs to be provided on the surface of the transition part 40 before plating the plating layer 3. After step S10, step 15 is further included: removing the third shielding layer to expose the surface of the transition part 40, and providing the temperature-resistant coating 502 on the surface of the transition part 40.

[0137] Alternatively, in another embodiment, as shown in FIG. 12, the coating process of the insulating coating 5 is as follows: in step S24, the transition part 40 is further provided between the contact part 10 and the connection part 20, and the connection area 210 is part of the surface of the connection part 20. The ordinary plating layer 3 is provided on the contact part 10 except the surface of the contact area 110. In step S10, a third shielding layer is further provided on the surface of the connection part 20 except the connection area 210. After step S10, step 15 is further included: removing the third shielding layer to expose the surface of the connection part 20 except the connection area 210, and providing the temperature-resistant coating 502 on the surface of the transition part 40 and the connection part 20 except the connection area 210.

[0138] After the third shielding layer is removed, a temperature-resistant coating 502 is arranged on the surface of the transition portion 40 or the surface of the connecting portion 20 outside the connecting area 210, and the temperature-resistant coating 502 is ensured to be uniformly and firmly attached to the surface and achieve the expected protection effect.

[0139] The third shielding layer has a melting point greater than the working environment temperature during electroplating and less than the melting point of the temperature-resistant coating 502. In this way, the third shielding layer can be ensured not to melt due to the increase of the working environment temperature during electroplating, thereby maintaining its integrity and effectively preventing the penetration of the electroplating solution. At the same time, the melting point of the third shielding layer is set to be less than the melting point of the temperature-resistant coating 502, so that the shielding layer can be easily removed in the subsequent step, thereby facilitating the next processing or treatment. The feasibility and efficiency of the removal process are ensured.

[0140] It should be understood that in the present embodiment, the third shielding layer can be made of a high-molecular polymer material (such as polyphenylene sulfide, polyimide, polyether ether ketone, etc.), which can be selected according to actual needs, and is not limited herein.

[0141] The third shielding layer can prevent the electroplating solution, chemical solvent or other harmful substances from directly contacting the surface of the transition portion 40, thereby avoiding corrosion, pollution or other adverse effects. The temperature-resistant coating 502 is mainly used to prevent the high temperature generated during the welding connection of the connecting portion 20 and the wire from damaging or melting the adjacent ordinary coating 501, effectively isolating the direct effect of high temperature on the ordinary coating 501, and preventing the melting of the ordinary coating 501.

[0142] In an embodiment, before step S10, there is also step S05: a pretreatment process, which includes sequentially performing ultrasonic degreasing, alkali etching and acid etching on the electrical connection device.

[0143] Ultrasonic degreasing is to remove the oil stains on the surface of the terminal by using the combined action of alkaline degreasing agent and ultrasonic waves. The alkaline degreasing agent itself can react with the oil stains to remove the oil stains by chemical method, and the ultrasonic waves can generate a large number of small bubbles on the surface of the product and in the degreasing agent. These small bubbles have strong mechanical force and can tear and remove the oil stains on the surface of the product, thereby accelerating the degreasing process and effect.

[0144] Taking a chip-type electrical connection device as an example, the material of the chip-type electrical connection device is generally aluminum or aluminum alloy. The ultrasonic degreasing solution is composed of sodium carbonate 40-50 g / L, trisodium phosphate 40-50 g / L, and sodium silicate 20-30 g / L, with a temperature of 50-70°C. The ultrasonic wave frequency is greater than 26 kHz, and the ultrasonic degreasing time of the electrical connection device is 8-16 min.

[0145] Alkaline etching, aluminum is amphoteric metal, can react with acid and alkali. The process by strong alkaline solution (NaOH, KOH, etc.) dissolved the surface of the electrical connection device aluminum oxide and part of the aluminum, for the coverage of the plated layer 3 to provide a good surface, to ensure its binding force.

[0146] The alkaline etching plating solution is composed of sodium hydroxide 50-70 g / L, trisodium phosphate 30-40 g / L, sodium carbonate 20-30 g / L, sodium silicate 5-10 g / L, temperature 60-80℃, time 60-120s, based on the total volume of the plating solution.

[0147] Acid etching, acid etching on aluminum corrosion is small, but also can remove the iron, manganese, copper, magnesium, silicon and other elements in the aluminum alloy can not be dissolved in the alkali (commonly known as hanging ash) in the surface of the plated parts to form a rich aluminum layer, to the electrical connection device to play the role of activation matrix and improve the adhesion of the plated layer 3.

[0148] The acid etching plating solution is composed of concentrated nitric acid 750-800 g / L, 40% hydrofluoric acid 250-300 g / L, temperature is room temperature, time is 50-90s, based on the total volume of the plating solution.

[0149] Or,

[0150] Step S10 also has step S05 before: pretreatment process, the pretreatment process includes the ultrasonic degreasing, electrolytic degreasing and acid etching of the electrical connection device in turn. This scheme takes the electrical connection device in the form of charging seat slot as an example.

[0151] The method of ultrasonic degreasing, the same as the ultrasonic degreasing method of sheet type electrical connection device.

[0152] Electrolytic degreasing is to immerse the electrical connection device in alkaline degreasing agent, the electrical connection device as cathode, using the polarization effect and hydrogen generated by electrolysis to tear and remove the oil on the surface of the electrical connection device.

[0153] The electrolytic degreasing plating solution is composed of sodium hydroxide 10-15 g / L, sodium carbonate 20-30 g / L, sodium phosphate 50-70 g / L, sodium silicate 10-15 g / L, temperature 50-70℃, current density 3-8 A / dm2, time 10-15 minutes, based on the total volume of the plating solution.

[0154] Pickling is to use dilute sulfuric acid solution to soak and clean the electrical connection device, to remove the surface oxide skin and play the role of activation.

[0155] The pickling plating solution is composed of sulfuric acid 10%-20% (volume ratio), time 60-90 seconds, based on the total volume of the plating solution.

[0156] After step S50, step 60 is further included: at the interface area between the plating layer 3 and the insulating coating 5, a corrosion-proof coating 6 is further arranged to cover the boundary between the plating layer 3 and the insulating coating 5. The position where the surface plating layer 3 and the insulating coating 5 of the electrical connection device meet can be prevented from being exposed, so that corrosion of the electrical connection device at the exposed position can be avoided, the service life of the entire component or product can be prolonged, and the overall performance of the product can be further improved.

[0157] Although some specific embodiments of the present disclosure have been described in detail by examples, those skilled in the art should understand that the above examples are only for illustration, not for limiting the scope of the present disclosure. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present disclosure. The scope of the present disclosure is defined by the appended claims.

Claims

1. An electrical connection device for connecting an electrical device to a conductor and transferring electrical energy, characterized in that The electrical connection device comprises a contact part and a connecting part, the contact part has a contact area for connecting with the electrical device, the connecting part has a connecting area for connecting with the wire; the surface of the contact area is provided with a plating layer, and the surface of the contact area and the surface of the connecting area are provided with an insulating coating.

2. The electrical connection device of claim 1, wherein, The melting point of the insulating coating is greater than the working temperature of the plating process.

3. The electrical connection device of claim 1, wherein, When the plating layer and the insulating coating are on the same surface of the electrical connection device, the surface of the plating layer is higher than the surface of the insulating coating.

4. The electrical connection device of claim 1, wherein, In the boundary area between the plating layer and the insulating coating, a corrosion-resistant coating is further provided to cover the boundary between the plating layer and the insulating coating.

5. The electrical connection device of claim 1, wherein, The contact part is in a plate structure and has a connecting hole penetrating through the contact part, and the contact area is at least part of the surface of the contact part near the inner wall of the connecting hole and the two ends of the connecting hole.

6. The electrical connection device of claim 1, wherein, The connecting part is in a plate structure, and the connecting area is a surface in contact with the wire or an end in contact with the wire.

7. The electrical connection device of claim 1, wherein, The contact part is in a cylindrical structure, and the contact area is at least part of the inner wall surface of the cylindrical structure.

8. The electrical connection device of claim 1, wherein, The connecting part is in a cylindrical structure or a U-shaped structure, and the connecting area is at least part of the inner wall surface of the cylindrical structure or at least part of the inner surface of the U-shaped structure.

9. The electrical connection device of claim 1, wherein, The transition part is further provided between the contact part and the connecting part, and the insulating coating comprises a general coating and a temperature-resistant coating, and the temperature-resistant coating is provided on the surface of the transition part and / or part of the surface of the connecting part.

10. The electrical connection device of claim 9, wherein, The melting point of the temperature-resistant coating is greater than the melting point of the general coating.

11. A process for manufacturing an electrical connection device as claimed in any one of the claims 1-10, characterized in that, The method comprises the following steps: S10, determining a contact area and a connecting area on the electrical connection device, and providing a first shielding layer on the contact area and a second shielding layer on the connecting area; S20, providing the insulating coating on the surface of the electrical connection device; S30, removing the first shielding layer to expose the contact area while retaining the second shielding layer; S40, plating, and plating the plating layer on the surface of the contact area; S50, removing the second shielding layer to expose the connecting area.

12. The manufacturing process of an electrical connection device according to claim 11, characterized in that, Before the step S10, there is a step S05: a pretreatment process, which comprises sequentially performing ultrasonic degreasing, alkali etching, and acid etching on the electrical connection device, or the pretreatment process comprises sequentially performing ultrasonic degreasing, electrolytic degreasing, and acid etching on the electrical connection device.

13. The manufacturing process of an electrical connection device according to claim 11, characterized in that, The melting point of the first shielding layer is lower than 100°C, and in the step S30, the first shielding layer is removed by placing the electrical connection device in boiling water.

14. The manufacturing process of an electrical connection device according to claim 11, wherein, The melting points of the second shielding layer and the insulating coating are greater than the working temperature of the plating process.

15. The manufacturing process of an electrical connection device according to claim 11, wherein, The melting point of the insulating coating is greater than the melting point of the second shielding layer, and in the step S50, the second shielding layer is melted and removed by placing the electrical connection device in an environment with a temperature greater than the melting point of the second shielding layer but less than the melting point of the insulating coating.

16. The manufacturing process of an electrical connection device according to claim 11, wherein, The transition part is further arranged between the contact part and the connecting part, and a third shielding layer is arranged on the surface of the transition part in step S10.

17. The manufacturing process of an electrical connection device according to claim 16, characterized in that, The third shielding layer has a melting point greater than the working environment temperature during electroplating and less than the melting point of the temperature-resistant coating.

18. The manufacturing process of an electrical connection device according to claim 11, wherein, After step S50, a step S60 is further included, in which a corrosion-resistant coating covering the boundary between the plating layer and the insulating coating is arranged on the boundary between the plating layer and the insulating coating.

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